Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, pattern forming method, and electronic device manufacturing method

Abstract

Provided are: an actinic ray-sensitive or radiation-sensitive resin composition comprising a resin, and a compound represented by formula (1A) or formula (2A) described in the specification; an actinic ray-sensitive or radiation-sensitive film formed using said composition; a pattern forming method using said composition; and an electronic device manufacturing method.

Description

Photosensitive or radiation-sensitive resin composition, photosensitive or radiation-sensitive film, pattern forming method, and method for manufacturing electronic devices.

[0001] The present invention relates to a photosensitive or radiation-sensitive resin composition, a photosensitive or radiation-sensitive film, a pattern-forming method, and a method for manufacturing an electronic device. More specifically, the present invention relates to a photosensitive or radiation-sensitive resin composition, a photosensitive or radiation-sensitive film, a pattern-forming method, and a method for manufacturing an electronic device that can be suitably used in ultramicrolithography processes applicable to the manufacturing processes of ultra-LSI (Large Scale Integration) and high-capacity microchips, nanoimprint mold creation processes, and high-density information recording media, as well as other photofabrication processes.

[0002] Traditionally, in the manufacturing processes of semiconductor devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integrations), microfabrication has been performed using lithography with resist compositions. In recent years, with the increasing integration of integrated circuits, there has been a growing demand for the formation of ultrafine patterns in the submicron or quarter-micron region. Accordingly, there has been a trend toward shorter exposure wavelengths, from the g-line to the i-line, and further to KrF excimer laser light. Currently, exposure machines using ArF excimer lasers with a wavelength of 193 nm as the light source have been developed. Furthermore, as a technique to further improve resolution, development of the so-called immersion method has been progressing, in which a high refractive index liquid (hereinafter also called "immersion liquid") is filled between the projection lens and the sample.

[0003] Furthermore, in addition to excimer laser light, lithography using electron beams (EB), X-rays, and extreme ultraviolet (EUV) light is also being developed. Accordingly, resist compositions that are effectively sensitive to various types of active light or radiation are being developed.

[0004] Patent Document 1 describes a positive-type resist composition characterized by containing (A1) a compound having a specific structure that generates acid upon irradiation with active light or radiation, and (B) a polymer that is insoluble or sparingly soluble in alkaline aqueous solutions and becomes soluble in alkaline aqueous solutions upon the action of the acid. Patent Document 2 also describes an electron beam, EUV, or X-ray resist composition characterized by containing (A1) a compound having a higher reduction potential than diphenyliodonium salt that generates acid upon irradiation with active light or radiation.

[0005] Japanese Patent Publication No. 2003-149800 Japanese Patent Publication No. 2004-004557

[0006] Recently, the performance requirements for resist compositions and pattern formation methods have become increasingly stringent. In particular, further improvements are needed in the LWR (Line Width Roughness) of the formed patterns. Furthermore, as the time elapsed for the resist film formed from the resist composition increases (time elapsed from immediately after the formation of the resist film (coated film of the resist composition)), the sensitivity may decrease compared to when the resist composition is used for pattern formation immediately after preparation. In other words, further improvements are needed in the time-dependent stability of the coated film.

[0007] The present invention aims to provide a photosensitive or radiation-sensitive resin composition that can form patterns with excellent LWR and also exhibits excellent temporal stability of the coated film. Furthermore, the present invention aims to provide a photosensitive or radiation-sensitive film formed using the above photosensitive or radiation-sensitive resin composition, a pattern formation method using the above photosensitive or radiation-sensitive resin composition, and a method for manufacturing an electronic device.

[0008] The inventors have found that the above problems can be solved by the following configuration.

[0009] [1] A photosensitive or radiation-sensitive resin composition containing a resin and a compound represented by formula (1A) or formula (2A).

[0010]

[0011] In formula (1A) and formula (2A), Ar １ and Ar ３ each independently represent a divalent aromatic ring group. Ar ２ each independently represent a trivalent aromatic ring group. X １ and X ２ each independently represent a single bond or a divalent linking group. Ar １１ , Ar １２ and Ar １３ each independently represent a trivalent aromatic ring group. X １１ , X １２ and X １３ each independently represent a single bond or a divalent linking group. Z ｎ－ each independently represents an anion. Each m independently represents an integer of 1 or more, and each n independently represents an integer of 1 or more.

[0012] [2] The actinic ray-sensitive or radiation-sensitive resin composition according to [1], wherein the compound represented by formula (1A) or formula (2A) is a compound represented by formula (1B) or formula (2B).

[0013]

[0014] In formula (1B) and formula (2B), X １ and X ２ each independently represent a single bond or a divalent linking group. R １ to R ３ each independently represent a substituent. At least two of R １ to R ３ may be bonded to each other to form a ring. In addition, when a plurality of R １ to R ３ are present, the plurality of R １ to R ３ may be the same or different from each other. When a plurality of R １ to R ３ are present, the plurality of R １ may be bonded to each other to form a ring, the plurality of R ２ may be bonded to each other to form a ring, and the plurality of R ３These elements may be joined together to form a ring. o represents an integer from 0 to 4. p represents an integer from 0 to 3. q represents an integer from 0 to 4. X １１ , X １２ , and X １３ Each of these independently represents a single bond or a divalent linking group. １１ ~R １３ Each of these independently represents a substituent. １１ ~R １３ At least two of these may be joined together to form a ring. １１ ~R １３ If there are multiple instances of R, then there are multiple instances of R １１ ~R １３ The elements may be identical or different from one another. １１ ~R １３ If there are multiple instances of R, then there are multiple instances of R １１ These elements may combine with each other to form a ring, and there may be multiple R elements. １２ These elements may combine with each other to form a ring, and there may be multiple R elements. １３ These elements may be joined together to form a ring. r, s, and t each independently represent an integer between 0 and 3. Z ｎ－ Each of the 'm' and 'n' independently represents an anion. Each of the 'm' and 'n' independently represents an integer of 1 or greater.

[0015] [3] The photosensitive or radiation-sensitive resin composition according to [1] or [2], wherein the compound represented by formula (1A) or formula (2A) does not have a fluorine atom-containing substituent. [4] The photosensitive or radiation-sensitive resin composition according to any one of [1] to [3], wherein the resin comprises repeating units having an acid-degradable group. [5] The photosensitive or radiation-sensitive resin composition according to any one of [1] to [4], wherein the resin comprises repeating units having a phenolic hydroxyl group.

[0016] [6] The photosensitive or radiation-sensitive resin composition according to [4], wherein the repeating unit having the acid-degradable group comprises a repeating unit represented by formula (P1).

[0017]

[0018] In formula (P1), R ｂ１ and R ｂ２ each independently represent a hydrogen atom or an alkyl group. L ｂ１ represents a single bond or -COO-. Ar ｂ１ represents an aromatic ring group having a valency of s+t+1. Y ｂ１ represents -OR ｂ or -COOR ｂ R ｂ represents a leaving group. R ｂ３ represents a substituent different from -OR ｂ and -COOR ｂ s represents an integer of 1 or more. t represents an integer of 0 or more. R ｂ１ and Ar ｂ１ may be bonded to each other via a single bond or a divalent linking group to form a ring, R ｂ and R ｂ３ may be bonded to each other via a single bond or a divalent linking group to form a ring, R ｂ３ groups may be bonded to each other via a single bond or a divalent linking group to form a ring, and R ｂ groups may be bonded to each other via a single bond or a divalent linking group to form a ring.

[0019] [7] The actinic ray-sensitive or radiation-sensitive resin composition according to any one of [1] to [6], wherein Z ｎ－ in the above formula (1A) or formula (2A) has an organic anion represented by formula (a-1).

[0020]

[0021] In the formula, Ar ａ１ represents a monovalent aromatic ring group or a monovalent aliphatic hydrocarbon group.

[0022] [8] The actinic ray-sensitive or radiation-sensitive resin composition according to any one of [1] to [6], wherein Z ｎ－ in the above formula (1A) or formula (2A) has an organic anion represented by formula (b-1).

[0023]

[0024] In the formula, Ar ｂ１This represents a monovalent aromatic ring group.

[0025] [9] The photosensitive or radiation-sensitive resin composition according to any one of [1] to [8], wherein the composition contains a photoacid generator and an acid diffusion control agent, and the content of the acid diffusion control agent relative to the photoacid generator is 50 mol% or more.

[10] The photosensitive or radiation-sensitive resin composition according to any one of [1] to [9], wherein the composition contains a photoacid generator and an acid diffusion control agent, and the content of the acid diffusion control agent relative to the photoacid generator is 100 mol% or more.

[11] A photosensitive or radiation-sensitive film formed using the photosensitive or radiation-sensitive resin composition according to any one of [1] to

[10] .

[0026]

[12] A pattern forming method comprising the steps of: forming a resist film on a substrate using a photosensitive or radiation-sensitive resin composition described in any one of [1] to

[10] ; exposing the resist film; and developing the exposed resist film using a developer.

[13] A method for manufacturing an electronic device, comprising the pattern forming method described in

[12] .

[0027] The present invention provides a photosensitive or radiation-sensitive resin composition that can form patterns with excellent LWR and also exhibits excellent temporal stability of the coated film. Furthermore, the present invention provides a photosensitive or radiation-sensitive film formed using the above photosensitive or radiation-sensitive resin composition, a pattern formation method using the above photosensitive or radiation-sensitive resin composition, and a method for manufacturing an electronic device.

[0028] The present invention will now be described in detail. The following descriptions of constituent elements may be based on typical embodiments of the present invention, but the present invention is not limited to such embodiments.

[0029] In this specification, a numerical range expressed using "~" means a range that includes the numbers written before and after "~" as the lower and upper limits. Also in this specification, if there are two or more types of a component, the "content" of that component means the total content of those two or more types of components. In this specification, in numerical ranges described in steps, the upper or lower limit stated in one numerical range may be replaced with the upper or lower limit of another numerical range described in steps. Also, in numerical ranges described in this specification, the upper or lower limit stated in one numerical range may be replaced with the value shown in the example. In this specification, a combination of two or more preferred embodiments is a more preferred embodiment.

[0030] In this specification, "active light" or "radiation" means, for example, the emission spectrum of a mercury lamp, far ultraviolet light represented by an excimer laser, extreme ultraviolet light (EUV), X-rays, soft X-rays, and electron beams (EB). In this specification, "light" means active light or radiation. In this specification, "exposure" includes not only exposure with emission spectrum of a mercury lamp, far ultraviolet light represented by an excimer laser, extreme ultraviolet light, and X-rays, but also drawing with particle beams such as electron beams and ion beams, unless otherwise specified. In this specification, "~" is used to mean that the values ​​written before and after it are included as the lower and upper limits.

[0031] In this specification, (meth)acrylate refers to at least one of acrylate and methacrylate. Also, (meth)acrylic acid refers to at least one of acrylic acid and methacrylic acid.

[0032] In this specification, the weight-average molecular weight (Mw), number-average molecular weight (Mn), and degree of dispersion (also called molecular weight distribution) (Mw / Mn) of a resin are defined as polystyrene equivalent values ​​obtained by GPC (Gel Permeation Chromatography) measurement using a GPC (Gel Permeation Chromatography) instrument (HLC-8120GPC manufactured by Tosoh Corporation) (solvent: tetrahydrofuran, flow rate (sample injection volume): 10 μL, column: TSK gel Multipore HXL-M manufactured by Tosoh Corporation, column temperature: 40°C, flow rate: 1.0 mL / min, detector: differential refractive index detector).

[0033] In this specification, regarding the notation of groups (atomic groups), unless contrary to the spirit of the present invention, notations that do not specify substituted or unsubstituted include both groups with and without substituents. For example, "alkyl group" includes not only alkyl groups without substituents (unsubstituted alkyl groups) but also alkyl groups with substituents (substituted alkyl groups). Furthermore, in this specification, "organic group" means a group containing at least one carbon atom. Unless otherwise specified, monovalent substituents are preferred. Examples of substituents include monovalent nonmetallic atomic groups excluding hydrogen atoms, and can be selected from, for example, the following substituent T.

[0034] (Substituent T) Substituents T include halogen atoms such as fluorine, chlorine, bromine, and iodine; alkoxy groups such as methoxy, ethoxy, and tert-butoxy; cycloalkyloxy groups; aryloxy groups such as phenoxy and p-tolyloxy; alkoxycarbonyl groups such as methoxycarbonyl and butoxycarbonyl; cycloalkyloxycarbonyl groups; aryloxycarbonyl groups such as phenoxycarbonyl; acyloxy groups such as acetoxy, propionyloxy, and benzoyloxy; acetyl, benzoyl, isobutyryl, acryloyl, methacryloyl, and methoxalyl groups, etc. Examples of substituents include acyl groups; sulfanyl groups; alkylsulfanyl groups such as methylsulfanyl and tert-butylsulfanyl groups; arylsulfanyl groups such as phenylsulfanyl and p-tolylsulfanyl groups; alkylsulfonyl groups; arylsulfonyl groups; alkyl groups; alkenyl groups; cycloalkyl groups; aryl groups; heteroaryl groups; hydroxyl groups; carboxyl groups; formyl groups; sulfo groups; cyano groups; alkylaminocarbonyl groups; arylaminocarbonyl groups; sulfonamide groups; silyl groups; amino groups; carbamoyl groups; and non-aromatic heterocyclic groups such as tetrahydrofuranyl and morpholino groups. Furthermore, if these substituents can have one or more substituents, groups having one or more substituents selected from the substituents listed above (for example, monoalkylamino groups, dialkylamino groups, arylamino groups, trifluoromethyl groups, etc.) are also included as examples of substituent T.

[0035] In this specification, the bonding direction of the divalent group as expressed is not limited unless otherwise specified. For example, in a compound represented by the formula "X-Y-Z", if Y is -COO-, Y may also be -CO-O- or -O-CO-. The above compound may also be "X-CO-O-Z" or "X-O-CO-Z".

[0036] In this specification, the acid dissociation constant (pKa) refers to the pKa in aqueous solution, and specifically, it is a value calculated using the following software package 1 based on a database of Hammett substituent constants and known literature values. All pKa values ​​described herein are calculated using this software package. Software package 1: Advanced Chemistry Development (ACD / Labs) Software V8.14 for Solaris (1994-2007 ACD / Labs).

[0037] Furthermore, pKa can also be determined by molecular orbital calculations. Specifically, this method involves calculating the H₂ in aqueous solution based on the thermodynamic cycle. ＋ One method is to calculate the dissociation free energy. ＋ The dissociation free energy can be calculated using, for example, the Density Functional Theory (DFT), but various other methods have been reported in the literature and are not limited to this. Several software programs exist that can perform DFT, such as Gaussian 16.

[0038] In this specification, pKa refers to the value calculated using software package 1 based on a database of Hammett substituent constants and known literature values, as described above. However, if pKa cannot be calculated by this method, the value obtained by Gaussian 16 based on DFT (density functional theory) shall be adopted. In this specification, pKa refers to "pKa in aqueous solution" as described above. However, if pKa in aqueous solution cannot be calculated, "pKa in dimethyl sulfoxide (DMSO) solution" shall be adopted.

[0039] In this specification, "solids" means components contained in a photosensitive or radiation-sensitive resin composition that form a photosensitive or radiation-sensitive film, and does not include solvents. Furthermore, any component contained in a photosensitive or radiation-sensitive resin composition that forms a photosensitive or radiation-sensitive film shall be considered a solid, even if its state is liquid.

[0040] [Photosensitive or Radiation-Sensitive Resin Composition] The photosensitive or radiation-sensitive resin composition of the present invention (also referred to as "the composition of the present invention") is a photosensitive or radiation-sensitive resin composition containing a resin and a compound represented by formula (1A) or formula (2A).

[0041]

[0042] In formula (1A) and formula (2A), Ar １ and Ar ３ Each of these independently represents a divalent aromatic ring group. Ar ２ This represents a trivalent aromatic ring group. １ and X ２ Each of these independently represents a single bond or a divalent linking group. １１ Ar １２ , and Ar １３ Each of these independently represents a trivalent aromatic ring group. １１ , X １２ , and X １３ Each of these independently represents a single bond or a divalent linking group. ｎ－ Each of the 'm' and 'n' independently represents an anion. Each of the 'm' and 'n' independently represents an integer of 1 or greater.

[0043] According to the composition of the present invention with the above configuration, although the reason is not clear, it is possible to form a pattern with excellent LWR and also exhibit excellent long-term stability of the coated film.

[0044] The composition of the present invention is preferably a resist composition, and may be either a positive-type resist composition or a negative-type resist composition. The composition of the present invention may be a resist composition for alkaline development or a resist composition for organic solvent development. The composition of the present invention may be either a chemically amplified resist composition or a non-chemically amplified resist composition. A photosensitive or radiation-sensitive film can be formed using the composition of the present invention. The photosensitive or radiation-sensitive film formed using the composition of the present invention is preferably a resist film.

[0045] [Compound represented by formula (1A) or formula (2A)] The composition of the present invention contains a compound represented by formula (1A) or formula (2A) (hereinafter also referred to as "compound (A)"). Ar １ and Ar ３ represents a divalent aromatic ring group. The above aromatic ring group may be monocyclic or polycyclic, with monocyclic being preferred. The above aromatic ring group may be either an aromatic hydrocarbon group or an aromatic heterocyclic group, with aromatic hydrocarbon groups being preferred. Examples of the above aromatic hydrocarbon group include groups containing aromatic hydrocarbon rings having 6 to 18 carbon atoms, such as benzene, naphthalene, anthracene, and naphthacene. The above aromatic heterocyclic group preferably contains at least one heteroatom selected from nitrogen, oxygen, and sulfur atoms as a ring member atom. Examples of aromatic heterocyclic groups include groups containing aromatic heterocyclic rings having 4 to 20 ring member atoms, such as thiophene, furan, pyridine, pyrrole, benzothiophene, benzofuran, benzopyrrole, triazine, imidazole, benzimidazole, triazole, thiadiazole, and thiazole.

[0046] Ar １ and Ar ３ The divalent aromatic ring group represented by Ar may have substituents. １ and Ar ３Examples of the substituent that the divalent aromatic ring group represented by may have include the above-mentioned substituent T, such as an alkyl group (for example, having 1 to 15 carbon atoms, preferably 1 to 6 carbon atoms), a cycloalkyl group (for example, having 3 to 15 carbon atoms, preferably 3 to 6 carbon atoms), an aromatic ring group (for example, having 3 to 12 carbon atoms. In the case of an aromatic heterocyclic group, specific examples of ring member atoms include a sulfur atom, a nitrogen atom, and an oxygen atom), an alkoxy group (for example, having 1 to 15 carbon atoms, preferably 1 to 6 carbon atoms), an aryloxy group (for example, having 6 to 14 carbon atoms), an alkylthio group (for example, having 1 to 15 carbon atoms, preferably 1 to 6 carbon atoms), an arylthio group (for example, having 6 to 14 carbon atoms), an acyloxy group (for example, having 2 to 15 carbon atoms, preferably 2 to 6 carbon atoms), an alkoxycarbonyl group (for example, having 2 to 15 carbon atoms, preferably 2 to 6 carbon atoms), a carboxy group, a cycloalkyloxycarbonyl group (for example, having 4 to 15 carbon atoms, preferably 4 to 8 carbon atoms), an aryloxycarbonyl group (for example, having 7 to 15 carbon atoms, preferably 7 to 8 carbon atoms), or a heteroaryloxy group (for example, having 5 or 6 ring members) is preferable. If possible, the groups exemplified as the above substituents may further have the above substituents. Ar １ and Ar ３ The number of substituents possessed by the divalent aromatic ring group represented by is preferably 0 to 4, more preferably 0 to 3.

[0047] Ar ２ , Ar １１ , Ar １２ , and Ar １３represents a trivalent aromatic ring group. The above aromatic ring group may be either monocyclic or polycyclic, and a monocyclic ring is preferable. The above aromatic ring group may be either an aromatic hydrocarbon group or an aromatic heterocyclic group, and an aromatic hydrocarbon group is preferable. Examples of the aromatic hydrocarbon group include groups containing an aromatic hydrocarbon ring having 6 to 18 carbon atoms such as benzene, naphthalene, anthracene, and naphthacene. The aromatic heterocyclic group preferably contains at least one heteroatom selected from a nitrogen atom, an oxygen atom, and a sulfur atom as a ring member atom. Examples of the aromatic heterocyclic group include groups containing an aromatic heterocycle having 4 to 20 ring member atoms such as thiophene, furan, pyridine, pyrrole, benzothiophene, benzofuran, benzopyrrole, triazine, imidazole, benzimidazole, triazole, thiadiazole, and thiazole.

[0048] Ar ２ , Ar １１ , Ar １２ , and Ar １３ the trivalent aromatic ring group represented by may have a substituent. Ar ２ , Ar １１ , Ar １２ , and Ar １３Substituents that may be present on the trivalent aromatic ring group represented by include, for example, the substituent T mentioned above, alkyl groups (e.g., 1 to 15 carbon atoms, preferably 1 to 6 carbon atoms), cycloalkyl groups (e.g., 3 to 15 carbon atoms, preferably 3 to 6 carbon atoms), aromatic ring groups (e.g., 3 to 12 carbon atoms; in the case of aromatic heterocyclic groups, specific examples of ring member atoms include sulfur atoms, nitrogen atoms, and oxygen atoms), alkoxy groups (e.g., 1 to 15 carbon atoms, preferably 1 to 6 carbon atoms), aryloxy groups (e.g., 6 to 14 carbon atoms), alkylthio Preferred substituents include groups (e.g., C1-C15, preferably C1-C6), arylthio groups (e.g., C6-C14), acyloxy groups (e.g., C2-C15, preferably C2-C6), alkoxycarbonyl groups (e.g., C2-C15, preferably C2-C6), carboxyl groups, cycloalkyloxycarbonyl groups (e.g., C4-C15, preferably C4-C8), aryloxycarbonyl groups (e.g., C7-C15, preferably C7-C8), or heteroaryloxy groups (e.g., ring member count of 5 or 6). The groups exemplified above as substituents may have further substituents if possible. ２ Ar １１ Ar １２ , and Ar １３ The number of substituents on the trivalent aromatic ring group represented by is preferably 0 to 4, and more preferably 0 to 3.

