Package scalable phased array antennas

Abstract

Meth Methods, systems, and devices for a phased array antenna are described. An antenna element module may form part of a phased array antenna, where the radiating antenna element may be part of the same package as the RFIC that controls the RF signal communicated via the antenna element. An antenna element module may include a lead frame having a base and sidewalls forming a cavity, where the sidewalls may include signal paths for routing RF, ground, and control signals, and a lid coupled to the top of the sidewalls with a radiating antenna element on its top surface. In a first example, the RFIC may be wire bonded in the cavity and the RF signal routed through the package sidewalls to the lid via an RF trace. In a second example, the lid may interface directly with the RFIC through RFIC bonds, eliminating the need for wire bonds.

Description

PACKAGE SCALABLE PHASED ARRAY ANTENNASBACKGROUND

[0001] The following relates generally to communications, including package scalable phased array antennas.

[0002] Communications devices may communicate with one another using wired connections, wireless (e.g., radio frequency (RF)) connections, or both. Wireless communications between devices may be performed using a wireless spectrum that has been designated for a service provider, wireless technology, or both. In some examples, the amount of information that can be communicated via a wireless communications network is based on an amount of wireless spectrum designated to the service provider, and an amount of frequency reuse within the region in which service is provided. Satellite communications may use beamforming via antenna arrays to establish beams, however, processing and power constraints may limit throughput using beamforming.SUMMARY

[0003] The described techniques relate to improved methods, systems, devices, and apparatuses that support package scalable phased array antennas. One example relates to a phased array antenna that includes an array of antenna element modules. Each of the array of antenna element modules may include a lead frame having a base and sidewalls that form a cavity in the lead frame, the lead frame including a first lead that connects a radio frequency (RF) solder pad on a bottom of the base with a first bond pad within the cavity, a second lead that connects a second bond pad in the cavity with an RF contact pad at a top of a first sidewall of the lead frame, and one or more ground leads that connect one or more ground solder pads on the bottom of the base with at least a third bond pad and one or more ground contact pads at the top of the sidewalls. Each of the array of antenna element modules may also include an RF integrated circuit (RFIC) that is attached within the cavity and is bonded to the first bond pad, the second bond pad, and the third bond pad using bond wires. Each of the array of antenna element modules may also include a planar lid. The planar lid may include a radiating antenna element on a top side of the planar lid, one or more ground vias that contact the one or more ground contact pads of the lead frame, an RF via that contacts the RF contact pad of the lead frame, a ground plane below the radiating antenna element, and a coplanarAttorney Docket No. VS2642-WO-1 (78120.0746)waveguide RF trace that connects the RF via to the radiating antenna element, the coplanar waveguide RF trace within a slot in the ground plane.

[0004] Another example relates to a phased array antenna that includes an array of antenna element modules. Each of the array of antenna element modules may include a lead frame having a base and sidewalls that form a cavity in the lead frame, the lead frame including a first lead that connects a radio frequency (RF) solder pad on a bottom of the base with an RF contact pad at a top of a first sidewall of the lead frame and one or more ground leads that connect one or more ground solder pads on the bottom of the base with one or more ground contact pads at the top of the sidewalls. Each of the array of antenna element modules may also include a planar lid. The planar lid may include a radiating antenna element on a top side of the planar lid, an RF via that connects the radiating antenna element to a first bond pad on an underside of the planar lid, a ground plane below the radiating antenna element, the first bond pad within an opening in the ground plane, and a coplanar waveguide RF trace that connects the RF contact pad of the lead frame to a second bond pad on the underside of the planar lid. Each of the array of antenna element modules may also include an RFIC that is bonded to the first bond pad and the second bond pad, the RFIC including a plurality of integrated circuit (IC) pads including a first group of the plurality of IC pads that are on a perimeter of the RFIC and a first IC pad that is located proximate to a center of the RFIC and that is bonded to the first bond pad of the planar lid.BRIEF DESCRIPTION OF THE DRAWINGS

[0005] FIG. 1 shows an example of a satellite communication system that supports package scalable phased array antennas in accordance with aspects described herein.

[0006] FIGs. 2A and 2B show a sideview and a top view of two portions of an example phased antenna array that supports package scalable phased array antennas in accordance with aspects of the present disclosure.

[0007] FIG. 3 shows vertical and horizontal cross-sections of a portion of an example antenna element module that supports package scalable phased array antennas in accordance with aspects of the present disclosure.

[0008] FIG. 4 shows vertical and horizontal cross-sections of a portion of an example antenna element module that supports package scalable phased array antennas in accordance with aspects of the present disclosure.Attorney Docket No. VS2642-WO-1 (78120.0746)DETAILED DESCRIPTION

[0009] In some examples, a phased array antenna may be an antenna system composed of multiple antenna elements that may collectively manipulate a phase of one or more transmitted or received signals to steer a beam of radio waves without physically moving the antenna. Achieving effective beam steering may rely on precise control over the phase and amplitude of signals delivered to each individual antenna element, which may in turn rely on complex and tightly calibrated electronics and manufacturing processes. However, this level of control may result in phased array antennas that may be highly integrated assemblies, which may make individual component rework difficult, potentially resulting in fallout that increases the overall cost of manufacturing. Additionally, or alternatively, analyzing the design of a phased array antenna may involve trading out parts early in the design cycle, meaning that issues identified later in the manufacturing process may result in significant non-recurring costs for any design updates or modifications. In some cases, because the electronics and radiating elements of a phased array antenna may be tightly coupled in their design, changes to the operating frequency, array size, or array geometry may involve substantial redesign effort, which may limit the flexibility of the overall system architecture and increase both development time and cost.

[0010] The techniques described herein support methods, systems, and devices for package scalable phased array antennas. In some cases, an antenna element module may form part of a phased array antenna, where the radiating antenna element may be part of the same package as the radio frequency (RF) integrated circuit (RFIC) that controls adjustment of an RF component signal communicated via the antenna element. In some examples, an antenna element module may include a lead frame having a base and sidewalls that form a cavity, where the sidewalls include one or more signal paths for routing one or more of an RF signal, a ground path, a DC signal (e.g., power), or a control signal between a bottom of the base and a top of the sidewalls. A planar lid may be coupled with the top of the sidewalls of the lead frame and may include a radiating antenna element on a top side of the planar lid, one or more ground vias that may contact one or more ground contact pads at the top of the sidewalls, and an RF via that may contact an RF contact pad at the top of a first sidewall of the lead frame. Additionally, or alternatively, the planar lid may further include a ground plane and a coplanar waveguide RF trace that may route an RF signal from the RF via to the radiating antenna element. In some cases, each antenna element module may be a surface mount package. An array of antenna element modules may be soldered to a printed wiringAttorney Docket No. VS2642-WO-1 (78120.0746)board (PWB) and the phased array antenna may be reconfigured by modifying the PWB rather than redesigning the antenna element modules themselves. Additionally, or alternatively, because each antenna element module may be individually surface mounted, individual modules that may be non-functioning may be reworked or replaced without replacing the entire array. In some examples, the spacing and arrangement of the antenna element modules on the PWB may be selected based on a desired operating frequency of the phased array antenna, which may allow the same antenna element module building block to support a variety of phased array configurations.

