Method for manufacturing polishing pad

Abstract

The objective of the present invention is to provide a method for manufacturing a polishing pad having a polishing layer with protrusions, the method enabling maintenance of bonding strength between layers of the polishing pad having a laminated structure while achieving process simplification.　The present invention relates to a method for manufacturing a polishing pad having a polishing layer that is formed by curing a resin and has protrusions, the method comprising: a step (step 1) of preparing an intaglio plate on which a concavo-convex pattern is formed; a step (step 2) of placing a liquid resin on the intaglio plate; a step (step 31) of placing, before the resin cures, a core material having a pressure-sensitive adhesive on at least one surface thereof such that the pressure-sensitive adhesive and the intaglio plate face each other; a step (step 41) of pressing the core material toward the intaglio plate and spreading the resin; a step (step 51) of curing the resin; and a step (step 6) of releasing the cured resin from the intaglio plate and obtaining a polishing layer to which the core material is attached.

Description

Manufacturing method for polishing pads

[0001] This invention relates to a method for manufacturing a polishing pad. More specifically, this invention relates to a method for manufacturing a polishing pad that can be suitably used for polishing optical materials, semiconductor wafers, semiconductor devices, hard disk substrates, metal and ceramic surfaces, and the like.

[0002] There are polishing pads used for polishing the surfaces of optical materials, semiconductor wafers, semiconductor devices, hard disk substrates, silicone wafers, and sapphire glass to flatten them, and these pads have a polishing layer with protrusions (Japanese Patent Publication No. 2015-178155). Furthermore, Japanese Patent Publication No. 05-023973 describes a method for manufacturing a polishing tape in which an ionizing radiation-curable resin containing an abrasive is filled only into the recesses of a roll intaglio plate, and a film substrate is brought into contact with it so that the adhesive-coated surfaces face each other, and while the substrate is in contact with the intaglio plate, ionizing radiation is irradiated to harden the resin interposed between the substrate and the intaglio plate. The polishing tape obtained by the above manufacturing method is described in which, when polishing is performed, the polishing debris generated from the material to be polished (object to be polished) is contained in the recesses formed by the polishing layer with the adhesive layer surface exposed, and is held in place by the adhesive layer surface of the recesses, thereby reducing scratches and contamination of the surface of the material to be polished by the polishing debris, as well as the scattering of polishing debris and the resulting environmental pollution. However, the polishing tapes described in previous literature are formed using roll intaglio printing, and the polishing layer constituent units are scattered. As a result, issues with thickness accuracy and adhesive strength are not recognized, and there is a risk of the adhesive peeling off during polishing.

[0003] Furthermore, Japanese Patent Publication No. 2002-542056 describes an invention relating to an abrasive article suitable for polishing glass or glass ceramic workpieces, stating that in order to obtain a precisely formed abrasive coating, "the abrasive slurry can be applied into the cavity of a manufacturing tool by conventional techniques such as die coating, vacuum die coating, spray coating, roll coating, transfer coating, knife coating, etc." (paragraph 0072).

[0004] Further, Japanese Unexamined Patent Application Publication No. 2004-148500 discloses an invention relating to a method for producing an abrasive article obtained by a production tool having a pattern (unevenness), and describes that "irradiation energy is transmitted into the mixture through the back surface 57 of the production tool 41, and the binder precursor is cured at least partially. After the binder precursor is cured at least partially, the molded handleable structure 62 is separated from the production tool 41" (paragraph 0006). However, the production method according to the prior art is intended for production in a continuous process, and does not recognize the problem in the sheet-fed method that tension is less likely to be applied to the backing material.

[0005] Japanese Unexamined Patent Application Publication No. 2015-178155, Japanese Unexamined Patent Application Publication No. 05-023973, Japanese National Publication of International Patent Application No. 2002-542056, Japanese Unexamined Patent Application Publication No. 2004-148500

[0006] Disclosed herein is an invention aiming to provide the following. That is: to provide a method for producing a polishing pad having a polishing layer with convex portions, which comprises a polishing layer having convex portions, can maintain the adhesive strength between layers in a polishing pad having a laminated structure, and can simplify the process; in a method for producing a polishing pad having a laminated structure and comprising a polishing layer with convex portions, to provide a method that can obtain a favorable coated state without filling leakage (chipping) up to the outer peripheral portion when producing the polishing layer even if the resin has high viscosity; and in the case of producing a polishing layer having convex portions by a sheet-fed method, to provide a method for producing a polishing pad that does not cause streaky lifting between a core material and a resin in a method of expanding a film after disposing the same. In the present specification, the term "sheet-fed method" means producing a polishing layer or a laminate including a polishing layer one by one.

[0007] In light of the above issues, we conducted intensive research and found that by pouring the resin raw material for the polishing layer into a grooved plate, arranging a core material having an adhesive layer on at least one side so that the adhesive layer faces the grooved plate before the resin hardens, pressing the core material from the side not facing the resin to spread the resin, and curing the resin with ultraviolet light, the adhesive strength between the layers can be maintained and the process can be simplified. Furthermore, in a method for manufacturing a polishing pad having a laminated structure with a polishing layer having protrusions, we found a method to obtain a good coating state without any gaps (chips) in the outer periphery when manufacturing the polishing layer, even with a highly viscous resin. And, in the process of pouring the resin raw material for the polishing layer into a grooved plate, arranging a core material facing the grooved plate before the resin hardens, pressing the core material from the side not facing the resin to spread the resin, and curing the resin, we found that by first curing at least the edges of the spread resin, and then curing the entire surface of the resin, the occurrence of streaky lifting can be easily suppressed. In other words, the present invention encompasses the following. [1] A method for manufacturing a polishing pad having a polishing layer having protrusions, which is made of a cured resin, comprising: a step of preparing a recessed plate having an uneven pattern formed on it (step 1); a step of placing a liquid resin on the recessed plate (step 2); a step of placing a core material having an adhesive layer on at least one side before the resin hardens, such that the adhesive layer and the recessed plate face each other (step 31); a step of pressing the core material toward the recessed plate to spread the resin (step 41); a step of hardening the resin (step 51); and a step of peeling the hardened resin from the recessed plate to obtain a polishing layer to which the core material is attached (step 6). [2] The manufacturing method according to [1], wherein the resin and the adhesive constituting the adhesive layer are made of the same resin. [3] A polishing pad comprising: a polishing layer made of resin, which is composed of a base and protrusions; an adhesive layer attached to the side of the polishing layer opposite to the polishing surface; and a core material attached to the adhesive layer. [4] The polishing pad according to [3], wherein the thickness of the core material is 10 μm or more and 300 μm or less. [5] The polishing pad according to [3], wherein the resin and the adhesive constituting the adhesive layer contain the same resin. [6] The polishing pad according to [3], wherein the resin contains abrasive grains and a filler.[7] The polishing pad according to [3], wherein the base material layer is attached to the core material via an adhesive layer. [8] A method for manufacturing a polishing pad having a polishing layer having protrusions, which is made of a hardened resin, comprising: a step of preparing a plate with an uneven pattern formed on it (step 1); a step of placing a liquid resin on the plate (step 2); a step of placing a core material opposite to the plate before the resin hardens (step 32); a step of pressing the core material by moving a pressing means toward the plate from the first end to the opposing second end, thereby spreading the resin (step 42); a step of hardening the resin (step 51); and a step of peeling the hardened resin from the plate to obtain a polishing layer to which the core material is attached (step 6), wherein when the plate is divided into two equal parts by a straight line perpendicular to the direction of movement, the area including the first end is called the first area, and the area including the second end is called the second area, and in step 2, 90% by mass or more of the total resin amount is placed in the first area of ​​the plate. A method for manufacturing an abrasive pad, wherein, when viewed perpendicular to the surface of the intaglio plate, the shape of the resin arranged in the first area is such that the width narrows from the first end to the second end, and the width is the length of the shape in a direction parallel to the length direction of the first end. [9] The manufacturing method according to [1] or [8], wherein step 51 is curing by ultraviolet light.

