Foldable electronic device comprising flexible display and protective member attached thereto

Abstract

A foldable electronic device is provided. The foldable electronic device may comprise a housing including a first housing part and a second housing part rotatably coupled thereto. The foldable electronic device may comprise a flexible display including a front side visible from the front side of the foldable electronic device. The flexible display may comprise a portion which bends when the first housing part and the second housing part are folded. The housing may comprise a front frame portion which at least partially covers a portion of the periphery of the front side of the flexible display. The foldable electronic device may comprise a protective member. The protective member may comprise a coating layer attached to a central portion of the front side of the flexible display surrounded by the peripheral portion thereof.

Description

A foldable electronic device comprising a flexible display and a protective member attached to the flexible display

[0001] The following descriptions relate to a foldable electronic device comprising a flexible display and a protective member attached to the flexible display.

[0002] A foldable electronic device may include a first housing part and a second housing part rotatably coupled to the first housing part. The second housing part may be rotated relative to the first housing part through a hinge mechanism of the foldable electronic device. The foldable electronic device may be in a folded state in which the first housing part and the second housing part are folded. The foldable electronic device may be in an unfolded state in which the first housing part and the second housing part are unfolded.

[0003] The foldable electronic device may include a flexible display. The flexible display may include a portion that bends when the foldable electronic device is in the folded state.

[0004] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0005] A foldable electronic device is provided. The foldable electronic device may include a housing comprising a first housing part and a second housing part rotatably coupled to the first housing part. The foldable electronic device may include a flexible display comprising a front side visible from the front side of the foldable electronic device. The flexible display may include a portion that bends when the first housing part and the second housing part are folded. The housing may include a front frame portion that at least partially covers a peripheral portion of the front side of the flexible display. The foldable electronic device may include a protective member. The protective member may include a coating layer attached to a central portion of the front side of the flexible display surrounded by the peripheral portion of the front side of the flexible display. The protective member may include a protective film disposed on the coating layer. The flexible display may include a protective layer. The flexible display may include a window disposed below the protective layer. The flexible display may include a first adhesive layer that attaches the protective layer to the window. The flexible display may include a display panel disposed below the window. The flexible display may include a light-blocking layer disposed below the display panel and configured to block light emitted from the display panel from being transmitted toward the rear side of the flexible display. The flexible display may include a second adhesive layer that attaches the display panel to the light-blocking layer. At a temperature of less than 10 degrees Celsius, the storage modulus of the first adhesive layer may be smaller than the storage modulus of the second adhesive layer.

[0006] Figure 1 illustrates a foldable electronic device.

[0007] Figure 2 is a cross-sectional view of A-A' in Figure 1.

[0008] FIG. 3 illustrates a flexible display of a foldable electronic device and a protective member attached to the flexible display.

[0009] Figure 4 is a chart showing the storage modulus of the first adhesive layer and the storage modulus of the third adhesive layer.

[0010] Figure 5 is a chart showing the storage modulus of the third adhesive layer.

[0011] Figure 6 illustrates the layers within the third adhesive layer.

[0012] FIG. 7 is a block diagram of an electronic device in a network environment according to various embodiments.

[0013] FIG. 8 is a block diagram of a display module according to various embodiments.

[0014] Figure 1 illustrates a foldable electronic device.

[0015] Referring to FIG. 1, a foldable electronic device (100) may include a housing (105). The housing (105) may be foldable. The housing (105) may include a first housing part (110) and a second housing part (120) rotatably coupled to the first housing part (110). For example, the second housing part (120) may be rotated relative to the first housing part (110) through a hinge mechanism (or hinge structure) included within the housing (105) of the foldable electronic device (100). For example, the second housing part (120) may be rotated relative to the first housing part (110) with respect to a folding axis (199). The state of the foldable electronic device (100) may vary. For example, the foldable electronic device (100) may be in an unfolded state (191) of the foldable electronic device (100) in which the first housing part (110) and the second housing part (120) are unfolded. For example, the foldable electronic device (100) may be in a folded state (192) of the foldable electronic device (100) in which the first housing part (110) and the second housing part (120) are folded.

[0016] The foldable electronic device (100) may include a flexible display (130).

[0017] The flexible display (130) may include a first part (131) and a second part (132) that are substantially unbent when the foldable electronic device (100) is in a folded state (192). The first part (131) of the flexible display (130) may be spaced apart from the second part (132) of the flexible display (130). The shape of the first part (131) and the second part (132) of the flexible display (130) when the foldable electronic device (100) is in a folded state (192) may be the same as the shape of the first part (131) and the second part (132) of the flexible display (130) when the foldable electronic device (100) is in an unfolded state (191). For example, the first part (131) and the second part (132) of the flexible display (130) may be substantially flat or planar, independently of the state of the foldable electronic device (100).

[0018] The flexible display (130) may include a third part (133) that bends when the foldable electronic device (100) is in a folded state (192). The third part (133) of the foldable display (130) may be located between the first part (131) and the second part (132) of the foldable display (130). The flexible display (130) may include at least a part of the display module (760) of FIG. 7, or correspond to at least a part of the display module (760) of FIG. 7.

[0019] The housing (105) of the foldable electronic device (100) may include a side wall (190) surrounding the lateral side of the flexible display (130). The side wall (190) may define at least a portion of the lateral side of the foldable electronic device (100). The side wall (190) may include a first side wall (111) contained within a first housing part (110) and a second side wall (121) contained within a second housing part (120).

[0020] The housing (105) may include a front frame portion (114) for protecting the flexible display (130). The front frame portion (114) can protect the flexible display (130) by covering a portion of the flexible display (130). The front frame portion (114) may be described as a front frame member, a front frame structure, a front protection portion, a front protection member, or a front protection structure.

[0021] A flexible display (130) may include a front side (or front surface) visible from the front side of a foldable electronic device (100). A front frame portion (114) may at least partially cover a periphery portion (141) of the front side of the flexible display (130). For example, the periphery portion (141) of the front side of the flexible display (130) may surround a central portion (142) of the front side of the flexible display (130). In an example without limitation, the central portion (142) of the front side of the flexible display (130) may include a displayable area configured to display an image. In an example without limitation, the periphery portion (141) of the front side of the flexible display (130) may include a non-displayable area that is unavailable for displaying an image. As a non-limiting example, the central part (142) of the front side of the flexible display (130) may include a portion of the displayable area and the non-displayable area.

