Electronic device comprising structure for preventing overflow of heat transfer material of stacked substrate

Abstract

An electronic device according to various embodiments of the present disclosure may comprise: a housing; a laminate substrate disposed in the housing; at least one electronic component disposed in the housing; and a flexible circuit board electrically connecting the laminate substrate and the at least one electronic component. The laminate substrate may include: an interposer disposed between the first substrate and the second substrate to electrically connect the first substrate and the second substrate; and a heat transfer material injected into a space formed by the first substrate, the second substrate, and the interposer through a first through hole formed in the first substrate. The flexible circuit board may comprise: a first rigid part disposed at one end of the flexible circuit board and having a first connector connected to a connection part disposed on a first substrate; a second rigid part spaced apart from the first rigid part and including a first recess formed on one surface facing the first substrate; and a first flexible part connecting the first rigid part and the second rigid part, wherein when the substrate surface of the first substrate is viewed in the vertical direction, at least a portion of the first through hole may overlap the first recess of the second rigid part.

Description

Electronic device including an overflow prevention structure for a heat transfer material of a stacked substrate

[0001] The various embodiments disclosed in this document relate to an electronic device including an overflow prevention structure for a heat transfer material of a stacked substrate.

[0002] Stacked substrates are a widely used structure driven by the demand for miniaturization and high integration in mobile terminals, allowing for the efficient utilization of internal space by stacking multiple substrates. However, this stacked substrate structure creates enclosed internal spaces, which leads to a problem of degraded heat dissipation performance. To address this, heat dissipation technology is being applied that injects heat transfer materials into the enclosed spaces of the stacked substrate to effectively transfer heat from heat-generating components to the outside.

[0003] Meanwhile, when injecting heat transfer materials, there is a tendency to inject as much as possible to maximize heat dissipation performance; however, this can cause the heat transfer material to overflow outside the substrate, leading to various problems such as electrical signal short circuits, substrate deformation, and degradation of display quality.

[0004] In addition, depending on the rigidity of the flexible circuit board and the arrangement structure of the connector, problems may arise where the connector detaches from the board due to external impact or battery movement. Accordingly, various structural improvements are required to simultaneously solve the two problems of preventing heat transfer material overflow and preventing connector slippage.

[0005] An electronic device according to various embodiments of the present disclosure provides an electronic device capable of preventing overflow of a heat transfer material injected into a sealed space of a stacked substrate, while simultaneously improving the problem of connector insertion caused by the rigid part of a flexible circuit board and the arrangement structure of the connector.

[0006] An electronic device according to various embodiments of the present disclosure may include a housing, a stacked substrate disposed in the housing, at least one electronic component disposed in the housing, and a flexible circuit board electrically connecting the stacked substrate and at least one electronic component. The stacked substrate may include an interposer disposed between the first substrate and the second substrate and electrically connecting the first substrate and the second substrate, and a heat transfer material injected into a space formed by the first substrate, the second substrate and the interposer through a first through-hole formed in the first substrate. A flexible circuit board may include a first rigid portion disposed at one end of the flexible circuit board and having a first connector disposed therein connected to a connection portion disposed on a first board, a second rigid portion spaced apart from the first rigid portion and including a first recess formed on one surface facing the first board, and a first flexible portion connecting the first rigid portion and the second rigid portion, and when the substrate surface of the first board is viewed in a vertical direction, at least a portion of the first through hole may overlap with the first recess of the second rigid portion.

[0007] According to one embodiment, a first cover member may be further included to be disposed on the substrate surface of a first substrate and to close a first through hole. Additionally, a first elastic member may be further included to be disposed between the first cover member and a second rigid member, and to include a first opening corresponding to a first recess. In this case, the first elastic member may press the first cover member.

[0008] Additionally, the thickness of the first flexible part may be thinner than the thickness of the first rigid part and the thickness of the second rigid part. The thickness of the second rigid part may be thicker than the thickness of the first rigid part.

[0009] According to one embodiment, the flexible circuit board may include a third rigid portion located opposite to the second rigid portion with respect to the first rigid portion, and a second flexible portion connecting the first rigid portion and the third rigid portion. When the substrate surface of the first substrate is viewed from a vertical direction, at least a portion of the second through-hole formed in the first substrate may overlap with the third rigid portion. Additionally, the third rigid portion of the flexible circuit board may include a second recess that overlaps with the second through-hole. It may further include a second cover member disposed on the substrate surface of the first substrate to close the second through-hole. Additionally, it may further include a second elastic member disposed between the second cover member and the third rigid portion, which includes a second opening corresponding to the second recess. The second rigid portion and the third rigid portion may be positioned diagonally with respect to the long side direction of the first rigid portion.

[0010] Additionally, the housing may further include a battery disposed between a laminated substrate and at least one electronic component, and the flexible circuit board may include a fourth rigid portion having a second connector connected to at least one electronic component, and a connection portion connecting the first rigid portion and the fourth rigid portion, which overlaps with the battery when the substrate surface of the first substrate is viewed in a vertical direction.

[0011] Additionally, it may include a first housing, a second housing, and a hinge assembly that rotatably connects the first housing and the second housing with respect to a folding axis, and the long side of the first connector of the stacked substrate may be parallel to the folding axis.

[0012] In addition, the first cover member may have an incision formed therein into which a dispenser for injecting a heat transfer material is inserted.

[0013] According to another embodiment, the flexible circuit board may include a first rigid portion disposed at one end of the flexible circuit board and having a connector disposed therein for connecting to a connection portion disposed on the first board, a second rigid portion spaced apart from the first rigid portion, and a first flexible portion connecting the first rigid portion and the second rigid portion, and when the substrate surface of the first board is viewed in a vertical direction, at least a portion of the first through hole may overlap with the second rigid portion. In this case, it may include a first housing, a second housing, and a hinge assembly rotatably connecting the first housing and the second housing with respect to a folding axis, and the long side of the second rigid portion of the laminated board may be parallel to the folding axis. Additionally, the thickness of the first flexible portion may be thinner than the thickness of the first rigid portion and the thickness of the second rigid portion, and the thickness of the second rigid portion may be thicker than the thickness of the first rigid portion. It may further include a first cover member disposed on the substrate surface of the first substrate to close the first through hole, and the first cover member may have an incision formed therein into which a dispenser for injecting a heat transfer material is inserted.

[0014] An electronic device according to various embodiments of the present disclosure can effectively suppress the overflow of a heat transfer material by forming a first recess in a second rigid portion of a flexible circuit board to prevent the heat transfer material injected into a sealed space of a stacked substrate from overflowing to the outside, and by arranging the first recess to overlap with a first through-hole of the stacked substrate.

[0015] In addition, by connecting the first rigid part and the second rigid part of the flexible circuit board to the first flexible part, the connector can be prevented from being inserted despite the tilt phenomenon of the stiffener that may occur due to the pressure of the heat transfer material.

[0016] The effects obtainable from an electronic device according to various embodiments of the present disclosure are not limited to the effects mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from the description in this specification.

[0017] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0018] FIG. 1a is a front perspective view of an electronic device in an unfolding state according to various embodiments of the present disclosure.

[0019] FIG. 1b is a drawing showing the front of an electronic device in an unfolded state according to various embodiments of the present disclosure.

[0020] FIG. 1c is a drawing showing the rear view of an electronic device in an unfolded state according to various embodiments of the present disclosure.

[0021] FIG. 2a is a rear perspective view of an electronic device in a folding state according to various embodiments of the present disclosure.

[0022] FIG. 2b is a perspective view of an electronic device illustrating an intermediate state according to various embodiments of the present disclosure.

[0023] FIG. 3 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0024] FIG. 4 is a drawing showing a top view of a first substrate of an electronic device according to various embodiments of the present disclosure.

[0025] FIGS. 5 to 8 are cross-sectional views taken along the line C1-C2 of the electronic device of FIG. 4 according to various embodiments of the present disclosure.

[0026]

[0027] FIG. 9 is a drawing for showing the movement of the second rigid member when an overflow occurs as a liquid heat transfer material passes through the first cover member in the cross-sectional view of FIG. 8.

[0028] FIG. 10 is a diagram illustrating the appearance when a liquid heat transfer material passes through the first cover member in the cross-sectional view of FIG. 8 and overflow occurs.

[0029] FIG. 11 is a drawing showing a top view of the first rigid part, the second rigid part, and the first flexible part.

[0030] FIG. 12 is a drawing illustrating the case where the width of the first flexible part of FIG. 11 is adjusted.

