Dual-channel vacuum grip end effector

Abstract

An end effector of a substrate-holding robotic arm for moving substrates into and out of a substrate-processing chamber is provided. In at least one aspect, the end effector includes a movable link. The end effector also includes a wafer blade coupled with the movable link and defining a wafer vacuum channel within which a vacuum pressure is selectively applied to vacuum hold a wafer to the wafer blade. Further, the end effector includes a tape frame blade coupled with the movable link and defining a tape frame vacuum channel within which a vacuum pressure is selectively applied to vacuum hold a tape frame to the tape frame blade.

Description

PATENTAttorney Docket No.: 44025329WO01DUAL-CHANNEL VACUUM GRIP END EFFECTORBACKGROUNDField

[0001] The present disclosure generally relates to end effectors of substratehandling robotic arms arranged to move substrates into and out of substrateprocessing chambers, such as is used in semiconductor processing or the like.Description of the Related Art

[0002] Some substrate-processing chambers, such as those used in semiconductor processing, are configured to process different types of substrates having different sizes, such as wafers and tape frames. A robotic arm having an end effector can be used to move these substrates into and out of such substrateprocessing chambers before and after processing. In one conventional technique, to move wafers into or out of such a substrate-processing chamber, a wafer-specific blade has been used as the end effector of the robotic arm. To switch to processing tape frames, the wafer-specific blade is removed from the robotic arm and a tape frame-specific blade is attached to the robotic arm and used as the end effector. Tape frames can then be moved into and out of the substrate-processing chamber. To switch back to processing wafers, the tape frame-specific blade is removed from the robotic arm and the wafer-specific blade is attached once again to the robotic arm and used as the end effector. Accordingly, conventional end effectors have been exclusively associated with a specific substrate type. Changing blades of a robotic arm can result in a throughput bottle neck during processing, among other drawbacks. In another conventional technique, a two-armed robot has been implemented to move different types of substrates, with one arm utilizing a wafer-specific blade and the other arm utilizing a tape frame-specific blade. Nevertheless, a throughput limitation may still be present due to the fact that only one arm can handle one substrate. So, to exchange a same substrate in the process chamber, the processed substrate would have to be removed from the process chamber and parked in a storage / buffer, and then a new substrate would need to be picked up and delivered to the process chamber. This is done by the single end effector, which limits throughput.PATENTAttorney Docket No.: 44025329WO01

[0003] Accordingly, there is a need for improved end effectors that address one or more of the challenges described above.SUMMARY

[0004] In one or more aspects, an end effector is provided. The end effector can be a component of a substrate-holding robotic arm for moving substrates into and out of a substrate-processing chamber. The end effector includes a movable link; a wafer blade coupled with the movable link and defining a wafer vacuum channel within which a vacuum pressure is selectively applied to vacuum hold a wafer to the wafer blade; and a tape frame blade coupled with the movable link and defining a tape frame vacuum channel within which a vacuum pressure is selectively applied to vacuum hold a tape frame to the tape frame blade.

[0005] In one or more aspects, a substrate handling robotic arm is provided. The substrate-handling robotic arm includes a base link and an end effector. The end effector includes a movable link, a wafer blade, and a tape frame. The movable link is rotatably coupled with the base link. The wafer blade is coupled with the movable link and defines a wafer vacuum channel within which a vacuum pressure is selectively applied to vacuum hold a wafer to the wafer blade. The tape frame blade is coupled with the movable link and defines a tape frame vacuum channel within which a vacuum pressure is selectively applied to vacuum hold a tape frame to the tape frame blade.

[0006] In one or more aspects, an end effector of a substrate-holding robotic arm for moving substrates into and out of a substrate-processing chamber is provided. The end effector includes a movable link, a first blade, and a second blade. The first blade is coupled with the movable link and defines a first vacuum channel within which a vacuum pressure is selectively applied to vacuum hold a first type of substrate to the first blade. The second blade is coupled with the movable link and defines a second vacuum channel within which a vacuum pressure is selectively applied to vacuum hold a second type of substrate to the second blade. The first type of substrate and the second type of substrate have different predefined sizes.PATENTAttorney Docket No.: 44025329WO01BRIEF DESCRIPTION OF THE DRAWINGS

[0007] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only exemplary embodiments of the disclosure and are therefore not to be considered limiting of its scope, as the disclosure may admit to other equally effective embodiments.

