Picker hand for electronic component handler and electronic component handler

Abstract

The present invention relates to a picker hand for an electronic component handler. The picker hand for an electronic component handler, according to the present invention, comprises: a plurality of pickers which can grip or release electronic components; a rotating mechanism which rotates the plurality of pickers along with each other; and a support frame which supports the plurality of pickers and the rotating mechanism, and when the rotating mechanism operates, the plurality of pickers rotate together relative to the support frame. According to the present invention, the position of the electronic component can be set more precisely, and production costs can be reduced.

Description

Picker hand for electronic component handlers and electronic component handlers

[0001] The present invention relates to a picker hand involved in the movement of electronic components in an electronic component handler.

[0002] An electronic component handler is equipment that handles electronic components.

[0003] There are various types of electronic component handlers depending on the purpose for which they handle electronic components.

[0004] Among electronic component handlers, there are electronic component test handlers used to test electronic components.

[0005] An electronic component test handler is equipment that handles electronic components to electrically connect them to a tester.

[0006] As the integration density of electronic components, such as semiconductor devices, continues to increase, circuit line widths are becoming increasingly narrow. Consequently, greater precision is required when connecting electronic components to testers.

[0007] Previously, it was possible to make a proper electrical connection between electronic components and testers with an error range of 20㎛, but now, an error range of 10㎛ or less, or even a few㎛, is required.

[0008] Among electronic components, there are dies that are separated into individual units from the wafer state.

[0009] The die can be completed as a final product by undergoing a packaging process or by stacking it for HBM (High Bandwidth Memory) production and then undergoing a packaging process.

[0010] To perform post-die operations, testing of the die is required.

[0011] Electronic components in die form can be tested by electrically connecting contact pads to a tester.

[0012] Dies are very thin and have fine spacing between contact pads, so they can easily break or shatter. Until now, no automated test capable of adequately supporting the testing of electronic components in the die or HBM state has been proposed. Accordingly, the applicant has proposed a handler according to Korean Published Patent No. 10-2021-0088373 (hereinafter referred to as 'Prior Art 1').

[0013] Prior Art 1 proposes a technique for aligning the positions of electronic components by repositioning them before connecting them to a tester.

[0014] Prior Art 1 scans an electronic component on a test table (named 'chuck' in the prior art) with a camera to determine its current position and readjusts the position of the electronic component to reduce the error range.

[0015] According to Prior Art 1, automated testing of electronic components at the die level is possible by precisely resetting the position of the electronic components.

[0016] According to Prior Art 1, electronic components are moved from a customer tray (such as a ZEDEC tray or ring frame) to a shuttle or from a shuttle to a customer tray.

[0017] A picker hand is used to move electronic components.

[0018] The picker hand has at least one picker capable of gripping or releasing electronic components.

[0019] The electronic components being moved from the customer tray to the shuttle are components that need to be tested, so they must undergo a relocation process later.

[0020] During the process of moving electronic components from the customer tray to the shuttle, if the picker hand places the components in a precise position, the time required for subsequent component repositioning can be reduced.

[0021] However, electronic components placed on the customer tray have a certain degree of positional error.

[0022] It needs to be implemented so that pickers can precisely grasp electronic components from customer trays with a finely reduced positional error.

[0023] Position errors include position on a plane and position in an angle.

[0024] The position on the plane can be made more precise by the movement of the picker hand.

[0025] The precision of each position can be increased by the rotation of the pickers.

[0026] A picker hand can be implemented with only one picker, but it is preferable to implement it with multiple pickers to increase processing capacity.

[0027] If implemented to rotate multiple pickers, the size of the picker hand increases, leading to the following problem.

[0028] As the inertia of the picker hand increases, difficulty arises in setting the position for gripping electronic components.

[0029] Since rotating machines are applied to every picker, the production unit cost also increases.

[0030] [Prior Art Literature]

[0031] [Patent Literature]

[0032] (Patent Document 1) Republic of Korea Published Patent No. 10-2021-0088373

[0033] Technology is required that enables precise angular positioning of electronic components while minimizing the size of the picker hand.

[0034] A picker hand for an electronic component handler according to the present invention comprises: a plurality of pickers capable of gripping or releasing electronic components; a rotating mechanism for rotating the plurality of pickers together; and a support frame for supporting the plurality of pickers and the rotating mechanism; wherein when the rotating mechanism is operated, the plurality of pickers rotate together relative to the support frame.

[0035] The above-described rotating mechanism includes a rotating plate capable of rotating within a predetermined angle range; a rotating shaft coupled to the support frame that provides a rotation reference for the rotating plate; and a rotating motor that provides rotational force required for the rotation of the rotating plate; and the plurality of pickers are coupled to the rotating plate.

[0036] The above-described rotating mechanism includes: a linear moving member that moves linearly by the rotation motor; and a converter that converts the linear moving force of the linear moving member into rotational force and transmits it to the rotating plate.

[0037] The above-described switch comprises: a pair of mutually spaced rollers coupled to the linear moving member; and a transmission member coupled to the rotating plate, with one end disposed between the pair of rollers.

[0038] It further includes an axis changer capable of changing the rotation reference line by moving one end of the above-mentioned rotation axis.

[0039] It further includes a mounting checker for checking the mounting status of electronic components.

[0040] It further includes a positioner for verifying the location of electronic components.