[0031] FIG. 13a is a drawing illustrating the case where the number of layers of the first flexible part is increased.

[0032] FIG. 13b is a drawing illustrating a case where the number of layers of the first flexible part is reduced.

[0033] FIG. 14 is a drawing showing the first rigid part, the second rigid part, and the third rigid part viewed from above.

[0034] Figure 15 is a drawing showing the upper surface of a flexible circuit board.

[0035] Figure 16 is a drawing showing the bottom surface of a flexible circuit board.

[0036] In the following description, various embodiments of the present disclosure are described with reference to the accompanying drawings. The various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features described in the present disclosure to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments.

[0037] In relation to the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of the noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise.

[0038] In this document, each of the phrases such as “A or B,” “at least one of A and B,” “or at least one of B,” “A, B or C,” “at least one of A, B and C,” and “B, or at least one of C” may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any (e.g., first) component is referred to as “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicationly,” it means that said component may be connected to said other component directly (e.g., wired), wirelessly, or through a third component.

[0039] Hereinafter, embodiments of the present disclosure are described in detail with reference to the drawings so that those skilled in the art can easily practice them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0040] FIG. 1a is a front perspective view of an electronic device in an unfolded state according to various embodiments of the present disclosure. FIG. 1b is a drawing showing the front of an electronic device in an unfolded state according to various embodiments of the present disclosure. FIG. 1c is a drawing showing the rear of an electronic device in an unfolded state according to various embodiments of the present disclosure.

[0041] FIG. 2a is a rear perspective view of an electronic device in a folding state according to various embodiments of the present disclosure. FIG. 2b is a perspective view of an electronic device in an intermediate state according to various embodiments of the present disclosure.

[0042] Referring to FIGS. 1a through 2b, the electronic device (100) may include first and second housings (110, 120) (e.g., housing, housing structure, foldable housing, or foldable housing structure) rotatably coupled to each other with respect to a hinge device (e.g., hinge device (140) of FIG. 1b). In one embodiment, the hinge device (e.g., hinge device (140) of FIG. 1b) may be positioned in the x-axis direction. In one embodiment, the electronic device (100) may include a first display (400) (e.g., flexible display, foldable display, or main display) positioned in an area (e.g., recess) formed by the first and second housings (110, 120). In one embodiment, the first housing (110) and the second housing (120) may be positioned on both sides with respect to the folding axis (F) and may have a shape that is substantially symmetric with respect to the folding axis (F). In one embodiment, the angle or distance between the first housing (110) and the second housing (120) may vary depending on the state of the electronic device (100). For example, the angle or distance between the first housing (110) and the second housing (120) may vary depending on whether the electronic device is in a fully unfolded state, a fully folded state, or an intermediate state.

[0043] According to various embodiments, the first housing (110) may include a first surface (111) facing a first direction (e.g., front direction) (e.g., z-axis direction) and a second surface (112) facing a second direction (e.g., rear direction) (e.g., -z-axis direction) opposite to the first surface (111). In one embodiment, the second housing (120) may include a third surface (121) facing a first direction (e.g., z-axis direction) and a fourth surface (122) facing a second direction (e.g., -z-axis direction) in the unfolded state of the electronic device (100). In one embodiment, in the unfolded state of the electronic device (100), the first surface (111) of the first housing (110) and the third surface (121) of the second housing (120) may face substantially the same first direction (e.g., z-axis direction). In one embodiment, in the folded state of the electronic device (100), the first surface (111) of the first housing (110) and the third surface (121) of the second housing (120) may face each other. In one embodiment, in the unfolded state of the electronic device (100), the second surface (112) of the first housing (110) and the fourth surface (122) of the second housing (120) may face substantially the same second direction (e.g., z-axis direction). In one embodiment, in the folded state of the electronic device (100), the second surface (112) of the first housing and the fourth surface (122) of the second housing (120) may face opposite directions. For example, in the folded state of the electronic device (100), the second surface (112) may face the first direction (e.g., z-axis direction), and the fourth surface (122) may face the second direction (e.g., z-axis direction). In this case, the first display (400) may not be visible from the outside (in folding method). In one embodiment, the electronic device (100) may be folded so that the second side (112) of the first housing (110) and the fourth side (122) of the second housing (120) face each other. In this case, the first display (400) may be positioned to be visible from the outside (out folding method).

[0044] According to various embodiments, the first housing (110) (e.g., the first housing structure) may include a first side member (113) that forms at least partially the exterior of the electronic device (100) and a first rear cover (114) that is coupled to the first side member (113) and forms at least a portion of the second side (112) of the electronic device (100). In one embodiment, the first side member (113) may include a first side (113a), a second side (113b) extending from one end of the first side (113a), and a third side (113c) extending from the other end of the first side (113a). In one embodiment, the first side member (113) may be formed into a rectangular shape (e.g., a square or a rectangle) through the first side (113a), the second side (113b), and the third side (113c).

[0045] According to various embodiments, the second housing (120) (e.g., the second housing structure) may include a second side member (123) that forms at least partially the exterior of the electronic device (100) and a second rear cover (124) that is coupled to the second side member (123) and forms at least a portion of the fourth side (122) of the electronic device (100). In one embodiment, the second side member (123) may include a fourth side (123a), a fifth side (123b) extending from one end of the fourth side (123a), and a sixth side (123c) extending from the other end of the fourth side (123a). In one embodiment, the second side member (123) may be formed into a rectangular shape through the fourth side (123a), the fifth side (123b), and the sixth side (123c).

[0046] According to various embodiments, the first and second housings (110, 120) are not limited to the illustrated forms and combinations and may be implemented by other shapes or combinations and / or combinations of parts. In one embodiment, the first side member (113) may be formed integrally with the first rear cover (114), and the second side member (123) may be formed integrally with the second rear cover (124).

[0047] According to various embodiments, in the unfolded state of the electronic device (100), the second side (113b) of the first side member (113) and the fifth side (123b) of the second side member (123) may be connected substantially without a gap. In one embodiment, in the unfolded state of the electronic device (100), the third side (113c) of the first side member (113) and the sixth side (123c) of the second side member (123) may be connected substantially without a gap. In one embodiment, in the unfolded state of the electronic device (100), the sum of the lengths of the second side (113b) and the fifth side (123b) may be configured to be longer than the length of the first side (113a) and / or the fourth side (123a). In one embodiment, in the unfolded state of the electronic device (100), the sum of the lengths of the third side (113c) and the sixth side (123c) may be configured to be longer than the length of the first side (113a) and / or the fourth side (123a).

[0048] Referring to FIGS. 2a and 2b, the first side member (113) and / or the second side member (123) may be formed of metal or may further comprise a polymer injected into the metal. In one embodiment, the first side member (113) and / or the second side member (123) may comprise at least one conductive portion (116 and / or 126) electrically segmented through at least one segmented portion (1161, 1162 and / or 1261, 1262) formed of a polymer. In this case, the at least one conductive portion (116 and / or 126) may be used as at least part of an antenna operating in at least one designated band (e.g., legacy band or NR (new radio) band) by being electrically connected to a wireless communication circuit included in the electronic device (100).

[0049] According to various embodiments, the first rear cover (114) and / or the second rear cover (124) may be formed by at least one or a combination of at least two of coated or colored glass, ceramic, polymer, or metal (e.g., aluminum, stainless steel (STS), or magnesium).

[0050] According to various embodiments, the first display (130) may be positioned to extend from the first surface (111) of the first housing (110) across a hinge device (e.g., hinge assembly (HA) of FIG. 1b) to at least a portion of the third surface (121) of the second housing (120). In one embodiment, the first display (130) may include a first area (130a) substantially corresponding to the first surface (111), a second area (130b) corresponding to the second surface (112), and a third area (130c) connecting the first area (130a) and the second area (130b) (e.g., a folding area or a bendable area). In one embodiment, the third region (130c) may be positioned as part of the first region (130a) and / or the second region (130b) at a location corresponding to the hinge device (e.g., the hinge assembly (HA) of FIG. 1b). In one embodiment, the electronic device (100) may include a hinge housing (141) (e.g., a hinge cover) that supports the hinge device (e.g., the hinge assembly (HA) of FIG. 1b). In one embodiment, the hinge housing (141) may be positioned so that at least a portion is visually exposed to the outside when the electronic device (100) is in a folded state, and is retracted into the internal space of the first housing (110) and the internal space of the second housing (120) so that it is not visually visible from the outside when the electronic device (100) is in an unfolded state.

