Resin sheet and molded body

Abstract

The resin sheet contains a composition containing a polycarbonate resin (A), one or more resins (X) having an SP value [(J / cm3)1 / 2] of 19.2 or more, and a conductive filler (B).

Description

Resin sheets and molded articles

[0001] This invention relates to resin sheets and molded articles.

[0002] Resin sheets are widely used to package final or intermediate industrial products, including electronic components. Resin sheets used in such applications are often given antistatic and conductive properties, preventing dust and debris from adhering to electronic components such as semiconductors and microchips due to static electricity.

[0003] Patent Document 1 reports a carrier tape formed by a conductive polycarbonate resin composition having a specific composition.

[0004] Japanese Patent Publication No. 2011-111171

[0005] The object of this disclosure is to provide a resin sheet with superior conductivity.

[0006] This disclosure has the following aspects: [1] Polycarbonate resin (A) and SP value [(J / cm ３ ) １／２ A resin sheet comprising one or more resins (X) having a coefficient of 19.2 or higher, and a conductive filler (B).

[0007] According to this disclosure, a resin sheet with superior conductivity can be provided.

[0008] One embodiment of the present disclosure will be described in detail below, but the scope of the present disclosure is not limited to the embodiment described herein, and various modifications can be made without departing from the spirit of the present disclosure. Each embodiment disclosed herein can be combined with any other features disclosed herein. If multiple upper and lower limits are given for a particular parameter, any combination of these upper and lower limits can be used to create a suitable numerical range. The lower and / or upper limits of the numerical ranges described herein may be replaced with numerical values ​​within that range, as shown in the examples. The expression "X to Y" indicating a numerical range means "X or greater and Y or less". If a particular description given for one embodiment also applies to other embodiments, that description may be omitted in the other embodiments.

[0009] [Resin Sheet] The resin sheet according to this embodiment comprises a polycarbonate resin (A) and an SP value [(J / cm²)]. ３ ) １／２ The resin sheet comprises one or more resins (X) having a ratio of 19.2 or higher, and a conductive filler (B). The above configuration results in a resin sheet with superior conductivity. Furthermore, the resin sheet according to this embodiment can easily achieve the desired resistance value even with a small proportion of conductive filler (B).

[0010] The resin sheet according to this embodiment exhibits superior conductivity compared to conventional resin sheets. Although the mechanism is not clear at this stage, a non-limiting mechanism is considered to be as follows. That is, a resin (X) having a specific SP value is incompatible with polycarbonate resin (A), but exhibits incompatibility to the extent that it does not undergo phase separation with polycarbonate resin (A). As a result, it is thought that polycarbonate resin (A) and resin (X) readily form a co-continuous phase in the resin sheet. At this time, it is presumed that the conductive filler (B) is selectively dispersed in one of the resin phases constituting the co-continuous phase, resulting in a resin sheet with superior conductivity. Furthermore, by selectively dispersing the conductive filler (B) in one of the resin phases in this way, a network of conductive fillers (B) is more easily formed, and it is thought that good conductivity can be easily achieved even when the proportion of conductive filler (B) in the resin sheet is small. Furthermore, good mechanical properties are easier to achieve, and if the proportion of conductive filler (B) in the resin sheet can be reduced, costs, environmental impact, and carcinogenic risks can also be easily reduced.

[0011] <Polycarbonate Resin (A)> The resin sheet according to this embodiment includes polycarbonate resin (A). Examples of polycarbonate resins include aromatic polycarbonate resin, aliphatic polycarbonate resin, aromatic-aliphatic polycarbonate resin, etc. Polycarbonate resin (A) may be used individually or in combination of two or more types. Of these, it is preferable to include aromatic polycarbonate resin from the viewpoint of heat resistance, mechanical properties, electrical properties, etc.