[0011] In a first example, an antenna element module may include an RFIC that may be installed within the cavity of the lead frame and may be bonded to the lead frame using bond wires, which may allow any of a variety of RFICs to be installed into the same lead frame without modification to the lead frame itself. In some cases, the RF via of the planar lid may contact the RF contact pad at the top of the first sidewall of the lead frame, and the coplanar waveguide RF trace may route the RF signal from the RF via to the radiating antenna element on the top side of the planar lid.

[0012] In a second example, an antenna element module may include a planar lid including a first bond pad and a second bond pad on an underside of the planar lid, where an RFIC may be bonded directly to the first bond pad and the second bond pad. For example, solder bumps on the RFIC may be bonded to the first bond pad and the second bond pad on the planar lid (e.g., the RFIC may be flip-chip mounted on the planar lid). In some examples, a first RF via of the planar lid may connect the radiating antenna element on the top side of the planar lid to the first bond pad on the underside of the planar lid, and a coplanar waveguide RF trace of the planar lid may connect the RF contact pad at the top of the first sidewall of the lead frame to the second bond pad on the underside of the planar lid. In some cases, the RFIC may include multiple IC pads on a perimeter of the RFIC and a first IC pad at a center of the RFIC, where the first IC pad may be bonded to the first bond pad of the planar lid to deliver an RF signal from the RFIC to the radiating antenna element through the first RF via.

[0013] Additionally, or alternatively, the coplanar waveguide RF trace may connect the RF contact pad at the top of the first sidewall of the lead frame to a second bond pad on the underside of the planar lid, which may allow the RF signal path to be routed from the lead frame to the RFIC and then from the RIC to the radiating antenna element without the use of bond wires.Attorney Docket No. VS2642-WO-1 (78120.0746)

[0014] Aspects of the disclosure are initially described in the context of satellite communication systems. Aspects of the disclosure are then described with reference to a wireless communications system and radio architectures. Aspects of the disclosure are described in reference to sideviews, top views, and vertical and horizontal cross-sections of a portions example antenna element modules.

[0015] FIG. 1 shows an example of a satellite communication system 100 that supports package scalable phased array antennas in accordance with aspects described herein. Satellite communication system 100 may include a ground system 135, terminals 120, and satellite system 101. The ground system 135 may include a network of access nodes 140 that are configured to communicate with the satellite system 101 via feeder links 132. The access nodes 140 may be coupled with access node transceivers 145 that are configured to process signals received from and to be transmitted through corresponding access node(s) 140. The access node transceivers 145 may also be configured to interface with a network 125 (e.g., the Internet) — e.g., via a network device 130 (e.g., a network operations center, satellite and gateway terminal command centers, or other central processing centers or devices) that may provide an interface for communicating with the network 125.

[0016] Terminals 120 may include various devices configured to communicate signals with the satellite system 101 via terminal links 122. Terminals 120 may include fixed terminals (e.g., ground-based stationary terminals), mobile terminals mounted on or integrated with mobile platforms (e.g., boats, aircraft, ground-based vehicles, and the like) or portable platforms (e.g., laptops, tablets, handsets, and the like). A terminal 120 may communicate data and information with an access node 140 via the satellite system 101. The data and information may be communicated with a destination device such as a network device 130, or some other device or distributed server associated with a network 125.

[0017] Terminals 120 may include an antenna assembly 124 which may also include various hardware for mounting an antenna. An antenna assembly 124 may also include circuits and / or processors for converting (e.g., performing frequency conversion, modulating / demodulating, multiplexing / demultiplexing, filtering, forwarding, etc.) between radio frequency (RF) satellite communication signals, and satellite terminal communications signals transmitted between the antenna and a satellite terminal receiver. For mobile terminals, the antenna assembly may be mounted on the outside of the mobile or portable platform (e.g., outside of the fuselage of an aircraft), and may protrude from the mobile or portable platform, or may be integrated into a housing of the mobile or portable platform. TheAttorney Docket No. VS2642-WO-1 (78120.0746)terminal 120 may include a transceiver, which may be mounted on the inside or outside of a mobile or portable platform and may include circuits and / or processors for performing various RF signal operations (e.g., receiving, performing frequency conversion, modulating / demodulating, multiplexing / demultiplexing, etc.).

[0018] The satellite system 101 may include a single satellite 105, or a network of satellites 105 that are deployed in space orbits (e.g., low earth orbit (LEO), medium earth orbit (MEO), geosynchronous orbit, geostationary orbit (GEO), etc.). Satellites 105 may include an antenna assembly 104 that may be equipped with one or multiple antennas (e.g., one or more antenna arrays). In some examples, the one or more satellites 105 equipped with multiple antennas may each include one or more antenna panels that include an array of evenly distributed antennas (which may also be referred to as antenna elements). The ground system 135 may also contain access nodes 140 with multiple antenna array elements.

[0019] The satellite system 101 may use the one or more satellites 105 to support beamforming techniques within the coverage area 155 of the satellite system to increase a utilization of resources used for communications. Beamforming, including using multipleinput multiple-output (MIMO) techniques, may be used to exploit multipath signal propagation and increase spectral efficiency by transmitting or receiving multiple signals via different spatial layers over the same frequency resources. The multiple signals may, for example, be transmitted by a transmitting device (e.g., satellite 105, terminal 120) via a set of antennas in accordance with a set of weighting coefficients. Likewise, the multiple signals may be received by a receiving device (e.g., satellite 105, terminal 120) via a set of antennas in accordance with a set of weighting coefficients. Each of the multiple signals may be associated with a separate spatial stream and may carry bits associated with the same data stream (e.g., the same codeword) or different data streams (e.g., different codewords).

[0020] In some examples, some or all of the antenna elements on the satellite and / or the ground system may be arranged as an array of constituent receive and / or transmit feed elements that cooperate to enable various examples of on-board beamforming (OBBF), ground-based beamforming (GBBF), end-to-end beamforming, or other types of beamforming. In the GBBF implementation, there may be multiple transmit or receive antennas on the ground system access node(s).

[0021] To determine weighting coefficients to apply to the set of antennas such that N spatial layers are formed, an (M x N) MIMO matrix may be formed, where M may representAttorney Docket No. VS2642-WO-1 (78120.0746)the quantity of antennas of the set of antennas. In some examples, M may be equal to N. The MEMO matrix may be determined based on a channel matrix and used to isolate the different spatial layers of the channel. In some examples, the weighting coefficients are selected to emphasize signals transmitted using the different spatial layers while reducing interference of signals transmitted in the other spatial layers. Accordingly, processing signals received at each antenna of the set of antennas (e.g., a signal received at the set of antennas) using the MEMO matrix may result in multiple signals being output, where each of the multiple signals may correspond to one of the spatial layers. In some examples, the weighting coefficients used for MEMO communications may be referred to as beam coefficients or beamforming coefficients, and the multiple spatial layers may be referred to as beams or spot beams.