[0049] X １ , X ２ , X １１ , X １２ , and X １３ The divalent linking groups represented are not particularly limited, but examples of divalent linking groups include -O-, -S-, -CO-, -NR-, -SO-, and -SO ２Examples include alkylene groups, alkenylene groups, and groups formed by combining two or more of these. R represents a hydrogen atom or an alkyl group. The alkyl group is not particularly limited, but alkyl groups having 1 to 10 carbon atoms are preferred, and alkyl groups having 1 to 4 carbon atoms are more preferred. The number of carbon atoms in the alkylene group is not particularly limited. As for the alkylene group, for example, alkylene groups having 1 to 10 carbon atoms such as methylene groups, ethylene groups, propylene groups, and butylene groups are preferred, and alkylene groups having 1 to 4 carbon atoms are more preferred. The alkylene group may have substituents. The number of carbon atoms in the alkenylene group is not particularly limited, but 2 to 10 carbon atoms are preferred. The alkenylene group may have substituents.

[0050] Each m independently represents an integer of 1 or more, and each n independently represents an integer of 1 or more. m is preferably 1 to 4, more preferably 1 or 2. n is preferably 1 to 4, more preferably 1 or 2. m represents the valence of the cation and is the same integer as n, which represents the valence of the anion.

[0051] Z ｎ－ Each of these independently represents an anion. When n represents an integer greater than or equal to 2, the anion is, for example, one Z ｎ－ It may be, or n Z － It may be. Z ｎ－ The anions represented by are not particularly limited, but include organic anions.

[0052] The organic anion may be either a monovalent or polyvalent (2 or more valent) organic anion, but a monovalent organic anion is preferred. The organic anion is preferably one with a remarkably low ability to undergo nucleophilic reactions, and a non-nucleophilic organic anion (hereinafter also referred to as "non-nucleophilic anion") is more preferred.

[0053] Examples of non-nucleophilic anions include sulfonate anions (aliphatic sulfonate anions, aromatic sulfonate anions, camphor sulfonate anions, and the like), carboxylate anions (aliphatic carboxylate anions, aromatic carboxylate anions, aralkyl carboxylate anions, and the like), sulfonylimide anions, bis(alkylsulfonyl)imide anions, and tris(alkylsulfonyl)methide anions.

[0054] The aliphatic moiety in the aliphatic sulfonate anion and the aliphatic carboxylate anion may be a linear or branched alkyl group or a cycloalkyl group, and a linear or branched alkyl group having 1 to 30 carbon atoms or a cycloalkyl group having 3 to 30 carbon atoms is preferred. The alkyl group may be, for example, a fluoroalkyl group (which may have a substituent other than a fluorine atom, and may be a perfluoroalkyl group).

[0055] As the aryl group in the aromatic sulfonate anion and the aromatic carboxylate anion, an aryl group having 6 to 14 carbon atoms is preferred, and examples thereof include a phenyl group, a tolyl group, and a naphthyl group.

[0056] The alkyl group, cycloalkyl group, and aryl group mentioned above may have a substituent. Examples of the substituent include a nitro group, halogen atoms such as a fluorine atom and a chlorine atom, a carboxy group, a hydroxy group, an amino group, a cyano group, an alkoxy group (preferably having 1 to 15 carbon atoms), an alkyl group (preferably having 1 to 10 carbon atoms), a cycloalkyl group (preferably having 3 to 15 carbon atoms), an aryl group (preferably having 6 to 14 carbon atoms), an alkoxycarbonyl group (preferably having 2 to 7 carbon atoms), an acyl group (preferably having 2 to 12 carbon atoms), an alkoxycarbonyloxy group (preferably having 2 to 7 carbon atoms), an alkylthio group (preferably having 1 to 15 carbon atoms), an alkylsulfonyl group (preferably having 1 to 15 carbon atoms), an alkyliminosulfonyl group (preferably having 1 to 15 carbon atoms), and an aryloxysulfonyl group (preferably having 6 to 20 carbon atoms).

[0057] In aralkyl carboxylate anions, aralkyl groups having 7 to 14 carbon atoms are preferred. Examples of aralkyl groups having 7 to 14 carbon atoms include benzyl, phenethyl, naphthylmethyl, naphthylethyl, and naphthylbutyl groups.

[0058] An example of a sulfonylimid anion is the saccharin anion.

[0059] In bis(alkylsulfonyl)imido anions and tris(alkylsulfonyl)methide anions, alkyl groups having 1 to 5 carbon atoms are preferred. Substituents for these alkyl groups include halogen atoms, halogen-substituted alkyl groups, alkoxy groups, alkylthio groups, alkyloxysulfonyl groups, aryloxysulfonyl groups, and cycloalkylaryloxysulfonyl groups, with fluorine atoms or fluorine-substituted alkyl groups being preferred. Furthermore, the alkyl groups in bis(alkylsulfonyl)imido anions may be bonded to each other to form a ring structure.

[0060] As non-nucleophilic anions, aliphatic sulfonic acid anions in which at least the α position of the sulfonic acid is substituted with a fluorine atom, aromatic sulfonic acid anions substituted with a fluorine atom or a group having a fluorine atom, bis(alkylsulfonyl)imide anions in which the alkyl group is substituted with a fluorine atom, or tris(alkylsulfonyl)methide anions in which the alkyl group is substituted with a fluorine atom are also preferred. Among these, perfluoroaliphatic sulfonic acid anions (preferably having 4 to 8 carbon atoms) or benzenesulfonic acid anions having a fluorine atom are more preferred, and nonafluorobutanesulfonic acid anions, perfluorooctanesulfonic acid anions, pentafluorobenzenesulfonic acid anions, or 3,5-bis(trifluoromethyl)benzenesulfonic acid anions are even more preferred.

[0061] As a non-nucleophilic anion, the anion represented by the following formula (AN1) is also preferred.

[0062]

[0063] In formula (AN1), R １ and R ２ Each of these independently represents a hydrogen atom or a substituent. Examples of substituents include hydrocarbon groups, hydroxyl groups, oxy hydrocarbon groups, oxycarbonyl hydrocarbon groups, amino groups, hydrocarbon-substituted amino groups, and hydrocarbon-substituted amide groups, and are -R', -OH, -OR', -OCOR', -NH ２ ,-NR' ２ , -NHR', or -NHCOR' are preferred. R' is a monovalent hydrocarbon group. Among them, R １ and R ２ Each of these is independently preferably a hydrocarbon group (cycloalkyl group is preferred) or a hydrogen atom.

[0064] Examples of monovalent hydrocarbon groups represented by R' above include alkyl groups such as methyl, ethyl, propyl, and butyl groups; alkenyl groups such as ethenyl, propenyl, and butenyl groups; monovalent linear or branched hydrocarbon groups such as alkynyl groups such as ethynyl, propynyl, and butynyl groups; cycloalkyl groups such as cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, norbornyl, and adamantyl groups; monovalent alicyclic hydrocarbon groups such as cyclopropenyl, cyclobutenyl, cyclopentenyl, and norbornenyl groups; aryl groups such as phenyl, tolyl, xylyl, mesityl, naphthyl, methylnaphthyl, anthryl, and methylanthryl groups; and monovalent aromatic hydrocarbon groups such as benzyl, phenethyl, phenylpropyl, naphthylmethyl, and anthrylmethyl groups.

[0065] L represents a divalent linking group. Examples of divalent linking groups include -CO-, -NH-, -O-, -S-, -SO-, and -SO ２ Examples of divalent linking groups include alkylene groups (preferably having 1 to 6 carbon atoms), cycloalkylene groups (preferably having 3 to 15 carbon atoms), alkenylene groups (preferably having 2 to 6 carbon atoms), and divalent linking groups formed by combining multiples thereof. Among these, examples of divalent linking groups include -O-CO-O-, -COO-, -CONH-, -CO-, -O-, and -SO ２-, -O-CO-O-alkylene group-, -COO-alkylene group-, or -CONH-alkylene group- are preferred, and -O-CO-O-, -O-CO-O-alkylene group-, -COO-, -CONH-, -SO ２ - or -COO-alkylene group- is more preferred.

[0066] For L, a group represented by the following formula (AN1-1) is preferred. * ａ - (CR ２ａ ２ ) Ｘ -Q- (CR ２ｂ ２ ) Ｙ - * ｂ (AN1-1)

[0067] In formula (AN1-1), * ａ R in equation (AN1) ３ This indicates the connection point with [the other element]. ｂ This is -C(R) in equation (AN1). １ ) (Caution ２ ) - Represents the connection position with . X and Y each independently represent integers from 0 to 10, preferably integers from 0 to 3. R ２ａ and R ２ｂ Each of these independently represents a hydrogen atom or a substituent. ２ａ and R ２ｂ If there are multiple instances of each, then there are multiple instances of R ２ａ and R ２ｂ These may be the same or different. However, if Y is 1 or greater, -C(R) in equation (AN1) １ ) (Caution ２ )- and CR that bind directly ２ｂ ２ In R ２ｂ is anything other than a fluorine atom. Q is * Ａ -O-CO-O-* Ｂ , * Ａ -CO-* Ｂ , * Ａ -CO-O-* Ｂ , * Ａ -O-CO-* Ｂ , * Ａ -O-* Ｂ , * Ａ -S-*Ｂ , or, * Ａ -SO ２ - * Ｂ This represents the condition that X+Y in equation (AN1-1) is 1 or greater, and R in equation (AN1-1) is greater than or equal to 1. ２ａ and R ２ｂ If all of them are hydrogen atoms, then Q is * Ａ -O-CO-O-* Ｂ , * Ａ -CO-* Ｂ , * Ａ -O-CO-* Ｂ , * Ａ -O-* Ｂ , * Ａ -S-* Ｂ , or, * Ａ -SO ２ - * Ｂ This represents. * Ａ R in equation (AN1) ３ This indicates the connection position on the side, * Ｂ This is -SO in equation (AN1). ３ － This indicates the connection point on the side.

[0068] In formula (AN1), R ３ R represents an organic group. The above organic group is not particularly limited and may be a linear group (e.g., a linear alkyl group), a branched group (e.g., a branched alkyl group such as a t-butyl group), or a cyclic group. The above organic group may have substituents and may have heteroatoms (oxygen atom, sulfur atom, and / or nitrogen atom, etc.). Among these, R ３ It is preferable that the organic group has a cyclic structure. The cyclic structure may be monocyclic or polycyclic and may have substituents. It is preferable that the ring in the organic group containing the cyclic structure is directly bonded to L in formula (AN1). The organic group having the cyclic structure may have, for example, heteroatoms (oxygen atom, sulfur atom, and / or nitrogen atom). The heteroatoms may be substituted for one or more carbon atoms forming the cyclic structure.

[0069] The organic group having the above-mentioned cyclic structure is preferably a cyclic hydrocarbon group, a lactone ring group, or a sultone ring group, with a cyclic hydrocarbon group being more preferred. The above-mentioned cyclic hydrocarbon group is preferably a monocyclic or polycyclic cycloalkyl group. These groups may have substituents. The above-mentioned cycloalkyl group may be monocyclic (e.g., a cyclohexyl group) or polycyclic (e.g., an adamantyl group), and the number of carbon atoms is preferably 5 to 12.

[0070] R ３ It is preferable that it contains a halogen atom. ３ The halogen atoms included are preferably fluorine atoms or iodine atoms, with iodine atoms being more preferred. If iodine atoms are present, a structure in which they are directly bonded to carbon atoms on the aromatic ring is preferred. When the resist composition of the present invention is used as an EUV resist, a larger number of halogen atoms is preferable from the viewpoint of EUV light absorption efficiency.

[0071] Examples of anions represented by formula (AN1) include those described in

[0040] to

[0044] of Japanese Patent Publication No. 2018-155908,

[0184] to

[0185] and

[0197] to

[0198] of Japanese Patent Publication No. 2021-128331,

[0124] to

[0125] and

[0137] to

[0138] of International Publication No. 2022 / 064863, and

[0056] to

[0061] of Japanese Patent Publication No. 2023-177048, the above descriptions are incorporated herein by reference.

[0072] As a non-nucleophilic anion, the anion represented by the following formula (AN2) is also preferred.

[0073]

[0074] In formula (AN2), o represents an integer from 1 to 3. p represents an integer from 0 to 10. q represents an integer from 0 to 10. L represents a divalent linking group. The definition of L is the same as that of L in formula (AN1).

[0075] Xf represents a hydrogen atom, a fluorine atom, an alkyl group substituted with one or more fluorine atoms, or an organic group without a fluorine atom. The number of carbon atoms in this alkyl group is preferably 1 to 10, more preferably 1 to 4. As the alkyl group substituted with one or more fluorine atoms, a perfluoroalkyl group is preferred. Xf is preferably a fluorine atom or a perfluoroalkyl group having 1 to 4 carbon atoms, and fluorine atom or CF ３ It is more preferable that all Xf are fluorine atoms, and even more preferable that all Xf are fluorine atoms.

[0076] R ４ and R ５ Each of these independently represents a hydrogen atom, a fluorine atom, an alkyl group, or an alkyl group substituted with one or more fluorine atoms. ４ and R ５ If multiple instances exist, R ４ and R ５ These may be the same or different. ４ and R ５ The alkyl group represented by preferably has 1 to 4 carbon atoms. The alkyl group may have substituents. ４ and R ５ Hydrogen atoms are preferred as the element.

[0077] W represents an organic group containing a cyclic structure. Among these, a cyclic organic group is preferred. The carbon atoms constituting the cyclic organic group (carbon atoms contributing to ring formation) may be carbonyl carbons. Examples of cyclic organic groups include alicyclic groups, aryl groups, and heterocyclic groups. Alicyclic groups may be monocyclic or polycyclic. Examples of monocyclic alicyclic groups include monocyclic cycloalkyl groups such as cyclopentyl groups, cyclohexyl groups, and cyclooctyl groups. Examples of polycyclic alicyclic groups include polycyclic cycloalkyl groups such as norbornyl groups, tricyclodecanyl groups, tetracyclodecanyl groups, tetracyclododecanyl groups, and adamantyl groups. Among these, alicyclic groups having a bulky structure with 7 or more carbon atoms, such as norbornyl groups, tricyclodecanyl groups, tetracyclodecanyl groups, tetracyclododecanyl groups, and adamantyl groups, are preferred.

[0078] The aryl group may be monocyclic or polycyclic. Examples of the above aryl group include the phenyl group, naphthyl group, phenanthryl group, and anthryl group. The heterocyclic group may be monocyclic or polycyclic. The heterocyclic group may or may not be aromatic. Examples of aromatic heterocyclic rings include the furan ring, thiophene ring, benzofuran ring, benzothiophene ring, dibenzofuran ring, dibenzothiophene ring, and pyridine ring. Examples of heterocyclic rings that are not aromatic include the tetrahydropyran ring, lactone ring, sultone ring, and decahydroisoquinoline ring. The heterocyclic ring in the heterocyclic group is preferably a furan ring, thiophene ring, pyridine ring, or decahydroisoquinoline ring.

[0079] The above-mentioned cyclic organic group may have substituents. Examples of substituents include alkyl groups (which may be linear or branched, preferably having 1 to 12 carbon atoms), cycloalkyl groups (which may be monocyclic, polycyclic, or spirocyclic, preferably having 3 to 20 carbon atoms), aryl groups (preferably having 6 to 14 carbon atoms), hydroxyl groups, alkoxy groups, ester groups, amide groups, urethane groups, ureido groups, thioether groups, sulfonamide groups, and sulfonic acid ester groups.

[0080] It is preferable that W contains halogen atoms. Preferably, the halogen atoms in W are fluorine atoms or iodine atoms, with iodine atoms being more preferable. If iodine atoms are present, a structure in which they are directly bonded to carbon atoms on an aromatic ring is preferred. When the resist composition of the present invention is used as an EUV resist, a larger number of halogen atoms is preferable from the viewpoint of EUV light absorption efficiency.

[0081] Anions represented by formula (AN2) include SO ３ － -CF ２ -CH ２ -OCO-(L) ｑ’ -W, SO ３ － -CF ２ -CHF-CH ２ -OCO-(L)ｑ’ -W, SO ３ － -CF ２ -COO-(L) ｑ’ -W, SO ３ － -CF ２ -CF ２ -CH ２ -CH ２ - (L) ｑ -W, or SO ３ － -CF ２ -CH(CF ３ )-OCO-(L) ｑ’ -W is preferred. q' represents an integer from 0 to 10. L, q, and W are the same as in formula (AN2).

[0082] Anions represented by formula (AN2) include

[0076] in International Publication No. 2023 / 157455,

[0071] to

[0089] in Japanese Patent Publication No. 2021-081708,

[0033] to

[0045] in Japanese Patent Publication No. 2018-005224,

[0031] to

[0039] in Japanese Patent Publication No. 2018-025789, and Japanese Patent Publication No. 2021 Examples include the anions described in

[0176] to

[0183] and

[0186] to

[0196] of Publication No. 128331,

[0116] to

[0123] and

[0126] to

[0136] of International Publication No. 2022 / 064863, and

[0076] of International Publication No. 2023 / 157455, which are incorporated herein by reference.

[0083] As a non-nucleophilic anion, an aromatic sulfonic acid anion represented by the following formula (AN3) is also preferred.

[0084]

[0085] In formula (AN3), Ar represents an aryl group (such as a phenyl group) and may further have substituents other than a sulfonic acid anion and a -(D-B) group. Examples of further substituents include a fluorine atom and a hydroxyl group. n represents an integer of 0 or more. n is preferably 1 to 4, more preferably 2 to 3, and even more preferably 3.

[0086] D represents a single bond or a divalent linking group. Examples of divalent linking groups include ether groups, thioether groups, carbonyl groups, sulfoxide groups, sulfone groups, sulfonic acid ester groups, ester groups, and groups consisting of two or more combinations thereof.

[0087] B represents a hydrocarbon group. B is preferably an aliphatic hydrocarbon group which may have substituents, and more preferably an isopropyl group, a cyclohexyl group, or an aryl group which may have further substituents (such as a tricyclohexylphenyl group).

[0088] It is preferable that B contains halogen atoms. Preferably, the halogen atoms in B are fluorine atoms or iodine atoms, with iodine atoms being more preferable. If iodine atoms are present, a structure in which they are directly bonded to carbon atoms on an aromatic ring is preferred. When the resist composition is used as an EUV resist, a larger number of halogen atoms is preferable from the viewpoint of EUV light absorption efficiency.

[0089] Examples of anions represented by formula (AN3) include those described in

[0029] to

[0034] of Japanese Patent Publication No. 2018-159744,

[0045] of Japanese Patent Publication No. 2018-155908,

[0037] to

[0055] and

[0062] to

[0064] of Japanese Patent Publication No. 2023-177048, the above descriptions are incorporated herein by reference.

[0090] As a non-nucleophilic anion, disulfonamide anions are also preferred. Disulfonamide anions include, for example, N － (SO ２ -R ｑ ) ２ This is an anion represented by R. ｑ R represents an alkyl group which may have substituents, preferably a fluoroalkyl group, and more preferably a perfluoroalkyl group. ｑ They may be joined to each other to form a ring. Two R ｑ The group formed by the bonding of these atoms is preferably an alkylene group, which may have substituents, preferably a fluoroalkylene group, and more preferably a perfluoroalkylene group. The alkylene group preferably has 2 to 4 carbon atoms.

[0091] Furthermore, non-nucleophilic anions include those represented by the following formulas (d1-1) to (d1-4).

[0092]

[0093] In formula (d1-1), R ５１ represents a hydrocarbon group (e.g., an aryl group such as a phenyl group) which may have substituents (e.g., a hydroxyl group). Examples of anions represented by formula (d1-1) include

[0041] to

[0047] in JP 2017-219836,

[0026] to

[0028] in JP 2018-155902,

[0040] to

[0041] and

[0128] in JP 2020-154212,

[0049] to

[0061] and

[0278] to

[0279] in JP 2021-091666, and International Publication No. 2022 / Examples of anions described in

[0150] to

[0154] of JP 064863,

[0013] to

[0015] of JP 2022-077505,

[0026] to

[0031] and

[0050] to

[0051] of JP 2022-141598,

[0147] of JP 2023-108593, and

[0088] of International Publication No. 2023 / 157455 are included, and the above descriptions are incorporated herein by reference.

[0094] In formula (d1-2), Z ２ｃ represents a hydrocarbon group having 1 to 30 carbon atoms, which may have substituents (however, carbon atoms adjacent to S are not substituted with fluorine atoms). ２ｃ The hydrocarbon group in the above may be linear, branched, or have a cyclic structure. Furthermore, the carbon atoms in the hydrocarbon group (preferably, the ring member carbon atoms when the hydrocarbon group has a cyclic structure) may be carbonyl carbons (-CO-). Examples of the hydrocarbon group include a group having a norbornyl group which may have substituents. The carbon atoms in the norbornyl group may also be carbonyl carbons.

