Electronic device comprising structure for receiving sound signal

WO2026205690A1PCT designated stage Publication Date: 2026-10-01SAMSUNG ELECTRONICS CO LTD
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Patent Information

Application Number
PCT/KR2025/020472
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-15
Filing Date
2025-12-02
Publication Date
2026-10-01

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Abstract

This electronic device may comprise a housing. The housing may include a rear cover defining an opening and a first hole. The electronic device may comprise a camera. The camera may be disposed in the housing such that a lens of the camera is positioned in the opening when viewed from the rear side of the housing. The electronic device may comprise a camera cover which defines a second hole acoustically coupled to the first hole and is disposed on the rear cover so as to cover the opening and the first hole. The camera cover may include a light-transmitting portion aligned with the lens of the camera. The electronic device may comprise a microphone configured to receive sound waves from the outside of the electronic device that pass through the second hole of the camera cover and then pass through the first hole of the rear cover.
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Description

Electronic device including a structure for receiving sound signals

[0001] The disclosure relates to an electronic device including a structure for receiving a sound signal.

[0002] An electronic device such as a smartphone may include one or more microphones. The one or more microphones, which are used for various functions such as calling, voice recording, and voice recognition, may receive external sound through a hole or small passage provided in the electronic device.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0004] According to an exemplary embodiment, an electronic device is disclosed. The electronic device may include a housing. The housing may include a rear cover defining an opening and a first hole. The electronic device may include a camera. The camera may be disposed within the housing such that the lens of the camera is located within the opening when viewed from the rear side of the housing. The electronic device may include a camera cover disposed on the rear cover to cover the opening and the first hole, defining a second hole acoustically coupled with the first hole. The camera cover may include a light-transmitting portion aligned with the lens of the camera. The electronic device may include a microphone configured to receive sound waves from outside the electronic device passing through the second hole of the camera cover and then passing through the first hole of the rear cover.

[0005] The above and other aspects, features, and advantages of specific embodiments of the present disclosure will become more apparent from the following detailed description, which is taken into account together with the accompanying drawings.

[0006] FIG. 1 is a block diagram of an exemplary electronic device in a network environment according to various embodiments.

[0007] FIG. 2a is a drawing illustrating examples of unfolded states of an electronic device according to various embodiments.

[0008] FIG. 2b is a drawing illustrating examples of the folding state of an electronic device according to various embodiments.

[0009] FIG. 2c is an exploded perspective view of an exemplary electronic device according to various embodiments.

[0010] FIG. 3a is a drawing illustrating a partial rear view of a housing of an electronic device according to various embodiments.

[0011] FIGS. 3b and FIGS. 3c are partially exploded perspective views of an electronic device according to various embodiments.

[0012] FIG. 3d is a partial perspective view of an electronic device according to various embodiments.

[0013] FIG. 4 is a cross-sectional view taken along line A-A' of FIG. 3a according to various embodiments.

[0014] FIG. 5 is a cross-sectional view taken along line B-B' of FIG. 3a according to various embodiments.

[0015] FIG. 6 is a partial perspective view of an electronic device according to various embodiments.

[0016] FIG. 1 is a block diagram of an exemplary electronic device (101) in a network environment (100) according to various embodiments.

[0017] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In various embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In various embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0018] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof. Thus, the processor (120) may include various processing circuits and / or multiple processors. For example, the term "processor" as used herein, including in the claims, may include various processing circuits including at least one processor, wherein at least one of the at least one processor may be configured to perform the various functions described herein individually and / or collectively in a distributed manner.When "processor," "at least one processor," and "one or more processors" as used herein are described as being configured to perform numerous functions, these terms include, for example and but not limited to, situations where one processor performs a part of the mentioned functions and other processor(s) perform a different part of the mentioned functions, and also situations where a single processor can perform all the mentioned functions. Additionally, at least one processor may include a combination of processors that perform the various mentioned / disclosed functions, for example, in a distributed manner. At least one processor may execute program instructions to achieve or perform the various functions.

[0019] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0020] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0021] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0022] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0023] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0024] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0025] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0026] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0027] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0028] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0029] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0030] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0031] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0032] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0033] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0034] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 664 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 6 ms or less) for realizing URLLC.

[0035] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator comprising a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0036] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0037] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0038] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0039] FIG. 2a is a drawing illustrating an example of an unfolded state of an electronic device according to various embodiments. FIG. 2b is a drawing illustrating an example of a folded state of an electronic device according to various embodiments. FIG. 2c is an exploded perspective view of an exemplary electronic device according to various embodiments.

[0040] Referring to FIGS. 2a, 2b, and 2c, the electronic device (201) may include a first housing part (210), a second housing part (220), and a foldable display (230). The electronic device (201) may be referred to as a foldable electronic device in that it is configured to be folded along a folding axis (237).

[0041] In one embodiment, the electronic device (201) may include a first housing part (210), a second housing part (220), a hinge structure (260), a foldable display (230), a printed circuit board (250), a display (235), and / or a back plate (290). According to one embodiment, the electronic device (201) may omit at least one of the components or additionally include other components.

[0042] In one embodiment, the first housing part (210) may define a portion of the outer surface of the electronic device (201). For example, the first housing part (210) may define a first surface (211), a second surface (212) spaced apart from and opposite to the first surface (211), and a first side of a first side wall (213) that encloses at least a portion of the first surface (211) and the second surface (212). In one embodiment, the first housing part (210) may provide the space defined by the first surface (211), the second surface (212), and the first side as a space for placing components of the electronic device (201).

