Speaker module and electronic device

Abstract

An electronic device according to an embodiment disclosed herein may comprise: a speaker unit; a display; a digitizer disposed below the display; and a metal plate located between the digitizer and the speaker unit. The speaker unit may include: a speaker housing; a first magnetic component and a second magnetic component that are arranged inside the speaker housing; and a coil disposed between the first magnetic component and the second magnetic component. The first magnetic component may be located in a central region of the speaker housing. The second magnetic component may be located outside the first magnetic component. The metal plate may be disposed above the speaker housing. The metal plate may include a plurality of slits. Various other embodiments are also possible.

Description

Speaker Module and Electronic Device

[0001] The present disclosure relates to a speaker module with improved shielding performance against leakage magnetic force generated in a magnetic component of a speaker unit, and an electronic device including the speaker module.

[0002] With the advancement of information technology (IT), various types of electronic devices, such as smartphones and tablet PCs, are becoming widespread. Electronic devices are pursuing thinness, lightweight design, miniaturization, and multifunctionality. Displays and various components can be arranged to provide multifunctionality. Portable mobile phones include various functions and may include sound playback capabilities in response to the demand for high-quality music. Electronic devices, including mobile phones, may include speakers for sound reproduction. Additionally, displays and digitizers may be included inside the electronic devices. Magnetic fields generated by the speaker module can affect the operation of digitizers and electronic pens (e.g., stylus pens).

[0003] The foregoing is provided for background information only to aid in understanding the embodiments of the present disclosure. It has not been determined, nor is any claim made, whether any of the foregoing constitutes prior art in relation to the present disclosure.

[0004] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0005] As the thickness of electronic devices becomes increasingly thinner and speaker units must also become thinner, there are limitations in ensuring sufficient thickness of the shielding material to shield against magnetic leakage. Electronic pens (e.g., stylus pens) used in mobile electronic devices and digitizers placed at the bottom of the display operate via electromagnetic force sensing, and magnetic leakage can occur in the magnetic components that operate the speaker. Magnetic leakage directed toward the digitizer can cause malfunctions in the electronic pen (e.g., stylus pen). When the electronic pen (e.g., stylus pen) and digitizer are in operation, if magnetic leakage occurs in the speaker unit, it can interfere with communication between the electronic pen (e.g., stylus pen) and the digitizer. The closer the distance between the digitizer and the speaker unit, the greater the impact caused by magnetic leakage. As electronic devices become slimmer, the gap between the digitizer and the speaker unit decreases; since leakage magnetic force generated by the speaker unit can cause the electronic pen to malfunction, this leakage magnetic force must be shielded.

[0006] The present disclosure proposes a magnetic shielding structure (e.g., a metal plate) for an ultra-thin speaker unit in an electronic device.

[0007] The present disclosure may provide a metal plate capable of shielding leakage magnetic force generated in a speaker unit, and an electronic device including the same.

[0008] A metal plate (e.g., magnetic shielding material) according to one embodiment of the present disclosure can be applied to a smartphone, tablet PC (personal computer), or laptop PC in which a slim-type speaker unit is applied.

[0009] The present disclosure may provide a speaker module with improved magnetic shielding performance and an electronic device including the speaker module.

[0010] The present disclosure may provide a speaker module and an electronic device including the speaker module that can improve the shielding of leakage magnetic force by forming a bonding tube to secure thickness competitiveness of the speaker module.

[0011] The present disclosure can provide a speaker module and an electronic device including the speaker module that can improve the shielding of leakage magnetic force by dividing a bonding tube shape formed of SPCC (Steel Plate Cold Rolled Commercial) perpendicular to the long axis direction of a magnetic component.

[0012] The technical tasks intended to be accomplished in this document are not limited to those mentioned above, and other technical tasks not mentioned can be clearly understood by a person skilled in the art to which this document belongs from the description below.

[0013] An electronic device according to one embodiment of the present disclosure may include a speaker unit, a display, a digitizer disposed below the display, and a metal plate disposed between the digitizer and the speaker unit. The speaker unit may include a speaker housing, a first magnetic component disposed inside the speaker housing, a second magnetic component, and a coil disposed between the first magnetic component and the second magnetic component. The first magnetic component may be disposed in the center of the speaker housing. The second magnetic component may be disposed on the outer edge of the first magnetic component. The metal plate may be disposed on the upper part of the speaker housing. The metal plate may include a plurality of slits (e.g., thin patterns).

[0014] The electronic device of the present disclosure may include a metal plate capable of shielding leakage magnetic force generated in a speaker unit.

[0015] The magnetic force generated from the magnetic component moves into the interior of the shielding material, a metal plate (e.g., cold-rolled commercial steel plate, SPCC: Steel Plate Cold Rolled Commercial), and magnetizes it. Only the magnetic force exceeding the magnetic saturation level of the metal plate (SPCC) can move outside the metal plate (SPCC). Through this, the magnetic force leaking outward is reduced as the shielding material becomes magnetized, and the magnetic force can be shielded.

[0016] In addition, various effects that can be identified directly or indirectly through this document may be provided.

[0017] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0018] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0019] FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment of the present disclosure.

[0020] FIG. 2 is a front perspective view of an electronic device (e.g., mobile electronic device) according to various embodiments of the present disclosure.

[0021] FIG. 3 is a perspective view of the rear of the electronic device of FIG. 2 according to various embodiments of the present disclosure.

[0022] FIG. 4 is a block diagram illustrating the configuration of an electronic device according to one embodiment of the present disclosure.

[0023] FIG. 5 is a drawing showing the front of an electronic device (e.g., a tablet PC) according to one embodiment of the present disclosure.

[0024] FIG. 6 is a drawing showing the rear and side of an electronic device (e.g., a tablet PC) according to one embodiment of the present disclosure.

[0025] FIG. 7 is a drawing showing a speaker unit placed inside an electronic device (e.g., a tablet PC) according to one embodiment of the present disclosure.

[0026] Figure 8a is a drawing showing a cross-section along the line AA' of Figure 7.

[0027] FIG. 8b shows a speaker module according to one embodiment of the present disclosure, which is a drawing showing that a speaker unit and a metal plate are bonded (e.g., attached) by a bonding member (e.g., adhesive member).

[0028] FIG. 9a is a drawing showing a speaker unit according to one embodiment of the present disclosure.

[0029] FIG. 9b is a drawing showing a metal plate that is bonded (e.g. attached) to a speaker unit.

[0030] FIG. 10 is a drawing showing a metal plate according to an embodiment of the present disclosure being bonded (e.g., attached) to a speaker unit.

[0031] FIG. 11 is a drawing showing a speaker unit and a metal plate (SPCC) placed in a speaker enclosure.

[0032] FIG. 12 is a drawing showing a protective film being bonded (e.g., attached) to the speaker enclosure of FIG. 11.

[0033] FIGS. 13a and FIGS. 13b are drawings showing a plurality of slits formed in a metal plate.

[0034] FIG. 14 is a drawing showing the front and rear sides of a metal plate including a plurality of slits.

[0035] FIG. 15 is a drawing showing a speaker unit, including a yoke, a first magnetic component (e.g., a center magnetic component), and a second magnetic component (e.g., a side magnetic component).

[0036] Figure 16 is a diagram showing leakage magnetic force occurring in the speaker unit of the comparative example.

[0037] Figure 17 is a diagram showing that an electronic pen and a digitizer operate by mutual magnetic force.

[0038] Figure 18 is a diagram showing a comparison of the shielding performance of leakage magnetic force according to the thickness of a metal plate (e.g., magnetic shielding material) placed in a speaker unit.

[0039] FIGS. 19 and 20 are drawings showing that a plurality of slits are formed in a metal plate to correspond to the position where a first magnetic component (e.g., a center magnetic component) of a speaker unit is placed.

[0040] FIG. 21 is a diagram showing the mutual inductance between a first antenna (e.g., a transmitting antenna) and a second antenna (e.g., a receiving antenna) in free space.

[0041] FIG. 22 is a diagram showing the mutual inductance between the first antenna (e.g., transmitting antenna) and the second antenna (e.g., receiving antenna) when a conductive plate is placed between them.

[0042] FIGS. 23 and 24 are drawings showing a comparison of the degree of magnetic field shielding according to the size (e.g., area) of the opening formed in the conductor plate.

[0043] FIG. 25 is a diagram showing the mutual inductance Ms according to the size of the slit formed in the metal plate (e.g., the size of the opening of the conductor plate) and the mutual inductance Mi in free space set to a constant value (e.g., 100).

[0044] FIG. 26 is a drawing showing a comparison of the leakage magnetic force generated when a metal plate of a comparative example is applied to a speaker unit and when a metal plate of the present disclosure is applied to a speaker unit.

