Liquid cooling heat dissipation device for controller, controller and movable platform

Abstract

Disclosed in the present application are a liquid cooling heat dissipation device for a controller, a controller, and a movable platform. The liquid cooling heat dissipation device for a controller comprises a cold plate, a water pump and a radiator, and at least two of the cold plate, the water pump and the radiator are integrated; the cold plate is used for cooling the controller, and the water pump is used for conveying a cooling liquid flowing through the cold plate to the radiator and then to the cold plate. Thus, self-circulation of the cooling liquid of the heat dissipation device can be realized without connecting same a vehicle body water circulation system, which facilitates the connection between the heat dissipation device and a housing of the controller, reduces the number of pipes and reduces costs.

Description

Liquid cooling system for controller, controller and mobile platform Technical Field

[0001] This application relates to the field of heat dissipation device technology, specifically to a liquid cooling heat dissipation device for a controller, a controller, and a mobile platform. Background Technology

[0002] Existing heat dissipation methods mainly include air cooling and liquid cooling (such as water cooling). Air cooling involves adding heat dissipation fins to the casing and placing a cooling fan above the fins for heat dissipation. This requires a relatively large heat dissipation fin structure and additional installation space for airflow. Even so, the upper limit of air cooling is still relatively low, generally only suitable for products with a power consumption of 50W or less, and is mainly applicable to low-power platforms. Liquid cooling involves adding a first liquid flow channel inside the casing, filled with flowing liquid that carries away the heat transferred to the casing, and is mainly used for high-power platforms.

[0003] Since high-performance chips or high-power devices typically have high power consumption, air-cooled devices with low heat dissipation efficiency generally cannot meet the heat dissipation requirements, and efficient liquid cooling (such as water cooling) is required.

[0004] However, liquid cooling systems require a liquid cooling circulation system. For electric vehicles, the domain controller (such as the onboard controller) can be connected to its own circulation system for cooling the battery and motor; however, for purely gasoline-powered vehicles, they do not have an additional water cooling circulation system. The engine's water cooling system is usually located at the front of the vehicle, making it inconvenient to run water pipes out, and its own water temperature is high, so even if connected, the cooling effect is not good. This results in the domain controller of purely gasoline-powered vehicles not being able to get adequate cooling.

[0005] Application content

[0006] To address at least one of the aforementioned problems, according to one aspect of this application, a liquid cooling heat dissipation device for a controller is provided.

[0007] The liquid cooling device for the controller includes a cold plate, a water pump, and a radiator; at least two of the three components are integrated. The cold plate is used to cool the controller; the water pump delivers the coolant flowing through the cold plate to the radiator and then back to the cold plate. Because this application uses a water pump to deliver the coolant flowing through the cold plate to the radiator for cooling before returning it to the cold plate to cool the controller, its heat dissipation performance is significantly better than air cooling. It is suitable for cooling high-power chips on vehicle controllers and achieves self-circulation of the coolant, eliminating the need to connect it to the vehicle's water circulation system. This means the liquid cooling device for the controller does not rely on the vehicle's water circulation system. Furthermore, the integration of at least two of the three components not only facilitates connection to the controller's housing but also reduces the number of pipes and other components (for example, when the water pump is integrated into the radiator, the number of pipes connecting the water pump to the radiator is reduced; similarly, when the water pump is integrated into the cold plate, the number of pipes connecting the water pump to the cold plate is reduced), thus lowering costs.

[0008] In some embodiments, the water pump is integrated into at least one of the cold plate, the radiator, and the controller housing. This not only facilitates the connection between the liquid cooling device for the controller and the controller housing, but also reduces the number of components such as pipes, or the number of manufacturing steps (for example, when the water pump is integrated into the controller housing and the pump housing is integrally formed on the housing, the manufacturing of the water pump housing can be eliminated), thus reducing costs. At the same time, when the radiator is set independently, it can be placed away from the controller, for example, in a low-temperature location (such as a location where the vehicle's air conditioning can reach), to avoid the high ambient temperature of the radiator affecting the heat dissipation effect of the liquid cooling device for the controller.

