Electronic device including structure for protecting display driver IC from static electricity

Abstract

Embodiments of the present disclosure relate to an electronic device including a structure for protecting a display driver IC from static electricity. A display module may comprise a display driver IC (DDI), an FPCB covering the DDI, and a waterproof tape for attaching one end of the FPCB to the extension area of a display panel. The FPCB may comprise: a first cover layer forming a first surface facing the DDI; a second cover layer forming a second surface opposite to the first surface; and at least one metal layer disposed between the first cover layer and the second cover layer. The first cover layer may be disposed adjacent to the DDI and may include at least one first slit through which a portion of the at least one metal layer is exposed.

Description

Electronic device including a structure that protects the display driving circuit from static electricity

[0001] Embodiments of the present disclosure relate to an electronic device comprising a structure that protects a display driving circuit from static electricity.

[0002] A foldable electronic device may include a hinge device and a first housing and a second housing that are movably connected to each other through the hinge device. The foldable electronic device may operate in an in-folding and / or out-folding manner by rotating the first housing relative to the second housing through the hinge device in a range of 0 to 360 degrees. For example, the foldable electronic device may include a flexible display positioned to span the first housing and the second housing while open at 180 degrees.

[0003] A flexible display may include a bendable display panel. The display panel may include a bending portion that extends to one side and is electrically connected (e.g., grounded) to a conductive plate disposed on the back surface of the flexible display, and on which a control circuit is disposed. For example, when the flexible display is placed in a foldable electronic device and the display panel is viewed from above, the bending portion may protrude outward from the edge of the display panel.

[0004] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0005] In a foldable electronic device, static electricity from the outside can enter the interior through the edges of the flexible display. This static electricity does not enter the conductive plate electrically connected to the main ground of the electronic device through the bending part, but instead directly or indirectly affects the display panel and the display driver circuit (e.g., DDI (display driver IC)), thereby causing malfunctions such as blackening of the display panel or short circuits in some data lines.

[0006] According to various embodiments of the present invention, an electronic device including a structure that protects a display driving circuit from static electricity can be provided.

[0007] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art to which this invention belongs from the description below.

[0008] According to one embodiment, an electronic device comprises a display module including a first housing, a second housing foldably coupled to the first housing, and a display panel supported by the first housing and the second housing and configured to be bendable with respect to a folding axis formed by a hinge, wherein the display panel includes a display area forming the front surface of the display module, a bending area extending from one end of the display area and at least a portion of which is bent, and an extension area extending from the bending area to the back surface of the display module, and the display module includes a display driver IC (DDI) disposed on the extension area of ​​the display panel, an FPCB bonded to a portion of the extension area of ​​the display panel and covering the display driver IC as it extends in a first direction of the display module where the bending area is located, and a waterproof tape attaching one end of the FPCB to the extension area of ​​the display panel, wherein the FPCB includes a first cover layer forming a first surface facing the display driver circuit and a second surface opposite to the first surface The device includes a cover layer and at least one metal layer disposed between the first cover layer and the second cover layer, wherein the first cover layer is disposed adjacent to the display driving circuit and may include at least one first slit that exposes a portion of the at least one metal layer.

[0009] According to one embodiment, the electronic device comprises a display module including a first housing, a second housing foldably coupled to the first housing, and a display panel supported by the first housing and the second housing and configured to be bendable with respect to a folding axis formed by a hinge, wherein the display panel includes a display area forming the front surface of the display module, a bending area extending from one end of the display area and at least a portion of which is bent, and an extension area extending from the bending area to the back surface of the display module, and the display module may include a display driver IC (DDI) disposed on the extension area of ​​the display panel, an FPCB bonded to a portion of the extension area of ​​the display panel and covering the display driver IC as it extends in a first direction of the display module where the bending area is located, a waterproof tape attaching one end of the FPCB to the extension area of ​​the display panel, and a conductive member disposed adjacent to the waterproof tape.

[0010] According to one embodiment, the electronic device comprises a display module including a first housing, a second housing foldably coupled to the first housing, and a display panel supported by the first housing and the second housing and configured to be bendable with respect to a folding axis formed by a hinge, wherein the display panel includes a display area forming the front surface of the display module, a bending area extending from one end of the display area and at least a portion of which is bent, and an extension area extending from the bending area to the back surface of the display module, and the display module may include a display driver IC (DDI) disposed on the extension area of ​​the display panel, an FPCB bonded to a portion of the extension area of ​​the display panel and covering the display driver IC as it extends in a first direction of the display module where the bending area is located, a waterproof tape attaching one end of the FPCB to the extension area of ​​the display panel, and a cover member disposed between the FPCB and the display driver IC.

[0011] According to the embodiments of the present disclosure, by protecting the display driving circuit from static electricity, the product lifespan can be extended and malfunctions such as blackening of the display panel or short circuits in some data lines can be reduced.

[0012] In addition, various effects that can be identified directly or indirectly through this document may be provided.

[0013] Other aspects, features, and advantages according to specific embodiments of the present disclosure will become more apparent from the accompanying drawings and description.

[0014] FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment.

[0015] FIGS. 2a and 2b are drawings of the unfolded stage of an electronic device according to various embodiments disclosed in this document, viewed from the front and rear.

[0016] FIGS. 3a and 3b are drawings of the folded state of an electronic device according to various embodiments disclosed in this document, viewed from the front and rear.

[0017] FIG. 4 is an exploded perspective view of an electronic device according to various embodiments disclosed in this document.

[0018] FIG. 5 is an exploded perspective view of a display module according to various embodiments disclosed in this document.

[0019] FIG. 6 is a configuration diagram showing the back side of a display module according to various embodiments of the present invention.

[0020] FIGS. 7 and FIGS. 8 are partial cross-sectional views of an electronic device schematically illustrating the edges of a display module according to a comparative example.

[0021] Figure 9 is a conceptual diagram explaining the wiring structure of an FPCB and the lifting phenomenon of a waterproof tape according to a comparative example.

[0022] FIG. 10 is a conceptual diagram illustrating the wiring structure of an FPCB according to one embodiment designed to reduce the lifting phenomenon of the waterproof tape.

[0023] FIGS. 11 to 13 are configuration diagrams illustrating the back side of a display module according to one embodiment.

[0024] FIGS. 14 to 18 are partial cross-sectional views of an electronic device schematically illustrating the edges of a display module according to one embodiment.

[0025] FIG. 19 is a configuration diagram showing the back side of a display module according to one embodiment that further includes a cover member.

[0026] FIGS. 20 and FIGS. 21 are partial cross-sectional views of an electronic device schematically illustrating the edges of a display module according to one embodiment shown in FIG. 19.

[0027] FIG. 22 is a partial cross-sectional view of an electronic device schematically illustrating the edges of a display module according to a comparative example.

[0028] FIGS. 23 to 25 are partial cross-sectional views of an electronic device schematically illustrating the edges of a display module according to one embodiment.

[0029] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or may communicate with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0030] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0031] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0032] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0033] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0034] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0035] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0036] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0037] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0038] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0039] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0040] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0041] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0042] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0043] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0044] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0045] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0046] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0047] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0048] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0049] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0050] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0051] The electronic device according to the various embodiments disclosed in this disclosure may be a device of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this disclosure is not limited to the devices described above.

[0052] The various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features described in the present disclosure to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In the present disclosure, phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B, or C” each may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0053] The term “module” as used in various embodiments of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0054] Various embodiments of the present disclosure may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0055] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0056] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0057] FIGS. 2a and 2b are drawings of an unfolded stage of an electronic device according to various embodiments of the present disclosure, viewed from the front and rear. FIGS. 3a and 3b are drawings of a folded state of an electronic device according to various embodiments of the present disclosure, viewed from the front and rear.

[0058] Referring to FIGS. 2a through 3b, an electronic device (200) (e.g., electronic device (101) of FIG. 1) may include a pair of housings (210, 220) (e.g., foldable housing structure) that are rotatably coupled about a folding axis (A) through a hinge device (e.g., hinge device (320) of FIG. 4) (e.g., hinge module) so as to be foldable relative to each other, a first display (230) (e.g., flexible display, foldable display, or main display) disposed through the pair of housings (210, 220), and / or a second display (300) (e.g., sub display) disposed through the second housing (220). According to one embodiment, at least a portion of the hinge device (e.g., the hinge device (320) of FIG. 4) may be positioned so as not to be seen from the outside through the first housing (210) and the second housing (220), and in the unfolded state, may be positioned so as not to be seen from the outside through the hinge housing (310) covering the foldable portion. According to one embodiment, the hinge device (320) may include a gear assembly comprising a plurality of gears, a hinge module comprising a plurality of hinge cams that are coupled to hinge shafts rotating through the gear assembly and perform a cam-linking operation, and hinge plates connecting the hinge module to the first housing (210) and the second housing (220). In this document, the surface on which the first display (230) is positioned may be defined as the front surface of the electronic device (200), and the opposite surface of the front surface may be defined as the rear surface of the electronic device (200). In addition, the surface surrounding the space between the front and the rear can be defined as the side of the electronic device (200).

[0059] According to various embodiments, a pair of housings (210, 220) may include a first housing (210) and a second housing (220) that are foldably arranged relative to each other via a hinge device (e.g., the hinge device (320) of FIG. 4). According to one embodiment, the pair of housings (210, 220) are not limited to the shapes and combinations shown in FIG. 2a through 3b and may be implemented by other shapes or combinations and / or combinations of parts. According to one embodiment, the first housing (210) and the second housing (220) may be arranged on both sides with respect to a folding axis (A) and may have a shape that is symmetrical overall with respect to the folding axis (A). According to some embodiments, the first housing (210) and the second housing (220) may be folded asymmetrically with respect to the folding axis (A). According to one embodiment, the angle or distance between the first housing (210) and the second housing (220) may differ depending on whether the electronic device (200) is in an unfolded stage, a folded state, or an intermediate state.

