Method for processing decomposition target and system for processing decomposition target
Patent Information
- Application Number
- PCT/JP2026/012869
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-28
- Filing Date
- 2026-03-27
- Publication Date
- 2026-10-01
Smart Images
Figure JP2026012869_01102026_PF_FP_ABST
Abstract
Description
Method and system for treating a substance to be decomposed
[0001] The present invention relates to a method and a system for treating a substance to be decomposed.
[0002] Conventionally, the method described in Patent Document 1 is known as a method for decomposing organic fluorine compounds. Further, the method described in Patent Document 2 is known as a method for adsorbing organic fluorine compounds.
[0003] Japanese Patent Application Laid-Open No. 2011-157314, Japanese Patent Application Laid-Open No. 2024-139775, Japanese Patent No. 7138356
[0004] Treatment of substances to be decomposed such as organic fluorine compounds has become an increasingly important issue from the viewpoints of environmental persistence and environmental load.
[0005] The inventors have conducted intensive studies on the treatment of substances to be decomposed, and as a result, have found that the substance to be decomposed can be suitably decomposed by irradiation with laser light.
[0006] That is, one of the objects of the present invention is, for example, to provide a novel method and system for treating a substance to be decomposed using laser light.
[0007] The method for treating a substance to be decomposed according to the present invention comprises, for example, the steps of: conveying an object to be treated, in which a base material and a content containing the substance to be decomposed are integrated, to a predetermined treatment region; and decomposing the substance to be decomposed by irradiating laser light onto the object to be treated conveyed to the treatment region.
[0008] The method for treating a substance to be decomposed may further comprise a step of adjusting the object to be treated to a predetermined thickness before the step of decomposing the substance to be decomposed.
[0009] The method for treating a substance to be decomposed may further comprise a step of smoothing the surface of the object to be treated that is irradiated with the laser light before the step of decomposing the substance to be decomposed.
[0010] The method for treating a substance to be decomposed may further comprise a step of integrating the base material and the content containing the substance to be decomposed to produce the object to be treated before the step of decomposing the substance to be decomposed.
[0011] The method for processing the decomposition target may include a step of concentrating the decomposition target in the product to be processed, which was generated in the step of generating the product to be processed, before the step of decomposing the decomposition target.
[0012] In the method for processing the object to be decomposed, the laser beam may be irradiated in an oxygen-free state, a low-oxygen state such that a dust explosion of the object to be processed does not occur, or in an inert gas state during the decomposition step.
[0013] In the method for processing the object to be disassembled, in the step of disassembling the object to be disassembled, multiple beams of laser light may be scanned on the surface of the object to be processed.
[0014] In the aforementioned method for processing the object to be decomposed, a beam shaper may be used to split a single laser beam into the multiple beams.
[0015] In the method for processing the object to be disassembled, in the step of disassembling the object to be disassembled, the spot may be rotated on the surface around a rotation center while the rotation center is moved linearly.
[0016] In the method for processing the object to be disassembled, in the step of disassembling the object to be disassembled, laser light may be successively irradiated onto the multiple first objects into which the object to be processed has been divided.
[0017] In the method for processing the object to be disassembled, laser light may be irradiated onto the strip-shaped object to be processed during the step of disassembling the object to be disassembled.
[0018] In the method for processing the object to be disassembled, laser light may be irradiated onto the object to be processed while it is stationary during the step of disassembling the object to be disassembled.
[0019] In the method for processing the object to be disassembled, laser light may be irradiated onto the object to be processed while it is in motion during the step of disassembling the object to be disassembled.
[0020] In the method for processing the decomposition target, the processing target may contain an additive that generates radicals in the step of decomposing the target.
[0021] The processing system for a material to be disassembled according to the present invention comprises, for example, a transport mechanism for transporting a workpiece including the material to be disassembled to a predetermined processing area, and a disassembly device for disassembling the material by irradiating the workpiece transported to the processing area with laser light.
[0022] The processing system for the object to be decomposed may include an integrated processing device that integrates the base material and the object to be decomposed to produce the processed object.
[0023] The processing system for the object to be disassembled includes a preprocessing device that performs a predetermined preprocessing on the object to be processed before the object to be disassembled by the disassembly device, and the preprocessing may include a process to bring the object to be processed to a predetermined thickness.
[0024] In the processing system for the material to be decomposed, the decomposition apparatus may perform the decomposition of the material to be decomposed in an oxygen-free state, a low-oxygen state such that a dust explosion of the material to be processed does not occur, or in an inert gas.
[0025] According to the present invention, for example, it is possible to provide a novel method for processing a decomposition target using laser light and a system for processing a decomposition target.
[0026] Figure 1 is an exemplary schematic configuration diagram of the processing system for disassembling an object according to the embodiment. Figure 2 is a flowchart showing an example of the procedure for processing an object according to the embodiment. Figure 3 is an exemplary cross-sectional view showing the schematic configuration of a disassembly processing device included in the processing system for disassembling an object according to the embodiment. Figure 4 is an exemplary cross-sectional view showing the schematic configuration of the optical head of the disassembly processing device included in the processing system for disassembling an object according to the embodiment. Figure 5 is an explanatory diagram showing the concept of the principle of the diffractive optical element included in the optical head of Figure 4. Figure 6 is a schematic plan view showing an example of the spot pattern of the laser beam output from the optical head of the disassembly processing device included in the processing system for disassembling an object according to the embodiment on the surface of the object to be processed. Figure 7 is a schematic plan view showing another example of the spot pattern of the laser beam output from the optical head of the disassembly processing device included in the processing system for disassembling an object according to the embodiment on the surface of the object to be processed. Figure 8 is a schematic plan view showing an example of the change in the processing area on the surface of the object to be processed in the disassembly processing device included in the processing system for disassembling an object according to the embodiment. Figure 9 is an exemplary cross-sectional view showing the schematic configuration of a disassembly processing device included in a processing system for disassembling an object according to another embodiment.