[0022] As a non-limiting example, the front frame portion (114) may be discontinuous within the third portion (133) of the flexible display (130). For example, the first housing part (110) may include a first front frame portion (114-1). For example, the second housing part (120) may include a second front frame portion (114-2) spaced apart from the first front frame portion (114-1).

[0023] The front frame portion (114) may be supported by the side wall (190). As a non-limiting example, the front frame portion (114) and the side wall (190) may be integral. For example, when the front frame portion (114) and the side wall (190) are integral, the portion of the side wall (190) corresponding to the front frame portion (114) may cover the peripheral portion (141) of the front side of the flexible display (130) and may not cover the central portion (142) of the front side of the flexible display (130).

[0024] The front frame portion (114) supported by the side wall (190) is described with reference to FIG. 2.

[0025] Figure 2 is a cross-sectional view of A-A' in Figure 1.

[0026] Referring to FIG. 2, the first front frame portion (114-1) may be supported by the first side wall (111). The first front frame portion (114-1) may include a first section (201) supported by the first side wall (111), and a second section (202) extending from the first section (201) of the first front frame portion (114-1). As a non-limiting example, the second section (202) of the first front frame portion (114-1) may not be supported by the first side wall (111).

[0027] The first front frame portion (114-1) can cover the peripheral portion (141) of the front side of the flexible display (130) placed within the first housing part (110). For example, the central portion (142) of the front side of the flexible display (130) may not be covered by the first front frame portion (114-1). As described with reference to FIG. 1, the first front frame portion (114-1) and the first side wall (111) may be integral, as is not a limiting example.

[0028] A foldable electronic device (100) may include a protective member (200) for protecting a flexible display (130). The protective member (200) may be attached to the flexible display (130). For example, the protective member (200) may be attached to a central portion (142) of the front side of the flexible display (130). As a non-limiting example, the protective member (200) may be included within the foldable electronic device (100) after the front frame portion (114) and the flexible display (130) are included within the foldable electronic device (100). For example, the protective member (200) may not be attached to a peripheral portion (141) of the front side of the flexible display (130). However, various embodiments are not limited thereto. For example, the protective member (200) may be partially attached to the peripheral portion (141) of the front side of the flexible display (130).

[0029] The descriptions related to FIG. 2 and below, which are based on the premise that a protective member (200) is applied to a foldable electronic device (100) including a front frame portion (114), are merely exemplary. A foldable electronic device including a protective member (e.g., corresponding to the protective member (200)) may not include a front frame portion (e.g., corresponding to the front frame portion (114)). For example, the protective member may be attached to a flexible display of a foldable electronic device that does not include the front frame portion. By example, without limitation, the width of the protective member may be narrower than the width of a protective layer of the flexible display (e.g., corresponding to the protective layer (311) of FIG. 3 described below). By example, without limitation, the width of the protective member may be substantially the same as the width of the protective layer.

[0030] The protective member (200) may be described as a display protective sheet, a display protective cover, or a display protective plate. The protective member (200) may be a hardware component of the foldable electronic device (100), distinguished from a protective film which is an accessory device (or accessory) attached for the protection of the foldable electronic device (100).

[0031] The flexible display (130) and the protective member (200) coupled to the flexible display (130) are described in more detail with reference to FIG. 3.

[0032] FIG. 3 illustrates a flexible display of a foldable electronic device and a protective member attached to the flexible display.

[0033] Referring to FIG. 3, the protective member (200) can be attached to the central part (142) of the front side of the flexible display (130).

[0034] The protective member (200) may include a coating layer (301). The coating layer (301) may be (substantially) transparent. The coating layer (301) may be bendable or deformable. The coating layer (301) may be attached to a central portion (142) of the flexible display (130). The coating layer (301) may be placed on the central portion (142) of the flexible display (130) among the peripheral portion (141) and the central portion (142) of the flexible display (130). The coating layer (301) may include acrylic. The coating layer (301) may include an acrylic-based material. The coating layer (301) may be formed from a shear thickening fluid (STF), which is a dense colloidal suspension of nanoparticles in a carrier fluid whose viscosity increases rapidly as the shear rate increases. The storage modulus of the coating layer (301) may be between 100 kilopascals (kPa) and 1 gigapascal (GPa) at room temperature. For example, the storage modulus of the coating layer (301) may be greater than 100 kilopascals and less than 1 gigapascal at temperatures between 21 degrees Celsius and 23 degrees Celsius. For example, the storage modulus of the coating layer (301) may be greater than 100 kilopascals and less than 1 gigapascal at about 25 degrees Celsius. As a non-limiting example, the thickness of the coating layer (301) may be about 25 micrometers (um, micrometers). As a non-limiting example, the thickness of the coating layer (301) may be less than 25 micrometers.

[0035] The protective member (200) may include a protective film (302). The protective film (302) may be (substantially) transparent. The protective film (302) may be bendable or deformable. The protective film (302) may be placed on a coating layer (301). The protective film (302) may be in (direct) contact with the coating layer (301). The protective film (302) may include PET (polyethylene terephthalate). As a non-limiting example, the thickness of the protective film (302) may be about 55 micrometers. As a non-limiting example, the thickness of the protective film (302) may be less than 55 micrometers. The protective member (200) can be more robust against external impacts (e.g., depression of a pen (e.g., stylus) or pressure of a ball) by including a coating layer (301) placed under or beneath the protective film (302).

[0036] The protective member (200) may include an adhesive layer (303). The adhesive layer (303) may attach the coating layer (301) to the central portion (142) of the front side of the flexible display (130). For example, the adhesive layer (303) may be placed under or beneath the coating layer (301). The adhesive layer (303) may be (substantially) transparent. The adhesive layer (303) may be bendable or deformable. The adhesive layer (303) may include a pressure-sensitive adhesive (PSA). As a non-limiting example, the thickness of the adhesive layer (303) may be about 25 micrometers. As a non-limiting example, the thickness of the adhesive layer (303) may be less than 25 micrometers.