[0060] According to various embodiments, the first housing (210) is connected to a hinge device (e.g., hinge device (320) of FIG. 4) in an unfolded state of the electronic device (200) and may include a first surface (211) positioned to face the front of the electronic device (200), a second surface (212) facing in the opposite direction of the first surface (211), and / or a first side member (213) surrounding at least a portion of a first space between the first surface (211) and the second surface (212). According to one embodiment, the second housing (220) is connected to a hinge device (e.g., hinge device (320) of FIG. 4) in the unfolded state of the electronic device (200) and may include a third surface (221) positioned to face the front of the electronic device (200), a fourth surface (222) facing in the opposite direction of the third surface (221), and / or a second side member (223) surrounding at least a portion of the second space between the third surface (221) and the fourth surface (222). According to one embodiment, the first surface (211) may face substantially the same direction as the third surface (221) in the unfolded state and may be at least partially facing the third surface (221) in the folded state. According to one embodiment, the electronic device (200) may include a recess (201) formed to accommodate a first display (230) through the structural combination of a first housing (210) and a second housing (220). According to one embodiment, the recess (201) may have substantially the same size as the first display (230). According to one embodiment, the first housing (210) may include a first protective frame (213a) (e.g., a first decorative member) which is combined with a first side member (213) when the first display (230) is viewed from above and overlaps with the edge of the first display (230) to cover the edge of the first display (230) so that it is not visible from the outside. According to one embodiment, the first protective frame (213a) may be formed integrally with the first side member (213).According to one embodiment, the second housing (220) may include a second protective frame (223a) (e.g., a second decorative member) which is coupled to the second side member (223) when the first display (230) is viewed from above and overlaps with the edge of the first display (230) to cover the edge of the first display (230) so that it is not visible from the outside. According to one embodiment, the second protective frame (223a) may be formed integrally with the second side member (223). In some embodiments, the first protective frame (213a) and the second protective frame (223a) may be omitted.

[0061] According to various embodiments, a hinge housing (310) (e.g., a hinge cover) may be positioned between a first housing (210) and a second housing (220) and positioned to cover a part (e.g., at least one hinge module) of a hinge device (e.g., the hinge device (320) of FIG. 4) positioned in the hinge housing (310). According to one embodiment, the hinge housing (310) may be covered by a part of the first housing (210) and the second housing (220) or exposed to the outside, depending on the unfolded state, folded state, or intermediate state of the electronic device (200). For example, when the electronic device (200) is in the unfolded state, at least a part of the hinge housing (310) may be covered by the first housing (210) and the second housing (220) and may not be substantially exposed. According to one embodiment, when the electronic device (200) is in a folded state, at least a portion of the hinge housing (310) may be exposed to the outside between the first housing (210) and the second housing (220). According to one embodiment, when the first housing (210) and the second housing (220) are in an intermediate state where they are folded with a certain angle, the hinge housing (310) may be at least partially exposed to the outside of the electronic device (200) between the first housing (210) and the second housing (220). For example, the area of ​​the hinge housing (310) exposed to the outside may be smaller than in a fully folded state. According to one embodiment, the hinge housing (310) may include a curved surface.

[0062] According to various embodiments, when the electronic device (200) is in an unfolded state (e.g., the state of FIG. 2a and FIG. 2b), the first housing (210) and the second housing (220) form an angle of about 180 degrees, and the first area (230a), the second area (230b), and the folding area (230c) of the first display (230) form a coplanar and may be arranged to face substantially the same direction (e.g., z-axis direction). In another embodiment, when the electronic device (200) is in an unfolded state, the first housing (210) may be rotated at an angle of about 360 degrees relative to the second housing (220) and folded in the opposite direction so that the second surface (212) and the fourth surface (222) face each other (out folding method).

[0063] According to various embodiments, when the electronic device (200) is in a folded state (e.g., the state of FIG. 3a and FIG. 3b), the first surface (211) of the first housing (210) and the third surface (221) of the second housing (220) may be positioned to face each other. In this case, the first area (230a) and the second area (230b) of the first display (230) may be positioned to face each other through the folding area (230c), forming a narrow angle (e.g., a range of 0 to about 10 degrees) from each other. According to one embodiment, the folding area (230c) may be deformed into a curved shape having at least a portion of a certain curvature. According to one embodiment, when the electronic device (200) is in an intermediate state, the first housing (210) and the second housing (220) may be positioned at a certain angle from each other. In this case, the first region (230a) and the second region (230b) of the first display (230) may form an angle that is larger than the folded state and smaller than the unfolded state, and the curvature of the folding region (230c) may be smaller than the folded state and larger than the unfolded state. In some embodiments, the first housing (210) and the second housing (220) may form an angle that can stop at a designated folding angle between the folded state and the unfolded state through a hinge device (e.g., the hinge device (320) of FIG. 4) (free stop function). In some embodiments, the first housing (210) and the second housing (220) may be continuously operated while being pressed in the unfolding direction or the folding direction based on a designated inflection angle through a hinge device (e.g., the hinge device (320) of FIG. 4).

[0064] According to various embodiments, the electronic device (200) may include at least one display (230, 300), an input device (215), an audio output device (227, 228), a sensor module (217a, 217b, 226), a camera module (216a, 216b, 225), a key input device (219), an indicator (not shown), or a connector port (229) disposed in the first housing (210) and / or the second housing (220). In some embodiments, the electronic device (200) may omit at least one of the components or additionally include at least one other component.

[0065] According to various embodiments, at least one display (230, 300) may include a first display (230) (e.g., a flexible display module) positioned to be supported by a third surface (221) of a second housing (220) through a hinge device (e.g., a hinge device (320) of FIG. 4) from a first surface (211) of a first housing (210), and a second display (300) positioned to be visible from the outside at least partially through a fourth surface (222) in the internal space of the second housing (220). In some embodiments, the second display (300) may be positioned to be visible from the outside through a second surface (212) in the internal space of the first housing (210). According to one embodiment, the first display (230) may be primarily used in the unfolded state of the electronic device (200), and the second display (300) may be primarily used in the folded state of the electronic device (200). According to one embodiment, in the case of an intermediate state, the electronic device (200) may control the first display (230) and / or the second display (300) to be usable based on the folding angle of the first housing (210) and the second housing (220).

[0066] According to various embodiments, the first display (230) may be placed in a receiving space formed by a pair of housings (210, 220). For example, the first display (230) may be placed in a recess (201) formed by a pair of housings (210, 220) and may be placed to occupy substantially most of the front surface of the electronic device (200) in an unfolded state. According to one embodiment, the first display (230) may include a flexible display module in which at least some area may be deformed into a flat or curved surface. According to one embodiment, the first display (230) may include a first area (230a) facing the first housing (210) and a second area (230b) facing the second housing (220). According to one embodiment, the first display (230) may include a folding area (230c) comprising a portion of the first area (230a) and a portion of the second area (230b) with respect to the folding axis (A). According to one embodiment, at least a portion of the folding area (230c) may include an area corresponding to a hinge device (e.g., hinge device (320) of FIG. 4). According to one embodiment, the area division of the first display (230) is merely an exemplary physical division by a pair of housings (210, 220) and a hinge device (e.g., hinge device (320) of FIG. 4), and substantially, the first display (230) can be displayed as a single, seamless, whole screen through the pair of housings (210, 220) and the hinge device (e.g., hinge device (320) of FIG. 4). According to one embodiment, the first region (230a) and the second region (230b) may have a shape that is symmetrical overall with respect to the folding region (230c) or a shape that is partially asymmetrical.

[0067] According to various embodiments, the electronic device (200) may include a first rear cover (240) disposed on a second side (212) of a first housing (210) and a second rear cover (250) disposed on a fourth side (222) of a second housing (220). In some embodiments, at least a portion of the first rear cover (240) may be formed integrally with the first side member (213). In some embodiments, at least a portion of the second rear cover (250) may be formed integrally with the second side member (223).

[0068] According to various embodiments, the input device (215) may include a microphone. In some embodiments, the input device (215) may include a plurality of microphones arranged to detect the direction of sound. According to one embodiment, the acoustic output device (227, 228) may include speakers. According to one embodiment, the acoustic output device (227, 228) may include a call receiver (227) arranged through the fourth side (222) of the second housing (220) and an external speaker (228) arranged through at least a portion of the second side member (223) of the second housing (220). In some embodiments, the input device (215), the acoustic output device (227, 228), and the connector (229) are disposed in the spaces of the first housing (210) and / or the second housing (220) and may be exposed to the external environment through at least one hole formed in the first housing (210) and / or the second housing (220).

[0069] According to various embodiments, the camera module (216a, 216b, 225) may include a first camera module (216a) disposed on a first surface (211) of a first housing (210), a second camera module (216b) disposed on a second surface (212) of the first housing (210), and / or a third camera module (225) disposed on a fourth surface (222) of a second housing (220). According to one embodiment, the electronic device (200) may include a flash (218) disposed near the second camera module (216b).

[0070] According to various embodiments, the sensor module (217a, 217b, 226) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. According to one embodiment, the sensor module (217a, 217b, 226) may include a first sensor module (217a) disposed on a first surface (211) of a first housing (210), a second sensor module (217b) disposed on a second surface (212) of the first housing (210), and / or a third sensor module (226) disposed on a fourth surface (222) of the second housing (220). In some embodiments, the sensor module (217a, 217b, 226) may include at least one of a gesture sensor, a grip sensor, a color sensor, an IR (infrared) sensor, an ambient light sensor, an ultrasonic sensor, an iris recognition sensor, or a distance detection sensor (e.g., a TOF (time of flight) sensor or a LiDAR (light detection and ranging)).

