Resin composition and cured film

Abstract

The purpose of the present invention is to provide a resin composition capable of forming a cured film that has a low linear expansion coefficient.　The present invention provides a resin composition which contains an epoxy resin, alumina particles, and a flux, wherein the product X of the amount of surface hydroxyl groups (groups / nm2) of the alumina particles and the value of the water solubility log S of the flux is 8.0 (groups / nm2) or more. It is preferable that the D50 on a volume basis in the cumulative particle size distribution of the alumina particles is 3.0 μm or less, and it is also preferable that the α emission rate of the alumina particles is 0.006 cph / cm2 or less.

Description

Resin composition and cured film

[0001] This invention relates to a resin composition and a cured film.

[0002] In recent years, with the advancement of high integration and miniaturization of semiconductor devices, advanced packaging technologies such as flip-chip mounting technology and fan-out wafer-level packaging (FOWLP) have been widely adopted. In these technologies, underfill materials play an important role in ensuring high reliability of the connection between the chip and the substrate. Underfill materials such as capillary underfill (CUF), non-conductive paste (NCP), and non-conductive film (NCF) are used, and examples of such underfill materials are known, such as those described in Patent Documents 1 and 2.

[0003] International Publication No. 2016 / 060088, Japanese Patent Publication No. 2016-46299

[0004] With advancements in packaging technology, the integration and high-density mounting of individual components are accelerating. Underfill materials are preferred to have a low coefficient of thermal expansion to prevent warping and stress concentration. However, with the increasing integration and high-density mounting of components in recent years, there is a demand for even lower coefficients of thermal expansion to further reduce warping and stress concentration. However, no materials with sufficiently low coefficients of thermal expansion are known, making the development of underfill materials suitable for high integration and high-density mounting a challenge.

[0005] This invention was made against the backdrop of the aforementioned technical problems. In other words, the object of this invention is to provide a resin composition capable of forming a cured film with a low coefficient of thermal expansion.

[0006] The present invention, which has achieved the above objectives, is as follows: [1] comprising epoxy resin, alumina particles and flux, wherein the surface hydroxyl groups of the alumina particles (particles / nm) ２ ) and the product X of the water solubility value of the flux: logS is 8.0 (particles / nm) ２[2] A resin composition having a volume basis D50 in the cumulative particle size distribution of the alumina particles of 3.0 μm or less. [3] The resin composition according to [1], wherein the α dose of the alumina particles is 0.006 cph / cm². ２ The resin composition according to [1] or [2] below. [4] The BET specific surface area S of the alumina particles is 0.9 m². ２ A resin composition according to any one of [1] to [3], wherein the amount is 1 / g or more. [5] A resin composition according to any one of [1] to [4], wherein the epoxy resin is a polyfunctional epoxy resin. [6] A resin composition according to any one of [1] to [5], wherein the flux is a carboxylic acid. [7] A resin composition according to any one of [1] to [6], wherein the flux content is 0.5 to 20 parts by mass per 100 parts by mass of the alumina particles. [8] A resin composition according to any one of [1] to [7], wherein the alumina particles may further contain inorganic particles (excluding alumina particles), and the content of the alumina particles is 50% by mass or more of the total of 100% by mass of the alumina particles and the inorganic particles (excluding alumina particles). [9] A resin composition according to any one of [1] to [8], further containing a curing accelerator.

[10] A resin composition according to any one of [1] to [9] for semiconductor encapsulation.

[11] A resin composition according to

[10] for pre-supplied underfill. A cured film of the resin composition described in any of

[12] [1] to [9].

[0007] The present invention provides a resin composition capable of forming a cured film with a low coefficient of thermal expansion.

[0008] <Resin Composition> The resin composition according to the present invention comprises an epoxy resin, alumina particles, and flux, wherein the surface hydroxyl groups of the alumina particles (particles / nm) ２ ) and the product of the water solubility of the flux: logS value is 8.0 (particles / nm) ２), characterized in that it is greater than or equal to the above. When the amount of surface hydroxyl groups on the alumina particles is large, and logS, which is the logarithmic expression of the dissolution amount S (g) of the flux in 100 g of water, is large, chemical bonding and physical bonding between the alumina particles and the flux are promoted. Therefore, it is considered that a large value of X, which is the product of these factors, can strengthen the interface between the alumina particles and the flux. Strengthening the interface between the alumina particles and the flux can reduce the linear expansion coefficient of the cured film. From this perspective, the X value is 8.0 pieces / nm ２ or more, preferably 8.5 pieces / nm ２ or more, more preferably 9.0 pieces / nm ２ or more, still more preferably 10 pieces / nm ２ or more, even more preferably 15 pieces / nm ２ or more, particularly preferably 20 pieces / nm ２ or more. On the other hand, if the X value is too large, the flux will excessively aggregate around alumina, which tends to inhibit the crosslinking of the epoxy resin. As a result, the crosslinking density decreases and Tg tends to decrease. Therefore, the X value is preferably 30 pieces / nm ２ or less, more preferably 25 pieces / nm ２ or less, still more preferably 22 pieces / nm ２ or less, for example 20 pieces / nm ２ or less may be acceptable.

[0009] As long as the value X satisfies the above range, the value of the amount of surface hydroxyl groups of the alumina particles and the value of water solubility of the flux: logS are not limited, but for example, the following ranges are preferred. The amount of surface hydroxyl groups of the alumina particles is preferably 6.0 pieces / nm ２ or more, more preferably 7.0 pieces / nm ２ or more, still more preferably 8.0 pieces / nm ２ or more, even more preferably 9.0 pieces / nm ２ or more, and preferably 20.0 pieces / nm ２ or less, more preferably 15.0 pieces / nm ２ or less, still more preferably 13.0 pieces / nm ２ or less, even more preferably 12.5 pieces / nm ２ or less, for example 12.0 pieces / nm２ or less, or 11.5 pieces / nm ２ or less. When the amount of surface hydroxyl groups of the alumina particles falls within the above range, it is easy to adjust the value X to the above range, the linear expansion coefficient of the obtained cured film can be reduced, and Tg can be further easily increased. The amount of surface hydroxyl groups of alumina particles can be measured by the method described in the examples below. When a plurality of types of alumina particles are contained in the resin composition, the amount of surface hydroxyl groups may be measured in a state where the plurality of types of alumina particles are mixed. The amount of surface hydroxyl groups of alumina particles can be adjusted by treating the surface of alumina particles with an acidic solution, or surface-treating alumina particles with a surface treatment agent such as a silane coupling agent. Water solubility of flux: logS is preferably 0.50 or more, more preferably 0.60 or more, still more preferably 0.70 or more, and may be, for example, 0.80 or more, 0.90 or more, or 0.95 or more. Further, logS is preferably 3.00 or less, more preferably 2.50 or less, still more preferably 2.20 or less, even more preferably 2.00 or less, and particularly preferably 1.99 or less. When the water solubility logS of the flux falls within the above range, it is easy to adjust the value X to the above range, the linear expansion coefficient of the obtained cured film can be reduced, and Tg can be further easily increased. The water solubility logS of the flux can be calculated by the method described in the examples below. When a plurality of types of flux are contained in the resin composition, logS may be calculated as a weighted average of the logS of each calculated flux.