[0037] The flexible display (130) may include a protective layer (311). The protective layer (311) may be (substantially) transparent. The protective layer (311) may be bendable or deformable. A portion of the protective layer (311) located within the central portion (142) of the front side of the flexible display (130) may be attached to a coating layer (301) via an adhesive layer (303). The protective layer (311) may be included within the flexible display (130) before the protective member (200) is included within the foldable electronic device (100). For example, the protective member (200) may be attached to the protective layer (311) after the flexible display (130) and the front frame portion (114) are assembled to the housing (105). The protective layer (311) may include PET. As a non-limiting example, the thickness of the protective layer (311) may be about 54 micrometers. As a non-limiting example, the thickness of the protective layer (311) may be less than 54 micrometers.

[0038] A flexible display (130) may include a window (312) disposed below a protective layer (311). The window (312) may be (substantially) transparent. The window (312) may be bendable or deformable. The window (312) may include ultra-thin glass (UTG). In a non-limiting example, the thickness of the window (312) may be about 45 micrometers. In a non-limiting example, the thickness of the window (312) may be less than 45 micrometers.

[0039] The flexible display (130) may include a first adhesive layer (321) that attaches a protective layer (311) to a window (312). The first adhesive layer (321) may be positioned between the protective layer (311) and the window (312). The first adhesive layer (321) may be in contact with the rear surface of the protective layer (311) and the front surface of the window (312), respectively. The first adhesive layer (321) may be (substantially) transparent. The first adhesive layer (321) may be bendable or deformable. The first adhesive layer (321) may include a PSA. The storage modulus of the first adhesive layer (321) may be less than 50 kilopascals at minus 20 degrees Celsius. For example, the first adhesive layer (321) that attaches the protective layer (311) to the window (312) may be configured to have a storage modulus less than 50 kilopascals at minus 20 degrees Celsius in order to further reduce the thickness of the flexible display (130). The storage modulus of the first adhesive layer (321) is described in more detail with reference to FIG. 4.

[0040] Figure 4 is a chart showing the storage modulus of the first adhesive layer and the storage modulus of the third adhesive layer.

[0041] Referring to FIG. 4, the horizontal axis of the chart (400) represents frequency (unit: Hz (hertz)), and the vertical axis of the chart (400) represents storage modulus (unit: megapascal (MPa)).

[0042] Line (401) or line (402) in the chart (400) represents the storage modulus of the first adhesive layer (321) according to frequency on a logarithmic scale. Line (403) in the chart (400) represents the storage modulus of another adhesive layer according to frequency on a logarithmic scale. The other adhesive layer may be described as an adhesive layer that is not included in the flexible display (130) but is usable for attaching the protective layer (311) to the window (312).

[0043] As indicated by a comparison between line (401) or line (402) and line (403), within a frequency range (411), the storage modulus of the first adhesive layer (321) may be smaller than the storage modulus of the other adhesive layer. Since the storage modulus of the first adhesive layer (321) is smaller than the storage modulus of the other adhesive layer within a frequency range (411), under conditions where the thickness of the first adhesive layer (321) and the thickness of the other adhesive layer are the same, the amount of energy of an impact corresponding to one (a) frequency within a frequency range (411) absorbed by the first adhesive layer (321) may be greater than the amount of energy of an impact corresponding to said frequency absorbed by the other adhesive layer. For example, under conditions where the amount of energy of the impact transferred to the layer below the first adhesive layer (321) (e.g., the display panel (313) of FIG. 3) and the amount of energy of the impact transferred to the layer below the other adhesive layer (e.g., the layer corresponding to the layer below the first adhesive layer (321)) are the same, the first adhesive layer (321) may be thinner than the other adhesive layer. As an example without limitation, under conditions where the amount of energy of the impact transferred to the layer below the first adhesive layer (321) (e.g., the display panel (313) of FIG. 3) and the amount of energy of the impact transferred to the layer below the other adhesive layer (e.g., the layer corresponding to the layer below the first adhesive layer (321)) are the same, the thickness of the first adhesive layer (321) may be about 25 micrometers and the thickness of the other adhesive layer may be about 35 micrometers. For example, the flexible display (130) may have a thickness that is smaller than the thickness of the flexible display including the other adhesive layer by including the first adhesive layer (321) instead of the other adhesive layer.For example, the foldable electronic device (100) can be slimmer by including the first adhesive layer (321) within the flexible display (130).

[0044] Referring again to 3, according to the time-temperature superposition (TTS) theory, the storage modulus at a lower frequency can correspond to the storage modulus at a higher temperature, and the storage modulus at a higher frequency can correspond to the storage modulus at a lower temperature. For example, the storage modulus of the first adhesive layer (321) may be less than 50 kilopascals at minus 20 degrees Celsius, which is the temperature corresponding to one frequency within the frequency range (411) of FIG. 4 according to the time-temperature superposition (TTS) theory. As a non-limiting example, since the storage modulus of the first adhesive layer (321) is less than 50 kilopascals at minus 20 degrees Celsius, the thickness of the first adhesive layer (321) may be about 25 micrometers. As a non-limiting example, the thickness of the first adhesive layer (321) may be less than 25 micrometers.

[0045] A flexible display (130) may include a display panel (313) placed below a window (312). The display panel (313) may include a light-emitting layer configured to emit light, a circuit layer placed below the light-emitting layer and configured to control light-emitting diodes (e.g., OLEDs (organic LEDs)) within the light-emitting layer to emit light, a substrate layer placed below the circuit layer, an encapsulation layer placed above the light-emitting layer to cover the light-emitting layer, a color filter layer placed above the encapsulation layer and including color filter portions aligned with the LEDs, and a coating layer placed above the color filter layer. The display panel (313) may include a touch-sensitive layer configured to identify touch inputs on the flexible display (130). The touch-sensitive layer may be placed between the color filter layer and the encapsulation layer, but is not limited thereto. For example, the touch-sensitive layer may be placed on the coating layer of the display panel (313). The display panel (313) may be bendable or deformable. As a non-limiting example, the thickness of the display panel (313) may be 30 micrometers. As a non-limiting example, the thickness of the display panel (313) may be less than 30 micrometers. As a non-limiting example, the thickness of the display panel (313) may be greater than 30 micrometers.

