Method for manufacturing electronic component

Abstract

[Problem] To provide a method for manufacturing an electronic component. [Solution] A method for manufacturing an electronic component including an electronic component element body, an exterior body surrounding the element body, and an electrode disposed outside the exterior body, the method for manufacturing an electronic component comprising: a step for preparing the element body from which a conductor part is led out; a step for positioning the element body in a delineated internal space defined by a boundary portion such that the element body is disposed in the delineated internal space and a portion of the conductor part is positioned in the boundary portion; a step for filling an exterior material into the delineated internal space in which the element body is positioned and a conductor part positioning space in the boundary part, in which a part of the conductor part is positioned; a step for forming the exterior body surrounding the element body in the delineated internal space by solidifying the exterior material, and forming an exterior body extension connected to the exterior body and positioned along the conductor part positioning space in the conductor part positioning space; and a step for withdrawing the exterior body from the delineated internal space.

Description

Method for manufacturing electronic component

[0001] The present invention relates to a method for manufacturing an electronic component.

[0002] Conventionally, there has been known an electronic component in which an electronic element such as a coil or a capacitor is arranged inside an exterior body formed of a resin material. For example, Citation Document 1 describes a method of inserting a capacitor element into a molding die set in a transfer molding machine and performing sealing molding with a resin. This type of so-called resin-molded electronic component is generally considered to be advantageous in terms of cost.

[0003] Japanese Patent Application Laid-Open No. Hei 1-98213

[0004] For example, the method of forming an exterior body by transfer molding disclosed in Patent Document 1 causes waste of exterior material such as a cull and a runner, which is an obstacle to cost reduction. Further, since a mold that can withstand high clamping force is required, there may be restrictions on design freedom and manufacturing conditions, which may be a factor that makes it difficult to improve characteristics and further reduce costs.

[0005] The present disclosure provides a method for manufacturing an electronic component that enables cost reduction, improvement in design freedom, facilitation of manufacturing processes, and the like.

[0006] A method for manufacturing an electronic component according to the present disclosure is a method for manufacturing an electronic component including an electronic component element body, an exterior body surrounding the element body, and an electrode arranged outside the exterior body, the method comprising: preparing the element body from which a conductor portion is led out; arranging the element body such that the element body is arranged in a compartment internal space defined by a boundary portion and a part of the conductor portion is arranged at the boundary portion; filling an exterior material into the compartment internal space in which the element body is arranged and a conductor arrangement space of the boundary portion in which a part of the conductor portion is arranged; solidifying the exterior material to form the exterior body surrounding the element body in the compartment internal space, and forming an exterior body extension portion continuous with the exterior body and arranged along the conductor arrangement space in the conductor arrangement space; and taking out the exterior body from the compartment internal space.

[0007] In this method of manufacturing electronic components, the electronic component base is placed in an internal space defined by a boundary, a portion of the conductive part extending from the base is placed in the conductive part arrangement space at the boundary, and an outer casing material is filled and solidified in these spaces to manufacture the electronic component. Therefore, by appropriately configuring the internal space of the compartment and the conductive part arrangement space as desired, the arrangement and configuration of the conductive part relative to the base can be arbitrarily arranged and configured, thereby improving the degree of design freedom. As a result, the characteristics of the electronic component can be improved or stabilized, and the impact on manufacturing conditions can be easily adjusted, making it possible to simplify the manufacturing process and reduce manufacturing costs for electronic components. Furthermore, in this method of manufacturing electronic components, the outer casing can be easily formed by compression molding with a high degree of design freedom, thus reducing waste of outer casing material, further improving the degree of design freedom, improving and stabilizing the characteristics of electronic components, simplifying the manufacturing process for electronic components, and reducing manufacturing costs.

[0008] In the step of preparing the base body, an assembly is prepared that includes a plurality of base bodies and a conductor portion that connects the plurality of base bodies to each other; in the step of arranging the base bodies, the base bodies are arranged in each of the plurality of internal spaces of the compartments, and the assembly is arranged such that a portion of the conductor portion that connects the plurality of base bodies to each other passes through the conductor portion arrangement space at the boundary; in the step of removing the outer casing, the outer casing that surrounds each of the plurality of base bodies may be removed from the plurality of internal spaces of the compartments.

[0009] After forming the outer casing, the process may further involve cutting the conductive parts that connect the base bodies to each other to separate the outer casing into individual pieces.

[0010] The outer casing extension may be removed together with the outer casing and the conductor.

[0011] The process may further include removing the outer casing extension and forming an outer conductor portion, which is the portion of the conductor that extends outward from the outer casing.

[0012] The portion of the conductor extending outward from the outer casing may be bent to break and remove the extension from the outer casing, and the external conductor portion may be formed as the electrode.

[0013] The process may further include removing the outer casing extension and the conductor portion extending outward from the outer casing, exposing the end face of the conductor portion to the outer surface of the outer casing, and installing the electrode member constituting the electrode on the exposed end face of the conductor portion.

[0014] The exterior material may be filled into the conductor arrangement space at the same time as, or after, the internal space of the compartment, and upon solidification of the exterior material, it may adhere to the conductor arranged in the conductor arrangement space to form the exterior extension.

[0015] The conductor portion has a cross-sectional shape defined by a predetermined width and a predetermined thickness in the thickness direction perpendicular to the width direction, the width of the space where the conductor portion is arranged is longer than the width of the conductor portion, and the thickness of the space where the conductor portion is arranged may be approximately the same as the thickness of the conductor portion, or it may be thicker than the thickness of the conductor portion.

[0016] In the process of removing the exterior body from the internal space of the compartment, the solidified exterior material may be broken to remove the exterior body, thereby forming burrs on predetermined locations on the surface of the exterior body.

[0017] The process includes forming the internal space of the compartment within the mold, placing the base body from which the conductor portion is led out, filling with the exterior material, and solidifying the exterior material, and a rough surface may be formed on at least a part of the surface of the exterior body by forming a rough surface on at least a part of the inner surface of the mold.

[0018] The boundary portion may consist of at least two partition members arranged in the depth direction of the internal space of the compartment, and the conductor portion arrangement space may be formed by sandwiching the portion of the conductor portion between at least two of the partition members.

[0019] The multiple compartmentalized internal spaces are formed within the recesses of the mold, the boundary portions are composed of partition members arranged in the depth direction of the compartmentalized internal spaces, and the conductor portion arrangement space may be formed by sandwiching a portion of the conductor portion between the bottom surface of the recess and the partition members.

[0020] The conductor portion has a positioning projection, and the element from which the conductor portion is led out may be positioned relative to the internal space of the compartment by engaging the positioning projection with the partition member.

[0021] Figure 1A is a perspective view of a coil component according to the first embodiment of this disclosure. Figure 1B is a perspective view of the coil component shown in Figure 1A, viewed from the mounting side. Figure 1C is a perspective view of the coil component shown in Figure 1A. Figure 1D is a cross-sectional view along the first side surface of the outer casing of the coil component shown in Figure 1A. Figure 2 is a flowchart for explaining the manufacturing method of the coil component shown in Figure 1A. Figure 3A1 is a first diagram for explaining the raw material preparation step of the manufacturing method shown in the flowchart in Figure 2. Figure 3A2 is a second diagram for explaining the raw material preparation step of the manufacturing method shown in the flowchart in Figure 2. Figure 3B is a diagram for explaining the lower partition member installation step and the raw material placement step of the manufacturing method shown in the flowchart in Figure 2. Figure 3C is a diagram for explaining the raw material placement step of the manufacturing method shown in the flowchart in Figure 2, following Figure 3B. Figure 3D1 is a first diagram for explaining the upper partition member installation step of the manufacturing method shown in the flowchart in Figure 2. Figure 3D2 is a second diagram illustrating the upper partition member installation process of the manufacturing method shown in the flowchart in Figure 2, and is a plan cross-sectional view taken from IIID to IIID in Figure 3D1. Figure 3E1 is a first diagram illustrating the outer material filling process of the manufacturing method shown in the flowchart in Figure 2. Figure 3E2 is a second diagram illustrating the outer material filling process of the manufacturing method shown in the flowchart in Figure 2, and is a plan cross-sectional view taken from IIIE to IIIE in Figure 3E1. Figure 3F is a diagram illustrating the molding (solidification) process of the manufacturing method shown in the flowchart in Figure 2. Figure 3G is a diagram illustrating the demolding process of the manufacturing method shown in the flowchart in Figure 2. Figure 3H1 is a first diagram illustrating the individualization process of the manufacturing method shown in the flowchart in Figure 2. Figure 3H2 is a second diagram illustrating the individualization process of the manufacturing method shown in the flowchart in Figure 2, and is a plan cross-sectional view taken from IIIH to IIIH in Figure 3H1. Figure 4A is a diagram illustrating the individualized coil parts in the individualization process of the manufacturing method shown in the flowchart in Figure 2. Figure 4B is a diagram illustrating the lead bending process of the manufacturing method shown in the flowchart in Figure 2. Figure 5A is a perspective view of the partition member used in the manufacturing method shown in the flowchart in Figure 2.Figure 5B is a perspective view of a partition member used in a method for manufacturing another electronic component as a second embodiment of the present disclosure. Figure 6A is a first diagram illustrating a method for manufacturing another electronic component as a second embodiment of the present disclosure. Figure 6B is a second diagram illustrating a method for manufacturing an electronic component in the second embodiment. Figure 6C is a third diagram illustrating a method for manufacturing an electronic component in the second embodiment. Figure 7A is a diagram showing a first modified example of the coil component shown in Figure 1A. Figure 7B is a diagram showing a second modified example of the coil component shown in Figure 1A. Figure 7C is a diagram showing a third modified example of the coil component shown in Figure 1A. Figure 7D is a diagram showing a fourth modified example of the coil component shown in Figure 1A. Figure 7E1 is a diagram showing a fifth modified example of the coil component shown in Figure 1A. Figure 7E2 is a cross-sectional view taken along VIIE-VIIIE in Figure 7E1. Figure 7F is a diagram showing a sixth modified example of the coil component shown in Figure 1A. Figure 8A is a diagram illustrating a first modified example of the method for manufacturing an electronic component according to the present disclosure. Figure 8B1 is a first diagram illustrating a second modified example of the method for manufacturing an electronic component according to the present disclosure. Figure 8B2 is a second diagram illustrating a second modified example of the method for manufacturing an electronic component according to the present disclosure. Figure 8C1 is a first diagram illustrating a third modified example of the method for manufacturing an electronic component according to the present disclosure. Figure 8C2 is a second diagram illustrating a third modified example of the method for manufacturing an electronic component according to the present disclosure.

[0022] Embodiments of this disclosure will be described below with reference to the drawings. The embodiments described below are illustrative examples for illustrating this disclosure. Various components of the embodiments of this disclosure, such as numerical values, shapes, materials, and manufacturing processes, can be modified or changed to the extent that no technical problems arise.

[0023] The shapes and other features shown in the drawings of this disclosure may not necessarily match the actual shapes and other features. This is because the shapes and other features may have been altered for illustrative purposes.

