Dual-path diffuser for recipe-controlled switching of diffuser hole patterns

Abstract

An electroplating system is described comprising a vessel, a substrate receiving surface, a paddle disposed within the vessel, and a diffuser disposed within the vessel. The diffuser is configured of at least a first plate and a second plate, the diffuser including a plurality of openings therethrough wherein electrolyte is flowed toward a substrate on the substrate receiving surface. The plurality of openings further comprise a first plurality of openings and a second plurality of openings, wherein the openings of the first plurality of openings are fluidly isolated from the openings of the second plurality of openings.

Description

PATENTAttorney Docket No.: 44026215WO01DUAL-PATH DIFFUSER FOR RECIPE-CONTROLLED SWITCHING OF DIFFUSER HOLE PATTERNS BACKGROUNDField

[0001] The present technology relates to methods, components, and apparatuses for semiconductor manufacturing. More specifically, the present technology relates to electroplating systems and components therefor, and other semiconductor processing equipment.Description of the Related Art

[0002] Microelectronic devices, such as semiconductor devices, are fabricated on and / or in substrates such as semiconductor wafers or other types of work pieces. One process useful for the fabrication of such devices is electroplating, where a metal is deposited on portions of a seed layer exposed through openings in an overlying resist lor mask layer. A typical substrate plating process involves first depositing a metal seed layer onto the surface of the substrate via vapor deposition. A photoresist may be deposited over the seed layer and patterned to create islands of photoresist and interspersed portions of the seed layer exposed through openings in the photoresist. The substrate is then moved into the vessel of an electroplating processor where electric current is conducted between an anode, through an electrolyte to the surface of the seed layer exposed in the openings in the photoresist and in contact with the electrolyte, to deposit a blanket layer on the seed layer where no photoresist is present, or deposit a patterned layer of a metal or other conductive material onto the exposed portions of the seed layer in the openings in the photoresist. Examples of conductive materials include permalloy, gold, silver, copper, cobalt, tin, nickel, and alloys of these metals. Subsequent processing steps form components, contacts and / or conductive lines on the substrate. Many aspects of an electroplating process may impact process uniformity, such as irregularities in the electric field due to exposed metal seed pattern variations, mass-transfer rates in the electrolyte, as well as other process and component parameters. Additionally, the surface area of exposed portions of the seed layer to be plated per square millimeter or square centimeter of the substrate or work piece on the to be plated surface side thereof can vary significantly across the substrate or work piece. This variation in plateable seedPATENTAttorney Docket No.: 44026215WO01layer density across the substrate can also lead to variations in the deposition thickness across the substrate or work piece. Even minor discrepancies in the surface features and plating properties across a substrate may impact finishing processes occurring after the plating process is completed.

[0003] Conventional electroplating chambers and methods lead to high Total Thickness Variation (hereafter TTV) when processing large die patterns that include significant area density variations and also have a pattern perimeter that does not extend to the edge of the substrate. Controlling the TTV using conventional means often requires low plating rates, which results in low throughput. Designs that yield lower TTV enable higher plating rates and therefore higher substrate throughput, which is a desirable factor in producing microelectronic devices. Additionally, where a first substrate has a first variation in plateable seed layer density thereacross, and a second substrate has a second, different, variation in plateable seed layer density thereacross, it is difficult to impossible to obtain a desirable TTV on both substrates when plated in the same chamber with the same chamber hardware. This limits the utility of the plating hardware as dedicated to a single substrate type, or requires shutting down the system and replacing components thereof designed to obtain a desirable TTV on the second substrate.

[0004] Thus, there is a need for improved systems and methods that can be used to produce high quality devices and structures with acceptable TTV with greater flexibility of the plating hardware.SUMMARY

[0005] Embodiments of the present disclosure generally relate to a semiconductor processing chamber, and more particularly, an electroplating system and methods of processing substrates that include large die patterns.

[0006] In one aspect herein, a diffuser for the electroplating cell is provided, and the diffuser is configured as a multi-plate or multi-piece element including openings therethrough through which electrolyte is flowed toward the substrate. The diffuser hereof includes at least two different sets or pluralities of openings, a first plurality of openings of a first set of fluid passages extending through the diffuser and a second plurality of openings of a second set of fluid passages extending through the diffuser,PATENTAttorney Docket No.: 44026215WO01wherein the openings of the first plurality of openings are fluidly isolated from the openings of the second plurality of openings. Each of the plurality of openings form a pattern at the substrate facing side of the diffuser. Further, the length of the first set of fluid passages and the second set of fluid passages as measured as the depth of the passages from the substrate facing side of the diffuser may be the same length. In one aspect, the electrolyte is flowed only through the first plurality of openings for depositing a plated layer on a substrate having a first patterned seed layer thereon and flowed only through the second plurality of openings for depositing a plated layer on a different substrate having a second, different from the first, seed layer pattern thereon. Thus, substrates having two different seed layer patterns exposed in openings in an overlying resist layer can be processed in the same electroplating cell without the need to change the diffuser to provide a substrate specific seed layer pattern.

