Edge ring, conductive member, heat conductive member, electro-conductive member, conductive sheet, heat conductive sheet, and electro-conductive sheet

Abstract

This edge ring (1) is provided with a conductive member (heat conductive sheet) (3). The conductive member (3) is an elastic body. The edge ring (1) is used in contact with a plasma resistant member (5) via the conductive member (3).

Description

Edge ring, conductive material, thermal conductive material, conductive material, conductive sheet, thermal conductive sheet, conductive sheet

[0001] The present invention relates to edge rings, conductive members, thermal conductive members, conductive members, conductive sheets, thermal conductive sheets, and conductive sheets.

[0002] Conventionally, etching equipment that uses plasma to dry etch objects has been used as semiconductor manufacturing equipment. In etching equipment, an electrostatic chuck is used to fix the object using static electricity. When etching an object with a larger surface area than the top of the electrostatic chuck, an edge ring is placed around the electrostatic chuck to achieve uniform etching. This edge ring is also heated by the plasma, and this heat may affect the properties of the object. Therefore, in Japanese Patent Publication No. 2015-62237 (JP2015-62237A), a heat transfer gas is supplied independently to the edge ring to control its thermal conductivity.

[0003] Further improvements are needed in temperature control of edge rings using heat transfer gases, as well as in electric field control of objects subjected to plasma treatment. Furthermore, novel technologies are required to improve the efficiency of plasma treatment processes for objects using edge rings.

[0004] The present invention aims to provide novel edge rings, conductive members, thermal conductive members, conductive members, conductive sheets, thermal conductive sheets, and conductive sheets that improve the process efficiency of plasma processing steps.

[0005] The edge ring of this disclosure is an edge ring equipped with a conductive member, wherein the conductive member is an elastic body, and the edge ring is used in contact with a plasma-resistant member via the conductive member.

[0006] The edge ring of this disclosure comprises a corrosion-resistant member, the corrosion-resistant member being an elastic body, and the edge ring may be used in contact with a plasma-resistant member via the conductive member and the corrosion-resistant member, respectively.

[0007] In the edge ring of the present disclosure, when the side of the edge ring on which the conductive member and the corrosion-resistant member are provided is pressed against a flat plate at a pressure of 0.1 MPa, the conductive member and the corrosion-resistant member may be in contact with the flat plate.

[0008] In the edge ring of this disclosure, the thickness of the corrosion-resistant member when uncompressed may differ from the thickness of the conductive member.

[0009] In the edge ring of the present disclosure, the edge ring is provided with a recess for providing the corrosion-resistant member, and the depth of the recess may be set such that when the side of the edge ring on which the conductive member and the corrosion-resistant member are provided is pressed against a flat plate at a pressure of 0.1 MPa, the thickness of the conductive member becomes thinner than the thickness of the corrosion-resistant member.

[0010] In the edge ring of this disclosure, the corrosion-resistant member may be arranged on the outer surface side of the conductive member.

[0011] The edge ring of this disclosure includes the conductive member and the main body, wherein the conductive member is a sheet layer, and the sheet layer and the main body may be directly joined.

[0012] In the edge ring of this disclosure, the conductive member may be at least one of a thermal conductive member or a conductive member.

[0013] The conductive member of this disclosure comprises an upper surface and a lower surface, wherein the lower surface is a conductive member used in contact with a plasma-resistant member, and the conductive member is an elastic body.

[0014] In the conductive member of this disclosure, the average maximum displacement calculated from the load-displacement curve obtained by a nanoindentation test performed on the lower surface of the conductive member under the following test conditions is preferably 0.5 μm or more and 10 μm or less. (Test conditions) Measurement temperature: 25°C Indenter used: Berkovich indenter Loading speed: 0.05 mN / sec Maximum load: 0.5 mN Maximum load holding time: 10 seconds Number of measurement points: n = 5

[0015] In the conductive member of this disclosure, it is preferable that the ratio of the average maximum displacement to the thickness of the conductive member before load application in the nanoindentation test is 0.2% or more and 6.5% or less.

[0016] In the conductive member of this disclosure, the average creep amount during the maximum load holding time, calculated from the load-displacement curve obtained by a nanoindentation test performed on the lower surface of the conductive member under the following test conditions, is preferably 0.05 μm or more and 0.5 μm or less. (Test conditions) Measurement temperature: 25°C Indenter used: Berkovich indenter Loading speed: 0.05 mN / sec Maximum load: 0.5 mN Maximum load holding time: 10 seconds Number of measurement points: n = 5

[0017] In the conductive member of this disclosure, it is preferable that the ratio of the average creep amount to the thickness of the conductive member before load application in the nanoindentation test is 0.0% or more and 0.5% or less.

[0018] In the conductive member of this disclosure, the average unloaded displacement of the lower surface of the conductive member, calculated from the load-displacement curve obtained by a nanoindentation test performed under the following test conditions, is preferably 0.0 μm or more and 4.0 μm or less. (Test conditions) Measurement temperature: 25°C Indenter used: Berkovich indenter Loading speed: 0.05 mN / sec Maximum load: 0.5 mN Maximum load holding time: 10 seconds Number of measurement points: n = 5

[0019] In the conductive member of this disclosure, the average Martens hardness of the lower surface of the conductive member, calculated by a nanoindentation test performed under the following test conditions, is 0.1 N / mm². 2 More than 5000N / mm 2 The following conditions are preferable: (Test conditions) Measurement temperature: 25°C Indenter used: Berkovich indenter Loading speed: 0.05 mN / sec Maximum load: 0.5 mN Holding time of maximum load: 10 seconds Number of measurement points: n = 5

[0020] In the conductive member of this disclosure, the thickness of the conductive member when uncompressed is preferably 30 μm or more and 600 μm or less.

[0021] In the conductive member of this disclosure, the thermal conductivity in the direction perpendicular to the upper surface is preferably 1.0 W / m·K or higher.

[0022] The conductive member of this disclosure may be used with an edge ring supported on the upper surface.

[0023] The thermal conductive member of this disclosure is a conductive member of this disclosure that has thermal conductivity.

[0024] The conductive member of this disclosure is a conductive member of this disclosure, characterized in that it is electrically conductive.

[0025] In the conductive member of this disclosure, it is preferable that the volume resistivity is smaller than the volume resistivity of the edge ring disposed on the upper surface of the conductive member.

[0026] The conductive member of this disclosure preferably has a volume resistivity of 4.0 Ω·cm or less.

[0027] The conductive member of this disclosure preferably has a volume resistivity of 0.1 Ω·cm or more and 0.4 Ω·cm or less.

[0028] The conductive sheet of this disclosure is characterized by comprising a sheet layer formed from the conductive member of this disclosure.

[0029] The thermal conductive sheet of this disclosure is a conductive sheet of this disclosure that has thermal conductivity.

[0030] The conductive sheet of this disclosure is a conductive sheet of this disclosure, characterized in that it is electrically conductive.

[0031] This is a cross-sectional view showing the schematic configuration of an edge ring according to an embodiment of this disclosure. This is a diagram showing an example in which a fibrous material is included in the heat conductive member according to an embodiment of this disclosure. This is a schematic configuration diagram in which the edge ring according to an embodiment of this disclosure is arranged to surround a plasma-resistant member. This is a partial cross-sectional view to explain each member of the edge ring according to an embodiment of this disclosure, as well as the changes in shape when uncompressed and when compressed. This is a diagram showing the load-displacement curve of the heat conductive member obtained in Example 6.

[0032] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings, but the invention according to the present disclosure is not limited thereto.

[0033] [Edge Ring 1] The edge ring 1 of the present disclosure includes at least a conductive member (conductive sheet) 3 that is an elastic body, and is used in contact with a plasma-resistant member 5 via the conductive member 3. As will be described later, in the present disclosure, for example, in order to control the temperature of the edge ring 1 or control the electric field of an object subjected to plasma processing using the edge ring 1, the conductive member (conductive sheet) 3 is capable of conducting at least one of heat and electricity. Therefore, it should be noted that, unless otherwise specifically stated, the conductive member (conductive sheet) 3 as used herein means both a heat conductive member (heat conductive sheet) 3 and an electrically conductive member (electrically conductive sheet) 3. In addition, the conductive member (conductive sheet) 3, the heat conductive member (heat conductive sheet) 3, and the electrically conductive member (electrically conductive sheet) 3 are common in terms of arrangement, shape, and other aspects not related to thermal conductivity or electrical conductivity. Therefore, it should be noted that even when described as a heat conductive member (heat conductive sheet) 3, the description may also apply equally to the conductive member (conductive sheet) 3 including the electrically conductive member (electrically conductive sheet) 3.

[0034] An edge ring 1 according to one embodiment of the present disclosure comprises at least an elastic heat conductive member (heat conductive sheet) 3, and is used in contact with a plasma-resistant member 5 via the heat conductive member 3. In the embodiment shown in Figures 1(A) and 1(B), the main body 2 of the edge ring 1 comprises a heat conductive member 3 and a corrosion-resistant member 4, the heat conductive member 3 and the corrosion-resistant member 4 are elastic, and the edge ring 1 is used in contact with the plasma-resistant member 5 via the heat conductive member 3 and the corrosion-resistant member 4, respectively (see Figures 3 and 4). Figures 1(A) and 1(B) are perspective and cross-sectional views of the edge ring 1, respectively. The edge ring 1 is formed to surround the upper outer circumference of the plasma-resistant member 5 and is formed in a ring shape, but it may be in other shapes, for example, multiple arc-shaped rings may be installed in an annular shape. Note that an "elastic body" is a material that generates strain when pressure is applied. In the case of the heat conductive member 3, it is preferable that the storage modulus is 0.001 MPa or more and 1 GPa or less, more preferably 0.2 MPa or more and 100 MPa or less, and the loss tangent is preferably less than 1.0, and preferably 0.2 or more and 0.8 or less. When the storage modulus and loss tangent are within these ranges, the heat conductive member 3 can follow the surface shape of the plasma-resistant member 5 and make close contact, so that heat can be dissipated through the heat conductive member 3. Furthermore, even if the edge ring 1 is removed from the plasma-resistant member 5 and re-contacted for repeated use, deformation of the heat conductive member 3 is suppressed and thermal conductivity can be maintained (durability). As a result, it is possible to provide an edge ring 1 with a longer lifespan, the frequency of edge ring replacement in the plasma processing process can be reduced, and the process efficiency of the plasma processing process can be improved. The storage modulus and loss tangent of the elastic body can be measured by the dynamic viscoelasticity measurement method described later.

[0035] An edge ring 1 according to another embodiment of the present disclosure includes at least a conductive member (conductive sheet) 3 that is an elastic body, and is used in contact with a plasma-resistant member 5 via the conductive member 3. In the embodiment shown in FIGS. 1A and 1B, a main body portion 2 of the edge ring 1 includes the conductive member 3 and a corrosion-resistant member 4, wherein the conductive member 3 and the corrosion-resistant member 4 are elastic bodies, and the edge ring 1 is used in contact with the plasma-resistant member 5 via the conductive member 3 and the corrosion-resistant member 4 respectively (see FIGS. 3 and 4). The edge ring 1 is formed so as to surround the upper outer circumference of the plasma-resistant member 5 and is formed in a ring shape, but may have other shapes; for example, a plurality of arc-shaped members may be disposed to form an annular shape. Note that the "elastic body" refers to a body that deforms when pressure is applied thereto. In the case of the conductive member 3, it is preferable that the storage elastic modulus is 0.001 MPa or more and 1 GPa or less, more preferably 0.2 MPa or more and 100 MPa or less, the loss tangent is preferably less than 1.0, and more preferably 0.2 or more and 0.8 or less. When the storage elastic modulus and the loss tangent are within these ranges, the conductive member 3 can follow and closely adhere to the surface shape of the plasma-resistant member 5. Therefore, by adjusting the electric field via the conductive member 3, plasma distribution can be controlled. Furthermore, even when the edge ring 1 is removed from the plasma-resistant member 5, brought into contact again, and repeatedly used, deformation of the conductive member 3 is suppressed, and plasma distribution controllability can be maintained (durability). As a result, it is also possible to provide the edge ring 1 with a longer service life. In the present disclosure, the frequency of edge ring replacement in a plasma processing step can be reduced, and the process efficiency of the plasma processing step can be improved.

[0036] As described above, the main body 2 of the edge ring 1 shown in Figures 1(A) and 1(B) comprises a conductive member 3 and a corrosion-resistant member 4, the conductive member 3 and the corrosion-resistant member 4 being elastic bodies, and the edge ring 1 is used in contact with the plasma-resistant member 5 via the conductive member 3 and the corrosion-resistant member 4, respectively (see Figures 3 and 4). The edge ring 1 is formed to surround the upper outer circumference of the plasma-resistant member 5 and is formed in a ring shape, but it may be in other shapes, for example, multiple arc-shaped rings may be installed in an annular shape. Note that an "elastic body" is one that generates strain when pressure is applied. In the case of the conductive member 3, it is preferable that the storage modulus is 0.001 MPa or more and 1 GPa or less, more preferably 0.2 MPa or more and 100 MPa or less, and it is preferable that the loss tangent is less than 1.0, and preferably 0.2 or more and 0.8 or less. When the storage modulus and loss tangent are within these ranges, the conductive member 3 can conform to and closely adhere to the surface shape of the plasma-resistant member 5, enabling heat dissipation or plasma distribution control via the conductive member 3. Furthermore, even when the edge ring 1 is removed from the plasma-resistant member 5 and re-contacted for repeated use, deformation of the conductive member 3 is suppressed, maintaining thermal conductivity or plasma distribution control (durability). As a result, it is possible to provide an edge ring 1 with a longer lifespan, and in this disclosure, the frequency of edge ring replacement in the plasma processing process can be reduced, further improving the process efficiency of the plasma processing process.