[0051] According to various embodiments, the electronic device (100) may include a second display (131) (e.g., a sub-display) that is disposed separately from the first display (130). In one embodiment, the second display (131) may be disposed so as to be at least partially visually exposed on the second surface (112) of the first housing (110). In one embodiment, when the electronic device (100) is in a folded state, the second display (131) may display at least a portion of the status information of the electronic device (100) by at least partially replacing the display function of the first display (130). In one embodiment, the second display (131) may be disposed so as to be visible from the outside through at least a portion of the area of ​​the first rear cover (114). In one embodiment, the second display (131) may be disposed on the fourth surface (122) of the second housing (120). In this case, the second display (131) may be positioned so that it can be seen from the outside through at least a portion of the second rear cover (124).

[0052] According to various embodiments, the electronic device (100) may include at least one of an input device (103) (e.g., a microphone), an acoustic output device (101, 102), a sensor module (104), a camera device (105, 108), a key input device (106), or a connector port (107). In the illustrated embodiment, the input device (103) (e.g., a microphone), the acoustic output device (101, 102), the sensor module (104), the camera device (105, 108), the key input device (106), or the connector port (107) is illustrated as a hole or a circular element formed in the first housing (110) or the second housing (120), but this is an exemplary illustration for illustrative purposes and is not limited thereto. According to various embodiments, the input device (103) may include at least one microphone (103) disposed in the second housing (120). In one embodiment, the input device (103) may include a plurality of microphones (103) positioned to detect the direction of sound. In one embodiment, the plurality of microphones (103) may be positioned at appropriate locations in the first housing (110) and / or the second housing (120). In one embodiment, the sound output device (101, 102) may include at least one speaker (101, 102). In one embodiment, the at least one speaker (101, 102) may include a call receiver (101) positioned in the first housing (110) and a speaker (102) positioned in the second housing (120). In one embodiment, an input device (103), an audio output device (101, 102), and a connector port (107) are disposed in a space provided in the first housing (110) and / or the second housing (120) of the electronic device (100) and may be exposed to the external environment through at least one hole formed in the first housing (110) and / or the second housing (120). In one embodiment, at least one connector port (107) may be used to transmit and receive power and / or data to and from an external electronic device.In one embodiment, at least one connector port (e.g., ear jack hole) may accommodate a connector (e.g., ear jack) for transmitting and receiving audio signals with an external electronic device. In one embodiment, a hole formed in the first housing (110) and / or the second housing (120) may be used in common for an input device (103) and an audio output device (101, 102). In one embodiment, the audio output device (101, 102) may include a speaker (e.g., a piezo speaker) that is not exposed through the hole formed in the first housing (110) and / or the second housing (120).

[0053] According to various embodiments, the sensor module (104) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (100) or an external environmental state. In one embodiment, the sensor module (104) may detect the external environment through the first surface (111) of the first housing (110). In one embodiment, the electronic device (100) may further include at least one sensor module positioned to detect the external environment through the second surface (112) of the first housing (110). In one embodiment, the sensor module (104) (e.g., an illuminance sensor) may be positioned below the first display (130) to detect the external environment through the first display (130). In one embodiment, the sensor module (104) may include at least one of a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, an illuminance sensor, a proximity sensor, a biosensor, an ultrasonic sensor, or an illuminance sensor (104).

[0054] According to various embodiments, camera devices (105, 108) may include a first camera device (105) (e.g., a front camera device) disposed on a first surface (111) of a first housing (110) and a second camera device (108) disposed on a second surface (112) of the first housing (110). In one embodiment, the electronic device (100) may further include a flash (109) disposed near the second camera device (108). In one embodiment, the camera device (105, 108) may include at least one lens, an image sensor, and / or an image signal processor. In one embodiment, the camera device (105, 108) may be arranged such that two or more lenses (e.g., wide-angle lens, ultra-wide-angle lens, or telephoto lens) and two or more image sensors are located on one side of the electronic device (100) (e.g., first side (111), second side (112), third side (121), or fourth side (122)). In one embodiment, the camera device (105, 108) may include lenses and / or image sensors for time of flight (TOF).

[0055] According to various embodiments, a key input device (106) (e.g., a key button) may be placed on a third side (113c) of a first side member (113) of a first housing (110). In one embodiment, the key input device (106) may be placed on at least one of the other sides (113a, 113b) of the first housing (110) and / or the sides (123a, 123b, 123c) of the second housing (120). In one embodiment, the electronic device (100) may not include some or all of the key input devices (106), and the key input device (106) that is not included may be implemented in other forms, such as a soft key, on the first display (130). In one embodiment, the key input device (106) may be implemented using a pressure sensor included in the first display (130).

[0056] According to various embodiments, some of the camera devices (105, 108), such as a first camera device (105) or a sensor module (104), may be positioned to be visually exposed through a first display (130). In one embodiment, the first camera device (105) or the sensor module (104) may be optically exposed to the outside through an opening (e.g., a through hole) formed at least partially in the first display (130) within the internal space of the electronic device (100). In one embodiment, at least a portion of the sensor module (104) may be positioned so as not to be visually exposed through the first display (130) within the internal space of the electronic device (100). Referring to FIG. 2b, the electronic device (100) may operate to maintain at least one designated folding angle in an intermediate state through a hinge device (e.g., the hinge assembly (HA) of FIG. 1b). For example, the electronic device (100) can control the first display (130) so that different content is displayed in the display area corresponding to the first surface (111) and the display area corresponding to the third surface (121). In one embodiment, the electronic device (100) can operate in a substantially unfolded state (e.g., the unfolded state of FIG. 1a) and / or a substantially folded state (e.g., the folded state of FIG. 2a) based on a certain folding angle (e.g., the angle between the first housing (110) and the second housing (120) when the electronic device (100) is in an intermediate state) through a hinge device (e.g., the hinge assembly (HA) of FIG. 1b). In one embodiment, the electronic device (100) can be operated to transition to an unfolded state (e.g., the unfolded state of FIG. 1a) when a pressing force is applied in the unfolding direction (direction A) while it is unfolded at a certain folding angle through a hinge device (e.g., the hinge assembly (HA) of FIG. 1b).In one embodiment, the electronic device (100) can be operated to transition to a folded state (e.g., the folded state of FIG. 2a) when a pressing force is applied in the direction to be folded (direction B) while it is unfolded at a certain folding angle through a hinge device (e.g., the hinge assembly (HA) of FIG. 1b). In one embodiment, the electronic device (100) can be operated to maintain an unfolded state (not shown) at various folding angles through a hinge device (e.g., the hinge assembly (HA) of FIG. 1b) (free stop function).

[0057] FIG. 3 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0058] Referring to FIG. 3, the electronic device (100) may include a first side member (113) (e.g., a first side frame), a second side member (123) (e.g., a second side frame), and a hinge device (140) (e.g., a hinge module or a hinge structure) that rotatably connects the first side member (113) and the second side member (123) to each other. In one embodiment, the electronic device (100) may include a first support member (1131) (e.g., a first support plate or a first extension member) extending at least partially from the first side member (113), and a second support member (1231) (e.g., a second support plate or a second extension member) extending at least partially from the second side member (123). In one embodiment, the first support member (1131) may be formed integrally with the first side member (113) or structurally coupled with the first side member (113). In one embodiment, the second support member (1231) may be formed integrally with the second side member (123) or structurally coupled with the second side member (123). In one embodiment, the first display (400) may be positioned to receive support from the first support member (1131) and the second support member (1231). In one embodiment, the electronic device (100) may include a first rear cover (114) coupled to the first side member (113) and providing a first space between it and the first support member (1131), and a second rear cover (124) coupled to the second side member (123) and providing a second space between it and the second support member (1231). In one embodiment, the first side member (113) and the first rear cover (114) may be formed integrally. In one embodiment, the second side member (123) and the second rear cover (124) may be formed integrally. In one embodiment, the first housing (110) may include a first side member (113), a first support member (1131), and a first rear cover (114).In one embodiment, the second housing (120) may include a second side member (123), a second support member (1231), and a second rear cover (124). In one embodiment, the electronic device (100) may include a second display (131) positioned so as to be visible from the outside through at least a portion of the first rear cover (114).