[0043] In one embodiment, the second side wall (223) may be pivotally or rotatably connected to the first side wall (213) through a hinge structure (260) disposed on the hinge cover (265). The hinge structure (260) may include a hinge module and hinge plates (266, 267). The hinge plates may include a first hinge plate (266) and a second hinge plate (267), the first hinge plate (266) may be connected to the first housing part (210), and the second hinge plate (267) may be connected to the second housing part (220).

[0044] In one embodiment, the second housing part (220) may include a third surface (221), a fourth surface (222) separated from and facing the third surface (221), and a second side wall (223) that encloses at least a portion of the third surface (221) and the fourth surface (222). The second housing part (220) may provide a space defined by the third surface (221), the fourth surface (222), and the second side of the second side wall (223) as a space for placing components of the electronic device (201).

[0045] In one embodiment, the foldable display (230) may include a window exposed to the outside. The window protects the surface of the foldable display (230) and is formed of a transparent material to transmit visual information provided from the foldable display (230) to the outside. The window may include a glass material such as ultra-thin glass (UTG) or a polymer material such as polyimide (PI).

[0046] In one embodiment, the foldable display (230) may form at least a portion of the first surface (211) of the first housing part (210) (e.g., the front of the first housing part (210)) and the third surface (221) of the second housing part (220) (e.g., the front of the second housing part (220)). The foldable display (230) may be disposed on the first surface (211) of the first housing part (210) and the third surface (221) of the second housing part (220) across the hinge structure (260) within the hinge cover (265). The foldable display (230) may be configured to be bent within the folded state of the electronic device (201) by the hinge structure (260). The foldable display (230) may include a first display area (231), a second display area (232), and a third display area (233). For example, the foldable display (230) may include a first display area (231) disposed on a first surface (211) of a first housing, a second display area (232) disposed on a third surface (221) of a second housing, and a third display area (233) between the first display area (231) and the second display area (232). The foldable display (230) may be supported by a first bracket (270) of a first housing part (210) and a second bracket (280) of a second housing part (220).

[0047] According to one embodiment, the foldable display (230) may include an opening formed in a part of the screen display area, or the bracket supporting the foldable display (230) may include a recess or an opening. The electronic device (201) may include at least one camera aligned with the recess or the opening. For example, the first display area (231) may further include at least one camera (236) capable of acquiring an image from the outside through a part of the first display area (231). According to one embodiment, at least one camera (236) may be included on the rear of the foldable display (230) corresponding to the first display area (231) or the second display area (232) of the foldable display (230). For example, at least one camera (236) may be positioned below the foldable display (230) and wrapped by the foldable display (230). At least one camera (236) may be an under-display camera (UDC) that is wrapped by the foldable display (230) and is not exposed to the outside. However, not limited thereto, the foldable display (230) may include an opening that exposes at least one camera (236) to the outside. In one embodiment, the camera (236) may acquire an image of an external environment and / or an external object through the opening.

[0048] In one embodiment, the fourth surface (222) of the second housing part (220) may further include at least one camera (234) and a display (235) that can be seen through a part of the fourth surface (222).

[0049] In one embodiment, the hinge structure (260) may be configured to pivotally connect a first bracket (270) forming a first housing part (210) and a second bracket (280) forming a second housing part (220).

[0050] In one embodiment, the electronic device (201) may be in a folded state, an unfolded state, or an intermediate state. The folded state may be a state in which the first surface (211) of the first housing part (210) and the third surface (221) of the second housing part (220) face each other. In the folded state, the direction in which the first surface (211) faces and the direction in which the third surface (221) faces may be opposite to each other. The unfolded state may be a state in which the first surface (211) of the first housing part (210) and the third surface (221) of the second housing part (220) are substantially continuous planes. In the unfolded state, the direction in which the first surface (211) faces and the direction in which the third surface (221) faces may be the same. The intermediate state may be a state between the unfolded state and the folded state. In the intermediate state, the direction in which the first surface (211) faces and the direction in which the third surface (221) faces may be different.

[0051] In one embodiment, while the electronic device (201) is in a folded state, the hinge cover (265) covering the hinge structure (260) may be exposed at least partially through the space between the first housing part (210) and the second housing part (220). In one embodiment, while the electronic device (201) is in an unfolded state, the hinge cover (265) may be covered by the first housing part (210) and the second housing part (220).

[0052] In one embodiment, the electronic device (201) can be folded along a folding axis (237) passing through a hinge cover (265) or a hinge structure (260). For example, a hinge structure (260) within the hinge cover (265) may be positioned between a first housing part (210) and a second housing part (220) of the electronic device (201) to allow the electronic device (201) to be bent, curved, or folded. For example, the first housing part (210) may be connected to the second housing part (220) through a hinge structure (260) positioned within the hinge cover (265) and may be rotated along a folding axis (237).

[0053] In one embodiment, the electronic device (201) can be folded so that the first housing part (210) and the second housing part (220) face each other by rotating about the folding axis (237). In one embodiment, the electronic device (201) can be folded so that the first housing part (210) and the second housing part (220) overlap or are stacked on top of each other.

[0054] The hinge structure (260) may include a hinge module and hinge plates (266, 267). The hinge module may include a hinge gear (262, 263) that makes the first housing part (210) and the second housing part (220) pivotable.

[0055] The first housing part (210) may include a first bracket (270), and the second housing part (220) may include a second bracket (280). The first bracket (270) may be partially covered by the first side wall (213), and the second bracket (280) may be partially covered by the second side wall (223). The first bracket (270) may be formed integrally with the first side wall (213), and the second bracket (280) may be formed integrally with the second side wall (223). According to one embodiment, the first bracket (270) may be formed separately from the first side wall (213), and the second bracket (280) may be formed separately from the second side wall (223). The first sidewall (213) and the second sidewall (223) may be formed of a metallic material, a non-metallic material, or a combination thereof. For example, the first sidewall (213) may include a conductive portion (218) and a non-conductive portion (219). The conductive portion (218) may be used as a radiator of the antenna.