[0022] The elements of the MIMO matrix used to form the spatial layers of the channel may be determined based on channel sounding probes communicated between a satellite system 101 and one or more devices. Channel sounding probes include reference signals transmitted periodically between a satellite system and a device (e.g., a terminal 120) coupled with the satellite system 101. For example, a channel sounding probe may be periodically transmitted from a terminal 120 to the satellite system 101, or from the satellite system 101 to a terminal 120, or both, and may include a sequence that is known to the transmitter and receiver (e.g., based on a terminal identifier or other parameters known to the transmitter and receiver). The receiving device (e.g., the terminal or the satellite system) may use the received channel sounding probe to evaluate the connection by correlating a received channel sounding probe to the expected signal for the channel sounding probe (e.g., to determine a signal strength, an interference, etc.) and make decisions based thereon. Due to the periodicity of the signal, the receiving device may know when the signal should be received.

[0023] Beamforming techniques may be used to shape or steer a communication beam 150 along a spatial path between a satellite system 101 and a location within the coverage area 155. A communication beam 150 may be formed by determining weighting coefficients for antenna elements of an antenna array that result in the signals transmitted from or received at the antenna elements being combined such that signals propagating in a particular orientation with respect to an antenna array experience constructive interference while others experience destructive interference. Thus, beamforming may be used to transmit signals having energy that is focused in a direction of a communication beam 150 and to receive signals that arrive in a direction of the communication beam 150 with increased signal power (relative to the absence of beamforming). The weighting coefficients may be used to applyAttorney Docket No. VS2642-WO-1 (78120.0746)amplitude offsets, phase offsets, true time delay (TTD), or combinations thereof to signals carried via the antennas. The beamforming may account for various signal propagation effects of atmospheric conditions 156 such as clouds, rain, or snow, and objects 158 such as trees, buildings, or vehicles.

[0024] In some examples, the weighting coefficients applied to the antennas may be used to form multiple communication beams 150, each associated with a different direction, where the multiple communication beams 150 may be used to communicate multiple signals having the same frequency at the same time to different user terminals. This may be referred to as multi-beam processing, and may support multiuser MIMO. The weighting coefficients used for beamforming may be referred to as beam coefficients, and the multiple signals may be referred to as beam signals. The resulting communication beams 150 may be referred to herein as beamformed spot beams, spot beams, or beams.

[0025] The amplitude and phase of each weighting coefficient may be calculated given the antenna array and reflector geometry, antenna location, and the desired beam locations. However, due to inaccuracies (e.g., in the satellite location, array orientation, geometry, atmospheric conditions 156, object 158, etc.), such an approach may not be practical. Instead, the weighting coefficients may be calculated by continuously measuring the MIMO propagation channel characteristics (e.g., pairwise channels from each system antenna element to each terminal antenna element) and adjusting the weighting coefficients based on the changing channel characteristics. The measured MIMO channel characteristics may include pairwise gain and phase response and noise level and may be referred to as MIMO channel state information (CSI). Once the MIMO CSI is available, the weighting coefficients may be derived by solving a set of equations or applying a set of adaptation formulas. Various beamformer calculation and adaptation techniques may be used, including minimum mean square (MMSE) beamformer, zero forcing beamformer, singular value decomposition (SVD), MIMO sphere decoder, and others.

[0026] The beamformed communication beams 150 may be associated with a set of resources of the satellite system 101. The set of resources may include frequency resources, time resources, and polarization resources. Beamformed communication beams 150 may overlap spatially without interfering if they are associated with different resources. For example, a given frequency range for the satellite system 101 may be divided into frequency resources or channels, and a given amount of time may be divided into different recurring time slots, where a frequency resource may be used to carry a beam signal (e.g., a modulatedAttorney Docket No. VS2642-WO-1 (78120.0746)signal carried in a beamformed spot beam) on one of the recurring time slots. Each frequency channel may carry a single modulated signal, while in other cases each frequency channel may be further divided to carry multiple modulated signals which may be multiplexed in time (e.g., time division multiple access (TDMA)) or frequency (frequency division multiple access (FDMA)). Information (e.g., data, control information) may be modulated onto the modulated signals using a variety of single-carrier or multi-carrier modulation techniques (e.g., Orthogonal Frequency Division Multiplexing (OFDM), Direct Sequence Spread Spectrum (DSSS), linearly pre-coded OFDM (LP-OFDM)).

[0027] In addition to being multiplexed in time or frequency, different polarizations may be used to define the resources for assignment to beams. For example, a set of resources may include a first sub-set of resources associated with a first polarization and a second sub-set of resources associated with a second, orthogonal, polarization. The first and second polarizations may be any orthogonal polarizations, and may be linearly polarized or circularly polarized (e.g., a right-hand circular polarization (RHCP), a left-hand circular polarization (LHCP)).

[0028] In some examples, a phased array antenna may be an antenna system composed of multiple antenna elements that may collectively manipulate a phase of one or more transmitted or received signals to steer a beam of radio waves without physically moving the antenna. Achieving effective beam steering may rely on precise control over the phase and amplitude of signals delivered to each individual antenna element, which may in turn rely on complex and tightly calibrated electronics and manufacturing processes. However, this level of control may result in phased array antennas that may be highly integrated assemblies, which may make individual component rework difficult, potentially resulting in fallout that increases the overall cost of manufacturing. Additionally, or alternatively, analyzing the design of a phased array antenna may involve trading out parts early in the design cycle, meaning that issues identified later in the manufacturing process may result in significant non-recurring costs for any design updates or modifications. In some cases, because the electronics and radiating elements of a phased array antenna may be tightly coupled in their design, changes to the operating frequency, array size, or array geometry may involve substantial redesign effort, which may limit the flexibility of the overall system architecture and increase both development time and cost.

[0029] The techniques described herein support methods, systems, and devices for package scalable phased array antennas. In some cases, an antenna element module may formAttorney Docket No. VS2642-WO-1 (78120.0746)part of a phased array antenna, where the radiating antenna element may be part of the same package as the radio frequency RFIC that controls adjustment of an RF component signal communicated via the antenna element. In some examples, an antenna element module may include a lead frame having a base and sidewalls that form a cavity, where the sidewalls may include one or more signal paths for routing one or more of an RF signal, a ground path, a DC signal (e.g., power), or a control signal between a bottom of the base and a top of the sidewalls. A planar lid may be coupled with the top of the sidewalls of the lead frame and may include a radiating antenna element on a top side of the planar lid, one or more ground vias that may contact one or more ground contact pads at the top of the sidewalls, and an RF via that may contact an RF contact pad at the top of a first sidewall of the lead frame.Additionally, or alternatively, the planar lid may further include a ground plane and a coplanar waveguide RF trace that may route an RF signal from the RF via to the radiating antenna element.