[0027] Illustrative embodiments of the present invention are disclosed below. The configurations of the embodiments shown below, as well as the actions and results (effects) brought about by such configurations, are examples only. The present invention can also be realized by configurations other than those disclosed in the following embodiments. Furthermore, according to the present invention, it is possible to obtain at least one of the various effects (including derived effects) that can be obtained by the configuration.
[0028] Furthermore, in this specification, ordinal numbers are assigned for convenience to distinguish items to which they are assigned, and do not indicate priority, order, or limit the number of items.
[0029] In addition, directions are sometimes defined by arrows labeled X, Y, and Z in the diagram. The X, Y, and Z directions intersect and are also orthogonal to each other.
[0030] [Substances to be decomposed] In this specification, substances to be decomposed are, for example, persistent substances. Persistent substances include persistent organic pollutants (POPs). Persistent organic pollutants are POPs as defined in the POPs Convention (Stockholm Convention on Persistent Organic Pollutants). POPs are a general term for chemical substances that are difficult to decompose in the environment, readily accumulate in living organisms, and have high mobility and diffusion. The Convention defines specific PFAS as chemical substances that are regulated for being persistent, highly bioaccumulative, mobile over long distances, and harmful to humans and living organisms. Specific PFAS include perfluorooctanesulfonic acid (PFOS), perfluorooctanoic acid (PFOA), perfluorohexanesulfonic acid (PFHxS) (and their salts and related substances), etc. These PFAS, PFOS, PFOA, and PFHxS are also examples of organofluorine compounds. In this specification, the substances to be decomposed also include other recalcitrant substances (chemical substances that are difficult to decompose in the natural environment) besides those mentioned above. Furthermore, "fluorine and its compounds," which are water quality standard items stipulated in the "Ministerial Ordinance Concerning Water Quality Standards" (Ministry of Health, Labour and Welfare Ordinance No. 101 of 2003) issued by the Ministry of Health, Labour and Welfare of Japan, are substances in which fluorine is bonded to inorganic substances such as sodium, and are different from organofluorine compounds in which fluorine is bonded to carbon (organic matter).
[0031] The criteria for easily degradable and difficult-to-degradable substances are based on the following criteria described in the "Test Methods and Criteria for Determining New Chemical Substances and Determining Applicability to Monitoring Chemical Substances" (April 13, 2018) established by the government. Specifically, substances that meet the following conditions (1) and (2) are classified as easily degradable substances, and substances that do not meet the conditions (1) and (2) are classified as difficult-to-degradable substances. (1) When conducted in three test containers, the degree of degradation by BOD must be 60% or higher in two or more containers, and the average of the three containers must be 60% or higher. (2) When conducted in two test containers, the average degree of degradation by BOD must be 60% or higher, and the degree of degradation by BOD must be 60% or higher in all containers, or the difference between the maximum and minimum degree of degradation must be less than 20%. In making the above determinations, it must also be confirmed that no degradation products have been generated by direct analysis methods such as HPLC and GC. If the test results obtained using the test method specified in the notification do not meet the above criteria, a comprehensive judgment may be made by considering test results other than the degree of decomposition by BOD. Furthermore, if the BOD curve or other indicators suggest that biodegradation continues after the end of the test (e.g., an upward trend), a judgment may be made based on the test results according to OECD Test Guideline 302C.
[0032] Furthermore, the substances to be decomposed are not limited to recalcitrant substances. The substances to be decomposed may be flame-retardant, or they may be organic compounds containing, for example, silicon or fluorine.
[0033] [Processing System for Disassemblable Objects] Figure 1 is a diagram showing the schematic configuration of the processing system 10 for disassemblable objects according to the embodiment. As shown in Figure 1, the processing system 10 for disassemblable objects comprises an integration processing device 100, a pre-processing device 200, a disassembly processing device 300, and a post-processing device 400.
[0034] Figure 2 is a flowchart showing an example of the processing procedure by the processing system 10 for the decomposition target of the embodiment.
[0035] [Integration Process] As shown in Figure 2, first, in the integration processing apparatus 100, the contents containing the decomposition target and the base material are integrated to produce the product to be processed (S1). The integration processing apparatus 100 performs a process such as that shown in Patent Document 3, that is, a process in which the contents are adsorbed onto the base material. Examples of the base material include activated carbon, porous material (e.g., zeolite), ion exchange resin, etc. The integration process is not limited to adsorption, and may also be an integration process based on other chemical or physical actions, or an integration process in an ionized state.
[0036] [Integration process according to base material] Base materials can generally be broadly classified into powder and granular forms. Activated carbon is defined as follows in the Japanese Industrial Standard (JIS K 1474): Powdered activated carbon (PAC): very fine (0.15 mm or less) Granular activated carbon (GAC): relatively large (greater than 0.15 mm) Granular activated carbon is generally about 1 to 10 mm in size and includes pellet activated carbon.
