Liquid discharge head, recording device, and method for prodcuing liquid discharge head

Abstract

In this liquid discharge head, a first flow path member has a plurality of nozzles that open toward a first side. One or more flexible substrates have an overlapping portion that faces the first flow path member from a second side opposite from the first side. A plurality of layers overlap the overlapping portions from the second side. The plurality of layers include a first adhesive that adheres to the overlapping portions. In a planar perspective view, the arrangement region of the plurality of nozzles includes a non-overlapping region in which none of the overlapping portions overlap. At least one of the plurality of layers has a void that overlaps the non-overlapping region in the planar perspective view.

Description

Liquid ejection head, recording apparatus, and method for manufacturing liquid ejection head

[0001] The present disclosure relates to a liquid ejection head such as an inkjet head, a recording apparatus including the liquid ejection head, and a method for manufacturing a liquid ejection head.

[0002] A liquid ejection head (e.g., an inkjet head) that ejects liquid (e.g., ink) toward a medium (e.g., paper) is known (see, for example, Patent Document 1 below). In Patent Document 1, the liquid ejection head includes a plate-shaped first flow path member having nozzles that eject liquid formed with openings therein, and a plate-shaped second flow path member stacked on the opposite side of the first flow path member from the side where the nozzles are open, the second flow path member supplying liquid to the first flow path member. A recess is formed on the surface of the second flow path member on the side of the first flow path member. That is, a space is formed between the first flow path member and the second flow path member. This space accommodates an actuator that applies pressure for ejecting liquid into the first flow path member, and a part of a flexible substrate for inputting a drive signal to the actuator.

[0003] Japanese Patent Application Laid-Open No. 2023-25267

[0004] A liquid ejection head according to an aspect of the present disclosure includes a first flow path member, one or more flexible substrates, and a plurality of layers. The first flow path member has a plurality of nozzles opening toward a first side. The one or more flexible substrates each have an overlapping portion facing the first flow path member from a second side opposite the first side. The plurality of layers overlap the overlapping portion from the second side. The plurality of layers include a first adhesive that is in close contact with the overlapping portion. In planar perspective, the arrangement area of the plurality of nozzles includes a non-overlapping area that does not overlap any of the overlapping portions. At least one of the plurality of layers has a void that overlaps the non-overlapping area in planar perspective.

[0005] A recording apparatus according to an aspect of the present disclosure includes the above liquid ejection head, and a moving device that relatively moves the liquid ejection head and a medium.

[0006] A method for manufacturing a liquid dispensing head according to one aspect of the present disclosure comprises applying pressure in the lamination direction to the overlapping portion and two or more layers, including the first adhesive, among the plurality of layers. At least one of the two or more layers has the void.

[0007] A side view of the recording device according to the embodiment. A plan view of the recording device of Figure 1. An exploded perspective view of the liquid discharge head according to the first embodiment. A cross-sectional view along the line IV-IV in Figure 3. A perspective view showing the first and second flow path members of the liquid discharge head of Figure 3. A plan perspective view of region VI in Figure 5. A cross-sectional view along the line VII-VII in Figure 6. An enlarged view of region VIII in Figure 4. An enlarged view of region IX in Figure 8, which is a cross-sectional view illustrating a first specific example according to the first embodiment. A cross-sectional view illustrating a second specific example according to the first embodiment. A cross-sectional view illustrating a third specific example according to the first embodiment. A cross-sectional view illustrating a fourth specific example according to the first embodiment. An exploded perspective view of the liquid discharge head according to the second embodiment. A cross-sectional view showing a part of the liquid discharge head of Figure 13, which is a cross-sectional view illustrating a fourth specific example according to the second embodiment. An enlarged view of region XV in Figure 14. A perspective view showing a specific example of the tab of the liquid discharge head of Figure 13. A cross-sectional view illustrating a fifth specific example according to the second embodiment. A cross-sectional view illustrating a third embodiment. An exploded perspective view of the liquid discharge head according to the fourth embodiment.

[0008] Regarding aspects described later among multiple aspects, only the differences from the previously described aspects will be discussed. Unless otherwise specified, matters may be treated the same as those described earlier, or inferred from those previously described. Multiple aspects may be combined as appropriate. From another perspective, regardless of the order of explanation, a description of one aspect may be applied to other aspects, provided that no contradictions arise. For the sake of convenience, corresponding configurations in multiple aspects may be assigned the same reference numerals, even if there are differences.

[0009] The diagrams used in the following explanation are schematic. Therefore, for example, certain shapes and / or dimensions may be exaggerated, or details may be omitted. Also, the dimensional ratios of the same component do not necessarily match between drawings. The dimensional ratios in the drawings may differ from those in the specification. However, the above does not negate the possibility of extracting shape and / or dimensional features from the drawings.

[0010] For convenience, the drawings may be labeled with the Cartesian coordinate system D1, D2, and D3, and terms such as the D1 direction, D2 direction, and D3 direction may be used. The recording device, etc., according to the embodiment may be used in any orientation. However, for convenience, unless otherwise specified, an example may be given in which the +D3 side is upward, and expressions based on this configuration may be used.

[0011] Generally, the terms "adhesion" (or "adhesive") and "tackiness" (or "adhesive agent") are sometimes distinguished as distinct entities, or the latter may be considered a type of the former. In the description of the embodiments, unless it causes inconsistencies, please interpret "adhesion" as referring to a broad concept that includes "tackiness."

[0012] The term "shape" may or may not include dimensions. Either interpretation is acceptable as long as it does not create a contradiction. Furthermore, regarding terms describing shape (e.g., "cuboid"), unless otherwise specified and as long as it does not create a contradiction, it is acceptable for there to be unique aspects or errors, provided that there is no significant practical difference in the function of the shape. The same applies to position, etc.

[0013] A "slit" is defined as a through-hole in which, when viewed in the direction of penetration, the length in the longitudinal direction (the maximum length in the longitudinal direction if the planar shape of the through-hole is not rectangular; the same applies to the short-side direction) is by a certain extent longer than the length (width) in the short-side direction. Whether or not something is a slit can be determined reasonably (the ratio of the length in the longitudinal direction to the length in the short-side direction is arbitrary), but for example, anything where the length in the longitudinal direction is 5 times or more, or 10 times or more, than the length in the short-side direction may be considered a slit.

[0014] (Outline of Embodiments) Figure 3 is an exploded perspective view showing at least a part of the head 3 (an example of a liquid ejection head) according to the first embodiment. The head 3 is constructed by roughly stacking the components shown in Figure 3. The head 3 ejects liquid (e.g., ink) downwards in the figure (towards -D3). This allows printing to be performed on media (e.g., paper) located below the head 3.

[0015] Head 3 has the following components in order from the -D3 side, for example: ・First flow path member 5: For example, it has a plurality of nozzles 19 (Figure 7) for discharging liquid on its lower surface (discharge surface 5a). ・Actuator substrate 7: For example, it has a plurality of actuators 21 (Figure 7) for applying pressure to the first flow path member 5 for discharging liquid. ・Flexible substrate 9: For example, it has an overlapping portion 9a facing the actuator substrate 7 (or the upper surface 5b of the first flow path member 5 in another view). The overlapping portion 9a is fixed to the actuator substrate 7 and electrically connected, and contributes to the transmission of drive signals to the plurality of actuators 21. ・Adhesive layer 11: For example, it adheres the overlapping portion 9a to the overlapping plate 13 described below. ・Overlapping plate 13: For example, it contributes to positional regulation of the overlapping portion 9a, heat dissipation of the portion of head 3 below the overlapping plate 13, and / or equalization of heat in head 3. - Heat conduction layer 15: For example, it contributes to transferring heat from the stacking plate 13 to the second flow channel member 17 described below. - Second flow channel member 17: For example, it supplies liquid to the first flow channel member 5.

[0016] The head 3 has two flexible substrates 9 (and thus two overlapping portions 9a). The tips (ends in the D2 direction) of the two overlapping portions 9a face each other with a gap G1 in between. Therefore, in a planar perspective view (viewed in the D3 direction), the actuator substrate 7 includes a non-overlapping region (sometimes denoted by the symbol G1) in which neither of the overlapping portions 9a overlap.

[0017] The non-overlapping region G1 is the region where the overlapping portion 9a is not located in the planar perspective view, and for convenience, its position in the D3 direction may be expressed without strict accuracy. For example, in the D3 direction, the non-overlapping region G1 may be expressed as being located at the position of the overlapping portion 9a, or as being located at the actuator substrate 7. Similarly, the position of the gap G1 in the D3 direction may also be expressed without strict accuracy.

[0018] Furthermore, the non-overlapping region G1 may be defined in a planar perspective not as the region containing the actuator substrate 7, but as the region containing the arrangement region of the multiple nozzles 19, and / or the region containing the multiple pressurizing chambers 23 (Figure 7) that apply pressure to the multiple nozzles 19 for discharge. For convenience, in the description of the embodiment, the actuator substrate 7, the arrangement region of the multiple nozzles 19, and the arrangement region of the multiple pressurizing chambers 23 may not be distinguished (these terms may be substituted for each other as long as no contradictions arise). The arrangement region of the multiple nozzles 19 may be defined, for example, by the smallest convex polygon (which may be limited to a quadrilateral) that encompasses all the nozzles 19 (excluding dummy nozzles that do not discharge liquid). The arrangement region of the multiple pressurizing chambers 23 is similar.

[0019] Figure 4 is a cross-sectional view taken along the line IV-IV in Figure 3. As previously described, in head 3, the first flow channel member 5, actuator substrate 7, two overlapping parts 9a, adhesive layer 11, overlapping plate 13, and second flow channel member 17 are stacked in order from the -D3 side. A gap G1 is also formed between the two overlapping parts 9a.

[0020] Figure 8 is an enlarged view of region VIII in Figure 4. The adhesive layer 11 is not located in at least a portion (all of the example shown) of the gap G1 (the non-overlapping region of the overlapping portion 9a) in, for example, a planar perspective view (viewed in the direction of D3). More specifically, as also shown in Figure 3, the adhesive layer 11 includes two adhesive members 25. Because the two adhesive members 25 are separated from each other, the adhesive layer 11 is not located in the gap G1. That is, the adhesive layer 11 has a void 11a that overlaps the gap G1.

[0021] Furthermore, as can be seen from the fourth specific example described later (Figure 12), the adhesive layer 11 (11A in Figure 12) may only be relatively thin in at least a part of the gap G1 (the void may be a recess). The embodiment in which the adhesive layer 11 is not located in the gap G1, as in the example in Figure 8, may be considered as an example of an embodiment in which the adhesive layer 11 is relatively thin in the gap G1 (the embodiment in which it is thinnest).

[0022] Figure 9 is an enlarged view of region IX in Figure 8, and also shows a first specific example according to the first embodiment. The adhesive member 25 is made of, for example, double-sided tape. Specifically, for example, the adhesive member 25 has a film-like base material 27, a first adhesive 29A located on the -D3 side with respect to the base material 27, and a second adhesive 29B located on the +D3 side with respect to the base material 27.

[0023] Note that the term "adhesive 29" may be used without distinguishing between the first adhesive 29A and the second adhesive 29B. Also, unlike the illustrated example, the adhesive layer 11 (adhesive member 25) may consist only of adhesive 29. However, in the description of the embodiment, for convenience, it may be assumed without further explanation that the adhesive layer 11 is double-sided tape.

[0024] As described above, the adhesive layer 11 may not be located in at least a portion of the gap G1. From another viewpoint, in an adhesive layer 11 made of double-sided tape, for example, the base material 27 may not be located in at least a portion of the gap G1. That is, the base material 27 may have a void 27a.

[0025] By ensuring that the base material 27 is not located in at least a portion of the non-overlapping region G1 of the overlapping portion 9a, and / or by making the adhesive layer 11 thin in at least a portion of the non-overlapping region G1, the following effects are achieved, for example.

