Characteristic measurement device and characteristic measurement method

Abstract

The present invention provides a characteristic measurement device that, even when a manufacturing error has occurred in a sheet base in which a plurality of bases are formed in a continuous manner, makes it possible to bring a pair of contact pins into contact with external connection terminals of the bases. A frequency measurement device 50 measures the frequencies of a plurality of crystal vibration devices that are each configured by mounting a crystal vibration element P in each base B in a sheet base SB. A control device 59 calculates position coordinates of a pair of external connection terminals Tr2 on the basis of previously measured measurement position coordinates of one surface of the sheet base SB, causes a movement unit to relatively move the sheet base SB with respect to the pair of contact pins 51 so that the pair of contact pins 51 are brought into contact with the pair of external connection terminals Tr2, and causes a frequency measurement unit 57 to measure the frequency of the crystal vibration device.

Description

Characteristic measurement apparatus and characteristic measurement method

[0001] The present invention relates to a characteristic measurement apparatus and a characteristic measurement method.

[0002] Electronic devices include, for example, transistors, IC tags, CMOS sensors, thin-film solar cells, quartz crystal vibrating devices equipped with quartz crystal vibrating elements, and the like. In the manufacturing process of such electronic devices, in order to improve production efficiency, an electronic device manufacturing method is known in which electronic elements are mounted on a sheet base formed by connecting a plurality of bases such as silicon bases, films, and ceramic bases for electronic elements in a matrix. For example, Patent Document 1 discloses a method for manufacturing a quartz crystal vibrating device in which the quartz crystal vibrating elements are bonded for each base to the sheet base, which is an assembly of the bases having a pair of electrode pads to which the quartz crystal vibrating elements are bonded and a pair of external connection terminals electrically connected to the pair of electrode pads.

[0003] The quartz crystal vibrating device includes a quartz crystal vibrating element and a base that holds the quartz crystal vibrating element. In the quartz crystal vibrating device, the quartz crystal vibrating element is accommodated in the box-shaped base made of an insulator such as ceramics. The quartz crystal vibrating device is hermetically sealed in a state where the electrodes of the quartz crystal vibrating element are bonded to the electrodes in the base.

[0004] In the manufacturing method described in Patent Document 1, the plurality of bases are positioned by handling the plurality of bases in the state of the sheet base. Therefore, operations in various processes can be efficiently performed on the plurality of fine bases.

[0005] Japanese Unexamined Patent Publication No. 2024-108488

[0006] However, the sheet base formed by firing ceramics as described in Patent Document 1 is subject to manufacturing errors due to distortion during firing. As the number of bases constituting the sheet base increases, the positional deviation from the design position increases due to the manufacturing errors. Therefore, when measuring the frequency, which is an important characteristic of the quartz oscillator, for each base using a characteristic measuring device, even if the pair of contact pins of the characteristic measuring device are positioned based on the reference point of the sheet base, it may not be possible to electrically connect to the external connection terminals of the base due to the manufacturing errors of the sheet base.

[0007] The present invention aims to provide a characteristic measuring device and a characteristic measuring method that can measure the characteristics of each electronic device by bringing a pair of contact pins into contact with the external connection terminals of a sheet base formed by connecting multiple bases, even if manufacturing errors occur in the sheet base.

[0008] The inventors investigated a characteristic measurement device and characteristic measurement method that can measure the characteristics of each electronic device by contacting a pair of contact pins with the external connection terminals of a sheet base formed by connecting multiple bases, even if manufacturing errors occur in the sheet base. As a result of diligent investigation, the inventors came up with the following configuration.

[0009] A characteristic measuring device according to one embodiment of the present invention is a characteristic measuring device for measuring the characteristics of multiple electronic devices, which are formed by mounting electronic elements on each base in a sheet base that is formed in a sheet shape by connecting multiple bases.

[0010] The characteristic measuring device includes a pair of contact pins that contact a pair of external connection terminals electrically connected to the electronic element, a moving unit that moves the sheet base and at least one of the pair of contact pins in at least one of two directions perpendicular to the thickness direction of the sheet base, the thickness direction of the sheet base, and the circumferential direction around an axis extending in the thickness direction of the sheet base, a characteristic measuring unit that measures the characteristics of the electronic device, and a control unit that controls the moving unit based on the measurement results of the position coordinates of one surface of the sheet base that have been measured in advance.

[0011] The control unit calculates the position coordinates of the pair of external connection terminals based on the measured position coordinates of one surface of the sheet base, which have been measured in advance. The control unit moves the sheet base relative to the pair of contact pins using the moving unit to bring it into contact with the pair of external connection terminals. The control unit causes the characteristic measuring unit to measure the characteristics of the electronic device.

[0012] In the above configuration, the sheet base, formed by connecting multiple bases in a matrix, may have manufacturing errors due to distortions and other factors that occur during the manufacturing process of the sheet base. The characteristic measuring device calculates the position coordinates, including manufacturing errors, of a pair of external connection terminals electrically connected to the electronic element, based on the measurement position coordinates of one face of the sheet base. Therefore, the characteristic measuring device can bring a pair of contact pins into contact with the pair of external connection terminals based on the measurement position coordinates of one face of the sheet base. Since the characteristic measuring device calculates the position coordinates of the pair of external connection terminals for each base constituting the electronic device to be measured, it can eliminate the effects of manufacturing errors, distortions, and other factors occurring in the entire sheet base. As a result, even if manufacturing errors occur in the sheet base formed by connecting multiple bases, the pair of contact pins can be brought into maximum contact with the external connection terminals of the base.

[0013] From another perspective, the characteristic measuring device of the present invention preferably includes the following configuration: The characteristic measuring device has a plurality of pairs of contact pins supported by a single support member. The plurality of pairs of contact pins are configured to move independently in the thickness direction of the sheet base. The control unit moves the sheet base relative to the plurality of pairs of contact pins by the moving part, causing the plurality of pairs of contact pins to contact the plurality of pairs of external connection terminals, respectively.

[0014] In the above configuration, the multiple pairs of contact pins are supported by a single support member and are therefore moved as a single component. The control unit brings the multiple pairs of contact pins into contact with the multiple pairs of external connection terminals in a single contact operation, based on the position coordinates of the multiple pairs of contact pins and the position coordinates of the multiple pairs of external connection terminals. In this case, even if the positions of the multiple pairs of external connection terminals vary in the thickness direction, contact will be made with each of the multiple pairs of external connection terminals. As a result, even if there are manufacturing errors in the thickness direction in the sheet base formed by connecting multiple bases, the pairs of contact pins will follow the external connection terminals of the base, thus ensuring more reliable contact.

[0015] From another perspective, the characteristic measuring device of the present invention preferably includes the following configuration: The control unit moves the sheet base relative to a plurality of pairs of contact pins by the moving unit, and brings the plurality of pairs of contact pins into contact with each of the plurality of pairs of external connection terminals within a predetermined range.

[0016] In the above configuration, the characteristic measuring device adjusts the contact positions of the multiple pairs of contact pins with respect to the multiple pairs of external connection terminals so that each of the multiple pairs of contact pins contacts any position within a predetermined range on each of the multiple pairs of external connection terminals. In other words, the characteristic measuring device ensures that the contact positions of the multiple pairs of contact pins on each of the multiple pairs of external connection terminals are within a predetermined range. This allows for more reliable contact between the multiple pairs of contact pins and the multiple external connection terminals, even if manufacturing errors occur in the sheet base formed by connecting multiple bases.

[0017] From another perspective, the characteristic measurement method of the present invention preferably includes the following configuration. The characteristic measurement method is a characteristic measurement method for measuring the frequencies of multiple electronic devices, which are formed by mounting electronic elements on each base in a sheet base formed by connecting multiple bases in a sheet shape.

[0018] The characteristic measurement method comprises: a position coordinate measurement step of measuring the measurement position coordinates of at least a portion of one surface of the sheet base; an external connection terminal position calculation step of calculating the position coordinates of a pair of external connection terminals electrically connected to the electronic element based on the measurement position coordinates; a contact step of moving at least one of the sheet base and the pair of contact pins relative to each other in at least one of two directions orthogonal to the thickness direction of the sheet base, the thickness direction of the sheet base, and the circumferential direction around the axis extending in the thickness direction of the sheet base, based on the position coordinates of the pair of external connection terminals, to bring the pair of contact pins into contact with the pair of external connection terminals; and a characteristic measurement step of measuring the frequency of the crystal oscillator device using the pair of contact pins that have come into contact with the pair of external connection terminals.

[0019] In the above configuration, the sheet base, formed by connecting multiple bases in a matrix, has manufacturing errors due to distortions and other factors that occur during the manufacturing process of the sheet base. The characteristic measurement method calculates the position coordinates of the pair of external connection terminals, including the manufacturing errors, in the external connection terminal position calculation step, based on the measured position coordinates of one surface of the sheet base measured in the position coordinate measurement step. Therefore, the characteristic measurement method can bring the pair of contact pins into contact with the pair of external connection terminals in the contact step. Since the characteristic measurement method calculates the position coordinates of the external connection terminals for each base being measured, it can eliminate the influence of manufacturing errors, distortions, and other factors that occur throughout the entire sheet base. As a result, even if manufacturing errors occur in the sheet base formed by connecting multiple bases, the pair of contact pins can be brought into contact with the external connection terminals of the base.

[0020] From another perspective, the characteristic measurement method of the present invention preferably includes the following configuration. The characteristic measurement method involves moving the sheet base relative to a plurality of pairs of contact pins, which are supported by a single support member and moved as a single component in the contact step, so that the plurality of pairs of contact pins come into contact with a plurality of pairs of external connection terminals, respectively.

[0021] In the above configuration, the multiple pairs of contact pins are supported by a single support member and are therefore moved as a single component. Accordingly, the characteristic measurement method, in the contact step, brings the multiple pairs of contact pins into contact with the multiple pairs of external connection terminals in a single contact operation, based on the position coordinates of the multiple pairs of contact pins and the position coordinates of the multiple pairs of external connection terminals. At this time, the multiple pairs of contact pins move independently in the thickness direction of the sheet base, so even if the positions of the multiple pairs of external connection terminals in the thickness direction are varied, they will each make contact with the multiple pairs of external connection terminals. As a result, even if there are manufacturing errors in the sheet base formed by connecting multiple bases, the pairs of contact pins can be brought into contact with the external connection terminals of the base.

[0022] From another perspective, the characteristic measurement method of the present invention preferably includes the following configuration: In the contact step, the plurality of pairs of contact pins are moved such that the tips of the plurality of pairs of contact pins are located within a predetermined range of each of the plurality of pairs of terminals when viewed in the thickness direction of the sheet base.