[0008] FIG. 1 is an axonometric view of a substrate-handling robotic arm having two end effectors carrying respective wafers, according to one or more embodiments disclosed herein.

[0009] FIG. 2 is an axonometric view of the substrate-handling robotic arm of FIG.1 having its two end effectors carrying respective tape frames.

[0010] FIG. 3 is a close-up top view of one of the end effectors of the substratehandling robotic arm of FIG. 1.

[0011] FIG. 4 is a side view of the one of the end effectors of the substrate-handling robotic arm of FIG. 1 , with the end effector carrying a wafer.

[0012] FIG. 5 is an axonometric cross-sectional view of the one of the end effectors of the substrate-handling robotic arm of FIG. 1 , with the end effector carrying a wafer.

[0013] FIG. 6 is a side view of the one of the end effectors of the substrate-handling robotic arm of FIG. 1 , with the end effector carrying a tape frame.

[0014] FIG. 7 is an axonometric cross-sectional view of the one of the end effectors of the substrate-handling robotic arm of FIG. 1, with the end effector carrying a tape frame.

[0015] FIG. 8 is a schematic view of the substrate-handling robotic arm of FIG. 1.PATENTAttorney Docket No.: 44025329WO01

[0016] FIG. 9 is a block diagram of a computing system of the substrate-handling robotic arm of FIG. 1.

[0017] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.DETAILED DESCRIPTION

[0018] A dual-blade, dual-channel vacuum grip end effector for handling two different types / sizes of substrates in a substrate processing system is disclosed. Such an end effector can be a component of a robotic arm arranged to move substrates into and out of substrate-processing chambers, such as those used in semiconductor fabrication equipment.

[0019] In at least one aspect, an end effector for a substrate-handling robotic arm is provided. The end effector can be arranged to move different types of substrates, such as wafers and tape frames, into and out of a substrate-processing chamber (or many substrate-processing chambers). The end effector can include a movable link and blades, including a wafer blade and a tape frame blade, both of which can be coupled with the movable link. The wafer blade can define a wafer vacuum channel within which a vacuum pressure can be selectively applied to “vacuum hold” or “vacuum chuck” a wafer to the wafer blade. The tape frame blade can define a tape frame vacuum channel within which a vacuum pressure can be selectively applied to vacuum hold a tape frame to the tape frame blade. In at least one example, the vacuum channels of the blades can be controlled independently of one another.

[0020] Advantageously, the end effector disclosed herein can use the wafer blade to hold and move wafers into and out of one or more substrate-processing chambers. Then, when it is desired to process tape frames, the tape frame blade of the end effector can be used to move the tape frames into and out of one or more substrateprocessing chambers. When it is desired to process wafers once again, the waferPATENTAttorney Docket No.: 44025329WO01blade of the end effector can be used again to move the wafers into and out of the one or more substrate-processing chambers. Accordingly, in switching between processing wafers and tape frames, there is no need to change blades. Indeed, the end effector can carry both wafers and tape frames. This can increase throughput during semiconductor processing.

[0021] Turning now to the drawings, FIG. 1 is an axonometric view of a substratehandling robotic arm 100, according to one or more embodiments disclosed herein. For reference, the substrate-handling robotic arm 100 defines an X-direction, a Y-direction, and a Z-direction, which are mutually perpendicular to one another. In at least one embodiment, the X-direction can be a transverse direction, the Y-direction can be a lateral direction, and the Z-direction can be a vertical direction.