[0037] When the base material is in powder form, the particles are smaller compared to when it is in granular form, which has the advantage of making it easier to increase processing efficiency during laser irradiation in the decomposition process described later. In addition, it has high processability and is easy to process into a size and shape suitable for laser irradiation in the shape modification process described later. Therefore, it also has the advantage of making it easier to increase processing efficiency in the decomposition process. As a specific method for integration when the base material is in powder form, for example, one method is to put the base material into a raw water tank containing the contents and agitate and adsorb the contents to be decomposed onto the base material. In this case, the raw water may be filtered using a filter containing an activated carbon layer. However, it should be noted that when the base material is in powder form, dewatering in the concentration process described later is more labor-intensive than with granular material, and machinery such as a dewatering device may be required.
[0038] On the other hand, when the base material is granular, it has the advantage of making solid-liquid separation in the concentration process described later easier compared to when the base material is powdered. It also has the advantage of being easier to handle in the integration process. A specific method for integration when the base material is granular is, for example, to fill a container such as a box with the base material, put raw water containing the contents into the container, and allow the contents to be decomposed to be adsorbed onto the filled base material. In this case, the raw water may have undergone the pretreatment described later. However, it should be noted that surface irregularities are more likely to occur compared to when the base material is powdered, and variations in energy density may occur during laser irradiation.
[0039] [Pre-processing] Next, the workpiece generated in the integrated processing device 100 in S1 is transported to the pre-processing device 200, where it undergoes predetermined pre-processing (S2).
[0040] [Concentration Treatment, Morphological Change Treatment] In S2, as a pretreatment, for example, a treatment to concentrate the contents of the material to be treated or a treatment to change its morphology may be performed. If the material to be treated is in the air, as a pretreatment, for example, powdering or dissolution may be performed. If the material to be treated is in a liquid, as a pretreatment, for example, solid-liquid separation (solid extraction), dehydration, coagulation using a flocculant, adsorption using an adsorbent, centrifugation, viscosification treatment, impurity removal may be performed. Furthermore, if the material to be treated is a solid powder, granules, or small lumps, impurity removal, compression to a predetermined shape, agglomeration, coagulation using a coagulant, adhesion using a binder, etc. may be performed.
[0041] Dehydration can be carried out using, for example, a belt press, a centrifugal separator, a screw press, or a multi-disc type apparatus. To improve the efficiency of the laser irradiation process, the overall moisture content of the material to be treated 1 is preferably 80% or less, and more preferably 50% or less. The lower the moisture content, the more efficient the decomposition process can be. The moisture content of the base material, such as activated carbon, is approximately 10%.
[0042] [Shaping Process] In S2, as a pre-processing step, for example, a shaping process may be performed to adjust the shape of the object to be processed. As such a pre-processing step, for example, a process may be performed to set the thickness (height in the Z direction) of the object to be processed 1 (see Figure 3) to a predetermined value. Specifically, a process may be performed to flatten the object to be processed 1 (see Figure 3) so that its thickness falls within a predetermined range. As such a pre-processing step, for example, a process may be performed to smooth the upper surface 1a (see Figure 3) of the object to be processed 1. Other pre-processing steps may be performed, for example, a process to set the width (width in the Y direction) of the object to be processed 1 to a predetermined value, a process to shape the object to be processed 1 into a strip of predetermined thickness and width, or a process to divide the object to be processed 1 into processing units 1A (processing unit 1A in S4) of predetermined size as shown in Figure 3. The predetermined size of processing unit 1A can be defined, for example, by volume, weight, height, width, and length (length in the X direction). Processing unit 1A is an example of the first material to be processed and may also be called a divided body. The preprocessing device 200 may include, for example, rollers, a rolling mill, a crusher, a pulverizer, a cutter, a screw feeder, an extruder, etc.
[0043] [Conveyance of Object to be Processed] Next, the object to be processed that has undergone pretreatment in S2 (see FIG. 2) is conveyed into the chamber of the decomposition treatment apparatus 300 (S3). FIG. 3 is a cross-sectional view of a decomposition treatment apparatus 300A (300). The conveyance mechanism 340 is, for example, a conveyor. In the example of FIG. 3, the conveyance mechanism 340 has a plurality of conveyors in the vicinity of the decomposition treatment apparatus 300. Each conveyor conveys the object 1 to be processed, respectively, and can move back and forth in the X direction, respectively. With this configuration, only the part (conveyor) of the conveyance mechanism 340 located inside the decomposition treatment apparatus 300 can be configured to have high heat resistance, and the other parts (conveyors) can be configured to have low heat resistance. It is preferable that at least the conveyance mechanism or support member located in the chamber, or the conveyance mechanism capable of entering the chamber, has a structure with high heat resistance. In this case, the portion that becomes high temperature due to irradiation with the laser beam L can be made of a material with high heat resistance such as stainless steel material, heat-resistant metal, heat-resistant alloy, ceramics, or carbon. Note that in the example of FIG. 3, only the conveyor located inside the decomposition treatment apparatus 300 may be configured to be movable back and forth in the X direction. Further, the conveyance mechanism 340 may convey the decomposed object 2 to be processed out of the chamber of the decomposition treatment apparatus 300. Note that the conveyance mechanism 340 is not limited to the configuration shown in FIG. 3, and may have a conveyance arm such as a robot arm, or may have a plurality of conveyance mechanisms of different types, for example.