[0012] Aromatic polycarbonate resins are typically classified as engineering plastics, and those obtained by polycondensation of bisphenol A and phosgene or bisphenol A and carbonate esters can be used. These can be manufactured by known methods, and the manufacturing method is not limited. Commercially available resins may also be used as aromatic polycarbonate resins.

[0013] From the viewpoint of conductivity, moldability, secondary processing properties, and mechanical properties, the content of polycarbonate resin (A) in the resin sheet is preferably 30% by mass or more and less than 90% by mass, more preferably 40% by mass or more and less than 85% by mass, and even more preferably 45% by mass or more and 80% by mass or less, out of 100% by mass of the total of polycarbonate resin (A), resin (X), and conductive filler (B).

[0014] The weight-average molecular weight of the polycarbonate resin (A) is preferably 12,000 to 30,000, more preferably 15,000 to 25,000. By setting the weight-average molecular weight to be above the lower limit of the above range, the mechanical strength of the resin sheet can be further improved. By setting the weight-average molecular weight to be below the upper limit of the above range, it becomes easier to suppress the decrease in fluidity during resin sheet molding. As a result, moldability is improved, and for example, the resin sheet can be molded more easily by extrusion molding. When a mixture of two or more polycarbonate resins with different weight-average molecular weights is used as the polycarbonate resin (A), it is preferable that the weight-average molecular weight of the mixture is within the above range. In that case, a polycarbonate resin whose weight-average molecular weight is outside the above preferred range may also be mixed. The weight-average molecular weight (Mw) of the polycarbonate resin (A) can be measured by gel permeation chromatography (GPC), where a sample dissolved in a solvent (THF) is passed through a column and separated and detected by molecular size (on a standard polystyrene basis). Furthermore, if a commercially available polycarbonate resin (A) is used, the catalog value may be adopted as the weight-average molecular weight (Mw).

[0015] The glass transition temperature (Tg) of the polycarbonate resin (A) is preferably 150°C. By setting the polycarbonate resin (A) to 150°C or higher, the extrusion moldability tends to improve when manufacturing resin sheets, thus resulting in good moldability and secondary processing properties.

[0016] <Resin (X)> The resin sheet according to this embodiment has a solubility parameter (SP) value [(J / cm²)]. ３ ) １／２is 19.2 or higher, contains one or more resins (X). By combining the above polycarbonate resin (A) and resin (X), and further containing a conductive filler (B), a resin sheet with more excellent conductivity can be obtained. In addition, the resin sheet according to the present embodiment combines the polycarbonate resin (A) and the resin (X). Since the resin (X) tends to have a lower glass transition temperature (Tg) than the polycarbonate resin (A), the fluidity of the polymer tends to increase at the molding temperature of the resin sheet, and the moldability and secondary processability also tend to be favorable.

[0017] In the resin sheet, from the viewpoints of conductivity, molding processability, mechanical properties and the like, the content of the resin (X) is preferably 1% by mass or more and 50% by mass or less, more preferably 1% by mass or more and 40% by mass or less, still more preferably 5% by mass or more and 40% by mass or less, and particularly preferably 10% by mass or more and 40% by mass or less, based on 100% by mass in total of the polycarbonate resin (A), the resin (X) and the conductive filler (B).

[0018] (SP value) The resin sheet according to the present embodiment has a solubility parameter SP value [(J / cm ３ ) １／２ is 19.2 or higher, contains the resin (X). The SP value is the Hildebrand solubility parameter, which is an index indicating the compatibility of resins and solvents. Substances with similar SP values have high compatibility and tend to mix easily. On the other hand, when the SP values differ greatly, substances tend to be difficult to dissolve and mix. By combining the above polycarbonate resin (A) with one or more resins (X) having an SP value [(J / cm ３ ) １／２ of 19.2 or higher, and further containing a conductive filler (B), a resin sheet with more excellent conductivity can be obtained.