[10] The manufacturing method according to [8], wherein the arranged resin is arranged integrally with the first end.

[11] The manufacturing method according to [8], wherein step 2 is carried out using a coating mold.

[12] A method for manufacturing a polishing pad having a polishing layer having protrusions, which is made of a hardened resin, comprising: a step of preparing a recessed plate having an uneven pattern formed on it (step 1); a step of placing a liquid resin on the recessed plate (step 2); a step of placing a core material opposite to the recessed plate before the resin hardens (step 32); a step of pressing the core material toward the recessed plate and hardening at least the edges of the spread resin while spreading it out (step 43); a step of hardening the entire surface of the resin (step 52); and a step of peeling the hardened resin from the recessed plate to obtain a polishing layer to which the core material is attached (step 6).

[13] The manufacturing method according to [8] or

[12] , wherein step 32 is a step (step 31) in which a core material having an adhesive layer on at least one side is arranged such that the adhesive layer and the intaglio plate face each other before the resin hardens.

[14] The manufacturing method according to

[12] , wherein steps 43 and 52 are cured by ultraviolet light.

[15] The manufacturing method according to [1], [8] or

[12] , wherein the thickness of the core material is 10 μm or more and 300 μm or less.

[16] The manufacturing method according to

[12] , wherein the polishing layer is manufactured in a single-wafer method.

[17] The manufacturing method according to [1] or

[12] , wherein a liquid resin is placed on a part of the intaglio plate.

[18] The manufacturing method according to [1], [8] or

[12] , wherein the resin comprises abrasive grains and a filler.

[0008] A method for manufacturing a polishing pad having a polishing layer with protrusions, which is made by curing a resin, comprises the steps of: preparing a plate with an uneven pattern (step 1); placing liquid resin on the plate (step 2); arranging a core material having an adhesive layer on at least one side so that the adhesive layer and the plate face each other before the resin hardens (step 31); pressing the core material toward the plate to spread the resin (step 41); hardening the resin (step 51); and peeling the hardened resin from the plate to obtain a polishing layer to which the core material is attached (step 6). This manufacturing method maintains the adhesive strength between layers and simplifies the process. In particular, the process can be simplified with resin raw materials that contain many components other than resin and have high viscosity. Furthermore, handling can be improved by adjusting the thickness of the core material.

[0009] A method for manufacturing a polishing pad having a polishing layer having protrusions, which is made by curing a resin, comprising the steps of: preparing a plate with an uneven pattern formed on it (step 1); placing liquid resin on the plate (step 2); positioning a core material opposite the plate before the resin hardens (step 32); pressing the core material by moving a pressing means toward the plate from the first end to the opposing second end, thereby spreading the resin (step 42); and hardening the resin (step 51). The method for manufacturing an abrasive pad includes a step (step 6) of peeling off the hardened resin from the intaglio plate to obtain an abrasive layer to which the core material is attached, wherein when the intaglio plate is divided into two equal parts by a straight line perpendicular to the direction of movement, the area including the first end is called the first area, and the area including the second end is called the second area, and in step 2, 90% or more of the total amount of resin is placed in the first area of ​​the intaglio plate, and when viewed perpendicular to the surface of the intaglio plate, the shape of the resin placed in the first area is such that the width narrows from the first end to the second end, and the width is the length of the shape in a direction parallel to the length direction of the first end, and if the resin on the intaglio plate is tapered (shape that becomes narrower in width) with respect to the leveling direction, a good coating state without any gaps (chips) up to the outer circumference can be obtained.

[0010] A method for manufacturing a polishing pad having a polishing layer having protrusions, which is made by curing a resin, comprising the steps of: preparing a plate with an uneven pattern formed on it (step 1); placing a liquid resin on the plate (step 2); positioning a core material opposite the plate before the resin hardens (step 32); pressing the core material toward the plate and hardening at least the edges of the spread resin while spreading it out (step 43); hardening the entire surface of the resin (step 52); and peeling the hardened resin from the plate to obtain a polishing layer to which the core material is attached (step 6). This method for manufacturing a polishing pad can suppress the occurrence of streaks by hardening at least the edges of the spread resin and then hardening the entire surface of the resin.

[0011] Figure 1 is a schematic diagram of the vertical cross-section of the polishing pad. Figure 2 is a schematic cross-sectional view of the steps of the manufacturing method of the polishing layer with the core material attached (first embodiment). Figure 3 is a schematic cross-sectional view of the steps of the manufacturing method of the polishing layer with the core material attached (second embodiment). Figure 4 is a view of the process of the manufacturing method of Figure 3, looking from above in a direction perpendicular to the surface of the intaglio plate. Figure 5 is a specific example of a coating type. Figure 6 is a schematic cross-sectional view of the steps of the manufacturing method of the polishing layer with the core material attached (third embodiment). Figure 7 is a schematic view of steps (d'), (e-1), and (e-2) of the manufacturing method of Figure 6, looking from above in a direction perpendicular to the surface of the intaglio plate 7.

[0012] The following describes embodiments for carrying out the invention, but the present invention is not limited to these embodiments.

[0013] <Method for Manufacturing the Core Material Adhering Polishing Layer (First Embodiment)> The method for manufacturing the core material adhering polishing layer, which is a constituent material of the polishing pad, in the first embodiment will be explained with reference to Figures 1 and 2. As shown in Figure 2, the manufacturing method includes the steps of preparing a printing plate 7 (Figure 2 (a)), placing liquid resin 11 on the printing plate 7 (Figure 2 (b)), placing the core material 21 (Figure 2 (c)), pressing the core material 21 to spread the resin 11 (Figure 2 (d)), curing the resin 11 (Figure 2 (e)), and peeling off the cured resin 11 from the printing plate 7 (Figure 2 (f)) to obtain the core material adhering polishing layer 1 (Figure 2 (g)).