[0010] Hereinafter, components contained in the resin composition will be described in detail. Unless otherwise specified, the compounds exemplified as each component may be used alone or in combination of two or more thereof. In the present disclosure, the term "resin composition" is a concept that broadly encompasses varnishes, paste-like resin compositions, sheet-like resin compositions, and the like, and refers to a resin composition before curing.

[0011] <Epoxy Resin> The term "epoxy resin" is used to mean both epoxy compounds having epoxy groups and polymers of said epoxy compounds. As for the epoxy resin, any resin containing epoxy groups (preferably glycidyl groups) in its molecule can be used without particular limitations. As for the epoxy resin, a polyfunctional epoxy resin having two or more epoxy groups (preferably glycidyl groups) in its molecule (preferably 2 to 6, more preferably 2 to 5, and even more preferably 2 to 4) is preferred. A polyfunctional epoxy resin can form a high-density crosslinked structure, and the cured film after curing has good heat resistance.

[0012] As for the epoxy resin, from the viewpoint of improving the heat resistance of the cured film, it is preferable to include a polyfunctional epoxy resin having three or more glycidyl groups in its molecule. To further improve the heat resistance of the cured film and to make the cured film have a low coefficient of linear expansion, it is even more preferable to include a trifunctional epoxy resin having three glycidyl groups in its molecule. Furthermore, to further improve the heat resistance of the cured film and to make the cured film have a low coefficient of linear expansion, it is even more preferable to include two types: the trifunctional epoxy resin and a bifunctional epoxy resin having two glycidyl groups in its molecule. When the resin composition contains these two types of polyfunctional epoxy resins, the amount of the trifunctional epoxy resin is preferably 50 parts by mass or more and 500 parts by mass or less, more preferably 100 parts by mass or more and 400 parts by mass or less, and even more preferably 150 parts by mass or more and 300 parts by mass or less, per 100 parts by mass of the bifunctional epoxy resin.

[0013] The epoxy equivalent of the epoxy resin is preferably 50 g / eq to 300 g / eq, more preferably 60 g / eq to 250 g / eq, and even more preferably 70 g / eq to 200 g / eq. Within this range, a cured film with a low coefficient of thermal expansion and excellent heat resistance can be formed. When the resin composition contains two or more epoxy resins, the epoxy equivalent of the epoxy resin is determined by the amount of component i added to W ｉ (g) The epoxy equivalent of component i is E ｉ If we consider (g / eq), then Σ(W ｉ ) / Σ(W ｉ / E ｉ It is determined by ).

[0014] Examples of the epoxy resin include: bisphenol-type epoxy resins such as bisphenol A type epoxy resin, bisphenol AP type epoxy resin, bisphenol AF type epoxy resin, bisphenol B type epoxy resin, bisphenol BP type epoxy resin, bisphenol C type epoxy resin, bisphenol E type epoxy resin, bisphenol F type epoxy resin, bisphenol G type epoxy resin, bisphenol M type epoxy resin, bisphenol S type epoxy resin, bisphenol P type epoxy resin, bisphenol PH type epoxy resin, bisphenol TMC type epoxy resin, bisphenol Z type epoxy resin, and hexanediol bisphenol S diglycidyl ether; novolac phenol type epoxy resin; biphenyl type epoxy resin; naphthalene type epoxy resin; dicyclopentadiene type epoxy resin; bixylenol type epoxy resin such as bixylenol diglycidyl ether; hydrogenated bisphenol type epoxy resin such as hydrogenated bisphenol A glycidyl ether, and dibasic acid-modified diglycidyl ether type epoxy resins derived therefrom; aliphatic epoxy resin; phenylcyclohexyl type epoxy resin; triazine type epoxy resin; glycidylamine type epoxy resins such as triglycidyl p-aminophenol, N-[2-methyl-4-(oxiranylmethoxy)phenyl]-N-(oxiranylmethyl)oxiranemethanamine, tetraglycidyldiaminodiphenylmethane, and tetraglycidyl metaxylylenediamine; and tetrakisphenolethane type epoxy resin.

[0015] As for the epoxy resin, from the viewpoint of reducing the coefficient of linear expansion of the cured film and further improving heat resistance, bisphenol-type epoxy resin, novolacphenol-type epoxy resin, naphthalene-type epoxy resin, or glycidylamine-type epoxy resin are preferred, and it is more preferable that the resin composition contains at least a bisphenol-type epoxy resin and / or a glycidylamine-type epoxy resin. When the resin composition contains a bisphenol-type epoxy resin and a glycidylamine-type epoxy resin, the content of the glycidylamine-type epoxy resin is preferably 50 parts by mass or more and 500 parts by mass or less, more preferably 100 parts by mass or more and 400 parts by mass or less, and even more preferably 150 parts by mass or more and 300 parts by mass or less, per 100 parts by mass of the bisphenol-type epoxy resin. By keeping it within the above range, the coefficient of linear expansion of the cured film can be reduced and the heat resistance can be further improved.

[0016] The epoxy resin content in the resin composition is preferably 1% to 50% by mass, more preferably 10% to 40% by mass, and even more preferably 15% to 30% by mass, based on 100% by mass of the solid content of the resin composition. By keeping it within this range, the coefficient of linear expansion of the cured film can be reduced, and the heat resistance can be further improved.

[0017] In this invention, the solid content of the resin composition refers to the components that remain as solids after heating the resin composition at 150°C for 10 minutes. Specifically, it excludes components that evaporate or volatilize upon heating (e.g., solvents). Even components that are liquid at 25°C are included in the solid content if they remain in the resin composition after heating.

[0018] <Alumina Particles> The volume-based D50 in the cumulative particle size distribution of alumina particles is preferably 3.0 μm or less, more preferably 2.4 μm or less, even more preferably 2.0 μm or less, even more preferably 1.5 μm or less, particularly preferably 1.0 μm or less, particularly more preferably 0.5 μm or less, preferably 0.01 μm or more, more preferably 0.1 μm or more, and even more preferably 0.2 μm or more. Within the above range, the dispersibility of alumina particles in the resin composition is good, and the coefficient of linear expansion of the cured film can be reduced. Furthermore, by setting the particle size D50 within the above range, the underfill material can be filled into fine gaps of several μm. The particle size D50 of alumina particles can be determined, for example, by measuring the particle size distribution of alumina particles by laser diffraction using a Microtrac MT3300EXII manufactured by Microtrac Bell Co., Ltd. as a laser particle size distribution measuring device.