[0095] The anion represented by formula (d1-2) is preferably different from the anions represented by formulas (AN1) to (AN3) described above. For example, Z２ｃ A group other than an aryl group is preferred. Also, Z ２ｃ In, -SO ３ － For Z, the atoms at the α and β positions are preferably atoms other than carbon atoms that have a fluorine atom as a substituent. ２ｃ is, -SO ３ － In relation to this, the atom at the α position and / or the atom at the β position are preferably ring member atoms in the cyclic group.

[0096] In formula (d1-3), R ５２ represents an organic group (preferably a hydrocarbon group having a fluorine atom), Y ３ represents a linear, branched, or cyclic alkylene group, arylene group, or carbonyl group, and Rf represents a hydrocarbon group. Examples of anions represented by formula (d1-3) include those described in

[0040] to

[0046] of Japanese Patent Publication No. 2019-211751,

[0039] to

[0047] of Japanese Patent Publication No. 2021-128331,

[0043] to

[0060] of Japanese Patent Publication No. 2021-165824, and

[0062] and

[0075] of International Publication No. 2023 / 119910, the above descriptions are incorporated herein by reference.

[0097] In formula (d1-4), R ５３ and R ５４ Each of these independently represents an organic group (preferably a hydrocarbon group having a fluorine atom). ５３ and R ５４ They may be joined to each other to form a ring.

[0098] Furthermore, anion represented by the following formula (b-1) can also be mentioned as a non-nucleophilic anion. In one preferred embodiment, the above Z in formula (1A) or formula (2A) ｎ－ However, it is preferable to have an organic anion represented by formula (b-1). In another preferred embodiment, the above Z in formula (1A) or formula (2A) is also preferable. ｎ－ However, it is preferable that it be an organic anion represented by formula (b-1).

[0099]

[0100] In the formula, Ar ｂ１This represents a monovalent aromatic ring group.

[0101] In formula (b-1), Ar ｂ１ represents a monovalent aromatic ring group. The above aromatic ring group may be monocyclic or polycyclic, with monocyclic being preferred. The above aromatic ring group may be either an aromatic hydrocarbon group or an aromatic heterocyclic group, with aromatic hydrocarbon groups being preferred. Examples of the above aromatic hydrocarbon group include groups containing aromatic hydrocarbon rings having 6 to 18 carbon atoms, such as benzene, naphthalene, anthracene, and naphthacene. The above aromatic heterocyclic group preferably contains at least one heteroatom selected from nitrogen, oxygen, and sulfur atoms as a ring member atom. Examples of aromatic heterocyclic groups include groups containing aromatic heterocyclic rings having 4 to 20 ring member atoms, such as thiophene, furan, pyridine, pyrrole, benzothiophene, benzofuran, benzopyrrole, triazine, imidazole, benzimidazole, triazole, thiadiazole, and thiazole.

[0102] Ar ｂ１ The monovalent aromatic ring group represented by Ar may have substituents. ｂ１ Examples of substituents that the monovalent aromatic ring group represented by (b-1) may have include the substituent T described above. Examples include alkyl groups (e.g., 1 to 15 carbon atoms, preferably 1 to 6 carbon atoms), cycloalkyl groups (e.g., 3 to 15 carbon atoms, preferably 3 to 6 carbon atoms), aromatic ring groups (e.g., 3 to 12 carbon atoms), alkoxy groups (e.g., 1 to 15 carbon atoms, preferably 1 to 6 carbon atoms), and aryloxy groups (e.g., 6 to 14 carbon atoms). The groups exemplified above as substituents may have further substituents if possible. The lower limit of the molecular weight of the organic anion represented by formula (b-1) is preferably 250 or more, and more preferably 300 or more in terms of superior effects of the present invention. The upper limit is preferably 2000 or less, more preferably 1500 or less, and even more preferably 1000 or less.

[0103] Furthermore, examples of organic anions include the anions represented by the above formulas (d1-1) to (d1-4), and among these, compounds containing an anionic portion represented by any of the following formulas (BB-1) to (BB-7) are preferred.

[0104]

[0105] Specific examples of the above-mentioned organic anions include, for example, the organic anions present in the compounds described in paragraphs

[0305] to

[0314] of International Publication No. 2020 / 158337, which are incorporated herein by reference.

[0106] As the above organic anion, the anion represented by the following formula (a-1) is preferred. In one preferred embodiment, the above Z in formula (1A) or formula (2A) is preferred. ｎ－ However, it is preferable to have an organic anion represented by formula (a-1). In another preferred embodiment, the above Z in formula (1A) or formula (2A) is also preferable. ｎ－ However, it is preferable that it is an organic anion represented by formula (a-1).

[0107]

[0108] In the formula, Ar ａ１ Ar represents a monovalent aromatic ring group or an aliphatic hydrocarbon group. ａ１ The monovalent aromatic ring group represented by is Ar in formula (b-1) above. ｂ１ This is the same as the monovalent aromatic ring group represented by , and the preferred embodiment is also the same.

[0109] Ar ａ１ The monovalent aliphatic hydrocarbon group represented by is preferably a linear or branched alkyl group (for example, having 1 to 30 carbon atoms, preferably 1 to 12 carbon atoms) or a cycloalkyl group (for example, having 3 to 30 carbon atoms, preferably 3 to 10 carbon atoms).

[0110] Ar ａ１ A monovalent aromatic ring group and Ar represented by ａ１ The monovalent aliphatic hydrocarbon group represented by Ar may have substituents. ａ１ A monovalent aromatic ring group and Ar represented by ａ１Examples of substituents that the monovalent aliphatic hydrocarbon group represented by may have include the substituent T mentioned above, which includes hydroxyl groups, amino groups, cyano groups, alkoxy groups (preferably with 1 to 15 carbon atoms), alkyl groups (preferably with 1 to 10 carbon atoms), cycloalkyl groups (preferably with 3 to 15 carbon atoms), aryl groups (preferably with 6 to 14 carbon atoms), alkoxycarbonyl groups (preferably with 2 to 7 carbon atoms), acyl groups (preferably with 2 to 12 carbon atoms), alkoxycarbonyloxy groups (preferably with 2 to 7 carbon atoms), and alkylthio groups (preferably with 1 to 15 carbon atoms). ａ１ A monovalent aromatic ring group and Ar represented by ａ１ The substituents that the monovalent aliphatic hydrocarbon group represented by may have may have further substituents. ａ１ A monovalent aromatic ring group and Ar represented by ａ１ The substituents that the monovalent aliphatic hydrocarbon group represented by may have and further substituents may be bonded together to form a ring.

[0111] The compound represented by formula (1A) or formula (2A) is preferably the compound represented by formula (1B) or formula (2B).

[0112]

[0113] In formula (1B) and formula (2B), X １ and X ２ Each of these independently represents a single bond or a divalent linking group. １ ~R ３ Each of these independently represents a substituent. １ ~R ３ At least two of these may be joined together to form a ring. １ ~R ３ If there are multiple instances of R, then there are multiple instances of R １ ~R ３ The elements may be identical or different from one another. １ ~R ３ If there are multiple instances of R, then there are multiple instances of R １ These elements may combine with each other to form a ring, and there may be multiple R elements. ２These elements may combine with each other to form a ring, and there may be multiple R elements. ３ These elements may be joined together to form a ring. o represents an integer from 0 to 4. p represents an integer from 0 to 3. q represents an integer from 0 to 4. X １１ , X １２ , and X １３ Each of these independently represents a single bond or a divalent linking group. １１ ~R １３ Each of these independently represents a substituent. １１ ~R １３ At least two of these may be joined together to form a ring. １１ ~R １３ If there are multiple instances of R, then there are multiple instances of R １１ ~R １３ The elements may be identical or different from one another. １１ ~R １３ If there are multiple instances of R, then there are multiple instances of R １１ These elements may combine with each other to form a ring, and there may be multiple R elements. １２ These elements may combine with each other to form a ring, and there may be multiple R elements. １３ These elements may be joined together to form a ring. r, s, and t each independently represent an integer between 0 and 3. Z ｎ－ Each of the 'm' and 'n' independently represents an anion. Each of the 'm' and 'n' independently represents an integer of 1 or greater.

[0114] In formula (1B) and formula (2B), X １ , X ２ , X １１ , X １２ , and X １３ This is X in equations (1A) and (2A). １ , X ２ , X １１ , X １２ , and X １３ This is synonymous with the same thing, and the preferred embodiment is also the same.

[0115] R １ ~R ３ , R １１ ~R １３The substituents are not particularly limited, but examples include the substituent T mentioned above, such as alkyl groups, cycloalkyl groups, alkoxy groups, cycloalkoxy groups, aryloxy groups, aromatic ring groups, non-aromatic heterocyclic groups, alkoxycarbonyl groups, acyl groups, alkylthio groups, and hydroxyl groups. Examples of alkyl groups include linear or branched alkyl groups. The number of carbon atoms in the alkyl group is, for example, 1 to 30, preferably 1 to 12. Examples of cycloalkyl groups include monocyclic or polycyclic cycloalkyl groups. The number of carbon atoms in the cycloalkyl group is, for example, 3 to 30, preferably 3 to 10. Examples of alkyl groups in alkoxy groups include linear or branched alkyl groups. The number of carbon atoms in the alkyl group in alkoxy groups is, for example, 1 to 30, preferably 1 to 12. Examples of cycloalkyl groups in cycloalkoxy groups include monocyclic or polycyclic cycloalkyl groups. The number of carbon atoms in the cycloalkyl group in cycloalkyloxy groups is, for example, 3 to 30, preferably 3 to 10. Examples of aryl groups in aryloxy groups include monocyclic or polycyclic aryl groups. The number of carbon atoms in the aryl group in the aryloxy group is, for example, 6 to 30, preferably 6 to 10.

[0116] The aromatic ring group may be monocyclic or polycyclic, with monocyclic being preferred. The aromatic ring group may be either an aromatic hydrocarbon group or an aromatic heterocyclic group, with aromatic hydrocarbon groups being preferred. Examples of aromatic hydrocarbon groups include groups containing aromatic hydrocarbon rings having 6 to 18 carbon atoms, such as benzene, naphthalene, anthracene, and naphthacene. The aromatic heterocyclic group preferably contains at least one heteroatom selected from nitrogen, oxygen, and sulfur atoms as a ring member atom. Examples of aromatic heterocyclic groups include groups containing aromatic heterocyclic rings having 4 to 20 ring member atoms, such as thiophene, furan, pyridine, pyrrole, benzothiophene, benzofuran, benzopyrrole, triazine, imidazole, benzimidazole, triazole, thiadiazole, and thiazole.

[0117] The non-aromatic heterocyclic group may be monocyclic or polycyclic, with monocyclic being preferred. The non-aromatic heterocyclic group preferably contains at least one heteroatom selected from nitrogen, oxygen, and sulfur atoms as a ring member atom. Examples of non-aromatic heterocyclic groups include groups containing non-aromatic heterocyclic rings with 4 to 20 ring member atoms, such as pyrrolidine, tetrahydrofuran, and morpholine.

[0118] Examples of alkyl groups in an alkoxycarbonyl group include linear or branched alkyl groups. The number of carbon atoms in the alkyl group in an alkoxycarbonyl group is, for example, 1 to 30, preferably 1 to 12. The number of carbon atoms in an acyl group is not particularly limited, but is, for example, 1 to 20, preferably 1 to 10. Examples of alkyl groups in an alkylthio group include linear or branched alkyl groups. The number of carbon atoms in the alkyl group in an alkylthio group is, for example, 1 to 30, preferably 1 to 12.

[0119] The alkyl groups, cycloalkyl groups, alkoxy groups, cycloalkoxy groups, aryloxy groups, aromatic ring groups, non-aromatic heterocyclic groups, alkoxycarbonyl groups, acyl groups, and alkylthio groups may further have substituents. Examples of substituents that the alkyl groups, cycloalkyl groups, alkoxy groups, cycloalkoxy groups, aryloxy groups, aromatic ring groups, non-aromatic heterocyclic groups, alkoxycarbonyl groups, acyl groups, and alkylthio groups may have include the substituent T mentioned above, which includes hydroxyl groups, amino groups, cyano groups, alkoxy groups (preferably having 1 to 15 carbon atoms), alkyl groups (preferably having 1 to 10 carbon atoms), cycloalkyl groups (preferably having 3 to 15 carbon atoms), aryl groups (preferably having 6 to 14 carbon atoms), alkoxycarbonyl groups (preferably having 2 to 7 carbon atoms), acyl groups (preferably having 2 to 12 carbon atoms), alkoxycarbonyloxy groups (preferably having 2 to 7 carbon atoms), and alkylthio groups (preferably having 1 to 15 carbon atoms).

[0120] o represents an integer from 0 to 4. In a preferred embodiment, o is preferably an integer from 0 to 2. p represents an integer from 0 to 3. In a preferred embodiment, p is preferably an integer from 0 to 2. q represents an integer from 0 to 4. In a preferred embodiment, q is preferably an integer from 0 to 2. r, s, and t each independently represent an integer from 0 to 3. In a preferred embodiment, r is preferably an integer from 0 to 2. In a preferred embodiment, s is preferably an integer from 0 to 2. In a preferred embodiment, t is preferably an integer from 0 to 2.

[0121] In formula (1B) and formula (2B), Z ｎ－ , m, and n are Z in equations (1A) and (2A). ｎ－ , m, and n are synonymous, and the preferred embodiments are also the same.

[0122] Specific examples of cations in compounds represented by formula (1A) or formula (2A) are shown, but are not limited thereto. Me represents a methyl group.

[0123]

[0124] In a preferred embodiment, the Z in formula (1A) or formula (1B) is ｎ－ However, it is preferable to have an organic anion represented by the above formula (b-1). In another preferred embodiment, the above Z in formula (1A) or formula (1B) ｎ－ However, it is preferable that it is an organic anion represented by the above formula (b-1). In one preferred embodiment, the above Z in formula (1A) or formula (1B) ｎ－ However, it is preferable to have an organic anion represented by the above formula (a-1). In another preferred embodiment, the above Z in formula (1A) or formula (1B) ｎ－ However, it is preferable that it is an organic anion represented by formula (a-1).

[0125] The compounds represented by formula (1A) or formula (2A) can be synthesized according to conventional methods.

[0126] The compound represented by formula (1A) or formula (2A) (compound (A)) preferably does not have a fluorine atom-containing substituent. Examples of fluorine atom-containing substituents include fluorine atoms and groups having a fluorine atom as a substituent.

[0127] The compound represented by formula (1A) or formula (2A) may be a photoacid generator as described later, or it may not be a photoacid generator. The compound represented by formula (1A) or formula (2A) may be an acid diffusion control agent as described later, or it may not be an acid diffusion control agent. In a preferred embodiment, Z in the compound represented by formula (1A) or formula (2A) ｎ－ However, if the compound (A) has an organic anion represented by formula (b-1), it is preferable that the compound (A) is a photoacid generator. In another preferred embodiment, Z in the compound represented by formula (1A) or formula (2A) ｎ－ However, if the compound has an organic anion represented by formula (a-1), it is preferable that compound (A) is an acid diffusion control agent.

[0128] The content of compound (A) is not particularly limited, but is preferably 0.5% by mass or more, more preferably 1.0% by mass or more, and even more preferably 5.0% by mass or more, relative to the total solid content of the composition of the present invention. Furthermore, the content of compound (A) is preferably 50.0% by mass or less, more preferably 40.0% by mass or less, and even more preferably 30.0% by mass or less, relative to the total solid content of the composition of the present invention. Compound (A) may be used alone or two or more types. When two or more types of compound (A) are used, it is preferable that their total content is within the range of the above preferred content. The composition of the present invention contains compound (A), but compound (A) may be a compound represented by formula (1A), a compound represented by formula (2A), or a compound represented by both formula (1A) and formula (2A).

[0129] [Resin] The composition of the present invention includes a resin. The resin is preferably a resin whose polarity changes upon the action of an acid (hereinafter also referred to as "acid-degradable resin"). The acid-degradable resin is preferably one whose polarity increases upon the action of an acid, thereby increasing its solubility in an alkaline developer. It is also preferable that the acid-degradable resin's polarity increases upon the action of an acid, thereby decreasing its solubility in an organic solvent. The acid-degradable resin is preferably one that has a group that decomposes and changes polarity upon the action of an acid (hereinafter also referred to as "acid-degradable group"), and more preferably one that has a repeating unit having an acid-degradable group.

[0130] <Repeating Unit Having an Acid-Decomposing Group> <Acid-Decomposing Group> The acid-decomposing group may be either a group that decomposes upon the action of an acid, increasing its polarity or decreasing it, but it is preferable that it is a group that decomposes upon the action of an acid, increasing its polarity, and typically it is a group that decomposes upon the action of an acid to produce a polar group. The acid-decomposing group preferably has a structure in which the polar group is protected by a group that is left behind upon the action of an acid (leaving group). Examples of the polar groups mentioned above include acidic groups such as carboxyl groups, phenolic hydroxyl groups, fluorinated alcohol groups, sulfonic acid groups, phosphoric acid groups, sulfonamide groups, sulfonylimide groups, (alkylsulfonyl)(alkylcarbonyl)methylene groups, (alkylsulfonyl)(alkylcarbonyl)imide groups, bis(alkylcarbonyl)methylene groups, bis(alkylcarbonyl)imide groups, bis(alkylsulfonyl)methylene groups, bis(alkylsulfonyl)imide groups, tris(alkylcarbonyl)methylene groups, and tris(alkylsulfonyl)methylene groups, as well as alcoholic hydroxyl groups. Among these, carboxyl groups, phenolic hydroxyl groups, fluorinated alcohol groups (preferably hexafluoroisopropanol groups), or sulfonic acid groups are preferred as polar groups.

[0131] Examples of groups that are eliminated by the action of an acid include the group represented by any of the following formulas: (Y1), (Y2), and (Y3). Formula (Y1): -C(Rx １ ) (Rx ２ ) (Rx ３ ) Formula (Y2): -C(R ３６ ) (Caution３７ ) ( OR ３８ ) Formula (Y3): -C(Rn)(H)(Ar)

[0132] In formula (Y1), Rx １ ~Rx ３ Each of these independently represents an alkyl group (linear or branched), a cycloalkyl group (monocyclic or polycyclic), an alkenyl group (linear or branched), an alkynyl group, or an aryl group (monocyclic or polycyclic). １ ~Rx ３ If all of them are alkyl groups (linear or branched), then Rx １ ~Rx ３ Preferably, at least two of them are methyl groups. Among them, Rx １ ~Rx ３ Each preferably independently represents a linear or branched alkyl group, and Rx １ ~Rx ３ It is more preferable that each of these independently represents a linear alkyl group. １ ~Rx ３ These two may combine to form a monocycle or polycycle. Rx １ ~Rx ３ Preferred alkyl groups include C1-C5 alkyl groups such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, and t-butyl groups. １ ~Rx ３ Preferred cycloalkyl groups include monocyclic cycloalkyl groups such as cyclopentyl and cyclohexyl groups, and polycyclic cycloalkyl groups such as norbornyl, tetracyclodecanyl, tetracyclododecanyl, and adamantyl groups. １ ~Rx ３ A vinyl group is preferred as the alkenyl group. Rx １ ~Rx ３ The alkynyl group is preferably an ethynyl group or a propargyl group. Rx １ ~Rx ３ The aryl group is preferably an aryl group having 6 to 10 carbon atoms, such as a phenyl group, a naphthyl group, and an anthyl group.

[0133] Rx １ ~Rx ３ A cycloalkyl group is preferred as the ring formed by the bonding of these two. Rx １ ~Rx ３ The cycloalkyl group formed by the bonding of these two groups is preferably a monocyclic cycloalkyl group such as a cyclopentyl group or a cyclohexyl group, or a polycyclic cycloalkyl group such as a norbornyl group, a tetracyclodecanyl group, a tetracyclododecanyl group, or an adamantyl group, with a monocyclic cycloalkyl group having 5 to 6 carbon atoms being more preferred. １ ~Rx ３ The cycloalkyl group formed by the bonding of these two groups may have one of the methylene groups constituting the ring replaced by a heteroatom such as an oxygen atom, a group containing a heteroatom such as a carbonyl group, or a vinylidene group. In these cycloalkyl groups, one or more of the ethylene groups constituting the cycloalkane ring may be replaced by vinylene groups. The group represented by formula (Y1) is, for example, Rx １ is a methyl group or an ethyl group, and Rx ２ and Rx ３ A preferred embodiment is one in which the two are bonded together to form the aforementioned cycloalkyl group.

[0134] When the composition of the present invention is used as an EUV resist, Rx １ ~Rx ３ Alkyl groups, cycloalkyl groups, alkenyl groups, aryl groups, and Rx are represented by １ ~Rx ３ The ring formed by the bonding of these two elements may further preferably have a fluorine atom or an iodine atom as a substituent.