[0046] A flexible display (130) may include a light-blocking layer (314) disposed below a display panel (313). The light-blocking layer (314) may be configured to block light emitted from the display panel (313) from being transmitted toward the rear side of the flexible display (130). The light-blocking layer (314) may be bendable or deformable. As an example, without limitation, the light-blocking layer (314) may include a polymer. As an example, without limitation, the light-blocking layer (314) may be a coating layer. As an example, without limitation, the light-blocking layer (314) may include a black coated film (e.g., including PET). As an example, without limitation, the thickness of the light-blocking layer (314) may be 50 micrometers. As an example, without limitation, the thickness of the light-blocking layer (314) may be less than 50 micrometers.

[0047] The flexible display (130) may include a second adhesive layer (322) that attaches a display panel (313) to a light-blocking layer (314). The second adhesive layer (322) may be disposed between the display panel (313) and the light-blocking layer (314). The second adhesive layer (314) may be in contact with the rear surface of the display panel (313) and the front surface of the light-blocking layer (314), respectively. The second adhesive layer (322) may be bendable or deformable. The second adhesive layer (322) may include a PSA. The storage modulus of the second adhesive layer (322) may be greater than the storage modulus of the first adhesive layer (321) at a temperature of less than minus 10 degrees Celsius. For example, at minus 20 degrees Celsius, the storage modulus of the first adhesive layer (321) may be smaller than the storage modulus of the second adhesive layer (322). The thickness of the second adhesive layer (322) may be 25 micrometers. As a non-limiting example, the thickness of the second adhesive layer (322) may be less than 25 micrometers.

[0048] The flexible display (130) may include a third adhesive layer (323) that attaches the window (312) to the display panel (313). The third adhesive layer (323) may be positioned between the window (312) and the display panel (313). The third adhesive layer (323) may be in contact with the rear surface of the window (312) and the front surface of the display panel (313), respectively. The third adhesive layer (323) may be (substantially) transparent. The third adhesive layer (323) may be bendable or deformable. The third adhesive layer (323) may include a PSA. The storage modulus of the third adhesive layer (323) may be less than 50 kilopascals at minus 20 degrees Celsius. For example, the storage modulus of the third adhesive layer (323) may be configured to have a storage modulus smaller than 50 kilopascals at minus 20 degrees Celsius in order to further reduce the thickness of the flexible display (130). For example, at a temperature of minus 10 degrees Celsius or less, the storage modulus of the third adhesive layer (323) may be smaller than the storage modulus of the second adhesive layer (322). The storage modulus of the third adhesive layer (323) is described in more detail with reference to FIG. 4.

[0049] Referring to FIG. 4, the line (401) or line (402) in the chart (400) represents the storage modulus of the third adhesive layer (323) according to frequency on a logarithmic scale. The line (404) in the chart (400) represents the storage modulus of another adhesive layer according to frequency on a logarithmic scale. The other adhesive layer may be described as an adhesive layer available for attaching the window (312) to the display panel (313).

[0050] As indicated by a comparison between line (401) or line (402) and line (404), within a frequency range (411), the storage modulus of the third adhesive layer (323) may be smaller than the storage modulus of the other adhesive layer. Since the storage modulus of the third adhesive layer (323) is smaller than the storage modulus of the other adhesive layer within a frequency range (411), under conditions where the thickness of the third adhesive layer (323) and the thickness of the other adhesive layer are the same, the amount of impact energy corresponding to one (a) frequency within the frequency range (411) absorbed by the third adhesive layer (323) may be greater than the amount of impact energy corresponding to said frequency absorbed by the other adhesive layer. For example, under conditions where the amount of energy of the impact transferred to the layer below the third adhesive layer (323) (e.g., the display panel (313) of FIG. 3) and the amount of energy of the impact transferred to the layer below the other adhesive layer (e.g., the layer corresponding to the layer below the third adhesive layer (323)) are the same, the third adhesive layer (323) may be thinner than the other adhesive layer. As an example without limitation, under conditions where the amount of energy of the impact transferred to the layer below the third adhesive layer (323) (e.g., the display panel (313) of FIG. 3) and the amount of energy of the impact transferred to the layer below the other adhesive layer (e.g., the layer corresponding to the layer below the third adhesive layer (323)) are the same, the thickness of the third adhesive layer (323) may be about 50 micrometers and the thickness of the other adhesive layer may be about 75 micrometers. For example, the flexible display (130) may have a thickness that is smaller than the thickness of the flexible display including the other adhesive layer by including a third adhesive layer (323) instead of the other adhesive layer.For example, the foldable electronic device (100) can be slimmer by including a third adhesive layer (323) within the flexible display (130).

[0051] Referring again to FIG. 3, the storage modulus of the third adhesive layer (323) may be less than 50 kilopascals at minus 20 degrees Celsius, which is the temperature corresponding to one frequency within the frequency range (411) of FIG. 4 according to TTS theory. As a non-limiting example, since the storage modulus of the third adhesive layer (323) is less than 50 kilopascals at minus 20 degrees Celsius, the thickness of the third adhesive layer (323) may be about 50 micrometers. As a non-limiting example, the thickness of the third adhesive layer (323) may be less than 50 micrometers. For example, the third adhesive layer (323) may be thicker than the first adhesive layer (321). For example, the third adhesive layer (323) may be thicker than the second adhesive layer (322). As a non-limiting example, the material contained in the third adhesive layer (323) and the material contained in the first adhesive layer (321) may be the same.

[0052] As a non-limiting example, the storage modulus of the third adhesive layer (323) may be greater than 24 kilopascals (or 30 kilopascals) at 60 degrees Celsius. For example, an external impact may cause the coating layer and / or the encapsulation layer contained within the display panel (313) to break. To reduce the probability of such breakage, the storage modulus of the third adhesive layer (323) may be less than 50 kilopascals at minus 20 degrees Celsius and greater than 24 kilopascals (or 30 kilopascals) at 60 degrees Celsius. The storage modulus of the third adhesive layer (323) is described in more detail with reference to FIG. 5.