[0019] The alpha dose of alumina particles is preferably 0.006 cph / cm². ２ More preferably, 0.005 cph / cm² ２ More preferably, 0.004 cph / cm² ２ More preferably, 0.003 cph / cm² ２ The following applies: The lower limit of the alpha dose of alumina particles is not particularly limited, but for example, 0.0001 cph / cm². ２ The result is 0.0005 cph / cm². ２ Above or above, or 0.0008 cph / cm² ２ The above is also acceptable. When the resin composition is used as an underfill for semiconductor devices, a low alpha dose is preferred. Therefore, it is necessary to reduce the content of alpha-emitting radionuclides such as uranium and thorium in the alumina particles. The alpha dose of alumina particles is measured using a measuring device model 1950 (manufactured by Alpha Science Co., Ltd.).

[0020] The BET specific surface area S, measured by the nitrogen adsorption method of alumina particles, is, for example, 0.9 m². ２ The amount is 2.0 m or more, preferably 2.0 m ２ / g or more, more preferably 4.0m ２ / g or more, more preferably 6.0m ２ It is 1 / g or more, preferably 30m ２ / g or less, more preferably 25m ２ / g or less, more preferably 20m ２ / g or less, particularly preferably 15m ２ It is less than or equal to / g. Within the above range, the dispersibility of alumina particles in the resin composition is good, and the coefficient of linear expansion of the cured film can be reduced. The BET specific surface area of ​​the alumina particles is measured in accordance with JIS-Z8830 (2013).

[0021] When measuring the BET specific surface area S, particle size D50, and α-dose of alumina particles in a sheet-like resin composition or cured film, it is preferable to remove the epoxy resin, etc., contained in the sheet-like resin composition or cured film by, for example, dissolving it with an organic solvent or by thermally decomposing the resin by heating it to a temperature of 500°C or higher, thereby separating only the alumina particles, and then measuring using the separated alumina particles. If the resin composition contains two or more types of alumina particles, the BET specific surface area S, particle size D50, and α-dose should be measured while the alumina particles in the resin composition are mixed.

[0022] The alumina particles may be surface-treated with a silane coupling agent. This improves the dispersibility of the alumina particles in the resin composition and, as described above, allows for adjustment of the amount of hydroxyl groups on the surface of the alumina particles. The silane coupling agent may be one or more types.

[0023] Known silane coupling agents can be used. A silane coupling agent may be represented by the following chemical formula (A): X ３－ｎ Me ｎ -Si-Y...(A) (wherein Me is a methyl group, X is a hydrolysis group, Y is a monovalent organic group, and n is 0, 1, or 2)

[0024] In chemical formula (A), X (hydrolysis group) can be, for example, a methoxy group (CH ３ O-), ethoxy group (CH ３ CH ２ O-), propoxy group (CH３ CH ２ CH ２ O-), isopropoxy group ((CH ３ ) ２ CHO-), chloro group, or 2-methoxyethoxy group (CH ３ OCH ２ CH ２ Examples include O-). n is preferably 0 or 1, and more preferably 0.

[0025] In chemical formula (A), Y is a monovalent organic group. Y is preferably a C1-C20 alkyl group which may have vinyl, epoxy, phenyl, styryl, methacrylic, acrylic, amino, ureido, mercapto, isocyanate, etc., at its terminals. Part of the carbon skeleton may be substituted with -O-, -NH-, -S-, -CO-, -COO- as long as they are not adjacent. Among these, unsubstituted C1-C20 alkyl groups having vinyl, phenyl, or epoxy groups are more preferred. Unsubstituted C1-C20 alkyl groups are particularly preferred. This improves the dispersibility of alumina particles in the resin composition, reduces the coefficient of thermal expansion of the cured film, and further improves heat resistance.

[0026] In chemical formula (A), Y is preferably a linear alkyl group having 1 to 20 carbon atoms, more preferably 2 or more carbon atoms, even more preferably 5 or more carbon atoms, and preferably 15 or less carbon atoms. This makes it easier to achieve an effect that suppresses aggregation between alumina particles by allowing the flux to be adsorbed appropriately onto the surface of the alumina particles and by causing steric hindrance by the silane coupling agent.

[0027] Examples of the above-mentioned silane coupling agents include decyltrimethoxysilane, tetramethoxysilane, vinyltrimethoxysilane, 7-octenyltrimethoxysilane, 8-glycidoxyoctyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, hexamethyldisilazane, phenyltrimethoxysilane, glycidoxyoctyltrimethoxysilane, 2-phenylethyltrimethoxysilane, 2,2-diphenylethyltrimethoxysilane, vinyltrichlorosilane, vinyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropylethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane Tacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, N-2(aminoethyl)3-aminopropylmethyldimethoxysilane, N-2(aminoethyl)3-aminopropyltrimethoxysilane, N-2(aminoethyl)3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-triethoxysilyl-N-(1,3-dimethylbutylidene)propylamine, hydrochloride of N-(vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-chloropropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, bis(triethoxysilylpropyl)tetrasulfide, 3-isocyanatetopropyltriethoxysilane, hexamethyldisilazane, etc. can be used.

[0028] The mass ratio of the alumina particles (g) to the silane coupling agent (g) is, for example, 1:0.0005 to 1:0.03. When the mass ratio of the alumina particles (g) to the silane coupling agent (g) is within the above range, the dispersibility of the alumina particles in the resin composition is improved, which reduces the coefficient of thermal expansion of the cured film and further improves its heat resistance.

[0029] The alumina particle content in the resin composition is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% or more, preferably 70% by mass or less, more preferably 60% by mass or less, and even more preferably 50% by mass or less, based on 100% by mass of the solid content of the resin composition. By keeping it within the above range, the coefficient of linear expansion of the cured film can be reduced, and the heat resistance and thermal conductivity can be further improved.

[0030] Examples of methods for producing alumina particles include: obtaining aluminum hydroxide from a slurry containing seed crystal alumina and an aluminum alkoxide, and then calcining the aluminum hydroxide to obtain alumina particles (production method 1); obtaining raw material alumina by a known method such as the Bayer process, and then obtaining alumina particles from the raw material alumina by flame melting (production method 2); or calcining transition alumina such as the θ phase or γ phase, or an aluminum compound that generates transition alumina by calcination, in an atmosphere gas containing hydrogen halide gas (production method 3).

[0031] <Method 1 for producing alumina particles> Method 1 includes the steps of: preparing a seed crystal slurry in which seed crystal alumina is dispersed; mixing the seed crystal slurry with aluminum alkoxide to obtain an aluminum hydroxide slurry; and drying and calcining the aluminum hydroxide slurry to obtain alumina particles.

[0032] After dispersing alumina particles, which serve as seed crystals, in water, wet grinding is performed using a ball mill. Subsequently, centrifugation is performed using a centrifuge to remove the precipitate. This yields a seed crystal slurry in which the seed crystals are dispersed. The seed crystals are preferably α-alumina. By using α-alumina seed crystals, the α-conversion of alumina can be promoted at low temperatures during the sintering process described later.