[0135] In formula (Y2), R ３６ ~R ３８ Each of these independently represents a hydrogen atom or a monovalent organic group. ３７ and R ３８ These may bond to each other to form a ring. Examples of monovalent organic groups include alkyl groups, cycloalkyl groups, aryl groups, aralkyl groups, alkenyl groups, and alkynyl groups. ３６It is also preferable that it be a hydrogen atom. Furthermore, the alkyl group, cycloalkyl group, aryl group, alkenyl group, and alkynyl group may include groups containing heteroatoms such as oxygen atoms and / or carbonyl groups. For example, in the alkyl group, cycloalkyl group, aryl group, and aralkyl group, one or more methylene groups may be replaced with groups containing heteroatoms such as oxygen atoms and / or carbonyl groups. ３８ R may bond with other substituents on the repeating main chain to form a ring. ３８ The group formed by the bonding of the repeating unit main chain with another substituent is preferably an alkylene group such as a methylene group. When the composition of the present invention is used as an EUV resist, R ３６ ~R ３８ A monovalent organic group represented by, and R ３７ and R ３８ The ring formed by the bonding of these elements may further preferably have a fluorine atom or an iodine atom as a substituent.

[0136] In formula (Y3), Ar represents an aromatic ring group. Rn represents an alkyl group, a cycloalkyl group, or an aryl group. Rn and Ar may bond to each other to form a non-aromatic ring. An aryl group is preferred as Ar. When the resist composition of the present invention is used as an EUV resist, it is also preferable that the aromatic ring group represented by Ar, and the alkyl group, cycloalkyl group, and aryl group represented by Rn, have a fluorine atom or an iodine atom as a substituent.

[0137] From the standpoint of excellent acid decomposition properties of repeating units, in a leaving group that protects a polar group, if a non-aromatic ring is directly bonded to the polar group (or its residue), it is preferable that the ring member atoms in the non-aromatic ring adjacent to the ring member atom directly bonded to the polar group (or its residue) do not have halogen atoms such as fluorine atoms as substituents.

[0138] Other groups that may be removed by the action of an acid include a 2-cyclopentenyl group having a substituent (such as an alkyl group), such as a 3-methyl-2-cyclopentenyl group, and a cyclohexyl group having a substituent (such as an alkyl group), such as a 1,1,4,4-tetramethylcyclohexyl group.

[0139] As the repeating unit having an acid-degradable group, the repeating unit represented by formula (P1) is preferred. In one preferred embodiment, it is preferable that the repeating unit having an acid-degradable group includes the repeating unit represented by formula (P1).

[0140]

[0141] In formula (P1), R ｂ１ and R ｂ２ Each of these independently represents either a hydrogen atom or an alkyl group. ｂ１ Ar represents a single bond or a -COO- bond. ｂ１ This represents an s+t+1 valent aromatic ring group. ｂ１ is, -OR ｂ or -COOR ｂ Represents R ｂ R represents a leaving group. ｂ３ is, -OR ｂ and -COOR ｂ Represents a substituent different from the given one. s represents an integer greater than or equal to 1. t represents an integer greater than or equal to 0. R ｂ１ and Ar ｂ１ They may be bonded to each other via single bonds or divalent linking groups to form a ring, R ｂ and R ｂ３ They may be bonded to each other via single bonds or divalent linking groups to form a ring, R ｂ３ They may be bonded to each other via single bonds or divalent linking groups to form a ring, R ｂ These elements may be linked to each other via single bonds or divalent linking groups to form a ring.

[0142] In formula (P1), R ｂ１ and R ｂ２ Each of these independently represents either a hydrogen atom or an alkyl group. ｂ１ and R ｂ２ Examples of the alkyl group represented by the above include a methyl group or -CH２ -R １１ A group represented by is an example. The alkyl group may have substituents. R １１ R represents a halogen atom (such as a fluorine atom), a hydroxyl group, or a monovalent organic group. １１ Examples of monovalent organic groups represented by include alkyl groups having 5 or fewer carbon atoms that may be substituted with halogen atoms, acyl groups having 5 or fewer carbon atoms that may be substituted with halogen atoms, and alkoxy groups having 5 or fewer carbon atoms that may be substituted with halogen atoms, with alkyl groups having 3 or fewer carbon atoms being preferred, and methyl groups being more preferred. ｂ１ A hydrogen atom is preferred as the component. ｂ２ Preferably, the group is a hydrogen atom, a methyl group, a trifluoromethyl group, or a hydroxymethyl group.

[0143] In formula (P1), Ar ｂ１ represents an s+t+1 valent aromatic ring group. The above aromatic ring group may be monocyclic or polycyclic. The above aromatic ring group may be either an aromatic hydrocarbon group or an aromatic heterocyclic group, with aromatic hydrocarbon groups being preferred. As the above aromatic hydrocarbon group, groups containing aromatic hydrocarbon rings having 6 to 18 carbon atoms, such as benzene, naphthalene, anthracene, and naphthacene, are preferred. As the heteroatoms of the above aromatic heterocyclic group, nitrogen atoms, oxygen atoms, or sulfur atoms are preferred. As the aromatic heterocyclic group, groups containing aromatic heterocyclic rings with 4 to 20 ring member atoms, such as thiophene, furan, pyridine, pyrrole, benzothiophene, benzofuran, benzopyrrole, triazine, imidazole, benzimidazole, triazole, thiadiazole, and thiazole, are preferred. The number of ring member atoms of the above aromatic ring group is preferably 6 to 18, and more preferably 6 to 10.

[0144] In formula (P1), Y ｂ１ is, -OR ｂ or -COOR ｂ Represents R ｂ R represents a leaving group. ｂThe definition and preferred embodiment of the leaving group represented by are as described above, and the group represented by formulas (Y1) to (Y3) is preferred. When s is an integer of 2 or more, there are multiple Y ｂ１ They may be the same or different from one another.

[0145] In formula (P1), R ｂ３ is, -OR ｂ and -COOR ｂ Represents a different substituent. ｂ３ It is also preferable that the group does not contain an acid-degradable group. ｂ３ Examples of groups represented by include halogen atoms, alkyl groups, cycloalkyl groups, alkoxy groups, aryloxy groups, alkylthio groups, arylthio groups, aryl groups, heteroaryl groups, ester groups, carboxyl groups, and groups formed by combining two or more of these. When t is an integer of 2 or more, there are multiple R groups. ｂ３ They may be identical or different to each other.

[0146] In formula (P1), s represents an integer of 1 or more, preferably an integer between 1 and 4, and more preferably 1 or 2. t represents an integer of 0 or more, preferably an integer between 0 and 4, and more preferably an integer between 0 and 2.

[0147] In formula (P1), R ｂ１ and Ar ｂ１ They may be linked to each other via single bonds or divalent linking groups to form a ring. When t represents an integer of 1 or more, R ｂ and R ｂ３ They may be linked to each other via single bonds or divalent linking groups to form a ring. When s represents an integer of 2 or more, R ｂ They may be linked to each other via single bonds or divalent linking groups to form a ring, and when t represents an integer of 2 or more, R ｂ３ These elements may be bonded to each other via single bonds or divalent linking groups to form a ring. Examples of the divalent linking groups include -O-, -S-, -CO-, and -CO ２ -, -SO-, -SO ２- Examples include alkylene groups (preferably having 1 to 5 carbon atoms), alkenylene groups (preferably having 2 to 5 carbon atoms), and groups formed by combining two or more of these. The alkylene groups and alkenylene groups may have substituents.

[0148] As a repeating unit having an acid-degradable group, the repeating unit represented by formula (A) is also preferred.

[0149]

[0150] L １ R represents a divalent linking group which may have a fluorine atom or an iodine atom. １ R represents a hydrogen atom, a fluorine atom, an iodine atom, an alkyl group which may have a fluorine atom or an iodine atom, or an aryl group which may have a fluorine atom or an iodine atom. ２ This represents a leaving group that is removed by the action of an acid and may have a fluorine atom or an iodine atom. However, L １ , R １ and R ２ At least one of them has a fluorine atom or an iodine atom. １ Divalent linking groups that may have a fluorine atom or an iodine atom, represented by -CO-, -O-, -S-, -SO-, -SO ２ - Hydrocarbon groups which may have a fluorine atom or an iodine atom (for example, alkylene groups, cycloalkylene groups, alkenylene groups, and arylene groups, etc.), and linked groups formed by linking multiple thereof. Among these, L １The alkylene group is preferably -CO-, an arylene group, or an -arylene group-an alkylene group having a fluorine or iodine atom, and more preferably -CO-, or an -arylene group-an alkylene group having a fluorine or iodine atom. The arylene group is preferably a phenylene group. The alkylene group may be linear or branched. The number of carbon atoms in the alkylene group is not particularly limited, but is preferably 1 to 10, and more preferably 1 to 3. The total number of fluorine and iodine atoms in the alkylene group having a fluorine or iodine atom is not particularly limited, but is preferably 2 or more, more preferably 2 to 10, and even more preferably 3 to 6.

[0151] R １ The alkyl group represented by may be linear or branched. The number of carbon atoms in the alkyl group is not particularly limited, but 1 to 10 is preferred, and 1 to 3 is more preferred. １ The total number of fluorine atoms and iodine atoms contained in the alkyl group having a fluorine atom or an iodine atom, represented by R, is not particularly limited, but is preferably 1 or more, more preferably 1 to 5, and even more preferably 1 to 3. １ The alkyl group represented by may contain heteroatoms other than halogen atoms, such as oxygen atoms.

[0152] R ２ Examples of leaving groups that may have a fluorine atom or an iodine atom, represented by formula (Y1), formula (Y2), and formula (Y3) above, include leaving groups that have a fluorine atom or an iodine atom.

[0153] As a repeating unit having an acid-degradable group, a repeating unit represented by formula (AI) is also preferred.

[0154]

[0155] In equation (AI), Xa １ Rx represents a hydrogen atom or an alkyl group. T represents a single bond or a divalent linking group. １ ~Rx ３ The definition and preferred embodiment of Rx in formula (Y1) １ ~Rx ３ They are the same.

[0156] Xa １ Examples of alkyl groups represented by this formula include a methyl group or -CH ２ -R １１ A group represented by is an example. The alkyl group may have substituents. R １１ R represents a halogen atom (such as a fluorine atom), a hydroxyl group, or a monovalent organic group. １１ Examples of monovalent organic groups represented by include alkyl groups having 5 or fewer carbon atoms that may be substituted with halogen atoms, acyl groups having 5 or fewer carbon atoms that may be substituted with halogen atoms, and alkoxy groups having 5 or fewer carbon atoms that may be substituted with halogen atoms, with alkyl groups having 3 or fewer carbon atoms being preferred and methyl groups being more preferred. １ Preferably, the group is a hydrogen atom, a methyl group, a trifluoromethyl group, or a hydroxymethyl group.

[0157] Examples of divalent linking groups for T include alkylene groups, aromatic ring groups, -COO-Rt- groups, and -O-Rt- groups. In the formula, Rt represents an alkylene group or a cycloalkylene group. T is preferably a single bond or a -COO-Rt- group. When T represents a -COO-Rt- group, Rt is preferably an alkylene group having 1 to 5 carbon atoms, and -CH ２ -, - (CH ２ ) ２ - or - (CH ２ ) ３ - is preferable.

[0158] When each of the above groups has substituents, examples of substituents include alkyl groups (1 to 4 carbon atoms), halogen atoms, hydroxyl groups, alkoxy groups (1 to 4 carbon atoms), carboxyl groups, and alkoxycarbonyl groups (2 to 6 carbon atoms). The number of carbon atoms of the substituent is preferably 8 or less.

[0159] The repeating unit represented by formula (AI) is an acid-degradable (meth)acrylate tertiary alkyl ester repeating unit (Xa １ A repeating unit in which represents a hydrogen atom or a methyl group, and T represents a single bond, is preferred.

[0160] The repeating unit having an acid-degradable group may have an acid-degradable group containing an unsaturated bond. The repeating unit represented by formula (B) is preferred as the repeating unit having an acid-degradable group containing an unsaturated bond.

[0161]

[0162] In formula (B), Xb represents a hydrogen atom, a halogen atom, or an alkyl group. L represents a single bond or a divalent linking group which may have substituents. １ ~Ry ３ Each of these independently represents a linear or branched alkyl group, a monocyclic or polycyclic cycloalkyl group, an alkenyl group, an alkynyl group, or a monocyclic or polycyclic aryl group. However, Ry １ ~Ry ３ At least one of these represents an alkenyl group, an alkynyl group, a monocyclic or polycyclic cycloalkenyl group, or a monocyclic or polycyclic aryl group. １ ~Ry ３ These two may combine to form a monocyclic or polycyclic (monocyclic or polycyclic cycloalkyl group, cycloalkenyl group, etc.) structure.

[0163] In formula (B), the alkyl group represented by Xb is, for example, a methyl group or -CH ２ -R １１ The group represented by R is an example. １１ Xa is as described above. The alkyl group may have substituents. Xb is preferably a hydrogen atom, a fluorine atom, a methyl group, a trifluoromethyl group, or a hydroxymethyl group.

[0164] In formula (B), the divalent linking group represented by L includes -Rt-, -CO-, -COO-Rt-, -COO-Rt-CO-, -Rt-CO-, and -O-Rt-. Rt represents an alkylene group, a cycloalkylene group, or an aromatic ring group, with an aromatic ring group being preferred. Rt may have substituents such as a halogen atom, a hydroxyl group, or an alkoxy group. As for L, -Rt-, -CO-, -COO-Rt-CO-, or -Rt-CO- are preferred.

[0165] In formula (B), Ry １ ~Ry ３ The alkyl group represented is preferably an alkyl group having 1 to 4 carbon atoms, such as a methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, or t-butyl group. １ ~Ry ３ The cycloalkyl group represented by is preferably a monocyclic cycloalkyl group such as a cyclopentyl group and a cyclohexyl group, or a polycyclic cycloalkyl group such as a norbornyl group, a tetracyclodecanyl group, a tetracyclododecanyl group, and an adamantyl group. １ ~Ry ３ A vinyl group is preferred as the alkenyl group represented by Ry. １ ~Ry ３ As the alkynyl group represented by , an ethynyl group is preferred. １ ~Ry ３ The cycloalkenyl group represented by is preferably a cyclopentyl group and a monocyclic cycloalkyl group such as a cyclohexyl group that contains a double bond in part. １ ~Ry ３ The aryl group represented by is preferably an aryl group having 6 to 10 carbon atoms, such as a phenyl group, a naphthyl group, and an anthyl group.

[0166] Ry １ ~Ry ３ The cycloalkyl group formed by the bonding of these two groups is preferably a monocyclic cycloalkyl group such as a cyclopentyl group and a cyclohexyl group, or a polycyclic cycloalkyl group such as a norbornyl group, a tetracyclodecanyl group, a tetracyclododecanyl group, and an adamantyl group. Among these, a monocyclic cycloalkyl group having 5 to 6 carbon atoms is more preferred. １ ~Ry ３ A cycloalkyl group or cycloalkenyl group formed by the bonding of these two elements may, for example, have one of the methylene groups constituting the ring be a heteroatom such as an oxygen atom, a carbonyl group, or -SO ２ -Base and -SO ３- These groups may be replaced by groups containing heteroatoms such as - groups, vinylidene groups, or combinations thereof. Furthermore, in these cycloalkyl or cycloalkenyl groups, one or more ethylene groups constituting the cycloalkane or cycloalkene ring may be replaced by vinylene groups. The repeating unit represented by formula (B) is, for example, Ry １ is a methyl group, ethyl group, vinyl group, allyl group, or aryl group, R ２ and Ry ３ A preferred embodiment is one in which the two are bonded together to form the aforementioned cycloalkyl group or cycloalkenyl group.

[0167] When each of the above groups has substituents, examples of substituents include alkyl groups (1 to 4 carbon atoms), halogen atoms, hydroxyl groups, alkoxy groups (1 to 4 carbon atoms), carboxyl groups, and alkoxycarbonyl groups (2 to 6 carbon atoms). The number of carbon atoms of the substituent is preferably 8 or less.

[0168] The repeating units represented by formula (B) are preferably acid-degradable (meth)acrylic acid tertiary ester repeating units (a repeating unit in which Xb represents a hydrogen atom or a methyl group and L represents a -CO- group), acid-degradable hydroxystyrene tertiary alkyl ether repeating units (a repeating unit in which Xb represents a hydrogen atom or a methyl group and L represents a phenyl group), or acid-degradable styrene carboxylic acid tertiary ester repeating units (a repeating unit in which Xb represents a hydrogen atom or a methyl group and L represents a -Rt-CO- group (Rt is an aromatic group)).

[0169] Specific examples of repeating units having an acid-degradable group containing an unsaturated bond include, for example, the repeating units described in

[0067] to

[0071] of International Publication No. 2022 / 024928, which are incorporated herein by reference.

[0170] Specific examples of repeating units having acid-degradable groups are shown below, but are not limited to these. Repeating units having acid-degradable groups described in the examples later are also preferred. Furthermore, for repeating units having acid-degradable groups, one can refer to, for example, the descriptions in

[0029] to

[0071] of International Publication No. 2022 / 024928, which are incorporated herein by reference.

[0171]

[0172] The repeating unit having an acid-degradable group preferably includes at least one repeating unit selected from the group consisting of the repeating unit represented by formula (P1) and the repeating unit represented by formula (AI) described above, and more preferably includes the repeating unit represented by formula (P1) described above.

[0173] The repeating units having acid-degradable groups may be used individually or in combination of two or more types. The content of the repeating units having acid-degradable groups is preferably 5 to 100 mol%, more preferably 10 to 80 mol%, and even more preferably 15 to 70 mol%, relative to the total repeating units in the acid-degradable resin.

[0174] <Repeating units having acidic groups> The resin preferably has repeating units having acidic groups. The repeating units having acidic groups are preferably different from the repeating units having acid-degradable groups. The repeating units having acidic groups may also have fluorine atoms or iodine atoms. Preferred acidic groups are carboxyl groups, phenolic hydroxyl groups, fluorinated alcohol groups (preferably hexafluoroisopropanol groups), sulfonic acid groups, sulfonamide groups, or isopropanol groups, with phenolic hydroxyl groups being more preferred. In other words, the resin preferably contains repeating units having phenolic hydroxyl groups (phenolic hydroxyl groups). The hexafluoroisopropanol group may have one or more fluorine atoms (preferably one to two) substituted with a group other than a fluorine atom (such as an alkoxycarbonyl group). The acidic group is -C(CF) formed in this way. ３ ) (OH)-CF ２- is also preferable. In addition, one or more fluorine atoms are substituted with a group other than a fluorine atom, -C(CF ３ ) (OH)-CF ２ A ring containing - may be formed.

[0175] As the repeating unit having an acid group, the repeating unit represented by the following formula (Pa1) is preferred; that is, the resin preferably contains the repeating unit represented by the following formula (Pa1).

[0176]

[0177] In formula (Pa1), R ａ１ and R ａ２ Each of these independently represents a hydrogen atom or a substituent. ａ１ Ar represents a single bond or a divalent linking group. ａ１ Ar represents an aromatic ring group with (m+n+1) valency. ａ１ And, R ａ２ or L ａ１ This may be a single bond or a bond via a linking group. Ｘ represents a substituent other than a hydroxyl group. n represents an integer between 1 and 9 (inclusive). m represents an integer between 0 and 8 (inclusive).

[0178] In the above formula (Pa1), R ａ１ and R ａ２ Each of these independently represents a hydrogen atom or a substituent. ａ１ and R ａ２ The substituent represented is not particularly limited, but is preferably an alkyl group, a cycloalkyl group, a halogen atom, a cyano group, or an alkoxycarbonyl group. ａ１ and R ａ２ The alkyl group represented by may be linear or branched, and may have substituents. The number of carbon atoms in the alkyl group is not particularly limited, but is preferably 1 to 10, more preferably 1 to 5, and even more preferably 1 to 3. Examples of alkyl groups include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, and t-butyl groups. ａ１ and R ａ２The number of carbon atoms in the cycloalkyl group represented by is not particularly limited, but is preferably 3 to 20, and more preferably 5 to 15. The cycloalkyl group may be a monocyclic cycloalkyl group such as a cyclopentyl group or a cyclohexyl group, or a polycyclic cycloalkyl group such as a norbornyl group, a tetracyclodecanyl group, a tetracyclododecanyl group, or an adamantyl group. The cycloalkyl group may have substituents. ａ１ and R ａ２ Examples of halogen atoms represented by include fluorine, chlorine, bromine, and iodine atoms, with fluorine or iodine atoms being preferred. ａ１ and R ａ２ The alkyl group contained in the alkoxycarbonyl group represented by may be linear or branched. The number of carbon atoms in the alkyl group contained in the alkoxycarbonyl group is not particularly limited, but 1 to 5 is preferred, and 1 to 3 is more preferred. The alkoxycarbonyl group may have substituents.

[0179] In the above formula (Pa1), L ａ１ L represents a single bond or a divalent linking group. ａ１ Examples of divalent linking groups represented by include -COO- and -CONR ａ３ -, alkylene groups, or groups formed by combining two or more of these groups. ａ３ R represents a hydrogen atom or an alkyl group. Preferred alkylene groups include C1-C8 alkylene groups such as methylene, ethylene, propylene, butylene, hexylene, and octylene. The alkylene group may have substituents. ａ３ Examples of alkyl groups that represent an alkyl group include alkyl groups having 20 or fewer carbon atoms, such as methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, sec-butyl group, hexyl group, 2-ethylhexyl group, octyl group, and dodecyl group, with alkyl groups having 8 or fewer carbon atoms being preferred.