[0007] In another aspect the diffuser includes at least a first perforated plate having the first set of openings and a first portion of second passages connected to the second openings therein, and a second perforated plate having a second portion of the second passages therein, and the first and second perforated plates are interconnected to align the first portion of the second passages with the second portion of the second passages. In this aspect, the first perforated plate has a surface, through which the first set of openings and the second set of openings open, and which faces the substrate, and a second surface having a plurality of recesses, each recess aligned with one of the first portion of the second passages, and the second perforated plate has a plurality of protrusions configured to extend into the recesses in the second surface of the first perforated plate. Each of the second portions of the second set of passages is generally centered in a protrusion, and each of the openings of the first portion of the second passages opens at the second surface of the first perforated plate generally centered in a recess. As a result, by inserting the protrusions of the second perforated plate into the recesses of the first perforated plates, the longitudinal axis of the first and second portions of the second passages are aligned to allow electrolyte to flow therethrough.

[0008] In another aspect, fluid is flowed through one set of openings for a first substrate seed layer type, and fluid is flowed through both the first and second sets ofPATENTAttorney Docket No.: 44026215WO01openings for a substrate having second, different, seed layer pattern, having a higher density of plateable features than those of the seed layer pattern of the first substrate.

[0009] In another aspect, electrolyte is flowed through one set of openings and the electrode is powered as an anode, and fluid is flowed through the second set of openings where the electrode is powered as a cathode or thief.

[0010] In another aspect, three or more sets of openings, each set fluidly isolated from the other sets, is provided in the diffuser.

[0011] In another aspect, an electroplating system is provided, and it includes an anode, a head to which a substrate can be releasably affixed, and a diffuser is configured as a multi-plate or multi-piece element including openings therethrough wherein electrolyte is flowed toward the substrate. The diffuser hereof includes at least two different sets or pluralities of openings, a first plurality of openings and a second plurality of openings, wherein the openings of the first plurality of openings are fluidly isolated from the openings of the second plurality of openings. Each of the plurality of openings form a pattern at the substrate facing side of the diffuser. Further, the length of fluid passages through the diffuser connecting to the first set of openings and the second set of openings as measured as the depth of the passages from the substrate facing side of the diffuser may be the same length. In one aspect, the electrolyte is flowed only through the first plurality of openings for depositing a plated layer on a substrate having a first exposed seed layer pattern thereon and flowed only through the second plurality of openings for depositing a plated layer on a different substrate having a second, different from the first, exposed seed layer pattern thereon. Thus, substrates having two different seed layer exposure patterns can be processed in the same electroplating cell without the need to change the diffuser to provide a substrate specific seed layer pattern. Additionally, electrolyte can be flowed simultaneously through he first set of openings and second set of openings to deposit a plated layer on a substrate having an exposed seed layer pattern different from that on the first and second seed layer patterns / BRIEF DESCRIPTION OF THE DRAWINGS

[0012] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure,PATENTAttorney Docket No.: 44026215WO01briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of its scope, and may admit to other equally effective embodiments.

[0013] FIG. 1 shows a top perspective view of an exemplary electroplating system according to some embodiments of the present technology.

[0014] FIG. 2 shows a top perspective view of the system of FIG. 1 with the head removed for purposes of illustration.

[0015] FIG. 3 shows a partial sectional view of portions of a multi-plate diffuser useful in the exemplary electroplating system FIG. 1.

[0016] FIG. 4 shows a sectional view of the first plate of the multi-plate diffuser of FIG. 3.

[0017] FIG.s 5A and 5B show a perspective view of, and an enlarged perspective view of a portion of, the second plate of the multi-plate diffuser of FIG. 3.

[0018] FIG. 6A shows a partial section view of the multi-plate diffuser of FIG. 3 with portions of the posts of the second plate received in recesses provided therefor in the first plate, and FIG. 6B shows an enlarged view of two columns of the second plate of the multi-plate diffuser received two different recesses in the first plate of the multiplate diffuser.

[0019] FIG. 7 shows a schematic sectional side view of the electroplating system of Figure 1 having the multi-plate diffuser located between the anode or electrode and the substrate processing location thereof.

[0020] FIG. 8 shows a plan view of a portion of the diffuser of FIG. 3.

