Inductor component and method for manufacturing inductor component

Abstract

An inductor component according to the present disclosure comprises a magnetic layer having a through-hole penetrating from one thickness-direction surface to the other thickness-direction surface, metal wiring disposed in the through-hole, and a first insulating layer disposed on the one thickness-direction surface of the magnetic layer. The metal wiring is provided with a metal pin, and one thickness-direction end of the metal wiring protrudes from one thickness-direction surface of the magnetic layer.

Description

Inductor Component and Method for Manufacturing Inductor Component

[0001] The present disclosure relates to an inductor component and a method for manufacturing an inductor component.

[0002] Patent Document 1 discloses a method for manufacturing an inductor component. Specifically, there is known a method for manufacturing an inductor component that sequentially includes: a step of preparing a magnetic base material; a step of forming a through-hole in the magnetic base material; a step of forming electrolytic copper plating on a surface of the magnetic base material and an inner wall of the through-hole; and a step of forming a through-hole conductor in the through-hole by the electrolytic copper plating (see, for example, Patent Document 1).

[0003] Japanese Unexamined Patent Publication No. 2019-129278

[0004] On the other hand, in the method for manufacturing an inductor component described in Patent Document 1, the through-hole conductor is formed by electrolytic copper plating, and there is a problem that manufacturing takes time depending on the desired dimensions of the through-hole conductor.

[0005] Furthermore, in the method for manufacturing an inductor component described in Patent Document 1, a conductor pattern is formed on the surface of the inductor component by patterning the electrolytic copper plating on the surface of the magnetic base material. However, forming electrolytic copper plating directly on the surface of the magnetic base material and patterning the electrolytic copper plating by etching or the like has the problem of damaging the magnetic base material.

[0006] An object of the present disclosure is to provide an inductor component and a method for manufacturing an inductor component that can improve manufacturability and further improve the degree of freedom in circuit design.

[0007] The present disclosure [1] includes an inductor component including: a magnetic layer having a through-hole penetrating from one surface in a thickness direction to the other surface in the thickness direction; a metal wiring disposed in the through-hole; and a first insulating layer disposed on one surface in the thickness direction of the magnetic layer, wherein the metal wiring includes a metal pin, and one end portion of the metal wiring in the thickness direction protrudes from the one surface in the thickness direction of the magnetic layer.

[0008] In such inductor components, the metal wiring is provided with metal pins. Therefore, manufacturability can be improved compared to when the metal wiring is formed by plating.

[0009] Furthermore, such inductor components include a first insulating layer positioned on one side in the thickness direction of the magnetic layer. Therefore, compared to the case where a conductor pattern is directly formed on one side in the thickness direction of the magnetic layer, damage to the magnetic layer can be suppressed. As a result, the degree of freedom in circuit design can be improved.

[0010] Furthermore, in such inductor components, one end of the metal wiring in the thickness direction is formed to protrude from one side of the magnetic layer in the thickness direction. Therefore, one end of the metal wiring used as a terminal in the thickness direction can be easily exposed from the magnetic layer. In other words, manufacturability can be improved.

[0011] The present disclosure [2] includes the inductor component described in [1] above, wherein one end face in the thickness direction of the metal wiring and one face in the thickness direction of the first insulating layer are flush.

[0012] In such inductor components, one end face in the thickness direction of the metal wiring and one face in the thickness direction of the first insulating layer are flush. Therefore, when forming a conductor pattern on one face in the thickness direction of the first insulating layer, a reliable connection with the metal wiring can be ensured.

[0013] The present disclosure [3] includes the inductor component described in [1] or [2], further comprising a second insulating layer disposed on the other side of the thickness direction of the magnetic layer.

[0014] Such inductor components include a second insulating layer positioned on the other side of the magnetic layer in the thickness direction. Therefore, when forming conductor patterns on one and the other side of the inductor component in the thickness direction, damage to the magnetic layer can be further suppressed. As a result, the degree of freedom in circuit design can be improved.

[0015] This disclosure [4] includes the inductor component described in [3] above, wherein the other end of the metal wiring in the thickness direction protrudes from the other surface in the thickness direction of the magnetic layer.

[0016] In such inductor components, the other end of the metal wiring in the thickness direction is formed to protrude from the other surface in the thickness direction of the magnetic layer. Therefore, the other end of the metal wiring used as a terminal can be easily exposed from the magnetic layer. In other words, manufacturability can be improved.

[0017] The present disclosure [5] includes the inductor component described in [4] above, wherein the other end face in the thickness direction of the metal wiring and the other face in the thickness direction of the second insulating layer are flush.

[0018] In such inductor components, the other end face in the thickness direction of the metal wiring and the other face in the thickness direction of the second insulating layer are flush. Therefore, when forming a conductor pattern on the other face in the thickness direction of the second insulating layer, a reliable connection with the metal wiring can be ensured.

[0019] This disclosure [6] includes an inductor component according to any one of the above [1] to [5], wherein the metal wiring has the same length in a direction perpendicular to the thickness direction from one side in the thickness direction to the other side in the thickness direction.

[0020] In such inductor components, the length of the metal wiring in the direction perpendicular to the thickness direction is the same from one side in the thickness direction to the other side in the thickness direction. Therefore, a constant clearance can be maintained with respect to the inner circumferential surface facing the through hole. As a result, manufacturability can be improved.

[0021] This disclosure [7] includes an inductor component according to any one of the above [1] to [6], wherein the metal wiring comprises the metal pins.

[0022] In such inductor components, the metal wiring consists of metal pins. Therefore, compared to cases where the metal wiring is formed by plating, manufacturability can be further improved.

[0023] This disclosure [8] includes an inductor component according to any one of the above [1] to [6], wherein the metal wiring comprises the metal pins and a metal layer covering the outer surface of the metal pins.

[0024] In such inductor components, the metal wiring consists of metal pins and a metal layer covering the outer surface of the metal pins. Therefore, the clearance with respect to the inner surface facing the through-hole can be adjusted. As a result, manufacturability can be improved.

[0025] The present disclosure [9] includes an inductor component according to any one of the above [1] to [8], further comprising a third insulating layer disposed between the outer circumferential surface of the metal wiring and the inner circumferential surface facing the through hole.

[0026] Such inductor components further include a third insulating layer positioned between the outer surface of the metal wiring and the inner surface of the through-hole. This allows for more reliable suppression of short circuits in the metal wiring.

[0027] The present disclosure

[10] includes a step of preparing a magnetic layer having through holes that penetrate from one surface in the thickness direction to the other surface in the thickness direction; an arrangement step of arranging metal wiring equipped with metal pins in the through holes, wherein the metal wiring is arranged such that one end of the metal wiring in the thickness direction protrudes from one surface in the thickness direction of the magnetic layer; and a step of forming a first insulating layer on one surface in the thickness direction of the magnetic layer.

[0028] The manufacturing method for such inductor components includes a placement step in which metal wiring with metal pins is placed in through holes. Therefore, compared to the case where metal wiring is formed by plating, manufacturability can be improved.

[0029] Furthermore, the manufacturing method for such inductor components includes a step of forming a first insulating layer on one side in the thickness direction of the magnetic layer. Therefore, it is possible to manufacture inductor components that offer improved flexibility in circuit design.

[0030] Furthermore, in this method of manufacturing inductor components, the metal wiring is positioned such that one end in the thickness direction of the metal wiring protrudes from one side in the thickness direction of the magnetic layer. Therefore, one end in the thickness direction of the metal wiring used as a terminal can be easily exposed from the magnetic layer. In other words, manufacturability can be improved.

[0031] The present disclosure

[11] includes a method for manufacturing an inductor component according to

[10] , further comprising the step of making one end face in the thickness direction of the metal wiring flush with one face in the thickness direction of the first insulating layer, after the step of forming the first insulating layer.

[0032] The manufacturing method for such inductor components includes a step of making one end face in the thickness direction of the metal wiring flush with one end face in the thickness direction of the first insulating layer. Therefore, the connectivity of one end of the metal wiring as a terminal can be improved.

[0033] The present disclosure

[12] includes a method for manufacturing an inductor component according to

[10] or

[11] , further comprising the step of forming a second insulating layer on the other side of the thickness direction of the magnetic layer.

[0034] The manufacturing method for such inductor components includes a step of forming a second insulating layer on a surface other than the thickness direction of the magnetic layer. Therefore, it is possible to manufacture inductor components that offer even greater flexibility in circuit design.

[0035] This disclosure

[13] includes a method for manufacturing an inductor component according to

[12] , wherein in the arrangement step, the metal wiring is arranged such that the other end of the metal wiring in the thickness direction protrudes from the other surface in the thickness direction of the magnetic layer.

[0036] In this method of manufacturing inductor components, the metal wiring is positioned such that its other end in the thickness direction protrudes from the other side of the magnetic layer in the thickness direction. Therefore, the other end in the thickness direction of the metal wiring used as a terminal can be easily exposed from the magnetic layer. In other words, manufacturability can be improved.

[0037] The present disclosure

[14] includes a method for manufacturing an inductor component as described in

[13] , further comprising the step of making the other end face in the thickness direction of the metal wiring flush with the other face in the thickness direction of the second insulating layer, after the step of forming the second insulating layer.

[0038] The manufacturing method for such inductor components further includes a step of making the other end face in the thickness direction of the metal wiring flush with the other end face in the thickness direction of the second insulating layer. Therefore, the connectivity of the other end of the metal wiring as a terminal can be improved.

[0039] This disclosure

[15] includes a method for manufacturing an inductor component according to any one of the above

[10] to

[14] , further comprising the step of forming the metal wiring, the step of forming a metal layer covering the metal pin on the outer circumferential surface of the metal pin.

[0040] The manufacturing method for such inductor components further includes a step of forming a metal layer on the outer surface of the metal pin to cover the metal pin. Therefore, the clearance between the metal pin and the inner surface facing the through hole can be adjusted by the metal layer. As a result, manufacturability can be improved.

[0041] The present disclosure

[16] includes a method for manufacturing an inductor component according to any one of the above

[10] to

[14] , further comprising the step of forming a third insulating layer disposed between the outer circumferential surface of the metal wiring and the inner circumferential surface facing the through hole.