[0024] First Embodiment Coil Component As one embodiment of the electronic component according to the present disclosure, a coil component 1 that functions as an inductor and is mounted on various electrical devices will be described with reference to Figures 1A to 1D. Figure 1A is an external perspective view of the coil component 1 as seen from the top side, Figure 1B is an external perspective view of the coil component 1 as seen from the mounting side, Figure 1C is a perspective view of the coil component 1, and Figure 1D is a cross-sectional view of the coil component 1, which is a cross-sectional view along the first side surface 30c of the outer casing 30 of the coil component 1.

[0025] As shown in Figures 1A and 1B, the coil component 1 is an electronic component with a roughly rectangular parallelepiped shape (hexahedral shape). The coil component 1 has a mounting surface (bottom surface) 1a that is connected to an external circuit formed on a substrate or the like, a top surface 1b that is opposite to the mounting surface 1a (located on the opposite side), and first to fourth side surfaces 1c to 1f that connect the mounting surface 1a and the top surface 1b.

[0026] As shown in Figure 1C, the coil component 1 has a coil portion 10 as an electronic component base (sometimes simply called a base), a pair of leads (conductor portions) 20a and 20b extending from the coil portion 10, an outer casing 30, and a pair of electrodes 40a and 40b. In the following description, each of the pair of leads 20a and 20b may be simply referred to as lead 20. Similarly, each of the pair of electrodes 40a and 40b may be simply referred to as electrode 40.

[0027] In this specification, as shown in Figure 1A, the direction in which the bottom surface (mounting surface) 1a and the top surface 1b of the coil component 1 face each other is described as the Z-axis direction, the direction in which the second side surface 1d and the fourth side surface 1f face each other is described as the X-axis direction, and the direction in which the first side surface 1c and the third side surface 1e face each other is described as the Y-axis direction. Furthermore, in each axis, the direction from the bottom surface 1a to the top surface 1b, the direction from the second side surface 1d to the fourth side surface 1f, and the direction from the third side surface 1e to the first side surface 1a are described as positive directions, and the direction in the opposite direction is described as a negative direction. In addition, the Z-axis direction may be specifically referred to as the height direction or up and down direction, and the positive Z-axis side may be referred to as the upper side, and the negative Z-axis side as the lower side. The X-axis, Y-axis, and Z-axis are perpendicular to each other.

[0028] The coil component 1 is roughly rectangular (hexahedral), but at least one, two, three, or all of the first to fourth sides 1c to 1f may be inclined, either entirely or partially, or the middle part in the height direction may protrude, forming an inclined surface in the vertical direction. In other words, the first to fourth sides 1c to 1f do not have to be strictly perpendicular to the top surface 1b and the mounting surface 1a. The shape of the sides of such a coil component 1 depends on the shape of the outer casing 30, which mainly defines the external shape of the coil component 1, and will be described in detail later in the section describing the outer casing 30.

[0029] In the coil component 1, the top surface 1b, the second side surface 1d, and the fourth side surface 1f are the top surface 30b, the second side surface 30d, and the fourth side surface 30f of the outer casing 30. The mounting surface 1a, the first side surface 1c, and the third side surface 1e of the coil component 1 are composed of the bottom surface 30a, the first side surface 30c, and the third side surface 30e of the outer casing 30, and the surfaces of the electrodes 40a and 40b.

[0030] The size of the coil component 1 is not particularly limited, but for example, as shown in Figure 1A, the length Lx in the X-axis direction of the coil component 1 is 0.6 mm to 6.5 mm, the length Ly in the Y-axis direction of the coil component 1 is 0.6 mm to 6.5 mm, and the length (height) H in the Z-axis direction of the coil component 1 is 0.5 mm to 5.0 mm.

[0031] The configuration of each part of the coil component 1 will be described below. As mentioned above, the coil component 1 has a coil section 10, a pair of leads 20a and 20b, an outer casing 30, and a pair of electrodes 40a and 40b. The coil section 10 also has a winding section 11 and a covering section 12.

[0032] As shown in Figure 1C, the winding section 11 is formed by spirally winding a conductor (wire) to create a coil, and has a substantially cylindrical outer shape as shown in the figure. Both ends of the wire forming the winding section 11 are led out from the winding section 11 as a pair of leads 20a and 20b, respectively, in opposite directions along the Y-axis.

[0033] The winding section 11 is constructed by edge-wounding a rectangular cross-section flat wire made of copper or the like. In addition to the rectangular wire, any conductive wire such as round wire, stranded wire, Litz wire, or braided wire may be used as the wire constituting the winding section 11. Furthermore, an insulated coated wire, in which these conductive wires (conductive core wires) are coated with an insulating film, may also be used. Specifically, known winding wires such as AIW (polyamide-imide wire), UEW (polyurethane wire), and USTC can be used.

[0034] In this embodiment, the cross-sectional dimensions of the rectangular wire constituting the winding portion 11 are, for example, a thickness of 20 μm to 2 mm and a width of 40 μm to 2 mm, but the thickness may be 20 μm to 200 μm and the width may be 40 μm to 400 μm. When the winding portion 11 is made of round wire, the cross-sectional dimensions (thickness, wire diameter) of the round wire may be, for example, 50 μm to 2 mm, and are not particularly limited.

[0035] In the example shown in Figure 1C, the number of layers in the winding axis direction of the winding section 11 is 3 to 5, and the number of layers in the radial direction is 1, but these number of layers can be changed arbitrarily. Also, in the example shown in Figure 1C, the winding axis direction of the winding section 11 corresponds to the Z axis direction, that is, the direction perpendicular to the mounting surface 1a of the coil component 1, but it may also correspond to a direction perpendicular to the Z axis direction. The method of winding the wire can also be arbitrary, and flatwise bending, in which a flat rectangular wire is bent in the thickness direction, is also acceptable.

[0036] The covering portion 12 is a member that seals and houses the winding portion 11 and defines the outer shape of the coil portion 10 as an electronic component body covered by the outer casing 30. In this embodiment, the covering portion 12 is substantially rectangular in shape, but it may be cylindrical in shape following the shape of the winding portion 11, or it may be any other arbitrary shape. A pair of leads 20a and 20b are led out from the covering portion 12.

[0037] The covering portion 12 may be made of any material, for example, it may be formed by encapsulating any resin. Alternatively, the covering portion 12 may be constructed by housing the winding portion 11 in a metal, ceramic, or resin case and sealing the case. It is preferable that the thermal expansion coefficient of the covering portion 12 is small compared to the thermal expansion coefficient of the outer casing 30 described later (for example, 45 ppm / K or less, or 10 ppm / K or less). By reducing the difference between the thermal expansion coefficient of the covering portion 12 and the thermal expansion coefficient of the outer casing 30, it is possible to prevent cracks from occurring in the outer casing 30 around the covering portion 12.

[0038] The covering portion 12 is effective in improving or stabilizing the characteristics of the coil (winding portion) 11 as a functional component (electronic component), facilitating the handling of the coil 11, increasing the environmental resistance (moisture resistance, etc.) of the coil 11, or extending the service life (lifespan) of the coil 11.

[0039] In the coil component 1 or coil section 10, if the aforementioned effects are sufficiently ensured even without, for example, the covering portion 12, then the covering portion 12 may be omitted. That is, the winding portion 11 may be considered as an electronic component element to constitute the coil section 10 or coil component 1. In this case, the winding portion 11 will be directly housed in the outer casing 30.

[0040] The covering portion 12 may function as a core relative to the winding portion (coil) 11. That is, the covering portion 12 may be formed as a magnetic core by annealing a ceramic material such as metal or ferrite formed by, for example, powder compaction, injection molding, or machining. Alternatively, the covering portion 12 may be formed by annealing a resin containing magnetic particles. The covering portion 12 is made of a material with a higher relative magnetic permeability than the outer casing 30, but it may also be made of the same material as the outer casing 30.

[0041] In the present embodiment, the winding portion 11, which is an air-core coil, is resin-sealed and sealed and housed in the covering portion 12. However, a configuration may be adopted in which the covering portion 12 has a cylindrical winding core portion serving as a core, and the winding portion 11 is provided on the outer peripheral surface of the winding core portion serving as the core. In this case, the winding portion 11 may be formed, for example, by winding a wire around the core winding portion, or may be formed by fitting the winding portion 11 formed as an air-core coil onto the core winding portion. The covering portion 12, in other words the coil portion 10, may be formed by further performing resin sealing or the like on such a configuration in which the winding portion 11 is formed around the winding core portion.

[0042] The pair of leads 20a and 20b are conductor portions led out from the coil portion 10 and are electrically connected to the winding portion 11. In the coil portion 10 of the present embodiment, both end portions of the rectangular wire forming the winding portion 11 are drawn out from the covering portion 12 (from the winding portion 11), and directly form the pair of leads 20a and 20b. Therefore, the leads 20a and 20b are also the same rectangular wire as that forming the winding portion 11. The leads 20a and 20b are further led out to the outside from the exterior body 30, and are bent outside the exterior body 30 to constitute electrodes 40a and 40b.

[0043] In the lead 20, the portion located inside the exterior body 30, that is, the portion led out from the winding portion 11, led out from the covering portion 12, and extending to the surface of the exterior body 30 is referred to as an internal lead (internal conductor portion) 21. The portion continuous to the internal lead 21 and led out to the outside from the exterior body 30 is referred to as an external lead (external conductor portion) 22 or a lead-out portion. Further, the boundary portion between the internal lead 21 and the external lead 22 is referred to as a connection portion 23. In other words, the connection portion 23 can be referred to as the cross-sectional portion of the lead 20 along the outer surface of the exterior body 30.

[0044] As shown in FIG. 1C, the exterior body 30 is a member surrounding the coil portion 10. The exterior body 30 seals and houses the coil portion 10 and defines the outer shape of the coil component 1.

[0045] In the present embodiment, the exterior body 30 has a substantially rectangular parallelepiped shape (hexahedral shape). As shown in FIGS. 1A and 1B, the exterior body 30 has, as outer surfaces thereof, a first main surface (bottom surface) 30a that forms the mounting surface 1a of the coil component 1, and a second main surface (top surface) 30b that faces the first main surface 30a (is located on the opposite side thereof) and forms the top surface 1b of the coil component 1, and first to fourth side surfaces 30c to 30f that connect the first main surface 30a and the second main surface 30b and form the first to fourth side surfaces 1c to 1f of the coil component 1.

[0046] The second main surface (top surface) 30b, the second side surface 30d, and the fourth side surface 30f of the exterior body 30 directly form the top surface 1b, the second side surface 1d, and the fourth side surface 1f of the coil component 1. Electrodes 40a and 40b are provided on the first main surface (bottom surface) 30a, the first side surface 30c, and the third side surface 30e of the exterior body 30, to constitute the mounting surface 1a, the first side surface 1c, and the third side surface 1e of the coil component 1.

[0047] A pair of electrodes 40a and 40b are provided on the outer surface of the exterior body 30. One electrode 40a is provided across the first side surface 30c and the first main surface 30a, and the other electrode 40b is provided across the third side surface 30e and the first main surface 30a.