[0021] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.PATENTAttorney Docket No.: 44026215WO01DETAILED DESCRIPTION

[0022] Herein, electroplating cells for depositing a conductive layer, for example a metal such as copper, on a substrate is provided. Herein, the substrate includes a conductive seed layer deposited thereon prior to the introduction thereof into the electroplating call. The substrate is located in the cell such that the seed layer faces an anode of the cell, and electrolyte having the conductor to be deposited on the substrate -electrolyte-seed layer circuit therein is flowed over the surface of the substrate, while power is applied to the anode-electrolyte-seed layer circuit to cause metal ions in the electrolyte to deposit on the exposed portions of the seed layer. As the seed layer on the substrate is electrically coupled into the plating circuit, the ionic conductor material in the electrolyte is thereby deposited on the exposed portions of the seed layer.

[0023] In one aspect herein, a diffuser for the electroplating cell is provided, and the diffuser is configured as a multi-plate or multi-piece element including openings therethrough wherein electrolyte is flowed therethrough toward the substrate. The diffuser hereof includes at least two different sets or pluralities of openings, a first plurality of openings 330 and a second plurality of openings 340, wherein the openings of the first openings 330 are fluidly isolated from the openings of the second plurality of openings 340 (Figure 3). Each of the first and second plurality of openings 330, 340 form a pattern at the substrate facing side of the diffuser. Further, the length of the flow passages extending through the diffuser and connected to the first set of openings and the second set of openings as measured as the depth of the opening from the substrate facing side of the diffuser may be the same length. In one aspect, the electrolyte is flowed only through the first plurality of openings for depositing a plated layer on a substrate having a first patterned seed layer thereon and flowed only through the second plurality of openings 340 for depositing a plated layer on a different substrate having a second, different from the first, seed layer pattern thereon. Thus, substrates having two different seed layer patterns can be processed in the same electroplating cell without the need to change the diffuser.

[0024] FIGS. 1-2 illustrate an exemplary system 10 for electroplating a substrate 30 (Figure?) according to embodiments of the present technology. System 10 may include a head 14 supported on a head lifter 16 and a vessel 24. A single system 10PATENTAttorney Docket No.: 44026215WO01may be used as a standalone unit. Alternatively, multiple systems 10 may be provided in arrays within an enclosure, with substrates or work pieces loaded and unloaded into and out of the processors by one or more robots. Head lifter 16 may lift and / or invert the head 14 to load a substrate 30 thereto and unload a substrate 30 therefrom. Head lifter 16 may also lower the head 14 into engagement with one or more components of the vessel 24 for processing of the substrate 30 by contacting the substrate with an electrolyte in the vessel 24. As shown in Figure 7, a membrane 40a, 40b may be included to divide the vessel 24 into a lower chamber 309 containing one or more anodes A1, A2 and an upper chamber 319. A first membrane is disposed over a central anode A1, and a peripheral membrane 40b surrounds the first membrane 40a over a second, ring shaped anode A2. The membranes 40a, 40b separate a first liquid electrolyte in the lower chamber 309 below the membrane 40, second liquid electrolyte in the chamber upper 319 above the membrane 40. Alternatively, the membrane 40 may be omitted with the vessel 24 having a single chamber holding a single electrolyte.

[0025] A contact ring (not shown) may be disposed on the head 14, which may hold the substrate 30 and may have a plurality of contact fingers for making electrical contact with a conductive layer, such as a metal seed layer, on the substrate 30. The contact ring may optionally have a seal to seal the contact fingers from the electrolyte. The head 14 may include a rotor for rotating the substrate 30 during processing, with the contact ring on the rotor. Typically, the contact ring may include a seal and a backing plate, with the contact ring and the backing plate forming a substrate holder. The head 14 may be movable to position the substrate holder into a processing position in the vessel 24, where the seed layer may be in contact with electrolyte in the vessel 24. A weir surrounds the plating region, and electrolyte flows past the substrate and into the weir. The electrolyte is replenished and returned through the diffuser to the to be plated surface of the substrate 30. Electrical control and power cables (not shown) may be linked to the lift / rotate a weir shield and to internal head components lead up from system 10 to facility connections, or to connections within multi-processor automated system. A rinse assembly 12 having tiered drain rings may be provided above and / or about the vessel 24.PATENTAttorney Docket No.: 44026215WO01

[0026] A paddle 18 may be provided at a fixed vertical position within the vessel 24 adjacent to the substrate 30. In some embodiments, the paddle 18 may be a generally circular plate of dielectric material having a plurality of parallel ribs or blades spaced apart by slots and / or other openings. A paddle actuator 32 may move the paddle 18 horizontally in a flat plane, parallel to the substrate 30, within the vessel 24 to agitate the electrolyte. The paddle 18 and the paddle actuator 32 may be supported on a base plate 20 attached to the vessel 24. The substrate 30 may be rotating or stationary. The slots and / or other openings on the paddle 18 may enable allow ionic current to pass through the paddle 18.