[0030] In a first example, an antenna element module may include an RFIC that may be installed within the cavity of the lead frame and may be bonded to the lead frame using bond wires, which may allow any of a variety of RFICs to be installed into the same lead frame without modification to the lead frame itself. In some cases, the RF via of the planar lid may contact the RF contact pad at the top of the first sidewall of the lead frame, and the coplanar waveguide RF trace may route the RF signal from the RF via to the radiating antenna element on the top side of the planar lid.

[0031] In a second example, an antenna element module may include a planar lid including a first bond pad and a second bond pad on an underside of the planar lid, where an RFIC may be bonded directly to the first bond pad and the second bond pad where the planar lid contacts solder bumps on the RFIC. In some examples, a first RF via of the planar lid may connect the radiating antenna element on the top side of the planar lid to the first bond pad on the underside of the planar lid, and a coplanar waveguide RF trace of the planar lid may connect the RF contact pad at the top of the first sidewall of the lead frame to the second bond pad on the underside of the planar lid. In some cases, the RFIC may include a plurality of IC pads on a perimeter of the RFIC and a first IC pad at a center of the RFIC, where the first IC pad may be bonded to the first bond pad of the planar lid to deliver an RF signal from the RFIC to the radiating antenna element through the first RF via.

[0032] In some cases, each antenna element module may be a surface mount package. An array of antenna element modules may be soldered to a PWB and the phased array antennaAttorney Docket No. VS2642-WO-1 (78120.0746)may be reconfigured by modifying the PWB rather than redesigning the antenna element modules themselves. Additionally, or alternatively, because each antenna element module may be individually surface mounted, individual modules that may be non-functioning may be reworked or replaced without replacing the entire array. In some examples, the spacing and arrangement of the antenna element modules on the PWB may be selected based on a desired operating frequency of the phased array antenna, which may allow the same antenna element module building block to support a variety of phased array configurations.

[0033] Additionally, or alternatively, the coplanar waveguide RF trace may connect the RF contact pad at the top of the first sidewall of the lead frame to a second bond pad on the underside of the planar lid, which may allow the RF signal path to be routed from the lead frame to the RFIC and then from the RFIC to the radiating antenna element without the use of bond wires.

[0034] FIG. 2A shows an example of a sideview of a portion of a phased array antenna 200 that supports package scalable phased array antennas in accordance with aspects of the present disclosure. The phased array antenna 200 may include one or more antenna element modules 205, which may be examples of the antenna element modules 300 and 400 in reference to FIGs. 3 and 4. Each antenna element module 205 may include a package with a planar a lid, where the lid may include a radiating antenna element 206 coupled with the top surface of the lid. Each antenna element module 205 may be coupled with a printed wiring board (e.g., PWB 210), for example, by solder bumps 207.

[0035] The PWB 210 may provide connectivity between the antenna element modules 205 and a beamforming network (e.g., BFN 215), where RF signals may be routed through the PWB 210 connecting each antenna element module 205 to an RF port 208. The BFN 215 may be integrated within or coupled with the PWB 210 and may provide consistent path lengths between RF port 208 and each antenna element module 205 of the phased array antenna. The PWB 210 may also route a digital bus 212, which may provide control signals to the RFIC (e.g., control signals via a serial bus). The PWB 210 may also provide power and ground connections to each antenna element module 205 (not shown).

[0036] Each antenna element module 205 may include a pin out (e.g., quad flat no-leads (QFN)-style pin out), where the connections between each antenna element module 205 and the PWB 210 are made through the solder bumps 207 on the underside of the package base. Since each antenna element module 205 may be an individual self-contained surface mountAttorney Docket No. VS2642-WO-1 (78120.0746)package, adjacent antenna element modules 205 may be placed in close proximity to one another on the PWB 210 while still operating as independent RFICs. For example, QFN packages can generally be mounted as close as 0.25 mm apart, depending on assembly capabilities, and high-density designs may even allow closer spacing if using precise stencil apertures and high-accuracy pick-and-place machines. The spacing between antenna element modules 205 on the PWB 210 may be determined by the desired operating frequency of the phased array antenna 200, where the element spacing may correspond to approximately one-half wavelength of the operating frequency. For example, antenna element modules 205 having a package size of approximately 2 mm may be arranged on the PWB 210 with approximately 1 mm spacing to enable operation at approximately 50 GHz.

[0037] Each antenna element module 205 may be a QFN package with pins (e.g., solder bumps 207) on a perimeter of the QFN package arranged in a square or rectangle. The pins may have a standard pitch of QFN packages such that a standard QFN layout on a PWB may be used (e.g., 0.4 mm or 0.8 mm pitch).

[0038] FIG. 2B shows an example of a top view of a portion of a phased array antenna 201 that supports package scalable phased array antennas in accordance with aspects of the present disclosure. The dashed box 202 indicates that the phased array antenna 200 of FIG. 2 A may be included in the phased array antenna 201. The phased array antenna 201 may include an array of antenna element modules 205 arranged on the PWB 210 in a grid pattern, where each antenna element module 205 may be an individual self-contained surface mount package. Each antenna element module 205 may include a radiating antenna element 206 disposed on the top surface of the lid, where the radiating antenna element 206 of each antenna element module 205 may be independently controlled by the RFIC within its respective package. Since each antenna element module 205 may be an individual surface mount package with a dedicated RFIC, adjacent antenna element modules 205 may be placed in close proximity to one another on the PWB 210 while still operating as independent RFICs. Thus, any non-functioning antenna element module 205 may be individually reworked or replaced without affecting the remaining antenna element modules 205 in the array.

[0039] The antenna element modules 205 may be arranged on the PWB 210 at a spacing determined by the desired operating frequency of the phased array antenna 201, where the element spacing may correspond to approximately one-half wavelength of the operating frequency. For example, antenna element modules 205 having a package size of approximately 2 mm may be arranged on the PWB 210 with approximately 1 mm spacing toAttorney Docket No. VS2642-WO-1 (78120.0746)enable operation at approximately 50 GHz, where the 3 mm center-to-center spacing of the antenna element modules 205 corresponds to approximately one-half wavelength at 50 GHz. The array of antenna element modules 205 may be arranged in a rectangular lattice as shown in FIG. 2B, or alternatively in other configurations such as a triangular lattice, by modifying the routing of the PWB 210. In another example, the spacing between antenna element modules 205 may be increased to approximately 2 mm to enable operation at approximately 37.5 GHz. The phased array antenna 201 may be scaled to any desired size by adding or removing antenna element modules 205 and adjusting the PWB 210 accordingly, and a single or multiple PWBs 210 may be used for the array.

[0040] FIG. 3 shows vertical and horizontal cross-sections of a portion of an example antenna element module 300 that supports package scalable phased array antennas in accordance with aspects of the present disclosure. The antenna element module 300 may include a package having a base 308, sidewalls 309, a lid 311 (e.g., planar lid), and an antenna element 306 (e.g., radiating antenna element), where the package may be a standard package such as a QFN package that is modified to bring an RF output to the edge of the package top. FIG. 3 includes horizontal cross-sections of the package base inside, inside the lid (BB horizontal cross-section), and the top side of the lid. FIG. 3 also include an AA sideview that illustrates a vertical cross-section of the antenna element module 300 taken along section line A-A as seen in the lid horizontal cross-section.

