A feedback system for a cryogenic container assembly

Abstract

A feedback system for a cryogenic container assembly, the feedback system including one or more interior surface temperature elements locatable on or near an interior surface of an inner vessel of the cryogenic container assembly, where the interior surface temperature elements generate electrical output signals proportional to a surface temperature measurement of the interior surface temperature elements. This feedback system allows for intercommunication with the liquid and vapor phases for the controlled keeping and conditioning of the cryogenic liquid in the container. The sensing of the feedback system can cover from inside to outside, the contents of the container, the container itself (the cold mass), the thermal insulation system, connecting piping, and structural supports. By using the feedback system and quantifying the rate of heat ingress, absorption of heat into a cryogenic container allows for calculating the net cold power being applied to the cryogenic container contents.

Description

A FEEDBACK SYSTEM FOR A CRYOGENIC CONTAINER ASSEMBLY CROSS-REFERENCE TO RELATED APPLICATION

[0001] This application claims the benefit of U.S. Provisional Application Serial No. 63 / 779,763, filed on March 28, 2025, entitled “FEEDBACK SYSTEM FOR A CRYOGENIC CONTAINER ASSEMBLY’’, which is commonly assigned with this application and incorporated herein by reference in its entirety.TECHNICAL FIELD

[0002] This application is directed, in general, to systems for monitoring and controlling the refrigeration (R) and the keeping (K) of cryogenic fluids in a cryogenic container assembly.BACKGROUND

[0003] There is an industry-wide need to monitor and control of the keeping, conveyance, thermalization, and refrigeration management of cryogenic fluids kept in a cryogenic container Such management decisions, however, are often based on limited information about physical parameters associated with the cryogenic container and its fluid system contents (termed cryogenic fluid herein). For instance, often, a management decision to refill or not refill the container is based on timing, e.g., to refill at regular time periods, which in turn, assumes a constant evaporation rate of the cryogenic fluids. Filling can involve over-filling the container until cryogenic fluid spills out of the container, at which time, the timing for the next refill is restarted. However, a refill time deadline can be missed, e.g., because of an unaccounted for increased evaporation rate, or because there is an irregular refill rate, e.g., because a human operator accelerated the refill operation before the refill deadline or missed the deadline. In extreme instances, the liquid phase of the cryogenic fluid in the container can go to zero, at which point, a costly and slow process has to be conducted to cooldown the container before the container can keep the cryogenic fluids again. Likewise, the conveyance (or “dispensing”) of liquid to any end-use application, and the receiving of vented vapors from the same operation, means that a connected refrigeration or heating process system must, or at least should, respond to the operational needs as determined by the feedback system of the container.SUMMARY

[0004] The disclosure provides a feedback system for a cryogenic container assembly. In one example the feedback system includes one or more interior surface temperature elements locatable on or near an interior surface of an inner vessel of the cryogenic container assembly, wherein each of the one or more interior surface temperature elements generate an electrical output signals proportional to a corresponding surface temperature measurement.

[0005] The disclosure also provides a smart tank system. In one example the smart tank system includes: (1) at least one cryogenic container having a heat lift assembly and a cryogenic fluid, (2) a cold mass process flow loop connecting between the heat lift assembly and a process system of refrigeration or heating, and afeedback system having at least one computing device and one or more instrumentations associated with the at least one cryogenic container or the cold mass process flow loop, wherein the at least one computing device is configured to monitor and meter operations of the smart tank system using data received from the one or more instrumentations.DESCRIPTION OF THE DRAWINGS

[0006] Embodiments of the disclosure are best understood from the following detailed description, when read with the accompanying FIGURES. Various features may not be drawn to scale and may be arbitrarily increased or reduced in size for clarity of discussion. Reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:

[0007] FIG. 1 presents a block diagram of an example feedback system employed in a cryogenic container assembly;

[0008] FIG. 2 presents a side view of example sensory element locations of the system of FIG. 1 in the context of an example vertically oriented cryogenic container assembly embodiment;

[0009] FIG. 3A presents a side view of example sensory element locations of the system of FIG. 1 in the context of an example horizontally oriented cryogenic container assembly embodiment;

[0010] FIG. 3B presents hypothetical time course temperature signatures from temperature elements located on the interior surface of an inner vessel of a container assembly embodiment at different stages of operation;

[0011] FIG. 4A shows a detailed elevated view of the example cryogenic container assembly embodiment shown in FIG. 2, and illustrates an example wiring module and wire segments of the wiring module;

[0012] FIG. 4B shows a top view of an example anchor post assembly embodiment for attaching a temperature element and wiring extension module to the interior surface of an inner vessel;

[0013] FIG. 4C shows a cross-sectional side view of the anchor post assembly of FIG. 4B along view line 4C-4C in FIG. 4B;

[0014] FIG. 4D shows a side view of an example lead wire clip assembly embodiment for a packaging wires extension module;

[0015] FIG. 4E shows a side view of the wire clip assembly shown in FIG. 4D at an early stage of assembly;

[0016] FIG. 4F shows a side view of the wire clip assembly shown in FIG. 4D at a late stage of assembly;

[0017] FIG. 4G shows a top view of an example embodiment of a feedthrough flange assembly for routing wiring extension modules from an annular space through an outer vessel of a container assembly;

[0018] FIG. 4H shows a cross-sectional side view of the feedthrough flange assembly embodiment along view line 4H — 4H in FIG. 4G;

[0019] FIG. 5A shows a detailed elevated view of an example container assembly embodiment analogous to that shown in FIG. 3A, and illustrates an example wiring module and wire segments of the wiring module;

[0020] FIG. 5B shows a detailed side view of an example container assembly embodiment, analogous to that shown in FIG. 5A, and illustrates example wiring modules for temperature elements and HLA structural supports located in the cryogenic fluid inside an inner vessel;

[0021] FIG. 5C shows a side view of an example container assembly embodiment, analogous to that shown in FIG. 2, and illustrates example wiring modules for temperature elements and structural supports located in a cryogenic fluid inside an inner vessel;

[0022] FIG. 5D shows a detailed view of portions of structural supports and wiring module as shown in FIG.5C;

[0023] FIG. 5E shows a detailed side view of an inner vessel of the example container assembly shown in FIG. 5A, illustrating an example a transition pipe for transferring process fluid to and from a HLA of a cryogenic container assembly;

[0024] FIGs 6A-6D present sketches of example embodiments of the wire segments of a wiring module, connected to a sensor mounting assembly and connectors of the wiring module;

[0025] FIG. 7A presents a top view of an example sensor mounting assembly of a cryogenic container assembly;

[0026] FIG. 7B shows a cross-sectional side view of the sensor mounting assembly through view line 7B as shown in FIG. 7A;

[0027] FIG. 7C shows a cross-sectional side view of the sensor mounting assembly through view line 7C in FIG. 7A;

[0028] FIG. 8 presents a block diagram of operations conducted by a processor and I / O module of a monitoring module, wherein the processor is programed to perform computational operations on sensor data files obtained from output signals to generate liquid level, heat ingress and supply fluid data files;

[0029] FIG. 9 presents a block diagram of operations conducted by a processor and I / O module of the control module, wherein the processor is programed to perform computational operations on physical parameter data files obtained from the monitoring module of FIG. 8 to generate feedback parameter files;

[0030] FIGs. 10A, 10B and 10C present example graphical user interface displays of physical parameter data and feedback parameter data associated with the cryogenic container assembly;

[0031] FIGs. 10D present an example tabular graphical user interface display of the physical parameter data and the feedback parameter data associated with the cryogenic container assembly;

[0032] FIGs. 11 A, 11B, and 11C present sketches of the calculation of total mass balance parameters, total heat balance, total systems operations, respectively, and, further include example plots of selected ones of such parameters;

[0033] FIG. 12 presents an example lookup graphic table for different heights of liquid phase levels for 9 kgal vertically oriented container assembly keeping (K) a cryogenic fluid of LH2 therein; and

[0034] FIG. 13 presents example lookup graphic tables of thermophysical properties cryogenic fluid liquid and gas (vapor) phase, of hydrogen at saturation conditions.DETAILED DESCRIPTION

[0035] The present disclosure describes a feedback system to provide feedback information for monitoring and controlling a cryogenic container assembly and its cryogenic fluid contents.

[0036] The disclosure recognizes that present reasons for having limited information about the physical parameters associated with cryogenic containers can be based on the assumption that typical high-sensitivity temperature sensors are inadequate for obtaining suitably accurate temperature information at the low cryogenic temperatures associated with cryogenic containers (e.g., containers that keep cryogenic fluids at temperatures below 120 K, below 70 K, below 50 K, and as low as 15 K), and, that some such sensors are cost-prohibitive, fragile and can require complex electronic and special calibrated current sources which have not been developed for use at such low cryogenic temperatures.

[0037] Another important realization made as part of this disclosure is that, even though some of these typical temperature sensors may not provide precision information at such low cryogenic temperatures, these temperature sensors can still be used as temperature elements to gather important information about relative changes in temperature, e.g., to at least differentiate between changing levels of liquid phase and gas phase states of a cryogenic fluid in a cryogenic container. That is, a need for consistency in monitoring information, rather than absolute accuracy, can be used to measure and react to physical parameter changing trends of a cryogenic container, such as changing liquid phase cryogenic fluid levels. The accuracy of some of the sensor locations (e.g., locations at the upper portion of cryogenic containers) can be important for accuracy and utilization in thermal performance calculations. However, as further disclosed herein, these temperature ranges at such locations can be above 50 K, or even above 100 K, where sensor accuracy and precision is not problematic.

[0038] As further disclosed herein, such information, in turn, can be used to gather insights into levels of liquid and gas phases of the cryogenic fluid as part of characterizing the keeping (K), conveyance (C), thermalization, and refrigeration management of the cryogenic fluids. The insights and the analytical information gained from the sensors form the basis for multifunctional use including a wide range of process fluid flow operations, controls, monitoring, diagnostics, and control signaling to connected process refrigeration and heating systems. Moreover, as also disclosed herein, embodiments of these temperature elements can be or include relatively low-cost sensors (e.g., thermocouples) which, in turn, facilitates the useof a plurality of such temperature elements to, e.g., provide detailed mapping of the temperature environment of a cryogenic container.

[0039] Still another realization as part of the present disclosure is the importance and value of quantifying the rate of heat ingress into a cryogenic container. Heat ingress rate, commonly referred to as the boil-off rate (BOR), for a given cryogenic container design with a specific thermal insulation (TIS), can vary with the vacuum level of the TIS, the liquid level of the cryogenic fluid, the environment, the operating pressure of the cryogenic container, and other parameters as further disclosed herein. Determining and monitoring the BOR for a specific cryogenic container enables the calculation of the net cold power being supplied to a connected refrigeration or heating process system that is providing refrigeration to the cryogenic fluid system inside the cryogenic container, such as via a heat lift assembly (HLA). The parameters associated with the process flow system and its net cold power for heat lifting, including flow rate, direction, temperature, and pressure, can then be advantageously verified and optimized to allow most energy efficient and time effective operations. The cryogenic container must also be filled (or loaded) from, for example, another cryogenic container assembly or tanker trailer system or conversely unloaded to the same. The keeping (K) of the cryogenic fluid for standby, or for conditioning until it is to be conveyed out of the cryogenic container to any end-use application, means that the connected refrigeration or heating process system should respond to the physical demands of the cryogenic container system. For example, using one or more of the disclosed instrumentations, the keeping can include modulating refrigeration of a refrigeration or heating process system connected to the HLA. As such, the keeping of the cryogenic fluid in a liquid phase can be maintained indefinitely.

[0040] Yet another realization is that a heat ingress rate into a cryogenic container (or the BOR) can be calculated via the disclosed cryogenic container assembly and feedback system design. For example, via the feedback system the BOR for the cryogenic container assembly can be calculated and thereby the net cold power coming into the cryogenic container can be calculated. The net cold power margins can be relatively small for some cryogenic container assemblies, e.g., in the case of liquid hydrogen, it can take 100 W or more of electrical input power at 300 K (ambient temperature) to create 1 W of equivalent cold power at 20 K (liquid hydrogen temperature) at the outlet of a refrigeration process system. The refrigerant flow line of the refrigeration or heating process system is connected to the cryogenic container and the HLA located therein. At, for example, every increment of distance and for every step in the components of the refrigerant flow line, the disclosure recognizes that there is heat ingress and thus loss of cold power. With a refrigeration or heating process system running, there is a gross cold power. However, the disclosure further recognizes that the actual or “true” heat ingress rate into the cryogenic container itself should also be considered and calculated. Subtracting the cryogenic container heat ingress rate number plus the heat ingress rate into theflow lines allows calculation of the net cold power being applied to the cryogenic container contents. With sufficient cold power being applied to the cryogenic container contents, the liquid phase cryogenic fluid can be properly preserved and conditioned so that the liquid can be conveyed from the cryogenic container assembly to a receiving container without loss due to vaporization. The disclosed cryogenic container assembly multifunctional system provides for keeping (K) and conveyance (C) of a cryogenic liquid without losses due to vaporization (“boiling”). With sufficient net cold power applied to the cryogenic container assembly contents, an enthalpy margin is created in the cryogenic liquid that allows the cryogenic liquid to absorb heat. As recognized by the disclosure, a cryogenic liquid that can absorb heat will not boil. The normal evaporation rate (NER) is a common term in industry for the daily loss of liquid due to evaporation when the cryogenic container is under steady-state conditions and constantly open to venting to the ambient pressure. The NER in percent per day (percent of full cryogenic container capacity) can be directly related to the static heat ingress rate (joules per second or watts) for a cryogenic container system at approximately three-fourths full.

