Rib turbulators for coolant channels of substrate supports

Abstract

A substrate support includes a baseplate, a coolant channel, and a plurality of ribs. The coolant channel includes a groove arranged in the baseplate. The groove includes a plurality of turns. The plurality of ribs is arranged in one or more of the turns in a flow path of a coolant in the coolant channel.

Description

Attorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0ARIB TURBULATORS FOR COOLANT CHANNELS OF SUBSTRATE SUPPORTSCROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of U.S. Provisional Application No.63 / 776,784, filed on March 24, 2025. The entire disclosure of the above application is incorporated herein by reference.FIELD

[0002] The present disclosure relates generally to substrate processing systems and more particularly to rib turbulators for coolant channels used in substrate supports.BACKGROUND

[0003] The background description provided here is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.

[0004] Substrate processing systems may be used to perform etching, deposition, and / or other treatment of substrates such as semiconductor wafers. Examples of the processes that may be performed on a substrate include, but are not limited to, etching, deposition, and cleaning processes. Substrate processing systems (also called tools) may comprise multiple processing chambers (also called process modules). Some processing chambers in a tool may perform the same process on different substrates. In some tools, different processes may be performed in different processing chambers. For example, different processes may be performed sequentially on the same substrate by moving the substrate from one processing chamber to another. During processing, a substrate is arranged on a substrate support such as a pedestal or an electrostatic chuck (ESC) in a processing chamber of a tool. A gas delivery system supplies a gas mixture to the processing chamber to treat the substrate. Plasma may be struck to enhance chemical reactions in the processing chamber.SUMMARY

[0005] A substrate support comprises a baseplate, a coolant channel, and a plurality of ribs. The coolant channel comprises a groove arranged in the baseplate. The grooveAttorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0Acomprises a plurality of turns. The plurality of ribs is arranged in one or more of the turns in a flow path of a coolant in the coolant channel.

[0006] In additional features, the ribs extend upwards from a bottom of the groove and across sidewalls of the coolant channel.

[0007] In additional features, the ribs partially obstruct a flow of the coolant and wherein the obstruction generates turbulence in the flow of the coolant.

[0008] In additional features, a height of the ribs is less than a height of the groove.

[0009] In additional features, at least one of the ribs has the same height as at least another one of the ribs.

[0010] In additional features, at least two successive ones of the ribs have the same height.

[0011] In additional features, at least two successive ones of the ribs have different heights.

[0012] In additional features, the ribs in at least a portion of one of the turns have the same height.

[0013] In additional features, a first set of the ribs in one of the turns has a first height, and a second set of the ribs in the one of the turns has a second height that is different than the first height.

[0014] In additional features, a first set of the ribs in a first one of the turns has a first height, and a second set of the ribs in a second one of the turns has a second height that is different than the first height.

[0015] In additional features, the ribs in at least two of the turns have the same height.

[0016] In additional features, the ribs in at least two of the turns have different heights.

[0017] In additional features, a set of the ribs in one of the turns are equidistant from each other.

[0018] In additional features, the ribs in at least a portion of one of the turns are equidistant from each other.

[0019] In additional features, a first set of the ribs in one of the turns are separated from each other by a first distance, and a second set of the ribs in the one of the turns are separated from each other by a second distance that is different than the first distance.Attorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0A

[0020] In additional features, a first set of the ribs in a first one of the turns are separated from each other by a first distance, and a second set of the ribs in a second one of the turns are separated from each other by a second distance that is different than the first distance.

[0021] In additional features, the ribs in at least two of the turns are separated from each other by the same distance.

[0022] In additional features, at least one of the ribs has the same length as at least another one of the ribs.

[0023] In additional features, at least two successive ones of the ribs have the same length.

[0024] In additional features, at least two successive ones of the ribs have different lengths.

[0025] In additional features, the ribs in at least a portion of one of the turns have the same length.

[0026] In additional features, a first set of the ribs in one of the turns has a first length, and a second set of the ribs in the one of the turns has a second length that is different than the first length.

[0027] In additional features, a first set of the ribs in a first one of the turns has a first length, and a second set of the ribs in a second one of the turns has a second length that is different than the first length.

[0028] In additional features, the ribs in at least two of the turns have the same length.

[0029] In additional features, the ribs in at least two of the turns have different lengths.

[0030] In additional features, the ribs are polygonal.

[0031] In additional features, edges of the ribs are chamfered.

[0032] In additional features, at least one of the ribs comprises at least one opening or hole.

[0033] In additional features, at least two successive ones of the ribs comprise at least one opening, and the openings in the at least two successive ones of the ribs are not aligned with each other.Attorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0A

[0034] In additional features, at least one of the ribs comprises two portions each of a different height.

[0035] In additional features, at least one of the ribs in one of the turns extends at an angle relative to a cross-section of the one of the turns.

[0036] In additional features, a first one of the ribs in one of the turns extends at a first angle relative to a length of the one of the turns, and a second one of the ribs in the one of the turns extends at a second angle that is different than the first angle relative to the length of the one of the turns.

[0037] In additional features, at least one of the ribs comprises two portions that extend from sidewalls of one of the turns forming a shape of the letter “V,” and a junction of the two portions points in a direction opposite to a direction of a flow of the coolant.

[0038] Further areas of applicability of the present disclosure will become apparent from the detailed description, the claims and the drawings. The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the disclosure.BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The present disclosure will become more fully understood from the detailed description and the accompanying drawings, wherein:

[0040] FIG. 1 shows a first example of a substrate processing system comprising a processing chamber that includes a substrate support comprising a coolant channel according to the present disclosure;

[0041] FIG. 2 shows a second example of a substrate processing system comprising a processing chamber that includes a substrate support comprising a coolant channel according to the present disclosure;

[0042] FIG. 3 schematically shows a substrate support comprising a coolant channel according to the present disclosure;

[0043] FIG. 4 schematically shows the coolant channel of the present disclosure that can be used in the substrate supports of FIGS. 1-3;

[0044] FIG. 5 shows a bottom view of an upper plate of the coolant channel of FIG. 4;

[0045] FIG. 6 shows a top view of a lower plate of the coolant channel of FIG. 4;Attorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0A

[0046] FIGS. 7-9 show cross-sectional views of the upper plate, the lower plate comprising rib turbulators, and the coolant channel formed by the upper and lower plates according to the present disclosure;

[0047] FIGS. 10-12 show cross-sectional views of the upper plate comprising the rib turbulators, the lower plate, and the coolant channel formed by the upper and lower plates according to the present disclosure;

[0048] FIG. 13 shows a vertical section of a portion of a turn of the coolant channel comprising the rib turbulators showing how coolant flowing over the rib turbulators minimizes hot spots and cold spots according to the present disclosure;

[0049] FIG. 14 shows a vertical section of a portion of a turn of the coolant channel comprising the rib turbulators showing examples geometrical features of the rib turbulators according to the present disclosure;

[0050] FIG. 15 shows a view of a portion of a turn of the coolant channel with coolant flowing over the rib turbulators according to the present disclosure;

[0051] FIG. 16 shows an example of turbulence generated by coolant flowing over the rib turbulators according to the present disclosure;

[0052] FIGS. 17-21 show examples of various configurations and arrangements of the rib turbulators in the coolant channel according to the present disclosure; and

[0053] FIG. 22 shows examples of various shapes for the rib turbulators in the coolant channel according to the present disclosure.

