Package for housing electronic component, electronic module, and electronic device

Abstract

This package comprises a heat sink, a frame body, an insulator, and an annular plate. The frame body has an opening that penetrates between a first frame body surface and a second frame body surface facing the first frame body surface, and is open to the heat sink. The insulator is fitted into the opening and bonded to the frame body. The annular plate is inserted between a first heat sink surface of the heat sink, a first bonding surface of the frame body, and a second bonding surface of the insulator, and is bonded to the frame body and the insulator using a first bonding material. The plate has a first bonding part and a second bonding part. The first bonding part is bonded to the frame body. The second bonding part is connected to the first bonding part, has a protruding part protruding from a connection portion with the first bonding part to at least one of the first frame body surface side and the second frame body surface side, and is bonded to the insulator.

Description

Package for housing electronic component, electronic module and electronic device

[0001] The present disclosure relates to a package for housing an electronic component, an electronic module and an electronic device.

[0002] Conventionally, packages for housing electronic components are known, which are used for bonding and housing electronic components such as ICs, light-emitting diodes, piezoelectric elements or crystal oscillators on a substrate (see, for example, Patent Document 1). Packages for housing electronic components are required to ensure sufficient airtightness between the inside and the outside of the package, in order to suppress the influence of foreign matter mixing into the package and humidity changes. Thereby, the electronic component is hermetically sealed inside the package.

[0003] Japanese Unexamined Patent Application Publication No. 2014-49700

[0004] The package for housing an electronic component according to the present disclosure comprises: a heat sink; a frame body; an insulator; and an annular plate. The frame body penetrates between a first frame surface and a second frame surface opposite to the first frame surface, and has an opening opened toward the heat sink. The insulator is fitted into the opening and bonded to the frame body. The plate is inserted between a first heat sink surface of the heat sink, a first bonding surface of the frame body and a second bonding surface of the insulator, and bonded to the frame body and the insulator using a first bonding material. The plate has a first bonding portion and a second bonding portion. The first bonding portion is bonded to the frame body. The second bonding portion is connected to the first bonding portion, has a protruding portion protruding toward at least one of the first frame surface side and the second frame surface side from a connection position with the first bonding portion, and is bonded to the insulator.

[0005] The electronic module according to the present disclosure comprises: the above-described package for housing an electronic component; an electronic component; and a lid body. The electronic component is mounted on the heat sink. The lid body is bonded to the frame body.

[0006] The electronic device relating to this disclosure comprises an electronic module and an external substrate. The external substrate is joined to the electronic module using a third bonding material. The plate is joined to the heat sink using a second bonding material. The melting point of the second bonding material is lower than that of the first bonding material, and the melting point of the third bonding material is lower than that of the second bonding material.

[0007] This is an exploded perspective view showing the schematic configuration of the package of this embodiment. This is a perspective view showing the schematic configuration of the package of this embodiment. This is an enlarged plan view taken from the positive side in the Z direction, showing an enlarged view of the area near the opening of the frame. This is an enlarged cross-sectional view taken along line A-A' in Figure 2, showing the schematic configuration of the laminated structure of the heat sink, plate, and frame. This is an exploded perspective view showing the schematic configuration of the electronic module and electronic device of this embodiment.

[0008] Embodiments of the present disclosure will be described below with reference to the drawings. However, for the sake of clarity, the drawings below are simplified to show only the main components necessary to describe the embodiments. Therefore, embodiments of the present disclosure may include any components not shown in the drawings. Furthermore, the drawings do not necessarily accurately represent the dimensional ratios of the actual components.

[0009] In this specification, the first heat sink surface 11 side of the heat sink 10 constituting the electronic component housing package 1 (hereinafter simply referred to as "package 1") can be defined as the upper side.

[0010] In this disclosure, the directions do not refer to the directions in actual use. Furthermore, for convenience, each direction is expressed using the Cartesian coordinate system XYZ, where the top is the positive side of the Z direction. In this disclosure, "plan view" means a view from above (the positive side of the Z direction), and includes planar perspective. Similarly, in this disclosure, "front view" means a view from the negative side of the Y direction, "rear view" means a view from the positive side of the Y direction, and "side view" means a view from the negative (or positive) side of the X direction.