[0048] As shown in FIG. 1C, connection portions 23 of the leads 20 are respectively arranged on the first side surface 30c and the third side surface 30e of the exterior body 30. The connection portion 23 is a portion that connects the electrode 40 arranged outside the exterior body 30 and the coil portion 10 (element body) arranged inside the exterior body 30. That is, the internal lead 21 of the coil portion 10 and the electrode 40 are connected at the connection portion 23.

[0049] In the present embodiment, the lead 20 led out from the coil portion 10 is directly drawn out to the outside of the exterior body 30, and is bent outside the exterior body 30 to form the electrode 40. Therefore, the connection portion 23 is a boundary between the internal lead 21 and the external lead (lead-out portion) 22 of the lead 20.

[0050] Therefore, the shape of the connection portion 23 is the cross-sectional shape of the lead 20 along the first side surface 30c and the third side surface 30e of the outer casing 30, and in this embodiment, it is the same as the cross-sectional shape of the flat wire forming the winding portion 11 and the lead 20. That is, as shown in Figure 1D, the shape of the connection portion 23 is a rectangular cross-sectional shape having a width wc of a predetermined length in the width direction parallel to the first main surface 30a (mounting surface 1a of the coil component 1) of the outer casing 30, and a predetermined thickness tc that is smaller than the width wc in the thickness direction perpendicular to the width direction. Specifically, the width wc may be 40 μm to 2 mm, or 40 μm to 400 μm. Also, the thickness tc may be 20 μm to 2 mm, or 20 μm to 200 μm.

[0051] The connecting portion 23 is positioned approximately in the center of the first side surface 30c and the third side surface 30e of the outer casing 30, that is, approximately in the center in the direction parallel to the mounting surface 1a and in the height direction of the first side surface 30c and the third side surface 30e. In other words, the lead 20 is drawn out from approximately in the center of the first side surface 30c and the third side surface 30e to the outside of the outer casing 30.

[0052] As shown in Figures 1A and 1B, the first side surface 30c of the exterior body 30 where the connecting portion 23 is located is divided into an upper region 30c1, an intermediate region 30c2, and a lower region 30c3 along the direction from the second main surface 30b to the first main surface 30a.

[0053] Although not shown in the drawing, the third side surface 30e of the outer casing 30, where the connection portion 23 connecting the other electrode 40b to the coil portion 10 is located, is also divided into an upper region, an intermediate region, and a lower region along the direction from the second main surface 30b to the first main surface 30a, similar to the upper region 30c1, intermediate region 30c2, and lower region 30c3 of the first side surface 30c. Since the configuration of the third side surface 30e is the same as that of the first side surface 30c, the explanation of these upper region, intermediate region, and lower region of the first side surface 30c and the third side surface 30e will be given representatively for the first side surface 30c, and the explanation of the outer casing 30e will be omitted.

[0054] Of the upper region 30c1, intermediate region 30c2, and lower region 30c3 formed on the first side surface 30c of the exterior body 30, the intermediate region 30c2 is formed as a rough surface region (first region) with a rougher surface roughness than other regions of the outer surface of the exterior body 30, that is, the outer surface of the exterior body 30 other than the first side surface 30c and the third side surface 30e, and the upper region 30c1 and lower region 30c3 of the first side surface 30c and the third side surface 30e, respectively.

[0055] In other words, the upper region 30c1 and the lower region 30c3 of the first side surface 30c are formed as smooth regions (second regions) with a smoother surface roughness than the intermediate region 30c2. The surfaces of the outer surface of the outer body 30 other than the first side surface 30c and the third side surface 30e have the same surface roughness as the upper region 30c1 and the lower region 30c3 of the first side surface 30c, that is, they are smooth regions (second regions) with a smoother surface roughness than the intermediate region 30c2 of the first side surface 30c.

[0056] The intermediate region 30c2, which is the rough surface region (first region), is formed continuously with the connection portion 23 along the width direction of the connection portion 23, that is, along a direction parallel to the mounting surface 1a of the coil component 1, as shown in Figures 1A, 1B, and 1D. The intermediate region 30c2 is formed on both sides of the connection portion 23 in the width direction of the connection portion 23, extending over the entire area of ​​the first side surface 30c.

[0057] Regarding the thicknesses H1, H2, and H3 (lengths in the direction perpendicular to the mounting surface 1a of the coil component 1) of the upper region 30c1, the intermediate region 30c2, and the lower region 30c3, respectively, the thickness H2 of the intermediate region 30c2 is approximately the same as the thickness tc of the connection portion 23, or slightly thicker (larger) than the thickness Tc of the connection portion 23. However, the thickness H2 of the intermediate region 30c2 may be thinner (smaller) than the thickness tc of the connection portion 23.

[0058] The thicknesses H1 and H3 of the upper region 30c1 and the lower region 30c3 may be approximately equal. When the thicknesses H1 and H3 of the upper region 30c1 and the lower region 30c3 are approximately equal, the intermediate region 30c2 will be positioned approximately in the center in the height direction of the first side surface 30c of the outer casing 30. As described above, in this embodiment, the connection portion 23 of the lead 20 is positioned approximately in the center of the first side surface 30c, so the intermediate region 30c2 formed continuously with the connection portion 23 may also be positioned approximately in the center of the first side surface 30c in the height direction.

[0059] However, if the connecting portion 23 is positioned off-center in either an upward or downward direction from the center in the height direction of the first side surface 30c, the intermediate region 30c2 formed continuously with the connecting portion 23 may also be positioned at a location corresponding to the height of the connecting portion 23. In this case, the thicknesses H1 and H3 of the upper region 30c1 and the lower region 30c3 may be set to an appropriate thickness (height) corresponding to the position of the intermediate region 30c2.

[0060] The width of the intermediate regions 30c2 formed on both sides of the connection portion 23 is greater than the width of the connection portion 23. However, if the connection portion 23 is not located in the center of the first side surface 30c in a direction parallel to the mounting surface 1a of the coil component 1, then it is sufficient that the width of at least one of the intermediate regions 30c2 formed on both sides of the connection portion 23 is greater than the width of the connection portion 23. If the width (length) of the first side surface 30c in a direction parallel to the mounting surface 1a of the coil component 1 is less than three times the width of the connection portion 23, it becomes difficult to form intermediate regions 30c2 with a width greater than the width of the connection portion 23 on both sides of the connection portion 23. In such cases, the connection portion 23 may be positioned such that the width of the intermediate region 30c2 on one side of the connection portion 23 is greater than the width of the connection portion 23.

[0061] The actual surface roughness Ra of the intermediate region 30c2 as the rough surface region (first region) and the other outer surfaces of the outer casing 30 as the smooth region (second region) may be, for example, a surface roughness Ra of 1.4 μm or less for the smooth region (second region) and a surface roughness Ra of greater than 1.4 μm for the rough surface region (first region). Furthermore, the relationship between the surface roughness of the rough surface region (first region) and the smooth region (second region) may be such that the surface roughness of the rough surface region (first region) is 1.2 times or more than the surface roughness of the smooth region (second region), may be 1.5 times or more, or may be 2 to 2.5 times.

[0062] Having an intermediate region 30c2, which is a rough surface area, in the outer casing 30 is effective in improving adhesion with other components. For example, when, after mounting a coil component 1 onto a substrate, the entire peripheral circuit of the coil component 1, or the entire substrate on which the coil component 1 is mounted, is further covered and sealed with an integral sealing resin, the formation of the intermediate region 30c2 on the side surfaces 30c to 30f of the outer casing 30 improves the adhesion of the integral sealing resin and increases the bonding strength.

[0063] The outer casing 30 is formed of an outer casing material containing magnetic particles and resin, and may form part of the core for the winding portion (coil) 11. The magnetic particles forming the outer casing 30 are not particularly limited, but may be ferrite or metallic magnetic material, for example. The particle size of the magnetic particles forming the outer casing 30 is not particularly limited, but may be 1 μm to 50 μm, for example. The resin forming the outer casing 30 is not particularly limited, but may be a thermosetting resin such as epoxy resin or phenolic resin, for example. When the electronic component is a coil component, the relative permeability of the outer casing 30 is not particularly limited, but may be 1 to 20000, for example.

[0064] The outer casing 30 is generally rectangular in shape, but the first to fourth sides 30c to 30f may be slightly inclined. Specifically, although not shown in the illustration, for example, the second main surface 30b may be slightly smaller (smaller in area) than the first main surface 30a, and the first to fourth sides 30c to 30f may be inclined at an acute angle with respect to the first main surface 30a. Conversely, the second main surface 30b may be slightly larger (larger in area) than the first main surface 30a, and the first to fourth sides 30c to 30f may be inclined at an obtuse angle with respect to the first main surface 30a (and at an acute angle with respect to the second main surface 30b).

[0065] Alternatively, the horizontal cross-section (cross-section in the X-axis-Y-axis plane, parallel to the first main surface 30a and the second main surface 30b) of the outer casing 30 at an intermediate position in the height direction of the coil component 1, or an intermediate region occupying a predetermined range in the height direction, may be slightly larger (larger in area) than the first main surface 30a and the second main surface 30b, and the first to fourth sides 30c to 30f may be inclined such that the cross-sectional area decreases in the direction of the first main surface 30a and the second main surface 30b, respectively, from this intermediate position or intermediate region. In other words, the first to fourth sides 30c to 30f may be configured to have a protrusion that projects outward at a specific intermediate position or intermediate region in the height direction. The intermediate position or intermediate region in the height direction where the protrusion is formed does not need to be the central position or region including the center in the height direction, but may be any position (any height) in the height direction or a region (a range in the height direction) at any height (any position).

[0066] Such inclinations (including inclinations from the convex portion toward the first main surface 30a and the second main surface 30b; the same applies hereinafter) may be selectively formed on one, two, or three of the first to fourth side surfaces 30c to 30f, or they may be formed on all of the first to fourth side surfaces 30c to 30f. Alternatively, on each side surface 30c to 30f, a portion of its height direction (vertical direction) may be inclined (the uninclined portion may be substantially perpendicular to the first main surface 30a and the second main surface 30b), or the entire side surface may be inclined.

[0067] The angle of inclination can be any angle, but in this embodiment, it is, for example, about 0.5°. Therefore, the shape of the outer casing 30 in this embodiment, that is, the shape of the coil component 1, can be considered to be substantially a rectangular parallelepiped.

[0068] Having such inclinations on the first to fourth sides 30c to 30f of the outer casing 30 is effective in facilitating the removal of the outer casing 30 from the mold or core when the outer casing 30 is molded using a mold or core (partition member), as will be described later. By making the inner circumferential surface of the mold or core an inclined surface, inclined surfaces corresponding to that inclined surface are formed on the first to fourth sides 30c to 30f of the outer casing 30, making it easy to remove the outer casing 30 from the mold or core.