[0026] In double-sided tape, the adhesive 29 is ideally located within the same placement range as the substrate 27, as shown in the example in Figure 9. However, depending on the material of the adhesive 29 and the pressure and / or temperature applied to the adhesive 29 during the manufacturing process of the head 3 (or during use of the head 3), the adhesive 29 may flow outwards from the substrate 27 in a direction along the substrate 27 (e.g., direction D2). As a result, the adhesive 29 may flow into the gap G1 and, furthermore, come into contact with the actuator substrate 7. The portion of the adhesive 29 that comes into contact with the actuator substrate 7 may affect the discharge characteristics of the nozzle 19 directly below it (i.e., a portion of the multiple nozzles 19).

[0027] However, by pre-placing the double-sided tape in a portion of the gap G1, the probability of the adhesive 29 reaching the actuator substrate 7 is reduced. Alternatively, even if the adhesive 29 reaches the actuator substrate 7, the area in contact with the actuator substrate 7 is likely to be reduced. As a result, variations in the discharge characteristics of the multiple nozzles 19 are likely to be reduced. In the product after the adhesive 29 has flowed out of the substrate 27, it can be confirmed whether the above effect has been achieved by checking whether the substrate 27 is located in at least a portion of the gap G1.

[0028] The same effect as described above is achieved even when the adhesive layer 11 is thinned in at least a portion of the non-overlapping region G1. That is, even if the adhesive 29 located outside the gap G1 in a planar view flows towards the gap G1, the probability of the adhesive 29 reaching the actuator substrate 7 is reduced because the thickness of the adhesive layer 11 in the gap G1 is thinned in advance.

[0029] In the second embodiment shown in Figure 15, the stacking plate 213 (corresponding to stacking plate 13) has a cavity 213a (e.g., a through hole or recess) that opens to the side of the adhesive layer 211 (corresponding to adhesive layer 11) (-D3 side) at a position overlapping the non-overlapping region G1. This allows the adhesive layer 11 (e.g., the second adhesive 29B pushed out toward the gap G1) to escape into the cavity 213a. As a result, the probability of the adhesive layer 11 (e.g., the first adhesive 29A) reaching the actuator substrate 7 can be reduced. This effect is the same as that of the first embodiment.

[0030] In the fourth embodiment shown in Figure 19, the heat conduction layer 415 (corresponding to the heat conduction layer 15) has a cavity 415a (e.g., a through hole or recess) that overlaps the non-overlapping region G1. As a result, for example, in the position overlapping the non-overlapping region G1, the pressure applied from the second flow channel member 17 to the adhesive layer 11 via the heat conduction layer 415 and the overlapping plate 13 is reduced. As a result, the probability of the adhesive layer 11 (e.g., the first adhesive 29A) reaching the actuator substrate 7 can be reduced. This effect is common to the effects of the first and second embodiments.

[0031] As described above, in this embodiment, at least one of the multiple layers (for example, 29A, 27, 29B, 13, 15, and 17) overlapping the superimposed portion 9a has a void that overlaps the non-superimposed region G1. The layer having the void is arbitrary. For example, although not specifically shown, a void overlapping the non-superimposed region G1 may be formed in the second flow channel member 17.

[0032] Note that each of the multiple layers referred to here refers to a layer that directly or indirectly overlaps the overlapping portion 9a. Therefore, for example, a second flow channel member (e.g., a frame-shaped one) that does not overlap the overlapping portion 9a, unlike the illustrated example, is not included in the layers referred to here. Furthermore, voids in such second flow channel members (e.g., openings in the frame) do not fall under the definition of voids as referred to here.

[0033] The effects described above do not necessarily have to be achieved. Technical ideas different from the technical ideas described above may be extracted from this disclosure. In this case, for example, the adhesive layer 11 may overlap the non-overlapping region G1, and the overlapping plate 213 does not have to have a void 213a that overlaps the non-overlapping region G1. There may not even be a layer that has a void that overlaps the non-overlapping region G1.

[0034] In the above description, the gap G1 between the overlapping portions 9a was given as an example of a non-overlapping region that is included in the arrangement area of ​​the nozzle 19 (or the arrangement area of ​​the actuator substrate 7 or the pressurizing chamber 23) and does not overlap with the overlapping portion 9a. However, the non-overlapping region is not limited to the gap G1, and may be formed, for example, on the opposite side of the gap G1 in the D2 direction relative to the overlapping portion 9a, or on the outside in the D1 direction relative to the overlapping portion 9a. If other non-overlapping regions exist, the configuration of at least one layer on the flexible substrate 9 (e.g., adhesive layer 11 and / or overlapping plate 13) corresponding to the non-overlapping region may be applied to the other non-overlapping regions in addition to or instead of the gap G1 (or not applied). For convenience, in the description of the embodiment, we will basically focus only on the gap G1 as a non-overlapping region.

[0035] In the above description, multiple components are stacked. However, if, for example, at least the first flow channel member 5, the overlapping portion 9a, and the adhesive layer 11 (or the first adhesive 29A) are arranged in a stacked manner, the aforementioned adhesive layer 11 will reach the first flow channel member 5 via the non-overlapping region G1. Therefore, the head 3 does not necessarily have to have the actuator substrate 7, the stacking plate 13, the heat conductive layer 15, and / or the second flow channel member 17. Conversely, other components (which may or may not have voids) may overlap the first flow channel member 5.

[0036] For example, in the illustrated example, the second flow channel member 17 indirectly overlaps the adhesive layer 11, but it may also directly overlap the adhesive layer 11 without the overlapping plate 13 and the heat conduction layer 15 being provided. Alternatively, for example, the overlapping plate 13 may be provided, but the second flow channel member 17 that indirectly or directly overlaps the overlapping plate 13 may not be provided, and liquid may be supplied to the first flow channel member 5 from another member. Furthermore, for example, an element for adjusting the temperature of the head (e.g., a heater) may be interposed between the first flow channel member 5 and the second flow channel member 17. For convenience, in describing the embodiments, only the laminated structure shown in the illustration will be used as an example.

[0037] The above is an overview of the embodiments. Below, the details of the embodiments will be described in general order. 1. Printer in general (Figures 1 and 2) 2. Head (excluding the configuration related to gap G1; Figures 3 to 8) 2.1. Head in general 2.2. First flow path member 2.3. Actuator substrate 2.4. Flexible substrate and drive IC 2.5. Adhesive layer 2.6. Stacking plate 2.7. Thermal conductive layer 2.8. Second flow path member 2.9. Method for manufacturing the head 3. First embodiment 3.1. First specific example (Figure 9) 3.2. Second and third specific examples (Figures 10 and 11) 3.3. Fourth specific example (Figure 12) 4. Second embodiment 4.1. Fifth specific example 4.1.1. Cavity in stacking plate (Figures 13 to 15) 4.1.2. Tab (Figure 16) 4.2. Sixth specific example (Figure 17) 5. Third Embodiment (Figure 18) 6. Fourth Embodiment (Figure 19) 7. Summary of Embodiments

[0038] (1. Printers in general) Figure 1 is a side view of printer 1 having a head 3. Figure 2 is a top view of printer 1.

[0039] The configuration of printer 1 can be various, except for the configuration related to the head 3, and may be a known configuration, for example. The printer 1 shown in Figures 1 and 2 is merely one example. Below, we will briefly describe the printer 1 in general, using the printer 1 shown in Figures 1 and 2 as an example.

[0040] The printer 1 includes the head 3 described above and a transport device 31 for transporting media P (for example, paper). An image is formed on the media P by ejecting ink droplets downward from the head 3, which is located above the media P.

[0041] Specifically, as shown in Figure 2, one head unit 33 is composed of multiple (five in the illustrated example) heads 3. In each head unit 33, the five heads 3 are arranged in a staggered pattern so that there are no gaps in the D1 direction when viewed in the D2 direction. The printable area of ​​each head unit 33 is roughly the width of the media P (in the D1 direction). An image is formed when the heads 3 eject ink droplets as the media P passes below them.

[0042] As can be understood from the above, printer 1 is configured as a so-called line printer. However, printer 1 is not limited to a line printer. For example, printer 1 may be a serial printer. In a serial printer, for example, the operation of moving the head (head unit) in a direction intersecting the media P transport direction and the transport of media P are performed alternately.

[0043] Printer 1 has multiple (four in the illustrated example) head units 33. The four head units 33 are arranged, for example, in the direction of media P transport. The five heads 3 within each head unit 33 correspond to ink of the same color. The four head units 33 correspond to inks of different colors (four colors of ink). The four colors of ink are, for example, magenta (M), yellow (Y), cyan (C), and black (K). Thus, printer 1 functions as a color printer.

[0044] Unlike the above description, the printer 1 may perform single-color printing, or conversely, may perform printing with more than four colors. That is, the number of colors is arbitrary. Further, two or more head units 33 may correspond to one color. Conversely, one head unit 33 may correspond to two or more colors, for example, due to one head 3 corresponding to two or more colors. The number of heads 3 included in one head unit 33 is arbitrary, and may be one. As understood from the above, the number of heads 3 included in the printer 1 is arbitrary.

[0045] In each head unit 33, any configuration for fixing a plurality of heads 3 to each other is acceptable. In FIGS. 1 and 2, a frame 35 having an opening (not shown) that exposes the ejection surface 5a (FIG. 3) of the head 3 downward is illustrated.

[0046] The printer 1 performs printing on roll paper as the medium P, for example. However, the medium P may be sheet paper. Also, the size of the medium P is arbitrary. For example, the size of the medium P may be as small as a receipt, may be a size commonly used in offices, or may be as large as a poster.

[0047] The configuration of the conveying device 31 for conveying the medium P is arbitrary. In FIGS. 1 and 2, a configuration in which the medium P is conveyed by rotating a roller in contact with the medium P is illustrated. Other configurations include, for example, a configuration in which the medium P is conveyed by conveying a belt that adsorbs the medium P, and a configuration in which the medium P is conveyed by rotating a drum around which the medium P is wound. In a broad sense, the conveying device 31 is a moving device that relatively moves the head 3 and the medium P.

[0048] In addition to the components described above, the printer 1 may include various other components. Examples are given below, which are not particularly illustrated: ・Controller: For example, controls the head 3 and the conveyance device 31. ・Drying device: For example, accelerates drying of ink. ・Coating device: For example, uniformly applies a transparent coating agent to the medium P. ・Cleaning device: For example, cleans the head 3. Note that the printer 1 may use the head 3 to apply the coating agent in addition to or instead of printing with colored ink.

[0049] (2. Head (excluding the configuration related to the gap G1)) (2.1. Overview of the Head) The configuration of the head 3 may be any of various configurations except for the configuration related to the adhesive layer 11 and / or the laminated plate 13, and may be a known configuration, for example. The configuration shown in FIG. 3 and other drawings is merely an example. Hereinafter, an overview of the head 3 will be briefly described taking the configuration shown in FIG. 3 as an example.

[0050] There is no limitation on the mode in which the head 3 (or an actuator from another perspective) applies pressure to liquid for discharging the liquid. For example, the head 3 may be of a piezo type or a thermal type. The piezo type applies pressure to the liquid using deformation of a piezoelectric body. The thermal type heats the liquid to generate bubbles, thereby applying pressure to the liquid. There is also no limitation on the deformation mode of the piezoelectric body used in the piezo-type head 3, and the deformation mode may be, for example, a bending mode, a longitudinal mode, or a shear mode. In the description of the embodiment, the bending mode is taken as an example.

[0051] The head 3 may be of a type that only receives supply of ink, or may be of a type that not only receives supply of ink but also collects undischarged ink (in other words, a circulation type). In the description of the embodiment, the former is taken as an example for convenience.

[0052] As previously described, head 3 has multiple stacked members (5, 7, 9, 11, 13, 15, and 17). This combination is sometimes referred to as the head body (reference numerals omitted). Although not specifically shown, head 3 may have, in addition to the head body, the following components: ・Circuit board: For example, connected to the head body (for example, the part of the flexible substrate 9 opposite to the overlapping portion 9a). ・Connector: Mounted on the circuit board, contributing to the electrical connection between the head body and a controller (described above) not shown. ・Housing: For example, covering the top of the head body and housing the circuit board and the flexible substrate 9. Regardless of whether head 3 has components other than the head body, the head body may be considered an example of the liquid dispensing head of this disclosure.