[0023] In the above configuration, the characteristic measurement method adjusts the contact positions of the multiple pairs of contact pins on the multiple pairs of external connection terminals so that the multiple pairs of contact pins contact each of the multiple pairs of external connection terminals at an adjusted arbitrary position within a predetermined range on the multiple pairs of external connection terminals, based on the position coordinates of the multiple pairs of external connection terminals, in order to bring the multiple pairs of contact pins into contact with the multiple pairs of external connection terminals on the sheet base during the contact process. In other words, the characteristic measurement method provides a range for the contact positions of the multiple pairs of contact pins at each of the multiple pairs of external connection terminals during the contact process. This ensures that even if manufacturing errors occur in the sheet base formed by connecting multiple bases, the pair of contact pins can still be brought into contact with the external connection terminals of the base.

[0024] From another perspective, the characteristic measurement method of the present invention preferably includes the following configuration. In the external connection terminal position calculation step, if a plurality of pairs of external connection terminals are located on one face of the sheet base, the position coordinates of the centers on one face of the plurality of bases are calculated based on the measurement position coordinates, and the position coordinates of the plurality of pairs of external connection terminals are calculated based on the position coordinates of the centers on one face of the plurality of bases. If a plurality of pairs of external connection terminals are located on the other face of the sheet base, the position coordinates of the centers on one face of the plurality of bases are calculated based on the measurement position coordinates, the position coordinates of the centers on the other face of the plurality of bases are calculated based on the position coordinates of the centers on one face of the plurality of bases, and the position coordinates of the plurality of pairs of external connection terminals are calculated based on the position coordinates of the centers on the other face of the plurality of bases.

[0025] In the above configuration, in the external connection terminal position calculation step, if a plurality of the pair of external connection terminals are located on the other surface of the sheet base, the position coordinates of the centers of the plurality of bases on the other surface are calculated based on the position coordinates of the centers of the plurality of bases on one surface of the sheet base. Furthermore, the position coordinates of the plurality of the pair of external connection terminals are calculated from the position coordinates of the centers on the other surface of the plurality of bases. Therefore, in the external connection terminal position calculation step, the position coordinates of the plurality of the pair of external connection terminals are calculated even if the surface measured in the position coordinate measurement step and the surface on which the plurality of the pair of external connection terminals are located are different on the sheet base. As a result, a plurality of the pair of contact pins can be brought into contact with a pair of external connection terminals on a plurality of bases, regardless of the manufacturing precision of the sheet base.

[0026] From another perspective, the characteristic measuring device of the present invention preferably includes the following configuration. The characteristic measuring device is configured to measure the frequency of a plurality of quartz oscillator devices, each of which is an electronic element, mounted on a base. The characteristic measuring unit is configured as a frequency measuring unit for measuring the frequency of the quartz oscillator devices. The control unit measures the frequency of the quartz oscillator devices using the frequency measuring unit.

[0027] In the above configuration, the sheet base, formed by connecting multiple bases in a matrix, may have manufacturing errors due to distortions and other factors that occur during the manufacturing process of the sheet base. The frequency measuring device calculates the position coordinates, including manufacturing errors, of a pair of external connection terminals located on the back surface of the sheet base and electrically connected to the quartz oscillator, based on the measured position coordinates of one surface of the sheet base. Therefore, the frequency measuring device can bring a pair of contact pins into contact with the pair of external connection terminals based on the measured position coordinates of one surface of the sheet base. Since the frequency measuring device calculates the position coordinates of the pair of external connection terminals for each base constituting the quartz oscillator device to be measured, the effects of manufacturing errors, distortions, and other factors occurring in the entire sheet base can be eliminated. As a result, even if manufacturing errors occur in the sheet base formed by connecting multiple bases, the pair of contact pins can be brought into maximum contact with the external connection terminals of the base.

[0028] From another perspective, the characteristic measuring device of the present invention preferably includes the following configuration: The characteristic measuring device has a frequency adjustment unit for increasing or decreasing the thickness of the metal film formed on the quartz oscillator for at least one of the pair of contact pins. The control unit adjusts the frequency of the quartz oscillator by the frequency adjustment unit based on the frequency measured by the frequency measuring unit.

[0029] The control unit adjusts the thickness of the metal film on the quartz oscillator by the frequency adjustment unit until the frequency measured by the frequency measurement unit falls within a predetermined frequency range. The frequency adjustment unit reduces the mass of the quartz oscillator by, for example, removing at least a portion of the metal film with an ion beam. In other words, the control unit increases the frequency of the quartz oscillator by the frequency adjustment unit. The frequency adjustment unit also increases the mass of the quartz oscillator by, for example, depositing metal onto at least a portion of the metal film by metal deposition. In other words, the control unit decreases the frequency of the quartz oscillator by the frequency adjustment unit. If the frequency measured by the frequency measurement unit falls within a predetermined frequency range, the control unit stops the ion beam or metal deposition irradiating the quartz oscillator with the frequency adjustment unit. In this way, the frequency measurement device can adjust the frequency of each quartz oscillator while confirming the measured frequency for each quartz oscillator. This makes it possible to suppress the number of quartz oscillators in which the thickness of the metal film cannot be properly adjusted even if the manufacturing error of the sheet base increases.

[0030] From another perspective, the characteristic measuring device of the present invention preferably includes the following configuration: The characteristic measuring device has a plurality of pairs of contact pins supported by a single support member. The plurality of pairs of contact pins are configured to be independently expandable and contractible in the thickness direction of the sheet base. The control unit moves the plurality of pairs of contact pins relative to the sheet base by the moving part, and brings the plurality of pairs of contact pins into contact with the plurality of pairs of external connection terminals.

[0031] In the above configuration, the multiple pairs of contact pins are supported by a single support member and are therefore moved as a single component. The control unit brings the multiple pairs of contact pins into contact with the multiple pairs of external connection terminals in a single contact operation, based on the position coordinates of the multiple pairs of contact pins and the position coordinates of the multiple pairs of external connection terminals. In this case, even if the positions of the multiple pairs of external connection terminals vary in the thickness direction, contact will be made with each of the multiple pairs of external connection terminals. As a result, even if there are manufacturing errors in the thickness direction in the sheet base formed by connecting multiple bases, the pairs of contact pins will follow the external connection terminals of the base, thus ensuring more reliable contact.

[0032] From another perspective, the characteristic measuring device of the present invention preferably includes the following configuration: The control unit moves the sheet base relative to a plurality of pairs of contact pins by the moving unit, and brings the plurality of pairs of contact pins into contact with each of the plurality of pairs of external connection terminals within a predetermined range.

[0033] In the above configuration, the frequency measuring device adjusts the contact positions of the multiple pairs of contact pins with respect to the multiple pairs of external connection terminals so that each of the multiple pairs of contact pins contacts any position within a predetermined range on each of the multiple pairs of external connection terminals. In other words, the frequency measuring device ensures that the contact positions of the multiple pairs of contact pins on each of the multiple pairs of external connection terminals are within a predetermined range. This allows for more reliable contact between the multiple pairs of contact pins and the multiple external connection terminals, even if manufacturing errors occur in the sheet base formed by connecting multiple bases.

[0034] From another perspective, the characteristic measurement method of the present invention preferably includes the following configuration. The characteristic measurement method measures the frequency of a plurality of quartz oscillator devices, each of which is an electronic element, mounted on a base. In the characteristic measurement step, the frequency of the quartz oscillator device is measured by the pair of contact pins that are in contact with the pair of external connection terminals.

[0035] In the above configuration, the sheet base, which is formed in a matrix by connecting multiple bases, each having a crystal oscillator mounting section and a pair of external connection terminals, has manufacturing errors due to distortion and other factors that occur during the manufacturing process of the sheet base. The frequency measurement method calculates the position coordinates of the pair of external connection terminals, including the manufacturing errors, in the external connection terminal position calculation step, based on the measured position coordinates of the surface of the sheet base measured in the position coordinate measurement step. Therefore, the frequency measurement method can bring the pair of contact pins into contact with the pair of external connection terminals in the contact step. Since the frequency measurement method calculates the position coordinates of the external connection terminals for each base being measured, it can eliminate the effects of manufacturing errors, distortions, and other factors that occur throughout the entire sheet base. As a result, even if manufacturing errors occur in the sheet base formed by connecting multiple bases, the pair of contact pins can be brought into contact with the external connection terminals of the bases.

[0036] From another perspective, the characteristic measurement method of the present invention preferably includes the following configuration: The characteristic measurement method further comprises a frequency adjustment step of increasing or decreasing the thickness of the metal film formed on the quartz oscillator for each pair of contact pins. In the frequency adjustment step, the frequency of the quartz oscillator is adjusted based on the frequency measured in the characteristic measurement step.

[0037] In the above configuration, the frequency measurement method adjusts the thickness of the metal film on the quartz crystal oscillator by the frequency adjustment unit in the frequency adjustment step until the frequency measured by the frequency measurement unit falls within a predetermined frequency range. In the frequency adjustment step, the frequency measurement method reduces the mass of the quartz crystal oscillator by, for example, removing at least a portion of the metal film on the quartz crystal oscillator. In other words, the frequency measurement method increases the frequency of the quartz crystal oscillator by the frequency adjustment step. Also, in the frequency adjustment step, the mass of the quartz crystal oscillator is increased by, for example, depositing metal onto at least a portion of the metal film on the quartz crystal oscillator. In other words, the frequency measurement method decreases the frequency of the quartz crystal oscillator by the frequency adjustment step. If the frequency measured in the frequency measurement step falls within a predetermined frequency range, the frequency measurement method stops the ion beam or metal deposition irradiating the quartz crystal oscillator. In this way, the frequency measurement method can adjust the frequency of the quartz crystal oscillator while confirming the frequency measured for each quartz crystal oscillator. This makes it possible to suppress the number of quartz crystal oscillators that are not properly irradiated by the ion beam even if the manufacturing error of the sheet base increases.

[0038] [Quartz Oscillating Device] In this specification, a quartz oscillator means a quartz oscillator having a quartz oscillator element that converts a force applied to a quartz crystal into a voltage, or a voltage applied to a quartz crystal into a force. Quartz oscillators include quartz oscillator elements, quartz oscillators, etc. Quartz oscillators are used in oscillation circuits, filter circuits, actuators, sensors, etc.

[0039] [Quartz Oscillating Element] In this specification, a quartz oscillator means a piezoelectric body that converts an applied force into a voltage, or converts an applied voltage into force. In this embodiment, the quartz oscillator is a plate-shaped quartz oscillator cut from a quartz crystal in a specific direction. The quartz oscillator has electrodes that have been deposited by vapor deposition, sputtering, or the like.

[0040] [Base] In the present specification, the base refers to a container made of an insulator for holding the crystal vibration element. In the present embodiment, the base is a ceramic casing. The base has a crystal vibration element terminal inside that is electrically connected to the crystal vibration element.

[0041] [Bonding material] In the present specification, the bonding material means a conductive material for bonding the crystal vibration element to the crystal vibration element terminal. Examples of the bonding material include solder, adhesive, and the like. In the present embodiment, the bonding material is a thermosetting adhesive.

[0042] [Relative distance] In the present specification, the relative distance means the distance between the centers of components.

[0043] [Position information] In the present specification, the position information means the coordinates in the X direction, Y direction, Z direction and θ direction of a specific point on a target device, component or the like, with an arbitrary point in a characteristic measurement device set as the origin. The coordinates in the present embodiment are based on a coordinate system with an arbitrary point in the characteristic measurement device as the origin.