[0054] In the drawings, reference numbers may be reused to identify similar and / or identical elements.DETAILED DESCRIPTION

[0055] Some processes use a plasma to process a substrate. The plasma tends to heat the substrate. To control a temperature of the substrate, a substrate support comprises a coolant channel disposed in a baseplate through which a coolant is circulated. The coolant channel comprises many turns and extends between a center region and a periphery of the substrate support.

[0056] However, the temperature of the substrate may not be uniform across the substrate (from center to an outer diameter or OD of the substrate). For example, the substrate may have cold spots and hot spots. Cold spots are cooler than neighboringAttorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0A(adjacent) areas of the substrate. Hot spots are warmer than neighboring (adjacent) areas of the substrate. The temperature nonuniformity due to the cold and hot spots causes undesirable variations in the processing of the substrate.

[0057] Many techniques are used to reduce the temperature nonuniformity. For example, a fin-like structure may be disposed along a length of the coolant channel. The coolant channel may include bends at some locations (e.g., in a portion of a turn) to address temperature nonuniformities near those locations. Spacing between some of the turns of the coolant channel may be adjusted. However, these techniques may not reduce the temperature nonuniformity to an acceptable level.

[0058] The present disclosure provides features called rib turbulators, which are obstacles or dams, that are disposed at various locations in the turns of the coolant channel as described below in detail. Briefly, each rib turbulator partially obstructs the flow of the coolant through the coolant channel and generates turbulence in the flow of the coolant through the coolant channel. The turbulence generates secondary flows in the vicinity of each rib turbulator. The secondary flows interact with the walls of the coolant channel and enhance heat transfer from the walls by forming vortices.

[0059] The rib turbulators can have different geometries (e.g., shapes, heights, lengths, and so on). The rib turbulators can be disposed and spaced variously in different turns of the coolant channel. The geometries and locations of the rib turbulators can be designed to minimize the temperature nonuniformity. For example, some rib turbulators can be taller to increase the heat transfer at hot spots while others can be shorter to decrease the heat transfer at cold spots.

[0060] Additionally, by using the rib turbulators, the manufacture of the coolant channel can be simplified. For example, the discrete rib turbulators are easier to dispose at various locations in the coolant channel than the fins that extend throughout the length of the coolant channel. For example, the coolant channel need not be bent at some locations except around features such as electrical connections that are routed through the substrate support to provide other functionalities. For example, the spacing between some of the turns of the coolant channel need not be adjusted. Instead, the turns of the coolant channel can be uniformly (e.g., evenly) spaced, which simplifies the manufacture of the coolant channel. These and other features of the present disclosure are described below in detail.Attorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0A

[0061] The present disclosure is organized as follows. Initially, examples of substrate processing systems comprising a processing chamber that includes a substrate support comprising a coolant channel of the present disclosure are shown and described with reference to FIGS. 1 and 2. An example of a substrate support comprising a coolant channel of the present disclosure is shown and described with reference to FIG. 3. An example of the coolant channel comprising the rib turbulators of the present disclosure is schematically shown and described with reference to FIG. 4. FIG. 5 shows a bottom view of an upper plate of the coolant channel of FIG. 4. FIG. 6 shows a top view of a lower plate of the coolant channel of FIG. 4. FIGS. 7-12 show cross-sectional views of the upper plate, the lower plate, and the coolant channel formed by the upper and lower plates with different arrangements of the rib turbulators. FIG. 13 shows a vertical section of a portion of a turn of the coolant channel comprising the rib turbulators showing how coolant flowing over the rib turbulators minimizes hot spots and cold spots. FIG. 14 shows a vertical section of a portion of a turn of the coolant channel comprising the rib turbulators showing examples geometrical features of the rib turbulators. FIG. 15 shows a view of a portion of a turn of the coolant channel with coolant flowing over the rib turbulators. FIG.16 shows an example of turbulence generated by coolant flowing over the rib turbulators. FIGS. 17-21 show examples of various configurations and arrangements of the rib turbulators in the coolant channel. FIG. 22 shows examples of various shapes for the rib turbulators in the coolant channel.EXAMPLES OF SUBSTRATE PROCESSING SYSTEMS

[0062] FIG. 1 shows a first example of a substrate processing system 10 comprising a processing chamber 28, which includes a substrate support 30 that can utilize a coolant channel according to the present disclosure. In FIG. 1 , the coolant channel is only generally shown at 38. Various coolant channel designs of the present disclosure are shown and described with reference to subsequent figures. Any of these coolant channel designs can be used in the substrate support 30 instead of the coolant channel 38 shown in FIG. 1.

[0063] The substrate processing system 10 uses inductively coupled plasma to etch substrates. While the substrate processing system 10 comprising only one processing chamber is shown, the substrate processing system 10 may comprise additional processing chambers. The additional processing chambers may perform deposition processes on substrates. While the example shows a processing chamber for an etchAttorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0Aprocess, the coolant channel designs of the present disclosure can also be used in a processing chamber in which a deposition process is performed.

[0064] The substrate processing system 10 includes a coil driving circuit 11. The coil driving circuit 11 includes a radio frequency (RF) source 12, a pulsing circuit 14, and a tuning circuit (i.e., matching circuit) 13. The RF source 12 generates an RF signal. The pulsing circuit 14 controls a transformer coupled plasma (TCP) envelope of the RF signal and varies a duty cycle of TCP envelope (e.g., between 1% and 99%) during operation. The pulsing circuit 14 and the RF source 12 can be combined or separate. The tuning circuit 13 may be directly connected to an inductive coil 16. While a single coil is shown for example, the substrate processing system 10 may use a plurality of coils (e.g., inner and outer coils). The tuning circuit 13 tunes an output of the RF source 12 to a desired frequency and / or a desired phase, and matches an impedance of the inductive coil 16.