[0041] The cryogenic container assembly and feedback system is thus multifunctional for total mass balance, total heat balance, and total system operational parameter realization. When connected to a refrigeration or heating process system, the calculation of the true heat ingress rate (through the total heat balance) is typically required to know the net cold power applied by the process system. As disclosed elsewhere herein embodiments of the cryogenic container assembly can include an inner vessel which is an example of an always cold, cryostatically cold mass assembly, or cold mass. The sensing of the feedback system is centered around, from inside to outside, the contents of the cryogenic container, the container itself (the cold mass), the thermal insulation system that may include a vacuum jacketed annular space volume, connecting piping inside the annular space, and structural supports inside the annular space. The operational parameters of the cryogenic container must, or at least should, be monitored, calculated, and analyzed so that the contents of the cryogenic container (i.e., a cryogenic fluid) can be properly dealt with regarding all flows of vapor in / out (such as properly dealing with vapor recondensation) and all flows of liquid in / out to achieve the necessary conveyance of liquid and recovery of vapor operations associated with any of a number of different end-use applications. For example, when on-loading or off-loading cryogenic fluid of a cryogenic container such as transfer or conveyance of liquid hydrogen..

[0042] Also, further disclosed herein are temperature element mounting assemblies, wire management and wire feedthroughs, to facilitate mounting the plurality of such temperature elements in an inner vessel of a cryogenic container assembly to provide a “smart tank system” or “smart” cryogenic container system for monitoring and feedback control of the cryogenic container assembly. The disclosed feedback system can be a low-cost feedback system that can facilitate currently “dumb tanks” to become “smart tank systems” orsimply “smart tanks” in a cryogenic fluid on-demand approach for saving time and product and provides in-situ, real-time responses, monitoring, data analytics, logistical planning estimates, and heating and refrigeration process control.In addition to the above noted temperature elements, additional sensors, detectors, and transducers as part of the feedback system are further disclosed herein, to further provide information about temperature, pressure, and vacuum-level in and around the cryogenic container, and its connecting process fluid lines and vent exit tubing, for further monitoring, diagnostics, and data analytics, to enhance the controlled refrigeration, automation, and optimization of efficient time and / or energy management of the cryogenic container. The various elements, sensors, detectors, and transducers of the feedback system are collectively referred to as instrumentation. For example, the instrumentation can include the temperature and pressure elements, such as one or more interior surface temperature elements, one or more cryogenic fluid temperature elements, one or more ullage pressure transducer elements, one or more container differential transducer elements, one or more exterior container surface temperature elements, or one or more vacuum pressure transducer elements.

[0043] One embodiment of the disclosure is a feedback system for a cryogenic container assembly, such as illustrated in FIGs 1-3 A.

[0044] FIG. 1 presents a block diagram of an example feedback system 100 employed in a cryogenic container assembly 102, and FIGs. 2 and 3A present side views of example sensory element locations of the system 100 in the context of example vertically oriented or horizontally oriented cryogenic container assemblies 102, respectively. With continuing reference to FIGs. 1-3A throughout, embodiments of the system 100 can include one or more interior surface temperature elements (generally 105, 105a...105k) locatable on or near an interior surface 107 of an inner vessel 109 of the cryogenic container assembly 102, wherein each of the temperature elements 105 generate electrical output signals (generally signals 110) proportional to a surface temperature measurement of the temperature elements.

[0045] As illustrated in FIGs. 2 and 3A, the cryogenic container assembly 102 includes an outer vessel 210 and the inner vessel 109. The term interior surface 107 as used herein refers to either an outer surface (e.g., surface 107a) of the inner vessel 109 or an inner surface (e.g., surface 107b) of the inner vessel 109.

[0046] In some such embodiments, the temperature elements 105 can advantageously be placed on or near the outer surface of the inner vessel 109, e.g. to avoid the complication of compromising the integrity and leak-tightness of the inner vessel 109 (e.g., the pressure-containing boundary of the inner vessel 109). In other such embodiments, however, one or more of the temperature elements 105 can be advantageously placed on or near the inner surface of the inner vessel 109 (e.g., with connecting wires penetrating the pressure containing boundary of the inner vessel 109), e.g., so that the temperature elements 105 are surrounded by the liquid or gas phases of a cryogenic fluid 112 kept in the inner vessel109. In still other embodiments, some of the temperature elements 105 can be placed on or near the outer surface 107a of the inner vessel 109 while others of the temperature elements 105 can be placed on or near the inner surface 107b of the inner vessel 109.

[0047] An important realization as part of the present disclosure is that, regardless of whether the interior surface location of the temperature elements 105, i.e., the outer surface 107a of the inner vessel 109 or the inner surface 107b of the inner vessel 109, valuable information can be obtained about the cryogenic fluid's liquid level in the cryogenic container assembly 102 and about other physical parameters, as further disclosed herein.

[0048] If the temperature elements 105 are located on or near the inner surface 107b of the inner vessel 109, then the temperature elements 105 would be surrounded by the gas or liquid phase of the cryogenic fluid 112 in the cryogenic container assembly 102. If the temperature elements 105 are located on or near the outer surface 107a of the inner vessel 109, then the temperature elements 105 would be surrounded by an annular space between the inner vessel 109 and the outer vessel 210 (e.g., FIGs. 2 and 3 annular space 220), but would still be in contact with portions of the inner vessel 109 that, in turn, are in contact with either the gas or liquid phase of the cryogenic fluid, and therefore, the temperature elements 105 can record information about the temperature, or relative temperature of the cryogenic fluid at such local contact locations.

[0049] The term, on or near, as used herein, refers to a location at or within 1 cm of the interior surface of the container, e.g., within 1 cm of the outer surface 107a or the inner surface 107b of the inner vessel 109. Placement of the temperature elements 105 at the outer surfaces 107a advantageously helps ensure the electrical surface temperature output signals 110 from the temperature element 105 are reflective of the local temperature of the cryogenic fluid adjacent to the temperature elements 105 located on the inner surface 107b or the outer surface 107a of the inner vessel 109.

[0050] The term cryogenic container assembly as used herein refers to any container that can keep and, if also connected to a suitable refrigeration or heating process system, manage, control, and modulate the rate of heat lift into or from a cryogenic fluid for extended periods (e.g., days, weeks, months or years). Refrigeration or heating process systems may also provide a rate of heat lift such that the cryogenic liquid is conditioned to a densified state and an enthalpy margin is created within that cryogenic liquid, and thus able to absorb heat before it can begin to evaporate or “boil off’. Embodiments of the cryogenic container assembly, such as cryogenic container assembly 102, can include any vessel, tank, drum, cylinder, reservoir or other receptacle for holding the cryogenic fluid therein, including stationary, transportable, refillable or non-refillable container embodiments, and, such as disclosed, but not limited to, containers disclosed in US provisional applications 63 / 740,402, 63 / 740,418, and Patent Applications PCT / US2025 / 045161 andPCT / US2025 / 045192, which are all incorporated by reference in their entirety herein. Accordingly, as noted above the cryogenic container assembly can include a HLA that facilitates the keeping of cryogenic fluids for extended periods, and the conveyance (transfer) of fluids for offloading and onloading (filling) in mobile applications.

[0051] As illustrated in FIGs. 2-3 A, the cryogenic container assembly 102 includes an outer vessel 210 and the inner vessel 109 separated by the annular space 220. The term outer vessel refers to an outer thermal insulation system shell that can include metallics, polymers, or composites. The term inner vessel refers to an inner pressure vessel that keeps the cryogenic fluid therein as gas (vapor) and liquid phase states of the fluid, e.g., up to a limiting or maximum design fluid system pressure or the Maximum Allowable Working Pressure (MAWP) of the inner vessel.

[0052] Non-limiting examples of cryogenic fluids 112 include cryogenic fluids having liquid normal boiling points equal to or below cryogenic temperatures (e.g., 120 K or less, 70 K or less, or 50 K or less, in some embodiments) include cryogenic fluids such as liquid helium (LHe), liquid hydrogen (LH2), liquid neon (LNe), liquid nitrogen (LN2), liquid argon (LAr), liquid oxygen (LO2), liquid methane (CH4), liquefied natural gas (LNG), natural gas mixtures, or helium and neon mixtures.

[0053] As further illustrated in FIGs. 2 and 3A, the cryogenic container assembly 102 can further include embodiments of a HLA, such as HLA 215. The inner vessel 109 can be sized to hold the HLA 215 therein. A supply line and a return line 240. 242 can be connected to circulate a process fluid through the HLA 215 and supporting structures 245 can be provided to hold the HLA framework.

[0054] The HLA 215 has several advantageous features: a) simple lightweight tubular framework structure with spring-loaded integral design architecture for both stationary and onboard containers for mobility applications feeding a powertrain for propulsion, b) single inlet and outlet with mass flow balanced distribution through a large number of flow tubes within the bulk volume, c) process cooling or process heating providing full heat lift performance, d) reliability, e) manufacturability and transportability, and f) thermo-economic cost effectiveness in application.

[0055] The HLA 215 includes a lightweight tubular framework structure with spring-force installation and flexibility in design architectures inside the inner vessel 109 that is practical for widespread adoption and thermo-economic efficiency to meet the growing industrial needs in energy, transportation, and other applications. The heat lift performance of the HLA 215 can be adjusted as needed for control of cryogenic fluids such that ullage vapor pressures are controlled, venting is controlled (or eliminated), pressurization is controlled for liquid conveyance, loss of evaporated molecules is reduced (or eliminated), liquid density (and energy density) is increased, or enthalpy margin is created for the absorption of heat. The cryogenic container assembly 102 can use any one or more of these features.

[0056] Considering FIG. 2 as an example, the tubular framework can include an upper flow manifold tube loop, a lower flow manifold tube loop, and flow tubes connected to the upper flow manifold tube loop and to the lower flow manifold tube loop. Hollow interior spaces of the upper and lower flow manifold tube loops and the flow tubes can be in fluid communication with each other. A spring force can be present between the upper and lower flow manifold tube loops and the flow tubes. Additionally, a spring force can be present within the upper flow manifold tube loops, within the lower flow manifold tube loops, and within each of the flow tubes.

[0057] The annular space 220 can be empty or filled in full or in part by one or more thermal insulation materials. The annular space 220 can be kept purged with a gas, partially evacuated to a soft, moderate or high vacuum level or can be left vented to atmosphere. For applications benefiting from low practical heat ingress, or high thermal insulating performance, the annular space 220 can include one or more insulation materials and be evacuated to a low pressure or high vacuum level to maintain for the life of the container assembly.

[0058] The outer vessel 210, the annular space 220, and any optional insulation materials, together define a thermal insulation system (TTS). The annular space 220 can be evacuated to some level of reduced pressure, e.g., to help reduce the rate of heat transmission and thus the heat ingress into the cryogenic fluid contained (e.g., as characterized by measuring the BOR). The TIS can provide heat flux values below 10 W / m2for soft vacuum levels, below 1 W / m2for moderate vacuum levels, and near 0.1 W / m2for high vacuum levels.

[0059] The TIS can provide broad area insulating effects for the entire cryogenic container assembly 102 envelope. The total heat ingress rate (or “heat leakage rate”) [Qtotai] into the inner vessel 109 has four components: insulation [QJ; structural supports between the inner vessel 109 and the outer vessel 210 (e.g., “shell” or “foundation”) [Qs]; piping inside the annular space 220 and connecting between the inner vessel 109 and the outer vessel 210 [QP]; and the fabrication and installation degradation effects on the insulation or Insulation Quality Factor (IQF) [QIQF]. Thus, the total heat ingress rate can be expressed as follows: Qtotal= QI+ Qs+ QP+ QIQF[J / s or W]. The Qi is a composite of all modes of heat transmission (radiation, solid conduction, gaseous conduction, and convection, as applicable) coming through the insulation system. The Qsand the Qpare each the heat transmission from the ambient (warm) side to the cold side of the cryogenic container assembly 102 due to solid conduction coming through the respective components connected to the cryogenic container assembly 102. The QIQF can be equal to zero or greater than zero depending on the availability of test data or field experience data.

[0060] The term temperature element 105 as used herein refers to any sensor, probe etc. capable of measuring temperature by detecting a change in a physical property, such as resistance or voltage, which varies with temperature, and convert the detected change into an electrical signal. Non-limiting exampleembodiments of the temperature elements include silicon diode (e.g., 4-wire silicon diodes) or other semiconductor-Based Sensors chip type sensors, Negative Temperature Coefficient (NTC) Thermistors, Resistance Temperature Detectors (RTDs) or thermocouple (TC) sensors. Example platinum RTDs can be two-wire, three-wire, or four-wire types RTDs, depending on the temperature range and accuracy desired. TCs are typically two-wire, but in some embodiments, can include a third wire for independent electrical grounding.

[0061] As illustrated in FIG.l, embodiments of the system 100 can further include a monitoring module 115, a control module 130, or both. The monitoring module 115 and the control module 130 can be integrated in a single computing device or located in multiple computing devices.

[0062] The term monitoring module 115 as used herein refers to any device or apparatus that receives and logs the electrical output signals 110 from the one or more temperature elements 105 as surface temperature data. For instance, embodiments of the monitoring module 115 can be connected to receive the electrical output signals 110 from the one or more temperature elements 105. In some embodiments, as further disclosed herein, the monitoring module 115 can also receive and log electrical output signals 110 from other sensor elements (e.g., FIG. 1, sensor elements 140...165 as further discussed elsewhere herein) that can measure other physical parameters of the inner vessel 109, the cryogenic container assembly 102, or environmental parameters surrounding the cryogenic container assembly 102.

[0063] In some embodiments, the monitoring module 115 can include a computer processor 117 programed to calculate physical parameter data 120 based on the electrical output signals 110, and an input output (I / O) module 118 connected to receive the electrical output signals 110 and transmit the calculated physical parameter data 120.

[0064] One skilled in the pertinent art would be familiar with how the monitoring module’s VO module 115 can include, e.g., analog-to-digital converters to receive and convert the electrical output signals 110 into digital signal data which is transferred to the processor 117 which can include integrated circuits including a central processing unit and memory units that are programmed to calculate physical parameter data 120 from the digitized signal data and then the I / O module 115 can transmit the physical parameter data 120, e.g., to a control module, such as control module 130, for further processing.

[0065] Embodiments of the system 100 can include control module 130 connected to receive the calculated physical parameter data 120 transmitted by a monitoring module 115 and calculate feedback parameter data. The term control module 130, as used herein, refers to any device or apparatus that can receive physical parameter data 120 and further process the physical parameter data 120 to calculate feedback parameter data files (e.g., generally, parameter data files 910 such as disclosed in the context of FIG. 9).