[0041] The antenna element module 300 may be mounted on a PWB 310, for example by solder bumps 307 disposed on the underside of the base 308. A lead frame 312 may include the base 308 with a central paddle 303 to which an RFIC 313 is attached. The RFIC 313 may include a beamformer, a low noise amplifier, or a power amplifier. The RFIC 313 may be seated within a cavity 329 defined by the base 308 and the sidewalls 309. The sidewalls 309 may extend upward from the base 308 and may provide structural support for the lid 311, as well as route signal paths between the base 308 and the lid 311 using one or more leads.

[0042] As shown in the package base inside view, the lead frame 312 may include a ground plane that extends along at least three sides of the package and one or more RF pads. The RFIC 313 may be attached (e.g., glued, bonded) to the central paddle 303 and wire bonded to pads on the outer edge of the lead frame, where the pads provide connections for RF In, RF Out, and DC / digital signals (e.g., via wire bonds). For example, the lead frame 312 may include one or more pads 318 for DC / digital signals (e.g., DC / digital signal pad 318-a, DC / digital signal pad 318-b), an RF In pad 334, and an RF Out pad 337. A control lead of aAttorney Docket No. VS2642-WO-1 (78120.0746)DC / digital connection may connect to a control solder pad or a power supply solder pad. The antenna element module 300 may include an RF In 314, for example, routed from the BFN 215 as discussed in reference to FIG. 2A. The RF In 314 may be routed to the RFIC 313 by a wire bond 315 to RF In pad 334. The resulting RF signal from the RFIC 313 (RF Out 317) may be routed by a wire bond 316 to RF Out pad 337 to RF Out lead 327. The RF Out lead 327 may be routed within a sidewall 309-a to an RF contact 347. Depending on the RFIC type, the RFIC 313 may be bonded to the lead frame 312 using three or more bond wires. For example, the RFIC 313 may be bonded to the lead frame 312 using at least six (6) bond wires corresponding to power, ground, RF In, RF Out, and a control bus (e.g., two-wire serial bus). The lead frame 312 may include ground leads that may connect to one or more ground contacts 330 at the top of the lead frame 312. As illustrated in FIG. 3, the lead frame 312 may have one continuous ground contact 330 at the top of the lead frame 312. However, in some cases the lead frame 312 may have individual leads and ground contacts 330 at the top of the lead frame 312. The central paddle 303 may be used for thermal connectivity between the RFIC 313 and the PWB 310. In some cases, the central paddle 303 may be coupled to the ground leads.

[0043] The RFIC 313 may include circuits for amplifying, mixing, or adjusting phase or timing of RF signals. For example, the RFIC 313 may be a Monolithic Microwave Integrated Circuit (MMIC). The RFIC 313 may include active devices (transistors) and passive components (inductors, capacitors, resistors) on a single semiconductor chip (e.g., silicon (Si), gallium arsenide (GaAs), gallium nitride (GaN), silicon carbide (SiC), or high-resistivity silicon (HR-Si)). Components of RFIC may include amplifiers (e.g., low noise amplifiers (LNAs), power amplifiers (PAs)), mixers, voltage-controlled oscillators (VCOs), filters, and switches for signal processing at high frequencies (e.g., GHz range). In some cases, RFIC 313 may implement phase shifters, amplifiers, or other components for performing beamforming. In some cases, RFIC 313 may implement TTD for beamforming or other analog RF processing.

[0044] It should be understood that both of RF In 314 and RF Out 317 may be bidirectional, such that RF Out 317 may be used to transmit and receive RF signals between the antenna element and the RFIC 313, and RF In 314 may be used to transmit and receive RF signals between the RFIC 313 and one or more circuits or connections on the PWB (e.g., via the BFN).Attorney Docket No. VS2642-WO-1 (78120.0746)

[0045] The RF Out 317 connection may be brought out to the top of the lead frame 312 via the sidewalls 309 of the lead frame 312 to enable connection to the lid 311 via RF Out lead 327. The lid 311 may be coupled with the top of the sidewalls 309 and may be a planar structure that includes a first layer 319-a and a second layer 319-b, where the second layer 319-b may include a ground plane 324. The lid 311 may be bonded to the top of the sidewalls 309 of the lead frame 312 to form a hermetic seal. The first layer 319-a may be a ceramic material or a high-frequency laminate material. The second layer 319-b may be a metal layer.

[0046] The lid 311 may be considered to have a single electrical routing layer, where the second layer 319-b may perform both functions of a ground layer for the antenna element 306 and a redistribution layer for routing RF Out 317 from a via that connects to the antenna element 306 to an edge of the lid 311 (e.g., at RF pad 321). It should be noted that the layer structure of the lid 311 may be formed in three total layers (e.g., the lid 311 may have no more than three layers), including the layer where the antenna element 306 is formed, the first layer 319-a (e.g., dielectric layer), and the second layer 319-b (e.g., metal layer, single electrical routing layer).

[0047] As can be seen the view of the lid (BB horizontal cross-section of the AA sideview vertical cross-section), the lid 311 may include one or more ground pads 320 disposed along the perimeter of the lid 311 that contact the one or more ground contacts 330 at the top of the sidewalls 309 of the lead frame 312 when the lid 311 is placed onto the lead frame 312. The lid 311 may also include an RF pad 321 that contacts the RF contact 347 at the top of the sidewall 309-a. The RF pad 321 may be connected to an RF trace 322, which may be a coplanar waveguide (CPWG) trace routed across the interior of the lid 311 to an RF via 323 located at the center of the lid 311. The ground plane 324 may include at least one opening which the RF trace 322 passes through. The ground plane 324 of the metal layer may provide shielding for the RF trace 322 between the RF pad 321 and the RF via 323. In some cases, the RF trace 322 is within a slot in the ground plane 324. In some cases, the ground plane 324 may otherwise be continuous in the second layer 319-b underneath the antenna element 306.

[0048] The antenna element 306 (e.g., radiating antenna element) may be formed on the top side of the lid 311 (e.g., over first layer 319-a), as can be seen in the top side of lid view and the AA sideview. The antenna element 306 may be coupled with the RF via 323 at the center of the lid 311, such that the RF Out 317 from the RFIC 313 is routed through the package sidewalls 309 (e.g., the sidewall 309-a), through the RF Out lead 327, through the RFAttorney Docket No. VS2642-WO-1 (78120.0746)pad 321, along the RF trace 322, through the RF via 323, and to the antenna element 306 on the top surface of the lid 311.

[0049] In some cases, an IC that interfaces with the antenna element module 300 may be installed into the package by being attached (e.g., glued, bonded) to the central paddle 303 and then bonded (e.g., wire bonded) to the pads on the outer edge of the package. The modified RF output / input may enable the connection to the antenna element 306.