[0019] The SP value of the resin (X) contained in the resin sheet according to the present embodiment [(J / cm ３ ) １／２ is 19.2 or higher, preferably 19.5 or higher and 27.9 or lower, more preferably 20.0 or higher and 25.0 or lower, and still more preferably 21.0 or higher and 22.0 or lower. The SP value [(J / cm ３ ) １／２By using a resin (X) having a value of 19.2 or more, excellent conductivity tends to be achieved while preventing excessive addition of the conductive filler contained in the resin sheet. Further, there is a tendency that the higher the SP value of the resin (X) is, the more the resistance value tends to decrease. SP value [(J / cm ３ ) １／２ As the resin (X) having a value of 19.2 or more, it is preferable to use a resin that exhibits incompatibility to an extent that does not cause phase separation with a polycarbonate resin. The resin (X) may be a homopolymer or a copolymer (copolymer). In the case of a copolymer, it is preferable to adjust the type and proportion of comonomers such that the SP value [(J / cm ３ ) １／２ becomes 19.2 or more.

[0020] (Method for calculating SP value) As methods for calculating the solubility parameter (SP value) of a resin, the Hansen sphere method, a method of estimation from molecular structure, and the like are known. In the present disclosure, the SP value of resin (X) is calculated by inputting the molecular structure of resin (X) and the monomer ratio into, for example, the practical Hansen solubility parameter software "Hansen Solubility Parameters in Practice (HSPiP) ver. 4.1.07", analyzing the solubility of the resin raw material, and calculating the SP value. The SP value of the polycarbonate resin (A) calculated by the above method is, for example, 20.7.

[0021] As the resin (X), there is no particular limitation as long as it is a thermoplastic resin in which the SP value [(J / cm ３ ) １／２ calculated above is 19.2 or more. Examples of thermoplastic resins having an SP value of 19.2 or more that easily exert the effects of the present disclosure include styrene-based resins and ester-based resins.

[0022] (Styrene-based resin) As a styrene-based resin having an SP value [(J / cm ３ ) １／２ of 19.2 or more, a resin containing an aromatic vinyl unit can be preferably exemplified. The "resin containing an aromatic vinyl unit" means a resin containing a structural unit derived from an aromatic vinyl compound.

[0023] Examples of aromatic vinyl compounds include styrene, vinyltoluene, o-methylstyrene, p-methylstyrene, p-tert-butylstyrene, 1,3-dimethylstyrene, α-methylstyrene, vinylnaphthalene, vinylanthracene, 1,1-diphenylethylene and the like. Among these, from the viewpoint of easily adjusting the SP value to 19.2 or more, styrene, vinyltoluene, and o-methylstyrene are preferable, and styrene is more preferable.

[0024] SP value [(J / cm ３ ) １／２ Specific examples of styrenic resins having a value of 19.2 or more include polystyrene resins such as polystyrene resin (SP value: 20.0) and high-impact polystyrene resin; copolymers of monomers such as (meth)acrylonitrile, conjugated dienes (butadiene, isoprene, etc.), ethylene-propylene-conjugated diene, (meth)acrylic acid esters and aromatic vinyl compounds, and the like. More preferable examples of the copolymer include acrylonitrile-styrene resins (SP value: 20.0 to 27.9), acrylonitrile-butadiene-styrene copolymers having a butadiene content of less than 30% by mass (SP value: 19.4 to 27.9), methyl methacrylate-styrene copolymers having a methyl methacrylate content of less than 70% by mass (SP value: 19.2 to 20.0), methyl methacrylate-butadiene-styrene copolymers having a methyl methacrylate content of less than 40% by mass and a butadiene content of less than 20% by mass (SP value: 19.2 to 20.0), and styrene-butadiene copolymers having a butadiene content of less than 30% by mass (SP value: 19.4 to 20.0). These may be used alone or in combination of two or more. The numerical range may vary depending on the molecular structure and monomer ratio of the styrenic resin.

