Substrate processing system and control method for substrate processing system

Abstract

This substrate processing system comprises: a processing chamber which comprises a substrate support part, a lifter, and an actuator that lifts and lowers the lifter; a vacuum transfer chamber which is connected to the processing chamber and in which is installed a transfer robot comprising an arm and an end effector that is connected to the arm and that places a transferred object; an imaging device; and a system control unit, wherein the system control unit executes (a) controlling the actuator so as to lift the transferred object by means of the lifter, (b) controlling the imaging device so as to acquire a captured image including the transferred object, which has been lifted by the lifter, before the end effector enters the inside of the processing chamber in order to unload the transferred object from the processing chamber, (c) specifying the position of the transferred object on the basis of the captured image, and (d) controlling the transfer of the transferred object from the processing chamber to the vacuum transfer chamber on the basis of the specified position of the transferred object.

Description

Substrate Processing System and Control Method for Substrate Processing System

[0001] The present disclosure relates to a substrate processing system and a control method for a substrate processing system.

[0002] Patent Document 1 discloses a semiconductor processing apparatus including an optical sensor on a wall of a substrate transfer module provided outside a processing chamber.

[0003] US Patent Application Publication No. 2023 / 0055839

[0004] The present disclosure provides a technique for detecting the state of a conveyed object when conveying the conveyed object.

[0005] According to one aspect of the present disclosure, there is provided a substrate processing system comprising: a processing chamber including a substrate support portion, a lifter that lifts and lowers a conveyed object, and an actuator that lifts and lowers the lifter; a vacuum transfer chamber connected to the processing chamber, in which a transfer robot including an arm and an end effector connected to the arm for placing the conveyed object is installed; an imaging device; and a system control unit, wherein the system control unit executes: (a) controlling the actuator to lift the conveyed object by the lifter; (b) controlling the imaging device to acquire a captured image including the conveyed object lifted by the lifter before the end effector enters the processing chamber in order to carry the conveyed object out of the processing chamber; (c) specifying the position of the conveyed object based on the captured image; and (d) controlling transfer of the conveyed object from the processing chamber to the vacuum transfer chamber based on the specified position of the conveyed object.

[0006] The present disclosure provides a technique for detecting the state of a conveyed object when conveying the conveyed object.

[0007] Figure 1 is a diagram illustrating the configuration of the substrate processing system according to the first embodiment. Figure 2 is a plan view illustrating the mounting of the imaging device in the substrate processing system according to the first embodiment. Figure 3 is a flowchart illustrating the processing in the substrate processing system according to the first embodiment. Figure 4 is a diagram illustrating the image captured by the imaging device in the substrate processing system according to the first embodiment. Figure 5 is a diagram illustrating the image captured by the imaging device in the substrate processing system according to the first embodiment. Figure 6 is a diagram illustrating the image captured by the imaging device in the substrate processing system according to the first embodiment. Figure 7 is a diagram illustrating the image captured by the imaging device in the substrate processing system according to the first embodiment. Figure 8 is a plan view illustrating a modified example 1 of the mounting of the imaging device in the substrate processing system according to the first embodiment. Figure 9 is a side view illustrating a modified example 2 of the mounting of the imaging device in the substrate processing system according to the first embodiment. Figure 10 is a plan view illustrating a modified example 3 of the mounting of the imaging device in the substrate processing system according to the first embodiment. Figure 11 is a side view illustrating a modified example 3 of the mounting of the imaging device in the substrate processing system according to the first embodiment. Figure 12 is a plan view illustrating a modified example 4 of the mounting of the imaging device in the substrate processing system according to the first embodiment. Figure 13 is a side view illustrating a modified example 4 of the mounting of the imaging device in the substrate processing system according to the first embodiment. Figure 14 is a plan view illustrating a modified example 5 of the mounting of the imaging device in the substrate processing system according to the first embodiment. Figure 15 is a diagram illustrating the configuration of a modified example of the substrate processing system according to the first embodiment. Figure 16 is a diagram illustrating the image captured by the imaging device in the substrate processing system according to the first embodiment. Figure 17 is a diagram illustrating the image captured by the imaging device in the substrate processing system according to the first embodiment. Figure 18 is a diagram illustrating the image captured by the imaging device in the substrate processing system according to the first embodiment. Figure 19 is a diagram illustrating the configuration of the substrate processing system according to the second embodiment. Figure 20 is a diagram illustrating the image captured by the imaging device in the substrate processing system according to the second embodiment.Figure 21 is a diagram illustrating the image captured by the imaging device in the substrate processing system according to the second embodiment. Figure 22 is a diagram illustrating the image captured by the imaging device in the substrate processing system according to the second embodiment. Figure 23 is a diagram illustrating the image captured by the imaging device in the substrate processing system according to the second embodiment. Figure 24 is a diagram illustrating the image captured by the imaging device in the substrate processing system according to the second embodiment. Figure 25 is a diagram illustrating the image captured by the imaging device in the substrate processing system according to the second embodiment. Figure 26 is a diagram illustrating the image captured by the imaging device in the substrate processing system according to the second embodiment. Figure 27 is a diagram illustrating the image captured by the imaging device in the substrate processing system according to the second embodiment.

[0008] Hereinafter, embodiments for carrying out this disclosure will be described with reference to the drawings. In this specification and the drawings, substantially identical components are denoted by the same reference numerals to avoid redundant explanations. For ease of understanding, the scale of the parts in the drawings may differ from that of the actual parts. In directions such as parallel, right angles, orthogonal, horizontal, vertical, up and down, and left and right, deviations are permitted to the extent that they do not impair the effect of the embodiment. The shape of the corners is not limited to right angles and may be rounded. Parallel, right angles, orthogonal, horizontal, and vertical may include substantially parallel, substantially right angles, substantially orthogonal, substantially horizontal, and substantially vertical.

[0009] The following describes an example configuration of a substrate processing system.

[0010] <First Embodiment> Figure 1 is a diagram illustrating the configuration of a substrate processing system 100, which is an example of a substrate processing system according to the first embodiment.

[0011] The substrate processing system 100 comprises a plasma processing system 3, a vacuum transport chamber 4, an imaging device 5, and a system control unit 6. Each component will be described below.

[0012] [Plasma Processing System 3] The plasma processing system 3 includes a capacitively coupled plasma processing apparatus 1 and a control unit 2. The capacitively coupled plasma processing apparatus 1 includes a plasma processing chamber 10, a gas supply unit 20, a power supply 30, and an exhaust system 40. The plasma processing apparatus 1 also includes a substrate support unit 11 and a gas introduction unit. The gas introduction unit is configured to introduce at least one processing gas into the plasma processing chamber 10. The gas introduction unit includes a shower head 13. The substrate support unit 11 is located inside the plasma processing chamber 10. The shower head 13 is located above the substrate support unit 11. In one embodiment, the shower head 13 constitutes at least a part of the ceiling of the plasma processing chamber 10. The plasma processing chamber 10 has a plasma processing space 10s defined by the shower head 13, the side walls 10a of the plasma processing chamber 10, and the substrate support unit 11. The plasma processing chamber 10 has at least one gas supply port for supplying at least one processing gas to the plasma processing space 10s, and at least one gas outlet for discharging gas from the plasma processing space. The side wall 10a is grounded. The shower head 13 and the substrate support portion 11 are electrically insulated from the plasma processing chamber 10 housing.

