Laminate
Patent Information
- Application Number
- PCT/JP2026/011387
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-28
- Filing Date
- 2026-03-23
- Publication Date
- 2026-10-01
Smart Images
Figure JP2026011387_01102026_PF_FP_ABST
Abstract
Description
Laminate
[0001] The present invention relates to a laminate.
[0002] In recent years, opportunities to use electronic components through which large currents flow, such as high-brightness LEDs and power semiconductors, have been increasing. When a large current is passed through, these types of electronic components generate heat at high temperatures. Therefore, when using these types of electronic components, it is important to ensure sufficient heat dissipation performance.
[0003] Conventionally, as a means for dissipating heat from electronic components, a laminate is known in which a heat dissipation member, an insulating layer, and a circuit pattern are laminated, and an electronic component can be mounted on the circuit pattern (see, for example, Patent Document 1). According to such a laminate, heat generated in the electronic component can be conducted from the circuit pattern through the insulating layer to the heat dissipation member, and then dissipated from the heat dissipation member into the air.
[0004] Japanese Unexamined Patent Application Publication No. 2002-012653
[0005] On the other hand, this type of laminate has high thermal resistance in the insulating layer, so there is a risk that heat cannot be sufficiently dissipated especially when electronic components through which large currents flow are used. For this reason, conventionally, countermeasures have been taken, for example, by providing a heat dissipation mechanism separate from the heat dissipation member (for example, providing a water-cooled heat dissipation mechanism). In addition, when a plurality of such electronic components are used, if the electronic components are arranged close to each other, thermal interference occurs, and the loss of a place for heat to escape may result in a higher temperature than when the electronic components are used alone, so a sufficient space between the electronic components must be ensured. As described above, conventional laminates require providing a heat dissipation mechanism separate from the heat dissipation member or ensuring a sufficient space between electronic components, which leads to an increase in size and also increases weight.
[0006] In view of these points, an object of the present invention is to provide a laminate that can sufficiently dissipate heat from electronic components while suppressing increases in size and weight.
[0007] One of the laminates of the present invention comprises a heat dissipation component, an insulating layer provided on the surface of the heat dissipation component, a metal circuit pattern provided on the surface of the insulating layer, and a first electronic component provided on a portion of the surface of the heat dissipation component where the insulating layer is not provided, wherein the first electronic component has a heat dissipation electrode on its back surface that is connected to the surface of the heat dissipation component and is electrically conductive with the metal circuit pattern, and the back surface of the first electronic component, including the heat dissipation electrode, is electrically insulated from the inside of the first electronic component.
[0008] Furthermore, one of the laminates of the present invention comprises a heat dissipation component, an insulating substrate provided on the surface of the heat dissipation component and at least its back surface being electrically insulated from the heat dissipation component, and a first electronic component provided on a portion of the surface of the heat dissipation component where the insulating substrate is not provided, wherein the heat dissipation component is a vapor chamber, the first electronic component has a heat dissipation electrode on its back surface that is connected to the surface of the heat dissipation component and is electrically conductive with the insulating substrate, and the back surface of the first electronic component, including the heat dissipation electrode, is electrically insulated from the inside of the first electronic component.
[0009] The laminate of the present invention allows for sufficient heat dissipation from electronic components while suppressing increases in size and weight.
[0010] This is a side view cross-sectional view showing the first embodiment of the laminate according to the present invention. This is a side view cross-sectional view showing the second embodiment of the laminate according to the present invention. This is a side view cross-sectional view showing the third embodiment of the laminate according to the present invention. This is a side view cross-sectional view showing the fourth embodiment of the laminate according to the present invention.
[0011] An embodiment of the laminate according to the present invention will be described below with reference to the attached drawings. Note that the figures shown in the attached drawings are schematic, and the thickness and width of each part, the ratios between each part, etc., may differ from those of the actual implementation.
[0012] Figure 1 shows a laminate 1A, which is a first embodiment of the laminate according to the present invention. The laminate 1A comprises a heat dissipation component 2A, an insulating layer 3, a metal circuit pattern 4, a first electronic component 5, a second electronic component 6, and a connecting portion 7.