[0044] [Decomposition Treatment] Next, in the decomposition treatment apparatus 300, the laser beam L is emitted from the optical head 310 toward the upper surface 1a of the object 1 to be processed, whereby the object to be decomposed is decomposed (S4). The position of the object 1 to be processed irradiated with the laser beam L is the treatment area. The decomposition treatment apparatus 300 forms a chamber for decomposition treatment by the housing 301, and a treatment area is formed in the chamber. In the example of FIG. 3, the laser beam L is irradiated in a state where the object 1 to be processed is stationary in the chamber, that is, in the treatment area. The upper surface 1a is an example of a surface irradiated with the laser beam L. The decomposition treatment will be described in detail later.
[0045] [Post-processing] Next, the material to be processed 1, which was decomposed in S4 (Figure 2), is subjected to post-processing in the post-processing device 400 (S5). As part of the post-processing, for example, the material to be processed 1, which was decomposed in the decomposition device 300 in S4, is separated into reprocessed material, exhaust gas, and residue (see Figure 3). Here, exhaust gas and residue refer to materials that have been reduced in volume or detoxified to meet the prescribed standards stipulated by laws and regulations and are in a state where they can be discharged. The reprocessed material is returned to the integrated processing device 100, the pre-processing device 200, or the decomposition processing device 300, depending on its state, and is processed again in each respective device. Note that reprocessed material may also be generated from the pre-processing device 200.
[0046] [Disassembly Processing Device] As shown in Figure 3, the housing 301 is provided with an opening 301o for loading or unloading the object to be processed 1. The housing 301 is provided with a shutter 302 that can open and close the opening 301o. The housing 301 is also provided with an intake port 301i and an exhaust port 301e. An inert gas, such as nitrogen, is supplied from the intake port 301i. Exhaust gas containing fumes is discharged from the exhaust port 301e. The exhaust gas is sent to the post-processing device 400.
[0047] In this specification, "decomposition" in the decomposition processing apparatus 300 refers to the phenomenon in which the material to be processed 1 is vaporized or reduced in volume by irradiation with a high-power, high-density laser beam L. In this specification, "decomposed" or "decomposed" means that the material to be decomposed is not detected in measurements after the decomposition process (so-called ND), or that its volume has been reduced to a level below the standard value stipulated by laws and regulations. Note that "decomposition" here does not mean "combustion" of the material to be processed 1. Furthermore, if the material to be processed 1 is a powder or generates powder, there is a risk of dust explosion, so it is preferable to maintain an oxygen-free state or a low-oxygen state such that combustion of the material to be processed 1 does not occur around the material to be processed 1. For this reason, an inert gas may be supplied around the material to be processed 1. The inert gas may be supplied into the chamber from the intake port 301i, or it may be supplied from the optical head 310 or a nozzle (not shown) provided on the housing 301 toward the irradiation position of the laser beam L or its vicinity.
[0048] Further, in the decomposition treatment, when the object 1 to be treated contains PFOS, the temperature of the part of the object 1 to be treated irradiated with the laser beam L reaches 850°C or higher, and when the object contains PFOA, the temperature is preferably 1000°C or higher, more preferably 1100°C or higher. Note that irradiation with the laser beam L may generate plasma inside the chamber of the decomposition treatment apparatus 300. In order to suppress the influence of plasma, the optical head 310 may be arranged at a certain distance (for example, 10 [cm] or more and 100 [cm] or less) from the object 1 to be treated.
[0049] [Optical Head] The optical head 310 is an optical device for appropriately irradiating the upper surface 1a of the object 1 to be treated with laser light input from a light source device (not shown) via an optical fiber cable 331. The upper surface 1a intersects the Z direction and is substantially orthogonal thereto. The optical head 310 outputs the laser beam L substantially along the direction opposite to the Z direction in FIG. 3. When the optical head 310 includes a laser scanner, the laser beam L may be inclined with respect to (the opposite direction of) the Z direction. However, even in this case, the average irradiation direction of the laser beam L is substantially along the direction opposite to the Z direction. The laser beam L may be irradiated while the object 1 to be treated is stationary, or may be irradiated while the object 1 to be treated is being conveyed by the conveyance mechanism 340, that is, while it is moving.
[0050] FIG. 4 is a cross-sectional view showing a schematic configuration of the optical head 310. As shown in FIG. 4, the optical head 310 includes a housing 311, a plurality of optical components 312, a connector 313, a motor 314, a rotation transmission mechanism 315, a slider 316, and the like.
[0051] The housing 311 has a substantially cylindrical shape, and houses the plurality of optical components 312 therein. In addition to the plurality of optical components 312, the housing 311 also functions as a support member that supports the connector 313, the motor 314, the rotation transmission mechanism 315, the slider 316, and the like.
[0052] A window member 311a that transmits the output laser light L is attached to the end of the housing 311. The housing 311 is also provided with a passage 311b through which refrigerant supplied from a cooling device (not shown) via a refrigerant tube 333 passes. Refrigerant circulates between the cooling device and the passage 311b of the optical head 310 via the refrigerant tube 333. The part of the housing 311 that constitutes the passage 311b, the cooling device, and the refrigerant tube 333 are an example of a cooling mechanism that cools the housing 311 and, consequently, the optical component 312.
[0053] The optical components 312 include, for example, collimating lenses 312a and 312b, diffractive optical elements 312c (hereinafter referred to as DOE312c, DOE: diffractive optical element), and tuner lenses 312d.
[0054] The collimating lenses 312a and 312b collimate the laser light input via the optical fiber and connector 313. The collimated laser light becomes parallel light.