[0013] The substrate support portion 11 includes a main body portion 111 and a ring assembly 112. The main body portion 111 has a central region (substrate support surface) 111a for supporting a substrate (wafer) W and an annular region (ring support surface) 111b for supporting the ring assembly 112. In a plan view, the annular region 111b of the main body portion 111 surrounds the central region 111a of the main body portion 111. The substrate W is placed on the central region 111a of the main body portion 111, and the ring assembly 112 is placed on the annular region 111b of the main body portion 111 so as to surround the substrate W on the central region 111a of the main body portion 111. In one embodiment, the main body portion 111 includes a base and an electrostatic chuck. The base includes a conductive member. The conductive member of the base functions as a lower electrode. The electrostatic chuck is placed on the base. The upper surface of the electrostatic chuck has a substrate support surface 111a. The ring assembly 112 includes one or more annular members. At least one of the one or more annular members is an edge ring or a covering ring. Although not shown in the figures, the substrate support 11 may also include a temperature control module configured to adjust at least one of the electrostatic chuck, ring assembly 112, and substrate to a target temperature. The temperature control module may include a heater, a heat transfer medium, a flow path, or a combination thereof. A heat transfer fluid such as brine or gas flows through the flow path. The substrate support 11 may also include a heat transfer gas supply unit configured to supply a heat transfer gas between the back surface of the substrate W and the substrate support surface 111a.

[0014] The main body 111 includes a lifter 51 and an actuator 52 for raising and lowering the substrate W. When the actuator 52 moves the lifter 51 upward, the upper part of the lifter 51 protrudes from the substrate support surface 111a, thereby lifting the substrate W. When the actuator 52 moves the lifter 51 downward, the upper part of the lifter 51 that is protruding from the substrate support surface 111a is retracted into the substrate support surface 111a, thereby placing the substrate W on the substrate support surface 111a.

[0015] Furthermore, the main body 111 includes a lifter 53 and an actuator 54 for raising and lowering the ring assembly 112. When the actuator 54 moves the lifter 53 upward, the upper part of the lifter 53 protrudes from the ring support surface 111b, thereby lifting the ring assembly 112. When the actuator 54 moves the lifter 53 downward, the upper part of the lifter 53 that is protruding from the ring support surface 111b is retracted into the ring support surface 111b, thereby placing the ring assembly 112 on the ring support surface 111b.

[0016] The side wall 10a has a transport opening 10h for transporting the substrate W or ring assembly 112. The plasma processing chamber 10 is equipped with a gate valve 61 for opening and closing the transport opening 10h. The plasma processing chamber 10 is also equipped with a shutter 62 on the side (inside) of the plasma processing space 10s of the transport opening 10h.

[0017] The gate valve 61 hermetically separates the plasma processing chamber 10 from the vacuum transfer chamber 4. When the gate valve 61 is opened, the object to be transferred, such as the substrate W or ring assembly 112, can be transferred through the transfer port 10h. The gate valve 61 is kept closed when not transferring an object.

[0018] The shutter 62 is closed when plasma processing is being performed in the plasma processing apparatus 1 to prevent plasma from leaking towards the gate valve 61. The shutter 62 protects the gate valve 61 from plasma by preventing plasma from leaking towards the gate valve 61. The shutter 62 moves, for example, in the vertical direction.

[0019] The shower head 13 is configured to introduce at least one processing gas from the gas supply unit 20 into the plasma processing space 10s. The shower head 13 has at least one gas supply port 13a, at least one gas diffusion chamber 13b, and a plurality of gas inlet ports 13c. The processing gas supplied to the gas supply port 13a passes through the gas diffusion chamber 13b and is introduced into the plasma processing space 10s through the plurality of gas inlet ports 13c. The shower head 13 also includes a conductive member. The conductive member of the shower head 13 functions as an upper electrode. In addition to the shower head 13, the gas introduction unit may also include one or more side gas injectors (SGIs) attached to one or more openings formed in the side wall 10a.

[0020] The gas supply unit 20 may include at least one gas source 21 and at least one flow controller 22. In one embodiment, the gas supply unit 20 is configured to supply at least one processing gas to the shower head 13 from a corresponding gas source 21 via a corresponding flow controller 22. Each flow controller 22 may include, for example, a mass flow controller or a pressure-controlled flow controller. Furthermore, the gas supply unit 20 may include one or more flow modulation devices that modulate or pulse the flow rate of at least one processing gas.

[0021] The power supply 30 includes an RF power supply 31 coupled to the plasma processing chamber 10 via at least one impedance matching circuit. The RF power supply 31 is configured to supply at least one RF signal (RF power), such as a source RF signal and a bias RF signal, to the conductive members of the substrate support 11 and / or the showerhead 13. This causes plasma to be formed from at least one processing gas supplied to the plasma processing space 10s. Therefore, the RF power supply 31 can function as at least part of a plasma generation unit configured to generate plasma from one or more processing gases in the plasma processing chamber 10. Furthermore, by supplying a bias RF signal to the conductive members of the substrate support 11, a bias potential is generated on the substrate W, and ionic components in the formed plasma can be drawn into the substrate W.

[0022] In one embodiment, the RF power supply 31 includes a first RF generation unit 31a and a second RF generation unit 31b. The first RF generation unit 31a is coupled to a conductive member of the substrate support unit 11 and / or a conductive member of the shower head 13 via at least one impedance matching circuit and is configured to generate a source RF signal (source RF power) for plasma generation. In one embodiment, the source RF signal has a frequency in the range of 13 MHz to 150 MHz. In one embodiment, the first RF generation unit 31a may be configured to generate a plurality of source RF signals having different frequencies. One or more generated source RF signals are supplied to the conductive member of the substrate support unit 11 and / or a conductive member of the shower head 13. The second RF generation unit 31b is coupled to a conductive member of the substrate support unit 11 via at least one impedance matching circuit and is configured to generate a bias RF signal (bias RF power). In one embodiment, the bias RF signal has a lower frequency than the source RF signal. In one embodiment, the bias RF signal has a frequency in the range of 400 kHz to 13.56 MHz. In one embodiment, the second RF generation unit 31b may be configured to generate a plurality of bias RF signals having different frequencies. The generated bias RF signals are supplied to the conductive member of the substrate support unit 11. In various embodiments, at least one of the source RF signal and the bias RF signal may be pulsed.

[0023] The power supply 30 may also include a DC power supply 32 coupled to the plasma processing chamber 10. The DC power supply 32 includes a first DC generation unit 32a and a second DC generation unit 32b. In one embodiment, the first DC generation unit 32a is connected to a conductive member of the substrate support unit 11 and configured to generate a first DC signal. The generated first bias DC signal is applied to the conductive member of the substrate support unit 11. In one embodiment, the first DC signal may be applied to other electrodes, such as electrodes in an electrostatic chuck. In one embodiment, the second DC generation unit 32b is connected to a conductive member of the shower head 13 and configured to generate a second DC signal. The generated second DC signal is applied to the conductive member of the shower head 13. In various embodiments, at least one of the first and second DC signals may be pulsed. The first and second DC generation units 32a and 32b may be provided in addition to the RF power supply 31, and the first DC generation unit 32a may be provided in place of the second RF generation unit 31b.

[0024] The exhaust system 40 may be connected to, for example, a gas outlet 10e located at the bottom of the plasma processing chamber 10. The exhaust system 40 may include a pressure regulating valve and a vacuum pump. The pressure regulating valve regulates the pressure in the plasma processing space 10s. The vacuum pump may include a turbomolecular pump, a dry pump, or a combination thereof.