[0045] FIGS. 27a and FIGS. 27b are drawings showing a metal plate with multiple slits formed thereon placed in a speaker unit of a dual magnetic component structure.

[0046] It should be noted that throughout the drawings, the same reference number is used to describe the same or similar elements, features, and structures.

[0047] Hereinafter, embodiments of the present disclosure are described in detail with reference to the drawings so that those skilled in the art can easily practice them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0048] The following description, with reference to the attached drawings, is provided to facilitate a comprehensive understanding of various embodiments of the disclosure as defined by the claims and their equivalents. While various specific details are included to aid understanding, they should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various changes and modifications to the various embodiments described herein may be made without departing from the scope and spirit of the disclosure. Additionally, for clarity and brevity, descriptions of well-known functions and configurations may be omitted.

[0049] The terms and words used in the following description and claims are not limited to their literary meanings and are merely used by the applicant to enable a clear and consistent understanding of this document. Accordingly, it should be apparent to those skilled in the art that the following description of various embodiments of this document is provided for illustrative purposes only and is not intended to limit this document as defined by the appended claims and their equivalents.

[0050] The singular form should be understood to include plural referents unless the context clearly indicates otherwise. Thus, for example, a reference to "component surfaces" may include a reference to one or more of such surfaces.

[0051] FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment of the present disclosure.

[0052] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0053] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0054] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0055] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0056] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0057] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0058] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0059] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0060] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0061] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, an angle sensor, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor (e.g., a geomagnetic sensor), an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0062] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0063] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0064] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0065] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0066] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0067] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0068] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0069] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0070] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0071] According to one embodiment, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0072] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0073] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0074] An electronic device according to one embodiment disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiment of this document is not limited to the aforementioned devices.

[0075] The embodiments of the present disclosure and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, each of phrases such as “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “at least one of A, B, or C” may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any (e.g., first) component is referred to as “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicationly,” it means that said component may be connected to said other component directly (e.g., wired), wirelessly, or through a third component.

[0076] As used in one embodiment of the present disclosure, the term “module” may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0077] One embodiment of the present disclosure may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0078] According to one embodiment, the method according to one embodiment disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0079] According to one embodiment, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to one embodiment, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to one embodiment, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0080] According to one embodiment, the display module (160) may include a bar-type or plate-type display (e.g., the display (201) of FIG. 2, the display (410) of FIG. 4), a display driver IC (e.g., the display driver IC (430) of FIG. 4), a touch circuit (e.g., the touch circuit (450) of FIG. 4), and a digitizer (e.g., the digitizer (460) of FIG. 2 and FIG. 4).

[0081] According to one embodiment, the electronic device (101) may include a display module (160) and an electronic pen (e.g., a stylus pen) (e.g., the electronic pen (300) of FIGS. 2 and 3). For example, the display module (160) may include a flexible display configured to be foldable or unfoldable. For example, the display module (160) may include a display (e.g., the display (410) of FIG. 4), a display driver IC (e.g., the display driver IC (430) of FIG. 4), a touch circuit (e.g., the touch circuit (450) of FIG. 4), and a digitizer (e.g., the digitizer (460) of FIGS. 2 and 4).

[0082] According to one embodiment, the display module (160) may include a flexible display that is slidably arranged to provide a screen (e.g., a display screen), a display driver IC (e.g., the display driver IC (430) of FIG. 4), a touch circuit (e.g., the touch circuit (450) of FIG. 4), and a digitizer (the digitizer (460) of FIG. 4).

[0083] According to one embodiment, the display module (160) may be referred to as a variable display (e.g., a stretchable display), an expandable display, or a slide-out display.

[0084] According to one embodiment, the processor (120) (e.g., processing circuit) may be implemented as one or more IC (integrated circuit (or circuitry)) chips and may perform various data processing operations. The processor (120) may include at least one electrical circuit and may process instructions (or programs, data) stored in memory (130) individually or collectively in a distributed manner. The processor (120) may include a processor assembly comprising one or more processing circuits. The processor (120) may include any processing circuit that is operative to control the performance and operations of one or more components of the electronic device (101) (e.g., memory (130), display module (160), sensor module (176) (e.g., sensor), camera module (180) (e.g., image sensor) and / or communication module (190) (e.g., communication circuit)). For example, a processor (120) (e.g., an application processor (AP)) may be implemented as a system on chip (SoC) (e.g., a single chip or a chipset). For example, the processor (120) may be implemented as a plurality of cores (or at least one core circuit), a plurality of chips, or a plurality of chipsets. For example, the processor (120) may include one or more processing circuits. For example, the processor (120) may include one or more processing circuits configured to perform the various functions of the present disclosure individually and / or collectively. As an example without limitation, at least a portion of the processor (120) may be included in a first chip of the electronic device (101), and at least another portion of the processor (120) may be included in a second chip of the electronic device (101) different from the first chip of the electronic device (101).

[0085] According to one embodiment, the number of processors (120) may be one or more. For example, the processor (120) may have the structure of a multi-core processor such as a dual core, quad core, hexa core, or octa core. The processor (120) can control the operations of the electronic device (101) by executing instructions stored in memory (130). For example, the processor (120) may correspond to a plurality of processors that collectively perform a plurality of operations by dividing them among the processors.

[0086] FIG. 2 is a front perspective view of an electronic device (e.g., mobile electronic device) according to various embodiments of the present disclosure.

[0087] FIG. 3 is a perspective view of the rear of the electronic device of FIG. 2 according to various embodiments of the present disclosure.

[0088] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (210) comprising a first surface (or front) (210A), a second surface (or rear) (210B), and a side (210C) surrounding the space between the first surface (210A) and the second surface (210B). In another embodiment, the housing (210) may refer to a structure forming some of the first surface (210A), the second surface (210B), and the side (210C) of FIG. 1.

[0089] An electronic device (101) according to one embodiment of the present disclosure (e.g., the electronic device (101) of FIG. 1) may include a display (201), a display driver IC (e.g., the display driver IC (430) of FIG. 4), a touch circuit (e.g., the touch circuit (450) of FIG. 4), a digitizer (460) (e.g., the digitizer (460) of FIG. 4), and a digitizer driver (e.g., the digitizer driver (470) of FIG. 4). For example, an electronic pen (300) (e.g., a stylus pen) may be housed inside the electronic device (101) or may be configured as a separate device outside.

[0090] According to one embodiment, the first surface (210A) may be formed by a front plate (202) in which at least a portion is substantially transparent (e.g., a glass plate containing various coating layers, or a polymer plate). The second surface (210B) may be formed by a rear plate (211) that is substantially opaque. The rear plate (211) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. The side (210C) may be formed by a side bezel structure (218) (or "side member") comprising metal and / or polymer, which is combined with the front plate (202) and the rear plate (211). In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0091] In an embodiment, the front plate (202) may include a first region (210D) that is curved from the first surface (210A) toward the rear plate (211) and extends seamlessly at both ends of the long edge of the front plate (202).

[0092] In an embodiment, the rear plate (211) may include a second region (210E) that is curved from the second surface (210B) toward the front plate (202) and extends seamlessly at both ends of the long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) may not include the first region and the second region, but may include only a flat plane positioned parallel to the second surface (210B).

[0093] In the embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E) as described above, and may have a second thickness that is thinner than the first thickness on the side that includes the first region (210D) or the second region (210E).

[0094] According to one embodiment, the electronic device (101) may include at least one of a display (201) (e.g., the display module (160) of FIG. 1), an input device (203) (e.g., the input module (150) of FIG. 1), an audio output device (207, 214) (e.g., the audio output module (155) of FIG. 1), a sensor module (204, 219) (e.g., the sensor module (176) of FIG. 1), a camera module (205, 212) (e.g., the camera module (180) of FIG. 1), a key input device (217), an indicator, and a connector (208). In some embodiments, the electronic device (101) may omit at least one of the components (e.g., the key input device (217), or the indicator) or additionally include other components.

[0095] According to one embodiment, the display (201) may be exposed through the upper portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202) forming a first area (210D) of the first surface (210A) and side (210C). The display (201) may be combined with or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer for detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor module (204, 219) and / or at least a portion of the key input device (217) may be placed in the first area (210D) and / or the second area (210E).

[0096] According to one embodiment, the input device (203) may include a microphone (203). In some embodiments, the input device (203) may include a plurality of microphones (203) arranged to detect the direction of sound.

[0097] According to one embodiment, the acoustic output device (207, 214) may include speakers (207, 214). The speakers (207, 214) may include an external speaker (207) and a receiver (214) for communication. In some embodiments, the microphone (203), speakers (207, 214), and connector (208) may be placed in at least part of the internal space of the electronic device (101) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used in common for the microphone (203) and the speakers (207, 214). In some embodiments, the acoustic output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates with the hole formed in the housing (210) excluded.