[0056] One side of the first bracket (270) is coupled to the rear plate (290), and the other side of the first bracket (270) can be coupled to the foldable display (230). One side of the second bracket (280) is coupled to the display (235), and the other side of the second bracket (280) can be coupled to the foldable display (230).

[0057] A printed circuit board (250) and a battery may be disposed in the space between the surface formed by the first bracket (270) and the second bracket (280) and the surface formed by the display (235) and the rear plate (290). The printed circuit board (250) may be separated so as to be disposed on the first bracket (270) of the first housing part (210) and the second bracket (280) of the second housing part (220), respectively. Components for implementing various functions of the electronic device (201) may be disposed on the printed circuit board (250).

[0058] According to one embodiment, the first printed circuit board (251) may have components for implementing the overall function of the electronic device (201) placed thereon, and the second printed circuit board (252) may have electronic components for implementing some function of the first printed circuit board (251) placed thereon, or components for driving a display panel placed on the fourth side (222) placed thereon. The first printed circuit board (251) and the second printed circuit board (252) may be electrically connected by a flexible printed circuit board (240).

[0059] The battery (255) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell as a device for supplying power to at least one component of the electronic device (201). At least a portion of the battery (255) may be disposed substantially coplanar with the printed circuit board (250). The surface formed substantially coplanar with the printed circuit board (250) and the battery (255) may be disposed on one side of the first bracket (270) and the second bracket (280) (e.g., the side facing the second side (212) and the fourth side (222) or the side facing the display panel and the rear plate (290). For example, a foldable display (230) may be placed on a first surface (211) and a third surface (221), and a printed circuit board (250) and a battery (255) may be placed on a second surface (212) and a fourth surface (222) facing the surface where the foldable display (230) is placed.

[0060] In one embodiment, the antenna (285) may be positioned between the rear plate (290) and the battery (255). The antenna (285) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (285) may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging.

[0061] In FIG. 2a, 2b, and 2c, the electronic device (201) is illustrated as including a plurality of foldable housing parts, but is not limited thereto. For example, the electronic device (201) may be a bar-type electronic device.

[0062] FIG. 3a is a drawing illustrating a partial rear view of a housing of an electronic device according to various embodiments. FIG. 3b and FIG. 3c are partial exploded perspective views of an electronic device according to various embodiments. FIG. 3d is a partial perspective view of an electronic device according to various embodiments.

[0063] Referring to FIG. 3a, according to one embodiment, an electronic device (300) (e.g., the electronic device (201) of FIG. 2a) may include a housing (e.g., the first housing part (210) of FIG. 2a) including a rear cover (310) and a camera cover (320). Referring to FIG. 3b and FIG. 3c, the electronic device (300) may include a rear cover (310), a camera cover (320), a coupling plate (330), a rear plate (350), and a printed circuit board (360).

[0064] Referring again to FIG. 3a, the rear cover (310) may include a first surface (310A) (or, front side, or, front side surface)) and a second surface (310B) (or, rear side, or, rear side surface) opposite to the first surface (310A). The first surface (310A) may face the interior of the electronic device (300), and the second surface (310B) may face the exterior of the electronic device (300). For example, the second surface (310B) of the rear cover (310) may form (or define) at least a portion of the rear of the electronic device (300) (e.g., the second surface (212) in FIG. 2a). The camera cover (320) may be referred to as camera decoration (or, deco).

[0065] Referring to FIGS. 3b and 3c, the rear cover (310) may define an opening (315). In one embodiment, the opening (315) may penetrate the rear cover (310). For example, the opening (315) may extend from a first surface (310A) of the rear cover (310) to a second surface (310B).

[0066] Referring to FIGS. 3b and 3c, the rear cover (310) may define a first hole (311). In one embodiment, the first hole (311) may penetrate the rear cover (310). For example, the first hole (311) may extend from a first surface (310A) of the rear cover (310) to a second surface (310B). For example, the first hole (311) may be spaced apart (in the +x axis direction) from the opening (315).

[0067] For example, the member (313) may surround the first hole (311) on the rear cover (310) and be interposed (positioned) between the camera cover (320) and the rear cover (310). For example, the member (313) may include a material configured to absorb and / or block sound (e.g., sponge and / or rubber). For example, the member (313) may be an adhesive material (or double-sided tape, and / or waterproof tape) that causes the camera cover (320) and the rear cover (310) to come into contact with each other.

[0068] In one embodiment, the camera cover (320) may be positioned to cover the opening (315) and the first hole (311) of the rear cover (310). In one embodiment, the camera cover (320) may be positioned on the rear cover (310). For example, the camera cover (320) may be positioned on the second surface (310B) (or rear) of the rear cover (310). For example, the camera cover (320) may be positioned on the second surface (310B) (or rear) of the rear cover (310) to cover the opening (315) and the first hole (311) of the rear cover (310). For example, the camera cover (320) may be attached to the second surface (310B) (or rear) of the rear cover (310).

[0069] In one embodiment, the camera cover (320) may define a second hole (e.g., hole (420) of FIG. 4) that is acoustically coupled to the first hole (311). In one embodiment, the acoustic coupling of the first hole (311) and the second hole may refer to a sound signal (370) (or sound wave) passing through the second hole from outside the electronic device (300) being sequentially transmitted to the first hole (311) (or passing through the first hole (311)). In one embodiment, the space within the camera cover (320) (or the space where the sound signal (370) passing through the second hole (e.g., hole (420) of FIG. 4) is transmitted to (or guided to) the first hole (311)) may be referred to as an acoustic conduit.

