Resin sheet and molded body

Abstract

A resin sheet comprising a composition containing 30 mass% or more and less than 90 mass% of a polycarbonate resin (A), 5-60 mass% of at least one resin (X) selected from a styrene-based resin, an ester-based resin, and an acrylic resin, and more than 0 mass% and 25 mass% or less of a conductive filler (B) (provided that the total of each component does not exceed 100 mass%). A resin sheet comprising a composition containing 30 mass% or more and less than 90 mass% of a polycarbonate resin (A), 10-60 mass% of at least one resin (X) selected from a styrene-based resin, an ester-based resin, and an acrylic resin, and more than 0 mass% and 25 mass% or less of a conductive filler (B) (provided that the total of each component does not exceed 100 mass%).

Description

Resin sheets and molded articles

[0001] This invention relates to resin sheets and molded articles.

[0002] Resin sheets are widely used to package final or intermediate industrial products, including electronic components. Resin sheets used in such applications are often given antistatic and conductive properties, preventing dust and debris from adhering to electronic components such as semiconductors and microchips due to static electricity. Furthermore, for electronic component packaging, resin sheets are often processed after extrusion molding, such as by punching sprocket holes, embossing, or slitting them into tapes of a specific width.

[0003] Japanese Patent Publication No. 2011-111171

[0004] The object of this disclosure is to provide a resin sheet with excellent conductivity, moldability, and secondary processability.

[0005] This disclosure includes the following embodiments: [1] A resin sheet comprising a composition comprising 30% by mass or more and less than 90% by mass of polycarbonate resin (A), 5% by mass or more and 60% by mass of one or more resins (X) selected from styrene resins, ester resins, and acrylic resins, and a conductive filler (B) greater than 0% by mass and 25% by mass or less (provided that the sum of each component does not exceed 100% by mass). [2] A resin sheet comprising a composition comprising 30% by mass or more and less than 90% by mass of polycarbonate resin (A), 10% by mass or more and 60% by mass of one or more resins (X) selected from styrene resins, ester resins, and acrylic resins, and a conductive filler (B) greater than 0% by mass and 25% by mass or less (provided that the sum of each component does not exceed 100% by mass).

[0006] According to this disclosure, it is possible to provide a resin sheet with excellent conductivity, moldability, and secondary processability.

[0007] One embodiment of the present disclosure will be described in detail below, but the scope of the present disclosure is not limited to the embodiment described herein, and various modifications can be made without departing from the spirit of the present disclosure. Each embodiment disclosed herein can be combined with any other features disclosed herein. If multiple upper and lower limits are given for a particular parameter, any combination of these upper and lower limits can be used to create a suitable numerical range. The lower and / or upper limits of the numerical ranges described herein may be replaced with numerical values ​​within that range, as shown in the examples. The expression "X to Y" indicating a numerical range means "X or greater and Y or less". If a particular description given for one embodiment also applies to other embodiments, that description may be omitted in the other embodiments.

[0008] [Resin Sheet] The resin sheet according to this embodiment includes the following embodiments: [1] A resin sheet comprising a composition comprising 30% by mass or more and less than 90% by mass of polycarbonate resin (A), 5% by mass or more and 60% by mass of one or more resins (X) selected from styrene resins, ester resins, and acrylic resins, and a conductive filler (B) greater than 0% by mass and 25% by mass or less (however, the sum of each component does not exceed 100% by mass). [2] A resin sheet comprising a composition comprising 30% by mass or more and less than 90% by mass of polycarbonate resin (A), 10% by mass or more and 60% by mass of one or more resins (X) selected from styrene resins, ester resins, and acrylic resins, and a conductive filler (B) greater than 0% by mass and 25% by mass or less (however, the sum of each component does not exceed 100% by mass). The resin sheet according to this embodiment is excellent in conductivity, moldability, and secondary processability. Hereinafter, the resin sheet in [1] will be referred to as "resin sheet (1)" and the resin sheet in [2] will be referred to as "resin sheet (2)". Furthermore, in the following description, "resin sheet" refers to both "resin sheet (1)" and "resin sheet (2)". In this specification, "moldability" refers to the extrusion moldability when molding a resin sheet. For example, excellent moldability can be said to occur when the current value during extrusion molding is small (i.e., the motor load is small). "Secondary processability" refers to the ease of secondary processing of the obtained resin sheet. For example, excellent secondary processability can be said to occur when, after secondary processing, there is little variation in the thickness of the pockets formed by embossing and the corners of the pockets are sharp (not rounded).