[0041] It further includes a plurality of elevators that individually raise and lower the plurality of pickers mentioned above.

[0042] An electronic component handler according to the present invention comprises: a picker hand for the electronic component handler described above; and a controller for controlling the picker hand.

[0043] The above controller controls the pickers of the picker hand to sequentially grasp electronic components.

[0044] The above controller controls the picker hand to correct the error in the coordinates on the horizontal plane and the error in the angular position of the electronic component whenever the picker hand grasps an individual electronic component.

[0045] According to the present invention, since multiple pickers can all adjust and grip the angular positions of electronic components using only a single rotating mechanism, the inertia due to their own mass is reduced, allowing the position of the electronic components to be set more precisely and reducing production costs.

[0046] FIG. 1 is a conceptual plan view of a handler for testing electronic components to which a picker hand according to the present invention can be applied.

[0047] FIGS. 2 to 11 are reference diagrams for explaining the electronic component test handler of FIG. 1.

[0048] FIG. 12 is a perspective view of a picker hand for an electronic component handler according to the present invention.

[0049] Fig. 13 is a bottom view of the picker hand of Fig. 12.

[0050] Fig. 14 is an excerpt of the picker and elevator applied to the picker hand of Fig. 12.

[0051] FIGS. 15 to 19 are reference diagrams for explaining the picker hand of FIG. 12.

[0052] Preferred embodiments according to the present invention are described by example with reference to the attached drawings, provided that for the sake of brevity, descriptions of well-known or redundant components are omitted or compressed as much as possible.

[0053] The picker hand for an electronic component handler according to the present invention is used in an electronic component handler that handles electronic components. Therefore, as an example of an electronic component handler, a handler for testing electronic components will be described first, and then the picker hand will be described in a different section.

[0054] <Description of Handlers for Electronic Component Testing>

[0055] FIG. 1 is a conceptual plan view of an electronic component test handler (TH, hereinafter abbreviated as 'handler') to which a picker hand for an electronic component handler according to the present invention can be applied.

[0056] The handler (TH) can be divided into a loading section (LU), a relocation section (RP), a connecting section (CP), and a moving section (MP), and includes a transport shuttle (100), a first picker hand (210), a second picker hand (220), a test table (300), a vacuum device (400), a relocation mechanism (500), a moving mechanism (600), and a controller (700).

[0057] The unloading unit (LU) supplies electronic components to be tested or retrieves electronic components for which testing is complete.

[0058] In the relocation section (RP), the positions of the electronic components to be tested supplied from the unloading section (LU) are precisely relocated.

[0059] In the connection section (CP), electronic components whose positions have been precisely repositioned in the relocation section (RP) are electrically connected to the tester.

[0060] In the moving section (MF), electronic components can be moved to exchange electronic components between the unloading section (LU) and the relocation section (RP).

[0061] The moving section (MF) moves electronic components to be tested from the unloading section (LU) to the relocation section (RP), and moves electronic components that have completed testing from the relocation section (RP) to the unloading section (LU).

[0062] A transport shuttle (100) for carrying electronic components is installed in the moving part (MP).

[0063] When viewed in a planar view, the transport shuttle (100) of the moving part (MP) has a portion of one side (the right side in the drawing) overlapping with the unloading part (LU).

[0064] A transport shuttle (100) is provided to transport electronic components between the unloading section (LU) and the relocation section (RP).

[0065] The transport shuttle (100) has a movable transport table (110).

[0066] The transport shuttle (100) may have at least one transport table (110).

[0067] The transport table (110) can move back and forth in one direction.

[0068] The transport table (110) can move back and forth in the X-axis direction.

[0069] In the case where there are multiple transport tables (100), the multiple transport tables (110) may be provided in parallel in the Y-axis direction. In this case, the multiple transport tables (110) need to be implemented to move back and forth in the X-axis direction independently of each other.

[0070] The transport table (110) can move between the first area (A1) on the side overlapping with the unloading section (LU) and the second area (A2) on the side of the relocation section (RP).

[0071] Electronic components can be placed on the transport table (110).

[0072] The transport table (110) has a vacuum structure that fixes electronic components placed on a flat surface by vacuum pressure.

[0073] As shown in the schematic plan view of FIG. 2, the transport table (110) has vacuum holes (VH) and vacuum grooves (VG) formed therein for vacuum-adsorbing electronic components.

[0074] One vacuum hole (VH) and one vacuum groove (VG) form a pair.

[0075] When viewed in a planar view, the vacuum hole (VH) is positioned near the center of the area occupied by the vacuum groove (VG).

[0076] The vacuum pressure coming through the vacuum hole (VH) acts on the electronic component as it is evenly distributed through the vacuum groove (VG).

[0077] Since the electronic component is fixed to the transport table (110) by vacuum pressure, no movement of the electronic component occurs during the process of moving in the X-axis direction while being carried on the transport table (110).

[0078] The vacuum holes (VH) and vacuum grooves (VG) are arranged in a 2x8 matrix.

[0079] Since the loading capacity of the transport table (110) can be increased or decreased, the number of vacuum holes (VH) and vacuum grooves (VG) can also be increased or decreased.

[0080] In the unloading section (LU), electronic components are supplied to the handler (TH) or recovered from the handler (TH).

[0081] Electronic components to be tested are supplied to the handler (TH) through the unloading section (LU), and electronic components that have completed testing are recovered from the handler (TH) through the unloading section (LU).