[0055] The DOE312c shapes the laser beam, which has been made parallel by the collimating lenses 312a and 312b. The DOE312c is an example of a beam shaper.
[0056] Figure 5 is an explanatory diagram illustrating the concept of the DOE312c principle. As conceptually illustrated in Figure 5, the DOE312c has a configuration in which, for example, multiple diffraction gratings 312c1 with different periods are superimposed. The DOE312c can shape the beam by bending or superimposing parallel light in the direction influenced by each diffraction grating 312c1.
[0057] By having a beam shaper such as DOE312c, the laser beam in the optical head 310 is divided into multiple beams, each with appropriately adjusted power. From the optical head 310, the laser beam L, which has multiple beams, is output in the Z direction toward the upper surface 1a, and multiple spots are formed on the upper surface 1a by these multiple beams. The spots may be spaced apart from each other or connected. The Z direction is the output direction of the laser beam L from the optical head 310 and is an example of a first direction.
[0058] The adjustment lens 312d is either a focusing lens or a diffusing lens. The adjustment lens 312d is mounted on the housing 311 so that its position along the optical axis Ax can be changed. Specifically, for example, the position of the adjustment lens 312d can be changed by a slider 316 that is manually operated outside the housing 311. The position of the adjustment lens 312d may also be adjusted by an electrically operated actuator.
[0059] Furthermore, the adjustment lens 312d is removably mounted on the housing 311. Specifically, for example, a subassembly integrating the slider 316 and the adjustment lens 312d is removably mounted on the housing 311.
[0060] With this configuration, in this embodiment, as shown in Figure 4, the laser beam L output from the optical head 310 can be enlarged or reduced, and consequently, the size of the spot formed on the upper surface 1a can be adjusted.
[0061] In this embodiment, as an example, an adjustment lens 312d, which is an optical component 312, is shown to be interchangeably (removably) attached to the housing 311. However, other optical components 312, such as a DOE 312c or collimating lenses 312a and 312b, may also be interchangeably (removably) attached to the housing 311.
[0062] Furthermore, the DOE 312c is mounted on the housing 311 so as to be rotatable around a rotation center parallel to the optical axis Ax while the laser beam L is output. In this embodiment, the rotor of the motor 314 rotates due to power supplied from a power supply device (not shown) via an electrical cable 332, and the rotation of the rotor is transmitted to the DOE 312c via a rotation transmission mechanism 315, thereby causing the DOE 312c to rotate. In this case, the rotation center of the DOE 312c may substantially coincide with the optical axis Ax, or it may be separated from the optical axis Ax. The motor 314 and the rotation transmission mechanism 315 are examples of rotation mechanisms and are also examples of movement mechanisms that move the DOE 312c relative to the housing 311. The rotation transmission mechanism 315 may also be called a reduction mechanism. In this embodiment, the motor 314 is an electric motor, but it is not limited to this and may be an air motor. In this case, the motor 314, acting as an air motor, is operated by compressed air supplied from an air supply device (not shown) mounted on the device, via an air tube (not shown) housed in the cable 330.
[0063] Furthermore, as shown in Figure 3, the disassembly processing apparatus 300 is equipped with a moving mechanism 320 that moves the optical head 310 relative to the housing 301 in a direction intersecting the Z direction. This allows the irradiation position on the upper surface 1a to be moved. Although not shown, the optical head 310 may be equipped with a laser scanner, such as a galvanometer scanner, and configured to allow the irradiation direction and irradiation position of the laser beam L to be changed.
[0064] [Disassembly Processing Conditions] Through diligent research by the inventors, it has been found that the following conditions are preferable for disassembling an object to be disassembled by irradiation with laser light. <Laser light and optical fiber> ・Output of laser light L (light source device): 1 [kW] or more and 10 [kW] or less, preferably 6 [kW] ・Wavelength of laser light L: 900 [nm] or more and 1100 [nm] or less, preferably 1060 [nm] or more and 1090 [nm] or less ・Length of optical fiber from light source device to optical head 310: 5 [m] or more and 100 [m] or less ・Core diameter of optical fiber: 10 [μm] or more and 300 [μm] or less, preferably 25 [μm] or more and 100 [μm] or less ・Type of optical fiber: Preferably multimode optical fiber ・M of optical fiber ２ Beam quality: 10 or less <Material to be processed> - Properties: Solid-containing lumps, paste, powder, liquid, etc.
[0065] [Spot Pattern] Due to the rotation of the DOE 312c described above, the spot of the laser beam L rotates on the upper surface 1a and on the upper surface 1a that is separated from the optical head 310 in the Z direction and intersects with the Z direction, around the rotation center C. In this configuration, the DOE 312c as a beam shaper splits the laser beam into multiple beams, and by further rotating the DOE 312c, spots corresponding to multiple beams can be rotated on the upper surface 1a, thereby increasing the area of the region that can be processed simultaneously on the upper surface 1a. In addition, the energy density at each position on the upper surface 1a can be set lower, which has the advantage of mitigating the thermal effects on regions deeper than the surface to be processed. Furthermore, in a pattern containing multiple spots by appropriately setting the DOE 312c, the arrangement of the multiple spots and the power of each spot can be appropriately set, thereby suppressing variations in the power density distribution on the upper surface 1a, and suppressing variations and uneven processing on the processed surface. Furthermore, simply rotating a single spot using a single beam without splitting it makes it difficult to suppress processing inconsistencies.