[0071] According to various embodiments, the key input device (219) may be positioned so as to be exposed to the outside through the first side member (213) of the first housing (210). In some embodiments, the key input device (219) may be positioned so as to be exposed to the outside through the second side member (223) of the second housing (220).

[0072] According to various embodiments, the connector port (229) may include a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device.

[0073] According to various embodiments, at least one camera module (216a, 225) among the camera modules (216a, 216b, 225), at least one sensor module (217a, 226) among the sensor modules (217a, 217b, 226), and / or an indicator may be positioned to be exposed through at least one display (230, 300). For example, at least one camera module (216a, 225), at least one sensor module (217a, 226), and / or an indicator may be positioned in the internal space of at least one housing (210, 220), below the display area of ​​at least one display (230, 300), and may be positioned to come into contact with the external environment through an opening or transparent area perforated to a cover member (e.g., a window layer (not shown) of the first display (230) and / or a second rear cover (250)).

[0074] FIG. 4 is an exploded perspective view of an electronic device (200) according to various embodiments of the present disclosure.

[0075] Referring to FIG. 4, the electronic device (200) may include a first display (230) (e.g., a flexible display module), a second display (300), a hinge device (320), a pair of support members (261, 262), at least one substrate (270) (e.g., a printed circuit board (PCB)), a first housing (210), a second housing (220), a first rear cover (240) and / or a second rear cover (250).

[0076] According to various embodiments, the first display (230) may include a display panel (430) (e.g., a flexible display panel), a support plate (450) placed below the display panel (430), and a pair of reinforcing plates (461, 462) placed below the support plate (450). According to one embodiment, the display panel (430) may include a first panel area (430a) corresponding to a first area of ​​the first display (230) (e.g., the first area (230a) of FIG. 2a), a second panel area (430b) extending from the first panel area (430a) and corresponding to a second area of ​​the first display (230) (e.g., the second area (230b) of FIG. 2a), and a third panel area (430c) connecting the first panel area (430a) and the second panel area (430b) and corresponding to a folding area of ​​the first display (230) (e.g., the folding area (230c) of FIG. 2a). According to one embodiment, the support plate (450) is disposed between the display panel (430) and a pair of support members (261, 262) and may be formed to have a material and shape to provide a planar support structure for the first panel area (430a) and the second panel area (430b) and a bendable structure to aid in flexibility for the third panel area (430c). According to one embodiment, the support plate (450) may be formed of a conductive material (e.g., metal) or a non-conductive material (e.g., polymer or FRP (fiber reinforced plastics)). According to one embodiment, a pair of reinforcing plates (461, 462) may include a first reinforcing plate (461) positioned to correspond to at least a portion of a first panel area (430a) and a third panel area (430c) and a second reinforcing plate (462) positioned to correspond to at least a portion of a second panel area (430b) and a third panel area (430c) between a support plate (450) and a pair of support members (261, 262).According to one embodiment, a pair of reinforcing plates (461, 462) are formed of a metal material (e.g., SUS) to help with ground connection structure and rigidity reinforcement for the first display (230).

[0077] According to various embodiments, the second display (300) may be positioned in the space between the second housing (220) and the second rear cover (250). According to one embodiment, the second display (300) may be positioned in the space between the second housing (220) and the second rear cover (250) so as to be visible from the outside through substantially the entire surface area of ​​the second rear cover (250).

[0078] According to various embodiments, at least a portion of the first support member (261) may be foldably coupled to the second support member (262) through a hinge device (320). According to one embodiment, the electronic device (200) may include at least one wiring member (263) (e.g., a flexible printed circuit board (FPCB)) disposed from at least a portion of the first support member (261) across the hinge device (320) to a portion of the second support member (262). According to one embodiment, the first support member (261) may be disposed in a manner that extends from the first side member (213) or is structurally coupled to the first side member (213). According to one embodiment, the electronic device (200) may include a first space (e.g., the first space (2101) of FIG. 2a) provided through the first support member (261) and the first rear cover (240).

[0079] According to one embodiment, the first housing (210) (e.g., the first housing structure) may be formed by combining a first side member (213), a first support member (261), and a first rear cover (240). According to one embodiment, the second support member (262) may be arranged in such a way that it extends from the second side member (223) or is structurally coupled to the second side member (223). According to one embodiment, the electronic device (200) may include a second space (e.g., the second space (2201) of FIG. 2a) provided through the second support member (262) and the second rear cover (250).

[0080] According to one embodiment, the second housing (220) (e.g., the second housing structure) may be formed by combining a second side member (223), a second support member (262), and a second rear cover (250). According to one embodiment, at least one wiring member (263) and / or at least part of the hinge device (320) may be positioned to be supported by at least part of a pair of support members (261, 262). According to one embodiment, at least one wiring member (263) may be positioned in a direction (e.g., x-axis direction) across the first support member (261) and the second support member (262). According to one embodiment, at least one wiring member (263) may be positioned in a direction (e.g., x-axis direction) substantially perpendicular to the folding axis (e.g., y-axis or the folding axis (A) of FIG. 2A).

[0081] According to various embodiments, at least one substrate (270) may include a first substrate (271) disposed in a first space (2101) and a second substrate (272) disposed in a second space (2201). According to one embodiment, the first substrate (271) and the second substrate (272) may include a plurality of electronic components disposed to implement various functions of the electronic device (200). According to one embodiment, the first substrate (271) and the second substrate (272) may be electrically connected through at least one wiring member (263).

[0082] According to various embodiments, the electronic device (200) may include at least one battery (291, 292). According to one embodiment, the at least one battery (291, 292) may include a first battery (291) disposed in a first space (2101) of a first housing (210) and electrically connected to a first substrate (271), and a second battery (292) disposed in a second space (2201) of a second housing (220) and electrically connected to a second substrate (272).

[0083] According to various embodiments, the first housing (210) may include a first rotational support surface (214), and the second housing (220) may include a second rotational support surface (224) corresponding to the first rotational support surface (214). According to one embodiment, the first rotational support surface (214) and the second rotational support surface (224) may include a curved surface corresponding to (naturally connected to) the curved outer surface of the hinge housing (310). According to one embodiment, when the electronic device (200) is in an unfolded state, the first rotational support surface (214) and the second rotational support surface (224) may cover the hinge housing (310), thereby preventing the hinge housing (310) from being exposed to the rear of the electronic device (200) or exposing only a portion of it. According to one embodiment, when the electronic device (200) is in a folded state, the first rotational support surface (214) and the second rotational support surface (224) can rotate along the outer surface of the hinge housing (310) to expose at least a portion of the hinge housing (310) to the rear of the electronic device (200).

[0084] According to various embodiments, the electronic device (200) may include at least one antenna (276) disposed in a first space (2201). According to one embodiment, at least one antenna (276) may be disposed in the first space (2201) on the first battery (291) and the first rear cover (240). According to one embodiment, at least one antenna (276) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. According to one embodiment, at least one antenna (276) may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. In some embodiments, an antenna structure may be formed by at least a part of the first side member (213) or the second side member (223) and / or a part of the first support member (261) and the second support member (262) or a combination thereof.

[0085] According to various embodiments, the electronic device (200) may further include at least one electronic component assembly (274, 275) and / or additional support members (263, 273) disposed in the first space (2101) and / or the second space (2201). For example, at least one electronic component assembly may include an interface connector port assembly (274) or a speaker assembly (275).

[0086] According to various embodiments, the electronic device (200) may include a first waterproof structure (WP1) disposed between a first reinforcing plate (461) and a first support member (261), and a second waterproof structure (WP2) disposed between a second reinforcing plate (462) and a second support member (262). According to one embodiment, the first waterproof structure (WP1) may include a first waterproof member (481) disposed between the first reinforcing plate (461) and the first support member (261) such that at least one first waterproof space (4811, 4812, 4813) is formed. According to one embodiment, the second waterproof structure (WP2) may include a second waterproof member (482), a third waterproof member (483), and a fourth waterproof member (484) arranged such that at least one second waterproof space (4821) is formed between the second reinforcing plate (462) and the second support member (262). According to one embodiment, the fourth waterproof member (484) may be arranged to connect the stepped and spaced-apart space between the second waterproof member (482) and the third waterproof member (483).

[0087] According to various embodiments, the electronic device (200) may include a waterproof tape (241) disposed between a first rear cover (240) and a first housing (210). According to one embodiment, the electronic device (200) may include a bonding member (251) disposed between a second rear cover (250) and a second housing (220). In some embodiments, the bonding member (251) may be disposed between a second display (300) and a second housing (220). In some embodiments, the waterproof tape (241) may be replaced by the bonding member (251), and the bonding member (251) may be replaced by the waterproof tape (241).

[0088] FIG. 5 is an exploded perspective view of a display module (230) according to various embodiments disclosed in this document. The display module of FIG. 5 may be an example of the first display (e.g., the first display (230) of FIG. 2a and FIG. 4) described above.

[0089] A flexible display module (230) according to exemplary embodiments of the present disclosure may include an unbreakable (UB) type OLED display (e.g., a curved display). However, it is not limited thereto, and the flexible display module (230) may include an on-cell touch AMOLED (active matrix organic light-emitting diode) type flat display. In this document, the flexible display module (230) may be used interchangeably with terms such as "display module (230)".

[0090] Referring to FIG. 5, the flexible display module (230) may include a window layer (410), a polarizing layer (POL) (420) (e.g., polarizing film) sequentially disposed on the back surface (e.g., -z-axis direction) of the window layer (410), a display panel (430), a polymer layer (440), a support plate (450), and reinforcing plates (461, 462). In some embodiments, the flexible display module (230) may include a digitizer panel (470) disposed between the support plate (450) and the reinforcing plates (461, 462). In some embodiments, the digitizer panel (470) may be disposed between the polymer layer (440) and the support plate (450).