[0042] The manufacturing method for such inductor components includes a step of forming a third insulating layer, which is placed between the outer surface of the metal wiring and the inner surface facing the through-hole. Therefore, short circuits in the metal wiring can be suppressed more reliably.

[0043] The inductor component of this disclosure comprises a magnetic layer having a through hole that penetrates from one surface in the thickness direction to the other surface in the thickness direction, a metal wiring disposed in the through hole, and a first insulating layer disposed on one surface in the thickness direction of the magnetic layer, wherein the metal wiring includes a metal pin, and one end of the metal wiring in the thickness direction protrudes from one surface in the thickness direction of the magnetic layer. This improves manufacturability and further enhances the freedom of circuit design.

[0044] The method for manufacturing an inductor component according to this disclosure comprises the steps of: preparing a magnetic layer having through holes that penetrate from one surface in the thickness direction to the other surface in the thickness direction; arranging metal wiring equipped with metal pins in the through holes, wherein the metal wiring is arranged such that one end of the metal wiring in the thickness direction protrudes from one surface in the thickness direction of the magnetic layer; and forming a first insulating layer on one surface in the thickness direction of the magnetic layer. Therefore, the manufacturability can be improved in an inductor component that can improve the degree of freedom in circuit design.

[0045] FIG. 1 is a perspective view of one embodiment of the inductor component of the present disclosure. FIG. 2 is a cross-sectional view taken along line A-A of the inductor component in FIG. 1. FIG. 3 is a cross-sectional view of a first modification of the inductor component of the present disclosure. FIG. 4 is a cross-sectional view of a second modification of the inductor component of the present disclosure. FIG. 5 is a cross-sectional view of a third modification of the inductor component of the present disclosure. FIG. 6 is a cross-sectional view of a fourth modification of the inductor component of the present disclosure. FIG. 7 is a cross-sectional view of a fifth modification of the inductor component of the present disclosure. FIGS. 8A to 8D illustrate a method of manufacturing the inductor component shown in FIGS. 1 and 2. FIG. 8A shows the step of preparing a magnetic layer, FIG. 8B shows the step of arranging metal wiring, FIG. 8C shows the step of forming a first insulating layer, and FIG. 8D shows the step of flattening one end face in the thickness direction of the metal wiring and one surface in the thickness direction of the first insulating layer. FIG. 9 is a perspective view of an inductor structure using the inductor component of the present disclosure.

[0046] 1. Inductor Component Referring to FIGS. 1 and 2, an embodiment of the inductor component of the present disclosure will be described.

[0047] The inductor component 1 is a component of an electronic device (for example, a printed wiring board), that is, a component for manufacturing an electronic device, and is an industrially applicable device that is distributed as a single component.

[0048] As shown in FIG. 1, in the thickness direction, the inductor component 1 has one surface (one surface in the thickness direction) and the other surface on the opposite side (the other surface in the thickness direction). The inductor component 1 has a shape extending in a planar direction orthogonal to the thickness direction. The inductor component 1 has a plurality of side surfaces connecting the one surface in the thickness direction and the other surface in the thickness direction. In other words, the inductor component 1 has a substantially rectangular parallelepiped shape.

[0049] Note that the thickness direction is the direction in which the metal wiring 3 described below extends. In addition, among the planar directions orthogonal to the thickness direction, a predetermined direction (the left-right direction on the paper of FIG. 1) may be referred to as the first direction. Further, a direction orthogonal to the first direction in the planar direction (the depth direction on the paper of FIG. 1) may be referred to as the second direction.

[0050] The inductor component 1 comprises a magnetic layer 2 having a through hole 21 that penetrates from one surface in the thickness direction to the other surface in the thickness direction, a metal wiring 3 arranged in the through hole 21, and a first insulating layer 4 arranged on one surface in the thickness direction of the magnetic layer 2. As shown in Figure 2, in this embodiment, the inductor component 1 further comprises a second insulating layer 5 arranged on the other surface in the thickness direction of the magnetic layer 2. In addition, it further comprises a third insulating layer 6 arranged between the outer peripheral surface 3S of the metal wiring 3 and the inner peripheral surface 2S facing the through hole 21.

[0051] 1.1. Magnetic Layer As shown in Figure 1, the magnetic layer 2 has one surface (one surface in the thickness direction) and another surface (the other surface in the thickness direction) on the opposite side in the thickness direction. The magnetic layer 2 has a shape that extends in a plane direction perpendicular to the thickness direction. The magnetic layer 2 has multiple sides that connect the one surface in the thickness direction and the other surface in the thickness direction. In other words, the magnetic layer 2 has a roughly rectangular parallelepiped shape.

[0052] One surface of the magnetic layer 2 in the thickness direction does not form one surface of the inductor component 1 in the thickness direction. The other surface of the magnetic layer 2 in the thickness direction may or may not form the other surface of the inductor component 1 in the thickness direction. In this embodiment, the other surface of the magnetic layer 2 in the thickness direction does not form the other surface of the inductor component 1 in the thickness direction.

[0053] Multiple sides of the magnetic layer 2, together with the first insulating layer 4 and the second insulating layer 5 described later, form multiple sides of the inductor component 1.

[0054] The magnetic layer 2 has a plurality of through holes 21 that penetrate from one side in the thickness direction to the other side in the thickness direction. In this embodiment, the plurality of through holes 21 are arranged in a manner that is spaced apart from each other in the first direction and the second direction.

[0055] The shape of the through-hole 21 is adjusted as appropriate according to the shape of the metal wiring 3. For example, the shape of the through-hole 21 is a roughly straight shape that penetrates in the thickness direction of the magnetic layer 2 when viewed in cross-section. Specifically, it is a roughly cylindrical shape (roughly circular when viewed from the thickness direction).

[0056] The magnetic layer 2 has an inner circumferential surface 2S facing each of the through holes 21, corresponding to each of the through holes 21.

[0057] The dimensions of the magnetic layer 2 are not particularly limited. The thickness of the magnetic layer 2 is, for example, 1 μm or more, preferably 2 μm or more, and, for example, 50 mm or less, preferably 20 mm or less. The length of the magnetic layer 2 in the first direction and the length in the second direction are adjusted as appropriate according to the dimensions of the desired inductor component 1.

[0058] The thickness of the magnetic layer 2 corresponds to the length of the through-hole 21 in the thickness direction.

[0059] When viewed from the thickness direction (in a plan view), the maximum length of the through hole 21 is appropriately adjusted according to the maximum length of the metal wiring 3, which will be described later. When viewed from the thickness direction, the maximum length of the through hole 21 is, for example, 1 μm or more, preferably 10 μm or more, and, for example, 100 mm or less, preferably 50 mm or less. When viewed from the thickness direction, if the through hole 21 is substantially circular in shape, the above-mentioned maximum length corresponds to the diameter of the through hole 21.

[0060] In the first direction, the spacing between adjacent through holes 21 is, for example, 1 μm or more, preferably 2 μm or more, and also, for example, 100 mm or less, preferably 50 mm or less. In the second direction, the spacing between adjacent through holes 21 is, for example, 1 μm or more, preferably 2 μm or more, and also, for example, 100 mm or less, preferably 50 mm or less.

[0061] The magnetic layer 2 contains a binder and magnetic particles. As will be described in more detail later, the magnetic layer 2 is formed by laminating multiple magnetic sheets, each containing a binder and magnetic particles.

[0062] The binder is a resin matrix that disperses magnetic particles. Examples of binders include thermosetting resins and thermoplastic resins.

[0063] Examples of thermosetting resins include epoxy resins, phenolic resins, melamine resins, thermosetting polyimide resins, unsaturated polyester resins, polyurethane resins, and silicone resins.

[0064] Examples of thermoplastic resins include acrylic resins, ethylene-vinyl acetate copolymers, polycarbonate resins, polyamide resins (e.g., 6-nylon, 6,6-nylon), thermoplastic polyimide resins, and saturated polyester resins (e.g., PET, PBT).

[0065] The binder may be a thermosetting resin or a thermoplastic resin, either individually or in combination. Preferably, a combination of a thermosetting resin and a thermoplastic resin is used. More preferably, a combination of an acrylic resin, an epoxy resin, and a phenolic resin is used.

[0066] Another example of a binder is a photocurable resin.

[0067] The magnetic particles are uniformly (isotropically) dispersed in the magnetic layer 2. Examples of materials for the magnetic particles include soft magnetic materials and hard magnetic materials. From the viewpoint of inductance, soft magnetic materials are preferred as the material for the magnetic particles.

[0068] Examples of soft magnetic materials include single metallic bodies containing one type of metallic element in a pure state, and alloy bodies which are eutectic bodies (mixtures) of one or more metallic elements (first metallic element) and one or more metallic elements (second metallic element) and / or non-metallic elements (carbon, nitrogen, silicon, phosphorus, etc.). These can be used individually or in combination.

[0069] Examples of a single metallic body include a pure metal consisting of only one type of metallic element (the first metallic element). The first metallic element can be appropriately selected from among iron (Fe), cobalt (Co), nickel (Ni), and other metallic elements that can be contained as the first metallic element in a soft magnetic material.

[0070] Furthermore, examples of single metallic bodies include forms comprising a core containing only one type of metal element and a surface layer containing inorganic and / or organic materials that modifies part or all of the surface of the core, and forms obtained by decomposing (e.g., thermal decomposition) an organometallic compound or inorganic metal compound containing a first metal element. More specifically, the latter form includes iron powder (sometimes referred to as carbonyl iron powder) obtained by thermal decomposition of an organoiron compound (specifically, carbonyl iron) containing iron as the first metal element. The position of the layer containing inorganic and / or organic materials that modifies the part containing only one type of metal element is not limited to the surface as described above. The organometallic compound or inorganic metal compound that can obtain a single metallic body is not particularly limited and can be appropriately selected from known or conventional organometallic compounds or inorganic metal compounds that can obtain a single metallic body of soft magnets.

[0071] The alloy is a eutectic mixture of one or more metallic elements (first metallic elements) and one or more metallic elements (second metallic elements) and / or non-metallic elements (carbon, nitrogen, silicon, phosphorus, etc.), and is not particularly limited as long as it can be used as a soft magnetic alloy.

