Pin control method and pin control device

Abstract

Provided are a pin control method and a pin control device with which pins can be arranged as designed in the next step, and which contribute to an overall improvement in yield. The pin control method comprises the steps of: introducing pins made of a magnetic material to the upper surface of a plate unit 12 in which pin-receiving holes for receiving the pins are formed in the upper surface, wherein the number of the introduced pins is greater than the number of the pin-receiving holes; displacing a vertically magnetized magnet, below the plate unit 12, along the plate unit 12, thereby inserting the pins into the pin-receiving holes; removing the pins that remain on the plate unit 12 outside the pin-receiving holes; and imaging the upper surface of the plate unit 12 after the step of removing the pins, and determining whether the pins have been inserted into all the pin-receiving holes.

Description

Pin Control Method and Pin Control Apparatus

[0001] The present invention relates to a pin control method and a pin control apparatus for transferring pins into pin receiving holes that open on the surface of a plate material and receive the pins.

[0002] Patent Document 1 discloses a camera that photographs the surface of a pin receiving member when transferring pins. The pin receiving holes are identified in an image. When all the pin receiving holes are filled with pins, the pins remaining on the surface of the pin receiving member (hereinafter referred to as "residual pins") are removed. When removing the pins, the surface of the pin receiving member is photographed by the camera. The residual pins are identified in the image. When a residual pin is detected, the residual pins are swept away from the pin receiving member by air blowing.

[0003] Japanese Patent No. 7464926, Japanese Patent No. 6927542

[0004] As disclosed in Patent Document 2, aligned pins are transferred to a semiconductor device. The pins are soldered to, for example, conductive pads of the semiconductor device. If even one pin is missing from its corresponding pin receiving hole, the semiconductor device becomes unusable. The work of inserting one pin into only one pin receiving hole is not easy. The absence of just one pin leads to the scrapping of the entire semiconductor device.

[0005] An object of the present invention is to provide a pin control method and a pin control apparatus that can arrange pins as designed in the next step and contribute to improving yield as a whole.

[0006] A pin control method according to one aspect of the present invention comprises: a step of feeding a larger number of the pins than the number of pin receiving holes onto the upper surface of a plate unit having the pin receiving holes opening on the upper surface for receiving magnetic pins; a step of displacing a magnet vertically magnetized along the plate unit below the plate unit to transfer the pins into the pin receiving holes; a step of removing the pins remaining on the plate unit outside the pin receiving holes; and a step of imaging the upper surface of the plate unit after the step of removing the pins, and determining whether all the pin receiving holes have been filled with the pins.

[0007] A pin control device according to another embodiment of the present invention comprises: a frame that is detachably superimposed on the upper surface of a plate unit having a pin receiving hole on its upper surface for receiving magnetic pins, and that surrounds a loading space continuous with the pin receiving hole while in contact with the upper surface around its entire circumference; a magnet that is magnetized vertically and positioned below the plate unit; a removal table that supports the plate unit separated from the frame and is combined with a removal mechanism that removes any pins remaining on the upper surface of the plate unit other than the pin receiving hole; and a control unit that detects the operation of the removal mechanism, supplies an imaging signal to an imaging device to image the upper surface of the plate unit, and determines whether or not all of the pins have been loaded into the pin receiving holes based on the captured image.

[0008] As described above, according to the form of disclosure, a pin control method and a pin control device are provided that allow the pins to be arranged as designed in the next process, and contribute to an overall improvement in yield.

[0009] This is a schematic conceptual diagram showing the configuration of a pin control device according to an embodiment of the present invention. This is a schematic plan view showing the configuration of the transfer jig. This is an enlarged cross-sectional view along line 3-3 in Figure 2. This is a conceptual diagram corresponding to Figure 3, showing a through hole in a modified example of the transfer jig. This is a schematic plan view showing the structure of the frame body, corresponding to Figure 2. This is a cross-sectional view along line 6-6 in Figure 5. This is a schematic plan view showing the configuration of the transfer magnet unit. This is an enlarged cross-sectional view along line 8-8 in Figure 7. This is a schematic side view showing the configuration of the transfer stage. This is a schematic plan view showing the configuration of the first preliminary stage. This is a schematic side view showing the configuration of the removal stage. This is a schematic side view showing the configuration of the second preliminary stage. This is a schematic side view showing the configuration of the transfer stage, corresponding to Figure 12. This is a schematic side view showing the configuration of the semiconductor device image inspection, corresponding to Figure 13. This is a schematic block diagram showing the control system including the control unit. This is a schematic diagram showing the relative displacement between the transfer jig and the transfer magnet unit. This is a conceptual diagram showing the operation of the first preliminary stage.

[0010] One embodiment of the present invention will be described below with reference to the attached drawings.

[0011] Figure 1 schematically shows the configuration of a pin control device 11 according to an embodiment of the present invention. The pin control device 11 includes a transfer stage 13 that supplies a large number of pins to the surface of a transfer jig 12 and transfers the pins into pin receiving holes opening on the surface of the transfer jig 12, a removal stage 15 that removes pins remaining on the surface of the transfer jig 12 other than those transferred into the pin receiving holes (hereinafter referred to as "residual pins"), and a transfer stage 17 that transfers the pins from the transfer jig 12 to a semiconductor device 16. A first preliminary stage 18 is set between the transfer stage 13 and the removal stage 15. In the first preliminary stage 18, residual pins scattered on the transfer jig 12 are collected at specific locations on the transfer jig 12. In the removal stage 15, the collected residual pins are efficiently removed. An inspection stage 19 and a second preliminary stage 20 are set between the removal stage 15 and the transfer stage 17. In inspection stage 19, it is checked whether pins have been placed into all the pin receiving holes, and whether any pins remain on the surface of the transfer jig 12 outside of the pin receiving holes. In the second preliminary stage 20, the transfer jig 12 is turned over. The pins are held in place within the pin receiving holes when it is turned over. In transfer stage 17, the turned-over transfer jig 12 is positioned facing the semiconductor device 16, and a large number of pins are simultaneously transferred from the transfer jig 12 to the semiconductor device 16.