[0009] In some implementations, the cold plate is integrated into the controller housing and located on the side of the housing opposite to the controller's circuit board, or the cold plate is mounted on the controller housing and located on the side of the housing opposite to the controller's circuit board. Thus, the cold plate can be used to dissipate heat from the controller.

[0010] In some embodiments, a first thermally conductive protrusion is provided on the housing, corresponding to the position of the chip on the circuit board. The first thermally conductive protrusion is located on the side of the housing facing the circuit board and is used to conduct the heat from the chip to the cold plate. Because the first thermally conductive protrusion is provided on the side of the housing facing the circuit board, the heat dissipation effect of the cold plate on the controller can be ensured through the first thermally conductive protrusion.

[0011] In some embodiments, the cold plate includes a first liquid flow channel and a first heat dissipation feature. The first liquid flow channel is disposed on the side of the housing opposite to the circuit board, and the first heat dissipation feature is disposed in the first liquid flow channel and configured to accelerate the heat exchange efficiency between the liquid in the first liquid flow channel and the housing. This improves the heat dissipation efficiency of the cold plate.

[0012] In some embodiments, the first heat-conducting boss is integrally formed on the outer casing, or the first heat-conducting boss is made of copper and welded to the outer casing. When the first heat-conducting boss is integrally formed on the outer casing, processing efficiency can be improved; when the first heat-conducting boss is made of metal, the heat conduction effect of the first heat-conducting boss can be guaranteed. At this time, the first heat-conducting boss also has a heat-uniforming effect, that is, the first heat-conducting boss acts as a heat-uniforming block.

[0013] In some embodiments, the cold plate further includes a first cover; a first liquid channel is integrally machined onto the housing, the first liquid channel having a first opening facing away from the circuit board, and the first cover sealing the first opening. Because the first liquid channel is integrally machined onto the housing, it can be ensured that the liquid in the first liquid channel will not seep into the circuit board and chip between the housing and the bottom cover of the controller, thereby preventing the circuit board and chip from being damaged or malfunctioning due to water contact.

[0014] In some embodiments, the first liquid flow channel is connected to the water pump through a first inlet and a first outlet. When the cold plate and the water pump are not integrated, the first inlet can be connected to the outlet of the water pump and the first outlet can be connected to the inlet of the water pump through a pipeline. This ensures that the water pump can output liquid from the first liquid flow channel and input liquid into the first liquid flow channel of the cold plate, thereby ensuring the self-circulation of liquid in the liquid cooling heat dissipation device for the controller.

[0015] In some embodiments, the first heat dissipation feature includes fins extending along a first direction X, which is not parallel to at least one of a second direction Y and a third direction Y', where the second direction Y is the liquid flow direction at the first inlet and the third direction Y' is the liquid flow direction at the first outlet. Thus, the fins can agitate the liquid flowing into the first inlet to improve the heat exchange effect between the fins and the liquid; and the first outlet can also agitate the liquid flowing through the fins to slow down the velocity of the liquid flowing out of the first outlet, thereby improving the heat exchange effect between the fins and the liquid.

[0016] In some implementations, a heat-conducting element is provided on the side of the controller's circuit board and chip facing the housing. This allows the heat from the circuit board and chip to be better transferred to the cold plate, enabling the cold plate to dissipate heat more efficiently.

[0017] In some embodiments, the cold plate includes a second liquid flow channel and a second heat dissipation feature. The second liquid flow channel is disposed on the housing, specifically on the side of the housing facing the circuit board of the controller. The second liquid flow channel has a second opening facing the side where the circuit board of the controller is located. The second heat dissipation feature is disposed on a second thermally conductive protrusion. When the second thermally conductive protrusion seals and closes the second opening, the second heat dissipation feature is located within the second liquid flow channel. The second thermally conductive protrusion is disposed on the housing at a position corresponding to the chip on the circuit board and is used to conduct heat from the chip into the cold plate. Therefore, the second thermally conductive protrusion ensures the effective heat dissipation of the controller by the cold plate; the second heat dissipation feature also accelerates the heat dissipation efficiency of the cold plate.

