Heat-curable adhesive film and device

Abstract

Provided are a heat-curable adhesive film with which low-temperature bonding is possible and which has long-term storage stability, and a device.　According to one embodiment of the present invention, the following invention is provided: a heat-curable adhesive film comprising an epoxy resin, a polymer component, and a hardener, wherein the hardener has a solubility (25°C) [g / 100 g-MEK] in methyl ethyl ketone (MEK) of less than 0.01, and the content of the hardener is higher than 0.05 parts by mass but less than 19 parts by mass per 100 parts by mass of the epoxy resin.

Description

Thermosetting adhesive film and device

[0001] The present invention relates to a thermosetting adhesive film and a device.

[0002] In various elements such as semiconductor elements and liquid crystal display elements (display elements), various adhesives have been conventionally used for the purpose of bonding various members in the elements (for example, Patent Document 1). The properties required for adhesives cover a wide range, including adhesiveness, heat resistance, and reliability under high-temperature and high-humidity conditions. Conventionally, thermosetting resins (epoxy resins, acrylic resins, etc.) exhibiting high adhesiveness and high reliability have been used as adhesives for semiconductor elements and liquid crystal display elements.

[0003] As constituent components of an adhesive using an epoxy resin, an epoxy resin and a latent curing agent that generates cationic species or anionic species having reactivity with the epoxy resin by heat or light are known. A latent curing agent is an important factor that determines the curing temperature and curing rate, and various compounds have been used as latent curing agents from the viewpoints of storage stability at room temperature and curing rate upon heating.

[0004] Japanese Patent No. 7430892

[0005] In recent years, along with the higher integration of semiconductor elements and the higher definition of liquid crystal display elements, the pitch between elements and between wirings has been narrowed. For this reason, heat generated during curing may adversely affect peripheral members of the adhesive. For example, as a semiconductor component, a substrate and a resin adherend are sometimes bonded with an adhesive. A large number of wirings are arranged on the resin adherend. If the heat during curing of the adhesive is too high, the difference in shrinkage caused by the difference in coefficient of linear expansion between the adhesive and the resin adherend or the substrate may increase, which may lead to warpage. Furthermore, throughput needs to be improved for cost reduction. For these reasons, adhesives are required to achieve adhesion at low temperatures. As a method for achieving low-temperature curing, a method using a thermal latent catalyst with low activation energy has been proposed. However, it is known that it is very difficult for an adhesive to have both storage stability around room temperature in this method.

[0006] The present invention was made to solve the above problems, and its objective is to provide a thermosetting adhesive film and device that can be bonded at low temperatures and has long-term storage stability.

[0007] According to one aspect of the present invention, the following invention is provided.

[0008] (1) A thermosetting adhesive film comprising an epoxy resin, a polymer component, and a curing agent, wherein the solubility of the curing agent in methyl ethyl ketone (MEK) (25°C) [g / 100g-MEK] is less than 0.01, and the content of the curing agent is more than 0.05 parts by mass and less than 19 parts by mass per 100 parts by mass of epoxy resin.

[0009] (2) The thermosetting adhesive film according to (1), wherein the curing agent has a triazine skeleton.

[0010] (3) A thermosetting adhesive film according to (1) or (2), having curability at 100°C or below.

[0011] (4) A thermosetting adhesive film according to any one of (1) to (3), which has storage stability for one month or more.

[0012] (5) A thermosetting adhesive film according to any one of (1) to (4), which contains an inorganic filler.

[0013] (6) A thermosetting adhesive film according to any one of (1) to (5), wherein the solubility of the curing agent in methyl ethyl ketone (MEK) (80°C) [g / 100g-MEK] is less than 0.01.

[0014] (7) A device in which the constituent members are bonded together by a thermosetting adhesive film as described in any one of (1) to (6).

[0015] According to one aspect of the present invention, adhesion at low temperatures is possible, and long-term storage stability is possible.

[0016] This figure schematically shows a device according to an embodiment of the present invention.

[0017] The following embodiments for carrying out the thermosetting adhesive film and device according to the present invention are illustrated with drawings. The embodiments illustrated below are for the purpose of facilitating understanding of the present invention and are not intended to limit the interpretation of the present invention. The present invention can be modified and improved from the following embodiments without departing from its spirit. In addition, in the above drawings, the dimensions of each component may be exaggerated or reduced, or hatching may be omitted, in order to facilitate understanding.