[0037] Furthermore, edge rings in plasma processing equipment are typically annular components positioned on the outer periphery of an electrostatic chuck device. Edge rings are primarily used to protect the electrostatic chuck device and to ensure uniform plasma distribution. However, recent advancements in semiconductor device miniaturization and high aspect ratio structure formation technology have necessitated more advanced characteristics and control. In this disclosure, the main body 2 and the conductive member 3 may be conductive, and the main body 2 and the plasma-resistant member 5 may be electrically connected via the conductive member 3. Alternatively, electrodes (not shown) placed inside the plasma-resistant member 5 may be electrically connected to a power supply (not shown), thereby electrically connecting the electrodes to the main body 2. If the resistance value of the electrical connection circuit is low, power can be efficiently supplied to the plasma during the plasma processing process, improving process efficiency.

[0038] Furthermore, from the viewpoint of electric field uniformity, the electrical (volume) resistivity of the conductive member 3 is preferably smaller than that of the edge ring (main body 2). If it is 4.0 Ω·cm or less, it becomes possible to control the plasma distribution within the plasma processing apparatus and further suppress abnormal discharge. As a result, it becomes possible to provide an edge ring 1 with a longer lifespan, and in this disclosure, the frequency of edge ring replacement in the plasma processing process can be reduced, and the process efficiency of the plasma processing process can be improved. Moreover, if the electrical (volume) resistivity of the conductive member 3 is 0.1 Ω·cm or more and 0.4 Ω·cm or less, and particularly 0.1 Ω·cm or more and 0.2 Ω·cm or less, it becomes possible to control the plasma distribution within the plasma processing apparatus with higher precision and further suppress abnormal discharge.

[0039] (Edge ring body 2) Body 2 is a part that constitutes the edge ring 1. The material of body 2 may be a semiconductor, a conductor, an insulator, or a combination of two or more of these, but is not limited to these. By using a desired combination of these, dielectric properties can be controlled, and the object to be held, such as a wafer, adsorbed on the upper surface of the plasma-resistant member 5 can be uniformly subjected to plasma treatment.

[0040] The material of the main body 2 may be a semiconductor or a conductor, from the viewpoint of appropriate control of the plasma electric field distribution. Examples include silicon (Si) and silicon carbide (SiC). The electrical (volume) resistivity of the main body 2 is preferably greater than the electrical (volume) resistivity of the conductive member 3. 14 It is more preferable that the Ω·cm is less than or equal to Ω·cm, and may be between 100 Ω·cm and 10,000 Ω·cm, or between 1.0 Ω·cm and 4.0 Ω·cm. This makes it easier to control the plasma distribution on the surface of the edge ring 1 and further suppresses abnormal discharge. As a result, it is possible to provide an edge ring 1 with a longer lifespan, and in this disclosure, the frequency of edge ring replacement in the plasma processing process can be reduced, and the process efficiency of the plasma processing process can be further improved.

[0041] Since the edge ring 1 is used in devices and methods that utilize plasma, it is more preferable that the main body 2 be formed from a plasma-resistant material. This prevents the edge ring 1 from being eroded even under processing conditions with long plasma processing times, allowing for uniform plasma treatment of the object W to be held. Examples of plasma-resistant materials include organic and inorganic materials. Preferred organic materials include nylon, polyimide, polyamide, polyester, acrylic, polyolefin, aromatic polyether ketone, polyphenylene sulfide, fluororesin, polyvinyl alcohol, ethylene-vinyl alcohol resin, phenolic resin, vinyl chloride, and silicone resin, but are not limited to these. Preferred inorganic materials include metals and ceramics, but are not limited to these. Examples of inorganic materials include those containing at least one of yttrium, aluminum, zirconium, hafnium, calcium, magnesium, nickel, titanium, and silicon, and may also be oxides, hydroxides, carbides, or mixtures thereof (minerals, etc.), and the mixture may contain hydroxyapatite.

[0042] (Conducting member 3 including heat conductive member 3 and conductive member 3) As described above, the embodiment of the conducting member 3 includes a heat conductive member 3 and a conductive member 3, so unless otherwise specified, the following description also applies to the heat conductive member 3 and the conductive member 3. Details of the conducting member 3 will be described later, but the conducting member 3 can be provided on the edge ring 1 as a sheet-like heat conductive sheet. The conducting member 3 provided on the edge ring 1 may be ring-shaped like the edge ring 1, or it may be provided in an island-like manner (as multiple members) along the edge ring 1. In the latter case, each island constituting the conducting member 3 can be in various shapes such as arc-shaped, spherical, or rectangular (the ends of some or more islands may be connected or separated).

[0043] By providing the heat conduction members 3 in an island-like manner along the edge ring 1 only where heat transfer is required, the heat dissipation of the edge ring 1 can be ensured while suppressing particles generated from the heat conduction members 3 by the plasma. As a result, the durability of the heat conduction members 3 and the edge ring 1 is improved.

[0044] Furthermore, by providing the conductive members 3 in an island-like manner along the edge ring 1 only where conductivity is required, it is possible to suppress particles generated from the conductive members 3 by the plasma while ensuring the conductivity or plasma distribution control of the edge ring 1. As a result, the durability of the conductive members 3 and the edge ring 1 is improved.

[0045] The thickness of the conductive member 3 when uncompressed may be greater or less than the thickness of the corrosion-resistant member 4 (upper side of Figures 4(a) and 4(b)). When the side of the edge ring 1 equipped with the conductive member 3 and the corrosion-resistant member 4 is pressed against a flat plate at a pressure of 0.1 MPa, it is preferable that the thicknesses of the conductive member 3 and the corrosion-resistant member 4 are approximately the same (lower side of Figures 4(a) and 4(b)). That is, when the side of the edge ring 1 equipped with the conductive member 3 and the corrosion-resistant member 4 is pressed against a flat plate at a pressure of 0.1 MPa, it is preferable that the conductive member 3 and the corrosion-resistant member 4 are both in contact with this flat plate. This allows the corrosion-resistant member 4 to be shielded from the plasma atmosphere flowing through the edge ring 1 (conductive member 3) as shown in Figure 3, and at the same time, the uniformity of the heat distribution of the edge ring 1 can be improved by the conductive member 3 being in close contact with the plasma-resistant member 5 (electrostatic chuck) (in the case of the heat conductive member 3). In addition, in the case of the conductive member 3, the plasma distribution controllability can be improved. In either case, process efficiency in the plasma treatment process can be improved. This pressurizing condition corresponds to the condition in which the edge ring (main body 2, heat conductive member 3, etc.) is compressed relative to the electrostatic chuck by the electrostatic force when the electrostatic chuck is in operation.

[0046] Furthermore, when the conductive member 3 is not compressed, its thickness is thinner than that of the corrosion-resistant member 4. When the side of the edge ring 1 equipped with the conductive member 3 and the corrosion-resistant member 4 is pressed against a flat plate at a pressure of 0.1 MPa, and both the conductive member 3 and the corrosion-resistant member 4 are in contact with this flat plate, the corrosion-resistant member 4 is compressed and pressurized more than the conductive member 3 between the main body 2 of the edge ring 1 and the plasma-resistant member 5. As a result, the occurrence of gaps between the corrosion-resistant member 4 and the main body 2, or between the corrosion-resistant member 4 and the plasma-resistant member 5, is suppressed. Consequently, the conductive member 3 is more reliably protected from the plasma atmosphere, and the durability of the conductive member 3 and the edge ring 1 is improved.

[0047] When the conductive member 3 is uncompressed, its thickness is greater than that of the corrosion-resistant member 4. When the side of the edge ring 1 equipped with the conductive member 3 and the corrosion-resistant member 4 is pressed against a flat plate at a pressure of 0.1 MPa, and both the conductive member 3 and the corrosion-resistant member 4 are in contact with this flat plate, the conductive member 3 is compressed and pressurized more than the corrosion-resistant member 4 between the main body 2 of the edge ring 1 and the plasma-resistant member 5. As a result, the conductive member 3 and the plasma-resistant member 5 are in closer contact, and the corrosion-resistant member 4 can be shielded from the plasma atmosphere flowing through the conductive member 3. At the same time, the uniformity of the heat distribution of the edge ring 1 can be improved, providing an edge ring 1 that achieves both uniformity and durability (in the case of the heat conductive member 3). In the case of the conductive member 3, an edge ring 1 that achieves both stable conductivity and durability can also be provided.

[0048] In order to achieve the state during compression due to electrostatic force shown in the lower part of Figure 4 (where both are in contact with a flat plate), the relationship between the elastic modulus (Young's modulus) of the conductive member 3 and the corrosion-resistant member 4, both of which are elastic materials, can be explained as follows. When the corrosion-resistant member 4 is thicker than the conductive member 3, as shown in the upper part of Figure 4(a) (when uncompressed), it is preferable that the elastic modulus of the material of the corrosion-resistant member 4 is less than or equal to that of the material of the conductive member 3, so that both are in contact with the flat plate during compression. When the corrosion-resistant member 4 is thinner than the conductive member 3, as shown in the upper part of Figure 4(b) (when uncompressed), it is preferable that the elastic modulus of the material of the corrosion-resistant member 4 is greater than or equal to that of the material of the conductive member 3, so that both are in contact with the flat plate during compression. As a result, the positional relationship between the conductive member 3 and the corrosion-resistant member 4 is adjusted by the difference in the dimensional change (elastic modulus) in the compression direction during compression under the above pressurized conditions, and the conductive member 3 and the corrosion-resistant member 4 can simultaneously contact the flat plate during compression. As a result, the corrosion-resistant member 4 can be shielded from the plasma atmosphere flowing through the conductive member 3, and at the same time, in the case of the heat conductive member 3, the uniformity of the heat distribution of the edge ring 1 can be improved, and in the case of the conductive member 3, an edge ring 1 that balances conductivity and durability can be provided. As a result, process efficiency can be improved more reliably.

[0049] When the edge ring 1 is provided with a recess 2a for accommodating a corrosion-resistant member 4 (see Figure 4(c)), the depth of the recess 2a may be set such that, when the side of the edge ring 1 on which the conductive member 3 and the corrosion-resistant member 4 are provided is pressed flat at a pressure of 0.1 MPa, the thickness of the conductive member 3 becomes thinner than the thickness of the corrosion-resistant member 4. Specifically, the depth of the recess 2a may be 5 μm or more and 3000 μm or less. As a result, a part of the corrosion-resistant member 4 is surrounded by the inner surface forming the recess 2a, and as a result, the plasma atmosphere flowing to the conductive member 3 can be further reduced. As a result, an edge ring 1 with a longer lifespan can be provided. The recess 2a is for attaching and fixing the corrosion-resistant member 4 to the main body 2. The shape of the recess 2a is not particularly limited and may be C-shaped, triangular, rectangular, etc. Recesses 2a can be provided at both ends (inner circumference side and outer circumference side) of the main body 2 to correspond to the corrosion-resistant members 4a and 4b (see Figure 4(c)). In this case, the corrosion-resistant member 4 may be installed sandwiched between the inner surfaces that form the recess 2a. This suppresses the formation of gaps between the corrosion-resistant member 4 and the recess 2a (edge ​​ring 1), and as a result, the conductive member 3 is protected from the plasma atmosphere, providing a conductive member 3 and edge ring 1 with a longer lifespan.

[0050] (Corrosion-resistant member 4) The corrosion-resistant member 4 provided on the edge ring 1 is an elastic body with plasma resistance and is used in contact with both the main body 2 and the plasma-resistant member 5. Preferably, the corrosion-resistant member 4 is arranged on the outer side of the conductive member 3. Here, the "outer side" of the conductive member 3 means the side that is in contact with the external atmosphere. In Figure 1(B), a cross-sectional view showing the schematic configuration of the edge ring 1, the corrosion-resistant members 4a and 4b (corrosion-resistant members 4) are arranged on the outer and inner circumferences of the edge ring 1 at both ends of the conductive member 3, and both these outer and inner circumferences are located on the "outer side" of the conductive member 3 (the same applies to the edge ring 1) that is in contact with the external atmosphere. Furthermore, the corrosion-resistant member 4 may be arranged along the outer circumference of the conductive member 3, or it may cover the outer circumference of the conductive member 3 (it may be in contact with the conductive member 3). This improves the durability of the conductive member 3. As a result, an edge ring 1 with a longer lifespan can be provided.

[0051] The corrosion-resistant member 4 may be separated from the conductive member 3 during compression and uncompression (see Figure 1(B)). Alternatively, the corrosion-resistant member 4 may be in contact with the conductive member 3 during compression, and the conductive member 3 may be separated from the corrosion-resistant member 4 during uncompression. By being separated during uncompression, the conductive member 3 can be more easily brought into close contact with the plasma-resistant member 5 during compression without being hindered by the corrosion-resistant member 4. As a result, the thermal conductivity and electrical conductivity of the conductive member 3 are improved.

[0052] The corrosion-resistant member 4 is resistant to plasma. Depending on its arrangement and application, the corrosion-resistant member 4 can isolate or keep other members other than the conductive member 3 away from the plasma atmosphere. The material and structure of the corrosion-resistant member 4 are not particularly limited and can be made of organic and / or inorganic materials. For examples of the corrosion-resistant member 4, please refer to the embodiments described later.

[0053] [Conductive member (thermal conductive member, conductive member, conductive sheet, thermal conductive sheet, conductive sheet, sheet layer) 3] The conductive member 3 is an elastic body and has an upper surface and a lower surface, and the conductive member 3 is used with the lower surface in contact with the plasma-resistant member. The conductive member 3 can be used by supporting the edge ring 1 on its upper surface. The conductive member 3 is preferably in the form of a sheet (sheet layer) as described above, and either surface may be called the upper surface or the lower surface (the upper surface and lower surface of the conductive member 3 are used for convenience to distinguish them). If the conductive member 3 is a flat sheet, the contact area with the edge ring 1 and the plasma-resistant member 5 increases, improving thermal conductivity or plasma distribution control. Also, in the case of a sheet-shaped conductive member 3, the area in contact with the plasma atmosphere (sheet edge surface) is small, and the durability of the conductive member 3 is improved. As a result, a longer-lasting edge ring 1 can be provided, the frequency of edge ring replacement in the plasma processing process can be reduced, and the process efficiency of the plasma processing process can be improved.