[0013] The heat dissipation component 2A is made of a material with high thermal conductivity (for example, a metal such as copper, aluminum, or iron). The metal used for the heat dissipation component 2A may be a single metal or an alloy. The heat dissipation component 2A may have a single-layer structure or a multi-layer structure, and may be made of a single component or a combination of multiple components. In this embodiment, the heat dissipation component 2A is shaped like a plate that is rectangular in plan view, but it may also be a heat sink with comb-shaped fins on the back surface (bottom surface in Figure 1).
[0014] The heat dissipation component 2A may be a vapor chamber. The vapor chamber comprises an outer shell located on the outer circumference and a space provided inside the outer shell. The outer shell is made of a material with high thermal conductivity (e.g., copper or aluminum), and the space contains a working fluid that is heated, evaporates, and condenses upon heat release, and a wick with a structure such as fine irregularities that allows the working fluid to permeate and generates capillary action. With this configuration, the working fluid evaporates due to heat from the heat source, and the evaporated working fluid moves through the space, diffusing the heat. When the diffused vapor condenses upon heat release, it returns to the working fluid, and the working fluid that has permeated the wick is returned to the vicinity of the heat source by capillary action. By repeating this evaporation and condensation of the working fluid, the heat from the heat source can be effectively diffused in the planar direction of the vapor chamber.
[0015] The insulating layer 3 is formed of an insulating material and is provided so as to cover the surface (upper surface in Figure 1) of the heat dissipation component 2A. Examples of materials for forming the insulating layer 3 include resin compositions containing thermosetting resins. Examples of thermosetting resins include epoxy resins, phenolic resins, melamine resins, urea resins, unsaturated polyester resins, alkyd resins, and cyanate resins. One type of thermosetting resin may be used alone, or two or more types may be used in combination. The resin composition may contain, for example, curing agents (such as amine-based curing agents, imidazole-based curing agents, and phenol-based curing agents), curing accelerators (such as organometallic salts like benzoxazine compounds, borate complexes, zinc naphthenate, cobalt naphthenate, tin octate, cobalt octate, bisacetylacetonate cobalt(II), triacetylacetonate cobalt(III)), phenols, phenol compounds like bisphenol A and nonylphenol, tertiary amines, tertiary amine salts, phosphines, phosphonium salts, etc.), fillers (such as aluminum oxide, silica, aluminum nitride, boron nitride, silicon nitride, and magnesium oxide), and additives (such as stabilizers, ion scavengers, and flexibility enhancers).
[0016] The insulating layer 3 may be constructed using a plate-shaped ceramic substrate made of, for example, silicon nitride, aluminum nitride, or alumina.
[0017] In this embodiment, the insulating layer 3 is provided on the outer periphery of the heat dissipation component 2A, as shown in Figure 1, and the central part of the heat dissipation component 2A is exposed and not covered by the insulating layer 3. In this embodiment, the outer end 3a of the insulating layer 3 is positioned to align with the outer end 2a of the heat dissipation component 2A.
[0018] As described above, when providing the insulating layer 3, one method is to provide the insulating layer 3 over the entire surface of the heat dissipation component 2A, and then remove the insulating layer 3 from the central part of the heat dissipation component 2A by counterboring it. Alternatively, one method may be used in which a single sheet-like insulating layer 3 with a hole in the central part of the heat dissipation component 2A is prepared and applied to the surface of the heat dissipation component 2A. Note that the insulating layer 3 is not limited to one sheet, but may be divided into multiple parts and combined to create a hole in the center. Alternatively, one method may be used in which the central part of the heat dissipation component 2A is masked, the material constituting the insulating layer 3 is applied, and the masking is removed from the heat dissipation component 2A after the material has hardened.
[0019] The metal circuit pattern 4 is obtained by using a conductive material and forming a predetermined pattern with conductive and non-conductive portions. Examples of such materials include copper and aluminum metal plates. The thickness of the metal plate (thickness of the metal circuit pattern 4) is 0.1 mm or more. There is no particular upper limit on the thickness of the metal plate (thickness of the metal circuit pattern 4), but as an example, it is 2.0 mm or less. Methods for forming a predetermined pattern using a metal plate include, for example, forming a mask pattern on the metal plate and removing the exposed parts of the metal plate by etching, or punching out the metal plate using a mold.