[0022] The substrate-handling robotic arm 100 is generally arranged to move substrates into and out of one or more substrate-processing chambers of a semiconductor processing system, such as a die-to-wafer hybrid bonding processing system. Example substrate-processing chambers include, without limitation, an atomic layer deposition (ALD) chamber, chemical vapor deposition (CVD) chamber (such as a plasma enhanced-CVD (“PECVD”) chamber), physical vapor deposition (PVD) chamber, etch chamber, degas chamber, an ion implantation chamber, ashing chamber, cleaning chamber, and thermal processing chamber (e.g., rapid thermal processing, anneal, cool down, thermal management control).

[0023] As depicted in FIG. 1, the substrate-handling robotic arm 100 includes a base link 110 and a pair of end effectors, including a first end effector 120 and a second end effector 170. The first end effector 120 is rotatably coupled with the base link 110, e.g., about an axis of rotation AX. Similarly, the second end effector 170 is rotatably coupled with the base link 110, e.g., about the axis of rotation AX. In at least one embodiment, the first end effector 120 and the second end effector 170 are rotatable about the axis of rotation AX independently of one another. Although not shown, the base link 110 can be coupled with other links of the substrate-handling robotic arm 100.PATENTAttorney Docket No.: 44025329WO01

[0024] The first end effector 120 includes a first movable link 122, which is coupled with the base link 110. The first end effector 120 also includes two substrate-carrying blades coupled with the first movable link 122. In this regard, the first end effector 120 can be considered a dual-blade substrate-carrying end effector. In the depicted embodiment of FIG. 1, the first end effector 120 includes a first wafer blade 124 coupled with the first movable link 122 as well as a first tape frame blade 126 coupled with the first movable link 122. The first wafer blade 124 is arranged to carry wafers (one at a time) while the first tape frame blade 126 is arranged to carry tape frames (one at a time). In FIG. 1 , the first wafer blade 124 is shown carrying a first wafer W1 while the first tape frame blade 126 is not carrying a tape frame.

[0025] The second end effector 170 is configured in a similar manner as the first end effector 120. The second end effector 170 includes a second movable link 172, which is coupled with the base link 110. The second end effector 170 is the upper end effector and the first end effector 120 is the lower end effector in this example embodiment. However, in other embodiments, the second end effector 170 can be the lower end effector and the first end effector 120 can be the upper end effector. The second end effector 170 includes two substrate-carrying blades coupled with the second movable link 172. In this way, the second end effector 170 can be considered a dual-blade substrate-carrying end effector. In the depicted embodiment of FIG. 1, the second end effector 170 includes a second wafer blade 174 coupled with the second movable link 172 as well as a second tape frame blade 176 coupled with the second movable link 172. The second wafer blade 174 is arranged to carry wafers (one at a time) while the second tape frame blade 176 is arranged to carry tape frames (one at a time). In FIG. 1, the second wafer blade 174 is shown carrying a second wafer W2 while the second tape frame blade 176 is not carrying a tape frame.

[0026] In one or more embodiments, during processing of wafers, the first end effector 120 can pick up the first wafer W1 after being processed in a substrateprocessing chamber (e.g., a deposition chamber). The now-processed first wafer W1 can be held by the first wafer blade 124 of the first end effector 120 while the second wafer W2 (which can be un-processed by the substrate-processing chamber) can be held by the second wafer blade 174 of the second end effector 170. The first endPATENTAttorney Docket No.: 44025329WO01effector 120 and the second end effector 170 can be rotated about the axis of rotation AX such that they have switched their positions shown in FIG. 1. The un-processed second wafer W2 can then be moved into the substrate-processing chamber for processing.

[0027] With reference to FIG. 2, which is an axonometric view of the substratehandling robotic arm 100, the first tape frame blade 126 of the first end effector 120 is shown carrying a first tape frame TF1 and the second tape frame blade 176 of the second end effector 170 is shown carrying a second tape frame TF2. The first wafer blade 124 and the second wafer blade 174 are not carrying wafers in FIG. 2. Although not shown, in some instances, one of the end effectors can carry a wafer while the other end effector can carry a tape frame.

