Level sensing device having molded housing and components
WO2026206572A1PCT designated stage Publication Date: 2026-10-01SIEMENS AG +1
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Patent Information
- Application Number
- PCT/US2026/017682
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-28
- Filing Date
- 2026-03-04
- Publication Date
- 2026-10-01
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Figure US2026017682_01102026_PF_FP_ABST
Abstract
A level sensing device (200) comprises a controller (220), a radar component (230) mounted to the controller (220), and a radar module (210) formed by encapsulation. The radar component (230) includes a radio frequency source to emit a high frequency signal and a radio frequency sensor to receive a return signal corresponding to the high frequency signal. Utilizing low pressure molding, the radar component (230) and the controller (220) are encapsulated in a low pressure molding material that is also formed in a lens shape to realize a radar module antenna. The radar module antenna is positioned in an emitting path of the high frequency signal to direct the high frequency signal. The lens (240) of the radar module (210) is directed toward a target material to be measured by the radar component (230).
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