[0066] In some such embodiments, the control module 130 can include a computer processor 124 programed to calculate feedback parameter data 910 based on the physical parameter data 120, and, an input output (I / O) module 126 to receive the physical parameter data 120, transmit to the computer processor 124 and transmit the feedback parameter data 910 to one or more of the monitoring module 115, a refrigeration system of the assembly 102 or a display unit of the assembly 102.

[0067] One skilled in the pertinent art would understand how the computer processor 124 could be programmed to calculate the feedback parameter data 910 for transmission as instructions to control the monitoring module (e.g., to change the calculation of the parameter data e.g., the rate or type of signal data collection), control a refrigeration or heating process system (e.g., to increase or decrease a flow rate as well as modulate the temperature and pressure of a process fluid circulating through the HLA 215 to change the assembly’s heat lift characteristics), or present infographic representations of the physical parameter data or feedback parameter data such as further disclosed in the context of FIGs. 9- 10C.

[0068] In some embodiments, each of the one or more interior surface temperature elements 105 can include or be a TC. The term TC. as used herein, refers to a temperature element that includes two different metal wires joined at one end, which generates an electromotive force (EMF), or thermoelectric voltage proportional to the temperature difference between the joined end (a "hot junction"), and the other end (a "cold junction"), generated due to the Seebeck effect, as familiar to those skilled in the pertinent art. The generated voltage results in electrical output signals 110 from each of the temperature elements 105 to be transmitted to the monitoring module 115.

[0069] The effective use of a TC in the present disclosure is surprising in light of consensus views that TCs are not useful for monitoring cryogenic container temperatures of 50 K or less, or temperature changes in such temperature ranges, because they will not work accurately or at least have not been setup to work for such low temperatures. In the absence of such temperature information, an operator of a cryogenic container can be left to speculate about when to refill the container, e.g.. based on assumptions about heat ingress and BOR, without the benefit of having any actual feedback parameters, in contrast to as disclosed herein.

[0070] Non-limiting example TCs include type E, K, or T TCs, which can be used in cryogenic temperature environments down to 20 K or down to 14 K. Type E TCs can be advantageous as these can have more than twice the signal than K, or T TCs for temperature ranges below 50 K and especially in temperature range for liquid hydrogen (e.g., 14 K to 32 K) because of its larger thermoelectric voltage and Seebeck coefficient. However, type T and K TCs can also be used down to 20 K although more complex electronics and calibrations may be required. TC lead wires and extension wires can be advantageously less expensive, more robust against damage or breakage, and, more easily shielded, as compared to other types of non-thermocouple temperature elements that could also be used (e.g., silicon diode, NTC or RTD temperature elements).

[0071] As noted, the interior surface temperature elements 105 can be strategically located to facilitate temperature mapping of the cryogenic fluid kept inside the cryogenic container assembly 102 (e.g., inner vessel 109) as well as gain information about other parameters to facilitate management of the cryogenic container assembly 102 such as liquid phase cryogenic fluid levels.

[0072] For instance, in some embodiments, at least one of the interior surface temperature elements 105 (e.g., temperature element 105a) can be locatable at or near a lower-most cryogenic fluid liquid level (e.g., level 225) of the interior surface 107 (e.g., surface 107a or 107b) of the inner vessel 109.

[0073] The term at or near a lower-most level of the interior surface, as used herein, means that an outer surface of the temperature element 105a is proximal to the lowermost level of the interior surface 107 that is a distance value of 1 cm or less away from the lower-most cryogenic fluid liquid level (e.g., FIGs. 2-3A, level 225). Placing the temperature element 105a at such a location can advantageously provide feedback indicating the onset of cryogenic fluid liquid warmup e.g., due to evaporation or performing an emptying (e.g., unfilling) operation of the inner vessel 109, and, the cooldown of the cryogenic fluid liquid, e.g., due to filling or refilling operations, to thereby facilitate the keeping and conveyance of the liquid / vapor phase balance. For instance, temperature elements can signal when the first portion of liquid phase cryogenic fluid has accumulated inside the inner vessel 109 during cooldown, filling or refilling, and can also signal when the last portion of liquid has evaporated.

[0074] For instance, in some embodiments, at least one of the interior surface temperature elements 105 (e.g., temperature elements 105b, 105c) can be locatable at or near a lower cryogenic fluid fill level (e.g., level 226) of the interior surface 107 (e.g., surface 107a or 107b) of the inner vessel 109.

[0075] The term at or near a lower cryogenic fluid fill level of the interior surface 107, as used herein, means that an outer surface of an interior surface temperature element (e.g., element 105b, 105c) is proximal to a lower level of the interior surface 107 that is a distance value of 1 cm or less away from the lower cryogenic fluid fill level value which can be in a range from 10 to 30 percent of a total volume of the inner vessel 109 for various embodiments. Thus, a temperature element embodied as a TC can provide a type of point-level sensor for determining cryogenic fluid liquid levels.

[0076] Placing one of the interior surface temperature elements 105 at such a location can advantageously provide feedback indicating when the inner vessel’s refill operation should be commenced, e.g., to help avoid completely depleting liquid cryogenic fluid from the inner vessel 109 and thereby necessitating a time consuming and expensive cooldown operation. This is in contrast to typical present procedures, where an operator of a cryogenic container assumes when a refill operation is needed e.g., based on historical patternsof refill time intervals, which in turn, may assume a constant bulk liquid BOR without actual knowledge of this feedback parameter, in contrast to such as disclosed herein. As such, again the operator is left to speculate about when to refill a cryogenic container. For example, a typical delta-P transducer can be of limited use because its accuracy requires both steady-state pressure and temperature conditions, for consistent liquid density properties, and a non-perturbed fluid system (e.g., a constant liquid / vapor ratio) over periods of hours or days.

[0077] For instance, in some embodiments, at least one of the interior surface temperature elements 105 (e.g., temperature element 105i or 105j) can be locatable at or near an upper cryogenic fluid fill level (e.g., level 227) of the inner vessel 109.

[0078] The term at or near a upper cryogenic fluid fill level, as used herein, means that an outer surface of the interior surface temperature elements 105 (e.g., element 105i or 105j) is proximal to an upper level of the interior surface 107 that is a distance value of 1 cm or less away from the upper cryogenic fluid fill level 227 which can be in a range from 70 to 90 percent of a total volume of the inner vessel for various embodiments.

[0079] Placing one of the interior surface temperature elements 105 at such a location can advantageously provide feedback indicating when the fill or refill operation of the inner vessel 109 should be ceased, e.g., to help avoid spilling liquid cryogenic fluid out of the inner vessel 109 and thereby avoid wasting cryogenic fluid. This is in contrast to typical present procedures where an operator may be left to speculate about when to stop refilling or just refill until cryogenic fluid does overflow out of the inner vessel 109 thereby causing the waste and hazard of cryogenic fluid spillage.

[0080] For instance, in some embodiments, at least one of the interior surface temperature elements 105 (e.g., temperature element 105k) can be locatable at or near a vent line exit tube 222 of the inner vessel 109.

[0081] The term at or near a vent line exit tube 222 as used herein means that the temperature element 105j is proximal to an outer surface of the vent line exit tube 222 by a distance value of 20 cm or less. In some embodiments, the temperature element 105k can be locatable on the interior vessel surface 107 (e.g., surface 107a or 107b) proximal to where the vent line exit tube 222 exits the inner vessel 109 into the annular space 220. In other embodiments, the temperature element 105k can be locatable on the surface of the vent line exit tube 222 or inside the vent line exit tube 222 where the tube exits from the inner vessel 109, e.g., to provide a more accurate measure of the temperature of the gaseous cryogenic fluid venting out of the tube 222.

[0082] Placing one of the interior surface temperature elements at such a location can advantageously provide feedback to assess the total heat (e.g., the enthalpy of the liquid plus vapor) contained within the inner vessel 109 at any given time, and thus the ullage pressurization rate and the liquid evaporation rate(e.g., the BOR). Heat ingress comes into both the liquid phase and the vapor phase of the cryogenic fluid system kept in the inner vessel 109. BOR can be calculated based on the mass flow rate coming out of the vent line exit tube 222. In particular, for some cryogenic fluids, such as, e.g., LN2, LNG, the calculated BOR can be relatively small because there are larger gas-liquid differences in density and other thermophysical properties. However, there can be larger errors in the calculated BOR for some cryogenic fluids (e.g., LH2) if the liquid and vapor phases of the cryogenic fluid are not that far apart in terms of density and other thermophysical properties. To help correct for the error in the calculated BOR, two additional physical parameter data can be collected: 1) the temperature of the ullage gas at the point where it exits the inner vessel 109 (e.g., as measured by the temperature element 105k at or near a vent line exit tube 222) and 2) the liquid level inside the inner vessel 109 (e.g., as measured by temperature elements 105b..105j) and thus providing a liquid / vapor fraction inside the inner vessel 109, to provide the vent gas exit temperature. The BOR can vary based on a combination of the ullage pressure, the temperature distribution of the container, and the liquid level (LL) within the container. These data allow a more accurate corrected calculation of the BOR of cryogenic fluid in the inner vessel, as further disclosed elsewhere herein.

[0083] To further illustrate applications of the system 100 to assess liquid capacity levels in the inner vessel 109, FIG. 3B presents hypothetical example time course temperature signatures similar to what could be obtained from temperature elements 105 located on the interior surface 107 of the inner vessel 109 of the cryogenic container assembly 102, at different stages 310...350 of operation. As illustrated, the time course of the temperature signatures are presented as temperature (T, K) versus time (h, hours) graphs but other temperature or time scales could be used depending on the environment surrounding the inner vessel 109, the volume size of the inner vessel 109 and the type of cryogenic fluid being kept.

[0084] For clarity, only selected ones of temperature elements are depicted: the temperature element 105a at or near a lower-most liquid cryogenic fluid level 225 (e.g., FIGs. 2-3A, substantially 0 to 2 % of liquid cryogenic fluid in the inner vessel); the temperature element 105c at or near a lower liquid cryogenic fluid fill level 226 (e.g., FIGs. 2-3A, substantially 20 ± 2% of liquid cryogenic fluid in the inner vessel); the temperature element 105e at or near a low intermediate liquid cryogenic fluid level (e.g., substantially 40% of liquid cryogenic fluid in the inner vessel); the temperature element 105g at or near a higher intermediate liquid cryogenic fluid level (e.g., substantially 60 ±2 % of liquid cryogenic fluid in the inner vessel); the temperature element 105i at or near a still higher intermediate liquid cryogenic fluid level (e.g., substantially 80 ±2 % of a total liquid volume of the inner vessel); the temperature element 105j at or near an upper liquid cryogenic fluid fill level 227 (e.g., FIGs 2-3A, substantially 100% of liquid cryogenic fluid in the inner vessel); and the temperature element 105k proximal to where the vent line exit tube 222 exits the inner vesselinto the annular space 220 (e.g., FIGs 2-3A, substantially 100% of a total volume of the inner vessel); at or near a vent line exit tube 222 of the inner vessel 109).

[0085] With continuing reference to FIG. 3B, at a pre-fill operational stage 310, all of the temperature elements 105 can be at an ambient temperature (e.g., 293 K in some embodiments). At commencement of a cryogenic fluid filling operational stage 315, all of temperature elements 105 have rapidly decreasing temperature levels. The temperature elements (e.g., elements 105a...105j) surrounded by liquid phase cryogenic fluid, or, adjacent to the portion of the inner vessel surrounded by liquid phase cryogenic fluid, will drop to the liquid temperature of the cryogenic fluid (e.g., 20 K for liquid hydrogen), or bottom out and flat line, if such temperature is below the working range of the temperature element, and send signals 110 corresponding to such a temperature, or bottomed out status, to the monitoring module 115.

[0086] The disclosure recognizes that it does not matter if the temperature elements are accurately measuring the cryogenic fluid’s liquid phase temperature at stage 315. Rather, so long as the signal 110 of the temperature element when surrounded by, or, adjacent to the portion of the inner vessel 109 surrounded by, liquid phase cryogenic fluid (e.g., the minimal voltage EMF signals 317a) is distinguishable from the analogous signal 110 when the temperature element is surrounded by, or, adjacent to the portion of the inner vessel 109 surrounded by, gas phase cryogenic fluid, the temperature elements will provide information about the liquid cryogenic fluid levels in the inner vessel 109 as further illustrated herein to follow.

[0087] The temperature element 105k proximal to where the vent line exit tube 222 typically is not surrounded by, or, adjacent to the portion of the inner vessel 109 surrounded by, liquid phase cryogenic fluid, unless the inner vessel 109 is mistakenly overfilled. Rather temperature element 105k, will be surrounded by, or, adjacent to the portion of the inner vessel 109 surrounded by, gas phase cryogenic fluid, which has a substantially higher temperature inside the inner vessel 109, e.g., due to the heat ingress through the upper half or upper quarter of the inner vessel 109. E.g., for hydrogen cryogenic fluids, the gas phase temperature can be 50 K to 60 K, or higher.

[0088] Consequently, a higher voltage EMF signal 317b will be generated by this temperature element 105k and sent as the signal 110 to the monitoring module 115 equivalent to this temperature. Thus, at the cessation of the filling operational stage 315 (e.g., a time, t, range 320 from 6 to 20 hours for this example) the inner surface temperature elements 105 (e.g., elements 105a...105j) surrounded by, or, adjacent to the portion of the inner vessel 109 surrounded by, liquid phase cryogenic fluid will all have a EMF signals 317a corresponding to that of liquid phase hydrogen (e.g., 20 K or the bottomed out signal) and inner surface temperature element 105k surrounded by, or, adjacent to the portion of the inner vessel 109 surrounded by, gas phase hydrogen will have a higher EMF signals 317b.

[0089] For progressive liquid phase depletion of operational stages 320...350 (e.g., due to use and unfilling of the cryogenic fluid from the inner vessel 109, or, due to cryogenic fluid boil off from the inner vessel during long term storage) the EMF signals will serially increase from one temperature element to the next, to be above the minimal voltage EMF signals 317a at different stages of liquid depletion occur.