[0053] Figure 5 is an exploded perspective view of the first flow path member 5, the actuator substrate 7, and the second flow path member 17. Other components of the head 3 are not shown.

[0054] The second flow channel member 17 has a recess 17a that opens to its lower surface, and a slit 17b (see also Figure 3) that penetrates from the bottom surface of the recess 17a (the surface facing the -D3 side) to the upper surface of the second flow channel member 17. Of the lower surface of the second flow channel member 17, the area around the recess 17a is superimposed on the upper surface 5b of the first flow channel member 5 and fixed to the upper surface 5b by an adhesive layer (not shown) interposed between the two. The actuator substrate 7, the superimposed portion 9a, the adhesive layer 11, the superimposed plate 13, and the heat conductive layer 15 are housed in the recess 17a. Of the flexible substrate 9, the portion other than the superimposed portion 9a extends to the outside of the recess 17a through the slit 17b.

[0055] The relative thickness relationships of the components stacked in head 3 are arbitrary. For example, the actuator substrate 7 may be thinner than the first flow channel member 5. The flexible substrate 9 may be thinner than the first flow channel member 5, and may be thinner than the actuator substrate 7, the same thickness, or thicker. The adhesive layer 11 (before and / or after bonding; the same applies hereafter unless contradictions arise) may be thinner than the first flow channel member 5, and may be thinner than the actuator substrate 7 and / or flexible substrate 9, the same thickness, or thicker. The stacking plate 13 may be thinner than the first flow channel member 5, the same thickness, or thicker, and may be thicker than the actuator substrate 7, flexible substrate 9, and / or adhesive layer 11. The heat conductive layer 15 may be thinner than the first flow channel member 5 and / or stacking plate 13, and may be thinner than the actuator substrate 7, flexible substrate 9, and / or adhesive layer 11, the same thickness, or thicker. The thickness of the region where the recess 17a of the second flow channel member 17 is located (the thickness from the bottom surface of the recess 17a to the top surface of the second flow channel member 17) may be thicker than any of the various components described above.

[0056] The specific thickness of each component is also arbitrary. Examples are given below. The thickness of the first flow channel member 5 may be 500 μm or more and 3 mm or less. The thickness of the actuator substrate 7 may be 30 μm or more and 200 μm or less. The thickness of the flexible substrate 9 may be 30 μm or more and 300 μm or less. The thickness of the adhesive layer 11 may be 30 μm or more and 200 μm or less. The thickness of the stacking plate 13 may be 300 μm or more and 1.5 mm or less. The thickness of the heat conductive layer 15 may be 100 μm or more and 500 μm or less.

[0057] As shown in Figure 8, a bump 57 is interposed between the actuator substrate 7 (more specifically, the lead electrode 55b described later) and the superimposed portion 9a (more specifically, the pad 59a described later) to join and electrically connect the two. The material of the bump 57 is arbitrary and may be solder (including lead-free solder). The size of the bump 57 is also arbitrary. For example, when the actuator substrate 7 and the superimposed portion 9a are joined, the thickness of the bump 57 (in the D3 direction) may be thinner than the thickness of the actuator substrate 7 and the flexible substrate 9, and may be between 5 μm and 20 μm.

[0058] (2.2. First Flow Channel Member) As shown in Figure 3, the shape of the first flow channel member 5 is, for example, roughly plate-shaped. Its planar shape is, for example, roughly a rectangle with the D1 direction as the longitudinal direction. A rectangle can be said to be a shape having a longitudinal direction and a transverse direction. As can be understood from the above explanation, various dimensions and dimensional ratios are arbitrary. For example, the length in the longitudinal direction may be 50 mm or more and 300 mm or less. The length in the transverse direction may be 20 mm or more and 100 mm or less (however, shorter than the length in the longitudinal direction).

[0059] Figure 6 is a plan perspective view of a part of the first flow channel member 5 (region VI in Figure 5), showing an extracted portion of the flow channel. Figure 7 is a cross-sectional view taken along the line VII-VII in Figure 6.

[0060] The first flow path member 5 is equipped with flow paths from one or more (multiple in the illustrated example) ports 37 (Figures 5 and 6) opening to the outside of the first flow path member 5 to multiple nozzles 19 (Figure 7). For example, liquid flows through the flow paths from the ports 37 to the nozzles 19 and is discharged from the nozzles 19. The configuration of the flow paths from the ports 37 to the nozzles 19 (shape, dimensions, etc.) is arbitrary. The flow path configurations shown in Figures 5 to 7 are merely examples. Below, the flow path configuration in the illustrated example will be briefly described, and other flow path examples will also be briefly described.

[0061] The first flow channel member 5 has one or more (multiple in the illustrated example) common flow channels 39 extending from one or more ports 37, and a plurality of individual flow channels 41 (Figures 6 and 7) branching off from each common flow channel 39. Each individual flow channel 41 includes a nozzle 19.

[0062] Port 37 opens onto the upper surface 5b of the first flow channel member 5. The specific position of port 37 within the upper surface 5b is arbitrary. For example, port 37 may be located at the end in the longitudinal direction (D1 direction) (as shown in the illustration) or at the end in the short direction. The number of ports 37 is also arbitrary; there may be one or multiple ports.

[0063] The shape of the common channel 39 is also arbitrary. For example, the common channel 39 may extend in the longitudinal direction (D1 direction) (as shown in the illustration), in the transverse direction, or in a direction inclined at an angle of 45° or less in the longitudinal or transverse direction. There may be one common channel 39 or multiple common channels. One common channel 39 may extend from each port 37 (as shown in the illustration), or multiple common channels 39 may extend from each port 37 in a manifold-like manner.

[0064] As shown in Figure 7, the individual flow path 41 includes, for example, a connecting passage 43, a pressurizing chamber 23, a descender 45, and a nozzle 19, in that order from the side of the common flow path 39. Note that in Figure 6, only the pressurizing chamber 23 and the descender 45 of the individual flow path 41 are shown. When pressure is applied to the pressurizing chamber 23 by the actuator 21, the ink in the descender 45 is pushed toward the nozzle 19, and ink droplets are discharged from the nozzle 19. Subsequently, ink is replenished into the pressurizing chamber 23 from the common flow path 39 via the connecting passage 43.

[0065] The specific shapes and dimensions of each part of the individual flow path 41 are arbitrary. In the illustrated example, the pressurizing chamber 23 opens to the upper surface 5b of the first flow path member 5 and is blocked by the actuator substrate 7. The pressurizing chamber 23 is also thin (its depth is smaller than its diameter), and its planar shape may be a suitable shape such as a rhombus (as in the example in Figure 6), ellipse, or circle. The descender 45 extends downward from one end of the bottom surface of the pressurizing chamber 23. A nozzle 19 opens to the bottom surface of the descender 45. The connecting passage 43 connects the end of the bottom surface of the pressurizing chamber 23 opposite to the descender 45 to the common flow path 39.

[0066] Unlike the illustrated example, for example, the descender 45 may not be provided, and the nozzle 19 may directly pass through the lower surface of the pressurizing chamber 23. Also, unlike the description of the embodiment, the descender 45 may be considered as part of the pressurizing chamber. Furthermore, the pressurizing chamber 23 may not open to the upper surface 5b of the first flow path member 5, but may be blocked by one or more flow path parts 47 (described later).

[0067] As shown in Figure 6, the multiple individual channels 41 (or nozzles 19 or pressurizing chambers 23, from another viewpoint) connected to each common channel 39 are arranged, for example, in four rows on both sides of each common channel 39 (two rows on each side). Note that the number of rows of individual channels 41 corresponding to each common channel 39 is not limited to four rows; for example, it could be one or two rows.

[0068] In the illustrated example, the planar shape of the arrangement area for the multiple nozzles 19 (and / or pressurizing chambers 23) is generally a rectangle with four sides parallel to the four sides of the first flow channel member 5, and its longitudinal direction is the same as the longitudinal direction of the first flow channel member 5. Other examples include a trapezoidal or parallelogram shape.

[0069] Unlike the example in Figure 6, for example, the multiple common channels 39 may be arranged at uneven pitches rather than at equal pitches. For example, the two common channels 39 on the +D2 side and the two common channels 39 on the -D2 side may be further apart than in the illustrated example. In such a case, the multiple nozzles 19 (and / or pressurizing chambers 23; the same applies hereinafter) are arranged in two separate regions in the D2 direction. Even in such a case, when defining non-overlapping regions where the overlapping portions 9a do not overlap, the arrangement region of the nozzles 19 may be a single region encompassing the two separate regions mentioned above. The same applies to the D1 direction and when there are three or more regions.

[0070] As shown in Figure 7, the first flow channel member 5 is constructed, for example, by laminating a plurality of plate-shaped flow channel parts 47 via an adhesive (not shown). The flow channel parts 47 have a plurality of cavities (e.g., through holes and recesses) that constitute the flow channel. The thickness and number of layers of the plurality of flow channel parts 47 may be set appropriately according to the shape of the flow channel, etc. The material of the plurality of flow channel parts 47 is arbitrary and may be, for example, metal, ceramics, or resin.

[0071] (2.3. Actuator Substrate) The number, shape, and dimensions of the actuator substrates 7 are arbitrary. In the example of Figure 5, one actuator substrate 7 is provided that has an area that covers all of the pressurizing chambers 23. The planar shape of the actuator substrate 7 may be set, for example, according to the shape of the arrangement area of ​​the pressurizing chambers 23. The description of the planar shape of the arrangement area of ​​the multiple nozzles 19 (and / or pressurizing chambers 23) described above may be applied to the planar shape of the actuator substrate 7. Unlike the illustrated example, for example, multiple actuator substrates 7 may be arranged in the longitudinal direction of the first flow channel member 5.

[0072] As shown in Figure 7, the actuator 21 on the actuator substrate 7 is provided for each pressurized chamber 23. As previously described, in this embodiment, the actuator 21 is a piezoelectric type that utilizes the deflection mode. More specifically, the actuator 21 illustrated in Figure 7 is a so-called unimorph type. However, the actuator 21 may be of other types, such as a bimorph type.

[0073] The unimorph-type actuator 21 has, for example, a diaphragm 49, a common electrode 51, a piezoelectric layer 53, and individual electrodes 55 in that order from the first flow channel member 5 side. The diaphragm 49, common electrode 51, and piezoelectric layer 53 are, for example, spread over the entire actuator substrate 7. That is, they are provided in common to a plurality of pressurizing chambers 23. Individual electrodes 55 are provided for each pressurizing chamber 23. Each individual electrode 55 has an electrode body 55a that overlaps the pressurizing chamber 23 and a lead electrode 55b (an example of a terminal) drawn out from the electrode body 55a. The electrode body 55a has, for example, the same shape and dimensions as the pressurizing chamber 23. The lead electrode 55b extends, for example, in a wiring-like manner to the outside of the pressurizing chamber 23. The specific material and thickness of each layer are arbitrary.

[0074] Of the piezoelectric layer 53, at least the portion sandwiched between the electrode body 55a of the individual electrode 55 and the common electrode 51 is polarized in the thickness direction. Therefore, for example, when an electric field (voltage) is applied in the polarization direction of the piezoelectric layer 53 by the electrode body 55a and the common electrode 51, the piezoelectric layer 53 contracts in the direction along the layer. This contraction is restricted by the diaphragm 49. As a result, the actuator 21 deforms by bending so that it becomes convex toward the pressurizing chamber 23. When an electric field (voltage) is applied in the opposite direction by the electrode body 55a and the common electrode 51, the actuator 21 deforms by bending toward the opposite side of the pressurizing chamber 23. By utilizing this bending deformation, the volume of the pressurizing chamber 23 can be changed, and pressure can be applied to the ink inside the pressurizing chamber 23.

[0075] Each of the multiple actuators 21 has an individual electrode 55 (drawout electrode 55b) to which a drive signal is input separately. As a result, the multiple nozzles 19 can discharge droplets independently of each other.

[0076] When considering various embodiments of the actuator substrate 7, the actuator substrate 7 may be considered as a component having a plate-shaped body (49, 51, 53, and 55a) and individual terminals (55b) for each of the multiple actuators 21. The individual terminals (lead-out electrodes 55b) may be positioned in any direction relative to the corresponding pressurizing chamber 23 or nozzle 19 in a planar perspective view. For example, in the illustrated example, the terminal (55b) is located on the opposite side of the pressurizing chamber 23 from the nozzle 19. Also, the terminal (55b) is located on the side of the common flow path 39 to which the nozzle 19 is connected relative to the nozzle 19.