[0020] The metal circuit pattern 4 is provided on the surface of the insulating layer 3, as shown in Figure 1. In this embodiment, the metal circuit pattern 4 is shaped to be smaller than the insulating layer 3 in a plan view and is provided so as to fit inside the insulating layer 3, as shown in Figure 1. The metal circuit pattern 4 may also have the same outer shape as the insulating layer 3 in a plan view (i.e., in the side view shown in Figure 1, the edge of the metal circuit pattern 4 is aligned with the edge of the insulating layer 3).
[0021] The first electronic component 5 is a component that performs a predetermined operation when power is applied, or a component that converts electrical energy into light or the like. There are no limitations on the type of first electronic component 5, but in this embodiment, a component that generates heat when operating, in particular a component that generates heat at a high temperature, is used. Examples of such first electronic components 5 include high-brightness LEDs that carry a large current when operating, and power semiconductors (for example, IGBTs (insulated-gate bipolar transistors), MOSFETs (MOS field-effect transistors), diodes, etc.). The first electronic component 5 in this embodiment is equipped with a heat dissipation electrode 5a on its back surface. The heat dissipation electrode 5a is electrically insulated from the inside of the first electronic component 5 and has the function of dissipating the heat generated by the first electronic component 5 to the outside. The bottom surface of the first electronic component 5, including the heat dissipation electrode 5a, is electrically insulated from the inside of the first electronic component 5. An electrode (not shown) that is electrically conductive to the inside of the first electronic component 5 is provided on the surface of the first electronic component 5, and the first electronic component 5 can be operated by supplying current from the outside through this electrode. This electrode may be provided on the side surface of the first electronic component 5. Alternatively, this electrode may be like an outer lead extending outward from the first electronic component 5.
[0022] The first electronic component 5 is provided on a portion of the surface of the heat dissipation component 2A where the insulating layer 3 is not provided. In this embodiment, the first electronic component 5 is mounted on the central part of the exposed heat dissipation component 2A, as shown in Figure 1. A method for mounting the first electronic component 5 to the heat dissipation component 2A is to place a sintered material containing metal nanoparticles such as Ag nanoparticles or Cu nanoparticles between the heat dissipation electrode 5a and the heat dissipation component 2A, apply a predetermined pressure and heat to a predetermined temperature to sinter the metal nanoparticles and connect the heat dissipation electrode 5a and the heat dissipation component 2A. Alternatively, the heat dissipation electrode 5a and the heat dissipation component 2A may be connected using a bonding material that does not basically require pressurization and is bonded by heating at a predetermined temperature, such as solder.
[0023] The second electronic component 6 is a component that performs a predetermined operation when power is applied, or a component that converts electrical energy into light or the like. The second electronic component 6 may be the same as the first electronic component 5, or it may be different. In this embodiment, the first electronic component 5 and the second electronic component 6 are different, and when the laminate 1A is performing normal operation, the heat generated by the first electronic component 5 is greater than that of the second electronic component 6. In this embodiment, an electrode (not shown) that is electrically conductive to the inside of the second electronic component 6 is provided on the back surface of the second electronic component 6, and the second electronic component 6 can be operated by supplying current from the outside through this electrode. This electrode may be provided on the surface or side of the second electronic component 6. Alternatively, this electrode may be like an outer lead extending outward from the second electronic component 6.
[0024] The connection portion 7 uses a conductive material and electrically connects an electrode (not shown) provided by the first electronic component 5 to the metal circuit pattern 4. For example, a bonding wire can be used as the connection portion 7.
[0025] In this embodiment, the laminate 1A is provided directly on the surface of the heat dissipation component 2A without passing through the insulating layer 3. That is, when the first electronic component 5 is operated, the heat generated by the first electronic component 5 is transferred directly to the heat dissipation component 2A without passing through the insulating layer 3, which has high thermal resistance, thus suppressing the temperature rise of the first electronic component 5.
[0026] It is preferable to place the first electronic component 5 on the central side of the heat dissipation component 2A, as in this embodiment, relative to the insulating layer 3. Heat from the first electronic component 5 is conducted not only in the thickness direction but also in the surface direction of the heat dissipation component 2A. However, if the first electronic component 5 is placed close to the outer end 2a of the heat dissipation component 2A, the heat conducted from the first electronic component 5 in the surface direction will not diffuse further in the surface direction once it reaches the outer end 2a, thus suppressing heat dissipation. Furthermore, if the temperature rises locally at the edge of the heat dissipation component 2A, there is a risk that the heat dissipation component 2A will warp and become uneven. On the other hand, when the first electronic component 5 is placed on the central side of the heat dissipation component 2A relative to the insulating layer 3, as in this embodiment, sufficient heat dissipation is ensured, and warping of the heat dissipation component 2A can be suppressed.