[0012] As shown in Figure 2, the transfer jig 12 consists of a plate unit 22 with pin receiving holes 21 on its upper surface for receiving magnetic pins. The pin receiving holes 21 are arranged in a predetermined configuration for each section 23. Each section 23 corresponds to a semiconductor device (die) 16 cut from a wafer. The arrangement of the pin receiving holes 21 reflects a mirror image of the conductive pads (or terminals) formed on the semiconductor device 16, as will be described later. Outside the aggregate 23z of section 23, a pair of left and right suction pieces 22a are formed on the plate unit 22.

[0013] As shown in Figure 3, the plate unit 22 comprises a first plate 24a and a second plate 24b superimposed on the first plate 24a and having a through hole 25 that is upright from the surface of the first plate 24a. Here, for a pin 26 with a diameter D = 0.2 [mm] and a length L = 0.4 [mm], the plate thickness tf of the first plate 24a is set to, for example, 1 [mm]. The plate thickness ts of the second plate 24b is set to, for example, 0.3 [mm]. The first plate 24a and the second plate 24b are made of, for example, silicon (Si) or silicon nitride (Si ３ N ４ ) is formed from. The surface of the second plate 24b has irregularities such as a matte finish and scratches. The matte finish has a surface roughness with vertices distributed at intervals smaller than the diameter of the pins. The scratches are formed by grooves with edges arranged at intervals smaller than the diameter of the pins. The grooves may also have a hairline shape. In the case of silicon, the plate material cut from the silicon wafer is subjected to a matte finish and polishing process.

[0014] The through-hole 25 is formed in a cylindrical space having an axis 27 perpendicular to the surface of the first flat plate 24a. The generatrix of the inner wall is set to a straight line. The through-hole 25 maintains a uniform diameter from the top to the bottom. Here, for a pin with diameter D = 0.2 [mm] and length L = 0.4 [mm], the diameter dh of the cylindrical space is set to, for example, 0.205 [mm]. The height of the cylindrical space (length of the axis) is equal to the plate thickness ts (= 0.3 [mm]) of the second flat plate 24b. Therefore, it is desirable that the protrusion b of the pin 26 be set to be less than or equal to the radius of the pin 26 (= D / 2). As shown in Figure 4, the through-hole 25 may be formed in the shape of a frustocone tapering towards the bottom. The generatrix of the inner wall is set to a straight line. The gradient (angle of inclination) In of the generatrix is ​​set to within 5°.

[0015] The through-hole 25 corresponds to the pin receiving hole 21. The pitch Pc of the pin receiving holes 21 is set to, for example, 0.45 [mm]. Since the pin receiving holes 21 are arranged at equal intervals in a grid pattern, the shortest distance between pin receiving holes 21 is greater than the diameter D of the pin 26.

[0016] As shown in Figure 5, the pin control device 11 includes a frame 31 that is detachably superimposed on the upper surface of the transfer jig 12 and is in contact with the upper surface of the transfer jig 12 around its entire circumference. The frame 31 is made of a metallic material such as stainless steel or other non-magnetic hard material. The frame 31 surrounds an input space 32 that is continuous with all the pin receiving holes 21. The frame 31 has through holes 33 on the suction pieces 22a of the transfer jig 12. A negative pressure source 34 is connected to the through holes 33. The transfer jig 12 is fixed to the lower surface of the frame 31 in accordance with the negative pressure generated by the negative pressure source 34. When the negative pressure is released, the frame 31 is separated from the transfer jig 12. As shown in Figure 6, the edges 35 of the frame 31 are not chamfered at the lower end of the input space 32. The edges 35 maintain their corners. The chipping of the corners 36 is limited to less than the radius (D / 2) of the tip face of the pin 26.

[0017] As shown in Figure 7, the pin control device 11 includes a transfer magnet unit 37 installed on the transfer stage 13. The transfer magnet unit 37 includes a first plate magnet 38a magnetized vertically upward and a second plate magnet 38b magnetized vertically downward. As shown in Figure 8, in the first plate magnet 38a, the magnetized Mu is perpendicular to the upper surface (plate surface) 41 and forms an N pole on the upper surface 41. In the second plate magnet 38b, the magnetized Md is perpendicular to the upper surface (plate surface) 42 and forms an S pole on the upper surface 42. The first plate magnet 38a and the second plate magnet 38b are joined to each other by mating surfaces 43 and 44 that extend within the vertical plane VP perpendicular to the horizontal plane HP. The first plate magnet 38a aligns its upper surface 41 with the horizontal plane HP and abuts against the vertical plane VP from the horizontal direction with its mating surface 43. The second plate magnet 38b is positioned with its upper surface 42 aligned with the horizontal plane HP, and its mating surface 44 is abutted against the vertical plane VP from the horizontal direction. The magnetized Mu and Md are arranged with their directions opposite to each other, with the mating surfaces 43 and 44 in between.

[0018] In the first plate magnet 38a, a chamfer 45 is provided between the top surface 41 and the mating surface 43 along the vertical plane VP. The size of the chamfer 45 is set according to the thickness of the plate unit 22. In the second plate magnet 38b, a chamfer 46 is provided between the top surface 42 and the mating surface 44 along the vertical plane VP. The size of the chamfer 46 is set according to the thickness of the plate unit 22. The sizes of the chamfers 45 and 46 should be set to be equal on either side of the mating surfaces 43 and 44. Between the first plate magnet 38a and the second plate magnet 38b, the magnetic field lines are tilted horizontally. Due to the action of the chamfers 45 and 46, the horizontal magnetic field lines approach the horizontal plane HP as closely as possible.