[0072] The first metallic element is an essential element in an alloy, and examples include iron (Fe), cobalt (Co), and nickel (Ni). If the first metallic element is Fe, the alloy is classified as an Fe-based alloy; if the first metallic element is Co, the alloy is classified as a Co-based alloy; and if the first metallic element is Ni, the alloy is classified as a Ni-based alloy.

[0073] The second metallic element is an element (sub-component) secondarily contained in the alloy, and is a metallic element that is miscible (eutectic) with the first metallic element, such as iron (Fe) (when the first metallic element is something other than Fe), cobalt (Co) (when the first metallic element is something other than Co), nickel (Ni) (when the first metallic element is something other than Ni), chromium (Cr), aluminum (Al), silicon (Si), copper (Cu), silver (Ag), manganese (Mn), calcium (Ca), and varium. Examples include magnesium (Ba), titanium (Ti), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb), tantalum (Ta), molybdenum (Mo), tungsten (W), ruthenium (Ru), rhodium (Rh), zinc (Zn), gallium (Ga), indium (In), germanium (Ge), tin (Sn), lead (Pb), scandium (Sc), yttrium (Y), strontium (Sr), and various rare earth elements. These can be used individually or in combination of two or more.

[0074] Nonmetallic elements are elements (sub-components) that are incidentally present in alloys and are miscible (eutectic) with the primary metallic element. Examples include boron (B), carbon (C), nitrogen (N), silicon (Si), phosphorus (P), and sulfur (S). These can be used individually or in combination of two or more.

[0075] Examples of Fe-based alloys include magnetic stainless steel (Fe-Cr-Al-Si alloy) (including electromagnetic stainless steel), Sendust (Fe-Si-Al alloy) (including Super Sendust), Permalloy (Fe-Ni alloy), Fe-Ni-Mo alloy, Fe-Ni-Mo-Cu alloy, Fe-Ni-Co alloy, Fe-Cr alloy, Fe-Cr-Al alloy, Fe-Ni-Cr alloy, Fe-Ni-Cr-Si alloy, silicon copper (Fe-Cu-Si alloy), Fe-Si alloy, Fe-Si-B(-Cu-Nb) alloy, Fe-B-Si-Cr alloy, Fe-Si-Cr- Examples include Ni alloys, Fe-Si-Cr alloys, Fe-Si-Al-Ni-Cr alloys, Fe-Ni-Si-Co alloys, Fe-N alloys, Fe-C alloys, Fe-B alloys, Fe-P alloys, ferrites (including stainless steel ferrites, and soft ferrites such as Mn-Mg ferrites, Mn-Zn ferrites, Ni-Zn ferrites, Ni-Zn-Cu ferrites, Cu-Zn ferrites, and Cu-Mg-Zn ferrites), Permendur (Fe-Co alloys), Fe-Co-V alloys, Fe-C-Cr alloys, and Fe-based amorphous alloys.

[0076] Examples of alloys include Co-based alloys such as Co-Ta-Zr and cobalt (Co)-based amorphous alloys.

[0077] An example of a Ni-based alloy is a Ni-Cr alloy.

[0078] The material for the magnetic particles is appropriately selected from the soft magnetic material and hard magnetic material described above so as to impart a desired relative permeability to the magnetic layer 2.

[0079] The magnetic particles are preferably made of iron. Examples of iron magnetic particles include iron powder obtained by thermal decomposition of an organic iron compound, more preferably carbonyl iron powder (relative permeability at 10 MHz: for example, 1.1 or more, preferably 3 or more, and for example, 25 or less, preferably 20 or less).

[0080] The shape of the magnetic particles is not particularly limited. In other words, the magnetic particles may be non-anisotropic or anisotropic. Examples of non-anisotropic magnetic particle shapes include spherical, granular, lump, and pellet shapes. Examples of anisotropic magnetic particle shapes include flattened (plate-like) and needle-like shapes.

[0081] When the magnetic particles are non-anisotropic magnetic particles, their average particle diameter (D50) is, for example, 0.1 μm or more, preferably 0.5 μm or more, and also, for example, 200 μm or less, preferably 150 μm or less.

[0082] When the magnetic particles are anisotropic magnetic particles, their average length is, for example, 3.5 μm or more, preferably 10 μm or more, and also, for example, 200 μm or less, preferably 150 μm or less.

[0083] The proportion of cured resin in magnetic layer 2 is, for example, 20% by volume or more, preferably 30% by volume or more, and also, for example, 70% by volume or less, preferably 60% by volume or less. The proportion of magnetic particles in magnetic layer 2 is, for example, 30% by volume or more, preferably 40% by volume or more, and also, for example, 80% by volume or less, preferably 70% by volume or less.

[0084] The magnetic layer 2 may also contain additives such as thermosetting catalysts, inorganic particles, organic particles, and crosslinking agents, as needed.

[0085] 1.2. Metal Wiring As shown in Figures 1 and 2, the inductor component 1 comprises a plurality of metal wires 3. The metal wires 3 are arranged in through holes 21 of the magnetic layer 2. In this embodiment, each of the plurality of metal wires 3 is arranged corresponding to each of the plurality of through holes 21. That is, the plurality of metal wires 3 are arranged in alignment with spacing between them in the first and second directions.

[0086] Each of the multiple metal wires 3 extends in the thickness direction. In other words, the direction in which the metal wires 3 extend corresponds to the thickness direction.

[0087] Each of the multiple metal wirings 3 has one end 3A (one end 3A in the thickness direction) and another end 3B (other end 3B in the thickness direction) in the thickness direction. The one end 3A of the metal wiring 3 in the thickness direction protrudes from one surface of the magnetic layer 2 in the thickness direction. In this embodiment, the other end 3B of the metal wiring 3 in the thickness direction protrudes from the other surface of the magnetic layer 2 in the thickness direction.

[0088] One end 3A in the thickness direction of the metal wiring 3 may protrude or be recessed relative to one surface in the thickness direction of the inductor component 1. Alternatively, the surface (one end surface in the thickness direction) of one end 3A of the metal wiring 3 may be flush with one surface in the thickness direction of the inductor component 1. In this embodiment, one end surface in the thickness direction of the metal wiring 3 is flush with one surface in the thickness direction of the inductor component 1. In other words, one end surface in the thickness direction of the metal wiring 3 and one surface in the thickness direction of the first insulating layer 4, which will be described later, are flush.

[0089] The other end 3B in the thickness direction of the metal wiring 3 may protrude or be recessed relative to the other surface in the thickness direction of the inductor component 1. Furthermore, the surface of the other end 3B in the thickness direction of the metal wiring 3 (the other end surface in the thickness direction) may be flush with the other surface in the thickness direction of the inductor component 1. In this embodiment, one end surface in the thickness direction of the metal wiring 3 is flush with the other surface in the thickness direction of the inductor component 1. In other words, the other end surface in the thickness direction of the metal wiring 3 and the other surface in the thickness direction of the first insulating layer 4, which will be described later, are flush.

[0090] One end 3A and the other end 3B in the thickness direction of such metal wiring 3 can be used as external terminals for the inductor component 1.

[0091] Specifically, at one end 3A in the thickness direction of the metal wiring 3, at least one end face in the thickness direction is exposed from one side of the inductor component 1 in the thickness direction. If one end 3A in the thickness direction of the metal wiring 3 is recessed relative to one side of the inductor component 1 in the thickness direction, and if one end face in the thickness direction of the metal wiring 3 is flush with one side of the inductor component 1 in the thickness direction, then only one end face in the thickness direction of the metal wiring 3 is exposed from one side of the inductor component 1 in the thickness direction. Also, if one end 3A in the thickness direction of the metal wiring 3 protrudes relative to one side of the inductor component 1 in the thickness direction, then one end face in the thickness direction of the metal wiring 3 and a part of the outer circumferential surface of one end 3A in the thickness direction are exposed from one side of the inductor component 1 in the thickness direction. In this embodiment, one end face in the thickness direction of the metal wiring 3 is flush with one side of the inductor component 1 in the thickness direction, and only one end face in the thickness direction of the metal wiring 3 is exposed from one side of the inductor component 1 in the thickness direction. In the metal wiring 3, at least one end face in the thickness direction is exposed from one side in the thickness direction of the inductor component 1, making it usable as an external terminal of the inductor component 1.

[0092] Specifically, at the other end 3B in the thickness direction of the metal wiring 3, at least the other end face in the thickness direction is exposed from the other side in the thickness direction of the inductor component 1. If the other end 3B in the thickness direction of the metal wiring 3 is recessed relative to the other side in the thickness direction of the inductor component 1, and if the other end face in the thickness direction of the metal wiring 3 is flush with the other side in the thickness direction of the inductor component 1, then only the other end face in the thickness direction of the metal wiring 3 is exposed from the other side in the thickness direction of the inductor component 1. Furthermore, if the other end 3B in the thickness direction of the metal wiring 3 protrudes relative to the other side in the thickness direction of the inductor component 1, then the other end face in the thickness direction of the metal wiring 3 and a part of the outer circumferential surface of the other end 3B in the thickness direction are exposed from the other side in the thickness direction of the inductor component 1. In this embodiment, the other end face in the thickness direction of the metal wiring 3 is flush with the other side in the thickness direction of the inductor component 1, and only the other end face in the thickness direction of the metal wiring 3 is exposed from the other side in the thickness direction of the inductor component 1. In the metal wiring 3, at least the other end face in the thickness direction is exposed from the other side in the thickness direction of the inductor component 1, making it usable as an external terminal of the inductor component 1.

[0093] The shape of the metal wiring 3 is, for example, substantially straight in cross-sectional view. Specifically, it is substantially cylindrical (substantially circular when viewed from the thickness direction). In other words, preferably, the length of the metal wiring 3 in the direction perpendicular to the thickness direction (including the first and second directions) is the same from one side in the thickness direction to the other side in the thickness direction.

[0094] Furthermore, if the shape of the metal wiring 3 is substantially cylindrical (substantially circular when viewed from the thickness direction), the length of the metal wiring 3 is the same in all directions perpendicular to the thickness direction, but is not limited to this, and the length of the metal wiring 3 does not have to be the same in all directions perpendicular to the thickness direction. Even if the length of the metal wiring 3 is not the same in all directions perpendicular to the thickness direction, it is preferable that the length in the direction perpendicular to the thickness direction (including the first and second directions) is the same from one side in the thickness direction to the other side in the thickness direction.