[0066] Figure 6 is a plan view illustrating a pattern P21 of spots S formed on the upper surface 1a. As shown in Figure 6, the pattern P21 includes multiple spots S of multiple beams of laser light L, each at a different distance from the rotation center C. The multiple spots S are arranged in a roughly cross shape in a plan view relative to the upper surface 1a. The power and size of the multiple spots S are also the same.
[0067] As the DOE312c rotates as described above, the pattern P21 rotates on the upper surface 1a around the rotation center C at a substantially constant angular velocity over time. As a result, multiple beam spots S, each with appropriately adjusted power density by the DOE312c, rotate on the upper surface 1a. Therefore, compared to, for example, a case where a single beam spot without any particular power density adjustment rotates on the upper surface 1a, variations in power density depending on the location on the upper surface 1a, and consequently variations in the processing state of the upper surface 1a depending on the location, can be suppressed.
[0068] Figure 7 is a plan view illustrating a pattern P22 of spots S formed on the upper surface 1a. Pattern P22 includes multiple spots S that rotate around a rotation center C, as well as multiple spots S at different distances from the rotation center C. In pattern P22, adjacent spots S are arranged such that the spacing i between them is greater than or equal to a predetermined distance, and the difference in distance dr (i.e., difference in radius) from the rotation center C is less than a predetermined distance. The spacing i is the distance between the centers (geometric centers) of the spots S. If the spacing i between adjacent spots S in a plurality of spots S arranged radially along the rotation center C is too short, the power density may become excessively high, potentially causing melting or damage to areas deeper than the surface layer being treated. To counter this, increasing the spacing i may cause variations in the power density distribution in the radial direction, potentially resulting in a situation where sufficiently treated areas and insufficiently treated areas alternate in a concentric pattern. Another approach is to reduce the power of each spot S without changing the spacing i between adjacent spots S. However, this may result in insufficient power for surface treatment or an increased time required to complete the required surface treatment. In this regard, pattern P22 is designed such that adjacent spots S are arranged such that the spacing i between them is greater than a predetermined distance, and the difference in distance dr from the rotation center C is smaller than the spacing i. This suppresses excessive energy density between adjacent spots S and allows for setting an appropriate power density while suppressing variations in the radial power density distribution. In other words, pattern P22 reduces uneven processing and shortens the time required for processing. Furthermore, in the example shown in Figure 7, since the spacing i between adjacent spots S is set to a constant (approximately the same) distance, the multiple spots S are arranged approximately along a spiral curve Cs where the angular difference with respect to the radial direction increases as the radial direction moves outward. Furthermore, pattern P22 includes multiple groups of spots S aligned along the curve Cs. In this case, the processing time can be reduced compared to the case where there is only one group of spots S aligned along the curve Cs.
[0069] Furthermore, when rotating the spot S pattern on the upper surface 1a, the pattern may be formed such that the power density per spot S increases as it moves away from the rotation center C, or the area of each spot S increases as it moves away from the rotation center C. In this case, the difference in power density depending on the distance from the rotation center C can be reduced, and variations in power density depending on the location on the upper surface 1a, and consequently variations in the processing state depending on the location on the upper surface 1a, can be further suppressed.
[0070] Figure 8 is a plan view showing an example of the change in the processing area on the upper surface 1a due to the optical head 310. In Figure 8, Ar indicates the irradiation area formed by the rotation of the DOE 312c, and As and A indicate the processing areas that move due to the operation of the moving mechanism 320, i.e., the movement of the optical head 310. The white arrows indicate the direction of movement of the irradiation area As. For simplicity of explanation, in the example of Figure 8, the irradiation area Ar moves linearly, but this is not the only option, and the irradiation area Ar can move along any path, including a curved path.
[0071] As shown in Figure 8, the movement mechanism 320 allows for an expansion of the irradiation area Ar formed by the rotation of the DOE 312c, making it easier to expand the irradiation areas As and A compared to the case without the movement mechanism 320. Furthermore, if a laser scanner is provided on the optical head 310, at least one of the irradiation areas Ar and As may be moved by the operation of the laser scanner alone, or by the operation of the laser scanner in conjunction with the movement mechanism 320. Such processing allows for a further expansion of the processing range.
[0072] [Another Embodiment of the Disassembly Apparatus] Figure 9 is a cross-sectional view of a disassembly apparatus 300B (300) in an embodiment different from that of Figure 3. In the example of Figure 9, the object to be processed 1 is shaped into a strip in the pre-processing apparatus 200 and transported into the chamber of the disassembly apparatus 300 by the transport mechanism 340. The laser light L may be irradiated onto the object to be processed 1 while it is being transported by the transport mechanism 340, i.e., while it is moving, or it may be irradiated while the object to be processed 1 is stationary.
[0073] [Addition of Additives] Furthermore, by adding an additive that promotes decomposition, the efficiency of the decomposition treatment on the workpiece 1 can be improved in the decomposition treatment by irradiation with laser light L. Specifically, the additive includes, for example, at least one of alkali metal hydroxides, carbonates of alkali metal hydroxides, alkaline earth metal hydroxides, or carbonates of alkaline earth metal hydroxides. Examples of alkali metal hydroxides include potassium hydroxide (KOH) and potassium carbonate (K2CO3). Examples of alkaline earth metal hydroxides include calcium hydroxide (Ca(OH)2) and calcium carbonate (CaCO3). When the workpiece 1 is irradiated with laser light L while the additive that promotes decomposition is mixed in, a thermal decomposition reaction due to the energy of the laser light L and a chemical decomposition reaction due to radicals (•OH) generated from the additive can be produced in combination. Here, the chemical decomposition reaction is a reaction that breaks the CF bond of PFAS. The additives can be added at an appropriate time before irradiating the object to be treated 1 with laser light.