[0019] The reciprocating magnet unit 37 includes a coupling mechanism 47 that maintains the connection between the first plate magnet 38a and the second plate magnet 38b. The coupling mechanism 47 includes a stationary body 49 fixed to the horizontal surface of the support table 48 and a pushing member 51 that moves back and forth along the horizontal plane toward the stationary body 49. A feed mechanism 52 is connected to the pushing member 51, which applies a pushing force to the pushing member 51 in the forward direction toward the stationary body 49. The feed mechanism 52 includes a shaft body 52a coupled to the pushing member 51 and rotatable around its axis. A male thread is cut into the shaft body 52a around its axis. The male thread engages with a female thread cut into a stationary body 52b that is fixed immovably to the support table 48. As the shaft body 52a rotates, the pushing member 51 moves forward toward the stationary body 49. The first plate magnet 38a and the second plate magnet 38b are sandwiched between the stationary body 49 and the pushing member 51. When the screws are released, the first plate magnet 38a and the second plate magnet 38b can be removed from the support table 48. Here, the first plate magnet 38a and the second plate magnet 38b are arranged in a matrix. A coupling mechanism 47 is established for each row and column. The first plate magnet 38a and the second plate magnet 38b have, for example, a rectangular outline.

[0020] As shown in Figure 9, the pin control device 11 is connected to the frame 31 and includes a relative displacement mechanism 56 that drives the frame 31 according to the three-dimensional coordinate system x, y, and z. In the relative displacement mechanism 56, the frame 31 is fixed to a connecting body 57. The connecting body 57 is connected to a vertical guide 58. The vertical guide 58 guides the linear displacement of the connecting body 57 in the vertical direction along the z axis of the three-dimensional coordinate system. When the connecting body 57 is displaced, a driving force is transmitted to the connecting body 57 from a drive source. The drive source is realized, for example, by an electric motor mounted on the vertical guide 58.

[0021] The vertical guide 58 is connected to the first horizontal guide 59. The first horizontal guide 59 guides the linear displacement of the vertical guide 58 in the horizontal direction along the y-axis of the three-dimensional coordinate system. When the vertical guide 58 is displaced, a driving force is transmitted to the vertical guide 58 from a drive source. The drive source is realized, for example, by an electric motor mounted on the first horizontal guide 59.

[0022] The first horizontal guide 59 is connected to the second horizontal guide 61. The second horizontal guide 61 guides the linear displacement of the first horizontal guide 59 horizontally along the x-axis of the three-dimensional coordinate system. When the first horizontal guide 59 is displaced, a driving force is transmitted to the first horizontal guide 59 from a drive source. The drive source is realized, for example, by an electric motor mounted on the second horizontal guide 61. The second horizontal guide 61 extends through the transfer stage 13, the first preliminary stage 18, the removal stage 15, and the inspection stage 19. The relative displacement mechanism 56 positions the frame 31 relative to the transfer stage 13, the first preliminary stage 18, the removal stage 15, and the inspection stage 19, respectively. In the transfer stage 13, the upper surfaces of the first plate magnet 38a and the second plate magnet 38b face the back surface (bottom surface) of the transfer jig 12. A uniform gap Sp of, for example, 3.5 [mm] or less is ensured between the back surface of the transfer jig 12 and the upper surfaces of the first plate magnet 38a and the second plate magnet 38b. The frame 31 moves between the transfer stage 13, the first preliminary stage 18, the removal stage 15, and the inspection stage 19.

[0023] As shown in Figure 10, the pin control device 11 includes a pin attractor 63 installed on the first preliminary stage 18. The pin attractor 63 is formed from a single plate magnet that is spread horizontally and magnetized, for example, vertically upward (or vertically downward). The top surface of the pin attractor 63 is positioned in a horizontal plane. The pin attractor 63 is smaller than the inner dimensions of the frame 31 in at least one direction within the horizontal plane. Here, the width W of the pin attractor 63 is smaller than the distance between the suction pieces 22a of the transfer jig 12. The contour of the pin attractor 63 is divided parallel to the reference line 64 set on the first preliminary stage 18. When gathering the remaining pins, the transfer jig 12 aligns the centerlines of the suction pieces 22a with the reference line 64. The width W of the pin attractor 63 is formed to such an extent that when the pin attractor 63 moves along the reference line 64, it gathers the remaining pins closer to the reference line 64 than to the frame 31. In addition, the upper surface of the magnet 63 may be formed from multiple magnets arranged in a horizontal plane. The boundaries between the magnets may be chamfered, similar to the first plate magnet 38a and the second plate magnet 38b. The multiple magnets may be aligned to face a horizontal plane on a semi-cylindrical or partially cylindrical surface having a generatrix parallel to the axis.

[0024] As shown in Figure 11, the pin control device 11 is combined with a removal stage 15 and includes a removal mechanism 65 that removes pins 26 remaining on the surface of the transfer jig 12 other than the pin receiving holes 21. The removal mechanism 65 includes a table 66 that supports the transfer jig 12 separated from the frame 31, and a removal magnet 67 that faces downwards onto the top plate of the table 66. The table 66 receives the back surface of the transfer jig 12 on the horizontal surface of its top plate. The surface of the top plate has irregularities such as a matte finish or scratches. The matte finish has a surface roughness in which the vertices are distributed at intervals smaller than the diameter of the pins 26. The scratches are formed by grooves in which the edges are arranged at intervals smaller than the diameter of the pins 26. The grooves may also have a hairline shape. The top plate of the table 66 is formed from a non-magnetic hard material such as stainless steel. If the top plate is stainless steel, the top plate is subjected to a matte finish or polishing after molding.