[0027] Furthermore, after the inventors conducted extensive research on the position of the first electronic component 5 on the heat dissipation component 2A, they found that in order to suppress the effects on heat dissipation and warping of the heat dissipation component 2A as described above, it is effective to place the first electronic component 5 in a region at least 20 mm inward from the outer end 2a of the heat dissipation component 2A, whether the heat dissipation component 2A is a plate-shaped component as shown in Figure 1, a heat sink with comb-shaped fins, or a vapor chamber.
[0028] The laminate 1A of this embodiment includes a first electronic component 5 and a second electronic component 6. As described above, placing heat-generating electronic components in close proximity may cause thermal interference. However, with the laminate 1A of this embodiment, heat from the first electronic component 5 can be directly dissipated to the heat dissipation component 2A, suppressing the temperature rise at the first electronic component 5. This reduces the likelihood of thermal interference between the first electronic component 5 and the second electronic component 6. In other words, the overall temperature rise of the laminate 1A is suppressed, which allows the laminate 1A to be used even in environments with high ambient temperatures, thus contributing to improved performance of the laminate 1A. Furthermore, compared to the case where both the first electronic component 5 and the second electronic component 6 are provided on the metal circuit pattern 4 on the surface of the insulating layer 3, the laminate is less susceptible to thermal interference, making it possible to bring the first electronic component 5 and the second electronic component 6 closer together, contributing to miniaturization.
[0029] In this embodiment, the first electronic component 5 is one that generates more heat than the second electronic component 6. That is, by directly placing the first electronic component 5, which generates more heat, on the surface of the heat dissipation component 2A, the temperature of the first electronic component 5 can be effectively lowered, thereby more effectively suppressing the overall temperature rise of the laminate 1A.
[0030] It is preferable to use a vapor chamber for the heat dissipation component 2A. By using a vapor chamber, heat from the first electronic component 5 and heat from the second electronic component 6 can be effectively diffused in the planar direction, and therefore the temperature rise at the first electronic component 5 and the second electronic component 6 can be more effectively suppressed. However, due to its structure, the edges of the vapor chamber are difficult to distribute the working fluid through, making it difficult to sufficiently diffuse heat. Also, generally, the edges of the vapor chamber have lower flatness compared to the central part, resulting in lower contact with the mating object that contacts the vapor chamber. Therefore, when using a vapor chamber as the heat dissipation component 2A, it is preferable to position the insulating layer 3 (including the metal circuit pattern 4 provided on the insulating layer 3) and the first electronic component 5 closer to the center of the heat dissipation component 2A than the outer end 2a of the heat dissipation component 2A. That is, in the embodiment shown in Figure 1, when the heat dissipation component 2A is a vapor chamber, it is preferable that the outer end 3a of the insulating layer 3 is located closer to the center of the heat dissipation component 2A than the outer end 2a of the heat dissipation component 2A.
[0031] Next, a second embodiment of the laminate according to the present invention, laminate 1B, will be described with reference to Figure 2. Laminate 1B comprises a heat dissipation component 2B, an insulating substrate 8, a first electronic component 5, a second electronic component 6, and a connecting portion 7. The heat dissipation component 2B is the vapor chamber described above, and the first electronic component 5, the second electronic component 6, and the connecting portion 7 have the same functions as laminate 1A described above, so a detailed explanation of these will be omitted below.
[0032] The insulating substrate 8 has a predetermined circuit pattern and at least its back surface (bottom surface in Figure 2) is electrically insulated from the heat dissipation component 2B. The insulating substrate 8 is, for example, a glass epoxy substrate formed by laminating a thin plate-shaped circuit pattern with glass cloth impregnated with epoxy resin. The insulating substrate 8 may be made of materials other than glass epoxy substrate, such as a paper phenolic substrate, a paper epoxy substrate composite epoxy substrate, a glass composite substrate, a glass polyimide substrate, a fluorine substrate, or a glass PPO substrate. The circuit pattern on the insulating substrate 8 may be a single layer or multiple layers. The insulating substrate 8 has substrate connection parts 8a such as lands and pads that are exposed on its surface.