[0091] According to various embodiments, the window layer (410) may include a glass layer. According to one embodiment, the window layer (410) may include ultra-thin glass (UTG). In some embodiments, the window layer (410) may include a polymer. In this case, the window layer (410) may include polyethylene terephthalate (PET) or polyimide (PI). In some embodiments, the window layer (410) may be arranged in a plurality of layers to include a glass layer and a polymer.

[0092] According to various embodiments, the window layer (410), the polarizing layer (420), the display panel (430), the polymer layer (440), and the support plate (450) may be arranged to cross at least a portion of the first surface (e.g., the first surface (211) of FIG. 2A) of the first housing (e.g., the first housing (210) of FIG. 2A) and the third surface (e.g., the third surface (221) of FIG. 2A) of the second housing (e.g., the second housing (220) of FIG. 2A). According to one embodiment, the reinforcing plates (461, 462) may include a first reinforcing plate (461) corresponding to the first housing (e.g., the first housing (210) of FIG. 2A) and a second reinforcing plate (462) corresponding to the second housing (e.g., the second housing (220) of FIG. 2A). According to one embodiment, reinforcing plates (461, 462) provide rigidity for the flexible display module (230) and can be used as a ground to prevent malfunction of the flexible display module (230). According to one embodiment, the reinforcing plates (461, 462) can be formed from a metal material. According to one embodiment, the reinforcing plates (461, 462) can be formed from SUS or AL. According to one embodiment, the window layer (410), the polarizing layer (420), the display panel (430), the polymer layer (440), the support plate (450), and the reinforcing plates (461, 462) can be attached to each other through an adhesive (P1, P2, P3) (or adhesive). For example, the adhesive (P1, P2, P3) may include at least one of OCA (optical clear adhesive), PSA (pressure sensitive adhesive), a thermoreactive adhesive, a general adhesive, or double-sided tape.

[0093] According to various embodiments, the display panel (430) may include a plurality of pixels and a wiring structure (e.g., an electrode pattern). According to one embodiment, the polarizing layer (420) may selectively pass light generated from a light source of the display panel (430) and vibrating in a certain direction. According to one embodiment, the display panel (430) and the polarizing layer (420) may be formed integrally. According to one embodiment, the flexible display module (230) may include a touch panel (not shown).

[0094] According to various embodiments, the polymer layer (440) may be placed below the display panel (430) to provide a dark background for ensuring visibility of the display panel (430) and may be formed as a cushioning material for cushioning. In some embodiments, for waterproofing of the flexible display module (230), the polymer layer (440) may be removed or placed below the support plate (450).

[0095] According to various embodiments, the support plate (450) may provide bending characteristics to the flexible display module (230). For example, the support plate (450) may be formed from a non-metallic thin-plate material, such as fiber reinforced plastics (FRP) (e.g., carbon fiber reinforced plastics or glass fiber reinforced plastics) having rigid characteristics for supporting the display panel (430). According to one embodiment, the support plate (450) may include a first planar portion (451) corresponding to a first housing (e.g., the first housing (210) in FIG. 2a), a second planar portion (452) corresponding to a second housing (e.g., the second housing (220) in FIG. 2a), and a bending portion (453) (flexible portion or bending portion) connecting the first planar portion (451) and the second planar portion (452). According to one embodiment, the bending portion (453) may include a plurality of openings (4531) arranged at specified intervals. According to one embodiment, the bending portion (453) may have a bending characteristic determined by at least one of the size, shape, or arrangement density of at least some of the plurality of openings (4531). In some embodiments, the support plate (450) may be formed of a metal material such as SUS (steel use stainless) (e.g., STS (stainless steel)), Cu, Al, or a metal CLAD (e.g., a laminated member in which SUS and Al are alternately arranged). In this case, the support plate (450) may have a plurality of openings formed over its entire surface area to induce a detection operation of the digitizer panel (470) placed underneath. According to one embodiment, the support plate (450) can be used to help reinforce the rigidity of an electronic device (e.g., the electronic device (200) of FIG. 2a), shield ambient noise, and dissipate heat emitted from surrounding heat dissipation components.

[0096] According to various embodiments, a display module (230) (e.g., the first display (230) of FIG. 2a) may include a digitizer panel (470) as a detection member that is placed under a support plate (450) and receives input from an electronic pen (e.g., a stylus). According to one embodiment, the digitizer panel (470) may include coil members placed on a dielectric substrate (e.g., a dielectric film or a dielectric sheet) so as to detect an electromagnetic induction resonant frequency applied from the electronic pen. According to one embodiment, the digitizer panel (470) may include a first digitizer panel (471) corresponding to a first housing (e.g., the first housing (210) of FIG. 2a) and a second digitizer panel (472) corresponding to a second housing (e.g., the second housing (220) of FIG. 2a). According to one embodiment, the first digitizer panel (471) and the second digitizer panel (472) can be operated as a single digitizer panel by being electrically connected to substrates (e.g., substrates (271, 272) of FIG. 4) of an electronic device (e.g., electronic device (200) of FIG. 4) through an FPCB connection. In some embodiments, the first digitizer panel (471) and the second digitizer panel (472) may be operated individually.

[0097] According to various embodiments, the flexible display module (230) may include at least one functional member (not shown) disposed between the polymer layer (440) and the support plate (450), or below the support plate (450). According to one embodiment, the functional member may include a graphite sheet for heat dissipation, an added display, a force touch FPCB, a fingerprint sensor FPCB, a communication antenna radiator, or a conductive / non-conductive tape. According to one embodiment, if bending is not possible, the functional member may be disposed separately in a first housing (e.g., the first housing (210) in FIG. 2a) and a second housing (e.g., the second housing (220) in FIG. 2a). According to one embodiment, if the functional member is bendable, it may be positioned from a first housing (e.g., the first housing (210) of FIG. 2a) to at least a portion of a second housing (e.g., the second housing (220) of FIG. 2a) through a hinge device (e.g., the hinge device (320) of FIG. 4).

[0098] According to various embodiments, the flexible display module (230) may include a bending area (432) that is positioned to be folded from the display panel (430) to at least a portion of the back surface (e.g., in the -z-axis direction) of the flexible display module (230). According to one embodiment, the bending area (432) may include an extension (4321) that extends from the display panel (430) and includes a control circuit (4321a), and a flexible substrate (4322) that is electrically connected to the extension (4321) and includes a plurality of electrical elements. According to one embodiment, the control circuit (4321a) may include a DDI (display driver IC) or TDDI (touch display driver IC) that is positioned on the extension (4321) having an electrical wiring structure.

[0099] According to one embodiment, the flexible display module (230) may include an FPCB connection portion (4323) that extends from a flexible substrate (4322) and is electrically connected to a substrate (e.g., a second substrate (272) of FIG. 4) of an electronic device (e.g., an electronic device (200) of FIG. 4).

[0100] FIG. 6 is a configuration diagram showing the back side of a display module (230) according to a comparative example.

[0101] Referring to FIG. 6, the display module (230) of the electronic device according to the comparative example may be at least partially similar to the flexible display module (230) described with reference to FIG. 2a to FIG. 5.

[0102] In the display module (230) according to the comparative example, when viewed from the rear direction of the display module (230), a bending area (432) (e.g., 432 in FIG. 5) and an extension area (433) (e.g., 4321 in FIG. 5) of the display panel (430) may be disposed therein. A display driving circuit (hereinafter, DDI (610) (display driver IC)) (e.g., 4321a in FIG. 5) may be disposed in the extension area (433) of the display module (230), and the DDI (610) may be covered by an FPCB (630) that is bonded in the reverse direction to the display panel (430). Thus, when viewed from the rear direction of the display module (230), the DDI (610) is substantially not visible, and only the FPCB (630) may be visible. The comparative example may further include a cover member (540) (e.g., 540 of FIG. 8) covering the FPCB (630). The cover member (540) may include at least one conductive layer and at least one non-conductive layer, and the outer layer of the cover member (540) may be formed as a non-conductive layer.

[0103] In a comparative example, the back surface of the display module (230) may be a surface positioned to face the back surface of the electronic device (200) in an unfolded state of the electronic device (200). The back surface of the display module (230) may mean a surface facing the rear cover (e.g., 240, 250 of FIG. 4) of the electronic device (200).

[0104] In the display module (230) according to the comparative example, a waterproof tape (620) may be attached around the DDI (610) to prevent external static electricity from entering the DDI (610). In the comparative example, the waterproof tape (620) may be attached to the first direction (e.g., the -x direction in FIG. 6) where the bending area (432) is located from the DDI (610). The waterproof tape (620) serves to attach the end of the FPCB (630) to the display panel (430) and also serves to prevent static electricity from entering the DDI (610) from the outside through the bending area (432).

[0105] FIG. 7 is a partial cross-sectional view of an electronic device schematically illustrating the edge of a display module (230) according to the comparative example shown in FIG. 6. For example, FIG. 7 may be a cross-sectional view of the edge of the display module (230) cut along the line B-B' shown in FIG. 6.

[0106] Referring to FIG. 7, a display module (230) according to a comparative example includes a display panel (430) configured to be bendable. The display panel (430) may include a display area (431) configured to form the front of the display module (230) and display a screen, a bending area (432) extending from one end of the display area (431) and at least a portion of which is bendable, and an extension area (433) extending from the bending area (432) to the back of the display module (230). The extension area (433) may be positioned substantially parallel to the display area (431). The extension area (433) may be interchangeably used with terms similar to "extension part" and "third area," etc.

[0107] According to a comparative example, a support plate (450) may be disposed below the display area (431) of the display panel (430), and the support plate (450) may be disposed between the display area (431) and the extension area (433) of the display panel (430). According to a comparative example, the display module (230) may include a spacer member (710) for compensating for the step difference between the display area (431) and the extension area (433). The spacer member (710) is disposed between the extension area (433) of the display panel (430) and the support plate (450) and serves to compensate for the step difference between the display area (431) and the extension area (433). The spacer member (710) may include a polymer material.