[0098] According to one embodiment, the sensor module (204, 219) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., proximity sensor) and / or a second sensor module (e.g., fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210) (e.g., home key button), a portion of the second surface (210B), and / or below the display (201).

[0099] According to one embodiment, the electronic device (101) may further include at least one sensor module not illustrated, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illuminance sensor.

[0100] According to one embodiment, the camera module (205, 212) may include a first camera module (205) disposed on a first surface (210A) of the electronic device (101), a second camera module (212) disposed on a second surface (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle lenses, ultra-wide-angle lenses, or telephoto lenses) and image sensors may be disposed on one surface of the electronic device (101).

[0101] According to one embodiment, the key input device (217) may be placed on the side (210C) of the housing (210). In another embodiment, the electronic device (101) may not include some or all of the mentioned key input devices (217), and the key input device (217) not included may be implemented in other forms, such as soft keys, on the display (201). In another embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0102] According to one embodiment, an indicator may be disposed on a first surface (210A) of a housing (210). The indicator may, for example, provide status information of an electronic device (101) in the form of light (e.g., a light-emitting element). In another embodiment, the light-emitting element may, for example, provide a light source that is coupled with the operation of a camera module (205). The indicator may include, for example, an LED, an IR LED, and / or a xenon lamp.

[0103] According to one embodiment, the connector hole (208) may include a first connector hole (208) capable of receiving a connector (e.g., a USB (universal serial bus) connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device.

[0104] According to one embodiment, some camera modules (205) among the camera modules (205, 212), some sensor modules (204) among the sensor modules (204, 219), or an indicator may be positioned to be exposed through the display (201). For example, the camera module (205), the sensor module (204), or the indicator may be positioned in the internal space of the electronic device (101) to come into contact with the external environment through a through hole perforated to the front plate (202) of the display (201). In another embodiment, some sensor modules (204) may be positioned to perform their function without being visually exposed through the front plate (202) in the internal space of the electronic device. For example, the area of ​​the display (201) facing the sensor module may not require a through hole.

[0105] According to one embodiment, the display (201) may be combined with a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer (e.g., the digitizer (460) of FIG. 2 and FIG. 4) that detects a magnetic field electronic pen (300) (e.g., a stylus pen). For example, the display (201) may be combined with or placed adjacent to the digitizer (460) that detects a magnetic field electronic pen (300) (e.g., a stylus pen).

[0106] According to one embodiment, an electronic pen (300) (e.g., a stylus pen) may be housed in the internal space of an electronic device (101). An electronic pen (300) may be inserted and positioned on one side of the space of the electronic device (101). The electronic pen (300) may be inserted (e.g., inserted) or removed (e.g., withdrawn) through a pen hole (not shown) formed on the side of the electronic device (101). When in use, the electronic pen (300) (e.g., a stylus pen) may be removed (e.g., withdrawn) from the inside to the outside of the electronic device (101). When not in use, the electronic pen (300) (e.g., a stylus pen) may be inserted (e.g., inserted) into the inside of the electronic device (101).

[0107] According to one embodiment, an electronic pen (300) (e.g., a stylus pen) may be attached to one side (e.g., the front, back, or side) of an electronic device (101) by magnetic force.

[0108] According to one embodiment, the electronic device (101) may include a processor (e.g., the processor (120) of FIG. 1).

[0109] According to one embodiment, a processor (120) (e.g., a processing circuit) may be implemented as one or more IC (integrated circuit (or circuitry)) chips and may perform various data processing operations. The processor (120) may include at least one electrical circuit and may process instructions (or programs, data) stored in memory (e.g., memory (130) of FIG. 1) individually or collectively in a distributed manner. The processor (120) may include a processor assembly comprising one or more processing circuits. The processor (120) may include any processing circuit that is operative to control the performance and operations of one or more components of the electronic device (101) (e.g., memory (130), display module (e.g., display module (160) of FIG. 1), sensor module (e.g., sensor module (176) of FIG. 1 or sensor), camera module (180) (e.g., camera module (180) of FIG. 1, camera module (180) of FIG. 4, image sensor) and / or communication module (e.g., camera module (190) of FIG. 1, communication circuit)).

[0110] For example, a processor (120) (e.g., an application processor (AP)) may be implemented as a system on chip (SoC) (e.g., a single chip or a chipset). For example, the processor (120) may be implemented as a plurality of cores (or at least one core circuit), a plurality of chips, or a plurality of chipsets. For example, the processor (120) may include one or more processing circuits. For example, the processor (120) may include one or more processing circuits configured to perform the various functions of the present disclosure individually and / or collectively. As an example without limitation, at least a portion of the processor (120) may be included in a first chip of the electronic device (101), and at least another portion of the processor (120) may be included in a second chip of the electronic device (101) different from the first chip of the electronic device (101).

[0111] According to one embodiment, the number of processors (120) may be one or more. For example, the processor (120) may have the structure of a multi-core processor such as a dual core, quad core, hexa core, or octa core. The processor (120) can control the operations of the electronic device (101) by executing instructions stored in memory (130). For example, the processor (120) may correspond to a plurality of processors that collectively perform a plurality of operations by dividing them among the processors.

[0112] FIG. 4 is a block diagram illustrating the configuration of an electronic device according to one embodiment of the present disclosure.

[0113] Referring to FIG. 4, an electronic device (400) according to one embodiment of the present disclosure may include a processor (120) (e.g., processor (120) of FIG. 1), a memory (130) (e.g., memory (130) of FIG. 1), a sensor module (510) (e.g., sensor module (176) of FIG. 1), a camera module (520) (e.g., camera module (180) of FIG. 1), a digitizer (460), a digitizer driver (470), and a display module (160) (e.g., display module (160) of FIG. 1).

[0114] In one embodiment, the memory (130) (e.g., the memory (130) of FIG. 1) may include one or more of HBM (high bandwidth memory), DRAM (dynamic random access memory), SRAM (static random access memory), PRAM (phase-change random access memory), MRAM (magnetic random access memory), RRAM (resistive random access memory), flash memory, and / or EEPROM (electrically erasable programmable read-only memory).

[0115] According to one embodiment, a display module (160) (e.g., the display module (160) of FIG. 1) may include a display (410), a display driver IC (hereinafter referred to as 'DDIC') (430) (e.g., a display driver unit) for driving the display (410), a touch circuit (450), and a digitizer (460). For example, all or part of a sensor module (176) may be included in the display module (160).

[0116] According to one embodiment, the DDIC (430) may include an interface module (431) (e.g., an interface circuit), a memory (433) (e.g., a buffer memory), an image processing module (435) (e.g., an image processing circuit), or a mapping module (437) (e.g., a mapping circuit).

[0117] According to one embodiment, the DDIC (430) can receive image information including image data or an image control signal corresponding to a command for controlling the image data from another component of an electronic device (e.g., the electronic device (101) of FIG. 1, the electronic device (101) of FIG. 2 and FIG. 3) through an interface module (431).

[0118] According to one embodiment, image information may be received from a processor (120) (e.g., the processor (120) of FIG. 1) (e.g., the main processor (121) of FIG. 1) (e.g., an application processor) or an auxiliary processor (e.g., the auxiliary processor (123) of FIG. 1) that operates independently of the functions of the main processor (121) (e.g., a graphics processing unit).

[0119] According to one embodiment, the DDIC (430) can communicate with the touch circuit (450) or sensor module (176) through the interface module (431). Additionally, the DDIC (430) can store at least some of the received image information in the memory (433). As an example, the DDIC (430) can store at least some of the received image information in the memory (433) in frame units.

[0120] According to one embodiment, the image processing module (435) can perform preprocessing or postprocessing (e.g., resolution, brightness, or size adjustment) on at least a portion of the image data based on at least the characteristics of the image data or the characteristics of the display (410).

[0121] According to one embodiment, the mapping module (437) can generate a voltage value or a current value corresponding to the image data that has been preprocessed or postprocessed through the image processing module (435). According to one embodiment, the generation of the voltage value or the current value can be performed, for example, based at least partially on the attributes of the pixels of the display (410) (e.g., an array of pixels (RGB stripe or pentile structure), or the size of each of the subpixels).

[0122] According to one embodiment, at least some pixels of the display (410) are driven, for example, based on at least some of the voltage value or current value, so that visual information (e.g., text, image, or icon) corresponding to the image data can be displayed through the display (410).

[0123] According to one embodiment, the touch circuit (450) may include a touch sensor (451) and a touch sensor IC (integrated circuit) (453) for controlling the touch sensor (451).