[0059] According to various embodiments, the electronic device (100) may include a first substrate (161) (e.g., a first substrate assembly or a main printed circuit board) disposed in a first space between a first side member (113) and a first rear cover (114), a camera assembly (163), a first battery (171), or a first bracket (151). In one embodiment, the camera assembly (163) may include a plurality of camera devices (e.g., camera devices (105, 108) of FIG. 1a and FIG. 2a) and may be electrically connected to the first substrate (161). In one embodiment, the first bracket (151) may provide a support structure and enhanced rigidity for supporting the first substrate (161) and / or the camera assembly (163). In one embodiment, the electronic device (100) may include a second substrate (162) (e.g., a second substrate assembly or a sub-printed circuit board) disposed in a second space between a second side member (123) and a second rear cover (124), an antenna (190) (e.g., a coil member), a second battery (172), or a second bracket (152). In one embodiment, the electronic device (100) is arranged to extend from the first substrate (161) across the hinge device (140) to a plurality of electronic components (e.g., second substrate (162), second battery (172), or antenna (190)) disposed between the second side member (123) and the second rear cover (124), and may include a wiring member (180) (e.g., a flexible printed circuit board (FPCB)) that provides an electrical connection. In one embodiment, the antenna (190) may include a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna.

[0060] According to various embodiments, the electronic device (100) may include a first protective cover (115) (e.g., a first protective frame or a first decorative member) coupled along the edge of a first housing (110) and a second protective cover (125) (e.g., a second protective frame or a second decorative member) coupled along the edge of a second housing (120). In one embodiment, the first protective cover (115) and / or the second protective cover (125) may be formed of a metal or polymer material. In one embodiment, the first protective cover (115) and / or the second protective cover (125) may be used as a decoration member. In this case, the first display (400) may be positioned so that the edge of the first planar portion (400b) is not visible from the outside between the first housing (110) and the first protective cover (115). In one embodiment, the first display (400) may be positioned so that the edge of the second flat portion (400c) is not visible from the outside between the second housing (120) and the second protective cover (125).

[0061] According to various embodiments, the electronic device (100) may include a protective cap (135) positioned to protect the edge of a bending portion (e.g., the bending portion (400a) of FIG. 1b) of the first display (400). In this case, the edge of the first display (400) may be protected through the protective cap (135) positioned at a location corresponding to the bending portion (e.g., the bending portion (400a) of FIG. 1b). In one embodiment, the first protective cover (115) and / or the second protective cover (125) may be omitted. In one embodiment, the protective cap (135) may be omitted.

[0062] According to various embodiments, the first support member (1131) may include a first support surface (1131a) facing a first direction (e.g., z-axis direction) and a second support surface (1131b) facing a second direction opposite to the first direction (e.g., -z-axis direction). In one embodiment, the second support member (1231) may include a third support surface (1231a) facing a first direction and a fourth support surface (1231b) facing a second direction in an unfolded state of the electronic device (100). In one embodiment, the first display (400) may be positioned to be supported by the first support surface (1131a) of the first support member (1131) and the third support surface (1231a) of the second support member (1231).

[0063] FIG. 4 is a top view of a first substrate according to various embodiments of the present disclosure. FIGS. 5 to 8 are cross-sectional views of the electronic device of FIG. 4 according to various embodiments of the present disclosure, cut along the line C1-C2.

[0064] Hereinafter, with reference to FIGS. 4 to 8, the features and arrangement relationships of the components forming an electronic device according to various embodiments of the present invention will be described in detail.

[0065] In various embodiments of the present disclosure, an electronic device (200) may include a housing (210), a stacked substrate (220), at least one electronic component (230), and a flexible circuit board (240). The electronic device (200) may place the stacked substrate (220) inside the housing (210). The stacked substrate (220) may be electrically connected to at least one electronic component (230). The flexible circuit board (240) may transmit signals between the stacked substrate (220) and at least one electronic component (230). The housing (210) may protect the stacked substrate (220) and the flexible circuit board (240) from external shocks. The stacked substrate (220) may be formed in a multilayer structure so that the electronic component (230) may be mounted between a plurality of substrates. The flexible circuit board (240) may be designed with a bendable structure so that it may be placed in a limited space within the housing (210).

[0066] In various embodiments of the present disclosure, the electronic device (200) may include a first housing (110), a second housing (120), and a hinge device (140). The first housing (110) and the second housing (120) may be rotatably connected through the hinge device (140). The hinge device (140) may adjust the relative position of the first housing (110) and the second housing (120) with respect to a folding axis (F). The electronic device (200) implements a foldable structure so that a user can fold or unfold the housing (210). A stacked substrate (220) or an electronic component (230) may be disposed on each of the first housing (110) and the second housing (120).

[0067] In one embodiment, the stacked substrate (220) may form a multilayer structure to provide electrical connections and heat transfer paths within the electronic device (200). The stacked substrate (220) may be implemented in a structure in which a plurality of insulating layers and conductive layers are alternately stacked. Each conductive layer may be used as a signal line, a power line, or a ground line. A heat transfer path is provided inside the stacked substrate (220) to transfer heat generated from the electronic component (230) to the outside. For example, a portion of the conductive layer of the stacked substrate (220) may be formed of a metal with high thermal conductivity so that heat can be transferred to the housing (210) or a heat sink.

[0068] The stacked substrate (220) may include a first substrate (221), a second substrate (222), an interposer (223), and a heat transfer material (224). The first substrate (221) and the second substrate (222) may be spaced apart from each other, and the interposer (223) may be located between the first substrate (221) and the second substrate (222) to provide an electrical connection. The heat transfer material (224) may form a heat transfer path within a sealed space.

[0069] The first substrate (221) and the second substrate (222) may be arranged at a predetermined distance apart. The spaced-apart space may be utilized as a space for arranging the interposer (223) and the heat transfer material (224). The spacing distance may be designed considering the mounting height and heat transfer efficiency of the electronic component (230).

[0070] The interposer (223) is positioned between the first substrate (221) and the second substrate (222) to transmit electrical signals. At this time, the interposer (223) includes a sealing structure on its outer surface to form a sealed space, thereby preventing leakage of the heat transfer material (224). For example, the sealing structure of the interposer (223) can be implemented with silicone, rubber, or an adhesive.

[0071] The sealed space can be used as a space for injecting and storing a heat transfer material (224). The interposer (223) also performs a mechanical support role to fix the relative positions of the first substrate (221) and the second substrate (222).

[0072] Additionally, the interposer (223) may include a plurality of conductive patterns to transmit signals and power between the first substrate (221) and the second substrate (222).

[0073] A heat transfer material (224) can be injected into a sealed space through a first through hole (2211) formed in the first substrate (221). The heat transfer material (224) can form a heat transfer path by contacting the first substrate (221), the second substrate (222), and the interposer (223) within the sealed space.

[0074] A heat transfer material (224) can be injected into a sealed space through a first through hole (2211) formed in a first substrate (221). At this time, the first through hole (2211) can be formed as a passage for injecting the heat transfer material (224). The heat transfer material (224) can be injected into the first through hole (2211) through an injection nozzle or a dispenser. The injected heat transfer material (224) can fill the inside of the sealed space to form a heat transfer path. Pressure changes in the sealed space may occur during the injection process, and the size and location of the through hole can be designed taking this into account. The injection nozzle can be in close contact with the first through hole (2211) to prevent leakage of the heat transfer material (224). The injection speed and pressure can be adjusted according to the viscosity of the heat transfer material (224) and the volume of the sealed space. For example, the injection process can accurately inject a constant amount of heat transfer material (224) using automated equipment.

[0075] The heat transfer material (224) may be composed of silicone oil, grease, or a polymer-based thermally conductive material. The filled heat transfer material (224) can increase heat transfer efficiency and suppress the temperature rise of the electronic component (230).

[0076] The flexible circuit board (240) may include a first rigid part (241), a second rigid part (242), and a first flexible part (243). The first rigid part (241) may be disposed at one end of the flexible circuit board (240). The second rigid part (242) may be disposed spaced apart from the first rigid part (241). The first flexible part (243) may connect the first rigid part (241) and the second rigid part (242).

[0077] The first rigid member (241) may be disposed at one end of the flexible circuit board (240). The first rigid member (241) is located at the end of the flexible circuit board (240) and can support connection with an external circuit or a laminated board (220). The first rigid member (241) has a structure with increased thickness and can provide mechanical support when the connector is fastened.

[0078] In one embodiment, the first rigid member (241) may have a first connector (2412) disposed therein to be connected to a connection member (2411) disposed on the first substrate (221).