[0065] A dielectric window 24 is arranged along a top end of the processing chamber 28. The processing chamber 28 comprises the substrate support (or pedestal) 30 to support a substrate 34. The substrate support 30 may include an electrostatic chuck (ESC), a substrate support that uses vacuum clamping, mechanical clamping, or other type of substrate support. The substrate support 30 comprises a baseplate 32 and a ceramic plate 33. The baseplate 32 is made of a metallic material (e.g., aluminum or an alloy). The ceramic plate 33 is arranged on a top surface of the baseplate 32. A thermal resistance layer 36 made of an electrically and thermally insulating material is disposed between the ceramic plate 33 and the baseplate 32. The substrate 34 is arranged on the ceramic plate 33 during processing.

[0066] The ceramic plate 33 comprises an electrode 31 to electrostatically clamp the substrate 34 to the substrate support 30 during processing. While not shown, one or more heaters may also be arranged in the ceramic plate 33 to heat the substrate 34 during processing. The baseplate 32 comprises the coolant channel 38 to cool the substrate support 30. The coolant channel 38 uses a fluid supplied by a fluid delivery system 39 to cool the substrate support 30.

[0067] A gas delivery system 56 is used to supply a process gas mixture to the processing chamber 28. The gas delivery system 56 may include process and inert gas sources 57, a gas metering system 58 including valves and mass flow controllers (MFCs), and a manifold 59. A gas injector 63 may be arranged at a center of the dielectric window 24 and is used to inject gas mixtures from the gas delivery system 56 into the processingAttorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0Achamber 28. Additionally or alternatively, the gas mixtures may be injected from the side of the processing chamber 28.

[0068] When a process gas is supplied to the processing chamber 28, a plasma 40 is generated inside of the processing chamber 28 by supplying RF power from the coil driving circuit 11 to the inductive coil 16. The plasma 40 etches an exposed surface of the substrate 34. An RF source 50, a pulsing circuit 51 , and a bias matching circuit 52 may be used to bias the substrate support 30 during processing to control ion energy.

[0069] The substrate support 30 includes temperature sensor 35 to sense temperature of substrate support 30. A temperature controller 64 communicates with the temperature sensor 35. Based on the temperature of substrate support 30 sensed by the temperature sensor 35, the temperature controller 64 controls the fluid delivery system 39 to control fluid flow through the coolant channel 38 to cool the substrate support 30. The temperature controller 64 also controls the heaters in the substrate support 30 to control the temperature of the substrate support 30 and the substrate 34.

[0070] An exhaust system 65 includes a valve 66 and pump 67 to control pressure in the processing chamber 28 and / or to remove reactants from the processing chamber 28 by purging or evacuation. A controller 70 (also called system controller) controls the etching process. The controller 70 controls the components of the substrate processing system 10 described above. For example, the controller 70 monitors system parameters and controls delivery of the gas mixture from the gas delivery system 56. The controller 70 controls striking, maintaining, and extinguishing the plasma 40; removal of reactants from the processing chamber 28; fluid supply from the fluid delivery system 39; and so on. Additionally, the controller 70 controls various aspects of the coil driving circuit 11 , the RF source 50, the pulsing circuit 51 , and the bias matching circuit 52, and so on.

[0071] FIG. 2 shows a second example of a substrate processing system 100 for processing substrates. The substrate processing system 100 comprises a processing chamber 102 for processing the substrates using processes such as plasma etching or deposition. The processing chamber 102 comprises a substrate support 104 and a showerhead 106. For example, the substrate support 104 comprises an electrostatic chuck (ESC) although other types of substrate supports can be used instead. A substrate 108 is arranged on the substrate support 104 during processing.

[0072] The substrate support 104 can utilize a coolant channel according to the present disclosure. In FIG. 2, the coolant channel is only generally shown at 152. Various coolantAttorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0Achannel designs of the present disclosure are shown and described with reference to subsequent figures. Any of these coolant channel designs can be used in the substrate support 104 instead of the coolant channel 152 shown in FIG. 2.

[0073] The showerhead 106 comprises a base portion 109 and a stem portion 110. The base portion 109 is generally cylindrical and extends radially outwardly towards sidewalls of the processing chamber 102. The stem portion 110 is also cylindrical and is smaller in diameter than the base portion 109. One end of the stem portion 110 is attached to the center of the base portion 109. The other end of the stem portion 110 is attached to a top plate of the processing chamber 102.

[0074] The base portion 109 of the showerhead 106 comprises a plurality of through holes (not shown) on a substrate-facing side of the base portion 109. The showerhead 106 receives one or more gases from a gas delivery system 170 as described below. The gases are dispensed via the through holes in the base portion 109 into the processing chamber 102. A plasma 112 may be struck between the showerhead 106 and the substrate 108 during substrate processing as explained below.

[0075] The substrate support 104 comprises a ceramic plate 103 disposed on a metallic baseplate 105. The ceramic plate 103 comprises an electrode 118 to electrostatically clamp the substrate 108 to the substrate support 104 during substrate processing. An edge ring 120 is arranged on the substrate support 104 along a periphery of the substrate support 104. The edge ring 120 surrounds the substrate 108 as shown.

[0076] The baseplate 105 comprises the coolant channel 152. A coolant supply 160 circulates a coolant through the coolant channel 152 to control the temperature of the substrate support 104 and the substrate 108 during substrate processing. While not shown, a heater may be arranged under the electrode 118 in the ceramic plate 103 of the substrate support 104. The heater heats the substrate 108 during processing.

[0077] A temperature controller 162 receives the temperature of the substrate support 104 from a temperature sensor (not shown) disposed in the substrate support 104. Based on the temperatures of the substrate support 104, the temperature controller 162 controls the heater and the supply of the coolant from the coolant supply 160 through the coolant channels 152.

[0078] The substrate processing system 100 further comprises the gas delivery system 170 to supply various gases (e.g., process gases, purge gases, cleaning gases, etc.) toAttorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0Athe processing chamber 102. The gas delivery system 170 comprises gas sources 172, valves 174, and mass flow controllers (MFCs) 176. The gas sources 172 supply the various gases through the valves 174 to the MFCs 176. The MFCs 176 control the flow rates of the gases. The MFCs 176 supply the gases at the controlled flow rates to a mixing manifold 182.

[0079] In addition, the gas delivery system 170 comprises a vapor delivery system 178 to deliver one or more vaporized precursors used in some processes. The vapor delivery system 178 delivers the vaporized precursors through valves 180 to the mixing manifold 182. The gases (or gas mixtures) from the mixing manifold 182 are delivered to the showerhead 106 via a valve system 184 attached to the showerhead 106.