[0025] When the resin (X) contains a styrenic resin, the content thereof is preferably 1% by mass or more and 50% by mass or less, more preferably 1% by mass or more and 40% by mass or less, still more preferably 5% by mass or more and 40% by mass or less, and particularly preferably 10% by mass or more and 40% by mass or less, based on 100% by mass in total of the polycarbonate resin (A), the resin (X), and the conductive filler (B), from the viewpoints of conductivity, molding processability, mechanical properties and the like.

[0026] (Ester resin) SP value [(J / cm²) ３ ) １／２ Examples of ester resins with an SP value of 19.2 or higher include polyester resins obtained by polycondensation of aromatic polycarboxylic acids and / or aliphatic polycarboxylic acids with polyhydric alcohols, as well as hydroxycarboxylic acid-based polyester resins. More specifically, examples include polyethylene terephthalate (SP value: 22.1), polybutylene terephthalate (SP value: 21.4), polyethylene naphthalate (SP value: 22.2), polybutylene naphthalate (SP value: 21.6), polyethylene adipate (SP value: 21.2), polybutylene adipate (SP value: 20.6), polylactic acid (SP value: 21.5), polybutylene succinate (SP value: 21.1), polyhydroxybutyric acid (SP value: 20.7), polyglycolic acid (SP value: 23.6), polycaprolactone (SP value: 20.1), etc. Copolymers of each of the polyester resins exemplified above can also be used in this disclosure. Ester resins may be used individually or in combination of two or more types. The numerical range may vary depending on the molecular structure and monomer ratio of the ester resins.

[0027] When resin (X) contains an ester-based resin, its content is preferably 1% to 50% by mass, more preferably 1% to 40% by mass, even more preferably 5% to 40% by mass, and particularly preferably 10% to 40% by mass, based on the total mass of polycarbonate resin (A), resin (X), and conductive filler (B), from the viewpoint of conductivity, moldability, mechanical properties, etc. For example, if resin (X) contains a resin with an SP value of 21.4, it is preferable that the proportion of resin (X) is 1 to 50% by mass, based on the total mass of polycarbonate resin (A), resin (X), and conductive filler (B).

[0028] In one embodiment, the total content of resin (X) in the resin sheet is preferably 1% to 50% by mass, more preferably 1% to 40% by mass, even more preferably 5% to 40% by mass, and particularly preferably 10% to 40% by mass, based on the total mass of polycarbonate resin (A), resin (X), and conductive filler (B), from the viewpoint of conductivity, moldability, mechanical properties, etc.

[0029] The content of resin (X) in the polymer blend of polycarbonate resin (A) and resin (X) is preferably 1 part by mass or more and 100 parts by mass or less, more preferably 5 parts by mass or more and 95 parts by mass or less, and even more preferably 10 parts by mass or more and 90 parts by mass or less, per 100 parts by mass of polycarbonate resin (A).

[0030] In one embodiment, the resin sheet may contain polycarbonate resin (A) and other resins other than resin (X). The other resin may include thermoplastic resins with an SP value of less than 19.2. Any resin can be used as the other resin as long as it does not hinder the effects of this disclosure. When the resin sheet contains other resins, the content is preferably 10% by mass or less, and more preferably 5% by mass or less, of 100% by mass of the total resin components. In one embodiment, it is preferable that the resin sheet does not contain polyethylene resin and / or polypropylene resin. When these polyolefin resins are blended, the difference in SP values ​​between the polyolefin resin and the polycarbonate resin is large, causing phase separation of each component and making it difficult to form a co-continuous structure, which may result in not being able to obtain the desired resistance value. As the other resin, it is preferable to use thermoplastic resins other than polyethylene resin and / or polypropylene resin. In one embodiment, the resin sheet may contain only polycarbonate resin (A) and resin (X) as resin components.