[0069] The shape of the outer casing 30 is not limited to a roughly rectangular parallelepiped (hexahedral) shape. From the viewpoint of effective magnetic flux, it may be a prism shape such as a cylinder, or a shape that conforms to the shape of the coil section 10 (base body) it houses (for example, a prism shape such as a cylinder, hexagonal prism, or octagonal prism, or a flattened shape, etc.), or any other arbitrary shape (for example, other polyhedral shapes such as an octahedron). In the case of a prism shape, the first principal surface (base) 30a and the second principal surface (top) 30b may not be congruent, such as a frustoconical shape.

[0070] It should be noted that the "frustoconical shape in which the first principal surface (base) 30a and the second principal surface (top) 30b are not congruent" referred to here differs from the "shape in which the sides are slightly inclined, for example, by about 0.5°, and can be considered substantially as a rectangular prism" mentioned above. Instead, it refers to a shape in which the first to fourth sides 30c to 30f are more significantly inclined, making it inappropriate to consider it as a rectangular prism. On the other hand, each of the various forms mentioned above can take the form having the "sides that are slightly inclined, for example, by about 0.5°" mentioned above.

[0071] The pair of electrodes 40a and 40b are the connection points between the coil section 10 (base body) as the functional component body and the external circuit. In this embodiment, the electrodes 40a and 40b, and the pair of leads 20a and 20b, are conductors led out from the coil section 10 and are electrically connected to the winding section 11. In the coil section 10 of this embodiment, the electrodes 40a and 40b are constructed by leading out both ends of a flat wire that forms the winding section 11 of the coil section 10 as a pair of leads 20a and 20b from the coil section 10 (from the covering section 12), leading out to the outside from the outer casing 30, bending outside the outer casing 30, and arranging along the outer casing 30.

[0072] As shown in Figure 1B, electrodes 40a and 40b each have side mounting portions 40a1 and 40b1 and surface mounting portions 40a2 and 40b2, respectively. One electrode 40a is installed in an L-shape spanning the first side surface 30c and the first main surface 30a of the outer casing 30, with the surface mounting portion 40a2 positioned on the first main surface 30a and the side mounting portion 40a1 positioned on the first side surface 30c. The other electrode 40b is installed in an L-shape spanning the third side surface 30e and the first main surface 30a of the outer casing 30, with the surface mounting portion 40b2 positioned on the first main surface 30a and the side mounting portion 40b1 positioned on the third side surface 30e.

[0073] As a result, the mounting surface portions 40a2 and 40b2 of electrodes 40a and 40b form the mounting surface 1a of the coil component 1. In addition, the side mounting portions 40a2 and 40b2 of electrodes 40a and 40b can be used as areas where fillets of solder or the like are formed when the coil component 1 is connected to the substrate with solder or the like.

[0074] The pair of electrodes 40a and 40b may simply be arranged along the outer surface of the outer casing 30, or they may be joined to the outer surface of the outer casing 30. The coil component 1 according to this disclosure has such a configuration.

[0075] Next, the method for manufacturing the coil component 1 according to this disclosure will be described with reference to Figures 2 to 5A. Figure 2 is a flowchart illustrating the method for manufacturing the coil component 1.

[0076] First, multiple coil sections 10 are prepared as electronic component bodies (step S1). Each individual coil component 1 has one coil section 10 and a pair of leads 20a, 20b extending from the coil section 10, as described above. However, in the manufacturing method of this embodiment, as shown in Figures 3A1 and 3A2, the coil sections 10 are prepared in the form of an assembly 100 in which multiple coil sections 10 are connected by a connecting conductor section 200. Figure 3A1 is a view of the assembly 100 from the side (positive X-axis direction), and Figure 3A2 is a so-called plan view of the assembly 100 from above in the Z-axis direction.

[0077] The connecting conductor section 200 is cut in a later process and becomes a pair of leads 20a and 20b led out from the coil section 10, ultimately becoming a pair of electrodes 40a and 40b. By integrating one lead 20a and the other lead 20b of adjacent coil sections 10 into a single connecting conductor section 200, an assembly 100 is constructed in which multiple coil sections 10 are sequentially connected in the Y-axis direction via the connecting conductor section 200, as shown in Figures 3A1 and 3A2.

[0078] Therefore, in the assembly 100, the length of the connecting conductor portion 200 is approximately equal to the sum of the lengths of the pair of electrodes 40a and 40b in the coil component 1 and the thicknesses of the first side surface 30c and the third side surface 30e of the outer casing 30 from which the pair of electrodes 40a and 40b in the coil component 1 are derived. However, it may be slightly longer to account for deformation when the connecting conductor portion 200 is cut.

[0079] In this embodiment, the assembly 100 is installed on the lower partition member 520, which will be described later with reference to Figure 5A, to manufacture the coil component 1. For this reason, the assembly 100 in this embodiment has a configuration in which four coil sections 10 are formed in a series via a connecting conductor section 200, and four of these assemblies 100 are used simultaneously to manufacture the coil component 1.

[0080] Furthermore, in each assembly 100, the length of the connecting conductor portion 200 at the end of the coil portion 10 located at both ends is approximately half the length of the connecting conductor portion 200 that connects the two coil portions 10, since there is no other coil portion 10 to connect to. That is, it is approximately equal to the sum of the length of one electrode of the coil portion 10 located at its end (either one or the other of the pair of electrodes 40a and 40b) and the thickness of either the first side surface 30c or the third side surface 30e of the outer casing 30 from which the electrode is exposed when the coil component 1 is manufactured.

[0081] Once the assembly 100 is prepared, the lower partition member 520 is installed in the mold to form a base body placement space 502 (Figures 3D1, 3D2) for resin sealing the coil section 10 (step S2). An example of the lower partition member 520 is shown in Figure 5A.

[0082] As shown in Figure 3D1, the lower partition member 520, together with the upper partition member 540 which is installed on top of the lower partition member 520, constitutes the partition member 500. The partition member 500 is a member for molding the outer casing 30 of the coil component 1. The partition member 500 is divided by partition wall portions 501 and defines a grid-like base body arrangement space 502 in a plan view, and a conductor portion arrangement space 503 which is continuously formed on both sides of the base body arrangement space 502 in a predetermined direction. The base body arrangement space 502 is a bottomless cylindrical space and may be arranged in a matrix along the X and Y axes. The conductor portion arrangement space 503 is formed inside the partition wall portions 501 which are arranged between adjacent base body arrangement spaces 502.

[0083] In a partition member 500 with such a configuration, formed by a lower partition member 520 and an upper partition member 540, the lower partition member 520 forms the lower space for the base components 532 and the lower space for the conductor components 533, which are approximately half of the lower part of each of the aforementioned spaces. Therefore, the HB of the lower partition member 520 is approximately half the height H (Figure 1D) of the outer casing 30 of the coil component 1. Note that the base component space 502, the lower space for the base components 532 which is approximately half of the lower part thereof, and the upper space for the base components 552 which is approximately half of the upper part thereof may all be referred to as partition spaces (502, 532, 552).

[0084] As shown in Figure 5A, the lower partition member 520 has lower partition wall portions 521 arranged in a grid pattern in a plan view. The lower partition wall portions 521 include a lower partition wall portion 522 that covers the entire height and a lower wall portion 523 for conductor arrangement. The bottomless cylindrical space enclosed by the lower partition wall portions 521 is the lower space 532 for conductor arrangement where the coil portion (basic body) 10 of the coil component 1 is arranged. Multiple lower spaces 532 for conductor arrangement may be arranged in a matrix pattern along the X and Y axes.

[0085] The lower partition wall section 522 is a wall section having the same height as the thickness (height) HB of the lower partition member 520. Multiple lower partition wall sections 522 are arranged in the X-axis direction at predetermined intervals WN2, so as to extend in the Y-axis direction. The lower partition wall sections 522 are also arranged so as to connect the ends of the multiple lower partition wall sections 522 that extend in the Y-axis direction and the X-axis direction, respectively, to both ends of the lower partition member 520 in the Y-axis direction. The lower partition wall sections 522 arranged at both ends in the Y-axis direction and both ends in the X-axis direction constitute the outer periphery frame of the lower partition member 520.

[0086] Furthermore, each of the concave spaces extending in the Y-axis direction, enclosed by the lower-side partition wall portions 522 at both ends in the Y-axis direction and the adjacent lower-side partition wall portions 522 extending in the Y-axis direction, becomes the lower assembly arrangement space 531 where the assembly 100 is placed. Also, the distance WN2 between the adjacent lower-side partition wall portions 522 extending in the Y-axis direction is equal to the size (length) of the coil component 1 (outer casing 30) in the X-axis direction, that is, the length between the second side surface 30d and the fourth side surface 30f of the outer casing 30 from which the electrodes 40 are not drawn out.

[0087] In the space 531 below each assembly, a lower wall section 523 for conductor arrangement is installed to connect adjacent lower partition wall sections 522 that extend in the Y-axis direction.

[0088] In each assembly lower space 531, the space between adjacent conductor section lower wall sections 523, 523 is a bottomless cylindrical partition space, which is the space below the base body arrangement space 502 where the coil section 10 of the assembly 100 is arranged and the outer casing 30 is formed to surround the coil section 10, i.e., the base body lower space 532. Therefore, the spacing LN2 of the conductor section lower wall sections 523 in each assembly lower space 531 is equal to the size (length) of the outer casing 30 of the coil component 1 in the Y-axis direction, i.e., the length between the first side surface 30c and the third side surface 30e from which the electrodes 40a and 40b of the outer casing 30 are drawn out.

[0089] The thickness (height) HN3 of the conductor section lower wall section 523, which is installed to connect adjacent full-height lower partition wall sections 522, is lower by a predetermined height HN4 than the thickness (height) HB of the lower partition member 520. As a result, the space on the upper surface of the conductor section lower wall section 523 is recessed relative to the upper surface of the full-height lower partition wall section 522 that forms the periphery of the assembly lower space 531, and this space becomes the conductor section lower space 533 on which the connecting conductor section 200 of the assembly 100 is placed.

[0090] As mentioned above, the depth of the space 533 below the conductor arrangement is the difference HN4 between the thickness HB of the lower partition member 520 (the total height of the lower partition wall portion 522) and the thickness HN3 of the lower wall portion 523 where the conductor arrangement is located. This depth HN4 is preferably approximately half the thickness of the connecting conductor portion 200 of the assembly 100 (for example, tc in Figure 1D), or slightly greater than the thickness of the connecting conductor portion 200. However, the depth HN4 of the space 533 below the conductor arrangement may be less than the thickness of the connecting conductor portion 200.

[0091] Furthermore, the thickness HN3 of the lower wall portion 523 of the conductor arrangement is greater than the distance H4 between the lower surface 220a of the connecting conductor portion 200 that connects the coil portion 10 and the lower surface 10a of the coil portion 10, as shown in Figure 3A1.

[0092] By forming it in this way, when the assembly 100 is placed in the lower space 531 for assembly arrangement, the height position of the assembly 100 is defined by the fact that the connecting conductor portion 200 is placed in contact with the upper surface of the lower wall portion 523 for conductor arrangement, and a gap is created between the lower surface of the assembly 100 and the bottom surface of the lower partition member 520 (which subsequently becomes the position of the bottom surface of the lower mold 610). As a result, when the exterior material that forms the exterior body 30 is filled, the exterior material also enters the lower surface of the coil portion 10, and the entire surface of the coil portion 10 is covered by the exterior body 30.