[0018] <Thermosetting Adhesive Film Structure> First, the structure of the thermosetting adhesive film according to the embodiment of the present invention will be described. The thermosetting adhesive film is in the pre-curing state, i.e., the B stage state. The shape, size, etc. of the thermosetting adhesive film are not particularly limited and can be adjusted as appropriate according to the manner of use. The thermosetting adhesive film according to this embodiment contains an epoxy resin, a polymer component, and a curing agent. Here, "film" in this embodiment means a thin film with a thickness of 200 μm or less. The solubility of the curing agent in methyl ethyl ketone (MEK) (25°C) [g / 100g-MEK] is less than 0.01, and the content of the curing agent is more than 0.05 parts by mass and less than 19 parts by mass per 100 parts by mass of epoxy resin.

[0019] (Epoxy Resin) Any epoxy resin having epoxy groups is acceptable, and a wide range of epoxy resins suitable for use as adhesives can be used. The epoxy resin forms a cross-linked structure in the resin composition through the reaction of epoxy groups with reactive groups of other components or through ring-opening polymerization of epoxy groups. The epoxy equivalent of the epoxy resin is preferably 100 to 3000 g / eq, and more preferably 200 to 1500 g / eq.

[0020] In this embodiment, epoxy equivalent refers to the number of grams (g / eq) of resin containing 1 gram equivalent of epoxy groups. Examples of epoxy resin skeletons include phenol novolac type, orthocresol novolac type, cresol novolac type, dicyclopentadiene type, biphenyl type, fluorenebisphenol type, triazine type, naphthol type, naphthalenediol type, triphenylmethane type, tetraphenyl type, bisphenol A type, bisphenol F type, bisphenol AD ​​type, bisphenol S type, trimethylolmethane type, and the like.

[0021] (Polymer Component) The polymer component should be any component that suppresses film tackiness (the property of the film state being easily changed even with slight temperature changes) at room temperature (25°C) when a thermosetting adhesive film is formed, and imparts sufficient adhesion and film-forming properties (film-forming ability) to the thermosetting adhesive film. Examples of polymer components include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester copolymer, polybutadiene resin, polycarbonate resin, thermoplastic polyimide resin, polyamide resin such as 6-nylon and 6,6-nylon, phenoxy resin, (meth)acrylic resin, polyester resin such as polyethylene terephthalate and polybutylene terephthalate, polyamide-imide resin, and fluororesin. These polymer components may be used individually or in combination of two or more. The weight-average molecular weight of the polymer component is usually 10,000 or more. There is no particular upper limit, but 5,000,000 or less is practical.

[0022] (Curing agent) The curing agent is a component that generates cationic or anionic species that are reactive with epoxy resin. In other words, the curing agent is an epoxy resin curing agent. In this embodiment, since the thermosetting adhesive film has storage stability, the curing agent is a latent curing agent. That is, the curing agent according to this embodiment is a component that generates cationic or anionic species that are reactive with epoxy resin by heat. Furthermore, in this embodiment, the solubility of the curing agent in methyl ethyl ketone (MEK) (25°C) [g / 100g-MEK] is less than 0.01. As a result, the thermosetting adhesive film has high storage stability. MEK is used as a solvent to dissolve various materials when making a thermosetting adhesive film. That is, the materials constituting the thermosetting adhesive film are dissolved and dispersed in MEK to form a slurry, and this slurry is coated onto a substrate of any choice and dried to make a thermosetting adhesive film. Here, if the solubility of the hardener in MEK (at 25°C) [g / 100g-MEK] is less than 0.01 (i.e., it is poorly soluble at room temperature), it is thought that the hardener will not dissolve with other materials, and its storage stability will improve.

[0023] Here, it is preferable that the solubility of the curing agent in methyl ethyl ketone (MEK) (at 80°C) [g / 100g-MEK] is less than 0.01. This further improves the storage stability of the thermosetting adhesive film.

[0024] Any curing agent may be used as long as it meets the above requirements. Examples of curing agents include dicyandiamide compounds, imidazole compounds, curing catalyst complex polyvalent phenol compounds, hydrazide compounds, boron trifluoride-amine complexes, amineimide compounds, polyamine salts, and modified or microencapsulated forms thereof. In other words, from these exemplified compounds, only those with a solubility in MEK (25°C) [g / 100g-MEK] of less than 0.01 should be selected and used. The curing agent may be used individually or in combination of two or more types.

[0025] The curing agent preferably has a triazine skeleton in its framework. The triazine skeleton is represented by the following chemical formula (1).