[0031] In one embodiment, if the resin (X) contains polybutylene terephthalate, the resin sheet (1) may further satisfy at least one of the following (I) to (III): (I) The content of polycarbonate resin (A) is less than 90% by mass in the total 100% by mass of polycarbonate resin (A) and polybutylene terephthalate. (II) The content of polybutylene terephthalate is more than 10% by mass in the total 100% by mass of polycarbonate resin (A) and polybutylene terephthalate. (III) The total 100% by mass of polycarbonate resin (A) and polybutylene terephthalate does not contain polyethylene resin, or the content of polyethylene resin is less than 0.5% by mass.

[0032] <Conductive Filler (B)> The composition contained in the resin sheet according to this embodiment includes a conductive filler (B). By including the conductive filler (B), conductivity can be imparted to the resin sheet.

[0033] The conductive filler (B) is not particularly limited as long as it does not impair the effects of this disclosure, but from the viewpoint of easily achieving the above-described mechanism, the SP value [(J / cm²) ３ ) １／２ A conductive filler (B) with an SP value of 19.2 or higher is preferred, a conductive filler (B) with an SP value of 19.2 or higher or 26.0 or lower is more preferred, and a value of 22.0 or higher or 24.0 or lower is even more preferred. Examples of such fillers include carbon blacks such as acetylene black, furnace black, and channel black. Conductive filler (B) may be used alone or in combination of two or more types. The SP value of the conductive filler can be estimated by referring to, for example, "Part. Part. Syst. Character., 2025, 42, 2400069".

[0034] The content of conductive filler (B) is preferably more than 0% by mass and 25% by mass or less, more preferably 5% by mass or more and 25% by mass or less, and even more preferably 10.5% by mass or more and 25% by mass or less, in the total of 100% by mass of the polycarbonate resin (A), resin (X), and conductive filler (B). The resin sheet according to this embodiment tends to easily achieve the desired resistivity even when the proportion of conductive filler (B) is reduced. Therefore, from the viewpoint of reducing the burden on health and the environment, the proportion of conductive filler (B) may be reduced.

[0035] Furthermore, the average primary particle diameter of the conductive filler (B) may be 5.0 μm or less, more preferably 10 nm to 5.0 μm, and even more preferably 10 nm to 100 nm, from the viewpoint of suppressing the generation of aggregates and easily achieving good dispersibility. The average primary particle diameter may be the manufacturer's catalog value or a measurement taken by a transmission electron microscope.

[0036] In one embodiment, the resin sheet comprises a composition in which, in a total of 100% by mass of polycarbonate resin (A), resin (X), and conductive filler (B), the polycarbonate resin (A) is preferably 30% by mass or more and less than 90% by mass, more preferably 40% by mass or more and less than 85% by mass, and even more preferably 45% by mass or more and 80% by mass or less; resin (X) is preferably 1% by mass or more and 50% by mass or less, more preferably 1% by mass or more and 40% by mass or less, even more preferably 5% by mass or more and 40% by mass or less, and particularly preferably 10% by mass or more and 40% by mass or less; and the conductive filler is preferably more than 0% by mass and 25% by mass or less, more preferably 5% by mass or more and 25% by mass or less, and even more preferably 10.5% by mass or more and 25% by mass or less (provided that the sum of each component does not exceed 100% by mass). These may be within the upper or lower limits of the above numerical ranges, or they may be a combination of these ranges.

[0037] <Other Additives> The resin sheet may contain various additives such as modifiers, lubricants, plasticizers, and processing aids. The resin sheet may also contain resins other than polycarbonate resin (A) and resin (X) to the extent that they do not impair the effects of this disclosure. The content of resins other than polycarbonate resin (A) and resin (X) is preferably 10% by mass or less, and more preferably 5% by mass or less, of 100% by mass of the total resin components.