[0070] In one embodiment, the camera cover (320) may include a first camera cover portion (322) and a second camera cover portion (324). In one embodiment, the second hole of the camera cover (320) may be defined (or formed) by a spaced gap between the first camera cover portion (322) and the second camera cover portion (324). For example, the second hole of the camera cover (320) may be obscured by the second camera cover portion (324) when looking at the rear of the electronic device (300).

[0071] In one embodiment, the first camera cover portion (322) may be positioned to cover the opening (315) and the first hole (311) of the rear cover (310). For example, the first camera cover portion (322) may be positioned on the rear cover (310) to cover the opening (315) and the first hole (311) of the rear cover (310). In one embodiment, the first camera cover portion (322) may be in contact (or attached) to the rear cover (310) (e.g., by an adhesive material such as double-sided tape and / or waterproof tape).

[0072] For example, the first camera cover portion (322) may include one or more openings (323-1, 323-2, 323-3) aligned with a window portion (325) comprising one or more window portions (325-1, 325-2, 325-3) of the second camera cover portion (324) of the camera cover (320). The one or more openings (323-1, 323-2, 323-3) may be aligned in one direction (e.g., -y-axis direction or +y-axis direction).

[0073] In one embodiment, the first camera cover portion (322) may be formed by molding. In one embodiment, the first camera cover portion (322) may include a plastic material. In one embodiment, the first camera cover portion (322) may be formed of plastic. Regions surrounding each of the one or more openings (323-1, 323-2, 323-3) may be formed substantially opaque. In one embodiment, the hardness of the rear cover (310) may be higher than the hardness of the first camera cover portion (322).

[0074] In one embodiment, the second camera cover portion (324) may be supported by the first camera cover portion (322) of the camera cover (320). In one embodiment, the second camera cover portion (324) may be in contact (or attached) (or placed) on the first camera cover portion (322). For example, the second camera cover portion (324) may be placed on the first camera cover portion (322) of the camera cover (320) to cover one or more openings (323-1, 323-2, 323-3) of the first camera cover portion (322). For example, the second camera cover portion (324) may be in contact (or attached) to the first camera cover portion (322) through an adhesive material (e.g., double-sided tape, and / or waterproof tape). In one embodiment, the first camera cover portion (322) may be covered by the second camera cover portion (324).

[0075] In one embodiment, the second camera cover portion (324) may include a metal material. In one embodiment, the second camera cover portion (324) may be formed of metal. For example, without limitation, the second camera cover portion (324) may be formed of stainless steel. For example, the hardness of the rear cover (310) may be lower than the hardness of the second camera cover portion (324).

[0076] For example, the second camera cover portion (324) may include (or define) one or more window portions (325-1, 325-2, 325-3) for cameras. One or more window portions (325-1, 325-2, 325-3) may be formed to be substantially transparent. One or more cameras (e.g., camera (400) of FIG. 4) may be configured to receive light through one or more window portions (325-1, 325-2, 325-3) of the camera cover (320). Hereinafter, each of the one or more window portions (325-1, 325-2, 325-3) may be referred to as a lens or a light-transmitting portion.

[0077] In one embodiment, one or more cameras of the electronic device (300) (e.g., at least one camera (234) of FIG. 2A) may be disposed under the camera cover (320). For example, the camera cover (320) may include one or more window portions (325-1, 325-2, 325-3) (or lenses, light-transmitting portions) for the one or more cameras. In one embodiment, the one or more cameras may be arranged along one direction (e.g., the -y-axis direction or the +y-axis direction). For example, but not limited to, the one or more cameras may include a wide-angle camera, an ultra-wide-angle camera, and / or a telephoto camera. In one embodiment, the one or more cameras may each be included in distinct camera modules. Alternatively, the one or more cameras may be included in a single camera module.

[0078] In one embodiment, one or more window portions (325-1, 325-2, 325-3) of the camera cover (320) may be aligned with respect to each of one or more cameras. For example, one or more window portions (325-1, 325-2, 325-3) may be positioned over each of one or more cameras (e.g., in the +z axis direction). For example, one or more window portions (325-1, 325-2, 325-3) may be substantially centered on the optical axis of each of one or more cameras.

[0079] According to an embodiment, the camera cover (320) may be formed integrally. For example, the camera cover (320) may be a camera cover in which a first camera cover portion (322) and a second camera cover portion (324) are formed integrally. In one embodiment, when the first camera cover portion (322) and the second camera cover portion (324) are formed integrally, the camera cover (320) may be formed (of a plastic material) by molding. In one embodiment, when the first camera cover portion (322) and the second camera cover portion (324) are formed integrally, the hardness of the camera cover (320) may be lower than the hardness of the rear cover (310).

[0080] Referring to FIG. 3b, in one embodiment, a coupling plate (330) may be positioned between a rear cover (310) and a rear plate (350). For example, the coupling plate (330) may be positioned below the rear cover (310) (e.g., in the -z axis direction). For example, the coupling plate (330) may be positioned on a first surface (310A) of the rear cover (310). For example, the coupling plate (330) may be attached to the first surface (310A) of the rear cover (310) (e.g., via an adhesive material such as double-sided tape and / or waterproof tape). For example, the coupling plate (330) may face at least a portion of the first camera cover portion (322) through the rear cover (310). For example, the coupling plate (330) and the first camera cover portion (322) may face each other with the rear cover (310) in between. According to an embodiment, the connecting plate (330) may be referred to as an inner deco plate (or inner decoration plate) (or a fixing plate).