[0027] In some embodiments, the paddle 18 itself is used as an electric field shield. In typical operation, the paddle 18 may move with an oscillation (which may be between or about 6-10 Hz in some embodiments), and with a stroke that is about to 1 x the paddle rib pitch. A secondary low frequency oscillation may be used to shift the rib reversal points to avoid imprinting either an electric field or mass transfer signature on the substrate 30 (i.e., stripes on a stationary substrate, and rings on a rotating substrate). This secondary oscillation is referred to as the stagger motion. The stagger motion envelope may be roughly equal to the rib pitch. During processing, the paddle actuator 32 moves the paddle 18 to agitate the catholyte contained in the vessel 24. For example, the paddle 18 may move back and forth within a paddle travel dimension, with an oscillating motion. For some applications the paddle 18 may use other movements, such as start / stop, stagger, etc.

[0028] In use, the operator of a plating system can include a diffuser therein between the plating electrode and the substrate mounting area of the head 14, wherein the diffuser includes an opening pattern therein configured to provide the desired thickness uniformity of the plated material across the surface of the substrate or work piece on which plating is occurring. The paddle 18 can be located between the diffuser and the substrate. The openings in these diffusers are thus customized for a pattern to be plated onto a specific substrate or work piece and frequently cannot be used to provide a desired thickness uniformity of the plated material across the surface of the other substrates or work pieces having different patterns to be plated thereonto. To increase the flexibility of the exemplary system 10 hereof, a diffuser is provided having different sets of openings therethrough which are fluidly isolated fromPATENTAttorney Docket No.: 44026215WO01one another are provided, to enable desired thickness uniformity of the deposited layer for substrates having different patterns to be plated thereon. FIG 3 illustrates a schematic cross-sectional view of an exemplary dual path diffuser 300. Dual path diffuser 300 may include at least two stacked, and partially nested with one another, diffuser plates, here first diffuser plate 310 and second diffuser plate 321, that may be formed of any chemically compatible, to the electrolyte, plastic (PPO, PEEK, NPP, PVDF, etc.), a ceramic, or other rigid chemically compatible material such as Titanium.

[0029] Referring to FIG 4, a cross sectional view of a first diffuser plate 310 comprising a generally planar first surface 311 and an opposed generally planar second surface 312 disposed generally parallel to the first surface 311, is shown. The first surface 311 further comprises a series of first openings 330 and second openings 340 at the first ends of flow passages extending between the first surface 311 and the second surface 312. The second surface 312 further comprises a series of third openings 334 and a series of fourth openings 341 where the flow passages exit the second surface 312. As will be described further herein, counterbores 343 extend inwardly of the second surface 312 of the first diffuser plate 310 and terminate within the first diffuser plate 310, into which protrusions or posts of the second diffuser plate 320 are received. Third openings 334 bound one end of a counterbore 343 at the second surfaces 312, and the counterbores 343 include a cylindrical inner wall 360, terminating inwardly of the second side 312 of the first plate at a generally circular base wall 361 as shown in Figures 4 and 6B.

[0030] The flow passages in the first diffuser plate 310 further comprise a series of first flow passages 362 extending through the first diffuser plate 310 from the first openings 330 to open at a base wall opening 363 at the base wall 361 of the counterbore 343 so that the first openings 330 are in fluid communication with the counterbore 343 of the third openings 334. The flow passages of the first diffuser plate 310 further comprise a plurality of second flow passages 342 extending from the second flow openings 340 to the fourth openings 341, so that the second flow openings 340 are in fluid communication with the fourth openings 341. In the first diffuser plate 310, the length of the second flow passages 342 are approximately twice the length of the first flow passages 362 of the first diffuser plate 310. Likewise, in this construct of the diffuser 300, the diameter and cross sections of the first flow passagesPATENTAttorney Docket No.: 44026215WO01362 and second flow passages 342 are the same. However, in other constructs the lengths, diameters and cross sections of the first flow passages 362 and second flow passages 342 may be the same, or may be different.

[0031] Referring to FIG.s 5A, 5B, 6A and 6B, views of the second diffuser plate 320 comprising a third surface 321 and an opposed fourth surface 322, is shown. A plurality of protrusions configured as columns 350 protrude from the third surface 321, wherein the columns 350 each have a fifth opening 332 centered on the end face 333 thereof. The fourth surface 322 further comprises a series of sixth openings 337, larger than the first openings 330 in the first diffuser plate 310 and larger than the fifth opening 332. As shown in Figures 6A and 6B, there is an open area 400 surrounding the exterior of the columns 350 between the third surface 321 of the second diffuser plate 320 and the end faces 333 of the columns 350 when second diffuser plate 320 is connected to first diffuser plate 310. The height of the columns 350 from the third surface 321 of the second diffuser plate 320 to the end faces 333 of the columns 350 is greater that the length of the first flow passages 362 in the first diffuser plate 310. Each of the columns 350 has an outer circumferential surface 364 extending from the third surface 321 of the second diffuser plate 320 to the end faces 333 of the columns 350, and has the same cross section, or slightly smaller, as the surface of the end faces 333. For example, the columns 350 are right circular in section and extend from the third surface 321 normal thereto, and the end faces 333 are likewise circular. However, other column 350 cross sections can be employed, for example oval or ellipsoid in section, or polygonal in section, so long as the mating recesses of the third openings 334 formed in the first diffuser plate have the same section to receive the inserted portion of the column 350 thereinto. Thus the end of the column 350 adjacent to the first diffuser plate 310 extends inwardly of the counterbore 343 of the first diffuser plate 310 with the end faces 333 of the columns 350 contact the base walls 361 of the counterbore 343 of the first diffuser plate 310, and the base wall openings 363 and the fifth openings 332 of the second diffuser plate are aligned to allow electrolyte flow therethrough.