[0028] In one or more embodiments, during processing of tape frames, the first end effector 120 can pick up the tape frame TF1 after being processed in a substrateprocessing chamber (e.g., a deposition chamber). The now-processed first tape frame TF1 can be held by the first tape frame blade 126 of the first end effector 120 while the second tape frame TF2 (which can be un-processed by the substrate-processing chamber) can be held by the second tape frame blade 176 of the second end effector 170. The first end effector 120 and the second end effector 170 can be rotated about the axis of rotation AX such that they have switched their positions shown in FIG. 2. The un-processed second tape frame TF2 can then be moved into the substrateprocessing chamber for processing.

[0029] In at least one embodiment, the wafers arranged to be carried by the wafer blades and the tape frames arranged to be carried by the tape frame blades can have different diameters, or more generally, different predefined sizes. For instance, in at least one example, the substrates arranged to be carried by the wafer blades can have 300 mm diameters while the tape frames arranged to be carried by the tape frame blades can have 400 mm diameters. While wafers and tape frames are used herein to designate two different substrate types, it will be appreciated that the inventive aspects disclosed herein can apply more generically to a first substrate type and a second substrate type, wherein these substrate types are of different sizes.PATENTAttorney Docket No.: 44025329WO01

[0030] With reference now to FIG. 3, a close-up top view of the first end effector 120 is depicted. FIGS. 4-7 illustrate various views of the first end effector 120. That is, FIG. 4 is a side view of the first end effector 120 carrying the first wafer W1, and FIG. 5 is an axonometric cross-sectional view of the first end effector 120 carrying the first wafer W1. Similarly, FIG. 6 is a side view of the first end effector 120 carrying the first tape frame TF1 , and FIG. 7 is an axonometric cross-sectional view of the first end effector 120 carrying the first tape frame TF1. The second end effector 170 (FIGS. 1 and 2) can be configured in a similar manner as described below.

[0031] As shown in FIG. 3, the first wafer blade 124 has a fork-like shape and has prongs 128, 130 extending outward from a neck 132. The neck 132 is fixedly coupled with the first movable link 122 (see also FIGS. 4 and 5). The prongs 128, 130 each have prong tips 134, 136, which extend further out away from the first movable link 122 than do the prong tips of the prongs of the first tape frame blade 126. The first wafer blade 124 can be arranged below the first tape frame blade 126, e.g., along the Z-direction as shown in FIGS. 4 and 5. Accordingly, in at least one embodiment, an end effector can be configured so that the blade arranged to carry the smaller substrate type (e.g., a wafer) is arranged below the blade arranged to carry the larger substrate type (e.g., a tape frame).

[0032] Further, as illustrated in FIG. 3, the first wafer blade 124 defines a wafer vacuum channel 138 within which a vacuum pressure can be selectively applied to vacuum hold a wafer to the first wafer blade 124. Stated differently, a vacuum pressure can be applied within the wafer vacuum channel 138 to “vacuum chuck” a wafer to the first wafer blade 124. The vacuum pressure can be created by a vacuum pump, which can be remotely located relative to the first end effector 120. For instance, the vacuum pump can be arranged within a facilities / pump room. The wafer vacuum channel 138 can be fluidly coupled with the vacuum pump. In the depicted embodiment of FIG. 3, the wafer vacuum channel 138 has a wafer vacuum line 140 that splits into a first prong line 142 that traverses along the first prong 128 and a second prong line 144 that traverses along the second prong 130. The wafer vacuum line 140 can be fluidly coupled with one or more other lines and ultimately with a vacuum pump. One or more suction pads 146 can be arranged along the waferPATENTAttorney Docket No.: 44025329WO01vacuum channel 138. These are the locations at which a wafer can be vacuum held. In the illustrated embodiment of FIG. 3, the wafer vacuum channel 138 has four (4) suction pads 146, with two (2) being arranged along the first prong line 142 and two (2) being arranged along the second prong line 144. In other embodiments, more or less than four (4) suction pads can be implemented.