[0018] In some embodiments, the second heat dissipation feature includes multiple closely spaced teeth. Therefore, the heat exchange efficiency of the second heat dissipation feature can be ensured by having a high surface area.

[0019] In some embodiments, the second thermally conductive boss is connected to the housing by friction stir welding. This ensures that the second thermally conductive boss effectively seals the second opening.

[0020] In some embodiments, part of the pump housing is integrally formed with the outer casing. This eliminates the need for manufacturing the pump housing separately, as well as the step of connecting the pump to the housing, improving manufacturing and usage efficiency and effectively preventing liquid leakage.

[0021] In some embodiments, the second heat dissipation feature is made of at least one material, either aluminum or copper. This ensures the heat exchange efficiency of the second heat dissipation feature.

[0022] In some embodiments, the second heat dissipation feature is integrally formed with the second heat-conducting boss. This ensures the stability of the connection and heat exchange effect.

[0023] In some embodiments, the second heat dissipation feature has a flange edge, which is welded to a second heat-conducting boss, which is a heat-spreading block. Therefore, the heat conduction effect can be improved by using a heat-spreading block.

[0024] In some embodiments, a third opening is provided on the side of the housing opposite to the circuit board. The third opening communicates with the second liquid flow channel, and the water pump seal is fitted onto the third opening, forming a sealed cavity with the second liquid flow channel. This reduces the number of pipes connecting the water pump to the cold plate.

[0025] In some embodiments, the second liquid channel is connected to the water pump via a second inlet and a second outlet. Thus, when the cold plate and the water pump are not integrated, the second inlet can be connected to the water pump's outlet via a pipeline, and the second outlet can be connected to the water pump's inlet. This ensures that the water pump can output liquid from the second liquid channel and also output liquid from the cold plate's second liquid channel, thereby ensuring the liquid self-circulation of the liquid cooling device used for the controller.

[0026] In some embodiments, at least one of the second liquid flow channel, the second inlet, and the second outlet is integrally formed on the outer casing. This reduces the number of connection steps and improves manufacturing and usage efficiency.

[0027] In some implementations, the water pump is located on the side of the cold plate away from the outer casing. This ensures the effective heat dissipation of the cold plate from the outer casing.

[0028] In some implementations, the water pump is mounted on one side of the radiator. This integrated arrangement of the water pump and radiator improves the installation efficiency of the liquid-cooled heat dissipation device for the controller.

[0029] In some embodiments, the liquid cooling device for the controller further includes a power supply control module. The water pump and the radiator fan are connected to the power supply control module, which is configured to control when the water pump and fan are connected to the power supply. This facilitates the power supply control module's adjustment of the operation of the water pump and radiator.

[0030] In some implementations, the radiator is integrated on the side of the cold plate away from the housing. This ensures the cold plate effectively dissipates heat from the housing.

[0031] In some implementations, at least one of the water pump and the radiator is integrated into or mounted on the housing. This allows for the installation of the liquid cooling system for the controller simply by connecting the vehicle body to the housing, improving the efficiency of installation, disassembly, and maintenance.

[0032] In some implementations, the water pump is set up independently and located away from the controller. This allows the water pump to be placed in a low-temperature location (e.g., where it can be reached by the vehicle's air conditioning) to avoid the water pump being at a high temperature and affecting the heat dissipation effect of the liquid cooling device used for the controller. The water pump can be powered by connecting it to the controller or by an external power supply along with the radiator.

[0033] In some implementations, the radiator is located on the side of the controller housing away from the circuit board of the controller. This improves the installation efficiency of the liquid cooling device for the controller.