[0014] (Process of preparing the intaglio plate) In order to form the protrusions 14 on the polished surface of the polishing layer 1, an intaglio plate 7 with an uneven pattern is prepared. The intaglio plate 7 is not particularly limited as long as it is an intaglio plate 7 that can form the protrusions 14 on the polished surface. The material of the intaglio plate 7 is not particularly limited as long as it can form the protrusions 14, and examples include metal plates and resin plates, and as shown in Figure 2(f), a resin plate is preferred from the viewpoint of being able to peel off the hardened resin 11 and being low cost. The intaglio plate 7 may be made of a disposable material or a material that can be used repeatedly. In the process of hardening the resin 11 that constitutes the polishing layer 1, if hardening is performed by ultraviolet irradiation from the intaglio plate 7 side, it is preferable that the intaglio plate 7 is an intaglio plate that transmits ultraviolet light. The polishing layer 1 is composed of a base portion 15 and protrusions 14, and it is preferable that the thickness of the base portion 15 and protrusions 14 of the polishing layer 1, and the total thickness of the base portion 15 and protrusions 14 are uniform. Therefore, it is preferable to make the intaglio plate 7 horizontal before the liquid resin 11 hardens and to keep it horizontal until the resin 11 hardens. To keep the intaglio plate 7 horizontal, additional metal plates or resin plates may be placed on the back surface of the intaglio plate 7 (the side where the resin 11 is not placed).

[0015] (Step of placing liquid resin on the intaglio plate) The polishing layer 1 is composed of a curable resin. The curable resin can be a two-component curable resin that hardens when mixed with a curing agent, a thermosetting resin that hardens with heat, or a photocurable resin that hardens when irradiated with light, such as ultraviolet light. The two-component curable resin is not particularly limited, but for example, prepolymers with different physical properties can be used, such as epoxy resins, unsaturated polyester resins, and polyamide resins. The thermosetting resin is not particularly limited, but for example, phenolic resins, epoxy resins, acrylic resins, urethane resins, and formaldehyde resins can be used. The photocurable resin is not particularly limited as long as it is a resin that polymerizes and hardens with light of a specific wavelength, but for example, polyester resins, unsaturated polyester resins, vinyl ether resins, vinyl ester resins, acrylic resins, and epoxy resins can be used. Photocurable resins are preferred, and acrylic resins are preferred among them. The resin 11 may be used alone or in combination of two or more types.

[0016] The resin 11 constituting the polishing layer 1 may be a resin composition containing a filler 12 and abrasive grains 13. In this specification, the resin constituting the polishing layer also includes embodiments of the resin composition. The filler 12 and abrasive grains 13 can be arbitrarily selected and used from fillers and abrasive grains known in the art. The filler 12 is preferably a filler having shape anisotropy. The abrasive grains 13 are preferably composite particles in which a plurality of abrasive grains are dispersed in a matrix, and more preferably composite particles in which a plurality of diamond abrasive grains are dispersed in a matrix. When the resin composition constituting the polishing layer 1 contains a filler 12, depending on the shape anisotropy of the filler 12, the mass of the filler 12 in the resin composition may, for example, be more than 50% by mass of the total amount of the resin composition. If the shape anisotropy of the filler 12 is large, the mass of the filler 12 in the resin composition may be 50% by mass or less of the total amount of the resin composition. The resin 11 that constitutes the polishing layer 1 has high viscosity because it holds fillers and the like inside. As shown in Figures 2(b) and (c), if it is only placed on a part of the intaglio plate 7, it does not easily spread to the entire intaglio plate 7, so it is preferable to press and spread it.

[0017] (Step of arranging the core material 21) The core material 21 preferably has an adhesive layer 22 on at least one side, and more preferably has an adhesive layer 22 on only one side. The thickness of the core material 21 is not particularly limited, but the lower limit is usually 10 μm or more, preferably 20 μm or more, and the upper limit is usually 300 μm or less, preferably 250 μm or less, and even more preferably 200 μm or less. The thickness of the core material 21 may be, for example, 50 μm or more and 100 μm or less. If the thickness of the core material 21 is 10 μm or more, the handling properties are good. When ultraviolet light is irradiated from the core material 21 side as shown in Figure 2 during the process of curing the resin 11, it is preferable that the core material 21 is a core material that transmits ultraviolet light. The adhesive constituting the adhesive layer 22 may contain the same resin as the resin 11 constituting the polishing layer 1 as the base resin. The same resin means a resin in which the main component with the highest content in each resin is the same (a resin with the same skeleton). The structural classifications include acrylic, urethane, and ester types. For the adhesive, an acrylic adhesive with an acrylic base resin is preferred. In addition to the base resin, a tackifier is added to the adhesive.

[0018] If the core material 21 has an adhesive layer 22 before the resin 11 hardens, the core material 21 is positioned so that the adhesive layer 22 faces the intaglio plate 7. At this time, the liquid resin 11 placed in the previous step does not have to be placed over the entire intaglio plate 7. That is, it may be placed on a part of the intaglio plate 7 and then spread out. If the core material 21 is placed with the liquid resin 11 placed on a part of the intaglio plate 7, the adhesive layer 22 and the intaglio plate 7 will be in direct contact with the parts where the liquid resin 11 is not placed, and the intaglio plate 7 and the core material 21 will be temporarily fixed before the subsequent steps.

[0019] (Process of pressing the core material and spreading the resin) As mentioned above, the resin 11 that constitutes the polishing layer contains filler 12 and abrasive grains 13 and has high viscosity, so it needs to be spread. In the previous process, liquid resin 11 is placed on the intaglio plate 7, and the core material 21 is placed opposite the intaglio plate 7 before the resin 11 hardens. Therefore, the resin 11 is spread by pressing the core material 21 toward the intaglio plate 7. The method of pressing the core material 21 is not particularly limited as long as the resin 11 is spread uniformly, but one example is to use a roller 8, squeegee, etc. as shown in Figure 2. Since the spreading of the highly viscous resin 11 is done via the core material 21, the tool used to press the core material 21 can be used continuously without intervening in processes such as cleaning. The viscosity of the resin 11 is not particularly limited, but the lower limit is usually 1 dPa·s or more, preferably 3 dPa·s or more, and more preferably 5 dPa·s or more, under atmospheric pressure and heated conditions (for example, 50°C). The upper limit is usually 100 dPa·s or less, preferably 80 dPa·s or less, and more preferably 60 dPa·s or less. It may also be 50 dPa or less. The viscosity of the resin 11 may be, for example, 3 dPa·s or more and 60 dPa·s or less. When the viscosity of the resin 11 is 100 dPa·s or less, it tends to spread uniformly. The viscosity is the viscosity at the time of coating after heating, etc., and is measured using a B-type rotational viscometer. As shown in Figure 2, in the process of pressing the core material 21 and spreading the resin 11, the resin 11 is not contained only in the recesses of the intaglio plate 7, but is also spread so that the resin 11 exists between the protrusions of the intaglio plate 7 and the adhesive layer 22. The resin 11 contained in the recesses of the intaglio plate 7 constitutes the protrusions 14 of the polishing layer 1 shown in Figure 1, and the resin 11 between the protrusions of the intaglio plate 7 and the adhesive layer 22 constitutes the base 15 of the polishing layer 1.