[0082] Electronic components can be loaded onto a Jetec Tray, Ring Frame, or other types of customer tray and supplied to or retrieved from the handler (TH).

[0083] The structure of the loading / unloading section (LU) may vary depending on the type of customer tray.

[0084] The electronic components to be tested in the unloading section (LU) are loaded onto the transport table (110) in the first area (A1).

[0085] The electronic components that have completed testing and are loaded on the transport table (110) of the first area (A1) are unloaded from the transport table (110) and moved to the unloading section (LU).

[0086] A first picker hand (210) is provided in the unloading section (LU).

[0087] The first picker hand (210) is provided to load electronic components onto the transport table (110) or to unload them from the transport table (110).

[0088] For unloading operations by the first picker hand (210), the transport table (110) must be moved toward the unloading section (LU) and be in the first area (A1).

[0089] The first picker hand (210) carries the electronic components to be tested on the transport table (110) in the first area (A1).

[0090] In the process of the first picker hand (210) moving electronic components from the customer tray (CT) to the transport table (110), it is necessary for the electronic components to be placed on the transport table (100) with their positions precisely adjusted. Therefore, the picker hand for an electronic component handler according to the present invention can be preferably applied as the first picker hand (210).

[0091] The first picker hand (210) picks up the electronic components that have been tested from the transport table (110) in the first area (A1) and moves them to the customer tray (CT).

[0092] The first picker hand (210) has one or more pickers capable of gripping or releasing electronic components (ED).

[0093] The picker can grip electronic components by vacuum pressure.

[0094] The first picker hand (210) can be implemented to improve processing capacity by having four paired pickers.

[0095] For example, as shown in the conceptual diagram of FIG. 3, the first picker hand (210) may have four pickers (P) arranged in a 2x2 matrix form.

[0096] Depending on the embodiment, the number of pickers (P) provided in the first picker hand (210) may be increased or decreased.

[0097] In the relocation section (RP), electronic components to be tested are unloaded from the transport table (110) and loaded onto the test table (300), and the electronic components loaded onto the test table (300) are relocated.

[0098] In the relocation section (RP), a relocation space (RS) is formed for the relocation of electronic components.

[0099] According to the present embodiment, the relocation portion (RP) is positioned on one side of the connection portion (CP) in the X-axis direction.

[0100] The repositioning part (RP) is equipped with a second picker hand (220).

[0101] The second picker hand (220) takes electronic components to be tested from the transport table (110) or loads electronic components that have been tested onto the transport table (110).

[0102] For unloading operations by the second picker hand (220), the transport table (110) must be moved toward the relocation section (RP) and be in the second area (A2).

[0103] The second picker hand (220) takes electronic components to be tested from the transport table (110) in the second area (A2) or loads electronic components that have been tested from the transport table (110) in the second area (A2).

[0104] The second picker hand (220) can be configured in the same way as the first picker hand (210).

[0105] The number of pickers provided in the second picker hand (220) may be different from the number of pickers (P) provided in the first picker hand (210).

[0106] The second picker hand (220) loads the electronic components (ED) to be tested from the transport table (110) in the second area (A2) onto the test table (300) that has been moved to the relocation area (RP).

[0107] In order for the electronic components (ED) to be tested by the second picker hand (220) to be loaded onto the test table (300), the test table (300) must be located in the relocation space (RP).

[0108] The second picker hand (220) loads the electronic components that have been tested and are loaded on the test table (300) onto the transport table (110) in the second area (A2).

[0109] The test table (300) is provided to load electronic components that are unloaded from the transport table (110) by the second picker hand (220).

[0110] The electronic components are electrically connected to the tester while seated on the test table (300).

[0111] As shown in the schematic excerpt of FIG. 4, the test table (300) is in the shape of a disc and has a flat top surface.

[0112] The test table (300) may be in the shape of a square plate when viewed from a flat plane, and in this case, the top surface is also flat.

[0113] The electronic components are placed and loaded on the test table (300) in a manner such that they are placed on the flat upper surface of the test table (300).

[0114] The test table (300) can be moved in the X-axis, Y-axis and Z-axis directions.

[0115] The test table (300) can be rotated in the Θ-axis direction with the vertical line (V) passing through the center of the test table (300) in the Z-axis direction as the axis of rotation.

[0116] Generally, when an electronic component (ED) is moved to a test table (300), shock or inertia accompanying the movement occurs.

[0117] Impact or inertia, etc., can disrupt the position of the electronic components (ED) loaded on the test table (300). To prevent this, vacuum channels (311) are formed in the area where the electronic components (ED) are loaded on the test table (300).

[0118] The vacuum structure of the test table (300) for fixing the electronic component (ED) may be the same as the vacuum structure of the transport table (110).

[0119] The test table (300) is a characteristic feature of the present invention, so it will be explained in more detail later in a different section.

[0120] When an electronic component is placed on the test table (300) by the second picker hand (220), the electronic component can be placed in the same position by vacuum pressure.

[0121] The vacuum device (400) provides vacuum pressure to the vacuum channels (311) in the test table (300) through a vacuum circuit (not shown).

[0122] The vacuum device (400) may be configured with only a structure that is installed in a factory and distributes vacuum pressure supplied from outside the handler (TH) to each electronic component through a vacuum circuit.