[0026]

[0027] When the curing agent has a triazine skeleton, the thermosetting adhesive film is more likely to exhibit adhesive strength even at low heating temperatures. In other words, even at low heating temperatures, the curing agent can be activated and generate cationic or anionic species that are reactive with epoxy resins.

[0028] The curing agent content is more than 0.05 parts by mass and less than 19 parts by mass per 100 parts by mass of epoxy resin. Preferably, it is 0.5 parts by mass or more and 15 parts by mass or less, and more preferably 0.8 parts by mass or more and 10 parts by mass or less. When the curing agent content is within this range, the thermosetting adhesive film exhibits adhesive strength even at low temperatures and has long-term storage stability. If the curing agent content is 0.05 parts by mass or less, the thermosetting adhesive film does not exhibit adhesive strength. If the curing agent content is 19 parts by mass or more, the storage stability decreases.

[0029] (Characteristics of Thermosetting Adhesive Film) Here, the characteristics of the thermosetting adhesive film will be explained in detail. The thermosetting adhesive film has a curing property of 100°C or lower. In other words, the thermosetting adhesive film exhibits adhesive strength at a heating temperature of 100°C or lower. The lower limit of the heating temperature is not particularly limited, but for example, it may be 70°C. More specifically, as shown in the examples described later, the offset time [min] of the DSC exothermic peak when the thermosetting adhesive film is held at 100°C for 4 hours using a differential scanning calorimeter (DSC) is less than 240 min. Here, the offset time is the time from the time of the reaction heat peak to the time when the reaction heat peak ends.

[0030] Furthermore, the thermosetting adhesive film has storage stability for more than one month. In this embodiment, storage stability is evaluated using DSC in the following way. Specifically, the amount of heat generated is calculated from the reaction heat peaks obtained by heating the thermosetting adhesive film immediately after its preparation and after it has been stored at room temperature for one month. The change in heat generated is calculated by dividing the amount of heat generated after one month by the amount of heat generated immediately after preparation and multiplying the result by 100. If this value is 80% or more, the storage stability is excellent. As shown in the examples described later, in the examples that satisfy the requirements of this embodiment, the storage stability value is 80% or more.

[0031] (Additives) Inorganic fillers may be added to the thermosetting adhesive film. Inorganic fillers are added, for example, to adjust the coefficient of thermal expansion of the thermosetting adhesive film. This further improves the properties of the thermosetting adhesive film. Examples of inorganic fillers include various inorganic powders such as ceramics such as silica, clay, gypsum, calcium carbonate, barium sulfate, alumina (aluminum oxide), beryllium oxide, magnesium oxide, silicon carbide, silicon nitride, aluminum nitride, and boron nitride; metals or alloys such as aluminum, copper, silver, gold, nickel, chromium, tin, zinc, palladium, and solder; and carbons such as carbon nanotubes and graphene. Among these, conductive materials include metals or alloys such as aluminum, copper, silver, gold, nickel, chromium, tin, zinc, palladium, and solder, as well as carbon materials such as carbon nanotubes and graphene. Non-conductive materials include ceramics such as silica, clay, gypsum, calcium carbonate, barium sulfate, alumina (aluminum oxide), beryllium oxide, magnesium oxide, silicon carbide, silicon nitride, aluminum nitride, and boron nitride.

[0032] The inorganic filler may be surface-treated or surface-modified. Examples of such surface treatments or modifications include silane coupling agents, phosphoric acid, phosphoric acid compounds, and surfactants. Except for matters described in this embodiment, for example, the descriptions of silane coupling agents, phosphoric acid, phosphoric acid compounds, and surfactants in the section on thermal conductive fillers in International Publication No. 2018 / 203527 or the section on aluminum nitride fillers in International Publication No. 2017 / 158994 can be applied.