[0033] Next, the seed crystal slurry and aluminum alkoxide are continuously supplied to a stirrer and mixed. By stirring this mixture at high speed using a stirrer, the water in the seed crystal slurry and the aluminum alkoxide undergo a hydrolysis reaction, yielding a slurry (aluminum hydroxide slurry) containing aluminum hydroxide particles, which are the hydrolysis products.

[0034] Furthermore, alumina particles can be obtained by drying the aluminum hydroxide slurry by a known method, for example, at about 100 to 200°C, and then calcining the resulting aluminum hydroxide in a calcination furnace. Calcination is preferably carried out at 800°C to 1000°C. Calcination may also be carried out in the atmosphere or in an inert gas such as nitrogen gas or argon gas.

[0035] <Method for producing alumina particles 2> (Alumina raw material) Alumina raw material is produced by known methods. Examples include the Bayer process, ammonium alum process, ammonium aluminum carbonate hydroxide process (AACH process), solvent extraction method, organoaluminum hydrolysis method (aluminum alkoxide process), CZ method, Bernoulli process, Chiroporous process, Bridgman process, EFG method, and other melt growth methods.

[0036] In the Bayer process, raw alumina can be produced by calcining aluminum hydroxide obtained from bauxite. Furthermore, the ammonium alum method, AACH method, solvent extraction method, and aluminum alkoxide method are preferable because they can produce high-purity raw alumina.

[0037] (Grinding of raw alumina) In order to easily obtain alumina particles of the desired size by the flame melting method, the raw alumina is ground to obtain alumina raw material powder for flame melting. The raw alumina can be ground using known methods such as a vibratory mill, bead mill, ball mill, or jet mill, and may be ground in either a dry or wet state.

[0038] In the above grinding process, a surface protectant may be used. The surface protectant not only protects the surface of the alumina raw material powder after grinding, but may also have the function of inactivating the surface of the alumina raw material powder. Because the surface protectant reduces aggregation of alumina raw material powders due to its surface inactivation function, it is suitable for obtaining alumina particles of a target particle size after flame melting using raw material alumina with a high BET specific surface area that is prone to aggregation. Suitable surface protectants include, for example, monohydric alcohols such as methanol, ethanol, 1-propanol, and 2-propanol; glycols such as ethylene glycol, polyethylene glycol, propylene glycol, and polypropylene glycol; amines such as triethanolamine; and higher fatty acids such as palmitic acid, stearic acid, and oleic acid. One of these surface protectants may be used alone, or two or more may be used in combination. Of these, glycols are preferred, and one or more of ethylene glycol, polyethylene glycol, propylene glycol, and polypropylene glycol are particularly preferred.

[0039] Polyethylene glycol and polypropylene glycol, which are preferably used as surface protective agents, do not have any particular restrictions on their molecular weight, but liquid forms with an average molecular weight of about 200 to 600 are preferred for ease of addition.

[0040] The amount of surface protective agent added is preferably 0.01 parts by mass or more when the raw material alumina is 100 parts by mass, in order to allow the surface protective agent to exert its full effect. However, if the amount of surface protective agent added is too large, the effect of the surface protective agent will saturate, so it is preferable to add 10 parts by mass or less. The amount of surface protective agent added is more preferably 0.05 to 8 parts by mass, and even more preferably 0.1 to 5 parts by mass.

[0041] (Flame Melting) The flame melting method can be applied as a method for producing alumina particles. The flame melting method is a method in which raw material alumina is sprayed into a flame, liquefied, and then cooled and solidified. In the flame melting method, the temperature of the flame melting furnace is preferably 1000°C or higher. In the flame melting method, the raw material supply rate can be adjusted as appropriate, but it is preferably 50 kg / hour or less, and more preferably 10 kg / hour or less, so that the amount of thermal energy applied to the alumina particles can be controlled within a predetermined range.

[0042] The alumina particles after flame melting are collected by a cyclone or bag filter and classified as necessary. After classification, the obtained alumina particles may be immersed in an acidic solution such as hydrochloric acid, and the amount of surface hydroxyl groups of the alumina particles can be adjusted by treatment with an acidic solution. Hydrochloric acid is preferred as the type of acidic solution to be used due to the ease of concentration adjustment. The concentration of the acidic solution is preferably 1 M to 12 M, more preferably 1 M to 10 M, and even more preferably 2 M to 5 M. The preferred mass ratio of alumina particles to acidic solution is alumina particles:acidic solution = 1:2 to 1:10. The preferred immersion time is 5 hours or more. The immersion time can be shortened by heating the acidic solution. The temperature of the heated acidic solution is, for example, 50 to 90°C. After immersion in the acidic solution, the alumina particles are washed and dried.

[0043] <Method 3 for producing alumina particles> Method 3 involves using transition alumina such as the θ phase or γ phase, or an aluminum compound that produces transition alumina by calcination, as a raw material, and calcining this raw material in an atmosphere gas containing hydrogen halide gas. Aluminum chloride and aluminum hydroxide can be used as the aluminum compound that produces transition alumina by calcination.

[0044] When controlling the particle size of alumina particles (α-alumina) using the aforementioned raw materials, approximately 0.01 to 10% by mass of seed crystals such as α-alumina powder should be added to the raw materials. By increasing the amount of seed crystals added within this range, the particle size of the resulting alumina particles can be reduced.

[0045] When calcining transition alumina or an aluminum compound that produces transition alumina by calcination in an atmosphere gas containing hydrogen halide gas, the hydrogen halide gas in the atmosphere gas is, for example, 1 volume% or more, preferably 5 volume% or more, and can be increased up to 100 volume%. Other components in the atmosphere gas during calcination include inert gases such as nitrogen and argon, and the concentration of hydrogen halide gas in the atmosphere gas is preferably 10 to 100 volume%. As the hydrogen halide gas, hydrogen chloride gas, hydrogen fluoride gas, hydrogen bromide gas, or hydrogen iodide gas can be used, and among these, hydrogen chloride gas is preferred.

[0046] <Flux> Specifically, flux is a compound that has functions such as removing oxide films from electrode terminals, preventing re-oxidation, or improving wettability when coating with a resin composition. Any compound having the above functions can be used as flux without particular limitations, but the flux is preferably a carboxylic acid.

[0047] The molecular weight of the flux is preferably 80 or more, more preferably 100 or more, even more preferably 110 or more, even more preferably 120 or more, and also preferably 900 or less, more preferably 600 or less, even more preferably 400 or less, even more preferably 280 or less, particularly preferably 240 or less, and may also be 200 or less, 170 or less, or 160.0 or less.

[0048] The acid equivalent of the flux is preferably 40 g / mol or more, more preferably 50 g / mol or more, even more preferably 55 g / mol or more, and even more preferably 60 g / mol or more. It is also preferably 450 g / mol or less, more preferably 300 g / mol or less, even more preferably 200 g / mol or less, even more preferably 140 g / mol or less, and particularly preferably 120 g / mol or less. It may also be 100 g / mol or less, 85 g / mol or less, or 80.0 g / mol or less. Within the above range, the value of X can be easily adjusted to the above range, and the oxide film removal function will be sufficient. The acid equivalent of the flux is defined by the molecular weight of the flux per 1 mol of carboxyl groups in the flux. Specifically, it is obtained by dividing the molecular weight of the flux by the number of carboxyl groups present in one molecule of flux. If the resin composition contains two or more types of flux, the acid equivalent of the flux is obtained by the weighted average of the fluxes contained in the resin composition.