[0123] The vacuum pressure provided by the vacuum device (400) is transmitted to the electronic components through the vacuum channel (311), and the electronic components loaded on the test table (300) are fixed in position by the vacuum pressure.

[0124] The vacuum channels (311) are implemented to be selectively opened and closed depending on the control of the vacuum circuit.

[0125] The electronic components may optionally be fixed to the test table (300) or detached from the test table (300).

[0126] The electronic components (ED) are electrically connected to the tester while loaded on the test table (300).

[0127] The electrical connection between the electronic components loaded on the test table (300) and the tester is made via a test board (TB).

[0128] The test board (TB) is fixedly coupled to the handler (TH) at the connection part (CP).

[0129] A test space (TS) is formed below the test board (TB) where a test table (300) can be positioned.

[0130] The test board (TB) has test pins that make electrical contact with electronic components.

[0131] The electronic components loaded on the test table (300) that has been moved to the connection part (CP) are electrically connected to the test pins of the test board (TB).

[0132] The test board (TB) may have any structure as long as it has a configuration that can be electrically connected to electronic components.

[0133] The test board (TB) may be a widely known probe card. In this case, it is preferable that the test table (300) be provided in the form of a disc, just like the probe card.

[0134] The test board (TB) may have a structure having socket modules. Test pins are provided in the socket modules, and the socket modules are installed in the socket body. In this case, it is preferable that the test table (300) be provided in the shape of a square plate.

[0135] As shown in the bottom view of FIG. 5, test zones (TZ) corresponding to one electronic component are arranged on the test board (TB).

[0136] The test zones (TZ) correspond one-to-one with the electronic components loaded on the test table (300).

[0137] One test zone (TZ) is equipped with test pins (t) for electrically connecting to one electronic component.

[0138] The test pins (t) in one test zone (TZ) form a set of clusters that form the test zone (TZ) and are electrically connected to the electronic components.

[0139] When the test board (TB) is a probe card, a set of test pins (t) is densely arranged in the test area (TZ). Here, the set of test pins (t) corresponds to terminals on a single electronic component. The test pins (t) on the probe card are also commonly referred to as probe pins.

[0140] In the case where the test board (TB) has a structure with a socket module, a set of test pins (t) are installed in one socket module (22), and one socket module (22) forms one test zone (TZ). Therefore, replacing one socket module (22) replaces one test zone (TZ).

[0141] The test area (TZ) and the electronic component must be aligned. If the coordinates of the electronic component on the test table (300) on the XY plane do not match the coordinates of the test area (TZ), a defect occurs in the electrical connection between the electronic component and the tester.

[0142] As shown in the conceptual example of FIG. 6, if an electronic component (ED) on the test table (300) is in an angular position having a rotation angle (Θ1) twisted in the Θ-axis direction with respect to the test zone (TZ), a failure occurs in the electrical connection between the electronic component (ED) and the tester. To prevent this, all test zones (TZ) of the test board (TB) and all electronic components (ED) on the test table (300) must be aligned.

[0143] By relocating the electronic component (ED) to align it with the test zone (TZ), the test zone (TZ) and the electronic component (ED) can be aligned.

[0144] A relocation mechanism (500) is provided to realize alignment between the test zone (TZ) and the electronic component (ED).

[0145] According to the present embodiment, the electronic component (ED) is moved from the transport table (110) to the test table (300) by the second picker hand (220). During this process, an error in the position of the electronic component (ED) may occur due to an operating error or operating shock of the second picker hand (220).

[0146] The positions or angular positions of the electronic components (ED) that are placed and loaded on the test table (300) by the second picker hand (220) may differ in the XY plane, and the electronic components (ED) loaded on the test table (300) and the test zones (TZ) of the test board (TB) may not coincide with each other.

[0147] It does not matter if the error tolerance between the electronic component (ED) and the test zone (TZ) is wide. However, the reality is that the packaged semiconductor device requires a precision of within 30㎛, and in the case of the die or HBM, a precision of within 5㎛ is required.

[0148] In the present invention, when the second picker hand (220) moves electronic components (ED) from the transport table (110) to the test table (300), the electronic components (ED) are loaded into temporary zones and then relocated from the temporary zones to the fixed zones.

[0149] The temporary area may not be a set location, but any location where the electronic component (ED) is placed on the test table (300) by the second picker hand (220).

[0150] The temporary area is a location that is not set or fixed by the controller (700) and is arbitrarily determined by the operation of the second picker hand (220).

[0151] For example, when the second picker hand (220) places an electronic component (ED) on the test table (300), the area where the electronic component (ED) is placed becomes a temporary area.

[0152] Exaggerated Figure 7 shows an example of a temporary zone (BZ) on a test table (300).

[0153] All temporary zones (BZ) can have their own positions on the X-axis, Y-axis, and Θ-axis.

[0154] The fixed position zone refers to the location where the electronic component (ED) and the test zone (TZ) coincide. The exaggerated figure 8 shows the relationship between the temporary zone (BZ) and the fixed position zone (RZ) on the test table (300).

[0155] The RZ (Right Zone) may be pre-set.

[0156] The positioning zone (RZ) can be obtained from an image precisely scanned by a separate high-magnification camera attached to the test table (300) before the test operation of the handler (TH).

[0157] As shown in Fig. 8, the temporary zone (BZ) may have errors in the X-axis, Y-axis, and Θ-axis directions with respect to the fixed zone (RZ).