[0033] The first tape frame blade 126 has a fork-like shape and has prongs 148, 150 extending outward from a neck 152. The prongs 148, 150 of the first tape frame blade 126 flank the prongs 128, 130 of the first wafer blade 124. That is, the prongs 148, 150 of the first tape frame blade 126 are spaced further away from one another, e.g., along the Y-direction, than are the prongs 128, 130 of the first wafer blade 124, and the prongs 128, 130 of the first wafer blade 124 of are positioned between the prongs 148, 150 of the first tape frame blade 126, e.g., along the Y-direction. The prongs 148, 150 each have prong tips 154, 156. The neck 152 is fixedly coupled with the first movable link 122 (see also FIGS. 6 and 7). The first tape frame blade 126 can be arranged above the first wafer blade 124, e.g., along the Z-direction as shown in FIGS. 6 and 7.

[0034] In addition, as illustrated in FIG. 3, the first tape frame blade 126 defines a tape frame vacuum channel 158 within which a vacuum pressure can be selectively applied to vacuum hold a tape frame to the first tape frame blade 126. Stated differently, a vacuum pressure can be applied within the tape frame vacuum channel 158 to “vacuum chuck” a tape frame to the first tape frame blade 126. As noted above, the vacuum pressure can be created by a vacuum pump, which can be remotely located relative to the first end effector 120. The tape frame vacuum channel 158 can be fluidly coupled with the vacuum pump. In the depicted embodiment of FIG. 3, the tape frame vacuum channel 158 has a tape frame vacuum line 160 that splits into a first prong line 162 that traverses along the first prong 148 and a second prong line 164 that traverses along the second prong 150. The tape frame vacuum line 160 can be fluidly coupled with one or more other lines and ultimately with a vacuum pump. One or more suction pads 166 can be arranged along the tape frame vacuum channel 158. These are the locations at which a tape frame can be vacuum held. In the illustrated embodiment of FIG. 3, the tape frame vacuum channel 158 has four (4)PATENTAttorney Docket No.: 44025329WO01suction pads 166, with two (2) being arranged along the first prong line 162 and two (2) being arranged along the second prong line 164. In other embodiments, more or less than four (4) suction pads can be implemented.

[0035] In at least one embodiment, the vacuum pressure applied within the wafer vacuum channel 138 and the vacuum pressure applied within the tape frame vacuum channel 158 can be independently controllable. For instance, when the first end effector 120 of the substrate-handling robotic arm 100 goes to pick up and move a wafer, a vacuum pressure can be applied within the wafer vacuum channel 138 while no vacuum pressure can be applied within the tape frame vacuum channel 158. In contrast, when the first end effector 120 of the substrate-handling robotic arm 100 goes to pick up and move a tape frame, a vacuum pressure can be applied within the tape frame vacuum channel 158 while no vacuum pressure can be applied within the wafer vacuum channel 138.

[0036] As shown in FIG. 8, in at least one embodiment, a valve 180 (or a plurality of valves) can be used to control the vacuum pressure applied within the wafer vacuum channel 138 and the tape frame vacuum channel 158 within the first end effector 120. In at least one example, the valve 180 can be located inside the robot body. The vacuum pressure can be applied by a vacuum pump 182 selectively fluidly coupled with the wafer vacuum channel 138 and the tape frame vacuum channel 158 by the valve 180. For instance, when a wafer is to be picked up and moved, the valve 180 can be controlled so that a vacuum pressure is applied within the wafer vacuum channel 138 and so that no vacuum pressure is applied within the tape frame vacuum channel 158. A computing system 190 of, or associated with, the substrate-handling robotic arm 100 can control the valve 180. When a tape frame is to be picked up and moved, the one or more valves 180 can be controlled, e.g., by the computing system 190, so that a vacuum pressure is applied within the tape frame vacuum channel 158 and so that no vacuum pressure is applied within the wafer vacuum channel 138. The vacuum channels of the second end effector 170 can be similarly independently controlled using the computing system 190 and a valve associated with the vacuum channels of the second end effector 170.PATENTAttorney Docket No.: 44025329WO01