[0054] The heat conduction member 3 is an elastic body and has an upper surface and a lower surface, and is used with its lower surface in contact with the plasma-resistant member 5. The heat conduction member 3 can be used by supporting the edge ring 1 on its upper surface. The heat conduction member 3 is preferably in the form of a sheet (sheet layer) as described above, and either surface may be called the upper surface or the lower surface (the upper surface and lower surface of the heat conduction member 3 are used for convenience to distinguish them). If the heat conduction member 3 is a flat sheet, the contact area with the edge ring 1 and the plasma-resistant member 5 increases, and the thermal conductivity between the edge ring 1 and the plasma-resistant member 5 improves. In addition, in the case of a sheet-shaped heat conduction member 3, the area in contact with the plasma atmosphere (sheet edge surface) is small, and the durability of the heat conduction member 3 is improved. As a result, an edge ring 1 with a longer lifespan can be provided. The conductive member 3 has the same structure as the heat conduction member 3, and in the case of the conductive member 3, an edge ring 1 with a long lifespan that balances conductivity and durability can also be provided.

[0055] The thickness of the conductive member 3 (thermal conductive member 3, conductive member 3) can be appropriately designed and changed according to the application, but the thickness of the conductive member 3 when uncompressed is preferably 30 μm to 600 μm, more preferably 50 μm to 300 μm, and even more preferably 100 μm to 300 μm. If the thickness of the conductive member 3 is within this range, it can maintain conductivity even when repeatedly removed from the plasma-resistant member 5 and re-contacted while conforming to the surface shape of the plasma-resistant member 5. As a result, a conductive member 3 with a long lifespan is provided, and process efficiency in the plasma processing process can be more reliably improved. Furthermore, the thermal conductive member 3 can exhibit good thermal conductivity and durability. For example, when used in contact with the plasma-resistant member 5 in a plasma processing apparatus, such a thermal conductive member 3 can conform to the surface shape of the plasma-resistant member 5 and adhere closely, so heat can be dissipated through the thermal conductive member 3, promoting heat transfer in the plasma processing apparatus and electrostatic chuck, etc. Furthermore, even when used as part of the edge ring 1, thermal conductivity can be maintained even when the edge ring 1 is removed from the plasma-resistant member 5 and re-contacted and repeatedly used (durability). As a result, it becomes possible to provide an edge ring 1 with a longer lifespan. Furthermore, in the case of the conductive material 3, it is possible to provide an edge ring 1 with a long lifespan that achieves both stable plasma distribution control and durability.

[0056] The average maximum displacement of the conductive member 3, calculated from the load-displacement curve obtained by nanoindentation testing, is preferably 0.5 μm to 10 μm, and more preferably 0.5 μm to 5.0 μm. When this displacement is within this range, process efficiency can be more reliably improved. The heat conductive member 3 exhibits good heat uniformity and durability (restorability is maintained). For example, when used in contact with a plasma-resistant member 5 in a plasma processing apparatus, such a heat conductive member 3 can conform to the surface shape of the plasma-resistant member 5 in response to electrostatic force, thereby suppressing thermal non-uniformity in the plasma processing apparatus (heat uniformity). Furthermore, even when used as part of an edge ring 1 within a plasma processing apparatus, the edge ring 1 can maintain its shape even after being removed from the plasma-resistant member 5 and re-contacted for repeated use (durability). As a result, it is possible to provide an edge ring 1 with a longer lifespan. In addition, in the case of the conductive member 3, a long-life edge ring 1 that achieves both stable plasma distribution control and durability can also be provided.

[0057] (Nanoindentation Test) The above nanoindentation test (micro-indentation test) can be performed in accordance with the international standard ISO 14577. For example, an ultra-micro-indentation hardness tester (ENT-NEXUS, manufactured by Elionix Corporation) can be used. (Measurement Conditions) Measurement temperature: 25°C Indenter used: Berkovich indenter Loading speed: 0.05 mN / sec Maximum load: 0.5 mN Maximum load holding time: 10 seconds Number of measurement points: n = 5

[0058] The ratio of the average maximum displacement (average maximum displacement / thickness when uncompressed) to the thickness of the conductive member 3 before load application is preferably 0.2% to 6.5%, and more preferably 1.0% to 5.0%. If this ratio is within this range, process efficiency can be more reliably improved. The heat conductive member 3 can exhibit good heat uniformity and durability. For example, when used in contact with a plasma-resistant member 5 in a plasma processing apparatus, such a heat conductive member 3 can follow the surface shape of the plasma-resistant member 5 in response to electrostatic force and adhere closely, thereby promoting heat transfer in the plasma processing apparatus (heat uniformity). This suppresses localized overheating within the plasma processing apparatus and makes it possible to provide an edge ring 1 with a longer lifespan. In addition, in the case of the conductive member 3, it is possible to provide an edge ring 1 with a long lifespan that achieves both stable plasma distribution control and durability. Furthermore, even when the conductive member 3 is used as part of the edge ring 1 within the plasma processing apparatus, the shape can be maintained even if the edge ring 1 is removed from the plasma-resistant member 5 and re-contacted for repeated use (durability). As a result, it is possible to provide an edge ring 1 with an even longer lifespan.

[0059] The average creep amount during the maximum load holding time, calculated from the load-displacement curve obtained in the nanoindentation test described above, for the conductive member 3 is preferably 0.05 μm or more and 0.5 μm or less. If this average creep amount is 0.05 μm or more, the conductive member 3 can deform. For example, when used in contact with a plasma-resistant member 5 in a plasma processing apparatus, such a thermal conductive member 3 can follow the surface shape of the plasma-resistant member 5 in response to electrostatic force and adhere closely, thereby promoting heat transfer in the plasma processing apparatus. If this change is 0.5 μm or less, the thermal conductive member 3 can maintain its shape while deforming in response to electrostatic force, thus achieving both durability and thermal conductivity. As a result, it becomes possible to provide an edge ring 1 with a longer lifespan. Furthermore, in the case of the conductive member 3, it is also possible to provide an edge ring 1 with a long lifespan that achieves both stable plasma distribution control and durability.

[0060] The ratio of the average creep amount (average creep amount / thickness when uncompressed) to the thickness of the conductive member 3 before load application is preferably 0.0% to 0.5%, and more preferably 0.0% to 0.2%. If this ratio is within this range, process efficiency can be more reliably improved. Since the heat conductive member 3 can maintain its original shape while deforming in response to electrostatic force, durability and thermal conductivity can be achieved simultaneously. As a result, it becomes possible to provide an edge ring 1 with a longer lifespan. Furthermore, in the case of the conductive member 3, it is also possible to provide an edge ring 1 with a long lifespan that achieves both stable plasma distribution control and durability.

[0061] The average unloaded displacement of the conductive member 3, calculated from the load-displacement curve obtained in the nanoindentation test described above, is preferably 0.0 μm to 4.0 μm, more preferably 0.0 μm to 2.0 μm, and even more preferably 0.0 μm to 1.0 μm. Within these ranges, the conductive member 3 can exhibit suitable durability. For example, when used in contact with a plasma-resistant member 5 in a plasma processing apparatus, it can maintain approximately its original shape even when repeatedly compressed (adsorption by an electrostatic chuck during plasma processing), resulting in suitable durability. As a result, an edge ring 1 with a longer lifespan can be provided. Furthermore, in the case of a thermal conductive member 3, an edge ring 1 that achieves both stable thermal conductivity and durability can be provided. In the case of a conductive member 3, an edge ring 1 that achieves both stable plasma distribution control and durability can also be provided.

[0062] Preferably, the average post-peel displacement calculated from the load-displacement curve obtained in the nanoindentation test described above for the conductive member 3 is not less than 0.0 µm and not more than 1.0 µm. Within these ranges, the conductive member 3 can exhibit suitable durability. For example, when used in contact with a plasma-resistant member 5 in a plasma processing apparatus, even if compression (adsorption by an electrostatic chuck during plasma processing) is repeated, the original shape can be substantially maintained despite deformation, leading to suitable durability. As a result, an edge ring 1 with a longer service life can be provided. Furthermore, in the case where the conductive member 3 is a thermally conductive member, an edge ring 1 that achieves both stable thermal conductivity and durability can be provided. In the case where the conductive member 3 is an electrically conductive member, an edge ring 1 that achieves both stable plasma distribution controllability and durability can be provided.

[0063] Preferably, the average Martens hardness calculated by the nanoindentation test described above for the conductive member 3 is 0.1 N / mm 2 or more and 5000 N / mm 2 or less, more preferably 1 N / mm 2 or more and 1000 N / mm 2 or less, and still more preferably 100 N / mm 2 or more and 500 N / mm 2 or less. Within these ranges, even after repeated compression, the conductive member 3 can elastically return substantially to its original shape, resulting in suitable durability. As a result, an edge ring 1 with a longer service life can be provided. Furthermore, in the case where the conductive member 3 is a thermally conductive member, an edge ring 1 that achieves both stable thermal conductivity and durability can be provided. In the case where the conductive member 3 is an electrically conductive member, an edge ring 1 that achieves both stable plasma distribution controllability and durability can be provided.

[0064] The average peel strength of the conductive member 3, calculated by the nanoindentation test described above, is preferably 0.05 mN or more and 0.5 mN or less, and more preferably 0.08 mN or more and 0.2 mN or less. Within these ranges, both adhesion and peelability of the conductive member 3 to the plasma-resistant member 5 are achieved, and even after repeated adhesion, it can elastically return to approximately its original shape, resulting in suitable durability. As a result, an edge ring 1 with a longer lifespan can be provided. Furthermore, in the case of a heat-conducting member 3, an edge ring 1 that achieves both stable heat conductivity and durability can be provided. In the case of a conductive member 3, an edge ring 1 that achieves both stable plasma distribution control and durability can also be provided.

[0065] The conductive member 3 (thermal conductive member 3, conductive member 3) preferably contains an elastic organic material, and more preferably mainly contains an elastic organic material. By including an elastic organic material, the conductive member 3 can be adjusted to desired properties when compressed, and can conform to the surface shape of the plasma-resistant member 5 and adhere tightly even when compressed repeatedly, thereby suppressing thermal non-uniformity and electric field non-uniformity in the plasma processing apparatus. The organic material is not particularly limited, but examples include resin materials and polymer materials. Specifically, examples include resin materials (including elastomers) such as acrylic resin, polyamide resin, fluororesin, polyimide resin, polyester resin, polyolefin resin, polyurethane resin, epoxy resin, and silicone resin. Fluororesin and polyimide resin are particularly preferred from the viewpoint of plasma resistance and improve the durability of the conductive member 3. Acrylic resin and silicone resin are also preferred from the viewpoint of conforming to the surface shape of the plasma-resistant member 5 due to their excellent flexibility and elasticity, and improve the conductivity (thermal conductivity, electrical conductivity, etc.) of the conductive member 3. As a result, an edge ring 1 that can maintain the necessary functions for a long period of time can be provided.

[0066] The conductive member 3 may contain a thermally conductive filler. By including a thermally conductive filler, the thermal conductivity can be appropriately adjusted, thereby providing the edge ring 1 with uniform heat distribution suitable for long-term use in a plasma processing apparatus. As a result, a long-life edge ring 1 can be provided. The thermally conductive filler is not particularly limited, but examples include one containing at least one of metals, aluminum, boron, magnesium, and silicon, and their oxides, nitrides, carbides or mixtures thereof (minerals, etc.), carbon fibers, carbon black, carbon nanotubes, graphite, diamond, etc. Preferably, the thermally conductive filler contains at least one of carbon fibers, carbon black, carbon nanotubes, graphite, or diamond. In these cases, the amount of thermally conductive filler added to the thermal conductive member 3 can be reduced, and adhesion to the plasma-resistant member can be maintained even after repeated use.

[0067] The packing ratio of the thermal conductive filler in the thermal conductive member 3 is preferably 20% to 80%, more preferably 30% to 70%, and even more preferably 35% to 70%. When the packing ratio of the thermal conductive filler is within these ranges, both cushioning and thermal conductivity of the thermal conductive member 3 can be achieved. For the method of measuring the packing ratio, please refer to the examples described later.

[0068] The thermally conductive filler may be a fibrous material 3a, and it is preferable that the aspect ratio of the fibrous material 3a is 10.0 or greater, as this ensures that the heat transfer path formed by the fibrous material 3a in the thermal conductive member 3 is secured and improves thermal conductivity. The upper limit of the aspect ratio of the fibrous material 3a is not particularly limited, but it is preferable that the fibrous material 3a extends from the upper surface to the lower surface (height direction) of the thermal conductive member 3 for superior thermal conductivity (Figure 2). Furthermore, from the viewpoint of achieving both cushioning and thermal conductivity, the fibrous material 3a may be perpendicular to the height direction of the thermal conductive member 3 or it may be inclined. With such a fibrous material 3a, the edge ring 1 can exhibit good cushioning and thermal conductivity. As a result, an edge ring 1 with a longer lifespan can be provided.

[0069] The thermal conductivity in the direction perpendicular to the upper surface of the conductive member 3 (heat conductive member 3, conductive member 3) is preferably 1.0 W / m·K or higher, more preferably 5 W / m·K or higher, even more preferably 10 W / m·K or higher, and particularly preferably 14 W / m·K or higher. This allows the edge ring 1 to exhibit good thermal conductivity. As a result, an edge ring 1 with a longer lifespan can be provided.

[0070] The conductive member 3 may contain a conductive filler. By including a conductive filler, the conductivity can be adjusted as appropriate, improving plasma distribution controllability and, as a result, providing an edge ring 1 with a long lifespan. The conductive filler is not particularly limited, but examples include one containing at least one of metals and carbon materials, such as metal oxides, nitrides, carbides or mixtures thereof (minerals, etc.), carbon fibers, carbon black, carbon nanotubes, graphite, and diamond. Preferably, the conductive filler contains at least one of carbon fibers, carbon black, carbon nanotubes, graphite, and diamond. In these cases, the amount of conductive filler added to the conductive member 3 can be reduced, and adhesion to the plasma-resistant member can be maintained even after repeated use. With the conductive member 3, an edge ring 1 that can maintain stable plasma distribution controllability can be provided. Furthermore, when the conductive member 3 is used, in the plasma processing process, when power is supplied from the power supply (not shown) to the plasma, the power supply and the main body 2 become electrically connected, and the upper surface of the main body 2 becomes the electrode plate of the lower electrode. As a result, the process efficiency of the plasma processing process can be improved.