[0093] The length LN3 in the Y-axis direction of the space 533 below each conductor arrangement is approximately equal to the combined length of the pair of electrodes 40a and 40b in the coil component 1, since the connecting conductor portion 200 placed in the space 533 below the conductor arrangement is cut to form a pair of electrodes 40a and 40b. However, it may be slightly longer or slightly shorter.

[0094] In the installation step S2 of the lower partition member 520, the lower partition member 520 with such structure is placed in the cavity of the lower mold 610 as shown in Figure 3B. As a result, a plurality of assembly arrangement lower spaces 531 corresponding to the structure of the lower partition member 520 described above are formed in the cavity of the lower mold 610, referring to Figure 5A. Each assembly arrangement lower space 531 has a plurality of basic body arrangement lower spaces 532 and a conductor arrangement lower space 533. The basic body arrangement lower spaces 532, which were bottomless cylindrical, have their bottoms closed by the bottom surface 610b of the lower mold 610, forming a bottomed basic body arrangement lower space 532. The lower partition member 520 may be fixed to the lower mold 610 using adhesive sheets, adhesives, or mechanical means, magnetic means, etc., as needed.

[0095] Once the lower partition member 520 is installed in the lower mold 610, the assembly 100 is placed in the assembly placement lower space 531 located in the cavity of the lower mold 610, as shown in Figure 3B, in order to place the coil section (base body) 10 in the base body placement lower space (partition space) 532 (step S3). The assembly 100 is placed in the assembly placement lower space 531 (Figure 5A) of the lower partition member 520, as shown in Figure 3C, such that the connecting conductor section 200 is placed in the conductor section placement lower space 533 and the coil section 10 is placed in the base body placement lower space 532. As described above with reference to Figure 5A, the lower partition member 520 in this embodiment has multiple (four) assembly placement lower spaces 531, so multiple (four) assemblies 100 corresponding to these spaces are prepared and placed in each assembly placement lower space 531.

[0096] At this time, the thickness HN3 of the lower wall portion 523 of the conductor arrangement is greater than the distance H4 between the lower surface of the connecting conductor portion 200 of the assembly 100 and the lower surface of the coil portion 10. As shown in Figure 3C, a gap 532a is formed between the lower surface 10a of the coil portion 10 and the bottom surface 610b of the lower mold 610. The gap 532a is filled with exterior material in a later process.

[0097] Once the multiple assemblies 100 are each placed in the respective space 531 below the lower partition member 520, the upper partition member 540 is placed on top of the lower partition member 520 on which the assemblies 100 are installed, as shown in Figure 3D1 (step S4).

[0098] In this embodiment, the upper partition member 540 is a member with the same structure as the lower partition member 520, but is positioned in the opposite orientation to the lower partition member 520 so as to contact the assembly 100 (and the lower partition member 520) from above. As described above, the upper partition member 540 together with the lower partition member 520 constitutes the partition member 500, forming a matrix of multiple element arrangement spaces 502 and a conductor arrangement space 503 within the partition wall portion 501. The upper partition member 540 forms the upper element arrangement space 552 and the conductor arrangement space 553, which are approximately the upper half of each of these spaces.

[0099] Since the upper partition member 540 has the same configuration as the lower partition member 520, the aforementioned lower partition wall portion 521 corresponds to the upper partition wall portion 541, the overall height lower partition wall portion 522 corresponds to the overall height upper partition wall portion 542, the conductor portion lower wall portion 523 corresponds to the conductor portion upper wall portion 543, the assembly lower space 531 corresponds to the assembly upper space 551, the base body lower space 532 corresponds to the base body upper space 552, and the conductor portion lower space 533 corresponds to the conductor portion upper space 553.

[0100] Furthermore, the thickness (height) of the upper partition member 540 and the upper partition wall portion 542 is the same as the thickness (height) HB of the lower partition wall portion 522 and the lower partition member 520, the spacing in the X-axis direction of the upper partition wall portion 542 is the same as the spacing WN2 in the X-axis direction of the lower partition wall portion 522, the spacing in the Y-axis direction of the upper wall portion 543 where the conductor portion is arranged is the same as the spacing LN2 in the Y-axis direction of the lower wall portion 523 where the conductor portion is arranged, the thickness (height) of the upper wall portion 543 where the conductor portion is arranged is the same as the thickness HN3 of the lower wall portion 523 where the conductor portion is arranged, the length in the Y-axis direction of the upper space 553 where the conductor portion is arranged is the same as the length LN3 in the Y-axis direction of the lower space 533 where the conductor portion is arranged, and the depth of the upper space 553 where the conductor portion is arranged is the same as the depth HN4 of the lower space 533 where the conductor portion is arranged.

[0101] In the installation step of the upper partition member 540 (step S4), the upper partition member 540 is installed on top of the lower partition member 520 such that the upper partition wall portion 542 of the entire height abuts against the upper surface of the lower partition wall portion 522 of the entire height, the upper space 552 for the base body arrangement communicates with the lower space 532 for the base body arrangement, and the upper space 553 for the conductor arrangement is positioned opposite the lower space 533 for the conductor arrangement. If the cavity of the lower mold 610 has an internal shape that is substantially the same as the external shape of the lower partition member 520 and the upper partition member 540, and the depth of the cavity of the lower mold 610 is substantially the same as the height of the partition member 500 (at least higher than the height H of the lower partition member 520), then by fitting the upper partition member 5402 into the cavity of the lower mold 610, the upper partition member 540 can be easily aligned and superimposed on the lower partition member 520.

[0102] As mentioned above, the depth of the lower space 533 for conductor arrangement in the lower partition member 520 and the depth of the upper space 553 for conductor arrangement in the upper partition member 540 are approximately half the thickness tc of the connecting conductor portion 200 of the assembly 100 (Figure 1D). Therefore, as shown in Figure 3D1, when the lower space 533 for conductor arrangement and the upper space 553 for conductor arrangement are arranged opposite each other, the lower surface 200b and upper surface 200a of the connecting conductor portion 200 of the assembly 100 are in approximate contact with the upper surface of the lower wall portion 523 for conductor arrangement and the lower surface of the upper wall portion 543 for conductor arrangement.

[0103] On the other hand, as shown in Figure 3D2, the width WN2 of the conductor arrangement space 503 (the distance in the X-axis direction between the partition wall portions 501 extending in the Y-axis direction) is sufficiently large compared to the width of the connecting conductor portion 200. Therefore, in the conductor arrangement space 503, a gap 504 around the conductor portion is formed on both sides of the connecting conductor portion 200.

[0104] After the upper partition member 540 is placed on top of the lower partition member 520, the exterior material 300 is then filled into the space formed in the cavity of the lower mold 610 by the lower partition member 520 and the upper partition member 540 (partition member 500) (step S5). The exterior material 300 is filled into the base body arrangement space 502 and the conductor arrangement space 503 of the partition member 500, as shown in Figures 3E1 and 3E2.

[0105] The exterior material 300 is filled into each element placement space 502 so as to cover and house the coil portion 10, except for the portion from which the connecting conductor portion 200 is led out. That is, in the element placement space 502, as shown in Figure 3E1, the exterior material 300 is filled between the lower surface 10a of the coil portion 10 and the bottom surface 610b of the lower mold 610, and also so as to cover the upper surface 10b of the coil portion 10. Also, as shown in Figure 3E2, the exterior material 300 is filled between the first to fourth side surfaces 10c to 10f of the coil portion 10 and the partition wall portions 521 and 541 of the partition member 500.

[0106] Furthermore, in the conductor section arrangement space 503, as shown in Figure 3E2, the exterior material 300 fills the entire width of the lower partition wall section 522 (Figure 5A), except for the area through which the connecting conductor section 200 passes, that is, it also fills the gap 504 around the conductor section. Since the lower surface 200b and upper surface 200a of the connecting conductor section 200 are in substantially contact with the upper surface of the lower wall section 523 and the lower surface of the upper wall section 543, the exterior material does not penetrate the top and bottom of the connecting conductor section 200, or if it does, only a small amount.

[0107] As the exterior material 300, a fluid material is used. For example, as the exterior material 300, a composite magnetic material containing a binder such as a thermoplastic resin or a thermosetting resin and magnetic particles (magnetic filler) is used.

[0108] After filling with the exterior material 300, the filled exterior material 80 is then compressed and hardened (step S6). Specifically, as shown in Figure 3F, an upper mold 620 is prepared, and the exterior material 300 is compressed and hardened at a predetermined mold temperature for a predetermined time using the lower mold 610 and the upper mold 620. As a result, the exterior material 300 filled in each of the element placement spaces 502 of the partition member 500 is compressed and hardened, forming an exterior body 30 that covers the coil portion 10. In addition, the exterior material 300 filled in the conductor portion placement space 503, as explained with reference to Figure 3E2, is also compressed and hardened, and is formed on an exterior body extension 320 (Figure 3H2) that is connected to the exterior body 30 and arranged along the conductor portion placement space 503 formed between the element placement spaces 502.

[0109] Once the outer material 300 has been compressed and solidified, the outer material 300 that covers and houses the coil portion 10 is removed from the base body placement space 502 (step S7). That is, the assembly 100 covered with the outer material 300 is removed from the molds 610 and 620. As a result, as shown in Figure 3G, a molded product is obtained in which the assembly 100 having the coil portion 10 and the connecting conductor portion 200 is covered with the outer material 30 and the outer material extension portion 320 (Figure 3H2).

[0110] Next, after removing the assembly 100 covered with the exterior material 300 (exterior body 30) from the molds 610 and 620, the assembly 100 is separated into individual coil parts 10 (step S8). Separation is performed by cutting the connecting conductor part 200 and the exterior body extension part 320 with a cutting tool 660 at an intermediate position (cutting position) 660y of each coil part 10, which has the exterior body 30 formed around it, as shown in Figures 3H1 and 3H2.

[0111] Figure 4A is a view of the individualized molded body 15 from the end face side (negative Y-axis direction) of the cut connecting conductor portion 200. As shown in Figure 4A, in the individualized molded body 15, the lead 20 (one lead 20a) extends in the Y-axis direction from the outer casing 30 that covers and houses the coil portion 10 (Figure 1C). In addition, an outer casing extension portion 320 is formed with approximately the same thickness as the lead 20 and approximately the same width as the width WN2 of the outer casing 30, and is approximately the same length as the lead 20. The outer casing extension portion 320 is formed on both sides in the width direction of the lead 20 on the first side surface 30c and the third side surface 30e of the outer casing 30 of the individualized molded body 15 (Figure 4A shows the first side surface 30c), extending to the positions of both side surfaces 30c and 30f of the outer casing 30.