[0025] The removal magnet 67 is formed from a single plate magnet that is spread horizontally and magnetized, for example, vertically upward (or vertically downward). The top surface of the removal magnet 67 is positioned in a horizontal plane. The removal magnet 67, like the attracting magnet 63, has a width smaller than the spacing between the suction pieces 22a of the transfer jig 12. In addition, the top surface of the removal magnet 67 may be formed from multiple magnets arranged in a horizontal plane. The boundaries between the magnets may be chamfered, similar to the first plate magnet 38a and the second plate magnet 38b. The multiple magnets may be aligned in a horizontal plane on a semi-cylindrical or partially cylindrical surface having a generatrix parallel to the axis.

[0026] Here, the removal mechanism 65 includes a drive mechanism 68 that causes a relative displacement between the tabletop 66 and the removal magnet 67. The drive mechanism 68 drives the removal magnet 67 along a path determined according to a three-dimensional coordinate system. The removal magnet 67 is displaced horizontally below the tabletop 66 from a starting position 67a to a retrieval position 67b. In accordance with this horizontal displacement, the removal magnet 67 traverses the back side of the aggregate 23z of the section 23 between the adsorption pieces 22a. A magnetic field from the removal magnet 67 acts on the pin 26 on the transfer jig 12.

[0027] The pin control device 11 is installed on the removal stage 15 and includes a recovery unit 69 that recovers the pins 26 removed from the surface of the transfer jig 12. The recovery unit 69 generates suction force, for example, in accordance with the rotation of a fan. The recovery unit 69 sucks up the remaining pins from the table 66 according to the suction force.

[0028] The pin control device 11 includes, for example, an imager 71 connected to the first horizontal guide 59 of the relative displacement mechanism 56. The imager 71 images the upper surface of the transfer jig 12 supported on the table 66 in the removal stage 15. The imager 71 is capable of identifying the pins 26 lying on the surface of the transfer jig 12 other than the pin receiving holes 21, and generates an image with a resolution that allows for the determination of the presence or absence of a pin 26 for each individual pin receiving hole 21. An image signal that identifies the captured image is output from the imager 71. In addition, the imager 71 may be attached to, for example, the connecting body 57 or the vertical guide 58 of the relative displacement mechanism 56. The frame 31 is always within the field of view of the imager 71.

[0029] As shown in Figure 12, the pin control device 11 includes a transfer mechanism 72 for transferring the transfer jig 12 from the inspection stage 19 to the second preliminary stage 20. The transfer mechanism 72 has, for example, a coupling body 73 that can be detachably superimposed on the surface of the transfer jig 12. The coupling body 73 is made of a metallic material such as stainless steel or other non-magnetic hard material. The coupling body 73 is formed in a frame surrounding the assembly 23z of compartments 23. The coupling body 73 attracts the transfer jig 12 in response to the action of negative pressure, similar to the frame 31 described above. When transferring the transfer jig 12, a plate magnet may be placed facing (or superimposed) on the back surface of the transfer jig 12. The plate magnet holds the pin 26 in the pin receiving hole 21 by applying a magnetic field to the back surface of the transfer jig 12.

[0030] The pin control device 11 includes an imager 83 connected to the transfer mechanism 72. The imager 83 images the upper surface of the transfer jig 12, which is supported on a table on the inspection stage 19. The imager 83 generates an image with a resolution that allows it to distinguish the pins 26 lying on the surface of the transfer jig 12 other than the pin receiving holes 21, and to distinguish the presence or absence of a pin 26 for each individual pin receiving hole 21. An image signal that identifies the captured image is output from the imager 83. Since the imager 83 is connected to the combiner 73, the combiner 73 is always within the field of view of the imager 83.

[0031] The pin control device 11 includes a transfer mechanism 74 which is combined with a second preparatory stage 20 and a transfer stage 17. The transfer mechanism 74 includes an inversion table 75 which receives the transfer jig 12 from the coupling body 73 of the transport mechanism 72. The inversion table 75 is displaced between a first position with an upward-facing horizontal plane 75a and a second position which rotates around a horizontal axis Ha and, as shown in Figure 13, has a downward-facing horizontal plane 75a. A driving force is transmitted to the inversion table 75 around the horizontal axis Ha during the displacement. The driving force is generated, for example, by an electric motor. The inversion table 75 attracts the transfer jig 12 which is separated from the coupling body 73 in the first position. A retaining magnet 76 is built into the inversion table 75. The retaining magnet 76 is positioned below the transfer jig 12 within the inversion table 75 in the first position. The retaining magnet 76 applies a magnetic field to the pins 26 of the transfer jig 12 from the upward-facing horizontal plane 75a.

[0032] As shown in Figure 13, the pin control device 11 is installed on the transfer stage 17 and includes a table 77 that supports the semiconductor device 16 that retrieves the pins 26 from the transfer jig 12. The table 77 is a horizontal surface that receives the surface of the semiconductor device 16. The back surface of the semiconductor device 16 is positioned facing upward. Conductive pads are arranged on the back surface of the semiconductor device 16. Solder paste, for example, is applied to each conductive pad. The semiconductor device 16 is heated on the table 77. The pins 26 are joined to each conductive pad by the action of the solder. For heating the semiconductor device 16, for example, a heater 78 may be built into the table 77.

[0033] As shown in Figure 14, the pin control device 11 includes an imager 79 installed on the transfer stage 17. The imager 79 images the upper surface of the semiconductor device 16 supported on the table 77 on the transfer stage 17. The imager 79 generates an image with a resolution that allows for the determination of the presence or absence of a pin 26 for each individual conductive pad. An image signal that identifies the captured image is output from the imager 79.

[0034] As shown in Figure 15, the pin control device 11 includes a control unit 81 that controls the operation of the pin control device 11. The control unit 81 is connected to the negative pressure source 34 of the frame 31, the relative displacement mechanism 56, the drive mechanism 68 for the removal magnet 67, the recovery unit 69, the imaging devices 71 and 83, the transfer mechanism 72, the transfer mechanism 74, the heater 78, and the imaging device 79. The control unit 81 controls the attraction and separation of the transfer jig 12 (plate unit 22) from the frame 31. In this control, the control unit 81 generates a control signal for the negative pressure source 34. The control signal is supplied to the negative pressure source 34.