[0033] As shown in Figure 2, the insulating substrate 8 of this embodiment is provided on the outer periphery of the heat dissipation component 2B, and the central part of the heat dissipation component 2B is exposed and not covered by the insulating substrate 8. In this embodiment, the outer end 8b of the insulating substrate 8 is located closer to the center of the heat dissipation component 2B than the outer end 2a of the heat dissipation component 2B.
[0034] In the laminate 1B, the first electronic component 5 is provided in a portion of the surface of the heat dissipation component 2B where an insulating substrate 8 is not provided. In this embodiment, as shown in Figure 2, the first electronic component 5 is connected to the heat dissipation electrode 5a and the heat dissipation component 2B at the central part of the exposed heat dissipation component 2B using the aforementioned sintered material and bonding material.
[0035] As mentioned above, the second electronic component 6 has an electrode (not shown) on its back surface, and this electrode and the substrate connection portion 8a are connected using a sintered material or bonding material.
[0036] The connection portion 7 of the laminate 1B electrically connects the electrode (not shown) of the first electronic component 5 to the substrate connection portion 8a.
[0037] In the laminate 1B of this embodiment, the first electronic component 5 is directly provided on the surface of the heat dissipation component 2B without passing through the insulating substrate 8. Therefore, when the first electronic component 5 is operated, the heat generated by the first electronic component 5 is transferred directly to the heat dissipation component 2B without passing through the insulating substrate 8, which has high thermal resistance, thus suppressing the temperature rise of the first electronic component 5.
[0038] Furthermore, it is preferable that the first electronic component 5 of the laminate 1B be located on the central side of the heat dissipation component 2B, similar to the laminate 1A, relative to the insulating substrate 8. If the first electronic component 5 is located near the outer end 2a of the heat dissipation component 2B, the heat conducted in the planar direction from the first electronic component 5 will not be diffused upon reaching the outer end 2a, thus suppressing heat dissipation. In addition, the temperature may rise locally at the edge of the heat dissipation component 2B, potentially causing the heat dissipation component 2B to warp and become uneven. On the other hand, when the first electronic component 5 is located on the central side of the heat dissipation component 2B relative to the insulating substrate 8, as in this embodiment, sufficient heat dissipation is ensured, and warping of the heat dissipation component 2B can be suppressed.
[0039] In this embodiment, the laminate 1B directly dissipates heat from the first electronic component 5 to the heat dissipation component 2B, thereby suppressing the temperature rise at the first electronic component 5. This reduces the likelihood of thermal interference between the first electronic component 5 and the second electronic component 6. In other words, similar to the laminate 1A described above, the laminate 1B can be used even in environments with high ambient temperatures, contributing to improved performance of the laminate 1B. Furthermore, the laminate 1B of this embodiment is less susceptible to thermal interference compared to the case where both the first electronic component 5 and the second electronic component 6 are provided on the surface of the insulating substrate 8. This allows for a closer distance between the first electronic component 5 and the second electronic component 6, contributing to miniaturization.
[0040] In this embodiment, the first electronic component 5 is one that generates more heat than the second electronic component 6. That is, by directly placing the first electronic component 5, which generates more heat, on the surface of the heat dissipation component 2B, the temperature of the first electronic component 5 can be effectively lowered, thereby more effectively suppressing the overall temperature rise of the laminate 1B.
[0041] Furthermore, since the heat dissipation component 2B provided in the laminate 1B is a vapor chamber, it effectively diffuses heat from the first electronic component 5 and the second electronic component 6 in the planar direction, thereby more effectively suppressing the temperature rise at the first electronic component 5 and the second electronic component 6. As described above, the edges of the vapor chamber are areas where it is difficult to sufficiently diffuse heat, but in this embodiment, the outer edge 8b of the insulating substrate 8 is located closer to the center of the heat dissipation component 2B than the outer edge 2a of the heat dissipation component 2B, so the effect of sufficiently diffusing heat by the vapor chamber is effectively exerted.