[0112] Once such individual molded bodies 15 are obtained, the leads 20 are bent to form electrodes 40 (step S9). In the electrode formation step, as shown in Figure 4B, a pair of leads 20a and 20b are bent along the outer surface of the outer casing 30 in the direction of the first main surface 30a of the outer casing 30. As a result, the pair of leads 20a and 20b are formed into pull-out portions 23, 23 from which the pair of leads 20a and 20b (a pair of electrodes 40a and 40b) are pulled out from the outer casing 30, side mounting portions 40a1 and 40a2 which are positioned along the first side surface 30c or third side surface 30e of the outer casing 30, and mounting surface mounting portions 40a2 and 40b2 which are both positioned along the first main surface 30a of the outer casing 30.

[0113] When the pair of leads 20a and 20b are bent in this manner, the outer casing extensions 320, 320 that were formed along the pair of leads 20a and 20b are broken off and removed from the outer casing 30 and the pair of leads 20a and 20b. At this time, the area of ​​the outer casing 30 where the outer casing extensions 320 were formed becomes a fracture surface, and this fracture surface becomes the intermediate region 30c2, 30e2, which is the rough surface region of the first side surface 30c and the third side surface 30e.

[0114] As described above, the exterior extension 320 was formed on both sides in the width direction of the lead 20, extending over the entire width of the exterior 30, with approximately the same thickness as the lead 20, on both the first side surface 30c and the third side surface 30e of the exterior 30. Therefore, the intermediate regions 30c2 and 30e2, which are fracture surfaces of the exterior extension 320, were also formed on both sides in the width direction of the lead 20, extending over the entire width of the exterior 30, with approximately the same thickness as the lead 23, on both the width direction of the lead 23, on both the width direction of the lead 23, 23.

[0115] Furthermore, by forming intermediate regions 30c2 and 30e2 on the first side surface 30c and the third side surface 30e of the outer casing 30 in this manner, the upper surface 1b (second main surface 30b of the outer casing 30) of the intermediate regions 30c2 and 30e2 on the first side surface 1c (first side surface 30c of the outer casing 30) and the third side surface 1e (third side surface 30e of the outer casing 30) of the coil component 1 forms the upper region 30c1, and the mounting surface 1a (first main surface 30a of the outer casing 30) forms the lower region 30c3.

[0116] The surface roughness of these upper region 30c1 and lower region 30c3 is approximately the same as the surface roughness of the side surface of the upper wall portion 543 of the conductor portion arrangement that defines the upper space 552 of the upper partition member 540, and is at least smoother than the surface roughness of the intermediate region 30c2 formed by the fracture of the outer casing extension portion 320.

[0117] By bending a pair of leads 20a and 20b in this manner to form a pair of electrodes 40a and 40b, the coil component 1 described with reference to Figures 1 to 1D is manufactured.

[0118] In the method for manufacturing electronic components according to this embodiment, a rough surface region can be formed on the side surfaces 1c and 1e of the coil component 1 by bending a pair of leads 20a and 20b, so that a rough intermediate region 30c2 can be easily formed on the outer surface of the coil component 1.

[0119] Second Embodiment Method for Manufacturing Electronic Components (Coil Components) In the first embodiment, a coil component 1 was manufactured using an assembly 100 in which a plurality of coil parts (base bodies) 10 were connected by a connecting conductor part 200. However, a coil component 1 can also be manufactured in the same manner as in the first embodiment using a plurality of electronic component bodies, each of which has a pair of leads 20a and 20b led out from an individual coil part 10. A method for manufacturing such a coil component 1 will be described below as the second embodiment of this disclosure. In the description of the second embodiment, the same processing content and configuration as in the first embodiment will be shown using the same reference numerals, and their explanation will be omitted.

[0120] In the manufacturing method of the electronic component of the second embodiment, in the basic body preparation step (step S1), a plurality of component bodies are prepared, each having a pair of leads 20a and 20b led out from an individual coil section 10, as shown in Figure 6A.

[0121] Furthermore, in the manufacturing method of the electronic component according to the second embodiment, in the lower partition member installation step (step S2), the lower partition member 560 shown in Figure 5B is installed in the lower mold 610. In the lower partition member 560 shown in Figure 5B, the conductor portion arrangement space (503) of the lower partition member (520) of the first embodiment is separated into a first conductor portion arrangement space 505a and a second conductor portion arrangement space 505b by a conductor portion partition portion 565 that extends in a direction perpendicular to the direction in which the connecting conductor portion (200) extends (X direction) and is installed in the center of the direction in which the connecting conductor portion (200) extends (Y direction). In the lower partition member 560, the first conductor portion arrangement space 505a is the portion on which one lead 20a led out from the coil portion 10 is placed, and the second conductor portion arrangement space 505b is the portion on which the other lead 20b led out from the coil portion 10 is placed. The other components of the lower partition member 560 are the same as those of the lower partition member 520 in the first embodiment shown in Figure 5A.

[0122] Figure 6B shows the state in which the coil portion 10, as shown in Figure 6A, is arranged with respect to the lower partition member 560 in the basic body arrangement process S3. As shown in Figure 6B, the electronic component body, each having a coil portion 10 and a pair of leads 20a and 20b, is appropriately arranged with respect to the lower partition member 560 in the following configuration: the coil portion 10 is placed in the lower basic body arrangement space 532, and the pair of leads 20a and 20b are placed in the first conductor arrangement space 505a and the second conductor arrangement space 505b, respectively.

[0123] The upper partition member 570 used in the manufacturing method of the second embodiment is a member with the same structure as the lower partition member 560, and is installed in the opposite orientation to the lower partition member 560 so as to be in contact with the lower partition member 560 from above.Therefore, although not shown in the figures, the conductor partition portion 565 of the lower partition member 560 is positioned to face the conductor partition portion 565 of the upper partition member 570, which has the same configuration.Similar to the partition member 500 consisting of the lower partition member 520 and the upper partition member 540 of the first embodiment, the lower partition member 560 and the upper partition member 570 can accommodate multiple electronic component bodies, each having a coil portion 10 and a pair of leads 20a and 20b, in their base body arrangement space 502, first conductor portion arrangement space 505a, and second conductor portion arrangement space 505b.

[0124] In this manner, once the electronic component body is housed, the process of filling with outer material (step S5), compression molding and solidification (step S6), and demolding (step S7) is performed, similar to the first embodiment. As a result, in the manufacturing method of the second embodiment, a molded body 15 as shown in Figure 6C can be obtained without performing the individual piece formation step (step S8) in the manufacturing method of the first embodiment. Then, the lead is bent on the obtained molded body 15, similar to the first embodiment (step S9). As a result, the outer material extension portion 320 (Figure 4A) is broken and removed, and rough intermediate regions 30c2 and 30e2 are formed on the first side surface 30c and the third side surface 30e of the outer material 30, respectively, and the coil component 1 according to the present disclosure shown in Figures 1 to 1D is manufactured.

[0125] In Figure 5B, the conductor partition portion 565 of the lower partition member 560 is schematically shown as being the same height as the lower partition wall portion 522. However, the conductor partition portion 565 may be slightly lower than the lower partition wall portion 522. This allows a gap to be created between the lower partition member 560 and the upper partition member 570 at the location of the conductor partition portion 565 when the lower partition member 560 and the upper partition member 570 are stacked, providing a function similar to the conductor perimeter gap 504 in the partition member 500 of the first embodiment. That is, by forming such a gap, it becomes easier to allow the exterior material 300 to flow through the internal space of the partition member during the filling process (process S5) or the compression molding and solidification process (process S6), making it possible to fill the entire internal space of the partition member with the exterior material 300 without any gaps.

[0126] In the manufacturing method of the electronic component according to this second embodiment, compared to the manufacturing method of the first embodiment, the step of separating the assembly 100 covered and molded with the exterior material 300 into individual pieces (step S8) is unnecessary, thus simplifying the manufacturing process. The manufacturing method of the electronic component according to this disclosure may be carried out by such a method.

[0127] The electronic components and methods for manufacturing electronic components relating to this disclosure are not limited to the embodiments described above, and any suitable modifications can be made as appropriate.

[0128] Figure 7A of the first modified electronic component (coil component) is a view of the individualized molded body 715 for manufacturing the coil component 2 according to the modified version of this disclosure, as seen from the end face side (negative Y-axis direction) of the connecting conductor portion cut in the individualization process S8 (Figure 2), and corresponds to Figure 4A according to the first embodiment.

[0129] In the coil component 2 (individually molded body 715), the winding portion 11 of the coil portion 10 (Figure 1C, etc.) and a pair of leads 720 drawn out from the winding portion 11 have a configuration in which a conductor 721 and an insulating coating layer 722 covering the conductor 721 are made. In the individually molded body 715, the leads 720 thus formed may be bent in the lead bending process S9 (Figure 2) in the same manner as in the first embodiment, and further, electrodes may be formed on the mounting surface 1a of the coil component 2 by peeling off the coating layer 722 of the leads 720 arranged along the mounting surface 1a (first main surface 30a of the outer casing 30). The present disclosure may be implemented in such a form.

[0130] Second Modification of Electronic Component (Coil Component) In the coil component 1 of the above-described embodiment, the intermediate region 30c2 of the first side surface 1c and the third side surface 1e was formed as a rough surface with a rougher surface roughness than the other outer surfaces of the casing 30. However, a rough surface with a rough surface roughness may also be formed on the other outer surfaces of the casing 30.

[0131] In the coil component 3 shown in Figure 7B, the first main surface 30a of the outer casing 30, which is a different surface from the first side surface 30c and the third side surface 30e where the intermediate region 30c2 (, 30e2) is formed, is formed on a surface (third region) that is rougher than the other outer circumferential surfaces that are not rough surfaces (the upper region 30c1 and lower region 30c3 of the first side surface 30c and the third side surface 30e, the second main surface 30b, the second side surface 30d, and the fourth side surface 30f).

[0132] The first main surface 30a of the outer casing 30 is the surface on which the mounting surface portions 40a2 and 40b2 of the pair of electrodes 40a and 40b are arranged. By forming the first main surface 30a as such a rough surface, the adhesion of the mounting surface portions 40a2 and 40b2 to the first main surface 30a can be improved, for example, by using an adhesive.

[0133] The first main surface 30a, which serves as the rough surface of the coil component 3 shown in Figure 7B, can be formed, for example, by roughening the surface of the lower mold 610 in the compression molding process S6 (Figure 2). When bending the pair of leads 20a and 20b, which will become a pair of electrodes 40a and 40b (process S9), the adhesion of the mounting surface portions 40a2 and 40b2 can be improved by bending the pair of leads 20a and 20b in the direction of the first main surface 30a formed on the rough surface.

[0134] Such roughened areas (third areas) can be selectively formed on any other area of ​​the outer surface of the outer casing 30. That is, a desired area corresponding to the roughened area (third area) can be formed as a roughened surface within the bottom surface of the lower mold 610, the lower surface of the upper mold 620, and the inner circumferential surface of the base body arrangement space 502 of the partition member 500. The present disclosure may be implemented in such a form.

[0135] Figure 7C of the third modified example of the electronic component (coil component) shows a coil component 4 according to the modified example of the present disclosure. In the coil component 4, burrs 734 are formed on the ridge portion where the first main surface 30a and the second side surface 30d meet, and on the ridge portion where the first main surface 30a and the third side surface 30f meet. The burrs 734 are strip-shaped portions of a predetermined width with a rough surface roughness.