[0035] The control unit 81 controls the position of the frame 31 relative to the transfer stage 13, the first preliminary stage 18, the removal stage 15, and the inspection stage 19. In this control, the control unit 81 generates control signals for the relative displacement mechanism 56. The control signals specify the operation of each electric motor for each coordinate axis of the three-dimensional coordinate system. The control signals are supplied to the electric motors.

[0036] The control unit 81 controls the operation of the removal mechanism 65. In doing so, the control unit 81 generates a control signal for the drive mechanism 68. The control signal specifies the operation of the drive source of the drive mechanism 68. In response to the supply of the control signal, the drive mechanism 68 drives the removal magnet 67 to the tabletop 66 along a predetermined path.

[0037] The control unit 81 controls the operation of the recovery unit 69. In doing so, the control unit 81 generates control signals for the recovery unit 69. These control signals, for example, specify the operation of the rotor. The suction force of the recovery unit 69 is determined according to the rotor's operation. When the rotor stops, the operation of the recovery unit 69 is suspended.

[0038] The control unit 81 controls the operation of the transfer mechanism 72. In doing so, the control unit 81 generates a control signal for the transfer mechanism 72. The control signal determines the magnitude of the negative pressure acting on the coupling body 73 and determines the position of the coupling body 73 relative to the inspection stage 19 and the second preliminary stage 20. In response to the supply of the control signal, the transfer mechanism 72 transfers the transfer jig 12 from the inspection stage 19 to the second preliminary stage 20.

[0039] The control unit 81 controls the operation of the transfer mechanism 74. In doing so, the control unit 81 generates a control signal for the transfer mechanism 74. The control signal specifies the reversal operation of the reversal table 75 around the horizontal axis Ha and specifies the position of the reversal table 75 relative to the transfer stage 17. In response to the supply of the control signal, the transfer mechanism 74 drives the reversal table 75 around the horizontal axis Ha and positions the reversal table 75 relative to the table 77.

[0040] The control unit 81 controls the heating of the heater 78. In doing so, the control unit 81 generates a control signal for the heater 78. The control signal specifies, for example, the temperature of the heater 78. The heater 78 reaches the melting point of the solder paste in response to the supply of the control signal. When the heating of the heater 78 is released, the heater 78 returns to room temperature.

[0041] The control unit 81 supplies imaging signals to the individual imagers 71, 83, 79. In response to the supply of the imaging signals, the individual imagers 71, 83, 79 capture an image of the transfer jig 12 or the semiconductor device 16. An image signal specifying the captured image is transmitted to the control unit 81.

[0042] Next, the operation of the pin control device 11 will be described. The transfer jig 12 is set on the frame body 31. A control signal is supplied to the negative pressure source 34. The pins 26 are loaded into the loading space 32 of the frame body 31. The number of the pins 26 is set to, for example, approximately twice the number of the pin receiving holes 21. The pins 26 are received on the upper surface of the transfer jig 12 (plate unit 22). Since the frame body 31 surrounds the loading space 32 on the upper surface of the transfer jig 12, the pins 26 are held on the upper surface of the transfer jig 12.

[0043] The control unit 81 positions the frame body 31 on the transfer stage 13. A control signal is supplied from the control unit 81 to the relative displacement mechanism 56. The upper surfaces of the first plate magnet 38a and the second plate magnet 38b are opposed to the back surface of the transfer jig 12 at an interval Sp of 3.5 [mm] or less. The pins 26 on the transfer jig 12 are exposed to the magnetic fields of the first plate magnet 38a and the second plate magnet 38b. The orientation of the pins 26 is controlled by the magnetic lines of force of the first plate magnet 38a and the second plate magnet 38b. The magnetic lines of force are set according to the positions and orientations of the mating surfaces 43, 44.

[0044] In response to the supply of the control signal, the relative displacement mechanism 56 drives the frame body 31 horizontally along a determined movement path. As shown in Fig. 16, relative displacement is caused between the transfer jig 12 and the transfer magnet unit 37 in a direction intersecting the vertical plane VP defined by the mating surfaces 43, 44 at a predetermined inclination angle θ. Here, the transfer jig 12 is displaced along a zigzag movement path 82. The center of the transfer jig 12 is moved along the movement path 82 in the two-dimensional plane xy. The pins 26 enter the pin receiving holes 21 according to the action of the magnetic field. In the transfer magnet unit 37, the magnetic lines of force between the first plate magnet 38a and the second plate magnet 38b tilt in the horizontal direction. According to the set inclination angle θ, the entry of the pins 26 is promoted.

[0045] Once the operation determined in the transfer stage 13 is completed, the control unit 81 positions the frame 31 in the first preliminary stage 18. A control signal is supplied from the control unit 81 to the relative displacement mechanism 56. The upper surface of the attracting magnet 63 faces the back surface of the transfer jig 12. The centerlines of the suction pieces 22a are aligned with the reference line 64. In response to the supply of the control signal, the relative displacement mechanism 56 moves the transfer jig 12 horizontally along the reference line 64. In accordance with the relative displacement, the attracting magnet 63 crosses the aggregate 23z of section 23. As shown in Figure 17, during relative displacement, the magnetic field of the attracting magnet 63 acts on the pins 26 in the input space 32. Since the attracting magnet 63 is formed smaller than the aggregate 23z of section 23, the pins 26 remaining on the upper surface of the transfer jig 12 outside of the pin receiving hole 21 are collected inward from the frame 31. The pins 26 are gathered along the reference line 64. Since a textured surface is established on the surface of the second plate 24b, the collection of pins 26 is facilitated.