[0034] According to another aspect of this application, a controller is provided, which includes the aforementioned liquid cooling heat dissipation device for the controller. Since the heat dissipation performance of the liquid cooling heat dissipation device is significantly better than that of air cooling, it is suitable for heat dissipation of high-power chips on the controller, and it achieves self-circulation of the coolant, eliminating the need to connect it to an external water circulation system, making it suitable for vehicle-mounted controllers; moreover, since at least two of the cold plate, water pump, and radiator are integrated on the controller, it facilitates the installation and disassembly of the controller, making operation convenient.

[0035] According to another aspect of this application, a mobile platform is provided, which includes the aforementioned controller. Since the controller's liquid cooling system enables self-circulation of the coolant, it does not need to be connected to an external water circulation system. Therefore, when the controller is used in a mobile platform, the piping connection to an external water circulation system is eliminated, making operation convenient. Attached Figure Description

[0036] Figure 1 is a schematic diagram of the liquid cooling heat dissipation device for the controller according to the first embodiment of this application;

[0037] Figure 2 is a structural schematic diagram of the liquid cooling heat dissipation device for the controller shown in Figure 1 from another perspective;

[0038] Figure 3 is a partial structural schematic diagram of the liquid cooling heat dissipation device used for the controller shown in Figure 1.

[0039] Figure 4 is a schematic diagram of the partial disassembly state of the liquid cooling heat dissipation device for the controller shown in Figure 3.

[0040] Figure 5 is a schematic diagram of the liquid cooling heat dissipation device for the controller according to the second embodiment of this application;

[0041] Figure 6 is a schematic diagram of the liquid cooling heat dissipation device for the controller according to the third embodiment of this application;

[0042] Figure 7 is a schematic diagram of the liquid cooling heat dissipation device for the controller according to the fourth embodiment of this application;

[0043] Figure 8 is a schematic diagram of the integrated water pump and cold plate structure according to the first embodiment of this application;

[0044] Figure 9 is a schematic diagram of the disassembled structure of the water pump and the cold plate integrated as shown in Figure 8.

[0045] Figure 10 is another perspective structural diagram of the water pump and cold plate integration shown in Figure 9 in a disassembled state.

[0046] Figure 11 is a schematic diagram of the structure of the water pump and the cold plate integrated and installed on the controller as shown in Figure 8;

[0047] Figure 12 is a schematic diagram of the disassembled state of the water pump and cold plate integrated with the controller shown in Figure 11 after installation on the controller.

[0048] Figure 13 is a structural schematic diagram from another perspective of the disassembled state of the water pump and cold plate integrated with the controller shown in Figure 12.

[0049] Figure 14 is a cross-sectional structural diagram of the water pump and cold plate integrated with the controller shown in Figure 11;

[0050] Figure 15 is a schematic diagram of the integrated water pump and cold plate according to the second embodiment of this application;

[0051] Figure 16 is a schematic diagram of the disassembled structure of the water pump integrated on the cold plate and controller as shown in Figure 15.

[0052] Figure 17 is a cross-sectional schematic diagram of the water pump integrated on the cold plate and controller as shown in Figure 15.

[0053] Figure 18 is a schematic diagram of the integrated water pump and cold plate according to the third embodiment of this application;

[0054] Figure 19 is a schematic diagram of the disassembled structure of the water pump and the cold plate integrated in Figure 18.

[0055] Figure 20 is a cross-sectional view of the integrated water pump and cold plate shown in Figure 18.

[0056] Figure 21 is a schematic diagram of the structure of the cold plate integrated on the controller in the first embodiment of this application;

[0057] Figure 22 is a schematic diagram of the disassembled structure of the cold plate integrated on the controller as shown in Figure 21;

[0058] Figure 23 is a cross-sectional view of the cold plate integrated on the controller as shown in Figure 21.

[0059] Figure 24 is a cross-sectional structural diagram of the cold plate integrated on the controller in the second embodiment of this application;

[0060] Figure 25 is a schematic diagram of the disassembled structure of the cold plate integrated on the controller as shown in Figure 24;

[0061] Figure 26 is a structural schematic diagram from another perspective of the disassembled state of the cold plate integrated on the controller as shown in Figure 25.