[0053] Figure 5 is a chart showing the storage modulus of the third adhesive layer.

[0054] Referring to FIG. 5, the horizontal axis of the chart (500) represents frequency (unit: Hz (hertz)), and the vertical axis of the chart (500) represents storage modulus (unit: kilopascal (kPa)).

[0055] The line (501) in the chart (500) represents the storage modulus of the third adhesive layer (323) according to frequency on a logarithmic scale. As indicated by the line (501), at the frequency (fb) corresponding to minus 20 degrees Celsius, the storage modulus of the third adhesive layer (323) may be less than 50 kilopascals. As indicated by the line (501), at the frequency (fa) corresponding to 60 degrees Celsius, the storage modulus of the third adhesive layer (323) may be greater than 30 kilopascals (or 24 kilopascals).

[0056] Referring again to FIG. 3, as the storage modulus of the third adhesive layer (323) at a relatively high temperature (e.g., 60 degrees Celsius) increases, the first probability that a layer included in the display panel (313) (e.g., the circuit layer in the display panel (313)) will break decreases, but as the storage modulus of the third adhesive layer (323) at a relatively high temperature (e.g., 60 degrees Celsius) increases, the second probability that a defect will occur due to shrinkage of the flexible display (130) (e.g., display panel (313)) may increase. For example, to reduce the second probability, the storage modulus of the third adhesive layer (323) may be greater than 30 kilopascals (or 24 kilopascals) and less than 35 kilopascals at 60 degrees Celsius.

[0057] As a non-limiting example, the third adhesive layer (323) may be composed of a plurality of layers. For example, the third adhesive layer (323) may include a first layer and a second layer disposed below the first layer. The second layer of the third adhesive layer (323) may be attached to the first layer of the third adhesive layer (323). The second layer of the third adhesive layer (323) may be in contact with the rear surface of the first layer of the third adhesive layer (323). The first layer and the second layer of the third adhesive layer (323) are described in more detail with reference to FIG. 6.

[0058] Figure 6 illustrates the layers within the third adhesive layer.

[0059] Referring to FIG. 6, the third adhesive layer (323) may include a first layer (601) and a second layer (602) placed below the first layer (601).

[0060] The storage modulus of the first layer (601) may be less than 50 kilopascals at minus 20 degrees Celsius. The storage modulus of the second layer (602) may be greater than 30 kilopascals at 60 degrees Celsius. The storage modulus of the second layer (602) may be less than 35 kilopascals at 60 degrees Celsius. However, it is not limited thereto. For example, the storage modulus of the first layer (601) may be greater than 30 kilopascals at 60 degrees Celsius. The storage modulus of the first layer (601) may be less than 35 kilopascals at 60 degrees Celsius. For example, the storage modulus of the second layer (602) may be less than 50 kilopascals at minus 20 degrees Celsius.

[0061] The thickness of the first layer (601) may be substantially the same as the thickness of the second layer (602). However, it is not limited thereto. For example, the first layer (601) may be thicker than the second layer (602). For example, the second layer (602) may be thicker than the first layer (601).

[0062] Referring again to FIG. 3, the flexible display (130) may include a barrier layer (315) disposed below a light-blocking layer (314). The barrier layer (315) may be disposed on a support plate (316) to cover a plurality of slits (340) defined by a support plate (316) described below. The barrier layer (315) may be disposed on the support plate (316) to reduce the probability that foreign matter located within one or more of the plurality of slits (340) will be visible from the outside of the flexible display (130). The barrier layer (315) may be disposed on the support plate (316) to reduce the probability that the surface characteristics of the support plate (316) that are uneven due to the plurality of slits (340) will be visible from the outside of the flexible display (130). A barrier layer (315) may be placed over a support plate (316) to prevent or reduce impact from the outside to the support plate (316) being transmitted to the display panel (313). The barrier layer (315) may include PI (polyimide) and / or PET. The barrier layer (315) may be bendable or deformable.

[0063] As a non-limiting example, the thickness of the barrier layer (315) may be about 25 micrometers. As a non-limiting example, the thickness of the barrier layer (315) may be less than 25 micrometers.

[0064] The flexible display (130) may include a fourth adhesive layer (324) that attaches a light-blocking layer (314) to a barrier layer (315). The fourth adhesive layer (324) may be disposed between the light-blocking layer (314) and the barrier layer (315). The fourth adhesive layer (324) may be in contact with the rear surface of the light-blocking layer (314) and the front surface of the barrier layer (315), respectively. The fourth adhesive layer (324) may be bendable or deformable. The fourth adhesive layer (324) may include a PSA. As a non-limiting example, the thickness of the fourth adhesive layer (324) may be about 15 micrometers. As a non-limiting example, the thickness of the fourth adhesive layer (324) may be less than 15 micrometers.

[0065] The flexible display (130) may include a support plate (316) disposed below a barrier layer (315). The support plate (316) may define a plurality of slits (340) within a portion corresponding to a third portion (133) of the flexible display (130). The portion of the support plate (316) defining the plurality of slits (340) may be bendable. As an example without limitation, the support plate (316) may additionally define recesses in the plurality of slits (340). As an example without limitation, the support plate (316) may define recesses replacing the plurality of slits (340). The plurality of slits (340) (and / or said recesses) may extend in the direction of a folding axis (e.g., the axis (199) of FIG. 1). As a non-limiting example, the plurality of slits (340) may be arranged in a grid pattern. As a non-limiting example, the thickness of the support plate (316) may be 115 micrometers. As a non-limiting example, the thickness of the support plate (316) may be less than 115 micrometers.