[0050] FIG. 4 shows vertical and horizontal cross-sections of a portion of an example antenna element module 400 that supports package scalable phased array antennas in accordance with aspects of the present disclosure. The antenna element module 400 may include a package having a base 408, sidewalls 409, a lid 411 (e.g., planar lid), and an antenna element 406, where the package may be a standard package such as a QFN package that is modified to enable direct contact between the lid and the die. In comparison to the example antenna element module 300, the antenna element module 400 employs a direct-contact approach in which the lid 411 interfaces directly with the die through one or more RFIC bonds 404, rather than routing the RF signal between the die and the antenna element through the package sidewalls 409 and via wire bonds. FIG. 4 includes horizontal crosssections of the package base inside, inside the lid (BB horizontal cross-section), and the top side of the lid. FIG. 4 also includes an AA sideview that illustrates a vertical cross-section of the antenna element module 400 taken along section line A-A as seen in the lid horizontal cross-section.

[0051] The antenna element module 400 may be mounted on a PWB 410, for example by solder bumps 407 disposed on the underside of the base 408. A lead frame 412 may include the base 408 with a central paddle 403. An RFIC 413 may be attached to the lid 411. The RFIC 413 may be similar to RFIC 313 and may be a MMIC or perform other analog RF processing (e.g., amplification, mixing, phase shifting, TTD). The RFIC 413 may be located within a cavity 429 defined by the base 408 and the sidewalls 409. The sidewalls 409 may extend upward from the base 408 and may provide structural support for the lid 411, as well as route signal paths between the base 408 and the lid 411 using one or more leads. The central paddle 403 may be used for thermal connectivity between the antenna element module 400 and the PWB 410. In some cases, the central paddle 403 may be coupled to ground leads within the base 408.

[0052] As shown in the package base inside view, the lead frame 412 may include a plurality of leads disposed around the perimeter of the package. The leads may includeAttorney Docket No. VS2642-WO-1 (78120.0746)ground leads that connect ground solder bumps 407 to ground contacts 420 arranged along all four sides of the top of base 408, as well as one or more DC / digital leads that connect to DC / digital contacts 418 and a lead for RF In 414 that connects to an RF contact 434. The ground contacts 420 may correspond to the ground pads 422 of the lid 411, such that when the lid 411 is placed onto the package, the ground pads 422 may contact the ground contacts 420 at the top of the sidewalls 409. The antenna element module 400 may include RF In 414 routed through a sidewall 409-a, as well as one or more DC / digital leads on the package perimeter for DC / digital signals that are coupled with DC / digital contacts 418-a and 418-b. A DC / control lead of a DC / digital connection may connect to a control solder bump 407 and / or a power supply solder bump 407. The RFIC 413 in the antenna element module 400 may be oriented with an active side facing up, such that the RF pads on the top surface of the RFIC 413 are accessible for direct contact with the lid 411 through the RFIC bonds 404. It should be understood that both of RF In 414 and RF Out 417 may be bi-directional, such that RF Out 417 may be used to transmit and receive RF signals between the antenna element and the RFIC 413, and RF In 414 may be used to transmit and receive RF signals between the RFIC 413 and one or more circuits or connections on the PWB 410 (e.g., via the BFN).

[0053] The lid 411 may be coupled with the top of the sidewalls 409 and may be a planar structure that includes a first layer 419-a and a second layer 419-b, where the second layer 419-b may include a ground plane 424. The lid 411 may be bonded to the top of the sidewalls 409 of the lead frame 412 to form a hermetic seal. The first layer 419-a may be a ceramic material or a high-frequency laminate material (e.g., dielectric material). Additionally, or alternatively, the second layer 419-b may be a metal routing layer. The sidewalls 409 may be single-layer sidewalls, meaning that they may include a single routing layer within the sidewall 409 (may exclude any additional layers for routing outside of the single routing layer).

[0054] The lid 411 may be considered to have a single electrical routing layer, where the second layer 419-b may perform both functions of a ground layer for the antenna element 406 and a redistribution layer for routing RF In 414, RF Out 417, and the DC / digital signals coming from DC / digital pads 425-a and 425-b. It should be noted that the layer structure of the lid 411 may be formed in three total layers (e.g., the lid 411 may have no more than three layers), including the layer where the antenna element 406 is formed, the first layer 419-a (e.g., dielectric layer), and the second layer 419-b (e.g., metal layer, single electrical routing layer). The RFIC 413 may be bonded (e.g., flip-chip bonded) directly to the second layer 419-Attomey Docket No. VS2642-WO-1 (78120.0746)b. The lid 411 may be planar, meaning that the first layer 419-a and the second layer 419-b form a planar structure, while the antenna element 406 may be planar for the region it covers of the lid 411.

[0055] As can be seen in the lid view (BB horizontal cross-section of the AA sideview vertical cross-section), the lid 411 may include one or more ground pads 422 disposed along the perimeter of the lid 411 that contact the ground contacts 420 at the top of the sidewalls 409 when the lid 411 is placed onto the package. The lid 411 may include a ground plane 424 in the second layer 419-b that extends across the interior of the lid 411. The lid 411 may be coupled with one or more RFIC bonds 404 that may make direct contact with ground pads, RF pads, and / or DC / digital pads on the top surface of the RFIC 413.

[0056] The ground plane 424 may include a plurality of cutouts 423 to route the DC / digital and RF connections through the lid 411. For example, the RF Out 417 signal from the RFIC 413 may be routed by an RFIC bond 404 to a first bond pad 427, which may be within a cutout 423 -b. The RF Out 417 may then be routed through RF via 437 to the antenna element 406. For RF In 414, an RF pad 444 in the lid perimeter may be routed using RF trace 464 through a cutout 423-a to a second bond pad 454. The second bond pad 454 may be coupled with an RFIC bond 404 to route the RF In 414 signal to the RFIC 413. Thus, the RF In 414 may be routed from the PWB 410 by solder bumps 407, through the RF In 414 lead in the sidewall 409-a, to the RF contact 434 in the sidewall 409-a, to the RF pad 444 in the lid 411, through the RF trace 464 to the second bond pad 454, and through an RFIC bond 404 to the RFIC 413. The DC / digital signals may be similarly routed from the PWB 410 to the lid 411 through one or more sidewalls 409 to DC / digital contacts 418 in lead frame 412 that contact DC / digital pads 425 in the lid 411. The DC / digital pads 425 may be connected to a DC / digital bond pad 455 by an associated trace in a cutout 423. For example, the DC / digital pad 425-a may be coupled with a bond pad 455-a via a trace in a cutout 423-c and the DC / digital pad 425-b may be coupled with a bond pad 455-b via a trace in a cutout 423-d. The DC / digital bond pads 455 may be coupled to IC bond pads of RFIC 413 via RFIC bonds 404. Thus, DC / digital signals may be delivered to and / or from the RFIC 413. Additionally, or alternatively, the ground plane 424 may include one or more cutouts 426 used to create ground bond pads 428 for the RFIC 413 to be bonded to the lid 411. In some cases, the ground bond pads 428 in cutouts 426 may provide similar thermal characteristics as the other bond pads used for RF and DC / digital signals, which may provide more consistent stress across the RFIC 413 and lid 411 due to differences in thermal expansion.Attorney Docket No. VS2642-WO-1 (78120.0746)