[0136] Burrs 734 are formed, for example, on the ridges of the outer surface of the outer body 30 when the solidified outer material 300 is broken and the outer body 30 is removed in the process of removing the outer body 30 from the partition member 500 (release process S7 (Figure 2)). More specifically, for example, in the molding process S6 (Figure 2), a gap may be formed between the upper surface of the upper partition member 540 and the lower surface of the upper mold 620 to increase the fluidity of the outer material 300. In such cases, when removing the solidified outer body 30 (the assembly 100 covered and molded with the outer material 300) from the upper partition member 540, punching may be performed using a punch with a shape approximately equal to the shape of the upper space 553 (conductor space 503) where the conductor is arranged. At this time, surface marks as cut surfaces due to deformation and tearing of the material caused by the punch, i.e., burrs, are formed in a predetermined range of the opening circumferential surface on the side where the punch is driven in or the side where the punch is removed. Whether or not burrs are formed depends on the shape of the punch (such as the play between the upper partition member 540 and the punch) and the processing conditions.

[0137] In such a coil component 4, a burr 734 is provided as a rough surface on a part of the outer surface of the outer casing 30, thereby improving the bonding and adhesion when joining the coil component 4 to other external components or when resin-encapsulating the entire circuit including the coil component 4. The present disclosure may be implemented in this form.

[0138] Fourth Modification of Electronic Component (Coil Component) In the above-described embodiment, the electrodes (40a, 40b) of the coil component were configured such that, for example as shown in Figure 1B, they were extended from the outer casing 30 on the opposing first side surface 30c and third side surface 30e of the coil component 1, bent along the outer surface of the outer casing 30, and their mounting surface mounting portions 40a1, 40b1 were arranged to extend toward the center from opposing positions on the first main surface 30a of the outer casing 30 (the mounting surface 1a of the coil component 1). However, the arrangement of the electrodes can be any configuration, and for example, they may be arranged as shown in Figure 7D.

[0139] In the coil component 5 shown in Figure 7D, the pair of electrodes 740a and 740b are both drawn out from the first side surface 30c of the outer casing 30. The drawn-out electrodes 740a and 740b are bent along the first side surface 30c and the first main surface 30a to form L-shaped electrodes having side mounting portions 740a1 and 740b1 and mounting surface mounting portions 740a2 and 740b2. Furthermore, in the electrodes 740a and 740b of the coil component 5, the mounting surface mounting portions 740a2 and 740b2 are each formed over the entire Y-axis area of ​​the first main surface 30a of the outer casing 30. That is, the mounting surface mounting portions 740a2 and 740b2 are formed to be sufficiently longer than the mounting surface mounting portions 40a2 and 40b2 of the pair of electrodes 40a and 40b of the coil component 1.

[0140] In a coil component 5 having such a pair of electrodes 740a and 740b, since the pair of electrodes 40a and 40b are led out from one surface (first side surface 30c) of the outer surface of the outer casing 30, the mounting area of ​​the coil component 5 can be reduced, which is effective in miniaturizing the device. Furthermore, since the mounting surface mounting portions 740a2 and 740b2 are sufficiently long, reliable and stable electrical connection can be made to electrodes of external circuits, etc. This disclosure may be implemented in such a form.

[0141] Fifth Modified Example of an Electronic Component (Coil Component) Another coil component 6 according to this disclosure is shown in Figures 7E1 and 7E2. The coil component 6 has a coil portion (base body) 710, an outer casing 30, and a pair of electrodes 770a and 770b. The coil portion 710 has a configuration in which a substrate 750 and a coil conductor 760 are provided inside the covering portion 12. The pair of electrodes 770a and 770b each have mounting surface portions 770a1 and 770b1 and side mounting portions 770a2 and 770b2, respectively.

[0142] The substrate 750 is a flat plate-like member having a roughly elliptical annular planar shape, and is positioned approximately in the center of the height direction of the outer casing 30 such that its major axis direction is in the direction opposite to the first side surface 30c and the third side surface 30e of the outer casing 30 (Y-axis direction). Both ends of the substrate 750 in the major axis direction are exposed from the first side surface 30c and the third side surface 30e of the outer casing 30.

[0143] The coil conductor 760 has a first coil portion 761 provided on the upper side of the substrate 750, a second coil portion 762 provided on the lower side of the substrate 750, and a connecting portion (not shown) that connects the first coil portion 761 and the second coil portion 762 via a through-hole (not shown) in the substrate 750. One end of the first coil portion 761 (the end not connected to the second coil portion 762 by the connecting portion) is exposed from the first side surface 30c of the outer casing 30, and one end of the second coil portion 762 (the end not connected to the first coil portion 761 by the connecting portion) is exposed from the third side surface 30e of the outer casing 30.

[0144] The covering portion 12 of the coil portion 710 encloses and houses most of the substrate 750 and coil conductor 760, similar to the embodiments described above. However, as shown in Figure 7E2, both ends of the substrate 750 and coil conductor 760 are led out from outside the covering portion 12. Therefore, the ends of the first coil portion 761 and the second coil portion 762 leading out from the covering portion 12 correspond to the pair of leads 20a and 20b in the embodiments described above. In the coil component 6, the ends of the first coil portion 761 and the second coil portion 762 exposed on the first side surface 30c and the third side surface 30e of the outer casing 30 correspond to the lead-out portion 23.

[0145] Unlike the embodiments described above, in the coil component 6, the conductor portion forming the coil conductor 760 does not constitute a pair of electrodes 40a and 40b. The pair of electrodes 770a and 770b of the coil component 6 are formed by separately connecting external electrode members to the lead-out portions 23 of the coil conductor (conductor portion) 760 exposed on the outer surface of the outer casing 30, that is, to the ends of the first coil portion 761 and the second coil portion 762.

[0146] The electrode members are formed, for example, by machining a conductive metal plate, but the method for forming the pair of electrodes 770a and 770b is not particularly limited. The material of the electrode members is not particularly limited as long as it is a conductive metallic material, for example, iron, nickel, copper, silver, or alloys containing these can be used. In addition, a metal coating of Ni, Sn, Cu, etc. may be formed on the surface of the electrode members.

[0147] The pair of electrodes 770a and 770b may be formed on the outer casing 30 by plating instead of being metal plate-shaped electrode members. In this case, the pair of electrodes 770a and 770b are composed of a laminated electrode film consisting of, for example, a base electrode film and a plating film formed on the base electrode film. The base electrode film is not particularly limited, but is, for example, a conductive paste film containing a metal such as Sn, Ag, Ni, Cu or an alloy thereof. The plating film is not particularly limited, but is, for example, a metal such as Sn, Au, Ni, Pt, Ag, Pd or an alloy thereof.

[0148] The pair of electrodes 770a and 770b may be formed by removing the exposed substrate 750 and the ends of the coil conductor 760 from the individual molded body after the sealing molding process S6 (Figure 2) or release process S7 of the outer casing 30, along with the outer casing extension, exposing the end face of the coil conductor 760 on the outer surface of the outer casing 30, and then installing the electrode members (metal plate material or plating film, etc.) constituting the electrodes 770a and 770b on the exposed end face of the coil conductor 760. The present disclosure may be implemented in such a form.

[0149] Sixth Modification of Electronic Component (Coil Component) In each of the embodiments described above, for example as shown in Figure 1A, the rough surface region (first region), which has a rougher surface roughness than other areas of the outer surface of the casing 30, was formed in the intermediate region 30c2 of the region obtained by dividing the first side surface 30c and the third side surface 30e of the casing 30 into three regions along the direction from the second main surface 30b to the first main surface 30a. That is, the rough surface region (first region) was formed on both sides in the width direction of the lead portion 23 (the portion in which the lead 20 led out from the coil portion 10 is led out or exposed to the outside from the casing 30) which has a predetermined width and thickness, and was continuous in the width direction with respect to the lead portion 23 (the portion in which the lead 20 led out from the coil portion 10 is led out or exposed to the outside from the casing 30).

[0150] However, the rough surface region (first region) may be formed on both sides of the thickness direction of the pull-out portion 23, continuously in the thickness direction of the pull-out portion 23, on the first side surface 730c and the third side surface 730e of the outer casing 730, as shown in the coil component 7 in Figure 7F. In this case, the first side surface 30c and the third side surface 30e of the outer casing 730 may be divided into three regions along the direction from the fourth side surface 30f to the second side surface 30d, namely the first side region 730c1, the second side region 730c2, and the third side region 730c3, with the intermediate region, the second side region 730c2, being designated as the rough surface region (first region).

[0151] The rough surface region (first region), which is the second side surface region 730c2, is formed along a direction parallel to the height direction of the coil component 7, in the thickness direction of the pull-out portion 23, continuous with the connecting portion 23, and extends over the entire area of ​​the first side surface 30c on both sides of the connecting portion 23. The width of the second side surface region 730c2 is approximately the same as the width of the connecting portion 23, or slightly wider (larger) than the width of the connecting portion 23. However, the width of the second side surface region 730c2 may be narrower (smaller) than the width of the connecting portion 23. The present disclosure may be implemented in such a form.

[0152] In the embodiment described above with reference to Figure 5A, which shows the first modified example of the method for manufacturing electronic components (coil components), a lower partition member 520 was used, which had a lower partition wall portion 521 having a total height lower partition wall portion 522 and a conductor portion arrangement lower wall portion 523. This created a lower space 532 for arranging the base body where the coil portion 10 of the assembly 100 is arranged, and a lower space 533 for arranging the conductor portion where the connecting conductor portion 200 of the assembly 100 is arranged, within the cavity of the lower mold 610 (Figure 3c).

[0153] However, as shown in Figure 8A, the lower mold 630 may have the same configuration as the wall portion 521 of the lower partition member 520. That is, a wall portion 631 is formed on the bottom surface of the lower mold 630, having a wall portion 631a corresponding to the lower partition wall portion (522) of the entire height of the lower partition member (520) and a wall portion 631b corresponding to the lower wall portion (523) of the conductor portion arrangement of the lower partition member (520). In this way, a lower space 632 for the base body arrangement where the coil portion 10 of the assembly 100 is arranged, and a lower space 633 for the conductor portion arrangement where the connecting conductor portion 200 of the assembly 100 is arranged are formed within the cavity of the lower mold 630.

[0154] By manufacturing electronic components using such a lower mold 630, the amount of material used in manufacturing can be reduced, thereby simplifying the manufacturing method and lowering costs. The manufacturing method of the present disclosure may be implemented in such a form.

[0155] A second modified example of the method for manufacturing electronic components (coil components) is that it is also possible to manufacture electronic components by the method according to this disclosure without forming a lower space for arranging the base body (532 (Figure 3D1), 632 (Figure 8A)) or a lower space for arranging the conductor part (533 (Figure 3D1), 633 (Figure 8A)) in the lower mold 610.