[0020] (Process for curing the resin) The curing method can be appropriately selected depending on the resin 11 used, but in this specification, a method of curing the resin 11 by irradiating it with ultraviolet light is described as an example. The ultraviolet light 9 may be irradiated from the core material 21 side as shown in Figure 2, or from the intaglio plate 7 side. The device for irradiating light is not particularly limited as long as it emits light in a wavelength range that includes the wavelength of light that cures the photocurable resin, for example, an ultraviolet irradiation device, and more specifically, a high-pressure mercury lamp, a UV-LED lamp, or a black light blue fluorescent lamp (BLB) can be used. The wavelength and irradiation time of ultraviolet irradiation are not particularly limited as long as the resin 11 can be cured, but for example, a wavelength of 250 nm to 480 nm and an irradiation time of 1 to 15 minutes. Ultraviolet irradiation may be done once or in multiple stages. The adhesive constituting the adhesive layer 22 of the core material 21 contains the same resin as the resin 11 constituting the polishing layer 1, and may be cured together with ultraviolet irradiation. The adhesive constituting the adhesive layer 22 of the core material 21 is also cured in conjunction with ultraviolet irradiation, thereby obtaining good adhesive strength between the polished layer 1 and the core material 21.

[0021] (Step of peeling off the hardened resin 11 from the intaglio plate and obtaining a core material-attached polishing layer) As shown in Figure 2, the hardened resin 11 is peeled off from the intaglio plate 7 to obtain a core material-attached polishing layer. A polishing pad is manufactured using the core material-attached polishing layer.

[0022] In the process of pressing the core material and spreading the resin, the resin 11 is located between the protrusions of the intaglio plate 7 and the adhesive layer 22, and the base 15 of the polishing layer 1 is formed, so the adhesive layer 22 is not exposed in the polishing layer attached to the core material. The polishing layer 1 is composed of protrusions 14 and a base 15, as shown in Figure 1.

[0023] <Method for Manufacturing the Core Material Adhering Polishing Layer (Second Embodiment)> The second embodiment of the method for manufacturing the core material adhering polishing layer, which is a constituent material of the polishing pad, will be explained using Figures 1, 3, and 4. As shown in Figure 3, this manufacturing method includes the steps of: preparing a printing plate 7 (Figure 3 (a)); placing liquid resin 11 on the printing plate 7 (Figure 3 (b-1), (b-2), (b-3)); arranging the core material so as to face the printing plate 7 before the resin hardens (Figure 3 (c)); pressing the core material 21 by moving a pressing means toward the printing plate 7 from the first end to the opposing second end, thereby spreading the resin (Figure 3 (d)); hardening the resin 11 (Figure 3 (e)); and peeling off the hardened resin 11 from the printing plate 7 (Figure 3 (f)) to obtain the core material adhering polishing layer 1 (Figure 3 (g)).

[0024] (Step of preparing the intaglio plate) In the second embodiment as well, in order to form the protrusions 14 on the polished surface of the polished layer 1, an intaglio plate 7 with an uneven pattern is prepared (Figure 3(a), Figure 4(a)), but this is the same as in the first embodiment and is therefore omitted from the description. When viewed from above in a direction perpendicular to the pressing surface of the intaglio plate 7, the shape of the intaglio plate 7 is not particularly limited, but it is preferably rectangular as shown in Figure 4.

[0025] In the second embodiment, the definitions of each part of the intaglio plate 7 are as follows. That is, the resin 11 is spread out by moving the roller 8, which is a pressing means, from the first end 71 to the opposing second end 72 of the intaglio plate 7 shown in Figures 3 and 4 (see Figure 3(d)). In this embodiment, the roller 8 is moved in the direction of movement 81 while rotating from the first end 71 to the second end 72 of the intaglio plate 7. Here, if the intaglio plate 7 is divided into two equal parts by a straight line 75 perpendicular to the direction of movement 81, the area of ​​the intaglio plate 7 with an uneven pattern including the first end 71 is called the first area 73, and the area of ​​the intaglio plate 7 with an uneven pattern including the second end 72 is called the second area 74. That is, the area of ​​the first area 73 and the second area 74 are the same.

[0026] (Step of placing liquid resin on the intaglio plate) The polishing layer 1 is made of a curable resin. The type of curable resin is the same as in the first embodiment. The resin 11 that constitutes the polishing layer 1 may also be a resin composition containing a filler 12 and abrasive grains 13. In this specification, the resin that constitutes the polishing layer also includes the form of the resin composition. The mass of the filler 12, abrasive grains 13, and the filler 12 in the resin composition is the same as the mass of the filler 12, abrasive grains 13, and the filler 12 in the resin composition described in the first embodiment. The resin 11 that constitutes the polishing layer 1 has high viscosity because it holds the filler and the like inside, and as shown in Figures 3(b-3) and (c), if it is only placed on a part of the intaglio plate 7 it does not easily spread to the entire intaglio plate 7, so it is preferable to press and spread it.

[0027] In steps (b-2) to (b-3) of Figures 3 and 4, more than 90% of the total amount of resin 11 is placed in the first area 73. By placing it in this manner, it is possible to achieve a good coating state without any gaps (missing parts) throughout the entire intaglio plate 7. The resin used in this specification tends to have high viscosity when it contains abrasive grains or fillers. However, because the resin 11 is a liquid, even though it is a highly viscous resin, it will gradually spread throughout the entire intaglio plate 11 over time. Therefore, a coating mold 10 is used to maintain the state in which more than 90% by mass of the total amount of resin 11 is placed in the first area 73. By using the coating mold 10, more than 90% by mass of the total amount of resin 11 can be placed in the first area 73.