[0009] <Polycarbonate Resin (A)> The composition contained in the resin sheet according to this embodiment includes polycarbonate resin (A). Examples of polycarbonate resins include aromatic polycarbonate resins, aliphatic polycarbonate resins, and aromatic-aliphatic polycarbonates. Aromatic polycarbonate resins are generally classified as engineering plastics, and those obtained by polycondensation of bisphenol A and phosgene or polycondensation of bisphenol A and carbonate esters can be used. These can be manufactured by known methods and are not limited to those methods; commercially available resins can be used. From the viewpoint of heat resistance, mechanical properties, electrical properties, etc., aromatic polycarbonate resins are preferred. The content of polycarbonate resin (A) is preferably 30% to less than 90% by mass, more preferably 40% to less than 85% by mass, and even more preferably 45% to 80% by mass, based on the total mass of polycarbonate resin (A), resin (X), and conductive filler (B), from the viewpoint of moldability, secondary processability, mechanical properties, and conductivity. The weight-average molecular weight of polycarbonate resin (A) is preferably 14,000 to 100,000, more preferably 14,000 to 50,000. By setting the weight-average molecular weight above the lower limit of the above range, the mechanical strength of the resin sheet can be further improved. By setting the weight-average molecular weight below the upper limit of the above range, the decrease in fluidity of the resin composition for the resin sheet can be suppressed and improved, improving moldability and facilitating extrusion molding. Furthermore, two or more polycarbonate resins with different weight-average molecular weights may be mixed and used. In this case, polycarbonate resins whose weight-average molecular weight is outside the preferred range described above may also be mixed. The melt flow rate of polycarbonate resin (A) is preferably 10 g / 10 min, and the glass transition temperature (Tg) is preferably 150 °C. When producing polycarbonate resin (A), molecular weight adjusters, catalysts, etc., can be used as needed.

[0010] <Resin (X)> The composition included in the resin sheet according to this embodiment includes one or more resins (X) selected from styrene resins, ester resins, and acrylic resins. By combining the above-mentioned polycarbonate resin (A) and resin (X), and further including a conductive filler (B), a resin sheet with excellent conductivity, moldability, and secondary processability can be obtained.

[0011] The mechanism is not yet clear, but a non-limiting mechanism is considered to be as follows: Styrene resins, ester resins, and acrylic resins are incompatible with polycarbonate resin, but exhibit incompatibility to the extent that they do not undergo phase separation with polycarbonate resin. As a result, polycarbonate resin (A) and resin (X) form a co-continuous phase in the resin composition. In this case, the conductive filler (B) does not disperse uniformly in the polymer blend, but rather tends to selectively concentrate in or on the phase surface of resin (X), which has a lower glass transition temperature (Tg) and more flexible polymer chains, among the resin phases constituting the co-continuous phase. As a result, even if the total content of conductive filler (B) is small, the content of conductive filler (B) increases locally, and because resin (X) constitutes the co-continuous phase, the localized locations of conductive filler (B) are scattered throughout the resin sheet. Consequently, it is thought that the conductive performance due to conductive filler (B) is more easily exhibited than before. Furthermore, since resin (X) tends to have a lower glass transition temperature (Tg) than polycarbonate resin (A), the fluidity of the polymer is more easily increased at the molding temperature of the resin sheet, and the extrusion moldability is easily improved. In addition, the operability when secondary processing of the resin sheet is also easily improved. According to the resin sheet of this embodiment, it is possible to prevent the excessive addition of conductive fillers such as carbon black, which have been reported to be carcinogenic, and to realize a resin sheet with good mechanical properties as well as conductivity. Since the amount of conductive filler blended in the resin sheet can be reduced, costs, environmental burden, and carcinogenic risks can be reduced.

[0012] In one embodiment, the glass transition temperature Tg of the resin (X) （ｘ） (°C) is the glass transition temperature Tg of polycarbonate resin (A).（ａ） It is preferable that the temperature is below (°C).