[0079] The first connector (2412) may be mounted on the surface of the first rigid portion (241). The first connector (2412) may be electrically connected to the connection portion (2411) of the first substrate (221). The first connector (2412) may include a plurality of pins or contact structures. At this time, the connection direction and position of the connector may be determined according to the shape of the first rigid portion (241), and may be implemented in a Board to Board (BTB) or Zero Insertion Force (ZIF) manner.

[0080] The connection portion (2411) is disposed on one side of the first substrate (221) and corresponds to the first connector (2412) to form an electrical connection relationship.

[0081] The second rigid part (242) may be spaced apart from the first rigid part (241) with the first flexible part (243) in between. The spacing structure may be designed to secure the bending characteristics of the first flexible part (243), and the spacing distance may be determined according to the total length of the flexible circuit board (240) and the arrangement structure within the housing (210).

[0082] The second rigid member (242) can be designed independently of the mounting location of the first connector (2412) or electronic component (230) and can be overlapped with the first recess (2421), the first through hole (2211), and the first cover member (250) to be described later to support a sealing structure of the heat transfer material (224) injection part.

[0083] In one embodiment, the thickness (d3) of the second rigid portion (242) may be thicker than the thickness (d1) of the first rigid portion (241). As illustrated in FIG. 5, the second rigid portion (242) according to one embodiment can directly press the first cover member (250). Therefore, the thickness (d3) of the second rigid portion (242) is set to a thickness capable of pressing the first cover member (250), thereby increasing the adhesion force with the first cover member (250) and enhancing the effect of preventing the overflow of the heat transfer material (224). At this time, the electronic device (200) according to one embodiment of the present invention can prevent contact detachment or signal short circuit of the first connector (2412) by increasing the thickness (d3) of the second rigid portion (242).

[0084] In one embodiment, the optimization of the thickness (d3) of the second rigid part (242) can contribute to controlling the mechanical rigidity of the entire flexible circuit board (240). The thickness (d3) of the second rigid part (242) can control the bending stiffness of the flexible circuit board (240) to improve the durability of the entire structure, and the optimization of the thickness (d3) of the second rigid part (242) can make the stress distribution uniform during the assembly process of the electronic device (200).

[0085] In at least one embodiment of the present disclosure, the second rigid portion (242) may include a first recess (2421) formed on one surface facing the first substrate (221).

[0086] As illustrated in FIGS. 6 and 8, the first recess (2421) may be formed as a recessed structure on the lower surface of the second rigid portion (242). The first recess (2421) overlaps with the through hole of the first substrate (221) to prevent the heat transfer material (224) from overflowing outside the second rigid portion (242). Accordingly, the depth and area of ​​the first recess (2421) may be designed according to the size and location of the first through hole (2211). In this case, the first recess (2421) may be a concave structure formed by cutting a portion of the stiffener stack.

[0087] The first recess (2421) can serve to prevent the heat transfer material (224) from overflowing.

[0088] Referring to FIGS. 6 and FIGS. 8, in various embodiments of the present disclosure, the first recess (2421) of the second rigid member (242) is positioned to overlap with the first through hole (2211) so as to primarily block the overflow of the heat transfer material (224). This overlapping structure allows the heat transfer material (224) to temporarily remain inside the first recess (2421) after being injected through the first through hole (2211). Thus, the overlapping structure can minimize external leakage even when the amount of injected heat transfer material (224) increases.

[0089] Specifically, a cavity can be secured between the second rigid part (242) and the heat transfer material (224) cover by cutting a portion of the second rigid part (242) to form a first recess (2421). The first recess (2421) can be concavely formed in the lower part of the second rigid part (242) to form an empty space between it and the first cover member (250). The cavity can be utilized as a space to temporarily accommodate the overflowing heat transfer material (224). The structure of the first recess (2421) and the cavity can contribute to preventing the heat transfer material (224) from leaking out.

[0090] In at least one embodiment of the present disclosure, the first recess (2421) and cavity structure can provide a space to accommodate the overflowing heat transfer material (224) to prevent the heat transfer material (224) from leaking out. The overflowing heat transfer material (224) remains inside the first recess (2421) and cavity and can be blocked from diffusing outward. The volume of the cavity can be designed to match the expected amount of TIM overflow. The first recess (2421) and cavity structure can widen the tolerance of the heat transfer material (224) injection process.

[0091] In one embodiment, the first recess (2421) and cavity structure can mitigate the effect of the second rigid part (242) being pushed by securing an additional distance (z-axis) between the stiffener and the heat transfer material (224) cover. Additionally, the first recess (2421) and cavity structure can minimize deformation of the second rigid part (242) even under repeated external impacts and mitigate stress concentration caused by the pushing of the second rigid part (242).

[0092] The first flexible part (243) can connect the first rigid part (241) and the second rigid part (242). In one embodiment, the first flexible part (243) is formed of a flexible insulating material to provide electrical and mechanical connections between the first rigid part (241) and the second rigid part (242) and to allow bending. The first flexible part (243) includes electrical signal lines and ground lines to transmit signals and power between the first rigid part (241) and the second rigid part (242). The first flexible part (243) can prevent short circuits or disconnections of the conductive pattern even under bending, twisting, or repetitive deformation, and can be designed to allow repetitive bending even in areas with a small radius of curvature.

[0093] In one embodiment, the thickness and stress control of the flexible region can affect the durability, flexibility, and supporting strength of the connector of the flexible circuit board (240). The thickness of the flexible region can have a direct effect on durability in a repeated bending environment. Stress control can improve structural reliability by mitigating stress concentration occurring at the boundary between the rigid region and the flexible region.

[0094] In one embodiment, the thickness (d2) of the first flexible part (243) may be thinner than the thickness (d1) of the first rigid part (241) and the thickness (d3) of the second rigid part (242). The thickness (d2) of the first flexible part (243) may be designed to be in the range of 0.05 mm to 0.15 mm, and the thickness (d3) of the first rigid part (241) and the second rigid part (242) may be formed to be 0.2 mm or more. The difference in thickness can reduce the bending radius of the flexible part and maintain the mechanical support of the rigid part. The thin thickness of the first flexible part (243) may contribute to reducing the overall thickness of the electronic device (200). At this time, the electronic device (200) according to one embodiment can be designed to have a thin thickness (d2) of the first flexible part (243) so that it can operate without cracking or short circuit of electrical signals during repeated folding operations while ensuring the bending flexibility of the flexible circuit board (240).

[0095] In addition, the thickness difference between the first flexible part (243), the first rigid part (241), and the second rigid part (242) can alleviate stress concentration at the boundary with the rigid part, thereby increasing the reliability of the entire structure. The thickness difference between the first flexible part (243) and the rigid part can induce stress distribution by applying a curved or tapered structure to the boundary. When stress concentration is alleviated, cracks or delamination at the joint between the first flexible part (243) and the rigid part can be reduced.

[0096] In various embodiments of the present disclosure, the electronic device (200) may include a first cover member (250) disposed on the substrate surface of a first substrate (221) to close a first through hole (2211).

[0097] The first cover member (250) can seal the first through hole (2211) to prevent leakage of the heat transfer material (224). The first cover member (250) is bonded to the edge of the first through hole (2211) through an adhesive layer to block the injected heat transfer material (224) from leaking out. Therefore, the first cover member (250) can perform the function of protecting and sealing the heat transfer path within the laminated substrate (220). At this time, the first cover member (250) may be made of silicone or rubber material for sealing, and may be made of a material with excellent heat resistance and chemical resistance to prevent damage to the heat transfer path.

[0098] Meanwhile, since the first cover member (250) is positioned to be attached to one surface of the first substrate (221) by a soldering method, the one surface of the first cover member (250) in contact with the first substrate (221) may be made of a metal material capable of soldering.

[0099] In addition, the first cover member (250) can prevent external foreign substances from entering the laminated substrate (220).

[0100] Referring to FIG. 8, the first cover member (250) may include an incision (251) into which a dispenser for injecting a heat transfer material (224) is inserted. The incision (251) of the first cover member (250) may be machined to a size such that the nozzle of the dispenser can be inserted during the injection process. The incision (251) may be designed as a self-recovery structure that automatically restores itself after injection. The incision (251) may maintain a sealed state without a separate sealing process after the injection of the heat transfer material (224).

[0101] Additionally, the incision (251) may include a guide mark that accurately guides the injection location. The incision (251) may be formed of a material having resilience to prevent residual heat transfer material (224) from leaking out after injection, and may be designed with a structure that has minimal deformation even during repeated injection processes.