[0044] According to one embodiment of the present invention, even if a manufacturing error occurs in the sheet base formed by connecting a plurality of the bases, the pair of contact pins can be brought into contact with the external connection terminals of the base.

[0045] Figure 1 is a functional block diagram showing the configuration of a crystal oscillator device manufacturing apparatus. Figure 2 is a plan view showing the configuration of a sheet base used in the manufacture of a crystal oscillator device. Figure 3 is a plan view, side cross-sectional view, and bottom view showing the configuration of a base that houses a crystal oscillator element. Figure 4 is a plan view showing the schematic configuration of a crystal oscillator element mounting apparatus that constitutes a crystal oscillator device manufacturing apparatus. Figure 5 is a block diagram showing the control configuration of the crystal oscillator element mounting apparatus. Figure 6 is a plan view showing the schematic configuration of a frequency measuring device according to an embodiment of the present invention, viewed from the back surface of the sheet base. Figure 7 is a block diagram showing the control configuration of a frequency measuring device according to an embodiment of the present invention. Figure 8 is a flowchart showing the control process of a frequency measuring device according to an embodiment of the present invention. Figure 9 is a cross-sectional view of the sheet base in a state where the frequency of a crystal oscillator element is being measured by a frequency measuring device according to an embodiment of the present invention. Figure 10 is a schematic diagram showing the state of calculating the position of the external connection terminal on the back surface from the shape of the surface of the base according to an embodiment of the present invention. Figure 11 is a schematic diagram showing how, when the sheet base is moved relative to a plurality of pairs of contact pins in the X direction by a frequency measuring device according to an embodiment of the present invention, the plurality of pairs of contact pins are moved in the Y direction to adjust the contact position of the external connection terminal. Figure 12 is a schematic diagram showing how, in a frequency measuring device according to an embodiment of the present invention, when the sheet base is moved relative to a plurality of pairs of contact pins in the X direction, the sheet base is also moved in the X direction, and the plurality of pairs of contact pins are moved in the Y direction to adjust the contact position of the external connection terminals. Figure 13 is a schematic diagram showing how, in a frequency measuring device according to an embodiment of the present invention, when the sheet base is moved relative to a plurality of pairs of contact pins in the X direction, the sheet base is also moved in the θ direction to adjust the contact position of the external connection terminals. Figure 14 is a schematic diagram showing how, in another embodiment of the frequency measuring device according to an embodiment of the present invention, the frequency of a three-layer laminated resonator with a sealed quartz resonator is being adjusted and measured. Figure 15 is a schematic diagram showing a partial cross-section of a quartz resonator device having a two-layer laminated resonator. Figure 16 is a schematic diagram showing a partial cross-section of a quartz resonator device capable of adjusting and measuring the frequency of a three-layer quartz resonator.

[0046] Hereinafter, each embodiment will be described with reference to the drawings. In each figure, the same reference numeral is assigned to the same portion, and repeated description of the same portion will be omitted. Note that the dimensions of constituent members in each drawing do not faithfully represent the actual dimensions of the constituent members or the dimensional ratio of each constituent member, etc.

[0047] In the following description of the quartz vibration element mounting apparatus 1 which is an embodiment of the present invention, the direction in which the quartz vibration element P is conveyed to the quartz vibration element supply position Sp is defined as the "X direction", the direction orthogonal to the X direction in which the quartz vibration element P is conveyed from the quartz vibration element supply position Sp to the sheet base supply position Sh is defined as the "Y direction", the direction orthogonal to both the X direction and the Y direction is defined as the "Z direction", and the rotational direction rotating around an axis extending in the Z direction is defined as the "θ direction". Furthermore, in the present embodiment, the X direction and the Y direction are directions on a horizontal plane. The Z direction is the vertical direction. However, the definition of these directions is not intended to limit the orientation when the quartz vibration element mounting apparatus 1 is used.

[0048] Furthermore, in the following description of the frequency measuring apparatus 50 according to the embodiment of the present invention, the two orthogonal directions in which the bases B are arranged in a matrix are defined as the "X direction" and the "Y direction". The thickness direction of the sheet base SB, which is perpendicular to both the X direction and the Y direction, is defined as the "Z direction". The rotational direction rotating around an axis extending in the Z direction is defined as the "θ direction". However, the definition of these directions is not intended to limit the orientation when the frequency measuring apparatus 50 is used.

[0049] Furthermore, in the following description, expressions such as "fix", "connect", "join", and "attach" (hereinafter referred to as "fix and the like") include not only cases where members are directly fixed or the like to each other, but also cases where they are fixed or the like via other members. That is, in the following description, expressions such as fix and the like include the meaning of both direct and indirect fixing or the like between members.

[0050] [Embodiment 1] <Configuration of Quartz Oscillating Device Manufacturing Apparatus> The quartz oscillator manufacturing apparatus 100 will be described with reference to Figures 1 to 3. The quartz oscillator manufacturing apparatus 100 is part of an apparatus that manufactures a quartz oscillator device, which is a sheet-shaped electronic device, by mounting a quartz oscillator element P on a base B that constitutes a sheet base SB. Figure 1 is a functional block diagram showing the configuration of the quartz oscillator manufacturing apparatus 100. Figure 2 is a plan view showing the configuration of the sheet base SB used in the manufacture of the quartz oscillator device. Figure 3 is a plan view, a side cross-sectional view, and a bottom view showing the configuration of the base B that houses the quartz oscillator element P.

[0051] The quartz oscillator device manufacturing apparatus 100 includes a quartz oscillator element mounting device 1, a bonding material hardening device 40, and a frequency measuring device 50 for measuring the frequency, which is a characteristic of the quartz oscillator device of the present invention. In the quartz oscillator device manufacturing apparatus 100, the quartz oscillator element mounting device 1, the bonding material hardening device 40, and the frequency measuring device 50 are connected by a conveying device such as a conveyor (not shown). The quartz oscillator device manufacturing apparatus 100 electrically bonds the quartz oscillator element P (see Figure 4) to the sheet base SB (see Figure 2) using the quartz oscillator element mounting device 1. The quartz oscillator device manufacturing apparatus 100 hardens the bonding material that bonds the sheet base SB and the quartz oscillator element P using the bonding material hardening device 40. The quartz oscillator device manufacturing apparatus 100 also measures the frequency of the quartz oscillator element P bonded to the sheet base SB and adjusts the frequency of the quartz oscillator element P using the frequency measuring device 50.

[0052] As shown in Figure 2, the sheet base SB is constructed by arranging bases B, which house the quartz oscillator P (an electronic element), in a matrix in the X and Y directions. The sheet base SB is formed, for example, by firing ceramics. The sheet base SB is constructed by arranging multiple bases B in a sheet-like manner to form a single unit, thereby facilitating the handling of the bases B, which are otherwise difficult to handle. A jig J is attached to the outer edge of the sheet base SB. The jig J is frame-shaped to hold the outer edge of the sheet base SB while exposing the bases B. The jig J has a holding member for holding the sheet base SB, alignment marks for positioning the sheet base SB in the device, positioning holes, pins, etc. The jig J also has the function of correcting warping, distortion, etc. of the sheet base SB.

[0053] As shown in Figure 3, the base B constituting the sheet base SB is configured in a box shape capable of housing a quartz oscillator P. The base B has an opening to house the quartz oscillator P inside. The sheet base SB is integrally formed by aligning the openings of multiple base B in the same direction. Of the two surfaces of the base B and the sheet base SB, the surface on which the opening for housing the quartz oscillator P inside the base B is formed is called the front surface. Of the two surfaces of the base B and the sheet base SB, the surface on which the bottom of the base B is formed is called the back surface. The back surface may have openings for housing electronic elements other than the quartz oscillator P. Inside the base B, there is a quartz oscillator terminal Tr1 to which the quartz oscillator P is electrically connected. The back surface is provided with multiple external connection terminals Tr2 for joining to an external substrate. Refer to Figure 10 for the state in which the quartz oscillator P is housed inside the base B. Note that the front and back surfaces of the base B do not limit the direction, shape, function, or orientation of the base B.

[0054] <Crystal Oscillator Mounting Device 1> Next, the crystal oscillator mounting device 1, which constitutes a part of the crystal oscillator device manufacturing apparatus 100, will be described using Figures 4 and 5. Figure 4 is a plan view showing the schematic configuration of the crystal oscillator mounting device 1 that constitutes the crystal oscillator device manufacturing apparatus 100. Figure 5 is a block diagram showing the control configuration of the crystal oscillator mounting device 1.

[0055] As shown in Figure 4, the quartz crystal oscillator mounting device 1 is a device for joining a quartz crystal oscillator P to a base B that constitutes a sheet base SB. The quartz crystal oscillator mounting device 1 includes a stand 2, a quartz crystal oscillator supply device 10, a sheet base supply device 11, a suction head moving device 12, a supply head moving device 13, a camera 14 for measuring the position of the quartz crystal oscillator P, a laser measuring device 15 for measuring the surface shape of the sheet base SB, a control device 16 (see Figure 5), a suction head 20, and a supply head 30. In the quartz crystal oscillator mounting device 1, each device is arranged on the mounting surface, which is the horizontal surface of the stand 2. Multiple quartz crystal oscillators P and sheet bases SB are supplied to the quartz crystal oscillator mounting device 1 from a supply line (not shown).

[0056] Multiple quartz oscillators P are supplied to the quartz oscillator mounting device 1. In this embodiment, the multiple quartz oscillators P are supplied to the quartz oscillator mounting device 1 while housed in a tray T. A sheet-shaped sheet base SB is also supplied to the quartz oscillator mounting device 1. The sheet base SB is supplied to the quartz oscillator mounting device 1 with its surface facing upward in the Z direction.

[0057] The quartz oscillator supply device 10 positions the target quartz oscillator P at the quartz oscillator supply position Sp. The quartz oscillator supply device 10 is positioned on the stand 2 with the direction of transport of the quartz oscillator P in the vertical direction being the X direction. A tray T is supplied to the quartz oscillator supply device 10 from an external supply line (not shown) to the quartz oscillator standby position Wp. The quartz oscillator supply device 10 transports the tray T supplied to the quartz oscillator standby position Wp to the quartz oscillator supply position Sp. The quartz oscillator supply device 10 positions a quartz oscillator P at any position from among the multiple quartz oscillators P housed in the tray T to the quartz oscillator supply position Sp.

[0058] The sheet base supply device 11 positions the target base B within the sheet base SB at the sheet base supply position Sh. The sheet base supply device 11 is positioned on the frame 2 with the direction of transport of the sheet base SB in the vertical direction being the X direction. The sheet base supply device 11 is positioned adjacent to the crystal oscillator supply device 10 on the frame 2. At the base standby position Wh, the sheet base supply device 11 is supplied with sheet bases SB with their surfaces facing upward in the Z direction from an external supply line (not shown). The sheet base supply device 11 transports the sheet bases SB supplied at the base standby position Wh to the sheet base supply position Sh. The sheet base supply device 11 positions a base B of any position within the sheet base SB at the sheet base supply position Sh.