[0032] The second diffuser plate 320 further comprises a series of third flow paths extending from the fifth openings 332 to the sixth openings 337 through a first plurality of columns 350 so that the first openings 330 are in fluid communication with the thirdPATENTAttorney Docket No.: 44026215WO01openings 334. The third flow paths further comprise a column flow passage first portion 331 with a first diameter and a column flow passage second portion 335 with a second diameter, the first diameter greater than the second diameter. Here, the diameter of the column flow passage second portion 335 has the same diameter, or slightly larger diameter, as that of first flow passages 362 of the first diffuser plate 310. Thus the first flow passages 362 of the first diffuser plate 310 and the column flow passage second portion together provide a flow passage, and that combined flow passage has the same length as that of second flow passage 342. The column flow passage first portion 331 and the column flow passage second portion 335 are in fluid communication with each other. The length of the column flow passage second portion 335 is here the same length as the first flow passages 362 in the first diffuser plate 310. Additionally, the centerlines of the column flow passages second portion 335 and the first flow passages 362 are, within machining tolerances, collinear and parallel, and thereby together form a flow passage from the first surface 311 of the first diffuser plate 310 to the fourth surface 322.

[0033] Referring to Figures 6A and 6B, the pitch P, in other words the spacing, between the centers of the adjacent columns 350 and the centers of the column flow passage second portion 335 on the second diffuser plate 320 is the same pitch as between the centers of the adjacent third openings 334 of the first diffuser plate 310. A portion of each of the columns 350 forming an inserted portion 370 extends inwardly of the third openings 334 and into the counterbore 343 of the first diffuser plate 310, such that end face 333 of the column 350 bears against base wall 361 of the opening 334 of the first diffuser plate 310. The depth of insertion of the inserted portion 370, because the distance between the base wall 361 of the opening 334 of the first diffuser plate 310 and the second surface 312 of the first diffuser plate 310 is equal to the length of the column flow passage second portion 335, results in an intermediate portion 372 of the column 350 to extend between the second surface 312 of the first diffuser plate 310 and the third surface 321 of the second diffuser plate 320, such that a gap is present between the second surface 320 of the first diffuser plate 310 and the third surface 321 of the second diffuser plate 320. This gap defines a fluid flow space or fluid manifold region 368 between the first diffuser plate 310 and the second diffuser plate 320, from which the column flow passage first portion 335 and the firstPATENTAttorney Docket No.: 44026215WO01flow passages 362 are fluidly isolated, but which is in fluid communication with the second flow passages 342 of the first diffuser plate 310. Thus, the diffuser 300 hereof is configured to flow a first fluid or electrolyte through the second flow passages 342 independently of flowing a second fluid or electrolyte through the combination of column flow passage second portions 335 and the first flow passages 362.

[0034] FIG 7 is a partial schematic side cross-sectional view of a first configuration of the electroplating chamber shown in Figures 2A-2B, according to one or more embodiments. A membrane 40 (Figure 7 may be included to divide the vessel 24 into a lower chamber 309 having a central lower chamber 309a between anode A1 and membrane 40a and a peripheral lower chamber 309b between membrane 40b and anode A2, and an upper chamber 319 containing a second liquid electrolyte configured as separate central upper chamber 319a over the central anode A1 and membrane 40a, and a peripheral upper chamber 319b over anode A2 and membrane 40b. Alternatively, membrane 40 may be omitted with the vessel 24 having a single chamber holding a single electrolyte. Anodes A1 and A2 are charged independently of one another and are controlled by a controller.