[0158] A relocation mechanism (500) is provided to precisely relocate the position of an electronic component (ED) loaded on a test table (300) in a relocation space (RS).

[0159] The relocation mechanism (500) is provided to relocate electronic components (ED) loaded in the temporary zone (BZ) of the test table (300) to the fixed zone (RZ) by the second picker hand (220).

[0160] According to the present embodiment, the second picker hand (220) loads the electronic components (ED) to be tested, which are unloaded from the transport table (110), into a temporary zone (BZ). Then, a relocation mechanism (500) is utilized to move the electronic components (ED) in the temporary zone (BZ) to the designated zone (RZ).

[0161] As shown in the schematic diagram of FIG. 9, the relocation mechanism (500) includes a relocation picker (510), a relocation camera (520), and an elevator (530).

[0162] The relocation mechanism (500) has its position fixed.

[0163] The relocation mechanism (500) can be fixedly mounted on the frame forming the skeleton of the handler (TH).

[0164] The repositioning picker (510) can grasp or release the electronic component (ED). The repositioning picker (510) can grasp the electronic component (ED) by vacuum pressure.

[0165] The repositioning picker (510) is fixed in a horizontal position in the X-axis and Y-axis directions.

[0166] The repositioning picker (510) can be provided to be able to move up and down.

[0167] The relocation camera (520) is positioned apart from the relocation picker (510).

[0168] The repositioning camera (520) is fixed in position in the horizontal direction, which is the X-axis and Y-axis direction.

[0169] A repositioning camera (520) is provided to photograph electronic components (ED).

[0170] As in the example of FIG. 10, the repositioning camera (520) photographs identification marks (M: M1, M2) on the electronic component (ED). The identification marks (M) may be arranged diagonally opposite each other.

[0171] However, the object photographed by the relocation camera (520) to relocate the electronic component (ED) does not need to be limited to the identification mark (M).

[0172] The object being photographed by the repositioning camera (520) may be replaced with the edge of the electronic component (ED), the identification pad or identification pattern of the electronic component (ED), or other identifiable object.

[0173] The relocation picker (510) and the relocation camera (520) are connected and fixed as a single module.

[0174] On a plane, the mutual placement positions of the relocation picker (510) and the relocation camera (520) are fixed.

[0175] The elevator (530) raises the relocation picker (510).

[0176] By raising the repositioning picker (510) by the elevator (530), the repositioning picker (510) can grasp the electronic component (ED) placed on the test table (300) or properly place the electronic component (ED) on the test table (300).

[0177] The moving mechanism (600) can move the test table (300) in the horizontal direction, which is the X-axis and Y-axis direction.

[0178] The moving mechanism (600) can rotate the test table (300) in the Θ-axis direction.

[0179] The moving mechanism (600) can move the test table (300) up and down in the Z-axis direction.

[0180] As shown in the schematic excerpt of FIG. 11, the moving mechanism (600) includes a rotating mechanism (610), an elevator (620), a first moving mechanism (640), and a second moving mechanism (660).

[0181] The rotator (610) rotates the test table (300) in the Θ-axis direction.

[0182] The test table (300) can be rotated by the rotating mechanism (610) so that the angular position of the electronic component (ED) in the Θ-axis direction can be adjusted.

[0183] The elevator (620) raises the test table (300).

[0184] The test table (300) is connected to the elevator (620) via a rotating mechanism (610).

[0185] When the test table (300) is raised by the elevator (620), the electronic components (ED) of the test table (300) come into contact with the test pins (t), thereby electrically connecting the electronic components (ED) to the tester. When the test table (300) is lowered by the elevator (620), the contact between the electronic components (ED) and the test pins (t) is released, and the test table (300) becomes capable of moving in a horizontal direction.

[0186] The first moving device (640) moves the test table (300) in the X-axis direction.

[0187] As the test table (300) is moved in the X-axis direction by the first moving device (640), the test table (300) can be selectively positioned in the relocation space (RS) and the test space (TS).

[0188] When the test table (300) is in the test space (TS), an electrical connection is made between the electronic component (ED) and the tester by raising the test table (300).

[0189] The second mover (660) moves the test table (300) in the Y-axis direction.

[0190] The above-mentioned moving mechanism (600) has three functions.

[0191] The first function is to move the test table (300) between the relocation space (RS) and the test space (TS).

[0192] The second function is to electrically connect or disconnect electronic components (ED) to the tester.

[0193] The third function is for the relocation of electronic components (ED) in the relocation space (RS).

[0194] Since the position of the repositioning picker (510) is fixed in the plane, the test table (300) moves in the horizontal X-axis and Y-axis directions or rotates in the Θ-axis direction to adjust the position of the electronic component (ED) on the horizontal plane.

[0195] Depending on the implementation, the test table (300) is raised in parallel with the raising and lowering of the relocation picker (510) during the relocation process of the electronic component (ED), thereby enabling the gripping or release of the electronic component (ED) by the relocation picker (510).

[0196] Here, the operation during the relocation of electronic components (ED) is explained.

[0197] As shown in Fig. 8, the temporary zone (BZ) of the electronic component (ED) may differ from the fixed zone (RZ) in the X-axis, Y-axis, and Θ-axis directions.

[0198] During the relocation process, the elevator (620) maintains the test table (300) at a certain height, thereby positioning the electronic component (ED) at the focal length of the relocation camera (520).