[0180] In the above formula (Pa1), Ar ａ１ Ar represents an aromatic ring group with (m+n+1) valency. ａ１The aromatic ring group represented by may be either an aromatic hydrocarbon group or an aromatic heterocyclic group. Preferred aromatic hydrocarbon groups include groups containing aromatic hydrocarbons having 6 to 18 carbon atoms, such as benzene, naphthalene, anthracene, and naphthacene. Preferred aromatic heterocyclic groups include groups containing aromatic heterocyclic rings with 4 to 20 ring member atoms, such as thiophene, furan, pyridine, pyrrole, benzothiophene, benzofuran, benzopyrrole, triazine, imidazole, benzimidazole, triazole, thiadiazole, and thiazole.

[0181] Ar ａ１ And, R ａ２ or L ａ１ These may be bonded via single bonds or linking groups. Examples of linking groups include -O-, -S-, -CO-, and -CO ２ -, -SO-, -SO ２ - Examples include alkylene groups (preferably having 1 to 5 carbon atoms), alkenylene groups (preferably having 2 to 5 carbon atoms), and groups formed by combining two or more of these. The alkylene groups and alkenylene groups may have substituents.

[0182] In the above formula (Pa1), R Ｘ R represents substituents other than hydroxyl groups. Ｘ Examples of substituents represented by include carboxyl groups, sulfo groups, cyano groups, halogen atoms, hydrocarbon groups, amino groups, nitro groups, and groups formed by combining two or more of these. Ｘ Examples of hydrocarbon groups represented by include alkyl groups (preferably having 1 to 10 carbon atoms), cycloalkyl groups (preferably having 5 to 15 carbon atoms), and alkenyl groups (preferably having 2 to 10 carbon atoms). Ｘ The hydrocarbon group represented by may have substituents. Also, R Ｘ The hydrocarbon group represented is -CH ２ If it contains -, -CH ２ At least one of the following is -O-, -CO-, -S-, and -SO ２- May be replaced by at least one selected from the group consisting of -. Ｘ The substituent represented by preferably has a halogen atom. The halogen atom is preferably a fluorine atom or an iodine atom.

[0183] In the above formula (Pa1), n ​​represents an integer between 1 and 9, preferably between 1 and 5, and more preferably between 1 and 4. m represents an integer between 0 and 8, preferably between 0 and 4, and more preferably between 0 and 3.

[0184] The repeating unit having an acid group is preferably a repeating unit represented by the following formula (Pa2), that is, the resin preferably contains a repeating unit represented by the following formula (Pa2).

[0185]

[0186] In formula (Pa2), R ａ４ L represents a hydrogen atom or an alkyl group. ａ２ represents a single join or -COO-. r represents an integer between 0 and 3 (inclusive). Ｘ１ represents a halogen atom or hydrocarbon group. n1 represents an integer between 1 and 5. m1 represents an integer between 0 and 4.

[0187] In the above formula (Pa2), R ａ４ R represents a hydrogen atom or an alkyl group. ａ４ The alkyl group represented by may be linear or branched and may have substituents. The number of carbon atoms in the alkyl group is not particularly limited, but is preferably 1 to 10, more preferably 1 to 5, and particularly preferably 1 to 3. Examples of alkyl groups include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, and t-butyl groups.

[0188] In the above formula (Pa2), L ａ２represents a single bond or -COO-, with a single bond being preferred. r represents an integer between 0 and 3, preferably between 0 and 2, more preferably 0 or 1, and even more preferably 0. In formula (Pa2), the aromatic ring is benzene when r is 0, naphthalene when r is 1, anthracene when r is 2, and naphthacene when r is 3. n1 represents an integer between 1 and 5, preferably between 1 and 4. m1 represents an integer between 0 and 4, preferably between 0 and 3.

[0189] In the above formula (Pa2), R Ｘ１ R represents a halogen atom or hydrocarbon group. Ｘ１ The halogen atom represented is preferably a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom, and more preferably a fluorine atom or an iodine atom. Ｘ１ Examples of hydrocarbon groups represented by include alkyl groups (preferably having 1 to 10 carbon atoms), cycloalkyl groups (preferably having 5 to 15 carbon atoms), and alkenyl groups (preferably having 2 to 10 carbon atoms). Ｘ１ The hydrocarbon group represented by may have substituents. Also, R Ｘ１ The hydrocarbon group represented is -CH ２ If it contains -, -CH ２ At least one of the following is -O-, -CO-, -S-, and -SO ２ - May be replaced by at least one selected from the group consisting of -. Ｘ１ The hydrocarbon group represented by preferably has a halogen atom. The halogen atom is preferably a fluorine atom or an iodine atom.

[0190] Specific examples of repeating units having an acid group include, for example, the repeating units described in

[0079] to

[0110] of International Publication No. 2022 / 024928, which are incorporated herein by reference.

[0191] The repeating units having acidic groups may be used alone or in combination of two or more types. The content of repeating units having acidic groups is preferably 5 to 90 mol%, more preferably 10 to 90 mol%, and even more preferably 20 to 80 mol%, relative to the total repeating units of the resin.

[0192] <Other Repeating Units> The resin may contain other repeating units other than those described above. The content of other repeating units is preferably 0 to 50 mol%, and more preferably 0 to 30 mol%, relative to the total repeating units of the resin.

[0193] 《Repeating units that do not have either an acid-degradable group or an acid group, but have a fluorine atom, a bromine atom, or an iodine atom》 The resin may have repeating units (hereinafter also simply referred to as "repeating unit X") that do not have either an acid-degradable group or an acid group, but have a fluorine atom, a bromine atom, or an iodine atom. It is preferable that repeating unit X is different from repeating unit Y and repeating unit P, which will be described later. The repeating unit X is preferably a repeating unit represented by formula (C).

[0194]

[0195] In formula (C), L ５ R represents a single bond or an ester group. ９ R represents an alkyl group which may have a hydrogen atom, or a fluorine atom or an iodine atom. １０ This represents an alkyl group which may have a hydrogen atom, a fluorine atom, or an iodine atom, a cycloalkyl group which may have a fluorine atom or an iodine atom, an aryl group which may have a fluorine atom or an iodine atom, or a group which is a combination thereof.

[0196] The content of repeating unit X is preferably 0 mol% or more, more preferably 5 mol% or more, and even more preferably 10 mol% or more, relative to the total repeating units in the resin. Furthermore, the upper limit is preferably less than 40 mol%, and more preferably 35 mol% or less, relative to the total repeating units in the resin.

[0197] Furthermore, the resin may have repeating units having at least one of a fluorine atom, a bromine atom, and an iodine atom. Examples of repeating units having at least one of a fluorine atom, a bromine atom, and an iodine atom include repeating units having a fluorine atom, a bromine atom, or an iodine atom and having an acid-degradable group, repeating units having a fluorine atom, a bromine atom, or an iodine atom and having an acidic group, and repeating units having a fluorine atom, a bromine atom, or an iodine atom. The total content of repeating units having at least one of a fluorine atom, a bromine atom, and an iodine atom among the repeating units of the resin is preferably 10 mol% or more, more preferably 20 mol% or more, even more preferably 30 mol% or more, and particularly preferably 40 mol% or more, relative to the total repeating units of the resin. There is no particular upper limit, but for example, it is 100 mol% or less relative to the total repeating units of the resin.

[0198] Specific examples of repeating units having fluorine atoms or iodine atoms include, for example, the repeating units described in

[0116] to

[0117] of International Publication No. 2022 / 024928, which are incorporated herein by reference.

[0199] Repeating units having lactone groups, sultone groups, or carbonate groups The resin may have repeating units (hereinafter also simply referred to as "repeating unit Y") having at least one selected from the group consisting of lactone groups, sultone groups, and carbonate groups. It is also preferable that repeating unit Y does not have acidic groups such as hydroxyl groups and hexafluoropropanol groups.

[0200] The lactone group or sultone group may have a lactone structure or a sultone structure. The lactone structure or sultone structure is preferably a 5-7 membered ring lactone structure or a 5-7 membered ring sultone structure. More preferably, the 5-7 membered ring lactone structure is fused with another ring structure in the form of a bicyclo or spiro structure, or the 5-7 membered ring sultone structure is fused with another ring structure in the form of a bicyclo or spiro structure. For units containing a lactone group or sultone group, refer to, for example, the descriptions in International Publication No. 2022 / 024928

[0119] to

[0126] and

[0132] to

[0133] , which are incorporated herein by reference.

[0201] A cyclic carbonate ester group is preferred as the carbonate group. For repeating units having a cyclic carbonate ester group, see, for example, the descriptions in

[0127] to

[0133] of International Publication No. 2022 / 024928, which are incorporated herein by reference.

[0202] When the resin contains repeating units Y, the content of repeating units Y is preferably 1 mol% or more, and more preferably 10 mol% or more, relative to the total repeating units in the resin. Furthermore, the upper limit is preferably less than 40 mol%, and more preferably 35 mol% or less, relative to the total repeating units in the resin.

[0203] 《Repeating Units Having Photoacid Generating Groups》 The resin may contain repeating units (hereinafter simply referred to as "repeating unit P") that have a group that generates acid upon irradiation with active light or radiation (also called "photoacid generating group"), but it is also preferable that the resin does not contain repeating unit P. An example of repeating unit P is the repeating unit represented by formula (4).

[0204]

[0205] In formula (4), R ４１ L represents a hydrogen atom or a methyl group. ４１ L represents a single bond or a divalent linking group. ４２ R represents a divalent linking group. ４０ This represents a structural site that decomposes upon irradiation with active light or radiation, generating acid in the side chain.

[0206] In formula (4), L ４１ represents a single bond or a divalent linking group, and a single bond or -COO- is preferred. ４２ The symbols represent divalent linking groups, including alkylene groups, cycloalkylene groups, arylene groups, -O-, -CO-, -S-, -SO-, and -SO ２ A linking group consisting of at least one selected from the group consisting of - and -NR- is preferred. R represents a hydrogen atom or an organic group (preferably an organic group having 1 to 10 carbon atoms, such as an alkyl group, cycloalkyl group, or aryl group). The alkylene group may be linear or branched. The number of carbon atoms in the alkylene group is not particularly limited, but 1 to 10 is preferred. The cycloalkylene group may be monocyclic or polycyclic. The number of carbon atoms in the cycloalkylene group is not particularly limited, but 3 to 20 is preferred, and 5 to 15 is more preferred. The number of carbon atoms in the arylene group is not particularly limited, but 6 to 20 is preferred, and 6 to 10 is more preferred. The alkylene group, cycloalkylene group and arylene group may have substituents, and the substituent T mentioned above is an example of a substituent.

[0207] In formula (4), R ４０ The group is preferably represented by the following formula (S4-1).

[0208]

[0209] In equation (S4-1), Q － represents an acid residue, M ＋ * represents a cation. * represents L ４１ This indicates the bonding position. An acid residue is a group formed when a proton dissociates from an acid. Q － is a carboxylate anion group (COO － ), sulfonate anion group (SO ３ － ), or sulfonamide group (N － -SO ２ R Ｎ１ It is represented by R Ｎ１represents an organic group, and examples include organic groups having 1 to 10 carbon atoms, with alkyl groups, fluoroalkyl groups, or aryl groups being preferred. A sulfonate anion group is more preferred. ＋ Examples of cations represented by this symbol include the compound (A) described above and the cations contained in the photoacid generator described later.

[0210] Specific examples of repeating units P include, for example, the repeating units described in paragraphs

[0094] to

[0105] of Japanese Patent Publication No. 2014-041327, the repeating units described in paragraph

[0094] of International Publication No. 2018 / 193954, and the repeating units described in paragraph

[0138] of International Publication No. 2022 / 024928, and these descriptions are incorporated herein by reference. Furthermore, examples of repeating units represented by formula (4) include, for example, the repeating units described in paragraphs

[0094] to

[0105] of Japanese Patent Publication No. 2014-041327, and the repeating units described in paragraph

[0094] of International Publication No. 2018 / 193954, and these descriptions are incorporated herein by reference.

[0211] When the resin contains repeating units P, the content of repeating units P is preferably 1 mol% or more, more preferably 3 mol% or more, and even more preferably 5 mol% or more, relative to the total repeating units in the resin. Furthermore, the content of repeating units P is preferably less than 40 mol%, more preferably 30 mol% or less, and even more preferably 20 mol% or less, relative to the total repeating units in the resin.

[0212] (Repeating units represented by formula (V-1) or formula (V-2)) The resin may have repeating units represented by the following formula (V-1) or formula (V-2). It is preferable that the repeating units represented by formula (V-1) and the following formula (V-2) are different from the repeating units described above.

[0213]

[0214] In equation (V-1) and equation (V-2) below, R ６ and R ７Each of these independently represents a hydrogen atom, a hydroxyl group, an alkyl group, an alkoxy group, an acyloxy group, a cyano group, a nitro group, an amino group, a halogen atom, an ester group (-OCOR or -COOR: R is an alkyl group or fluorinated alkyl group having 1 to 6 carbon atoms), or a carboxyl group. As the alkyl group, linear, branched, or cyclic alkyl groups having 1 to 10 carbon atoms are preferred. ３ n represents an integer between 0 and 6. ４ X represents an integer between 0 and 4. ４ represents a methylene group, an oxygen atom, or a sulfur atom. Examples of repeating units represented by formula (V-1) or (V-2) include the repeating units described in paragraph

[0100] of International Publication No. 2018 / 193954, which are incorporated herein by reference.

[0215] 《Repeating units to reduce the mobility of the main chain》 A resin is preferable to have a high glass transition temperature (Tg) in order to suppress excessive diffusion of generated acid or pattern breakdown during development. The resin may have repeating units to reduce the mobility of the main chain in order to adjust the glass transition temperature. For repeating units to reduce the mobility of the main chain, refer to the contents of

[0144] to

[0160] of International Publication No. 2022 / 024928.

[0216] Repeating units having at least one group selected from lactone groups, sultone groups, carbonate groups, hydroxyl groups, cyano groups, and alkali-soluble groups. The resin may have repeating units having at least one group selected from lactone groups, sultone groups, carbonate groups, hydroxyl groups, cyano groups, and alkali-soluble groups. Examples of repeating units having lactone groups, sultone groups, or carbonate groups include the repeating units described for repeating unit Y above. The preferred content is also as described for repeating unit Y.

[0217] The resin may have repeating units having a hydroxyl group or a cyano group. This improves substrate adhesion. The repeating units having a hydroxyl group or a cyano group are preferably repeating units having saturated hydrocarbon groups (substituted with a hydroxyl group or a cyano group) that have a hydroxyl group or a cyano group. Alternatively, they may be repeating units having an alicyclic hydrocarbon structure substituted with a hydroxyl group or a cyano group. The repeating units having a hydroxyl group or a cyano group are preferably not having acid-degradable groups. Examples of repeating units having a hydroxyl group or a cyano group include the repeating units described in paragraphs

[0081] to

[0084] of Japanese Patent Application Publication No. 2014-098921, and the above description is incorporated herein by reference.

[0218] The resin may have repeating units having alkali-soluble groups. The inclusion of repeating units having alkali-soluble groups in the resin increases resolution in contact hole applications. Examples of alkali-soluble groups include carboxyl groups, sulfonamide groups, sulfonylimide groups, bissulfonylimide groups, and aliphatic alcohol groups (e.g., hexafluoroisopropanol group) whose α-position is substituted with an electron-withdrawing group, with carboxyl groups being preferred. Examples of repeating units having alkali-soluble groups include the repeating units described in paragraphs

[0085] and

[0086] of Japanese Patent Application Publication No. 2014-098921, which are incorporated herein by reference.

[0219] 《Repeating units having an alicyclic hydrocarbon structure and not exhibiting acid decomposition》 The resin may have repeating units having an alicyclic hydrocarbon structure and not exhibiting acid decomposition. This reduces the elution of low molecular weight components from the resist film into the immersion liquid during immersion exposure. Examples of repeating units having an alicyclic hydrocarbon structure and not exhibiting acid decomposition include repeating units derived from 1-adamantyl (meth)acrylate, diamantyl (meth)acrylate, tricyclodecanyl (meth)acrylate, or cyclohexyl (meth)acrylate.

[0220] 《Repeating units represented by formula (III) that do not have either a hydroxyl group or a cyano group》 The resin may have repeating units represented by formula (III) that do not have either a hydroxyl group or a cyano group.

[0221]

[0222] In formula (III), R ５ represents a hydrocarbon group having at least one cyclic structure and lacking both a hydroxyl group and a cyano group. Ra represents a hydrogen atom, an alkyl group, or -CH ２ -O-Ra ２ It represents the base. In the formula, Ra ２ represents a hydrogen atom, an alkyl group, or an acyl group. Examples of repeating units represented by formula (III) that do not have either a hydroxyl group or a cyano group include the repeating units described in paragraphs

[0087] to

[0094] of Japanese Patent Application Publication No. 2014-098921, which are incorporated herein by reference.

[0223] Other Repeating Units The resin may have other repeating units other than those described above. For other repeating units, see, for example, the descriptions in

[0141] to

[0143] and

[0169] to

[0170] of International Publication No. 2022 / 024928, which are incorporated herein by reference.

[0224] In addition to the repeating structural units described above, the resin may have various repeating structural units for the purpose of adjusting dry etching resistance, suitability for standard developers, substrate adhesion, resist profile, resolution, heat resistance, and sensitivity.

[0225] A preferred embodiment of the present invention is that the resin has at least one selected from the group consisting of lactone groups, carbonate groups, sultone groups, and saturated hydrocarbon groups having hydroxyl groups. Having at least one selected from the group consisting of lactone groups, carbonate groups, sultone groups, and saturated hydrocarbon groups having hydroxyl groups further improves etching resistance and LWR performance.

[0226] In a preferred embodiment of the present invention, the resin contains repeating units having iodine atoms. By including repeating units having iodine atoms in the acid-degradable resin, the absorption rate of EUV light and the like is increased, the effects of shot noise can be reduced, and the LWR performance is further improved.

[0227] The resin can be synthesized according to conventional methods (e.g., radical polymerization). According to the GPC method, the weight-average molecular weight (Mw) of the resin, expressed as polystyrene equivalent, is preferably 30,000 or less, more preferably 1,000 to 30,000, even more preferably 3,000 to 30,000, and particularly preferably 3,500 to 15,000. The polydispersity (molecular weight distribution, Mw / Mn) of the resin is preferably 1.0 to 5.0, more preferably 1.0 to 3.0, even more preferably 1.1 to 2.0, and particularly preferably 1.1 to 1.8. A lower polydispersity results in better resolution and resist shape, smoother sidewalls of the resist pattern, and superior roughness.

[0228] The resin content is preferably 30.0 to 99.9% by mass, more preferably 40.0 to 99.9% by mass, and even more preferably 60.0 to 90.0% by mass, based on the total solid content of the composition of the present invention. Only one type of resin may be used, or two or more types may be used. When two or more types are used, it is preferable that their total content is within the range of the above preferred content.

[0229] <Photoacid Generator> The composition of the present invention may contain a photoacid generator (also called "compound (S)"). Compound (S) is a compound that generates acid upon irradiation with active light or radiation. Preferably, compound (S) is a compound that generates an acid with a pKa of 2.0 or less upon irradiation with active light or radiation. The pKa of the acid generated from compound (S) upon irradiation with active light or radiation is preferably 2.0 or less, more preferably 1.0 or less, and even more preferably -0.5 or less. Furthermore, the pKa of the acid generated from compound (S) upon irradiation with active light or radiation is preferably -5.0 or higher, and more preferably -4.5 or higher.

[0230] Compound (S) may be in the form of a low molecular weight compound or a high molecular weight compound such as a resin. When compound (S) is in the form of a low molecular weight compound, the molecular weight of compound (S) is not particularly limited, but is preferably 100 to 3000, more preferably 150 to 2500, and even more preferably 200 to 2000. When compound (S) is in the form of a high molecular weight compound, compound (S) and the resin may be the same compound, or compound (S) may be a high molecular weight compound different from the resin. When the resin does not contain the repeating units having the photoacid generating group described above, it is preferable that the composition of the present invention contains compound (S) as a compound different from the resin. When the resin contains the repeating units having the photoacid generating group, the composition of the present invention may or may not contain compound (S) as a compound different from the resin.

[0231] For example, the compound (S) is "M ＋ X － Examples of compounds represented by '' (onium salts) include compounds that generate organic acids upon exposure. Examples of organic acids include sulfonic acids (aliphatic sulfonic acids, aromatic sulfonic acids, and camphor sulfonic acids, etc.), carboxylic acids (aliphatic carboxylic acids, aromatic carboxylic acids, and aralkyl carboxylic acids, etc.), carbonylsulfonylimide acid, bis(alkylsulfonyl)imide acid, and tris(alkylsulfonyl)methidic acid.

[0232] "M ＋ X － In the compound represented by ", M ＋ The symbol represents a cation, preferably an organic cation. The valency of the cation may be monovalent or divalent or higher. The cation is preferably a cation represented by formula (ZaI) (hereinafter also referred to as "cation (ZaI)") or a cation represented by formula (ZaII) (hereinafter also referred to as "cation (ZaII)").