[0080] The substrate processing system 100 further comprises a RF power supply 186 that supplies RF power to the showerhead 106 to generate the plasma 112 during substrate processing. The RF power supply 186 comprises an RF generator 188 and a matching circuit 190. The RF generator 188 generates the RF power. The matching circuit 190 performs impedance matching and outputs the RF power to the showerhead 106. When the process gases are supplied to the showerhead 106, the RF power supply 186 supplies the RF power to the showerhead 106 to generate the plasma 112.

[0081] The substrate processing system 100 further comprises a vacuum pump 192 that is connected to the processing chamber 102 via a valve 194. The vacuum pump 192 maintains vacuum in the processing chamber 102. The vacuum pump 192 also evacuates reactants from the processing chamber 102. The substrate processing system 100 further comprises a controller 196. The controller 196 controls the operations of the components of the substrate processing system 100 described above.SUBSTRATE SUPPORT WITH COOLANT CHANNEL

[0082] FIG. 3 schematically shows a substrate support 200 in which any coolant channel described below with reference to FIG. 4 onwards can be used. The substrate support 200 is similar to the substrate supports 30 and 104 shown in FIGS. 1 and 2. The substrate support 200 can be used in the substrate processing systems 10 and 100 shown in FIGS.1 and 2. Some of the elements of the substrate supports 30 and 104 shown in FIGS. 1 and 2 are omitted in the substrate support 200 shown in FIG. 3 but are presumed present in the substrate support 200 shown in FIG. 3.Attorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0A

[0083] The substrate support 200 comprises a baseplate 202 and a ceramic plate 204 disposed on the baseplate 202. A substrate 208 is arranged on the ceramic plate 204 during processing. The baseplate 202 is made of a metallic material (e.g., aluminum or an alloy). The baseplate 202 is generally cylindrical. The baseplate 202 comprises a coolant channel 206. The coolant channel 206 is also generally cylindrical. An outer diameter (OD) of the coolant channel 206 is greater than or equal to an OD of the substrate 208 and less than an OD of the baseplate 202 of the substrate support 200.

[0084] FIG. 4 schematically shows the coolant channel 206. The coolant channel 206 comprises two plates: an upper plate 210 and a lower plate 212. The upper and lower plates 210, 212 are cylindrical. The upper plate 210 and the lower plate 212 are joined together to form the coolant channel 206. The upper plate 210 is adjacent to the ceramic plate 204 of the substrate support 200 on which the substrate 208 is placed for processing. The upper plate 210 is closer to the substrate 208 compared to the lower plate 212. The upper plate 210 also called a substrate-facing plate. The upper plate 210 and the lower plate 212 have the same diameter, which is the diameter of the coolant channel 206. The coolant channel 206 comprises a plurality of rib turbulators having various designs shown and described below with reference to subsequent figures.EXAMPLE OF COOLANT CHANNEL

[0085] FIG. 5 shows a bottom view of the upper plate 210 of the coolant channel 206. The upper plate 210 comprises a groove 220 on a bottom side of the upper plate 210. A top surface of the upper plate 210 is flat. The top surface of the upper plate 210, which is also the top surface of the coolant channel 206, is parallel to a plane in which the substrate 208 lies on the ceramic plate 204 during processing.

[0086] The groove 220 extends between a center region and a periphery (e.g., OD) of the upper plate 210. For example, the groove 220 extends outwards from the center region towards the periphery of the upper plate 210 in a first direction (e.g., clockwise) forming a first set of turns 222. The first set of turns 222 extend spirally from the center region towards the periphery of the upper plate 210 in the first direction.

[0087] Near the periphery (e.g., OD) of the upper plate 210, the groove 220 changes direction and extends inwards from the periphery towards the center region of the upper plate 210 in a second direction (e.g., counterclockwise) forming a second set of turns 224. The second set of turns 224 extend spirally from the periphery towards the center region of the upper plate 210 in the second direction.Attorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0A

[0088] The groove 220 comprises the first and second sets of turns 222, 224. The first and second sets of turns 222, 224 form the groove 220 that is continuous. The turns in the first and second sets of turns 222, 224 alternate with each other. The groove 220 comprises an inlet 230 and an outlet 232. The inlet 230 is located at a beginning of an innermost turn of the first set of turns 222. The outlet 232 is located at a beginning of an innermost turn of the second set of turns 224. The inlet 230 and the outlet 232 are located near the center region of the upper plate 210.

[0089] FIG. 6 shows a top view of the lower plate 212 of the coolant channel 206. The lower plate 212 comprises a groove 240 on a top side of the lower plate 212. A bottom surface of the lower plate 212 is flat. The bottom surface of the lower plate 212, which is also the bottom surface of the coolant channel 206, is parallel to the plane in which the substrate 208 lies on the ceramic plate 204 during processing.

[0090] The groove 240 extends between a center region and a periphery (e.g., OD) of the lower plate 212. For example, the groove 240 extends outwards from the center region towards the periphery of the lower plate 212 in the second direction (e.g., counterclockwise) forming a first set of turns 242. The first set of turns 242 extend spirally from the center region towards the periphery of the lower plate 212 in the second direction.

[0091] Near the periphery (e.g., OD) of the lower plate 212, the groove 240 changes direction and extends inwards from the periphery towards the center region of the lower plate 212 in the first direction (e.g., clockwise) forming a second set of turns 244. The second set of turns 244 extend spirally from the periphery towards the center region of the lower plate 212 in the first direction.

[0092] The groove 240 comprises the first and second sets of turns 242, 244. The first and second sets of turns 242, 244 form the groove 240 that is continuous. The turns in the first and second sets of turns 242, 244 alternate with each other. The groove 240 comprises an inlet 250 and an outlet 252. The inlet 250 is located at a beginning of an innermost turn of the first set of turns 242. The outlet 252 is located at a beginning of an innermost turn of the second set of turns 244. The inlet 250 and the outlet 252 are located near the center region of the lower plate 212.

[0093] The grooves 220 and 240 in the upper and lower plates 210 and 212 are mirror images of each other. The first and second sets of turns 222, 224 of the groove 220 in the bottom side of the upper plate 210 are mirror images of the first and second sets ofAttorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0Aturns 242, 244 of the groove 240 in the top side of the lower plate 212. The bottom side of the upper plate 210 is joined to the top side of the lower plate 212 to form the coolant channel 206.

[0094] When the upper and lower plates 210 and 212 are joined, the grooves 220 and 240 in the upper and lower plates 210 and 212 form a single groove 254 (shown in FIGS.7-12) of the coolant channel 206. The first and second sets of turns 222, 224 of the groove 220 in the upper plate 210 coincide, match, and join with the first and second sets of turns 242, 244 of the groove 240 in the lower plate 212, respectively, forming the single groove 254 of the coolant channel 206. The inlet and outlet 230 and 232 of the groove 220 in the bottom side of the upper plate 210 coincide, match, and join with the inlet and outlet 250 and 252 of the groove 240 in the top side of the lower plate 212, respectively, forming a single inlet and a single outlet of the coolant channel 206.