[0090] For instance, in some embodiments, at depletion stage 325, as the inner surface temperature element 105j at or near the upper liquid cryogenic fluid fill level is no longer surrounded by, or, adjacent to the portion of the inner vessel 109 surrounded by, liquid phase cryogenic fluid, the EMF signal from the inner surface temperature element 105j will increase above the element’s minimal voltage EMF signal 317a, signaling that the liquid level of cryogenic fluid has dropped below 100%. At depletion stage 330, as the inner surface temperature element 105i at or near the 80% fluid fill level is no longer surrounded by, or, adjacent to the portion of the inner vessel 109 surrounded by, liquid phase cryogenic fluid, the EMF signal from the inner surface temperature element 105i will increase above the element’s minimal voltage EMF signal 317a, signaling that the liquid level of cryogenic fluid has dropped below 80% full. Similarly, at depletion stages 335, 340, 345, as the respective inner surface temperature elements 105g, 105e, and 105c are no longer surrounded by, or, adjacent to the portion of the inner vessel 109 surrounded by, liquid phase cryogenic fluid, the EMF signal from these temperature elements will increase above these element’s respective minimal voltage EMF signals 317a, signaling that the liquid level of cryogenic fluid has dropped below 60%, 40% and 20% full, respectively.

[0091] If refilling is not commenced (e.g., at 20% full) the temperature element 105a at or near a lower-most liquid cryogenic fluid level will no longer be surrounded by, or, adjacent to the portion of the inner vessel surrounded by, liquid phase cryogenic fluid, resulting in an increased EMF signal, signaling a complete liquid depletion stage 350 has been reached in the vessel.

[0092] Similarly, as illustrated, the temperature element 105k proximal to the vent line exit tube 222 will have an increased EMF signal as the liquid cryogenic fluid levels in the inner vessel 109 fall.

[0093] Based on the present disclosure, one skilled in the pertinent art would appreciate how multiple interior surface temperature elements 105 (e.g., one or more of temperature elements 105a...105k) could be employed along a vertical dimension 230 of the inner vessel 109 (e.g., a direction perpendicular to a mounting surface 232), to provide further information about temperature uniformity, and, a fill level of liquid cryogenic fluid in the inner vessel 109.

[0094] For instance, as illustrated in FIGs. 2-3 A, in some such embodiments, the system 100 can include a plurality of such interior surface temperature elements 105 distributed vertically on or near the interior surface 107 of the inner vessel 109 to provide a sensor data signal 110 to create a temperature map such as further disclosed in the context of FIG. 10A.

[0095] As noted, in some embodiments, the inner surface temperature elements 105 can be strategically located on the outer surface 107a of the inner vessel 109 to avoid the complication of comprising the integrity and leak-tightness of the inner vessel 109 (the pressure-containing boundary). In some embodiments, the inner surface temperature elements 105 can be strategically located on the top and bottom of the inner vessel 109 and down the side at locations corresponding to the different percentage full liquid capacity levels of 100%, 90%, 80% (e.g., upper header tube level), 70%, 60%, 50%, 40%, 30%, 20%, 10%, 0% levels (lower header tube level) or other locations as needed for a particular use case or equipment constraints. A more select group of locations could be as follows: Top (uppermost), 100%, 80%, 50%, 20%, and 0% (lowermost). The specific number of inner surface temperature elements 105 used depends on the operational use case of a given cryogenic container assembly 102 and the resolution of liquid level measurements and other analytical details, as desired. In some embodiments, the inner surface temperature elements 105 can be doubled at each of the strategic locations, e.g., to provide redundancy, in case one or more of the inner surface temperature elements 105 fails.

[0096] As further illustrated in FIG. 1, embodiments of the system can further include wiring extension modules (generally, 132). In some such embodiments, the interior surface temperature elements 105 can be connected to the wiring extension modules 132a to connect to the monitoring module 115 to thereby transmit the surface temperature electrical output signals 110a to the monitoring module 115. One of ordinary skill would understand how wires of the wiring extension modules 132a would be insulated with a non-electrically conductive material to prevent interference of the electrical signals 110 passing through the wires.

[0097] In some such embodiments, the wiring extension modules 132 have wire diameter values in a range from 16 to 30 gauge. The gauges and lengths of the lead wires, extension wires, and air-side extension wires are newly discovered result-effective variables that are carefully selected and tailored to meet the three synergetic objectives: a) thermal responsiveness at and near a temperature element tip (e.g., the joined end corresponding to the hot junction), b) low resistance over the entire length of a wiring extension module 132 (e.g., any of wiring extension modules 132a...132g), and c) equal resistances for all of the wiring extension modules 132 going to the monitoring module 115. In some such embodiments, wire gauges of 24 to 30 for a few feet (3-4 feet) from the inner surface temperature elements 105 (e.g., a lead wire) can be advantageous for their thermal responsiveness and ability to be conformed to a curved outer surface 107a of the inner vessel 109 and their ability to be easily clamped down to secure the conformation the outside surface curvature and thereby hug the inner vessel 109. A wire gauge of 20 can be advantageous for further distances from the inner surface temperature elements 105, as facilitated using mini-connectors, to keep the overall electrical resistance low (e.g., below 100 ohms). On the outside (air side) of the cryogenic containerassembly 102, a 24 to 30 gauge wire can be advantageously used for connection to the monitoring module 115. In some embodiments, it can be advantageous for all of the wires connecting the inner surface temperature elements 105 to the monitoring module 115 to have about the same electrical resistance (e.g., below 100 ohms ± 10 %).

[0098] FIG. 4A shows a detailed side view of the example container assembly 102 shown in FIG. 2, and illustrates example wiring extension modules 132 and wire segments (generally 134) of the wiring extension modules 132 on the outer surface 107a of the inner vessel 109. FIG. 5A similarly shows a detailed side view of an example cryogenic container assembly 102 analogous to that shown in FIG. 3A, illustrating an example of the wiring extension modules 132 and the wire segments (generally 134) on the outer surface 107a of the inner vessel 109. For clarity, an example of multiple series-coupled wire segments 134aka...134akd for only one wiring extension module 132ak is illustrated. The wire segments 134aka...134akd facilitate connection of the inner surface temperature elements 105a to 105k to the monitoring module 115.

[0099] With continuing reference to FIGs. 4A and 5 A throughout, and referring to the wiring module 132ak connected to upper-most the interior surface temperature element 105k at or near the exit vent tube 222, example series-coupled wire segments can be connected to one of the interior surface temperature elements (e.g., element 105k) and includes: a first wire segment 134aka having one end 405a connected to receive the signal 110 from one of the interior surface temperature elements, an opposite end 405b connected to a first end 407a of a second wire segment 134akb having an opposite end 407b connected to a first end 410a of a third wire segment 134akc having an opposite end 410b connected to a wire feedthrough assembly 412, and, a fourth wire segment 134akd having one end 415a connected to the feedthrough assembly 412 and an opposite end 415b connected to the monitoring module 115. Although the wire feedthrough assembly 412 is depicted in FIGs. 4A and 5A as being located at the bottom of the container assembly 102, in other embodiments, the wire feedthrough assembly 412 can be located along a side of the cryogenic container assembly 102, e.g., at an axial end 515 of the cryogenic container assembly 102, e.g., to facilitate multilayer insulation wrapping of the outer vessel 210.

[0100] FIG. 4B shows a top view of an anchor post assembly 430 for attaching the temperature element 105 and the wiring extension modules 132 to the interior surface 107 the inner vessel 109. FIG. 4C shows a cross-sectional side view of the assembly 430 along view line 4C-4C in FIG. 4B. The assembly 430 includes a stainless steel (SST) cap 432, plastic spindle bearing 434 (UHM-PE. PTPE. G10), washer 436, spring washer 438, SST nut 440 and, SST threaded stud 442.

[0101] FIG. 4D shows a lead wire clip assembly 450 for packaging or bundling wires extension modules 132, the assembly 450 including a compression sleeve 452, a wire clip 454, and an adhesive 456 (weld orepoxy) for connecting the clip 454 to the outer surface 107a of the inner vessel 109. In some embodiments, the clip 454 can include a slit opening 458 for passing one or more wires there-through.

[0102] FIGs. 4E and 4F show example stages of the assembly lead the wire clip assembly 450. The wire extension modules 132 can be placed in the compression sleeve 452 and fitted into the wire clip 454. The compression sleeve 452 can be inserted into the wire clip 454 with compression to form pinched ends 460 for secure installation. As shown in FIG. 4E at an early assembly stage, the wire extension modules 132 can be placed in the compression sleeve 452 and fitted into the wire clip 454. As shown in FIG. 4H at a later assembly stage the compression sleeve 452 can be inserted into the wire clip 454 with compression to form the pinched ends 460 for secure installation. Finally, the wire clip assembly 450 can be adhered to the inner vessel surface 107a by apply the adhesive 456 between the surface 107 and the wire clip 454.

[0103] FIG. 4G shows a top view of an example embodiment of the feedthrough flange assembly 412 for routing the wiring extension modules 132 from the annular space 220 through the outer vessel 210 of the container assembly 102. FIG. 4H shows a cross-sectional side view of the feedthrough flange assembly 412 along view line 4H — 4H in FIG. 4G. The assembly 412 can include a mating flange 472 welded to the outer vessel 210, a trench 474 holding a plurality wiring feedthrough wells 476 therein, bolt receptacle through holes 478 and knife-edge surface 480 for a copper gasket seal 482. The assembly 412 can include an adhesive 484 (e.g., epoxy potting; skycast 385D or other suitable material for high vacuum low outgassing use) to secure each of the wiring extension modules in a feedthrough cartridge 486 held in the well 474. Each wiring extension module 132 can include wires 488 (e.g., two wires connected to a two-wire TC temperature element 105), wire insulation 490 and wire sheathing 492. Each of the wiring extension modules 132 can be held in one of the wells 476 with the feedthrough cartridge 486 sized to hold the sheathing 492 tightly therein and the cartridge 486 sized to fit tightly in the well 476.

[0104] In some such embodiments, the feedthrough assembly 412, to bring the third wire segment 134akc through the vacuum-jacketed annular space 220, can include a flanged feedthrough assembly (e.g., ConFlat® DN63 size) with connectors on air side and vacuum side of the container assembly 102 (e.g.. 10-pair MIL-SPEC) or other custom feedthrough assembly, e.g., a custom hermetically sealed feedthrough assembly 412.

[0105] In analogous fashion, other temperature elements 105a..105j can be connected to wire modules 132b..132f, and each of these wire modules could include wire segments 134 to facilitate connection of signals 110 to the monitoring module 115.

[0106] FIGs 6A-6D present sketches of example embodiments of the wire segments 134aka...134akd, of the wiring module 132ak connected to a sensor mounting assembly 610 holding the temperature element 105k therein and various optional connectors 615..640 of the wire segments as further disclosed below.

[0107] As shown in FIGs. 6A, the one end 405a of the first wiring segment 134aka can be connected to the interior surface temperature element 105k held in the sensor mounting assembly 610 of the wiring module 132ak, and the opposite end 405b of the first wire segment 134aka can be connected to a first connector 615 of the wiring module 132ak (e.g., a female mini connector, in some embodiments). Each wire segment can include a pair of wires (e.g., made of two different alloys, for each type of TC, e.g., Chromel and Constantan for Type E TCs).

[0108] As show in FIG 6B, the one end 407a of the second wiring segment 134akb can be connected to the opposite end 405b of the first wire segment 134aka by a second connector 617 of the wiring module 132ak that is adapted to couple to the first connector 615 (e.g., a male mini connector, in some embodiments). The opposite end 407b of the second wire segment 134akb can be connected to a third connector 620 of the wiring module 132a (e.g., a male mini connector, in some embodiments). The second wire segment 134akb can be one of a plurality of second wire segments (e.g., connected to other ones of the interior surface temperature elements) that can be bundled together by a first wire harness 625 of the wiring module 132a (e.g., polyester ties, in some embodiments) with other wire segments connected to other temperature elements. For instance, as illustrated, temperature elements 105k, 105j, 105i, 105h, 105g, can be connected through to wire segments 134akb, 134ajb, 134aib, 134ahb, 134agb respectively, and then on to wires segments 134akc..l34agc, respectively, as further disclosed in FIG. 6C. In some such embodiments, the first wire harness 625 can be connected to a first lock-wire 630 of the wiring module 132a and the first lock-wire (e.g., 0.032 in stainless steel lock-wire in some embodiments) cam be connected to outer surface 107a of the inner vessel 109.

[0109] As show in FIG 6B, the one end 410a of the third wiring segment 134akc can be connected to the opposite end 407b of the second wire segment 134akb by fourth connectors 632 of the wiring module 132ak (e.g., female mini connectors, in some embodiments) adapted to couple to the third connector 620 of the second wiring segment 134akb. The opposite end 410b of the third wiring segment 134akc can be connected to a first multi-connector 635 of the wiring module 132a (e.g., a male multi-connector in some embodiments) adapted to connect to a first receptacle of the feedthrough assembly 412 (e.g., receptacle 420a, FIGs 4A and 5).

[0110] As illustrated in FIGs. 4A and 5A, in some embodiments, the third wiring segment 134akc can be located in the annular space 220 between the inner vessel 109 and the outer vessel 210.

[0111] As show in FIG 6D, the one end 415a of the fourth wiring segment 134akd can be connected to a second multi-connector 640 of the wiring module 132ak (e.g., a female multiconnector in some embodiments) adapted to couple to a second receptacle of the feedthrough assembly (e.g., FIGs 4A, 4G, 4H, 5A, feedthrough assembly 412 and receptacle 420b). The opposite end 415b of thefourth wire segment 134akd can be terminated by a fifth connector 645 of the wiring module 132ak, the fifth connector adapted to connect to the monitoring module 115. As illustrated in FIGs. 4A and 5 A, in some embodiments, the fourth wiring segment 134akd can be located external to the outer vessel 210, e.g., on an air-side of the container assembly 102.