[0081] For example, the coupling plate (330) may include a hole (331) acoustically coupled to a first hole (311) of the rear cover (310), and an opening (335) substantially centered on an opening (315) of the rear cover (310). For example, the size (or diameter) of the opening (335) of the coupling plate (330) may be larger than the size (or diameter) of the opening (315) of the rear cover (310). For example, the hole (331) of the coupling plate (330) may be radially misaligned with respect to the first hole (311). For example, the center of the hole (331) of the coupling plate (330) may not be aligned with respect to the center of the first hole (311). For example, when the rear cover (310) is viewed from the rear of the electronic device (300) (or in the -z axis direction), the center of the hole (331) of the coupling plate (330) may be spaced apart from the center of the first hole (311) in a designated direction (e.g., in the +y axis direction) along the perimeter of the opening (315 or 335). In one embodiment, the hole (331) of the coupling plate (330) may be acoustically coupled with the first hole (311). For example, acoustic coupling of the hole (331) of the coupling plate (330) with the first hole (311) may refer to a sound signal (370) (or sound wave) that has sequentially passed through the second hole and the first hole (311) from outside the electronic device (300) being transmitted to the hole (331) of the coupling plate (330) (or passing through the hole (331) of the coupling plate (330). For example, as the hole (331) of the coupling plate (330) is radially misaligned with respect to the first hole (311), the sound signal (370) that has passed through the first hole (311) is guided along a direction specified by the rear cover (310) (e.g., +y axis direction) and subsequently can pass through the hole (331).

[0082] In one embodiment, the connecting members (341, 345) may be configured to secure the camera cover (320) to the rear cover (310). For example, the connecting members (341, 345) may be configured to secure the camera cover (320) to the rear cover (310) by being fastened to the camera cover (320) by penetrating the connecting plate (330) and the rear cover (310) below the connecting plate (330). In one embodiment, the connecting members (341, 345) (or fastening members) may secure the first camera cover portion (322) (or molded portion) of the camera cover (320) to the rear cover (310) by being inserted through the first surface (310A) (or front) of the rear cover (310).

[0083] In one embodiment, the connecting members (341, 345) may be members for fixing the camera cover (320) and the rear cover (310) (e.g., screws (or bolts) (or rivets)).

[0084] According to an embodiment, the coupling plate (330) and the coupling members (341, 345) may be omitted. When the coupling plate (330) and the coupling members (341, 345) are omitted, the camera cover (320) may be attached to the rear cover (310) through a contact material.

[0085] In one embodiment, the rear plate (350) may be placed between the rear cover (310) (or the coupling plate (330)) and the printed circuit board (360).

[0086] In one embodiment, the rear plate (350) may define a hole (351) that is acoustically coupled to the first hole (311) of the rear cover (310) and the hole (331) of the coupling plate (330). For example, the hole (351) of the rear plate (350) may be substantially aligned with the hole (331) of the coupling plate (330). For example, when the coupling plate (330) is viewed from the rear of the electronic device (300) (or in the -z axis direction), the hole (331) of the coupling plate (330) may overlap with the hole (351) of the rear plate (350). In one embodiment, the hole (351) of the rear plate (350) may be acoustically coupled to the hole (331) of the coupling plate (330). For example, the hole (351) of the rear plate (350) being acoustically coupled with the hole (331) of the coupling plate (330) may refer to a sound signal (370) (or sound wave) that has sequentially passed through the second hole, the first hole (311), and the hole (331) of the coupling plate (330) from outside the electronic device (300) being transmitted to the hole (351) of the rear plate (350) (or passing through the hole (351) of the rear plate (350).

[0087] In one embodiment, the printed circuit board (360) may be positioned below the rear cover (310) (or in the -z axis direction).

[0088] In one embodiment, the printed circuit board (360) may define a hole (361) aligned to transmit the sound signal (370) passing through the first hole (311) toward a microphone (e.g., microphone (380) in FIG. 3d). For example, the hole (361) of the printed circuit board (360) may be substantially aligned with the hole (351) of the back plate (350) and the hole (331) of the coupling plate (330). For example, the hole (361) of the printed circuit board (360) may be aligned in a designated direction (e.g., -z axis direction) with respect to the hole (351) of the back plate (350) and the hole (331) of the coupling plate (330). For example, when the printed circuit board (360) is viewed from the rear of the electronic device (300) (or in the direction of the -z axis), the hole (361) of the circuit board (360) may overlap with the hole (351) of the rear plate (350) and the hole (331) of the coupling plate (330). In one embodiment, the hole (361) of the printed circuit board (360) may be acoustically coupled with the hole (351) of the rear plate (350). For example, acoustic coupling of the hole (361) of the printed circuit board (360) with the hole (351) of the rear plate (350) may refer to a sound signal (370) (or sound wave) that has sequentially passed through the second hole, the first hole (311), the hole (331) of the coupling plate (330), and the hole (351) of the rear plate (350) from outside the electronic device (300) being transmitted to the hole (361) of the printed circuit board (360) (or passing through the hole (361) of the printed circuit board (360). In one embodiment, the sound signal (370) (or sound wave) transmitted to the hole (361) of the printed circuit board (360) (or passing through the hole (361) of the printed circuit board (360)) may be transmitted to a microphone (380). In one embodiment, referring to FIG. 3d, the microphone (380) can receive a sound signal (370) (or sound wave) from outside the electronic device (300).

[0089] FIG. 4 is a cross-sectional view taken along line A-A' of FIG. 3a according to various embodiments. FIG. 5 is a cross-sectional view taken along line B-B' of FIG. 3a according to various embodiments. FIG. 6 is a partial perspective view of an electronic device according to various embodiments.