[0095] Accordingly, as shown in FIGS. 7-12, the groove 254 of the coolant channel 206 comprises only two sets of turns: a first set of turns 256 that extends spirally from the center region to the periphery of the coolant channel 206 in the first direction and a second set of turns 258 that extends spirally from the periphery to the center region of the coolant channel 206 in the second direction. The groove 254 of the coolant channel 206 comprises only one inlet and only one outlet. The inlet and outlet of the groove 254 are hereinafter called the inlet 250 and the outlet 252 as shown in FIG. 6

[0096] Thus, the coolant channel 206 comprises a single groove 254 that extends between the center region and the periphery of the coolant channel 206. The single groove 254 of the coolant channel 206 comprises two sets of turns 256, 258 extending spirally in opposite directions between the center region and the periphery of the coolant channel 206. The single groove 254 of the coolant channel 206 comprises an inlet 250 and an outlet 252. The groove 254 and the turns 256, 258 of the coolant channel 206 have a uniform . The is generally rectangular but can have any other circular or polygonal shape.

[0097] A coolant (supplied as shown in FIGS. 1 and 2) flows through the inlet 250 into the coolant channel 206. The coolant flows through the first set of turns 256 in the first direction and through the second set of turns 258 in the second (opposite direction). Thus, the coolant flows in opposite directions in any pair of successive turns in the coolant channel 206. The coolant flows out of the coolant channel 206 through the outlet 252.Attorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0A

[0098] As shown in FIG. 6, a plurality of rib turbulators 260 are disposed in one or more turns of the groove 240 in the lower plate 212. Hereinafter, the rib turbulators 260 are simply called ribs 260. For example, the ribs 260 are formed in the lower plate 212. The ribs 260 extend upwards from the bottom of the lower plate 210 towards the upper plate 210. Some of the ribs 260 may extend partially into the groove 220 in the upper plate 210. Examples of the ribs 260 that can be formed in the upper plate 210 and that can extend downwards from the upper plate 210 towards the lower plate 212 are shown in subsequent figures.

[0099] Various designs and arrangements of the ribs 260 are shown and described below in detail with reference to subsequent figures. Briefly, the ribs 260 are obstructions to or obstacles in the flow of coolant. The ribs 260 can have different heights, lengths, and shapes. The ribs 260 can be spaced apart from each other by any distance. The distances between the ribs 260 may vary. In some examples, the ribs 260 may be placed only in selected turns of the coolant channel 206. Any combination of these features (arrangements) of the ribs 260 may be used.

[0100] In some examples, the ribs 260 in portions of the outer turns of the coolant channel 206 can have longer arc lengths than the ribs 260 in portions of the inner turns of the coolant channel 206. Consequently, an angle A of an arc of a rib 260 in an outer turn can be smaller than an angle B of an arc of a rib 260 in an inner turn. For example, as shown in FIG. 6, the angle A may be between 15 to 20 degrees, and the angle B may be between 20 and 25 degrees. In some of the turns, some ribs may be skipped (omitted) to optimize temperature uniformity and / or to accommodate connection paths that pass through the coolant channel 206 to other components such as electrodes, temperature sensors, lift pins, and so on.

[0101] FIGS. 7-9 show examples of ribs 260 arranged in the lower plate 212. FIGS. 10-12 show examples of ribs 260 arranged in the upper plate 210. FIGS. 7-12 show vertical s of the upper and lower plates 210, 212 and of the coolant channel 206. The vertical s are taken along a diameter of the coolant channel 206.

[0102] In FIG. 7, the groove 220 in the upper plate 210 does not have any ribs. In FIG.8, the groove 240 in the lower plate 212 comprises the ribs 260. In FIG. 9, when the upper and lower plates 210 and 212 are joined, the grooves 220 and 240 form the single groove 254 of the coolant channel 206 comprising the ribs 260.Attorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0A

[0103] In FIG. 10, the groove 220 in the upper plate 210 comprises the ribs 260. In FIG.11 , the groove 240 in the lower plate 212 does not have any ribs. In FIG. 12, when the upper and lower plates 210 and 212 are joined, the grooves 220 and 240 form the single groove 254 of the coolant channel 206 comprising the ribs 260.

[0104] In FIGS. 7-12, the ribs 260 are shown in only some of the turns of the groove 254. However, the ribs 260 can be disposed in any of the first and second sets of turns 256, 258 of the groove 254. The ribs 260 extend across the sidewalls of the turns 256, 258 of the coolant channel 206. Further, while the ribs 260 are shown as being rectangular, the ribs 260 can have any other shape or shapes as described below with reference to subsequent figures.

[0105] The coolant flowing through the turns 256, 258 of the coolant channel 206 flows perpendicularly towards the ribs 260. The coolant impinges onto the ribs 260 and flows over the ribs 260 as shown and described below in detail. Thus, the ribs 260 partially obstruct a primary flow of the coolant through the coolant channel 206. The obstruction caused by the ribs 260 generates turbulence in the flow of the coolant through the turns 256, 258 of the coolant channel 206. The turbulence depends on the design and layout of the ribs 260 in the turns 256, 258 of the coolant channel 206. The turbulence generates secondary flows in the vicinity of each rib 260. The secondary flows interact with the walls of the coolant channel 206 (i.e., walls of the turns 256, 258) and enhance heat transfer from and to the walls of the coolant channel 206. The secondary flows form vortices immediately adjacent to each rib 260 as shown and described below in detail.

[0106] In general, the cross-section of the coolant channel 206 (i.e., of the groove 254 and the turns 256, 258) is rectangular, and the coolant channel 206 follows a smooth spline profile. While the layout of the groove 254 and the turns 256, 258 of the coolant channel 206 are shown as being generally circular, the layout of the groove 254 and the turns 256, 258 can have any other shape (e.g., hexagonal, rectangular, or any polygonal shape). Further, the groove 254 and the turns 256, 258 can be arranged in any manner. For example, the turns 256, 258 can be evenly spaced relative to each other. The turns 256, 258 can be arranged in concentric groups (zones). The groups may be spaced apart from each other evenly. The groups may be separated from each other by different distances. The turns 256, 258 in each group may be spaced differently. The groove 254 and the turns 256, 258 can be arranged in four quadrants that are interconnected. Various other arrangements of the 256, 258 of the coolant channel 206 are contemplated.Attorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0AWhile the coolant channel 206 is shown as being bifilar, the coolant channel 206 can be unifilar instead.