[0199] The relocation camera (520) photographs the electronic component (ED) on the test table (300) and identifies the temporary zone (BZ) through the location of the identification mark (M).

[0200] When the temporary zone (BZ) is identified, the first mover (640) and the second mover (660) operate to position the center of the temporary zone (BZ) below the relocation picker (510), and the elevator (530) operates to lower the relocation picker (510).

[0201] When the repositioning picker (510) adsorbs and grasps an electronic component (ED) located in the temporary zone (BZ) of the test table (300) using vacuum pressure, the elevator (530) operates to raise the repositioning picker (510). Afterward, the first moving device (640) and the second moving device (660) operate to align the center of the fixed position zone (RZ) with the center of the electronic component (ED) grasped by the repositioning picker (510), and the rotating device (610) operates to align the electronic component (ED) with the fixed position zone (RZ). In this state, the elevator (530) operates to lower the repositioning picker (510), thereby allowing the electronic component (ED) grasped by the repositioning picker (510) to settle in the fixed position zone (RZ).

[0202] When the electronic component (ED) is fixed to the test table (300) by the vacuum pressure applied to the vacuum channel (311) while the electronic component (ED) is seated in the positioning zone (RZ), the repositioning picker (510) releases the grip of the electronic component (ED). Then, the repositioning picker (510) rises and begins repositioning the next electronic component (ED).

[0203] If precise control of the operation of the second picker hand (220) is possible, the second picker hand (220) may be equipped with a camera, and the relocation mechanism (500) may be omitted. In this case, the relocation of the electronic component (ED) can be achieved by utilizing the second picker hand (220).

[0204] Furthermore, the second picker hand (220) may be implemented to move the electronic component (ED) directly to the positioning zone (RZ) when moving it from the transport table (110) to the test table (300).

[0205] The controller (700) controls the components necessary for the proper operation of the handler (TH), such as the transport shuttle (100), the first picker hand (210), the second picker hand (220), the vacuum device (400), the relocation mechanism (500), and the moving mechanism (600).

[0206] The operation method of the handler (TH) is explained from the perspective of the logistics of electronic components (ED).

[0207] In the unloading section (LU), the first picker hand (210) loads electronic components (ED) to be tested onto a transport table (110) in the first area (A1).

[0208] When all the electronic components (ED) are loaded onto the transport table (110), the transport shuttle (100) operates and moves the transport table (110) to the second area (A2).

[0209] The second picker hand (220) unloads electronic components (ED) from the transport table (110) in the second area (A2) and moves them to the test table (300) in the relocation area (RS). At this time, the locations of the electronic components (ED) loaded onto the test table (300) by the second picker hand (220) are temporary zones (BZ).

[0210] When all the electronic components (ED) to be tested are loaded onto the test table (300), the controller (700) operates the relocation mechanism (500) and the moving mechanism (600) to relocate the electronic components (ED) from the temporary zones (BZ) to the fixed zones (RZ).

[0211] When the rearrangement of electronic components (ED) on the test table (300) is completed, the moving mechanism (600) operates to move the test table (300) to the test space (TS) formed in the connection part (CP). Afterwards, the connector (700) operates to raise the test table (300) toward the test board (TB) so that the electronic components (ED) are electrically connected to the tester.

[0212] When the testing of the electronic components (ED) is finished, the test table (300) is moved to the relocation section (RP) by the moving mechanism (600). Then, the second picker hand (220) moves the electronic components (ED) that have completed testing to the transport tray (110) in the second area (A2), and the transport tray (110) filled with the electronic components (ED) that have completed testing moves to the first area (A1). Subsequently, the first picker hand (210) unloads the electronic components (ED) that have completed testing from the transport table (110) and loads them onto an empty customer tray.

[0213] Based on the basic operation method described above, the electronic component (ED) is supplied to the tester for testing, and is retrieved after the test is completed.

[0214] <Explanation of Pickerhand>

[0215] FIG. 12 is a perspective view of a picker hand (200) according to one embodiment of the present invention, FIG. 13 is a bottom view of the picker hand (200) of FIG. 12, and FIG. 14 is an excerpt.

[0216] A picker hand (200) according to one embodiment of the present invention includes four pickers (231 to 234), four elevators (241 to 244), a rotating mechanism (250), a support frame (260), an axis changer (270), a seating confirmation device (280), and a position confirmation device (290).

[0217] The picker (231 to 234) can adsorb and hold an electronic component (ED) using vacuum pressure or release the grip.

[0218] It is sufficient for the pickers (231 to 234) to be provided in multiple numbers of two or more.

[0219] The elevator (241 to 244) raises the picker (231 to 234).

[0220] One elevator (241 to 244) is provided for each picker (231 to 234).

[0221] The elevator (241 to 244) is combined with the picker (231 to 234).

[0222] The pickers (231 to 234) and elevators (241 to 244) are connected to each other via an installation block (IB).

[0223] Four elevators (241 to 244) individually lift the pickers (231 to 234).

[0224] The pickers (231 to 234) can be individually lifted by elevators (241 to 244).

[0225] The rotating mechanism (250) rotates four pickers (231 to 234) together.

[0226] The rotating mechanism (250) rotates four pickers (231 to 234) and four elevators (241 to 244) together.

[0227] The rotating mechanism (250) rotates the pickers (231 to 234) and elevators (241 to 244) using a vertical line as the rotation reference line.