[0037] In one or more embodiments, a sensor 184 can be arranged to sense a pressure along a line between the first end effector 120 and the vacuum pump 182, e.g., as shown in FIG. 8. The sensed pressure can be utilized to determine which one of the blades of the first end effector 120 is carrying a substrate. For instance, in at least one example, the computing system 190 can control the valve 180 and the vacuum pump 182 so that a vacuum pressure is applied within the wafer vacuum channel 138 and within the tape frame vacuum channel 158. Then, a substrate can be picked up by one of the blades of the first end effector 120. The sensor 184 can sense the pressure of the fluid within the line and can report the sensed pressure to the computing system 190. The computing system 190 can then determine a difference between the sensed pressure of the fluid within the line and a baseline pressure (e.g., a pressure within the line for a predetermined set of operating conditions and with no substrate being carried by either blade of the first end effector 120).

[0038] The computing system 190 can use the determined difference to determine whether a wafer or a tape frame has been picked up by the first end effector 120, based at least in part on the magnitude of the difference (or deviation of the sensed pressure from the baseline pressure). For instance, a pressure change to a first range can correspond with a wafer being picked up and a pressure change to a second range can correspond with a tape frame being picked up. After determining which substrate type has been picked up, the vacuum channel associated with the blade that is not carrying a substrate can be closed off. Rather, the computing system 190 can control the valve 180 so that a vacuum pressure is applied only in the blade vacuum channel of the first end effector 120 that is carrying a substrate while no vacuum pressure is applied to the vacuum channel of the other blade of the first end effector 120. The vacuum channels of the second end effector 170 can be similarly controlled and monitored using the computing system 190 and sensor associated with the vacuum channels of the second end effector 170. The sensed pressure in the lines can be used in other example manners as well, such as to determine whether one of the blades as gripped a substrate properly (e.g., by looking at the deviation of the sensed pressure relative to a baseline pressure).PATENTAttorney Docket No.: 44025329WO01

[0039] FIG. 9 is a block diagram of the computing system 190. As shown in FIG.9, the computing system 190 can include one or more processor(s) 192 and one or more memory device(s) 193, which can be embodied in one or more computing devices 191 or controllers. The one or more processor(s) 192 can include any suitable processing device, such as a microprocessor, microcontroller, integrated circuit, logic device, or other suitable processing device. The one or more memory device(s) 193 can include one or more computer-readable medium, including, but not limited to, non-transitory computer-readable medium, RAM, ROM, hard drives, flash drives, and other memory devices.

[0040] The one or more memory device(s) 193 can store information accessible by the one or more processor(s) 192, including computer-readable instructions 194 or computer-readable program code that can be executed by the one or more processor(s) 192. The instructions 194 can be any set of instructions that when executed by the one or more processor(s) 192, cause the one or more processor(s) 192 to perform operations. The instructions 194 can be software written in any suitable programming language or can be implemented in hardware.

[0041] The memory device(s) 193 can further store data 195 that can be accessed by the processor(s) 192. For example, the data 195 can include any of the data noted herein. The data 195 can include one or more table(s), function(s), algorithm(s), model(s), equation(s), libraries, etc.

[0042] The computing device 191 can also include a communication interface 196 used to communicate, for example, with the other components of the substratehandling robotic arm 100. The communication interface 196 can include any suitable components for interfacing with one or more network(s), including for example, transmitters, receivers, ports, controllers, antennas, or other suitable components.

[0043] It is contemplated that any one or more elements or features of any one disclosed embodiment may be beneficially incorporated in any one or more other non-mutually exclusive embodiments. While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may bePATENTAttorney Docket No.: 44025329WO01devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

PATENTAttorney Docket No.: 44025329WO01WHAT IS CLAIMED IS:

1. An end effector of a substrate-holding robotic arm for moving substrates into and out of a substrate-processing chamber, the end effector comprising:a movable link;a wafer blade coupled with the movable link and defining a wafer vacuum channel within which a vacuum pressure is selectively applied to vacuum hold a wafer to the wafer blade; anda tape frame blade coupled with the movable link and defining a tape frame vacuum channel within which a vacuum pressure is selectively applied to vacuum hold a tape frame to the tape frame blade.