[0108] According to a comparative example, a DDI (610) may be placed in the extension area (433). An FPCB (630) is connected to one end of the extension area (433), and the FPCB (630) may be bonded to the display panel (430) in a reverse direction. Bonding the FPCB (630) in a reverse direction means that the FPCB (630) extends from one end (e.g., pad area) where it is bonded to the display panel (430) in a first direction (e.g., -x direction in FIG. 6) where the bending area (432) of the display panel (430) is located. Bonding the FPCB (630) in a reverse direction has the advantage of securing more space for the placement of the battery (720) of the electronic device.

[0109] According to the comparative example, the FPCB (630) can cover the DDI (610) as it extends in the first direction (e.g., the -x direction in FIG. 6) where the bending area (432) is located, and the end of the FPCB (630) can be attached to the back of the display panel (430) (e.g., a part of the extension area (433)) by a waterproof tape (620). In the comparative example, the waterproof tape (620) not only serves the functional role of attaching the FPCB (630) to the display panel (430), but also serves to prevent static electricity from entering the DDI (610) from the outside. However, in the display module (230) according to the comparative example, as shown in 701 of FIG. 7, the adhesion force between the waterproof tape (620) and the display panel (430) is reduced, so lifting may occur. If the waterproof tape (620) lifts up, static electricity from the outside can be transferred to the DDI (610).

[0110] FIG. 8 is a partial cross-sectional view of an electronic device schematically illustrating the edge of a display module (230) according to the comparative example shown in FIG. 6. For example, FIG. 8 may be a cross-sectional view of the edge of the display module (230) cut along the line B-B' shown in FIG. 6.

[0111] The comparative example illustrated in FIG. 8 differs from the comparative example illustrated in FIG. 7 in that it further includes a cover member (540). Referring to FIG. 8, the display module (230) according to the comparative example may further include a cover member (540) that covers an FPCB (630) and a waterproof tape (620). Since the cover member (540) includes a non-conductive layer, it can protect the DDI (610) from static electricity, but due to the step of the FPCB (630), the end of the cover member (540) may easily lift (801) from the surface of the display panel (430). If the cover member (540) and the waterproof tape (620) lift (801), static electricity introduced from the outside may be transferred to the DDI (610).

[0112] One embodiment of the present invention includes a protection structure that prevents static electricity introduced from the outside from being transmitted to the DDI (610) even if the lifting (801) of the waterproof tape (620) described in FIGS. 7 and 8 occurs. Hereinafter, with reference to FIGS. 10 to 21, a protection structure that prevents static electricity introduced from the outside from being transmitted to the DDI (610) will be described in detail.

[0113] FIG. 9 is a conceptual diagram illustrating the wiring structure of an FPCB (630) according to a comparative example and the lifting phenomenon of a waterproof tape (620). For example, FIG. 9 is a diagram illustrating the wiring structure of an FPCB (630) according to a comparative example shown in FIG. 7 and FIG. 8, and schematically illustrates the shape of an FPCB (630) in which lifting of the waterproof tape (620) can easily occur.

[0114] Referring to FIG. 9, the FPCB (630) includes a multi-layer structure including a plurality of wires. For example, the FPCB (630) may include a coverlay layer (not shown) as an outer layer and a plurality of metal layers (631, 632, 633, 634, 635, 636, 637, 638) as inner layers. The plurality of metal layers (631, 632, 633, 634, 635, 636, 637, 638) include a first metal layer (631), a second metal layer (632), a third metal layer (633), a fourth metal layer (634), a fifth metal layer (635), a sixth metal layer (636), a seventh metal layer (637), and an eighth metal layer (638), and these may be stacked sequentially. Here, the first metal layer (631) is the uppermost layer among the metal layers (e.g., the metal layer closest to the waterproof tape (620)), and the eighth metal layer (638) is the lowest layer among the metal layers.

[0115] According to a comparative example, at least one wiring (not shown) for transmitting a plurality of signals and / or a plurality of voltages for driving a display panel (430) may be disposed in each of the plurality of metal layers (631, 632, 633, 634, 635, 636, 637, 638). The wiring disposed in each of the plurality of metal layers (631, 632, 633, 634, 635, 636, 637, 638) can be electrically connected to the connecting wiring (6301) of one intermediate layer (e.g., the fourth metal layer (634)) among the plurality of metal layers (631, 632, 633, 634, 635, 636, 637, 638) through the via (639), and thus can be electrically connected to the pad portion (6302) disposed at one end of the FPCB (630).

[0116] In this comparative example, the connection portion (902) between the connecting wires (6301) and the pad portion (6302) extends from the connecting wires (6301) of one of the intermediate layers (e.g., the fourth metal layer (634)) among the plurality of metal layers (631, 632, 633, 634, 635, 636, 637, 638). In this comparative example, lifting (901) of the waterproof tape (620) can easily occur due to the step difference between the intermediate layer (e.g., the fourth metal layer (634)) and the first metal layer (631) which is positioned closest to the coverlay to which the waterproof tape (620) is attached. If the waterproof tape (620) lifts (901), static electricity (900) can flow into the gap between the display panel (430) (e.g., extension area (433)) and the FPCB (630), potentially damaging the DDI (610).

[0117] FIG. 10 is a conceptual diagram illustrating the wiring structure of an FPCB (630) according to one embodiment designed to reduce the lifting phenomenon of the waterproof tape (620). For example, FIG. 10 has a shape of an FPCB (630) in which the lifting of the waterproof tape (620) can easily occur, unlike the wiring structure of the FPCB (630) according to the comparative example shown in FIG. 9.

[0118] Referring to FIG. 10, an FPCB (630) according to one embodiment includes a multi-layer structure including a plurality of wires. For example, the FPCB (630) may include a coverlay layer (not shown) as an outer layer and a plurality of metal layers (631, 632, 633, 634, 635, 636, 637, 638) as an inner layer. The plurality of metal layers (631, 632, 633, 634, 635, 636, 637, 638) include a first metal layer (631), a second metal layer (632), a third metal layer (633), a fourth metal layer (634), a fifth metal layer (635), a sixth metal layer (636), a seventh metal layer (637), and an eighth metal layer (638), and these may be stacked sequentially. Here, the first metal layer (631) is the uppermost layer among the metal layers, and the eighth metal layer (638) is the lowest layer among the metal layers.

[0119] According to one embodiment, at least one wiring (not shown) for transmitting a plurality of signals and / or a plurality of voltages for driving a display panel (430) may be disposed in each of the plurality of metal layers (631, 632, 633, 634, 635, 636, 637, 638). The wiring disposed in each of the plurality of metal layers (631, 632, 633, 634, 635, 636, 637, 638) may be electrically connected to a pad portion (6302) disposed at one end of the FPCB (630) by being electrically connected to the connecting wiring (6301) of the first metal layer (631), which is the uppermost layer among the plurality of metal layers (631, 632, 633, 634, 635, 636, 637, 638) through a via (639).

[0120] According to one embodiment, the connection portion (1002) between the connection wires (6301) and the pad portion (6302) extends from the connection wires (6301) of the first metal layer (631), which is the uppermost layer among the plurality of metal layers (631, 632, 633, 634, 635, 636, 637, 638). Unlike the comparative example of FIG. 9, this embodiment reduces the step difference between the coverlay to which the waterproof tape (620) is attached and the first metal layer (631) to which the connection portion (1002) is placed, thereby reducing or preventing lifting (1001) of the waterproof tape (620). If the lifting (1001) of the waterproof tape (620) is reduced, static electricity (e.g., 900 in FIG. 9) can be introduced into the gap between the display panel (430) (e.g., extension area (433)) and the FPCB (630), thereby reducing the issue of damage to the DDI (610). According to one embodiment, an insulating layer may be included between a plurality of metal layers (631, 632, 633, 634, 635, 636, 637, 638). For example, an insulating layer may be placed between the first metal layer (631) and the second metal layer (632). For example, the insulating layer may be formed from an insulating material. For example, the insulating layer may include an insulating film (e.g., PET (polyester, polyethylene terephthalate), PI (polyimide)), or epoxy.

[0121] FIGS. 11 to 13 are configuration diagrams illustrating the back surface of a display module (230) according to one embodiment. For example, FIG. 11 illustrates an embodiment in which an FPCB (630) according to one embodiment includes a slit forming a path for discharging incoming static electricity, corresponding to three sides of a DDI (610). For example, FIG. 12 illustrates an embodiment in which an FPCB (630) according to one embodiment includes a slit forming a path for discharging incoming static electricity, corresponding to one side of a DDI (610). For example, FIG. 13 illustrates an embodiment in which an FPCB (630) according to one embodiment includes a slit forming a path for discharging incoming static electricity, corresponding to one side of a DDI (610).

[0122] The display module (230) according to one embodiment of FIG. 11 to 13 may be similar in at least part to the comparative example described with reference to FIG. 6. Hereinafter, only one embodiment of the present invention that differs from the comparative example of FIG. 6 will be described.

[0123] Referring to FIG. 11, an FPCB (630) according to one embodiment includes a slit (1110) that forms a path for discharging incoming static electricity, wherein the slit (1110) may be positioned to correspond to three sides of the DDI (610). According to one embodiment, the FPCB (630) may be positioned to cover the DDI (610) and may include at least one slit (1110) positioned adjacent to the DDI (610). According to one embodiment, at least one slit (1110) may include a first part (1112) positioned in a first direction (-x direction) where the banding area (432) is located from the DDI (610), a second part (1113) positioned in a second direction (y direction) perpendicular to the first direction from the DDI (610), and a third part (1111) positioned in a third direction (-y direction) opposite to the second direction (y direction) from the DDI (610).