[0059] The suction head moving device 12 moves multiple suction heads 20 simultaneously. The suction head moving device 12 is positioned on a frame 2. The suction head moving device 12 is also positioned vertically (in the Z direction) above the quartz crystal element supply device 10 and the sheet base supply device 11. The suction head moving device 12 has a suction head mounting section 12a on which multiple suction heads 20 are placed. In this embodiment, four suction heads 20 are placed on the suction head mounting section 12a. The suction head moving device 12 reciprocates the multiple suction heads 20 placed on the suction head mounting section 12a between the quartz crystal element supply position Sp and the sheet base supply position Sh.

[0060] The suction head 20 positions any quartz crystal oscillator P within any base B of the sheet base SB using a suction nozzle 21. The suction head 20 includes a suction nozzle 21 and a suction nozzle moving mechanism 22. The suction nozzle 21 is a nozzle that attracts the quartz crystal oscillator P from the tray T. The suction nozzle 21 attracts the quartz crystal oscillator P by creating a negative pressure inside the suction hole. The suction nozzle moving mechanism 22 moves the suction nozzle 21 in the X, Y, Z, and θ directions relative to the suction head mounting section 12a. The suction head 20 is capable of moving the suction nozzle 21 to match the position and orientation of the quartz crystal oscillator P.

[0061] Two suction heads 20 are arranged side by side in the X direction. Additionally, one suction head 20 is arranged side by side in the Y direction for each pair of suction heads 20 arranged side by side in the X direction. The suction nozzles 21 of the four suction heads 20 are independently and individually movable in the X, Y, Z, and θ directions when mounted on the suction head mounting section 12a.

[0062] With this configuration, the four suction heads 20 each pick up one quartz oscillator P located on the tray T using their respective suction nozzles 21 at the quartz oscillator supply position Sp. Similarly, at the sheet base supply position Sh, the four suction heads 20 each place the quartz oscillator P picked up by their respective suction nozzles 21 into any base B within the sheet base SB.

[0063] The supply head moving device 13 moves multiple supply heads 30 simultaneously. The supply head moving device 13 is positioned on the frame 2 with the direction of transporting the multiple supply heads 30 being the Y direction when viewed vertically. The supply head moving device 13 is located above the sheet base supply device 11 in the vertical direction (Z direction).

[0064] The supply head moving device 13 has a supply head mounting section 13a on which a plurality of supply heads 30 are mounted. In this embodiment, four supply heads 30 are mounted on the supply head mounting section 13a. The supply head moving device 13 moves the supply heads 30 to any position within the operating range. The supply head moving device 13 transports the plurality of supply heads 30 mounted on the supply head mounting section 13a from the standby position W to the sheet base supply position Sh.

[0065] The supply head 30 supplies bonding material into the base B that constitutes the sheet base SB. The supply head 30 includes a supply device 31 and a supply device moving mechanism 32. The supply device 31 supplies bonding material into the base B on which the quartz oscillator P is placed. In this embodiment, the supply device 31 is a dispensing device that dispenses a predetermined amount of conductive adhesive. The supply device 31 is located on the supply device moving mechanism 32. The supply device 31 is configured to supply bonding material into the base B located vertically downward (Z direction). The supply device moving mechanism 32 allows the supply device 31 to move in the X, Y, Z, and θ directions relative to the supply head mounting section 13a.

[0066] Two supply heads 30 are arranged side by side in the X direction. Additionally, one supply head 30 is arranged side by side in the Y direction for each pair of supply heads 30 arranged side by side in the X direction. The four supply heads 30, when mounted on the supply head mounting section 13a, can move independently and individually in the X, Y, Z, and θ directions. At the sheet base supply position Sh, each of the four supply heads 30 supplies bonding material into the base B by its respective supply device 31.

[0067] The camera 14, which is a crystal oscillator position measuring device, is a camera that measures the position of the crystal oscillator P, each of which is adsorbed by one of the four adsorption nozzles 21, relative to the adsorption head 20. The camera 14 is located on the stand 2, vertically below the adsorption head moving device 12. The camera 14 photographs the adsorption head 20, which is moved by the adsorption head moving device 12, and the crystal oscillator P to which the adsorption head 20 is adsorbed, from below the adsorption head 20.

[0068] The laser measuring device 15, which is the position coordinate measuring unit, is a measuring device that measures the shape of the multiple bases B that constitute the sheet base SB. The laser measuring device 15 is located on the stand 2 and is positioned vertically above the sheet base supply device 11. The laser measuring device 15 is also installed so as to irradiate a laser downwards. This allows the laser measuring device 15 to measure the surface or back surface of the sheet base SB supplied to the sheet base supply device 11 from above. In this embodiment, the laser measuring device 15 measures the measurement position coordinates of the surface of the sheet base SB in the X, Y, and Z directions. Furthermore, the laser measuring device 15 is capable of horizontal movement and rotation to match the horizontal position and degree of rotation of each sheet base SB. This allows for more accurate measurement of the shape, including the position of the base, by laser scanning.

[0069] As shown in Figure 5, the control device 16 controls the crystal oscillator supply device 10, the sheet base supply device 11, the suction head moving device 12, the supply head moving device 13, the suction head 20, the supply head 30, the camera 14, and the laser measuring device 15. The control device 16 is essentially a system in which the CPU, ROM, RAM, etc., are connected by a bus. Alternatively, the control device 16 may be configured as a single-chip LSI or the like. The control device 16 stores various programs and data for controlling the operation of each actuator, the camera 14, and the laser measuring device 15, and for processing image data.

[0070] The control device 16 can independently and individually control the quartz oscillator supply device 10, the sheet base supply device 11, the suction head moving device 12, and the supply head moving device 13. Furthermore, the control device 16 can independently and individually control the suction nozzle moving mechanism 22 of the suction head 20. The control device 16 can also control a solenoid valve (not shown). Additionally, the control device 16 can independently and individually control the supply device moving mechanism 32. Finally, the control device 16 can independently and individually control the four supply devices 31.

[0071] The control device 16 can control the camera 14. The control device 16 can also acquire images captured by the camera 14. The control device 16 can also control the laser measuring device 15. The control device 16 can also acquire the measurement position coordinates in the X, Y, and Z directions of the multiple sheet bases SB measured by the laser measuring device 15.

[0072] The crystal oscillator mounting device 1 configured in this way can simultaneously acquire the measurement position coordinates of each of the multiple crystal oscillators P attached to the suction head 20 by the camera 14, and the measurement position coordinates of the sheet base SB in the X, Y, and Z directions by the laser measuring device 15.

[0073] Furthermore, the crystal oscillator mounting device 1 arranges the crystal oscillators P within the sheet base SB, taking into account variations in the shape of the sheet base SB, based on the measurement position coordinates of each of the multiple crystal oscillators P attached to the suction head 20 and the measurement position coordinates of the sheet base SB. In addition, the multiple supply heads 30 acquire measurement position coordinates related to the position of the sheet base SB, thereby precisely arranging the multiple crystal oscillators P in predetermined positions and orientations within the multiple sheet bases SB.

[0074] <Bonding Material Curing Device> As shown in Figure 1, the bonding material curing device 40 cures the bonding material that joins the quartz crystal oscillator P and the sheet base SB. The bonding material curing device 40 hardens the bonding material that joins the quartz crystal oscillator P and the sheet base SB by heating the surrounding environment of the sheet base SB on which the quartz crystal oscillator P is mounted in the quartz crystal oscillator mounting device 1. The bonding material curing device 40 supplies the sheet base SB with the bonded material cured to the frequency measuring device 50.

[0075] Figures 6 to 9 will be used to describe the frequency measuring device 50, which is a characteristic measuring device for electronic devices. The frequency measuring device 50 measures the frequency, which is a characteristic of the quartz oscillator device. Figure 6 is a plan view showing the schematic configuration of the frequency measuring device 50 according to an embodiment of the present invention, as seen from the back surface of the sheet base SB. Figure 7 is a block diagram showing the control configuration of the frequency measuring device 50. Figure 8 is a flowchart showing the control process of the frequency measuring device 50. Figure 9 is a cross-sectional view of the sheet base SB in the state in which the frequency of the quartz oscillator P is being measured by the frequency measuring device 50. The sheet base SB is supplied to the frequency measuring device 50 with its surface facing downward in the Z direction.

[0076] <Frequency Measurement Device> As shown in Figures 6 and 7, the frequency measurement device 50 measures the frequency of a quartz oscillator device in which a quartz oscillator element P is bonded to the base B of a sheet base SB. Furthermore, the frequency measurement device 50 adjusts the frequency of the quartz oscillator device based on the frequency measurement result of the quartz oscillator device. The frequency measurement device 50 includes a laser measurement device 15 (see Figure 7), which is a position coordinate measurement unit, a plurality of pairs of contact pins 51, a support member 52 that supports the plurality of pairs of contact pins 51, a moving unit consisting of an X-direction moving device 53, a Y-direction moving device 54, a Z-direction moving device 55 (see Figure 7), and a θ-direction moving device 56 (see Figure 7), which are moving units, a frequency measurement unit 57 (see Figure 7), a frequency adjustment unit 58, and a control unit 59 (see Figure 7).

[0077] The laser measuring device 15 is included in the crystal oscillator mounting device 1 (see Figure 2). The laser measuring device 15 is configured to transmit the measurement results of the position coordinates of the surface of the sheet base SB to the control device 59. In other words, the laser measuring device 15 functions as a position coordinate measuring unit for the sheet base SB. In this embodiment, the laser measuring device 15 measures the surface of the sheet base SB. Note that the laser measuring device 15 does not necessarily have to be included in the crystal oscillator mounting device 1. In that case, the laser measuring device 15 may be configured to transmit the measurement results of the position coordinates of the surface or back surface of the sheet base SB to the control device 59.

[0078] The pair of contact pins 51 are measuring terminals for measuring the frequency of the quartz oscillator P that constitutes the quartz oscillator device. The pair of contact pins 51 are made of a conductive material. The pair of contact pins 51 are configured to be able to contact a pair of external connection terminals Tr2 that are electrically connected to the quartz oscillator P. In this embodiment, the frequency measuring device 50 has a plurality of pairs of contact pins 51 (for example, 14 pairs). The plurality of pairs of contact pins 51 are provided on a support member 52 which is a single component. The plurality of pairs of contact pins 51 are configured to be able to extend and retract independently in the Z direction relative to the support member 52. Furthermore, the plurality of pairs of contact pins 51 are configured not to move in the X and Y directions relative to the support member 52. Furthermore, the plurality of pairs of contact pins 51 are configured to move in the Y direction together with the support member 52.