[0035] During plating, electrolyte may be flowed through the central upper chamber 319a and only through the column flow passage second portions 335 and the first flow passages 362, while powering only the central anode A1. In this configuration, the plating fluid or electrolyte circulating through the central upper chamber 319a is in electrical series across the membrane 40a with the anode A1 and through the first passages 362 with the to be plated surface of the substrate 300. For example, the plating fluid flows past the substrate in and into a surrounding weir, where it flows to a pump 712 and thence to a valve 710. The valve 710 is positioned to flow the electrolyte through the first line 701 only into the central flow passages 714 to redirect the electrolyte to the central upper chamber 319a over the central portion of the membrane 40a to flow back through the combination of column flow passage second portions 335 and the first flow passages 362 to the to be plated surface of the substrate 300. Additionally the valve 710 can be positioned to flow the electrolyte only to the second flow line 702 and thence into the peripheral upper chamber 709b and then through the second passages 342 to the to be plated surface of the substrate 30. Thence, the electrolyte flows into the weir, and is pumped by pump 712 back throughPATENTAttorney Docket No.: 44026215WO01the valve where it is directed back to the upper peripheral chamber 319b. When the electrolyte is flowing from the valve 710 through the first line 701, the first anode A1 is powered.

[0036] The electrolyte is in an electrical series connection with the second peripheral anode A2, through the membrane 40b, and through the combination of the combination of column flow passage second portions 335 and the first flow passages 362 with the to be plated surface of the substrate. Here, by switching the valve 712 to flow the electrolyte into the central upper chamber 319a a first substrate having a first to be plated pattern thereon can be plated with a desired plated thickness uniformity across the plated surface thereof, and by flowing the electrolyte to the peripheral upper chamber 319b, a second substrate having a different plateable pattern thereon can be plated with a desired plated thickness uniformity across the plated surface thereof. Here, where different substrate specific patterns on two different substrates are to be plated, the electrolyte can be the same electrolyte directed to centrally located upper chamber 319a and peripheral upper chamber 319b, or different electrolytes can be flowed through central upper chamber 319a and thus through column flow passage second portions 335 and the first flow passages 362, and flowed through peripheral upper chamber 319b and through the second flow passages 342, and thus over the to be plated surface of the different substrates 300. Where different electrolytes are used, a rinse fluid can be flowed through the system between the uses of the different electrolytes.

[0037] The diffuser assembly is thus configurable to flow an electrolyte powered by a first anode through a first series of diffuser flow passages to then flow across the to be plated surface of a first substrate having a first plateable pattern, and flow an electrolyte powered by a second anode different than the first anode through a second first series of diffuser flow passages different than the first series, to then flow across the to be plated surface of a first substrate having a second plateable pattern different than the first plateable pattern.

[0038] Additionally, the dual path diffuser 300 assembly can be used to simultaneously flow an electrolyte through the first and second series of flow passages. For example both anodes A1 and A1 can be powered, and electrolytePATENTAttorney Docket No.: 44026215WO01flowed through both the central upper chamber 319a and peripheral upper chamber 319b, and thence through both the second flow passages 342 and the combination of column flow passage second portions 335 and the first flow passages 362 to the to be plated surface of the substrate 300. In variations of this use, one or the other of the anodes A1 and A2 can be powered, the fluid flowing through the central upper chamber 319a and through the second flow passages 342 can be the same or different than the fluid flowing through the peripheral upper chamber 319b and the second flow passages 342. For example, they can be different electrolyte solutions, or one as an electrolyte and the other a non-electrolyte, for example a fluid having insufficient conductivity to electrically connect an anode A1 or A2 to the seed layer on the substrate 300. Different flow rates of the different fluids or the electrolytes, and different powerings of the anodes, is also contemplated, separately or in combination with different flows and different fluids.

[0039] FIG. 8 is a top plan view of the first surface 311 of the first diffuser plate 310. When starting from a given opening and scanning across line a, every opening crossed by line a will be an opening of either the first flow passage 362 or the second flow passage 342 sat the first surface 311. If an opening encountered is a first opening 330 of first flow passage 362, all other openings along line a will also be first openings, 330. Likewise, if an opening encountered is a second opening 340 of second flow passage 362, all other openings along line a will also be second openings 340. Here, the first diffuser plate can include the same, or a different, number of first openings 330 and second openings 340. The second openings 340 and first openings are here aligned in alternating rows along straight lime paths across the first diffuser plate 310. When starting from a given opening and scanning across a diagonal, i.e., along any diagonal such as line b, which is disposed 45° offset from line a, every adjacent opening on line b will be a different type of opening with a different flow path from the previous opening and flow path. However, different pitches and spacing’s between the first flow passages, and different pitches and spacings between the second flow passages, can be employed in the diffuser to create substrate pattern specific flow passage patterns. For example, the first flow passages 362, the second flow passages 342, or both can be spaced from one another at different spacings to create regions where more electrolyte is emitted from the diffuser and toward thePATENTAttorney Docket No.: 44026215WO01substrate 300 where relatively larger exposed areas of seed layer are present on the substrate, and regions where less electrolyte is emitted from the diffuser and toward the substrate 30 where relatively smaller exposed areas of seed layer are present on the substrate. Relatively larger areas of exposed seed layer include relatively larger singular exposed regions of the seed layer, relatively higher density of exposed regions of the seed layer, or both. Likewise, relatively smaller areas of exposed seed layer include relatively smaller singular exposed regions of the seed layer, relatively smaller density of exposed regions of the seed layer, or both. Additionally, the opening area of the flow passages can be increased or decreased, alone or in addition to the spacing therebetween, to yield substrate pattern specific arrangements of flow passages.