[0233]

[0234] In the above formula (ZaI), R ２０１ , R ２０２ , and R ２０３Each of these independently represents an organic group. ２０１ , R ２０２ , and R ２０３ The number of carbon atoms in the organic group is preferably 1 to 30, and more preferably 1 to 20. ２０１ ~R ２０３ Two of these may bond to form a ring structure, and the ring may contain an oxygen atom, a sulfur atom, an ester group, an amide group, or a carbonyl group. ２０１ ~R ２０３ Examples of groups formed by the bonding of two of these include alkylene groups (e.g., butylene and pentylene groups) and -CH ２ -CH ２ -O-CH ２ -CH ２ - is an example. When the composition of the present invention is used as an EUV resist, R ２０１ ~R ２０５ Preferably, the cation contains a fluorine atom or an iodine atom as a substituent. Preferred embodiments of the cation represented by formula (ZaI) include cation (ZaI-1), cation (ZaI-2), cation (ZaI-3b), and cation (ZaI-4b), which will be described later.

[0235] First, let's explain the cation (ZaI-1). The cation (ZaI-1) is R in the above formula (ZaI). ２０１ ~R ２０３ It is an arylsulfonium cation in which at least one of the groups is an aryl group. ２０１ ~R ２０３ All of them may be aryl groups, or R ２０１ ~R ２０３ A portion of it may be an aryl group, and the remainder may be an alkyl group or a cycloalkyl group. ２０１ ~R ２０３ One of them is an aryl group, R ２０１ ~R ２０３ The remaining two of these may bond to form a ring structure, and the ring may contain an oxygen atom, a sulfur atom, an ester group, an amide group, or a carbonyl group. ２０１ ~R ２０３Examples of groups formed by the bonding of two of these include alkylene groups in which one or more methylene groups may be substituted with an oxygen atom, a sulfur atom, an ester group, an amide group, and / or a carbonyl group (e.g., butylene group, pentylene group, and -CH ２ -CH ２ -O-CH ２ -CH ２ Examples of arylsulfonium cations include triarylsulfonium cation, diarylalkylsulfonium cation, diarylcycloalkylsulfonium cation, aryldialkylsulfonium cation, and aryldicycloalkylsulfonium cation.

[0236] The aryl group contained in the arylsulfonium cation is preferably a phenyl group or a naphthyl group, with the phenyl group being more preferred. When the arylsulfonium cation has two or more aryl groups, the two or more aryl groups may be the same or different. The aryl group may be an aryl group having a heterocyclic structure containing an oxygen atom, a nitrogen atom, or a sulfur atom, etc. Examples of heterocyclic structures include pyrrole residues, furan residues, thiophene residues, indole residues, benzofuran residues, and benzothiophene residues. The alkyl or cycloalkyl group that the arylsulfonium cation may have is preferably a linear alkyl group having 1 to 15 carbon atoms, a branched alkyl group having 3 to 15 carbon atoms, or a cycloalkyl group having 3 to 15 carbon atoms, with methyl group, ethyl group, propyl group, n-butyl group, sec-butyl group, t-butyl group, cyclopropyl group, cyclobutyl group, or cyclohexyl group being more preferred.

[0237] The above aryl group may have substituents, and preferred substituents are alkyl groups (e.g., C1-C15), cycloalkyl groups (e.g., C3-C15), aryl groups (e.g., C6-C14), alkoxy groups (e.g., C1-C15), cycloalkylalkoxy groups (e.g., C1-C15), halogen atoms (e.g., fluorine and iodine), hydroxyl groups, carboxyl groups, ester groups, sulfinyl groups, sulfonyl groups, alkylthio groups, phenylthio groups, or alkyloxycarbonylalkyleneoxy groups. The above substituents may have further substituents if possible, and it is also preferable that the alkyl group has a halogen atom as a substituent to form a halogenated alkyl group such as a trifluoromethyl group. It is also preferable that the above substituents form an acid-degradable group in any combination. An acid-degradable group is a group that decomposes and increases in polarity upon the action of an acid, and it is preferable that the polar group is protected by a group that is eliminated upon the action of an acid.

[0238] Next, we will explain the cation (ZaI-2). The cation (ZaI-2) is R in formula (ZaI). ２０１ ~R ２０３ However, each of these independently represents a cation that does not have an aromatic ring. The term "aromatic ring" also includes aromatic rings containing heteroatoms. R ２０１ ~R ２０３ The number of carbon atoms in the organic group that does not have an aromatic ring is preferably 1 to 30, and more preferably 1 to 20. ２０１ ~R ２０３ The members are preferably alkyl groups, cycloalkyl groups, allyl groups, or vinyl groups, more preferably linear or branched 2-oxoalkyl groups, 2-oxocycloalkyl groups, or alkoxycarbonylmethyl groups, and even more preferably linear or branched 2-oxoalkyl groups.

[0239] R ２０１ ~R ２０３Examples of alkyl and cycloalkyl groups represented by include linear alkyl groups having 1 to 10 carbon atoms or branched alkyl groups having 3 to 10 carbon atoms (e.g., methyl group, ethyl group, propyl group, butyl group, and pentyl group), and cycloalkyl groups having 3 to 10 carbon atoms (e.g., cyclopentyl group, cyclohexyl group, and norbornyl group). ２０１ ~R ２０３ This may be further substituted with a halogen atom, an alkoxy group (e.g., having 1 to 5 carbon atoms), a hydroxyl group, a cyano group, or a nitro group.

[0240] Next, we will explain the cation (ZaI-3b). The cation (ZaI-3b) is a cation represented by the following formula (ZaI-3b).

[0241]

[0242] In formula (ZaI-3b), R １ｃ ~R ５ｃ Each of these independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, an alkoxy group, an aryloxy group, an alkoxycarbonyl group, an alkylcarbonyloxy group, a cycloalkylcarbonyloxy group, a halogen atom, a hydroxyl group, a nitro group, an alkylthio group, or an arylthio group. ６ｃ and R ７ｃ Each of these independently represents a hydrogen atom, an alkyl group (e.g., a t-butyl group), a cycloalkyl group, a halogen atom, a cyano group, or an aryl group. ｘ and R ｙ Each of these independently represents an alkyl group, a cycloalkyl group, a 2-oxoalkyl group, a 2-oxocycloalkyl group, an alkoxycarbonylalkyl group, an allyl group, or a vinyl group.

[0243] R １ｃ ~R ５ｃ Two or more of the following, R ５ｃ and R ６ｃ , R ６ｃ and R ７ｃ , R ５ｃ and R ｘ , and R ｘ and R ｙThese elements may be bonded to each other to form a ring, and each of these rings may independently contain an oxygen atom, a sulfur atom, a ketone group, an ester bond, or an amide bond. Examples of the above rings include aromatic or non-aromatic hydrocarbon rings, aromatic or non-aromatic heterorings, and polycyclic fused rings formed by the combination of two or more of these rings. Examples of rings include 3 to 10-membered rings, preferably 4 to 8-membered rings, and more preferably 5 or 6-membered rings.

[0244] R １ｃ ~R ５ｃ Two or more of the following, R ６ｃ and R ７ｃ , and R ｘ and R ｙ Examples of groups formed by the bonding include alkylene groups such as butylene and pentylene groups. The methylene group in the alkylene group may be substituted with a heteroatom such as an oxygen atom. ５ｃ and R ６ｃ , and R ５ｃ and R ｘ The groups formed by the bonding of these elements are preferably single bonds or alkylene groups. Examples of alkylene groups include methylene groups and ethylene groups.

[0245] R １ｃ ~R ５ｃ , R ６ｃ , R ７ｃ , R ｘ , R ｙ , and R １ｃ ~R ５ｃ Two or more of the following, R ５ｃ and R ６ｃ , R ６ｃ and R ７ｃ , R ５ｃ and R ｘ , and R ｘ and R ｙ The rings formed by the bonding of these elements to each other may have substituents.

[0246] Next, we will explain the cation (ZaI-4b). The cation (ZaI-4b) is a cation represented by the following formula (ZaI-4b).

[0247]

[0248] In equation (ZaI-4b), l represents an integer from 0 to 2, and r represents an integer from 0 to 8. １３ R represents a group containing a hydrogen atom, a halogen atom (e.g., a fluorine atom and an iodine atom), a hydroxyl group, an alkyl group, an alkyl halide, an alkoxy group, a carboxyl group, an alkoxycarbonyl group, or a cycloalkyl group (which may be a cycloalkyl group itself or a group containing a cycloalkyl group as part). These groups may have substituents. １４ R represents a hydroxyl group, a halogen atom (e.g., a fluorine atom and an iodine atom), an alkyl group, an alkyl halide, an alkoxy group, an alkoxycarbonyl group, an alkylcarbonyl group, an alkylsulfonyl group, a cycloalkylsulfonyl group, or a group containing a cycloalkyl group (which may be a cycloalkyl group itself or a group containing a cycloalkyl group in part). These groups may have substituents. １４ The fields in which multiple instances exist may be independent or distinct from each other. １５ Each of these independently represents an alkyl group, a cycloalkyl group, or a naphthyl group. １５ They may bond to each other to form a ring. Two R １５ When these atoms bond to each other to form a ring, the ring may contain heteroatoms such as oxygen atoms or nitrogen atoms. In one embodiment, two R １５ It is preferable that the alkyl group is an alkylene group and that they bond to each other to form a ring structure. The above alkyl group, the above cycloalkyl group, and the above naphthyl group, and the two R １５ The ring formed by the bonding of these elements may have substituents.

[0249] In formula (ZaI-4b), R １３ , R １４ and R １５ The alkyl group may be linear or branched. The alkyl group preferably has 1 to 10 carbon atoms. The alkyl group is preferably a methyl group, ethyl group, n-butyl group, or t-butyl group.

[0250] Next, we will explain equation (ZaII). In equation (ZaII), R ２０４ and R２０５ Each of these independently represents an aryl group, an alkyl group, or a cycloalkyl group. ２０４ and R ２０５ The aryl group is preferably a phenyl group or a naphthyl group, with the phenyl group being more preferred. Alternatively, it may be an aryl group having a heterocycle containing an oxygen atom, a nitrogen atom, or a sulfur atom. Examples of heterocycle aryl group skeletons include pyrrole, furan, thiophene, indole, benzofuran, and benzothiophene. ２０４ and R ２０５ The alkyl and cycloalkyl groups are preferably linear alkyl groups having 1 to 10 carbon atoms, branched alkyl groups having 3 to 10 carbon atoms (e.g., methyl group, ethyl group, propyl group, butyl group, or pentyl group), or cycloalkyl groups having 3 to 10 carbon atoms (e.g., cyclopentyl group, cyclohexyl group, or norbornyl group).

[0251] R ２０４ and R ２０５ The aryl group, alkyl group, and cycloalkyl group may each independently have substituents. ２０４ and R ２０５ Examples of substituents that the aryl group, alkyl group, and cycloalkyl group may have include alkyl groups (e.g., having 1 to 15 carbon atoms), cycloalkyl groups (e.g., having 3 to 15 carbon atoms), aryl groups (e.g., having 6 to 15 carbon atoms), alkoxy groups (e.g., having 1 to 15 carbon atoms), halogen atoms, hydroxyl groups, and phenylthio groups.

[0252] Specific examples of organic cations are shown below, but the present invention is not limited thereto.

[0253]

[0254]

[0255] The above M ＋ The organic cation represented by may be a cation in compound (A), or it may not be a cation in compound (A).

[0256] "M ＋ X －In the compound represented by ", X － The symbol represents an anion, preferably an organic anion. The valency of the anion may be monovalent or divalent or more. Examples of organic anions include those similar to the organic anions possessed by compound (A) (Z ｎ－ (Organic anions as such). Organic anions may be used individually or in combination of two or more.

[0257] The photoacid generator may be compound (A), or it may not be compound (A). Compound (A) and the photoacid generator may be the same compound. In a preferred embodiment, when the photoacid generator is compound (A), the above M ＋ The organic cation represented by is preferably a cation in compound (A).

[0258] Furthermore, it is preferable that the photoacid generator is at least one selected from the group consisting of compounds (I) to (II).

[0259] (Compound (I)) Compound (I) is a compound having one or more of the following structural sites X and one or more of the following structural sites Y, which generates an acid containing the following first acidic site derived from the following structural site X and the following second acidic site derived from the following structural site Y upon irradiation with active light or radiation. Structural site X: Anionic site A １ － and cation site M １ ＋ It consists of and is irradiated with active light or radiation, HA １ Structural site that forms the first acidic site represented by Structural site Y: Anionic site A ２ － and cation site M ２ ＋ It consists of and is irradiated with active light or radiation, HA ２ The structural site (I) that forms the second acidic site represented by satisfies the following condition I.

[0260] Condition I: In the above compound (I), the above cation site M in the above structural site X. １ ＋ and the cation portion M in the structural portion Y.２ ＋ to H ＋ The compound PI obtained by replacing the above structural site X is the cation site M １ ＋ to H ＋ HA is obtained by replacing it with １ The acid dissociation constant a1 originates from the acidic site represented by the above structure site Y, and the cation site M in the above structural site Y. ２ ＋ to H ＋ HA is obtained by replacing it with ２ It has an acid dissociation constant a2 derived from the acidic site represented by the above, and the acid dissociation constant a2 is greater than the acid dissociation constant a1.

[0261] Condition I will be explained in more detail below. If compound (I) is a compound that generates an acid having, for example, one first acidic site derived from structural site X and one second acidic site derived from structural site Y, then compound PI is "HA １ and HA ２ This falls under the category of "compounds having the above characteristics". More specifically, when the acid dissociation constants a1 and a2 of compound PI are determined, compound PI is "A １ － and HA ２ The pKa at which the compound becomes "a compound having " is the acid dissociation constant a1, and the above "A １ － and HA ２ Compounds having "A" １ － and A ２ － The pKa value at which the compound becomes "a compound having the above characteristics" is the acid dissociation constant a2.

[0262] If compound (I) is a compound that generates an acid having, for example, two first acidic sites derived from structural site X and one second acidic site derived from structural site Y, then compound PI is "two HA １ and one HA ２ This falls under the category of "compounds having one A". When the acid dissociation constant of compound PI is determined, compound PI is "a compound having one A １ － and one HA１ and one HA ２ The acid dissociation constant when a compound having " and " is formed, and " １ － and one HA １ and one HA ２ Compounds having "two A １ － and one HA ２ The acid dissociation constant when a compound having the two A's is obtained corresponds to the aforementioned acid dissociation constant a1. １ － and one HA ２ Compounds having "two A １ － and A ２ － The acid dissociation constant when a compound has the above-mentioned structure corresponds to the acid dissociation constant a2. In other words, in the case of compound PI, the above-mentioned cation site M in the above-mentioned structural site X. １ ＋ to H ＋ HA is obtained by replacing it with １ When a compound has multiple acid dissociation constants originating from the acidic site represented by , the value of acid dissociation constant a2 is greater than the largest of the multiple acid dissociation constants a1. １ － and one HA １ and one HA ２ Let aa be the acid dissociation constant when a compound having " １ － and one HA １ and one HA ２ Compounds having "two A １ － and one HA ２ When the acid dissociation constant for a compound having the above is denoted as ab, the relationship between aa and ab satisfies aa < ab.

[0263] The acid dissociation constants a1 and a2 are determined by the acid dissociation constant measurement method described above. The compound PI mentioned above corresponds to the acid generated when compound (I) is irradiated with active light or radiation. If compound (I) has two or more structural sites X, the structural sites X may be the same or different. Also, two or more of the above A１ － , and two or more of the above M １ ＋ These may be the same or different. In compound (I), the above A １ － and A above ２ － , and the above M １ ＋ and the above M ２ ＋ These may be the same or different, but A above １ － and A above ２ － It is preferable that they are all different.

[0264] In the above compound PI, the difference (absolute value) between the acid dissociation constant a1 (the maximum value if there are multiple acid dissociation constants a1) and the acid dissociation constant a2 is preferably 0.1 or more, more preferably 0.5 or more, and even more preferably 1.0 or more. There is no particular upper limit to the difference (absolute value) between the acid dissociation constant a1 (the maximum value if there are multiple acid dissociation constants a1) and the acid dissociation constant a2, but for example, it is 16 or less.

[0265] In the above compound PI, the acid dissociation constant a2 is preferably 20 or less, and more preferably 15 or less. The lower limit of the acid dissociation constant a2 is preferably -4.0 or higher.

[0266] In the above compound PI, the acid dissociation constant a1 is preferably 2.0 or less, and more preferably 0 or less. The lower limit of the acid dissociation constant a1 is preferably -20.0 or higher.

[0267] Anion part A １ － and anion part A ２ － This is a structural site containing a negatively charged atom or group of atoms, and examples include structural sites selected from the group consisting of formulas (AA-1) to (AA-3) and formulas (BB-1) to (BB-6) shown below. Anion site A １ －Preferably, it is an acidic moiety that can form an acidic moiety with a small acid dissociation constant, and among these, it is more preferably one of formulas (AA-1) to (AA-3), and even more preferably one of formulas (AA-1) and (AA-3). Also, anion moiety A ２ － For example, Anion part A １ － It is preferable that the acidic site can form an acidic site with a larger acid dissociation constant than the above, more preferably one of formulas (BB-1) to (BB-6), and even more preferably one of formulas (BB-1) and (BB-4). In formulas (AA-1) to (AA-3) and (BB-1) to (BB-6) below, * represents the bond position. In formula (AA-2), R Ａ R represents a monovalent organic group. Ａ The monovalent organic group represented by is not particularly limited, but examples include a cyano group, a trifluoromethyl group, and a methanesulfonyl group.

[0268]

[0269]

[0270] Cation site M １ ＋ and cation site M ２ ＋ This is a structural site containing a positively charged atom or group of atoms, for example, a monovalent organic cation. Examples of organic cations include M, as described in the above explanation of the photoacid generator. ＋ Examples include the same organic cations represented by [the formula shown].

[0271] (Compound (II)) Compound (II) is a compound having two or more of the above-mentioned structural sites X and one or more of the following structural sites Z, which generates an acid containing two or more of the above-mentioned first acidic sites derived from the above-mentioned structural sites X and the above-mentioned structural sites Z upon irradiation with active light or radiation. Structural site Z: A nonionic site capable of neutralizing acid

[0272] Definition of structural site X in compound (II), and A １ － and M １＋ The definition of is the definition of structural site X in compound (I) as described above, and A １ － and M １ ＋ This is synonymous with the definition of [the specified term], and the preferred embodiment is also the same.

[0273] In the above compound (II), the above cation moiety M in the above structural moiety X. １ ＋ to H ＋ In compound PII, which is obtained by replacing the above structural site X, the above cation site M １ ＋ to H ＋ HA is obtained by replacing it with １ The preferred range for the acid dissociation constant a1 derived from the acidic site represented by is the same as the acid dissociation constant a1 in compound PI. Note that if compound (II) is, for example, a compound that generates an acid having two of the first acidic sites derived from the structural site X and the structural site Z, then compound PII is "two HA １ This falls under the category of "a compound having one A". When the acid dissociation constant of this compound PII is determined, compound PII is "a compound having one A １ － and one HA １ The acid dissociation constant when a compound having " and " is formed, and " １ － and one HA １ Compounds having "two A １ － The acid dissociation constant when the compound becomes "a compound having " corresponds to the acid dissociation constant a1.

[0274] The acid dissociation constant a1 is determined by the acid dissociation constant measurement method described above. Compound PII refers to the acid generated when compound (II) is irradiated with active light or radiation. The two or more structural sites X may be the same or different. Two or more of the above A １ － , and two or more of the above M １ ＋ These may be the same or different.

[0275] The nonionic site in structural site Z that can neutralize the acid is not particularly limited, and is preferably a site containing a group that can electrostatically interact with a proton, or a functional group having electrons. Examples of groups that can electrostatically interact with a proton, or functional groups having electrons, include functional groups having a macrocyclic structure such as a cyclic polyether, or functional groups having a nitrogen atom with a lone pair of electrons that does not contribute to π-conjugation. A nitrogen atom having a lone pair of electrons that does not contribute to π-conjugation is, for example, a nitrogen atom having the substructure shown in the following formula.

[0276]

[0277] Examples of functional group substructures having a group or electron that can electrostatically interact with a proton include crown ether structures, azacrown ether structures, primary to tertiary amine structures, pyridine structures, imidazole structures, and pyrazine structures, with primary to tertiary amine structures being preferred.

[0278] Examples of non-cationic moieties that compound (I) and compound (II) may have include the anions described in International Publication No. 2022 / 024928, paragraphs

[0277] to

[0280] , which are incorporated herein by reference.

[0279] The content of the photoacid generator in the composition of the present invention is not particularly limited, but is preferably 0.5% by mass or more, more preferably 1.0% by mass or more, and even more preferably 5.0% by mass or more, relative to the total solid content of the composition of the present invention. Furthermore, the content of the photoacid generator is preferably 50.0% by mass or less, more preferably 45.0% by mass or less, even more preferably 40.0% by mass or less, particularly preferably 30.0% by mass or less, and most preferably 25.0% by mass or less, relative to the total solid content of the composition of the present invention. Only one type of photoacid generator may be used, or two or more types may be used. When two or more types of photoacid generators are used, it is preferable that their total content is within the range of the above preferred content.

[0280] [Acid Diffusion Control Agent] The composition of the present invention may contain an acid diffusion control agent. The acid diffusion control agent can act as a quencher that traps excess acid generated from the above-mentioned photoacid generator by irradiation (exposure) with active light or radiation, and suppresses the reaction of the acid-degradable resin in the unexposed area due to the excess acid. Note that the acid diffusion control agent is a different compound from the above-mentioned photoacid generator.

[0281] The type of acid diffusion control agent is not particularly limited, but examples include compounds selected from basic compounds (CA), low molecular weight compounds (CB) having a nitrogen atom and a group that is eliminated by the action of an acid, and compounds (CC) whose acid diffusion control ability is reduced or lost by irradiation with active light or radiation.