[0025] The control unit 2 processes computer-executable instructions that cause the plasma processing apparatus 1 to perform the various processes described herein. The control unit 2 may be configured to control each element of the plasma processing apparatus 1 to perform the various processes described herein. In one embodiment, part or all of the control unit 2 may be included in the plasma processing apparatus 1. The control unit 2 may include, for example, a computer 2a. The computer 2a may include, for example, a processing unit (CPU: Central Processing Unit) 2a1, a storage unit 2a2, and a communication interface 2a3. The processing unit 2a1 may be configured to perform various control operations based on a program stored in the storage unit 2a2. The storage unit 2a2 may include RAM (Random Access Memory), ROM (Read Only Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), or a combination thereof. The communication interface 2a3 may communicate with the plasma processing device 1 via a communication line such as a LAN (Local Area Network).

[0026] [Vacuum Transfer Chamber 4] The vacuum transfer chamber 4 transfers the substrate W or ring assembly 112 to be processed from, for example, an atmospheric pressure environment to the plasma processing apparatus 1. The vacuum transfer chamber 4 is connected to the plasma processing chamber 10. The inside of the vacuum transfer chamber 4 is kept under vacuum. The vacuum transfer chamber 4 is equipped with a transfer robot 70. The transfer robot 70 is installed in the vacuum transfer chamber 4. The transfer robot 70 carries the substrate W or ring assembly 112 into the plasma processing apparatus 1. The transfer robot 70 also carries the substrate W or ring assembly 112 out of the plasma processing apparatus 1. In other words, the transfer robot 70 transports the substrate W or ring assembly 112, which is the object to be transported, to the plasma processing apparatus 1.

[0027] The transport robot 70 comprises a main body 71, an arm 72, and an end effector 73. The end effector 73 is connected to the arm 72. The end effector 73 places the substrate W or ring assembly 112, which is the object to be transported, on it. The arm 72 operates to move the end effector 73 to a desired position. The main body 71 includes a control circuit and a power source for operating the arm 72.

[0028] [Imaging device 5] The imaging device 5 images the substrate W or ring assembly 112, etc., placed on the substrate support section 11 of the plasma processing apparatus 1. The imaging device 5 may be, for example, a still camera or a video camera. The imaging device 5 may also be an infrared camera. Furthermore, the imaging device 5 may be a three-dimensional camera capable of measuring three-dimensional shapes.

[0029] The installation of the imaging device 5 will now be described. Figure 2 is a plan view illustrating the installation of the imaging device 5 in a substrate processing system 100, which is an example of a substrate processing system according to the first embodiment.

[0030] In Figure 2, the state in which the substrate W is placed on the end effector 73 is shown by a dotted line. In Figure 2, the substrate W is transported into the plasma processing apparatus 1 by the end effector 73 moving in the direction of arrow A. That is, arrow A indicates the direction of movement of the end effector 73 (arm 72) when transporting the substrate W.

[0031] The imaging device 5 is installed at the tip 73a of the end effector 73. The imaging device 5 captures an image in the direction of arrow V.

[0032] [System Control Unit 6] The system control unit 6 controls the plasma processing system 3, the vacuum transport chamber 4, and the imaging device 5. The system control unit 6 has the same configuration as the control unit 2. That is, the system control unit 6 includes a computer and is equipped with a CPU, RAM, ROM, etc. For details on the configuration of the system control unit 6, please refer to the description of the control unit 2, and a detailed explanation of the configuration of the system control unit 6 will be omitted here.

[0033] The processing in the system control unit 6 will be described. By describing the processing in the system control unit 6, the procedures executed by the system control unit 6 will be explained. Furthermore, by describing the processing in the system control unit 6, the processes included in the control method of the substrate processing system 100 will be explained.

[0034] Figure 3 is a flowchart illustrating the processing in a substrate processing system 100, which is an example of a substrate processing system according to the first embodiment. Specifically, it is a diagram illustrating the process of unloading a substrate W after processing in the plasma processing apparatus 1.

[0035] (Step S10) First, the system control unit 6 controls the substrate W, which is the object to be transported and is placed on the substrate support surface 111a of the substrate support section 11 in the plasma processing chamber 10, to lift it from the substrate support surface 111a. Specifically, the system control unit 6 commands the control unit 2 in the plasma processing system 3 to lift the substrate W from the substrate support surface 111a. The control unit 2 controls the actuator 52 to move the lifter 51 upward. As the actuator 52 moves the lifter 51 upward, the substrate W is lifted above the substrate support surface 111a. Note that when lifting the substrate W with the lifter 51, the substrate W is destaticized first.

[0036] By performing the processing as described above, the system control unit 6 controls the actuator 52 to lift the substrate W, which is the object to be transported, using the lifter 51 in the plasma processing apparatus 1.

[0037] (Step S20) Next, the system control unit 6 controls the imaging device 5 to image the substrate W, which is the object to be transported and is being lifted by the lifter 51 in the plasma processing chamber 10.

[0038] First, in order to image the substrate W being lifted by the lifter 51, the system control unit 6 commands the control unit 2 in the plasma processing system 3 to open the transport port 10h. The control unit 2 controls the gate valve 61 to open and also controls the shutter 62 to open.

[0039] Next, the system control unit 6 controls the imaging device 5 to image the inside of the plasma processing chamber 10. Specifically, the system control unit 6 controls the transport robot 70 to adjust the position of the end effector 73 so that the inside of the plasma processing chamber 10 can be imaged. At this point, the transport robot 70 is controlled so that the end effector 73 does not enter the inside of the plasma processing chamber 10. The system control unit 6 then commands the imaging device 5 to image the inside of the plasma processing chamber 10. The imaging device 5 receives the command from the system control unit 6 and images the inside of the plasma processing chamber 10. The imaging device 5 transfers the captured image to the system control unit 6. The system control unit 6 acquires the captured image from the imaging device 5.

[0040] The image captured by the imaging device 5 will now be described. Figure 4 is a diagram illustrating the image IMG captured by the imaging device 5 in a substrate processing system 100, which is an example of a substrate processing system according to the first embodiment. In Figure 4, the substrate W, which is the object to be transported, is shown in the desired position.

[0041] The captured image IMG is an image taken by the imaging device 5 through the transport port 10h, capturing the inside of the plasma processing chamber 10. The captured image IMG includes an image IW of the substrate W, an image IP of the lifter 51, and an image IT of the substrate support part 11. The system control unit 6 identifies the position of the substrate W by analyzing the image recognition area R in the captured image IMG shown in Figure 4.

[0042] As described above, imaging by the imaging device 5 is performed after the gate valve 61 and shutter 62 are opened. Furthermore, imaging by the imaging device 5 is performed before the end effector 73 enters the interior of the plasma processing chamber 10.

[0043] (Step S30) Next, the system control unit 6 identifies the position of the substrate W, which is the object to be transported, based on the captured image. The system control unit 6 identifies the position of the substrate W, which is the object to be transported, by comparing (comparing) the image IW of the substrate W in the captured image IMG with, for example, a previously registered image (reference image).

[0044] The system control unit 6 specifies the position of the substrate W using, for example, an image processing technique such as pattern matching or an artificial intelligence-related technique.

[0045] (Step S40) Next, the system control unit 6 performs control to convey the substrate W, which is the object to be conveyed, based on information about the position of the substrate W, which is the object to be conveyed.

[0046] As shown in FIG. 4, for example, when the substrate W, which is the object to be conveyed, is at a desired position, the system control unit 6 performs control to convey the substrate W from the plasma processing chamber 10 to the vacuum transfer chamber 4. Specifically, the system control unit 6 instructs the transfer robot 70 to transfer the substrate W from the plasma processing chamber 10 to the vacuum transfer chamber 4.

[0047] The transfer robot 70 that has received the instruction extends an arm 72 to cause an end effector 73 to enter the interior of the plasma processing chamber 10. Then, the transfer robot 70 places the substrate W on the end effector 73. Next, the transfer robot 70 retracts the arm 72 to withdraw the end effector 73 from the plasma processing chamber 10. As described above, the transfer robot 70 carries the substrate W out of the plasma processing chamber 10 into the vacuum transfer chamber 4.