[0077] (2.4. Flexible Substrate and Drive IC) As can be seen from Figures 3, 6, and 7, the overlapping portion 9a of one or more flexible substrates 9 is arranged to overlap, for example, all of the lead electrodes 55b (at least some of them). The multiple pads 59a (Figure 8) of the overlapping portion 9a and the multiple (all) lead electrodes 55b are joined by bumps 57 (Figures 7 and 8). In addition, although not specifically shown, the actuator substrate 7 has terminals connected to the common electrode 51 at appropriate positions that overlap with the overlapping portion 9a. These terminals are also joined to the pads of the overlapping portion 9a via bumps 57.

[0078] The specific configuration of the flexible substrate 9 is arbitrary. In the example shown in Figure 8, the flexible substrate 9 has an insulating base film 63, a conductor pattern 59 (including a pad 59a) that overlaps one side of the base film 63 (the bottom side in Figure 8), and an insulating layer 65 (cover coat or solder resist) that covers a part of the conductor pattern 59 (for example, wiring not shown that extends from the pad 59a). In other words, the flexible substrate 9 is a single-sided board. However, unlike the illustrated example, the flexible substrate 9 may also be a double-sided board, for example, having conductor patterns 59 on both sides of the base film 63.

[0079] The material and thickness of each layer of the flexible substrate 9 are arbitrary. For example, the material of the base film 63 may be a resin (e.g., polyimide). The thickness of the insulating layer 65 may be, for example, thicker than the thickness of the conductor pattern 59. With the pad 59a and the lead electrode 55b joined by the bump 57, the insulating layer 65 may face the upper surface of the actuator substrate 7 (the upper surface of the individual electrodes 55) with a relatively small gap (e.g., 20 μm or less or 10 μm or less) in between (as shown in the illustration), or it may overlap.

[0080] As shown in Figures 3 and 4, a drive IC (integrated circuit) 61 may be mounted on the portion of the flexible substrate 9 that extends upward from the superimposed portion 9a. The drive IC 61 generates a drive signal based on a signal input from a controller (described above) (not shown) via the flexible substrate 9, and inputs the drive signal to the individual electrodes 55 via the flexible substrate 9. The drive signal is, for example, a pulse signal having an appropriate potential.

[0081] (2.5. Adhesive Layer) The adhesive layer 11 has a base material 27 and an adhesive 29, as described above. In a planar perspective view, the arrangement range of the first adhesive 29A and / or the second adhesive 29B includes, for example, the arrangement range of the base material 27 (including embodiments in which the two coincide). Unlike the embodiment, the adhesive layer 11 may consist only of the adhesive.

[0082] The materials of the base material 27 and the adhesive 29 are arbitrary. For example, the material of the base material 27 may be a resin (e.g., polyester). The adhesive 29 may be an adhesive in the narrow sense that achieves adhesion by curing, or it may be an adhesive (e.g., an acrylic adhesive) that achieves adhesion by tackiness. The materials of the first adhesive 29A and the second adhesive 29B may be the same or different from each other.

[0083] The thicknesses of the base material 27 and the adhesive 29 are also arbitrary. For example, before and / or after bonding, the thicknesses of the first adhesive 29A and the second adhesive 29B may be thinner, the same as, or thicker than the thickness of the base material 27. Before and / or after bonding, the thicknesses of the first adhesive 29A and the second adhesive 29B may be the same as or different from each other.

[0084] Assume there is no configuration corresponding to the gap G1 in the adhesive layer 11. In this case, in a planar view, the adhesive layer 11 may or may not have an area that encompasses the actuator substrate 7, the arrangement area of ​​the plurality of pressure chambers 23 and / or the arrangement area of ​​the plurality of nozzles 19 (including a configuration in which the outer edges overlap). In the latter case, the adhesive layer 11 may have an area that overlaps, for example, the plurality (all) of the extraction electrodes 55b (at least the portion that is joined to the pad 59a). The planar shape of the adhesive layer 11 may be appropriately set according to the shape of, for example, the actuator substrate 7, the arrangement area of ​​the plurality of pressure chambers 23 and / or the arrangement area of ​​the plurality of nozzles 19. The description of the planar shape of the arrangement area of ​​the plurality of nozzles 19 (and / or pressure chambers 23) described above may be applied to the planar shape of the adhesive layer 11. The description in this paragraph may be applied to the substrate 27 in place of, or in addition to, the adhesive layer 11.

[0085] As previously described, the adhesive layer 11 of the first embodiment is composed of two adhesive members 25. The configuration (shape, dimensions, material, etc.) of the two adhesive members 25 may be the same as shown in the illustration, or they may be different.

[0086] (2.6. Overlap Plate) The overlap plate 13 is, for example, a plate of roughly constant thickness. Its planar shape may be appropriately set according to the shape of the actuator substrate 7, the arrangement area of ​​the multiple pressurizing chambers 23 and / or the arrangement area of ​​the multiple nozzles 19. The description of the width and planar shape of the adhesive layer 11 in a planar view, assuming that there is no structure corresponding to the gap G1 in the adhesive layer 11, may be applied to the overlap plate 13. Furthermore, the overlap plate 13 may have the same planar shape and width as the adhesive layer 11 in a planar view, assuming that there is no structure corresponding to the gap G1, or it may be wider than the adhesive layer 11. In other words, the overlap plate 13 may have a width that encompasses the adhesive layer 11 (including a configuration in which the two overlap).

[0087] The material of the stacking plate 13 is arbitrary. For example, the material may be metal, ceramic, or resin. In the case of metal, for example, its thermal conductivity is higher than that of other materials, which is advantageous for dissipating heat generated in the actuator substrate 7 and transmitted to the stacking plate 13 via the overlapping portion 9a and adhesive layer 11 to the second flow channel member 17 side, and for equalizing the temperature distribution in a plan view. The specific type of metal is also arbitrary, and for example, it may be copper or aluminum.

[0088] (2.7. Thermal Conducting Layer) The thermal conducting layer 15 is composed of, for example, a thermal interface material (TIM). Specific examples of TIM include, for example, thermal conductive sheets, grease, gap fillers, and liquid metals. More specific materials are also optional. The thermal conductivity of the TIM is arbitrary. For example, the thermal conductivity may be 0.4 W / m·K or higher, 1 W / m·K or higher, 5 W / m·K or higher, or 20 W / m·K or higher. As can be understood from the above examples of materials, the thermal conducting layer 15 does not have to be solid (for example, a thermal conductive sheet), but for convenience, when describing the shape of the thermal conducting layer 15, expressions as if it were solid may be used.

[0089] The heat conduction layer 15 is, for example, a layer of roughly constant thickness. Its planar shape may be appropriately set according to the shape of the bottom surface (the surface facing the -D3 side) of the recess 17a of the stacking plate 13 and / or the second flow channel member 17. For example, the planar shape (including dimensions) of the heat conduction layer 15 may be the same as (or different from) the planar shape of the bottom surface of the stacking plate 13 and / or the recess 17a. Similar to the stacking plate 13, the description of the width and planar shape of the adhesive layer 11 in a planar view, assuming there is no structure corresponding to the gap G1 of the adhesive layer 11, may be applied to the heat conduction layer 15.

[0090] (2.8. Second Flow Channel Member) As shown in Figures 3 and 5, the second flow channel member 17 is, for example, a generally plate-shaped member. Its planar shape is, for example, a rectangle with four sides parallel to the four sides of the first flow channel member 5 and its longitudinal direction coinciding with the longitudinal direction of the first flow channel member 5. More specifically, the second flow channel member 17, although not specifically reference numerald, has a generally rectangular parallelepiped body and a flange that protrudes outward from the upper region of the outer peripheral surface (side surface) of the body.

[0091] The recess 17a is formed in the main body. Its bottom surface is, for example, flat. The shape and dimensions of the recess 17a may be appropriately set according to the shape and dimensions of the member to be housed in the recess 17a. In the illustrated example, the shape of the recess 17a is a thin rectangular parallelepiped with the longitudinal direction of the second flow channel member 17 as its longitudinal direction. Its size in plan view is slightly larger than that of the actuator substrate 7.

[0092] The second flow channel member 17 includes, for example, a port 67 (Figure 3) for receiving liquid from outside the second flow channel member 17, and a port 69 (Figure 5) for supplying the received liquid to the port 37 of the first flow channel member 5. The positions, shapes, and dimensions of ports 67 and 69, as well as the flow path (not shown) from port 67 to port 69, are arbitrary. For example, the flow path from port 67 to port 69 may be arranged so as not to overlap the bottom surface of the recess 17a (or the heat conduction layer 15 in another view) in a planar perspective view.

[0093] The material of the second flow channel member 17 is arbitrary. For example, the material of the second flow channel member 17 may be metal, ceramic, or resin. Also, the second flow channel member 17 may be formed as a single unit, or it may be constructed by stacking (or combining in a higher-level concept) multiple parts, like the first flow channel member 5.

[0094] (2.9. Method for Manufacturing the Head) In the manufacturing method of the head 3, the components (5, 7, 9, 11, 13, 15 and 17) are prepared, stacked, and fixed to each other. The stacking order is arbitrary. For example, first the first flow channel member 5 and the actuator substrate 7 are stacked and fixed. Next, the overlapping portion 9a is joined to the actuator substrate 7 by the bump 57. After that, the overlapping portion 9a and the stacking plate 13 are joined by the adhesive layer 11.

[0095] Before bonding the overlapping portion 9a and the stacking plate 13 with the adhesive layer 11, the adhesive layer 11 may be placed on either the overlapping portion 9a or the stacking plate 13. Also, when bonding with the adhesive layer 11, the heat conductive layer 15 may or may not be superimposed on the stacking plate 13. In the former case, the second flow channel member 17 may or may not be superimposed on the heat conductive layer 15. In the former case (when the stacking plate 13, heat conductive layer 15, and second flow channel member 17 are superimposed), bonding of the first flow channel member 5 and the second flow channel member 17 may or may not occur simultaneously with bonding with the adhesive layer 11.

[0096] The overlapping portion 9a and two or more layers including the first adhesive 29A (at least one of the two or more layers may contain a void) may be subjected to pressure and / or heating in the laminated state. For example, the adhesive layer 11 may be subjected to pressure and / or heating in the laminated direction while the overlapping portion 9a, the adhesive layer 11, and the stacking plate 13 are stacked. This pressure and / or heating may be for bonding by the adhesive layer 11 (or for improving adhesion after bonding), and / or for bonding the first flow channel member 5 and the second flow channel member 17 around the recess 17a with an adhesive layer not shown. The adhesive layer 11 (adhesive 29) may become more fluid (its viscosity may decrease) or, conversely, may harden due to heating.

[0097] The specific pressure and temperature for pressurization and / or heating are arbitrary. For example, the pressure may be between 400 kPa and 500 kPa. The temperature may be between 100°C and 200°C. Pressurization and heating may be carried out for a period of 20 minutes to 30 minutes.

[0098] During bonding with the adhesive layer 11, or during the pressurization and / or heating described above, the relationship between the stacking direction and the vertical direction of the overlapping portion 9a, the adhesive layer 11, and the stacking plate 13 is arbitrary. For example, the stacking direction may be such that the overlapping portion 9a is facing downwards relative to the stacking plate 13, or conversely, the overlapping portion 9a is facing upwards relative to the stacking plate 13.

[0099] (3. First Embodiment) (3.1. First Specific Example) As described in the overview of the embodiment, in the first embodiment, the substrate 27 of the adhesive layer 11 is not located in at least a part of the gap G1 in a planar perspective view. and / or, the thickness of the target region located in at least a part of the gap G1 in a planar perspective view is thinner than the thickness of other regions overlapping the overlapping portion 9a in a planar perspective view.