[0095] The outer circumferential surface 3S of the metal wiring 3 faces the inner circumferential surface 2S of the magnetic layer 2. The outer circumferential surface 3S of the metal wiring 3 may be in contact with the inner circumferential surface 2S of the magnetic layer 2, or it may be separated from the inner circumferential surface 2S of the magnetic layer 2. In this embodiment, the outer circumferential surface 3S of the metal wiring 3 is separated from the inner circumferential surface 2S of the magnetic layer 2, and the third insulating layer 6, which will be described later, is arranged between the inner circumferential surface 2S of the magnetic layer 2 and the outer circumferential surface 3S of the metal wiring 3. In other words, the outer circumferential surface 3S of the metal wiring 3 is in contact with the third insulating layer 6.

[0096] The dimensions of the metal wiring 3 are not particularly limited. The length of the metal wiring 3 in the direction of extension is, for example, 1 μm or more, preferably 2 μm or more, and for example, 20 mm or less, preferably 10 mm or less.

[0097] Preferably, the length of the metal wiring 3 in the direction in which it extends is longer than the thickness of the magnetic layer 2.

[0098] The length of the protruding portion at one end 3A of the metal wiring 3 (the distance from one side in the thickness direction of the magnetic layer 2 to one end face in the thickness direction of the metal wiring 3) is, for example, 1 μm or more, preferably 5 μm or more, more preferably 10 μm or more, and also, for example, 300 μm or less, preferably 200 μm or less, and more preferably 100 μm or less.

[0099] Furthermore, when the other end 3B of the metal wiring 3 in the thickness direction protrudes from the other surface in the thickness direction of the magnetic layer 2, the length of the protruding portion of the other end 3B of the metal wiring 3 (the distance from the other surface in the thickness direction of the magnetic layer 2 to the other end face of the metal wiring 3 in the thickness direction) is, for example, 1 μm or more, preferably 5 μm or more, more preferably 10 μm or more, and also, for example, 300 μm or less, preferably 200 μm or less, more preferably 100 μm or less.

[0100] The length of the metal wiring 3 in the direction of extension may be, for example, longer than, shorter than, or equal to the total thickness of the magnetic layer 2, the first insulating layer 4, and the second insulating layer 5. Preferably, it is equal to the total thickness.

[0101] The maximum length of the metal wiring 3 when viewed from the thickness direction is, for example, 1 μm or more, preferably 10 μm or more, and, for example, 100 mm or less, preferably 50 mm or less. When the metal wiring 3 is substantially circular in shape when viewed from the thickness direction, the above-mentioned maximum length corresponds to the diameter of the metal wiring 3.

[0102] When viewed from the thickness direction, the maximum length of the metal wiring 3 is less than or equal to the maximum length of the through hole 21. In other words, when viewed from the thickness direction, the maximum length of the metal wiring 3 may be the same as the maximum length of the through hole 21, or it may be shorter than the maximum length of the through hole 21. In this embodiment, when viewed from the thickness direction, the maximum length of the metal wiring 3 is shorter than the maximum length of the through hole 21.

[0103] The distance between the outer surface 3S of the metal wiring 3 and the inner surface 2S of the magnetic layer 2 (the difference between the maximum length of the metal wiring 3 and the maximum length of the through hole 21) is substantially uniform in the planar direction. The distance between the outer surface 3S of the metal wiring 3 and the inner surface 2S of the magnetic layer 2 is, for example, 0.01 μm or more, preferably 1 μm or more, and also, for example, 100 μm or less, preferably 50 μm or less.

[0104] In the first direction, the spacing between adjacent metal wirings 3 is, for example, 1 μm or more, preferably 2 μm or more, and also, for example, 100 mm or less, preferably 50 mm or less. In the second direction, the spacing between adjacent metal wirings 3 is, for example, 1 μm or more, preferably 2 μm or more, and also, for example, 100 mm or less, preferably 50 mm or less.

[0105] Each of the multiple metal wirings 3 is provided with a metal pin 31. Each of the multiple metal wirings 3 may consist of a metal pin 31, or it may consist of a metal pin 31 and a metal layer 32. In this embodiment, each of the multiple metal wirings 3 consists of a metal pin 31.

[0106] The metal pin 31 extends in the thickness direction. The metal pin 31 has a substantially straight shape in cross-sectional view, for example. Specifically, it has a substantially cylindrical shape (substantially circular when viewed from the thickness direction). Examples of materials for the metal pin 31 include copper, silver, gold, aluminum, nickel, and alloys thereof. Copper is preferred.

[0107] The metal pin 31 is made of a metal having the dimensions shown below (length in the direction in which the metal pin 31 extends, and the maximum length of the metal pin 31 when viewed from the thickness direction). Preferably, it is made of copper having the dimensions shown below. The metal pin 31 is made of metal only, and its outer surface is not insulated. In other words, the metal pin 31 is different from commercially available insulated wiring (insulated metal thin wires). Because the metal pin 31 is made of metal, its dimensions can be easily adjusted by polishing and cutting.

[0108] Furthermore, the metal pin 31 is an independent rod-shaped member made of metal. In other words, the metal pin 31 is different from the metal conductor formed by metal plating in the through-hole 21 of the magnetic layer 2, and the metal conductor formed by metal paste in the through-hole 21 of the magnetic layer 2. And, unlike the metal conductor described above, the metal pin 31 does not need to be formed separately in the manufacturing process of the inductor component, thus simplifying the process.

[0109] The length of the metal pin 31 in the extending direction is, for example, 1 μm or more, preferably 2 μm or more, and for example, 20 mm or less, preferably 10 mm or less.

[0110] When viewed from the thickness direction, the maximum length of the metal pin 31 is, for example, 1 μm or more, preferably 10 μm or more, and, for example, 100 mm or less, preferably 50 mm or less. When viewed from the thickness direction, if the metal pin 31 is substantially circular in shape, the above-mentioned maximum length corresponds to the diameter of the metal pin 31. In this embodiment, the maximum length of the metal pin 31 when viewed from the thickness direction is shorter than the maximum length of the through hole 21.

[0111] 1.3. First Insulating Layer As shown in Figure 1, the first insulating layer 4 has one surface (one surface in the thickness direction) and another surface (the other surface in the thickness direction) on the opposite side in the thickness direction. The first insulating layer 4 is a sheet shape that extends in a planar direction perpendicular to the thickness direction.

[0112] One surface of the first insulating layer 4 in the thickness direction forms one surface of the inductor component 1 in the thickness direction.

[0113] The first insulating layer 4 is positioned on one side of the magnetic layer 2 in the thickness direction. In other words, the other side of the first insulating layer 4 in the thickness direction is in contact with one side of the magnetic layer 2 in the thickness direction. Preferably, the other side of the first insulating layer 4 in the thickness direction is in contact with the entire surface of one side of the magnetic layer 2 in the thickness direction.

[0114] Furthermore, the first insulating layer 4 is not placed in the through-holes 21 of the magnetic layer 2. In other words, the metal wiring 3 (one end face in the thickness direction of the metal wiring 3) is not covered by the first insulating layer 4.

[0115] In this embodiment, one surface of the first insulating layer 4 in the thickness direction and one end surface of the metal wiring 3 in the thickness direction are flush.

[0116] The thickness of the first insulating layer 4 is, for example, 1 μm or more, preferably 5 μm or more, more preferably 10 μm or more, and also, for example, 300 μm or less, preferably 200 μm or less, and more preferably 100 μm or less.

[0117] The ratio of the thickness of the first insulating layer 4 to the thickness of the magnetic layer 2 (thickness of the first insulating layer 4 / thickness of the magnetic layer 2) is, for example, 0.0001 or more, and for example, 1.0 or less, preferably 0.50 or less, and more preferably 0.10 or less.

[0118] Preferably, the length of the first insulating layer 4 in the first direction and the length of the first insulating layer 4 in the second direction are the same as the length of the magnetic layer 2 in the first direction and the length of the magnetic layer 2 in the second direction, respectively.

[0119] Examples of materials for the first insulating layer 4 include insulating resins and insulating inorganic materials. The first insulating layer 4 does not contain magnetic particles.

[0120] Examples of insulating resins include epoxy resins, acrylic resins, polyester resins, polyurethane resins, polyesterimide resins, polyamideimide resins, and polyimide resins. Examples of insulating inorganic materials include silica, alumina, zirconia, titanium oxide, magnesium oxide, tin oxide, tantalum oxide, and silicon nitride.

[0121] The first insulating layer 4 may, as necessary, contain additives such as thermosetting catalysts, inorganic particles, organic particles, and crosslinking agents.

[0122] 1.4. Second Insulating Layer As shown in Figure 1, the second insulating layer 5 has one surface (one surface in the thickness direction) and another surface (the other surface in the thickness direction) on the opposite side in the thickness direction. The second insulating layer 5 is a sheet shape that extends in a planar direction perpendicular to the thickness direction.

[0123] The other surface in the thickness direction of the second insulating layer 5 forms the other surface in the thickness direction of the inductor component 1.

[0124] The second insulating layer 5 is positioned on the other side of the magnetic layer 2 in the thickness direction. In other words, one side of the second insulating layer 5 in the thickness direction is in contact with the other side of the magnetic layer 2 in the thickness direction. Preferably, one side of the second insulating layer 5 in the thickness direction is in contact with the entire other side of the magnetic layer 2 in the thickness direction.

[0125] Furthermore, the second insulating layer 5 is not placed in the through-holes 21 of the magnetic layer 2. In other words, the metal wiring 3 (the other end face in the thickness direction of the metal wiring 3) is not covered by the second insulating layer 5.

[0126] In this embodiment, the other surface in the thickness direction of the second insulating layer 5 and the other end surface in the thickness direction of the metal wiring 3 are flush.

[0127] The thickness of the second insulating layer 5 is, for example, 1 μm or more, preferably 5 μm or more, more preferably 10 μm or more, and also, for example, 300 μm or less, preferably 200 μm or less, more preferably 100 μm or less.

[0128] The thickness of the second insulating layer 5 may be the same as or different from the thickness of the first insulating layer 4. Preferably, the thickness of the second insulating layer 5 is the same as the thickness of the first insulating layer 4.