[0040] Although the multi plate diffuser hereof is described as having two sets of flow paths, the diffuser can me modified to have three or more sets of independent flow paths. For example, one or more additional plates having the construct of the second diffuser plate can be provided for connection to the first diffuser plate 310. These additional diffuser pates can be configured to have the same number, or a different number of flow passages, that those in the second diffuser plate, and employ longer columns similar to those of the second diffuser plate to be able to extend through the second diffuser plate and into the first diffuser plate.

[0041] Additionally, the use of the multi-plate diffuser hereof is described without respect to the use of a paddle 18, and can be employed with or without a paddle 18. For example, multi-plate diffuser can be positioned in a plating vessel such that a paddle structure s disposed between the substrate 300 and the multi-plate diffuser.

[0042] Further, in one use of the multi-plate diffuser, electrolyte is flowed either through the second flow passages 342 or through the combination of column flow passage second portions 335 and the first flow passages 362 and the electrode is powered as an anode, and electrolytes is flowed through the other of the first flow passages or the combination of the column flow passage second portions 335 and the first flow passages 362 and the electrode is powered as a cathode or thief.

[0043] In the preceding description, for the purposes of explanation, numerous details have been set forth in order to provide an understanding of variousPATENTAttorney Docket No.: 44026215WO01embodiments of the present technology. It will be apparent to one skilled in the art, however, that certain embodiments may be practiced without some of these details, or with additional details.

[0044] Having disclosed several embodiments, it will be recognized by those of skill in the art. that various modifications, alternative constructions, and equivalents may be used without departing from the spirit of the embodiments. Additionally, a number of well-known processes and elements have not been described in order to avoid unnecessarily obscuring the present technology. Accordingly, the above description should not be taken as limiting the scope of the technology.

[0045] Where a range of values is provided, it is understood that each intervening value, to the smallest fraction of the unit, of the lower limit, unless the context clearly dictates otherwise, between the upper and lower limits of that range is also specifically disclosed. Any narrower range between any stated values or unstated intervening values in a stated range and any other stated or intervening value in that stated range is encompassed. The upper and lower limits of those smaller ranges may independently be included or excluded in the range, and each range where either, neither, or both limits are included in the smaller ranges is also encompassed within the technology, subject to any specifically excluded limit in the stated range. Where the stated range includes one or both of the limits, ranges excluding either or both of those included limits are also included.

[0046] As used herein and in the appended claims, the singular forms “a”, “an”, and “the” include plural references unless the context clearly dictates otherwise. Thus, for example, reference to “a region” includes a plurality of such regions, and reference to “the aperture” includes reference to one or more apertures and equivalents thereof known to those skilled in the art, and so forth.

[0047] Also, the words “comprise(s)”, “comprising”, “contain(s)”, “containing”, “include(s)”, and “including”, when used in this specification and in the following claims, are intended to specify the presence of stated features, integers, components, or operations, but they do not. preclude the presence or addition of one or more other features, integers, components, operations, acts, or groups.PATENTAttorney Docket No.: 44026215WO01

[0048] The terms wafer, substrate or work piece, as used herein, can include any type of semiconductor substrate, packaging substrate, substrate carrier, interposer substrate, bridge substrate, printed circuit board (PCB), or other type of substrate that includes die patterns disposed on a surface of the substrate. In some embodiments, the die pattern containing substrate can include an advanced packaging substrate that may include a material such as glass, silicon, ceramic, or organic or polymeric (e.g., FR4, BT, polyimide (PI), polyester, etc.) containing materials. The advanced packaging substrates can include one or more redistribution layers (RDL). The substrates can also be square, rectangular, or circular in shape. In one example, a square 310mm x 310mm or 600mm x 600mm panel is used. Where a square substrate is being plated, the dual path diffuser 300 has a rectangular surface, facing the substrate having an area as large or slightly larger than the surface area of the substrate on which plateable features, such as seed layer exposed by openings in the resist, are located. Additionally, in some cases where a non-circular substrate is used, the non-circular substrate can be mounted to a circular shaped carrier substrate during processing.