[0042] Next, a third embodiment of the laminate according to the present invention, laminate 1C, will be described with reference to Figure 3. Laminate 1C is a modified example of laminate 1A shown in Figure 1, and comprises multiple first electronic components 5 and second electronic components 6. In addition, there are multiple portions where the surface of the heat dissipation component 2A is exposed without being covered by the insulating layer 3, and metal circuit patterns 4 are provided on the surface of the insulating layer 3 located near these exposed portions.
[0043] In the laminate 1C shown in Figure 3, similar to the laminate 1A, the first electronic component 5 is directly provided on the surface of the heat dissipation component 2A without passing through the insulating layer 3. The heat generated by the first electronic component 5 is transferred directly to the heat dissipation component 2A without passing through the insulating layer 3, which has high thermal resistance, thus suppressing the temperature rise at the first electronic component 5. In the laminate 1C as well, to more effectively suppress the temperature rise at the first electronic component 5 and the second electronic component 6, it is preferable to use a vapor chamber as the heat dissipation component 2A. In Figure 3, the outer end 3a of the insulating layer 3 is positioned to align with the outer end 2a of the heat dissipation component 2A. However, if the heat dissipation component 2A is a vapor chamber, it is preferable that the outer end 3a of the insulating layer 3 is positioned towards the center of the heat dissipation component 2A relative to the outer end 2a of the heat dissipation component 2A.
[0044] Next, a laminate 1D which is a fourth embodiment of the laminate according to the present invention will be described with reference to FIG. 4. The laminate 1D has a configuration like a combination of the laminate 1A shown in FIG. 1 and the laminate 1B shown in FIG. 2. The laminate 1D includes a heat dissipation component 2A, an insulating layer 3, a metal circuit pattern 4, a first electronic component 5, a second electronic component 6, a connecting portion 7, and an insulating substrate 8. The heat dissipation component 2A may be in a plate shape as illustrated, may be a heat sink provided with comb-shaped fins, or may be a vapor chamber.
[0045] In the laminate 1D shown in FIG. 4, similarly to the laminates 1A and 1B, the first electronic component 5 is directly provided on the surface of the heat dissipation component 2A without interposing the insulating layer 3 or the insulating substrate 8. The heat generated by the first electronic component 5 is directly transferred to the heat dissipation component 2A without passing through the insulating layer 3 or the insulating substrate 8 having high thermal resistance, so that a temperature rise in the first electronic component 5 can be suppressed.
[0046] Also in the laminate 1D, in order to more effectively suppress temperature rises in the first electronic component 5 and the second electronic component 6, it is preferable to use a vapor chamber as the heat dissipation component 2A. In FIG. 4, the outer end 3a of the insulating layer 3 and the outer end 8b of the insulating substrate 8 are positioned to align with the outer end 2a of the heat dissipation component 2A. However, when the heat dissipation component 2A is a vapor chamber, it is preferable that the outer end 3a of the insulating layer 3 and the outer end 8b of the insulating substrate 8 are positioned closer to the center side of the heat dissipation component 2A with respect to the outer end 2a of the heat dissipation component 2A.
[0047] One embodiment embodying the present invention has been described above with reference to the drawings, but this embodiment may be modified as follows.
[0048] For example, in FIGS. 1 to 4, there is a gap between the insulating layer 3 and the first electronic component 5, and there is also a gap between the insulating substrate 8 and the first electronic component 5. However, the insulating layer 3 and the first electronic component 5, and the insulating substrate 8 and the first electronic component 5 may be in contact with each other.
[0049] (Supplementary Note) In the present specification, the following technology is disclosed in one aspect. Reference numerals described below correspond to reference numerals attached to the accompanying drawings, which are presented by way of example and are not intended to limit the invention according to the present application.
[0050] (Technology 1) A laminate (1A) comprising: a heat dissipation component (2A); an insulating layer (3) provided on the surface of the heat dissipation component (2A); a metal circuit pattern (4) provided on the surface of the insulating layer (3); and a first electronic component (5) provided on the surface of the heat dissipation component (2A) in a portion where the insulating layer (3) is not provided, wherein the first electronic component (5) has a heat dissipation electrode (5a) connected to the surface of the heat dissipation component (2A) on its back surface and is electrically conductive with the metal circuit pattern (4), and the back surface of the first electronic component (5), including the heat dissipation electrode (5a), is electrically insulated from the inside of the first electronic component (5).