[0048] For example, when the substrate W, which is the object to be conveyed, as shown in FIG. 4 is not at a desired position, the system control unit 6 stops transferring the substrate W from the plasma processing chamber 10 to the vacuum transfer chamber 4.

[0049] Each of FIGS. 5 to 7 is a diagram for explaining a captured image captured by an imaging device 5 in a substrate processing system 100, which is an example of the substrate processing system according to the first embodiment. Note that FIGS. 5 to 7 show a case where the substrate W, which is the object to be conveyed, is not at a desired position.

[0050] Figure 5 is an image IMG2 showing, for example, a case where the pin of the lifter 51 is broken. If the pin of the lifter 51 is broken, the substrate W will tilt diagonally. Therefore, the image IW of the substrate W in the image IMG2 will be slanted. The system control unit 6 determines that the image IW of the substrate W is slanted by image processing or the like. If the system control unit 6 determines that the image IW of the substrate W is slanted, it stops the transport of the substrate W from the plasma processing chamber 10 to the vacuum transport chamber 4. Then, the system control unit 6 controls the gate valve 61 to close. By closing the gate valve 61, for example, if multiple substrate processing devices are connected to the vacuum transport chamber 4, it is possible to prevent them from affecting other substrate processing devices.

[0051] Figure 6 is an image IMG3 showing, for example, a case where the substrate W itself is cracked. When the substrate W is cracked, the lifter 51 cannot lift the substrate W. Therefore, the image IW of the substrate W in the image IMG3 is not in the predetermined position. The system control unit 6 determines, by image processing, that the image IW of the substrate W is not in the predetermined position. Once the system control unit 6 determines that the image IW of the substrate W is not in the predetermined position, it stops the transport of the substrate W from the plasma processing chamber 10 to the vacuum transport chamber 4. The system control unit 6 then controls the gate valve 61 to close. By closing the gate valve 61, for example, if multiple substrate processing devices are connected to the vacuum transport chamber 4, it is possible to prevent them from affecting other substrate processing devices.

[0052] Figure 7 is an image IMG4 showing, for example, a case where the position of the end effector 73 is misaligned in the transport robot 70. When the position of the end effector 73 is misaligned, the entire image is misaligned, and the entire image is significantly misaligned from the image recognition area R. When the position of the end effector 73 is misaligned, the substrate W cannot be transported correctly. The system control unit 6 determines that the entire captured image is misaligned by image processing, etc. If the system control unit 6 determines that the entire captured image is misaligned, it stops the transport of the substrate W from the plasma processing chamber 10 to the vacuum transport chamber 4. Then, the system control unit 6 controls the gate valve 61 to close. By closing the gate valve 61, for example, if multiple substrate processing devices are connected to the vacuum transport chamber 4, it is possible to prevent them from affecting other substrate processing devices.

[0053] Furthermore, for example, if the degree of displacement of the substrate W is small, the system control unit 6 may control the transport robot 70 to correct the insertion position of the end effector 73. For example, if the position of the specified object to be transported is within the first range, the system control unit 6 determines that transport is possible by controlling the end effector 73. On the other hand, if the position of the specified object to be transported is outside the first range, the system control unit 6 determines that transport is not possible and stops transport.

[0054] Furthermore, if the location of the identified object to be transported is within the first range but outside the second range, the system control unit 6 calculates the amount of deviation of the object from the reference position from the captured image and the reference image, and controls the transport robot 70 taking the calculated amount of deviation into account.

[0055] Furthermore, if the location of the identified object to be transported is within the second range, the system control unit 6 controls the transport robot 70 to unload the object without performing any corrections.

[0056] Furthermore, if the transport of the transported object is stopped, the system control unit 6 may display an alarm or issue an alarm.

[0057] According to the substrate processing system of the first embodiment, the state of the object to be transported can be detected during transport by imaging the object with an imaging device. Furthermore, according to the substrate processing system of the first embodiment, the state of the object to be transported can be confirmed by the imaging device before actual transport. Since the state of the object to be transported can be confirmed by the imaging device before actual transport in the substrate processing system of the first embodiment, transport can be stopped before the transport robot actually transports the object.

[0058] For example, conventionally, when an end effector was equipped with a sensor to determine the presence or absence of a substrate W, the determination of the substrate W was made with the arm extended into the processing chamber. Therefore, if there was no substrate W, the system would stop with the arm extended into the processing chamber. Because the system was stopped with the arm extended into the processing chamber, it was necessary to stop the entire system, including the transport device.

[0059] The substrate processing system according to the first embodiment can detect malfunctions before transport and stop transport, so it is not necessary to stop the entire system. For example, if there are multiple substrate processing devices, the normally functioning substrate processing device can be operated continuously. By operating the substrate processing devices continuously, the overall operating rate of the substrate processing system can be increased.

[0060] In the above explanation, an example of transporting a substrate W was described, but the transported object is not limited to a substrate W. For example, the transported object may be an annular member of the ring assembly 112, such as an edge ring or a covering ring. An example of using an edge ring as the transported object will be described later.

[0061] Furthermore, although the above description described an example of unloading the substrate W, which is the object to be transported, the state of the processing chamber may be determined by imaging the object being loaded using an imaging device. For example, the system control unit may determine whether the lifter has risen unintentionally or whether the position of the end effector has shifted during loading. Also, for example, the system control unit may determine whether the transported substrate is correctly placed on the substrate support.

[0062] Furthermore, although the above description used a plasma processing apparatus as an example, the substrate processing system according to the first embodiment may also be applied to a processing chamber used in a substrate processing apparatus that performs substrate processing other than plasma processing, such as film deposition processing.

[0063] Furthermore, in the substrate processing system according to the first embodiment, changes in the shape of the edge ring may be imaged. For example, the deterioration of the edge ring may be determined by analyzing the imaged image and calculating the cross-sectional area, corner curvature, and thickness of the edge ring. By determining the deterioration of the edge ring, for example, the lifespan of the edge ring or the replacement date may be predicted.

[0064] <Modified Arrangement of Imaging Device> A modified arrangement of the imaging device in the substrate processing system according to the first embodiment will be explained using the substrate processing system 100. In the following figures, arrow A indicates the direction of travel of the end effector 73 (arm 72) when the substrate W is loaded. Arrow V indicates the direction in which the imaging device 5 takes images.

[0065] [Modification 1] Figure 8 is a plan view illustrating modification 1 of the mounting of the imaging device 5 in a substrate processing system 100, which is an example of a substrate processing system according to the first embodiment. As shown in Figure 8, the imaging device 5 may be mounted on the outside of the end effector 73 when viewed from above.

[0066] [Modification 2] Figure 9 is a side view illustrating modification 2 of the mounting of the imaging device 5 in a substrate processing system 100, which is an example of a substrate processing system according to the first embodiment. As shown in Figure 9, the imaging device 5 may be mounted on the lower surface 73S of the end effector 73.

[0067] The above example shows a single imaging device 5, but multiple imaging devices 5 may be provided. When multiple imaging devices are provided, they may be attached to the tip 73a of the end effector 73 as shown in Figure 2, or to the outside of the end effector 73 in a top view as shown in Figure 8, or to the bottom surface 73S of the end effector 73 as shown in Figure 9. Alternatively, the above examples may be combined.