[0028] When viewed perpendicular to the surface of the intaglio plate 7, the shape of the resin placed in the first area 73 is such that its width narrows from the first end towards the second end. Here, width refers to the length of the shape of the placed resin in a direction parallel to the length direction of the first end 71. The resin is placed integrally with the first end, and its maximum width matches the length of the first end. To maintain the shape of the placed resin, for example, coating molds 10A to 10F shown in Figure 5 are used. Coating molds 10A to 10F are provided with coating holes 101A to 101F for placing the resin 11. Taking coating hole 101A as an example, the shape that narrows in width from the first end towards the second end means that when placed on the intaglio plate 7 (see Figures 4(b-1) and (b-2)), in a direction parallel to the length direction of the first end 71, the width 111A closer to the second end 72 is narrower than the width 110A closer to the first end 71. In other words, since the resin 11 that is placed is also placed in the same shape as the shape of the coating hole, the placed resin also has a shape that narrows in width from the first end 71 to the second end 72. The coating hole may be not only the triangular shape (101A) shown in Figure 5(a), but also a mountain-shaped shape with two indentations as shown in Figure 5(b) (101B), a semi-circular shape as shown in Figure 5(c) (101C), a trapezoidal shape as shown in Figure 5(d) (101D), or a fan-shaped shape as shown in Figure 5(f) (101F). There may also be multiple coating holes, such as a triangle (101E) and two circles (102E) as shown in Figure 5(e). For example, a coating hole 101B with a triangular shape with an indentation as shown in Figure 5(b) is preferable because it has the effect of suppressing leakage to the outside of the intaglio plate from the second end 72. Furthermore, the fan-shaped coating mold 101F shown in Figure 5(f) is preferable because it has the effect of suppressing air entrapment in the process of pressing the core material and spreading the resin, which will be described later. These coating holes (or the shape of the arranged resin) have a straight line parallel to the first end 71 (in the case of Figure 5(a), this corresponds to the straight line 112A), and the straight line parallel to the first end 71 is positioned on the first end 71. If the coating holes do not have a straight line parallel to the first end 71 (for example, a mold like the one in Figure 5(f)), it is sufficient that the position of the maximum width is positioned on the first end.Furthermore, if there are multiple coating holes as shown in Figure 5(e), it is sufficient that the largest coating hole has a shape in which the width narrows from the first end 71 to the second end 72. Also, if the coating hole 101 is surrounded by a straight line shape such as 101A, 101B, 101D, and 101E, it is preferable that the angle α between the straight line 112A parallel to the first end 71 and the straight line 113A connected to 112A is 45° or more. If the coating hole 101 is fan-shaped as shown in Figure 5(f), it is preferable that the central angle is 90° or less.

[0029] The amount of resin 11 placed in the first area 73 is preferably 93% or more, more preferably 95% or more, and even more preferably 98% or more, of the total amount of resin 11.

[0030] After placing the resin 11 in the coating holes 101, the coating mold 10 is removed as shown in Figures 3(b-3) and 4(b-3). The material and thickness of the coating mold are not particularly limited, as long as they can maintain the shape of the resin arrangement and can be removed after the resin is placed in the coating holes.

[0031] (Step of arranging the core material 21) The step of arranging the core material 21 in the second embodiment is the same as in the first embodiment, so the explanation will be omitted, but if the core material 21 and the resin 11 can be directly bonded together, the adhesive layer 22 does not need to be present.

[0032] (Step of pressing the core material 21 and spreading the resin) The step of pressing the core material and spreading the resin in the second embodiment is the same as in the first embodiment.

[0033] (Process for curing the resin) The process for curing the resin in the second embodiment is the same as in the first embodiment.

[0034] (Step of peeling off the hardened resin 11 from the intaglio plate and obtaining a core material-adhered polished layer) The step of peeling off the hardened resin 11 from the intaglio plate and obtaining a core material-adhered polished layer in the second embodiment is the same as in the first embodiment.

[0035] <Method for Manufacturing the Core Material Adhering Polishing Layer (Third Embodiment)> The method for manufacturing the core material adhering polishing layer, which is a component material of the polishing pad (third embodiment), will be explained using Figures 1 and 6. As shown in Figure 6, the manufacturing method includes the steps of: preparing a printing plate 7 (Figure 6 (a)); placing liquid resin 11 on the printing plate 7 (Figure 6 (b)); arranging a core material 21 having an adhesive layer on at least one side before the resin hardens, such that the adhesive layer and the printing plate 7 face each other (Figure 6 (c)); pressing the core material 21 toward the printing plate 7, spreading the resin, and hardening at least the edges of the spread resin (Figure 6 (d') and Figure 7 (e-1)); hardening the entire resin 11 (Figure 6 (e) and Figure 7 (e-2)); and peeling off the hardened resin 11 from the printing plate 7 (Figure 6 (f)) to obtain the core material adhering polishing layer 1 (Figure 6 (g)).

[0036] (Process for preparing the intaglio plate) The process for preparing the intaglio plate in the third embodiment is the same as in the first embodiment. When viewed from above in a direction perpendicular to the surface of the intaglio plate 7, the shape of the intaglio plate 7 is not particularly limited, but it is preferably rectangular as shown in Figure 7.

[0037] (Step of placing liquid resin on the intaglio plate) In the third embodiment, the polishing layer 1 is also composed of a curable resin. The type of curable resin is the same as in the first embodiment. The resin 11 constituting the polishing layer 1 may also be a resin composition containing a filler 12 and abrasive grains 13. In this specification, the resin constituting the polishing layer also includes the form of the resin composition. The mass of the filler 12, abrasive grains 13, and the filler 12 in the resin composition is the same as the mass of the filler 12, abrasive grains 13, and the filler 12 in the resin composition in the first embodiment. The resin 11 constituting the polishing layer 1 has high viscosity because it holds the filler and the like inside, and as shown in Figures 6(b) and 6(c), if it is only placed on a part of the intaglio plate 7, it does not easily spread to the entire intaglio plate 7, so it is preferable to press and spread it.

[0038] (Step of arranging the core material 21) The step of arranging the core material 21 in the third embodiment is the same as in the first embodiment, but the adhesive layer 22 does not need to be present if the core material 21 and the resin 11 can be directly bonded together.

[0039] (A process of pressing the core material, spreading the resin, and hardening at least the edges of the spread resin) Similar to the first embodiment, the resin 11 constituting the polishing layer contains a filler 12 and abrasive grains 13, and has high viscosity, so it needs to be spread. In the previous steps, liquid resin 11 is placed on the intaglio plate 7, and the core material 21 is placed opposite the intaglio plate 7 before the resin 11 hardens, so the resin 11 is spread by pressing the core material 21 toward the intaglio plate 7. The method of pressing the core material 21 is not particularly limited as long as the resin 11 is spread uniformly, but methods such as using a roller 8 or squeegee as shown in Figure 6 can be cited. Since the spreading of the highly viscous resin 11 is done via the core material 21, the tool used to press the core material 21 can be used continuously without intervening in processes such as cleaning. The viscosity of the resin 11 is not particularly limited, but the specific viscosity is the same as in the first embodiment. As shown in Figure 6, in the process of pressing the core material 21 and spreading the resin 11, the resin 11 is not contained only in the recesses of the intaglio plate 7, but is also spread so that resin 11 exists between the protrusions of the intaglio plate 7 and the adhesive layer 22. The resin 11 contained in the recesses of the intaglio plate 7 constitutes the protrusions 14 of the polishing layer 1 shown in Figure 1, and the resin 11 between the protrusions of the intaglio plate 7 and the adhesive layer 22 constitutes the base 15 of the polishing layer 1.