[0124] According to one embodiment, a touch sensor IC (453) can control a touch sensor (451) to detect a touch input or hovering input for a specific location on the display (410). For example, the touch sensor IC (453) can detect a touch input or hovering input by measuring a change in a signal (e.g., voltage, light intensity, resistance, or charge) for a specific location on the display (410). The touch sensor IC (453) can provide information regarding the detected touch input or hovering input (e.g., location, area, pressure, or time) to a processor (e.g., processor (120) of FIG. 1).

[0125] According to one embodiment, at least a part of the touch circuit (450) (e.g., touch sensor IC (453)) may be included as part of the DDIC (430) or the display (410).

[0126] According to one embodiment, at least a part of the touch circuit (450) (e.g., touch sensor IC (453)) may be included as part of another component (e.g., auxiliary processor (123)) placed outside the display module (160).

[0127] According to one embodiment, the display module (160) may further include at least one sensor of the sensor module (510) (e.g., fingerprint sensor, iris sensor, pressure sensor, or light sensor) or a control circuit for the sensors. In this case, the at least one sensor or the control circuit for the sensors may be embedded in a part of the display (410), a part of the DDIC (430), or a part of the touch circuit (450).

[0128] For example, if the sensor module (510) embedded in the display module (160) includes a biosensor (e.g., fingerprint sensor), the biosensor can obtain biometric information (e.g., fingerprint image) associated with touch input through a portion of the display (410).

[0129] For example, if the sensor module (510) embedded in the display module (160) includes a pressure sensor, the pressure sensor can obtain pressure information associated with touch input through a part or the entire area of ​​the display (410).

[0130] According to one embodiment, a touch sensor (451) or a sensor module (510) may be placed between pixels of a pixel layer of a display (410), or on top of or below the pixel layer.

[0131] According to one embodiment, the display module (160) may include a digitizer (460) for detecting input (e.g., touch input or hovering input) from an electronic pen (e.g., the electronic pen (300) of FIG. 2, a stylus pen). For example, the digitizer (460) may convert analog coordinates (e.g., position) of the electronic pen (300) (e.g., a stylus pen) into digital coordinate data. The digitizer (460) may transmit the digital coordinate data to a processor (120) and / or a DDI (430).

[0132] According to one embodiment, the processor (120) can control the operation of the digitizer driver (470). The digitizer driver (470) can supply current to the digitizer (460) based on the control of the processor (120). An electromagnetic field (EM) can be generated by supplying current from the digitizer driver (470) to the digitizer (460). The electromagnetic field can be transmitted to an electronic pen (300) (e.g., a stylus pen) to induce a first resonance and generate a first resonance signal.

[0133] For example, if the current supplied to the digitizer (460) is cut off, the primary resonance signal induced in the electronic pen (300) (e.g., stylus pen) may be maintained for a certain period of time and then gradually attenuate. A secondary resonance may be induced in the digitizer (460) by the primary resonance signal that is induced in the electronic pen (300) (e.g., stylus pen) and remains after attenuation, thereby generating a secondary resonance signal. The digitizer driving unit (470) can detect the coordinates (e.g., position) of the electronic pen (300) (e.g., stylus pen) by measuring the current (or voltage) induced by the secondary resonance signal. The digitizer driving unit (470) can provide information regarding the coordinates (e.g., position) of the electronic pen (300) (e.g., stylus pen) to the processor (120).

[0134] For example, a digitizer driver (470) that drives a digitizer (460) may be included as a component of the display module (160). For example, the digitizer driver (470) may be included as a separate component from the display module (160).

[0135] According to one embodiment, an electronic pen (300) (e.g., a stylus pen) may include an AES (active electrostatic solution) method (or, AES active method) and an ECR (electric coupled resonance) method in addition to an EMR method (or EMR passive method).

[0136] According to one embodiment, the processor (120) can acquire digital coordinate data input from the digitizer (460). Based on the digital coordinate data, the processor (120) can detect input (e.g., touch input or hovering input) through the electronic pen (300) (e.g., stylus pen). For example, the digitizer (460) may include a plurality of x-axis channels and a plurality of y-axis channels. The processor (120) can sense the position of the electronic pen (300) (e.g., stylus pen) using sensing signals (e.g., EMR signals) received from the x-axis channels and y-axis channels placed in the digitizer (460). For example, a plurality of x-axis channels and a plurality of y-axis channels may be arranged sequentially in the digitizer (460), and the processor (120) may sense the position of an electronic pen (300) (e.g., a stylus pen) using sensing signals (e.g., EMR signals) received from three consecutive channels (e.g., three adjacent channels).

[0137] According to one embodiment, the digitizer (460) may not be visible from the outside by means of the display (410), electronic components, and mechanisms.

[0138] For example, the digitizer (460) may be placed integrally with the flat display (410) or placed adjacent to the flat display (410). For example, when the digitizer (460) is applied to the flat display (410), the digitizer (460) may include an electromagnetic resonance (EMR) sheet (or EMR film). A plurality of x-axis channels and a plurality of y-axis channels for detecting the position of the electronic pen (300) may be placed on the EMR sheet.

[0139] For example, the digitizer (460) may be placed integrally with the flexible display or foldable display, or placed adjacent to the flexible display or foldable display. For example, the digitizer (460) may be placed at the bottom (e.g., the lower side) of the display (410) (e.g., the display (201) of FIGS. 2 and 3) in the z-axis direction (e.g., the z-axis direction of FIGS. 2 and FIGS. 3).

[0140] For example, when a digitizer (460) is applied to a flexible display or a foldable display, the digitizer (460) may include a plurality of EMR (electromagnetic resonance) sheets (or EMR films). A plurality of x-axis channels and a plurality of y-axis channels for detecting the position of an electronic pen (300) may be arranged in the plurality of EMR sheets.

[0141] FIG. 5 is a drawing showing the front of an electronic device (e.g., a tablet PC) according to one embodiment of the present disclosure.

[0142] FIG. 6 is a drawing showing the rear and side of an electronic device (e.g., a tablet PC) according to one embodiment of the present disclosure.

[0143] FIG. 7 is a drawing showing a speaker unit placed inside an electronic device (e.g., a tablet PC) according to one embodiment of the present disclosure.

[0144] Referring to FIGS. 5 through 7, an electronic device (500) (e.g., tablet PC) according to one embodiment of the present disclosure may include a housing (570) and electronic components. According to one embodiment, at least one sensor module (510) (e.g., sensor module (176) of FIG. 1), at least one camera module (520) (e.g., camera module (180) of FIG. 1), a display (560), and a plurality of speaker units (540) may be disposed in an internal space formed by the housing (570) (e.g., frame). The electronic device (500) according to one embodiment of the present disclosure may be disposed such that the display (560) is visible to the outside when viewed from the front.

[0145] According to one embodiment, the electronic device (500) may include a plurality of speaker units (540) to output high-quality sound.

[0146] For example, the electronic device (500) includes a plurality of speaker enclosures (550), and a speaker unit (540) may be disposed in each of the plurality of speaker enclosures (550). The speaker unit (540) may be disposed in at least a part of the speaker enclosure (550). The speaker unit (540) may be coupled with at least a part of the speaker enclosure (550).

[0147] For example, the speaker enclosure (550) may be injection molded from resin, metal, or ceramic powder. However, it is not limited thereto, and the speaker enclosure (550) may be formed by processing a base material (e.g., material) such as resin or metal.

[0148] For example, two speakers may be applied to an electronic device (500) (e.g., a tablet PC). In this case, multiple speaker units (540) may be placed on each of two sides (501, 502) among the four sides (501, 502, 503, 504) of the electronic device (500).

[0149] For example, a first speaker hole (531) may be formed on a first side (501) of an electronic device (500), and a first speaker unit (540) may be placed at the location where the first speaker hole (531) is formed.

[0150] A second speaker hole (532) is formed on a second side (502) opposite to a first side (501) of an electronic device (500), and a second speaker unit may be placed at the location where the second speaker hole (532) is formed.

[0151] Not limited to this, two speakers may be applied to an electronic device (500) (e.g., a tablet PC). In this case, among the four sides (501, 502, 503, 504) of the electronic device (500), a speaker unit (540) may be placed on each of the third side (503) and the fourth side (504).

[0152] Not limited to this, three speakers may be applied to an electronic device (500) (e.g., a tablet PC). In this case, among the four sides (501, 502, 503, 504) of the electronic device (500), a speaker unit (540) may be placed on each of the first side (501), the second side (502), and the third side (503).

[0153] Not limited to this, three speakers may be applied to an electronic device (500) (e.g., a tablet PC). In this case, among the four sides (501, 502, 503, 504) of the electronic device (500), a speaker unit (540) may be placed on each of the first side (501), the second side (502), and the fourth side (504).

[0154] Not limited to this, four speakers may be applied to an electronic device (500) (e.g., a tablet PC). In this case, a speaker unit (540) may be placed on each of the four sides (501, 502, 503, 504) of the electronic device (500).