[0071] The packing density of the conductive filler in the conductive member 3 is preferably 20% to 80%, more preferably 30% to 70%, and even more preferably 35% to 70%. When the packing density of the conductive filler is within these ranges, both cushioning properties and plasma distribution control properties of the conductive member 3 can be achieved.

[0072] The conductive filler may be a fibrous material 3a, and it is preferable that the aspect ratio of the fibrous material 3a is 10.0 or greater, as this ensures that the conductive paths formed by the fibrous material 3a in the conductive member 3 are secured and improves conductivity. The upper limit of the aspect ratio of the fibrous material 3a is not particularly limited, but it is preferable that the fibrous material 3a extends from the upper surface to the lower surface (height direction) of the conductive member 3 for superior conductivity (Figure 2). Furthermore, from the viewpoint of achieving both cushioning and conductivity, the fibrous material 3a may be perpendicular to the height direction of the conductive member 3 or inclined. With such a fibrous material 3a, the edge ring 1 can exhibit good cushioning and plasma distribution control. As a result, an edge ring 1 with a longer lifespan can be provided.

[0073] From the viewpoint of thermal conductivity or electrical conductivity, the main body 2 and the conductive member 3 are joined together. It is preferable that there are no voids such as air gaps between the main body 2 and the conductive member 3. This ensures that the main body 2 and the conductive member 3 are in close contact, uniformizing the conductivity characteristics (thermal characteristics or electrical characteristics), and providing an edge ring 1 with stable conductivity while maintaining durability. (If there are voids or adhesive layers, etc.) It is more preferable that the distance between the main body 2 and the conductive member 3 is 0.2 μm or less, and it is even more preferable that the main body 2 and the conductive member 3 are directly joined together. This allows for more stable conductivity between the electrode and the main body 2 when the electrode (not shown), power supply (not shown), and main body 2 are connected via the conductive member 3 (conductive member, conductive sheet) located inside the plasma-resistant member 5. As a result, power can be efficiently supplied to the plasma during the plasma processing process, improving process efficiency. Methods for direct joining include (1) a method in which the surface of the main body 2 that contacts the upper surface of the conductive member 3 (contact surface) is roughened and the upper surface of the conductive member 3 is pressed and joined to this contact surface, and (2) a method in which the contact surface is chemically modified and the conductive member 3 is brought into contact with this surface, and a chemical bond is formed between them. From the viewpoint of reducing the risk of damage to the main body 2 (such as particle generation) due to these surface treatments, method (2) is preferred. With the joining formed in this way, the joint between the main body 2 and the conductive member 3 becomes strong, damage (peeling) between the main body 2 and the conductive member 3 is suppressed, and an edge ring 1 with uniform conductivity can be provided while maintaining durability. Furthermore, in the case of a heat conductive member 3, an edge ring 1 that achieves both uniform thermal conductivity and durability can be provided. In the case of a conductive member 3, an edge ring 1 that achieves both uniform conductivity and durability can be provided. Furthermore, when electrodes (not shown) placed inside the plasma-resistant member 5, a power supply (not shown), and the main body 2 are electrically connected via a conductive member (conductive member, conductive sheet), more stable electrical conductivity becomes possible between the electrodes and the main body 2. As a result, power can be efficiently supplied to the plasma during the plasma processing step, improving process efficiency.

[0074] The roughening treatment method described in (1) above is not particularly limited, but examples include sandblasting, acid / alkali etching, laser irradiation, and anodic oxidation (porousing).

[0075] One method of (2) above is to introduce functional groups to the contact surface of the main body 2 and form a chemical bond with the upper surface of the conductive member 3. The method of introducing functional groups is not particularly limited, but examples include a method using plasma treatment to introduce functional groups, a method using silane coupling, a method of applying an activator, and a method using plasma CVD (chemical vapor deposition). As a result, a layer containing functional groups is generated on the contact surface of the main body 2, and this layer can form a chemical bond with the upper surface of the conductive member 3.

[0076] The distance between the main body 2 and the conductive member 3 (conductive sheet) can be calculated using the following method. Specifically, a scanning electron microscope (SEM) is used to obtain a cross-sectional photograph taken from a direction along the upper surface of the conductive sheet 3. The maximum value of the distance between the main body 2 and the conductive sheet 3 calculated from this cross-sectional photograph can be used as the value of the distance between the main body 2 and the conductive sheet 3.

[0077] <Conductive Sheet 3, Thermal Conductive Sheet 3, Conductive Sheet 3> The conductive sheet (thermal conductive sheet (thermal conductive member), conductive sheet (conductive member)) of this disclosure comprises a sheet layer (thermal conductive member 3, thermal conductive sheet, conductive member 3, conductive sheet) formed from the conductive member 3, and may also further comprise an adhesive layer for bonding the sheet layer to the main body 2. The thickness of the adhesive layer is not particularly limited, but from the viewpoint of balancing adhesion with thermal conductivity and electrical conductivity, it is preferably 0.5 μm to 20 μm, and more preferably 0.5 μm to 10 μm. This makes it possible to provide an edge ring 1 with a longer lifespan. The structure and dimensions of the conductive sheet 3 can be appropriately set according to the application.

[0078] Examples of polymer materials that can constitute the sheet layer (heat-conducting member 3) include resin materials (including elastomers) such as acrylic resin, polyamide resin, fluororesin, polyimide resin, polyester resin, polyolefin resin, polyurethane resin, epoxy resin, and silicone resin. The same types of polymer materials can also constitute the sheet layer (conductive member 3).

[0079] The adhesive layer is composed of an adhesive. The adhesive is not particularly limited, but examples include acrylic adhesives, epoxy adhesives, urethane adhesives, polyimide adhesives, and silicone adhesives. From the viewpoint of heat resistance and other factors, it is preferable that the adhesive constituting the adhesive layer be an acrylic adhesive, epoxy adhesive, or polyimide adhesive.

[0080] (Plasma-resistant member 5) The plasma-resistant member 5 is preferably an electrostatic chuck. For example, when an electrostatic chuck is used in a plasma processing apparatus, localized heat generation is likely to occur due to the influence of the plasma processing process. Typically, an electrostatic chuck may have, but is not limited to, a holding member for holding the object to be held W, an electrode for adsorbing the object to be held W, a base for holding the holding member, and a bonding layer disposed between the holding member and the base. In the example shown in Figure 3, the edge ring 1 is supported by an electrostatic chuck (plasma-resistant member 5) via a conductive member 3 (heat conductive member 3, conductive member 3) and a corrosion-resistant member 4 (4a, 4b), respectively. Furthermore, the "object to be held W" is not limited and can include, for example, wafers (silicon wafers, quartz wafers, SiC wafers, etc.), flat panel display (FPD) panels and substrates, metal members, film members, resin members (automotive interior materials, etc.), glass members, and other workpieces.

[0081] From the viewpoint of plasma resistance and heat resistance, the holding member is preferably a ceramic substrate, a resin substrate, or a composite substrate made of ceramics and resin. The position of the electrode for adsorbing the object to be held W is not particularly limited, but it may be provided inside the holding member or in contact with the holding member. The base may also have a temperature control function including a flow path for cooling the object to be held W and a heater for heating it. The shape, material, thickness, etc. of the base can be appropriately designed and changed according to the application. Examples of base materials include plasma-resistant materials such as ceramics and metals, and combinations thereof. Examples of bonding layer materials include metals and adhesive materials (resins). The corrosion-resistant member 4 may be placed on the outer surface side of the bonding layer to protect the bonding layer from the plasma atmosphere.

[0082] For example, in the dry etching and CVD processes of semiconductor manufacturing, the electrostatic chuck can use an edge ring 1 on its outer circumference when adsorbing a wafer (object to be held W).

[0083] <Manufacturing method and application examples of edge ring 1> Edge ring 1 can be manufactured, for example, as follows. Here, the conductive member 3 is described as a heat conductive member 3, but the same applies to the conductive member 3. First, the main body 2, the heat conductive member 3, and the corrosion-resistant member 4 are prepared. Then, the heat conductive member 3 and the corrosion-resistant member 4 are placed on one surface of the main body 2. In this case, the corrosion-resistant members 4 (4a, 4b) can be arranged on the outer surface side of the heat conductive member 3 other than the side that contacts the plasma-resistant member 5 (electrostatic chuck).

[0084] The edge ring 1 is used in apparatus and methods that utilize plasma. Figure 3 is a schematic configuration diagram showing the edge ring 1 arranged to surround the plasma-resistant member 5 (electrostatic chuck), illustrating the state of the edge ring 1 during use. Specifically, Figure 3 shows the edge ring 1 being adsorbed onto the plasma-resistant member 5 and irradiated with plasma. Figure 4 is a partial cross-sectional view illustrating the change in shape of the edge ring 1 of this disclosure when it is uncompressed and compressed. In the plasma processing step, the object to be held W is adsorbed by the electrostatic chuck (plasma-resistant member 5), and the edge ring 1 is simultaneously adsorbed onto the plasma-resistant member 5 by electrostatic force (the heat-conducting member and / or the corrosion-resistant member 4 is compressed). This compression and uncompression is repeated in each plasma processing step, but with the edge ring 1 of this disclosure, even if this plasma processing step is repeated, the corrosion-resistant member 4 protects the heat-conducting member 3 from the plasma atmosphere, and the heat-conducting member 3 can exhibit good thermal conductivity to the edge ring 1. Furthermore, if the conductive member 3 is a conductive member 3, it can exhibit good conductivity. Furthermore, even if the main body 2 becomes hot and expands due to plasma irradiation, the elastic corrosion-resistant member 4 deforms, absorbing the stress caused by the difference in expansion and contraction between the edge ring 1 and the plasma-resistant member 5. As a result, the lifespan of the edge ring 1 can be extended.

[0085] According to the edge ring 1 embodiment of this disclosure having the configuration described above, a conductive member 3 is provided, the conductive member 3 is an elastic body, and the edge ring 1 is used in contact with the plasma-resistant member 5 via the conductive member 3. The conductive member 3 has an upper surface and a lower surface, and can be used by contacting the plasma-resistant member 5 with the lower surface and supporting the edge ring 1 with the upper surface. Conductivity (thermal conductivity, electrical conductivity, etc.) can be ensured between the edge ring 1 and the plasma-resistant member 5, and such an edge ring 1 can improve the process efficiency of the plasma treatment process. Furthermore, since the conductive member 3 is an elastic body, it deforms while rebounding when compressed, and can adhere closely to the shape of the contacted member (plasma-resistant member 5). In this case, it is preferable that no voids such as air gaps are interposed at the interface between the conductive member 3 and the contacted member. This further improves the conductivity between the edge ring 1 and the plasma-resistant member 5.

[0086] In another embodiment, a heat conduction member 3 is provided, and the heat conduction member 3 is an elastic body. The edge ring 1 is used in contact with the plasma-resistant member 5 via the heat conduction member 3. The heat conduction member 3 has an upper surface and a lower surface. The lower surface contacts the plasma-resistant member 5, and the upper surface supports the edge ring 1 for use. With such an edge ring 1, even if the edge ring 1 is heated by plasma during the plasma treatment process, the heat can be transferred to the plasma-resistant member 5 via the heat conduction member 3. This maintains uniform heating for the object to be held W or the edge ring 1, resulting in uniform plasma treatment of the object to be held W. Furthermore, since the heat conduction member 3 is an elastic body, it deforms while rebounding under compression, and can adhere closely to the shape of the contacted member (plasma-resistant member 5). In this case, it is preferable that no voids such as air gaps are interposed at the interface between the heat conduction member 3 and the contacted member. This further improves the thermal conductivity between the edge ring 1 and the plasma-resistant member 5.

[0087] In yet another embodiment, a conductive member 3 is provided, and the conductive member 3 is an elastic body, and the edge ring 1 is used in contact with the plasma-resistant member 5 via the conductive member 3. The conductive member 3 has an upper surface and a lower surface, and can be used with the lower surface in contact with the plasma-resistant member 5 and the upper surface supporting the edge ring 1. With such an edge ring 1, electricity can be transmitted to the plasma-resistant member 5 via the conductive member 3 during the plasma treatment process, so that conductivity to the object to be held W or the edge ring 1 can be maintained, and as a result, uniform plasma treatment of the object to be held W is realized. Furthermore, since the conductive member 3 is an elastic body, it deforms while rebounding when compressed, and can adhere closely to the shape of the contacted member (plasma-resistant member 5). In this case, it is preferable that no voids such as air gaps are interposed at the interface between the heat conductive member 3 and the contacted member. This further stabilizes the conductivity between the edge ring 1 and the plasma-resistant member 5.

[0088] Furthermore, as one embodiment of this disclosure, a conductive sheet is provided which comprises a sheet layer formed from a conductive member 3. Such a conductive sheet can be used as the conductive member 3 in the edge ring 1.

[0089] Furthermore, as one embodiment of the present disclosure, a heat conductive sheet is provided which comprises a sheet layer formed from a heat conductive member 3. Such a heat conductive sheet can be used as the heat conductive member 3 in the edge ring 1.

[0090] Furthermore, as one embodiment of the present disclosure, a conductive sheet is provided which comprises a sheet layer formed from a conductive member 3. Such a conductive sheet can be used as the conductive member 3 in the edge ring 1.