[0090] Referring to FIG. 4, among one or more cameras, the first camera (400) may be oriented toward the rear direction (e.g., the +z axis direction) of the electronic device (300). In one embodiment, the first camera (400) may be positioned within the housing such that the lens (410) is located within the opening (315) of the rear cover (310) when viewed from the rear of the housing. For example, the size (or diameter) of the lens (410) may be larger than the size (or diameter) of the opening (335) of the rear cover (310). In one embodiment, the lens (410) of the first camera (400) may be aligned with the first window portion (325-1) (or light-transmitting portion) of the camera cover (320).

[0091] In one embodiment, the first camera (400) can receive light through the first window portion (325-1) and the lens (410). For example, the first camera (400) can be configured to acquire an image corresponding to the rear direction (e.g., +z axis direction) of the electronic device (300) through the camera cover (320).

[0092] In one embodiment, the second hole (420) of the camera cover (320) may be formed at a position spaced apart from the rear of the rear cover (310) (or the second surface (310B) of FIG. 3A) (or the surface in the +z axis direction) by a specified height or more. In one embodiment, the second hole (420) of the camera cover (320) may be aligned to face a direction (e.g., vertical direction) (e.g., +x axis direction) different from the direction of the image acquired by the first camera (400) (e.g., +z axis direction). For example, the second camera cover portion (324) of the camera cover (320) may be spaced apart from the first camera cover portion (322) of the camera cover (320) through a gap. The gap may be the second hole (420) that acoustically connects the space outside the electronic device (300) and the space inside the electronic device (300). For example, the gap is electronic When looking at the rear of the device (300), it may be obscured by the second camera cover portion (324).

[0093] In one embodiment, the electronic device (300) may include a waterproof membrane (450) positioned (or placed) (or interposed) between the rear plate (350) and the coupling plate (330) and covering the hole (351) of the rear plate (350) and / or the hole (331) of the coupling plate (330). The waterproof membrane (450) may be configured to reduce and / or prevent foreign substances, such as moisture and / or dust, from entering the hole (351) and may be configured to allow sound signals (or sound waves) to pass through.

[0094] For example, the waterproof membrane (450) may be placed on the upper side (e.g., +z axis direction) of the rear plate (350). For example, the waterproof membrane (450) may be placed on the lower side (e.g., -z direction) of the bonding plate (330). For example, the waterproof membrane (450) may be attached to the bonding plate (330) through an adhesive material (440). A hole corresponding to the hole (331) of the bonding plate (330) may be formed in the adhesive material (332).

[0095] In one embodiment, the electronic device (300) may include a printed circuit board (360) positioned below the rear plate (350) (e.g., in the -z axis direction) and defining a hole (361). The printed circuit board (360) may include a first surface facing the acoustic member (480), the waterproof membrane (450), or the rear cover (310), the coupling plate (330), or the rear plate (350). The printed circuit board (360) may include a second surface facing the microphone (380) and opposite to the first surface. For example, the first surface of the printed circuit board (360) may face the +z axis direction, and the second surface of the printed circuit board (360) may face the -z axis direction.

[0096] According to one embodiment, the electronic device (300) may include acoustic members (470, 480) for sound insulation. The acoustic members (470, 480) may include a material configured to absorb and / or block sound, not limited to, for example, sponge and / or rubber. The acoustic members (470, 480) may be referred to as sealing or sealing members.

[0097] In one embodiment, the acoustic member (470) may define a hole that acoustically connects the hole (331) to the hole (351). In one embodiment, the acoustic member (480) may define a hole that acoustically connects the hole (351) to the hole (361).

[0098] For example, the acoustic member (470) may be positioned (or placed) (or interposed) between the rear cover (310) and the coupling plate (330). For example, the acoustic member (470) may be attached to the surface of the rear plate (350) facing the +z axis direction (or the surface of the coupling plate (330) facing the -z axis direction) (e.g., via an adhesive material).

[0099] For example, the acoustic member (480) may be positioned (or placed) (or interposed) between the rear cover (310) and the printed circuit board (360). For example, the acoustic member (480) may be attached to the side of the rear plate (350) facing the -z axis direction (or the side of the printed circuit board (360) facing the +z axis direction) (e.g., via an adhesive material).

[0100] In one embodiment, the waterproof membrane (450) may overlap a portion of the acoustic member (470). For example, when viewed in a direction perpendicular to the printed circuit board (360) (e.g., the -z axis direction), the waterproof membrane (450) may overlap a portion of the acoustic member (470). For example, the waterproof membrane (450) may be aligned with the center of the hole of the acoustic member (470). The diameter of the waterproof membrane (450) may be larger than the diameter of the hole of the acoustic member (480).

[0101] An electronic device (300) according to one embodiment may include a microphone (380) disposed on a surface facing downward (-z axis direction) of a printed circuit board (360). For example, the microphone (380) may be mounted on a surface facing downward (-z axis direction) of the printed circuit board (360) so as to be aligned with a hole (361) of the printed circuit board (360). The microphone (380) may be configured to receive a sound signal (or sound wave) from outside the electronic device (300). For example, the microphone (380) may be configured to receive a sound signal from outside that passes sequentially through holes (420, 311, 331, 351, 361).

[0102] In a comparative example, the camera cover (320) may be positioned below the rear cover (310) and attached to the rear cover (310) from below the rear cover (310). In this case, one or more cameras may receive light through a portion of the opening (315) of the rear cover (310), and a sound signal for the microphone (380) may be obtained from the outside through a portion of the opening (315) (e.g., a gap formed by the gap between the rear cover (310) and the camera cover (320). However, as the camera cover (320) is positioned below the rear cover (310) and attached to the rear cover (310) from below the rear cover (310), it may be difficult to mount electronic components in the portion of the printed circuit board (360) that overlaps with the portion to which the camera cover (320) and the rear cover (310) are attached. Additionally, as the camera cover (320) is attached to the rear cover (310) from below the rear cover (310), the thickness of the electronic device (300) can be increased.