[0102] In various embodiments of the present disclosure, the electronic device (200) may include a first opening (2422) corresponding to a first recess (2421) and a first elastic member (260) disposed between a first cover member (250) and a second rigid member (242).

[0103] As illustrated in FIGS. 7 and 8, the first elastic member (260) can be inserted into the space between the first cover member (250) and the second rigid member (242) to press the first cover member (250). The first elastic member (260) can press the first cover member (250) downward using a restoring force. The pressing force of the first elastic member (260) can be designed to be sufficient to maintain the close contact state of the cover member. The first elastic member (260) can be made of a highly elastic material that has little deformation even under repeated pressing, such as rubber, sponge, or polyurethane.

[0104] The pressurizing action of the first elastic member (260) can prevent the overflow of the heat transfer material (224) through the compression of the first cover member (250). The first elastic member (260) can prevent the heat transfer material (224) from leaking out by suppressing the deformation of the cover member. At this time, the first elastic member (260) can maximize the sealing effect by minimizing the gap between the cover member and the second rigid member (242). In addition, the first elastic member (260) can provide stable sealing even with changes in the injection amount of the heat transfer material (224) by maintaining the compressed state of the cover member.

[0105] The first opening (2422) can be positioned to precisely engage with the first recess (2421) of the second rigid part (242).

[0106] The first opening (2422) may be positioned to correspond to the first recess (2421) of the second rigid part (242) and may be designed to have the same position and size as the first recess (2421) of the second rigid part (242). The first opening (2422) can secure an injection path for the heat transfer material (224) while simultaneously increasing the stability of the sealed space. Additionally, the first opening (2422) may include a fine filter structure to prevent the inflow of external foreign substances.

[0107] In at least one embodiment of the present disclosure, the electronic device (200) may further include a battery (290) disposed between a flexible circuit board (240) and at least one electronic component (230) in a housing (210).

[0108] The battery (290) can be electrically connected to the stacked substrate (220) to supply power. The battery (290) can absorb heat within the housing (210) and release it to the outside.

[0109] The battery (290) is positioned parallel to one side of the electronic component (230) to increase space utilization. The overlapping arrangement of the battery (290) minimizes the empty space within the housing (210), thereby supporting the miniaturization of the electronic device (200). At this time, the overlapping structure of the battery (290) can optimize the wiring and component placement within the housing (210) and contribute to reducing the thickness of the electronic device (200).

[0110] FIG. 9 is a drawing for showing the movement of the second rigid member when an overflow occurs as the liquid heat transfer material passes through the first cover member in the cross-sectional view of FIG. 8. FIG. 10 is a drawing illustrating the appearance when an overflow occurs as the liquid heat transfer material passes through the first cover member in the cross-sectional view of FIG. 8.

[0111] Referring to FIGS. 9 and 10, a mechanism to prevent the first connector (2412) from overflowing with heat transfer material (224) is described.

[0112] As illustrated in FIG. 8, the heat transfer material (224) can be maintained mounted inside the laminated substrate (220) without leaking out through the first cover member (250). Meanwhile, if the heat transfer material (224) expands due to external impact or heat, the heat transfer material (224) may leak out of the first cover member (250) as illustrated in FIG. 9.

[0113] An electronic device (200) according to one embodiment of the present invention may form an articulated structure by forming a first flexible portion (243) between a first rigid portion (241) and a second rigid portion (242) of a flexible circuit board (240). This articulated structure can cause only the second rigid portion (242) to lift by utilizing the bending characteristics of the first flexible portion (243). The articulated structure can stably maintain the position of the first rigid portion (241) in the event of an external shock or excessive injection of a heat transfer material (224).

[0114] Accordingly, if the heat transfer material (224) is over-injected, or if the heat transfer material (224) expands due to external shock or heat and the pressure of the heat transfer material (224) increases, only the second rigid part (242) can be lifted upwards with respect to the first flexible part (243) as shown in FIG. 10. At this time, the first rigid part (241) can maintain its position due to the reaction force of the first flexible part (243). Therefore, the phenomenon of only the second rigid part (242) being lifted can contribute to preventing connector insertion problems.

[0115] In one embodiment, the articulated structure can prevent the first connector (2412) from being displaced by ensuring that the first rigid portion (241) of the first connector (2412) remains in place. The articulated structure can adjust the reaction force of the first flexible portion (243) to prevent the first rigid portion (241) of the first connector (2412) from moving due to external force. Preventing the displacement of the first connector (2412) can increase the reliability of the connection of the first connector (2412) and prevent electrical connection failures. At this time, the articulated structure can stably maintain the position of the first connector (2412) even under repeated external impacts.

[0116] FIG. 11 is a schematic diagram showing a top view of the first rigid part, the second rigid part, and the first flexible part, and FIG. 12 is a schematic diagram showing the case where the width of the first flexible part of FIG. 11 is adjusted. FIG. 13a is a schematic diagram showing the case where the number of layers of the first flexible part is increased, and FIG. 13b is a schematic diagram showing the case where the number of layers of the first flexible part is reduced.

[0117] Referring to FIGS. 11 to 13b, a method for controlling the reaction force of the first flexible part (243) will be described.

[0118] In one embodiment, the tension of the first flexible part (243) can be controlled by the number of layers, width, wiring density, and / or pattern structure. If the number of layers of the first flexible part (243) increases, the tension may increase, and if the number of layers decreases, the tension may decrease. If the width of the first flexible part (243) is wider, the tension may increase, and if the width is narrower, the flexibility may increase. The wiring density and pattern structure of the first flexible part (243) may affect the mechanical strength and stress distribution of the first flexible part (243).

[0119] In at least one embodiment of the present disclosure, the tension of the first flexible part (243) may be designed according to various requirements, such as the pressure of the heat transfer material (224) and the prevention of connector insertion. For example, the tension of the first flexible part (243) may be adjusted to correspond to the internal pressure generated when the heat transfer material (224) is injected, for the purpose of preventing overflow or connector insertion. At this time, the tension of the first flexible part (243) may be optimized according to the folding operation, assembly process, and durability requirements of the electronic device (200).

[0120] In one embodiment, the tension can be increased by increasing the number of layers of the first flexible part (243) or by expanding the width. In one embodiment, a flexible part with many layers and a wide width can provide high reaction force to enhance structural stability. For example, a flexible part with a 4-layer structure can provide 1.5 times or more tension compared to a 2-layer structure. A flexible part with a wide width can suppress deformation caused by external impact or pressure.

[0121] Referring to FIG. 11 and FIG. 12, FIG. 12 has both ends of the first flexible part (243) cut compared to FIG. 11, so that the width of the first flexible part (243) is reduced, thereby lowering the tension.

[0122] In at least one embodiment of the present disclosure, when the tension of the first flexible part (243) is designed to be high, the reaction force of the first flexible part (243) against the pressure of the heat transfer material (224) can be increased to focus on preventing the heat transfer material (224) from overflowing. In one embodiment, such a design can set the structural reaction force of the first flexible part (243) to 0.5 N or more to suppress the phenomenon where the heat transfer material (224) pushes out the cover. Such a design can strengthen the adhesion force between the second rigid part (242) and the first cover member (250) to primarily block leakage of the heat transfer material (224).

[0123] In at least one embodiment of the present disclosure, if the tension of the first flexible part (243) is designed to be low, it may be suitable for environments requiring flexibility, such as preventing connector insertion. This low tension design sets the structural reaction force of the first flexible part (243) to 0.2 N or less, thereby suppressing the phenomenon where the first connector (2412) is lifted by external impact. Therefore, this design can simultaneously ensure durability and flexibility in an electronic device (200) where folding movements are frequent.

[0124] In at least one embodiment of the present disclosure, tension can be controlled by applying various patterns, such as a mesh structure and a U-cut pattern, to the first flexible part (243). The mesh structure can control the local stiffness of the first flexible part (243) by arranging a portion of the conductive pattern in a grid shape. As shown in FIG. 12, the U-cut pattern can selectively lower the tension in a specific area by cutting the outer edge of the first flexible part (243).

[0125] In at least one embodiment of the present disclosure, a mesh structure or a U-cut pattern can optimize the stress distribution of the entire structure by adjusting the local stiffness of the first flexible part (243). The mesh structure can increase the flexibility of the outer part while maintaining the stiffness of the central part of the first flexible part (243). The U-cut pattern can prevent stress concentration during folding by adjusting the radius of curvature of the first flexible part (243).