[0074] [Irradiation with laser light in a low-oxygen or oxygen-free state] Furthermore, in the decomposition process by irradiation with laser light L, irradiating with laser light L in a low-oxygen or oxygen-free state can suppress the formation of intermediate products (oxides) and prevent abnormal combustion of activated carbon. This, in turn, allows for the efficient defluorination reaction through thermal decomposition to proceed. Thermal decomposition, as referred to here, is a phenomenon different from combustion. Theoretically, if thermal decomposition proceeds completely, the products obtained from each element are as follows: ・C → CO2 gas ・F → HF gas ・S → H2SO4 ・H → H2O, H2 gas ・O → H2O, O2 gas Note that for harmful gases such as HF gas, treatment equipment such as a scrubber is essential. A scrubber is an exhaust gas cleaning or exhaust gas treatment device that removes harmful gases, malodorous odors, dust, etc. emitted from factories and research facilities using water, chemicals, adsorbents, etc., purifying the air before releasing it into the atmosphere.
[0075] As described above, the decomposition system 10 of this embodiment can decompose the decomposition target by irradiating the object to be processed 1, which includes the decomposition target, with laser light L. According to this embodiment, the irradiation of laser light L can deliver energy to the decomposition target at a high density. The decomposition process according to this embodiment is a decomposition process by irradiation with laser light L. An example of a decomposition process that does not involve irradiation with laser light L is combustion. The decomposition process according to this embodiment is not a decomposition process by combustion. According to this embodiment, the decomposition target can be decomposed more efficiently and quickly compared to combustion, etc. Furthermore, the decomposition system 10 of this embodiment can be configured as a smaller-scale facility compared to incinerators that conventionally processed decomposition target materials such as difficult-to-decompose substances. Therefore, the decomposition system 10 can be easily installed in various locations, making it easier to promote the widespread use of equipment for decomposing decomposition target materials. In addition, since the decomposition process by irradiation with laser light L can be carried out at a lower temperature, for example, room temperature, compared to conventional methods, advantages such as being able to configure the equipment for performing the decomposition process more simply, less expensively, or more compactly can be obtained. Furthermore, it offers the advantage of further reducing the energy consumption required for the decomposition process.
[0076] Furthermore, the processing system 10 for the object to be disassembled may adjust the thickness of the object to be processed 1 to a predetermined thickness before disassembling the object to be disassembled. In this case, the energy of the laser beam L can be supplied more reliably to deeper locations in the object to be processed 1 while suppressing localized variations, thereby preventing the object to be disassembled from remaining undisassembled in the object to be processed 1.
[0077] Furthermore, the processing system 10 for the object to be decomposed may smooth the upper surface 1a of the object to be processed 1 before decomposing it. In this case, scattering of the laser light L on the upper surface 1a can be suppressed, which would reduce the efficiency of the decomposition process. In other words, the efficiency of the decomposition process by irradiation with laser light L can be further increased.
[0078] Furthermore, the decomposition processing system 10 may integrate the base material and the contents containing the decomposition material to produce the processed object 1. In this case, the decomposition material can be handled more easily as the processed object 1 in the decomposition processing system 10.
[0079] Furthermore, the decomposition processing system 10 may concentrate the decomposition target in the object to be processed 1 before decomposing the decomposition target. In this case, the efficiency of the decomposition process by irradiation with laser light L can be further increased.
[0080] Furthermore, the decomposition process system 10 may perform the decomposition process in an oxygen-free environment, a low-oxygen environment such that dust explosion of the object to be processed 1 does not occur, or in an inert gas environment.
[0081] Furthermore, the processing system 10 for the object to be decomposed may scan the spots of multiple beams of the laser light L on the upper surface 1a of the object to be processed during the decomposition process. In this case, the laser light L can be irradiated over a wider area on the upper surface 1a, thereby increasing the efficiency of the decomposition process compared to when scanning is not performed.
[0082] Furthermore, the decomposition processing system 10 may, in the decomposition process, split a single laser beam into multiple beams using a beam shaper. In this case, the area on the upper surface 1a that is simultaneously irradiated with laser beam L can be expanded, and variations in power density within that area can be suppressed. Therefore, the efficiency of the decomposition process by irradiation with laser beam L can be further improved.
[0083] Furthermore, the processing system 10 for the object to be disassembled may, during the disassembly process, rotate multiple spots on the upper surface 1a around a rotation center C, while moving the rotation center C linearly. In this case, the irradiation range of the laser beam L on the upper surface 1a can be expanded, thereby increasing the efficiency of the disassembly process by irradiation with the laser beam L.
[0084] Furthermore, the processing system 10 for the object to be disassembled may sequentially irradiate multiple processing units 1A into which the object to be processed 1 has been divided with laser light during the disassembly process. In this case, the disassembly process can be managed for each processing unit 1A, and the disassembly process can be carried out more reliably for each processing unit 1A.
[0085] Furthermore, the processing system 10 for the object to be disassembled may irradiate the strip-shaped object to be processed 1 with laser light during the disassembly process. In this case, the disassembly process can be carried out more quickly because it can be performed continuously.