[0282] Basic Compounds (CA) As basic compounds (CA), compounds having a structure represented by any of the following formulas (A) to (E) are preferred. In formulas (B), (C), (D), and (E), * indicates a bond position.

[0283]

[0284] In formula (A), R ２００ ~R ２０２ Each of these independently represents a hydrogen atom, an alkyl group (preferably having 1 to 20 carbon atoms), a cycloalkyl group (preferably having 3 to 20 carbon atoms), or an aryl group (6 to 20 carbon atoms). ２００ ~R ２０２ At least two of them may be joined to form a ring. In formula (E), R ２０３ ~R ２０６ Each of these independently represents an alkyl group having 1 to 20 carbon atoms.

[0285] R in equations (A) and (E) ２００ , R ２０１ , R ２０２ , R ２０３ , R ２０４ , R ２０５ and R ２０６The alkyl group or cycloalkyl group represented by may have substituents. Preferred substituent alkyl groups include C1-C20 aminoalkyl groups, C1-C20 hydroxyalkyl groups, or C1-C20 cyanoalkyl groups. In formulas (A) and (E), R ２００ , R ２０１ , R ２０２ , R ２０３ , R ２０４ , R ２０５ and R ２０６ The alkyl group or cycloalkyl group represented by is preferably unsubstituted.

[0286] Examples of basic compounds (CA) include guanidine, aminopyrrolidine, pyrazole, pyrazoline, piperazine, aminomorpholine, aminoalkylmorpholine, and piperidine. The basic compound (CA) may also be a compound having at least one selected from the group consisting of an imidazole structure, a diazabicyclo structure, an onium hydroxide structure, an onium carboxylate structure, a trialkylamine structure, an aniline structure, and a pyridine structure. The basic compound (CA) may also be an alkylamine derivative having at least one selected from the group consisting of a hydroxyl group and an ether bond, or an aniline derivative having at least one selected from the group consisting of a hydroxyl group and an ether bond.

[0287] The difference between the pKa of the conjugate acid of the basic compound (CA) and the pKa of the acid generated from the photoacid generator (the value obtained by subtracting the pKa of the acid generated from the photoacid generator from the pKa of the conjugate acid of the basic compound (CA)) is preferably 1.00 or higher, more preferably 1.00 to 14.00, and even more preferably 2.00 to 13.00. Furthermore, the pKa of the conjugate acid of the basic compound (CA) is preferably, for example, 1.00 to 14.00, more preferably 3.00 to 13.00, and even more preferably 3.50 to 12.50.

[0288] Specific examples of basic compounds (CA) include, for example, the compounds described in paragraphs

[0132] to

[0136] of International Publication No. 2020 / 066824, which are incorporated herein by reference. Specific examples of low molecular weight compounds (CB) having a nitrogen atom and a group that is eliminated by the action of an acid include the compounds described in paragraphs

[0156] to

[0163] of International Publication No. 2020 / 066824, which are incorporated herein by reference.

[0289] Compounds (CC) whose acid diffusion control ability is reduced or lost by irradiation with active light or radiation. Specifically, examples of compounds (CC) include onium salts (CD) of acids that are relatively weak acids with respect to the acid generated from the above-mentioned photoacid generator, and basic compounds (CE) whose basicity is reduced or lost by irradiation with active light or radiation.

[0290] Compound (CD) may be a compound that generates acid upon exposure. Preferably, compound (CD) is a compound that generates an acid with a pKa of 1.00 or more greater than the acid generated from the photoacid generator. The difference between the pKa of the acid generated from compound (CD) and the pKa of the acid generated from the photoacid generator (the value obtained by subtracting the pKa of the acid generated from compound (N) or the photoacid generator from the pKa of the acid generated from compound (CD)) is preferably 1.00 or more, more preferably 1.00 to 10.00, even more preferably 1.00 to 5.00, and particularly preferably 1.00 to 3.00. Furthermore, the pKa of the acid generated from compound (CD) is preferably, for example, 0.50 to 10.00, more preferably 0.80 to 5.00, and even more preferably 1.00 to 5.00.

[0291] The compound (CD) is preferably an onium salt consisting of an anion and a cation. Examples of the compound (CD) include "M ＋ X － Examples include compounds represented by " (onium salts). ＋ represents a cation, preferably an organic cation. ＋ Examples include the same cations as those described in the above-mentioned photoacid generator. ＋The organic cation represented by may be a cation in compound (A), or it may not be a cation in compound (A). － The symbol represents an anion, preferably an organic anion. Examples of organic anions include those similar to those possessed by compound (A) (Z ｎ－ (Organic anions as such).

[0292] The acid diffusion control agent may be compound (A), or it may not be compound (A). Compound (S) and the acid diffusion control agent may be the same compound. In a preferred embodiment, when the acid diffusion control agent is compound (A), the above M ＋ The organic cation represented by is preferably a cation in compound (A).

[0293] In particular, when the above compound (CC) is an onium salt (CD) that is relatively weak acid with respect to the acid generated from the above photoacid generator, it is preferable that the above onium salt (CD) is a compound containing an anion part represented by any of the following formulas (BB-1) to (BB-7).

[0294]

[0295] Specific examples of onium salts (CD) include, for example, the compounds described in paragraphs

[0305] to

[0314] of International Publication No. 2020 / 158337, which are incorporated herein by reference. Specific examples of basic compounds (CE) include those described in paragraphs

[0137] to

[0155] and paragraph

[0164] of International Publication No. 2020 / 066824, which are incorporated herein by reference.

[0296] In addition to the compounds described above, other known compounds disclosed in paragraphs

[0627] to

[0664] of U.S. Patent Application Publication 2016 / 0070167A1, paragraphs

[0095] to

[0187] of U.S. Patent Application Publication 2015 / 0004544A1, paragraphs

[0403] to

[0423] of U.S. Patent Application Publication 2016 / 0237190A1, and paragraphs

[0259] to

[0328] of U.S. Patent Application Publication 2016 / 0274458A1 can also be suitably used as acid diffusion control agents, and such descriptions are incorporated herein by reference.

[0297] The molecular weight of the acid diffusion control agent is not particularly limited, but is preferably 100 to 3000, more preferably 150 to 2500, and even more preferably 200 to 2000.

[0298] The content of the acid diffusion control agent in the composition of the present invention is 1.0% by mass or more, preferably 1.0 to 40.0% by mass, more preferably 1.0 to 30.0% by mass, and even more preferably 2.0 to 25.0% by mass, based on the total solid content of the composition of the present invention. Only one type of acid diffusion control agent may be used, or two or more types may be used. When two or more types are used, it is preferable that their total content is within the range of the above preferred content.

[0299] When the composition of the present invention contains a photoacid generator and an acid diffusion control agent, the content of the acid diffusion control agent relative to the photoacid generator in the composition of the present invention (acid diffusion control agent / photoacid generator) is preferably 50 mol% or more, and more preferably 100 mol% or more, in terms of achieving superior effects of the present invention. The upper limit is preferably 500 mol% or less, and more preferably 300 mol% or less.

[0300] [Hydrophobic Resin] The composition of the present invention may also contain a hydrophobic resin as a resin different from the acid-degradable resin described above. The hydrophobic resin is preferably designed to be unevenly distributed on the surface of the resist film, but unlike surfactants, it does not necessarily need to have hydrophilic groups in its molecule and does not need to contribute to the uniform mixing of polar and nonpolar substances.

[0301] Hydrophobic resins, in terms of their uneven distribution on the film surface, contain fluorine atoms, silicon atoms, and CH4 atoms in the side chain portion of the resin. ３It is preferable that the substructure has one or more of these substructures, and more preferably two or more. Furthermore, the hydrophobic resin preferably has a hydrocarbon group having 5 or more carbon atoms. These groups may be present in the main chain of the resin or substituted in the side chain. Examples of hydrophobic resins include the compounds described in paragraphs

[0275] to

[0279] of International Publication No. 2020 / 004306, which are incorporated herein by reference.

[0302] When the composition of the present invention contains a hydrophobic resin, the content of the hydrophobic resin is preferably 0.01 to 20.0% by mass, more preferably 0.1 to 10.0% by mass, and even more preferably 0.1 to 5.0% by mass, based on the total solid content of the composition of the present invention. Only one type of hydrophobic resin may be used, or two or more types may be used. When two or more types are used, it is preferable that their total content is within the range of the above preferred content.

[0303] [Surfactants] The compositions of the present invention may contain surfactants. The inclusion of surfactants allows for superior adhesion and the formation of patterns with fewer development defects. Fluorine-based and / or silicone-based surfactants are preferred. Examples of fluorine-based and / or silicone-based surfactants include those disclosed in paragraphs

[0218] and

[0219] of International Publication No. 2018 / 193954.

[0304] When the composition of the present invention contains a surfactant, the surfactant content is preferably 0.0001 to 2.0% by mass, more preferably 0.0005 to 1.0% by mass, and even more preferably 0.01 to 1.0% by mass, based on the total solid content of the composition of the present invention. One type of surfactant may be used, or two or more types may be used. When two or more types are used, it is preferable that their total content is within the range of the above preferred content.

[0305] [Solvent] The composition of the present invention preferably contains a solvent. The solvent preferably contains (M1) propylene glycol monoalkyl ether carboxylate and (M2) at least one selected from the group consisting of propylene glycol monoalkyl ether, lactic acid ester, acetate ester, alkoxypropionic acid ester, linear ketone, cyclic ketone, lactone, and alkylene carbonate. The solvent may further contain components other than components (M1) and (M2). Details of components (M1) and (M2) are described in paragraphs

[0218] to

[0226] of International Publication No. 2020 / 004306, and these contents are incorporated herein by reference. The solvent content in the resist composition is preferably set so that the solid content concentration is 0.5 to 30% by mass, and more preferably 1 to 20% by mass. If the solvent further contains components other than components (M1) and (M2), the content of the components other than components (M1) and (M2) is preferably 5 to 30% by mass relative to the total amount of the solvent.

[0306] Bio-derived solvents can also be used as solvents. Examples of bio-derived solvents include those described in Japanese Patent Publication No. 2002-363135, U.S. Patent Application Publication No. 2015 / 0004664A1, International Publication No. 2025 / 106697, etc., as well as commercially available products such as the PURASOLV® ELECT series (see https: / / www.corbion.com / solutions / biochemical-specialties / electronics and https: / / www.corbion.com / - / media / Corbion / Files / PLA-PDFs-7-of-24 / brch-electronics-purasolv-eng-0421_940879.ashx). The bio-derived solvents described above can be purified using methods such as distillation and filtration as appropriate to achieve the purity required in the technical field of the present invention.

[0307] [Other Additives] The composition of the present invention may further contain, as other additives, at least one selected from the group consisting of dissolution inhibitors, dyes, plasticizers, photosensitizers, light absorbers, and compounds that promote solubility in the developer (for example, phenol compounds with a molecular weight of 1000 or less, or alicyclic or aliphatic compounds containing a carboxyl group). The above-mentioned "dissolution inhibitor" is a compound with a molecular weight of 3000 or less that decomposes due to the action of an acid, thereby reducing its solubility in an organic developer.

[0308] The content of other additives is not particularly limited, but may be 20.0% by mass or less, 10.0% by mass or less, or 5.0% by mass or less, relative to the total solid content of the composition of the present invention. Only one type of other additive may be used, or two or more types may be used. When two or more types are used, it is preferable that their total content is within the range of the above preferred content.

[0309] Furthermore, the composition of the present invention may contain water as an impurity. When water is present as an impurity, a smaller amount of water is preferable, but it may be present in an amount of 1 to 30,000 ppm by mass relative to the total resist composition. Furthermore, the composition of the present invention may contain residual monomers as impurities (for example, monomers derived from raw material monomers used in the synthesis of the resin). When residual monomers are present as impurities, a smaller amount of residual monomers is preferable, but it may be present in an amount of 1 to 30,000 ppm by mass relative to the total solid content of the composition of the present invention.

[0310] [Pattern Forming Method and Resist Film] The pattern forming method of the present invention is not particularly limited as long as it is a method of forming a pattern using the composition of the present invention, but a preferred pattern forming method comprises the steps of: (1) forming an active photosensitive or radiation-sensitive film (resist film) on a substrate using the composition of the present invention; (2) exposing the resist film; and (3) developing the exposed resist film using a developer. Each of the above steps will be described in detail below.

[0311] [Step (1)] Step (1) is a step of forming a resist film on a substrate using the composition of the present invention. Details of the composition of the present invention used in Step (1) are as described above.

[0312] One method for forming a resist film on a substrate using the composition of the present invention is to coat the resist composition onto the substrate. If necessary, it is preferable to filter the resist composition before coating. The pore size of the filter is preferably 0.1 μm or less, more preferably 0.03 μm or less, even more preferably 0.01 μm or less, and particularly preferably 0.005 μm or less. The lower limit of the pore size of the filter is not particularly limited, but may be 0.001 μm or more. The material of the filter is not particularly limited, but if it is a polymer, it is preferably a polymer containing polyolefins such as polyethylene (PE) and polypropylene (PP) (including high density and ultra-high molecular weight); polyamides such as nylon 6 and nylon 66; polyimide (PI); polyamideimide; polyesters such as polyethylene terephthalate; polyethersulfone; cellulose; polytetrafluoroethylene (PTFE) and polyfluorocarbons such as perfluoroalkoxyalkanes; derivatives of the above polymers; and more preferably at least one selected from the group consisting of polyolefins, polyamides, polyimides, polyamideimides, polyesters, polysulfones, cellulose, polyfluorocarbons and their derivatives. In addition to resin, materials such as diatomaceous earth and glass can also be used.

[0313] The filter used to filter the composition of the present invention may be one filter or two or more filters may be used in combination. If two or more filters are used, they may be the same filter or different filters. Furthermore, the composition of the present invention may be circulated and filtered repeatedly with the same filter.

[0314] The composition of the present invention can be applied to a substrate (e.g., silicon, silicon coated with silicon dioxide, etc.) used in the manufacture of integrated circuit elements by a suitable coating method such as a spinner or coater. Spin coating using a spinner is preferred. The rotation speed when spin coating using a spinner is preferably 1000 to 3000 rpm (rotations per minute). After applying the composition of the present invention, the substrate may be dried to form a resist film. If necessary, various undercoats (inorganic films, organic films, anti-reflective films, etc.) may be formed in the layer below the resist film.

[0315] As for drying methods, one example is drying by heating. Heating can be carried out using means provided in at least one of a normal exposure machine and a developer machine, and may also be carried out using a hot plate or the like. The heating temperature is not particularly limited, but is preferably 80 to 150°C, more preferably 80 to 140°C, and even more preferably 80 to 130°C. The heating time is not particularly limited, but is preferably 30 to 1000 seconds, more preferably 60 to 800 seconds, and even more preferably 60 to 600 seconds.

[0316] The present invention also includes a resist film obtained in step (1). The thickness of the resist film is not particularly limited, but 10 to 120 nm is preferred in that it is possible to form finer patterns with higher precision. In particular, when EUV exposure is used, the thickness of the resist film is more preferably 10 to 65 nm, and even more preferably 15 to 50 nm. When ArF immersion exposure is used, the thickness of the resist film is more preferably 10 to 120 nm, and even more preferably 15 to 90 nm.

[0317] A topcoat may be formed on the resist film using a topcoat composition. For example, it is preferable to form a topcoat containing a basic compound, such as that described in Japanese Patent Application Publication No. 2013-61648, on the resist film. Specific examples of basic compounds that the topcoat may contain include basic compounds that may be included in the composition of the present invention.

[0318] [Step (2)] Step (2) is a step of exposing the resist film formed in step (1). Methods of exposure include irradiating the formed resist film with active light or radiation through a predetermined mask. Examples of active light or radiation include infrared light, visible light, ultraviolet light, far ultraviolet light, extreme ultraviolet light, X-rays, and electron beams, preferably with a wavelength of 250 nm or less, more preferably 220 nm or less, and particularly preferably far ultraviolet light with a wavelength of 1 to 200 nm, specifically KrF excimer laser (248 nm), ArF excimer laser (193 nm), F ２ Examples include excimer lasers (157 nm), EUV (13.5 nm), X-rays, and electron beams. The compositions of the present invention are particularly suitable for pattern formation by EUV exposure or electron beam (EB) exposure. In other words, step (2) above is preferably a step of exposing the resist film using extreme ultraviolet light or an electron beam.

[0319] It is preferable to bake (heat) the image after exposure but before developing. This step is also called post-exposure bake (PEB). Baking promotes the reaction of the exposed area, resulting in better sensitivity and pattern shape. The baking temperature is not particularly limited, but is preferably 80 to 150°C, more preferably 80 to 140°C, and even more preferably 80 to 130°C. The baking time is not particularly limited, but is preferably 10 to 1000 seconds, more preferably 10 to 180 seconds, and even more preferably 30 to 120 seconds. Heating can be carried out using means provided in at least one of a normal exposure machine and developer machine, and may also be done using a hot plate or the like.

[0320] [Step (3)] Step (3) is a step in which the resist film exposed in step (2) is developed using a developer. By performing step (3), a resist pattern (also simply called a "pattern") is formed. The developer used in step (3) may be an alkaline developer or a developer containing an organic solvent (hereinafter also called an organic developer). Examples of development methods include immersing the substrate in a tank filled with developer for a certain period of time (dip method), puddling the developer on the substrate surface using surface tension and letting it stand for a certain period of time to develop (paddle method), spraying the developer onto the substrate surface (spray method), and continuously dispensing the developer while scanning a developer dispensing nozzle at a constant speed onto a substrate rotating at a constant speed (dynamic dispensing method). The development time is preferably 10 to 300 seconds, and more preferably 20 to 120 seconds. The temperature of the developer is preferably 0 to 50°C, and more preferably 15 to 35°C. In step (3), a step of stopping development while substituting with another solvent may be performed.

[0321] It is preferable to use an alkaline aqueous solution containing alkali as the alkaline developer. The type of alkaline aqueous solution is not particularly limited, but examples include alkaline aqueous solutions containing quaternary ammonium salts represented by tetramethylammonium hydroxide, inorganic alkalis, primary amines, secondary amines, tertiary amines, alcohol amines, or cyclic amines. Among these, it is preferable that the alkaline developer be an aqueous solution of a quaternary ammonium salt represented by tetramethylammonium hydroxide (TMAH). Appropriate amounts of alcohols, surfactants, etc., may be added to the alkaline developer. The alkali concentration of the alkaline developer is usually preferably 0.1 to 20% by mass. The pH of the alkaline developer is usually preferably 10.0 to 15.0.

[0322] The organic developer is preferably a developer containing at least one organic solvent selected from the group consisting of ketone solvents, ester solvents, alcohol solvents, amide solvents, ether solvents, and hydrocarbon solvents.

[0323] Bio-derived solvents can also be used as organic solvents in organic developing solutions. Examples of bio-derived solvents include those described in U.S. Patent Application Publication 2025 / 0068079A1, Proceedings of SPIE, 12957, 1295719 (2024), etc. The above-mentioned bio-derived solvents can be purified using methods such as distillation and filtration as appropriate to achieve the purity required in the technical field of the present invention.

[0324] The above organic solvents may be mixed in multiple quantities, or mixed with solvents other than the above organic solvents or with water. The water content of the organic developer as a whole is preferably less than 50% by mass, more preferably less than 20% by mass, even more preferably less than 10% by mass, and particularly preferably substantially water-free. The content of the organic solvent in the organic developer is preferably 50% by mass or more and 100% by mass or less, more preferably 80% by mass or more and 100% by mass or less, even more preferably 90% by mass or more and 100% by mass or less, and particularly preferably 95% by mass or more and 100% by mass or less, based on the total amount of the organic developer.

[0325] The organic developer preferably contains butyl acetate (n-butyl acetate), and more preferably contains butyl acetate and a hydrocarbon having 9 to 12 carbon atoms. The hydrocarbon having 9 to 12 carbon atoms contained in the organic developer may be just one type or two or more types. The hydrocarbon having 9 to 12 carbon atoms is preferably at least one selected from the group consisting of alkanes, alkenes, alkynes and cycloalkanes, more preferably an alkane, even more preferably at least one selected from the group consisting of nonanes, decanes, undecanes and dodecanes, particularly preferably at least one selected from the group consisting of undecanes and dodecanes, and most preferably undecanes. The hydrocarbon having 9 to 12 carbon atoms may also contain structural isomers.

[0326] The butyl acetate content in the organic developer is preferably 65% ​​to 99% by mass, more preferably 70% to 95% by mass, and even more preferably 75% to 90% by mass, based on 100% by mass of the entire organic developer. The hydrocarbon content (total amount if multiple hydrocarbons with 9 to 12 carbon atoms are included) in the organic developer is preferably 1% to 35% by mass, more preferably 5% to 30% by mass, and even more preferably 10% to 25% by mass, based on 100% by mass of the entire organic developer.

[0327] The mass ratio of butyl acetate to hydrocarbons having 9 to 12 carbon atoms in the organic developer (butyl acetate content / hydrocarbon content having 9 to 12 carbon atoms) is preferably 60 / 40 to 95 / 5, more preferably 70 / 30 to 95 / 5, even more preferably 80 / 20 to 90 / 10, and particularly preferably 90 / 10.