[0013] (Styrene-based resins) Examples of styrene-based resins include polystyrene resin (GPPS), high-impact polystyrene resin (rubber-modified styrene resin, HIPS), and copolymers of styrene with monomers such as acrylonitrile, butadiene, ethylene-propylene-diene, and methyl methacrylate (AS, ABS, AES, MS, MBS, SBC, etc.). These can be used individually or in combination of two or more. Examples of aromatic vinyl monomers that constitute styrene-based resins include styrene, vinyltoluene, o-methylstyrene, p-methylstyrene, p-tert-butylstyrene, 1,3-dimethylstyrene, α-methylstyrene, vinylnaphthalene, vinylanthracene, and 1,1-diphenylethylene. Among these aromatic vinyl monomers, styrene, vinyltoluene, o-methylstyrene, etc. can be used, and styrene is preferred.

[0014] In resin sheet (1), the content of styrene-based resin as resin (X) is 5% by mass or more and 60% by mass or less, preferably 10% by mass or more and 50% by mass or less, and even more preferably 10% by mass or more and 40% by mass or less, in 100% by mass of the total of polycarbonate resin (A), resin (X), and conductive filler (B), from the viewpoint of moldability, mechanical properties, conductivity, etc. In resin sheet (2), the content of styrene-based resin as resin (X) is 10% by mass or more and 60% by mass or less, preferably 10% by mass or more and 50% by mass or less, and even more preferably 10% by mass or more and 40% by mass or less, in 100% by mass of the total of polycarbonate resin (A), resin (X), and conductive filler (B), from the viewpoint of moldability, mechanical properties, conductivity, etc.

[0015] The glass transition temperature (Tg) of styrene-based resins is 70 to less than 150°C, which is lower than the glass transition temperature (Tg) of polycarbonate resin (A). For example, the glass transition temperature (Tg) of styrene-based resins is preferably 80 to 120°C, and more preferably 90 to 110°C.

[0016] (Ester Resins) Examples of ester resins include polyester resins obtained from aromatic polyfunctional carboxylic acids and / or aliphatic polyfunctional carboxylic acids and polyfunctional glycols, and hydroxycarboxylic acid-based polyester resins. Examples of polyester resins obtained from aromatic polyfunctional carboxylic acids and / or aliphatic polyfunctional carboxylic acids and polyfunctional glycols include polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyethylene naphthalate, polybutylene naphthalate, polyethylene adipate, polybutylene adipate, and other copolymers thereof. Examples of other copolymers include polyester resins copolymerized with polyalkylene glycol, polycaprolactone, etc. Examples of hydroxycarboxylic acid-based polyester resins include polylactic acid, polyglycolic acid, polycaprolactone, etc. Copolymers of each of the polyester resins exemplified above can also be used in this disclosure. Ester resins may be used alone or in combination of two or more types.

[0017] In resin sheet (1), the content of ester resin as resin (X) is 5% to 60% by mass, preferably 10% to 60% by mass, more preferably 10% to 50% by mass, and even more preferably 10% to 40% by mass, out of the viewpoint of moldability, mechanical properties, conductivity, etc., in the total of 100% by mass of polycarbonate resin (A), resin (X), and conductive filler (B). In resin sheet (2), the content of ester resin as resin (X) is 10% to 60% by mass, preferably 10% to 50% by mass, and even more preferably 10% to 40% by mass, out of the viewpoint of moldability, mechanical properties, conductivity, etc., in the total of 100% by mass of polycarbonate resin (A), resin (X), and conductive filler (B).

[0018] The glass transition temperature (Tg) of the ester resin is 40 to less than 150°C, which is lower than the glass transition temperature (Tg) of the polycarbonate resin (A). For example, the glass transition temperature (Tg) of the ester resin is preferably 40 to 90°C, and more preferably 40 to 80°C.

[0019] (Acrylic resins) Examples of acrylic resins include acrylic acid esters such as methyl acrylate, ethyl acrylate, propyl acrylate, and butyl acrylate; and methacrylic acid esters such as methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, and cyclohexyl methacrylate. Resins containing at least one (meth)acrylate component in an amount of 50% by mass or more are also acceptable. Resins obtained by copolymerizing two or more of these components may also be used.