[0086] Furthermore, the processing system 10 for the object to be disassembled may irradiate the object to be processed 1 with laser light while it is stationary during the disassembly process. In this case, the disassembly process can be carried out more reliably on the stationary object to be processed 1.
[0087] Furthermore, the disassembly processing system 10 may irradiate the object to be processed 1 with laser light while it is moving during the disassembly process. In this case, the disassembly process can be performed more quickly on a stationary object 1.
[0088] Although embodiments of the present invention have been illustrated above, these embodiments are merely examples and are not intended to limit the scope of the invention. The above embodiments can be implemented in various other forms, and various omissions, substitutions, combinations, and modifications can be made without departing from the spirit of the invention. Furthermore, each configuration, shape, and other specifications (structure, type, orientation, model, size, length, width, thickness, height, number, arrangement, position, material, etc.) can be modified as appropriate.
[0089] This invention can be used in a method for processing materials to be decomposed and a system for processing materials to be decomposed.
[0090] 1...Object to be processed 1A...Processing unit (first object to be processed) 1a...Top surface (surface) 2...Object to be processed (after disassembly) 10...Processing system (for objects to be disassembled) 100...Integration processing device 200...Preprocessing device 300, 300A, 300B...Disassembly processing device 301...Housing 301e...Exhaust port 301i...Intake port 301o...Opening 302...Shutter 310...Optical head 311...Housing (processing area) 311a...Window member 311b...Passageway 312...Optical component 312a, 312b...Collimating lens 312c...Diffraction optical element (DOE) 312c1...Diffraction grating 312d...Adjustment lens 313...Connector 314...Motor 315...Rotation transmission mechanism 316...Slider 320...Movement mechanism 330...Cable 331... Fiber optic cable 332... Electrical cable 333... Refrigerant tube 340... Transport mechanism 400... Post-processing device A, Ar, As... Irradiation area Ax... Optical axis C... Center of rotation Cs... Curve dr... Difference i... Spacing L... Laser beam P21, P22... Pattern S... Spot
Claims
1. A method for processing an object to be decomposed, comprising the steps of: transporting an object to be processed, in which a base material and a substance containing an object to be decomposed are integrated, to a predetermined processing area; and irradiating the object to be processed transported to the processing area with laser light to decompose the object to be decomposed.
2. The method for processing an object to be disassembled according to claim 1, further comprising the step of bringing the object to be processed to a predetermined thickness before the step of disassembling the object to be disassembled.
3. The method for processing an object to be disassembled according to claim 1, further comprising the step of smoothing the surface of the object to be processed that is irradiated with laser light before the step of disassembling the object to be disassembled.
4. The method for processing an object to be decomposed according to claim 1, further comprising the step of integrating the base material and the contained material including the object to be decomposed to produce the object to be processed, prior to the step of decomposing the object to be decomposed.
5. The method for processing a decomposition target according to claim 4, further comprising a step of concentrating the decomposition target in the product to be processed generated in the step of generating the product to be processed, prior to the step of decomposing the decomposition target.
6. The method for processing a material to be decomposed according to claim 1, wherein in the step of decomposing the material to be decomposed, laser light is irradiated in an oxygen-free state, a low-oxygen state such that a dust explosion of the material to be processed does not occur, or in an inert gas.
7. The method for processing an object to be disassembled according to claim 1, wherein in the step of disassembling the object to be disassembled, multiple beam spots of laser light are scanned on the surface of the object to be processed.
8. The method for processing an object to be decomposed according to claim 7, wherein a single laser beam is divided into a plurality of beams by a beam shaper.
9. The method for processing an object to be disassembled according to claim 7, wherein in the step of disassembling the object to be disassembled, the spot is rotated on the surface around a center of rotation while the center of rotation is moved linearly.
10. The method for processing an object to be disassembled according to claim 1, wherein in the step of disassembling the object to be disassembled, laser light is successively irradiated onto a plurality of first objects to be processed into which the object to be processed has been divided.
11. The method for processing an object to be disassembled according to claim 1, wherein in the step of disassembling the object to be disassembled, a laser beam is irradiated onto the strip-shaped object to be processed.
12. The method for processing an object to be disassembled according to claim 1, wherein in the step of disassembling the object to be disassembled, laser light is irradiated onto the object to be processed while it is stationary.
13. The method for processing an object to be disassembled according to claim 1, wherein in the step of disassembling the object to be disassembled, laser light is irradiated onto the object to be processed while it is in motion.
14. The method for treating a decomposition target according to claim 1, wherein the step of decomposing the decomposition target includes an additive that generates radicals in the treated material.
15. A processing system for objects to be disassembled, comprising: a transport mechanism for transporting objects to be processed, including objects to be disassembled, to a predetermined processing area; and a disassembly device for disassembling the objects to be disassembled by irradiating the objects to be processed, which have been transported to the processing area, with laser light.
16. The processing system for objects to be decomposed according to claim 15, comprising an integration processing apparatus that integrates a base material and an object to be decomposed to produce the object to be processed.
17. The processing system for objects to be disassembled according to claim 15, comprising a preprocessing device that performs a predetermined preprocessing on the object to be processed before disassembling the object to be disassembled with the disassembly device, wherein the preprocessing includes a process to make the object to be processed a predetermined thickness.
18. The decomposition apparatus performs the decomposition of the object to be decomposed in an oxygen-free state, a low-oxygen state such that a dust explosion of the object to be processed does not occur, or in an inert gas, as described in claim 15.