[0079] The support member 52 is a member that supports a plurality of pairs of contact pins 51. The support member 52 is, for example, a rectangular plate member. The support member 52 supports the plurality of pairs of contact pins 51 in an aligned Y-direction. In this embodiment, the frequency measuring device 50 has two support members 52. The two support members 52 are positioned facing the back surface of the sheet base SB. That is, the two support members 52 and the plurality of pairs of contact pins 51 supported by the two support members 52 are positioned below the sheet base SB in the Z-direction so as to face the back surface of the sheet base SB. The two support members 52 are arranged at a predetermined interval in the Y-direction. The two support members 52 are provided with the same number of pairs of contact pins 51 (for example, seven pairs each).

[0080] The X-direction moving device 53 is a device that moves the seat base SB in the X direction. In this embodiment, the X-direction moving device 53 is a single-axis linear motion unit having a servo motor as an actuator and a ball screw unit or the like as a linear motion mechanism. The X-direction moving device 53 is arranged on a horizontal frame (not shown). The X-direction moving device 53 supports the seat base SB via a jig J. The X-direction moving device 53 moves the seat base SB to any position in the X direction.

[0081] The Y-direction moving device 54 is a device that moves a support member 52 that supports a plurality of pairs of contact pins 51 in the Y direction. In this embodiment, the Y-direction moving device 54 is a single-axis linear motion unit having a servo motor as an actuator and a ball screw unit or the like as a linear motion mechanism. The Y-direction moving device 54 is arranged on a horizontal frame (not shown).

[0082] The Y-direction moving device 54 is provided with two support members 52 and two frequency adjustment units 58. The Y-direction moving device 54 moves a plurality of pairs of contact pins 51, the two support members 52 and the two frequency adjustment units 58 together to any position in the Y direction. In this embodiment, the plurality of pairs of contact pins 51 and the two support members 52 are supported by the Y-direction moving device 54 so as to face the back surface of the sheet base SB. The two frequency adjustment units 58 are supported by the Y-direction moving device 54 so as to face the front surface of the sheet base SB. In this embodiment, the plurality of pairs of contact pins 51 and the two support members 52 are supported by the Y-direction moving device 54 so as to be located below the sheet base SB. The two frequency adjustment units 58 are supported by the Y-direction moving device 54 so as to be located above the sheet base SB.

[0083] The Z-direction moving device 55 (see Figure 7) is a device that moves a plurality of pairs of contact pins 51 supported by a support member 52. In this embodiment, the Z-direction moving device 55 is a single-axis linear motion unit having a servo motor as an actuator and a ball screw unit or the like as a linear motion mechanism. The Z-direction moving device 55 is supported by the Y-direction moving device 54. The Z-direction moving device 55 moves the pair of contact pins 51 and the support member 52 in the Z direction relative to the Y-direction moving device 54. In other words, the Z-direction moving device 55 brings the plurality of pairs of contact pins 51 into contact with a pair of external connection terminals Tr2 of the seat base SB.

[0084] The θ-direction moving device 56 (see Figure 7) is a device that moves the seat base SB in the circumferential direction around the Z axis. In this embodiment, the θ-direction moving device 56 is a single-axis rotation unit having an actuator such as a servo motor. The seat base SB is placed on a horizontal frame (not shown). The θ-direction moving device 56 moves the seat base SB in the θ direction.

[0085] The frequency measurement unit 57 (see Figure 7) measures the frequency of the quartz oscillator P. The frequency measurement unit 57 includes, for example, a network analyzer. The frequency measurement unit 57 transmits an AC signal of a specific frequency to the quartz oscillator P using the network analyzer. The network analyzer measures the frequency of the quartz oscillator P based on the change in the AC signal. The frequency measurement unit 57 is electrically connected to a pair of contact pins 51. The frequency measurement unit 57 transmits the AC signal to the quartz oscillator P via the pair of contact pins 51 and measures the frequency from the change in the AC signal.

[0086] The frequency adjustment unit 58 (see Figure 7) adjusts the frequency of the quartz oscillator P. The frequency adjustment unit 58 is positioned opposite the surface of the sheet base SB. The frequency adjustment unit 58 has an ion beam irradiation unit 58a and a shutter unit 58b (see Figure 8). The frequency adjustment unit 58 irradiates the electrodes of the quartz oscillator P with an ion beam using the ion beam irradiation unit 58a. A portion of the electrodes of the quartz oscillator P is scraped away by the ion beam. The frequency of the quartz oscillator P, with a portion of its electrodes scraped away, increases due to the decrease in mass. When the quartz oscillator P reaches a predetermined frequency, the frequency adjustment unit 58 closes the shutter unit 58b to block the ion beam. The frequency adjustment unit 58 is provided to irradiate each quartz oscillator P measured by a pair of contact pins 51 with an ion beam.

[0087] As shown in Figure 7, the control device 59 controls the X-direction moving device 53, the Y-direction moving device 54, the Z-direction moving device 55, the θ-direction moving device 56, the frequency measurement unit 57, and the frequency adjustment unit 58. The control device 59 is essentially a system in which a CPU, ROM, RAM, etc., are connected by a bus. Alternatively, the control device 59 may consist of a single-chip LSI or the like. The control device 59 stores various programs and data for controlling the operation of each actuator and processing the measurement position coordinates.

[0088] The control device 59 is electrically connected to the laser measuring device 15 and can acquire the measurement position coordinates of the multiple sheet bases SB measured by the laser measuring device 15 in the X, Y, and Z directions. The control device 59 is electrically connected to the servo motors of the X-direction moving device 53, Y-direction moving device 54, Z-direction moving device 55, and θ-direction moving device 56, and can control each of them independently and individually. The control device 59 is electrically connected to the frequency measuring unit 57 and the frequency adjustment unit 58, and can control each of them.

[0089] The frequency measuring device 50 configured in this way can move the sheet base SB to any position in the X and θ directions using the X-direction moving device 53 and the θ-direction moving device 56, and move the plurality of pairs of contact pins 51 and the two frequency adjustment units 58, which are supported by the two support members 52, to any position in the Y direction using the Y-direction moving device 54. Furthermore, the frequency measuring device 50 can measure the frequency of the crystal oscillator P housed in the base B at any position by bringing the plurality of pairs of contact pins 51 into contact with the pair of external connection terminals Tr2 of the sheet base SB using the Z-direction moving device 55.

[0090] As shown in Figure 8, the frequency measuring device 50 has the following steps as a characteristic measurement method for measuring the frequency of a quartz oscillator configured on a sheet base SB: a position coordinate measurement step S110, an external connection terminal position calculation step S120, a contact step S130, a frequency measurement step S140 which is a characteristic measurement step, and a frequency adjustment step S150.

[0091] In the position coordinate measurement step S110, the control device 59 acquires the measured position coordinates of the sheet base SB measured by the laser measuring device 15. Next, in the external connection terminal position calculation step S120, the control device 59 calculates the position coordinates of a pair of external connection terminals Tr2 that are electrically connected to the quartz oscillator P based on the acquired measured position coordinates.

[0092] In the external connection terminal position calculation step S120, when the control device 59 obtains the measurement position coordinates of the back surface where the pair of external connection terminals Tr2 of the sheet base SB are located, it calculates the position coordinates of the center Cr2 on the back surface of each of the multiple base B based on the measurement position coordinates, and calculates the position coordinates of each of the multiple pairs of external connection terminals Tr2 based on the position coordinates of the center Cr2 on the back surface of each of the multiple base B. In the external connection terminal position calculation step S120, when the control device 59 obtains the measurement position coordinates of the surface where the pair of external connection terminals Tr2 of the sheet base SB are not located, it calculates the position coordinates of the center Cr1 on the measured surface of each of the multiple base B based on the measurement position coordinates. Furthermore, the control device 59 calculates the position coordinates of the center Cr2 on the back surface of each of the multiple base B based on the position coordinates of the center Cr1 on the surface of each of the multiple base B. The control device 59 calculates the position coordinates of each of the multiple pairs of external connection terminals Tr2 based on the position coordinates of the center Cr2 on the back surface of each of the multiple base B.

[0093] In the contact step S130, the control device 59 moves the sheet base SB and at least one of the pair of contact pins 51 relative to each other in at least one of the X and Y directions of the sheet base SB and the Z and θ directions of the sheet base SB, based on the position coordinates of the pair of external connection terminals Tr2, to bring the pair of contact pins 51 into contact with the pair of external connection terminals Tr2. In the frequency measurement step S140, the control device 59 measures the frequency of the crystal oscillator P using the pair of contact pins 51 that have come into contact with the pair of external connection terminals Tr2.

[0094] As a frequency adjustment step S150, the control device 59 irradiates the electrodes of the quartz oscillator P with an ion beam based on the frequency of the quartz oscillator P, and adjusts the frequency of the quartz oscillator by removing at least a portion of the electrodes.

[0095] As shown in Figure 9, the frequency measuring device 50 uses a Z-direction moving device 55 (see Figure 7) to bring a plurality of pairs of contact pins 51 into contact with the external connection terminal Tr2 of the sheet base SB. The frequency measuring device 50 measures the frequency of the quartz oscillator P that constitutes the quartz oscillator device using a frequency measuring unit 57. Furthermore, based on the measured frequency, the frequency measuring device 50 adjusts the frequency of the quartz oscillator P that constitutes the quartz oscillator device using a frequency adjustment unit 58. The frequency adjustment unit 58 opens the shutter unit 58b and irradiates the electrodes of the quartz oscillator P with an ion beam using an ion beam irradiation unit 58a. The frequency measuring device 50 repeats the frequency measurement by the frequency measuring unit 57 and the frequency adjustment by the frequency adjustment unit 58 until the frequency of the quartz oscillator P reaches an appropriate frequency.

[0096] <Method of Contacting Contact Pins to External Connection Terminals> A method of bringing multiple pairs of contact pins 51 into contact with multiple pairs of external connection terminals Tr2 using a frequency measuring device 50 will be explained using Figures 10 to 12. Figure 10 is a schematic diagram showing the state of calculating the position of the external connection terminals Tr2 on the back surface from the shape of the surface surface of the base B. Figure 11 is a schematic diagram showing that when the sheet base SB is moved relative to the four pairs of contact pins 51 in the X direction by the frequency measuring device 50, the four pairs of contact pins 51 are moved in the Y direction to adjust the contact position of the external connection terminals Tr2. Figure 12 is a schematic diagram showing that when the sheet base SB is moved relative to the four pairs of contact pins 51 in the X direction by the frequency measuring device 50, the sheet base SB is moved in the X direction and the four pairs of contact pins 51 are moved in the Y direction to adjust the contact position of the external connection terminals Tr2. For simplification, the pairs of contact pins 51 in Figures 11 to 13 represent four pairs of contact pins out of seven pairs of contact pins 51 arranged in the Y direction. Furthermore, the control device 59 of the frequency measuring device 50 is assumed to have previously acquired reference position coordinates indicating the two-dimensional shape of the base B. Note that in Figures 11, 12, and 13, only one of the pair of contact pins 51 is shown.

[0097] As shown in Figure 10, the control device 59 of the frequency measuring device 50 acquires the measurement position coordinates in the X, Y, and Z directions of the surface of the base B that constitutes the multiple sheet bases SB measured by the laser measuring device 15. The control device 59 compares the acquired measurement position coordinates of the surface of the base B to be measured with the reference position coordinates of the base B and calculates the position coordinates of the center Cr1 on the surface of the base B to be measured in the sheet base SB.