[0155] The first speaker unit (540) and the second speaker unit may have substantially the same configuration, differing only in their placement. Below, based on the first speaker unit (540), the structure of the speaker unit (540) and the metal plate (e.g., the metal plate (800) of FIG. 8a and FIG. 8b, the metal plate (800) of FIG. 9) placed on the speaker unit (540) as a magnetic shielding material will be described.

[0156] Figure 8a is a drawing showing a cross-section along the line AA' of Figure 7.

[0157] FIG. 8b shows a speaker module according to one embodiment of the present disclosure, which is a drawing showing that a speaker unit and a metal plate are bonded (e.g., attached) by a bonding member (e.g., adhesive member).

[0158] Referring to FIGS. 8a and 8b, a plurality of speaker units (540), a metal plate (800), a digitizer (460), a display (560), and electronic components (not shown) may be arranged in the internal space formed by the housing (570) of the electronic device (500).

[0159] According to one embodiment, a speaker unit (540) may be positioned at the bottom with respect to the z-axis direction. A digitizer (460) may be positioned at the top of the speaker unit (540). A display (560) may be positioned at the top of the digitizer (460).

[0160] Magnetic fields generated by electronic devices (e.g., smartphones, tablet PCs, laptop PCs) can affect the operation of electronic pens (e.g., the electronic pen (300) of FIGS. 2 and 3, stylus pen).

[0161] The electronic device (500) requires magnetic shielding for stable operation of the digitizer (460) and the electronic pen (300). The electronic device (500) includes magnetic components (e.g., center magnetic component, side magnetic component) for the operation of the speaker unit (540), and may include a metal plate (800) as a magnetic field absorber to shield the magnetic field.

[0162] For example, the metal plate (800) may include cold-rolled commercial steel plate (SPCC: Steel Plate Cold Rolled Commercial).

[0163] According to one embodiment, a metal plate (800) may be positioned to cover the upper surface (e.g., digitizer direction) of the speaker unit (540) with respect to the z-axis direction.

[0164] According to one embodiment, a bonding member (900) (e.g., an adhesive member) may be disposed between the speaker unit (540) and the metal plate (800). The metal plate (800) may be bonded (e.g., adhered) to the upper surface of the speaker unit (540) by the bonding member (900) (e.g., an adhesive member).

[0165] FIG. 9a is a drawing showing a speaker unit according to one embodiment of the present disclosure.

[0166] FIG. 9b is a drawing showing a metal plate that is bonded (e.g. attached) to a speaker unit.

[0167] Referring to FIGS. 8a, 8b, 9a, and 9b, according to one embodiment, a speaker unit (540) may include a yoke (541), a first magnetic component (542) (e.g., a center magnetic component), and a second magnetic component (543) (e.g., a side magnetic component), a center plate (544), a suspension (545), a frame (546, a housing), a coil (547), a center dome (548), and an edge dome (549).

[0168] For example, a first magnetic component (542) (e.g., center magnetic component) and a second magnetic component (543) (e.g., side magnetic component) may be placed in a yoke (541). For example, the first magnetic component (542) (e.g., center magnetic component) may be placed in the center. The second magnetic component (543) (e.g., side magnetic component) may be placed on the outer edge of the first magnetic component (542) (e.g., center magnetic component). The yoke (541) may be placed to shield leakage magnetic force generated from the first magnetic component (542) (e.g., center magnetic component) and the second magnetic component (543) (e.g., side magnetic component).

[0169] For example, based on the front view where the lower surface of the electronic device (500) is displayed, a yoke (541) may be positioned adjacent to a digitizer (460) and a display (560).

[0170] For example, based on the front view where the lower surface of the electronic device (500) is displayed, a center dome (548) and an edge dome (549) may be positioned adjacent to the lower surface of the housing (570).

[0171] The electronic pen (e.g., the electronic pen (300) and stylus pen of FIG. 2 and FIG. 3) and the digitizer (460) used in electronic devices (e.g., smartphones, tablet PCs, laptop PCs) operate through electromagnetic force sensing, but since leakage magnetic force generated from the speaker unit (540) can cause the electronic pen (300) to malfunction, the leakage magnetic force must be shielded. When the electronic pen (300) and the digitizer (460) are in operation, if leakage magnetic force is generated from the speaker unit (540), it can interfere with communication between the electronic pen (300) and the digitizer (460). The closer the distance between the digitizer (460) and the speaker unit (540), the greater the impact caused by leakage magnetic force.

[0172] For example, a coil (547) may be placed between a first magnetic component (542) (e.g., a center magnetic component) and a second magnetic component (543) (e.g., a side magnetic component). When current is passed through the coil (547), the coil (547) moves and a sound is produced. At this time, the magnetic field is not formed only between the first magnetic component (542) (e.g., a center magnetic component) and the second magnetic component (543) (e.g., a side magnetic component), but magnetic force may also leak to the surroundings. To shield the leaked magnetic force, a metal plate (800) may be placed to cover the upper surface of the yoke (541).

[0173] According to one embodiment, the magnetic shielding material (600) of the comparative example and the metal plate (800) of the present disclosure are described in comparison.

[0174] For example, the magnetic shielding material (600) of the comparative example may have different magnetic shielding performance in the central part (601) and the side part (602). The leakage magnetic force generated in the central part where the first magnetic component (542) (e.g., center magnetic component) is located may be relatively small, and the leakage magnetic force in the side part may be relatively large. This is because, in order to reduce the leakage magnetic force of the first magnetic component (542) (e.g., center magnetic component), the leakage magnetic force in the side part (602) may be relatively increased by removing the central part of the first magnetic component (542) (e.g., center magnetic component).

[0175] For example, the metal plate (800) of the present disclosure has a plurality of slits (810) (e.g., thin patterns) formed at a position corresponding to the first magnetic component (542) (e.g., center magnetic component) to shield leakage magnetic force generated from the first magnetic component (542) (e.g., center magnetic component) and the second magnetic component (543) (e.g., side magnetic component).

[0176] For example, the central portion (601) of the magnetic shielding material (600) of the comparative example may be formed with a thinner thickness than the side portion (602) and may be recessed. Accordingly, the thickness of the central portion (601) of the magnetic shielding material (600) may be formed thinner than that of the side portion (602).

[0177] For example, the thickness of the central portion of the metal plate (800) of the present disclosure can be formed thinly to form a plurality of slits (810). Since the plurality of slits (810) of the metal plate (800) are in a recessed (e.g., groove) shape, the thickness of the plurality of slits (810) may be thinner than the thickness of the peripheral portion.

[0178] For example, the thickness of the metal plate (800) may be about 0.3 to 0.35 mm. The thickness of the plurality of slits (810) may be about 0.02 to 0.05 mm.

[0179] For example, when comparing the magnetic shielding material (600) of the comparative example with the metal plate (800) of the present disclosure, the area of ​​the plurality of slits (810) of the metal plate (800) is reduced compared to the central portion (601) of the magnetic shielding material (600), so the leakage magnetic force can be measured to be lower. For bonding of the metal plate (800), a plurality of slits (810) formed with a thin thickness (e.g., recessed) are required, and shielding performance can be improved by reducing the area of ​​the plurality of slits (810) formed with a thin thickness (e.g., recessed).

[0180] FIG. 10 is a drawing showing a metal plate according to an embodiment of the present disclosure being bonded (e.g., attached) to a speaker unit.

[0181] FIG. 11 is a drawing showing a speaker unit and a metal plate (SPCC) placed in a speaker enclosure.

[0182] FIG. 12 is a drawing showing a protective film being bonded (e.g., attached) to the speaker enclosure of FIG. 11.

[0183] Referring to FIGS. 10 to 12, according to one embodiment, a metal plate (800) may be placed to cover the upper surface of the yoke (541) of the speaker unit (540).

[0184] For example, in order to shield leakage magnetic force generated from a first magnetic component (e.g., the first magnetic component (542) of FIG. 15, the center magnetic component) and a second magnetic component (e.g., the second magnetic component (543) of FIG. 15, the side magnetic component), the metal plate (800) may include a plurality of slits (810) (e.g., thin patterns). For example, a plurality of slits (810) may be formed at a position corresponding to the first magnetic component (542) (e.g., the center magnetic component).

[0185] An example is illustrated in which four (4) slits (810) are formed in a metal plate (800). This is not limited thereto, and the size and number of slits (810) may be changed depending on the size of the speaker unit (540) and the metal plate (800). For example, the slits (810) may be formed as recesses or depressions that do not penetrate the metal plate (800) and are thinner than the surrounding area.

[0186] As shown in FIG. 12, in order to prevent friction and grinding between the metal plate (800) and other electronic components or mechanisms inside the electronic device (e.g., the electronic device (500) of FIG. 5), a protective film (580) may be placed (e.g., attached) on the upper surface of the metal plate (800).