[0066] The flexible display (130) may include a fifth adhesive layer (325) that attaches the barrier layer (315) to the support plate (316). The fifth adhesive layer (325) may be disposed between the barrier layer (315) and the support plate (316). The fifth adhesive layer (325) may be in contact with at least a portion of the rear surface of the barrier layer (315) and at least a portion of the front surface of the support plate (316), respectively. As an example without limitation, the fifth adhesive layer (325) may be discontinuous within a portion (350) of the flexible display (130). A first portion of the fifth adhesive layer (325) may be spaced apart from a second portion of the fifth adhesive layer (325) by a gap defined by the fifth adhesive layer (325) within the portion (350) of the display (130). As a non-limiting example, the thickness of the fifth adhesive layer (325) may be about 16 micrometers. As a non-limiting example, the thickness of the fifth adhesive layer (325) may be less than 16 micrometers.

[0067] As described above, the foldable electronic device (100) may be slimmer than other electronic devices that include other flexible displays that do not include the first adhesive layer (321) and / or the third adhesive layer (323) by including a flexible display (130) that includes the first adhesive layer (321) and / or the third adhesive layer (323). Although the foldable electronic device (100) is slimmer than other electronic devices, the flexible display (130) of the foldable electronic device (100) that includes the first adhesive layer (321) and / or the third adhesive layer (323) may be robust. Because the foldable electronic device (100) includes a protective member (200) that includes a coating layer (301) and a protective film (302), the flexible display (130) of the foldable electronic device (100) may be robust.

[0068] The above descriptions may be applied to the electronic device (701) illustrated in FIGS. 7 and 8.

[0069] FIG. 7 is a block diagram of an electronic device (701) in a network environment (700) according to various embodiments. Referring to FIG. 7, in the network environment (700), the electronic device (701) may communicate with an electronic device (702) through a first network (798) (e.g., a short-range wireless communication network) or with at least one of an electronic device (704) or a server (708) through a second network (799) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (701) may communicate with the electronic device (704) through a server (708). According to one embodiment, the electronic device (701) may include a processor (720), memory (730), input module (750), sound output module (755), display module (760), audio module (770), sensor module (776), interface (777), connection terminal (778), haptic module (779), camera module (780), power management module (788), battery (789), communication module (790), subscriber identification module (796), or antenna module (797). In some embodiments, at least one of these components (e.g., connection terminal (778)) may be omitted from the electronic device (701), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (776), camera module (780), or antenna module (797)) may be integrated into a single component (e.g., display module (760)).

[0070] The processor (720) can control at least one other component (e.g., a hardware or software component) of the electronic device (701) connected to the processor (720) by executing software (e.g., a program (740)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (720) can store commands or data received from other components (e.g., a sensor module (776) or a communication module (790)) in volatile memory (732), process the commands or data stored in volatile memory (732), and store the resulting data in non-volatile memory (734). According to one embodiment, the processor (720) may include a main processor (721) (e.g., a central processing unit or an application processor) or an auxiliary processor (723) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (701) includes a main processor (721) and an auxiliary processor (723), the auxiliary processor (723) may be configured to use less power than the main processor (721) or to be specialized for a designated function. The auxiliary processor (723) may be implemented separately from the main processor (721) or as part thereof.

[0071] The auxiliary processor (723) may control at least some of the functions or states associated with at least one component of the electronic device (701) (e.g., display module (760), sensor module (776), or communication module (790)) on behalf of the main processor (721) while the main processor (721) is in an inactive (e.g., sleep) state, or together with the main processor (721) while the main processor (721) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (723) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (780) or communication module (790)). According to one embodiment, the auxiliary processor (723) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (701) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (708)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0072] The memory (730) can store various data used by at least one component of the electronic device (701) (e.g., processor (720) or sensor module (776)). The data may include, for example, software (e.g., program (740)) and input or output data for related commands. The memory (730) may include volatile memory (732) or non-volatile memory (734).

[0073] The program (740) may be stored as software in memory (730) and may include, for example, an operating system (742), middleware (744), or an application (746).

[0074] The input module (750) can receive commands or data to be used for a component of the electronic device (701) (e.g., processor (720)) from outside the electronic device (701) (e.g., user). The input module (750) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0075] The sound output module (755) can output a sound signal to the outside of the electronic device (701). The sound output module (755) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0076] The display module (760) can visually provide information to an external (e.g., user) of the electronic device (701). The display module (760) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (760) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0077] The audio module (770) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (770) can acquire sound through the input module (750) or output sound through the sound output module (755) or an external electronic device (e.g., electronic device (702)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (701).

[0078] The sensor module (776) can detect the operating state of the electronic device (701) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (776) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0079] The interface (777) may support one or more specified protocols that can be used for the electronic device (701) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (702)). According to one embodiment, the interface (777) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0080] The connection terminal (778) may include a connector through which the electronic device (701) can be physically connected to an external electronic device (e.g., electronic device (702)). According to one embodiment, the connection terminal (778) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0081] The haptic module (779) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (779) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0082] The camera module (780) can capture still images and video. According to one embodiment, the camera module (780) may include one or more lenses, image sensors, image signal processors, or flashes.

[0083] The power management module (788) can manage the power supplied to the electronic device (701). According to one embodiment, the power management module (788) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0084] The battery (789) can supply power to at least one component of the electronic device (701). According to one embodiment, the battery (789) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0085] The communication module (790) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (701) and an external electronic device (e.g., electronic device (702), electronic device (704), or server (708)), and the performance of communication through the established communication channel. The communication module (790) may include one or more communication processors that operate independently of the processor (720) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (790) may include a wireless communication module (792) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (794) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (704) through a first network (798) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (799) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (792) can identify or authenticate the electronic device (701) within a communication network such as the first network (798) or the second network (799) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (796).

[0086] The wireless communication module (792) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (792) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (792) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (792) can support various requirements specified in the electronic device (701), external electronic device (e.g., electronic device (704)), or network system (e.g., second network (799)). According to one embodiment, the wireless communication module (792) can support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0087] An antenna module (797) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (797) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (797) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (798) or a second network (799), may be selected from the plurality of antennas, for example, by a communication module (790). A signal or power may be transmitted or received between the communication module (790) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (797).