[0228] As shown in the excerpt of FIG. 15, the rotating mechanism (250) includes a rotating plate (251), a rotating shaft (252), a rotating motor (253), a linear moving member (254), and a switch (255).

[0229] The rotating plate (251) can rotate within a predetermined angle range.

[0230] The rotating plate (251) rotates relative to the support frame (260).

[0231] The range of rotation angles of the turntable (251) can be set to correspond to the error range for the rotation angle of the electronic component (ED) allowed in the customer tray (CT).

[0232] As shown in one example of FIG. 16, the rotation angle of the rotating plate (251) can be set by taking into account the maximum rotation angle (Θ) of the electronic component (ED) that can be allowed within the seating groove (AG) of the customer tray (CT) and the operating error of the rotating mechanism (250).

[0233] For example, the rotation angle of the turntable (251) can be set to a maximum of +10 degrees to -10 degrees.

[0234] If the customer tray (CT) is manufactured more precisely or the operating precision of the rotating mechanism (250) is high, the range of the rotation angle of the rotating plate (251) may be set within the range of +3 degrees to -3 degrees.

[0235] An installation block (IB) is attached to the rotating plate (251).

[0236] Four pickers (231 to 234) and four elevators (241 to 244) are connected to a rotating plate (251) via an installation block (IB).

[0237] The rotation axis (252) provides a rotation reference for the rotating plate (251).

[0238] The rotating plate (241) can rotate within a predetermined angle range using the rotation axis (252) as the rotation reference line.

[0239] As the rotating plate (241) rotates, the pickers (231 to 234) coupled to the rotating plate (241) also rotate within a predetermined angle range using the rotation axis (252) as the rotation reference line.

[0240] The rotation axis (252) is positioned approximately on a vertical line.

[0241] The rotation axis (252) is connected to the support frame (260), and one side of the rotation plate (251) is connected to the rotation axis (252).

[0242] The rotary motor (253) generates the rotational force required for the rotation of the rotating plate (251).

[0243] The rotational force generated by the rotary motor (253) is provided to the rotating plate (251).

[0244] When the rotary motor (253) is operated, the rotating plate (251) rotates with the rotation axis (252) as the rotation reference line.

[0245] The linear movement member (254) moves in a straight line in the forward and backward direction, which is a horizontal direction perpendicular to the vertical line.

[0246] The linear movement member (254) is screw-coupled to the motor shaft (253s) of the rotary motor (253).

[0247] When the rotary motor (253) is operated, the linear moving member (254) moves linearly along the guide rail (GR) in a horizontal direction.

[0248] The picker hand (200) may be equipped with an LM guide including a guide rail (GR) for linear movement of the linear movement member (254).

[0249] The converter (255) converts the linear movement force of the linear movement member (254) into rotational force.

[0250] The rotational force converted by the converter (255) is transmitted to the rotating plate (251).

[0251] The converter (255) includes a pair of rollers (255r) and a transmission member (255d).

[0252] A pair of rollers (255r) are connected to a linear moving member (254).

[0253] A pair of rollers (255r) are spaced apart from each other.

[0254] The transmission member (255d) is connected to the rotating plate (251).

[0255] The transmission member (255d) is fixed to the rotating plate (251).

[0256] One end (T1) of the transmission member (255d) protrudes toward the linear moving member (254) and is positioned between a pair of rollers (255r), and the other end (T2) is connected to the rotating plate (251).

[0257] The support frame (260) supports the pickers (231 to 234) and the rotating mechanism (250).

[0258] The support frame (260) supports the rotational axis (252) and thereby supports the rotational plate (251) coupled to the rotational axis (252).

[0259] When the rotating mechanism (250) is operated, the rotating plate (251) rotates relative to the support frame (260).

[0260] FIG. 17 shows a rotational state in which a rotating plate (251) rotates relative to a support frame (260) according to the operation of a rotating mechanism (250).

[0261] The support frame (260) supports the pickers (231 to 234) and elevators (241 to 244) coupled to the turntable (251) by supporting the turntable (251).

[0262] When the rotating mechanism (250) is operated, the pickers (231 to 234) connected to the rotating plate (251) rotate relative to the support frame (260).

[0263] Since the rotary motor (253) and the guide rail (GR) are connected to the support frame (260), the rotary motor (253) and the guide rail (GR) are supported by the support frame (260).

[0264] The linear moving member (254) is supported by a support frame (260) via a rotary motor (253) and a guide rail (GR).

[0265] The switch (255) is supported by a support frame (260) via a rotating plate (251) and a linear moving member (254).

[0266] The axis changer (270) changes the rotation reference line of the rotation axis (252).

[0267] The shaft changer (270) is coupled to the support frame (260).

[0268] As shown in the exaggerated example of FIG. 18, the axis changer (270) can change the rotation reference line of the rotation axis (252) by pushing or pulling the top of the rotation axis (252).

[0269] The shaft changer (270) may be operated manually, but may also be equipped with a motor to enable automatic operation.

[0270] The lower end of the rotation axis (252) is connected to the support frame (260) by a connecting pin (JP).

[0271] The connecting pin (JP) functions as a reference point when the upper end of the rotation axis (252) rotates by the axis changer (270).

[0272] As shown in the exaggerated example of FIG. 19, the axis changer (270) is operated so that the pickers (231 to 234) are positioned to correspond to each vertical line (V1, V2).