[0100] The gap G1 is formed between the overlapping portions 9a of the two flexible substrates 9. In other words, the gap G1 is the space sandwiched between the two flexible substrates 9. The gap G1 is, for example, a slit extending in the longitudinal direction of the head 3. Its width is, for example, generally constant over the length of the slit. The specific size of the width is arbitrary and may be, for example, 0.1 mm or more or 0.3 mm or more, or 2.0 mm or less or 1.0 mm or less. The above lower and upper limits may be combined in any way.

[0101] Unlike the illustrated example, the gap G1 does not have to extend with a constant width. Furthermore, a gap G1 extending in the short direction of the head 3 may be formed between overlapping portions 9a aligned in the longitudinal direction. Adjacent overlapping portions 9a constituting the gap G1 may belong to a single flexible substrate 9. For convenience, the description of the embodiment will assume the gap G1 shown in the illustrated example.

[0102] As indicated by the symbols in Figure 9, the portion where the base material 27 is not located corresponding to the gap G1 is referred to as the void 27a. The void 27a is, for example, a slit that extends along the slit-shaped gap G1. The slit-shaped void 27a extends over the entire adhesive layer 11 in its longitudinal direction (D1 direction). The width of the void 27a is, for example, approximately constant over the length of the void 27a.

[0103] The specific size of the width is arbitrary. For example, the width of the space 27a may be larger than the width of the gap G1 (as shown in the illustration), the same as, or smaller than. In other words, when viewed from a plane perspective, the space 27a may include the entire gap G1 in the width direction (as shown in the illustration), coincide with the gap G1, or be located only in a part of the gap G1.

[0104] The ratio or difference between the width of the space 27a and the width of the gap G1 when the width of the space 27a is greater than the width of the gap G1 is also arbitrary. For example, the width of the space 27a may be 1.2 times or more, 1.5 times or more, or 2 times or more than the width of the gap G1, and may also be 8 times or less, 5 times or less, or 3 times or less. The above lower and upper limits may be combined in any way. In addition, the length obtained by subtracting the width of the gap G1 from the width of the space 27a may be 100 μm or more, 200 μm or more, or 500 μm or more, and may also be 2000 μm or less, 1500 μm or less, or 1000 μm or less. The above lower and upper limits may be combined in any way.

[0105] In planar perspective, the centerline of the space 27a, for example, roughly coincides with the centerline of the gap G1. For example, the centerline of the space 27a is located in the middle range when the width of the gap G1 is divided into three or five equal parts.

[0106] Unlike the illustrated example, the void 27a does not have to extend over the entire adhesive layer 11 in the D1 direction. For example, the adhesive members 25 may be connected at both ends in the D1 direction. This connected portion may or may not overlap with the placement area of ​​the actuator substrate 7, the bump 57, the placement area of ​​the pressurizing chamber 23, and / or the placement area of ​​the nozzle 19 (it may be located outside the D1 direction). Also, the void 27a does not have to have a constant width and does not have to be slit-shaped.

[0107] In a cross-section crossing the cavity 27a as shown in Figure 9, the shape of the side surface of the adhesive layer 11 (or base material 27 or adhesive 29) on the cavity 27a side is arbitrary. For example, it may be planar, curved, parallel to the D3 direction, or inclined in the D3 direction. The same applies to the side surface of the recess 11r of the adhesive layer 11A and the cavity 213a of the overlapping plate 213, which will be described later.

[0108] The void 27a may be formed, for example, by arranging two adhesive members 25 apart on two overlapping portions 9a or stacking plates 13. Alternatively, for example, an adhesive layer 11 without a void 27a may be placed on two overlapping portions 9a or stacking plates 13, and then a portion of the adhesive layer 11 in plan view may be removed by an appropriate method such as laser processing or precision cutting to form the void 27a.

[0109] Unlike the illustrated example, the base material 27 may have a void 27a by being thinned in part. In another view, a recess as a void 27a may be formed on the -D3 side and / or the +D3 side.

[0110] (3.2. Second and Third Specific Examples) In Figure 9 (First Specific Example), the area where the adhesive 29 is placed is substantially the same as the area where the base material 27 is placed. However, as described in the overview of the embodiment, the adhesive 29 may spread in an appropriate amount from the base material 27 toward the cavity 27a. The second and third specific examples are examples in which such adhesive 29 flows toward the gap G1.

[0111] Figure 10 shows a head 3 relating to a second specific example and corresponds to Figure 9. In this example, the adhesive 29 protrudes beyond the edge of the base material 27 on the side of the cavity 27a, and furthermore, its tip protrudes into the gap G1 in a planar perspective view. However, the adhesive layer 11 is still not located in the gap G1 in the direction D3.

[0112] Figure 11 shows a head 3 relating to a third specific example, and corresponds to Figure 9. In this example, the adhesive 29 that protrudes from both sides of the gap G1 in the D2 direction merges, and the adhesive 29 extends across the entire width of the gap G1. Thus, while the substrate 27 is not located in a part of the gap G1 in a planar perspective, the adhesive 29 (or adhesive layer 11 in another view) may extend across the entire gap G1 (or its entire width).

[0113] Furthermore, as can be understood from the void 27a in the third specific example, the "void" does not have to be a space where gas is present or a vacuum (it may be such a space). The void may be a part in a given layer where the material constituting the layer is absent (for example, a through hole or notch), or a part where the layer is thin (for example, a recess).

[0114] Although not specifically shown, the adhesive 29 may be in a state between the example in Figure 9 and the example in Figure 10. That is, the tip of the adhesive 29 may be located between the edge of the base material 27 on the side of the cavity 27a and the edge of the overlapping portion 9a on the side of the gap G1 in a planar perspective view. Furthermore, the specific position of the tip of the adhesive 29 in that case is also arbitrary.

[0115] In the embodiment shown in Figure 10, where the tip of the adhesive 29 is located in the gap G1 in a planar perspective view, the specific position of the adhesive 29 in the D2 direction is arbitrary. Furthermore, in this embodiment, the adhesive 29 does not have to penetrate into the gap G1 in the D3 direction (as shown in the example), or it may penetrate. In the latter case, the degree of penetration is also arbitrary.

[0116] In the embodiment shown in Figure 11, where the adhesives 29 on both sides of the cavity 27a in the D2 direction merge, the adhesive 29 may or may not penetrate the gap G1 in the D3 direction (as shown in the example). The degree of penetration in the former case is also arbitrary. From another perspective, the thickness of the merged adhesive 29 in the region overlapping the gap G1 may be thicker than (as shown in the example), the same as, or thinner than the thickness of the region overlapping the overlapping portion 9a in a planar perspective view. The degree of difference in thickness is also arbitrary. In the above, the thickness of the adhesive layer 11 in the region overlapping the overlapping portion 9a is, in the example shown, the thickness of the adhesive 29 only in the cavity 27a, and the total thickness of the first adhesive 29A, the base material 27, and the second adhesive 29B outside of the cavity 27a.

[0117] In the cavity 27a, the amount of adhesive 29 on both sides in the D2 direction is, for example, roughly the same. From another viewpoint, for example, the state of the adhesive 29 on both sides is the same as the state shown in Figure 10 or the state shown in Figure 9. However, contrary to the above, for example, one of the adhesives 29 on both sides may be in the state between Figure 9 and Figure 10, and the other may be in the state shown in Figure 10. Also, the state of the adhesives 29 on both sides may be the same, but the specific position of the tip may be different from each other.

[0118] Furthermore, in the longitudinal direction (D1 direction) of the cavity 27a, the amount of adhesive 29 flowing out from the base material 27 is, for example, generally constant over the entire length (or 80% or more of the entire length; the same applies hereinafter). From another viewpoint, for example, the state between Figure 9 and Figure 10, the state as in Figure 10, or the state as in Figure 11 may extend over the entire length of the cavity 27a. However, contrary to the above, for example, the state between Figure 9 and Figure 10, the state as in Figure 10, and the state as in Figure 11 may differ depending on the position in the longitudinal direction, or the state may be the same, but the specific position of the tip may differ depending on the position in the longitudinal direction.

[0119] (3.3. Fourth Specific Example) Figure 12 shows a head 3 according to the fourth specific example, and corresponds to Figure 9. In this example, the adhesive layer 11A, which corresponds to the adhesive layer 11, extends across the entire width of the gap G1. However, in the region that overlaps with at least a part of the gap G1, the adhesive layer 11A is made thinner. As a result, for example, even if the adhesive 29 flows from the region overlapping the overlapping portion 9a toward the gap G1, the probability of the adhesive 29 reaching the actuator substrate 7 is reduced.

[0120] Specifically, in the illustrated example, the adhesive layer 11A is configured to have a recess 11r (an example of a void) formed on its lower side (-D3 side). For convenience, in the following, it may be said that a portion of the adhesive layer 11A has been removed with respect to the recess 11r. However, even when expressed in this way, the removal process is not necessarily required.

[0121] The depth of the recess 11r is arbitrary. For example, the bottom surface of the recess 11r (the +D3 side surface) may be located in the middle of the thickness of the first adhesive 29A, on the bottom surface of the base material 27 (the -D3 side surface) (as shown in the illustration), in the middle of the thickness of the base material 27, on the bottom surface of the second adhesive 29B, or in the middle of the thickness of the second adhesive 29B. The specific location when it is located in the middle of the thickness of any of the layers is also arbitrary.

[0122] The size of the recess 11r in the D2 direction is arbitrary. The previously described explanation of the size of the cavity 27a in the D2 direction may be applied to the recess 11r.

[0123] In Figure 12, similar to Figure 9 (First Specific Example), we assume that the adhesive 29 has not flowed from its initial position. Depending on the material of the adhesive 29, unlike the example in Figure 12, the adhesive 29 may flow in the D2 direction from both sides of the gap G1 towards the gap G1.

[0124] For example, in the example shown in Figure 12 (where the entire thickness of the first adhesive 29A is removed over the gap G1), the first adhesive 29A may flow in the direction D2 from the position shown towards the gap G1. The position of the tip of the first adhesive 29A in the direction D2 at this time can be described in Section 3.2 (Second and Third Specific Examples, etc.). The extent to which the adhesive 29 penetrates the gap G1 in the direction D3 when the tip reaches the gap G1 can also be described in Section 3.2.

[0125] Furthermore, for example, in the example shown in Figure 12 (where the base material 27 remains on the gap G1), the second adhesive 29B may flow in the D2 direction from both sides of the gap G1 (or recess 11r) toward the gap G1, and may become thicker in the gap G1 (or recess 11r) than in other areas. As a result, the base material 27 may bend downward (towards D3).

[0126] Although not specifically shown in the illustration, the adhesive layer 11A may be thinned from the overlapping plate 13 side (+D3 side) in the region that overlaps with at least a part of the gap G1, contrary to the illustrated example. The effect in this case is similar to that of the second embodiment described later, so please refer to the description of the second embodiment.

[0127] Furthermore, although not specifically shown in the illustrations, the illustrated example and the above example may be combined. That is, the adhesive layer 11A may be thinned from both the overlapping portion 9a side (-D3 side) and the overlapping plate 13 side (+D3 side).

[0128] In both the embodiment in which the adhesive layer 11A is thinned from the +D3 side and the embodiment in which it is thinned from both the +D3 side and the -D3 side, the depth of the recess corresponding to the recess 11r is arbitrary. For example, in the former embodiment, the description of the position of the bottom surface of the recess 11r when the recess 11r is formed on the -D3 side may be provided by substituting the words first adhesive 29A and second adhesive 29B, or by substituting the words upper surface and lower surface.

[0129] The method for thinning the area of ​​the adhesive layer 11A that overlaps with the gap G1 is arbitrary. For example, a portion of the thickness of the adhesive layer 11A may be removed by an appropriate processing method such as laser processing or precision cutting. The thinning process may be performed in any of the following states: when neither side of the adhesive layer 11A is bonded, when one side is bonded, or when both sides are bonded (also considering Figure 18 described later), as long as the portion to be removed is not covered by other components of the head 3.

[0130] (4. Second Embodiment) (4.1. Fifth Specific Example) (4.1.1. Empty Space in the Stacking Plate) Figure 13 is an exploded perspective view of the head 203 according to the second embodiment (more specifically, the fifth specific example), and corresponds to Figure 3 of the first embodiment. Figure 14 is a cross-sectional view of a part of the head 203, and corresponds to Figure 8 of the first embodiment. Figure 15 is an enlarged view of region XV in Figure 14, and corresponds to Figures 9 to 12 of the first embodiment.