[0107] Various dimensions of the coolant channel 206 can be optimized to optimize temperature uniformity. For example, as shown in FIG. 9, the coolant channel 206 (specifically, the groove 254) has a height H. Each turn (specifically, the groove 254) of the coolant channel 206 has a width (cross-sectional area) W. The parameters H and W of the coolant channel 206 are generally fixed. A rib 260 has a height R. The heights R of the ribs 260 can vary within a turn and / or from one turn to another as described above. In some examples, H may be between 18 to 22 mm, and W may be between 6 to 7 mm. These ranges for the parameters H and W provide the most surface area for about 8-12 turns of the coolant channel 206. The heights R of the ribs 260 can be between 25% and 40% of the height H of the coolant channel 206. The heights R of the ribs 260 are selected depending on empirical data about the locations of the hot spots and cold spots. The range 25-40% of H for the heights of the ribs 260 provides maximum control over temperature uniformity with minimal increase in pressure drop of the coolant in the coolant channel 206, which can occur due to the obstruction posed by the heights of the ribs 260 to the coolant flow.

[0108] Additionally, in some examples, the width W of the groove 254 of the coolant channel 206 can be increased at a location shown at 207 in FIG. 6 where the groove 254 changes direction near the periphery (OD) of the coolant channel 206. For example, the width W at 207 can be 8 to 9 mm. The increased width of the groove 254 at 207 further reduces cold spots in the region surrounding the location 207.

[0109] FIG. 13 shows a vertical section of a portion of a turn of the coolant channel 206. For example, the turn can be any of the turns 256, 258. The vertical section is taken along a length of a portion of a turn of the coolant channel 206. While the portion of the turn is arcuate, the portion of the turn is shown straight for simplicity of illustration.

[0110] During processing, a heat flux from the plasma is incident on the coolant channel 206 through the substrate 208 and the ceramic plate 204 above the coolant channel 206. The heat flux is shown by downward arrows above a top wall of the coolant channel 206. Above the top wall of the coolant channel 206, areas with normal temperature are indicated as N. Areas with higher than the normal temperature (hot spots) are indicated as H. Areas with lower than the normal temperature (cold spots) are indicated as C. The ribs 260 conduct more heat from the hot spots and less heat from the cold spots to bringAttorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0Athe temperatures of the hot and cold spots in equilibrium with the normal temperature as follows.

[0111] The flow of the coolant through the turn of the coolant channel 206 is shown by arrows from left to right. Due to different geometries (e.g., height) of the ribs 260, the coolant flows through the coolant channel 206 over the ribs 260 differently as shown by arrows around the ribs 260. For example, where the height of the rib 260 is greater (e.g., the left rib 260), a velocity v1 of the coolant over a top portion of the rib 260 is high due to a small gap between the top wall of the coolant channel 206 and the top portion of the rib 260. Consequently, a heat transfer coefficient (HTC) above the left rib 260 is high, and heat from the hot spot above the left rib 260 is removed at a faster rate.

[0112] In another example, where the height of the rib 260 is smaller (e.g., the middle rib 260), a velocity v2 of the coolant over the top portion of the rib 260 is low due to a large gap between the top wall of the coolant channel 206 and the top portion of the rib 260. That is, v2 < v1 and as a result the intensity of secondary flow (and vortices 270 shown in FIG. 16) at the downstream side of the middle rib 260 is comparatively lower. Consequently, the turbulence intensity and corresponding HTC above the middle rib 260 is low, and heat from the cold spot above the middle rib 260 is removed at a slower rate. Thus, hot and cold spots are brought to the normal temperature of the adjacent areas, and an equilibrium in temperature (i.e. , temperature uniformity) is achieved in the normal, hot, and cold areas.

[0113] FIG. 14 shows examples of ribs 260 having different heights hi , h2, h3; different lengths L1 , L2, L3; and different spacing d1, d2 between adjacent ribs in a turn of the coolant channel 206. d denotes a depth or height of the groove 254 and the turns 256, 258 of the coolant channel 206 along a vertical axis (i.e., along a of a turn of the coolant channel 206). The height of the ribs 260 is less than d. The vertical axis is perpendicular to the plane in which the substrate 208 and the coolant channel 206 lie.

[0114] In the example shown, the heights hi, h2, h3 are shown as being different (unequal). In some examples, at least one of the ribs 260 may have the same height as a height of at least one of the other rings 260. In other examples, a height of at least one of the ribs 260 may be different than a height of at least one of the other ribs 260.

[0115] In the example shown, the lengths L1, L2, L3 are shown as being different (unequal). In some examples, at least one of the ribs 260 may have the same length asAttorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0Aa length at least one of the other rings 260. In other examples, a length of at least one of the ribs 260 may be different than a length of at least one of the other ribs 260.

[0116] In the example shown, the spacing or distances d1 and d2 between adjacent ribs 260 are shown as being different (unequal). That is, d1 is not equal to d2. In other examples, some of the adjacent ribs 260 may be evenly space (i.e., equidistant) from each other. In other examples, a first group of ribs 260 may be equidistant from each other, followed by a second group of ribs 260 that are not equidistant from each other. The distance between the ribs 260 in a turn is measured as an arclength. Any combination of heights, lengths, and spacing can be designed and used in any of the turns of the coolant channel 206 to eliminate or minimize hot and cold spots in the substrate 208.

[0117] FIG. 15 shows a view of a portion of a turn of the coolant channel 206 without the top wall of the coolant channel 206. Again, while the portion of the turn is arcuate, the portion of the turn is shown straight for simplicity of illustration. The flow of the coolant through the coolant channel 206 and over the ribs 260 is shown by arrows.

[0118] FIG. 16 shows a vertical section of a portion of a turn of the coolant channel 206. The vertical section is taken along a length of a portion of a turn of the coolant channel 206. The flow of the coolant through the coolant channel 206 and over the ribs 260 is shown by arrows. Additionally, vortices 270, which are formed as described above in regions immediately following each rib due to the turbulence caused by the obstruction posed by the ribs 260 are shown.

[0119] FIGS. 17-21 show different arrangements of the ribs 260 in a portion of a turn of the coolant channel 106. In most arrangements shown and described herein, the ribs 260 are perpendicular to the length of the turn. That is, the ribs 260 are parallel to a cross-sectional plane of the turn. In FIG. 17, the ribs 260 are arranged at an angle relative to the length of the turn and relative to the direction of flow of the coolant through the coolant channel 206. That is, ribs 260 are arranged at an angle relative to the cross-sectional plane of the turn. In some examples, the ribs 260 can be arranged at the same angle. In other examples, different ribs 260 can be arranged at different angles. The angles can be the same or varied in the same turn or in different turns. The geometries (e.g., height, spacing, length, shape, location, etc.) of the ribs 260 can also be varied.