[0112] Thus for this limited example, five pairs of wires, two each from 134akb, 134ajb, 134aib, 134ahb, 134agb are shown connected to the first multi-connector 635 which has ten female or male inlet receptacles to accommodate all ten wires, and, on the other side of the feedthrough assembly 412, there would have to be ten female or male outlet receptacles corresponding to the ten wires connecting to the second multiconnector 640, so as to preserve the signal 110 integrity from these five temperature elements to the monitoring module 115.

[0113] Although four series-coupled wire segments 134aka...134akd are presented, any other number of wire segments could be series-coupled as needed to traverse the lengths between the specific locations of the interior surface temperature elements (e.g., any of 105a..,105k) and the feedthrough assembly 412 and on to the monitoring module 115. The specific lengths and gauges of any of the first, second third and fourth wire segments 134 can be adjusted as needed to connect and of the temperature elements 105 to the monitoring module 115 and meet the three synergetic objectives disclosed elsewhere herein.

[0114] Although the wire segments 134aka...134akd are shown for just one of the interior surface temperature elements (e.g., temperature element 105k), other interior surface temperature elements (e.g., elements 105a....l05j) could be similarly connected to the monitoring module 115 using an analogous sets of wiring extension modules 132aa...l32aj with their own respective wire segments (e.g., wire segments, analogous to wire segments 134aka...134akd) as needed to make the connections.

[0115] Embodiments of the connectors 615, 617, 620, 630 and multi-connectors 635, 640 of the first, second third and fourth wire segments 134aka...134akd, can be of male or female designs as needed to provide a continuous electrical path for sending the signals 110 to multi-connector 640. In some embodiments, e.g., the pins can be soldered to milspec connectors. Any of the connectors or multiconnectors can be of the locking type. The two halves of a connector or multi-connectors can also be permanently sealed together using an adhesive (e.g., Stycast 2850FT epoxy or similar epoxy in some embodiments).

[0116] In some such embodiments, the wire modules 132 and their wire segments 134, connected to one or more of the inner surface temperature elements 105, can be bundled together, to reduce clutter and protect the wires 132 during assembly of the cryogenic container assembly 102. As non-limiting examples wire segments 134ajb, 134aib, 134ahb, 134agb connected to the temperature elements 105j, 105i,105h, 105g, respectively, can be bundled with the second wiring segment 134akb via the first wire harness 625, or, with embodiments of the wire clip assembly 450 such as discussed in the context of FIGs 4D-4F.[001171 Alternatively, or additionally, in analogous fashion, any of the wiring extension modules 132, disclosed in the context of FIGs. 1 and 4A-6D, could include one or more wire segments, similar to wire segments 134aka..l34akd, as part of the wiring module (e.g., similar to wiring module 132ak) connected to the other types of measurement elements (e.g., elements 140, 145, 150, 155, 160, 165) as needed to connect to the monitoring module 115.

[0118] In some embodiments the inner surface temperature elements 105 can be mounted directly to the interior surface 107 (e.g., glued), or, in other embodiments, mounted to a sensor mounting assembly 610 that in turn is mounted directly to the interior surface 107 of the inner vessel 109. E.g., in some such embodiments, the sensor mounting assembly 610 can be fastened to the inner vessel’s outer surface 107a, or, to the inner vessel’s inner surface 107b.

[0119] FIG. 7A presents a top view of an example sensor mounting assembly 610 of the system 100. FIG. 7B shows a cross-section side view of the assembly through view line 7B in FIG. 7A. FIG. 7C shows a cross-section side view of the assembly through view line 7C in FIG. 7A.

[0120] Embodiments of the mounting assembly 610 can include: a first metal plate 705 with a first recess 707 and a second metal plate 712 (e.g., stainless steel plates) with a second recess 715, the first and second recesses 707. 715 sized to accommodate portions of the interior surface temperature element 105 therein; thru-slot openings 717a, 717b in the first metal plate 705 and thru-slot openings 720a, 720b in the second metal plate 712, the thru-hole openings 717a, 717b, 720a, 720b sized to accommodate a tip 722a, 722b of first and second threaded studs 725a, 725b there-through; a first nut 730a and a first washer 732a sized to secure the first threaded stud 725a to the first and second metal plates 705, 712; and a second nut 730b and a second washer 732b sized to secure the second threaded stud 725b to the first and second metal plates 705, 712.

[0121] The sensor mounting assembly 610 assembly can advantageously protect the temperature element from being damaged or shifted in position during installation in the container assembly 102 or transport of the container assembly. Having a tight fit of the sensor mounting assembly 610 to interior surface 107, in particular when the temperature element 105 is located on the outer surface 107a of the inner vessel, can help maximize the thermal responsiveness and accuracy of temperature element. The sensor mounting assembly 610 can ease the installation of the temperature element. The sensor mounting assembly 610 can help maintain the temperature element’s contact with the interior surface, e.g., as the inner vessel is cooled down and thermal contraction occurs. Rather, because the sensor mounting assembly's thermal contraction is greater than the temperature element’s thermal contraction the sensor mounting assembly can facilitateincreased or tighter contact between the temperature element and the inner vessel. Additionally, the sensor mounting assembly 610 can adapt to curved portions of the interior surface, by fastening to the interior surface to thereby create a pinch point for optimal contact of the temperature element’s contact with the interior surface in a central zone of the sensor mounting assembly. A greater thermal contraction of the first and second metal plates 705, 712 as compared to the interior surface temperature element 105 can increase a compression loading on the interior surface temperature element 105 located in the sensor mounting assembly 610. Additionally, the sensor mounting assembly can include particular layers of interface materials to enhance the sensor mounting assembly’s thermal conduction with the interior surface of the inner vessel and insulate the sensor mounting assembly’s from thermal conduction with the relatively warmer annular space 220.

[0122] In some embodiments, the interior surface temperature element 105, e.g., embodied as a cylindrical disk (“button”), can be located in cylindrically shaped first and second recesses 707, 715 to provide a tight fitting in the recesses. The sensor tip 767, e.g., the joined end corresponding to the hot junction, can be embedded in the cylindrical disk of the temperature element. In some such embodiments, portions of the temperature element 105 can be sealed to the first and second recesses 707, 715 (e.g., using an epoxy glue). In some embodiments, heads 740a, 740b of the first and second nuts 730a, 730b include a weld 742 sized to fit inside a beveled opening in the second plate 712.[00123J As illustrated in FIG, 7B, for some embodiments, the sensor mounting assembly 610 can be fastened to a curved portion of the interior surface 107 so as to create a pinch point 750 (FIG. 7B) to maximize surface contact force and minimize a distance 752 and between the interior surface temperature element 105 and the interior surface 107.

[0124] Embodiments of the assembly 610 can be oriented and fastened with the inner vessel’s curvature, e.g., bolted down, such that the bottom plate has the pinch point created right where the button is (the sensor tip 767, e.g., joined end corresponding to the hot junction) is embedded in the button), The sensor can be fitted tight inside the button and sealed with epoxy. The button has below for best thermal contact and polytime aerogel sheet on the top for thermal isolation. The button then engages with the housing with these two different functional layers on either side. The housing mounts and bolts securely onto vessel, creating the pinch point for optimal contact in the zone of the button.

[0125] As illustrated in FIGs 7A-7C, in some embodiments, a distal surface 755 of the first metal plate 705 (e.g., distil from the interior surface 107) can include an aluminum foil tape layer 760 to advantageously provide thermal conductive insulation or isolation between the temperature element 105 and the annular space 720. In some embodiments the foil tape layer 760 can cover the whole outer surface of the assembly 610.

[0126] As illustrated in FIG. 7C, in some embodiments, a wiring module (e.g., first wire segment 134a of a wiring module) can be connected to a thermocouple lead wire 765 with a sensor tip 767 of the temperature element 105 (e.g., a TC in some embodiments) located at an interior central location of the interior surface temperature element 105.

[0127] As illustrated in FIG. 7C, in some embodiments, one side 770 of the interior surface temperature element 105 can have or include a thermal insulating layer 772 thereon (e.g., a polyimide aerogel sheet, in some embodiments) and an opposite side 775 of the interior surface temperature element 105 can have or include a thermal conductive layer 777 (e.g., a graphene sheet, in some embodiments).

[0128] As illustrated in FIG. 7A, in some embodiments, the sensor mounting assembly 610 can further include thru-hole openings 780 (e.g., threaded thru-hole openings) sizes to accommodate a bolt or screw there-through (e.g., a hex-head bolt or screw 785), e.g., to secure the interior surface temperature sensor mounting assembly to the inner vessel. All such hex-head bolt or screw 785 can be safety wired together with lock-wires, as familiar to one skilled in the pertinent arts, so that they can’t come loose.

[0129] Thus for embodiments including both the sensor mounting assembly and the wire management assembly can together advantageously facilitate providing long-term accurate measurements, such as when the temperature elements are located in annular space 220 with a high vacuum environment. E.g., embodiments of the sensor mounting assembly 610 can facilitate creating a highly conductive heat transmission path to the interior surface temperature element 105 while providing an insulating barrier with respect to an outer exposed side of the interior surface temperature element 105 (e.g., in the annular space 220) to thereby improve thermal responsiveness and accuracy.

[0130] As further illustrated in FIG 1, some embodiments of the system 102 can, alternatively or additionally include other types of measurement elements to gain further information about the total heat ingress and heat flux being transmitted into the container assembly 102.

[0131] For instance, alternatively or additionally, some embodiments can further include one or more container exterior surface temperature elements (FIG. 1 generally 140) in a vicinity of the cryogenic container assembly. The term, in a vicinity of the cryogenic container, as used herein means within 10 mm of the container assembly outer vessel 210. Embodiments of the container exterior surface temperature elements 140 can include any of the example types of temperature elements 105 (e.g., Type K or T or E TCs) such as disclosed elsewhere herein or any commercially available temperature sensor element capable of producing a digital electrical signal representative of the measured temperature exterior surface temperature to serve as the output signal 110. Some such embodiments can further include a wiring module connected to the exterior surface temperature elements 140 (e.g., via wiring module 132b, FIG 1) to transmit the ambient environment as electrical output signals 110 to the monitoring module 115.

[0132] Having one or more such ambient external surface temperature elements 140 can advantageously provide the data for predictive analysis of trends in the long-term thermal performance of a cryogenic container and promote corrections and standardization for calculating thermal performance with regard to: a) weather extremes; b) day / night cycles; c) seasonal cycles; and d) surface coating and cleanliness effects on heat absorption versus heat reflection in the ambient environment. In some embodiments, data from temperature elements 140 positioned at lower, middle and higher locations on the outer vessel, can advantageous allow calculating an average temperature that can be applied to the outer vessel’s thermal performance.

[0133] For instance, alternatively or additionally, some embodiments can further include one or more cryogenic fluid temperature elements (generally 145, e.g., cryogenic fluid temperature elements 145a...145e, FIGs. 2A, 3A, 5B, 5C, 5D), the cryogenic fluid temperature elements locatable in either a vapor phase or a liquid phase of a cryogenic fluid 112 locatable in the inner vessel 109. Some such embodiments can further include a wiring module connected to the cryogenic fluid temperature elements 145 (e.g., via wiring module 132c, FIG 1, 5A-5C) to transmit the cryogenic fluid’s temperature as electrical output signals 110 to the monitoring module 115.

[0134] As non-limiting example embodiments, of such cryogenic fluid temperature elements 145, can include any of the example types of temperature elements 105 disclosed elsewhere herein. The cryogenic fluid temperature elements 145 can be mounted to low-thermal conductivity tubes made from, e.g., glass fiber reinforced plastic, GFRP, such as G10 composite (e.g., Atlas Fibre, Northbrook, IL), polyetherimide polymer such as ULTEMTM (Saudi Basic Industries Corporation, SABIC, Riyadh, Saudi Arabia), or any other suitable low-thermal-conductivity structural material that is suitable for temperatures down to 4 K, and, that can be clean and particle-free, as familiar to those skilled in the art. The cryogenic fluid temperature elements 145 can be mounted to low-thermal conductivity tubes, can be mounted to HLA supporting structures (generally 245, FIGs. 2-3A) such as support hoops, anchor rods spreader bars or mounting brackets as disclosed, in PV-402 and PV-418.

[0135] For instance, FIG. 5B shows a detailed side view of an example container assembly embodiment, analogous to that shown in FIG. 5A, and illustrates example wiring modules 133c for cryogenic fluid temperature elements 145a...145e and HLA structural supports 245a, 245 located in the cryogenic fluid 112 inside the inner vessel 109. FIG. 5C shows a side view of an example container assembly embodiment, analogous to that shown in FIG. 2, and illustrates example wiring modules 133c for cryogenic fluid temperature elements 145a...145e and structural supports 245c, 245d located in the cryogenic fluid 112 inside the inner vessel 109.

[0136] As illustrated, wiring modules 133c, analogous the wiring extension modules wiring module 132a and wire segments 134, and mounting assemblies, analogous to that disclosed in the context of FIGs. 1, 4A and 5A can be connected to the temperature elements 145 and then brought through a vent line (e.g., vent line exit tube 222) from the top portion of the inner vessel 109 with the vent line continuing through the annular space, through the vacuum jacket, and exiting the line with a suitable ambient-temperature, hermetically sealed feedthrough to the “air" side (e.g., vent feedthrough 510). The vent line can be an existing vent line as part of the container assembly, such as illustrated in FIGs. 5B and 5C, or could be a dedicated vent line just for the purpose of serving as a lead wires conduit from the top of the pressure vessel (container) to the ambient air side. A stainless-steel vent line could be, for example, in the range of approximately 0.5-inch to 1.5-inch diameter to accommodate at least 20 thermocouple wires (at 24 gage, for example) or at least 40 silicone diode wires (at 36 gage, for example).

[0137] Having one or more such cryogenic fluid temperature elements 145 can advantageously provide additional numbers of liquid phase cryogenic fluid levels measurement points, as well as data on thermophysical properties of the fluid system (e.g., liquid and vapor phases) inside the inner vessel.

[0138] For instance, in some cases the accuracy of the temperature sensor data may be of particular interest. For higher accuracy requirements, to distinguish between smaller graduations pressures or temperatures comprising the thermodynamic conditions of the cryogenic fluid at a given point in time, silicon diode type sensors could be advantageously used. Such sensors inside the inner vessel can provide for important thermofluidic analyses related to fluid behavior and the movement of heat with respect to both a connected refrigeration and heating process system and the flow rates of liquid phase cryogenic fluid in or out, or, vapor phase cryogenic fluid in or out of the inner vessel during various operational stages of various different end-use applications.