[0091] In the edge ring 1 according to the embodiment of this disclosure, a conductive member (conductive sheet) 3 and a corrosion-resistant member 4 are provided. The conductive member 3 is an elastic body, and the corrosion-resistant member 4 is an elastic body having plasma resistance. The edge ring 1 may be used in contact with a plasma-resistant member 5 (electrostatic chuck) via the conductive member 3 and the corrosion-resistant member 4, respectively. With such an edge ring 1, in addition to conductivity via the conductive member 3, the corrosion-resistant member 4 makes the edge ring 1 highly durable and long-lasting, enabling further efficiency improvements in plasma processing. That is, since the corrosion-resistant member 4 is also an elastic body, it deforms while rebounding when compressed, and can adhere closely to the contacted member (high durability).

[0092] In the edge ring 1 according to the embodiment of this disclosure, a heat conductive member (heat conductive sheet) 3 and a corrosion-resistant member 4 are provided. The heat conductive member 3 is an elastic body, and the corrosion-resistant member 4 is an elastic body with plasma resistance. The edge ring 1 may be used in contact with a plasma-resistant member 5 (electrostatic chuck) via the heat conductive member 3 and the corrosion-resistant member 4, respectively. With such an edge ring 1, in addition to heat transfer via the heat conductive member 3, the corrosion-resistant member 4 makes the edge ring 1 highly durable and long-lasting, thereby achieving further efficiency in plasma processing. That is, since the corrosion-resistant member 4 is also an elastic body, it deforms while rebounding when compressed, and can adhere closely to the contacted member (high durability).

[0093] In the edge ring 1 according to the embodiment of this disclosure, a conductive member (conductive sheet) 3 and a corrosion-resistant member 4 are provided. The conductive member 3 is an elastic body, and the corrosion-resistant member 4 is an elastic body with plasma resistance. The edge ring 1 may be used in contact with a plasma-resistant member 5 (electrostatic chuck) via the conductive member 3 and the corrosion-resistant member 4, respectively. With such an edge ring 1, in addition to improved conductivity via the conductive member 3, the corrosion-resistant member 4 makes the edge ring 1 highly durable and long-lasting, thereby achieving further efficiency in plasma processing. That is, since the corrosion-resistant member 4 is also an elastic body, it deforms while rebounding when compressed, and can adhere closely to the contacted member (high durability).

[0094] Furthermore, in the edge ring 1 of this embodiment, when the side of the edge ring 1 equipped with the conductive member 3 and the corrosion-resistant member 4 is pressed against a flat plate at a pressure of 0.1 MPa, it is preferable that the conductive member 3 and the corrosion-resistant member 4 are in contact with the flat plate (lower side of Figure 4). In this way, if the conductive member 3 and the corrosion-resistant member 4 are in contact with the same flat plate when pressed, it is expected that their respective functions will be continuously performed. On the other hand, the thickness of the corrosion-resistant member 4 when uncompressed may be different from the thickness of the conductive member 3 (upper side of Figure 4), or it may be the same.

[0095] Furthermore, in the edge ring 1 of this embodiment, when the side of the edge ring 1 equipped with the heat conductive member 3 and the corrosion-resistant member 4 is pressed against a flat plate at a pressure of 0.1 MPa, it is preferable that the heat conductive member 3 and the corrosion-resistant member 4 are in contact with the flat plate (lower side of Figure 4). In this way, if the heat conductive member 3 and the corrosion-resistant member 4 are in contact with the same flat plate when pressed, it is expected that their respective functions will be continuously performed. On the other hand, the thickness of the corrosion-resistant member 4 when uncompressed may be different from the thickness of the heat conductive member 3 (upper side of Figure 4), or it may be the same.

[0096] Furthermore, in the edge ring 1 of this embodiment, when the side of the edge ring 1 equipped with the conductive member 3 and the corrosion-resistant member 4 is pressed against a flat plate at a pressure of 0.1 MPa, it is preferable that the conductive member 3 and the corrosion-resistant member 4 are in contact with the flat plate (lower side of Figure 4). In this way, if the conductive member 3 and the corrosion-resistant member 4 are in contact with the same flat plate when pressed, it is expected that their respective functions will be continuously performed. On the other hand, the thickness of the corrosion-resistant member 4 when uncompressed may be different from the thickness of the conductive member 3 (upper side of Figure 4), or it may be the same.

[0097] Furthermore, in the edge ring 1 of this embodiment, the main body portion 2 is provided with a recess 2a for accommodating a corrosion-resistant member 4, and the depth of the recess 2a may be set such that when the side of the edge ring 1 on which the conductive member 3 and the corrosion-resistant member 4 are provided is pressed flat at a pressure of 0.1 MPa, the thickness of the conductive member 3 becomes thinner than the thickness of the corrosion-resistant member 4 (Figure 4(c)). As a result, the corrosion-resistant member 4 is fixed to the main body portion 2, and the risk of a gap forming between the corrosion-resistant member 4 and the main body portion 2 is reduced even during prolonged plasma processing.

[0098] Furthermore, in the edge ring 1 of this embodiment, the main body portion 2 is provided with a recess 2a for accommodating a corrosion-resistant member 4, and the depth of the recess 2a may be set such that when the side of the edge ring 1 on which the heat conductive member 3 and the corrosion-resistant member 4 are provided is pressed flat at a pressure of 0.1 MPa, the thickness of the heat conductive member 3 becomes thinner than the thickness of the corrosion-resistant member 4 (Figure 4(c)). As a result, the corrosion-resistant member 4 is fixed to the main body portion 2, and the risk of a gap forming between the corrosion-resistant member 4 and the main body portion 2 is reduced even during prolonged plasma processing.

[0099] Furthermore, in the edge ring 1 of this embodiment, the main body portion 2 is provided with a recess 2a for accommodating a corrosion-resistant member 4, and the depth of the recess 2a may be set such that when the side of the edge ring 1 on which the conductive member 3 and the corrosion-resistant member 4 are provided is pressed flat at a pressure of 0.1 MPa, the thickness of the conductive member 3 becomes thinner than the thickness of the corrosion-resistant member 4 (Figure 4(c)). As a result, the corrosion-resistant member 4 is fixed to the main body portion 2, and the risk of a gap forming between the corrosion-resistant member 4 and the main body portion 2 is reduced even during prolonged plasma processing.

[0100] Furthermore, in the edge ring 1 of this embodiment, it is preferable that the corrosion-resistant member 4 be positioned on the outer surface side of the conductive member 3 (for example, the outer circumference side, the inner circumference side, etc.). In this way, the corrosion-resistant member 4 can protect the conductive member 3 from the plasma atmosphere.

[0101] Furthermore, in the edge ring 1 of this embodiment, it is preferable that the corrosion-resistant member 4 be positioned on the outer surface side of the heat conduction member 3 (for example, the outer circumference side, the inner circumference side, etc.). In this way, the corrosion-resistant member 4 can protect the heat conduction member 3 from the plasma atmosphere.

[0102] Furthermore, in the edge ring 1 of this embodiment, it is preferable that the corrosion-resistant member 4 be arranged on the outer surface side of the conductive member 3 (for example, the outer circumference side, the inner circumference side, etc.). In this way, the corrosion-resistant member 4 can protect the conductive member 3 from the plasma atmosphere.

[0103] The average maximum displacement calculated from the load-displacement curve obtained in the nanoindentation test performed on the conductive member 3 under the following test conditions is preferably between 0.5 μm and 10 μm. If the displacement is within this range, process efficiency can be more reliably improved. (Test conditions) Measurement temperature: 25°C Indenter used: Berkovich indenter Loading speed: 0.05 mN / sec Maximum load: 0.5 mN Maximum load holding time: 10 seconds Number of measurement points: n = 5

[0104] The average maximum displacement calculated from the load-displacement curve obtained in the nanoindentation test performed on the heat conductive member 3 under the following test conditions is preferably 0.5 μm or more and 10 μm or less. When the displacement is within this range, the heat conductive member 3 can exhibit good heat uniformity and durability. (Test conditions) Measurement temperature: 25°C Indenter used: Berkovich indenter Loading speed: 0.05 mN / sec Maximum load: 0.5 mN Maximum load holding time: 10 seconds Number of measurement points: n = 5

[0105] The average maximum displacement calculated from the load-displacement curve obtained in the nanoindentation test performed on the conductive member 3 under the following test conditions is preferably 0.5 μm or more and 10 μm or less. When the displacement is within this range, the conductive member 3 can exhibit stable plasma distribution control and durability. (Test conditions) Measurement temperature: 25°C Indenter used: Berkovich indenter Loading speed: 0.05 mN / sec Maximum load: 0.5 mN Maximum load holding time: 10 seconds Number of measurement points: n = 5

[0106] Furthermore, in the edge ring 1 and conductive member (conductive sheet) 3 of this embodiment, the ratio of the average maximum displacement (average maximum displacement / thickness when uncompressed) to the thickness of the conductive member 3 before load application in the nanoindentation test is preferably 0.2% or more and 6.5% or less. If this ratio is within this range, the conductive member 3 can more reliably improve process efficiency.

[0107] Furthermore, in the edge ring 1 and heat conductive member (heat conductive sheet) 3 of this embodiment, the ratio of the average maximum displacement (average maximum displacement / thickness when uncompressed) to the thickness of the heat conductive member 3 before load application in the nanoindentation test is preferably 0.2% or more and 6.5% or less. If this ratio is within this range, the heat conductive member 3 can exhibit good heat uniformity and durability.

[0108] Furthermore, in the edge ring 1 and conductive member (conductive sheet) 3 of this embodiment, the ratio of the average maximum displacement (average maximum displacement / thickness when uncompressed) to the thickness of the conductive member 3 before load application in the nanoindentation test is preferably 0.2% or more and 6.5% or less. If this ratio is within this range, the conductive member 3 can exhibit stable plasma distribution control and durability.

[0109] Furthermore, in the edge ring 1 and conductive member (conductive sheet) 3 of this embodiment, the average creep amount during the maximum load holding time, calculated from the load-displacement curve obtained in the nanoindentation test on the conductive member 3, is preferably 0.05 μm or more and 0.5 μm or less. If this average creep amount is within this range, the conductive member 3 can conform to and adhere to the surface shape of the plasma-resistant member 5. Process efficiency can be improved more reliably.

[0110] Furthermore, in the edge ring 1 and heat conductive member (heat conductive sheet) 3 of this embodiment, the average creep amount during the maximum load holding time, calculated from the load-displacement curve obtained in the nanoindentation test on the heat conductive member 3, is preferably 0.05 μm or more and 0.5 μm or less. If this average creep amount is within this range, the heat conductive member 3 can conform to and adhere to the surface shape of the plasma-resistant member 5. In addition, durability and thermal conductivity can be achieved simultaneously.

[0111] Furthermore, in the edge ring 1 and conductive member (conductive sheet) 3 of this embodiment, the average creep amount during the maximum load holding time, calculated from the load-displacement curve obtained in the nanoindentation test on the conductive member 3, is preferably 0.05 μm or more and 0.5 μm or less. If this average creep amount is within this range, the conductive member 3 can conform to and adhere to the surface shape of the plasma-resistant member 5. In addition, stable plasma distribution controllability and durability can be achieved simultaneously.

[0112] Furthermore, in the edge ring 1 and conductive member (conductive sheet) 3 of this embodiment, the ratio of the average creep amount (average creep amount / thickness when uncompressed) to the thickness of the conductive member 3 before load application in the nanoindentation test is preferably 0.0% or more and 0.5% or less. If this ratio is within this range, the conductive member 3 can conform to and adhere to the surface shape of the plasma-resistant member 5. Process efficiency can be improved more reliably.

[0113] Furthermore, in the edge ring 1 and heat conductive member (heat conductive sheet) 3 of this embodiment, the ratio of the average creep amount (average creep amount / thickness when uncompressed) to the thickness of the heat conductive member 3 before load application in the nanoindentation test is preferably 0.0% or more and 0.5% or less. If this ratio is within this range, the heat conductive member 3 can conform to the surface shape of the plasma-resistant member 5 and adhere closely. In addition, durability and thermal conductivity can be achieved simultaneously.

[0114] Furthermore, in the edge ring 1 and conductive member (conductive sheet) 3 of this embodiment, the ratio of the average creep amount (average creep amount / thickness when uncompressed) to the thickness of the conductive member 3 before load application in the nanoindentation test is preferably 0.0% or more and 0.5% or less. If this ratio is within this range, the conductive member 3 can conform to the surface shape of the plasma-resistant member 5 and adhere closely. In addition, stable plasma distribution controllability and durability can be achieved simultaneously.

[0115] Furthermore, in the edge ring 1 and conductive member (conductive sheet) 3 of this embodiment, the average unloaded displacement of the conductive member 3, calculated from the load-displacement curve obtained in the nanoindentation test described above, is preferably 0.0 μm or more and 4.0 μm or less. Within this range, the conductive member 3 can exhibit suitable durability.

[0116] Furthermore, in the edge ring 1 and heat conductive member (heat conductive sheet) 3 of this embodiment, the average unloaded displacement of the heat conductive member 3, calculated from the load-displacement curve obtained in the nanoindentation test described above, is preferably 0.0 μm or more and 4.0 μm or less. Within this range, the heat conductive member 3 can exhibit suitable durability. Moreover, stable thermal conductivity and durability can be achieved simultaneously.

[0117] Furthermore, in the edge ring 1 and conductive member (conductive sheet) 3 of this embodiment, the average unloaded displacement of the conductive member 3, calculated from the load-displacement curve obtained in the nanoindentation test described above, is preferably 0.0 μm or more and 4.0 μm or less. Within this range, the conductive member 3 can exhibit suitable durability. Moreover, stable plasma distribution controllability and durability can be achieved simultaneously.

[0118] Furthermore, in the edge ring 1 and conductive member (conductive sheet) 3 of this embodiment, the average Martens hardness of the conductive member 3, calculated by the nanoindentation test described above, is 0.1 N / mm². 2 More than 5000N / mm 2 The following is preferable. Within these ranges, the conductive member 3 will have suitable durability. Furthermore, an edge ring 1 with a longer lifespan can be provided.

[0119] Furthermore, in the edge ring 1 and heat conductive member (heat conductive sheet) 3 of this embodiment, the average Martens hardness of the heat conductive member 3, calculated by the nanoindentation test described above, is 0.1 N / mm². 2 More than 5000N / mm 2 The following is preferable. Within these ranges, the heat conductive member 3 will have suitable durability. Furthermore, it is possible to provide an edge ring 1 with a longer lifespan that achieves both stable heat conductivity and durability.