[0273] Since the shaft changer (270) takes into account the fine manufacturing tolerance of the picker hand (200), the amount of change in the rotation reference line of the rotation axis (252) by the shaft changer (270) is very small.

[0274] The mounting confirmation device (280) checks whether the electronic components (ED) are properly mounted on the customer tray (CT).

[0275] For example, the settling confirmation device (280) can be implemented with a laser irradiator (281), a reflector (282), and a camera (283) as in Korean Patent Publication No. 10-2020-0011352.

[0276] The positioning device (290) accurately determines the location of the electronic component (ED).

[0277] The location of the electronic component (ED) includes coordinate positions on a horizontal plane and rotational angle positions.

[0278] For example, the positioner (290) can be implemented as a coaxial illumination camera as in Korean Patent Publication No. 10-2020-0011352.

[0279] Next, the operation related to the picker hand (200) according to the present invention is examined from the perspective of the first picker hand (210).

[0280] Before operating the electronic component handler normally, the manager operates the pickers (231 to 234)) through the axis changer (270) so that they align with each vertical line (V1, V2).

[0281] When the electronic component handler is activated, the controller (700) moves the picker hand (200) upward on the customer tray (CT).

[0282] The controller (800) determines whether the electronic components (ED) are properly seated on the customer tray (CT) through the seating confirmation device (280).

[0283] If the electronic components (ED) are poorly seated, the controller (700) causes a jam.

[0284] If the electronic components (ED) are properly seated, the controller (700) determines the coordinates and rotation angles of the electronic components (ED) through the position checker (290).

[0285] Afterwards, the controller (700) moves the picker hand (200) to sequentially raise and lower the four pickers (231 to 234) and sequentially picks up four electronic components (ED) by the picker hand (200).

[0286] Errors in the coordinates of the electronic component (ED) on the horizontal plane are appropriately corrected by determining the gripping position through the movement of the picker hand (200).

[0287] The error in the position of the electronic component (ED) is appropriately corrected by the operation of the rotating mechanism (250).

[0288] Whenever the picker hand (200) grasps an individual electronic component (ED), the error in the coordinates on the horizontal plane and the error in the angular position of the electronic component (ED) are corrected.

[0289] Correction of errors in coordinates on the horizontal plane and errors in angular positions of the electronic component (ED) is repeated whenever the picker hand (200) grasps one electronic component (ED).

[0290] When the picker hand (200) sequentially picks up all four electronic components (ED), the controller (700) moves the electronic components (ED) picked up by the picker hand (200) to the transport table (110).

[0291] When the picker hand (200) places the electronic components (ED) onto the transport table (110), it is sufficient to place four electronic components (ED) at once.

[0292] As seen above, the first picker hand (210) may be primarily considered as the target to which the picker hand (200) according to the present invention is applied.

[0293] However, depending on the implementation, the picker hand (200) according to the present invention may be applied as a second picker hand (220) or may also be applied to other electronic component handlers.

[0294] The embodiments described above are merely preferred examples of the present invention and may have various applications. Therefore, the present invention should not be understood as being limited only to the contents described above. Instead, the scope of the present invention should be understood as the separately described claims and their equivalents.

Claims

1. Multiple pickers capable of gripping or releasing electronic components; A rotating mechanism for rotating the above plurality of pickers together; and A support frame supporting the plurality of pickers and the rotating mechanism; comprising When the above-mentioned rotating mechanism operates, the plurality of pickers rotate together relative to the support frame. Picker hand for electronic component handlers.

2. In Paragraph 1, The above rotating mechanism A rotating plate capable of rotating within a predetermined angle range; A rotational axis coupled to the support frame, providing a rotational reference for the above-mentioned rotating plate; and A rotary motor that provides the rotational force required for the rotation of the above-mentioned rotating plate; comprising, The above plurality of pickers are coupled to the above-mentioned rotating plate. Picker hand for electronic component handlers.

3. In Paragraph 2, The above rotating mechanism A linear moving member that moves linearly by the above rotary motor; A converter that converts the linear movement force of the linear movement member into rotational force and transmits it to the rotating plate; Picker hand for electronic component handlers.

4. In Paragraph 3, The above switch A pair of mutually spaced rollers coupled to the above linear moving member; A transmission member coupled to the above-mentioned rotating plate, with one end disposed between the above-mentioned pair of rollers; comprising Picker hand for electronic component handlers.

5. In Paragraph 2, A shaft changer capable of changing a rotation reference line by moving one end of the above-mentioned rotation axis; further comprising Picker hand for electronic component handlers.

6. In Paragraph 1, A mounting verification device for verifying the mounting status of electronic components; further comprising Picker hand for electronic component handlers.

7. In Paragraph 1, A positioner for verifying the location of electronic components; further comprising Picker hand for electronic component handlers.

8. In Paragraph 1, A plurality of elevators for individually raising and lowering the plurality of pickers; further comprising Picker hand for electronic component handlers.

9. A picker hand for an electronic component handler according to any one of paragraphs 1 through 8; and A controller for controlling the above picker hand; comprising Electronic component handler.

10. In Paragraph 9, The above controller controls the pickers of the picker hand to sequentially grasp electronic components. Electronic component handler.

11. In Paragraph 10, The above controller controls the picker hand to correct errors in the coordinates on the horizontal plane and errors in the angular position of the electronic component whenever the picker hand grasps an individual electronic component. Electronic component handler.

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