[0049] A carboxylic acid is preferred as the flux, and the carboxylic acids include saturated or unsaturated dicarboxylic acids such as oxalic acid, malonic acid, succinic acid, methylsuccinic acid, glutaric acid, 2-methylglutaric acid, 3-methylglutaric acid, 2,2-dimethylglutaric acid, adipic acid, 2-methyladipic acid, pimelic acid, 2-methylpimelic acid, suberic acid, 2-methylsuberic acid, azelaic acid, 2-methylazelaic acid, sebacic acid, 2-methylsebacic acid, undecanediic acid, dodecanediic acid, fumaric acid, maleic acid, and diglycolic acid; saturated or unsaturated fatty acids such as formic acid, acetic acid, propionic acid, butyric acid, pivalic acid, valeric acid, caproic acid, caprylic acid, lauric acid, myristic acid, palmitic acid, stearic acid, oleic acid, and crotonic acid; and benzoic acid, toluic acid, salicylic acid, xylic Examples include aromatic monocarboxylic acids such as lylic acid, hemeltic acid, mesitylene acid, cinnamic acid, 3-phenylpropionic acid, and 4-phenylbutyric acid; aromatic dicarboxylic acids such as phthalic acid, isophthalic acid, terephthalic acid, and 2,6-naphthalenedicarboxylic acid; hydroxy acids such as malic acid, tartaric acid, and lactic acid; keto acids such as 5-ketohexanoic acid and levulinic acid; thio acids such as thiodiglycolic acid; heterocyclic carboxylic acids such as 2-furanic acid; trifunctional or more carboxylic acids such as 1,3,5-pentanetricarboxylic acid, citric acid, propanetricarboxylic acid, trimellitic acid, trimesic acid, prenitic acid, prenitylic acid, 1,2,3-benzenetricarboxylic acid, merophanic acid, pyromellitic acid, and mellitic acid; (meth)acrylic acids such as acrylic acid and methacrylic acid; and abietic acid and ascorbic acid. Among these, saturated or unsaturated dicarboxylic acids are preferred, saturated dicarboxylic acids are more preferred, oxalic acid, malonic acid, succinic acid, methylsuccinic acid, glutaric acid, 2-methylglutaric acid, 3-methylglutaric acid, 2,2-dimethylglutaric acid, adipic acid, 2-methyladipic acid, pimelic acid, 2-methylpimelic acid, suberic acid, 2-methylsuberic acid, azelaic acid, 2-methylazelaic acid, sebacic acid, 2-methylsebacic acid, undecanediic acid, and dodecanediic acid are even more preferred, and succinic acid, methylsuccinic acid, glutaric acid, 2-methylglutaric acid, 3-methylglutaric acid, 2,2-dimethylglutaric acid, adipic acid, and 2-methyladipic acid are even more preferred.

[0050] The flux content in the resin composition is preferably 0.05% to 20% by mass, more preferably 0.1% to 15% by mass, even more preferably 0.5% to 10% by mass, and even more preferably 0.8% to 5% by mass, based on 100% by mass of the solid content of the resin composition. Within the above range, the oxide film removal function can be fully exhibited.

[0051] The flux content in the resin composition is preferably 0.5 parts by mass to 20 parts by mass, more preferably 1.0 part by mass to 10 parts by mass, and even more preferably 2.0 parts by mass to 5.0 parts by mass, per 100 parts by mass of alumina particles. Within this range, the alumina particles and flux can fully exhibit their heat conduction function and the oxide film removal function of the flux without impairing each other's functions.

[0052] The resin composition may further contain one or more selected from curing agents, curing accelerators, solvents, and plasticizers.

[0053] <Curing Agent> The resin composition may further contain a curing agent. Known curing agents can be used. From the viewpoint of easily controlling the reactivity with the epoxy resin, phenolic curing agents, amine curing agents, or acid anhydride curing agents are preferred.

[0054] When the resin composition contains a curing agent, the curing agent content is preferably 1% by mass or more and 10% by mass or less of the solid content of the resin composition. Within this range, the epoxy resin reacts sufficiently, and a cured film with a low coefficient of thermal expansion and excellent heat resistance can be obtained.

[0055] <Curing Accelerator> The resin composition may further contain a curing accelerator. The curing accelerator can be one that promotes the reactivity of the epoxy groups (preferably glycidyl groups) of the epoxy resin, preferably a phosphorus-based curing accelerator or an imidazole-based curing accelerator, and more preferably an imidazole-based curing accelerator. These curing accelerators are useful for controlling the reactivity of the epoxy resin.

[0056] Examples of phosphorus-based curing accelerators include triphenylphosphine (TPP). Examples of imidazole-based curing accelerators include 1-(2-cyanoethyl)-2-ethyl-4-methylimidazole, and a commercially available example is "Curezol® 2E4MZ-CN" manufactured by Shikoku Chemicals Holdings Co., Ltd.

[0057] The content of the curing accelerator is preferably 0.01% by mass or more, more preferably 0.10% by mass or more, even more preferably 1.0% by mass or more, and also preferably 5% by mass or less, more preferably 4% by mass or less, and even more preferably 3% by mass or less, based on 100% by mass of the solid content of the resin composition. Within this range, the reactivity of the epoxy resin can be easily controlled.

[0058] <Solvent> The resin composition may further contain a solvent. This makes the resin composition more fluid, facilitating the formation of sheet-like resin compositions and cured films. The solvent may, for example, have a molecular weight of 500 or less, a boiling point of 250°C or less, and be liquid between -40°C and 30°C. The boiling point of the solvent is preferably 200°C or less, more preferably 180°C or less, even more preferably 160°C or less, preferably 40°C or higher, more preferably 50°C or higher, and even more preferably 60°C or higher. When the boiling point of the solvent is within the above range, the solvent can be effectively removed during the drying process when forming the resin composition into a sheet, while suppressing the reaction of the epoxy resin.

[0059] Any known solvent can be used, and it is not limited to any solvent that can dissolve epoxy resin. Examples include alcohol-based solvents, ketone-based solvents, ether-based solvents, ester-based solvents, amine-based solvents, amide-based solvents, halogen-based solvents, hydrocarbon-based solvents, and nitrile-based solvents. From the viewpoint of being a good solvent for epoxy resin and having excellent coatability of the resulting resin composition, it is preferable that the resin composition contains one or more solvents selected from the group consisting of ketone-based solvents and ester-based solvents.