[0124] Referring to FIG. 12, an FPCB (630) according to one embodiment may include a slit (1110) that forms a path for discharging incoming static electricity, wherein the slit (1110) may be positioned to correspond to one side of the DDI (610). According to one embodiment, the FPCB (630) may be positioned to cover the DDI (610) and may include at least one slit (1110) positioned adjacent to the DDI (610). According to one embodiment, the slit (1110) may include a first portion (1112) positioned in a first direction (-x direction) where the bending area (432) is located from the DDI (610).

[0125] Referring to FIG. 13, an FPCB (630) according to one embodiment may include a slit (1110) that forms a path for discharging incoming static electricity, wherein the slit (1110) may be positioned to correspond to two sides of the DDI (610). According to one embodiment, the FPCB (630) may be positioned to cover the DDI (610) and may include a slit (1110) positioned adjacent to the DDI (610). According to one embodiment, the slit (1110) may include a second part (1113) positioned in a second direction (y-direction) perpendicular to a first direction from the DDI (610), and a third part (1111) positioned in a third direction (-y-direction) opposite to the second direction (y-direction) from the DDI (610). According to one embodiment, the slit (1110) may include at least one of the second part (1113) and the third part (1111).

[0126] FIG. 14 illustrates an example in which slits forming a path for discharging incoming static electricity are arranged in a plurality of layers of an FPCB (630) according to one embodiment. For example, FIG. 14 illustrates a cross-section of a display module (230) along the B-B' line shown in FIG. 11 or FIG. 12.

[0127] Referring to FIG. 14, the FPCB (630) may include a first cover layer (not shown) (e.g., a first cover layer) forming a first surface facing the DDI (610), a second cover layer (not shown) (e.g., a second cover layer) forming a second surface (e.g., a bottom surface) opposite to the first surface (e.g., a top surface), and at least one metal layer (e.g., 631, 632, 633, 634, 635, 636, 637, 638 of FIG. 10) disposed between the first cover layer and the second cover layer.

[0128] According to one embodiment, the first cover layer of the FPCB (630) may be positioned adjacent to the DDI (610) and may include at least one first slit (1112a) (e.g., the slit (1110) of FIG. 11) that exposes a portion of at least one metal layer. According to one embodiment, at least one first slit (1112a) may be positioned to face the waterproof tape (620). The first slit (1112a) may form a discharge path (910) through which static electricity introduced from the outside flows even if the waterproof tape (620) lifts up. Static electricity introduced through the first slit (1112a) may be discharged to the ground of the FPCB (630) or discharged to a shielding component (1312) (e.g., gasket) placed on the support member (1410) as described below.

[0129] According to one embodiment, the second cover layer of the FPCB (630) may further include at least one second slit (1112b). The at least one second slit (1112b) may be positioned so as to overlap at least a portion with the first slit (1112a). For example, static electricity introduced through the first slit (1112a) may be discharged through the second slit (1112b) to a support member positioned to face the back surface of the FPCB (630). Here, the support member (1410) may be any one of the pair of support members (261, 262) described with reference to FIG. 4. The support member (1410) may include a shielding part (1412) (e.g., gasket) and a conductive tape (1411) positioned to face the second slit (1112b). Static electricity introduced through the first slit (1112a) can be discharged through the second slit (1112b) to a shielding component (1412) (e.g., gasket) disposed on a support member (1410) positioned to face the back surface of the FPCB (630). According to one embodiment, the cover layer of the FPCB (630) (e.g., first cover layer, second cover layer) may be formed of an insulating material. For example, the cover layer of the FPCB (630) (e.g., first cover layer, second cover layer) may include an insulating film (e.g., PET (polyester, polyethylene terephthalate), PI (polyimide)) and / or an insulating coating (e.g., acrylic, silicone, urethane, epoxy, or parylene).

[0130] FIG. 15 illustrates an example in which a slit forming a path for discharging incoming static electricity is disposed in a single layer of an FPCB (630) according to one embodiment. For example, FIG. 15 illustrates a cross-section of a display module (230) along the B-B' line shown in FIG. 11 or FIG. 12.

[0131] The embodiment of FIG. 15 may be similar to the embodiment of FIG. 14 in at least some respects. Hereinafter, only the embodiment of FIG. 15 that differs from the embodiment of FIG. 14 will be described. Accordingly, features not described in FIG. 15 will be replaced by the description of the embodiment of FIG. 14.

[0132] Unlike the embodiment of FIG. 14, the embodiment of FIG. 15 may not include the second slit (1112b) of the second cover layer in the FPCB (630).

[0133] According to one embodiment, the first cover layer of the FPCB (630) may be positioned adjacent to the DDI (610) and may include at least one first slit (1112a) that exposes a portion of at least one metal layer. According to one embodiment, at least one first slit (1112a) may be positioned to face the waterproof tape (620). The first slit (1112a) may form a discharge path through which static electricity introduced from the outside flows even if the waterproof tape (620) lifts. Static electricity introduced through the first slit (1112a) may be discharged to the ground of the FPCB (630) or discharged to a shielding component (e.g., gasket) placed on the support member (1410).

[0134] According to one embodiment, the support member (1410) may include a shielding component (e.g., gasket) and a conductive tape positioned to overlap with the first slit (1112a). Static electricity introduced through the first slit (1112a) may be discharged to the shielding component (e.g., gasket) positioned on the support member (1410).

[0135] FIG. 16 illustrates an example in which an FPCB (630) according to one embodiment includes a slit forming a path for discharging incoming static electricity, a display module (230) is positioned to face the slit, and further includes a conductive member positioned on the outer edge of a waterproof tape (620). For example, FIG. 16 illustrates a cross-section of the display module (230) along the B-B' line shown in FIG. 11 or FIG. 12.

[0136] The embodiment of FIG. 16 may be similar to the embodiment of FIG. 15 in at least some respects. Hereinafter, only the embodiment of FIG. 16 that differs from the embodiment of FIG. 15 will be described. Accordingly, features not described in FIG. 16 will be replaced by the description of the embodiment of FIG. 15.

[0137] The embodiment of FIG. 16 differs from the embodiment of FIG. 15 in that a conductive member (1610) is further disposed on the outer edge of the waterproof tape (620).

[0138] According to one embodiment, the display module (230) further includes a conductive member (1610) disposed adjacent to the waterproof tape (620). The conductive member (1610) may be formed of a conductive material or a coating member comprising a conductive material.

[0139] According to one embodiment, a conductive member (1610) may be disposed in a first direction where the banding area (432) is located from the waterproof tape (620). For example, if the conductive member (1610) is a conductive material, the conductive material may be designed to be attached to both the display panel (430) and the FPCB (630). According to one embodiment, since the outer side of the waterproof tape (620) has somewhat limited space, the conductive material and the coating of the conductive material may be designed in an area narrower than the width of the waterproof tape (620).

[0140] According to one embodiment, the FPCB (630) has at least one first slit (1112a) positioned to face the conductive member (1610). The first slit (1112a) may form a discharge path to discharge static electricity introduced from the conductive member (1610) or the waterproof tape (620) to the ground of the FPCB (630), or to discharge to a shielding component (e.g., 1412 in FIG. 14) (e.g., gasket) positioned on a support member (e.g., 1410 in FIG. 14).

[0141] According to one embodiment, it is preferable that the length of the conductive member (1610) be such that it can cover the entire length of the DDI (610). For example, the length of the conductive member (1610) may be designed to be longer than the length of the DDI (610). In the illustrated embodiment, by attaching the conductive member (1610) separately, damage to the DDI (610) due to static electricity can be prevented even if the waterproof tape (620) lifts up.

[0142] FIG. 17 illustrates an example in which an FPCB (630) according to one embodiment includes a slit forming a path for discharging incoming static electricity, a display module (230) is positioned to face the slit, and further includes a conductive member (1610) positioned between a waterproof tape (620) and a DDI (610). For example, FIG. 17 illustrates a cross-section of the display module (230) along the B-B' line shown in FIG. 11 or FIG. 12.

[0143] The embodiment of FIG. 17 may be similar to the embodiment of FIG. 16 in at least some respects. Hereinafter, only the embodiment of FIG. 17 that differs from the embodiment of FIG. 16 will be described. Accordingly, features not described in FIG. 17 will be replaced by the description of the embodiment of FIG. 16.

[0144] The embodiment of FIG. 17 differs from the embodiment of FIG. 16 in that the conductive member (1610) is placed between the waterproof tape (620) and the DDI (610).

[0145] According to one embodiment, the conductive member (1610) may be placed between the waterproof tape (620) and the DDI (610). According to one embodiment, the FPCB (630) has at least one first slit (1112a) placed facing the conductive member (1610). The first slit (1112a) may form a discharge path that discharges static electricity introduced from the conductive member (1610) or the waterproof tape (620) to the ground of the FPCB (630) or to a shielding part (e.g., 1412 in FIG. 14) (e.g., gasket) placed on the support member (e.g., 1410 in FIG. 14).

[0146] FIG. 18 illustrates an example in which an FPCB (630) according to one embodiment further includes at least one first slit (1112a) forming a path for discharging incoming static electricity, as well as at least one third slit (1120) electrically connected to a conductive plate. For example, FIG. 18 illustrates a cross-section of a display module (230) along the C-C' line shown in FIG. 11 to FIG. 13.

[0147] Referring to FIG. 18, an FPCB (630) according to one embodiment may include a ground area that contacts the back surface of a support plate (450) through a conductive tape (1810). The ground area of ​​the FPCB (630) may be an area along the C-C' line of FIG. 11 to FIG. 13, which is positioned so as to be spaced apart from the DDI (610). According to one embodiment, the FPCB (630) may be designed with a slit (1120) to form a discharge path in this ground area as well. For example, a first cover layer of the FPCB (630) may be positioned adjacent to the conductive tape (1810) and may include at least one third slit (1120) that exposes a portion of at least one metal layer.