[0011] Furthermore, expressions such as "constant," "orthogonal," "perpendicular," "parallel," and "same" may be used in the following descriptions. These expressions do not necessarily strictly mean "constant," "orthogonal," "perpendicular," "parallel," or "same," respectively, and may allow for deviations in manufacturing accuracy, installation accuracy, etc. Numerical ranges indicated using "~" include the values ​​before and after them as the lower and upper limits, respectively.

[0012] The electronic component housing package, electronic module, and electronic device of this disclosure enable sufficient airtightness between the inside and outside of the package.

[0013] 1. [Package] Package 1 of one embodiment of the present disclosure mainly comprises a heat sink 10, a frame 20, an insulator 30, and a plate 40, as shown in Figures 1 to 4.

[0014] The heat sink 10 is made of a material such as a metal material that has excellent heat dissipation or thermal conductivity, and its shape is not particularly limited. For example, as shown in Figure 1, a substantially rectangular flat plate member can be used.

[0015] If the heat sink 10 is a substantially rectangular flat plate member as described above, its dimensions may be set to, for example, a range of 5 mm x 5 mm to 50 mm x 50 mm. In the package 1 of this embodiment, the heat sink 10 has a first heat sink surface 11 corresponding to the top surface.

[0016] The materials that make up the heat sink 10 are not particularly limited and can be any metal material or other material with excellent heat dissipation or thermal conductivity. For example, copper, tungsten, molybdenum, iron, nickel, or cobalt, or alloys thereof, can be used. Furthermore, specific examples of alloys include copper-tungsten alloys, copper-molybdenum alloys, and iron-nickel-cobalt alloys.

[0017] On the other hand, other materials with excellent thermal conductivity include, for example, aluminum-diamond composite materials and carbon-based materials such as graphite. The heat sink 10 may be composed of a single material as described above, or it may have a laminated structure in which multiple of these materials are stacked.

[0018] The heat sink 10 can dissipate heat generated from the electronic components 101, etc. (described later) to the outside, cool the electronic components 101, etc., and can also function as a heat dissipation substrate that is in contact with the electronic components 101, etc. inside the package.

[0019] The frame 20 has an opening 23 that penetrates between the first frame surface 21 and the second frame surface 22 facing the first frame surface 21, and opens toward the first heat sink surface 11 of the heat sink 10.

[0020] In the package 1 of this embodiment, the frame 20 has four frame wall portions (first frame wall portion 25a and second frame wall portion 25b) arranged along the outer circumference of the heat sink 10, which has a substantially rectangular shape in plan view. Specifically, the frame 20 has a pair of first frame wall portions 25a arranged facing each other, and a pair of second frame wall portions 25b that are perpendicular to the pair of first frame wall portions 25a and also facing each other. In the package 1, the space enclosed by the pair of first frame wall portions 25a and the pair of second frame wall portions 25b of the frame 20 corresponds to the inside of the package. Furthermore, the pair of first frame wall portions 25a and the pair of second frame wall portions 25b have a first joining surface 24 that faces the first heat sink surface 11 and is joined to the plate 40.

[0021] In the package 1 of this embodiment, the frame 20 has a pair of openings 23 provided in a gate shape by cutting out from the lower side (bottom side) of the frame 20 to match the outer circumference shape of the insulator 30 at opposing positions on the pair of first frame wall portions 25a described above. The number of openings 23 provided in the frame 20, their positions on the first frame wall portion 25a and / or second frame wall portion 25b, and the shape of the openings 23 are not particularly limited. That is, it is sufficient that various signals can be transmitted between the outside and inside of the package by lead terminals 32 connected to the insulator 30 fitted into the openings 23 and signal wiring 33 joined to the lead terminals 32.