[0068] [Modification 3] Figure 10 is a plan view illustrating modification 3 of the mounting of the imaging device 5 in a substrate processing system 100, which is an example of a substrate processing system according to the first embodiment. Figure 11 is a side view illustrating modification 3 of the mounting of the imaging device 5 in a substrate processing system 100, which is an example of a substrate processing system according to the first embodiment.

[0069] As shown in Figures 10 and 11, the imaging device 5 may be mounted on the upper surface 73T of the end effector 73. By mounting the imaging device 5 on the upper surface 73T of the end effector 73, the state of the substrate W can be monitored when the substrate W is being transported.

[0070] Furthermore, it is preferable that the imaging device 5 be attached to the upper surface 73T of the end effector 73 near the arm 72.

[0071] [Modification 4] Figure 12 is a plan view illustrating modification 4 of the mounting of the imaging device 5 in a substrate processing system 100, which is an example of a substrate processing system according to the first embodiment. Figure 13 is a side view illustrating modification 4 of the mounting of the imaging device 5 in a substrate processing system 100, which is an example of a substrate processing system according to the first embodiment.

[0072] As shown in Figures 12 and 13, the imaging device 5 may be attached to the arm 72. In particular, the imaging device 5 is preferably attached to the axis 72a of the arm 72. By attaching the imaging device 5 to the arm 72, the state of the substrate W can be monitored when the substrate W is transported. Alternatively, the imaging device 5 may be attached to the main body 71. By attaching the imaging device 5 to the main body 71, the sagging of the arm 72 can be prevented.

[0073] Furthermore, it is preferable that the imaging device 5 be attached to the arm 72 near the end effector 73.

[0074] [Modification 5] Figure 14 is a plan view illustrating modification 5 of the mounting of the imaging device 5 in a substrate processing system 100, which is an example of a substrate processing system according to the first embodiment.

[0075] As shown in Figure 14, the substrate processing system 100 may also be equipped with two imaging devices 5 (imaging device 5A and imaging device 5B) on the end effector 73. Imaging devices 5A and 5B are positioned at equidistant locations from the central axis AX of the end effector 73.

[0076] The imaging device 5 may be provided in the plasma processing chamber 10. For example, the imaging device 5 may be provided on the gate valve 61, shutter 62, or side wall 10a in the plasma processing chamber 10. The position of the imaging device 5 is not particularly limited as long as it is in a position where the object to be transported, lifted by the lifter, can be viewed from the side.

[0077] <Modified Examples of the Substrate Processing System> A modified example of the substrate processing system according to the first embodiment will be described. Figure 15 is a diagram illustrating the configuration of a substrate processing system 200, which is an example of a modified example of the substrate processing system according to the first embodiment.

[0078] The substrate processing system 200 comprises a plasma processing system 3, a vacuum transport chamber 4, an imaging device 205, and a system control unit 206. Detailed descriptions of the plasma processing system 3 and the vacuum transport chamber 4 are omitted here, as they are described in the explanation of the substrate processing system 100, which is an example of a substrate processing system according to the first embodiment. Furthermore, the system control unit 206 is equivalent to the system control unit 6 except that it controls the imaging device 205 instead of the imaging device 5 controlled by the system control unit 6; therefore, detailed descriptions are omitted here, as they are described in the explanation of the system control unit 6.

[0079] [Imaging device 205] The imaging device 205 images the substrate W or ring assembly 112, etc., placed on the substrate support section 11 of the plasma processing apparatus 1. The imaging device 205 has the same configuration as the imaging device 5.

[0080] The substrate processing system 200 is equipped with an imaging device 205 on the gate valve 61. The imaging device 205 is provided on the side of the gate valve 61 on the plasma processing space 10s side. When the gate valve 61 is closed, the imaging device 205 is positioned horizontally relative to the substrate support portion 11 and higher vertically than the substrate support surface 111a. For example, the imaging device 205 is provided at the vertical center position of the gate valve 61. By providing the imaging device 205 at a position higher vertically than the substrate support surface 111a, the transported object lifted by the lifter can be observed more clearly.

[0081] In addition, in the substrate processing system according to the first embodiment, an imaging device may be provided on both the end effector and the gate valve in combination with a modified example.

[0082] The above example described an example using a substrate W as the object to be transported, but the object to be transported is not limited to a substrate W. The following example describes an example using an edge ring as the object to be transported.

[0083] Figures 16 to 18 illustrate images captured by the imaging device 5 in a substrate processing system 100, which is an example of a substrate processing system according to the first embodiment. Figure 16 shows the case where the edge ring to be transported is in the desired position, while Figures 17 and 18 show the case where the edge ring to be transported is not in the desired position.

[0084] In Figure 16, the captured image IMG 10 is an image taken by the imaging device 5 through the transport port 10h, showing the inside of the plasma processing chamber 10. The captured image IMG 10 includes an image FR of the edge ring, an image IP2 of the lifter 53, and an image IT of the substrate support portion 11. The system control unit 6 identifies the position of the edge ring by analyzing the image recognition area R in the captured image IMG shown in Figure 16.

[0085] For example, in step S40 described above, as shown in Figure 16, if the edge ring to be transported is in the desired position, the system control unit 6 commands the transport robot 70 to transport the edge ring from the plasma processing chamber 10 to the vacuum transport chamber 4. On the other hand, if the edge ring to be transported is not in the desired position, as shown in Figures 17 and 18 respectively, the system control unit 6 stops transporting the edge ring from the plasma processing chamber 10 to the vacuum transport chamber 4.

[0086] The following is an example of a case where the edge ring is not in the desired position.

[0087] Figure 17 shows an image IMG 11 illustrating, for example, the case where a pin on the lifter 53 is broken. If the pin on the lifter 53 is broken, the edge ring will be tilted. Therefore, the image FR of the edge ring in the image IMG 11 will be tilted. The system control unit 6 determines, through image processing or other means, that the image FR of the edge ring is tilted. If the system control unit 6 determines that the image FR of the edge ring is tilted, it stops the transport of the edge ring from the plasma processing chamber 10 to the vacuum transport chamber 4. Then, the system control unit 6 controls the gate valve 61 to close. By closing the gate valve 61, for example, if multiple substrate processing devices are connected to the vacuum transport chamber 4, it is possible to prevent them from affecting other substrate processing devices.

[0088] Figure 18 shows an image IMG12 illustrating, for example, a case where the edge ring is misaligned and falls from the lifter 53. When the edge ring falls from the lifter 53, it falls onto the substrate support 11, and the image FR of the edge ring is above the image IT. If the edge ring has fallen, it cannot be transported correctly. The system control unit 6 determines that the edge ring has fallen by image processing or the like. If the system control unit 6 determines that the edge ring has fallen, it stops transporting the edge ring from the plasma processing chamber 10 to the vacuum transport chamber 4. The system control unit 6 then controls the gate valve 61 to close. By closing the gate valve 61, for example, if multiple substrate processing devices are connected to the vacuum transport chamber 4, it is possible to prevent them from affecting other substrate processing devices.

[0089] Although the above example described an application to the edge ring, the same method can be applied to the covering ring that constitutes the ring assembly 112.

[0090] <Second Embodiment> An example of a substrate processing system according to the second embodiment is shown in which components are transported by a transport device separate from the vacuum transport chamber (vacuum transport device). The substrate processing system according to the second embodiment comprises a substrate processing device, a transport device equipped with a transport robot for transporting objects into or out of the substrate processing device, and an imaging device. The transport device of the substrate processing system according to the second embodiment controls the transport of objects based on the results of analyzing the captured images taken inside the substrate processing device by the imaging device.

[0091] First, a substrate processing system according to the second embodiment will be described. Figure 19 is a diagram illustrating the configuration of a substrate processing system 300, which is an example of a substrate processing system according to the second embodiment.