[0131] The second embodiment differs from the first embodiment only in the configuration of the adhesive layer 211 and the overlapping plate 213, which correspond to the adhesive layer 11 and overlapping plate 13 of the first embodiment. Specifically, the adhesive layer 211 extends over the entire width of the gap G1, including the base material 27 (Figure 15). Furthermore, the adhesive layer 211 is not thinned in any region that overlaps with at least a portion of the gap G1. On the other hand, the overlapping plate 213 has a void 213a that overlaps with at least a portion of the gap G1.

[0132] In this configuration, as illustrated in Figure 15, even if the portion of the second adhesive 29B sandwiched between the overlapping portion 9a and the stacking plate 213 flows toward the gap G1 in the D2 direction, the flowed portion can escape into the void 213a. As a result, the probability of the second adhesive 29B bending the base material 27 toward -D3 in the region overlapping with the gap G1 is reduced. Consequently, the probability of the first adhesive 29A reaching the actuator substrate 7 is reduced. This is particularly effective when the situation arises in which the adhesive 29 flows when the stacking plate 13 is positioned below the overlapping portion 9a.

[0133] The adhesive 29 (in this case, the second adhesive 29B) that flows toward the gap G1 in the D2 direction may be present only in a part of the cavity 213a, or it may fill the entire cavity 213a (the same applies to the third embodiment described later). The degree of the former case is also arbitrary. In Figure 15, the base material 27 is planar. However, the base material 27 may bend downward or upward. The same applies to the embodiment (not shown) in which the adhesive layer 11A described in the fourth specific example is thinned from the +D3 side (or both sides). Also, as in the example in Figure 9, the adhesive 29 does not have to flow toward the gap G1.

[0134] As shown in Figures 13 and 14, in the fifth specific example, the void 213a is formed by a slit 71 (a through-hole in a broader sense) that penetrates the stacked plate 213 in the thickness direction (D3 direction). As shown in Figure 13, the slit 71 may be divided into multiple divided slits 71a (a through-hole in a broader sense) by one or more (multiple in the illustrated example) tabs 73 that are stretched across the slit 71 in the width direction (D2 direction) (or it may not be divided).

[0135] As shown in Figure 13, the slit 71 may have both ends separated from both ends of the stacking plate 213. In other words, the stacking plate 213 may have end tabs 75 on the longitudinal outer side of the slit 71. Unlike the illustrated example, the slit 71 may extend to both ends of the stacking plate 213. In this case, the stacking plate 213 may be maintained as a single plate by one or more tabs 73 dividing the slit 71, or it may be divided into two plates without tabs 73.

[0136] The specific position, shape, and dimensions of the slit 71 are arbitrary. The description of the position, shape, and dimensions of the cavity 27a in the adhesive layer 11 in Section 3.1 may be applied to the slit 71, provided that no inconsistencies arise. In the embodiment where end tabs 75 are located at both ends, the length of the slit 71 may be, for example, 80% or more or 90% or more of the length of the stacking plate 213 (in the D1 direction).

[0137] Furthermore, when one or more tabs 73 are provided, the number and longitudinal length of the dividing slits 71a (or, from another viewpoint, the number, position, pitch, and length in the D1 direction of the tabs 73) are arbitrary. For example, the number of dividing slits 71a may be two (the minimum number), or it may be more than the illustrated example (five). Also, for example, the total length of the dividing slits 71a (in the D1 direction) may be 70% or more, or 80% or more, of the length of the stacking plate 213 (in the D1 direction).

[0138] The method for forming the slit 71 is arbitrary. For example, the slit 71 may be formed by etching (dry or wet) before the stacking plate 213 is fixed to other members. Alternatively, the slit 71 may be formed by laser processing or precision cutting, similar to the adhesive layer 11. Such processing may be performed either before or after the stacking plate 213 is fixed to other members, as long as the portion where the slit 71 is formed is not covered by other members of the head 3.

[0139] (4.1.2. Tabs) Figure 16 is a perspective view showing a specific example of a tab 73. As can be understood from the orientation of D3, this figure shows the bottom surface of the overlapping plate 213. The following description of tab 73 may also be applied to the end tab 75, unless it causes inconsistencies (or not).

[0140] In the upper diagram, tab 73A, as a specific example of tab 73, has the same thickness as the portion of the stacking plate 213 other than tab 73 (73A) (or, from another perspective, the portion that constitutes the lateral edge of the slit 71). In other words, both sides of tab 73A in the D3 direction are flush with both sides of the portion of the stacking plate 213 other than tab 73A in the D3 direction. With this configuration, for example, it is easy to ensure the strength of tab 73A.

[0141] In the lower diagram, tab 73B, as a specific example of tab 73, is thinned from the -D3 side compared to the portion of the overlapping plate 213 other than tab 73 (73B) (or, from another perspective, the portion that constitutes the lateral edge of the slit 71). In other words, the -D3 side surface of tab 73B is located on the +D3 side than the -D3 side surface of the portion of the overlapping plate 213 other than tab 73A. In this case, for example, even directly below tab 73B (on the -D3 side), the adhesive 29 that has flowed toward the gap G1 in the D2 direction can escape toward the overlapping plate 213 side (on the +D3 side).

[0142] The specific thickness of tab 73B is arbitrary. For example, the thickness of tab 73B may be 1 / 3 or more and 2 / 3 or less of the thickness of the other parts of the stacking plate 213. Note that the other parts mentioned above do not have to be the entirety of the stacking plate 213 other than tab 73A; for example, it may be 80% or more of the parts other than tab 73A.

[0143] Although not specifically shown in the diagram, the overlapping plate 213 may also be thinned at the connection point between the tab 73B and other parts, or at the lateral edge of the slit 71. Conversely, the tab 73 may be thinned from the +D3 side relative to the other parts of the overlapping plate 213, in the opposite direction to the tab 73B.

[0144] The specific shape and dimensions of tab 73 are arbitrary. For example, the configuration of multiple tabs 73 may be the same or different from one another. Also, for example, the shape of tab 73 in plan view is rectangular. The relative lengths in the D1 direction and the D2 direction are arbitrary.

[0145] The configuration of tab 73 and the configuration of end tab 75 may be the same or different. In the latter case, the differences between the two are also arbitrary. Figure 13 illustrates an example in which the length L1 of tab 73 in the D1 direction is shorter than the length L0 of end tab 75 in the D1 direction. In this case, the ratio or difference between the two is arbitrary. For example, L0 / L1 may be 1.2 times or more, or 1.5 times or more. Also, for example, the thickness of end tab 75 may be the same as the thickness of most of the overlapping plate 213 (in other words, the portion that constitutes the lateral edge of the slit 71), while tab 73B (i.e., a thin tab 73) may be used as tab 73.

[0146] The method for forming the tab 73A is clear from the method for forming the slit 71 described above. The method for thinning the tab 73B is arbitrary. For example, the tab 73B may be formed by using the same method as for forming the slit 71, but making the processing depth part of the thickness of the stacking plate 213. For example, half etching (dry or wet) may be performed before the stacking plate 213 is fixed to other members, or laser processing or precision cutting may be performed at an appropriate time.

[0147] (4.2. Sixth Specific Example) Figure 17 is a cross-sectional view showing another specific example (sixth specific example) of the second embodiment, and corresponds to Figure 14 of the fifth specific example. The sixth specific example differs from the fifth specific example only in the configuration of the cavity 213a. Specifically, in the overlapping plate 213A of the sixth specific example, the cavity 213a is a recessed groove 77 (a recess in a higher-level concept) that opens to the adhesive layer 211 side (-D3 side).

[0148] The shape and dimensions of the groove 77 in plan view can basically be the same as those of the slit 71 in plan view. However, the stacked plate 213A remains a single plate even without tabs 73 and end tabs 75. Therefore, the groove 77 may extend along the entire length (D1 direction) of the stacked plate 213A. However, tabs 73 and end tabs 75 may be provided for reinforcement or other purposes.

[0149] The depth of the groove 77 is arbitrary. For example, the depth of the groove 77 may be 1 / 3 or more and 2 / 3 or less of the thickness of the other parts of the stacking plate 213 (or, from another viewpoint, the parts that constitute the lateral edges of the groove 77). Note that the other parts mentioned above do not have to be the entirety of the stacking plate 213 other than the groove 77; for example, they may be 80% or more of the parts other than the groove 77.

[0150] The method for forming the groove 77 is arbitrary. For example, the groove 77 may be formed by using the same method as for forming the slit 71, but making the depth of the processing part of the thickness of the stacking plate 213A. For example, half etching (dry or wet) may be performed before the stacking plate 213 is fixed to other members, or laser processing or precision cutting may be performed at an appropriate time.

[0151] Unlike the illustrated example, the groove in the overlapping plate 213A may open to the +D3 side. In this case, similar to the void 415a in the heat conductive layer 415, the pressure applied from the second flow channel member 17 to the adhesive layer 11 via the overlapping plate 213A is reduced at the position overlapping the gap G1. Furthermore, a groove 77 opening to the -D3 side and a groove opening to the +D3 side may be provided.

[0152] (5. Third Embodiment) Figure 18 is a cross-sectional view showing a part of the head of the third embodiment, and corresponds to Figures 9 to 11 of the first embodiment and Figure 15 of the second embodiment.

[0153] The third embodiment is, simply put, a combination of the first and second embodiments. That is, the adhesive layer 11 (including 11A) has a void 27a in which the base material 27 overlaps at least a portion of the gap G1, and / or is relatively thin in at least a portion of the gap G1. The overlapping plate 213 (including 213A) also has a void 213a in which it overlaps at least a portion of the gap G1.

[0154] The widths of void 27a (in the D2 direction) and void 213a (in the D2 direction) may be the same (as shown in the illustration) or they may be different. In the latter case, either one may be wider. Regarding other aspects in plan view (shape and length in the D1 direction, etc.), voids 27a and void 213a may be the same or they may be different.

[0155] (6. Fourth Embodiment) Figure 19 is an exploded perspective view of the head 403 according to the fourth embodiment, and corresponds to Figure 3 of the first embodiment. The fourth embodiment differs from the first embodiment only in the configuration of the adhesive layer 211 and the heat conductive layer 15, which correspond to the adhesive layer 11 and the heat conductive layer 15 of the first embodiment. Specifically, the adhesive layer 211 is the same as the adhesive layer 211 of the second embodiment (Figure 13). The heat conductive layer 415 has a void 415a that overlaps with at least a part of the gap G1.

[0156] The descriptions of the various voids in the adhesive layer 11, the substrate 27, and the stacking plate 13 may be applied to the void 415a, provided that no inconsistencies arise. For example, the void 415a may be a portion where no material of the heat conductive layer 415 exists (as shown in the illustration), or a portion where the heat conductive layer 415 is thinned (for example, a recess on the -D3 side and / or +D3 side). In the former case, the void 415a may be slit-shaped. In the latter case, the void 415a may be a groove.

[0157] Furthermore, for example, the slit-shaped cavity 415a may extend over the entire D1 direction of the heat conduction layer 415 (as shown in the illustration), or tabs may be provided at the ends (one end or both ends) and / or at intermediate positions. In other words, the heat conduction layer 415 may have two heat conduction members 416, or it may be a single continuous structure. The tabs may be located outside the area where the bumps 57 are arranged. The specific shapes and dimensions of the slits and tabs in the first and second embodiments may also be applied to the cavity 415a.

[0158] The void 415a may be formed, for example, by arranging two heat conductive members 416 apart from each other on the stacking plate 13 or the second flow channel member 17. Alternatively, for example, a heat conductive layer 415 without the void 415a may be placed on the stacking plate 13 or the second flow channel member 17, and then the void 415a may be formed by removing a portion of the heat conductive layer 415 in plan view using an appropriate method such as laser processing or precision cutting.