[0046] Once the operations determined in the first preliminary stage 18 are completed, the control unit 81 positions the frame 31 on the removal stage 15. A control signal is supplied from the control unit 81 to the relative displacement mechanism 56. The transfer jig 12 is received on the upper surface of the table 66. The pins 26 gathered in the input space 32 are positioned in the center of the suction pieces 22a in the area close to the recovery unit 69. The control unit 81 separates the frame 31 from the transfer jig 12. A control signal is supplied to the negative pressure source 34. Movement of the pins 26 around the transfer jig 12 is permitted.

[0047] Here, the control unit 81 drives the removing magnet 67 along a predetermined path. A control signal is supplied from the control unit 81 to the drive mechanism 68. The removing magnet 67 ascends toward the start position 67a. A magnetic field from the removing magnet 67 acts on the pins 26 on the transfer jig 12. The removing magnet 67 is displaced horizontally from the start position 67a to the collection position 67b. The removing magnet 67 crosses the back side of the aggregate 23z of the compartments 23 between the attraction pieces 22a. In accordance with the magnetic field of the removing magnet 67, the pins 26 remaining outside the pin receiving holes 21 move from the upper surface of the transfer jig 12. The pins 26 can be removed from the upper surface of the transfer jig 12 only by the horizontal movement of the pins 26. The removing magnet 67 reaches the collection position 67b while pulling the pins 26 on the table 66 therewith. The removing magnet 67 descends from the collection position 67b. The pins 26 are released from the action of the magnetic field of the removing magnet 67. The pins 26 pulled by the removing magnet 67 are sucked into the collection unit 69. The remaining pins 26 are collected in this way.

[0048] When the removing operation of the removing magnet 67 is completed, the control unit 81 instructs an imaging device 71 to perform imaging. The imaging device 71 images the upper surface of the transfer jig 12 in accordance with a supplied imaging signal. The control unit 81 determines whether or not any pins 26 remain on the transfer jig 12 outside the pin receiving holes 21 based on the captured image. For the determination, an image signal is transmitted from the imaging device 71 to the control unit 81. When residual pins 26 are detected in the image, the removing magnet 67 horizontally moves again from the start position 67a to the collection position 67b along the predetermined path. During the horizontal movement, a control signal is supplied from the control unit 81 to the drive mechanism 68. In this way, the residual pins 26 remaining on the transfer jig 12 outside the pin receiving holes 21 are swept away.

[0049] Following the determination of the remaining pins 26, the control unit 81 determines, in accordance with the image signal from the imaging device 71, whether or not pins 26 have been placed in all the pin receiving holes 21. If an empty pin receiving hole 21 is detected in the image, the relative displacement mechanism 56 places the frame 31 on the insertion jig 12 again. The insertion jig 12 is set on the frame 31. Control signals are supplied from the control unit 81 to the relative displacement mechanism 56 and the negative pressure source 34 when setting the frame 31. The relative displacement mechanism 56 positions the frame 31 on the insertion stage 13. During positioning, the pins 26 are inserted into the insertion space 32 of the frame 31. On the insertion stage 13, the pins 26 enter the empty pin receiving holes 21 in response to the action of the magnetic field. Processing is carried out in the first preliminary stage 18 and the removal stage 15. In this way, all pins 26 are reliably placed in all the pin receiving holes 21. Once all the pin receiving holes 21 have been filled with pins 26, the transfer mechanism 72 moves the filling jig 12 to the next process. Since all the pin receiving holes 21 are filled with pins 26, the pins 26 are arranged as designed in the next process. Yield is improved.

[0050] When all pin receiving holes 21 are filled with pins 26 and all pins 26 are removed from the transfer jig 12 except for the pin receiving holes 21, the control unit 81 positions the transfer jig 12 on the inspection stage 19. The control unit 81 instructs the imaging device 71 to take an image. The imaging device 71 takes an image of the top surface of the transfer jig 12 according to the supplied imaging signal. Based on the captured image, the control unit 81 determines whether all pin receiving holes 21 have been filled with pins 26 and whether any pins 26 remain on the transfer jig 12 except for the pin receiving holes 21. An image signal is transmitted from the imaging device 71 to the control unit 81 for this determination. If an empty pin receiving hole 21 is detected in the image, the relative displacement mechanism 56 positions the frame 31 on the transfer stage 13. If residual pins 26 are detected in the image, the relative displacement mechanism 56 positions the frame 31 on the removal stage 15.

[0051] Once the operations determined in inspection stage 19 are completed, the control unit 81 positions the transfer jig 12 in the second preliminary stage 20. A control signal is supplied from the control unit 81 to the transfer mechanism 72. In the second preliminary stage 20, the inversion table 75 of the transfer mechanism 74 receives the transfer jig 12 from the coupling body 73 of the transfer mechanism 72. The control unit 81 checks the alignment of the transfer jig 12. In order to check, the control unit 81 instructs the imaging device 83 to take an image. The imaging device 83 takes an image of the top surface of the transfer jig 12 according to the supplied imaging signal. Based on the image taken, the control unit 81 performs alignment of the transfer jig 12. A control signal is supplied from the control unit 81 to the transfer mechanism 74 during alignment. In order to hand over the transfer jig 12, the inversion table 75 is positioned in the first position around the horizontal axis Ha. The transfer jig 12 is attracted to the upward horizontal plane 75a. The coupling 73 is separated from the transfer jig 12. Here, the pin 26 on the transfer jig 12 is exposed to the magnetic field of the holding magnet 76.

[0052] The reversing table 75 is driven from the first position to the second position around the horizontal axis Ha. When the transfer jig 12 is reversed, the transferred pins 26 are held in the pin receiving holes 21 by the action of the retaining magnets 76. The pins 26 are prevented from falling out. The transfer of the pins 26 is achieved with 100% of the pins 26 being transferred into the pin receiving holes 21.