[0020] In resin sheet (1), the content of acrylic resin as resin (X) is 5% by mass or more and 60% by mass or less, preferably 10% by mass or more and 50% by mass or less, and even more preferably 10% by mass or more and 40% by mass or less, in 100% by mass of the total of polycarbonate resin (A), resin (X), and conductive filler (B), from the viewpoint of moldability, mechanical properties, conductivity, etc. In resin sheet (2), the content of acrylic resin as resin (X) is 10% by mass or more and 60% by mass or less, preferably 10% by mass or more and 50% by mass or less, and even more preferably 10% by mass or more and 40% by mass or less, in 100% by mass of the total of polycarbonate resin (A), resin (X), and conductive filler (B), from the viewpoint of moldability, mechanical properties, conductivity, etc.

[0021] The glass transition temperature (Tg) of acrylic resins is 70 to less than 150°C, which is lower than the glass transition temperature (Tg) of polycarbonate resin (A). For example, the glass transition temperature (Tg) of acrylic resins is preferably 70 to 120°C, and more preferably 70 to 110°C.

[0022] In one embodiment, the acrylic resin as resin (X) does not have to contain PMMA. In one embodiment, resin (X) may be one or more selected from styrene resins, ester resins, and acrylic resins (excluding PMMA). In a preferred embodiment, resin (X) includes one or more selected from styrene resins and ester resins.

[0023] In one embodiment, the total content of resin (X) in the resin sheet (1) is 5% by mass or more and 60% by mass or less, preferably 10% by mass or more and 60% by mass or less, more preferably 10% by mass or more and 50% by mass or less, and even more preferably 10% by mass or more and 40% by mass or less, from the viewpoint of moldability, mechanical properties, conductivity, etc.

[0024] In one embodiment, if the resin (X) contains polybutylene terephthalate, the resin sheet (1) may further satisfy at least one of the following (I) to (III): (I) The content of polycarbonate resin (A) is less than 90% by mass in the total 100% by mass of polycarbonate resin (A) and polybutylene terephthalate. (II) The content of polybutylene terephthalate is more than 10% by mass in the total 100% by mass of polycarbonate resin (A) and polybutylene terephthalate. (III) The total 100% by mass of polycarbonate resin (A) and polybutylene terephthalate does not contain polyethylene resin, or the content of polyethylene resin is less than 0.5% by mass.

[0025] In one embodiment, the total content of resin (X) in the resin sheet (2) is 10% by mass or more and 60% by mass or less, more preferably 10% by mass or more and 50% by mass or less, and even more preferably 10% by mass or more and 40% by mass or less, from the viewpoint of moldability, mechanical properties, conductivity, etc.

[0026] The content of resin (X) in the polymer blend of polycarbonate resin (A) and resin (X) is preferably 1 part by mass or more and 100 parts by mass or less, more preferably 5 parts by mass or more and 95 parts by mass or less, and even more preferably 10 parts by mass or more and 90 parts by mass or less, per 100 parts by mass of polycarbonate resin (A).

[0027] <Conductive Filler (B)> The composition contained in the resin sheet according to this embodiment includes a conductive filler (B). The presence of conductive filler (B) makes it easier to increase the conductivity of the resin sheet.

[0028] The conductive filler (B) is not particularly limited as long as it does not impair the effects of the present invention, but carbon black such as acetylene black, furnace black, and channel black, and silicon-containing compounds such as silica are preferably used. The conductive filler (B) may be used alone or in combination of two or more types.

[0029] From the viewpoint of obtaining high conductivity with a small amount added to the resin, the content of conductive filler (B) is more than 0% by mass and 25% by mass or less, more preferably 5% by mass or more and 25% by mass or less, and even more preferably 10.5% by mass or more and 25% by mass or less, in 100% by mass of the total of polycarbonate resin (A), resin (X), and conductive filler (B). Furthermore, from the viewpoint of having good dispersibility to suppress the generation of aggregates, the average primary particle diameter of conductive filler (B) may be 5.0 μm or less, more preferably 10 nm to 5.0 μm, and even more preferably 10 nm to 100 nm. The average primary particle diameter may be the manufacturer's catalog value or a measurement taken by a transmission electron microscope.

[0030] In one embodiment, the resin sheet comprises a composition in which, in a total of 100% by mass of polycarbonate resin (A), resin (X), and conductive filler (B), polycarbonate resin (A) may be 30% by mass or more and less than 90% by mass, preferably 40% by mass or more and less than 85% by mass, and more preferably 45% by mass or more and 80% by mass or less; resin (X) may be 5% by mass or more and 60% by mass or less, preferably 10% by mass or more and 60% by mass or less, more preferably 10% by mass or more and 50% by mass or less, and even more preferably 10% by mass or more and 40% by mass or less; and conductive filler may be more than 0% by mass and 25% by mass or less, preferably 5% by mass or more and 25% by mass or less, and even more preferably 10.5% by mass or more and 25% by mass or less (provided that the sum of each component does not exceed 100% by mass). These may be within the upper or lower limits of the above numerical range, or a combination of these ranges.