[0120] Furthermore, in the edge ring 1 and conductive member (conductive sheet) 3 of this embodiment, the average Martens hardness of the conductive member 3, calculated by the nanoindentation test described above, is 0.1 N / mm². 2 More than 5000N / mm 2 The following is preferable. Within these ranges, the conductive member 3 will have suitable durability. Furthermore, it is possible to provide an edge ring 1 with a longer lifespan that achieves both stable plasma distribution control and durability.

[0121] Furthermore, in the edge ring 1 and conductive member (conductive sheet) 3 of this embodiment, the thickness of the conductive member 3 when uncompressed is preferably 30 μm or more and 600 μm or less. If the thickness of the conductive member 3 is within this range, the conductive member 3 can conform to the surface shape of the plasma-resistant member 5 and adhere closely. Process efficiency can be improved more reliably.

[0122] Furthermore, in the edge ring 1 and heat conductive member (heat conductive sheet) 3 of this embodiment, the thickness of the heat conductive member 3 when uncompressed is preferably 30 μm or more and 600 μm or less. If the thickness of the heat conductive member 3 is within this range, the heat conductive member 3 can conform to the surface shape of the plasma-resistant member 5 and adhere closely, thereby suppressing thermal non-uniformity in the plasma processing apparatus. Moreover, even if the edge ring 1 is removed from the plasma-resistant member 5 and reused, thermal uniformity can be maintained, improving durability. As a result, it becomes possible to provide an edge ring 1 with a longer lifespan. In addition, the increase in thermal resistance due to the thickness of the heat conductive member 3 being too large can be suppressed, and good thermal conductivity can be achieved.

[0123] Furthermore, in the edge ring 1 and conductive member (conductive sheet) 3 of this embodiment, the thickness of the conductive member 3 when uncompressed is preferably 30 μm or more and 600 μm or less. If the thickness of the conductive member 3 is within this range, the conductive member 3 can conform to the surface shape of the plasma-resistant member 5 and adhere closely, thereby suppressing non-uniformity of conductivity in the plasma processing apparatus. Moreover, even if the edge ring 1 is removed from the plasma-resistant member 5 and reused, the plasma distribution controllability can be maintained, improving durability. As a result, it becomes possible to provide an edge ring 1 with a longer lifespan. In addition, the increase in electrical resistance due to the thickness of the conductive member 3 being too large can be suppressed, and good conductivity (plasma distribution controllability) can be exhibited.

[0124] Furthermore, in the edge ring 1 and conductive member (conductive sheet) 3 of this embodiment, it is preferable that the thermal conductivity of the conductive member 3 in the direction perpendicular to the upper surface of the conductive member 3 is 1.0 W / m·K or higher. Within this range, the conductive member 3 has excellent thermal conductivity and can effectively transfer heat from the edge ring 1.

[0125] Furthermore, in the edge ring 1 and heat conductive member (heat conductive sheet) 3 of this embodiment, it is preferable that the thermal conductivity of the heat conductive member 3 in the direction perpendicular to the upper surface of the heat conductive member 3 is 1.0 W / m·K or higher. Within this range, the heat conductive member 3 has excellent thermal conductivity and can transfer heat well from the edge ring 1.

[0126] Furthermore, in the edge ring 1 and conductive member (conductive sheet) 3 of this embodiment, it is preferable that the thermal conductivity of the conductive member 3 in the direction perpendicular to the upper surface of the conductive member 3 is 1.0 W / m·K or higher. Within this range, the conductive member 3 has excellent thermal conductivity and can effectively transfer heat from the edge ring 1.

[0127] Furthermore, the edge ring 1, conductive member (conductive sheet) 3, heat conductive member (heat conductive sheet) 3, and conductive member (conductive sheet) 3 in this embodiment are not limited to the above-described embodiments or combinations.

[0128] For example, the above example mainly shows the use of edge ring 1, conductive member (conductive sheet) 3, heat conductive member (heat conductive sheet) 3, conductive member (conductive sheet) 3, and corrosion-resistant member 4 in a plasma atmosphere, but it can also be used in etching apparatuses and methods that utilize dry etching gases other than plasma gas.

[0129] The present disclosure will be described in more detail below with reference to examples and comparative examples.

[0130] [Method for Manufacturing Thermal Conductive Sheets 3A, 3C-3G] Thermal conductive sheets 3A, 3C-3G were manufactured as follows. Specifically, 100 parts by weight of a fluoropolymer (Chemours, Viton GLT-200S: elastic material) and 230 parts by weight of carbon fiber milled fiber (Mitsubishi Chemical, TR03M: thermal conductive material) were cut to the aspect ratio shown in Table 1, and these were put into a rubber kneader set to 120°C and kneaded for 50 minutes. Then, 12 parts by weight of liquid fluororubber (Daikin, G-8002: elastic material) was added and kneaded for a further 30 minutes. Subsequently, 4 parts by weight each of peroxide (NOF Corporation, Perbutyl P-40) and pentaerythritol tetraacrylate (Sigma-Aldrich) were added to prepare a resin composition, which was then formed into a sheet using a press machine (AS ONE Corporation, small hot press) set to 120°C. The resin composition was then crosslinked by placing it in a constant temperature dryer (Yamato Scientific Co., Ltd., Inert Oven DN411I, nitrogen gas atmosphere) set to 175°C for 30 minutes. The temperature was then raised to 200°C and heated for 4 hours to produce the thermal conductive sheets 3A, 3C-3G. The physical properties of the obtained thermal conductive sheets 3A, 3C-3G are shown in Table 1.

[0131] [Method for Manufacturing Thermal Conductive Sheet 3B] Thermal conductive sheet 3B was manufactured in the same manner as thermal conductive sheet 3A, except that 55 parts by weight of carbon fiber milled fiber was used. The physical properties of the obtained thermal conductive sheet 3B are shown in Table 1.

[0132] [Method for Manufacturing Thermal Conductive Sheet 3H] Thermal conductive sheet 3H was manufactured as follows. Specifically, 100 parts by weight of acrylic rubber (Osaka Soda Co., Ltd., Lacrestar AS: elastic material) and 270 parts by weight of carbon fiber milled fiber (Mitsubishi Chemical Corporation, TR03M: thermal conductive material) were cut to the aspect ratio shown in Table 1, and these were put into a rubber kneader set to 125°C and kneaded for 50 minutes. After that, 0.2 parts by weight of a crosslinking agent (Sigma-Aldrich, 2,4,6-trimercapto-S-triazine) and 0.7 parts by weight of dibutyldithiocarbamate zinc(II) (Sigma-Aldrich) were added to obtain a resin composition. This resin composition was made into a sheet using a press machine (AS ONE Corporation, small hot press) set to 125°C. Subsequently, the resin composition was crosslinked by placing it in a constant-temperature dryer (Yamato Scientific Co., Ltd., Inert Oven DN411I, nitrogen gas atmosphere) set to 175°C for 30 minutes. Then, the temperature was raised to 180°C and heated for 4 hours to produce a thermal conductive sheet 3H. The physical properties of the obtained thermal conductive sheet 3H are shown in Table 1.

[0133] [Method for Manufacturing Thermal Conductive Sheet 3I] Thermal conductive sheet 3I was manufactured as follows. Specifically, 100 parts by weight of silicone rubber (Aica Kogyo Co., Ltd., SE-AG4HR1: elastic material) and 310 parts by weight of alumina (Sumitomo Chemical Co., Ltd., spherical alumina AA-20: thermal conductive material) were kneaded for 30 minutes under 30°C conditions to obtain a resin composition, as shown in Table 1. This resin composition was poured into a Teflon® container (length 200 mm, width 200 mm, height 20 mm) and placed in a constant temperature dryer (Yamato Scientific Co., Ltd., Inert Oven DF412) set to 130°C for 60 minutes to crosslink the resin composition and produce thermal conductive sheet 3I. The physical properties of the obtained thermal conductive sheet 3I are shown in Table 1.

[0134] [Method for Manufacturing Thermal Conductive Sheet 3J] Thermal conductive sheet 3J was manufactured as follows. Specifically, 100 parts by weight of acrylic rubber (manufactured by Osaka Soda Co., Ltd., Lacrestar AS: elastic material) and 60 parts by weight of carbon fiber milled fiber (manufactured by Mitsubishi Chemical Corporation, TR03M: thermal conductive material) were cut to the aspect ratio shown in Table 1, and these were put into a rubber kneader set to 125°C and kneaded for 50 minutes. Then, 20 parts by weight of liquid acrylic rubber (manufactured by Toagosei Co., Ltd., Alphon UP-1110: elastic material) was added and kneaded for a further 30 minutes. After that, 0.2 parts by weight of a crosslinking agent (manufactured by Sigma-Aldrich, 2,4,6-trimercapto-S-triazine) and 0.7 parts by weight of zinc(II) dibutyldithiocarbamate (manufactured by Sigma-Aldrich) were added to obtain a resin composition. This resin composition was formed into a sheet using a press machine (AS ONE Corporation, small-scale hot press) set to 125°C. Then, it was placed in a constant-temperature dryer (Yamato Scientific Co., Ltd., Inert Oven DN411I, nitrogen gas atmosphere) set to 175°C for 30 minutes to crosslink the resin composition. Afterward, the temperature was raised to 180°C and heated for 4 hours to produce the heat-conducting sheet 3J.

[0135] [Method for Manufacturing Edge Rings] (Example 1) An edge ring 1A of Example 1 was manufactured using the prepared heat conductive sheet 3A. Specifically, a heat conductive sheet 3A cut to an outer diameter of 335 mm and an inner diameter of 305 mm was laminated onto the surface of a ring-shaped alumina plate (main body 2: outer diameter 340 mm, inner diameter 300 mm, thickness 16 mm), and the edge ring 1A was manufactured by heating and pressing at a temperature of 150°C and a pressure of 10 MPa for 10 minutes.

[0136] (Examples 2 to 10) In the same manner as in Example 1, edge rings 1B to 1J of Examples 2 to 10 were fabricated using thermal conductive sheets 3B to 3J, respectively.

[0137] [Example of corrosion-resistant component 4] 100 parts by weight of a fluoropolymer (Chemours, Viton GLT-200S), 3 parts by weight each of peroxide (NOF Corporation, Perbutyl P-40), and pentaerythritol tetraacrylate (Sigma-Aldrich) were placed in a rubber kneader set to 120°C and kneaded for 60 minutes to obtain a resin composition. This resin composition was molded into a round cord shape using an extruder set to 120°C. Then, the resin composition was placed in a constant temperature dryer (Yamato Scientific Co., Ltd., Inert Oven DN411I, nitrogen gas atmosphere) set to 175°C for 30 minutes to crosslink the resin composition. After that, the temperature was raised to 200°C and heated for 4 hours to produce corrosion-resistant component 4. For each embodiment, corrosion-resistant members 4 were prepared: 4A with a diameter of 0.220 mm, 4B with a diameter of 0.033 mm, 4C with a diameter of 0.110 mm, 4D with a diameter of 0.660 mm, and 4E with a diameter of 1.100 mm. Subsequently, these corrosion-resistant members 4A to 4E were installed in a ring around the outer circumference of the heat conductive sheets in the edge rings 1A to 1J.

[0138] [Measurement Method] (Nanoindentation Test) The average Martens hardness, thickness displacement (average maximum displacement), average unloaded displacement, average post-peeling displacement, average creep, and average peel strength of each thermal conductive sheet 3 were calculated using the nanoindentation method in accordance with the international standard ISO 14577. Specifically, each thermal conductive sheet 3 obtained was cut into 10 mm wide x 10 mm long test pieces, which were placed in an ultra-micro indentation hardness tester (ENT-NEXUS, manufactured by Elionix Corporation). A measuring indenter was placed on one surface of the thermal conductive sheet, and measurements were taken under the following conditions to obtain each load-displacement curve (Figure 5 shows the load-displacement curve of thermal conductive sheet 3F as an example). This measurement was performed at five arbitrary locations on the aforementioned surface of the thermal conductive sheet, and the average values ​​of the calculated data (Martens hardness, thickness displacement (maximum displacement), unloaded displacement, post-peeling displacement, creep, peel strength, etc.) obtained from each load-displacement curve are shown in Table 1. <Measurement Conditions> Measurement Temperature: 25°C Indenter Used: Berkovich indenter Loading Speed: 0.05 mN / sec Maximum Load: 0.5 mN Maximum Load Holding Time: 10 seconds Number of Measurement Points: n=5

[0139] (Filling coefficient of thermal conductive material in the cross-section of the thermal conductive member (sheet)) The filling coefficient of the thermal conductive material in the cross-section of each thermal conductive sheet 3 was measured. That is, after cutting each thermal conductive sheet in a direction perpendicular to the surface, the resulting cross-section (see Figure 4) was observed using a scanning electron microscope (SEM), and the value obtained by the following formula was taken as each filling coefficient. Filling coefficient (%) = (Area occupied by thermal conductive material / Cross-sectional area of ​​thermal conductive sheet) × 100

[0140] [Measurement of Thermal Conducting Materials] (Storage Modulus and tanδ (Loss Tangent) of Elastic Materials) The storage modulus and tanδ of each elastic material used in thermal conducting materials 3A to 3J were measured using a dynamic viscoelasticity measuring device (TA Instruments HR-20) under the following conditions. Specifically, each elastic material was cut into a disc shape (diameter 10 mm, thickness 200 μm), and then the storage modulus and tanδ of each elastic material at 25°C were obtained under the conditions of a heating rate of 5°C / min and a measurement frequency of 10 Hz.