[0187] FIGS. 13a and FIGS. 13b are drawings showing a plurality of slits formed in a metal plate.

[0188] FIG. 14 is a drawing showing the front and rear sides of a metal plate including a plurality of slits.

[0189] FIG. 15 is a drawing showing a speaker unit, including a yoke that shields leakage magnetic force, a first magnetic component (e.g., a center magnetic component), and a second magnetic component (e.g., a side magnetic component).

[0190] Referring to FIGS. 13a through 15, according to one embodiment, a first magnetic component (542) (e.g., a center magnetic component) and a second magnetic component (543) (e.g., a side magnetic component) may be disposed in a yoke (541). For example, the first magnetic component (542) (e.g., a center magnetic component) may be disposed in the center, and the second magnetic component (543) (e.g., a side magnetic component) may be disposed on the outer edge of the first magnetic component (542) (e.g., a center magnetic component). The yoke (541) can primarily shield the leakage magnetic force generated from the first magnetic component (542) (e.g., a center magnetic component) and the second magnetic component (543) (e.g., a side magnetic component).

[0191] According to one embodiment, a metal plate (800) may be placed to cover the upper surface of the yoke (541).

[0192] For example, the metal plate (800) can secondarily shield the leakage magnetic force generated from the first magnetic component (542) (e.g., center magnetic component) and the second magnetic component (543) (e.g., side magnetic component). The metal plate (800) can be positioned as a main shield to shield the leakage magnetic force generated from the first magnetic component (542) (e.g., center magnetic component) and the second magnetic component (543) (e.g., side magnetic component).

[0193] For example, a plurality of slits (810) formed in a metal plate (800) can be arranged in a single row.

[0194] For example, a plurality of slits (810) can be arranged in a single row along the long axis direction of the first magnetic component (542) (e.g., center magnetic component).

[0195] For example, a plurality of slits (810) can be arranged in a single row along the long axis direction of the metal plate (800).

[0196] For example, a plurality of slits (810) may be formed with a first length in the short axis direction of the metal plate (800) and a second length shorter than the first length in the long axis direction of the metal plate (800).

[0197] For example, a plurality of slits (810) may be formed in a rectangular shape that is relatively long in the short axis direction of the metal plate (800) and relatively short in the long axis direction of the metal plate (800).

[0198] Not limited thereto, the plurality of slits (810) may be formed in a square shape with substantially equal lengths in the short axis direction and the long axis direction of the metal plate (800).

[0199] Not limited to this, multiple slits (810) may be formed in a circular or elliptical shape.

[0200] Not limited thereto, some of the plurality of slits (810) may be formed in a rectangular shape, and the remaining parts may include a circular or elliptical shape.

[0201] For example, a bonding area (1501) may be formed in the center of the metal plate (800). By improving the bonding area of ​​the magnetic shielding material of the comparative example (e.g., the magnetic shielding material (600) of FIG. 9b), a plurality of slits (810) are formed in the center of the metal plate (800), thereby improving shielding performance and securing a bonding area.

[0202] Figure 16 is a diagram showing leakage magnetic force occurring in the speaker unit of the comparative example.

[0203] Figure 17 is a diagram showing that an electronic pen and a digitizer operate by mutual magnetic force.

[0204] Referring to FIGS. 15 to 17, when the magnetic shielding material (600) of the comparative example is applied to the speaker unit (610), a leakage magnetic force of about 30 [Gauss] is measured at the central part (1610) of the speaker unit (610).

[0205] For example, a digitizer (1720) may be positioned at the bottom relative to the front of an electronic device (e.g., the electronic device (500) of FIG. 5). A display (1730) may be positioned above the digitizer (1720). A window (1740) may be positioned above the display (1730). A speaker unit (e.g., the speaker unit (540) of FIG. 8a) may be positioned below the digitizer (1720).

[0206] For example, when an electronic pen (1710) (e.g., the electronic pen (300) and stylus pen of FIG. 2 and 3) and a digitizer (1720) are in operation, if a leakage magnetic force is generated from a speaker unit (e.g., the speaker unit (540) of FIG. 8a), it may affect the operation of the electronic pen (1710) and the digitizer (1720). Since the closer the distance between the digitizer (1720) and the speaker unit (540), the greater the effect of the leakage magnetic force, the leakage magnetic force must be shielded.

[0207] Figure 18 is a diagram showing a comparison of the shielding performance of leakage magnetic force according to the thickness of a metal plate (e.g., magnetic shielding material) placed in a speaker unit.

[0208] Referring to FIG. 18, according to one embodiment, the performance of shielding leakage magnetic force generated in the speaker unit (1810) may vary depending on the thickness of the metal plates (1820, 1830, 1830).

[0209] For example, if the thickness of the metal plate (1820) is 0.1 mm (0.1 T), 300 [Gauss] of leakage magnetic force may leak out of the metal plate (1820). In this case, it may affect the operation of the electronic pen (e.g., the electronic pen (1710) of FIG. 17) and the digitizer (e.g., the digitizer (1720) of FIG. 17).

[0210] For example, if the thickness of the metal plate (1830) is 0.2 mm (0.2 T), 150 [Gauss] of leakage magnetic force may leak out of the metal plate (1830). In this case, it may affect the operation of the electronic pen (e.g., the electronic pen (1710) of FIG. 17) and the digitizer (e.g., the digitizer (1720) of FIG. 17).

[0211] For example, if the thickness of the metal plate (1840) is 0.3 mm (0.23), the leakage magnetic force can be reduced to 60 [Gauss]. In this case, the operation of the electronic pen (e.g., the electronic pen (1710) of FIG. 17) and the digitizer (e.g., the digitizer (1720) of FIG. 17) may not be affected.

[0212] As such, the thicker the metal plate, the better the performance of shielding leakage magnetic force. However, as the thickness of electronic devices gradually decreases and the thickness of speaker units also decreases, there are limitations in forming the metal plate thick enough to sufficiently shield leakage magnetic force.

[0213] FIGS. 19 and 20 are drawings showing that a plurality of slits are formed in a metal plate to correspond to the position where a first magnetic component (e.g., a center magnetic component) of a speaker unit is placed.

[0214] Referring to FIGS. 19 and 20, since there is a limit to increasing the thickness of the metal plate (800), the present invention shields leakage magnetic force by forming a plurality of slits (810) in the metal plate (800). By improving the central portion (601) of the magnetic shielding material (600) shown in FIG. 9b, which is a single shape, the metal plate (800) of the present disclosure may be formed to include a plurality of slits (810). The shielding performance of magnetic force can be improved through the plurality of slits (810).

[0215] For example, a first magnetic component (2020) (e.g., a center magnetic component) may be placed in the center, and a second magnetic component (2030) (e.g., a side magnetic component) may be placed on the outer edge of the first magnetic component (2020) (e.g., a center magnetic component).

[0216] For example, to reduce leakage magnetic force in the first magnetic component (2020) (e.g., center magnetic component), the central part (2021) of the first magnetic component (2020) (e.g., center magnetic component) may form an empty space by removing the magnet.

[0217] For example, a plurality of slits (810) may be formed in the metal plate (800) to correspond to the position where the first magnetic component (2020) (e.g., center magnetic component) is placed.

[0218] For example, leakage magnetic force generated from the first magnetic component (2020) (e.g., center magnetic component) and the second magnetic component (2030) (e.g., side magnetic component) can move into the interior of the metal plate (800) and be magnetized. Only magnetic force exceeding the magnetic saturation level of the metal plate (800) can be leaked to the outside of the metal plate (800). In this way, the magnetic force leaking to the outside can be shielded by the metal plate (800) including a plurality of slits (810). Among the total area of ​​the metal plate (800), the area corresponding to the location of the first magnetic component (2020) (e.g., center magnetic component) can be divided into four parts to form a plurality of slits (810). By forming four slits (810) in the metal plate (800), the leakage magnetic force can be shielded while securing a bonding (e.g., adhesive) area with the speaker unit.

[0219] For example, the performance of shielding the leakage magnetic force of a speaker unit may vary depending on the size (e.g., area) of a plurality of slits (810) formed in a metal plate (800). In the present disclosure, experiments were conducted on the shielding performance of the leakage magnetic force according to the size (e.g., area) of a plurality of slits (810) to determine the size (e.g., area) of the plurality of slits (810).

[0220] FIG. 21 is a diagram showing the mutual inductance between a first antenna (e.g., a transmitting antenna) and a second antenna (e.g., a receiving antenna) in free space.

[0221] FIG. 22 is a diagram showing the mutual inductance between the first antenna (e.g., transmitting antenna) and the second antenna (e.g., receiving antenna) when a conductive plate is placed between them.