[0120] In FIG. 18, the ribs 260 have a V-shape. For example, the vortex of each rib (junction of two legs of the letter V) points in a direction opposite to the direction of flowAttorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0Aof the coolant. In some examples, the vortex can point in the direction of flow of the coolant. The geometries (e.g., height, spacing, length, shape, location, etc.) of the ribs 260 can be varied. In other examples, the ribs 260 can have other shapes. Non-limiting examples of other shapes include the letter W, a serpentine shape, a wavy (e.g., sinusoidal) shape, etc.

[0121] In some examples, widths of portions of the rib 260 measured from sidewalls of the turn along the of the turn may be equal so that the vortex can lie at the center of the turn. In other examples, the widths can be different so that the vortex is offset from the center of the turn. In still other examples, one vertical portion of the rib 260 can be of a different height than the other vertical portion of the rib 260. Any combination of these and other features described herein can be used.

[0122] In FIG. 19, a combination of the shapes of the ribs 260 shown in FIGS. 17 and 18 can be used in one or more turns of the coolant channel 206. Further, any combination of the various features of the ribs 260 described above with reference to FIGS. 17 and 18 can be used.

[0123] In FIG. 20, the ribs 260 comprise openings 262. The openings 262 can have different geometries (e.g., shapes, sizes, heights, and widths). In some examples, some of the ribs 260 may have the openings 262 while other ribs 260 may not have the openings 262. For example, the openings 262 may be provided in only some of the ribs 260 in only some of the turns 256, 258.

[0124] In FIG. 21 , various examples of the ribs 260 with the openings 262 and through holes or slits (collectively shown at 262) are shown. For example, while the openings 262 in FIG. 20 are shown as partitioning the ribs 260 into two portions, in some examples, the openings 262 may not partition the ribs 260 into two portions. Instead, the openings 262 may be in the form of through holes or slits in the ribs 260.

[0125] In some examples, a rib 260 may comprise two or more openings 262. The openings 262 (and through holes or slits) can have any shape, size, and location in the ribs 260. In some examples, the openings 262 (or through holes / slits) of successive ribs 260 in a turn may not be aligned with each other along the length of the turn (i.e. , in the direction of the flow of the coolant) to provide additional turbulence.

[0126] The openings 262 (or through holes / slits) can be provided in any of the designs of the ribs 260 described herein. The ribs 260 with and without the openings 262 (orAttorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0Athrough holes / slits) may be used in combination. Any combination of the above features and the other geometric features (height, spacing, length, location, shape, etc.) described herein can be used.

[0127] FIG. 22 shows non-limiting examples of various shapes for the ribs 260. Any combination of these shapes along with any combination of the various features described above (e.g., height, height of a portion of the rib, length of the rib, width of a portion of the rib, spacing between the ribs, locations in selected turns, openings, etc.) can be used.

[0128] As described above with reference to FIGS. 1 and 2, the RF power is supplied to generate plasma above the substrate 208. The RF power can cause arcing if the ribs 260 have sharp edges. In the shapes of the ribs 260 in which the ribs 260 comprise sharp edges, the edges are chamfered (rounded or smoothened) to prevent arcing.

[0129] The ribs 260 in the coolant channel 206 described above are different than fins used in some coolant channels. The ribs 260 transfer heat by increasing turbulence in flow of the coolant through the coolant channel 206. In contrast, the fins transfer heat by providing increased surface area that contacts the coolant. The coolant in the coolant channel 206 flows perpendicular to the width of the rib 260. In contrast, in coolant channels with fins, the coolant flows parallel to a length of the fin. Further, the ribs 260 extend from one sidewall to another sidewall of the coolant channel 206. Accordingly, there are no gaps between sidewalls of the coolant channel 206 and sides of the ribs 260. The ribs 260 extend side to side throughout the cross-section of a turn. Therefore, the coolant does not flow between sidewalls of the coolant channel 206 and sides of the ribs 260. In contrast, the coolant flows on both sides of the fin (between sidewalls of the coolant channel and sides of the fin). The global / overall heat transfer rate of the coolant channel 206 is significantly higher when the ribs 260 are used instead of fins in the coolant channel 206. At the same time, by varying the geometries (e.g., height etc.) of the ribs 260, local heat transfer can be tuned to achieve temperature uniformity at the substrate level as described above.

[0130] The foregoing description is merely illustrative in nature and is in no way intended to limit the disclosure, its application, or uses. The broad teachings of the disclosure can be implemented in a variety of forms. Therefore, while this disclosure includes particular examples, the true scope of the disclosure should not be so limited since otherAttorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0Amodifications will become apparent upon a study of the drawings, the specification, and the following claims.

[0131] It should be understood that one or more steps within a method may be executed in different order (or concurrently) without altering the principles of the present disclosure. Further, although each of the embodiments is described above as having certain features, any one or more of those features described with respect to any embodiment of the disclosure can be implemented in and / or combined with features of any of the other embodiments, even if that combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and permutations of one or more embodiments with one another remain within the scope of this disclosure.

[0132] Spatial and functional relationships between elements (for example, between modules, circuit elements, semiconductor layers, etc.) are described using various terms, including “connected,” “engaged,” “coupled,” “adjacent,” “next to,” “on top of,” “above,” “below,” and “disposed.” Unless explicitly described as being “direct,” when a relationship between first and second elements is described in the above disclosure, that relationship can be a direct relationship where no other intervening elements are present between the first and second elements, but can also be an indirect relationship where one or more intervening elements are present (either spatially or functionally) between the first and second elements. As used herein, the phrase at least one of A, B, and C should be construed to mean a logical (A OR B OR C), using a non-exclusive logical OR, and should not be construed to mean “at least one of A, at least one of B, and at least one of C.”

[0133] In some implementations, a controller is part of a system, which may be part of the above-described examples. Such systems can comprise semiconductor processing equipment, including a processing tool or tools, chamber or chambers, a platform or platforms for processing, and / or specific processing components (a wafer pedestal, a gas flow system, etc.). These systems may be integrated with electronics for controlling their operation before, during, and after processing of a semiconductor wafer or substrate. The electronics may be referred to as the “controller,” which may control various components or subparts of the system or systems.

[0134] The controller, depending on the processing requirements and / or the type of system, may be programmed to control any of the processes disclosed herein, including the delivery of processing gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generatorAttorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0Asettings, RF matching circuit settings, frequency settings, flow rate settings, coolant flow rate and pressure settings, fluid delivery settings, positional and operation settings, wafer transfers into and out of a tool and other transfer tools and / or load locks connected to or interfaced with a specific system.