[0022] The material constituting the frame 20 is not particularly limited, and various materials such as metals or ceramics can be used. Examples of metals include copper, tungsten, molybdenum, iron, nickel, or cobalt, or alloys thereof. Specific examples of alloys include copper-tungsten alloys, copper-molybdenum alloys, and iron-nickel-cobalt alloys.

[0023] On the other hand, examples of ceramic materials include aluminum oxide sintered bodies, aluminum nitride sintered bodies, silicon carbide sintered bodies, mullite sintered bodies, and glass ceramics. Examples of resin materials include epoxy resins, polyimides, and liquid crystal polymers.

[0024] The insulator 30 is fitted into the gate-shaped opening 23 and joined to the frame 20. In the package 1 of this embodiment, as shown in Figure 1, an insulator 30 having a step and a convex cross-section is used, but it is not limited to this. The insulator 30 is joined to three sides of the opening 23 of the frame 20, and has a second joining surface 31 that joins to the plate 40 on the surface facing the first heat sink surface 11 (the bottom surface in Figure 1, etc.).

[0025] The insulator 30 can be connected to lead terminals 32 from the outside of the package. The lead terminals 32 are connected to signal wiring 33 located on the insulator 30. This enables the transmission of various signals between the inside and outside of the package via the lead terminals 32 and signal wiring 33. The number of insulators 30 fitted into the frame 20 is not particularly limited and can correspond to the number of openings 23 in the frame 20 as described above.

[0026] The insulator 30 can be made of a ceramic material. For example, aluminum oxide sintered body, aluminum nitride sintered body, silicon carbide sintered body, mullite sintered body, glass ceramics, etc. can be used. The insulator 30 may be formed integrally with the frame 20 using the same ceramic material. This enables complex signal wiring 33 such as multiple wiring.

[0027] The plate 40 is formed to conform to the outer periphery of the heat sink 10. In the package 1 of this embodiment, the plate 40 has a substantially rectangular annular shape in plan view. The plate 40 is inserted between the first heat sink surface 11, which corresponds to the upper surface of the heat sink 10, the first joining surface 24 of the frame 20, and the second joining surface 31 of the insulator 30, and is joined using a bonding material.

[0028] The material constituting the plate 40 is not particularly limited, and for example, the same material as that constituting the frame 20 can be used. That is, similar to the frame 20, various materials such as metallic materials or ceramic materials can be used. Examples of metallic materials include copper, tungsten, molybdenum, iron, nickel, or cobalt, or alloys thereof. Specific examples of alloys include copper-tungsten alloys, copper-molybdenum alloys, and iron-nickel-cobalt alloys.

[0029] On the other hand, examples of ceramic materials include aluminum oxide sintered bodies, aluminum nitride sintered bodies, silicon carbide sintered bodies, mullite sintered bodies, and glass ceramics. Examples of resin materials include epoxy resins, polyimides, and liquid crystal polymers.

[0030] The plate 40 has a first joint portion 41 that joins with a pair of first frame wall portions 25a and a pair of second frame wall portions 25b of the frame 20, and a second joint portion 43 that is joined to the first joint portion 41 and has a protruding portion 42 that protrudes from the connection point with the first joint portion 41 to at least one of the first frame surface 21 side (corresponding to the outside of the package) and the second frame surface 22 side (corresponding to the inside of the package), and joins with the second joint surface 31 of the insulator 30.

[0031] In the package 1 of this embodiment, the second joint portion 43 of the plate 40 has protruding portions 42 that protrude from both the first frame surface 21 side and the second frame surface 22 side.

[0032] The plate 40 is joined to the frame 20 and the insulator 30 fitted into the opening 23 of the frame 20 using a first joining material 50. The first joining material 50 can be, for example, silver-copper brazing material, silver-copper-tin brazing material, Cu-P-Sn-Ni brazing material, or aluminum alloy brazing material.

[0033] The second bonding surface 31 of the insulator 30, which is fitted into the opening 23 of the frame 20 and faces the first heat sink surface 11, may have a step between it and the first bonding surface 24 of the frame 20 due to manufacturing tolerances. In this case, if the insulator 30 is directly bonded to the first heat sink surface 11, there is a possibility that sufficient airtightness cannot be ensured due to this step.