[0053] The control unit 81 positions the transfer mechanism 74 on the transfer stage 17. Control signals are supplied from the control unit 81 to the transfer mechanism 74. On the transfer stage 17, the semiconductor device 16 is set on the table 77. The surface of the transfer jig 12 is aligned with the semiconductor device 16. As the inversion table 75 descends, the pins corresponding to the individual conductive pads are pressed against it. When the semiconductor device 16 is heated on the table 77, the solder paste melts. Control signals are supplied from the control unit 81 to the heater 78 during heating. The molten solder clings to the pins 26 on the conductive pads. As the solder cools, it solidifies. The solder causes the pins 26 to be joined to the individual conductive pads. In this way, the pins 26 are transferred from the transfer jig 12 to the semiconductor device 16.

[0054] Once the transfer of pins 26 is complete, the control unit 81 instructs the imager 79 to take an image. The imager 79 takes an image of the top surface of the semiconductor device 16 according to the supplied imaging signal. Based on the captured image, the control unit 81 determines whether or not pins 26 have been placed on all conductive pads. For this determination, an image signal is transmitted from the imager 79 to the control unit 81. The image detects the pins 26 that have been transferred to the semiconductor device 16. The status of the pins 26 is confirmed on the top surface of the semiconductor device 16. Any missing pins 26 are detected. Here, since 100% transfer is confirmed based on the image from the transfer jig 12 prior to the transfer of pins 26, the yield of the semiconductor device 16 is improved.

[0055] In this embodiment, the pin control method includes the steps of: inserting more pins 26 than the number of pin receiving holes 22 into the upper surface of a plate unit 22 having pin receiving holes 21 on its upper surface for receiving magnetic pins 26; displacing a magnet magnetized vertically along the plate unit 22 below the plate unit 22 to load the pins 26 into the pin receiving holes 21; removing any remaining pins 26 on the plate unit 22 other than those in the pin receiving holes 21; and after the pin removal step, imaging the upper surface of the plate unit 22 to determine whether or not all pins 26 have been loaded into the pin receiving holes 21. Even if all pins 26 have been loaded into the pin receiving holes 21, some pins 26 will remain on the upper surface of the plate unit 22. The step of removing the remaining pins 26 is performed. After that, the upper surface of the plate unit 22 is imaged, so empty pin receiving holes 21 can be detected in the image. It is confirmed whether or not all pins 26 have been loaded into the pin receiving holes 21. Once all the pin receiving holes 21 are filled with pins 26, the plate unit 22 is transferred to the next process. Since all the pin receiving holes 21 are filled with pins 26, the pins 26 are arranged as designed in the next process. Yield is improved.

[0056] In this embodiment, the pin control method, upon detecting an empty pin receiving hole 21 based on the determination of whether or not a pin has been deposited, performs the step of depositing a pin 26 again. All pin receiving holes 21 are reliably filled with pins 26. When all pin receiving holes 21 are confirmed to have pins 26 based on the determination of whether or not a pin has been deposited, the pin control method moves the plate unit 22 to the next step while holding the pins 26 in the pin receiving holes 21 with a magnet that applies a magnetic field to the back surface of the plate unit 22. The deposited pins 26 are held in the corresponding pin receiving holes 21 by the action of the magnet. The plate unit 22 is moved to the next step with all pin receiving holes 21 filled with pins 26.

[0057] According to this embodiment, the pin control method comprises the steps of aligning the semiconductor device 16 with the surface of the plate unit 22 and transferring the pins 26 onto the semiconductor device 16, and imaging the surface of the semiconductor device 16 after the pin transfer step. The transferred pins 26 are detected in the image. The status of the pins 26 is confirmed on the surface of the semiconductor device 16. Missing pins 26 are detected in individual semiconductor devices 16.

[0058] In the pin control method according to this embodiment, when transferring the pins 26, after the step of imaging the plate unit 22, the pins 26 are held in the pin receiving holes 21 by a magnet that applies a magnetic field to the back surface of the plate unit 22. The transferred pins 26 are held in the pin receiving holes 21 by the action of the magnet. The transfer of the pins 26 is achieved when 100% of the pins 26 are transferred into the pin receiving holes 21.

[0059] The pin control device 11 according to this embodiment includes a frame 31 that is detachably superimposed on the upper surface of a plate unit 22 having a pin receiving hole 21 for receiving magnetic pins 26 on its upper surface, and surrounds an insertion space 32 that is continuous with the pin receiving hole 21 while in contact with the plate unit 22 around its entire circumference; magnets (first plate magnet 38a and second plate magnet 38b) that are magnetized vertically and positioned below the plate unit 22; a table 66 that supports the plate unit 22 separated from the frame 31 and is combined with a removal mechanism 65 that removes residual pins 26 remaining on the upper surface of the plate unit 22 other than the pin receiving hole 21; and a control unit 81 that detects the operation of the removal mechanism 65, supplies an imaging signal to an imaging device 71 to image the upper surface of the plate unit 22, and determines whether or not pins 26 have been inserted into all the pin receiving holes 21 based on the captured image. The pins 26 are inserted into the insertion space 32. The pins 26 are received by the upper surface of the plate unit 22. The pin 26 is exposed to the magnetic fields of the first plate magnet 38a and the second plate magnet 38b. The orientation of the pin 26 is controlled by the magnetic field lines of the first plate magnet 38a and the second plate magnet 38b. The pin 26 enters the pin receiving hole 21 in response to the action of the magnetic field. The entry of the pin 26 is facilitated. Since the frame 31 surrounds the insertion space 32 on the upper surface of the plate unit 22, the pin 26 is held on the upper surface of the plate unit 22. When the frame 31 is separated from the plate unit 22, the movement of the pin 26 around the plate unit 22 is permitted. The pin 26 is removed from the upper surface of the plate unit 22 on the table 66. When the removal of the pin 26 is detected, the upper surface of the plate unit 22 is imaged. Empty pin receiving holes 21 can be detected in the image. It is confirmed whether or not pins 26 have been inserted into all pin receiving holes 21. Once all the pin receiving holes 21 are filled with pins 26, the plate unit 22 is transferred to the next process. Since all the pin receiving holes 21 are filled with pins 26, the pins 26 are arranged as designed in the next process. Yield is improved.