[0031] In one embodiment, the resin sheet comprises a composition in which, in a total of 100% by mass of polycarbonate resin (A), resin (X), and conductive filler (B), polycarbonate resin (A) may be 30% by mass or more and less than 90% by mass, preferably 40% by mass or more and less than 85% by mass, and more preferably 45% by mass or more and 80% by mass or less; resin (X) may be 10% by mass or more and 60% by mass or less, preferably 10% by mass or more and 50% by mass or less, and more preferably 10% by mass or more and 40% by mass or less; and conductive filler may be more than 0% by mass and 25% by mass or less, preferably 5% by mass or more and 25% by mass or less, and more preferably 10.5% by mass or more and 25% by mass or less (provided that the sum of each component does not exceed 100% by mass). These may be within the upper or lower limits of the above numerical range, or a combination of these ranges.

[0032] <Other Additives> Various additives such as modifiers, lubricants, plasticizers, and processing aids may be added to the composition contained in the resin sheet. Further, the composition contained in the resin sheet may contain resins other than the polycarbonate resin (A) and the resin (X) within a range that does not impair the effects of the present invention. The content of resins other than the polycarbonate resin (A) and the resin (X) is preferably 10% by mass or less, more preferably 5% by mass or less, based on 100% by mass of the total resin components. In one embodiment, in the composition contained in the resin sheet, the resin components may consist only of the polycarbonate resin (A) and the resin (X).

[0033] <Physical Properties of Resin Sheet> The resin sheet of the present embodiment is an extrusion-formed product of a resin composition containing a polycarbonate resin (A), one or more resins (X) selected from styrene-based resins, ester-based resins and acrylic resins, and a conductive filler (B). The method for producing the resin sheet will be described later.

[0034] The resin sheet according to the present embodiment may have any optional layers in addition to the layer containing the above composition. Further, any optional layer may have a single-layer structure or a multilayer structure. In the case of a multilayer structure, forming the layer containing the above composition to be the outermost surface tends to result in a low surface resistance value on the outermost surface.

[0035] (Thickness of Resin Sheet) The thickness of the resin sheet can be arbitrarily set within a range that does not impair the effects of the present invention. For example, from the viewpoint of moldability and strength of a packaging container, the total thickness of the resin sheet is preferably 0.1 to 1 mm, more preferably 0.15 to 0.8 mm.

[0036] (Surface Resistance Value) In one embodiment, the surface resistance value of the resin sheet is 1.0×10 １０ It may be less than Ω, and 1.0×10 ３ to 1.0×10 ９ Ω is more preferable, and 1.0×10 ４ to 1.0×10 ８Ω is more preferred. When the surface resistance value is within the above range, the resin sheet can be suitably used for producing a molded article for packaging electronic components, and it becomes easy to prevent damage to electronic components caused by static electricity and damage to electronic components caused by inflow of electricity from the outside. The surface resistance value can be measured in accordance with JIS K 7194:1994 (Testing method for resistivity of conductive plastics with a four-point probe method) using a contact-type resistivity meter (for example, product name: Loresta EP manufactured by Nitto Seiko Analytech Co., Ltd., product name: "Torek 152-1" manufactured by Torek, etc.).

[0037] (Volume Resistivity) In one embodiment, the volume resistivity of the resin sheet is 1.0×10 １０ may be less than Ω, and 1.0×10 ３ to 1.0×10 ９ Ω is more preferred, and 1.0×10 ３ to 1.0×10 ８ Ω is even more preferred. When the volume resistivity is within the above range, the resin sheet can be suitably used as a resin sheet for packaging electronic components. Further, it becomes easy to prevent damage to electronic components contained in an electronic component package obtained from the resin sheet caused by static electricity or inflow of electricity from the outside. The volume resistivity can be measured in accordance with JIS K 7194:1994 (Testing method for resistivity of conductive plastics with a four-point probe method) using a contact-type resistivity meter (for example, product name: "Torek 152-1" manufactured by Torek).