[0034] Therefore, as shown in package 1 of this embodiment, by joining the frame 20 and the insulator 30 to the plate 40 to eliminate any steps, and then joining the plate 40 to the first heat sink surface 11 of the heat sink 10, it becomes possible to sufficiently ensure airtightness between the inside and outside of the package.

[0035] Furthermore, by inserting a plate 40 made of a material with a small difference in thermal expansion between the heat sink 10 and the insulator 30 between the heat sink 10 and the insulator 30, and then joining and arranging them, the occurrence of deformation, cracks, and other damage to the package 1 can be suppressed.

[0036] In the package 1 of this embodiment, the plate 40 may have a shape that matches the shape of the joining surface including the first joining surface 24 and the second joining surface 31.

[0037] By matching the shape of the plate 40 to the shape of the joint surface formed by the first joint surface 24 of the frame 20 and the second joint surface 31 of the insulator 30, the step difference between the first joint surface 24 of the frame 20 and the second joint surface 31 of the insulator 30 is eliminated, making it possible to join the frame 20 and the heat sink 10 with improved airtightness. Furthermore, the plate 40 allows heat generated from the electronic components 101 to be quickly transferred to the heat sink 10, making it possible to suppress deformation, cracks, and other damage to the package 1.

[0038] The first joining surface 24 is the bottom surface of the frame 20, and the second joining surface 31 may be the bottom surface of the insulator 30. In this way, the frame 20 and the insulator 30, with their respective lower surfaces (bottom surfaces) facing the first heat sink surface 11 of the heat sink 10, are joined to the heat sink 10.

[0039] This eliminates the step between the first joining surface 24 of the frame 20 and the second joining surface 31 of the insulator 30, making it possible to join the frame 20 and other components to the heat sink 10 with improved airtightness. Furthermore, the plate 40 quickly transfers the heat generated from the electronic components 101 to the heat sink 10, making it possible to suppress deformation, cracks, and other damage to the package 1.

[0040] The plate area of ​​the plate 40 in a plan view may be within ±10% of the area of ​​the joint surface including the first joint surface 24 and the second joint surface 31. By setting the plate area within +10% of the area of ​​the joint surface, it is possible to accommodate manufacturing errors of the frame 20 and the insulator 30 and stabilize the joint between the frame 20 and the insulator 30 and the plate 40.

[0041] On the other hand, by keeping the plate area within -10% of the area of ​​the bonding surface, it is possible to maintain a stable bond between the frame 20 and the insulator 30 and the plate 40 while keeping the size of the package 1 compact.

[0042] The insulator 30 is a ceramic material, and the frame body 20 may be a metal material. Adopting such a configuration makes it possible to suppress the cost required for manufacturing the package 1.

[0043] The frame body 20 and the plate 40 may be made of the same metal material. This reduces the difference in the coefficient of thermal expansion between the frame body 20 and the plate 40, and lowers the possibility of occurrence of warping or distortion.

[0044] The plate 40 is bonded to the heat sink 10 using a second bonding material 51, and the melting point (second melting point) of the second bonding material 51 may be lower than the melting point (first melting point) of the first bonding material 50. That is, as shown in FIG. 4, the package 1 of the present embodiment has a structure in which respective components are laminated in the order of the frame body 20 (and the insulator 30), the first bonding material 50, the plate 40, the second bonding material 51, and the heat sink 10 from the top.

[0045] Furthermore, the first bonding material 50 and the second bonding material 51 satisfy the relationship of first melting point > second melting point. In the package 1 of the present disclosure, the frame body 20 and the insulator 30 are bonded to the plate 40 in advance using the first bonding material 50. Thereafter, the plate 40 integrated with the frame body 20 and the insulator 30 is bonded to the heat sink 10 using the second bonding material 51. At this time, since the first melting point of the first bonding material 50 and the second melting point of the second bonding material 51 have the above relationship, when the plate 40 and the heat sink 10 are bonded, the first bonding material 50 does not melt during the bonding using the second bonding material 51, which has a lower melting point than the first bonding material 50. As a result, when the plate 40 and the heat sink 10 are bonded, the possibility that the first bonding material 50 melts, causing displacement in the bonding position between the frame body 20, the insulator 30 and the plate 40, or causing the bonding to come off is reduced. That is, there is an advantage in using the second bonding material 51 having a low melting point.