[0129] The ratio of the thickness of the second insulating layer 5 to the thickness of the magnetic layer 2 (thickness of the second insulating layer 5 / thickness of the magnetic layer 2) is, for example, 0.0001 or more, and for example, 1.0 or less, preferably 0.50 or less, and more preferably 0.10 or less.

[0130] Preferably, the length of the second insulating layer 5 in the first direction and the length of the second direction are the same as the length of the magnetic layer 2 in the first direction and the length of the second direction, respectively.

[0131] Examples of materials for the second insulating layer 5 include insulating resins and insulating inorganic materials. The second insulating layer 5 does not contain magnetic particles.

[0132] Examples of insulating resins and insulating inorganic materials include the insulating resins and insulating inorganic materials described in the first insulating layer 4 above.

[0133] The second insulating layer 5 may, as needed, contain additives such as thermosetting catalysts, inorganic particles, organic particles, and crosslinking agents.

[0134] The material of the second insulating layer 5 and the material of the first insulating layer 4 may be the same or different. Preferably, they are the same.

[0135] 1.5. Third Insulating Layer The third insulating layer 6 is positioned between the inner circumferential surface 2S of the magnetic layer 2 and the outer circumferential surface 3S of the metal wiring 3, as shown in Figure 1. In other words, the third insulating layer 6 is in contact with both the inner circumferential surface 2S of the magnetic layer 2 and the outer circumferential surface 3S of the metal wiring 3. Preferably, the third insulating layer 6 is in contact with the entire inner circumferential surface 2S of the magnetic layer 2, and further, with the entire outer circumferential surface 3S of the metal wiring 3.

[0136] In other words, the third insulating layer 6 has a hollow cylindrical shape that extends in the thickness direction. Preferably, it has a hollow cylindrical shape that extends in the thickness direction. In this case, the third insulating layer 6 has a substantially annular shape when viewed from the thickness direction. The length of the third insulating layer 6 in the surface direction, in other words, the distance between the inner surface and the outer surface of the third insulating layer 6 is substantially uniform.

[0137] Furthermore, the third insulating layer 6 is continuous with the first insulating layer 4. Also, the third insulating layer 6 is continuous with the second insulating layer 5. In Figure 2, the interface between the first insulating layer 4 and the third insulating layer 6 is not shown, but the interface between the first insulating layer 4 and the third insulating layer 6 may or may not be observed. Preferably, the first insulating layer 4 and the third insulating layer 6 are integrated. Furthermore, in Figure 2, the interface between the second insulating layer 5 and the third insulating layer 6 is not shown, but the interface between the second insulating layer 5 and the third insulating layer 6 may or may not be observed. Preferably, the second insulating layer 5 and the third insulating layer 6 are integrated. Note that "integrated" means that when the cross-section is observed, no interface is observed.

[0138] The planar length of the third insulating layer 6, in other words, the distance between the inner and outer surfaces of the third insulating layer 6, is, for example, 0.01 μm or more, preferably 1 μm or more, and also, for example, 100 μm or less, preferably 50 μm or less.

[0139] The length of the third insulating layer 6 in the planar direction, in other words, the distance between the inner and outer surfaces of the third insulating layer 6, may be the same as or different from the thickness of the first insulating layer 4 and the second insulating layer 5.

[0140] Examples of materials for the third insulating layer 6 include insulating resins and insulating inorganic materials. The third insulating layer 6 does not contain magnetic particles.

[0141] Examples of insulating resins and insulating inorganic materials include the insulating resins and insulating inorganic materials described in the first insulating layer 4 above.

[0142] The third insulating layer 6 may, as needed, contain additives such as thermosetting catalysts, inorganic particles, organic particles, and crosslinking agents.

[0143] The material of the third insulating layer 6 may be the same as or different from the material of the first insulating layer 4 and the second insulating layer 5. Preferably, the material of the third insulating layer 6 is at least the same as the material of the first insulating layer 4.

[0144] 2. Effects of the inductor component (1) In the inductor component 1 of this disclosure, the metal wiring 3 is provided with metal pins 31. Therefore, compared to the case in which the metal wiring 3 is formed by plating, manufacturability can be improved.

[0145] (2) The inductor component 1 of the present disclosure includes a first insulating layer 4 disposed on one side in the thickness direction of the magnetic layer 2. Therefore, compared to the case in which a conductor pattern is directly formed on one side in the thickness direction of the magnetic layer 2, damage to the magnetic layer 2 can be suppressed. As a result, the degree of freedom in circuit design can be improved.

[0146] (3) In the inductor component 1 of this disclosure, one end 3A in the thickness direction of the metal wiring 3 is formed to protrude from one side in the thickness direction of the magnetic layer 2. Therefore, one end 3A in the thickness direction of the metal wiring 3 used as a terminal can be easily exposed from the magnetic layer 2. In other words, manufacturability can be improved.

[0147] (4) In the inductor component 1 of this disclosure, one end face in the thickness direction of the metal wiring 3 and one face in the thickness direction of the first insulating layer 4 are flush. Therefore, when a conductor pattern is formed on one face in the thickness direction of the first insulating layer 4, it can be reliably connected to the metal wiring 3.

[0148] (5) The inductor component 1 of this disclosure includes a second insulating layer 5 disposed on the other side in the thickness direction of the magnetic layer 2. Therefore, when a conductor pattern is formed on one side and the other side in the thickness direction of the inductor component 1, damage to the magnetic layer 2 can be further suppressed. As a result, the degree of freedom in circuit design can be improved.

[0149] (6) In the inductor component 1 of this disclosure, the other end 3B in the thickness direction of the metal wiring 3 is formed to protrude from the other surface in the thickness direction of the magnetic layer 2. Therefore, the other end 3B in the thickness direction of the metal wiring 3 used as a terminal can be easily exposed from the magnetic layer 2. In other words, manufacturability can be improved.

[0150] (7) In the inductor component 1 of this disclosure, the other end face in the thickness direction of the metal wiring 3 and the other face in the thickness direction of the second insulating layer 5 are flush. Therefore, when a conductor pattern is formed on the other face in the thickness direction of the second insulating layer 5, it can be reliably connected to the metal wiring 3.

[0151] (8) In the inductor component 1 of this disclosure, the length of the metal wiring 3 in the direction perpendicular to the thickness direction is the same from one side in the thickness direction to the other side in the thickness direction. Therefore, a constant clearance can be maintained with respect to the inner circumferential surface 2S (inner circumferential surface of the third insulating layer 6) facing the through hole 21. As a result, manufacturability can be improved.

[0152] (9) In the inductor component 1 of this disclosure, the metal wiring 3 consists of metal pins 31. Therefore, compared to the case in which the metal wiring 3 is formed by plating, manufacturability can be further improved.

[0153] (10) The inductor component 1 of the present disclosure further comprises a third insulating layer 6 disposed between the outer peripheral surface 3S of the metal wiring 3 and the inner peripheral surface 2S facing the through hole 21. Therefore, short circuits of the metal wiring 3 can be suppressed more reliably.

[0154] 3. Modified Inductor Components In the following modified examples, components similar to those in the above-described embodiment are given the same reference numerals, and their detailed descriptions are omitted. Furthermore, each modified example can achieve the same effects and advantages as the first embodiment, unless otherwise specified. Moreover, the first embodiment and its modified examples can be combined as appropriate.

[0155] 3.1. As shown in Figure 3 of the first modified example, the inductor component 1 does not necessarily have a third insulating layer 6 disposed between the outer peripheral surface 3S of the metal wiring 3 and the inner peripheral surface 2S facing the through hole 21.

[0156] In the first modified inductor component 1, the outer circumferential surface 3S of the metal wiring 3 is in contact with the inner circumferential surface 2S facing the through hole 21. In other words, the maximum length of the metal wiring 3 and the maximum length of the through hole 21 are the same when viewed from the thickness direction.

[0157] In the first modified inductor component 1, the outer circumferential surface 3S of the metal wiring 3 and the inner circumferential surface 2S facing the through hole 21 are in contact. Therefore, when manufacturing the inductor component 1, there is no clearance between the outer circumferential surface 3S of the metal wiring 3 and the inner circumferential surface 2S facing the through hole 21, which suppresses displacement of the metal wiring 3. As a result, manufacturability can be improved.

[0158] 3.2. Second Modified Example As shown in Figure 4, the inductor component 1 does not need to have a second insulating layer 5 on the other side in the thickness direction of the magnetic layer 2.

[0159] In the second modified inductor component 1, the other end 3B in the thickness direction of the metal wiring 3 does not protrude from the other side of the thickness of the magnetic layer 2. Also, the other end face in the thickness direction of the metal wiring 3 is flush with the other side of the thickness of the magnetic layer 2.

[0160] 3.3. As shown in Figure 5 of the third modified example, the inductor component 1 may have one end face in the thickness direction of the metal wiring 3 recessed to the other side in the thickness direction compared to one side in the thickness direction of the first insulating layer 4, and the other end face in the thickness direction of the metal wiring 3 may have one end face in the thickness direction recessed to the other side in the thickness direction compared to the other side in the thickness direction of the second insulating layer 5.

[0161] In the third modified inductor component 1, one end 3A of the metal wiring 3 in the thickness direction protrudes from one surface of the magnetic layer 2 in the thickness direction, but the end face of the metal wiring 3 in the thickness direction is recessed on the other side in the thickness direction compared to one surface of the first insulating layer 4 in the thickness direction. Also, the other end 3B of the metal wiring 3 in the thickness direction protrudes from the other surface of the magnetic layer 2 in the thickness direction, but the other end face of the metal wiring 3 in the thickness direction is recessed on one side in the thickness direction compared to the other surface of the second insulating layer 5 in the thickness direction. In other words, one end face of the metal wiring 3 in the thickness direction is located between one surface of the magnetic layer 2 in the thickness direction and one surface of the first insulating layer 4 in the thickness direction, and the other end face of the metal wiring 3 in the thickness direction is located between the other surface of the magnetic layer 2 in the thickness direction and the other surface of the second insulating layer 5 in the thickness direction.