[0126] In addition, the pattern design of the first flexible part (243) can contribute not only to tension control but also to the optimization of the wiring path and the improvement of heat dissipation characteristics. The mesh structure can minimize signal transmission delay by optimizing the length of the conductive pattern, and the U-cut pattern can increase the surface area of ​​the flexible part to increase heat dissipation efficiency.

[0127] Referring to FIG. 13a and FIG. 13b, the tension of the first flexible part (243) can be controlled by adjusting the number of layers of the first flexible part (243).

[0128] In at least one embodiment of the present disclosure, as the wiring density of the layer increases, the mechanical rigidity of the first flexible part (243) increases, thereby improving resistance to external forces. The first flexible part (243) with a high wiring density of the layer can prevent signal short circuits or disconnections in environments of dropping, impact, or repeated bending. Increased mechanical rigidity can contribute to improved durability and reliability of the flexible part.

[0129] In addition, in at least one embodiment of the present disclosure, tension can be reduced by reducing the number of layers of the first flexible part (243) as shown in FIG. 13b. Structural reaction force can be reduced by designing the flexible part to have two layers or fewer, or by reducing the width to 3 mm or less. Reducing the number of layers and reducing the width can reduce the bending radius of the flexible part and increase flexibility.

[0130] In one embodiment, the first flexible part (243) with fewer layers has increased flexibility, thereby ensuring durability in a repeated bending environment. For example, when comparing FIG. 13a and FIG. 13b, the first flexible part (243) with a two-layer structure can have more than 30% increased flexibility compared to a four-layer structure.

[0131] FIG. 14 is a schematic diagram showing the first rigid part, the second rigid part, and the third rigid part as viewed from above, FIG. 15 is a diagram showing the upper surface of the flexible circuit board, and FIG. 16 is a diagram showing the lower surface of the flexible circuit board.

[0132] Hereinafter, a multi-stiffener structure of a flexible circuit board (240) according to another embodiment of the present invention will be described in detail with reference to FIG. 8 and FIG. 14 to 16.

[0133] The flexible circuit board (240) may include a third rigid part (244) and a second flexible part (247). The flexible circuit board (240) may be formed into a multi-stiffener structure including a first rigid part (241), a second rigid part (242), a third rigid part (244), and a second flexible part (247). The third rigid part (244) may be positioned on one side of the flexible circuit board (240) to provide additional mechanical support and a heat transfer path. The second flexible part (247) may be positioned between the first rigid part (241) and the third rigid part (244) to electrically and mechanically connect the two rigid parts.

[0134] This multi-stiffener structure can prevent heat transfer material (224) from overflowing through the through-holes through the arrangement of each rigid part and the connection of the flexible part. The articulated flexible part can be designed to prevent the corresponding connector part from being pushed out when lifting of each stiffener occurs.

[0135] In one embodiment, each rigid part and flexible part of the flexible circuit board (240) can contribute to signal transmission, mechanical support, sealing reinforcement, and improved space efficiency within the electronic device (200). The first rigid part (241) and the third rigid part (244) can each be responsible for connector mounting and securing a heat transfer path. The second flexible part (247) can increase durability in a repeated bending environment and support stable signal transmission. The combination of each rigid part and flexible part can increase the degree of freedom for component placement within the electronic device (200) and provide ease of assembly and maintenance.

[0136] The third rigid part (244) may be placed on one side of the flexible circuit board (240), and the second flexible part (247) may connect the first rigid part (241) and the third rigid part (244). The third rigid part (244) may be located at the end or center of the flexible circuit board (240) and may be placed at a position spaced apart from the first rigid part (241).

[0137] Specifically, the third rigid part (244) may be located opposite the second rigid part (242) with respect to the first rigid part (241). The third rigid part (244) may be positioned opposite the first rigid part (241) to form a symmetrical structure of the flexible circuit board (240). The second rigid part (242) and the third rigid part (244) may each be positioned on both sides of the first rigid part (241) to achieve balanced load distribution within the electronic device (200). The third rigid part (244) may include a second recess (not shown) that overlaps with a second through hole (not shown), and the second through hole (not shown) and the second recess (not shown) may have the same shape as the first through hole (2211) and the first recess (2421) of FIG. 8.

[0138] The arrangement of these third rigid members (244) can increase the symmetrical structure and space utilization of the flexible circuit board (240). The symmetrical structure can increase the degree of freedom for component placement within the electronic device (200) and improve the efficiency of the assembly process.

[0139] In at least one embodiment of the present disclosure, when the substrate surface of the first substrate (221) is viewed in a vertical direction, at least a portion of the second through-hole (not shown) formed in the first substrate (221) may overlap with the third rigid portion (244). The third rigid portion (244) may be precisely aligned with the second through-hole (not shown) to support the injection and sealing of the heat transfer material (224). The overlapping structure with the second through-hole (not shown) can simultaneously achieve alignment of the heat transfer path and optimization of the signal routing path. In at least one embodiment of the present disclosure, the overlapping structure of the third rigid portion (244) and the second through-hole (not shown) may contribute to alignment of the heat transfer path and improvement of sealing performance. The overlapping structure may prevent the heat transfer material (224) from leaking out and allow heat to be transferred efficiently.

[0140] In various embodiments of the present disclosure, the third rigid portion (244) of the flexible circuit board (240) may include a second recess (not shown) that overlaps with a second through-hole (not shown). The second through-hole (not shown) and the second recess (not shown) may have the same shape as the first through-hole (2211) and the first recess (2421) of FIG. 8. The second recess (not shown) may be formed by cutting or shaping a portion of the third rigid portion (244). The second recess (not shown) may maximize the sealing effect by precisely matching the through-hole. For example, the depth and shape of the second recess (not shown) may be designed to match the size and location of the through-hole.

[0141] A second recess (not shown) may provide a space that supports the injection and sealing of a heat transfer material (224). For example, an overflow of heat transfer material (224) may be temporarily contained within the second recess (not shown) to prevent external leakage.

[0142] In at least one embodiment of the present disclosure, the alignment structure of the second recess (not shown) and the second through hole (not shown) can contribute to sealing the heat transfer material (224) and preventing external leakage. Precise alignment of the second recess (not shown) and the second through hole (not shown) can block the heat transfer material (224) from leaking out through the through hole. For example, the second recess (not shown) can increase the contact surface with the cover member to enhance the sealing effect.

[0143] The second flexible section (247) is arranged continuously between the first rigid section (241) and the third rigid section (244) to connect signal and power lines. The wiring pattern of the second flexible section (247) can be designed to minimize signal interference.

[0144] In at least one embodiment of the present disclosure, the design of the second flexible part (247) can increase durability and reliability in a repeated bending environment. For example, the second flexible part (247) can operate without damage even under repeated bending in an electronic device (200) to which a folding or hinge structure is applied. The thickness, width, and wiring density of the second flexible part (247) can be optimized according to the usage environment.

[0145] In one embodiment, the electronic device (200) may further include a second cover member (not shown) disposed on the substrate surface of the first substrate (221) to close a second through hole (not shown). The second cover member (not shown) may be formed of silicone, rubber, or metal material to completely seal the second through hole (not shown).

[0146] In one embodiment, a second cover member (not shown) can seal the through hole to prevent leakage of the heat transfer material (224). The second cover member (not shown) is designed to fit the size and position of the through hole to prevent the heat transfer material (224) from leaking out.

[0147] The second cover member (not shown) can reinforce the sealing structure by combining with a stiffener and an elastic member. The second cover member (not shown) can maintain a sealed state even under external impact or pressure changes by adding an elastic layer to the bonding surface with the stiffener. For example, an elastic member made of sponge or rubber material may be inserted between the second cover member (not shown) and the stiffener.

[0148] In one embodiment, the electronic device (200) may further include a second opening (not shown) corresponding to a second recess (not shown) and a second elastic member (not shown) disposed between a second cover member (not shown) and a third rigid member (244).

[0149] The second opening (not shown) can be precisely aligned with the second recess (not shown) to support the injection and sealing of the heat transfer material (224). The second opening (not shown) can facilitate the insertion of the dispenser during the injection process and can act as part of the sealing structure after injection. For example, the second opening (not shown) can be precisely aligned with the cover member to prevent the heat transfer material (224) from leaking out.

[0150] A second elastic member (not shown) is positioned between the cover member and the stiffener to provide pressure and cushioning functions. The second elastic member (not shown) is formed of rubber, sponge, or silicone material and can act as a cushion against external impact. For example, the second elastic member (not shown) can press the cover member with a constant pressure to maintain a sealed state. At this time, the second elastic member (not shown) includes a cavity structure to temporarily accommodate the overflowing heat transfer material (224).