[0141] (Thermal Conductivity of Thermal Conductive Materials) The thermal conductivity of each thermal conductive material used in thermal conductive members 3A to 3J was measured as follows. Specifically, the thermal conductive material was placed in a container (internal dimensions: width 20 mm, length 20 mm, height 10 mm) with a fluorine coating applied to its surface until it was full, and then pressed into place using a hydraulic press at a pressure of 10 MPa and a temperature of 100°C for 60 minutes. The pressed thermal conductive material was removed and used as a test specimen. The thermal conductivity of these test specimens was measured using a thermal conductivity measuring device (NETZSCH, TCT716Lambda). The average value of the three test specimens was taken as the thermal conductivity of each thermal conductive material.

[0142] (Aspect Ratio of Thermal Conducting Materials) The method for calculating the aspect ratio of each thermal conducting material of thermal conducting members 3A to 3J is shown below. Specifically, each cut thermal conducting material (carbon fiber milled fiber) was observed at 10 points using a scanning electron microscope (SEM), and the value obtained by the following formula was taken as the aspect ratio. Aspect ratio = Average value of the maximum length (major axis, long side) of the thermal conducting material / Average value of the maximum length (or short side) in the direction perpendicular to the line segment parallel to the above maximum length

[0143] In the case of spherical alumina, the thermal conductive member (sheet) 3I was cut in a direction perpendicular to the surface, and the cross-section was observed at 10 points using a scanning electron microscope (SEM). The value obtained by the following formula was defined as the aspect ratio: Aspect ratio = Average value of the maximum length (major axis) of the thermal conductive material / Average value of the maximum length (minor axis) in the direction perpendicular to the line segment parallel to the aforementioned maximum length.

[0144] (Thermal conductivity of heat-conducting materials) The thermal conductivity of heat-conducting materials (sheets) 3A to 3J was measured. Specifically, disc-shaped test pieces (12.5 mm in diameter) were cut from each heat-conducting sheet, and the thermal conductivity was measured using a thermal conductivity measuring device (NETZSCH, TCT716Lambda). The average value of the three test pieces was taken as the thermal conductivity of each heat-conducting sheet.

[0145] [Evaluation Method] (Evaluation of Thermal Conductivity) The thermal conductivity of the thermal conductive members (sheets) 3A to 3J was evaluated as follows. Specifically, each thermal conductive sheet was cut into a disc shape (diameter 12.5 mm). Each of these cut thermal conductive sheets was sandwiched between disc-shaped alumina plates (diameter 12.5 mm, thickness 5.0 mm) on both sides, and pressed tightly together under conditions of 25°C, 0.1 MPa, and 1 minute to prepare each test piece. The thermal conductivity of these test pieces was measured using a thermal conductivity measuring device (NETZSCH, TCT716Lambda), and the average value of the three test pieces was used to evaluate the thermal conductivity of each thermal conductive sheet. The highest evaluation standard was set to "A", and the lowest evaluation standard was set to "D". Specifically, cases with a thermal conductivity of 5.0 W / m·K or higher were classified as "A", cases with a thermal conductivity of 2.0 W / m·K or higher but less than 5.0 W / m·K were classified as "B", cases with a thermal conductivity of 1.0 W / m·K or higher but less than 2.0 W / m·K were classified as "C", and cases with a thermal conductivity of less than 1.0 W / m·K were classified as "D".

[0146] (Evaluation of Adhesion) The adhesion of the heat conductive members (sheets) 3A to 3J was evaluated as follows. Specifically, each heat conductive sheet was cut into strips (width 50 mm, length 50 mm). These cut heat conductive sheets were sandwiched between two glass plates (width 100 mm, length 100 mm, thickness 5.0 mm), and pressurized at a temperature of 80°C and a pressure of 0.1 MPa for 30 minutes. The area in contact between the heat conductive sheet and the glass 10 seconds after unloading was calculated using publicly available image analysis software. The area of ​​the heat conductive sheet used was 2500 mm². 2 The value obtained by dividing by (width 50 mm x length 50 mm) was used to evaluate adhesion. The highest evaluation standard was "A+", and the lowest evaluation standard was "D". That is, (area of ​​the thermal conductive sheet in contact with the glass 10 seconds after unloading) / (area of ​​the thermal conductive sheet used 2500 mm) 2 If the percentage was 98% or higher, it was classified as "A+", if it was 95% or higher but less than 98%, it was classified as "A", if it was 92% or higher but less than 95%, it was classified as "B", if it was 60% or higher but less than 92%, it was classified as "C", and if it was less than 60%, it was classified as "D".

[0147] (Evaluation of Restorative Properties) The resilience (reusability) of the heat-conducting members (sheets) 3A to 3J was evaluated according to the following evaluation criteria. If the average displacement after peeling in the aforementioned nanoindentation test was 0.0 μm or more and less than 0.5 μm, it was classified as "A+", if it was 0.5 μm or more and less than 0.8 μm, it was classified as "A", if it was 0.8 μm or more and less than 1.5 μm, it was classified as "B", if it was 1.5 μm or more and less than 5 μm, and if it was 5 μm or more, or if visible surface roughness or undulation was observed regardless of the average displacement after peeling, or if measurement was not possible (cohesive failure during peeling, peeling impossible, etc.), it was classified as "D".

[0148] (Evaluation of Peelability) The peelability of the heat conductive members (sheets) 3A to 3J was evaluated according to the following evaluation criteria. If the average peel strength in the nanoindentation test described above was 0.0 μm or more and less than 0.5 μm, it was classified as "A+", if it was 0.5 μm or more and less than 0.8 μm, it was classified as "A", if it was 0.8 μm or more and less than 1.5 μm, it was classified as "B", if it was 1.5 μm or more and less than 5 μm, and if it was 5 μm or more, or if damage to the heat conductive member was observed regardless of the average peel strength, or if measurement was not possible (cohesive failure during peeling, peeling impossible, etc.), it was classified as "D".

[0149]

[0150] (Overall Evaluation 1) The results shown in Table 1 suggest the following trend: A negative correlation is suggested between the average Martens hardness of the heat-conducting material and the values ​​of average maximum displacement, average unloaded displacement, average displacement after delamination, average creep, and average delamination strength (hereinafter referred to as each physical property). In other words, the higher the average Martens hardness, the lower each physical property tended to be, and the lower the average Martens hardness, the higher each physical property tended to be.

[0151] Furthermore, it is suggested that the values ​​in the evaluation of thermal conductivity are correlated with the elastic modulus and loss tangent of the elastic material. The higher the elastic modulus of the elastic material or the lower the loss tangent, the smaller the value in the evaluation of thermal conductivity tended to be, and conversely, the lower the elastic modulus of the elastic material or the higher the loss tangent, the larger the value in the evaluation of thermal conductivity tended to be (Examples 1 and 9).

[0152] Furthermore, the values ​​used in the evaluation of thermal conductivity are not necessarily proportional to the thermal conductivity value, which is a characteristic value of the thermal conductive material. This suggests that the values ​​are influenced by the properties of the elastic material in the thermal conductive component (elastic modulus, loss tangent, thickness, etc.).

[0153] Furthermore, the results shown in Table 1 indicate that the average Martens hardness was 0.1 N / mm². 2 More than 1000N / mm 2 Below, especially 3N / mm 2 More than 500N / mm 2 The following conditions were found to result in a favorable evaluation regarding adhesion (Examples 3 and 10).

[0154] In Examples 1, 3 to 7, it was found that the greater the thickness of the heat conductive member (sheet), the lower the Martens hardness, and the smaller the thickness of the heat conductive member (sheet), the higher the Martens hardness. Conversely, the greater the thickness of the heat conductive member (sheet), the larger the physical properties, and the smaller the thickness of the heat conductive member (sheet), the smaller the physical properties tended to be. The average Martens hardness, average maximum displacement, average unloaded displacement, average displacement after peeling, average creep, and average peel strength represent the ease with which the heat conductive member deforms under stress. It was found that the greater the thickness of the heat conductive member (sheet), the easier it is to deform and the better the adhesion of the heat conductive member (sheet) to the plasma-resistant member. Conversely, the smaller the thickness of the heat conductive member (sheet), the more difficult it is to deform, but the better the resilience of the heat conductive member (sheet).

[0155] As described above, a comparison between Examples 1, 3 to 7 revealed that when the thickness of the heat conductive member is 30 μm or more and 600 μm or less, adhesion, resilience, and peelability can be exhibited more effectively.

[0156] Comparing Examples 1 and 2, both of which have a heat-conducting member thickness of 200 μm, it can be seen that when the packing density of the heat-conducting material is halved, the thermal conductivity of the heat-conducting member decreases, and each physical property increases. Surprisingly, in Example 2, although the evaluation of thermal conductivity deteriorated slightly, it was still good. This is thought to be because, compared to Example 1, in Example 2, although the packing density and thermal conductivity (single unit) of the heat-conducting material are lower, the adhesion to the glass plate is higher, resulting in a larger surface area that contributes to heat transfer. In other words, it can be seen that the packing density of the heat-conducting material (filler, etc.) in the heat-conducting member can be appropriately modified within the range of 30% to 70%.

[0157] Furthermore, while Example 10, which, like Examples 1 and 2, had a heat conductive member thickness of 200 μm, exhibited excellent adhesion, Examples 1 and 2 also showed excellent or good results in terms of resilience and peelability. Compared to Example 10, the elastic modulus of the elastic material in Examples 1 and 2 was larger, and the average maximum displacement, average unloaded displacement, and average creep amount were smaller. As a result, it is considered that the heat conductive members in Examples 1 and 2 exhibited good resilience and peelability as well as adhesion.

[0158] Furthermore, in Examples 1 and 8, where the thickness of the heat-conducting members was equivalent, Example 8 showed superior heat conductivity, adhesion, and peelability, while Example 1 also showed superior resilience. Compared to Example 8, the elastic modulus of the elastic material used in the heat-conducting member of Example 1 was larger, and the individual physical properties were smaller. As a result, it is thought that Example 1 exhibited not only heat conductivity, adhesion, and peelability, but also resilience.

[0159] In Example 9, the resilience and peelability were relatively good, while in Example 1, the thermal conductivity and adhesion were also excellent. Compared to Example 9, the average unloaded displacement, average displacement after peeling, average creep, and average peel strength of the thermal conductive member in Example 1 were larger. This suggests that not only resilience and peelability, but also thermal conductivity and adhesion were well exhibited.

[0160] [Method for preparing the conductive sheet] (Example 11) As the conductive sheet for Example 11, the thermal conductive (conductive) sheet 3A used in Example 1 was prepared.

[0161] (Examples 12 to 20) As conductive sheets for Examples 12 to 20, the same thermal conductive sheets (conductive sheets) 3B to 3J used in Examples 2 to 10 were prepared, as in Example 11.

[0162] (Examples 21 and 22) Conductive sheets 3K and 3L were prepared as conductive sheets for Examples 21 and 22, respectively. Specifically, they were prepared in the same manner as thermal conductive sheet 3A, except that 30 parts by weight and 25 parts by weight of milled carbon fiber were used, respectively. The physical properties of the obtained conductive sheets 3K and 3L are shown in Table 2.

[0163] [Evaluation Method] (Measurement of Volume Resistivity) The volume resistivity of conductive materials (conductive sheets) 3A to 3L and alumina plates (2.0 mm thick) was measured as follows. Specifically, first, each conductive sheet was cut into a square (50 mm wide, 50 mm long) to obtain test pieces. Next, the resistivity of each test piece was measured using a resistivity meter (Nitto Seikou Analytech Co., Ltd., Loresta GP) by the four-terminal method, and the volume resistivity was calculated from the average value (n=5) of the obtained values. The volume resistivity of the alumina plate was 1.0 × 10⁻⁶. 7 The values ​​were greater than Ω·cm. The results are shown in Table 2.

[0164] (Resistance Evaluation) The resistance of conductive materials (conductive sheets) 3A to 3L was evaluated as follows. Specifically, each conductive sheet cut into a square (10 mm wide, 10 mm long) and two 2 mm thick aluminum plates were prepared. Next, the aluminum plates, conductive sheets, and aluminum plates were stacked in that order, and this stack was pressed together under pressure at 120°C, 0.1 MPa for 30 minutes to create a test specimen. Here, the surface on one side of the aluminum plate of the test specimen was designated as the top surface, and the surface on the other side of the aluminum plate was designated as the bottom surface. Immediately after preparing the test specimen, a resistance meter (HIOKI RM3545A) was used to contact the top and bottom surfaces of the test specimen, respectively, with the measuring terminals, and the average value of the obtained resistance (n=5) was used to evaluate the resistance. The results are shown in Table 2. The results of Evaluation 1 corresponding to Examples 11 to 20 (Examples 1 to 10) are also shown in Table 2.

[0165] The resistance values ​​were evaluated using a scale from "Excellent (A)" for the highest rating to "Acceptable (C)" for the lowest rating. Specifically, an average resistance value of less than 10.0 Ω was rated "Excellent (A)", an average resistance value of 10.0 Ω or more but less than 1000 Ω was rated "Good (B)", and an average resistance value of 1000 Ω or more was rated "Acceptable (C)".

[0166] The smaller the measured resistance value, the more the potential difference between the main body 2 and the plasma-resistant member (electrostatic chuck) 5 is suppressed when the main body 2 and the plasma-resistant member (electrostatic chuck) 5 are connected via the conductive member. By electrically connecting the main body 2 and the plasma-resistant member 5 with the conductive member (conductive member) 3 having these characteristics, it becomes possible to adjust the electric field in the plasma processing apparatus more stably. Furthermore, by directly electrically connecting the edge ring 1 (main body 2) and the plasma-resistant member 5 via the conductive member 3 and forming a circuit with a low resistance value, it is suggested that power can be supplied to the plasma efficiently and uniformly. Note that directly electrically and thermally connected means that conductive members are in physical contact and connected in a state in which current and heat can be directly transmitted.

[0167]

[0168] (Overall Evaluation 2) From the results in Table 2, it was observed that the lower the volume resistivity of the conductive material (conductive sheet), the lower the resistance value and the better the evaluation tended to be (Examples 11, 12, 18-22). If the volume resistivity was 4.0 Ω·cm or less (Examples 11, 12, 18, 20-21), the resistance value was evaluated as "A", while in Example 22 (4.55 Ω·cm), which exceeded this, the evaluation dropped to "B", and in Example 19 (1.0 × 10), which was close to an insulator... 7 For values ​​of Ω·cm or higher, the rating was "Acceptable (C)". The results of Overall Evaluation 1 (Examples 1-10), corresponding to Examples 11-20, were also used in Overall Evaluation 2.