[0038] (Moldability) In one embodiment, when the resin sheet is melt coextrusion molded at 280°C using a φ30 mm single screw extruder, the current value [A] may be 13.0 [A] or less, preferably 12.0 [A] or less, and more preferably 11.0 [A] or less. The smaller the current value, the better the moldability of the resin sheet.

[0039] (Processability) In one embodiment, when the resin sheet is embossed using a vacuum forming machine at a hot air temperature of 570°C with dimensions of 1 mm in the flow direction, 2 mm in the width direction, and 0.5 mm in the depth direction, it is preferable that the thickness is uniform and the corners of the pockets are angular. When the thickness of the resin sheet is uniform and the corners of the pockets are angular, the shape of the electronic components fits into the pockets formed by the embossing, allowing them to be stored correctly and reducing the risk of scratches on the components during transport. On the other hand, when the thickness of the resin sheet is uneven and the corners of the pockets are rounded, the shape of the electronic components does not fit into the pockets formed by the embossing, and the electronic components come into contact with the rounded corners of the pockets, increasing the risk of scratches on the components during transport.

[0040] [Applications] The resin sheet according to this embodiment is typically a resin sheet that can be used as a material for molded articles for packaging intermediate or final industrial products. Industrial products are typically electronic components or products containing electronic components. That is, in this embodiment, the resin sheet may be used as a sheet for packaging electronic components. Examples of electronic components or products containing electronic components include, but are not limited to, semiconductors, integrated circuits (ICs), light-emitting diodes (LEDs), diodes, resistors, capacitors, transistors, piezoelectric resistors, filters, crystal oscillators, crystal resonators, connectors, switches, potentiometers, relays, inductors, memories, or combinations thereof. Another embodiment relating to the above resin sheet is the use of the above resin sheet as a sheet for packaging electronic components or a method of using it in this way.

[0041] [Method for Manufacturing Resin Sheets] The method for manufacturing resin sheets is not particularly limited and can be manufactured using general methods. For example, a resin sheet can be manufactured by extruding a composition containing polycarbonate resin (A), resin (X), and conductive filler (B) using a feed block method with a single-screw extruder (e.g., a φ30 mm single-screw extruder manufactured by INTYPE ENTERPRISE). If the resin sheet has a multilayer structure, the raw materials constituting each layer can be supplied to separate extruders and suitably manufactured by extrusion molding using a multilayer T-die with a multi-manifold, or by T-die extrusion molding using the feed block method.

[0042] [Molded article and method for manufacturing the same] The molded article according to this embodiment includes the resin sheet according to the above embodiment and can be obtained by processing the resin sheet. Processing the resin sheet can be done by known methods including vacuum forming, pressure forming, press forming, etc. Processing the resin sheet may include steps such as cutting the sheet into a desired shape or punching sprocket holes in the sheet. The molded article according to this embodiment is typically a molded article for packaging electronic components. In one embodiment, the molded article may be a container, and in particular a container having a storage section for storing electronic components. In another embodiment, the molded article may be a carrier tape or a tray, and in particular an embossed carrier tape.

[0043] A non-limiting list of exemplary embodiments and combinations of exemplary embodiments of the present disclosure is disclosed below: [1] A resin sheet comprising a composition comprising 30% by mass or more and less than 90% by mass of polycarbonate resin (A), 5% by mass or more and 60% by mass of one or more resins (X) selected from styrene resins, ester resins, and acrylic resins, and a conductive filler (B) greater than 0% by mass and 25% by mass or less (provided that the sum of each component does not exceed 100% by mass). [2] A resin sheet comprising a composition comprising 30% by mass or more and less than 90% by mass of polycarbonate resin (A), 10% by mass or more and 60% by mass of one or more resins (X) selected from styrene resins, ester resins, and acrylic resins, and a conductive filler (B) greater than 0% by mass and 25% by mass or less (provided that the sum of each component does not exceed 100% by mass). [3] Glass transition temperature Tg of the resin (X) （ｘ） (°C) is the glass transition temperature Tg of the polycarbonate resin (A). （ａ） A resin sheet according to [1] or [2], wherein the temperature is less than (°C). [4] A resin sheet according to any one of [1] to [3], wherein the resin (X) comprises the ester resin. [5] A resin sheet according to any one of [1] to [4], wherein the ester resin comprises PBT. [6] A resin sheet with a surface resistance of 1.0 × 10 １０ A resin sheet according to any one of [1] to [5], having a capacitance of less than Ω. [7] A resin sheet according to any one of [1] to [6], wherein the polycarbonate resin (A) is 40% by mass or more and less than 85% by mass, the resin (X) is 10% by mass or more and 50% by mass or less, and the conductive filler (B) is 5% by mass or more and 20% by mass or less (provided that the sum of each component does not exceed 100% by mass). [8] A resin sheet according to any one of [1] to [7], which is a sheet for packaging electronic components. [9] A molded article containing a resin sheet according to any one of [1] to [8].