Claims

PATENTAttorney Docket No.: 44026215WO01What is claimed is:

1. An electroplating system, comprising:a vessel;a substrate receiving surface;a diffuser, having a first side facing the substrate receiving surface and an opposed second side, disposed within the vessel, wherein:the diffuser is configured as at least a first plate and a second plate, the diffuser including a plurality of flow passages extending therethrough and opening through the second side of the diffuser and the first side of the diffuser, wherein electrolyte is flowed through the flow passages toward a substrate on the substrate receiving surface;wherein the plurality of flow passages further comprise a first plurality of flow passages and a second plurality of flow passages, wherein second plurality of flow passages includes a first partial flow passage in the first plate and a second partial flow passage in the second plate, and the first plurality of flow passages and second plurality of flow passages are fluidly isolated from one another on the second side of the diffuser.

2. The system of claim 1, wherein the plurality of first flow passages form a repeating pattern at the substrate facing side of the diffuser.

3. The system of claim 1, wherein the length of the first set of flow passages and the second set of flow passages comprising the combined lengths of the first partial flow passage in the first plate and a second partial flow passage in the second plate are the same length.

4. The system of claim 1, wherein the system is configured to allow fluid flow only through the first plurality of flow passages for depositing a plated layer on a substrate having a first patterned seed layer thereon and allow fluid flow only through the second plurality of flow passages for depositing a plated layer on a different substrate having a second, different from the first, seed layer pattern thereon.PATENTAttorney Docket No.: 44026215WO015. The system of claim 1, wherein the second plate of the diffuser includes a plurality of protrusions, and the plurality of second partial flow passages extend through the protrusions.

6. The system of claim 1, wherein the first plate includes a plurality of recesses extending thereinto, and the first plurality of first partial flow passages extend therefrom to the first side of the diffuser.

7. The system of claim 1, wherein the plurality of protrusions on the second plate extend inwardly of the plurality of recesses in the first plate.

8. The system of claim 1, further including a reciprocating paddle interposed between the diffuser and the substrate support.

9. A diffuser for use in an electroplating system, comprising:a first side and an opposed second side, the diffuser further including at least a first plate and a second plate, the diffuser including a plurality of electrolyte flow passages therethrough and opening through the second side of the diffuser and the first side of the diffuser;wherein the plurality of flow passages further comprise a first plurality of flow passages and a second plurality of flow passages, wherein second plurality of flow passages includes a first partial flow passage in the first plate and a second partial flow passage in the second plate, and the first plurality of flow passages and second plurality of flow passages are fluidly isolated from one another on the second side of the diffuser.

10. The diffuser of claim 9, wherein the plurality of first flow passages form a repeating pattern of openings on the first side of the diffuser.

11. The diffuser of claim 9, wherein the length of the first set of flow passages and the second set of flow passages comprising the combined lengths of the first partial flow passage in the first plate and a second partial flow passage in the second plate are the same length.PATENTAttorney Docket No.: 44026215WO0112. The diffuser of claim 9, wherein the second plate of the diffuser includes a plurality of protrusions, and the plurality of second partial flow passage extend through the protrusions.

13. The diffuser of claim 9, wherein the first plate includes a plurality of recesses extending thereinto, and the first plurality of first partial flow passages extend therefrom to the first side of the diffuser.

14. The system of claim 9, wherein the plurality of protrusions on the second plate extend inwardly of the plurality of recesses in the first plate.

15. The diffuser of claim 14, further including a fluid manifold between the first plate and the second plate, wherein the protrusions extend through the fluid manifold and fluidly isolate the second plurality of flow passages from the fluid manifold.

16. A method of providing a first fluid and a second fluid to the surface of a substrate on a substrate support in a electroplating system, comprising:providing a diffuser, the diffuser having a first side facing the substrate support and an opposed second side, the diffuser further including at least a first plate and a second plate, the diffuser including a plurality of electrolyte flow passages therethrough and opening through the second side of the diffuser and the first side of the diffuser;wherein the plurality of flow passages further comprise a first plurality of flow passages and a second plurality of flow passages, wherein second plurality of flow passages includes a first partial flow passage in the first plate and a second partial flow passage in the second plate, and the first plurality of flow passages and second plurality of flow passages are fluidly isolated from one another on the second side of the diffuser;flowing a first fluid through the first flow passages while not flowing a fluid through the second flow passages; and;flowing a second fluid through the first flow passages while not flowing a fluid through the first flow passages.PATENTAttorney Docket No.: 44026215WO0117. The method of claim 16, further comprising;configuring the diffuser as having a first plate and a second plate; providing the first flow passages through only the first plate; and providing the second flow passages through the first plate and the second plate.

18. The method of claim 17, further comprising including a plurality of protrusion on the second plate; andextending a portion of the second flow passages through the protrusions in the second plate.

19. The method of claim 18, further comprising providing a plurality of recesses in the first plate, and extending a portion of the protrusions of the second plate inwardly of the recesses in the first plate.

20. The method of claim 18, further comprising providing a fluid manifold between the first plate and the second plate, the fluid manifold in fluid communication with he first flow passages.

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