[0092] The substrate processing system 300 comprises a substrate processing subsystem 301, a transport device 350, a storage device 360, and a control device 370. The control device 370 controls the substrate processing subsystem 301, the transport device 350, and the storage device 360, respectively. The control device 370 communicates with the substrate processing subsystem 301, the transport device 350, and the storage device 360 ​​wirelessly or via wired connection. Note that the control device 370 is an example of a system control unit.

[0093] The substrate processing subsystem 301 includes a vacuum transport chamber 310 and substrate processing devices 321, 322, 323, 324, 325, and 326. The substrate processing subsystem 301 also includes load lock chambers 331 and 332 and an atmospheric pressure transport chamber 340. When it is not necessary to distinguish between substrate processing devices 321, 322, 323, 324, 325, and 326, they may be collectively referred to as the substrate processing device 320. Similarly, when it is not necessary to distinguish between load lock chambers 331 and 332, they may be collectively referred to as the load lock chamber 330.

[0094] The substrate processing subsystem 301 comprises a plurality of substrate processing devices 320, specifically six substrate processing devices 320. The number of substrate processing devices 320 in the substrate processing subsystem 301 is not limited to six; it may be one or two or more. The substrate processing subsystem 301 also comprises a plurality of load lock chambers 330, specifically two load lock chambers 330. The number of load lock chambers 330 in the substrate processing subsystem 301 is not limited to two; it may be one or three or more.

[0095] The vacuum transport chamber 310 is connected to the substrate processing apparatus 321, substrate processing apparatus 322, substrate processing apparatus 323, substrate processing apparatus 324, substrate processing apparatus 325, substrate processing apparatus 326, load lock chamber 331, and load lock chamber 332, respectively.

[0096] The substrate processing subsystem 301 includes a robotic arm 315 in a vacuum transport chamber 310. The inside of the vacuum transport chamber 310 is maintained at a predetermined vacuum level. The robotic arm 315 removes the substrate W before processing from either the load lock chamber 331 or the load lock chamber 332, which has been reduced to a predetermined vacuum level. The robotic arm 315 then transports the removed substrate W into one of the multiple substrate processing devices 320. The robotic arm 315 also removes the processed substrate W from one of the multiple substrate processing devices 320. The robotic arm 315 then transports the removed substrate W to a different substrate processing device 320 than the one from which it was removed. The robotic arm 315 also transports the removed substrate W into either the load lock chamber 331 or the load lock chamber 332.

[0097] Each of the substrate processing apparatuses 321, 322, 323, 324, 325, and 326 performs processes on the substrate W, such as etching or film deposition, under low-pressure conditions.

[0098] Each of the multiple substrate processing devices 320 may be a device that performs the same process in the manufacturing process, or it may be a device that performs different processes.

[0099] Each of the multiple substrate processing devices 320 is equipped with consumable parts that wear out depending on the processing performed on the substrate W. These consumable parts include, for example, edge rings and cover rings.

[0100] Each of the multiple substrate processing units 320 is equipped with a gate valve 320g that separates it from the vacuum transport chamber 310. Furthermore, each of the multiple substrate processing units 320 is equipped with a gate valve 320h for unloading used consumable parts and loading new consumable parts.

[0101] Each of the load lock chambers 331 and 332 is equipped with a gate valve 330g that separates it from the vacuum conveying chamber 310. Each of the load lock chambers 331 and 332 is equipped with a gate valve 330h that separates it from the atmospheric pressure conveying chamber 340.

[0102] Each of the load lock chambers 331 and 332 switches the internal pressure from a predetermined vacuum pressure to atmospheric pressure, or from atmospheric pressure to a predetermined vacuum pressure.

[0103] The substrate processing subsystem 301 includes a robotic arm 345 in an atmospheric pressure transport chamber 340. The atmospheric pressure transport chamber 340 is equipped with a plurality of load ports 341. Each of the plurality of load ports 341 is connected to a container (for example, a FOUP: Front Opening Unified Pod) capable of accommodating multiple substrates W before or after processing. The inside of the atmospheric pressure transport chamber 340 is at atmospheric pressure.

[0104] The robot arm 345 removes the substrate W before processing from the container connected to the load port 341 and transports it into the load lock chamber 331 or load lock chamber 332. The robot arm 345 also removes the processed substrate W from the load lock chamber 331 or load lock chamber 332 and transports it into the container connected to the load port 341.

[0105] The substrate processing subsystem 301 may include an alignment unit in the atmospheric pressure transport chamber 340 that adjusts the orientation of the substrate W removed from the container connected to the load port 341.

[0106] The transport device 350 transports, for example, deposit shields and upper electrodes to each of the multiple substrate processing devices 320. The transport device 350 is equipped with an imaging device similar to the imaging device 5 described above. The transport device 350 is also equipped with a transport robot similar to the transport robot 70 described above. The transport device 350 controls the transport of the transported objects by determining, based on the image captured by the imaging device, whether to transport the transported objects to or from each of the multiple substrate processing devices 320. In other words, the transport device 350 controls the transport of the transported objects based on the results of analyzing the image captured by the imaging device of the inside of the substrate processing device. From the viewpoint of the control method of the substrate processing system 300, the transport device is controlled to transport the transported objects based on the results of analyzing the image captured by the imaging device of the inside of the substrate processing device.

[0107] Furthermore, the control device 370 may determine, based on the image captured by the imaging device, whether to transport the object to be transported to or from each of the multiple substrate processing devices 320. When the control device 370 determines whether to transport the object to be transported to or from each of the multiple substrate processing devices 320, the control device 370 may control the transport device 350 to perform the desired operation.

[0108] The storage device 360 ​​stores new deposit shields, upper electrodes, and other components that are transported by the transport device 350. The storage device 360 ​​also stores recovered used deposit shields, upper electrodes, and other components that are transported by the transport device 350.

[0109] Since the processing related to the transport of the transported object is the same as the processing in the substrate processing system according to the first embodiment, details of the processing will be explained by referring to the description of the substrate processing system according to the first embodiment. Here, we will explain the image captured by the imaging device.

[0110] <Examples of what is judged to be normal> Figures 20 to 22 are diagrams illustrating images captured by the imaging device in the substrate processing system according to the second embodiment. Figures 20 to 22 each show examples of what is judged to be normal when transporting. In the following examples, an example of transporting the upper electrode will be described. Figure 20 is an example of when the transported object is brought in, and Figures 21 and 22 are examples of when the transported object is brought out. In Figures 20 to 22, the captured image IMG20, captured image IMG21, and captured image IMG23 are images of the inside of the chamber of the substrate processing device 320 captured by the imaging device provided in the transport device 350 through the open gate valve 320h.

[0111] Figure 20 shows the captured image IMG20 when the state is judged to be normal before the upper electrode is loaded. The captured image IMG20 includes the image IT of the substrate support. Since the upper electrode has not yet been loaded, the captured image IMG20 does not include the image of the upper electrode. The transport device 350 confirms that the image of the upper electrode is not included by analyzing the image recognition area R in the captured image IMG20 shown in Figure 20.

[0112] Figure 21 shows the captured image IMG21 when the upper electrode is installed and the system is judged to be normal. The captured image IMG21 includes the image CEL of the upper electrode and the image IT of the substrate support. The upper electrode is assumed to be located at the top of the chamber. Since the upper electrode is located at the top of the chamber, the captured image IMG21 includes the image CEL of the upper electrode at the top. The transport device 350 confirms that the image CEL of the upper electrode is included at the top by analyzing the image recognition area R in the captured image IMG21 shown in Figure 21.