[0038] <Physical Properties of the Resin Sheet> The resin sheet according to this embodiment may have a single-layer structure or a multilayer structure. In the case of a multilayer structure, it must include a layer containing polycarbonate resin (A), resin (X), and conductive filler (B), and the other layers may contain any components. In that case, it is preferable to configure the layer containing polycarbonate resin (A), resin (X), and conductive filler (B) to be the outermost layer. Here, "configured to be the outermost layer" includes, for example, configuring it as the layer that comes into contact with the cover tape, which is the lid material, when the resin sheet according to this embodiment is used as a carrier tape for an electronic component package. By configuring the layer containing polycarbonate resin (A), resin (X), and conductive filler (B) to be the outermost layer, the surface resistance value of the outermost layer tends to be low.

[0039] (Thickness of the resin sheet) The thickness of the resin sheet can be set arbitrarily, as long as it does not impair the effects of the present disclosure. For example, the total thickness of the resin sheet is preferably 0.1 mm or more and 1 mm or less, and more preferably 0.15 mm or more and 0.8 mm or less, from the viewpoint of the moldability and strength of the packaging container.

[0040] (Surface resistance value) In one embodiment, the surface resistance value of the resin sheet is 1.0 × 10 ８ It may be less than Ω, and 1.0 × 10 ３ Ω or more 1.0×10 ８ It is more preferable to have a value of Ω or less, and 1.0 × 10 ４ Ω or more 1.0×10 ８A value of Ω or less is even more preferable. When the surface resistance is within the above range, the resin sheet can be suitably used to manufacture molded bodies for packaging electronic components, and it becomes easier to prevent damage to electronic components due to static electricity or damage to electronic components due to the inflow of electricity from the outside. The surface resistance can be measured in accordance with ANSI / ESD STM 11.11 using a contact-type resistivity meter (for example, Torek 152-1, etc.).

[0041] (Volume resistivity) In one embodiment, the volume resistivity of the resin sheet is 1.0 × 10 ８ It may be less than Ω, and 1.0 × 10 ３ Ω or more 1.0×10 ８ Less than Ω is more preferable, 1.0 × 10 ４ Ω or more 1.0×10 ８ A value less than Ω is even more preferable. When the volume resistivity is within the above range, it can be suitably used as a resin sheet for packaging electronic components. Furthermore, it becomes easier to prevent damage to electronic components enclosed in the electronic component packaging obtained from the resin sheet due to static electricity or electrical inflow from the outside. The volume resistivity can be measured in accordance with ANSI / ESD STM 11.12 using a contact resistivity meter (for example, Torek 152-1).

[0042] [Applications] The resin sheet according to this embodiment is typically a resin sheet that can be used as a material for molded articles for packaging intermediate or final industrial products. Industrial products are typically electronic components or products containing electronic components. That is, in this embodiment, the resin sheet may be used as a sheet for packaging electronic components. Examples of electronic components or products containing electronic components include, but are not limited to, semiconductors, integrated circuits (ICs), light-emitting diodes (LEDs), diodes, resistors, capacitors, transistors, piezoelectric resistors, filters, crystal oscillators, crystal resonators, connectors, switches, potentiometers, relays, inductors, memories, or combinations thereof. Another embodiment relating to the above resin sheet is the use of the above resin sheet as a sheet for packaging electronic components or a method of using it in this way.

[0043] [Method for Manufacturing Resin Sheets] The method for manufacturing resin sheets is not particularly limited and can be manufactured using general methods. For example, a resin sheet can be manufactured by extruding a composition containing polycarbonate resin (A), resin (X), and conductive filler (B) using a feed block method with a single-screw extruder (e.g., a φ30 mm single-screw extruder manufactured by INTYPE ENTERPRISE). If the resin sheet has a multilayer structure, the raw materials constituting each layer can be supplied to separate extruders and suitably manufactured by extrusion molding using a multilayer T-die with a multi-manifold, or by T-die extrusion molding using the feed block method.