[0098] Next, the control device 59 calculates the position coordinates of the center Cr1 on the surface of the base B and the reference position coordinates of the base B, using the calculated position coordinates of the center Cr1 on the surface of the base B and the reference position coordinates of the base B. Furthermore, the control device 59 calculates the position coordinates of multiple pairs of external connection terminals Tr2 on the base B, the base B, using the center Cr2 as a reference. In this way, by using the measured position coordinates of the surface of the sheet base SB measured by the laser measuring device 15 and the reference position coordinates of the base B, it is possible to calculate the position coordinates of multiple external connection terminals Tr2 located on the back surface of the sheet base SB, which were not measured by the laser measuring device 15.

[0099] Next, the control device 59 calculates a predetermined contact range A for each of the pair of external connection terminals Tr2, which is the range in which the pair of contact pins 51 make contact. The contact range A is the area of ​​the external connection terminal Tr2 that is the joint surface of the external connection terminal Tr2 and in which both of the pair of contact pins 51 can contact the external connection terminal Tr2 without contacting the base B being measured, when viewed in the Z direction. In this embodiment, the contact range A is set as the largest rectangular area of ​​the area of ​​the external connection terminal Tr2 that is included in the joint surface of the external connection terminal Tr2 and in which both of the pair of contact pins 51 can contact the pair of external connection terminals Tr2 without contacting the base B being measured, when viewed in the Z direction. When the pair of contact pins 51 make contact with the contact range A, the control device 59 determines that the pair of contact pins 51 are making proper contact with the pair of external connection terminals Tr2.

[0100] The control device 59 calculates a pair of contact ranges A for each pair of external connection terminals Tr2 of multiple bases B based on the measurement position coordinates of the sheet base SB. The control device 59 adjusts the position of the support member 52 using the Y-direction moving device 54 and the position of the sheet base SB using the X-direction moving device 53 so that the number of times the four pairs of contact pins 51 that move at the same timing make contact with the contact range A of the four pairs of external connection terminals Tr2 is maximized.

[0101] As shown in Figure 11, the contact ranges A1, A2, and A3 of the external connection terminals Tr2 of the multiple bases B being measured are located on the positive side of the Y direction as you move from contact range A1 toward contact range A4 on the positive side of the X direction due to distortion of the sheet base SB, etc. Also, the contact ranges A5, A6, and A7 of the external connection terminals Tr2 are located on the positive side of the Y direction as you move from contact range A7 toward contact range A4 on the negative side of the X direction. The control device 59 moves the sheet base SB relative to the four pairs of contact pins 51 by the X-direction moving device 53 from the four contact ranges aligned in the Y direction from contact range A1 (hereinafter referred to as "the four contact ranges including contact range A1"; the same applies to contact ranges A2 to A7) toward the four contact ranges including contact range A7. The control device 59 brings the four pairs of contact pins 51 into contact with the pair of external connection terminals Tr2 of the four bases B, respectively. In this case, the four pairs of contact pins 51 cannot make contact with a portion of the four contact areas including contact area A5 (the lightly shaded area) from the four contact areas including contact area A2 (see upper part of Figure 11).

[0102] Therefore, the control device 59 moves the contact positions of the four pairs of contact pins 51 on the external connection terminal Tr2 in the Y direction, for example, by the Y-direction moving device 54, so that the number of pairs of contact pins 51 that contact the external connection terminal Tr2 is maximized. The control device 59 moves the positions of the four pairs of contact pins 51 to the positive Y direction so that each pair of contact pins 51 is located at the positive Y-direction end of the contact range A1. Similarly, the control device 59 moves the positions of the pairs of contact pins 51 to the positive Y direction so that each pair of contact pins 51 contacts the contact range A7 from the contact range A2. As a result, the four pairs of contact pins 51 contact the four external connection terminals Tr2, which have four contact ranges including the contact range A1, and the four external connection terminals Tr2, which have four contact ranges including the contact range A7 (see Figure 11, lower panel).

[0103] As shown in Figure 12, the contact ranges A1 and A2 of the multiple bases B being measured are located on the positive side of the Y direction as you move from contact range A1 towards the positive side of the X direction due to distortion of the sheet base SB. Also, contact ranges A3, A4, A5, A6, and A7 are located on the negative side of the Y direction as you move from contact range A3 towards contact range A7, which is on the positive side of the X direction. The control device 59 moves the sheet base SB relative to the four pairs of contact pins 51 on the positive side of the X direction using the X-direction moving device 53, from the four contact ranges including contact range A1 to the four contact ranges including contact range A7. The control device 59 brings the four pairs of contact pins 51 into contact with the pair of external connection terminals Tr2 of the four bases B. At this time, the four pairs of contact pins 51 cannot make contact with a part (lightly shaded area) of the four contact ranges from the four contact ranges including contact range A5 to the four contact ranges including contact range A7 (see upper part of Figure 12).

[0104] Therefore, the control device 59 moves the contact positions of the four pairs of contact pins 51 at the external connection terminal Tr2 in the X and Y directions, for example, using the X-direction moving device 53 and the Y-direction moving device 54, so that the number of pairs of contact pins 51 that contact the external connection terminal Tr2 is maximized. The control device 59 moves the positions of the four pairs of contact pins 51 to the negative Y direction so that each pair of contact pins 51 is located at the negative Y-direction end of the contact range A1. Similarly, the control device 59 moves the positions of the pairs of contact pins 51 to the negative Y direction so that each pair of contact pins 51 contacts the four contact ranges including contact range A7, rather than the four contact ranges including contact range A2 (see the middle section of Figure 12).

[0105] Furthermore, the control device 59 moves the position of the sheet base SB to the negative X direction so that the pair of contact pins 51 are located at the positive X-side end of the contact area A1. Similarly, the control device 59 moves the position of the sheet base SB to the negative X direction so that the pair of contact pins 51 contact the four contact areas including contact area A7, instead of the four contact areas including contact area A2 (see Figure 12, lower panel). As a result, the four pairs of contact pins 51 contact the four external connection terminals Tr2 having four contact areas including contact area A1, instead of the four external connection terminals Tr2 having four contact areas including contact area A7.

[0106] The frequency measuring device 50 adjusts the relative position of the sheet base SB with respect to the four pairs of contact pins 51 using the X-direction moving device 53 and the Y-direction moving device 54. However, as shown in Figure 13, the frequency measuring device 50 may also adjust the relative position of the sheet base SB with respect to the four pairs of contact pins 51 using the θ-direction moving device 56 (see Figure 7) in addition to the X-direction moving device 53 and the Y-direction moving device 54. Figure 13 is a schematic diagram showing how the frequency measuring device 50 adjusts the contact state of the external connection terminal Tr2 by moving the sheet base SB in the θ-direction when moving the sheet base SB in the X-direction relative to a plurality of pairs of contact pins 51.

[0107] As shown in Figure 13, the contact ranges A1 to A7 of the multiple bases B being measured are located on the positive Y side as they move from contact range A1 toward the positive X side due to distortion of the sheet base SB. The control device 59 moves the sheet base SB relative to the four pairs of contact pins 51 toward the positive X side, from the four contact ranges including contact range A1 toward the four contact ranges including contact range A7. The control device 59 brings the four pairs of contact pins 51 into contact with the pair of external connection terminals Tr2 of the four bases B. At this time, the four pairs of contact pins 51 cannot make contact with a portion (lightly shaded area) of the four contact ranges including contact range A4 of the external connection terminal Tr2 toward the four contact ranges including contact range A7 (see upper part of Figure 13).

[0108] Therefore, the control device 59 moves the contact position of the sheet base SB at the external connection terminal Tr2 in the θ direction, for example, by the θ direction moving device 56, so that the number of pairs of contact pins 51 that contact the external connection terminal Tr2 is as large as possible. The control device 59 moves the position of the sheet base SB to the positive θ direction so that the four pairs of contact pins 51 are located at the negative Y-side end and the negative X-side end of the contact range A1. Similarly, the control device 59 moves the position of the sheet base SB to the positive θ direction so that the pairs of contact pins 51 contact the four contact ranges including contact range A7, instead of the four contact ranges including contact range A2. As a result, the four pairs of contact pins 51 contact the four external connection terminals Tr2 having four contact ranges including contact range A1, instead of the four external connection terminals Tr2 having four contact ranges including contact range A1 (see Figure 13, lower panel).

[0109] The frequency measuring device 50 provides a range of contact positions for a pair of contact pins 51 by providing contact ranges A1, A2, A3, A4, A5, A6, and A7 for each of the multiple pairs of external connection terminals Tr2. The frequency measuring device 50 absorbs positional displacement due to distortion of the sheet base SB by changing the contact position of a pair of contact pins 51 within each of the multiple pairs of contact ranges A1, A2, A3, A4, A5, A6, and A7. As a result, even if the manufacturing error of the sheet base SB increases, the number of pairs of contact pins 51 that do not contact a pair of external connection terminals Tr2 of the multiple bases B that constitute the sheet base SB can be suppressed.

[0110] The frequency measuring device 50, which is a characteristic measuring device configured in this way, measures at least a portion of the sheet base SB based on the measurement position coordinates of the surface of the sheet base SB that has been measured. Furthermore, the frequency measuring device 50 calculates the position coordinates of a pair of external connection terminals Tr2 on the sheet base SB, taking into account the manufacturing tolerances of the sheet base SB, based on the measurement position coordinates of the sheet base SB. Therefore, the frequency measuring device 50 can bring a pair of contact pins 51 into contact with a pair of external connection terminals Tr2. Since the frequency measuring device 50 calculates the position coordinates of a pair of external connection terminals Tr2 for each base B being measured, it can suppress the effects of manufacturing tolerances, distortions, etc. that occur throughout the entire sheet base SB.

[0111] Furthermore, the control device 59 irradiates the quartz oscillator P with an ion beam using the frequency adjustment unit 58 until the frequency measured by the frequency measurement unit 57 falls within a predetermined frequency range. The frequency adjustment unit 58 reduces the mass of the quartz oscillator P by removing at least a portion of the electrodes of the quartz oscillator P with the ion beam. In other words, the control device 59 increases the frequency of the quartz oscillator device using the frequency adjustment unit 58. When the frequency measured by the frequency adjustment unit 58 falls within a predetermined frequency range, the control device 59 stops the ion beam irradiating the quartz oscillator P using the frequency adjustment unit 58. In this way, the frequency measurement device 50 can adjust the frequency of each quartz oscillator device while confirming the frequency measured for each quartz oscillator device. As a result, even if manufacturing errors occur in the sheet base SB formed by connecting multiple bases B, the frequency of the quartz oscillator P can be adjusted by irradiating it with an ion beam.