[0046] The second bonding material 51 only needs to have a melting point lower than the first melting point of the first bonding material 50. For example, gold germanium brazing filler metal, eutectic solder, silver copper tin brazing filler metal, Cu-P-Sn-Ni brazing filler metal, aluminum alloy brazing filler metal, or the like can be used.

[0047] In a plan view of the plate 40, a plate width W1 may, for example, as shown in FIG. 3, coincide with a frame width W2 of the frame body 20 in a plan view (see FIG. 3). Here, as shown in FIG. 3, the plate width W1 corresponds to the width of the annular plate 40 on the Y-direction side (or the X-direction side). On the other hand, the frame width W2 corresponds to the width of the first frame wall portion 25a of the frame body 20 on the Y-direction side (or the width of the second frame wall portion 25b on the X-direction side).

[0048] By matching the plate width W1 of the plate 40 with the frame width W2 of the first frame wall portion 25a (or the second frame wall portion 25b), the bonding between the frame body 20 and the plate 40 is stabilized, and it becomes possible to sufficiently ensure airtightness between the inside and the outside of the package while keeping the size of the package 1 compact.

[0049] Furthermore, in a plan view of the plate 40, a plate width W1' of the plate 40 may be larger than the frame width W2 of the frame body 20 in a plan view. Similar to the aforementioned plate width W1, the plate width W1' corresponds to the width of the plate 40 on the Y-direction side (or the X-direction side). The frame width W2 is as described above. Further, the plate width W1' is indicated by an alternate long and short dash line in FIG. 3.

[0050] By setting the plate width W1' to be larger than the frame width W2, manufacturing errors occurring during the production of the frame body 20 and / or the frame body 20 can be tolerated, and the frame body 20 can be reliably arranged on the plate 40. Thereby, the bonding between the frame body 20 and the plate 40 is stabilized, and it becomes possible to sufficiently ensure airtightness between the inside and the outside of the package.

[0051] The second joint portion 43 is polygonal in shape with multiple corners 44, and at least one corner 44 may be rounded (see Figure 3). By forming the corners 44 of the second joint portion 43 in a rounded shape, a fillet 53 is more easily formed by the first joining material 50 between the second joining surface 31 (for example, the bottom surface) of the insulator 30 using the first joining material 50. In other words, in a planar perspective view, the corners of the second joining surface 31 of the insulator 30 may protrude from the rounded corners 44 of the second joint portion 43. The formation of such a fillet 53 improves the bonding strength between the second joint portion 43 of the plate 40 and the insulator 30, and reduces the possibility of the insulator 30 falling off the plate 40.

[0052] Furthermore, the shape of the second joint surface 31 of the insulator 30 may match the shape of the second joint portion 43 excluding the R-shaped corner portion 44. That is, the area of ​​the second joint portion 43 excluding the corner portion 44 may match the area of ​​the second joint surface 31. This makes it possible to form the package 1 compactly and to improve the bonding strength with the insulator 30.

[0053] In the package 1 of this embodiment, for example, the frame joint portion of the insulator 30 that is joined to the opening 23 of the frame 20 may be subjected to a metallization treatment in which a metal layer is provided with a metal material such as tungsten or a molybdenum-manganese alloy. This makes it possible to improve the joining strength of the insulator 30 to the opening 23.

[0054] In the package 1 of this embodiment, if part or all of the frame 20 is formed from a metal material, the portion formed from the metal material may be plated with nickel, gold, or the like. Furthermore, even if the insulator 30 is metallized as described above, it may also be plated with nickel, gold, or the like. This makes it possible to prevent corrosion of the metal parts.