[0162] The length of the recess in the direction in which the metal wiring 3 extends (the distance between one end face of the metal wiring 3 in the thickness direction and one side of the first insulating layer 4 in the thickness direction, and the distance between the other end face of the metal wiring 3 in the thickness direction and the other side of the second insulating layer 5 in the thickness direction) is not particularly limited, as long as one end face of the metal wiring 3 in the thickness direction is between one side of the magnetic layer 2 in the thickness direction and one side of the first insulating layer 4 in the thickness direction, and the other end face of the metal wiring 3 in the thickness direction is between the other side of the magnetic layer 2 in the thickness direction and the other side of the second insulating layer 5 in the thickness direction.

[0163] In the third modification, one end face of the metal wiring 3 in the thickness direction is recessed on the other side in the thickness direction compared to one side in the thickness direction of the first insulating layer 4, and furthermore, the other end face of the metal wiring 3 in the thickness direction is recessed on one side in the thickness direction compared to the other side in the thickness direction of the second insulating layer 5, however, only one of them may be recessed.

[0164] 3.4. Fourth Modified Example As shown in Figure 6, the inductor component 1 may have one end 3A in the thickness direction of the metal wiring 3 protruding from one side in the thickness direction of the first insulating layer 4, and the other end 3B in the thickness direction of the metal wiring 3 protruding from the other side in the thickness direction of the second insulating layer 5.

[0165] In the fourth modified inductor component 1, one end 3A in the thickness direction of the metal wiring 3 protrudes from one surface in the thickness direction of the first insulating layer 4, and the other end 3B in the thickness direction of the metal wiring 3 protrudes from the other surface in the thickness direction of the second insulating layer 5.

[0166] The protruding length of the metal wiring 3 in the direction of extension (the distance between one end face of the metal wiring 3 in the thickness direction and one side of the first insulating layer 4 in the thickness direction, and the distance between the other end face of the metal wiring 3 in the thickness direction and the other side of the second insulating layer 5 in the thickness direction) is not particularly limited.

[0167] In the fourth modified example, one end 3A of the metal wiring 3 in the thickness direction protrudes from one side of the first insulating layer 4 in the thickness direction, and the other end 3B of the metal wiring 3 in the thickness direction protrudes from the other side of the second insulating layer 5 in the thickness direction; however, only one of these ends may protrude.

[0168] 3.5. As shown in Figure 7 of the fifth modified example, in the inductor component 1, the metal wiring 3 may consist of a metal pin 31 and a metal layer 32 covering the outer surface of the metal pin 31.

[0169] In the inductor component 1 of the fifth modified example, the metal wiring 3 consists of a metal pin 31 and a metal layer 32 that covers the outer surface of the metal pin 31, and the outer surface of the metal layer 32 (outer surface 3S of the metal wiring 3) is in contact with the third insulating layer 6.

[0170] The metal layer 32 has a hollow cylindrical shape that extends in the thickness direction. Preferably, it has a hollow cylindrical shape that extends in the thickness direction. In this case, the metal layer 32 is substantially annular in shape when viewed from the thickness direction. The length of the metal layer 32 in the planar direction, in other words, the distance between the inner and outer surfaces of the third insulating layer 6 is substantially uniform.

[0171] The length of the metal layer 32 in the planar direction, in other words, the distance between the inner and outer surfaces of the metal layer 32, is, for example, 0.01 μm or more, preferably 1 μm or more, and also, for example, 100 μm or less, preferably 50 μm or less.

[0172] Examples of materials for the metal layer 32 include copper, silver, gold, aluminum, nickel, and alloys thereof. Copper is preferred.

[0173] In the fifth modified inductor component 1, the metal wiring 3 consists of a metal pin 31 and a metal layer 32 covering the outer surface of the metal pin 31. Therefore, the clearance with respect to the inner surface 2S (the inner surface of the third insulating layer 6) facing the through hole 21 can be adjusted. As a result, manufacturability can be improved.

[0174] 4. Manufacturing Method of Inductor Components An embodiment of the manufacturing method of inductor components according to the present disclosure will be described with reference to Figures 8A to 8D.

[0175] The manufacturing method for the inductor component shown in Figures 8A to 8D is the same method used to manufacture the inductor component 1 shown in Figures 1 and 2.

[0176] A method for manufacturing an inductor component comprises the steps of: preparing a magnetic layer 2 having a through hole 21 that penetrates from one surface in the thickness direction to the other surface in the thickness direction (magnetic layer preparation step); arranging a metal wiring 3 equipped with a metal pin 31 in the through hole 21, wherein the metal wiring 3 is arranged such that one end 3A in the thickness direction of the metal wiring 3 protrudes from one surface in the thickness direction of the magnetic layer 2; and forming a first insulating layer 4 on one surface in the thickness direction of the magnetic layer 2 (first insulating layer formation step). In this embodiment, the method for manufacturing the inductor component further comprises a step of forming a second insulating layer 5 on the other side in the thickness direction of the magnetic layer 2 before forming the through hole 21 in the magnetic layer 2 (second insulating layer formation step), and further comprises a step of forming a third insulating layer 6 which is disposed between the outer peripheral surface 3S of the metal wiring 3 and the inner peripheral surface 2S facing the through hole 21, together with the first insulating layer formation step (third insulating layer formation step), and further comprises a step of making one end surface in the thickness direction of the metal wiring 3 and one surface in the thickness direction of the first insulating layer 4 flush (forming step) after the step of forming the first insulating layer 4 (first insulating layer formation step).

[0177] (Magnetic layer preparation process) The magnetic layer preparation process involves preparing a magnetic layer 2 having through holes 21 that penetrate from one side in the thickness direction to the other side in the thickness direction, as shown in Figure 8A.

[0178] First, the magnetic layer 2 is fabricated before the through-hole 21 is formed.

[0179] Specifically, a semi-cured (B-stage) magnetic sheet containing a binder and magnetic particles is formed. The magnetic sheet is formed by applying a varnish of a magnetic composition containing a binder, magnetic particles, and a solvent to a substrate (e.g., a metal substrate, a release sheet) to form a coating film. The coating film of the magnetic composition is then dried. During drying, the coating film of the magnetic composition is heated if necessary. Drying removes the solvent from the coating film of the magnetic composition. This forms a magnetic sheet.

[0180] As described above, the magnetic sheet is in a semi-cured state (Stage B), which is between the state where the binder is liquid (Stage A) and the state where it is fully cured (Stage C). In Stage B, the binder has hardened slightly, and the compressive modulus is lower than that of Stage C.

[0181] Next, multiple magnetic sheets are laminated and cured. The number of magnetic sheets laminated is adjusted as appropriate according to the desired thickness of the magnetic layer. If the binder contained in the magnetic sheet is a thermosetting resin, the magnetic sheet is heated. If the binder contained in the magnetic sheet is a photocurable resin, the magnetic sheet is irradiated with light. This causes the magnetic sheet to fully cure (C-stage). This forms the magnetic layer 2. This magnetic layer 2 does not yet have through holes 21.

[0182] Next, in this embodiment, before forming the through holes 21 in the magnetic layer 2, a second insulating layer 5 is formed on the other side in the thickness direction of the magnetic layer 2. In other words, the magnetic layer preparation step includes the step of forming the second insulating layer 5 on the other side in the thickness direction of the magnetic layer 2 before forming the through holes 21 in the magnetic layer 2 (second insulating layer formation step).

[0183] As a second insulating layer formation step, for example, the second insulating layer 5 is placed on the other side in the thickness direction of the magnetic layer 2 before the through holes 21 are formed. The second insulating layer 5 may be formed by applying an insulating composition varnish to the other side in the thickness direction of the magnetic layer 2 before the through holes 21 are formed, drying and curing it as necessary, or by attaching a separately formed semi-cured (B stage) insulating sheet to the other side in the thickness direction of the magnetic layer 2 and curing it. Alternatively, a separately formed cured (C stage) second insulating layer 5 may be attached to the other side in the thickness direction of the magnetic layer 2 before the through holes 21 are formed. The insulating composition varnish contains at least one of an insulating resin and an insulating inorganic material, and a solvent.

[0184] Alternatively, multiple magnetic sheets in the semi-cured state (Stage B) described above may be laminated on one side in the thickness direction of the second insulating layer 5 (insulating sheet) in the semi-cured state (Stage B), and cured together to form the magnetic layer 2 before the through-hole 21 is formed, and the second insulating layer 5 which is arranged on the other side in the thickness direction of the magnetic layer 2.

[0185] After the second insulating layer formation step, through holes 21 are formed in the magnetic layer 2, penetrating from one side in the thickness direction to the other side in the thickness direction. In other words, for a magnetic layer 2 having the second insulating layer 5 on the other side in the thickness direction, through holes 21 are formed penetrating from one side in the thickness direction to the other side in the thickness direction. Specifically, at least one of the group consisting of drilling, blasting, and dicing is used to form through holes 21 in the magnetic layer 2, penetrating from one side in the thickness direction to the other side in the thickness direction.

[0186] In this case, a through-hole may be further formed that has the same shape as the through-hole 21 in plan view and penetrates the second insulating layer 5 from one side in the thickness direction to the other side in the thickness direction. Alternatively, a groove 51 may be formed that has the same shape as the through-hole 21 in plan view and extends from one side in the thickness direction to the other side in the thickness direction, with a portion of the second insulating layer 5 removed, resulting in a groove 51 with a substantially U-shaped cross-section. In this embodiment, a groove 51 with the same shape as the through-hole 21 in plan view and extends from one side in the thickness direction to the other side in the thickness direction, with a portion of the second insulating layer 5 removed, resulting in a groove 51 with a substantially U-shaped cross-section.

[0187] In this way, a magnetic layer 2 having through holes 21 that penetrate from one side in the thickness direction to the other side in the thickness direction is prepared.

[0188] (Placement process) In the placement process, as shown in Figure 8B, the metal wiring 3, which has metal pins 31, is placed in the through hole 21.

[0189] In this embodiment, the metal wiring 3 consists of a metal pin 31. That is, the metal pin 31 is inserted into the through hole 21. When the metal pin 31 is inserted into the through hole 21, the other end face of the metal pin 31 in the thickness direction contacts one surface in the thickness direction of the second insulating layer 5 in the groove 51. At this time, the other end 3B of the metal pin 31 in the thickness direction protrudes from the other surface in the thickness direction of the magnetic layer 2. In other words, in this embodiment, the metal wiring 3 is arranged such that the other end 3B of the metal wiring 3 in the thickness direction does not protrude (expose) from one surface in the thickness direction of the second insulating layer 5, but protrudes from the other surface in the thickness direction of the magnetic layer 2.