[0103] Additionally, as the camera cover (320) is attached to the rear cover (310) from below, a portion of the opening (315) (e.g., a gap formed by the gap between the rear cover (310) and the camera cover (320)) may be visible from the outside. As a portion of the opening (315) is visible from the outside, the user may mistake the portion of the opening (315) visible from the outside for a defect, and the aesthetic appeal may be reduced. Furthermore, a portion of the opening (315), which is used as a hole for obtaining a sound signal for the microphone (380) from the outside, may be blocked by an accessory (e.g., a mobile phone case) attached to the rear cover (310).

[0104] As described above, the electronic device (300) may have a structure in which the thickness of the electronic device (300) is reduced by placing the camera cover (320) on the rear cover (310). Additionally, by placing the camera cover (320) on the rear cover (310), it may be possible to mount electronic components in the overlapping portion where the camera cover (320) and the rear cover (310) are attached. For example, referring to FIG. 5, by placing the camera cover (320) on the rear cover (310), the height (510) between the printed circuit board (360) and the rear cover (310) (or the coupling plate (330)) may be relatively increased. Accordingly, electronic components may be mounted in the overlapping portion (520) where the camera cover (320) and the rear cover (310) are attached.

[0105] Additionally, as described above, the electronic device (300) may be positioned on the rear cover (310) such that the camera cover (320) covers the opening (315) and the first hole (311), so that the first hole (311) may not be visible from the outside. Also, for example, referring to FIG. 6, even if a user looks at the part (610) where the second hole (420) of the camera cover (320) is positioned, it may be difficult to see the second hole (420) from the outside as the second hole (420) of the camera cover (320) is obscured by the second camera cover part (324). Additionally, since the second hole (420) is formed at a position spaced apart from the rear cover (310) by a specified height, even if an accessory (e.g., a mobile phone case) is attached to the rear cover (310), the interference of the sound signal passing through the second hole (420) by the accessory (e.g., a mobile phone case) can be reduced.

[0106] The technical problems addressed in this disclosure are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art to which this disclosure pertains.

[0107] According to an exemplary embodiment as described above, the electronic device (300) may include a housing. The housing may include a rear cover (310) defining an opening (315) and a first hole (311). The electronic device (300) may include a camera (400). The camera (400) may be positioned within the housing such that the lens (410) of the camera (400) is positioned within the opening when viewed from the rear side of the housing. The electronic device (300) may include a camera cover (320) positioned on the rear cover (310) to cover the opening and the first hole (311), defining a second hole (420) acoustically coupled with the first hole (311). The camera cover (320) may include a light-transmitting portion (325-1) aligned with the lens (410) of the camera (400). The electronic device (300) may include a microphone (380) configured to receive sound waves from outside the electronic device (300) passing through the second hole (420) of the camera cover (320) and then through the first hole (311) of the rear cover (310).

[0108] The camera cover (320) may include a portion (322) molded to contact the rear side of the rear cover (310). The molded portion (322) may be fastened to the rear cover (310) through a fastening member (341, 345) inserted through the front side of the rear cover (310).

[0109] The camera cover (320) may include a first camera cover portion (322) disposed on the rear cover (310), and a second camera cover portion (324) disposed on the first camera cover portion (322). The hardness of the rear cover (310) may be higher than the hardness of the first camera cover portion (322).

[0110] The hardness of the rear cover (310) may be lower than the hardness of the second camera cover portion (324).

[0111] The first camera cover portion (322) may include a plastic material. The second camera cover portion (324) may include a metal material.

[0112] The second hole (420) can be defined by the spaced gap between the first camera cover portion (322) and the second camera cover portion (324).

[0113] The above second camera cover portion (324) may further include an adhesive material for bonding the first camera cover portion (322).

[0114] The electronic device (300) may include a printed circuit board (360) positioned below the rear cover (310) and defining a third hole aligned to transmit the sound signal (370) passing through the first hole (311) toward the microphone (380). The microphone (380) may be positioned below the printed circuit board (360).

[0115] The electronic device (300) may include an acoustic member (480) for soundproofing that is interposed between the rear cover (310) and the printed circuit board (360) and defines a fourth hole that connects the first hole (311) of the rear cover (310) to the third hole of the printed circuit board (360).

[0116] The electronic device (300) may include a coupling plate (330) that is positioned between the rear cover (310) and the printed circuit board (360) and defines a fifth hole (331) that connects the first hole (311) of the rear cover (310) to the third hole of the printed circuit board (360), and a coupling member (341, 345) that is connected to the camera cover (320) by penetrating the coupling plate (330) and the rear cover (310) below the coupling plate (330).

[0117] The electronic device (300) may include an adhesive material (or waterproof tape (430), and / or waterproof tape) that is interposed between the rear cover (310) and the coupling plate (330) and attaches the coupling plate (330) to the rear cover (310).

[0118] The above-mentioned fifth hole (331) can be radially misaligned with respect to the above-mentioned first hole (311) and aligned with respect to the above-mentioned third hole.

[0119] The above connecting members (341, 345) may be screws.

[0120] The electronic device (300) may include a rear plate (350) positioned between the rear cover (310) and the printed circuit board (360) and defining a sixth hole connecting the first hole (311) of the rear cover (310) to the third hole of the printed circuit board (360), and a waterproof film (450) positioned on the rear plate (350) and covering the sixth hole of the rear plate (350).