[0040] The third embodiment includes a step of pressing a core material to spread the resin and hardening at least the edges of the spread resin. The edges of the spread resin refer to the resin portion that is positioned outside the uneven pattern of the intaglio plate 7 as a result of the resin being spread, and are thinner than the resin portion positioned in the recesses of the intaglio plate 7. The hardening method can be appropriately selected depending on the resin 11 used, but in this step and the next step, an embodiment in which the resin 11 is hardened by irradiation with ultraviolet light will be described as an example. Specifically, as shown in Figure 7, the roller 8, which is a pressing means, is moved from one straight edge of the intaglio plate 7 to the opposite straight edge to press it, and at this time, ultraviolet light is first irradiated with ultraviolet light using an ultraviolet irradiator 9I on at least the edges of the portion pressed by the roller 8 (see (d') in Figure 7). Of the portion pressed by the roller 8, the resin that has been hardened by irradiation with ultraviolet light is indicated as reference numeral 11A, and the unhardened resin is indicated as reference numeral 11B. Then, each time the roller 8 moves, it immediately irradiates at least the edges, and by the time the roller 8 finishes pressing, at least the edges, which are the surrounding area, are hardened (Figure 7 (e-1)). By hardening at least the edges of the resin arranged in this way, it is possible to prevent the streaky lifting that would occur if the entire surface were hardened at once without hardening the surrounding area, and also to prevent unhardened liquid from dripping onto the surrounding area.

[0041] When curing the edges, a small UV irradiator 9I is sufficient, given the purpose of curing a specific area. For example, irradiation with the UV irradiator 9I may be done manually on the edges of the portion pressed by the roller 8, or a small UV irradiator 9I may be installed on a member (not shown) that supports the roller 8, and irradiation may be done automatically as needed. In that case, the UV irradiator 9I is controlled so that the edges are irradiated. Even when irradiating the entire surface with UV light, the desired effect can be obtained by adjusting the light intensity. As mentioned above, since the thickness of the edges is small, the light intensity should be adjusted appropriately so that the resin placed in the recesses does not completely harden.

[0042] (Step of curing resin) In the third aspect, after irradiating at least the edge portion as described above, either immediately or after leaving to stand for 1 second to 3 hours, the entire resin (11) is irradiated with ultraviolet rays to cure the resin (11) (see (e-2) in FIG. 7). The ultraviolet rays (9) may be irradiated from the core material (21) side as shown in FIG. 6, or may be irradiated from the intaglio plate (7) side. The light irradiation device is not particularly limited as long as it emits light in a wavelength range including the wavelength of light that cures a photocurable resin; for example, an ultraviolet irradiation device may be mentioned, and more specifically, a high-pressure mercury lamp, a UV-LED lamp, and a black light blue fluorescent lamp (BLB) may be mentioned. The wavelength and irradiation time of the ultraviolet irradiation are not particularly limited as long as the resin (11) can be cured, and for example, the wavelength is 250 nm to 480 nm and the irradiation time is 1 minute to 15 minutes. As the ultraviolet irradiator, a small-sized ultraviolet irradiator (9I) used for curing the edge portion may be used, or a large-sized ultraviolet irradiator different from the small-sized ultraviolet irradiator (9I) may be used. The pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer (22) of the core material (21) contains a resin of the same quality as the resin (11) constituting the polishing layer (1), and may be cured together with the ultraviolet irradiation. By also curing the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer (22) of the core material (21) together with the ultraviolet irradiation, good adhesive strength between the polishing layer (1) and the core material (21) can be obtained.

[0043] (Step of peeling the cured resin (11) from the intaglio plate to obtain a core material-attached polishing layer) The step of peeling the cured resin (11) from the intaglio plate of the third aspect to obtain a core material-attached polishing layer is the same as that of the first aspect.

[0044] It should be noted that the first aspect, the second aspect, and the third aspect may be combined with each other, and by combining all the aspects, the process can be simplified while maintaining the adhesive strength between layers, a good coating state without filling leakage (chipping) up to the outer peripheral portion can be obtained, and this provides a method for producing a core material-attached polishing layer that can suppress the occurrence of floating streaks.

[0045] <Method for Manufacturing an Abrasive Pad> In addition to the core material-attached abrasive layer, the abrasive pad may also have an adhesive layer and a base layer. The abrasive pad may be manufactured by forming an adhesive layer on the side of the abrasive layer opposite to the abrasive surface and pressing the base layer 4 against the adhesive layer. In this specification, the abrasive surface refers to the surface facing the workpiece. The adhesive layer may be formed by applying it to the side of the abrasive layer opposite to the abrasive surface, or by attaching double-sided tape. Furthermore, a core material 21 having core material adhesive layers on both sides may be used as the core material layer. There are no particular restrictions on the adhesive and double-sided tape used, and they can be arbitrarily selected and used from adhesives and double-sided tapes known in the art. The base layer 4 is not particularly limited as long as it can make the contact of the abrasive layer with the workpiece more uniform, and can be manufactured using materials and manufacturing methods arbitrarily selected from those known in the art.

[0046] The polishing pad P shown in Figure 1 is an example, but it has a structure in which a polishing layer 1, a core material layer 2, a first adhesive layer 3, a base material layer 4, and a second adhesive layer 5 are laminated together, and in Figure 1 it is shown in a state where it is adhered to a polishing platen 6 for rotating the polishing pad. In this specification, the state in which the polishing layer 1 and the core material layer 2 are combined is called a core material-adhered polishing layer. The core material layer 2 includes a core material 21 and a core material adhesive layer 22, and the core material adhesive layer 22 corresponds to an adhesive layer 22. In the polishing pad P shown in Figure 1, the first adhesive layer 3 and the second adhesive layer 5 have a structure in which the first adhesive core material layer 31 and the second adhesive core material layer 51 have first adhesive adhesive layers 321, 322 and second adhesive adhesive layers 521, 522 on both sides. The first adhesive layer 3 and the second adhesive layer 5 may be made of double-sided tape. The core material can be any known material used as a core material for double-sided tape, such as resin film, nonwoven fabric, woven fabric, fine paper, kraft paper, glassine paper, coated paper, cast coated paper, resin-impregnated paper, metal foil laminate film, or metal vapor-deposited film. Preferably, it is polyethylene terephthalate (PET) film.