[0033] Methods for adding inorganic fillers to thermosetting adhesive films include directly blending a powdered inorganic filler and, if necessary, at least one of a silane coupling agent, phosphoric acid, a phosphate compound, and a surfactant into a slurry in which the thermosetting adhesive film material is dissolved and dispersed (integral blend method), or preparing a slurry by dispersing an inorganic filler treated with a surface treatment agent such as a silane coupling agent, phosphoric acid, a phosphate compound, and a surfactant in an organic solvent, and then blending this slurry into a slurry in which the thermosetting adhesive film material is dissolved and dispersed. The method for treating the inorganic filler with a silane coupling agent is not particularly limited and includes a wet method in which the inorganic filler and silane coupling agent are mixed in a solvent, a dry method in which the inorganic filler and silane coupling agent are mixed in the gas phase, and the integral blend method described above. The thermosetting adhesive film according to this embodiment contains an epoxy resin, a polymer component, and a curing agent. The solubility of the curing agent in methyl ethyl ketone (MEK) (25°C) [g / 100g-MEK] is less than 0.01, and the curing agent content is more than 0.05 parts by mass but less than 19 parts by mass per 100 parts by mass of epoxy resin. Therefore, adhesion at low temperatures is possible, and long-term storage stability is possible.

[0034] <Method for Manufacturing Thermosetting Adhesive Film> Next, a method for manufacturing the thermosetting adhesive film according to this embodiment will be described. The thermosetting adhesive film according to this embodiment can be obtained by dissolving and dispersing the components of the thermosetting adhesive film in an organic solvent (preferably MEK), coating the resulting slurry onto a release film or a desired substrate, and drying it as necessary.

[0035] As for the coating method, known methods can be appropriately adopted, such as methods using a roll knife coater, gravure coater, die coater, reverse coater, etc.

[0036] Drying only needs to be performed to remove the organic solvent without substantially causing a curing reaction and to form a film-like adhesive. This can be done, for example, by holding the material at a temperature of 80 to 150°C for 1 to 20 minutes.

[0037] From the viewpoint of suppressing the curing reaction (curing reaction of epoxy resin), thermosetting adhesive films are preferably stored under temperature conditions of 10°C or lower before use (before the curing reaction).

[0038] <Examples of Use of Thermosetting Adhesive Film> Next, examples of use of the thermosetting adhesive film will be described based on Figure 1. Figure 1 is a schematic diagram showing device 1 according to this embodiment. Of course, device 1 shown in Figure 1 is just one example of how the thermosetting adhesive film can be used, and it is certainly possible to use the thermosetting adhesive film according to this embodiment for other types of devices.

[0039] Device 1 comprises a substrate 10, a resin adherend 20, and a thermosetting adhesive film 30. Device 1 is used, for example, in a wearable device. A flexible substrate (not shown) is connected to the resin adherend 20. The thermosetting adhesive film 30 adheres the substrate 10 and the resin adherend 20. That is, the thermosetting adhesive film 30 is cured. In other words, the substrate 10, thermosetting adhesive film 30, and resin adherend 20 are laminated in this order, and then the thermosetting adhesive film 30 is cured. The thermosetting adhesive film 30 is cured by holding it at a heating temperature of, for example, 100°C for about 4 hours. In this way, since the thermosetting adhesive film 30 cures at a low temperature, it is possible to adhere the resin adherend 20 and the substrate 10 while suppressing the occurrence of warping.

[0040] Next, an example of this embodiment will be described. In this embodiment, the following tests were conducted to confirm the effect of the thermosetting adhesive film according to this embodiment.

[0041] <Preparation of Materials> The following materials were prepared as components of the thermosetting adhesive film.

[0042] (Epoxy resin) Cresol novolac epoxy resin (trade name: EOCN-104S, weight average molecular weight: 5000, softening point: 92°C, solid, epoxy equivalent: 218, manufactured by Nippon Kayaku Co., Ltd.) Bisphenol A epoxy resin (trade name: YD-128, weight average molecular weight: 400, softening point: 25°C or lower, liquid, epoxy equivalent: 190, manufactured by Nippon Steel & Sumitomo Metal Epoxy Manufacturing Co., Ltd.) (Polymer component) Polyurethane resin solution (trade name: UR-3500, weight average molecular weight: 13000, Tg: 10°C, storage modulus at 25°C: 150 MPa, solvent: MEK / toluene mixed solvent, manufactured by Toyobo MC Co., Ltd.) (Polyurethane resin is contained in an amount of 30 parts by mass in 75 parts by mass of the solution) Acrylic resin (trade name: SG-280EK23, weight average molecular weight: 800000, Tg: -29°C, storage modulus at 25°C: 6.5 MPa, manufactured by Nagase ChemteX Corporation) Bisphenol A type phenoxy resin (trade name: YP-50, weight average molecular weight: 70000, Tg: 85°C, storage modulus at 25°C: 1700 MPa, manufactured by Nippon Steel & Sumitomo Metal Epoxy Manufacturing Co., Ltd.) (Inorganic filler) SC2050-MNU (trade name: SC2050-MNU, manufactured by Admatechs Co., Ltd.) (Curing agent) 2MZA-PW (trade name: 2MZA-PW, manufactured by Shikoku Chemicals Corporation): has a triazine skeleton.