[0060] In this embodiment, when the control unit 81 detects an empty pin receiving hole 21 based on the image acquired by the imaging device 71, it places the frame 31 on the upper surface of the plate unit 22 and positions the first plate magnet 38a and the second plate magnet 38b below the plate unit 22. When a pin 26 is inserted into the insertion space 32, the pin 26 enters the empty pin receiving hole 21 in response to the magnetic field. All pin receiving holes 21 are reliably filled with pins 26.

[0061] The pin control device 11 according to this embodiment includes a transfer mechanism 72 that transfers the plate unit 22 to the next process while holding the pins 26 in the pin receiving holes 21 with a magnet that applies a magnetic field to the back surface of the plate unit 22. The inserted pins 26 are held in the corresponding pin receiving holes 21 by the action of the magnet. The plate unit 22 is transferred to the next process when all the pin receiving holes 21 are filled with pins 26.

[0062] The pin control device 11 includes a table 77 that supports a semiconductor device 16 that takes pins 26 from a board unit 22 and is combined with a transfer mechanism 74 that transfers the pins 26 from the board unit 22 to the semiconductor device 16, and a control unit 81 that detects the operation of the transfer mechanism 74, supplies an imaging signal to an imaging device 79 to image the top surface of the semiconductor device 16, and determines whether or not the pins 26 have been placed on all conductive pads based on the image captured. When the top surface of the semiconductor device 16 is imaged in response to the imaging signal, the pins 26 that have been transferred to the semiconductor device 16 are detected in the image. The status of the pins 26 is confirmed on the surface of the semiconductor device 16. Missing pins 26 are found in individual semiconductor devices 16.

[0063] The pin control device 11 includes a displacement mechanism that moves the plate unit 22 to the table 77 of the transfer stage 17 after the top surface of the plate unit 22 has been imaged by the imaging device 71, and a magnet that applies a magnetic field to the back surface of the plate unit 22 being moved by the displacement mechanism, holding the pins 26 in the pin receiving holes 21. The inserted pins 26 are held in the pin receiving holes 21 by the action of the magnet. The transfer of the pins 26 is achieved when 100% of the pins 26 are inserted into the pin receiving holes 21.

[0064] 11 Pin control device 12 Transfer jig (22 Plate unit) 16 Semiconductor device 21 Pin receiving hole 26 Pin 32 Input space 33 Through hole 38a Magnet (first plate magnet) 38b Magnet (second plate magnet) 65 Removal mechanism 66 Table 71 Imager 72 Transfer mechanism 74 Transfer mechanism 77 Table 81 Control unit

Claims

1. A pin control method comprising the steps of: inserting a number of pins greater than the number of pin receiving holes into the upper surface of a plate unit having pin receiving holes on its upper surface; displacing a magnet that is magnetized vertically along the plate unit below the plate unit to load the pins into the pin receiving holes; removing any pins remaining on the plate unit other than those in the pin receiving holes; and imaging the upper surface of the plate unit after the pin removal step to determine whether or not all of the pin receiving holes have been loaded with pins.

2. The pin control method according to claim 1, wherein if an empty pin receiving hole is detected in accordance with the determination of whether or not a pin has been deposited, the step of depositing the pin again is performed.

3. The pin control method according to claim 2, wherein, upon confirmation of the pins in all of the pin receiving holes in accordance with the determination of whether or not the payment has been made, the plate unit is transferred to the next process while holding the pins in the pin receiving holes with a magnet that applies a magnetic field to the back surface of the plate unit.

4. The pin control method according to claim 1, comprising the steps of: facing a semiconductor device toward the surface of the plate unit and transferring the pins onto the semiconductor device; and imaging the surface of the semiconductor device after the step of transferring the pins.

5. The pin control method according to claim 4, wherein, in transferring the pins, after the step of imaging the plate unit, the pins are held in the pin receiving holes by a magnet that applies a magnetic field to the back surface of the plate unit.

6. A pin control device comprising: a frame that is detachably superimposed on the upper surface of a plate unit having a pin receiving hole on its upper surface for receiving magnetic pins, and which surrounds an insertion space continuous with the pin receiving hole while in contact with the upper surface around its entire circumference; a magnet that is magnetized vertically and positioned below the plate unit; a removal table that supports the plate unit separated from the frame and is combined with a removal mechanism to remove any pins remaining on the upper surface of the plate unit other than the pin receiving hole; and a control unit that detects the operation of the removal mechanism, supplies an imaging signal to an imaging device to image the upper surface of the plate unit, and determines whether or not all of the pins have been inserted into the pin receiving holes based on the captured image.

7. The pin control device according to claim 6, wherein when the control unit detects an empty pin receiving hole based on the image, it places the frame on the upper surface of the plate unit and positions the magnet below the plate unit.

8. The pin control device according to claim 7, further comprising a transfer mechanism that transfers the plate unit to the next process while holding the pins in the pin receiving holes with a magnet that applies a magnetic field to the back surface of the plate unit.

9. The pin control device according to claim 6, comprising: a transfer table that supports a semiconductor device that takes the pins from the plate unit and is combined with a transfer mechanism that transfers the pins from the plate unit to the semiconductor device; and a control unit that detects the operation of the transfer mechanism and generates an imaging signal for imaging the upper surface of the semiconductor device.

10. The pin control device according to claim 9, further comprising: a displacement mechanism for transporting the plate unit to the transfer stage after the upper surface of the plate unit has been imaged by the imaging device; and a magnet for applying a magnetic field to the back surface of the plate unit being transported by the displacement mechanism and for holding the pin in the pin receiving hole.

Images