[0222] Referring to FIGS. 21 and 22, the case was set based on communication in a free space where there is no magnetic shielding between the first antenna (2110) (e.g., transmitting antenna) and the second antenna (2120) (e.g., receiving antenna).

[0223] For example, when a shielding material (2130) is positioned between a first antenna (2110) (e.g., a transmitting antenna) and a second antenna (2120) (e.g., a receiving antenna), the magnetic field shielding effect may vary depending on the size of the opening formed in the shielding material (2130). It can be observed that as the size of the opening formed in the shielding material (2130) decreases, the SE (Shielding Effect) value representing the shielding effect increases significantly.

[0224] In this experiment, to analyze the magnetic field shielding effect of a shielding material (2130) (e.g., an infinite planar conductor plate) having an aperture, the height of the first antenna (2110) (e.g., a transmitting antenna) and the second antenna (2120) (e.g., a receiving antenna) and the height of the center of the aperture were set to be the same (z=0). Additionally, the center point of the aperture was assumed to be located at the origin.

[0225] In addition, the center point coordinates (xs, ys) of the first antenna (2110) (e.g., transmitting antenna), the center point coordinates (xo, yo) of the second antenna (2120) (e.g., receiving antenna), the antenna size (d), and the aperture size (L) were set as parameters. At this time, the shielding effect was represented by the mutual inductance values ​​in two situations.

[0226]

[0227] (a) shows the situation when a free space and (b) a shielding material (2130) (e.g., an infinite planar conductor plate) including an opening are placed between them, and the shielding effect was verified by the ratio of the respective mutual inductance values.

[0228] Mutual inductance is a value representing the correlation between electric and magnetic fields, and in Equation 1 above, the ratio of mutual inductance can be considered as the ratio of magnetic fields.

[0229] FIGS. 23 and 24 are drawings showing a comparison of the degree of magnetic field shielding according to the size (e.g., area) of the opening formed in the conductor plate.

[0230] Referring to FIGS. 21 to 24, the shielding performance of leakage magnetic force was compared according to the size (L) of the opening formed in the shielding material (2130) with respect to a reference state (2310) in which there is no shielding material (2130) between the first antenna (2110) (e.g., transmitting antenna) and the second antenna (2120) (e.g., receiving antenna).

[0231] For example, when measuring the leakage magnetic force in a state (2320) where the size (L) of the opening of the shielding material (2130) is 1.8, it can be confirmed that the shielding performance of the leakage magnetic force is improved compared to the reference state (2310) without the shielding material (2130).

[0232] For example, when measuring the leakage magnetic force in a state (2330) where the size (L) of the opening of the shielding material (2130) is 1.2, it can be confirmed that the shielding performance of the leakage magnetic force is improved compared to a state (2320) where the size (L) of the opening of the shielding material (2130) is 1.8.

[0233] For example, when measuring the leakage magnetic force in a state (2340) where the size (L) of the opening of the shielding material (2130) is 0.6, it can be confirmed that the shielding performance of the leakage magnetic force is improved compared to a state (2330) where the size (L) of the opening of the shielding material (2130) is 1.2.

[0234] In this way, it can be confirmed that the shielding performance of leakage magnetic force improves as the size (L) of the opening of the shielding material (2130) decreases.

[0235] FIG. 25 is a diagram showing the mutual inductance Ms according to the size of the slit formed in the metal plate (e.g., the size of the opening of the conductor plate) and the mutual inductance Mi in free space set to a constant value (e.g., 100).

[0236] Referring to Table 1 and FIG. 25, assuming that the mutual inductance Mi in free space has a constant value of 100, it can be seen that the mutual inductance Ms of the space having an opening in the shielding surface that determines the value of SE, which is the shielding effect, increases non-linearly even though the size of the opening increases linearly as shown below. Therefore, it can be confirmed that the shielding effect improves non-linearly as the size of the opening of the shielding material (2130) decreases.

[0237]

[0238] FIG. 26 is a drawing showing a comparison of the leakage magnetic force generated when a metal plate of a comparative example is applied to a speaker unit and when a metal plate of the present disclosure is applied to a speaker unit.

[0239] Referring to FIG. 26, the shielding performance of leakage magnetic force was compared between the case where a metal plate of the comparative example was applied to the speaker unit (2610) and the case where a metal plate of the present disclosure (800) was applied (2620).

[0240] For example, when the metal plate of the comparative example was applied (2610), a leakage magnetic force of about 30 [Gauss] was measured based on the center of the metal plate.

[0241] For example, when the metal plate (800) of the present disclosure is applied (2620), a leakage magnetic force of about 5 [Gauss] is measured with respect to the center of the metal plate.

[0242] Through this, applying a metal plate (800) containing multiple slits (810) to a speaker unit improves the shielding performance of leakage magnetic force.

[0243] For example, it may be more advantageous to divide and form multiple slits (810) based on the long axis direction rather than dividing and forming multiple slits (810) based on the short axis direction. This allows for the division of more slits (810), and as the area in which the slits (810) are divided increases, the shielding performance of the leakage magnetic force can also be improved, thus allowing multiple slits (810) to be divided based on the long axis direction.

[0244] According to one embodiment, a bonding area (e.g., the bonding area (1501) of FIG. 15) can be formed in the center of the metal plate (800). For example, a plurality of slits (810) may be filled with a bonding member (e.g., the bonding member (900) of FIG. 8a and FIG. 8b, an adhesive member) to bond (e.g., combine) the speaker unit and the metal plate (800).

[0245] For example, if a bonding member (900) (e.g., adhesive member) leaks out of the metal plate (800), it may affect the operation of other electronic components and may cause a joint to occur due to contact with other mechanical parts. In the present disclosure, the bonding member (900) (e.g., adhesive member) is placed in the center of the metal plate (800) to prevent the bonding member (900) (e.g., adhesive member) from leaking out of the metal plate (800).

[0246] FIGS. 27a and FIGS. 27b are drawings showing a metal plate with multiple slits formed thereon placed in a speaker unit of a dual magnetic component structure.

[0247] Referring to FIG. 27a and FIG. 27b, a speaker unit (2700) according to one embodiment of the present disclosure may include a first magnetic component (2710), a second magnetic component (2720), a third magnetic component (2730), a speaker housing (2740), and a metal plate (2750) including a plurality of slits (2760).

[0248] According to one embodiment, a first magnetic component (2710) may be placed in the center of the speaker housing (2740). A second magnetic component (2720) may be placed on the outer edge of the first magnetic component (2710). A third magnetic component (2730) may be placed between the first magnetic component (2710) and the second magnetic component (2720).

[0249] For example, a first coil may be placed in the space between the first magnetic component (2710) and the second magnetic component (2720).

[0250] For example, a second coil may be placed in the space between the second magnetic component (2720) and the third magnetic component (2730).

[0251] In addition, a flexible circuit board (FPCB) may be placed in the internal space of the speaker housing (2740).

[0252] According to one embodiment, a metal plate (2750) may be placed on the upper part of a speaker unit (2700). The metal plate (2750) may include a plurality of slits (2760).

[0253] For example, a plurality of slits (2760) may be formed at positions corresponding to the third magnetic component (2730).

[0254] For example, multiple slits (2760) can be arranged in multiple rows (e.g., two rows).

[0255] For example, the plurality of slits (2760) may include first slits (2761) arranged on the first side in the short axis direction of the third magnetic component (2730), and second slits (2762) arranged on the second side in the short axis direction of the third magnetic component (2730).

[0256] Not limited thereto, first slits (2761) may be disposed on the first side in the long axis direction of the third magnetic component (2730). Second slits (2762) may be disposed on the second side in the long axis direction of the third magnetic component (2730).

[0257] For example, the plurality of slits (2760) may include first slits (2761) arranged on the first side in the short axis direction of the metal plate (2750), and second slits (2762) arranged on the second side in the short axis direction of the metal plate (2750).

[0258] Not limited thereto, first slits (2761) may be disposed on the first side in the direction of the long axis of the metal plate (2750). Second slits (2762) may be disposed on the second side in the direction of the long axis of the metal plate (2750).

[0259] For example, a plurality of slits (2760) may be formed in a rectangular shape that is relatively long in the direction of the major axis of the metal plate (2750) and relatively short in the direction of the minor axis of the metal plate (2750).

[0260] For example, a plurality of slits (2760) can be formed in a square shape with equal lengths in the short axis direction and the long axis direction of the metal plate (2750).

[0261] For example, the plurality of slits (2760) may include a circular or elliptical shape.

[0262] For example, a plurality of slits (2760) may be filled with a bonding member (e.g., a bonding member (900) of FIG. 8a and FIG. 8b, an adhesive member) to bond (e.g., join) the speaker unit (2700) and the metal plate (2750).