[0148] According to one embodiment, at least one third slit (1120) is disposed in the first cover layer of the FPCB (630), and at least a portion may overlap with the conductive tape (1810) in contact with the back surface of the support plate (450).

[0149] FIG. 19 is a configuration diagram showing the back side of a display module (230) according to an embodiment further including a cover member (2010). FIG. 20 and FIG. 21 are partial cross-sectional views of an electronic device schematically showing the edges of a display module (230) according to an embodiment shown in FIG. 19.

[0150] Referring to FIGS. 19 to 21, a display module (230) according to one embodiment includes an FPCB (630) that is bonded in reverse direction to a display panel (430), and a cover member (2010) may be placed between the FPCB (630) and the DDI (610) to protect the DDI (610) from static electricity.

[0151] According to one embodiment, the FPCB (630) is bonded to a portion of the extended area (433) of the display panel (430) and can cover the DDI (610) as it extends in a first direction of the display module (230) where the bending area (432) is located. One end of the FPCB (630) can be attached to the extended area (433) of the display panel (430) by a waterproof tape (620).

[0152] According to one embodiment, the display module (230) further includes a cover member (2010) disposed between the FPCB (630) and the DDI (610). The cover member (2010) may include at least one non-conductive layer and at least one conductive layer. The outer layer of the cover member (2010) may be formed as a non-conductive layer. For example, the stacked structure of the cover member (2010) may include a structure in which a non-conductive layer, a conductive layer, and a non-conductive layer are sequentially stacked.

[0153] Referring to FIGS. 19 and 20, a cover member (2010) according to one embodiment may include a first area and a second area as a first surface facing the front of the FPCB (630). For example, the first surface of the cover member (2010) may include a first area disposed between the FPCB (630) and the DDI (610), and a second area extending from the first area and disposed between the FPCB (630) and the waterproof tape (620). In the illustrated embodiment, the cover member (2010) directly covers the DDI (610), thereby protecting the DDI (610) from static electricity even if the waterproof tape (620) lifts up.

[0154] Referring to FIGS. 19 and FIGS. 21, a cover member (2010) according to one embodiment may further include a second surface that extends from a first surface facing the front of the FPCB (630) and covers the side of the waterproof tape (620). According to one embodiment, as shown in 2101 of FIG. 21, the second surface of the cover member (2010) may extend to a portion of the bending area (432) of the display panel (430) to cover a portion of the bending area (432).

[0155] FIG. 22 is a partial cross-sectional view of an electronic device schematically illustrating the edges of a display module according to a comparative example. For example, FIG. 22 may be a partial cross-sectional view of a display module according to a comparative example illustrated in FIG. 7. Thus, the comparative example illustrated in FIG. 22 may be at least partially identical or substantially identical to the comparative example illustrated in FIG. 7.

[0156] Referring to FIG. 22, the display module (230) according to the comparative example includes a display panel (430) configured to be bendable.

[0157] According to a comparative example, the display panel (430) includes an extended area (e.g., the extended area (433) of FIG. 7) that is bent downwards toward the back side opposite to the front of the display panel (430), and a DDI (610) may be disposed in the extended area.

[0158] According to a comparative example, an FPCB (630) may be connected to one end of a display panel (430) on which a DDI (610) is placed via an anisotropic conductive film (ACF) (220). The FPCB (630) may be bonded to the display panel (430) in reverse. Bonding the FPCB (630) in reverse may mean that the FPCB (630) extends in the direction in which the bending area of ​​the display panel (430) (e.g., the bending area (432) of FIG. 7) is located. According to a comparative example, the bending area of ​​the display panel (430) (e.g., the bending area (432) of FIG. 7) may be covered by a banding protective layer (e.g., BPL) (2210). The banding protection member (2210) may be used interchangeably with terms such as banding protection film. The banding protection member (2210) may be formed of a flexible material as a protective layer to relieve physical stress that may occur in the banding area (432) of the display panel (430) and to prevent damage to the circuit layer or wiring layer. For example, the banding protection member (2210) may include a polymer film material such as polyimide (PI), polyethylene terephthalate (PET), polycarbonate (PC), or polyetherimide (PEI). The banding protection member (2210) may include a silicone-based elastomer or an epoxy resin.

[0159] According to a comparative example, the FPCB (630) is bonded in the reverse direction to the display panel (430) and extends in the direction of the bending area of ​​the display panel (430), and can cover the DDI (610), and the end of the FPCB (630) can be attached to the display panel (430) by a waterproof tape (620).

[0160] FIG. 23 is a partial cross-sectional view of an electronic device schematically illustrating the edges of a display module according to one embodiment. For example, the display module according to one embodiment illustrated in FIG. 23 may be at least partially identical to the display module according to the comparative example illustrated in FIG. 22, except for features described below. The display module according to one embodiment illustrated in FIG. 23 may be at least partially similar to the display module according to one embodiment described with reference to FIG. 20. Hereinafter, with reference to FIG. 23, only features of the display module according to one embodiment that differ from FIG. 22 or are not described in FIG. 23 will be described.

[0161] Referring to FIG. 23, according to one embodiment, the display module (230) further includes a cover member (2010) disposed between an FPCB (630) and a DDI (610). The cover member (2010) may include at least one non-conductive layer and at least one conductive layer. The outer layer of the cover member (2010) may be formed as a non-conductive layer. For example, the stacked structure of the cover member (2010) may include a structure in which a non-conductive layer, a conductive layer, and a non-conductive layer are sequentially stacked.

[0162] According to one embodiment, the cover member (2010) can cover the DDI (610) and the waterproof tape (620). The cover member (2010) can be covered by the FPCB (630). For example, the cover member (2010) can be placed between the FPCB (630) and the DDI (610), and also between the FPCB (630) and the waterproof tape (620).

[0163] According to one embodiment, the end of the FPCB (630) (e.g., 2301 in FIG. 23) may be extended to cover the side of the cover member (2010).

[0164] According to the embodiment of FIG. 23, the cover member (2010) and the FPCB (630) may not cover the banding protection member (2210).

[0165] FIG. 24 is a partial cross-sectional view of an electronic device schematically illustrating the edges of a display module according to one embodiment. For example, the display module according to one embodiment illustrated in FIG. 24 may be at least partially identical to the display module according to one embodiment illustrated in FIG. 23, except for features described below. The display module according to one embodiment illustrated in FIG. 24 may be at least partially similar to the display module according to one embodiment described with reference to FIG. 21. Hereinafter, with reference to FIG. 24, only features of the display module according to one embodiment that differ from the embodiment of FIG. 23 or were not described in FIG. 21 will be described.

[0166] Referring to FIG. 24, according to one embodiment, a cover member (2010) may cover a DDI (610) and a waterproof tape (620). This cover member (2010) may be covered by an FPCB (630). For example, the cover member (2010) may be placed between the FPCB (630) and the DDI (610), and also between the FPCB (630) and the waterproof tape (620).

[0167] According to one embodiment, the end of the cover member (2010) corresponding to the end of the FPCB (630) (e.g., 2401 in FIG. 24) may be extended to cover the side of the waterproof tape (620).

[0168] According to the embodiment of FIG. 24, the cover member (2010) and the FPCB (630) may not cover the banding protection member (2210).

[0169] FIG. 25 is a partial cross-sectional view of an electronic device schematically illustrating the edges of a display module according to one embodiment. For example, the display module according to one embodiment illustrated in FIG. 25 may be at least partially identical to the display module according to one embodiment illustrated in FIG. 23, except for features described below. Hereinafter, with reference to FIG. 25, only one embodiment of the present invention that differs from the embodiment of FIG. 23 will be described.

[0170] Referring to FIG. 25, according to one embodiment, a cover member (2010) may cover a DDI (610) and a waterproof tape (620). This cover member (2010) may be covered by an FPCB (630). For example, the cover member (2010) may be placed between the FPCB (630) and the DDI (610), and also between the FPCB (630) and the waterproof tape (620).

[0171] According to the embodiment of FIG. 25, an end of the cover member (2010) (e.g., 2501 in FIG. 25) may be extended to cover a portion of the banding protection member (2210). The end of the cover member (2010) (e.g., 2501 in FIG. 25) extended to cover a portion of the banding protection member (2210) may not be covered by the FPCB (630).

[0172] According to one embodiment, an electronic device comprises a display module including a first housing, a second housing foldably coupled to the first housing, and a display panel supported by the first housing and the second housing and configured to be bendable with respect to a folding axis formed by a hinge, wherein the display panel includes a display area forming the front surface of the display module, a bending area extending from one end of the display area and at least a portion of which is bent, and an extension area extending from the bending area to the back surface of the display module, and the display module includes a display driver IC (DDI) disposed on the extension area of ​​the display panel, an FPCB bonded to a portion of the extension area of ​​the display panel and covering the display driver IC as it extends in a first direction of the display module where the bending area is located, and a waterproof tape attaching one end of the FPCB to the extension area of ​​the display panel, wherein the FPCB includes a first cover layer forming a first surface facing the display driver circuit and a second surface opposite to the first surface The device includes a cover layer and at least one metal layer disposed between the first cover layer and the second cover layer, wherein the first cover layer is disposed adjacent to the display driving circuit and may include at least one first slit that exposes a portion of the at least one metal layer.

[0173] The second cover layer of the FPCB may include at least one second slit that is positioned adjacent to the display driving circuit and exposes a portion of the at least one metal layer.

[0174] The above at least one first slit and the above at least one second slit may overlap at least partially.