[0047] The base material layer 4 is not particularly limited as long as the effects of the present invention are not impaired, and examples thereof include resin-impregnated base materials obtained by impregnating woven fabrics, knitted fabrics, and non-woven fabrics with resin, foams, resin films, etc., and may be a laminate of these. Examples of the foam include those having teardrop-shaped cells formed by a wet film-forming method and those having fine cells formed therein. In addition, by preparing a base material layer larger than the core material-attached polishing layer, a plurality of core material-attached polishing layers can be aligned and bonded together to form a single polishing pad P.

[0048] In the polishing pad P having the configuration of one example shown in Fig. 1, the polishing layer 1 and the core material layer 2 are constituted by a core material-attached polishing layer, and other layers are produced by appropriately laminating materials constituting each layer so as to obtain the configuration shown in Fig. 1.

[0049] Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited by these examples.

[0050] In each example, "part" means "part by mass" unless otherwise specified.

[0051] <Example 1> A polishing layer raw material resin 11X was prepared by adding 33.5 parts of acrylic resin (SR368D manufactured by Sartomer Co., Ltd.), 0.6 parts of dispersant (Solspers 32000 manufactured by Lubrizol Japan Co., Ltd.), 0.3 parts of photopolymerization initiator (Irgacure 819 manufactured by BASF Japan Co., Ltd.), 0.2 parts of photosensitizer (Anthracure UVS-581 manufactured by Kawasaki Chemical Industries, Ltd.), 7.2 parts of composite particles in which diamond abrasive grains are dispersed in a glass matrix, 3.6 parts of white alumina, and 54.6 parts of wollastonite. At this time, the viscosity of the polishing layer raw material resin 11X was 17 dPa·s. A core material 21 was prepared by applying an acrylic adhesive to one side of a PET film (thickness 75 μm) and having an adhesive layer 22 on the other side. Polishing layer raw material resin 11X was poured into the intaglio plate 7, and a core material 21 having an adhesive layer 22 was positioned so that the adhesive layer 22 faced the intaglio plate 7. The core material 21 was pressed toward the intaglio plate 7 with a roller, and the polishing layer raw material resin 11X was spread uniformly. UV light was irradiated from the core material 21 side to confirm that the polishing layer raw material resin 11X had hardened, and then it was peeled off from the intaglio plate to obtain a core material-attached polishing layer A. The core material-attached polishing layer A had appropriate rigidity, and it was possible to remove the air inside when pressed.

[0052] <Example 2> Core material-attached polishing layer B was obtained in the same manner as in Example 1, except that the core material 21 was changed to a PET film (thickness 188 μm). Core material-attached polishing layer B was slightly more rigid than core material-attached polishing layer A, and a small amount of air that did not escape was observed when pressed.

[0053] <Example 3> The core material-attached polished layer C was obtained in the same manner as in Example 1, except that the core material 21 was changed to a PET film (thickness 23 μm). The core material-attached polished layer C was slightly less rigid than the core material-attached polished layer A, and slight wrinkles were observed.

[0054] In Example 1, core material-attached polishing layer A, and in Example 2, core material-attached polishing layer B, the core material has a certain degree of rigidity, making it difficult for the core material to follow the intaglio plate when pressed. Therefore, the transfer of the indentations on the intaglio plate does not occur on the core material, and the core material is less likely to wrinkle. On the other hand, in Example 3, core material-attached polishing layer C, the core material follows the intaglio plate when pressed, and the indentations are transferred, making it more prone to wrinkling compared to Example 1. Furthermore, in Example 2, the core material has greater rigidity compared to Example 1, making it difficult to stretch the resin when pressing the core material, and making it difficult for air to escape.

[0055] <Example 4> The polishing layer raw material resin 11X was prepared in the same manner as in Example 1. A core material 21 was prepared, having an acrylic adhesive applied to one side of a PET film (thickness 75 μm) and an adhesive layer 22 on the other side. The polishing layer raw material resin 11X was poured into the intaglio plate 7 using the coating mold 10B (mountain-shaped coating mold) shown in Figure 5(b). After removing the coating mold 10B, the core material 21 with the adhesive layer 22 was positioned so that the adhesive layer 22 faced the intaglio plate 7. The core material 21 was pressed toward the intaglio plate 7 with a roller to uniformly spread the polishing layer raw material resin 11X. After confirming that the polishing layer raw material resin 11X had hardened by irradiating the core material 21 with UV light, it was peeled off from the intaglio plate to obtain a core material-attached polishing layer D. The core material-attached polishing layer D had appropriate core material rigidity, and it was possible to remove the air inside when pressed. Furthermore, because a coating mold was used, the resin spread uniformly throughout, and a good coating condition was obtained without any gaps (chips) even in the outer periphery.

[0056] <Example 5> The core material-attached polishing layer E was obtained in the same manner as in Example 4, except that the core material 21 was changed to a PET film (thickness 188 μm). The core material-attached polishing layer E was slightly more rigid than the core material-attached polishing layer D, and a small amount of air that did not escape was observed when pressed.

[0057] <Example 6> The core material-attached polished layer F was obtained in the same manner as in Example 4, except that the core material 21 was changed to a PET film (thickness 23 μm). The core material-attached polished layer F was slightly less rigid than the core material-attached polished layer D, and slight wrinkles were observed.

[0058] In Example 4, the core material-attached polishing layer D, and in Example 5, the core material-attached polishing layer E, have a certain degree of rigidity, making it difficult for the core material to follow the intaglio plate when pressed. Therefore, the transfer of the indentations on the intaglio plate does not occur on the core material, and the core material is less likely to wrinkle. On the other hand, in Example 6, the core material-attached polishing layer F allows the core material to follow the intaglio plate when pressed, resulting in the transfer of the indentations and making it more prone to wrinkling compared to Example 4. Furthermore, in Example 5, the core material-attached polishing layer E has greater rigidity than in Example 4, making it difficult to stretch the resin when pressing the core material, and making it difficult for air to escape.

[0059] <Example 7> The polishing layer raw material resin 11X was prepared in the same manner as in Example 1. A core material 21 was prepared, having an acrylic adhesive applied to one side of a PET film (thickness 75 μm) and an adhesive layer 22 on the other side. The polishing layer raw material resin 11X was poured into the intaglio plate 7, and the core material 21 with the adhesive layer 22 was positioned so that the adhesive layer 22 faced the intaglio plate 7. While pressing the core material 21 toward the intaglio plate 7 with a roller, ultraviolet light was irradiated onto the edges of the spread resin with a handheld UV light. Finally, the polishing layer raw material resin 11X was spread uniformly. UV light was irradiated onto the entire spread resin, starting from the core material 21 side, and after confirming that the polishing layer raw material resin 11X had hardened, it was peeled off from the intaglio plate to obtain a core material-attached polishing layer G. The core material-attached polishing layer G did not have any floating lines due to hardening, and the rigidity of the core material was appropriate, allowing the air inside to be removed when pressed.