[0112] Furthermore, since the multiple pairs of contact pins 51 are supported by a single support member 52, they move as a single component. Therefore, the control device 59 brings the multiple pairs of contact pins 51 into contact with the multiple pairs of external connection terminals Tr2 in a single contact operation, based on the position coordinates of the multiple pairs of contact pins 51 and the position coordinates of the multiple pairs of external connection terminals Tr2. At this time, since the multiple pairs of contact pins 51 move independently in the thickness direction of the sheet base SB, they will contact each of the multiple pairs of external connection terminals Tr2 even if the positions of the multiple pairs of external connection terminals Tr2 in the thickness direction are varied. As a result, even if there are manufacturing errors in the sheet base SB which is formed by connecting multiple bases B, the pairs of contact pins 51 can be brought into contact with the external connection terminals Tr2 of the base B.

[0113] Furthermore, the frequency measuring device 50 adjusts the contact positions of the multiple pairs of contact pins 51 on the multiple pairs of external connection terminals Tr2, and also makes the multiple pairs of contact pins 51 contact each of the multiple pairs of external connection terminals Tr2 at any position within the contact range A of the multiple pairs of external connection terminals Tr2. The frequency measuring device 50 provides a range for the contact positions of the pair of contact pins 51 on each of the multiple pairs of external connection terminals Tr2. This makes it possible to suppress the number of pairs of contact pins 51 that do not contact the pairs of external connection terminals Tr2 of the multiple bases B that constitute the sheet base SB, even if the manufacturing error of the sheet base SB increases.

[0114] [Other Embodiments] In the embodiments described above, the frequency measuring device 50 adjusts the frequency of the quartz oscillator P bonded to the base B using an ion beam and measures the frequency of the quartz oscillator P. However, the frequency measuring device may also be configured to adjust the frequency of the hermetically sealed quartz oscillator and measure the frequency of the quartz oscillator. Figure 14 is a schematic diagram showing the adjustment and measurement of the frequency of a laminated oscillator 204 in which the quartz oscillator 206a is sealed by a frequency measuring device 50X, which is another embodiment of the frequency measuring device according to the embodiment of the present invention. The frequency measuring device 50X adjusts the frequency of the laminated oscillator 204 bonded to the quartz oscillator device 200. In the embodiments shown in Figures 14 and 15, the quartz oscillator 205a is a quartz oscillator of the thickness sliding vibration system, such as an AT-cut quartz, which vibrates by sliding along its main surface.

[0115] The embodiment shown in Figure 14 includes a frequency measuring device 50X comprising a frequency measuring unit 57, a frequency adjustment unit 58X, and a control device (not shown). The frequency adjustment unit 58X adjusts the frequency of the quartz oscillator 205a. The frequency adjustment unit 58X is configured as a laser irradiation device. The frequency adjustment unit 58X can, for example, use a green laser with a wavelength of approximately 532 nm.

[0116] The quartz oscillator device 200 is a device in which an IC chip 203 and a stacked oscillator 204 are hermetically sealed on a substrate 201. The quartz oscillator device 200 comprises a substrate 201, an IC chip 203, a stacked oscillator 204, and a sealing plate 208.

[0117] The substrate 201 has a housing section on one main surface for housing an IC chip 203 and a stacked resonator 204. The substrate 201 also has an external connection terminal 202 on the other main surface for connecting to an external substrate. The IC chip 203 and the stacked resonator 204 are bonded to the housing section of the substrate 201 with a conductive adhesive or the like. The housing section of the substrate 201 is hermetically sealed by a sealing plate 208.

[0118] The laminated resonator 204 is a laminated resonator with a three-layer structure, consisting of three stacked quartz plates. The laminated resonator 204 includes a vibrating member 205, a first sealing member 206, and a second sealing member 207. The vibrating member 205, the first sealing member 206, and the second sealing member 207 are made of light-transmitting quartz plates.

[0119] The vibrating member 205 includes a quartz crystal oscillator 205a and a pair of excitation electrodes 205b. The quartz crystal oscillator 205a is a cantilevered diaphragm formed from a part of the vibrating member 205. The excitation electrodes 205b are electrodes to which a voltage is applied to vibrate the quartz crystal oscillator 205a. The excitation electrodes 205b are provided on both sides of the quartz crystal oscillator 205a. In Figure 14, the excitation electrodes 205b on one side of the quartz crystal oscillator 205a are not shown.

[0120] The first sealing member 206 and the second sealing member 207 hermetically seal the vibrating member 205. The first sealing member 206 is joined to one surface of the vibrating member 205 so as to cover the quartz crystal oscillator 205a. The second sealing member 207 is joined to the other surface of the vibrating member 205 so as to cover the quartz crystal oscillator 205a. A frequency-adjusting metal film 207a is formed on the surface of the second sealing member 207 facing the vibrating member 205 so as to face the excitation electrode 205b of the quartz crystal oscillator 205a.

[0121] In the laminated resonator 204 configured in this way, the quartz crystal oscillator 205a is hermetically sealed by stacking the first sealing member 206 and the second sealing member 207 on the vibrating member 205. The quartz crystal oscillator 205a of the laminated resonator 204 is frequency-adjusted by the frequency measuring device 50 before being hermetically sealed by the first sealing member 206 and the second sealing member 207. The laminated resonator 204 is then bonded to the substrate 201 with a conductive adhesive or the like in its frequency-adjusted state.

[0122] Furthermore, when the laminated resonator 204 is bonded to the substrate 201 with a conductive adhesive or the like, it may be affected by heat, stress, etc. due to the bonding, which may cause frequency fluctuations. Therefore, the laminated resonator 204 is configured to allow frequency adjustment of the quartz crystal oscillator 205a while it is hermetically sealed using a frequency adjustment metal film 207a. Frequency adjustment of the laminated resonator 204 is performed by a frequency measuring device 50X.

[0123] The frequency measuring device 50X adjusts and measures the frequency of the quartz crystal oscillator 205a located inside the laminated resonator 204 bonded to the substrate 201. The frequency measuring device 50X irradiates the frequency-adjusting metal film 207a with a laser L from outside the second sealing member 207 using a frequency adjustment unit 58X. At this time, the sealing plate 208 is not bonded to the substrate 201, and the housing is open. The laser L passes through the second sealing member 207, which transmits visible light, and heats the frequency-adjusting metal film 207a, causing at least a portion of the frequency-adjusting metal film 207a to evaporate (vaporize) by melting. A portion of the metal evaporated from the frequency-adjusting metal film 207a adheres to the excitation electrode 205b located on the surface facing the frequency-adjusting metal film 207a. The mass of the excitation electrode 205b increases due to the adhesion of the evaporated metal. Therefore, the oscillation frequency of the quartz oscillator 205a, which is equipped with the excitation electrode 205b, decreases as the mass of the excitation electrode 205b increases.

[0124] The frequency measuring device 50X can control the amount of frequency adjustment of the quartz oscillator 205a by controlling the number of pulses, sweep distance, sweep count, etc., of the laser L irradiated onto the frequency adjustment metal film 207a, while measuring the frequency of the quartz oscillator 205a with the frequency measuring unit 57. Furthermore, the frequency measuring device 50X can suppress damage to the excitation electrode 205b by the laser L by controlling it so that the laser L does not penetrate the frequency adjustment metal film 207a. The frequency measuring device 50X repeats the frequency measurement by the frequency measuring unit 57 and the frequency adjustment by the frequency adjustment unit 58X until the frequency of the quartz oscillator 205a reaches an appropriate frequency.

[0125] Furthermore, in the above embodiment, the frequency measuring device 50X adjusts the frequency of a three-layer laminated resonator 204 bonded to a substrate 201. However, the frequency measuring device may also be configured to adjust the frequency of a laminated resonator other than a three-layer structure bonded to a substrate. Figure 15 is a schematic diagram showing a partial cross-section of a quartz oscillator device 210 having a two-layer laminated resonator 211. Figure 16 is a schematic diagram showing a partial cross-section of a quartz oscillator device 220 capable of adjusting and measuring the frequency of a three-layer laminated resonator 204.

[0126] In the embodiment shown in Figure 15, the quartz oscillator device 210 is a device in which an IC chip 203 and a stacked oscillator 211 are hermetically sealed on a substrate 201. The quartz oscillator device 210 has a substrate 201, an IC chip 203, a stacked oscillator 211, and a sealing plate 208.

[0127] The substrate 201 has a housing section on one main surface for housing the IC chip 203 and the stacked resonator 211. The substrate 201 also has an external connection terminal 202 on the other main surface for connecting to an external substrate. The IC chip 203 and the stacked resonator 211 are bonded to the housing section of the substrate 201 with a conductive adhesive or the like. The housing section of the substrate 201 is hermetically sealed with a sealing plate 208.

[0128] The laminated resonator 211 is a laminated resonator with a two-layer structure, consisting of two stacked quartz plates. The laminated resonator 211 includes a vibrating member 212 and a first sealing member 213. The vibrating member 212 and the first sealing member 213 are made of light-transmitting quartz plates. The vibrating member 212 is joined to the upper side of the first sealing member 213. The vibrating member 212 has a quartz vibrating element 214. The quartz vibrating element 214 has a pair of excitation electrodes 214a.

[0129] Before the quartz oscillator device 210 is sealed by the sealing plate 208, a laser L is irradiated from the outside onto the excitation electrode 214a by a frequency measuring device 50X (see Figure 14). At least a portion of the excitation electrode 214a evaporates (vaporizes) due to the irradiation of the laser L. As the mass of the excitation electrode 214a decreases due to evaporation, the frequency of the quartz oscillator element 214 increases. This adjusts the frequency of the laminated resonator 211 bonded to the substrate 201.

[0130] In the embodiment shown in Figure 16, the quartz oscillator device 220 is a device in which a stacked oscillator 204 is hermetically sealed on a substrate 221. The quartz oscillator device 220 has a substrate 221, a stacked oscillator 204, and a flanged lid 223.

[0131] The substrate 221 has a laminated resonator 204 bonded to one main surface by a conductive adhesive or the like. The substrate 221 also has an external connection terminal 222 on the other main surface that connects to an external substrate. The flanged lid is a cover with a housing section. The flanged lid 223 is bonded to the substrate 221 so as to cover one main surface of the substrate 221. The laminated resonator 204 bonded to one surface of the substrate 221 is hermetically sealed by the flanged lid 223.

[0132] In the crystal oscillator device 220 configured in this way, before the flanged lid 223 is bonded to the substrate 221, a laser L is irradiated from outside the second sealing member 207 by a frequency measuring device 50X onto the frequency-adjusting metal film 207a (see Figure 14). Due to the irradiation of the laser L, a portion of the frequency-adjusting metal film 207a evaporates and adheres to the excitation electrode 205b. As the mass of the excitation electrode 205b increases, the frequency of the crystal oscillator element 205a decreases. This adjusts the frequency of the laminated resonator 204 bonded to the substrate 221.

[0133] Furthermore, in the above-described embodiment, the sealing member, such as the sealing plate 208 that hermetically seals the quartz oscillator devices 200 and 210, is made of ceramic, metal, or the like. However, the sealing member may also be made of a sheet-like resin material or a film lid such as a single metal foil.