[0062] Figure 27 is a cross-sectional structural diagram of the cold plate integrated on the controller according to the third embodiment of this application;

[0063] Figure 28 is a schematic diagram of the disassembled structure of the cold plate integrated on the controller as shown in Figure 27;

[0064] Figure 29 is a structural schematic diagram from another perspective of the disassembled state of the cold plate integrated into the controller as shown in Figure 28;

[0065] Figure 30 is a schematic diagram of a structure in which the radiator is independently set according to an embodiment of this application;

[0066] Figure 31 is a schematic diagram of a water pump independently installed according to an embodiment of this application;

[0067] Figure 32 is a schematic diagram of the disassembled structure of the water pump shown in Figure 31, which is set up independently.

[0068] Figure 33 is a schematic diagram of the module structure of a liquid cooling heat dissipation device for a controller according to an embodiment of this application;

[0069] Figure 34 is a schematic diagram of the structure of a mobile platform according to an embodiment of this application. Detailed Implementation

[0070] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0071] It should also be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising" or "including" include not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. The terminology used herein is generally that commonly used by those skilled in the art; in case of any discrepancy with commonly used terminology, the terminology used herein shall prevail.

[0072] Furthermore, for ease of description, spatial relative terms such as “below,” “under,” “lower,” “above,” and “upper” may be used herein to describe the relationship between one element or component and another (or other) element or component as shown in the figure. In addition to the orientation shown in the figure, spatial relative terms are intended to include different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein can be interpreted accordingly.

[0073] In this article, the term "domain controller" is short for domain controller, which refers to a server in a "domain" model that is responsible for authenticating every computer and user connected to the network.

[0074] Domain controller servers play a crucial role in ensuring security in any environment. In automotive applications, a domain controller is a computer that controls a set of vehicle functions associated with a specific area (or domain). Functional domains requiring domain controllers are typically computationally intensive, connected to a large number of input / output (I / O) devices. Examples of relevant domains include active safety, user experience, body, and chassis.

[0075] In this article, the term "cold plate" refers to a metal or composite material device used for efficient heat dissipation, typically integrated into electronic devices, high-power components, or mechanical systems, which conducts heat from heat-generating components to the external environment through contact with a cooling medium (such as a liquid or gas).

[0076] In this article, the term "radiator" refers to the core component of a liquid cooling system. It is typically made of metal (such as aluminum or copper) and contains dense heat dissipation fins and fluid channels that transfer heat from the coolant to the environment through air convection or forced air cooling.

[0077] In this article, the term "vapor chamber" (VC) refers to a highly efficient heat dissipation element whose working principle is based on the gas-liquid phase change of an internal liquid. It typically consists of a sealed cavity filled with a small amount of working liquid (such as deionized water or acetone), and the liquid circulates through capillary structures on its inner walls. When heat from a heat source (such as a CPU or GPU) is conducted to the vapor chamber, the liquid vaporizes in the evaporation zone. The vapor flows to the condensation zone under pressure difference, dissipates heat in the condensation zone, and then recondenses back into liquid, flowing back to the evaporation zone through the capillary structure, thus achieving rapid heat conduction and diffusion. A vapor chamber generally includes a shell, a working liquid, and a capillary structure. The shell can be made of copper, stainless steel, or aluminum alloy. The working liquid can be deionized water or acetone. The capillary structure can be sintered copper powder, copper mesh, or a composite structure.

[0078] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0079] According to a first embodiment of this application, a liquid cooling heat dissipation device for a controller 50 includes a cold plate 20, a water pump 30, and a radiator 40; the cold plate 20, the water pump 30, and the radiator 40 are integrated; the cold plate 20 is used to cool the controller 50; the water pump 30 is used to deliver the coolant flowing through the cold plate 20 to the radiator 40 and then to the cold plate 20.