[0263] The magnetic force generated from the magnetic component moves into the interior of the shielding material, a metal plate (e.g., cold-rolled commercial steel plate, SPCC: Steel Plate Cold Rolled Commercial), and magnetizes it. Only the magnetic force exceeding the magnetic saturation level of the metal plate (SPCC) can move outside the metal plate (SPCC). Through this, the magnetic force leaking outward is reduced as the shielding material becomes magnetized, and the magnetic force can be shielded.

[0264] A metal plate (e.g., magnetic shielding material) according to one embodiment of the present disclosure can be applied to a smartphone, tablet PC (personal computer), or laptop PC in which a slim-type speaker unit is applied.

[0265] An electronic device (500) according to an embodiment of the present disclosure may include a speaker unit (540), a display (560), a digitizer (460) disposed below the display (560), and a metal plate (800) located between the digitizer (460) and the speaker unit (540). The speaker unit (540) may include a speaker housing, a first magnetic component (2020, 2710) disposed inside the speaker housing, a second magnetic component (2030, 2720), and a coil (547) disposed between the first magnetic component (2020, 2710) and the second magnetic component (2030, 2720). The first magnetic component (2020, 2710) may be disposed in the central part of the speaker housing. The second magnetic component (2030, 2720) may be placed on the outer edge of the first magnetic component (2020, 2710). The metal plate (800) may be placed on the upper part of the speaker housing. The metal plate (800) may include a plurality of slits (810).

[0266] According to one embodiment, the plurality of slits (810) may be formed at positions corresponding to the first magnetic component (2020, 2710).

[0267] According to one embodiment, the plurality of slits (810) can be arranged in a single row.

[0268] According to one embodiment, the plurality of slits (810) may be arranged along the long axis direction of the first magnetic component (2020, 2710).

[0269] According to one embodiment, the plurality of slits (810) may be arranged along the long axis direction of the metal plate (800).

[0270] According to one embodiment, the plurality of slits (810) may be formed with a first length in the short axis direction of the metal plate (800) and a second length shorter than the first length in the long axis direction of the metal plate (800).

[0271] According to one embodiment, the plurality of slits (810) may be formed in a rectangular shape that is relatively long in the short axis direction of the metal plate (800) and relatively short in the long axis direction of the metal plate (800).

[0272] According to one embodiment, the plurality of slits (810) may be formed in a square shape with equal lengths in the short axis direction and the long axis direction of the metal plate (800).

[0273] According to one embodiment, the plurality of slits (810) may be formed in a circular or elliptical shape.

[0274] According to one embodiment, the speaker unit (540) may include a yoke (541) that shields the leakage magnetic force of the first magnetic component (2020, 2710) and the second magnetic component (2030, 2720). The metal plate (800) may be positioned to overlap with the yoke (541).

[0275] According to one embodiment, a third magnetic component (2730) may be further included between the first magnetic component (2710) and the second magnetic component (2720). The plurality of slits (2760) may be formed at positions corresponding to the third magnetic component (2730).

[0276] According to one embodiment, the plurality of slits (2760) may be arranged in a plurality of rows.

[0277] According to one embodiment, the plurality of slits (2760) may include first slits (2761) arranged on the first side in the short axis direction of the third magnetic component (2730), and second slits (2762) arranged on the second side in the short axis direction of the third magnetic component (2730).

[0278] According to one embodiment, the plurality of slits (2760) may include first slits (2761) arranged on a first side in the long axis direction of the third magnetic component (2730), and second slits (2762) arranged on a second side in the long axis direction of the third magnetic component (2730).

[0279] According to one embodiment, a bonding member is filled in a plurality of slits (2760) so that the speaker unit (540) and the metal plate (800) can be joined.

[0280] A speaker module according to one embodiment of the present disclosure may include a speaker unit (540); and a metal plate (800) disposed on the upper surface of the speaker unit (540).

[0281] The speaker unit (540) may include a speaker housing, a first magnetic component (2020, 2710) and a second magnetic component (2030, 2720) disposed inside the speaker housing, a coil (547) disposed between the first magnetic component (2020, 2710) and the second magnetic component (2030, 2720), and a yoke (541) that shields the leakage magnetic force of the first magnetic component (2020, 2710) and the second magnetic component (2030, 2720). The metal plate (800) may include a plurality of slits (810).

[0282] According to one embodiment, the first magnetic component (2020, 2710) may be positioned in the center of the speaker housing. The second magnetic component (2030, 2720) may be positioned on the outer edge of the first magnetic component (2020, 2710). The metal plate (800) may be positioned on the upper part of the speaker housing.

[0283] According to one embodiment, the plurality of slits (810) may be formed at positions corresponding to the first magnetic component (2020, 2710).

[0284] According to one embodiment, the plurality of slits (810) can be arranged in a single row.

[0285] According to one embodiment, the plurality of slits (810) may be arranged along the long axis direction of the metal plate (800).

[0286] According to one embodiment, a third magnetic component (2730) may be further included between the first magnetic component (2710) and the second magnetic component (2720). The plurality of slits (2760) may be formed at positions corresponding to the third magnetic component (2730). The plurality of slits (2760) may be arranged in a plurality of rows.

[0287] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure pertains from the description below.

[0288] Furthermore, the embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples provided to facilitate the explanation of the technical content according to the embodiments of the present disclosure and to aid in understanding the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Accordingly, the scope of the various embodiments of the present disclosure should be interpreted to include all modifications or variations derived based on the technical concept of the various embodiments of the present disclosure, in addition to the embodiments disclosed herein.

Claims

1. In an electronic device (500), Speaker unit (540); Display (560); A digitizer (460) positioned at the bottom of the above display (560); and It includes a metal plate (800) located between the digitizer (460) and the speaker unit (540), and The speaker unit (540) comprises a speaker housing, a first magnetic component (2020, 2710) disposed inside the speaker housing, a second magnetic component (2030, 2720), and a coil (547) disposed between the first magnetic component (2020, 2710) and the second magnetic component (2030, 2720). The first magnetic component (2020, 2710) is positioned in the center of the speaker housing, and The second magnetic component (2030, 2720) is positioned on the outer edge of the first magnetic component (2020, 2710), and The metal plate (800) is placed on the upper part of the speaker housing, and The metal plate (800) includes a plurality of slits (810). Electronic device (500).

2. In Paragraph 1, The plurality of slits (810) are formed at positions corresponding to the first magnetic component (2020, 2710), Electronic device (500).

3. In Paragraph 2, The above plurality of slits (810) are arranged in a single row, Electronic device (500).

4. In Paragraph 3, The plurality of slits (810) are arranged along the long axis direction of the first magnetic component (2020, 2710), Electronic device (500).

5. In Paragraph 3, The plurality of slits (810) are arranged along the long axis direction of the metal plate (800). Electronic device (500).

6. In Paragraph 5, The plurality of slits (810) are formed with a first length in the short axis direction of the metal plate (800) and a second length shorter than the first length in the long axis direction of the metal plate (800). Electronic device (500).

7. In Paragraph 5, The plurality of slits (810) are formed in a rectangular shape that is relatively long in the short axis direction of the metal plate (800) and relatively short in the long axis direction of the metal plate (800). Electronic device (500).

8. In Paragraph 5, The plurality of slits (810) are formed in a square shape with equal lengths in the short axis direction and the long axis direction of the metal plate (800). Electronic device (500).

9. In Paragraph 5, The plurality of slits (810) are formed in a circular or elliptical shape. Electronic device (500).

10. In Paragraph 1, The above speaker unit (540) is, It includes a yoke (541) that shields the leakage magnetic force of the first magnetic component (2020, 2710) and the second magnetic component (2030, 2720), and The metal plate (800) is positioned to overlap with the yoke (541), Electronic device (500).

11. In Paragraph 1, It further includes a third magnetic component (2730) disposed between the first magnetic component (2710) and the second magnetic component (2720), and The plurality of slits (2760) are formed at positions corresponding to the third magnetic component (2730), Electronic device (500).

12. In Paragraph 11, The above plurality of slits (2760) are arranged in a plurality of rows, Electronic device (500).

13. In Paragraph 12, The above plurality of slits (2760) are, First slits (2761) arranged on the first side in the short axis direction of the third magnetic component (2730); and including second slits (2762) arranged on the second side in the short axis direction of the third magnetic component (2730), Electronic device (500).

14. In Paragraph 12, The above plurality of slits (2760) are, First slits (2761) arranged on the first side in the direction of the major axis of the third magnetic component (2730); and including second slits (2762) arranged on the second side in the direction of the major axis of the third magnetic component (2730), Electronic device (500).

15. In Paragraph 1, A plurality of slits (810) are filled with a bonding material so that the speaker unit (540) and the metal plate (800) are joined. Electronic device (500).

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