[0328] Organic developers may contain other components in addition to butyl acetate and hydrocarbons having 9 to 12 carbon atoms. Examples of other components include water, organic solvents other than butyl acetate and hydrocarbons having 9 to 12 carbon atoms, surfactants, antioxidants, and basic compounds.

[0329] [Other steps] The pattern forming method of the present invention may include other steps other than those described above.

[0330] <Rinsing Step> After step (3), rinsing may be performed. The rinsing solution is not particularly limited as long as it does not dissolve the pattern, and a solution containing a general solvent can be used. Preferably, the rinsing solution contains at least one organic solvent selected from the group consisting of hydrocarbon solvents, ketone solvents, ester solvents, alcohol solvents, amide solvents, and ether solvents. Bio-derived solvents can also be used as the rinsing solution. Examples of bio-derived solvents include the bio-derived solvents presented as organic solvents in the organic developer above.

[0331] The rinsing method is not particularly limited and includes, for example, a method in which rinsing liquid is continuously discharged onto a substrate rotating at a constant speed (rotary coating method), a method in which the substrate is immersed in a tank filled with rinsing liquid for a certain period of time (dip method), and a method in which rinsing liquid is sprayed onto the surface of the substrate (spray method).

[0332] Furthermore, the pattern forming method of the present invention may include a heating step (PB; Post Bake) after step (3). This step removes any developer and rinse solution remaining between and inside the patterns. This step also has the effect of mellowing the resist pattern and improving the surface roughness of the pattern. The heating step after step (3) may be performed at, for example, 40 to 250°C (preferably 90 to 200°C) for, for example, 10 seconds to 3 minutes (preferably 30 seconds to 120 seconds).

[0333] Alternatively, the formed pattern may be used as a mask to perform an etching process on the substrate. In other words, the pattern formed in step (3) may be used as a mask to process the substrate (or the underlying film and substrate) to form a pattern on the substrate. The method of processing the substrate (or the underlying film and substrate) is not particularly limited, but a preferred method is to form a pattern on the substrate by performing dry etching on the substrate (or the underlying film and substrate) using the pattern formed in step (3) as a mask. Dry etching is not particularly limited, but oxygen plasma etching is preferred.

[0334] In the pattern forming method of the present invention, the developer, the composition of the present invention, and various other materials (e.g., solvent, rinse solution, anti-reflective film forming composition, top coat forming composition, etc.) used are preferably free of impurities such as metals. The impurity content in these materials is preferably 1 ppm (parts per million) or less, more preferably 10 ppb (parts per billion) or less, even more preferably 100 ppt (parts per trillion) or less, particularly preferably 10 ppt or less, and most preferably 1 ppt or less. The lower limit of the impurity content is not particularly limited and may be 0 ppt or more. Examples of metal impurities include Na, K, Ca, Fe, Cu, Mg, Al, Li, Cr, Ni, Sn, Ag, As, Au, Ba, Cd, Co, Pb, Ti, V, W, and Zn.

[0335] Methods for reducing impurities such as metals contained in various materials include, for example, selecting raw materials with a low metal content as constituent materials for various materials, performing filter filtration on the constituent materials of various materials, and performing distillation under conditions that suppress contamination as much as possible, such as by lining the inside of the apparatus with Teflon®. Details of filtration using filters are described in paragraph

[0321] of International Publication No. 2020 / 004306.

[0336] In addition to filter filtration, impurities may be removed using adsorbents, or a combination of filter filtration and adsorbents may be used. Known adsorbents can be used, such as inorganic adsorbents like silica gel and zeolite, and organic adsorbents like activated carbon. To reduce impurities such as metals contained in the above materials, it is necessary to prevent the introduction of metal impurities during the manufacturing process. Whether metal impurities have been sufficiently removed from the manufacturing equipment can be confirmed by measuring the content of metal components in the cleaning solution used to clean the equipment. The content of metal components in the cleaning solution after use is preferably 100 ppt by mass or less, more preferably 10 ppt by mass or less, and even more preferably 1 ppt by mass or less. There is no particular lower limit, but 0 ppt by mass or more is preferred.

[0337] [Method for Manufacturing Electronic Devices] This specification relates to a method for manufacturing electronic devices, including the pattern forming method of the present invention described above, and to electronic devices manufactured by this manufacturing method. Preferred embodiments of the electronic devices of this specification include those mounted on electrical and electronic equipment (home appliances, OA (Office Automation), media-related equipment, optical equipment, and communication equipment, etc.).

[0338] The present invention will be described in more detail below based on the following examples. The materials, amounts used, proportions, processing content, and processing procedures shown in the following examples can be modified as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention should not be interpreted as being limited by the following examples.

[0339] [Various Components of Photosensitive or Radiation-Sensitive Resin Compositions] [Resins] The resins (resins MP-1 to MP-10) shown in Table 2 are described below. Resins MP-1 to MP-10 synthesized according to known methods are used. Table 1 shows the composition ratio, weight-average molecular weight (Mw), and dispersion (Mw / Mn) of each repeating unit. The weight-average molecular weight (Mw) and dispersion (Mw / Mn) of resins MP-1 to MP-10 can be measured by GPC (carrier: tetrahydrofuran (THF)) (in polystyrene equivalent). The composition ratio (mol% ratio) of the resins is as follows: １３ It can be measured using C-NMR (nuclear magnetic resonance).

[0340]

[0341] The structures of the repeating units M-1 to M-10 shown in Table 1 are shown below.

[0342]

[0343] [Photoacid Generator] The photoacid generators shown in Table 2 are onium salt compounds composed of the cations and anions shown in Table 2. The cations and anions (anions RA-1 to RA-5) that constitute the photoacid generators shown in Table 2 are shown below. Note that the cations listed here also include the cations that constitute the acid diffusion control agents described later (cations C-1 to C-16, RC-1 to RC-2). Me represents a methyl group.

[0344] <Cation>

[0345]

[0346] <Anion>

[0347] 《Synthesis of Cation C-1》 Cation C-1, which constitutes the photoacid generator, can be synthesized as shown in the following scheme, with reference to References 1 and 2.

[0348]

[0349] Reference 1: Mindaugas Siauciulis, Nanna Ahlsten, Alexander P. Pulis, David J. Procter. (2019). Transition-Metal-Free Cross-Coupling of Benzothiophenes and Styrenesin a Stereoselective Synthesis of Substituted (E,Z)-1,3-Dienes. Angew. Chem. Int. Ed. 58, 8779-8783. [DOI: 10.1002 / anie.201902903]. Reference 2: Fatih Sirindil, Sinead Maher, Michael Scholl, Kerstin Sander, Erik Arstad. (2022). Oxidation-Cyclization of Biphenyl Thioethers to Dibenzothiophenium Salts for Ultrarapid 18F-Labeling of PET Tracers. Int. J. Mol. Sci. 2022, 23, 15481. [DOI: 10.3390 / ijms232415481].

[0350] In this example, mCPBA represents metachloroperbenzoic acid, and Tf represents a trifluoromethylsulfonyl group. The counter anion of the above compound having cation C-1 can then be replaced with the anion listed in the table below according to known methods to obtain a photoacid generator for use in resist compositions.

[0351] 《Synthesis of Other Cations》 Other cations can also be synthesized using the same method as cation C-1.

[0352] [Acid Diffusion Control Agents] The acid diffusion control agents shown in Table 2 are onium salt compounds composed of the cations and anions shown in Table 2. The cations and anions (anions RQ-1 to RQ-4) that constitute the acid diffusion control agents shown in Table 2 are shown below.

[0353] <Cation> The cations are described as the cations that constitute the photoacid generator described above (cations C-1 to C-16, RC-1 to RC-2).

[0354] <Anion>

[0355]

[0356] [Hydrophobic Resins] The hydrophobic resins (Resin AP-1) shown in Table 2 are described below. In the structural formulas of the hydrophobic resins shown below, the content of each repeating unit is the content ratio (mol%) of each repeating unit to the total number of repeating units.

[0357]

[0358] [Surfactants] The surfactants shown in Table 2 are listed below. W-1: Megafac R08 (manufactured by Dainippon Ink and Chemicals, Inc.)

[0359] [Solvents] The solvents shown in Table 2 are as follows: S-1: Propylene glycol monomethyl ether acetate (PGMEA: 1-methoxy-2-acetoxypropane) S-2: Propylene glycol monomethyl ether (PGME: 1-methoxy-2-propanol) S-3: Ethyl lactate S-4: γ-butyrolactone

[0360] [Preparation of Resist Compositions] The components shown in Table 2 below are dissolved in the solvents shown in the table to prepare solutions at the solid content concentrations shown in Table 2. These solutions are then filtered through a polyethylene filter with a pore size of 0.02 μm to prepare the resist compositions (R-1 to R-32, RR-1 to RR-2). In the table, the "Content (mass %)" column indicates the content (mass ratio) of each component relative to the total solid content in the resist composition. Solid content refers to components other than the solvent. In resist compositions using surfactants, the surfactant content is set to 0.1 mass %. The "mass ratio" of the solvent is the content of each solvent listed in the "Type" column relative to the total solvent (total content of the solvents listed in the "Type" column). In Table 2, the "Molar Ratio (%)" column indicates the molar ratio (%) of the acid diffusion control agent content to the photoacid generator content in each resist composition. The molar ratio (%) is calculated as (amount of substance of acid diffusion control agent / amount of substance of photoacid generator) × 100 (%).

[0361] In resist composition R-26, the photoacid generator contains 7.5% by mass of a compound composed of cation C-1 and anion RA-1, and 5.4% by mass of a compound composed of cation C-1 and anion RA-3. In resist composition R-28, the photoacid generator contains 6.7% by mass of a compound composed of cation C-1 and anion RA-2, and 3.1% by mass of a compound composed of cation C-1 and anion RA-3. In resist composition R-27, the acid diffusion control agent contains 6.8% by mass of a compound composed of cation C-4 and anion RQ-1, and 5.4% by mass of a compound composed of cation C-4 and anion RQ-3. In resist composition R-28, the acid diffusion control agent contains 7.0% by mass of a compound composed of cation C-1 and anion RQ-1, and 3.5% by mass of a compound composed of cation C-1 and anion RQ-3.

[0362]

[0363]

[0364] <Pattern Formation Method (EB Exposure)> The resist composition is applied to a 6-inch Si wafer that has been pre-treated with hexamethyldisilazane (HMDS) using a Tokyo Electron Mark 8 spin coater, and dried on a hot plate at 100°C for 60 seconds to obtain a resist film with a thickness of 100 nm. Here, 1 inch is 0.0254 m. Similar results can be obtained by changing the Si wafer to a chromium substrate. The wafer coated with the resist film obtained above is subjected to pattern irradiation using an electron beam lithography system (Hitachi Ltd. HL750, acceleration voltage 50 keV). At this time, the drawing is performed so that a 1:1 line and space pattern is formed. After electron beam lithography, post-exposure heating (PEB) is performed by heating on a hot plate at 110°C for 60 seconds, developing with a 2.38% by mass aqueous solution of tetramethylammonium hydroxide for 30 seconds, rinsing with pure water, rotating the wafer at 4000 rpm for 30 seconds, and then heating at 95°C for 60 seconds to obtain a resist pattern with a 1:1 line-and-space pattern and a line width of 50 nm.

[0365] <LWR Evaluation Method> A line-and-space pattern (line / space = 1 / 1) with a line width of 50 nm, resolved by the method described above, is observed from above using a length-measuring scanning electron microscope (SEM (Hitachi S-9380II)). The line width of the pattern is observed at arbitrary points (160 points), and the measurement variability of 3σ (nm) is evaluated as the LWR value. A smaller value indicates better performance.

[0366] <Temporal stability of the coated film> The electron beam irradiation dose (μC / cm²) used when forming a 1:1 line-and-space pattern with a line width of 50 nm obtained by the method described above. ２The electron beam irradiation dose (μC / cm²) used to form the pattern is measured and defined as the "exposure dose before time elapsed". Next, the coated films of each composition used above are stored at 40°C for 3 months, and a 1:1 line-and-space pattern with a line width of 50 nm is formed using the same pattern formation method as described above. ２ The exposure over time is measured and defined as the "exposure amount after time has passed". The rate of change in sensitivity is calculated based on the following formula and evaluated according to the evaluation criteria below. In practical terms, a rating of "B" or higher is preferable, and "A" is more preferable. Rate of change in sensitivity (%) = (exposure amount after time has passed - exposure amount before time has passed) / exposure amount before time has passed × 100 (Evaluation criteria) A: Rate of change in sensitivity is less than 1% B: Rate of change in sensitivity is 1% or more and less than 2% C: Rate of change in sensitivity is 2% or more and less than 5% D: Rate of change in sensitivity is 5% or more

[0367] Table 3 is shown below.

[0368]

[0369] The results shown in Table 3 clearly demonstrate that the resist compositions of the examples are capable of forming patterns with excellent LWR and also exhibit excellent long-term stability of the coated film. Furthermore, the results of the examples confirm that when the content (mol% ratio) of the acid diffusion control agent relative to the photoacid generator is 50 mol% or more (preferably 100 mol% or more), the LWR is even better (see the results of Examples 1-14 and 1-15 in particular).

[0370] [Pattern Formation (EUV Exposure)] A base layer formation composition AL412 (manufactured by Brewer Science) is applied to a silicon wafer and baked at 205°C for 60 seconds to form a 20 nm thick base layer. A resist composition is then applied on top of this and baked at 100°C for 60 seconds to form a 50 nm thick resist film. Pattern irradiation is performed on the silicon wafer having the obtained resist film using an EUV exposure apparatus (Exitech Micro Exposure Tool, NA 0.3, Quadrupol, outer sigma 0.68, inner sigma 0.36). A mask with a line size of 50 nm and a line-to-space ratio of 1:1 is used as the rectil. After exposure, the resist film is baked at 100°C for 60 seconds, then developed with an aqueous solution of tetramethylammonium hydroxide (2.38% by mass) for 30 seconds, followed by rinsing with pure water for 30 seconds. Finally, it is spin-dried to obtain a positive-type pattern.

[0371] [LWR Evaluation Method] The LWR evaluation method for the pattern formed by EUV exposure is performed using the same method as the LWR evaluation method shown in "Pattern Formation (EB Exposure)" above.

[0372] <Temporal stability of the coated film> EUV irradiation dose (mJ / cm²) when forming a 1:1 line-and-space pattern with a line width of 50 nm obtained by the method described above. ２ The amount of EUV irradiation (mJ / cm²) used to form the pattern is measured and defined as the "exposure amount before time elapsed". Next, the coated films of each composition used above are stored at 40°C for 3 months, and a 1:1 line-and-space pattern with a line width of 50 nm is formed using the same pattern formation method as described above. ２ The exposure over time is measured and defined as the "exposure amount after time has passed". Next, the rate of change in sensitivity is calculated based on the following formula and evaluated according to the evaluation criteria below. In practical terms, a score of "B" or higher is preferable, and "A" is more preferable. Rate of change in sensitivity (%) = (exposure amount after time has passed - exposure amount before time has passed) / exposure amount before time has passed × 100 (Evaluation criteria) A: Rate of change in sensitivity is less than 1% B: Rate of change in sensitivity is 1% or more and less than 2% C: Rate of change in sensitivity is 2% or more and less than 5% D: Rate of change in sensitivity is 5% or more

[0373] Table 4 is shown below.

[0374]

[0375] The results shown in Table 4 clearly demonstrate that the resist compositions of the examples are capable of forming patterns with excellent LWR and also exhibit excellent long-term stability of the coated film. Furthermore, the results of the examples confirm that when the content (mol% ratio) of the acid diffusion control agent relative to the photoacid generator is 50 mol% or more (preferably 100 mol% or more), the LWR is even better (see the results of Examples 2-14 and 2-15 in particular).

[0376] The present invention provides a photosensitive or radiation-sensitive resin composition that can form patterns with excellent LWR and also exhibits excellent temporal stability of the coated film. Furthermore, the present invention provides a photosensitive or radiation-sensitive film formed using the above photosensitive or radiation-sensitive resin composition, a pattern formation method using the above photosensitive or radiation-sensitive resin composition, and a method for manufacturing an electronic device.

[0377] Although the present invention has been described in detail and with reference to specific embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention. This application is based on Japanese Patent Application No. 2025-051842 filed on 26 March 2025, the contents of which are incorporated herein by reference.

Claims

1. An actinic ray-sensitive or radiation-sensitive resin composition comprising a resin and a compound represented by formula (1A) or formula (2A). In formula (1A) and formula (2A), Ar １ and Ar ３ each independently represent a divalent aromatic ring group. Ar ２ each independently represent a trivalent aromatic ring group. X １ and X ２ each independently represent a single bond or a divalent linking group. Ar １１ , Ar １２ , and Ar １３ each independently represent a trivalent aromatic ring group. X １１ , X １２ , and X １３ each independently represent a single bond or a divalent linking group. Z ｎ－ each independently represent an anion. m each independently represents an integer of 1 or more, and n each independently represents an integer of 1 or more.

2. The photosensitive or radiation-sensitive resin composition according to claim 1, wherein the compound represented by formula (1A) or formula (2A) is the compound represented by formula (1B) or formula (2B). In formula (1B) and formula (2B), X １ and X ２ Each of these independently represents a single bond or a divalent linking group. １ ~R ３ Each of these independently represents a substituent. １ ~R ３ At least two of these may be joined together to form a ring. １ ~R ３ If there are multiple instances of R, then there are multiple instances of R １ ~R ３ The elements may be identical or different from one another. １ ~R ３ If there are multiple instances of R, then there are multiple instances of R １ These elements may combine with each other to form a ring, and there may be multiple R elements. ２ These elements may combine with each other to form a ring, and there may be multiple R elements. ３ These elements may be joined together to form a ring. o represents an integer from 0 to 4. p represents an integer from 0 to 3. q represents an integer from 0 to 4. X １１ , X １２ , and X １３ Each of these independently represents a single bond or a divalent linking group. １１ ~R １３ Each of these independently represents a substituent. １１ ~R １３ At least two of these may be joined together to form a ring. １１ ~R １３ If there are multiple instances of R, then there are multiple instances of R １１ ~R １３ The elements may be identical or different from one another. １１ ~R １３ If there are multiple instances of R, then there are multiple instances of R １１ These elements may combine with each other to form a ring, and there may be multiple R elements. １２ These elements may combine with each other to form a ring, and there may be multiple R elements. １３ These elements may be joined together to form a ring. r, s, and t each independently represent an integer between 0 and 3. Z ｎ－ Each of the 'm' and 'n' independently represents an anion. Each of the 'm' and 'n' independently represents an integer of 1 or greater.

3. The photosensitive or radiation-sensitive resin composition according to claim 1 or 2, wherein the compound represented by formula (1A) or formula (2A) does not have a fluorine atom-containing substituent.

4. The photosensitive or radiation-sensitive resin composition according to claim 1 or 2, wherein the resin comprises repeating units having acid-degradable groups.

5. The photosensitive or radiation-sensitive resin composition according to claim 1 or 2, wherein the resin has repeating units having phenolic hydroxyl groups.

6. The photosensitive or radiation-sensitive resin composition according to claim 4, wherein the repeating unit having the acid-degradable group includes a repeating unit represented by formula (P1). In formula (P1), R ｂ１ and R ｂ２ Each of these independently represents either a hydrogen atom or an alkyl group. ｂ１ Ar represents a single bond or a -COO- bond. ｂ１ This represents an s+t+1 valent aromatic ring group. ｂ１ is, -OR ｂ or -COOR ｂ Represents R ｂ R represents a leaving group. ｂ３ is, -OR ｂ and -COOR ｂ Represents a substituent different from the given one. s represents an integer greater than or equal to 1. t represents an integer greater than or equal to 0. R ｂ１ and Ar ｂ１ They may be bonded to each other via single bonds or divalent linking groups to form a ring, R ｂ and R ｂ３ They may be bonded to each other via single bonds or divalent linking groups to form a ring, R ｂ３ They may be bonded to each other via single bonds or divalent linking groups to form a ring, R ｂ These elements may be linked to each other via single bonds or divalent linking groups to form a ring.

7. The Z in formula (1A) or formula (2A) ｎ－ The photosensitive or radiation-sensitive resin composition according to claim 1 or 2, wherein it has an organic anion represented by formula (a-1). In the formula, Ar ａ１ This represents a monovalent aromatic ring group or a monovalent aliphatic hydrocarbon group.

8. The Z in formula (1A) or formula (2A) ｎ－ The photosensitive or radiation-sensitive resin composition according to claim 1 or 2, wherein it has an organic anion represented by formula (b-1). In the formula, Ar ｂ１ This represents a monovalent aromatic ring group.

9. The photosensitive or radiation-sensitive resin composition according to claim 1 or 2, wherein the composition contains a photoacid generator and an acid diffusion control agent, and the content of the acid diffusion control agent relative to the photoacid generator is 50 mol% or more.

10. The photosensitive or radiation-sensitive resin composition according to claim 1 or 2, wherein the composition contains a photoacid generator and an acid diffusion control agent, and the content of the acid diffusion control agent relative to the photoacid generator is 100 mol% or more.

11. A photosensitive or radiation-sensitive film formed using the photosensitive or radiation-sensitive resin composition according to claim 1 or 2.

12. A pattern forming method comprising the steps of: forming a resist film on a substrate using the photosensitive or radiation-sensitive resin composition described in claim 1 or 2; exposing the resist film; and developing the exposed resist film using a developer.

13. A method for manufacturing an electronic device, comprising the pattern forming method described in claim 12.

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