[0080] As shown in Figures 1 to 4, in the first embodiment of the integrated arrangement of the cold plate 20, water pump 30, and radiator 40, the cold plate 20 is integrally formed or connected to the housing 51 of the controller 50 by welding or other connection methods, and is located on the side of the housing 51 away from the bottom cover 54 of the controller 50; the first water inlet 211 of the cold plate 20 is connected to the third water outlet 32 ​​of the water pump 30 through one of the pipes 60, and the first water outlet 212 of the cold plate 20 is connected to the third water inlet 31 of the water pump 30 through another pipe 60; the radiator 40 is integrated on the cold plate 20 (for example, the first housing body of the radiator 40 is integrally formed or integrated on the cold plate 20 by welding or other connection methods; when the cold plate 20 is integrally formed on the housing 51, the radiator 40 is integrally formed or welded on the housing 51), and is located on the side of the cold plate 20 away from the housing 51 of the controller 50, so as to ensure the heat dissipation effect of the cold plate 20 on the housing 51. As shown in Figures 1 to 4, the radiator 40 is integrated with the water pump 30. For example, the water pump 30 is installed on one side of the radiator 40, such as on the side of the radiator 40 where the fan 41 is not installed. The radiator 40 has a fourth water inlet 42 and a fourth water outlet 43 integrally formed, machined or connected on the side of the integrated water pump 30. One of the water inlets of the water pump 30 is connected to the fourth water outlet 43, and one of the water outlets of the water pump 30 is connected to the fourth water inlet 42. In this case, the pipe 60 connecting the water pump 30 and the radiator 40 can be reduced.

[0081] As shown in Figures 8 to 20, the second embodiment of the integrated arrangement of the cold plate 20, water pump 30 and radiator 40 differs from the first embodiment mainly in that the cold plate 20 is integrated on the water pump 30, and the radiator 40 can be integrated on the water pump 30 as needed (as shown in Figures 1 to 4).

[0082] Figures 8 to 14 schematically show a first embodiment in which the cold plate 20 is integrated into the water pump 30. As shown in Figure 11, the water pump 30 is disposed on the side of the cold plate 20 facing away from the housing 51. This ensures the heat dissipation effect of the cold plate 20 on the housing 51. As shown in Figures 9 and 10, the water pump 30 includes a cavity 34 and an assembly 33 disposed in the cavity 34. The pump assembly 33 typically includes components such as a pump housing, a rotating shaft, a pump impeller casting, bearings, and seals. These components work together to achieve functions such as liquid or gas transmission and pressurization. The pump assembly 33 can have different types and structural designs depending on different working principles and application scenarios. This application does not limit the specific implementation of the pump assembly 33. The third inlet 31 and the third outlet 32 ​​are connected to the cavity 34, and the third inlet 31 and the third outlet 32 ​​are connected to the radiator 40 through pipes. When the cold plate 20 is integrated with the water pump 30, the cold plate 20 is connected to the cavity 34 of the water pump 30 to reduce the number of pipes 60 connecting the water pump 30 and the cold plate 20.

[0083] In the first embodiment where the cold plate 20 is integrated into the water pump 30, as shown in Figures 11 to 14, the cold plate 20 is mounted on the housing 51 of the controller 50 and is located on the side of the housing 51 facing away from the bottom cover 54. The position of the cold plate 20 corresponds to that of the chip 53 on the circuit board 52 of the controller 50. A heat-conducting element 55 is provided on the side of the chip 53 facing the housing 51. A first heat-conducting protrusion 511 is provided on the side of the housing 51 facing the chip 53, and the first heat-conducting protrusion 511 corresponds to that of the chip 53. When the housing 51 is connected to the bottom cover 54, a space is formed between the two to accommodate the circuit board 52, the chip 53 and the heat-conducting element 55, so that the first heat-conducting protrusion 511 can be pressed against the chip 53 by the heat-conducting element 55, so that the heat of the circuit board 52 and the chip 53 can be better transferred to the housing 51 by the heat-conducting element 55, and then transferred to the cold plate 20 by the housing 51, so that the cold plate 20 can dissipate heat more efficiently. In some embodiments, the first heat-conducting boss 511 is integrally formed on the housing 51, so as to improve processing efficiency and ensure the heat dissipation effect of the cold plate 20 on the controller 50 through the first heat-conducting boss 511.