[0088] According to various embodiments, the antenna module (797) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0089] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0090] According to one embodiment, commands or data may be transmitted or received between the electronic device (701) and an external electronic device (704) through a server (708) connected to a second network (799). Each of the external electronic devices (702, or 704) may be the same or a different type of device as the electronic device (701). According to one embodiment, all or part of the operations performed on the electronic device (701) may be performed on one or more of the external electronic devices (702, 704, or 708). For example, if the electronic device (701) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (701) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (701). The electronic device (701) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (701) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (704) may include an Internet of Things (IoT) device. The server (708) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (704) or the server (708) may be included within the second network (799).The electronic device (701) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0091] FIG. 8 is a block diagram (800) of a display module (760) according to various embodiments. Referring to FIG. 8, the display module (760) may include a display (810) and a display driver IC (DDI) (830) for controlling the display. The DDI (830) may include an interface module (831), a memory (833) (e.g., a buffer memory), an image processing module (835), or a mapping module (837). The DDI (830) may receive image information, for example, image data or an image control signal corresponding to a command for controlling the image data, from another component of the electronic device (701) through the interface module (831). For example, according to one embodiment, image information may be received from a processor (720) (e.g., main processor (721) (e.g., application processor)) or an auxiliary processor (723) (e.g., graphics processing unit) that operates independently of the functions of the main processor (721). The DDI (830) may communicate with the touch circuit (850) or sensor module (776), etc., through the interface module (831). Additionally, the DDI (830) may store at least a portion of the received image information in memory (833), for example, in frame units. The image processing module (835) may perform preprocessing or postprocessing (e.g., resolution, brightness, or size adjustment) on at least a portion of the image data, for example, based at least on the characteristics of the image data or the characteristics of the display (810). The mapping module (837) may generate voltage values ​​or current values ​​corresponding to the image data preprocessed or postprocessed through the image processing module (835). According to one embodiment, voltage values ​​or current The generation of values ​​can be performed, for example, based on at least some of the properties of the pixels of the display (810) (e.g., array of pixels (RGB stripe or pentile structure), or size of each subpixel).At least some pixels of the display (810) are driven, for example, based on at least some of the voltage value or current value, so that visual information (e.g., text, image, or icon) corresponding to the image data can be displayed through the display (810).

[0092] According to one embodiment, the display module (760) may further include a touch circuit (850). The touch circuit (850) may include a touch sensor (851) and a touch sensor IC (853) for controlling the same. The touch sensor IC (853) may control the touch sensor (851) to detect a touch input or hovering input for a specific location on the display (810), for example. For example, the touch sensor IC (853) may detect a touch input or hovering input by measuring a change in a signal (e.g., voltage, light intensity, resistance, or charge) for a specific location on the display (810). The touch sensor IC (853) may provide information regarding the detected touch input or hovering input (e.g., location, area, pressure, or time) to the processor (720). According to one embodiment, at least a part of the touch circuit (850) (e.g., touch sensor IC (853)) may be included as part of the display driver IC (830) or the display (810), or as part of another component (e.g., auxiliary processor (723)) placed outside the display module (760).

[0093] According to one embodiment, the display module (760) may further include at least one sensor of the sensor module (776) (e.g., fingerprint sensor, iris sensor, pressure sensor, or light sensor) or a control circuit for the same. In this case, the at least one sensor or the control circuit for the same may be embedded in a part of the display module (760) (e.g., display (810) or DDI (830)) or a part of the touch circuit (850). For example, if the sensor module (776) embedded in the display module (760) includes a biometric sensor (e.g., fingerprint sensor), the biometric sensor may obtain biometric information (e.g., fingerprint image) associated with a touch input through a part of the display (810). As another example, if the sensor module (776) embedded in the display module (760) includes a pressure sensor, the pressure sensor may obtain pressure information associated with a touch input through a part or the entire area of ​​the display (810). According to one embodiment, a touch sensor (851) or a sensor module (776) may be placed between pixels of a pixel layer of a display (810), or on top of or below the pixel layer.

[0094] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure pertains.

[0095] As described above, a foldable electronic device (e.g., foldable electronic device (100)) may include a housing (e.g., housing (105)) comprising a first housing part (e.g., first housing part (110)) and a second housing part (e.g., second housing part (120)) rotatably coupled to the first housing part, and a flexible display (e.g., flexible display (130)) comprising a front side visible from the front side of the foldable electronic device. The flexible display may include a portion (e.g., third portion (133)) that bends when the first housing part and the second housing part are folded. The housing may include a front frame portion (e.g., front frame portion (114)) that at least partially covers a peripheral portion of the front side of the flexible display. The foldable electronic device may include a protective member (e.g., protective member (200)). The protective member may include a coating layer (e.g., coating layer (301)) attached to a central portion of the front side of the flexible display surrounded by the peripheral portion of the front side of the flexible display, and a protective film (e.g., protective film (302)) disposed on the coating layer.The flexible display may include a protective layer (e.g., protective layer (311)), a window (e.g., window (312)) disposed below the protective layer, a first adhesive layer (e.g., first adhesive layer (321)) for attaching the protective layer to the window, a display panel (e.g., display panel (313)) disposed below the window, a light blocking layer (e.g., light blocking layer (314)) disposed below the display panel and configured to block light emitted from the display panel from being transmitted toward the rear side of the flexible display, and a second adhesive layer (e.g., second adhesive layer (322)) for attaching the display panel to the light blocking layer. At a temperature of less than 10 degrees Celsius, the storage modulus of the first adhesive layer may be smaller than the storage modulus of the second adhesive layer.

[0096] The flexible display may include a third adhesive layer (e.g., a third adhesive layer (323)) for attaching the window to the display panel. At a temperature of less than 10 degrees Celsius, the storage modulus of the third adhesive layer may be smaller than the storage modulus of the second adhesive layer.

[0097] The third adhesive layer may be thicker than the first adhesive layer.

[0098] The third adhesive layer may be thicker than the second adhesive layer.

[0099] The thickness of the first adhesive layer may be substantially the same as the thickness of the second adhesive layer.

[0100] The second adhesive layer may be thicker than the first adhesive layer.

[0101] The thickness of the first adhesive layer may be less than about 25 micrometers.