[0060] Examples of ketone solvents include acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclopentanone, and cyclohexanone. Examples of ester solvents include methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, n-propyl acetate, amyl acetate, and sec-butyl acetate. Preferably, the solvent includes one or more selected from the group consisting of methyl ethyl ketone, cyclopentanone, and cyclohexanone.

[0061] The solvent content is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, preferably 70% by mass or less, more preferably 60% by mass or less, and even more preferably 50% by mass or less, based on 100% by mass of the resin composition. Within the above range, the coating properties of the resin composition will be good, and the resin composition can be used according to the application.

[0062] <Plasticizer> The resin composition preferably contains a plasticizer. The plasticizer content in the resin composition is preferably 1% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, and also preferably 50% by mass or less, more preferably 45% by mass or less, and even more preferably 40% by mass or less, based on 100% by mass of the solid content of the resin composition. By keeping it within the above range, sufficient conformability can be provided to the sheet-like resin composition and cured film, and a cured film with a low coefficient of linear expansion and excellent heat resistance can be easily obtained. Known plasticizers can be used as the plasticizer, and from the viewpoint of heat resistance, polymer-based plasticizers such as acrylic plasticizers are preferred. Examples of acrylic plasticizers include Clarity LA3320, Clarity LA2330, Clarity LA2250, Clarity LA2270, Clarity LA4285, Clarity LA2140, Clarity LA3710, and Clarity LK9243, all manufactured by Kuraray Co., Ltd.

[0063] <Other Components> The resin composition may, as necessary, contain known additives such as inorganic particles (excluding alumina particles), coupling agents, fillers, pigments, flame retardants, antioxidants, surfactants, compatibilizers, weathering agents, antiblocking agents, antistatic agents, leveling agents, and mold release agents, to the extent that they do not impair the effects of the invention.

[0064] As inorganic particles (excluding alumina particles), ceramic particles consisting of silica, aluminum nitride, boron nitride, silicon nitride, silicon carbide, etc. are preferred. Since ceramics have high thermal conductivity, using ceramic particles can improve the heat dissipation performance of the cured film formed from the resin composition. The resin composition may further contain inorganic particles (excluding alumina particles), but in the present invention, from the viewpoint of thermal conductivity, the higher the content of alumina particles, the more desirable. Of the total 100% by mass of alumina particles and inorganic particles (excluding alumina particles), the content of alumina particles is preferably 50% by mass or more, more preferably 60% by mass or more, even more preferably 70% by mass or more, even more preferably 80% by mass or more, particularly preferably 90% by mass or more, even more preferably 95% by mass or more, and most preferably 100% by mass.

[0065] <Method for Manufacturing Resin Composition and Cured Film> The resin composition can be manufactured by a method that includes a step of mixing predetermined components and other components used as needed. The method for manufacturing the resin composition preferably includes a step of mixing alumina particles into an epoxy resin varnish containing epoxy resin and flux. The epoxy resin varnish may optionally contain one or more selected from curing agents, curing accelerators, solvents and plasticizers. The mixing method is not particularly limited, and a mill, mixer, stirring blades, etc., can be used.

[0066] A sheet-like resin composition can be formed into a sheet by applying the resin composition of the present invention, which contains a solvent, onto a substrate, and then drying the applied mixture to remove the solvent.

[0067] The method for applying the solvent-containing resin composition is not particularly limited, but coating equipment such as a comma coater, lip coater, roll coater, gravure coater, die coater, or spin coater can be used.

[0068] The substrate is preferably in the form of a film, and a general polymer film can be used. Examples of polymer films include polyethylene film, polyolefin films such as polypropylene film, vinyl films such as polyvinyl chloride film, polyester films such as polyethylene terephthalate film, polycarbonate film, acetylcellulose film, and tetrafluoroethylene film. The thickness of the substrate is not particularly limited, but from the viewpoint of excellent workability and drying properties, 20 to 200 μm is preferred.

[0069] The drying is preferably carried out by heating, for example, with a heating temperature of 50 to 120°C and a heating time of 10 to 60 minutes. Furthermore, the heating is preferably carried out by a combination of multiple steps with different heating temperatures and heating times, and it is more preferable that the heating temperature increases with each step. The process is preferably two steps, with the first step being a heating temperature of 50 to 70°C and a heating time of 7 to 40 minutes, and the second step being a heating temperature of 80 to 120°C and a heating time of 5 to 20 minutes, which is more preferable.

[0070] The resulting sheet-like resin composition is fluid when heated and pressurized. That is, the sheet-like resin composition includes an uncured sheet-like resin composition (also called the "A-stage" sheet-like resin composition). The sheet-like resin composition may also contain a solvent to the extent that it does not impair handling properties.

[0071] The thickness of the sheet-like resin composition is preferably 500 μm or less. Within this range, the heating time required for sufficient curing can be shortened, and a cured film in which alumina particles are uniformly dispersed can be formed. The lower limit of the thickness of the sheet-like resin composition is not particularly limited, but may be, for example, 1 μm or more. The thickness of the sheet-like resin composition can be measured, for example, using a micrometer (Mitutoyo Corporation, PMU150-25MX). If the sheet-like resin composition is on a PET film as a base material, the total thickness of the PET film and the sheet-like resin composition and the thickness of the PET film can be measured separately, and the thickness can be calculated by subtracting the thickness of the PET film from the total thickness. It is preferable to measure the thickness at, for example, three or more locations and obtain the average value.

[0072] The resin composition of the present invention may be used to fill the gaps around solder bumps or in the substrate when mounting semiconductor chips.

[0073] The resin composition is cured by heating, producing a cured film. For example, the heating temperature is 150 to 220°C, and the heating time is 30 to 360 minutes.

[0074] In one embodiment, a pressurized heating step may be provided after the drying step, in which heating is performed under pressurized conditions. The pressurized heating step can be carried out using a vacuum press, transfer molding machine, compression molding machine, laminator, etc. The heating temperature is preferably 130°C to 170°C, the pressure is preferably 0.5 MPa to 20 MPa, and the pressurized heating time is preferably 10 seconds to 15 minutes.

[0075] The coefficient of linear expansion of the cured film is preferably 115 ppm / K or less, more preferably 110 ppm / K or less, even more preferably 105 ppm / K or less, and even more preferably 100 ppm / K or less. The lower limit of the coefficient of linear expansion of the cured film is not particularly limited and may be 80 ppm / K or more, or 85 ppm / K or more. The coefficient of linear expansion of the cured film can be measured, for example, by the method described in the examples.

[0076] The glass transition temperature of the cured film is preferably 130°C or higher, more preferably 140°C or higher, and even more preferably 150°C or higher. Being above the lower limit satisfies the heat resistance requirements for the underfill material. The upper limit of the glass transition temperature is not particularly limited, but is preferably 200°C or lower, more preferably 180°C or lower, and even more preferably 160°C or lower. The glass transition temperature of the cured film can be measured, for example, by the method described in the examples.