[0057] In some examples, the RF signal path for RF Out 417 may be established by direct contact between the lid 411 and the RFIC 413 through an RFIC bond 404, rather than being routed through the package sidewalls 409 as in the example antenna element module 300. The ground plane 424 of the second layer 419-b may provide shielding for the RF signals between a RFIC bond 404 and the RF via 437. The antenna element 406 (e.g., radiating antenna element) may be formed on the top side of the lid 411 (e.g., above first layer 419-a), as can be seen in the top side of lid view and the AA sideview. The antenna element 406 may be coupled with the RF via 437 in the lid 411, such that the RF Out 417 signal from the RFIC 413 may be routed through the direct contact of the RFIC bonds 404, along the RF via 437 and to the antenna element 406 on the top surface of the lid 411. Thus, the RF Out 417 signal (the RF signal between the RFIC 413 and the antenna element 406) may have a short line length, for example including no horizontal routing in the lid 411. Although the RF via 437 to the antenna element 406 is shown in the center of the lid 411 and RFIC 413, it may be located in other locations of lid 411 and RFIC 413, for example where a connection to antenna element 406 is desired to be off-center for polarization or other characteristics. In some examples, the RF Out 417 signal may have a short horizontal routing in lid 411, but direct routing from the RFIC 413 via the lid 411 (e.g., without being routed through the lead frame 412) may reduce the horizontal routing. For example, the horizontal routing may be less than one half of a diameter or side dimension of the antenna element 406.

[0058] In some cases, an IC that interfaces with the antenna element module 400 may be installed into the package by being bonded to the lid 411 (e.g., flip-chip bonded to the bond pads on the lid 411 in the second layer 419-b), enabling the lid 411 to make direct contact with the pads on the top surface of the IC through the RFIC bonds 404. The direct contact between the lid 411 and the RFIC 413 may eliminate the use of wire bonds to route the RF signal to the antenna element 406, which may improve impedance matching for signal paths in the antenna element module 400. Although illustrated in FIG. 4 as having nine (9) bond pads, the RFIC 413 may have any quantity of bond pads for ground, DC (e.g., power), control, and RF signals, depending on the RFIC type. For example, the RFIC 413 may have at least six (6) bond pads corresponding to power, ground, RF In, RF Out, and a control bus (e.g., two-wire serial bus).

[0059] It should be noted that these methods describe examples of implementations, and that the operations and the steps may be rearranged or otherwise modified such that other implementations are possible. In some examples, aspects from two or more of the methodsAttorney Docket No. VS2642-WO-1 (78120.0746)may be combined. For example, aspects of each of the methods may include steps or aspects of the other methods, or other steps or techniques described herein.

[0060] Information and signals described herein may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be referenced throughout the description may be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof.

[0061] The various illustrative blocks and modules described in connection with the disclosure herein may be implemented or performed with a general purpose processor, a DSP, an ASIC, an FPGA, or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general purpose processor may be a microprocessor, but in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices (e.g., a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration).

[0062] The functions described herein may be implemented in hardware, software executed by a processor, firmware, or any combination thereof. If implemented in software executed by a processor, the functions may be stored on or transmitted over as one or more instructions or code on a computer readable medium. Other examples and implementations are within the scope of the disclosure and appended claims. For example, due to the nature of software, functions described herein can be implemented using software executed by a processor, hardware, firmware, hardwiring, or combinations of any of these. Features implementing functions may also be physically located at various positions, including being distributed such that portions of functions are implemented at different physical locations.

[0063] Computer readable media includes both non transitory computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another. A non transitory storage medium may be any available medium that can be accessed by a general purpose or special purpose computer. By way of example, and not limitation, non transitory computer readable media may include RAM, ROM, electrically erasable programmable read-only memory (EEPROM), flash memory, compact disk read-only memory (CDROM) or other optical disk storage, magnetic diskAttorney Docket No. VS2642-WO-1 (78120.0746)storage or other magnetic storage devices, or any other non transitory medium that can be used to carry or store desired program code means in the form of instructions or data structures and that can be accessed by a general purpose or special purpose computer, or a general purpose or special purpose processor. Also, any connection is properly termed a computer readable medium. For example, if the software is transmitted from a website, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of medium. Disk and disc, as used herein, include CD, laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu ray disc where disks usually reproduce data magnetically, while discs reproduce data optically with lasers. Combinations of the above are also included within the scope of computer readable media.

[0064] As used herein, including in the claims, “or” as used in a list of items (e.g., a list of items prefaced by a phrase such as “at least one of’ or “one or more of’) indicates an inclusive list such that, for example, a list of at least one of A, B, or C means A or B or C or AB or AC or BC or ABC (i.e., A and B and C). Also, as used herein, the phrase “based on” shall not be construed as a reference to a closed set of conditions. For example, an exemplary step that is described as “based on condition A” may be based on both a condition A and a condition B without departing from the scope of the present disclosure. In other words, as used herein, the phrase “based on” shall be construed in the same manner as the phrase “based at least in part on.”

[0065] In the appended figures, similar components or features may have the same reference label. Further, various components of the same type may be distinguished by following the reference label by a dash and a second label that distinguishes among the similar components. If just the first reference label is used in the specification, the description is applicable to any one of the similar components having the same first reference label irrespective of the second reference label, or other subsequent reference label.

[0066] The description set forth herein, in connection with the appended drawings, describes example configurations and does not represent all the examples that may be implemented or that are within the scope of the claims. The term “exemplary” used herein means “serving as an example, instance, or illustration,” and not “preferred” or “advantageous over other examples.” The detailed description includes specific details for theAttorney Docket No. VS2642-WO-1 (78120.0746)purpose of providing an understanding of the described techniques. These techniques, however, may be practiced without these specific details. In some instances, well known structures and devices are shown in block diagram form in order to avoid obscuring the concepts of the described examples.