[0151] As illustrated in FIG. 14, the second rigid member (242) and the third rigid member (244) may be positioned diagonally with respect to the long side direction of the first rigid member (241). The second rigid member (242) and the third rigid member (244) are positioned on both diagonal sides of the first rigid member (241) to provide a mechanism for offsetting tilt in the Z-axis direction. This diagonal arrangement allows the rigid member in the opposite direction to correct for tilt when each rigid member is tilted, thereby maintaining the stability of the entire structure. For example, when the second rigid member (242) is lifted in the Z-axis direction, the tilt in the opposite direction of the third rigid member (244) offsets it, thereby preventing the slippage of each connector and maintaining the flatness of the entire flexible circuit board (240).

[0152] In addition, the diagonal arrangement of the second rigid member (242) and the third rigid member (244) can contribute to offsetting the inclination in the Z-axis direction and securing structural stability. This diagonal arrangement can increase the degree of freedom for component placement within the electronic device (200), improve the efficiency of the assembly process, and be effective in preventing connector misinsertion and maintaining flatness. Furthermore, this diagonal arrangement can prevent misinsertion of the connector and structural deformation by mutually offsetting the inclination effects of each rigid member when deformation occurs during the assembly process or due to external impact.

[0153] When the second rigid section (242) and the third rigid section (244) are arranged diagonally in this manner, a signal line may be placed on one side of the first rigid section (241) to provide electrical and mechanical connections between each rigid section. In at least one embodiment of the present disclosure, the flexible circuit board (240) may include a fourth rigid section (245) on which a second connector (2451) is placed and a connection section (246). The fourth rigid section (245) may provide additional mechanical support for the flexible circuit board (240) and a mounting function for the second connector (2451).

[0154] In at least one embodiment of the present disclosure, the second connector (2451) may be connected to at least one electronic component (230). The second connector (2451) may support electrical connection with a main board, a display, or other electronic component (230). The second connector (2451) may reliably connect signal and power lines by applying various types of contact structures.

[0155] The fourth rigid section (245) can provide additional connector mounting and signal distribution functions.

[0156] The fourth rigid member (245) can be designed in a multilayer structure or an expandable pattern so as to be able to mount a plurality of connectors or electronic components (230).

[0157] The connecting portion (246) electrically and mechanically connects the first rigid portion (241) and the fourth rigid portion (245), and may overlap with the battery (290) when the substrate surface of the first substrate (221) is viewed in a vertical direction. The connecting portion (246) may be positioned overlapping the battery (290) to maximize space utilization within the electronic device (200). For example, the connecting portion (246) may be positioned across the upper or lower part of the battery (290), and the position and shape of such connecting portion (246) may be optimized to fit the space constraints within the electronic device (200).

[0158] The electronic device according to the present invention can effectively suppress the overflow of a heat transfer material by forming a first recess in a second rigid portion of a flexible circuit board to prevent the heat transfer material injected into a sealed space of a stacked substrate from overflowing to the outside, and by arranging the first recess to overlap with a first through-hole of the stacked substrate.

[0159] In addition, by connecting the first rigid part and the second rigid part of the flexible circuit board to the first flexible part, the connector can be prevented from being inserted despite the tilt phenomenon of the stiffener that may occur due to the pressure of the heat transfer material.

[0160] Furthermore, by including a first cover member disposed on the substrate surface of the first substrate to close the first through hole, a first opening corresponding to the first recess, and a first elastic member disposed between the first cover member and the second rigid part, a secondary prevention effect against overflow of the heat transfer material, along with a pressurization and tolerance correction effect of the cover member, can be obtained.

[0161] In addition, by designing the thickness of the first flexible part to be thinner than the thickness of the first rigid part and the second rigid part, or by designing the thickness of the second rigid part to be thicker than the first rigid part, the structural stability against the pressure of the heat transfer material and the insertion of the connector can be further improved.

[0162] In addition, by including a plurality of rigid and flexible parts in a flexible circuit board and applying recesses and elastic members to each rigid part, structural flexibility corresponding to a plurality of heat transfer material injection ports can be provided.

Claims

1. In an electronic device, Housing; A stacked substrate disposed in the above housing; At least one electronic component disposed in the above housing; and A flexible circuit board that electrically connects the above-mentioned stacked substrate and the above-mentioned at least one electronic component; comprising The above-mentioned stacked substrate is, First substrate, A second substrate spaced apart from the first substrate, An interposer disposed between the first substrate and the second substrate to electrically connect the first substrate and the second substrate, and A heat transfer material injected into a space formed by the first substrate, the second substrate, and the interposer through a first through-hole formed in the first substrate, and The above flexible circuit board; is A first rigid member having a first connector connected to a connection part disposed on the first substrate, A second rigid member spaced apart from the first rigid member and including a first recess formed on one surface facing the first substrate, and It includes a first flexible part connecting the first rigid part and the second rigid part, An electronic device in which, when viewed from a direction perpendicular to the upper surface of the first substrate, at least a portion of the first through hole overlaps with the first recess of the second rigid part.

2. In Paragraph 1, An electronic device further comprising: a first cover member disposed on the substrate surface of the first substrate to close the first through hole.

3. In Paragraph 2, An electronic device further comprising: a first opening corresponding to the first recess, and a first elastic member disposed between the first cover member and the second rigid member.

4. In Paragraph 3, The first elastic member above is, An electronic device that presses the first cover member.

5. In Paragraph 1, The thickness of the first flexible part is, An electronic device thinner than the thickness of the first rigid part and the thickness of the second rigid part.

6. In Paragraph 1, The thickness of the second rigid part above is, An electronic device thicker than the thickness of the first rigid part.

7. In Paragraph 1, The above flexible circuit board is, It includes a third rigid part located opposite to the second rigid part with respect to the first rigid part, and a second flexible part connecting the first rigid part and the third rigid part. An electronic device in which, when the substrate surface of the first substrate is viewed in a vertical direction, at least a portion of the second through-hole formed in the first substrate overlaps with the third rigid portion.

8. In Paragraph 7, The third rigid part of the above flexible circuit board is, An electronic device comprising a second recess that overlaps with the second through hole.

9. In Paragraph 8, An electronic device further comprising: a second opening corresponding to the second recess, and a second elastic member disposed between the second cover member and the third rigid member.

10. In Paragraph 8, An electronic device further comprising: a second cover member disposed on the substrate surface of the first substrate to close the second through hole.

11. In Paragraph 7, The above second rigid part and the above third rigid part An electronic device positioned diagonally with respect to the long side direction of the first rigid member.

12. In Paragraph 1, A battery disposed between the flexible circuit board and the at least one electronic component; further comprising The above flexible circuit board is, A fourth rigid part disposed at one end of the above flexible circuit board, A second connector disposed in the fourth rigid part and connected to the at least one electronic component, and An electronic device comprising a connection portion that connects the first rigid portion and the fourth rigid portion, and overlaps with the battery when the substrate surface of the first substrate is viewed in a vertical direction.

13. In Paragraph 1, The above housing includes a first housing and a second housing, and The electronic device includes a hinge assembly that rotatably connects the first housing and the second housing with respect to a folding axis, and An electronic device in which the long side of the first connector of the above-described stacked substrate is substantially parallel to the folding axis.

14. In Paragraph 2, The first cover member above is, An electronic device having an incision formed therein into which a dispenser for injecting the above-mentioned heat transfer material is inserted.

15. In electronic devices, Housing; A stacked substrate disposed in the above housing; At least one electronic component disposed in the above housing; and It includes a flexible circuit board that electrically connects the above-mentioned stacked substrate and the above-mentioned at least one electronic component, and The above-mentioned stacked substrate is, First substrate, A second substrate spaced apart from the first substrate, An interposer disposed between the first substrate and the second substrate, electrically connecting the first substrate and the second substrate and providing a sealed space, and It includes a heat transfer material injected into a sealed space through a first through-hole formed in the first substrate, and The above flexible circuit board is; A first rigid part disposed at one end of the flexible circuit board and having a connector disposed therein for connecting to a connection part disposed on the first board, A second rigid member spaced apart from the first rigid member, and It includes a first flexible part connecting the first rigid part and the second rigid part, When the substrate surface of the first substrate is viewed in a vertical direction, at least a portion of the first through hole overlaps with the second rigid part of the electronic device.

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