[0055] [2. Electronic Module] As shown in Figure 5, the electronic module 100 of the embodiment comprises the package 1 described above, electronic components 101 mounted on the heat sink 10 inside the package, and a lid 102 joined to the frame 20. The electronic components 101 are, for example, light-emitting elements, light-receiving elements, power amplifiers, various sensors, etc.

[0056] The electronic component 101 can be electrically connected to the insulator 30 via lead terminals 32 and signal wiring 33, and connecting members such as wire bonding. The heat generated from the electronic component 101 mounted on the heat sink 10 can be efficiently dissipated to the outside through the heat sink 10.

[0057] The cover 102 is, for example, a plate-shaped member that can reduce the intrusion of some moisture, fine particles, etc., into the interior of the electronic module 100. The material of the cover 102 can be the same as that of the frame 20, for example, metal, ceramic, resin, etc.

[0058] As shown in Figure 5, the electronic module 100 may include a seal ring 103 located between the frame 20 and the lid 102. The seal ring 103 can function as a sealing material when the package 1 is hermetically sealed using the lid 102. The seal ring 103 may be formed, for example, by joining a frame-shaped metal plate containing an Fe-Ni alloy, Fe-Ni-Co alloy, etc., to a frame formed of a conductive paste containing a high-melting-point metal such as tungsten or molybdenum using metal brazing material or the like.

[0059] The electronic device 200 of this embodiment comprises an electronic module 100 including the package 1 described above, and an external substrate 201 joined to the electronic module 100 using a third bonding material 52. In the electronic device 200, the electronic module 100 contains the package 1 of this embodiment. The package 1 is joined to a frame 20 and an insulator 30 and a plate 40 using a first bonding material 50. Furthermore, in the package 1, the plate 40 and the heat sink 10 are joined using a second bonding material 51.

[0060] This configuration allows heat generated by the electronic component 101 to be transferred to and dissipated from the external substrate 201 via the heat sink 10. The external substrate 201 is joined to the heat sink 10 using a third bonding material 52, and like the heat sink 10, it can be made of a material such as a metal material with excellent heat dissipation or thermal conductivity. Examples include copper, tungsten, molybdenum, iron, nickel, or cobalt, or alloys thereof. Furthermore, specific examples of alloys include copper-tungsten alloys, copper-molybdenum alloys, and iron-nickel-cobalt alloys.

[0061] On the other hand, other materials with excellent thermal conductivity include, for example, aluminum-diamond composite materials and carbon-based materials such as graphite. The external substrate 201 may be composed of a single material as described above, or it may have a laminated structure in which multiple such materials are stacked.

[0062] The shape of the external base 201 is not particularly limited; for example, as shown in Figure 5, it can be joined to the lower surface of the heat sink 10 and can be a substantially rectangular flat plate member. Furthermore, the dimensions of the external base 201 are not particularly limited and may be substantially the same as the heat sink 10, or slightly larger, depending on the dimensions of the heat sink 10 to which it is joined. This makes it possible to form the entire electronic device 200 in a compact size.

[0063] In the electronic device 200, as described above, the package 1 is formed by joining the frame 20 and insulator 30 and the plate 40 using a first bonding material 50. Furthermore, the plate 40 is joined to the heat sink 10 using a second bonding material 51.

[0064] Furthermore, in an electronic device 200 containing an electronic module 100 including package 1, the plate 40 of package 1 is joined to the heat sink 10 using a second bonding material 51, and the melting point of the second bonding material (second melting point) is lower than the melting point of the first bonding material 50 (first melting point). As a result, as described above, the first bonding material 50 and the second bonding material 51 have the relationship first melting point > second melting point. This makes it possible to join the plate 40 and the heat sink 10 using the second bonding material 51 at a lower temperature than the joining between the frame 20 and the insulator 30 and the plate 40, which already uses the first bonding material 50.

[0065] Furthermore, the melting point (third melting point) of the third bonding material 52 that joins the heat sink 10 and the external substrate 201 is lower than the second melting point of the second bonding material 51. As a result, the first bonding material 50, the second bonding material 51, and the third bonding material 52 have the relationship first melting point > second melting point > third melting point. This makes it possible to join the heat sink 10 and the external substrate 201 after the construction of the package 1 and electronic module 100 in this embodiment at a lower temperature than when joining using the first bonding material 50 and the second bonding material 51.