[0067] The description herein is provided to enable a person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the scope of the disclosure. Thus, the disclosure is not limited to the examples and designs described herein but is to be accorded the broadest scope consistent with the principles and novel features disclosed herein.Attorney Docket No. VS2642-WO-1 (78120.0746)

Claims

CLAIMSWhat is claimed is:

1. A phased array antenna comprising:an array of antenna element modules (205, 300), each of the array of antenna element modules (205, 300) comprising:a lead frame (312) having a base (308) and sidewalls (309) that form a cavity (329) in the lead frame (312), the lead frame (312) comprising a first lead that connects a radio frequency (RF) solder pad (307) on a bottom of the base (308) with a first bond pad (314) within the cavity (329), a second lead (327) that connects a second bond pad (337) in the cavity with an RF contact (347) at a top of a first sidewall (309-a) of the lead frame (312), and one or more ground leads that connect one or more ground solder pads (307) on the bottom of the base (308) with at least a third bond pad and one or more ground contacts (330) at the top of the sidewalls (309);an RF integrated circuit (RFIC) (313) that is attached within the cavity and is bonded to the first bond pad (314), the second bond pad (317), and the third bond pad using bond wires (315, 316); anda planar lid (311) comprising:a radiating antenna element (306) on a top side of the planar lid (3H);one or more ground pads (320) that contact the one or more ground contacts (330) of the lead frame;an RF pad (321) that contacts the RF contact (347) of the lead frame (312);a ground plane (324) below the radiating antenna element (306); anda coplanar waveguide RF trace (322) that connects the RF pad (321) to the radiating antenna element (306), the coplanar waveguide RF trace (322) within a slot in the ground plane (324).

2. The phased array antenna of claim 1, wherein:the planar lid (311) comprises a single ceramic layer (319-a) and a single metal routing layer (319-b) comprising the ground plane (324), andthe ground plane (324) is positioned below the single ceramic layer (319- a).Attorney Docket No. VS2642-WO-1 (78120.0746)3. The phased array antenna of claim 1 or 2, wherein the coplanar waveguide RF trace (322) is routed from the RF contact (347) at the top of the lead frame first sidewall (309-a) to an RF via (323) connected with the radiating antenna element (306).

4. The phased array antenna of claim 3, wherein the ground plane (324) has at least one opening which the coplanar waveguide RF trace (322) passes through.

5. The phased array antenna of any one of claims 1 through 4, wherein the one or more ground pads (320) are positioned around the perimeter of the planar lid (311) and contact the one or more ground contacts positioned around the perimeter of the sidewalls (309) of the lead frame (312).

6. The phased array antenna of any one of claims 1 through 5, wherein the lead frame (312) comprises a ceramic material or a high-frequency laminate material.

7. The phased array antenna of any one of claims 1 through 6, wherein the lead frame (312) comprises at least three separate signal paths within the sidewalls (309):a first signal path comprising the first lead that connects the RF solder pad (307) on the bottom of the base (308) to the RF contact (347) at the top of the first sidewall (309-a), a second signal path comprising at least one of the one or more ground leads that connects at least one of the one or more ground solder pads (307) to at least one of the one or more ground contacts (330), and a third signal path comprising a control lead that connects a control solder pad (307) on the bottom of the base (308) to a control contact at the top of a sidewall of the lead frame.

8. The phased array antenna of any one of claims 1 through 7, wherein the planar lid (311) is bonded to the top of the sidewalls (309) of the lead frame (312) to form a hermetic seal.

9. The phased array antenna of any one of claims 1 through 8, wherein the RFIC (313) comprises a beamformer, a low noise amplifier, or a power amplifier.Attorney Docket No. VS2642-WO-1 (78120.0746)10. The phased array antenna of any one of claims 1 through 9, wherein the lead frame (312) forms part of a quad flat no-lead (QFN) package.

11. A phased array antenna comprising:an array of antenna element modules (205, 400), each of the array of antenna element modules (205, 400) comprising:a lead frame (412) having a base (408) and sidewalls (408) that form a cavity in the lead frame (412), the lead frame (412) comprising a first lead that connects a radio frequency (RF) solder pad (407) on a bottom of the base (408) with an RF contact (434) at a top of a first sidewall (409-a) of the lead frame and one or more ground leads that connect one or more ground solder pads (407) on the bottom of the base (408) with one or more ground contacts (420) at the top of the sidewalls (409);a planar lid (411) comprising:a radiating antenna element (406) on a top side of the planar lid (4H);an RF via (437) that connects the radiating antenna element (406) to a first bond pad (427) on an underside of the planar lid (411);a ground plane (424) below the radiating antenna element (406), the first bond pad (427) within an opening (423 -b) in the ground plane (424); anda coplanar waveguide RF trace (414-a) that connects the RF contact (434) of the lead frame (412) to a second bond pad (454) on the underside of the planar lid (411); andan RF integrated circuit (RFIC) (413) that is bonded to the first bond pad (427) and the second bond pad (454), the RFIC (413) comprising a plurality of integrated circuit (IC) pads including a first group of the plurality of IC pads that are on a perimeter of the RFIC (413) and a first IC pad that is located proximate to a center of the RFIC (413) and that is bonded to the first bond pad (427) of the planar lid (411).

12. The phased array antenna of claim 11, wherein the RFIC (413) is bonded to the first bond pad (427) and the second bond pad (454) using solder bumps (404) on a first surface of the RFIC (413), the first surface of the RFIC (413) facing the underside of the planar lid (411).

13. The phased array antenna of claim 11 or 12, wherein:Attorney Docket No. VS2642-WO-1 (78120.0746)the planar lid (411) comprises a single ceramic layer (419-a) and a single metal routing layer (419-b) comprising the ground plane (424), andthe ground plane (424) is positioned below the single ceramic layer (419-a).

14. The phased array antenna of any one of claims 11 through 13, wherein the coplanar waveguide RF trace (464) is routed from the RF contact (434) at the top of the lead frame first sidewall to an RF pad (444) in the planar lid (411).

15. The phased array antenna of claim 14, wherein the ground plane (424) has at least one opening (423 -a) which the coplanar waveguide RF trace (464) passes through.

16. The phased array antenna of any one of claims 11 through 15, wherein:the one or more ground contacts (420) are positioned around a perimeter of the top of the sidewalls (409) of the lead frame (412), andthe planar lid (411) comprises one or more ground pads (422) on a perimeter of the planar lid (411) that contact the one or more ground contacts (420).

17. The phased array antenna of any one of claims 11 through 16, wherein the lead frame (412) comprises a ceramic material or a high-frequency laminate material.

18. The phased array antenna of any one of claims 11 through 17, wherein the lead frame (412) comprises at least three separate signal paths within the sidewalls (409):a first signal path comprising the first lead that connects the RF solder pad (407) on the bottom of the base to the RF contact (434) at the top of the first sidewall (409-a), a second signal path comprising at least one of the one or more ground leads that connects at least one of the one or more ground solder pads (407) to at least one of the one or more ground contacts (420), and a third signal path comprising a control lead that connects a control solder pad (407) on the bottom of the base (408) to a control contact (418) at the top of a sidewall (409) of the lead frame (412).Attorney Docket No. VS2642-WO-1 (78120.0746)19. The phased array antenna of any one of claims 11 through 18, wherein the planar lid (411) is bonded to the top of the sidewalls (409) of the lead frame (412) to form a hermetic seal.

20. The phased array antenna of any one of claims 11 through 19, wherein the RFIC (413) comprises a beamformer, a low noise amplifier, or a power amplifier.

21. The phased array antenna of any one of claims 11 through 20, wherein the lead frame (412) forms part of a quad flat no-lead (QFN) package.Attorney Docket No. VS2642-WO-1 (78120.0746)

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