[0077] <Applications> The resin composition of the present invention is preferably used as a resin composition for semiconductor encapsulation in the semiconductor packaging process, and more preferably as an underfill. For underfill applications, pre-supplied underfill applications are particularly preferred, and more preferably as a sheet-like resin composition for non-conductive film (NCF) or a paste-like resin composition for non-conductive paste (NCP). The resin composition according to the present invention can form a cured film with a low coefficient of thermal expansion, which can suppress package warping and can be widely applied as an underfill material.

[0078] The present invention will be described in more detail below with reference to examples. The present invention is not limited by the following examples, and it is certainly possible to implement it with appropriate modifications within the scope that is consistent with the spirit described above, and all such modifications are included within the technical scope of the present invention. In the following, unless otherwise specified, "parts" means "parts by mass" and "%" means "percent mass".

[0079] 1. Evaluation Method and Measurement Method <Measurement of Hydroxyl Groups on the Surface of Alumina Particles> The amount of hydroxyl groups on the surface of alumina particles was calculated as the sum of isolated hydroxyl groups and hydrogen-bonded hydroxyl groups. The quantitative determination of isolated hydroxyl groups and hydrogen-bonded hydroxyl groups was performed using the Karl Fischer method (moisture vaporization-titration method) in accordance with the description in JIS K 0068:2001 "Method for Measuring Moisture Content of Chemical Products". Moisture detected in the Karl Fischer measurement was considered to originate from the hydroxyl groups of the alumina particles, with moisture detected at 550°C being considered to originate from hydrogen-bonded hydroxyl groups and moisture detected at 900°C being considered to originate from isolated hydroxyl groups. In the Karl Fischer measurement, it is thought that two hydroxyl groups condense to form one water molecule, and the amount of hydroxyl groups was determined by the following formula (1). Amount of hydroxyl groups on the surface of alumina [groups / nm] ２ ] = 0.0662 × (moisture content [ppm]) / (specific surface area of ​​alumina particles [m²]) ２ / g])...(1)

[0080] <Calculation of Flux Water Solubility: logS> The flux water solubility: logS was calculated using the Y-MB method with Hansen Solubility Parameters in Practice (HSPiP, version 5.2.05).

[0081] <Measurement of BET specific surface area of ​​alumina particles> The BET specific surface area of ​​each alumina particle was measured using a FlowSorb III 2310 (manufactured by Shimadzu Corporation). The nitrogen adsorption BET specific surface area obtained by the nitrogen adsorption single-point method according to the method specified in JIS-Z8830 (2013) was used as the BET specific surface area of ​​each alumina particle. The measurement conditions were as follows: Carrier gas: Nitrogen / helium mixed gas filling Sample amount: 0.1 g Sample pretreatment conditions: Treatment at 200°C for 20 minutes Nitrogen adsorption temperature: Liquid nitrogen temperature (-196°C or below) Nitrogen desorption temperature: Room temperature (approximately 20°C)

[0082] <Measurement of Alumina Particle Size (D50)> The particle size of each alumina particle was measured by laser diffraction using a Microtrac MT3300EXII (manufactured by Microtrac Bell Co., Ltd.) as a laser particle size distribution analyzer. D50 was determined from the measurement results of the particle size distribution. As the sample for measurement, an alumina particle dispersion was used, which was prepared by adding the alumina particles to be measured to a 0.2 mass% sodium hexametaphosphate aqueous solution in an appropriate laser scattering intensity, and then dispersing it with the instrument's built-in ultrasonic device at 40W for 5 minutes. The refractive index of alumina was assumed to be 1.76.

[0083] <Measurement of Alpha Dose of Alumina Particles> The alpha dose of each alumina particle was measured using a measuring device model 1950 (manufactured by Alpha Science Co., Ltd.). The measurement area of ​​the sample was 1000 cm². ２ The measurement time was set to 99 hours, and the counting gas used was PR-10 gas (Ar 90%, CH 410%).

[0084] <Measurement of the Thickness of Each Cured Film> The thickness of each cured film was measured using a micrometer (Mitutoyo Corporation, PMU150-25MX). Five arbitrary measurement points were selected, and the average value was taken as the thickness of each cured film (average thickness).

[0085] <Measurement of Linear Expansion Coefficient> The CTE (linear expansion coefficient) of each cured film was measured using a thermomechanical analyzer (TMA) under the following conditions, and the CTE at temperatures from 50°C to 100°C was calculated. Apparatus: TMA / SS7100, Hitachi High-Tech Science Co., Ltd. Load: 50.0 mN Temperature program: Heating from 20°C to 130°C at a rate of 5°C / min Test specimen: Length 40 mm, width 5 mm

[0086] <Measurement of Glass Transition Temperature> The glass transition temperature of each cured film was calculated by measuring it under the following conditions. A dynamic viscoelasticity measuring device DVA-220 (manufactured by IT Measurement Control Co., Ltd.) was used to obtain a tanδ curve, which is the ratio of the storage modulus to the loss modulus. The peak of the tanδ curve was defined as the glass transition temperature. The shape of the test specimen and the measurement conditions were as follows: Test specimen: rectangular parallelepiped with a length of 40 mm, a width of 5 mm, and a thickness of 300 μm Experiment mode: single frequency, constant rate heating Experiment method: tensile Sample gripping distance: 15 mm Measurement start temperature: 20°C to 250°C Heating rate: 5°C / min Frequency: 10 Hz Static / dynamic stress ratio: 1.8 The glass transition temperature was evaluated as follows: A if it was 150°C or higher, B if it was 140°C or higher but less than 150°C, and C if it was less than 140°C.

[0087] 2. Synthesis of Alumina Particles (1) Synthesis of Alumina Particle 1 First, a seed crystal (α-alumina) slurry was prepared. Specifically, alumina particles (raw material for seed crystals) were dispersed in water, and then wet-milled in a ball mill to obtain a wet-milled product. Subsequently, the wet-milled product was centrifuged at a rotation speed of 4000 rpm for 30 minutes to remove precipitate and obtain a seed crystal slurry in which seed crystals were dispersed. Next, the seed crystal slurry and aluminum isopropoxide were mixed at high speed and hydrolyzed to obtain an aluminum hydroxide slurry. The obtained aluminum hydroxide slurry was dried at 150°C to obtain aluminum hydroxide particles. Next, the aluminum hydroxide particles were calcined in a gas furnace at 965°C to obtain alumina particles 1. The particle size (D50) of the obtained alumina particles 1 was 0.23 μm, and the BET specific surface area was 9.7 m². ２ / g, alpha dose is 0.005 cph / cm² ２ That was the case.