[0156] In other words, as shown in Figures 8B1 and 8B2, by using an assembly 180 in which multiple coil sections 10 are connected by a connecting conductor section 280 whose central part is bent so that it passes at the same low position as the lower surface 10a of the coil section 10, the coil component 8 can be manufactured without using a lower partition member and using a normal lower mold without walls.

[0157] In this case, as shown in Figure 8B1, the upper partition member 580 is provided with a wall portion having a height approximately equal to the height of the coil component 8 (molded body 815) as the total height upper partition wall portion 582, and a member is used that has a wall portion having a height that is lower than the coil component 8 (molded body 815) by the height of the connecting conductor portion 280 as the upper wall portion 583 for conductor arrangement.

[0158] By using such an upper partition member 580, as shown in Figure 8B1, the assembly 180 can be housed in the mold cavity in such a way that the lower position of the connecting conductor portion 280 is sandwiched between the lower wall portion 583 of the upper partition member 580 where the conductor portion is arranged and the bottom surface 610b of the lower mold 610. The other steps are the same as described above, and a molded body 815 (Figure 8B2) can be obtained in which the periphery of the coil portion 10 is covered by the outer casing 30.

[0159] Once a continuous mass of molded bodies 815 as shown in Figure 8B2 has been formed, each molded body 815 can be separated into individual pieces by cutting the central part of the connecting conductor portion 280, and the coil component 9 can be manufactured by bending the cut connecting conductor portion 280.

[0160] In the coil component 8 shown in Figures 8B1 and 8B2, when the assembly 180 is placed in the mold, the lower surface 10a of the coil portion 10 is in contact with the bottom surface 610b of the lower mold 610. Therefore, in the coil component 8 (molded body 815), the lower surface 10a of the coil portion 10 is exposed on the mounting surface (without an outer casing). The present disclosure may be implemented in this form.

[0161] However, if the mounting surface of the coil component 8 is also to be covered with the outer casing, the assembly 180 can be configured such that the lowest position of the connecting conductor portion 280 is even lower than the lower surface 10a of the coil portion 1. With this configuration, when the assembly 180 is placed in the lower mold 610, the lower surface 10a of the coil portion 10 will be raised from the bottom surface 610b of the lower mold 610, making it possible to interpose the outer casing material even further below the lower surface 10a of the coil portion 10. The present disclosure may be implemented in this form.

[0162] Third Modification of Method for Manufacturing Electronic Components (Coil Components) In the above-described embodiment, for example, when positioning the assembly 100 in the lower space 531 of the lower partition member 520, positioning can be achieved by transporting and positioning the assembly 100 using a controlled transport machine. However, a positioning projection may be formed on the connecting conductor portion 200 of the assembly 100, and this projection may be engaged with the lower partition member to position the assembly 100.

[0163] For example, as shown in Figure 8C1, when the connecting conductor portion 200 is placed on the lower wall portion 523 of the lower partition member 520 where the conductor portion is arranged, a positioning projection 231 may be formed on the connecting conductor portion 200 at a position on the side of the lower space 533 where the conductor portion is arranged, which is the boundary between the lower wall portion 523 and the lower space 533 where the conductor portion is arranged. With this configuration, when the assembly 100 is positioned, the positioning projection 231 will come into contact with the side of the lower wall portion 523 of the lower partition member 520, thereby enabling proper positioning of the assembly 100.

[0164] Furthermore, as shown in Figure 8C2, a positioning projection 232 may be formed approximately in the center of the connecting conductor portion 200, and a recess (locking portion) 591 may be formed on the upper surface of the lower wall portion 523 of the conductor arrangement of the lower partition member 590 (the bottom surface of the lower space 533 of the conductor arrangement) into which the positioning projection 232 can engage. With such a configuration, when the assembly 100 is positioned, the positioning projection 232 engages with the locking portion 591 on the upper surface of the lower wall portion 523 of the conductor arrangement of the lower partition member 590, thereby enabling proper positioning of the assembly 100. The present disclosure may be implemented in this form.

[0165] Other Modifications This disclosure is not limited to the embodiments or modifications described above, and various other modifications are possible at will.

[0166] For example, in the embodiments described above, a coil was used as an example of an electronic component element. However, the electronic component element is not limited to a coil, but can be applied to any electronic functional component, in other words, various active or passive components. Specifically, for example, a polymer aluminum capacitor may be used as the element. Furthermore, it is also possible to apply the present disclosure by considering a circuit unit containing multiple elements as a single electronic component, that is, as the element according to the present disclosure.

[0167] 1-8... Coil components (electronic components) 1a, 3a... Mounting surface (bottom surface), 1b... Top surface, 1c-1f... 1st to 4th side surfaces 10, 710... Coil section (base body) 10a... Bottom surface, 10b... Top surface, 10c-10f... 1st to 4th side surfaces 11... Winding section 12... Sealing section 15, 715, 815... Molded body 20a, 20b (20), 720... Lead (conductor section) 21... Internal lead (internal conductor section) 22... External lead (external conductor section, electrode) 23... Connection section 721... Conductor, 722... Coating layer 30... Outer casing 30a... Bottom surface (1st main surface), 30b... Top surface (2nd main surface), 30c-30f... 1st to 4th side surfaces 30c1... Upper region (smooth region (1st region)) 30c2...Intermediate region (rough surface region (second region)) 30c3...Lower region (smooth region (first region)) 730c1...Side first region (smooth region (first region)) 730c2...Side second region (rough surface region (second region)) 730c3...Side third region (smooth region (first region)) 734...Burr 40a, 40b (40), 740a, 740b, 770a, 770b...Electrodes 40a1, 40b1, 740a1, 740b1, 770a1, 77b1...Side mounting portion 40a2, 40b2, 740a2, 740b2, 770a2, 77b2...Surface mounting portion 100, 180...Assembly 200, 280...Connecting conductor portion 220a...Bottom surface, 220b...Top surface 231, 232...Positioning protrusions 300...Exterior material 320...Exterior body extension 500...Partition member 520, 560, 590...Lower partition member, 540, 570, 580...Upper partition member 501...Partition wall section, 521...Lower partition wall section, 541...Upper partition wall section 522...Lower partition wall section of total height, 542, 582...Upper partition wall section of total height 523, 631...Lower wall section for conductor arrangement, 543, 583...Upper wall section for conductor arrangement 531...Lower space for assembly arrangement, 551...Upper space for assembly arrangement 502...Elemental body arrangement space (partition space), 532, 632...Lower space for elementary body arrangement, 552...Upper space for elementary body arrangement 503... Conductor arrangement space, 533, 633... Lower conductor arrangement space,553...Space above the conductor section 504...Gap around the conductor section 565...Partition section between conductor sections 505a...Space for the first conductor section 505b...Space for the second conductor section 600...Mold 610, 630...Lower mold 610b...Bottom surface (top surface) 620...Upper mold 660...Cutting tool 660y...Cutting position

Claims

1. A method for manufacturing an electronic component, comprising the steps of: preparing a base body from which a conductor portion is derived; arranging the base body in a partitioned internal space defined by a boundary portion such that the base body is placed in the partitioned internal space and a portion of the conductor portion is placed at the boundary portion; filling the partitioned internal space in which the base body is placed and the conductor portion placement space at the boundary portion in which a portion of the conductor portion is placed with an exterior material; solidifying the exterior material to form an exterior body surrounding the base body in the partitioned internal space, and forming an exterior body extension portion in the conductor portion placement space that is connected to the exterior body and arranged along the conductor portion placement space; and removing the exterior body from the partitioned internal space.

2. The method for manufacturing an electronic component according to claim 1, wherein in the step of preparing the base body, an assembly is prepared including a plurality of base bodies and a conductor portion that connects the plurality of base bodies to each other; in the step of arranging the base bodies, the base bodies are arranged in each of the plurality of internal spaces of the compartments, and the assembly is arranged such that a part of the conductor portion that connects the plurality of base bodies to each other passes through the conductor portion arrangement space at the boundary; and in the step of removing the outer casing, the outer casing that surrounds each of the plurality of base bodies is removed from the plurality of internal spaces of the compartments.

3. The method for manufacturing an electronic component according to claim 2, further comprising the step of separating the outer casing into individual pieces by cutting the conductive parts that connect the base bodies to each other after forming the outer casing.

4. The method for manufacturing an electronic component according to any one of claims 1 to 3, wherein the extension of the outer casing is removed together with the outer casing and the conductor.

5. The method for manufacturing an electronic component according to claim 4, further comprising the step of removing the outer casing extension and forming an outer conductor portion which is the portion of the conductor that extends outward from the outer casing.

6. The method for manufacturing an electronic component according to claim 5, wherein at least a portion of the extension of the outer casing is broken off and removed from the outer casing by bending the portion of the conductor that extends outward from the outer casing, and the outer conductor is formed as an electrode.

7. A method for manufacturing an electronic component according to any one of claims 1 to 3, further comprising the steps of removing the outer casing extension and the conductor portion extending outward from the outer casing, exposing the end face of the conductor portion to the outer surface of the outer casing, and installing electrode members constituting electrodes on the exposed end face of the conductor portion.

8. The method for manufacturing an electronic component according to any one of claims 1 to 3, wherein the exterior material is filled into the conductor portion arrangement space at the same time as, or after, the interior space of the compartment is filled, and the exterior material solidifies and adheres to the conductor portion arranged in the conductor portion arrangement space to form the exterior extension.

9. The method for manufacturing an electronic component according to claim 8, wherein the conductor portion has a cross-sectional shape defined by a predetermined width and a predetermined thickness in the thickness direction perpendicular to the width direction, the width of the conductor portion arrangement space is longer than the width of the conductor portion, and the thickness of the conductor portion arrangement space is substantially the same as or greater than the thickness of the conductor portion.

10. A method for manufacturing an electronic component according to any one of claims 1 to 3, wherein, in the step of removing the exterior body from the internal space of the compartment, the solidified exterior material is broken and the exterior body is removed, thereby forming a burr on a predetermined location on the surface of the exterior body.

11. A method for manufacturing an electronic component according to any one of claims 1 to 3, comprising the steps of forming the internal space of the compartment in a mold, arranging the base body from which the conductor portion is led out, filling with the exterior material, and solidifying the exterior material, wherein at least a portion of the inner surface of the mold is made rough, thereby forming a rough surface on at least a portion of the surface of the exterior body.

12. The method for manufacturing an electronic component according to any one of claims 1 to 3, wherein the boundary portion is composed of at least two partition members arranged in the depth direction of the internal space of the compartment, and the conductor portion arrangement space is formed by sandwiching the portion of the conductor portion with at least two of the partition members.

13. A method for manufacturing an electronic component according to any one of claims 1 to 3, wherein the plurality of compartmental internal spaces are formed within recesses of a mold, the boundary portion is composed of a partition member arranged in the depth direction of the compartmental internal space, and the conductor portion arrangement space is formed by sandwiching the conductor portion between the bottom surface of the recess and the partition member.

14. The method for manufacturing an electronic component according to claim 12, wherein the conductor portion has a positioning projection, and the positioning projection is engaged with the partition member to position the element from which the conductor portion is led out relative to the internal space of the partition.

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