[0102] The thickness of the third adhesive layer may be less than about 50 micrometers.

[0103] At minus 20 degrees Celsius, the storage modulus of the first adhesive layer may be less than 50 kilopascals.

[0104] The storage modulus of the third adhesive layer may be less than 50 kilopascals at minus 20 degrees Celsius and greater than 24 kilopascals at plus 60 degrees Celsius.

[0105] At 60 degrees Celsius, the storage modulus of the third adhesive layer may be less than 35 kilopascals.

[0106] The third adhesive layer may include a first layer (e.g., first layer (601)), and a second layer (e.g., second layer (602)) disposed below the first layer. At minus 20 degrees Celsius, the storage modulus of the first layer of the third adhesive layer may be less than 50 kilopascals. At 60 degrees Celsius, the storage modulus of the second layer of the third adhesive layer may be greater than 30 kilopascals and less than 35 kilopascals.

[0107] The thickness of the first layer of the third adhesive layer may be substantially the same as the thickness of the second layer of the third adhesive layer.

[0108] The first layer of the third adhesive layer may be thicker than the second layer of the third adhesive.

[0109] The second layer of the third adhesive layer may be thicker than the first layer of the third adhesive.

[0110] The above protective member may include an adhesive layer (e.g., adhesive layer (303)) that attaches the coating layer to a part of the protective layer located within the central part of the front side of the flexible display.

[0111] At temperatures between 21 degrees Celsius and 23 degrees Celsius, the storage modulus of the coating layer may be greater than 100 kilopascals and less than 1 gigapascal.

[0112] The thickness of the above protective film may be about 55 micrometers.

[0113] The thickness of the coating layer above may be about 25 micrometers.

[0114] The thickness of the adhesive layer of the protective member may be about 25 micrometers.

[0115] The housing may include a side wall (e.g., a side wall (190)) surrounding the side of the flexible display. The front frame portion of the housing may be supported by the side wall of the housing.

[0116] The above front frame portion may be discontinuous within the portion of the flexible display that bends when the first housing part and the second housing part are folded.

[0117] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs.

[0118] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0119] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0120] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0121] Various embodiments of the present document may be implemented as software (e.g., program (740)) comprising one or more instructions stored in a storage medium (e.g., internal memory (736) or external memory (738)) readable by a machine (e.g., electronic device (701)). For example, a processor (e.g., processor (720)) of the machine (e.g., electronic device (701)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0122] According to one embodiment, the method according to the various embodiments disclosed herein may be provided as included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0123] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In a foldable electronic device, A housing comprising a first housing part and a second housing part rotatably coupled to the first housing part; A flexible display including a front side visible from the front side of the foldable electronic device, and The flexible display above includes a portion that bends when the first housing part and the second housing part are folded, and The above housing is, It includes a front frame portion that at least partially covers the peripheral portion of the front side of the flexible display, and The above-mentioned foldable electronic device is, Includes a protective member, The above protective member is, A coating layer attached to the central portion of the front side of the flexible display, surrounded by the peripheral portion of the front side of the flexible display; and It includes a protective film disposed on the above coating layer, and The above flexible display is, protective layer; A window placed below the above protection layer; A first adhesive layer for attaching the above protective layer to the window; A display panel positioned below the above window; A light blocking layer disposed below the display panel and configured to block light emitted from the display panel from being transmitted toward the rear side of the flexible display; and It includes a second adhesive layer for attaching the display panel to the light-blocking layer, The storage modulus of the first adhesive layer is, Smaller than the storage modulus of the second adhesive layer, Foldable electronic device.

2. In claim 1, the flexible display is, It includes a third adhesive layer for attaching the above window to the above display panel, and At temperatures below -10 degrees Celsius: The storage modulus of the first adhesive layer is, Smaller than the storage modulus of the second adhesive layer, and The storage modulus of the third adhesive layer is, Smaller than the storage modulus of the second adhesive layer, Foldable electronic device.

3. In claim 2, the thickness of the first adhesive layer is, substantially the same thickness as the second adhesive layer above, Foldable electronic device.

4. In claim 2, the second adhesive layer is, Thicker than the first adhesive layer above, Foldable electronic device.

5. In claim 4, the thickness of the first adhesive layer is, Smaller than about 25 micrometers, Foldable electronic device.

6. In claim 5, the thickness of the third adhesive layer is, Smaller than about 50 micrometers, Foldable electronic device.

7. In claim 2, at minus 20 degrees Celsius, the storage modulus of the first adhesive layer is, Less than 50 kilopascals, Foldable electronic device.

8. In claim 2, the storage modulus of the third adhesive layer is, At minus 20 degrees Celsius, less than 50 kilopascals, and At 60 degrees Celsius, greater than 24 kilopascals, Foldable electronic device.

9. In claim 8, at 60 degrees Celsius, the storage modulus of the third adhesive layer is, Less than 35 kilopascals, Foldable electronic device.

10. In claim 2, the third adhesive layer is, 1st layer, and It includes a second layer disposed below the first layer, and At minus 20 degrees Celsius, the storage modulus of the first layer of the third adhesive layer is, Less than 50 kilopascals, and At 60 degrees Celsius, the storage modulus of the second layer of the third adhesive layer is, Greater than 30 kilopascals and less than 35 kilopascals, Foldable electronic device.

11. In claim 10, the thickness of the first layer of the third adhesive layer is, The thickness of the third adhesive layer is substantially the same as that of the second layer. Foldable electronic device.

12. In claim 10, the first layer of the third adhesive layer is, Thicker than the second layer of the third adhesive, Foldable electronic device.

13. In claim 10, the second layer of the third adhesive layer is, Thicker than the first layer of the third adhesive, Foldable electronic device.

14. In claim 1, the protective member is, A flexible display comprising an adhesive layer for attaching the coating layer to a portion of the protective layer located within the central portion of the front side of the flexible display. Foldable electronic device.

15. In claim 14, at a temperature between 21 degrees Celsius and 23 degrees Celsius, the storage modulus of the coating layer is, Greater than 100 kilopascals and less than 1 gigapascal, Foldable electronic device.

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