[0190] Furthermore, in this embodiment, as shown in Figure 8B, one end 3A in the thickness direction of the metal pin 31 protrudes from one surface in the thickness direction of the magnetic layer 2. In other words, the metal wiring 3 is arranged such that one end 3A in the thickness direction of the metal wiring 3 protrudes from one surface in the thickness direction of the magnetic layer 2. At this time, one end 3A in the thickness direction of the metal pin 31 (metal wiring 3) is exposed.

[0191] Furthermore, in this embodiment, as shown in Figure 8B, the outer peripheral surface 3S of the metal pin 31 (metal wiring 3) is arranged to be separated from the inner peripheral surface 2S facing the through hole 21 of the magnetic layer 2 by a substantially uniform distance in the planar direction.

[0192] (First insulating layer formation step) In the first insulating layer formation step, as shown in Figure 8C, the first insulating layer 4 is formed on one side of the magnetic layer 2 in the thickness direction.

[0193] In this embodiment, since a molding process described later is included, the first insulating layer formation step involves forming a first insulating layer 4 on one side of the magnetic layer 2 in the thickness direction, and further forming the first insulating layer 4 so as to cover one end 3A of the metal pin 31 (metal wiring 3) in the thickness direction.

[0194] Specifically, the first insulating layer 4 may be formed by applying an insulating composition varnish to one side in the thickness direction of the magnetic layer 2, drying and curing it as necessary, or by attaching a separately formed semi-cured (B stage) insulating sheet to one side in the thickness direction of the magnetic layer 2 and curing it. Alternatively, a separately formed cured (C stage) first insulating layer 4 may be attached to one side in the thickness direction of the magnetic layer 2. The insulating composition varnish contains at least one of an insulating resin and an insulating inorganic material, and a solvent.

[0195] In this embodiment, the first insulating layer 4 is formed to cover one end 3A in the thickness direction of the metal pin 31 (metal wiring 3), but the embodiment is not limited to this. Specifically, if the insulating composition is a photosensitive composition, the first insulating layer 4 may be formed on only one side in the thickness direction of the magnetic layer 2 by photolithography.

[0196] In this embodiment, along with the first insulating layer formation step, the process includes a step of forming a third insulating layer 6 which is disposed between the outer peripheral surface 3S of the metal pin 31 (metal wiring 3) and the inner peripheral surface 2S facing the through hole 21 (third insulating layer formation step).

[0197] Specifically, an insulating composition varnish is filled into the gap between the outer circumferential surface 3S of the metal pin 31 (metal wiring 3) and the inner circumferential surface 2S facing the through hole 21, and then the insulating composition varnish is applied to one side in the thickness direction of the magnetic layer 2. Then, by drying and curing as necessary, the first insulating layer 4 and the third insulating layer 6 can be formed together. Alternatively, the first insulating layer 4 and the third insulating layer 6 may be formed by attaching a separately formed semi-cured (B stage) insulating sheet to one side in the thickness direction of the magnetic layer 2, pressing it, filling the gap between the outer circumferential surface 3S of the metal pin 31 (metal wiring 3) and the inner circumferential surface 2S facing the through hole 21, and curing it.

[0198] (Molding Process) As shown in Figure 8D, the molding process involves making one end face in the thickness direction of the metal wiring 3 flush with one face in the thickness direction of the first insulating layer 4 after the first insulating layer formation process.

[0199] Specifically, after the first insulating layer formation step, one side of the first insulating layer 4 in the thickness direction is polished so that it becomes flush with one end face of the metal wiring 3 in the thickness direction. Alternatively, after the first insulating layer formation step, one side of the first insulating layer 4 in the thickness direction may be pressed so that it becomes flush with one end face of the metal wiring 3 in the thickness direction.

[0200] In this embodiment, the molding process further includes a step of making the other end face of the metal wiring in the thickness direction flush with the other face of the second insulating layer in the thickness direction. The step of making the other end face of the metal wiring in the thickness direction flush with the other face of the second insulating layer in the thickness direction is performed at least after the second insulating layer formation step.

[0201] Specifically, the other end face in the thickness direction of the second insulating layer 5 is polished so that it becomes flush with the other end face in the thickness direction of the second insulating layer 5.

[0202] Inductor component 1 is manufactured in the manner described above.

[0203] 5. Effects of the Method for Manufacturing Inductor Components (1) The method for manufacturing inductor components according to this disclosure includes an arrangement step of arranging a metal wiring 3 equipped with a metal pin 31 in a through hole 21. Therefore, compared to the case in which the metal wiring 3 is formed by plating, manufacturability can be improved.

[0204] (2) The method for manufacturing the inductor component of the present disclosure includes a step of forming a first insulating layer 4 on one side in the thickness direction of the magnetic layer 2 (first insulating layer formation step). Therefore, it is possible to manufacture an inductor component 1 with improved freedom in circuit design.

[0205] (3) The method for manufacturing an inductor component of the present disclosure includes a positioning step of arranging the metal wiring 3 such that one end 3A in the thickness direction of the metal wiring 3 protrudes from one surface in the thickness direction of the magnetic layer 2. Therefore, one end 3A in the thickness direction of the metal wiring 3 used as a terminal can be easily exposed from the magnetic layer 2. In other words, manufacturability can be improved.

[0206] (4) The method for manufacturing the inductor component of the present disclosure includes a step (molding step) in which one end face in the thickness direction of the metal wiring 3 and one side in the thickness direction of the first insulating layer 4 are made flush. As a result, the connectivity of the end face 3A of the metal wiring 3 as a terminal can be improved.

[0207] (5) The method for manufacturing the inductor component of the present disclosure includes a step of forming a second insulating layer 5 on a surface other than the thickness direction of the magnetic layer 2 (second insulating layer formation step). Therefore, it is possible to manufacture an inductor component 1 that further improves the degree of freedom in circuit design.

[0208] (6) In the method for manufacturing an inductor component of the present disclosure, the metal wiring 3 is arranged such that the other end 3B in the thickness direction of the metal wiring 3 protrudes from the other surface in the thickness direction of the magnetic layer 2. Therefore, the other end 3B in the thickness direction of the metal wiring 3 used as a terminal can be easily exposed from the magnetic layer 2. In other words, manufacturability can be improved.

[0209] (7) The method for manufacturing the inductor component of the present disclosure further includes a step of making the other end face in the thickness direction of the metal wiring flush with the other end face in the thickness direction of the second insulating layer. As a result, the connectivity of the other end 3B of the metal wiring as a terminal can be improved.

[0210] (8) The method for manufacturing the inductor component of the present disclosure includes a step of forming a third insulating layer 6 which is disposed between the outer peripheral surface 3S of the metal wiring 3 and the inner peripheral surface 2S facing the through hole 21 (third insulating layer formation step). As a result, short circuits of the metal wiring 3 can be suppressed more reliably.

[0211] 6. Modified Methods for Manufacturing Inductor Components In the following modified methods, the same reference numerals are used for components and processes as in the above-described embodiment, and their detailed descriptions are omitted. Furthermore, each modified method can achieve the same effects and advantages as the first embodiment, unless otherwise specified. Moreover, the first embodiment and its modified methods can be combined as appropriate.

[0212] 6.1. First Modified Example The manufacturing method for the inductor component 1 only needs to include a magnetic layer preparation step, an arrangement step, and a first insulating layer formation step. In other words, it does not need to include a second insulating layer formation step, a third insulating layer formation step, and a molding step.

[0213] Specifically, although not shown in the figures, a method for manufacturing the first modified inductor component 1 described above is one that does not include a third insulating layer formation step. In the method for manufacturing the first modified inductor component 1, there is no gap between the outer circumferential surface 3S of the metal pin 31 (metal wiring 3) and the inner circumferential surface 2S facing the through hole 21. Therefore, the varnish of the insulating composition is not filled between the outer circumferential surface 3S of the metal pin 31 (metal wiring 3) and the inner circumferential surface 2S facing the through hole 21, and the third insulating layer 6 is not formed. In other words, the third insulating layer formation step is not included.

[0214] Furthermore, as a method for manufacturing a second modified example of the inductor component 1 described above, there is a method for manufacturing the inductor component 1 that does not include a second insulating layer formation step.

[0215] Furthermore, as a method for manufacturing the third and fourth modified versions of the inductor component 1 described above, there is a method for manufacturing the inductor component 1 that does not include a molding process.

[0216] As a method for manufacturing the third and fourth modified versions of the inductor component 1, for example, in the magnetic layer preparation step, a through-hole is further formed that has the same shape as the through-hole 21 in plan view and penetrates the second insulating layer 5 from one side in the thickness direction to the other side in the thickness direction, and in the first insulating layer formation step, the first insulating layer 4 is formed on only one side in the thickness direction of the magnetic layer 2 by photolithography.

[0217] 6.2. Second Modified Example The manufacturing method of the inductor component 1 includes a magnetic layer preparation step which includes a second insulating layer formation step, and a third insulating layer formation step which is performed together with the first insulating layer formation step, but is not limited to this.

[0218] Specifically, the manufacturing method for the inductor component 1 may include a second insulating layer formation step and a third insulating layer formation step after the magnetic layer preparation step and before the arrangement step.

[0219] Although not shown in the diagram, first, in the magnetic layer preparation step, a magnetic layer 2 having a through hole 21 that penetrates from one side in the thickness direction to the other side in the thickness direction is prepared. Specifically, a through hole 21 that penetrates from one side in the thickness direction to the other side in the thickness direction is formed in a magnetic layer 2 that does not have a second insulating layer 5. Next, a second insulating layer 5 is formed on the other side in the thickness direction of the magnetic layer 2 in which the through hole 21 is formed, and then a third insulating layer 6 is formed so as to cover the inner circumferential surface 2S of the magnetic layer 2 facing the through hole 21.

[0220] More specifically, regarding the third insulating layer formation step, the material for the third insulating layer 6 is filled into the through-holes 21 of the magnetic layer 2, and dried and hardened as necessary. Then, through-holes with a small maximum length as viewed from the thickness direction are formed again from the through-holes 21 of the magnetic layer 2, from at least one side in the thickness direction to the other side in the thickness direction of the magnetic layer 2, thereby forming the third insulating layer 6 so as to cover the inner circumferential surface 2S of the magnetic layer 2 facing the through-holes 21.