[0051] This technology allows the heat generated by the first electronic component to be transferred directly to the heat dissipation component without passing through an insulating layer with high thermal resistance, thus enabling sufficient heat dissipation from the first electronic component. Furthermore, since there is no need to provide a separate heat dissipation mechanism from the heat dissipation member as in conventional laminates, it is possible to suppress the increase in size and weight of the laminate.
[0052] (Technology 2) The laminate (1A) described in Technology 1, wherein the first electronic component (5) is provided on the central side of the heat dissipation component (2A) relative to the insulating layer (3).
[0053] This technology ensures sufficient heat dissipation because the heat conducted from the first electronic component to the heat dissipation component is sufficiently diffused in the planar direction. Furthermore, if the first electronic component is placed near the edge of the heat dissipation component, the temperature may rise locally at that point, potentially causing the heat dissipation component to warp. However, by placing the first electronic component towards the center of the heat dissipation component, beyond the insulating layer, warping of the heat dissipation component can be suppressed.
[0054] (Technology 3) A laminate (1A) according to Technology 1 or 2, comprising a second electronic component (6) provided on the metal circuit pattern (4), wherein the amount of heat generated from the first electronic component (5) is greater than the amount of heat generated from the second electronic component (6).
[0055] This technology allows heat from the first electronic component to be directly dissipated to the heat dissipation component, suppressing the temperature rise of the first electronic component. This reduces thermal interference between the first and second electronic components. As a result, the laminate can be used even in environments with high ambient temperatures, contributing to improved performance of the laminate. Furthermore, because it is less susceptible to thermal interference, it becomes possible to bring the first and second electronic components closer together, enabling miniaturization of the laminate.
[0056] (Technical 4) A laminate (1D) according to any one of Technical 1 to 3, wherein an insulating substrate (8) is provided on the surface of the heat dissipation component (2A) in which the insulating layer (3) and the first electronic component (5) are not provided, and at least the back surface of the insulating substrate (8) is electrically insulated from the heat dissipation component (2A).
[0057] This technology allows for the provision of both a metal circuit pattern and an insulating substrate on the heat dissipation component while ensuring sufficient heat dissipation from the first electronic component.
[0058] (Technical 5) The laminate (1A) according to any one of Technical 1 to 4, wherein the heat dissipation component (2A) is a vapor chamber, and the insulating layer (3) and the first electronic component (5) are provided on the central side of the heat dissipation component (2A) rather than the outer end (2a) of the heat dissipation component (2A).
[0059] This technology allows heat from the first electronic component to be effectively diffused in the planar direction, thereby more effectively suppressing the temperature rise in the first electronic component.
[0060] (Technical 6) A laminate (1B) comprising: a heat dissipation component (2B); an insulating substrate (8) provided on the surface of the heat dissipation component (2B), with at least its back surface electrically insulated from the heat dissipation component (2B); and a first electronic component (5) provided on the surface of the heat dissipation component (2B) in a portion where the insulating substrate (8) is not provided, wherein the heat dissipation component (2B) is a vapor chamber, the first electronic component (5) has a heat dissipation electrode (5a) connected to the surface of the heat dissipation component (2B) on its back surface, and is electrically conductive with the insulating substrate (8), and the back surface of the first electronic component (5), including the heat dissipation electrode (5a), is electrically insulated from the inside of the first electronic component (5).
[0061] This technology allows the heat generated by the first electronic component to be transferred directly to the heat dissipation component without passing through an insulating substrate with high thermal resistance, thus enabling sufficient heat dissipation from the first electronic component. Furthermore, since there is no need to provide a separate heat dissipation mechanism from the heat dissipation member as in conventional laminates, it is possible to suppress the increase in size and weight of the laminate.
[0062] (Technical 7) The laminate (1B) described in Technical 6, wherein the first electronic component (5) is provided on the central side of the heat dissipation component (2B) relative to the insulating substrate (8).
[0063] This technology ensures sufficient heat dissipation because the heat conducted from the first electronic component to the heat dissipation component is sufficiently diffused in the planar direction. Furthermore, if the first electronic component is placed near the edge of the heat dissipation component, the temperature may rise locally in that area, potentially causing the heat dissipation component to warp. However, by placing the first electronic component closer to the center of the heat dissipation component than the insulating substrate, warping of the heat dissipation component can be suppressed.