[0139] FIG. 5D shows a detailed view of portions of structural supports 245c, 245d and wiring module 133ce as shown in FIG. 5C. In some embodiments one of the structural supports 245c can be a structural support tube (e.g., G10 % inch tubes in some embodiments) attached to the HLA 215 (e.g. a support hoops, anchor rods spreader bars or mounting brackets of the HLA) and the other structural supports 245d can be a sensor mount tube. In some embodiments, a thru-hole with clevis pins 520 in the sensor mount tube 246d, and a lock-wire 530 around the structural support tube 245c, can facilitate securing the wiring module 132ce.

[0140] FIG. 5E shows a detailed side view of an inner vessel of the example container assembly shown in FIG. 5A, illustrating an example transition conduit 540. The example transition conduit 540 (e.g., a pipe or tube, a 3 inch long a SCH40 304L pipe, in some embodiments) facilitates the transfer of process fluid in the supply or return lines 240, 242 connected to the HLA 215 in the cryogenic fluid 112 (e.g., FIG. 5E return line 242a) through the inner vessel 109, across the annular space 220 of the container assembly 102 (e.g.,FIG. 5E return line 242b). As illustrated, the transition conduit 540 can be butt welded (e.g., weld 542) to the inner surface 107b and outer surface 107a of the inner vessel 109, and butt welded to the supply or return lines 240, 242 (e.g., welds 544 to lines 242a, 242b). The transition conduit 540 could be a 0.5-inch to 1.5-inch tube outer diameter tubing in some embodiments.

[0141] For instance, alternatively or additionally, some embodiments can further include one or more vacuum pressure transducer elements (generally 150, e.g., vacuum pressure, VP, transducer elements 150a, 150b, 150c, FIGs, 2-3 A) connected to measure a pressure of an annular space 220 between the inner vessel 109 and outer vessel 210. Some such embodiments can further include a wiring module connected to the vacuum pressure transducer elements 150 (e.g., via wiring module 132d, FIG 1) to transmit the vacuum pressure as electrical output signals 110 to the monitoring module 115.

[0142] Non-limiting example embodiments of the vacuum pressure transducer elements 150 can be or include commercially available transducers with the primary sensing element being a thin diaphragm made from flexible material that flexes under pressure, causing a change in electrical resistance corresponding to a digital output signal (e.g., signal 110), to provide a continuous measure of the vacuum level. The housing and other components or the transducer can be selected for durability and operable compatibility with cryogenic temperature, e.g., stainless steel housing, silicon, ceramic, titanium, and sometimes high-performance polymers depending on the application. The vacuum pressure transducer elements 150 can be selected to have a measurement range from 0.1 millitorr to 10,000 millitorr, or from 1 millitorr to 500 millitorr, or from 0.01 millitorr to 760,000 millitorr (where 760 torr = ambient pressures), depending on TIS and container system design and operational requirements. This is in contrast to traditional vacuum pressure transducers used in the cryogenics industry, such as a Pirani type “vacuum thermocouple” type gauge to which is manually connected to a cryogenic container in the field and used as a readout device every few months or yearly.

[0143] Having one or more such vacuum pressure transducer elements 150 can advantageously provide signal data indicating the overall health of the cryogenic container assembly 102 and its real-time, real-world thermal performance. Such vacuum pressure data along with temperature data can be used to monitor and know the physical status of the container and its TIS is a practical and low-cost way, putting that information and data together to create a full picture of that information (e.g., as an infographic as further disclosed herein in the context of FIG. 10A-10C). as well as the calculation of physical and feedback parameter data, such as heat ingress.

[0144] E.g., some cryogenic containers are designed for a Normal Evaporation Rate, NER, of 1% per day or even less than 0.1% per day. The NER is similar to the BOR, but is expressed in terms of % per day rather than heat flow rate (e.g., J / s or W). A typical NER specification can be based on a inner vessel that isapproximately 75% full and under steady-state (quiescent) conditions. However, the NER is generally unknown as the test is not usually run and as it is not data that can be obtained through most operational usage cases. Also, the use of a mass flow meter on the vent line is not the norm. The TIS needs a good vacuum plus the complement insulation materials inside the annular space 220. A slight degradation of vacuum level (e.g., from 0.01 millitorr to 1 millitorr) could mean a five times increase in boil-off rate which can suggest a serious problem. A larger degradation from 1 millitorr to 1 torr could mean the liquefaction of air inside the annular space and major structural problems. E.g., a loss of vacuum from 1 torr to 760 torr could be catastrophic.

[0145] In some embodiments, the one or more vacuum pressure transducers elements 150 can be inserted outside outer vessel 210 of the container assembly 102 to monitor at least the top, middle and bottom of the annular space 220, in combination with the inner surface temperature elements 105, can provide data signals 110 allowing ability for data analytics such as disclosed herein, and not currently being utilized in the industry. E.g., different changing levels of pressure provides output for decisions about filling, un-filling and the dynamic operations of keeping and conveyance of moving the bulk liquid and the state of the “cold mass” in the container. Top, middle, and bottom vacuum pressure transducers 150a, 150b, 150c can provide information about the status inside the container and outside in the weather including liquid levels; time of day; season of year; etc. Having multiple such transducers can provide redundancy to ensure continuing realtime information about the vacuum pressure, real-time, including information on the health status of the insulation materials inside the annular space which can shift or open up gaps over time.

[0146] For instance, alternatively or additionally, some embodiments can further include one or more ullage pressure transducer elements (e.g.. FIG. 1 generally 155; FIGs. 2, 3A, 10A UP1, UP2, 155a, 155b) connected to measure a pressure of an ullage space of the inner vessel (e.g., FIG. 2. ullage space 250 in the inner vessel 109) of the cryogenic container 102.

[0147] Embodiments of the ullage pressure transducer elements (e.g., ullage pressure elements 155a, 155b) can be or include commercially available transducers analogous to that disclosed in the context of the vacuum pressure transducer elements 150. Some embodiments advantageously have two ullage pressure transducers, one wide range (e.g., 0 to 150 psig) and one low narrow range (e.g., 0 to 15 psig). The low narrow range transducer can facilitate providing more accuracy in the pressure range of primary interest for output signals 110 to the monitoring modules 115 of the system 100.

[0148] Some such embodiments can further include a wiring module connected to the ullage pressure transducer elements 155 (e.g., via a wiring module of FIG. 1) to transmit the ullage pressure as electrical output signals 110 to the monitoring module 115. The signals 110 from the ullage pressure transducer elements and the interior surface temperature elements 105 can be used by the system 100 topredictively control and modulate the refrigeration power to the cryogenic container assembly 102 and HLA 215. E.g., based on such signals 110, refrigeration power or heating power from a refrigeration or heating process system can be controlled by control signals sent from the control module 130 to thereby control heat ingress or heat egress to and from the cryogenic container assembly 102 and HLA 215 kept therein, as part of control exerted by the feedback system 100.

[0149] Examples of refrigeration or heating process systems connected to the supply and return lines 240, 242 to circulate a process fluid through the HLA 215 are systems that perform heat subtraction, or refrigeration (or “cooling”), of the cryogenic fluid 112 surrounding the HLA 215, while in other embodiments the HLA 215 can be connected to a process system to perform heat addition, or heating, of the cryogenic fluid 112 surrounding the HLA 215.. The return li ne s 240, 242, provide a cold mas s proce s s fl ow loop connecti ng between the HLA 215 and the refrigeration or heating process system. The process fluid is selected to be suited to the cryogenic fluid 112 being treated. E.g., the process fluid can be selected to remain in a gas phase that will not condense or liquefy and not freeze while in a cooling mode. The process fluid is able to be heated if heating processes are additionally required. Non-limiting examples of suitable can be helium for LHe or LH2 cryogenic fluids, neon for LO2 cryogenic fluid, or, nitrogen for LO2, LN2 or LNG cryogenic fluids. Further control by the feedback system 100 can relate to the operational demands of container offloading, liquid withdrawal, dispensing to vehicles, or vapor recovery, as required.

[0150] For instance, alternatively or additionally, some embodiments can further include one or more inner vessel differential pressure transducer elements (FIG. 1, generally 160, FIGs. 2, 3, 10A. DP) connected to measure a difference in a pressure of an ullage space of the inner vessel 109, e.g., via the exit vent line 222 and a pressure at a bottom of the inner vessel, e.g., via the supply or return lines (e.g., FIGs. 2-3 A, return line 265). That is, the differential pressure 160 equals a net pressure exerted by liquid phase cryogenic fluid inside the inner vessel.

[0151] As shown in FIGs. 2 and 3A, bidirectional cryogenic fluid liquid supply and return lines 260, 265 can be connected to the inner vessel 109. The pressure of an ullage space can be measured using the one or more ullage pressure transducer elements 155. The pressure at a bottom of the inner vessel can be measured by measuring the pressure from a return line 265 connected to the bottom of the inner vessel and the exit vent line 222. Embodiments of the differential pressure transducer elements (e.g., element 160) can be or include commercially available transducers analogous to that disclosed in the context of the vacuum pressure transducer elements 150. Some such embodiments can further include a wiring module connected to the differential pressure transducer elements 160 (e.g., via wiring module 132f, FIG. 1) to transmit the differential pressure as electrical output signals 110 to the monitoring module 115. As non-limitingexamples, in some embodiments for the keeping of LH2, the differential pressure can range from 20 psig or less or 2 psig or less. Other vent gas cryogens, e.g., nitrogen gas. natural gas, argon gas, helium gas could have similar differential pressures. Having the one or more pressure transducer elements can advantageously provide a means to calculate of liquid phase level of the cryogenic fluid as disclosed elsewhere herein. Having more than one differential pressure transducer element 160 can provide redundancy or provide wide range and narrow range pressure transducers, e.g., to facilitate providing more accuracy in the pressure range of primary interest.

[0152] For instance, alternatively or additionally, some embodiments can further include one or more ambient environment sensing elements 165 in a vicinity of the cryogenic container assembly 102. The term, in a vicinity of the cryogenic container assembly 102, as used herein means within 25 m of the container assembly outer vessel 210. For some such embodiments, the ambient environment sensing elements can include one or more of environment temperature sensors, environment pressure sensors or a relative humidity sensors. Such sensors can be any commercial sensor as familiar to one skilled in the pertinent arts, so long as the sensor generates digital electrical outputs representative of these ambient environment parameters can serve as a signal output 1 10. Some such embodiments can further include a wiring module connected to the ambient environment sensing elements 165 (e.g., via wiring module 132g, FIG. 1) to transmit the ambient environment as electrical output signals 110 to the monitoring module 115.

[0153] Having one or more such ambient environment sensing elements 165 can advantageously provide the data for predictive analysis of trends in the long-term thermal performance of the cryogenic container assembly 102 and promote corrections and standardization for calculating thermal performance with regard to: a) weather extremes; b) day / night cycles; and c) seasonal cycles.

[0154] To illustrate further processing features of the monitoring module 115 of the system 100, FIG. 8 presents a block diagram of operations conducted by a processor 117 and I / O module 118 of the monitoring module 115. The processor 117 can be programed to perform computational operations on sensor data files (e.g., files 815...830) obtained from the output signals 110 to generate physical parameter data files corresponding to liquid level, heat ingress and supply fluid 840...865 data. For example, the processor 117 can be programmed with an artificial intelligence system for performing the computational operations to generate the physical parameter data files. As illustrated, embodiments of the computer processor 117, via the I / O module 118, can receive signal 110 inputs corresponding to the container’s 102 interior surface temperature and / or the cryogenic fluid’s temperature (e.g., inner vessel 109 surface temperatures 105 measured from elements 105 and cryogenic fluid temperature measured from elements 145) and log such signals as vessel (e.g., air or liquid) temperature data 810.

[0155] As disclosed in the context of FIG.l, in some embodiments, the processor 117 can receive further signal inputs 110 corresponding to one or more of: exterior container surface temperature from temperature elements 140, annular space vacuum pressure from pressure transducer elements 150 and log such signals as annular space vacuum level data 820, container ullage pressure from pressure transducer elements 155 and log such signals as ullage pressure data 830, vessel differential pressure from pressure transducer elements 160 and log such signals as differential pressure data 815. and ambient environmental information from exterior container surface temperature elements 140 and from ambient environment elements 165 and log such signals as “weather” data 835.

[0156] As illustrated, the differential pressure data 815 can be used by the processor 117 to calculate liquid phase cryogenic fluid level map parameter data 840, as further disclosed elsewhere herein, and such data can be used to cross-check fluid level map calculated from data gathered from the temperature elements 105.

[0157] For instance, alternatively or additionally, the temperature of the ullage gas at the point where it exits the inner vessel 109 (e.g., temperature element 105k) and the liquid level inside the vessel (e.g., based on temperature elements 105a...105j or elements 145) can be used together by the processor 117 to calculate BOR and NER parameter data 825, as further disclosed elsewhere herein.

[0158] The vessel temperature data 810, annular space vacuum level data 820 and the weather data 835 can be used together by the processor 117 to calculate heat ingress parameter data 850, as further disclosed elsewhere herein.

[0159] Alternatively or additionally, the BOR data 825 and the Ullage pressure data 830 can be used together to calculate a direct measure heat ingress parameter data 860, as further disclosed elsewhere herein.

[0160] In turn, the calculated heat ingress data file 850 and / or the other information from the signals 110, can be used to calculate a supply fluid data 865 file to inform trailer hookup for cryogenic fluid on-loading or off-loading, as further disclosed elsewhere herein. For example, the supply fluid data 865 can be used to indicate a hookup for a top fill or bottom fill of the cryogenic container assembly 102 for on-loading or off-loading the cryogenic fluid 112. In determining the supply fluid data 865, either the calculated heat ingress data file 850 or the direct measured heat ingress data 860 can be used. The liquid level map 840 can also be used when determining the supply fluid data 865. The processor 117 can be configured to apply a correction factor to the calculated heat ingress 850 or the directly measured heat ingress 860. Equation (1) presented below is an example of a calculation performed by processor 117 for ullage vapor heating correction using the feedback system 100. Table 1 below identifies the different elements of Equation 1.