[0169] In Examples 11, 13-17, although the resistance value evaluation was the same, it was found that the greater the thickness of the conductive sheet, the lower the Martens hardness tended to be, and the smaller the thickness of the conductive sheet, the higher the Martens hardness tended to be. Conversely, it was also found that the greater the thickness of the conductive sheet, the larger the physical properties related to deformation tended to be, and the smaller the thickness of the conductive sheet, the smaller the physical properties tended to be. The average Martens hardness, average maximum displacement, average unloaded displacement, average displacement after peeling, average creep, and average peel strength represent the ease with which the conductive sheet deforms under stress. It was found that the greater the thickness of the conductive sheet, the easier it is to deform and the better the adhesion of the conductive sheet to the plasma-resistant material, and the smaller the thickness of the conductive sheet, the more difficult it is to deform but the better the resilience of the conductive sheet.

[0170] Examples 11, 12, 14, and 15 exhibited excellent adhesion, peelability, and thermal conductivity. In particular, Example 11 showed excellent resilience. Examples 12 and 15 also showed good resilience. Compared to Example 20, the average maximum displacement, average unloaded displacement, and average creep were smaller. This suggests that the conductive sheets in Examples 11, 12, 14, and 15 exhibited better adhesion, thermal conductivity, resilience, and peelability compared to Example 20.

[0171] Furthermore, in Examples 11 and 18, where the thickness of the conductive sheets was equivalent, Example 18 showed superior adhesion and peelability, while Example 11 also showed superior resilience. Compared to Example 18, the elastic modulus of the elastic material used in the conductive sheet of Example 11 was higher, and the various physical properties were lower. As a result, it is thought that Example 11 exhibited not only adhesion and peelability but also resilience.

[0172] In Example 19, the resilience and peelability were relatively good, while in Example 11, the adhesion was also excellent. Compared to Example 19, the average unloaded displacement, average displacement after peeling, average creep, and average peel strength of the conductive sheet in Example 11 were larger. This suggests that not only resilience and peelability, but also adhesion was well exhibited.

[0173] [Note] The matters described in each of the above embodiments are noted below.

[0174] (Note 1) An edge ring 1 equipped with a conductive member 3, wherein the conductive member 3 is an elastic body, and the edge ring 1 is used in contact with a plasma-resistant member 5 via the conductive member 3.

[0175] (Note 2) The edge ring 1 as described in (Note 1), comprising a corrosion-resistant member 4, wherein the corrosion-resistant member 4 is an elastic body, and the edge ring 1 is used in contact with the plasma-resistant member 5 via the conductive member 3 and the corrosion-resistant member 4, respectively.

[0176] (Note 3) The edge ring 1 as described in (Note 2), wherein when the side of the edge ring 1 on which the conductive member 3 and the corrosion-resistant member 4 are provided is pressed against a flat plate at a pressure of 0.1 MPa, the conductive member 3 and the corrosion-resistant member 4 are in contact with the flat plate.

[0177] (Note 4) The edge ring 1 described in (Note 2) or (Note 3), wherein the thickness of the corrosion-resistant member 4 when uncompressed is different from the thickness of the conductive member 3.

[0178] (Note 5) The edge ring 1 is provided with a recess 2a for providing a corrosion-resistant member 4, and the depth of the recess 2a is set such that when the side of the edge ring 1 on which the conductive member 3 and the corrosion-resistant member 4 are provided is pressed against a flat plate at a pressure of 0.1 MPa, the thickness of the conductive member 3 becomes thinner than the thickness of the corrosion-resistant member 4, as described in any of (Note 2) to (Note 4).

[0179] (Note 6) The corrosion-resistant member 4 is the edge ring 1 described in any of (Note 2) to (Note 5), which is arranged on the outer surface side of the conductive member 3.

[0180] (Note 7) The edge ring 1 according to any one of (Note 1) to (Note 6), wherein the edge ring 1 includes a conductive member 3 and a main body 2, the conductive member 3 is a sheet layer, and the sheet layer 3 and the main body 2 are directly joined.

[0181] (Note 8) The conductive member 3 is at least one of either a heat conductive member or a conductive member, as described in any of (Note 1) to (Note 7) of the edge ring 1.

[0182] (Note 9) The conductive member 3 comprises an upper surface and a lower surface, the lower surface being a conductive member 3 used in contact with the plasma-resistant member 5, and the conductive member 3 is an elastic conductive member 3.

[0183] (Note 10) The average maximum displacement of the conductive member 3 described in (Note 9) is 0.5 μm or more and 10 μm or less, calculated from the load-displacement curve obtained by a nanoindentation test performed under the following test conditions on the lower surface of the conductive member 3. (Test conditions) Measurement temperature: 25°C Indenter used: Berkovich indenter Loading speed: 0.05 mN / sec Maximum load: 0.5 mN Maximum load holding time: 10 seconds Number of measurement points: n=5

[0184] (Note 11) The conductive member 3 as described in (Note 9) or (Note 10), wherein the ratio of the average maximum displacement to the thickness of the conductive member 3 before load application in the nanoindentation test is 0.2% or more and 6.5% or less.

[0185] (Note 12) The average creep amount during the maximum load holding time, calculated from the load-displacement curve obtained by a nanoindentation test performed under the following test conditions on the lower surface of the conductive member 3, is 0.05 μm or more and 0.5 μm or less, as specified in any of (Note 9) to (Note 11). (Test conditions) Measurement temperature: 25°C Indenter used: Berkovich indenter Loading speed: 0.05 mN / sec Maximum load: 0.5 mN Maximum load holding time: 10 seconds Number of measurement points: n=5

[0186] (Note 13) The conductive member 3 according to any one of (Note 9) to (Note 12), wherein the ratio of the average creep amount to the thickness of the conductive member 3 before load application in the nanoindentation test is 0.0% or more and 0.5% or less.

[0187] (Note 14) The average unloaded displacement of the lower surface of the conductive member 3, calculated from the load-displacement curve obtained by a nanoindentation test performed under the following test conditions, is 0.0 μm or more and 4.0 μm or less, as specified in any of (Note 9) to (Note 13). (Test conditions) Measurement temperature: 25°C Indenter used: Berkovich indenter Loading speed: 0.05 mN / sec Maximum load: 0.5 mN Maximum load holding time: 10 seconds Number of measurement points: n = 5

[0188] (Note 15) The average Martens hardness of the lower surface of the conductive member 3, calculated by the nanoindentation test performed under the following test conditions, is 0.1 N / mm². 2 More than 5000N / mm 2 The conductive member 3 is as follows, as described in any of (Appendix 9) to (Appendix 14). (Test conditions) Measurement temperature: 25°C Indenter used: Berkovich indenter Loading speed: 0.05 mN / sec Maximum load: 0.5 mN Maximum load holding time: 10 seconds Number of measurement points: n = 5

[0189] (Note 16) The thickness of the conductive member 3 when uncompressed is 30 μm or more and 600 μm or less, as described in any of (Note 9) to (Note 15).

[0190] (Note 17) The conductive member 3 described in any of (Note 9) to (Note 16) has a thermal conductivity of 1.0 W / m·K or more in the direction perpendicular to the upper surface.

[0191] (Note 18) A conductive member 3 as described in any of (Note 9) to (Note 17), which is used to support the edge ring 1 on its upper surface.

[0192] (Note 19) The conductive member 3 is a heat conductive member as described in any of (Note 9) to (Note 18).

[0193] (Note 20) The conductive member 3 is a conductive member as described in any of (Note 9) to (Note 18).

[0194] (Note 21) The conductive member 3 described in (Note 20), wherein the volume resistivity of the conductive member 3 is smaller than the volume resistivity of the edge ring 1 placed on the upper surface of the conductive member 3.

[0195] (Note 22) The conductive member 3 described in (Note 20) or (Note 21), wherein the volume resistivity of the conductive member 3 is 4.0 Ω·cm or less.

[0196] (Note 23) The conductive member 3 described in (Note 20) or (Note 21), wherein the volume resistivity of the conductive member 3 is 0.1 Ω·cm or more and 0.4 Ω·cm or less.

[0197] (Note 24) A conductive sheet 3 comprising a sheet layer formed from any of the conductive members 3 described in (Note 9) to (Note 18).

[0198] (Note 25) The conductive sheet 3 is a thermal conductive sheet as described in (Note 23).

[0199] (Note 26) The conductive sheet 3 is the conductive sheet 3 described in (Note 23).

[0200] (Note 27) The conductive member 3 is a heat conductive member or a conductive member, as described in any of (Note 1) to (Note 7) of the edge ring 1.

Claims

1. An edge ring equipped with a conductive member, wherein the conductive member is an elastic body, and the edge ring is used in contact with a plasma-resistant member via the conductive member.

2. The edge ring according to claim 1, comprising a corrosion-resistant member, wherein the corrosion-resistant member is an elastic body, and the edge ring is used in contact with a plasma-resistant member via the conductive member and the corrosion-resistant member, respectively.

3. The edge ring according to claim 2, wherein when the side of the edge ring on which the conductive member and the corrosion-resistant member are provided is pressed against a flat plate at a pressure of 0.1 MPa, the conductive member and the corrosion-resistant member are in contact with the flat plate.

4. The edge ring according to claim 2 or 3, wherein the thickness of the corrosion-resistant member when uncompressed is different from the thickness of the conductive member.

5. The edge ring according to any one of claims 2 to 4, wherein the edge ring is provided with a recess for accommodating the corrosion-resistant member, and the depth of the recess is set such that when the side of the edge ring on which the conductive member and the corrosion-resistant member are provided is pressed against a flat plate at a pressure of 0.1 MPa, the thickness of the conductive member becomes thinner than the thickness of the corrosion-resistant member.

6. The edge ring according to any one of claims 2 to 5, wherein the corrosion-resistant member is disposed on the outer surface side of the conductive member.

7. The edge ring according to any one of claims 1 to 6, wherein the edge ring includes the conductive member and the main body, the conductive member is a sheet layer, and the sheet layer and the main body are directly joined together.

8. The edge ring according to any one of claims 1 to 7, wherein the conductive member is at least one of a heat conductive member or a conductive member.

9. A conductive member comprising an upper surface and a lower surface, wherein the lower surface is a conductive member used in contact with a plasma-resistant member, and the conductive member is an elastic conductive member.

10. The conductive member according to claim 9, wherein the average maximum displacement calculated from the load-displacement curve obtained by a nanoindentation test performed on the lower surface of the conductive member under the following test conditions is 0.5 μm or more and 10 μm or less. (Test conditions) Measurement temperature: 25°C Indenter used: Berkovich indenter Loading speed: 0.05 mN / sec Maximum load: 0.5 mN Maximum load holding time: 10 seconds Number of measurement points: n = 5 11. The conductive member according to claim 10, wherein in the nanoindentation test, the ratio of the average maximum displacement to the thickness of the conductive member before load application is 0.2% or more and 6.5% or less.

12. The conductive member according to any one of claims 9 to 11, wherein the average creep amount during the maximum load holding time, calculated from the load-displacement curve obtained by a nanoindentation test performed on the lower surface of the conductive member under the following test conditions, is 0.05 μm or more and 0.5 μm or less. (Test conditions) Measurement temperature: 25°C Indenter used: Berkovich indenter Loading speed: 0.05 mN / sec Maximum load: 0.5 mN Maximum load holding time: 10 seconds Number of measurement points: n = 5 13. The conductive member according to any one of claims 9 to 12, wherein in the nanoindentation test, the ratio of the average creep amount to the thickness of the conductive member before load application is 0.0% or more and 0.5% or less.

14. The conductive member according to any one of claims 9 to 13, wherein the average unloaded displacement of the lower surface of the conductive member, calculated from the load-displacement curve obtained by a nanoindentation test performed under the following test conditions, is 0.0 μm or more and 4.0 μm or less. (Test conditions) Measurement temperature: 25°C Indenter used: Berkovich indenter Loading speed: 0.05 mN / sec Maximum load: 0.5 mN Maximum load holding time: 10 seconds Number of measurement points: n = 5 15. The average Martens hardness of the lower surface of the conductive member, calculated by a nanoindentation test performed under the following test conditions, is 0.1 N / mm². 2 More than 5000N / mm 2 The conductive member according to any one of claims 9 to 14, as follows: (Test conditions) Measurement temperature: 25°C Indenter used: Berkovich indenter Loading speed: 0.05 mN / sec Maximum load: 0.5 mN Maximum load holding time: 10 seconds Number of measurement points: n = 5 16. The conductive member according to any one of claims 9 to 15, wherein the thickness of the conductive member when uncompressed is 30 μm or more and 600 μm or less.

17. The conductive member according to any one of claims 9 to 16, wherein the thermal conductivity in the direction perpendicular to the upper surface is 1.0 W / m·K or more.

18. The conductive member according to any one of claims 9 to 17, which is used to support an edge ring on the upper surface.

19. The heat conductive member according to any one of claims 9 to 18, wherein the conductive member is a heat conductive member.

20. The conductive member is a conductive member according to any one of claims 9 to 18.

21. The conductive member according to claim 20, wherein the volume resistivity of the conductive member is smaller than the volume resistivity of the edge ring disposed on the upper surface of the conductive member.

22. The conductive member according to claim 20 or claim 21, wherein the volume resistivity of the conductive member is 4.0 Ω·cm or less.

23. The conductive member according to claim 20 or claim 21, wherein the volume resistivity of the conductive member is 0.1 Ω·cm or more and 0.4 Ω·cm or less.

24. A conductive sheet comprising a sheet layer formed from a conductive member according to any one of claims 9 to 18.

25. The thermal conductive sheet according to claim 24, wherein the conductive sheet is a thermal conductive sheet.

26. The conductive sheet according to claim 24, wherein the conductive sheet is a conductive sheet.

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