[0060] <Example 8> The core material-attached polishing layer H was obtained in the same manner as in Example 7, except that the core material 21 was changed to a PET film (thickness 188 μm). The core material-attached polishing layer H was slightly more rigid than the core material-attached polishing layer G, and a small amount of air that did not escape was observed when pressed.

[0061] <Example 9> The core material-attached polished layer I was obtained in the same manner as in Example 7, except that the core material 21 was changed to a PET film (thickness 23 μm). The core material-attached polished layer I was slightly less rigid than the core material-attached polished layer G, and slight wrinkles were observed.

[0062] In Example 7, the core material-attached polishing layer G, and in Example 8, the core material-attached polishing layer H, have a certain degree of rigidity, making it difficult for the core material to follow the intaglio plate when pressed. Therefore, the transfer of the indentations on the intaglio plate does not occur on the core material, and the core material is less likely to wrinkle. On the other hand, in Example 9, the core material-attached polishing layer I allows the core material to follow the intaglio plate when pressed, resulting in the transfer of indentations and making it more prone to wrinkling compared to Example 7. Furthermore, in Example 8, the core material-attached polishing layer H has greater rigidity, making it more difficult to stretch the resin when pressing the core material compared to Example 7, and making it harder for air to escape.

[0063] The present invention provides a method for manufacturing an abrasive layer that simplifies the process while maintaining interlayer adhesive strength, a method for manufacturing an abrasive layer that can obtain a good coating state without filling voids (chips) even to the outer periphery, and a method for manufacturing an abrasive layer that can suppress the occurrence of floating streaks. Therefore, it contributes to the manufacture and sale of abrasive pads and has industrial applicability.

[0064] P Polishing pad 1 Polishing layer 11 Resin 11A Cured resin 11B Uncured resin 12 Filler 13 Abrasive grains 14 Protrusions 15 Base 2 Core material layer 21 Core material 22 Core material adhesive layer (adhesive layer) 3 First adhesive layer 31 First adhesive core material layer 321, 322 First adhesive adhesive layer 4 Base material layer 5 Second adhesive layer 51 Second adhesive core material layer 521, 522 Second adhesive adhesive layer 6 Polishing platen 7 Intaglio plate 71 First end 72 Second end 73 First area 74 Second area 8 Roller (pressing means) 9 Ultraviolet light 9I Ultraviolet irradiator 10, 10A, 10B, 10C, 10D, 10E, 10F Coating type 101, 101A, 101B, 101C, 101D, 101E, 102E, 101F Coating holes

Claims

1. A method for manufacturing a polishing pad having a polishing layer having protrusions, which is made by curing a resin, comprising: a step of preparing a plate with an uneven pattern formed on it (step 1); a step of placing a liquid resin on the plate (step 2); a step of placing a core material having an adhesive layer on at least one side so that the adhesive layer and the plate face each other before the resin hardens (step 31); a step of pressing the core material toward the plate and spreading the resin (step 41); a step of hardening the resin (step 51); and a step of peeling the hardened resin from the plate to obtain a polishing layer to which the core material is attached (step 6).

2. The manufacturing method according to claim 1, wherein the resin and the adhesive constituting the adhesive layer contain the same type of resin.

3. A polishing pad comprising a base portion and a convex portion, a polishing layer made of resin, an adhesive layer attached to the side of the polishing layer opposite to the polishing surface, and a core material attached to the adhesive layer.

4. The polishing pad according to claim 3, wherein the thickness of the core material is 10 μm or more and 300 μm or less.

5. The polishing pad according to claim 3, wherein the resin and the adhesive constituting the adhesive layer contain the same type of resin.

6. The polishing pad according to claim 3, wherein the resin comprises abrasive grains and a filler.

7. The polishing pad according to claim 3, wherein the base material layer is attached to the core material via an adhesive layer.

8. A method for manufacturing a polishing pad having a polishing layer having protrusions, which is made of cured resin, comprising: a step of preparing a plate with an uneven pattern formed on it (step 1); a step of placing liquid resin on the plate (step 2); a step of placing a core material opposite the plate before the resin hardens (step 32); a step of pressing the core material by moving a pressing means toward the plate from the first end to the opposing second end, thereby spreading the resin (step 42); a step of hardening the resin (step 51); and a step of peeling the hardened resin from the plate to obtain a polishing layer to which the core material is attached (step 6), wherein when the plate is divided into two equal parts by a straight line perpendicular to the direction of movement, the area including the first end is called the first area, and the area including the second end is called the second area, and in step 2, 90% by mass or more of the total resin amount is placed in the first area of ​​the plate. A method for manufacturing an abrasive pad, wherein, when viewed perpendicular to the surface of the intaglio plate, the shape of the resin arranged in the first area is such that its width narrows from the first end to the second end, and the width is the length of the shape in a direction parallel to the length direction of the first end.

9. The manufacturing method according to claim 1 or 8, wherein step 51 is curing by ultraviolet light.

10. The manufacturing method according to claim 8, wherein the arranged resin is arranged integrally with the first end.

11. The manufacturing method according to claim 8, wherein step 2 is carried out using a coating mold.

12. A method for manufacturing a polishing pad having a polishing layer having protrusions, which is made of a hardened resin, comprising: a step of preparing a plate with an uneven pattern formed on it (step 1); a step of placing a liquid resin on the plate (step 2); a step of placing a core material opposite the plate before the resin hardens (step 32); a step of pressing the core material toward the plate and hardening at least the edges of the hardened resin while spreading it out (step 43); a step of hardening the entire surface of the resin (step 52); and a step of peeling the hardened resin from the plate to obtain a polishing layer to which the core material is attached (step 6).

13. The manufacturing method according to claim 8 or 12, wherein step 32 is a step (step 31) in which a core material having an adhesive layer on at least one side is arranged such that the adhesive layer and the intaglio plate face each other, before the resin hardens.

14. The manufacturing method according to claim 12, wherein steps 43 and 52 are curing by ultraviolet light.

15. The manufacturing method according to claim 1, 8, or 12, wherein the thickness of the core material is 10 μm or more and 300 μm or less.

16. The manufacturing method according to claim 12, wherein the polishing layer is manufactured using a single-wafer method.

17. The manufacturing method according to claim 1 or 12, wherein a liquid resin is placed in a part of the intaglio plate.

18. The manufacturing method according to claim 1, 8, or 12, wherein the resin comprises abrasive particles and a filler.

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