[0161] These data files 810...865 can be programed for use by the processor 124 of the control module 130 to calculate various feedback parameters 910a, 910b 910c as further disclosed below.

[0162] To illustrate further processing features of the monitoring module 115 of the system 100, FIG. 9 presents a block diagram of operations conducted by a processor 124 and I / O module 126 of the control module 130. The processor 124 can be programed to perform computational operations on physical parameter data files 120 (e.g., files 840, 860, 865), obtained from the monitoring module 115, to generate feedback parameter files (e.g., files 910a...910c). As illustrated in FIG 9, embodiments the control module 130 can be programmed to calculate feedback parameters files 910a, 910b 910c based on the physical parameter data 120 which can be used to predictively control and modulate the cryogenic container assembly 102, including the HLA 215, as related to the various operational demands. For example, the processor 124 can be programmed with an artificial intelligence system for performing the calculations, recognizing patterns, or both for predictively controlling and modulating the cryogenic container assembly 102.

[0163] For instance, a calculated sensor control feedback parameter file 910a, based upon any one or more of the liquid level map data file 840, the “SUPPLY FLUID” data file 865 or the direct container heat ingress data file 860 can be used to control the logging and calculation of the physical parameter data 120 by the monitoring module 115, (e.g., via control signal 128 FIG. 1,) to increase or decrease the frequency or numbers of physical parameters measured by the temperature or pressure elements.

[0164] For instance, a calculated refrigeration control feedback parameter file 910b, based upon any one or more of the liquid level map data 840, the “SUPPLY FLUID” data file 865 or the direct container heat ingress data file 860, can be used to control refrigeration power to a refrigeration process system connected to the cryogenic container assembly 102, e.g., to increase or decrease a process fluid flow rate through the HLA 215 of the cryogenic container assembly 102.

[0165] For instance, a calculated feedback display parameter file 910c, based upon one or more of the liquid level map data 840, the “SUPPLY FLUID” data file 865 or the direct container heat ingress data file 860, or other sensor element data files 810...835, can be used to present a summary of any of the physical parameter data files for a graphical user interface (GUI) display, such as represented by FIGs. 10A to 10D.

[0166] FIGs. 10A, 10B and 10C present example iconic GUI displays of physical parameter data and feedback parameter data (e.g., feedback data 910c) associated with the cryogenic container assembly. FIG.10D presents an example tabular GUI display of the physical parameter data and the feedback parameter data associated with the cryogenic container assembly. As illustrated in FIGs. 10A to 10D, the control module 130 can be programmed to calculate the feedback display parameters in the form of iconographs that visually represent various physical parameter data and feedback parameter data associated with the cryogeniccontainer assembly 102, e.g., as notational overlays 1012 (e.g., boxes with numeric values therein), within a graphical user interface (GUI) panel (e.g., a display 1005 of a computer, mobile phone or similar device) thereby allowing a user to quickly identify and access each parameter with a glance. In some embodiments the inner vessel temperature T1-T10 can depict the temperature signal 110 from the temperature elements 105 in other embodiments additionally or alternatively such inner vessel temperatures can depict the temperature signal 110 from the temperature elements 145. A liquid level percentage (LL%) can be calculated and depicted as disclosed elsewhere herein. The term CBT(avg) means cold boundary temperature average. In some embodiments the annular space vacuum (Vac) Pressures display portion in FIG. 10C can include a warm boundary temperature (WBT) such as calculated from the signal inputs 110 from the container exterior surface temperature elements 140 (e.g., T12.. T14).

[0167] For example, in FIG. 10A, the GUI can include pictographic literal representations of the container including a liquid level (e.g.,, LL, level 1010) inside the container, pictographic representations cryogenic fluid vent line exit tube 222, process fluid supply line and return lines (not shown) and. pictographic representations of locations of various sensor elements (e.g., FIGs.1-3 one or more of interior surface temperature elements 105, T1... T11, liquid level map, UL, exterior surface elements 140, cryogenic fluid temperature elements 145 (FIGs. 2-3A), vacuum pressure elements 150, VP1, VP2, VP3, ullage pressure transducer elements 155, container differential pressure elements 160, ambient environment elements 165, BOR data 825, and weather data 835. As illustrated, the GUI can further include tabular representations of current values of some such data (e.g., table 1020 showing ambient environment parameters including temperature (T), pressure (P) and relative humidity (%RH) weather data 835), with the notational overlays 1012 on the pictographs showing physical or feedback parameter data.

[0168] Further feedback parameter data can include: total mass balance parameters such as mvapor, mliquid, Vvapor, Vliquidas defined elsewhere herein and such parameters can be calculated using the temperature elements data 810, the ullage pressure data 830 and liquid level data, as disclosed elsewhere herein. Additional feedback parameter data can include: thermal performance parameters such as calculated heat ingress, Q calculated, dynamic NER and static NER, as defined elsewhere herein and such parameters can be calculated using the temperature elements data 810, the vacuum pressure element 150 data, insulation performance specifications, and weather data 835, as disclosed elsewhere herein.

[0169] Additional, further feedback parameter data can include calculations of total mass balance parameters of the cryogenic container assembly 102 including: liquid levels; mass of vapor; mass of liquid; calculations of total heat balance parameters of the cryogenic container assembly 102, including: static heat ingress rate; corrected heat ingress rate; dynamic heat ingress rate; heat flux; container assembly thermal conductivity; static NER; dynamic NER; calculations of operational parameters of thecryogenic container assembly 1020 including: net cold power; dispensing duty cycle; offloading and on-loading schedule; maintenance schedule; calculations of multifunctional feedback parameters for monitoring, diagnostics, and control of the cryogenic container assembly 102.

[0170] Other feedback parameter data can include operations and system control functional data such as GUI infographical displays such as disclosed in the context of FIGs. 10A-10D. This can include total mass balance and usage rates of logistics and planning, off-load and on-load schedules for the cryogenic fluid 112, refrigeration process fluid flow rates, include cold power calculations, defined as Qnet, and cryogenic fluid dispensing schedules, as disclosed elsewhere herein.

[0171] Definitions of terms and disclosure of the calculation of physical and feedback parameters, such as via processor 117 or processor 124, are provided below, including Table 1 that has definitions of symbols used for calculation of thermal properties from boiloff testing.Symbol Description Unit VgVolumetric gas flow rate at STP* m3 / s or liter / min ρgDensity of gas at STP kg / m3ρlDensity of liquid kg / m3ρfgDensity of saturated liquid kg / m3hfg Heat (enthalpy) of vaporization J / g hf Enthalpy of saturated liquid J / g hg Enthalpy of saturated gas J / g Texit Temperature of gas at tank exit K PsatPressure of saturated liquid kPa do Outer diameter of insulation system m di Inner diameter of insulation system m x Thickness of insulation system m LeEffective length (cylindrical) m DeEffective diameter (flat plate) m AeEffective area of heat transmission m2AT Temperature difference (WBT - CBT) K *STP = Standard Temperature & Pressure = 0 °C and 760 torr TABLE 1

[0172] I. Total Mass BalanceA. Measurements:a. Container internal geometry and lookup table for % liquid levels (e.g., (FIG. 12):i. STA110 = Top of inner vessel [m]ii. STA100 = 100% Capacity [m]iii. STA80 = 80% Capacity [m]iv. STA50 = 50% Capacity [m]v. STA20 = 20% Capacity [m]vi. ST AO = 0% Capacity [m]b. Temperature sensors network (one or more temperature elements) on interior surface of inner vessel (T1 to Tn) in [K],c. Container differential pressure (AP) transducer [MPa].d. Container ullage pressure:i. Low / Fine Range (UP1) in [MPa].ii. Full / Coarse Range (UP2) in [MPa].e. Container liquid contents average temperature (Tavg_liq).f. Duration or operational time period (top) [s or h],B. Calculations:a. Thermophysical properties of cryogenic fluid (temperature, pressure, specific gravity, enthalpy, and so forth) are taken from the NIST webbook of data (NIST Chemistry WebBook, SRD 69) for the given fluid: Tliq, Tvap, Pliq, Pvap, Hliq, Hvap, (e.g., FIG. 13 for Hydrogen). Where: T = Temperature; P = Pressure, H = Enthalpy, and, the fluid system is estimated to be under saturated conditions for the calculations.b. Liquid Level or Ah [m] - from temperature sensor network and lookup table for % liquid level c. Liquid Level [m] - from AP transducer:AP = p x g x Ah [MPa], where:p = density of liquidg = specific gravity of liquidCalculate Ah (or height of liquid level)d. Compare liquid level value from each method - select liquid level to use for volume calculation based on known geometry of the inner vessel at the average temperature of the inner vessel. e. Volumes of fluid system inside inner vessel:i. Vvap[m3] = Vtotal− Vliqii. Vliq= calculated from Liquid Level [m3]iii. Vtotal= Vvap+ Vliq= fixed [m3] [check]f. Masses of fluid system inside container:i. mvap= Vvap× ρvap[kg]ii. mliq= Vliq× ρliq[kg]iii. mtotal= mvap+ mliq[kg]g. Mass flow rates or operational outputs:i. Mvap= mvap / top[kg / h]ii. Mliq= mliq / top[kg / h]Mtotal= mtotal / top [kg / h]C. Plots (e.g., for GUI)a. Liquid Level versus time (both methods - as applicable)b. Volume versus time (both liquid and vapor)c. Mass versus time (both liquid and vapor)d. Totalized Mass of vapor for user-selected time intervalse. Totalized Mass of liquid for user-selected time intervals

[0173] II. Total Heat BalanceA. Measurements and Inputsa. CVP [torr]b. Container temperature sensors networki. Calculate Tcon_avgfor a given time period [K]c. External of insulation system shell temperature sensor networki. Calculate Text_avgfor a given time period [K]d. Calculate AT:i. AT=WBT CBT=Text_avg“ Tcon_avge. Insulation performance specifications (varies with CVP):i. ke= effective thermal conductivity of TIS [mW / m-K] versus Cold Vacuum Pressure (CVP) ii. AX = Thickness of TIS [m]f. Effective area of thermal insulation system (Ae) [m2]i. Cylindrical: Ae= (2πLeΔX) / ln(do / di)ii. Flat Plate: Ae= (π / 4)(de)2iii. Spherical: Ae= πdodiWhere:Le = effective length for heat transmission [m]AX = Thickness of TIS (mlde = effective diameter for heat transmission [m]do = outer diameter of TIS [m] [inner of outer vessel]di = inner diameter of TIS [m] [outer of inner vessel]g. Container heat ingress by conduction through piping, supports, and quality factor (considered fixed)h. Mass flow rate from container (Mvap) [g / s] [at standard temperature and pressure (STP); 0 C and 760 torr]i. Vent exit temperature at container wall (Texit) [K]j. Density of vent gas:i. ρvap_exit@ Texit[at container wall exit point]ii. ρvap_meter@ Tmeter[at mass flow meter location]B. Calculationsa. Static Heat Ingress Rate (Qstat) [J / s or W]i. Qstat= Mvap_meter× HfgWhere: Hfg= heat of vaporization at saturation [J / g]Mvap_meter = mass flow rate of vapor at STP conditionsb. Corrected Heat Ingress Rate (Qstat_cor)I. Qstat_cor= Mvap_meter× (ρliq / ρliq_sat)(Hvap_exit− Hfg_sat)ii. Where:iii. ρliq= density of liquid [if at a temperature above the Normal Boiling Point (NBP)] iv. ρliq_sat= density of liquid at NBPv. Hvap_exit= enthalpy of vapor at the container wall exit temperature (Texit) vi. Hfg sat = enthalpy of vaporization of saturated liquidc. Dynamic Heat Ingress Rate (Qdyn) [J / s or W]d. Heat Flux (q) [W / m2]i. q = Qstat / Aee. Container-System Thermal Conductivity (ks) [mW / m-K]i. ks= q × (ΔT / ΔX)f. Static NER [% / day] [averaged or estimated for long time]g. Dynamic NER [% / day] [real-time]C. Plots (e.g., for GUI):a. Dynamic NER versus timeb. Qdyn versus timec. Qdyn versus Liquid Leveld. Qstatversus Texit[overall thermal performance indicator]g. Total heat ingress rate can be expressed as follows: Qtotal[J / s orW] Qtotal= Ql+ Qs+ Qp+ QIQFWhere: Qi = Qstat_corQs= Solid conduction through structural supportsQp= Solid conduction through pipingQIQF = Heat transmission increase due to installation effects (Insulation Quality Factor)

[0174] An example of Total System Operations for the cryogenic container assembly 102A. Monitoring graphical interface and map of measurementsB. Total mass balance and usage rates for logistics and planningC. Net cold power from connected process system:a. Nominal cold power from Refrigeration Process System connected to container (Qcoid-nom) [J / s or W]b. Heat Ingress into Container (Qstat_cor) [J / s or W]c. Net cold power (Qcold_net) available for Heat Lift from container:i. Qcold_net= Qcold-nom- Qstat_cor[J / s or W]ii. Calculate and plot:1. Net Cold Power versus time2. Net Cold Power versus Liquid Level3. Net Cold Power versus Tvap exitD. LH2 Dispensing duty cyclea. Totalized Mass of vapor for user-selected time intervalsb. Totalized Mass of liquid for user-selected time intervalsE. LH2 Tanker onload / offload schedulinga. Liquid Level versus timeF. Maintenance and performance diagnosticsa. CVP versus WVP (vacuum level): PLOT CVP versus timeb. CVP stability and degradationc. Re-evacuation schedulingd. Leak detection and repair

[0175] FIGs. 11 A, 11B, and 11C present infographic sketches of the calculation of total mass balance parameters, total heat balance, total systems operations, respectively, and example plots of selected ones of such parameters. These figures illustrate what kind of calculations can be made based on different kinds of the inputs and measurements are considered in the middle and right hand side column, and, then what kind of plots (e.g., graphical displays similar to that shown in FIGs. 10A-10C) could be presented to show this information visually, such as on a screen of a computing system.[00176J FIG. 12 presents an example lookup graphic table for different heights of liquid phase levels for a vertically oriented cryogenic container assembly, such as cryogenic container assembly 102, keeping a cryogenic fluid of LH2 therein (e.g., 9 kgal in some embodiments).