[10] A molded article according to [9], which is a carrier tape or tray. Each configuration and combination thereof in each embodiment are examples, and additions, omissions, substitutions, and other modifications of the configuration can be made as appropriate without departing from the spirit of this disclosure. This disclosure is not limited by embodiments.

[0044] The present disclosure will be further illustrated by the following examples, but these examples will not limit the interpretation of the present disclosure.

[0045] (Examples 1-7, Comparative Example 1) Using a φ30 mm single-screw extruder (manufactured by INTYPE ENTERPRISE, product name "EXT30"), each of the raw materials listed in Table 1 was melt-co-extruded at 280°C using the feed-block method, and then cooled and solidified to obtain a resin sheet. The current value [A] of the extruder at this time was read and is shown in Table 1. The thickness of the resin sheet was 0.25 mm.

[0046] The raw materials used are as follows: • Polycarbonate resin (A) • Conductive filler (B): Carbon black • PBT: Polybutylene terephthalate resin

[0047] The resin sheets obtained in the examples and comparative examples were evaluated using the following method. The results are shown in Table 1.

[0048] (Processability) Embossing was performed on a resin sheet using a vacuum forming machine (Mühlbauer, product name "Vacuum Rotary Forming Machine (CT8 / 24)") at a hot air temperature of 570°C, with pocket sizes of 1 mm in the flow direction, 2 mm in the width direction, and 0.5 mm in the depth direction. Processability was evaluated according to the following criteria: A: The thickness was uniform and the pocket corners were angular. B: The thickness was uneven and the pocket corners were rounded.

[0049] (Surface resistance) The surface resistance of the resin sheet surface was measured in accordance with JIS K 7194 using a contact-type resistivity meter (manufactured by Nitto Seiko Analystech Co., Ltd., product name: Loresta EP).

[0050]

[0051] As shown in Table 1, Examples 1 to 7 have a surface resistance value of 1.0 × 10⁻⁶ １０The surface resistance was less than Ω, indicating that the resin sheet had good conductivity (antistatic properties). Furthermore, the current value of the extrusion molding machine was 13.0 [A] or less during resin sheet molding. Therefore, the motor load of the extrusion molding machine was low, resulting in good moldability. In addition, the secondary processability was also good (evaluation: A). On the other hand, Comparative Example 1 had a surface resistance value of 1.0 × 10⁻⁶. １０ The conductivity was poor because the resistance was greater than Ω. Furthermore, the current value of the extrusion molding machine exceeded 15.0 [A] during the molding of the resin sheet. This resulted in a high motor load on the extrusion molding machine and poor moldability. In addition, secondary processability was also poor (evaluation: B). These results demonstrate that the resin sheet of this disclosure has excellent conductivity, moldability, and secondary processability. Therefore, the resin sheet of the present invention is useful for packaging electronic components, effectively suppressing the possibility of malfunctions occurring in electronic components due to static electricity and facilitating molding.

[0052] (Test Examples 1-18, Reference Example 1) Using a φ30 mm single-screw extruder (manufactured by INTYPE ENTERPRISE, product name "EXT30"), each of the raw materials listed in Tables 2-4 was melt-co-extruded at 280°C using the feed-block method, and then cooled and solidified to obtain a resin sheet. The thickness of the resin sheet was 0.25 mm.