[0044] [Molded article and method for manufacturing the same] The molded article according to this embodiment includes the resin sheet according to the above embodiment and can be obtained by processing the resin sheet. Processing the resin sheet can be done by known methods including vacuum forming, pressure forming, press forming, etc. Processing the resin sheet may include steps such as cutting the sheet into a desired shape or punching sprocket holes in the sheet. The molded article according to this embodiment is typically a molded article for packaging electronic components. In one embodiment, the molded article may be a container, and in particular a container having a storage section for storing electronic components. In another embodiment, the molded article may be a carrier tape or a tray, and in particular an embossed carrier tape.

[0045] A non-limiting list of exemplary embodiments and combinations of exemplary embodiments of the present disclosure is disclosed below: [1] Polycarbonate resin (A) and SP value [(J / cm²) ３ ) １／２[1] A resin sheet comprising one or more resins (X) having a ratio of 19.2 or higher, and a conductive filler (B). [2] The resin sheet according to [1], wherein the resin (X) comprises at least one selected from styrene resins and ester resins. [3] The resin sheet according to [1] or [2], wherein the polycarbonate resin (A) is contained in an amount of 30% by mass or more and less than 90% by mass of the total 100% by mass of the polycarbonate resin (A), resin (X), and conductive filler (B). [4] The resin sheet according to any one of [1] to [3], wherein the resin (X) is contained in an amount of 1% by mass or more and 50% by mass of the total 100% by mass of the polycarbonate resin (A), resin (X), and conductive filler (B). [5] The resin sheet according to any one of [1] to [4], wherein the conductive filler (B) is contained in an amount of more than 0% by mass and 25% by mass or less in a total of 100% by mass of the polycarbonate resin (A), resin (X), and conductive filler (B). [6] The SP value of the resin (X) [(J / cm²] ３ ) １／２ A resin sheet according to any of [1] to [5], wherein the surface resistance value is 19.5 or more and 27.9 or less. [7] Surface resistance value is 1.0 × 10 ８ A resin sheet as described in any of [1] to [6], having a resistivity of less than Ω. [8] A volume resistivity of 1.0 × 10 ８ A resin sheet according to any one of [1] to [7], having a density of less than Ω. [9] A resin sheet according to any one of [1] to [8], which is a sheet for packaging electronic components.

[10] A molded article comprising a resin sheet according to any one of [1] to [9].

[11] A molded article according to

[10] , which is a carrier tape or tray. Each configuration and combination thereof in each embodiment is an example, and additions, omissions, substitutions, and other modifications can be made as appropriate without departing from the spirit of this disclosure. This disclosure is not limited by embodiments.

[0046] The present disclosure will be further illustrated by the following examples, but these examples will not limit the interpretation of the present disclosure.

[0047] (Examples 1-16, Comparative Examples 1-3) Using a φ30 mm single-screw extruder (manufactured by INTYPE ENTERPRISE, product name "EXT30"), each of the raw materials listed in Tables 1-3 was melt-co-extruded at 280°C using the feed-block method, and then cooled and solidified to obtain a resin sheet. The thickness of the resin sheet was 0.25 mm.

[0048] The raw materials used are as follows: • Polycarbonate resin (A) • Conductive filler (B): Carbon black • PBT: Polybutylene terephthalate resin • PET: Polyethylene terephthalate resin • AS1: Acrylonitrile-styrene copolymer with an acrylonitrile-styrene ratio of 1:3 • AS2: Acrylonitrile-styrene copolymer with an acrylonitrile-styrene ratio of 1:4 • ABS: Acrylonitrile-butadiene-styrene copolymer • MBS: Methyl methacrylate-butadiene-styrene copolymer • GPPS: General-purpose polystyrene • SBC: Styrene-butadiene copolymer • MS: Methyl methacrylate-styrene copolymer • PP: Polypropylene resin • PMMA: Polymethyl methacrylate resin

[0049] (Method for measuring SP values) For resins, the molecular structure and monomer ratio were input into the HSPiP (Hansen Solubility Parameters in Practice) software "Hansen Solubility Parameters in Practice (HSPiP) ver. 4.1.07" to analyze the solubility of the resin raw materials and calculate the SP value. For conductive fillers, the SP value was estimated by referring to Part. Part. Syst. Character., 2025, 42, 2400069.