[0064] (Technical 8) A laminate (1B) according to Technical 6 or 7, comprising a second electronic component (6) provided on the insulating substrate (8), wherein the amount of heat generated from the first electronic component (5) is greater than the amount of heat generated from the second electronic component (6).
[0065] This technology allows heat from the first electronic component to be directly dissipated to the heat dissipation component, suppressing the temperature rise of the first electronic component. This reduces thermal interference between the first and second electronic components. As a result, the laminate can be used even in environments with high ambient temperatures, contributing to improved performance of the laminate. Furthermore, because it is less susceptible to thermal interference, it becomes possible to bring the first and second electronic components closer together, enabling miniaturization of the laminate.
[0066] (Technical 9) The insulating substrate (8) and the first electronic component (5) are provided on the central side of the heat dissipation component (2B) rather than on the outer end (2a) of the heat dissipation component (2B), in the laminate (1B) according to any one of Technical 6 to 8.
[0067] This technology allows heat from the first electronic component to be effectively diffused in the planar direction, thereby more effectively suppressing the temperature rise in the first electronic component.
[0068] Although one embodiment of the present invention has been described above, the present invention is not limited to such specific embodiments, and unless otherwise specifically limited in the above description, various modifications and changes are possible within the scope of the spirit of the present invention as described in the claims. For example, the configuration of the above-described embodiment can be added or deleted as appropriate, and the configuration of one embodiment can be provided in other embodiments. Furthermore, the effects in the above-described embodiment are merely illustrative of the effects that may result from the present invention. In other words, the effects of the present invention are not limited to the above-described effects, and additional effects may also be produced in addition to the above-described effects.
[0069] 1A-1D: Laminate 2A, 2B: Heat dissipation component 2a: Outer edge of heat dissipation component 3: Insulating layer 4: Metal circuit pattern 5: First electronic component 5a: Heat dissipation electrode 6: Second electronic component 8: Insulating substrate
Claims
1. A laminate comprising: a heat dissipation component; an insulating layer provided on the surface of the heat dissipation component; a metal circuit pattern provided on the surface of the insulating layer; and a first electronic component provided on a portion of the surface of the heat dissipation component where the insulating layer is not provided, wherein the first electronic component has a heat dissipation electrode on its back surface that is connected to the surface of the heat dissipation component and is electrically conductive with the metal circuit pattern, and the back surface of the first electronic component, including the heat dissipation electrode, is electrically insulated from the inside of the first electronic component.
2. The laminate according to claim 1, wherein the first electronic component is provided on the central side of the heat dissipation component relative to the insulating layer.
3. The laminate according to claim 1, comprising a second electronic component provided on the metal circuit pattern, wherein the amount of heat generated from the first electronic component is greater than the amount of heat generated from the second electronic component.
4. The laminate according to claim 1, wherein an insulating substrate is provided on the surface of the heat dissipation component, where the insulating layer and the first electronic component are not provided, the back surface of which is electrically insulated from the heat dissipation component.
5. The laminate according to claim 1, wherein the heat dissipation component is a vapor chamber, and the insulating layer and the first electronic component are provided on the central side of the heat dissipation component, rather than on the outer end of the heat dissipation component.
6. A laminate comprising: a heat dissipation component; an insulating substrate provided on the surface of the heat dissipation component, with at least its back surface electrically insulated from the heat dissipation component; and a first electronic component provided on a portion of the surface of the heat dissipation component where the insulating substrate is not provided, wherein the heat dissipation component is a vapor chamber, the first electronic component has a heat dissipation electrode on its back surface that is connected to the surface of the heat dissipation component and is electrically conductive with the insulating substrate, and the back surface of the first electronic component, including the heat dissipation electrode, is electrically insulated from the inside of the first electronic component.
7. The laminate according to claim 6, wherein the first electronic component is provided on the central side of the heat dissipation component relative to the insulating substrate.
8. The laminate according to claim 6, comprising a second electronic component provided on the insulating substrate, wherein the amount of heat generated from the first electronic component is greater than the amount of heat generated from the second electronic component.
9. The laminate according to claim 6, wherein the insulating substrate and the first electronic component are provided on the central side of the heat dissipation component, rather than on the outer end of the heat dissipation component.