[0043] C11Z-A (trade name: C11Z-A, manufactured by Shikoku Chemicals Corporation): has a triazine skeleton.

[0044] 2E4MZ-A (trade name: 2E4MZ-A, manufactured by Shikoku Chemicals Corporation): has a triazine skeleton.

[0045] 2MA-OK (trade name: 2MA-OK, manufactured by Shikoku Chemicals Corporation): has a triazine skeleton.

[0046] 2PHZ-PW (trade name: 2PHZ-PW, manufactured by Shikoku Chemicals Corporation): does not have a triazine skeleton.

[0047] 2E4MZ (trade name: 2E4MZ, manufactured by Shikoku Chemicals Corporation): does not have a triazine skeleton.

[0048] <Example 1> A slurry was prepared by dissolving and dispersing 55.5 parts by mass of cresol novolac epoxy resin, 48.5 parts by mass of bisphenol A epoxy resin, 55 parts by mass (solids) of polyurethane resin solution, 111.4 parts by mass of SC2050-MNU, and 8 parts by mass of 2MZA-PW in MEK. This slurry was then coated onto a substrate and dried to produce a thermosetting adhesive film.

[0049] <Solubility of hardener in MEK (25°C or 80°C) [g / 100g-MEK]> Each hardener was weighed in parts by mass (g) used in the formulation (for example, 8g if parts by mass is 8, 20g if parts by mass is 20), 100g of MEK was added, and the mixture was stirred at room temperature (25°C) or 80°C using a magnetic stirrer for a specified time (60 minutes). After stirring, the unsoluble hardener was filtered off, the amount of hardener in the unsoluble portion (Xg) was measured, and the solubility was calculated as (parts by mass - X)g. Solubility at 25°C was marked with ○ if less than 0.01 and × if 0.01 or more. ○ is the passing level. Solubility at 80°C was marked with ◎ if less than 0.01, ○ if 0.01 or more and less than 0.1, and × if 0.1 or more. The results are shown in Table 1. ○ or more is the passing level.

[0050] <Curing properties of thermosetting adhesive films> Thermosetting adhesive films were held at 100°C for 4 hours using a differential scanning calorimeter (DSC), and the offset time [min] of the DSC exothermic peak was measured. Here, the offset time is the time from the point of the reaction heat peak to the point of the reaction heat peak ending. An offset time of less than 240 min is considered acceptable. The results are shown in Table 1.

[0051] <Storage Stability of Thermosetting Adhesive Films> The storage stability of thermosetting adhesive films was evaluated using DSC in the following way. The amount of heat generated was calculated from the reaction heat peaks obtained by heating the thermosetting adhesive film immediately after preparation (initial) and after storage at room temperature for one month. The change in heat generated was calculated by dividing the amount of heat generated after one month by the amount of heat generated immediately after preparation and multiplying the result by 100. A value of 80% or more is considered acceptable. The results are shown in Table 1.

[0052]

[0053] <Example 2> In the preparation of a thermosetting adhesive film, the same procedure as in Example 1 was followed, except that the amount of 2MZA-PW added was 6 parts by mass. The results are shown in Table 1.

[0054] <Example 3> In the preparation of a thermosetting adhesive film, the same procedure as in Example 1 was followed, except that the amount of 2MZA-PW added was 3 parts by mass. The results are shown in Table 1.

[0055] <Example 4> In the preparation of a thermosetting adhesive film, the same procedure as in Example 1 was followed, except that the amount of 2MZA-PW added was 1 part by mass. The results are shown in Table 1.

[0056] <Example 5> In the preparation of a thermosetting adhesive film, C11Z-A was used instead of 2MZA-PW, and the amount added was 8 parts by mass, except that the procedure was the same as in Example 1. The results are shown in Table 1.

[0057] <Example 6> In the preparation of a thermosetting adhesive film, 2E4MZ-A was used instead of 2MZA-PW, and the amount added was 8 parts by mass, otherwise the same procedure as in Example 1 was followed. The results are shown in Table 1.

[0058] <Example 7> In the preparation of a thermosetting adhesive film, 2MA-OK was used instead of 2MZA-PW, and the amount added was 8 parts by mass, except that the procedure was the same as in Example 1. The results are shown in Table 1.