[0175] The display module further includes a conductive plate disposed on the back surface of the display panel and a conductive tape that attaches the other end of the FPCB to the conductive plate, and the first cover layer of the FPCB may include at least one third slit disposed adjacent to the conductive tape and exposing a portion of the at least one metal layer.

[0176] The above at least one first slit can be positioned between the display driving circuit and the bending area.

[0177] The above at least one first slit may include a first portion positioned in the first direction where the bending area is located from the display driving circuit, a second portion positioned in the second direction perpendicular to the first direction from the display driving circuit, and a third portion positioned in the third direction opposite to the second direction from the display driving circuit.

[0178] The above at least one first slit may include at least one part among a second part positioned in a second direction perpendicular to a first direction in which the bending area is located from the display driving circuit, and a third part positioned in a third direction opposite to the second direction from the display driving circuit.

[0179] According to one embodiment, the electronic device comprises a display module including a first housing, a second housing foldably coupled to the first housing, and a display panel supported by the first housing and the second housing and configured to be bendable with respect to a folding axis formed by a hinge, wherein the display panel includes a display area forming the front surface of the display module, a bending area extending from one end of the display area and at least a portion of which is bent, and an extension area extending from the bending area to the back surface of the display module, and the display module may include a display driver IC (DDI) disposed on the extension area of ​​the display panel, an FPCB bonded to a portion of the extension area of ​​the display panel and covering the display driver IC as it extends in a first direction of the display module where the bending area is located, a waterproof tape attaching one end of the FPCB to the extension area of ​​the display panel, and a conductive member disposed adjacent to the waterproof tape.

[0180] The conductive member can be positioned in the first direction from the waterproof tape.

[0181] The conductive member can be placed between the waterproof tape and the display driving circuit.

[0182] The conductive member may include at least one of a coating member containing a conductive material and a conductive material.

[0183] The above FPCB includes a first cover layer forming a first surface facing the display driving circuit, a second cover layer forming a second surface opposite to the first surface, and at least one metal layer disposed between the first cover layer and the second cover layer, and the first cover layer may include at least one first slit disposed facing the conductive member to expose a portion of the at least one metal layer.

[0184] The second cover layer of the FPCB may include at least one second slit that is positioned adjacent to the display driving circuit and exposes a portion of the at least one metal layer.

[0185] The above at least one first slit and the above at least one second slit may overlap at least partially.

[0186] The display module further includes a conductive plate disposed on the back surface of the display panel and a conductive tape that attaches the other end of the FPCB to the conductive plate, and the first cover layer of the FPCB may include at least one third slit disposed adjacent to the conductive tape and exposing a portion of the at least one metal layer.

[0187] According to one embodiment, the electronic device comprises a display module including a first housing, a second housing foldably coupled to the first housing, and a display panel supported by the first housing and the second housing and configured to be bendable with respect to a folding axis formed by a hinge, wherein the display panel includes a display area forming the front surface of the display module, a bending area extending from one end of the display area and at least a portion of which is bent, and an extension area extending from the bending area to the back surface of the display module, and the display module may include a display driver IC (DDI) disposed on the extension area of ​​the display panel, an FPCB bonded to a portion of the extension area of ​​the display panel and covering the display driver IC as it extends in a first direction of the display module where the bending area is located, a waterproof tape attaching one end of the FPCB to the extension area of ​​the display panel, and a cover member disposed between the FPCB and the display driver IC.

[0188] The above cover member may include a first surface facing the front of the FPCB, a first area disposed between the FPCB and the display driving circuit, and a second area extending from the first area and disposed between the FPCB and the waterproof tape.

[0189] The above cover member may include a second surface that extends from the first surface facing the front of the FPCB and covers the side of the waterproof tape.

[0190] The second surface of the cover member extends to a part of the bending area and can cover a part of the bending area.

[0191] The laminated structure of the above cover member may include a structure in which a non-conductive layer, a conductive layer, and a non-conductive layer are sequentially laminated.

Claims

1. In an electronic device, First housing; A second housing that is foldably coupled to the first housing; and A display module comprising a display panel supported by the first housing and the second housing and configured to be bendable with respect to a folding axis formed by a hinge, wherein The display panel comprises a display area forming the front surface of the display module, a bending area extending from one end of the display area and having at least a portion of it bent, and an extension area extending from the bending area to the back surface of the display module. The above display module is, A display driver circuit (DDI, display driver IC) disposed on the extended area of ​​the above-mentioned display panel; An FPCB bonded to a part of the extension region of the display panel and covering the display driving circuit as it extends in a first direction of the display module where the bending region is located; and It includes a waterproof tape for attaching one end of the above FPCB to the extension area of ​​the above display panel, and The above FPCB is A first cover layer forming a first surface facing the above-mentioned display driving circuit; A second cover layer forming a second surface opposite to the first surface; and It includes at least one metal layer disposed between the first cover layer and the second cover layer, The first cover layer is disposed adjacent to the display driving circuit and includes at least one first slit that exposes a portion of the at least one metal layer. Electronic device.

2. In Paragraph 1, The second cover layer of the above FPCB is disposed adjacent to the display driving circuit and includes at least one second slit that exposes a portion of the at least one metal layer, Electronic device.

3. In Paragraph 2, The above at least one first slit and the above at least one second slit are at least partially overlapping, Electronic device.

4. In Paragraph 1, The above display module is A conductive plate disposed on the back surface of the above-mentioned display panel; and It further includes a conductive tape for attaching the other end of the above FPCB to the above conductive plate, The first cover layer of the above FPCB is disposed adjacent to the conductive tape and includes at least one third slit that exposes a portion of the at least one metal layer, Electronic device.

5. In Paragraph 1, The above at least one first slit is disposed between the display driving circuit and the bending region, Electronic device.

6. In Paragraph 1, The above at least one first slit is A first part disposed in the first direction where the bending area is located from the display driving circuit, A second part disposed in a second direction perpendicular to a first direction from the above-mentioned display driving circuit, and A third part comprising a third portion disposed in a third direction opposite to the second direction from the display driving circuit, Electronic device.

7. In Paragraph 1, The above at least one first slit is A second part disposed in a second direction perpendicular to a first direction in which the banding area is located from the display driving circuit, and A third part positioned in a third direction opposite to the second direction from the display driving circuit. including at least one part of, Electronic device.

8. In electronic devices, First housing; A second housing that is foldably coupled to the first housing; and A display module comprising a display panel supported by the first housing and the second housing and configured to be bendable with respect to a folding axis formed by a hinge, wherein The display panel comprises a display area forming the front surface of the display module, a bending area extending from one end of the display area and having at least a portion of it bent, and an extension area extending from the bending area to the back surface of the display module. The above display module is, A display driver circuit (DDI, display driver IC) disposed on the extended area of ​​the above-mentioned display panel; An FPCB bonded to a part of the extension region of the display panel and covering the display driving circuit as it extends in a first direction of the display module where the bending region is located; A waterproof tape for attaching one end of the above FPCB to the extension area of ​​the above display panel; and A conductive member disposed adjacent to the above waterproof tape, Electronic device.

9. In Paragraph 8, The conductive member is disposed in the first direction from the waterproof tape, Electronic device.

10. In Paragraph 8, The conductive member is disposed between the waterproof tape and the display driving circuit, Electronic device.

11. In Paragraph 8, The above conductive member is A coating member comprising a conductive material, and comprising at least one of a conductive material, Electronic device.

12. In Paragraph 9 or 10, The above FPCB is A first cover layer forming a first surface facing the above-mentioned display driving circuit; A second cover layer forming a second surface opposite to the first surface; and It includes at least one metal layer disposed between the first cover layer and the second cover layer, The first cover layer is positioned to face the conductive member and includes at least one first slit that exposes a portion of at least one metal layer. Electronic device.

13. In Paragraph 12, The second cover layer of the above FPCB is disposed adjacent to the display driving circuit and includes at least one second slit that exposes a portion of the at least one metal layer, Electronic device.

14. In Paragraph 13, The above at least one first slit and the above at least one second slit are at least partially overlapping, Electronic device.

15. In Paragraph 12, The above display module is A conductive plate disposed on the back surface of the above-mentioned display panel; and It further includes a conductive tape for attaching the other end of the above FPCB to the above conductive plate, The first cover layer of the above FPCB is disposed adjacent to the conductive tape and includes at least one third slit that exposes a portion of the at least one metal layer, Electronic device.

16. In electronic devices, First housing; A second housing that is foldably coupled to the first housing; and A display module comprising a display panel supported by the first housing and the second housing and configured to be bendable with respect to a folding axis formed by a hinge, wherein The display panel comprises a display area forming the front surface of the display module, a bending area extending from one end of the display area and having at least a portion of it bent, and an extension area extending from the bending area to the back surface of the display module. The above display module is, A display driver circuit (DDI, display driver IC) disposed on the extended area of ​​the above-mentioned display panel; An FPCB bonded to a part of the extension region of the display panel and covering the display driving circuit as it extends in a first direction of the display module where the bending region is located; A waterproof tape for attaching one end of the above FPCB to the extension area of ​​the above display panel; and A cover member disposed between the FPCB and the display driving circuit, Electronic device.

17. In Paragraph 16, The above cover member is a first surface facing the front surface of the above FPCB, A first region disposed between the FPCB and the display driving circuit, and A second region extending from the first region and disposed between the FPCB and the waterproof tape, Electronic device.

18. In Paragraph 17, The above cover member includes a second surface that extends from the first surface facing the front surface of the FPCB and covers the side of the waterproof tape. Electronic device.

19. In Paragraph 18, The second surface of the cover member extends to a part of the bending area to cover a part of the bending area, Electronic device.

20. In Paragraph 16, The laminated structure of the above-mentioned cover member is, A structure comprising a non-conductive layer, a conductive layer, and a non-conductive layer stacked sequentially Electronic device.

Images