[0221] Subsequently, a metal pin 31 is placed in a through-hole 21 of the magnetic layer 2, whose inner circumferential surface 2S is covered with a third insulating layer 6, thereby forming the first insulating layer 4.

[0222] 6.3. Third Modification The manufacturing method of the inductor component 1 is, but is not limited to, that the metal wiring 3 consists of metal pins 31.

[0223] Specifically, in the manufacturing method of the inductor component of the second modified example described above, a step of forming metal wiring may be included before forming the first insulating layer 4 (first insulating layer formation step). In other words, the manufacturing method of the inductor component of the third modified example is a method for manufacturing the inductor component 1 of the fifth modified example described above.

[0224] First, similar to the manufacturing method of the inductor component in the second modified example described above, the second insulating layer formation step and the third insulating layer formation step are performed after the magnetic layer preparation step and before the placement step.

[0225] Then, a metal pin 31 is placed in a through hole 21 of the magnetic layer 2, whose inner circumferential surface 2S is covered by the third insulating layer 6. At this time, if the maximum length of the through hole 21 of the magnetic layer 2, whose inner circumferential surface 2S is covered by the third insulating layer 6, as viewed from the thickness direction, is greater than the maximum length of the through hole 21 as viewed from the thickness direction, then a gap will be created between the outer circumferential surface of the metal pin 31 and the third insulating layer 6.

[0226] A metal layer 32 is formed in this gap. In other words, this is a step in which a metal layer 32 is formed on the outer surface of the metal pin 31 so as to cover the metal pin 31.

[0227] Specifically, a metal paste containing a metal, which is the material for the metal layer 32, and an organic material is filled into the above-mentioned void. The metal paste is then fired. The firing conditions are not particularly limited. The metal layer 32 is formed by firing the metal paste. The organic material is a component that is decomposed and removed by firing and does not substantially remain in the metal layer 32.

[0228] In the third modified method for manufacturing the inductor component, the metal layer 32 allows adjustment of the clearance between the metal pin 31 and the inner circumferential surface 2S (the inner circumferential surface of the third insulating layer 6) facing the through hole 21. As a result, manufacturability can be improved.

[0229] 6.4. Fourth Modification Although not shown in the figures, the method for manufacturing the inductor component may be as follows:

[0230] First, a magnetic layer 2 having through holes 21 that penetrate from one side in the thickness direction to the other side in the thickness direction is prepared using the same procedure as the magnetic layer preparation step in one embodiment of the manufacturing method for the inductor component described above.

[0231] Next, prepare the metal pin 31 and place it inside the through hole 21.

[0232] Specifically, first, a metal pin 31 fixed to a substrate (e.g., a metal substrate, a release sheet) at a position corresponding to the through hole 21, and a varnish of an insulating composition containing the material for the third insulating layer 6 and a solvent are prepared. Next, the metal pin 31 fixed on the substrate is dipped in the insulating composition to form a coating of the insulating composition on the surface of the metal pin 31 (more specifically, on the surface of the metal pin 31 other than the surface in contact with the substrate). If necessary, the coating is dried. In this way, a metal pin 31 having a coating of the insulating composition on the substrate is obtained.

[0233] Next, a metal pin 31 having a coating of an insulating composition is inserted into the through hole 21. More specifically, while fixed to the substrate, the metal pin 31 having a coating of an insulating composition is inserted into the through hole 21 from a direction other than the thickness direction. The coating of the insulating composition may be cured before insertion into the through hole 21, or it may be cured after insertion into the through hole 21 at the same time as the formation of the first insulating layer 4 described below.

[0234] Next, the material for the third insulating layer 6 is filled into the gap between the outer circumferential surface of the metal pin 31, which has a coating of the insulating composition, and the inner circumferential surface 2S facing the through hole 21, and dried and hardened as necessary. At the same time, the first insulating layer 4 is formed on one side in the thickness direction of the magnetic layer 2.

[0235] In this modified example, the third insulating layer 6 is formed by dipping the metal pin 31 into an insulating composition containing the material of the third insulating layer 6, thereby forming a coating of the insulating composition, and by curing the material of the third insulating layer 6 that is filled into the gap between the outer circumferential surface of the metal pin 31 having the coating of the insulating composition and the inner circumferential surface 2S facing the through hole 21.

[0236] Subsequently, the substrate placed on the other side in the thickness direction of the magnetic layer 2 is peeled off. Next, a second insulating layer 5 is formed on the other side in the thickness direction of the magnetic layer 2. Then, it is molded using the same procedure as in the embodiment of the manufacturing method for the inductor component described above.

[0237] In this way, the inductor component 1 can also be manufactured.

[0238] 7. An inductor structure 10 using the inductor component 1 of this disclosure will be described with reference to Figure 9 of the inductor structure.

[0239] As shown in Figure 1, the inductor structure 10 has a substantially rectangular parallelepiped shape.

[0240] The inductor structure 10 comprises an inductor component 1, a first conductor pattern 11 on one side in the thickness direction of the inductor component 1, and a second conductor pattern 12 on the other side in the thickness direction of the inductor component 1.

[0241] On one side in the thickness direction of the inductor structure 10, the first conductor pattern 11 connects the metal wiring 3 of the inductor component 1. More specifically, the first conductor pattern 11 connects the one ends 3A of the metal wiring 3 of the inductor component 1 in the thickness direction.

[0242] Furthermore, on other surfaces in the thickness direction of the inductor structure 10, the second conductor pattern 12 connects the metal wiring 3 of the inductor component 1. More specifically, the second conductor pattern 12 connects the other ends 3B of the metal wiring 3 of the inductor component 1 in the thickness direction.

[0243] The structure of the conductor patterns 11 and 12 formed on one surface in the thickness direction and the other surface in the thickness direction of the inductor component 1 is appropriately adjusted by the electronic device that incorporates the inductor component 1. In this embodiment, in the inductor structure 10, the first conductor pattern 11 and the second conductor pattern 12 are arranged to form a spiral shape extending in a first direction perpendicular to the thickness direction via the metal wiring 3.

[0244] The material for the first conductor pattern 11 and the second conductor pattern 12 is not particularly limited as long as it can electrically connect the metal wiring 3, and examples include copper, silver, gold, iron, aluminum, chromium, nickel, and alloys thereof. Copper is preferred.

[0245] Although the above invention is provided as an illustrative embodiment of this disclosure, it is merely illustrative and should not be interpreted restrictively. Modifications of this disclosure that are obvious to those skilled in the art are included in the claims below.

[0246] The inductor component of this disclosure is used in electronic devices (e.g., wiring circuit boards).

[0247] 1 Inductor component 2 Magnetic layer 2S Inner surface facing the through-hole of the magnetic layer 21 Through-hole 3 Metal wiring 3A One end of the metal wiring in the thickness direction 3B The other end of the metal wiring in the thickness direction 3S Outer surface of the metal wiring 31 Metal pin 32 Metal layer 4 First insulating layer 5 Second insulating layer 6 Third insulating layer 10 Inductor structure

Claims

1. An inductor component comprising: a magnetic layer having a through hole that penetrates from one surface in the thickness direction to the other surface in the thickness direction; a metal wiring disposed in the through hole; and a first insulating layer disposed on one surface in the thickness direction of the magnetic layer, wherein the metal wiring includes a metal pin, and one end of the metal wiring in the thickness direction protrudes from one surface in the thickness direction of the magnetic layer.

2. The inductor component according to claim 1, wherein one end face in the thickness direction of the metal wiring and one face in the thickness direction of the first insulating layer are flush.

3. The inductor component according to claim 1, further comprising a second insulating layer disposed on a surface other than the thickness direction of the magnetic layer.

4. The inductor component according to claim 3, wherein the other end of the metal wiring in the thickness direction protrudes from the other surface in the thickness direction of the magnetic layer.

5. The inductor component according to claim 4, wherein the other end face in the thickness direction of the metal wiring and the other face in the thickness direction of the second insulating layer are flush.

6. The inductor component according to claim 1, wherein the length of the metal wiring in the direction perpendicular to the thickness direction is the same from one side in the thickness direction to the other side in the thickness direction.

7. The inductor component according to any one of claims 1 to 6, wherein the metal wiring consists of the metal pins.

8. The inductor component according to any one of claims 1 to 6, wherein the metal wiring comprises the metal pins and a metal layer covering the outer surface of the metal pins.

9. The inductor component according to any one of claims 1 to 6, further comprising a third insulating layer disposed between the outer circumferential surface of the metal wiring and the inner circumferential surface facing the through hole.

10. A method for manufacturing an inductor component, comprising the steps of: preparing a magnetic layer having a through hole that penetrates from one surface in the thickness direction to the other surface in the thickness direction; arranging a metal wiring equipped with a metal pin in the through hole, wherein the metal wiring is arranged such that one end of the metal wiring in the thickness direction protrudes from one surface in the thickness direction of the magnetic layer; and forming a first insulating layer on one surface in the thickness direction of the magnetic layer.

11. The method for manufacturing an inductor component according to claim 10, further comprising the step of making one end face in the thickness direction of the metal wiring flush with one face in the thickness direction of the first insulating layer, after the step of forming the first insulating layer.

12. The method for manufacturing an inductor component according to claim 10, further comprising the step of forming a second insulating layer on a surface other than the thickness direction of the magnetic layer.

13. The method for manufacturing an inductor component according to claim 12, wherein in the arrangement step, the metal wiring is arranged such that the other end of the metal wiring in the thickness direction protrudes from the other surface in the thickness direction of the magnetic layer.

14. The method for manufacturing an inductor component according to claim 13, further comprising the step of making the other end face in the thickness direction of the metal wiring flush with the other face in the thickness direction of the second insulating layer, after the step of forming the second insulating layer.

15. A method for manufacturing an inductor component according to any one of claims 10 to 14, further comprising the step of forming the metal wiring, wherein a metal layer covering the metal pin is formed on the outer circumferential surface of the metal pin.

16. A method for manufacturing an inductor component according to any one of claims 10 to 14, further comprising the step of forming a third insulating layer disposed between the outer circumferential surface of the metal wiring and the inner circumferential surface facing the through hole.

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