2. The end effector of claim 1 , wherein the wafer and the tape frame have different predefined sizes.

3. The end effector of claim 1 , wherein the wafer blade has a neck coupled with the movable link and prongs extending from the neck, and wherein the wafer vacuum channel has a first prong line running along one of the prongs and a second prong line running along another one of the prongs.

4. The end effector of claim 3, wherein the wafer blade has suction pads disposed along the first prong line and the second prong line and being arranged to engage the wafer with the vacuum pressure.

5. The end effector of claim 1 , wherein the tape frame blade has a neck coupled with the movable link and prongs extending from the neck, and wherein the tape frame vacuum channel has a first prong line running along one of the prongs and a second prong line running along another one of the prongs.

6. The end effector of claim 5, wherein the wafer blade has prongs, and wherein the prongs of the tape frame blade flank the prongs of the wafer blade.PATENTAttorney Docket No.: 44025329WO017. The end effector of claim 1 , wherein the wafer blade is arranged below the tape frame blade.

8. The end effector of claim 1 , wherein the wafer vacuum channel and the tape frame vacuum channel are independently controllable.

9. The end effector of claim 1 , wherein the wafer vacuum channel and the tape frame vacuum channel are controlled according to a sensed pressure in a line between the end effector and a vacuum pump.

10. The end effector of claim 1 , wherein the movable link is rotatable about an axis of rotation.

11. A substrate-handling robotic arm, comprising:a base link; andan end effector, comprising:a movable link rotatably coupled with the base link;a wafer blade coupled with the movable link and defining a wafer vacuum channel within which a vacuum pressure is selectively applied to vacuum hold a wafer to the wafer blade; anda tape frame blade coupled with the movable link and defining a tape frame vacuum channel within which a vacuum pressure is selectively applied to vacuum hold a tape frame to the tape frame blade.

12. The substrate-handling robotic arm of claim 11 , wherein the end effector is a first end effector, and wherein the substrate-handling robotic arm further comprises:a second end effector rotatably coupled with the base link, the second end effector comprising:a second movable link;a second wafer blade coupled with the second movable link and defining a second wafer vacuum channel within which a vacuum pressure is selectively applied to vacuum hold a wafer to the second wafer blade; andPATENTAttorney Docket No.: 44025329WO01a second tape frame blade coupled with the second movable link and defining a second tape frame vacuum channel within which a vacuum pressure is selectively applied to vacuum hold a tape frame to the second tape frame blade.

13. The substrate-handling robotic arm of claim 12, wherein the first end effector and the second end effector are rotatable about an axis of rotation independently of one another.

14. An end effector of a substrate-holding robotic arm for moving substrates into and out of a substrate-processing chamber, the end effector comprising:a movable link;a first blade coupled with the movable link and defining a first vacuum channel within which a vacuum pressure is selectively applied to vacuum hold a first type of substrate to the first blade; anda second blade coupled with the movable link and defining a second vacuum channel within which a vacuum pressure is selectively applied to vacuum hold a second type of substrate to the second blade,wherein the first type of substrate and the second type of substrate have different predefined sizes.

15. The end effector of claim 14, wherein the first blade has a neck coupled with the movable link and prongs extending from the neck, and wherein the first vacuum channel has a first prong line running along one of the prongs and a second prong line running along another one of the prongs.

16. The end effector of claim 15, wherein the first blade has suction pads disposed along the first prong line and the second prong line and being arranged to engage the wafer with the vacuum pressure.PATENTAttorney Docket No.: 44025329WO0117. The end effector of claim 14, wherein the second blade has a neck coupled with the movable link and prongs extending from the neck, and wherein the second vacuum channel has a first prong line running along one of the prongs and a second prong line running along another one of the prongs.

18. The end effector of claim 17, wherein the first blade has prongs, and wherein the prongs of the second blade flank the prongs of the first blade.

19. The end effector of claim 1 , wherein the first blade is arranged below the second blade.

20. The end effector of claim 14, wherein the movable link is rotatable about an axis of rotation.

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