[0059] <Example 8> In the preparation of a thermosetting adhesive film, acrylic resin was used instead of polyurethane resin solution, and the amount added was 55 parts by mass, except that the procedure was the same as in Example 1. The results are shown in Table 1.

[0060] <Example 9> In the preparation of a thermosetting adhesive film, bisphenol A type phenoxy resin was used instead of polyurethane resin solution, and the amount added was 55 parts by mass, except that the procedure was the same as in Example 1. The results are shown in Table 1.

[0061]

[0062] <Comparative Example 1> In the preparation of a thermosetting adhesive film, the same procedure as in Example 1 was followed, except that the amount of 2MZA-PW added was 20 parts by mass. The results are shown in Table 2.

[0063] <Comparative Example 2> In the preparation of a thermosetting adhesive film, the same procedure as in Example 1 was followed, except that the amount of 2MZA-PW added was 0.05 parts by mass. The results are shown in Table 2.

[0064] <Comparative Example 3> In the preparation of a thermosetting adhesive film, 2PHZ-PW was used instead of 2MZA-PW, and the amount added was 8 parts by mass, except that the procedure was the same as in Example 1. The results are shown in Table 1.

[0065] <Comparative Example 4> In the preparation of a thermosetting adhesive film, 2E4MZ was used instead of 2MZA-PW, and the amount added was 8 parts by mass, except that the procedure was the same as in Example 1. The results are shown in Table 1.

[0066] <Discussion> In Examples 1 to 9, which satisfy the requirements of this embodiment, the thermosetting adhesive film exhibits high adhesive strength at a low heating temperature (100°C) and shows excellent storage stability. In particular, when the solubility of the curing agent methyl ethyl ketone (MEK) (80°C) [g / 100g-MEK] was less than 0.01, there was a tendency for storage stability to be higher.

[0067] In contrast, in Comparative Example 1, the amount of curing agent added was 20 parts by mass, exceeding the upper limit of this embodiment. As a result, the storage stability was reduced.

[0068] In Comparative Example 2, the amount of curing agent added was 0.05 parts by mass, which is lower than the lower limit of the embodiment. As a result, no reaction heat peak was detected in the curing test of the thermosetting adhesive film. In other words, the thermosetting adhesive film did not substantially exhibit adhesive strength.

[0069] In Comparative Example 3, no reaction heat peak was detected in the curing test of the thermosetting adhesive film. In other words, the thermosetting adhesive film did not substantially exhibit adhesive strength. One possible reason for this is that the curing agent does not have a triazine skeleton.

[0070] In Comparative Example 4, the solubility of the curing agent in methyl ethyl ketone (MEK) (25°C) [g / 100g-MEK] was 0.01 or higher, indicating reduced storage stability. Furthermore, no reaction heat peak was detected in the curing performance test of the thermosetting adhesive film. In other words, the thermosetting adhesive film did not substantially exhibit adhesive strength. This is likely due in part to the curing agent not having a triazine skeleton.

[0071] Although the present invention has been described above with reference to the above embodiments, the present invention is not limited thereto. Those skilled in the art can modify the thermosetting adhesive film and device of the present invention as appropriate in accordance with conventionally known knowledge. Such modifications, insofar as they still possess the configuration of the present invention, are of course included within the scope of the present invention.

[0072] 1 device, 10 substrates, 20 resin adherends, 30 thermosetting adhesive film

Claims

1. A thermosetting adhesive film containing an epoxy resin, a polymer component, and a curing agent, wherein the solubility of the curing agent in methyl ethyl ketone (MEK) (25°C) [g / 100g-MEK] is less than 0.01, and the content of the curing agent is more than 0.05 parts by mass and less than 19 parts by mass per 100 parts by mass of epoxy resin.

2. The thermosetting adhesive film according to claim 1, wherein the curing agent has a triazine skeleton.

3. The thermosetting adhesive film according to claim 1, having curability at temperatures below 100°C.

4. The thermosetting adhesive film according to claim 1, which has storage stability for one month or more.

5. The thermosetting adhesive film according to claim 1, comprising an inorganic filler.

6. The thermosetting adhesive film according to claim 1, wherein the solubility of the curing agent in methyl ethyl ketone (MEK) (80°C) [g / 100g-MEK] is less than 0.

01.

7. A device in which components are bonded together by a thermosetting adhesive film according to any one of claims 1 to 6.

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