[0135] Broadly speaking, the controller may be defined as electronics having various integrated circuits, logic, non-transitory memory, and / or software that receive instructions, issue instructions, control operation, enable cleaning operations, enable endpoint measurements, and the like. The integrated circuits may include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors, or microcontrollers that execute program instructions (e.g., software). Program instructions may be instructions communicated to the controller in the form of various individual settings (or program files), defining operational parameters for carrying out a particular process on or for a semiconductor wafer or to a system. The operational parameters may, in some embodiments, be part of a recipe defined by process engineers to accomplish one or more processing steps during the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer.

[0136] The controller, in some implementations, may be a part of or coupled to a computer that is integrated with the system, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller may be in the “cloud” or all or a part of a fab host computer system, which can allow for remote access of the wafer processing. The computer may enable remote access to the system to monitor current progress of fabrication operations, examine a history of past fabrication operations, examine trends or performance metrics from a plurality of fabrication operations, to change parameters of current processing, to set processing steps to follow a current processing, or to start a new process.

[0137] In some examples, a remote computer (e.g., a server) can provide process recipes to a system over a network, which may include a local network or the Internet. The remote computer may include a user interface that enables entry or programming of parameters and / or settings, which are then communicated to the system from the remote computer. In some examples, the controller receives instructions in the form of data, which specify parameters for each of the processing steps to be performed during one or more operations. It should be understood that the parameters may be specific to theAttorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0Atype of process to be performed and the type of tool that the controller is configured to interface with or control.

[0138] Thus, as described above, the controller may be distributed, such as by comprising one or more discrete controllers that are networked together and working towards a common purpose, such as the processes and controls described herein. An example of a distributed controller for such purposes would be one or more integrated circuits on a chamber in communication with one or more integrated circuits located remotely (such as at the platform level or as part of a remote computer) that combine to control a process on the chamber.

[0139] Without limitation, example systems may include a plasma etch chamber or module, a deposition chamber or module, a spin-rinse chamber or module, a metal plating chamber or module, a clean chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etch (ALE) chamber or module, an ion implantation chamber or module, a track chamber or module, and any other semiconductor processing systems that may be associated or used in the fabrication and / or manufacturing of semiconductor wafers.

[0140] As noted above, depending on the process step or steps to be performed by the tool, the controller might communicate with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout a factory, a main computer, another controller, or tools used in material transport that bring containers of wafers to and from tool locations and / or load ports in a semiconductor manufacturing factory.

Claims

Attorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0ACLAIMSWhat is claimed is:

1. A substrate support comprising:a baseplate;a coolant channel comprising a groove arranged in the baseplate, the groove comprising a plurality of turns; anda plurality of ribs arranged in one or more of the turns in a flow path of a coolant in the coolant channel.

2. The substrate support of claim 1 wherein the ribs extend upwards from a bottom of the groove and across sidewalls of the coolant channel.

3. The substrate support of claim 1 wherein the ribs partially obstruct a flow of the coolant and wherein the obstruction generates turbulence in the flow of the coolant.

4. The substrate support of claim 1 wherein a height of the ribs is less than a height of the groove.

5. The substrate support of claim 1 wherein at least one of the ribs has the same height as at least another one of the ribs.

6. The substrate support of claim 1 wherein at least two successive ones of the ribs have the same height.

7. The substrate support of claim 1 wherein at least two successive ones of the ribs have different heights.

8. The substrate support of claim 1 wherein the ribs in at least a portion of one of the turns have the same height.

9. The substrate support of claim 1 wherein a first set of the ribs in one of the turns has a first height and wherein a second set of the ribs in the one of the turns has a second height that is different than the first height.Attorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0A10. The substrate support of claim 1 wherein a first set of the ribs in a first one of the turns has a first height and wherein a second set of the ribs in a second one of the turns has a second height that is different than the first height.

11. The substrate support of claim 1 wherein the ribs in at least two of the turns have the same height.

12. The substrate support of claim 1 wherein the ribs in at least two of the turns have different heights.

13. The substrate support of claim 1 wherein a set of the ribs in one of the turns are equidistant from each other.

14. The substrate support of claim 1 wherein the ribs in at least a portion of one of the turns are equidistant from each other.

15. The substrate support of claim 1 wherein a first set of the ribs in one of the turns are separated from each other by a first distance and wherein a second set of the ribs in the one of the turns are separated from each other by a second distance that is different than the first distance.

16. The substrate support of claim 1 wherein a first set of the ribs in a first one of the turns are separated from each other by a first distance and wherein a second set of the ribs in a second one of the turns are separated from each other by a second distance that is different than the first distance.

17. The substrate support of claim 1 wherein the ribs in at least two of the turns are separated from each other by the same distance.

18. The substrate support of claim 1 wherein at least one of the ribs has the same length as at least another one of the ribs.

19. The substrate support of claim 1 wherein at least two successive ones of the ribs have the same length.Attorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0A20. The substrate support of claim 1 wherein at least two successive ones of the ribs have different lengths.

21. The substrate support of claim 1 wherein the ribs in at least a portion of one of the turns have the same length.

22. The substrate support of claim 1 wherein a first set of the ribs in one of the turns has a first length and wherein a second set of the ribs in the one of the turns has a second length that is different than the first length.

23. The substrate support of claim 1 wherein a first set of the ribs in a first one of the turns has a first length and wherein a second set of the ribs in a second one of the turns has a second length that is different than the first length.

24. The substrate support of claim 1 wherein the ribs in at least two of the turns have the same length.

25. The substrate support of claim 1 wherein the ribs in at least two of the turns have different lengths.

26. The substrate support of claim 1 wherein the ribs are polygonal.

27. The substrate support of claim 1 wherein edges of the ribs are chamfered.

28. The substrate support of claim 1 wherein at least one of the ribs comprises at least one opening or hole.

29. The substrate support of claim 1 wherein at least two successive ones of the ribs comprise at least one opening and wherein the openings in the at least two successive ones of the ribs are not aligned with each other.

30. The substrate support of claim 1 wherein at least one of the ribs comprises two portions each of a different height.

31. The substrate support of claim 1 wherein at least one of the ribs in one of the turns extends at an angle relative to a cross-section of the one of the turns.Attorney Docket No. 11997-1 WOHDP Ref. No. 15545-001316-W0-P0A32. The substrate support of claim 1 wherein a first one of the ribs in one of the turns extends at a first angle relative to a length of the one of the turns and wherein a second one of the ribs in the one of the turns extends at a second angle that is different than the first angle relative to the length of the one of the turns.

33. The substrate support of claim 1 wherein at least one of the ribs comprises two portions that extend from sidewalls of one of the turns forming a shape of the letter “V” and wherein a junction of the two portions points in a direction opposite to a direction of a flow of the coolant.

Images