[0066] As a result, when joining using the third joining material 52, the first joining material 50 and the second joining material 51 melt, reducing the possibility of misalignment of the joining position between the frame 20 and the insulator 30 and the plate 40, and between the plate 40 and the heat sink 10, or of these joining positions coming undone.

[0067] The third bonding material 52 can be any material that has a lower melting point than the first bonding material 50 and the second bonding material, such as gold germanium brazing material or gold tin.

[0068] The following are further examples of embodiments of the electronic component housing package, electronic module, and electronic device relating to this disclosure.

[0069] (1) The electronic component housing package according to the present disclosure comprises: a heat sink; a frame that penetrates between a first frame surface and a second frame surface facing the first frame surface and has an opening that opens to the heat sink; an insulator that is fitted into the opening and joined to the frame; and an annular plate that is inserted between a first heat sink surface of the heat sink, a first joining surface of the frame, and a second joining surface of the insulator, and is joined to the frame and the insulator using a first joining material, wherein the plate has a first joining portion that joins to the frame; and a second joining portion that is connected to the first joining portion and has a protruding portion that protrudes from the connection point with the first joining portion toward at least one of the first frame surface side and the second frame surface side, and joins to the insulator.

[0070] (2) One embodiment of the electronic component storage package according to the present disclosure is the electronic component storage package according to (1) above, wherein the plate matches the shape of the bonding surface including the first bonding surface and the second bonding surface.

[0071] (3) One embodiment of the electronic component storage package according to the present disclosure is the electronic component storage package according to (1) or (2) above, wherein the first bonding surface is the bottom surface of the frame, and the second bonding surface is the bottom surface of the insulator.

[0072] (4) One embodiment of the electronic component storage package according to the present disclosure is the electronic component storage package according to (1) to (3) above, wherein the plate area in a plan view of the plate is within ±10% in area ratio with respect to the area of ​​the bonding surface including the first bonding surface and the second bonding surface.

[0073] (5) One embodiment of the electronic component storage package relating to the present disclosure is the electronic component storage package of (1) to (4) above, wherein the insulator is a ceramic material and the frame is a metal material.

[0074] (6) One embodiment of the electronic component storage package relating to the present disclosure is the electronic component storage package described in (1) to (5) above, wherein the frame and the plate are made of the same metal material.

[0075] (7) One embodiment of the electronic component storage package according to the present disclosure is the electronic component storage package according to (1) to (6) above, wherein the plate is joined to the heat sink using a second bonding material, and the melting point of the second bonding material is lower than the melting point of the first bonding material.

[0076] (8) One embodiment of the electronic component storage package according to the present disclosure is the electronic component storage package according to (1) to (7) above, wherein the width of the plate in a plan view of the plate is the same as the width of the frame in a plan view of the frame.

[0077] (9) One embodiment of the electronic component storage package according to the present disclosure is the electronic component storage package according to (1) to (8) above, wherein the width of the plate in a plan view is larger than the width of the frame in a plan view.

[0078] (10) One embodiment of the electronic component storage package according to the present disclosure is the electronic component storage package according to (1) to (9) above, wherein the second joint portion is a polygonal shape having a plurality of corners, and at least one of the corners is R-shaped.

[0079] (11) One embodiment of the electronic component storage package according to the present disclosure is the electronic component storage package according to (1) to (10) above, wherein a fillet made of the first bonding material is formed between the second bonding surface and the plate.

[0080] (12) One embodiment of the electronic component storage package according to the present disclosure is the electronic component storage package of (10) above, wherein the shape of the second joint surface is the same as the shape of the second joint portion excluding the R-shaped corner portion.

[0081] (13) One embodiment of the electronic module relating to the present disclosure comprises an electronic component housing package of any of (1) to (12) above, an electronic component mounted on the heat sink, and a lid joined to the frame.