[0050] (Method for measuring surface resistance) The surface resistance of the resin sheet surface was measured in accordance with ANSI / ESD STM 11.11 using a contact resistivity meter (Torek, product name: Torek 152-1).

[0051] (Method for measuring volume resistivity) A resin sheet sample measuring 110 mm (length) x 110 mm (width) x 250 μm (thickness) was prepared, and the volume resistivity of the resin sheet was measured in accordance with ANSI / ESD STM 11.12 using a contact-type resistivity meter (Torek Corporation, product name: Torek 152-1). The measurement environment was set to a temperature of 20°C ± 5°C and a humidity of 50% ± 10% RH.

[0052]

[0053]

[0054]

[0055] As shown in Tables 1 and 2, the SP value [(J / cm²) ３ ) １／２ Examples 1 to 16, which used resin (X) with a value of 19.2 or higher, had surface resistance and volume resistivity values ​​of 1 × 10 ８ A tendency towards lower values, below Ω, was observed. On the other hand, as shown in Table 3, the SP value [(J / cm²) ３ ) １／２ For resins where the ratio is less than 19.2, both the surface resistance and volume resistance are 1 × 10⁻⁶. ８ The resistance value exceeded Ω, indicating a decrease in conductivity. Furthermore, in compositions where polycarbonate resin (A) and resin (X) are PBT (Examples 1-8), even when the amount of PBT was varied within the range of 5-40% by mass, both the surface resistance and volume resistance remained at low levels, demonstrating extremely high stability of conductivity with respect to the blending ratio. These results indicate that the SP value of resin (X) contributes to the excellent conductivity in the resin compositions of this disclosure. Therefore, the resin sheets of the present invention are useful for packaging electronic components and can effectively suppress the possibility of malfunctions in electronic components due to static electricity.

[0056] The resin sheet of this embodiment has excellent conductivity and can be used in various fields, thus possessing industrial applicability.

Claims

1. Polycarbonate resin (A) and SP value [(J / cm²)] ３ ) １／２ A resin sheet comprising one or more resins (X) having a coefficient of 19.2 or higher, and a conductive filler (B).

2. The resin sheet according to claim 1, wherein the resin (X) comprises at least one selected from styrene-based resins and ester-based resins.

3. The resin sheet according to claim 1 or 2, wherein the polycarbonate resin (A) is contained in an amount of 30% by mass or more and less than 90% by mass of the total of 100% by mass of the polycarbonate resin (A), resin (X), and conductive filler (B).

4. The resin sheet according to claim 1 or 2, wherein the resin (X) is contained in an amount of 1% by mass or more and 50% by mass or less in the total mass of the polycarbonate resin (A), resin (X), and conductive filler (B).

5. The resin sheet according to claim 1 or 2, wherein the conductive filler (B) is contained in an amount of more than 0% by mass and 25% by mass or less in a total of 100% by mass of the polycarbonate resin (A), resin (X), and conductive filler (B).

6. SP value of the resin (X) [(J / cm²)] ３ ) １／２ The resin sheet according to claim 1 or 2, wherein the ratio is 19.5 or more and 27.9 or less.

7. Surface resistance value is 1.0 × 10 ８ A resin sheet according to claim 1 or 2, wherein the ohm is less than Ω.

8. The volume resistivity is 1.0 × 10⁻⁶ ８ A resin sheet according to claim 1 or 2, wherein the ohm is less than Ω.

9. The resin sheet according to claim 1 or 2, which is a sheet for packaging electronic components.

10. A molded article comprising the resin sheet described in claim 1 or 2.

11. The molded body according to claim 10, which is a carrier tape or tray.

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