[0177] FIG. 13 presents an example lookup graphic table of thermophysical properties cryogenic fluid liquid and gas (vapor) phase, of hydrogen at saturation conditions.

[0178] Aspects disclosed herein include:

[0179] A. A feedback system for a cryogenic container assembly, the feedback system comprising one or more interior surface temperature elements locatable on or near an interior surface of an inner vessel of the cryogenic container assembly, wherein each of the one or more interior surface temperature elements generate an electrical output signals proportional to a corresponding surface temperature measurement.

[0180] B. A smart tank system comprising: (1) at least one cryogenic container having a heat lift assembly and a cryogenic fluid, (2) a cold mass process flow loop connecting between the heat lift assembly and a process system of refrigeration or heating, and (3) a feedback system having at least one computing device and one or more instrumentations associated with the at least one cryogenic container or the cold mass process flow loop, wherein the at least one computing device is configured to monitor and meter operations of the smart tank system using data received from the one or more instrumentations.

[0181] Each of the aspects A and B may have one or more of the following additional elements in any combination: Element 1: a monitoring module connected to receive the electrical output signals. Element 2: wherein the monitoring module includes a computer processor programed to calculate physical parameter data based on the electrical output signals, and an input output (I / O) module connected to receive the electrical output signals and transmit the calculated physical parameter data. Element 3: a control module connected to receive the calculated physical parameter data transmitted by the monitoring module and calculate feedback parameter data. Element 4: wherein the control module includes a computer processorprogramed to calculate feedback parameter data based on the physical parameter data, and, an input output (I / O) module to receive the physical parameter data, transmit to the computer processor and transmit the feedback parameter data to one or more of the monitoring module, a refrigeration system of the cryogenic container assembly or a display unit of the cryogenic container assembly. Element 5: wherein each of the one or more interior surface temperature elements includes a thermocouple. Element 6: wherein at least one of the interior surface temperature elements is locatable at or near a lower-most cryogenic fluid liquid level of the interior surface of the inner vessel. Element 7: wherein at least one of the interior surface temperature elements is locatable at or near a lower cryogenic fluid fill level of the interior surface of the inner vessel. Element 8: wherein at least one of the interior surface temperature elements is locatable at or near an upper cryogenic fluid fill level of the inner vessel. Element 9: wherein at least one of the interior surface temperature elements is locatable at or near a vent line exit tube of the inner vessel. Element 10: wherein the one or more interior surface temperature elements are connected to wiring extension modules to transmit the surface temperature electrical output signals to a monitoring module. Element 11: wherein the wiring extension modules have diameter values in a range from 16 to 30 gauge. Element 12: wherein the wiring extension modules include wiring segments that are series-coupled together. Element 13: wherein the wiring extension module connected to at least one of the one or more of the interior surface temperature elements includes: a first wire segment having one end connected to receive the signal from one of the interior surface temperature elements, an opposite end connected to a first end of a second wire segment having an opposite end connected to a first end of a third wire segment having an opposite end connected to a wire feedthrough assembly, and a fourth wire segment having one end connected to the feedthrough assembly and an opposite end connected to the monitoring module. Element 14: a sensor mounting assembly, the sensor mounting assembly including: a first metal plate with a first recess and a second metal plate with a second recess, the first and second recesses sized to accommodate portions of the interior surface temperature element therein; thru-slot openings in the first metal plate and thru-slot openings in the second metal plate, the thru-slot openings sized to accommodate a tip of first and second threaded studs there-through; a first nut and a first washer sized to secure the first threaded stud to the first and second metal plates; and a second nut and a second washer sized to secure the second threaded stud to the first and second metal plates. Element 15: wherein the sensor mounting assembly is fastened to a curved portion of the interior surface so as to create a pinch point to maximize surface contact force and minimize a distance between the interior surface temperature element and the interior surface. Element 16: one or more container exterior surface temperature elements. Element 17: one or more cryogenic fluid temperature elements, the cryogenic fluid temperature elements locatable in either a vapor phase or a liquid phase of a cryogenic fluid locatable in the inner vessel. Element 18: one or more vacuum pressure transducer elements connected to measure apressure of an annular space between the inner vessel and outer vessel. Element 19: further including one or more ullage pressure transducer elements connected to measure a pressure of an ullage space of the inner vessel of the cryogenic container assembly. Element 20: one or more inner vessel differential pressure transducer elements connected to measure a difference in a pressure of an ullage space of the inner vessel and a pressure at a bottom of the inner vessel. Element 21: one or more ambient environment sensing elements in a vicinity of the cryogenic container assembly. Element 22: wherein the instrumentations include temperature and pressure elements. Element 23: wherein the instrumentations include one or more interior surface temperature elements, cryogenic fluid temperature elements, ullage pressure transducer elements, container differential transducer elements, exterior container surface temperature elements, or vacuum pressure transducer elements. Element 24: wherein the feedback system is further configured to, using the received data, condition the cryogenic fluid and generate an enthalpy margin in a liquid phase of the cryogenic fluid. Element 25: wherein the operations include vapor recondensation of a return vapor and accumulation of a liquid phase of the cryogenic fluid. Element 26: wherein the operations include vapor feed and in-situ liquefaction and accumulation of a liquid phase of the cryogenic fluid. Element 27: wherein the feedback system is configured for a combination of liquid conditioning and vapor recondensation of the cryogenic fluid. Element 28: wherein the at least one computing device includes a monitoring module and a control module. Element 29: wherein the at least one computing device is configured to indefinitely keep the cryogenic fluid in a liquid phase by modulating refrigeration of the process system of refrigeration or heating. Element 30: wherein the at least one computing device is configured to keep the cryogenic fluid at low pressure with enthalpy margin for heat absorption upon liquid conveyance. Element 31: wherein the at least one computing device is configured to control the cryogenic fluid within a differential pressure range of < 2 psig pressure or <20 psig. Element 32: wherein the at least one computing device is configured to process power balance over time data for the smart tank system. Element 33: wherein the at least one computing device is configured to process the data by generating a temperature map of the at least one cryogenic container. Element 34: wherein the at least one computing device is configured to maintain a selected ullage pressure. Element 35: wherein the at least one computing device is configured to maintain a selected maximum and minimum range of the ullage pressure. Element 36: wherein the at least one computing device is configured to supply fluid data for directing transfer of the cryogenic fluid into or out of the at least one cryogenic container. Element 37: wherein the at least one computing device is configured to generate a graphical user interface for display that presents physical parameter data of the smart tank system. Element 38: wherein the displayed graphical user interface provides a summary of the physical parameter data.

[0182] Those skilled in the art to which this application relates will appreciate that other and further additions, deletions, substitutions and modifications may be made to the described embodiments.

Claims

1. WHAT IS CLAIMED IS:

1. A feedback system for a cryogenic container assembly, the feedback system comprising:one or more interior surface temperature elements locatable on or near an interior surface of an inner vessel of the cryogenic container assembly, wherein each of the one or more interior surface temperature elements generate an electrical output signals proportional to a corresponding surface temperature measurement.

2. The feedback system of claim 1, further including a monitoring module connected to receive the electrical output signals.

3. The feedback system of claim 2 wherein the monitoring module includes a computer processor programed to calculate physical parameter data based on the electrical output signals, and an input output (I / O) module connected to receive the electrical output signals and transmit the calculated physical parameter data.

4. The feedback system of claim 3, further including a control module connected to receive the calculated physical parameter data transmitted by the monitoring module and calculate feedback parameter data.

5. The feedback system of claim 4, wherein the control module includes a computer processor programed to calculate feedback parameter data based on the physical parameter data, and, an input output (I / O) module to receive the physical parameter data, transmit to the computer processor and transmit the feedback parameter data to one or more of the monitoring module, a refrigeration system of the cryogenic container assembly or a display unit of the cryogenic container assembly.

6. The feedback system of claim 1, wherein each of the one or more interior surface temperature elements includes a thermocouple.

7. The feedback system of claim 1, wherein at least one of the interior surface temperature elements is locatable at or near a lower-most cryogenic fluid liquid level of the interior surface of the inner vessel.

8. The feedback system of claim 1, wherein at least one of the interior surface temperature elements is locatable at or near a lower cryogenic fluid fill level of the interior surface of the inner vessel.

9. The feedback system of claim 1, wherein at least one of the interior surface temperature elements is locatable at or near an upper cryogenic fluid fill level of the inner vessel.

10. The feedback system of claim 1, wherein at least one of the interior surface temperature elements is locatable at or near a vent line exit tube of the inner vessel.

11. The feedback system of claim 1, wherein the one or more interior surface temperature elementsare connected to wiring extension modules to transmit the surface temperature electrical output signals to a monitoring module.

12. The feedback system of claim 11, wherein the wiring extension modules have diameter values in a range from 16 to 30 gauge.

13. The feedback system of claim 11, wherein the wiring extension modules include wiring segments that are series-coupled together.

14. The feedback system of claim 13, wherein the wiring extension module connected to at least one of the one or more of the interior surface temperature elements includes: a first wire segment having one end connected to receive the signal from one of the interior surface temperature elements, an opposite end connected to a first end of a second wire segment having an opposite end connected to a first end of a third wire segment having an opposite end connected to a wire feedthrough assembly, and a fourth wire segment having one end connected to the feedthrough assembly and an opposite end connected to the monitoring module.

15. The feedback system of claim 1, further including a sensor mounting assembly, the sensor mounting assembly including:a first metal plate with a first recess and a second metal plate with a second recess, the first and second recesses sized to accommodate portions of the interior surface temperature element therein; thru-slot openings in the first metal plate and thru-slot openings in the second metal plate, the thru-slot openings sized to accommodate a tip of first and second threaded studs there -through; a first nut and a first washer sized to secure the first threaded stud to the first and second metal plates; anda second nut and a second washer sized to secure the second threaded stud to the first and second metal plates.

16. The feedback system of claim 15, wherein the sensor mounting assembly is fastened to a curved portion of the interior surface so as to create a pinch point to maximize surface contact force and minimize a distance between the interior surface temperature element and the interior surface.

17. The feedback system of claim 1, further including one or more container exterior surface temperature elements.

18. The feedback system of claim 1, further including one or more cryogenic fluid temperature elements, the cryogenic fluid temperature elements locatable in either a vapor phase or a liquid phase of a cryogenic fluid locatable in the inner vessel.

19. The feedback system of claim 1, further including one or more vacuum pressure transducer elements connected to measure a pressure of an annular space between the inner vessel and outervessel.

20. The feedback system of claim 1, further including one or more ullage pressure transducer elements connected to measure a pressure of an ullage space of the inner vessel of the cryogenic container assembly.

21. The feedback system of claim 1, further including one or more inner vessel differential pressure transducer elements connected to measure a difference in a pressure of an ullage space of the inner vessel and a pressure at a bottom of the inner vessel.

22. The feedback system of claim 1, further including one or more ambient environment sensing elements in a vicinity of the cryogenic container assembly.

23. A smart tank system, comprising:at least one cryogenic container having a heat lift assembly and a cryogenic fluid;a cold mass process flow loop connecting between the heat lift assembly and a process system of refrigeration or heating; anda feedback system having at least one computing device and one or more instrumentations associated with the at least one cryogenic container or the cold mass process flow loop, wherein the at least one computing device is configured to monitor and meter operations of the smart tank system using data received from the one or more instrumentations.

24. The smart tank system of Claim 23, wherein the instrumentations include temperature and pressure elements.

25. The smart tank system of Claim 23, wherein the instrumentations includes one or more interior surface emperature elements, cryogenic fluid temperature elements, ullage pressure transducer elements, container differential transducer elements, exterior container surface temperature elements, or vacuum pressure ransducer elements.

26. The smart tank system of Claim 23, wherein the feedback system is further configured to, using the received data, condition the cryogenic fluid and generate an enthalpy margin in a liquid phase of the cryogenic fluid.

27. The smart tank system of Claim 23, wherein the operations include vapor recondensation of a return vapor and accumulation of a liquid phase of the cryogenic fluid.

28. The smart tank system of Claim 23, wherein the operations include vapor feed and in-situ liquefaction and accumulation of a liquid phase of the cryogenic fluid.

29. The smart tank system of Claim 23, wherein the feedback system is configured for a combination of liquid conditioning and vapor recondensation of the cryogenic fluid.

30. The smart tank system of Claim 23, wherein the at least one computing device includes a monitoringmodule and a control module.

31. The smart tank system in Claim 23, wherein the at least one computing device is configured to indefinitely keep the cryogenic fluid in a liquid phase by modulating refrigeration of the process system of refrigeration or heating.

32. The smart tank system in Claim 23, wherein the at least one computing device is configured to keep the cryogenic fluid at low pressure with enthalpy margin for heat absorption upon liquid conveyance.

33. The smart tank system in Claim 23, wherein the at least one computing device is configured to control the cryogenic fluid within a differential pressure range of < 2 psig pressure or <20 psig.

34. The smart tank system in Claim 23, wherein the at least one computing device is configured to process power balance over time data for the smart tank system.

35. The smart tank system in Claim 23, wherein the at least one computing device is configured to process the data by generating a temperature map of the at least one cryogenic container.

36. The smart tank system in Claim 23, wherein the at least one computing device is configured to maintain a selected ullage pressure.

37. The smart tank system in Claim 36, wherein the at least one computing device is configured to maintain a selected maximum and minimum range of the ullage pressure.

38. The smart tank system in Claim 23, wherein the at least one computing device is configured to supply fluid data for directing transfer of the cryogenic fluid into or out of the at least one cryogenic container.

39. The smart tank system in Claim 23, wherein the at least one computing device is configured to generate a graphical user interface for display that presents physical parameter data of the smart tank system.

40. The smart tank system in Claim 39, wherein the displayed graphical user interface provides a summary of the physical parameter data.

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