[0159] In the illustrated example, the adhesive layer 11 and the overlapping plate 13 do not have a void that overlaps the gap G1. However, as with the third embodiment, the fourth embodiment may be combined with the first and / or second embodiment (the void in the adhesive layer 11 and / or the void in the overlapping plate 13).

[0160] (7. Summary of Embodiments) Below, we will extract configurations according to the embodiments and describe their effects. Note that the extracted configurations do not necessarily have to produce the effects exemplified below. Also, for convenience, the reference numerals of one of the multiple embodiments may be used to represent all of them. The following explanation may also apply to embodiments in which no reference numerals are used, as long as no inconsistencies arise.

[0161] The head 3 according to this embodiment (an example of a liquid discharge head) has a first flow channel member 5, one or more flexible substrates 9, and a plurality of layers. The first flow channel member 5 has a plurality of nozzles 19 that open toward the -D3 side (an example of the first side). One or more flexible substrates 9 have overlapping portions 9a that face the first flow channel member 5 from the +D3 side (an example of the second side). The plurality of layers overlap the overlapping portions 9a from the +D3 side. The plurality of layers include a first adhesive 29A that is in close contact with the overlapping portions 9a. In a planar perspective view (viewed in the D3 direction), the arrangement area of ​​the plurality of nozzles 19 includes a non-overlapping region G1 where none of the overlapping portions 9a overlap. At least one of the plurality of layers has a void that overlaps the non-overlapping region G1 in a planar perspective view.

[0162] For example, the multiple layers include an adhesive layer 11 and a second flow channel member 17. The adhesive layer 11 is in close contact with the overlapping portion 9a from the +D3 side. The second flow channel member 17 overlaps the adhesive layer 11 directly or indirectly from the +D3 side. The adhesive layer 11 includes a base material 27, a first adhesive 29A located on the -D3 side relative to the base material 27, and a second adhesive 29B located on the +D3 side relative to the base material 27. In a planar perspective view, as shown in Figures 9 to 11 and 18, the base material 27 is not located in at least a part of the non-overlapping region G1 (a void 27a is located there).

[0163] In another view, the printer 1 (an example of a recording device) according to the embodiment includes the head 3 and a transport device 31 (an example of a moving device) that moves the head 3 and the media P relative to each other. In yet another view, the method for manufacturing the head 3 according to the embodiment includes applying pressure in the stacking direction to the overlapping portion 9a and two or more layers, including the first adhesive 29A, among a plurality of layers. For example, the manufacturing method includes applying pressure in the stacking direction to the overlapping portion 9a, the adhesive layer 11, and a member (a stacking plate 13 in the illustrated example) that adheres to the adhesive layer 11 from the +D3 side. At least one of the two or more layers has a void.

[0164] In this case, for example, as described in the overview of the embodiment, the probability that the adhesive 29 reaches the first flow channel member 5 or a member overlapping the first flow channel member 5 (actuator substrate 7 in the illustrated example) via the non-overlapping region G1 is reduced. As a result, the probability of variations in the discharge characteristics of the multiple nozzles 19 is reduced.

[0165] In a planar perspective view, the non-overlapping region may include the gap G1 between adjacent overlapping portions 9a. The substrate 27 may not be located in at least a portion of the gap G1.

[0166] In this case, for example, the probability that the adhesive 29 reaches the actuator substrate 7 through the gap G1 is reduced by the space 27a, so the need to reduce the gap G1 to reduce the probability that the adhesive 29 will flow to the -D3 side is reduced. In other words, the design conditions for the gap G1 are relaxed. Also, for example, depending on the configuration of the printer 1, the effect of deterioration in the ejection characteristics of nozzles 19 located towards the center of the nozzle 19 arrangement area on image quality is more easily noticeable to the human eye than the effect of deterioration in the ejection characteristics of nozzles 19 located at the edges of the nozzle 19 arrangement area on image quality. On the other hand, the gap G1 is highly likely to be located towards the center of the nozzle 19 arrangement area. Therefore, the effect of reducing variations in ejection characteristics works effectively.

[0167] In a planar perspective view, the gap G1 may be a slit extending with a width of 2 mm or less (in the D2 direction). The area where the base material 27 is not located (void 27a) may extend along the gap G1.

[0168] Normally, if the gap G1 between two adjacent overlapping portions 9a is a narrow slit as described above, placing double-sided tape (adhesive layer 11) that covers the entire width of the two overlapping portions 9a simplifies the assembly process of the head 3. However, in this embodiment, reducing the likelihood of the adhesive 29 flowing into the gap G1 takes precedence over simplifying the assembly process, which is groundbreaking.

[0169] In a planar perspective view, the gap G1 may be slit-shaped. The area where the base material 27 is not located (void 27a) may extend along the gap G1 with a width wider than the width of the gap G1 (in the D2 direction).

[0170] In this case, for example, compared to an embodiment in which the width of the cavity 27a is narrower than the width of the gap G1 (which is also included in the technology of this disclosure), the probability of the adhesive 29 reaching the actuator substrate 7 can be reduced. Also, since the cavity 27a is slit-shaped, the probability of the width of the cavity 27a being made larger than necessary, thereby reducing the effectiveness of the adhesive layer 11, is reduced.

[0171] The head 3 may further have an actuator substrate 7 that overlaps the first flow path member 5 from the +D3 side. The actuator substrate 7 may have a plurality of actuators 21 that generate pressure for liquid discharge, each corresponding to a plurality of nozzles 19. The plurality of actuators 21 may each have a lead electrode 55b (an example of a terminal) that is joined to the overlapping portion 9a (pad 59a) separately. In a plan view, the base material 27 and all the lead electrodes 55b (at least the portion joined to the pad 59a) may overlap.

[0172] In areas where the base material 27 overlaps, the likelihood of the overlapping portion 9a floating towards the +D3 side is reduced compared to areas where the base material 27 does not overlap. Therefore, for example, the likelihood of the overlapping portion 9a and the lead electrodes 55b separating is reduced because the base material 27 overlaps all of the lead electrodes 55b. In other words, the reliability of the electrical connection is improved.

[0173] As shown in Figures 9, 10, and 18, the thickness of the adhesive layer 11 in the target region (not shown in numerals) located in at least a part of the non-overlapping region G1 in a planar perspective view may be thinner than the thickness in other regions that overlap with the overlapping portion 9a (at least a part thereof) in a planar perspective view.

[0174] Furthermore, the requirement that the thickness in the target area is relatively thin may be adjusted as shown in Figure 12, by not requiring the presence of a cavity 27a in the base material 27, or by not requiring the adhesive layer 11 to be double-sided tape.

[0175] As described above, when the thickness in the target area is relatively thin, for example, when the adhesive 29 flows toward the target area, the probability of the adhesive 29 reaching the actuator substrate 7 is reduced.

[0176] As shown in Figures 9, 10, 12, and 18, the first adhesive 29A may be positioned so that it is not located in at least a part of the target area.

[0177] The first adhesive 29A has a higher probability of reaching the actuator substrate 7 than the second adhesive 29B. Therefore, compared to, for example, a configuration in which the first adhesive 29A is not removed but the second adhesive 29B is removed (which is also included in the technology of this disclosure), the probability of the adhesive 29 reaching the actuator substrate 7 is reduced.

[0178] As shown in Figures 9, 10, and 18, the first adhesive 29A, the substrate 27, and the second adhesive 29B may be positioned so that they are not located in at least a portion of the target area.

[0179] In this case, for example, the effect of reducing the probability that the adhesive 29 will reach the actuator substrate 7 is improved.

[0180] As shown in Figures 10, 11, and 18, in a planar perspective view, at least one of the first adhesive 29A and the second adhesive 29B may have a portion located in the non-overlapping region G1 where the substrate 27 is not located.

[0181] In this case, for example, the adhesive 29 can be applied to the superimposed portion 9a over a wider area than the base material 27, thereby reducing the likelihood of vibration of the superimposed portion 9a. This reduces the likelihood of, for example, the generation of abnormal noise. This effect is particularly effective when the head 3 is of the piezo type.

[0182] The head 3 may further have an overlapping plate 213 that is in close contact with the second adhesive 29B from the +D3 side. As shown in Figure 18, the overlapping plate 213 may have a cavity 213a that opens to the side of the adhesive layer 11 at a position that overlaps with the non-overlapping region G1 in a planar perspective view.

[0183] Furthermore, as shown in Figure 15, the void 213a may not be required to be a void 27a in the base material 27, nor may it be required that the adhesive layer 11 be double-sided tape.

[0184] If a void 213a is provided, for example, as explained with reference to Figure 15, the adhesive 29 that flows out from between the stacking plate 213 and the overlapping portion 9a can be directed towards the stacking plate 213. As a result, the probability of the adhesive 29 reaching the actuator substrate 7 can be reduced. This effect is particularly effective when the adhesive 29 flows while the stacking plate 213 is positioned below the overlapping portion 9a.

[0185] As shown in Figures 15 and 18, a portion of the adhesive layer 211 may be located in the void 213a.

[0186] In this case, for example, the adhesive 29 and the overlapping plate 213 engage with each other in a direction that intersects the D3 direction (mainly the D2 direction). Therefore, the fixing between the adhesive 29 and the overlapping plate 213 is strengthened.

[0187] As shown in Figure 17, the cavity 213a may include a groove 77 with a depth of 1 / 3 to 2 / 3 of the thickness of the stacking plate 213A.

[0188] In this case, for example, it is easier to ensure the strength of the stacked plate 213A compared to the configuration in which the cavity 213a is a slit 71.

[0189] As shown in Figure 14, the cavity 213a may include the slit 71. The stacking plate 213 may have one or more tabs 73 that are stretched across the width direction of the slit 71 and divide the slit 71.

[0190] In this case, for example, compared to the configuration in which the void 213a is a groove 77, it is easier to increase the volume of escape route for the adhesive 29. Furthermore, the tab 73 can reduce the reduction in strength of the stacked plate 213 to a certain extent.

[0191] As shown in Figure 13, the distance between the slit 71 and the end of the stacking plate 213 in the D1 direction (an example of the longitudinal direction of the slit 71) (the length L0 of the end tab 75 in the D1 direction) may be longer than the length L1 of the tab 73 in the D1 direction.

[0192] In this case, for example, the strength of the overlapping plate 213 can be improved in the end tab 75, which is highly likely not to overlap with the nozzle 19's placement area, while the tab 73 that overlaps with the nozzle 19's placement area can be made relatively smaller, thereby increasing the volume of escape space for the adhesive 29.

[0193] The -D3 side of tab 73 may be located on the +D3 side than the -D3 side of the other part of stacking plate 213.

[0194] In this case, for example, an escape route for the adhesive 29 can be secured even directly below the tab 73. Also, if the amount of adhesive 29 that escapes into one divided slit 71a is greater than the amount of adhesive 29 that escapes into the adjacent divided slit 71a, the adhesive 29 is more likely to flow from the former to the latter. As a result, for example, the probability of the adhesive 29 flowing into the gap G1 directly below the former divided slit 71a is reduced.

[0195] The multiple layers may include a thermal conductive layer 415 (an example of a thermal interface material) that directly or indirectly overlaps the first adhesive 29A from the +D3 side, and a second flow channel member 17 that is in contact with the thermal conductive layer 415 from the +D3 side. As shown in Figure 19, the thermal conductive layer 415 may have a void 415a.

[0196] In this case, for example, as described in the overview of the embodiment, the pressure applied to the first adhesive 29A in the non-overlapping region G1 can be reduced. Consequently, the probability of the first adhesive 29A reaching the actuator substrate 7 is reduced, and the discharge characteristics are stabilized.

[0197] The multiple layers may include an adhesive layer 11 containing a first adhesive 29A and an overlapping plate 13 that is in close contact with the adhesive layer 11 from the +D3 side. The heat conductive layer 415 may overlap the overlapping plate 13 directly or indirectly from +D3, and may also have a void 415a that overlaps the gap G1 between adjacent overlapping portions 9a. The adhesive layer 11 and the overlapping plate 13 do not have a void that overlaps the gap G1.