[0121] The electronic device (300) may include a coupling plate (330) disposed between the rear plate (350) and the printed circuit board (360). The waterproof membrane (450) may be located between the rear plate (350) and the coupling plate (330).

[0122] The above-mentioned sixth hole can be aligned with respect to the above-mentioned third hole.

[0123] The electronic device (300) may further include at least one electronic component disposed on the printed circuit board (360) between the portion of the rear cover (310) where the camera cover (320) is disposed and the printed circuit board (360).

[0124] The direction of the second hole (420) may be perpendicular to the direction of the light-transmitting portion (325-1).

[0125] The electronic device (300) may further include an adhesive material for attaching the camera cover (320) to the rear cover (310).

[0126] The above housing may include a first housing part comprising the rear cover (310) and the camera cover (320), and a second housing part rotatably coupled to the first housing part. The microphone (380) may be disposed within the first housing part.

[0127] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs.

[0128] The electronic device according to the various embodiments disclosed in this document may be a device of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, a consumer electronics device, or the like. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0129] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., first) component is referred to as "coupled" or "connected" to another (e.g., second) component, with or without the terms "functionally" or "communicationly," said component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0130] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software firmware, or a combination thereof, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0131] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0132] Although the disclosure has been illustrated and described with reference to various exemplary embodiments, it should be understood that the various exemplary embodiments are intended to be illustrative and not limiting. Those skilled in the art will understand that various modifications, alternatives, and / or variations of the various exemplary embodiments may be made without departing from the true technical spirit and the entire technical scope of the disclosure, including the appended claims and their equivalents. Furthermore, it will be understood that any embodiment(s) described herein may be used in conjunction with any other embodiment(s) described herein.

Claims

1. In an electronic device (300), Housing, the housing includes a rear cover (310) defining an opening (315) and a first hole (311); A camera (400), wherein the camera (400) is positioned within the housing such that the lens (410) of the camera (400) is positioned within the opening when viewed from the rear side of the housing; Defines a second hole (420) acoustically coupled with the first hole (311), and a camera cover (320) disposed on the rear cover (310) to cover the opening (315) and the first hole (311), wherein the camera cover (320) includes a light-transmitting portion (325-1) aligned with the lens (410) of the camera (400); and A microphone (380) configured to receive sound waves (370) from outside the electronic device (300) that pass through the second hole (420) of the camera cover (320) and then pass through the first hole (311) of the rear cover (310). Electronic device (300).

2. In Claim 1, The camera cover (320) includes a portion (322) molded to contact the rear side of the rear cover (310), and The above-mentioned molded portion (322) is fastened to the rear cover (310) through a fastening member (341, 345) including a fastener inserted through the front side of the rear cover (310). Electronic device (300).

3. In Claim 1, The above camera cover (320) is, A first camera cover portion (322) disposed on the rear cover (310), and It includes a second camera cover portion (324) disposed on the first camera cover portion (322), and The hardness of the rear cover (310) is greater than the hardness of the first camera cover portion (322). Electronic device (300).

4. In Claim 3, The hardness of the rear cover (310) is smaller than the hardness of the second camera cover portion (324). Electronic device (300).

5. In Claim 3, The first camera cover portion (322) above comprises a plastic material, and The second camera cover portion (324) above is made of a metal material, Electronic device (300).

6. In Claim 3, The second hole (420) is defined by the gap between the first camera cover portion (322) and the second camera cover portion (324). Electronic device (300).

7. In Claim 3, A further comprising an adhesive material configured to adhere the second camera cover portion (324) to the first camera cover portion (322). Electronic device (300).

8. In Claim 1, It includes a printed circuit board (360) positioned below the rear cover (310), configured to transmit the sound wave (370) passing through the first hole (311) toward the microphone (380), and defining an aligned third hole (361). The microphone (380) is positioned below the printed circuit board (360). Electronic device (300).

9. In Claim 8, Acoustic member (480) comprising a sound-blocking and / or sound-absorbing material configured for soundproofing, which is interposed between the rear cover (310) and the printed circuit board (360) and defines a fourth hole connecting the first hole (311) of the rear cover (310) to the third hole of the printed circuit board (360). Electronic device (300).

10. In Claim 8, A coupling plate (330) disposed between the rear cover (310) and the printed circuit board (360) and defining a fifth hole (331) that connects the first hole (311) of the rear cover (310) to the third hole of the printed circuit board (360), and A coupling member (341, 345) comprising a fastener configured to be fastened to the camera cover (320) by penetrating the coupling plate (330) and the rear cover (310) below the coupling plate (330). Electronic device (300).

11. In Claim 10, A waterproof tape (430) interposed between the rear cover (310) and the coupling plate (330) and configured to attach the coupling plate (330) to the rear cover (310), Electronic device (300).

12. In Claim 10, The above fifth hole (331) is, With respect to the first hole (311) above, it is radially misaligned, and Regarding the above third hole, aligned, Electronic device (300).

13. In Claim 10, The above connecting members (341, 345) include screws, Electronic device (300).

14. In Claim 8, A rear plate (350) positioned between the rear cover (310) and the printed circuit board (360), defining a sixth hole (351) that connects the first hole (311) of the rear cover (310) to the third hole (361) of the printed circuit board (360), and A waterproof membrane (450) disposed on the rear plate (350) and covering the sixth hole (351) of the rear plate (350), Electronic device (300).

15. In Claim 14, It includes a coupling plate (330) disposed between the rear plate (350) and the printed circuit board (360), and The above waterproof membrane (450) is located between the rear plate (350) and the coupling plate (330). Electronic device (300).