[0082] (14) One embodiment of an electronic device according to the present disclosure comprises the electronic module described in (13) above, and an external substrate joined to the electronic module using a third bonding material, wherein the plate is joined to the heat sink using a second bonding material, the melting point of the second bonding material is lower than the melting point of the first bonding material, and the melting point of the third bonding material is lower than the melting point of the second bonding material.

[0083] Furthermore, details shown in the embodiments described above may be modified as appropriate without departing from the spirit of this disclosure. The scope of this disclosure includes the scope set forth in the claims and its equivalents. Various combinations of each embodiment are not limited to the examples of embodiments described above. Combinations of each embodiment are also possible.

[0084] 1 Package (package for housing electronic components) 10 Heat sink 11 First heat sink surface 20 Frame 21 First frame surface 22 Second frame surface 23 Opening 24 First joint surface 25a First frame wall 25b Second frame wall 30 Insulator 31 Second joint surface 32 Lead terminal 33 Signal wiring 40 Plate 41 First joint 42 Protrusion 43 Second joint 44 Corner 50 First joint material 51 Second joint material 52 Third joint material 53 Fillet 100 Electronic module 101 Electronic component 102 Cover 200 Electronic device 201 External substrate W1, W1' Plate width W2 Frame width

Claims

1. An electronic component housing package comprising: a heat sink; a frame having an opening that penetrates between a first frame surface and a second frame surface facing the first frame surface and opens to the heat sink; an insulator fitted into the opening and joined to the frame; and an annular plate inserted between the first heat sink surface of the heat sink, the first joining surface of the frame, and the second joining surface of the insulator, and joined to the frame and the insulator using a first joining material, wherein the plate has a first joining portion that joins to the frame; and a second joining portion that is connected to the first joining portion and has a protrusion that extends from the connection point with the first joining portion toward at least one of the first frame surface side and the second frame surface side, and joins to the insulator.

2. The electronic component housing package according to claim 1, wherein the plate matches the shape of the bonding surface including the first bonding surface and the second bonding surface.

3. The electronic component housing package according to claim 1 or 2, wherein the first bonding surface is the bottom surface of the frame, and the second bonding surface is the bottom surface of the insulator.

4. The electronic component housing package according to any one of claims 1 to 3, wherein the plate area in a plan view of the plate is within ±10% in area ratio to the area of ​​the bonding surface including the first bonding surface and the second bonding surface.

5. The electronic component housing package according to any one of claims 1 to 4, wherein the insulator is made of a ceramic material and the frame is made of a metal material.

6. The electronic component housing package according to any one of claims 1 to 5, wherein the frame and the plate are made of the same metal material.

7. The electronic component housing package according to any one of claims 1 to 6, wherein the plate is joined to the heat sink using a second bonding material, and the melting point of the second bonding material is lower than the melting point of the first bonding material.

8. The electronic component housing package according to any one of claims 1 to 7, wherein the plate width in a plan view of the plate matches the frame width in a plan view of the frame.

9. The electronic component storage package according to any one of claims 1 to 8, wherein the plate width in a plan view of the plate is greater than the frame width in a plan view of the frame.

10. The electronic component housing package according to any one of claims 1 to 9, wherein the second joint portion is polygonal in shape having multiple corners, and at least one of the corners is rounded (R-shaped).

11. The electronic component housing package according to any one of claims 1 to 10, wherein a fillet made of the first bonding material is formed between the second bonding surface and the plate.

12. The electronic component housing package according to claim 10, wherein the shape of the second joint surface matches the shape of the second joint portion excluding the R-shaped corner portion.

13. An electronic module comprising: an electronic component housing package according to any one of claims 1 to 12; an electronic component mounted on the heat sink; and a lid joined to the frame.

14. An electronic device comprising: an electronic module according to claim 13; and an external substrate joined to the electronic module using a third bonding material, wherein the plate is joined to the heat sink using a second bonding material, the melting point of the second bonding material is lower than the melting point of the first bonding material, and the melting point of the third bonding material is lower than the melting point of the second bonding material.

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