[0198] In this case, for example, the adhesive layer 11 and the stacking plate 13 can reduce unintended vibrations of the actuator substrate 7. For example, micro-vibrations caused by high-frequency driving are reduced. As a result, the likelihood of the natural frequency related to ink ejection deviating from the intended value is reduced, and consequently, the ejection characteristics become more stable. Combined with the stabilization of ejection characteristics due to the provision of the void 415a, the effect of stabilizing the ejection characteristics is improved.

[0199] The technology relating to this disclosure is not limited to the embodiments described above and may be implemented in various forms.

[0200] For example, the recording device is not limited to those generally classified as printers. For example, the recording device may be a plotter. Also, for example, the recording device may be one that uses a robot to move a liquid ejection device and print on a stationary recording medium, or it may be a handheld printer that uses a human to move a liquid ejection device and print on a stationary recording medium. Furthermore, as can be understood from the above, the moving device is not limited to a transport device that moves the recording medium, but may be one that moves the liquid ejection device, or one that moves both the liquid ejection device and the recording medium.

[0201] Furthermore, the liquid is not limited to ink; for example, it could be a paint or a conductive material for patterning on a circuit board (although all of these can be considered types of ink). Also, for example, the liquid may exhibit the properties of a Newtonian fluid or the properties of a non-Newtonian fluid (e.g., pseudoplasticity).

[0202] Furthermore, the media is not limited to paper. For example, it may be resin, cloth, wood, metal, or ceramic. Also, the media is not limited to paper (film) form, but may be, for example, a sheet, a vehicle body, or a building.

[0203] The liquid dispensing head may be used for purposes other than recording. For example, the liquid dispensing head may be used to dispense a chemical substance from a nozzle toward another chemical substance to induce a chemical reaction.

[0204] The following concepts can be extracted from this disclosure: (Concept 1) A liquid discharge head comprising: a first flow channel member having a plurality of nozzles opening toward a first side; one or more flexible substrates having overlapping portions facing the first flow channel member from a second side opposite to the first side; an adhesive layer in close contact with the overlapping portions from the second side; and a second flow channel member directly or indirectly overlapping the adhesive layer from the second side, wherein the adhesive layer comprises: a substrate; a first adhesive located toward the first side with respect to the substrate; and a second adhesive located toward the second side with respect to the substrate, wherein in a plan view, the arrangement region of the plurality of nozzles includes a non-overlapping region where none of the overlapping portions overlap, and the substrate is not located in at least a part of the non-overlapping region. (Concept 2) The liquid discharge head according to Concept 1, wherein in a plan view, the non-overlapping region includes gaps between adjacent overlapping portions, and the substrate is not located in at least a part of the gaps. (Concept 3) In a planar view, the gap is slit-shaped with a width of 2 mm or less, and the region where the substrate is not located extends along the gap, as described in Concept 2. (Concept 4) In a planar view, the gap is slit-shaped, and the region where the substrate is not located extends along the gap with a width wider than the width of the gap, as described in Concept 2 or 3. (Concept 5) The liquid discharge head according to any one of Concepts 1 to 4, further comprising an actuator substrate overlapping the first flow channel member from the second side, the actuator substrate having a plurality of actuators that generate pressure for liquid discharge, each corresponding to the plurality of nozzles, the plurality of actuators each having terminals that are joined separately to the overlapping portion, and in a planar view, the substrate and all of the terminals overlap. (Concept 6) The liquid dispensing head according to any one of Concepts 1 to 5, wherein the thickness of the adhesive layer in the target region that overlaps with at least a part of the non-overlapping region in a planar perspective view is thinner than the thickness in other regions that overlap with the overlapping portion in a planar perspective view.(Concept 7) A liquid discharge head comprising: a first flow channel member having a plurality of nozzles opening toward a first side; one or more flexible substrates having an overlapping portion facing the first flow channel member from a second side opposite to the first side; an adhesive layer in close contact with the overlapping portion from the second side; and a second flow channel member directly or indirectly overlapping the adhesive layer from the second side, wherein in a planar perspective view, the arrangement region of the plurality of nozzles includes a non-overlapping region where none of the overlapping portions overlap, and the thickness of the adhesive layer in a target region overlapping at least a part of the non-overlapping region in a planar perspective view is thinner than the thickness in other regions overlapping the overlapping portion in a planar perspective view. (Concept 8) The liquid discharge head according to Concept 6 or 7, wherein the adhesive layer comprises: a substrate; a first adhesive located on the first side with respect to the substrate; and a second adhesive located on the second side with respect to the substrate, wherein the first adhesive is not located in at least a part of the target region. (Concept 9) A liquid dispensing head according to Concept 8, wherein the first adhesive, the substrate, and the second adhesive are not located in at least a part of the target area. (Concept 10) A liquid dispensing head according to any one of Concepts 1 to 9, wherein, in a planar perspective view, at least one of the first adhesive and the second adhesive has a portion located in the non-overlapping area where the substrate is not located. (Concept 11) A liquid dispensing head according to any one of Concepts 1 to 10, further comprising an overlapping plate in close contact with the second adhesive from the second side, wherein the overlapping plate has a void opening to the side of the adhesive layer at a position overlapping the non-overlapping area in a planar perspective view.(Concept 12) A liquid discharge head comprising: a first flow channel member having a plurality of nozzles opening toward a first side; one or more flexible substrates having an overlapping portion facing the first flow channel member from a second side opposite to the first side; an adhesive layer in close contact with the overlapping portion from the second side; and a stacking plate in close contact with the adhesive layer from the second side, wherein, in a planar perspective view, the arrangement region of the plurality of nozzles includes a non-overlapping region where none of the overlapping portions overlap, and the stacking plate has a cavity opening toward the adhesive layer at a position overlapping the non-overlapping region in a planar perspective view. (Concept 13) The liquid discharge head according to Concept 11 or 12, wherein a part of the adhesive layer is located in the cavity. (Concept 14) The liquid discharge head according to any one of Concepts 11 to 13, wherein the cavity includes a groove with a depth of 1 / 3 or more and 2 / 3 or less of the thickness of the stacking plate. (Concept 15) A liquid dispensing head according to any one of Concepts 11 to 13, wherein the cavity includes a slit, and the stacking plate has one or more tabs that are stretched across the width direction of the slit and divide the slit. (Concept 16) A liquid dispensing head according to Concept 15, wherein the distance between the slit and the end of the stacking plate in the longitudinal direction of the slit is longer than the length of the tab in the longitudinal direction. (Concept 17) A liquid dispensing head according to Concept 15 or 16, wherein the first side surface of the tab is located on the second side than the first side surface of the other part of the stacking plate. (Concept 18) A recording device having a liquid dispensing head according to any one of Concepts 1 to 17, and a moving device for moving the liquid dispensing head and the media relative to each other. (Concept 19) A method for manufacturing a liquid dispensing head according to any one of Concepts 1 to 17, comprising: applying pressure to the overlapping portion, the adhesive layer, and the member that adheres to the adhesive layer from the second side in the stacking direction.

[0205] 1...Printer (recording device), 5...First flow channel member, 7...Actuator substrate, 9...Flexible substrate, 9a...Superimposed area, 11...Adhesive layer, 13...Stacking plate, 17...Second flow channel member, 19...Nozzle, 27...Base material, 29...Adhesive, 29A...First adhesive, 29B...Second adhesive, G1...Gap (non-superimposed area).

Claims

1. A liquid discharge head comprising: a first flow channel member having a plurality of nozzles opening toward a first side; one or more flexible substrates having an overlapping portion facing the first flow channel member from a second side opposite to the first side; and a plurality of layers overlapping the overlapping portion from the second side, wherein the plurality of layers include a first adhesive in close contact with the overlapping portion; in a planar perspective view, the arrangement region of the plurality of nozzles includes a non-overlapping region that does not overlap any of the overlapping portions; and at least one of the plurality of layers has a void that overlaps the non-overlapping region in a planar perspective view.

2. In a planar perspective view, the non-overlapping region includes gaps between adjacent overlapping portions, and at least a portion of the gaps contains the voids of any of the layers, as described in claim 1.

3. In a planar perspective view, the gap is slit-shaped with a width of 2 mm or less, and the cavity in any of the layers extends along the gap, as described in claim 2.

4. In a planar perspective view, the gap is slit-shaped, and the cavity in any of the layers extends along the gap with a width wider than the width of the gap, according to claim 2 or 3.

5. A liquid discharge head according to any one of claims 1 to 4, further comprising an actuator substrate overlapping the first flow channel member from the second side, wherein the actuator substrate has a plurality of actuators that generate pressure for liquid discharge, each corresponding to the plurality of nozzles, the plurality of actuators each having terminals that are joined separately to the overlapping portion, and in a plan view, any of the layers having the voids and all of the terminals overlap.

6. The liquid dispensing head according to any one of claims 1 to 5, wherein the plurality of layers include an adhesive layer in close contact with the overlapping portion from the second side, and a second flow channel member that directly or indirectly overlaps the adhesive layer from the second side, and the adhesive layer includes a substrate, a first adhesive located on the first side with respect to the substrate, and a second adhesive located on the second side with respect to the substrate, and in a planar perspective view, the void is formed by the substrate not being located in at least a part of the non-overlapping region.

7. The liquid discharge head according to any one of claims 1 to 6, wherein the plurality of layers include an adhesive layer containing the first adhesive, and a second flow channel member that directly or indirectly overlaps the adhesive layer from the second side, and the adhesive layer has the cavity configured such that the thickness of a target region that overlaps at least a part of the non-overlapping region in a plan view is thinner than the thickness of other regions that overlap the overlapping portion in a plan view.

8. The liquid dispensing head according to claim 7, wherein the adhesive layer comprises a substrate, a first adhesive located on the first side with respect to the substrate, and a second adhesive located on the second side with respect to the substrate, wherein the first adhesive is not located in at least a portion of the target area.

9. The liquid dispensing head according to claim 8, wherein the first adhesive, the substrate, and the second adhesive are not located in at least a portion of the target area.

10. In a planar perspective view, at least one of the first adhesive and the second adhesive has a portion located in the non-overlapping region where the substrate is not located, as described in claim 6, claim 7, claim 8, or claim 9.

11. The liquid dispensing head according to any one of claims 1 to 10, wherein the plurality of layers include an adhesive layer containing the first adhesive and an overlapping plate in close contact with the adhesive layer from the second side, and the overlapping plate has the cavity opening to the side of the adhesive layer.

12. The liquid dispensing head according to claim 11, wherein a portion of the adhesive layer is located in the space of the stacking plate.

13. The liquid dispensing head according to claim 11 or 12, wherein the cavity in the stacking plate includes a groove with a depth of 1 / 3 or more and 2 / 3 or less of the thickness of the stacking plate.

14. The liquid dispensing head according to claim 11 or 12, wherein the space in the stacking plate includes a slit, and the stacking plate has one or more tabs that are stretched across the slit in the width direction of the slit and divide the slit.

15. The liquid discharge head according to claim 14, wherein the distance between the slit and the end of the stacking plate in the longitudinal direction of the slit is longer than the length of the tab in the longitudinal direction.

16. The liquid dispensing head according to claim 14 or 15, wherein the first side surface of the tab is located on the second side than the first side surface of the other portion of the stacking plate.

17. The liquid discharge head according to any one of claims 1 to 16, wherein the plurality of layers include a thermal interface material that directly or indirectly overlaps the first adhesive from the second side, and a second flow channel member that is in contact with the thermal interface material from the second side, and the thermal interface material has the void.

18. The liquid dispensing head according to claim 17, wherein the plurality of layers include an adhesive layer containing the first adhesive, and a superimposed plate in close contact with the adhesive layer from the second side, the thermal interface material directly or indirectly overlaps the superimposed plate from the second side, in a planar perspective view, the non-overlapping regions include gaps between adjacent superimposed portions, the thermal interface material has the voids overlapping the gaps, and the adhesive layer and the superimposed plate do not have the voids overlapping the gaps.

19. A recording device comprising: a liquid discharge head according to any one of claims 1 to 18; and a moving device for moving the liquid discharge head and the media relative to each other.

20. A method for manufacturing a liquid dispensing head according to any one of claims 1 to 18, comprising: applying pressure in the lamination direction to the overlapping portion and two or more layers, including the first adhesive, among the plurality of layers, wherein at least one of the two or more layers has the void.

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