[0134] Furthermore, in the above-described embodiment, the frequency measuring device 50, which is a characteristic measuring device, measures the frequency of the crystal oscillator. However, the characteristic measuring device only needs to be able to measure characteristic values ​​such as the switching speed and transition frequency of a transistor, characteristic values ​​such as the data retention characteristics and operating current of an IC tag, characteristic values ​​such as the dark current and gain of a COMOS sensor, and characteristics of electronic devices such as the resistance and leakage current of a thin-film solar cell using contact pins.

[0135] Furthermore, in the above-described embodiment, the frequency measuring device 50 supports a plurality of pairs of contact pins 51 with two support members 52. However, the number of support members supporting a pair of contact pins in the characteristic measuring device may be one or three or more.

[0136] Furthermore, in the above-described embodiment, the support member 52 supports, for example, 14 pairs of contact pins 51. However, the support member only needs to support two or more pairs of contact pins.

[0137] Furthermore, in the above-described embodiment, the two support members 52 each support, for example, 14 pairs of contact pins 51. However, the two support members may be configured to support different numbers of pairs of contact pins.

[0138] Furthermore, in the above-described embodiment, the laser measuring device 15, which is the position coordinate measuring unit, measures the surface of the sheet base SB. However, the position coordinate measuring unit only needs to be configured to measure the position coordinates of at least one of the surface and back surfaces of the sheet base SB.

[0139] Furthermore, in the above-described embodiment, the sheet base SB is constructed by sintering ceramic. However, the sheet base SB may be constructed from an inorganic material other than glass, resin, or ceramic.

[0140] Furthermore, in the above-described embodiment, the base B has housing portions for housing elements on both its front and back surfaces. However, the base may also be configured to have housing portions on either the front or back surface.

[0141] Furthermore, in the above-described embodiment, the frequency measuring device 50 measures the surface of the sheet base SB using the laser measuring device 15. However, the characteristic measuring device may calculate the position of the external connection terminals based on measurement results from measuring devices other than the laser measuring device, image processing, etc.

[0142] Furthermore, in the above-described embodiment, the frequency measuring device 50 utilizes the measurement position coordinates of the sheet base SB measured by the laser measuring device 15 included in the crystal oscillator mounting device 1. However, the characteristic measuring device may also be configured to measure the surface of the sheet base SB using its own position coordinate measuring unit.

[0143] Furthermore, in the above embodiment, the frequency adjustment unit 58 reduces the mass of the quartz oscillator P by irradiating it with an ion beam from the ion beam irradiation unit 58a, thereby removing a portion of the electrodes of the quartz oscillator P. As a result, the frequency adjustment unit 58 lowers the frequency of the quartz oscillator. However, the frequency adjustment unit may also be configured to increase the mass of the quartz oscillator by, for example, depositing metal onto at least a portion of the metal film by metal deposition. As a result, the frequency adjustment unit lowers the frequency of the quartz oscillator.

[0144] Furthermore, in the above-described embodiment, the frequency measuring device 50 moves a plurality of pairs of contact pins 51 in the Y direction using a Y-direction moving device 54 to bring them into contact with a plurality of external connection terminals Tr2. The frequency measuring device 50 moves the sheet base SB in the X direction using an X-direction moving device 53, and moves a plurality of pairs of contact pins 51 in the Y direction using a Y-direction moving device 54 to bring them into contact with a plurality of external connection terminals Tr2. The frequency measuring device 50 moves the sheet base SB in the θ direction using a θ-direction moving device 56 to bring it into contact with a plurality of external connection terminals Tr2. However, the characteristic measuring device only needs to be configured to move the sheet base SB relative to a plurality of pairs of contact pins using at least one of the X-direction moving device, Y-direction moving device, and θ-direction moving device.

[0145] Although embodiments of the present invention have been described above, the embodiments described above are merely examples for carrying out the present invention. Therefore, the invention is not limited to the embodiments described above, and it is possible to carry out the invention by appropriately modifying the embodiments described above without departing from the spirit of the invention.

[0146] 1 Quartz oscillator mounting device 2 Stand 10 Quartz oscillator supply device 11 Sheet base supply device 12 Suction head moving device 12a Suction head mounting section 13 Supply head moving device 13a Supply head mounting section 14 Camera 15 Laser measuring device 16, 59 Control device 20 Suction head 21 Suction nozzle 22 Suction nozzle moving mechanism 30 Supply head 31 Supply device 32 Supply device moving mechanism 40 Bonding material curing device 50, 50X Frequency measuring device 51 Pair of contact pins 52 Support member 53 X-direction moving device 54 Y-direction moving device 55 Z-direction moving device 56 θ-direction moving device 57 Frequency measuring section 58, 58X Frequency adjustment section 58a Ion beam irradiation section 58b Shutter section 200, 210, 220 Piezoelectric vibration device 201, 221 Substrate 203 IC chip 204, 211 Multilayer vibrating element 205 Vibrating member 205a, 214, P Quartz vibrating element 205b, 214a Excitation electrode 206, 212 First sealing member 207, 213 Second sealing member 207a, 213a Metal film for frequency adjustment 208 Sealing plate 223 Flanged lid Tr1 Terminal for quartz vibrating element 202, 222, Tr2 External connection terminal B Base SB Sheet base L Laser A, A1, A2, A3, A4, A5, A6, A7 Contact range Cr1, Cr2 Center 100 Quartz vibrating device manufacturing apparatus

Claims

1. A characteristic measuring device for measuring the characteristics of multiple electronic devices, which are formed by mounting electronic elements on each base in a sheet base formed by connecting multiple bases, comprising: a pair of contact pins that contact a pair of external connection terminals electrically connected to the electronic elements; a moving unit that moves at least one of the sheet base and the pair of contact pins in at least one of two directions perpendicular to the thickness direction of the sheet base, the thickness direction of the sheet base, and the circumferential direction around an axis extending in the thickness direction of the sheet base; a characteristic measuring unit for measuring the characteristics of the electronic devices; and a control unit that controls the moving unit based on the measurement position coordinates of one surface of the sheet base measured in advance, wherein the control unit calculates the position coordinates of the pair of external connection terminals based on the measurement position coordinates of one surface of the sheet base measured in advance, moves the pair of contact pins relative to the sheet base by the moving unit to bring them into contact with the pair of external connection terminals, and measures the characteristics of the electronic devices by the characteristic measuring unit.

2. A characteristic measuring device according to claim 1, wherein the device has a plurality of pairs of contact pins supported by a single support member, the plurality of pairs of contact pins are configured to expand and contract independently in the thickness direction of the sheet base, and the control unit moves the sheet base relative to the plurality of pairs of contact pins by the moving part, thereby bringing the plurality of pairs of contact pins into contact with the plurality of pairs of external connection terminals.

3. A characteristic measuring device according to claim 2, wherein the control unit moves the sheet base relative to a plurality of pairs of contact pins by the moving unit, and brings the plurality of pairs of contact pins into contact with each of the plurality of pairs of external connection terminals within a predetermined range.

4. A characteristic measurement method for measuring the characteristics of a plurality of electronic devices, which are formed by mounting electronic elements on each base in a sheet base formed by connecting a plurality of bases, comprising: a position coordinate measurement step of measuring the measurement position coordinates of at least a part of one surface of the sheet base; an external connection terminal position calculation step of calculating the position coordinates of a pair of external connection terminals electrically connected to the electronic elements based on the measurement position coordinates; a contact step of moving at least one of the sheet base and the pair of contact pins relative to each other in at least one of two directions perpendicular to the thickness direction of the sheet base, the thickness direction of the sheet base, and the circumferential direction around the axis extending in the thickness direction of the sheet base, based on the position coordinates of the pair of external connection terminals, to bring the pair of contact pins into contact with the pair of external connection terminals; and a characteristic measurement step of measuring the characteristics of the electronic devices using the pair of contact pins that have come into contact with the pair of external connection terminals.

5. A characteristic measurement method according to claim 4, wherein in the contact step, the sheet base is moved relative to a plurality of the pair of contact pins, which are supported by a single support member and moved as a single component, so that the plurality of the pair of contact pins come into contact with a plurality of the pair of external connection terminals, respectively.

6. The characteristic measurement method according to claim 4, wherein in the contact step, the plurality of pairs of contact pins are moved such that, when viewed in the thickness direction of the sheet base, the plurality of pairs of contact pins each contact within a predetermined range of the plurality of pairs of external connection terminals.

7. A characteristic measurement method according to claim 4, wherein in the external connection terminal position calculation step, when a plurality of pairs of external connection terminals are located on one face of the sheet base, the position coordinates of the centers on one face of the plurality of bases are calculated based on the measurement position coordinates, and the position coordinates of the plurality of pairs of external connection terminals are calculated based on the position coordinates of the centers on one face of the plurality of bases, and when a plurality of pairs of external connection terminals are located on the other face of the sheet base, the position coordinates of the centers on one face of the plurality of bases are calculated based on the measurement position coordinates, and the position coordinates of the centers on the other face of the plurality of bases are calculated based on the position coordinates of the centers on one face of the plurality of bases, and the position coordinates of the plurality of pairs of external connection terminals are calculated based on the position coordinates of the centers on the other face of the plurality of bases.

8. A characteristic measuring device according to claim 1, wherein the device is configured to measure the frequency of a plurality of quartz oscillator devices, each of which is an electronic element, is mounted on a base, the characteristic measuring unit is configured as a frequency measuring unit for measuring the frequency of the quartz oscillator devices, and the control unit measures the frequency of the quartz oscillator devices using the frequency measuring unit.

9. A characteristic measuring device according to claim 8, wherein each of the pair of contact pins has a frequency adjustment unit that increases or decreases the thickness of a metal film formed on the quartz oscillator, and the control unit adjusts the frequency of the quartz oscillator by the frequency adjustment unit based on the frequency measured by the frequency measuring unit.

10. A characteristic measuring device according to claim 8 or 9, comprising a plurality of pairs of contact pins supported by a single support member, wherein the plurality of pairs of contact pins are configured to be independently expandable and contractible in the thickness direction of the sheet base, and the control unit moves the plurality of pairs of contact pins relative to the sheet base by the moving part, thereby bringing the plurality of pairs of contact pins into contact with a plurality of pairs of external connection terminals.

11. A characteristic measuring device according to claim 8 or 9, wherein the control unit moves the sheet base relative to a plurality of the pair of contact pins by the moving unit, and brings the plurality of the pair of contact pins into contact with each of the plurality of the pair of external connection terminals within a predetermined range.

12. A characteristic measurement method according to claim 4, wherein the frequency of a plurality of quartz oscillator devices, each of which is mounted on a base, is measured, and in the characteristic measurement step, the frequency of the quartz oscillator device is measured by the pair of contact pins that are in contact with the pair of external connection terminals.

13. A frequency measurement method according to claim 12, further comprising a frequency adjustment step of increasing or decreasing the thickness of a metal film formed on the quartz oscillator for each pair of contact pins, wherein the frequency adjustment step adjusts the frequency of the quartz oscillator based on the frequency measured in the characteristic measurement step.

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