[0053] The raw materials used are as follows: • Polycarbonate resin (A) • Conductive filler (B): Carbon black • PBT: Polybutylene terephthalate resin • PET: Polyethylene terephthalate resin • AS1: Acrylonitrile-styrene copolymer with an acrylonitrile-styrene ratio of 1:3 • AS2: Acrylonitrile-styrene copolymer with an acrylonitrile-styrene ratio of 1:4 • ABS: Acrylonitrile-butadiene-styrene copolymer • MBS: Methyl methacrylate-butadiene-styrene copolymer • GPPS: General-purpose polystyrene • SBC: Styrene-butadiene copolymer • MS: Methyl methacrylate-styrene copolymer

[0054] (Surface resistance) The surface resistance of the resin sheet surface was measured in accordance with JIS K 7194 using a contact-type resistivity meter (Torek, product name: Torek 152-1).

[0055] (Volume Resistivity) A resin sheet sample measuring 110 mm (length) x 110 mm (width) x 250 μm (thickness) was prepared, and the volume resistivity of the resin sheet was measured in accordance with JIS K 7194 using a contact-type resistivity meter (Torek Corporation, product name: Torek 152-1). The measurement environment was 20°C ± 5°C and 50% ± 10% RH.

[0056]

[0057]

[0058]

[0059] As shown in Tables 2-3, the test examples 1-16, which are embodiments, have a surface resistance value of 1.0 × 10⁻⁶. １０ The resistivity was less than Ω, indicating that the resin sheet had good conductivity (antistatic properties). Furthermore, the volume resistivity was 1.0 × 10⁻⁶. １０ The resistance was less than Ω, indicating that the resin sheet also had good conductivity (antistatic properties) in the thickness direction. Furthermore, having good conductivity in the thickness direction has the advantage of allowing grounding from the back side, opposite to the front surface. On the other hand, as shown in Table 4, comparative examples 17 and 18 had a surface resistance value of 1.0 × 10⁻⁶. １０ The conductivity was poor because it was greater than ohms. Also, the volume resistivity was 1.0 × 10⁻⁶. １２ Because the resistance was greater than Ω, the resin sheet was insulating in the thickness direction. Reference Example 1 shows that by increasing the content of conductive filler (B) without containing resin (X), both the surface resistance and volume resistance values ​​were 1.0 × 10⁻⁶. １０The resistance was less than Ω. To obtain a resistance value equivalent to that of the test example using conductive filler (B) without containing resin (X), it is necessary to further increase the amount of conductive filler added. These results demonstrate that the resin sheet of this disclosure has excellent conductivity. Therefore, the resin sheet of the present invention is useful for packaging electronic components and can effectively suppress the possibility of malfunctions occurring in electronic components due to static electricity.

[0060] The resin sheet of this embodiment has excellent conductivity, moldability, and secondary processability, and can therefore be used in various fields, making it industrially applicable.

Claims

1. A resin sheet comprising a composition containing 30% by mass or more and less than 90% by mass of polycarbonate resin (A), 5% by mass or more and 60% by mass of one or more resins (X) selected from styrene resins, ester resins, and acrylic resins, and a conductive filler (B) greater than 0% by mass and 25% by mass or less (provided that the sum of each component does not exceed 100% by mass).

2. A resin sheet comprising a composition containing 30% by mass or more and less than 90% by mass of polycarbonate resin (A), 10% by mass or more and 60% by mass of one or more resins (X) selected from styrene resins, ester resins, and acrylic resins, and a conductive filler (B) greater than 0% by mass and 25% by mass or less (provided that the sum of each component does not exceed 100% by mass).

3. Glass transition temperature Tg of the resin (X) （ｘ） (°C) is the glass transition temperature Tg of the polycarbonate resin (A). （ａ） The resin sheet according to claim 1, wherein the temperature is less than (°C).

4. The resin sheet according to claim 1 or 2, wherein the resin (X) includes the ester resin.

5. The resin sheet according to claim 1 or 2, wherein the ester resin contains PBT.

6. Surface resistance value is 1.0 × 10 １０ A resin sheet according to claim 1 or 2, wherein the ohm is less than Ω.

7. The resin sheet according to claim 1 or 2, wherein the polycarbonate resin (A) is 40% by mass or more and less than 85% by mass, the resin (X) is 10% by mass or more and 50% by mass or less, and the conductive filler (B) is 5% by mass or more and 20% by mass or less (provided that the sum of each component does not exceed 100% by mass).

8. The resin sheet according to claim 1 or 2, which is a sheet for packaging electronic components.

9. A molded article comprising the resin sheet described in claim 1 or 2.

10. The molded body according to claim 9, which is a carrier tape or tray.

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