[0113] Figure 22 shows the captured image IMG22 when the upper electrode is installed and the system is judged to be normal. The captured image IMG22 includes the image CEL of the upper electrode and the image IT of the substrate support. It is assumed that the upper electrode has been moved from the top to the bottom of the chamber for transport. Since the upper electrode has been moved from the top to the bottom of the chamber, the captured image IMG22 includes the image CEL of the upper electrode in the center. The transport device 350 confirms that the image CEL of the upper electrode is included in the center by analyzing the image recognition area R in the captured image IMG22 shown in Figure 22.

[0114] <Examples of abnormalities> Figures 23 to 27 are diagrams illustrating images captured by the imaging device in the substrate processing system according to the second embodiment. Figures 23 to 27 each show examples of abnormalities that may occur during transport. The following examples describe the transport of the upper electrode. Figures 23 and 24 are examples of transporting an object, Figures 25 and 26 are examples of transporting an object, and Figure 27 is an example of transporting an object or transporting an object. In Figures 23 to 27, the images IMG23 to IMG27 are images taken by the imaging device of the transport device 350 through the open gate valve 320h, capturing the inside of the chamber of the substrate processing device 320.

[0115] Figure 23 shows the captured image IMG23 in a state before the upper electrode is loaded, when it is determined to be abnormal. The captured image IMG23 includes the image CEL of the upper electrode and the image IT of the substrate support. Since this is before the upper electrode is loaded, under normal circumstances the captured image would not include the image CEL of the upper electrode, but the captured image IMG23 includes the image CEL of the upper electrode. Therefore, the transport device 350 analyzes the image recognition area R in the captured image IMG23 shown in Figure 23 and determines that it is abnormal because it includes the image CEL of the upper electrode. Note that in Figure 23, the upper electrode is shown in a state where it has moved downwards.

[0116] Figure 24 shows the captured image IMG24 in a state before the upper electrode is loaded, when it is determined to be abnormal. The captured image IMG24 includes the image CEL of the upper electrode and the image IT of the substrate support. Since this is before the upper electrode is loaded, under normal circumstances the captured image would not include the image CEL of the upper electrode, but the captured image IMG24 includes the image CEL of the upper electrode. Therefore, the transport device 350 analyzes the image recognition area R in the captured image IMG24 shown in Figure 24 and determines that it is abnormal because it includes the image CEL of the upper electrode. Note that in Figure 24, the upper electrode is shown fixed to the top.

[0117] Figure 25 shows the captured image IMG25 in a state before the upper electrode is removed, when it is determined to be abnormal. The captured image IMG25 includes only the image IT of the substrate support. Since this is before the upper electrode is removed, under normal circumstances the captured image would include the image CEL of the upper electrode, but the captured image IMG25 does not include the image CEL of the upper electrode. Therefore, the transport device 350 analyzes the image recognition area R in the captured image IMG25 shown in Figure 25 and determines that it is abnormal because the image CEL of the upper electrode is not included.

[0118] Figure 26 shows the captured image IMG26 when the upper electrode is judged to be abnormal before being unloaded. The captured image IMG26 includes the image CEL of the upper electrode and the image IT of the substrate support. However, the image CEL of the upper electrode is tilted at an angle. If the upper electrode is tilted at an angle, the end effector of the transport robot may collide with the upper electrode, and the transport robot may not be able to unload the upper electrode properly. Therefore, the transport device 350 analyzes the image recognition area R in the captured image IMG24 shown in Figure 24 and determines that the image CEL of the upper electrode is tilted at an angle, thus determining that there is an abnormality.

[0119] Figure 27 shows the captured image IMG27 when an abnormality is determined to occur before the upper electrode is loaded or unloaded. The captured image IMG27 shows a state in which the image recognition area R is significantly misaligned. A significant misalignment of the image recognition area R, as in the captured image IMG27, suggests that the position of the chamber or end effector is misaligned. Therefore, the transport device 350 determines an abnormality by analyzing the misalignment of the image recognition area R in the captured image IMG27 shown in Figure 27.

[0120] According to the substrate processing system of the second embodiment, the state of the object to be transported can be detected during transport by imaging the object with an imaging device. Furthermore, according to the substrate processing system of the second embodiment, the state of the object to be transported can be confirmed by the imaging device before actual transport. Since the state of the object to be transported can be confirmed by the imaging device before actual transport in the substrate processing system of the second embodiment, transport can be stopped before the transport robot actually transports the object.

[0121] The embodiments disclosed above include, for example, the following aspects.

[0122] [Note 1] A substrate processing system comprising: a processing chamber comprising a substrate support section, a lifter for raising and lowering an object to be transported, and an actuator for raising and lowering the lifter; a vacuum transport chamber in which a transport robot is installed, connected to the processing chamber and comprising an arm, and an end effector connected to the arm and on which the object to be transported is placed; an imaging device; and a system control unit, wherein the system control unit performs: (a) controlling the actuator to lift the object to be transported by the lifter; (b) controlling the imaging device to acquire an image including the object to be transported lifted by the lifter before the end effector enters the interior of the processing chamber in order to transport the object to be transported out of the processing chamber; (c) identifying the position of the object to be transported based on the image; and (d) controlling the transport of the object to be transported from the processing chamber to the vacuum transport chamber based on the identified position of the object to be transported.

[0123] [Note 2] The substrate processing system according to Note 1, wherein the processing chamber is provided with a gate valve separating it from the vacuum transport chamber, and the imaging device is provided on the side of the gate valve that faces the processing space of the processing chamber.

[0124] [Note 3] The substrate processing system according to Note 2, wherein the imaging device is provided at a position higher in the height direction than the substrate support surface of the substrate support portion when the gate valve is closed.

[0125] [Note 4] The substrate processing system according to Note 1, further comprising one or more imaging devices at the tip of the end effector.

[0126] [Note 5] The substrate processing system according to Note 1, further comprising one or more imaging devices on the upper surface of the end effector.

[0127] [Note 6] The substrate processing system according to Note 1, further comprising one or more imaging devices on the upper surface of the end effector near the arm.

[0128] [Note 7] The substrate processing system according to Note 1, further comprising one or more imaging devices on the upper surface of the arm near the end effector.

[0129] [Appendix 8] The substrate processing system according to Appendix 1, further comprising at least two imaging devices positioned equidistant from the central axis of the end effector.

[0130] [Note 9] The substrate processing system according to Note 1, wherein the processing chamber comprises a gate valve separating it from the vacuum transport chamber, and a shutter provided inside the gate valve to protect the gate valve from plasma, and the imaging device takes an image after the shutter opens.

[0131] [Note 10] The substrate processing system according to Note 1, wherein the processing chamber comprises a gate valve separating it from the vacuum transport chamber, and a shutter provided inside the gate valve to protect the gate valve from plasma, the imaging device is provided on the end effector or the arm, and the imaging device takes images after the gate valve and the shutter are opened.

[0132] [Note 11] The substrate processing system according to any one of Notes 1 to 10, wherein the system control unit in (c) identifies the position of the transported object by comparing the captured image with a previously acquired reference image.

[0133] [Note 12] The substrate processing system according to any one of Notes 1 to 11, wherein the system control unit stops transporting the transported object if the location of the transported object specified in (d) is outside the first range.

[0134] [Note 13] The substrate processing system according to any one of Notes 1 to 11, wherein the system control unit, in (d), displays an alarm and / or issues an alarm if the location of the object to be transported, which has been identified, is outside the first range.

[0135] [Note 14] The substrate processing system according to any one of Notes 1 to 11, wherein, in (d), if the position of the object to be transported is within the first range but outside the second range, the system control unit calculates the amount of deviation of the object to be transported from the reference position from the captured image and the reference image, and controls the transport robot to receive the object to be transported, taking into account the calculated amount of deviation.