[0088] (2) Synthesis of Alumina Particles 2 High-purity metallic aluminum obtained by the method described in Japanese Patent Publication No. 2010-106329 was prepared as a raw material. Aluminum hydroxide was obtained from metallic aluminum by the aluminum alkoxide method using the method described in Japanese Patent Publication No. 2018-048060, and then the aluminum hydroxide was calcined to obtain alumina raw material. Next, using a jet mill pulverizer (horizontal jet mill pulverizer PJM-280SP manufactured by Nippon Pneumatic Mfg. Co., Ltd.), the material was processed under the conditions of a raw material alumina supply rate of 30 kg / hour and a gauge pressure at the air supply port during pulverization of 0.5 MPa to obtain alumina raw material particles with an average particle diameter of approximately 2 μm for secondary particles. The obtained alumina raw material particles were put into a flame melting furnace and melted to obtain spherical alumina particles. The atmosphere temperature inside the flame melting furnace was set to 1250°C, and the raw material supply rate was set to 5 kg / hour. The obtained alumina particles were collected using a cyclone and subjected to classification by cyclone classification to remove particles larger than 5 μm, thereby obtaining alumina particle 2. The obtained alumina particle 2 had a particle size (D50) of 2.5 μm and a BET specific surface area of ​​1.1 m². ２ / g, alpha dose is 0.001 cph / cm² ２ That was the case.

[0089] (3) Synthesis of alumina particles 3 Alumina particles 3 were obtained by referring to Example 2 of Japanese Patent Publication No. 7-206434. The particle size (D50) of the obtained alumina particles 3 was 0.40 μm and the BET specific surface area was 5.6 m². ２ / g, alpha dose is 0.005 cph / cm² ２ That was the case.

[0090] (4) Synthesis of Alumina Particles 4 Alumina particles 4 were obtained in the method for producing alumina particles 1 by changing the mixing ratio of the aluminum isopropoxide and seed crystal slurry. The particle size (D50) of the obtained alumina particles 4 was 0.25 μm, and the BET specific surface area was 7.5 m². ２ It was / g.

[0091] 3. Preparation of an epoxy resin varnish (resin composition) containing alumina particles. The resin composition was prepared as follows.

[0092] (Example 1) Epoxy resin 1 and epoxy resin 2 were dissolved in a mixed solvent of methyl ethyl ketone (MEK) and cyclopentanone (CYP) (mass ratio 3:1) in the proportions shown in Table 1 to prepare a 25% by mass mixed solution. Furthermore, flux 1 was dissolved in the mixed solution in the proportions shown in Table 1 to prepare an epoxy resin varnish. Next, alumina particles 1 were added to the obtained epoxy resin varnish in the proportions shown in Table 1, and the mixture was kneaded at 2000 rpm for 60 seconds using a rotation-orbit mixer (manufactured by Thinky Co., Ltd.) to prepare resin composition 1.

[0093] (Examples 2-5, Comparative Example 1) Resin compositions 2-6 were prepared by compounding and kneading in the same manner as in Example 1, except that epoxy resin, curing accelerator, alumina particles, plasticizer, and flux were used in the components and mixing ratios listed in Table 1.

[0094]

[0095] The components in Table 1 are as follows: (Epoxy resin) Epoxy resin 1: N-[2-methyl-4-(oxyranylmethoxy)phenyl]-N-(oxyranylmethyl)oxiranmethaneamine (SumiEpoxy® ELM-100, manufactured by Sumitomo Chemical Co., Ltd.) Epoxy resin 2: Bisphenol F type epoxy resin (jER YL983U, manufactured by Mitsubishi Chemical Corporation) (Curing accelerator) Curing accelerator: 1-(2-cyanoethyl)-2-ethyl-4-methylimidazole (Curezol® 2E4MZ-CN, manufactured by Shikoku Chemicals Holdings Co., Ltd.) (Plasticizer) Plasticizer: Acrylic block copolymer (Clarity® LA2250, manufactured by Kuraray Co., Ltd.) (Flux) Flux 1: Methylsuccinic acid (manufactured by Tokyo Chemical Industry Co., Ltd., molecular weight: 132.12, acid equivalent: 66.06 g / mol) Flux 2: Adipic acid (manufactured by Tokyo Chemical Industry Co., Ltd., molecular weight: 146.14, acid equivalent: 73.07 g / mol) Flux 3: Glutaric acid (manufactured by Tokyo Chemical Industry Co., Ltd., molecular weight: 132.12, acid equivalent: 66.06 g / mol) Flux 4: 2-Methylglutaric acid (manufactured by Tokyo Chemical Industry Co., Ltd., molecular weight: 146.14, acid equivalent: 73.07 g / mol)

[0096] 4. Preparation of Cured Film The obtained resin composition was applied onto a PET film and coated using an applicator to obtain a coating film with a drying thickness of 300 μm. The coating film was heated at 65°C for 30 minutes, then at 100°C for 10 minutes to dry, and the resin composition was formed into a sheet to produce a sheet-like resin composition with a PET film on one side. Next, a PET film was placed on the side of the prepared sheet-like resin composition opposite to the bonded side of the PET film as a release paper, and then vacuum pressed at 140°C for 10 minutes under a pressure of 10 MPa to produce a sheet-like resin composition with PET film on both sides. The PET film was peeled off from both sides of the prepared sheet-like resin composition with PET film on both sides, and a cured film was prepared by heating at 175°C for 2 hours to cure it. Measurements and evaluations were performed on the obtained cured films 1 to 6. The measurement results are shown in Table 2.

[0097]

[0098] The cured films obtained in Examples 1 to 5 were all confirmed to have a lower coefficient of linear expansion compared to the cured film obtained in Comparative Example 1. In addition, the cured films obtained in Examples 1, 2, 4, and 5 were all confirmed to have a higher glass transition temperature Tg compared to the cured film obtained in Example 3, with Examples 1, 4, and 5 having a glass transition temperature Tg of 150°C or higher.

Claims

1. The material comprises epoxy resin, alumina particles, and flux, wherein the surface hydroxyl groups of the alumina particles are (number / nm). ２ ) and the product X of the water solubility value of the flux: logS is 8.0 (particles / nm) ２ A resin composition having the above characteristics.

2. The resin composition according to claim 1, wherein the volume-based D50 in the cumulative particle size distribution of the alumina particles is 3.0 μm or less.

3. The alpha dose of the alumina particles is 0.006 cph / cm². ２ The resin composition according to claim 1, wherein the following applies:

4. The BET specific surface area S of the alumina particles is 0.9 m². ２ The resin composition according to claim 1, wherein the amount is 1 / g or more.

5. The resin composition according to claim 1, wherein the epoxy resin is a polyfunctional epoxy resin.

6. The resin composition according to claim 1, wherein the flux is a carboxylic acid.

7. The resin composition according to claim 1, wherein the flux content is 0.5 to 20 parts by mass per 100 parts by mass of the alumina particles.

8. The resin composition according to claim 1, which may further contain inorganic particles (excluding alumina particles), wherein the content of alumina particles is 50% by mass or more of the total 100% by mass of the alumina particles and the inorganic particles (excluding alumina particles).

9. The resin composition according to claim 1, further comprising a curing accelerator.

10. A resin composition according to any one of claims 1 to 9, which is for semiconductor encapsulation.

11. The resin composition according to claim 10, which is for pre-supplied underfill.

12. A cured film of the resin composition according to any one of claims 1 to 9.

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