[0136] [Note 15] The substrate processing system according to any one of Notes 1 to 14, wherein the object to be transported is a substrate or an edge ring, and the object to be transported is lifted by the lifter after static discharge.

[0137] [Note 16] The substrate processing system according to any one of Notes 1 to 15, wherein the imaging device is an infrared camera or a three-dimensional camera.

[0138] [Note 17] A control method for a substrate processing system comprising: a processing chamber comprising a substrate support section, a lifter for raising and lowering an object to be transported, and an actuator for raising and lowering the lifter; a vacuum transport chamber in which a transport robot is installed, connected to the processing chamber and comprising an arm, and an end effector connected to the arm and on which the object to be transported is placed; and an imaging device, the control method for a substrate processing system comprising: (a) controlling the actuator to lift the object to be transported by the lifter; (b) controlling the imaging device to acquire an image including the object to be transported lifted by the lifter before the end effector enters the interior of the processing chamber in order to transport the object to be transported out of the processing chamber; (c) identifying the position of the object to be transported based on the image; and (d) controlling the transport of the object to be transported from the processing chamber to the vacuum transport chamber based on the identified position of the object to be transported.

[0139] [Note 18] A substrate processing system comprising: a substrate processing apparatus; a transport device equipped with a transport robot for transporting objects into or out of the substrate processing apparatus; and an imaging device, wherein the transport device controls the transport of the objects based on the results of analyzing images captured by the imaging device of the inside of the substrate processing apparatus.

[0140] [Note 19] A control method for a substrate processing system comprising: a substrate processing apparatus; a transport device equipped with a transport robot for transporting objects to be transported into or out of the substrate processing apparatus; and an imaging device, wherein the transport device is controlled to transport the objects to be transported based on the results of analyzing an image captured by the imaging device of the inside of the substrate processing apparatus.

[0141] The substrate processing systems according to the embodiments disclosed herein should be considered in all respects as illustrative and not restrictive. The above embodiments can be modified and improved in various ways without departing from the scope and spirit of the appended claims. The matters described in the above embodiments can be otherwise configured and combined in a non-consistent manner.

[0142] This application claims priority to Basic Patent Application No. 2025-047639, filed with the Japan Patent Office on March 24, 2025, the entire contents of which are incorporated herein by reference.

[0143] 1 Plasma processing apparatus 2 Control unit 3 Plasma processing system 4 Vacuum transport chamber 5, 5A, 5B, 205 Imaging device 6, 206 System control unit 10 Plasma processing chamber 11 Substrate support unit 51, 53 Lifter 52, 54 Actuator 61 Gate valve 62 Shutter 70 Transport robot 71 Main body 72 Arm 72a Axis 73 End effector 73a Tip 73S Bottom surface 73T Top surface 100, 200, 300 Substrate processing system 112 Ring assembly 350 Transport device 370 Control device W Substrate

Claims

1. A substrate processing system comprising: a processing chamber comprising a substrate support section, a lifter for raising and lowering an object to be transported, and an actuator for raising and lowering the lifter; a vacuum transport chamber in which a transport robot is installed, connected to the processing chamber and comprising an arm, and an end effector connected to the arm and on which the object to be transported is placed; an imaging device; and a system control unit, wherein the system control unit performs the following: (a) controlling the actuator to lift the object to be transported by the lifter; (b) controlling the imaging device to acquire an image including the object to be transported lifted by the lifter before the end effector enters the interior of the processing chamber in order to discharge the object to be transported from the processing chamber; (c) identifying the position of the object to be transported based on the image; and (d) controlling the transport of the object to be transported from the processing chamber to the vacuum transport chamber based on the identified position of the object to be transported.

2. The substrate processing system according to claim 1, wherein the processing chamber is provided with a gate valve separating it from the vacuum transport chamber, and the imaging device is provided on the side of the gate valve facing the processing space of the processing chamber.

3. The substrate processing system according to claim 2, wherein the imaging device is provided at a position higher in the height direction than the substrate support surface of the substrate support portion when the gate valve is closed.

4. The substrate processing system according to claim 1, further comprising one or more imaging devices at the tip of the end effector.

5. The substrate processing system according to claim 1, further comprising one or more imaging devices on the upper surface of the end effector.

6. The substrate processing system according to claim 1, further comprising one or more imaging devices on the upper surface of the end effector near the arm.

7. The substrate processing system according to claim 1, further comprising one or more imaging devices on the upper surface of the arm near the end effector.

8. The substrate processing system according to claim 1, further comprising at least two imaging devices positioned equidistant from the central axis of the end effector.

9. The substrate processing system according to claim 1, wherein the processing chamber comprises a gate valve separating it from the vacuum transport chamber, and a shutter provided inside the gate valve to protect the gate valve from plasma, and the imaging device takes an image after the shutter has opened.

10. The substrate processing system according to claim 1, wherein the processing chamber comprises a gate valve separating it from the vacuum transport chamber, and a shutter provided inside the gate valve to protect the gate valve from plasma, the imaging device is provided on the end effector or the arm, and the imaging device takes images after the gate valve and the shutter are opened.

11. The substrate processing system according to any one of claims 1 to 10, wherein the system control unit in (c) identifies the position of the object to be transported by comparing the captured image with a previously acquired reference image.

12. The substrate processing system according to any one of claims 1 to 10, wherein the system control unit stops transporting the transported object if the location of the transported object identified in (d) is outside the first range.

13. The substrate processing system according to any one of claims 1 to 10, wherein the system control unit, in (d), displays an alarm and issues an alarm if the specified position of the transported object is outside the first range.

14. The substrate processing system according to any one of claims 1 to 10, wherein, in (d), if the position of the object to be transported is within a first range but outside a second range, the system control unit calculates the amount of deviation of the object to be transported from the reference position from the captured image and the reference image, and controls the transport robot to receive the object to be transported, taking into account the calculated amount of deviation.

15. The substrate processing system according to any one of claims 1 to 10, wherein the object to be transported is a substrate or an edge ring, and the object to be transported is lifted by the lifter after static discharge.

16. The substrate processing system according to any one of claims 1 to 10, wherein the imaging device is an infrared camera or a three-dimensional camera.

17. A control method for a substrate processing system comprising: a processing chamber comprising a substrate support section, a lifter for raising and lowering an object to be transported, and an actuator for raising and lowering the lifter; a vacuum transport chamber in which a transport robot is installed, connected to the processing chamber and comprising an arm, and an end effector connected to the arm and on which the object to be transported is placed; and an imaging device, the control method for a substrate processing system comprising: (a) controlling the actuator to lift the object to be transported by the lifter; (b) controlling the imaging device to acquire an image including the object to be transported lifted by the lifter before the end effector enters the interior of the processing chamber in order to transport the object to be transported out of the processing chamber; (c) identifying the position of the object to be transported based on the image; and (d) controlling the transport of the object to be transported from the processing chamber to the vacuum transport chamber based on the identified position of the object to be transported.

18. A substrate processing system comprising: a substrate processing apparatus; a transport device equipped with a transport robot for transporting objects into or out of the substrate processing apparatus; and an imaging device, wherein the transport device controls the transport of the objects based on the results of analyzing images captured by the imaging device of the inside of the substrate processing apparatus.

19. A control method for a substrate processing system comprising: a substrate processing device; a transport device equipped with a transport robot for transporting objects to be transported into or out of the substrate processing device; and an imaging device, wherein the transport device is controlled to transport the objects to be transported based on the results of analyzing an image captured by the imaging device of the inside of the substrate processing device.

Images