[0084] Figures 15 to 17 schematically show a second embodiment in which the cold plate 20 is integrated onto the water pump 30. Part of the housing of the water pump 30 is integrally formed with the outer casing 51, eliminating the need for fabrication of the outer casing 51 and the connection process between the water pump 30 and the outer casing 51. This improves manufacturing and usage efficiency and effectively prevents liquid leakage. As shown in Figure 16, the water pump 30 includes a cavity 34 and an assembly 33 disposed within the cavity 34. The cavity 34 is integrally formed or machined onto the outer casing 51. A third inlet 31 and a third outlet 32 ​​communicate with the cavity 34 and are connected to the radiator 40 via pipes. As shown in Figure 17, a second opening 243 is provided on the side of the outer casing 51 facing the bottom cover 54, and a third opening 244 is provided on the side of the outer casing 51 away from the bottom cover 54. The third opening 244 communicates with the second opening 243. A cold plate 20 is provided on the side of the assembly 33 facing the chip 53. The assembly 33 is mounted on the outer casing 51 and seals the third opening 244. The cold plate 20 is mounted on the outer casing 51 of the controller 50 and seals the second opening 243, so as to form a second liquid flow channel 24 on the side of the cold plate 20 facing the cavity 34, that is, the second liquid flow channel 24 is provided on the outer casing 51. The side of the cold plate 20 facing the cavity 34 is provided with at least one of the following: multiple fine teeth 251, fins, heat sink pillars, and three-dimensional heat dissipation plates. At least one of the following components can be located in the second liquid flow channel 24: a fine tooth 251, fins, heat dissipation pillars, and a three-dimensional heat-dissipating plate. A second heat-conducting protrusion 26 is disposed on the side of the cold plate 20 facing the chip 53, and the second heat-conducting protrusion 26 corresponds to the position of the chip 53. A heat-conducting element 55 is disposed on the side of the chip 53 facing the housing 51. When the housing 51 is connected to the bottom cover 54, a space for accommodating the circuit board 52, the chip 53, and the heat-conducting element 55 is formed between the bottom cover 54, the housing 51, and the cold plate 20, so that the second heat-conducting protrusion 26 can be pressed against the chip 53 by the heat-conducting element 55, so that the heat of the circuit board 52 and the chip 53 can be better transferred to the cold plate 20 by the heat-conducting element 55, so that the cold plate 20 can dissipate heat more efficiently. In some embodiments, the second heat-conducting protrusion 26 is integrally formed on the cold plate 20, so as to improve the processing efficiency and ensure the heat dissipation effect of the cold plate 20 on the controller 50.

[0085] In a second embodiment where the cold plate 20 is integrated into the water pump 30, the second heat-conducting boss 26 is connected to the outer casing 51 by friction stir welding to ensure the effect of the second heat-conducting boss 26 sealing the second opening 243.

[0086] The dense teeth 251 refers to a heat dissipation structure with a small spacing between the heat sink fins. The dense teeth 251 are generally distributed in an array. The dense teeth 251 constitute a second heat dissipation feature 25 in this embodiment, so as to ensure the heat exchange efficiency of the second heat dissipation feature 25 by having a high surface area.

[0087] Fins and heat dissipation columns are generally arranged in an array to form another second heat dissipation feature 25 in this embodiment.

[0088] In a second embodiment where the cold plate 20 is integrated into the water pump 30, the second heat dissipation feature 25 is made of at least one of aluminum or copper to ensure the heat exchange efficiency of the second heat dissipation feature 25.

[0089] In a second embodiment where the cold plate 20 is integrated into the water pump 30, the second heat dissipation feature 25 and the second heat-conducting boss 26 are integrally formed to ensure the stability of the connection and heat exchange effect.

[0090] Figures 18 to 20 schematically show a third embodiment in which the cold plate 20 is integrated on the water pump 30. As shown in Figures 18 to 20, the main difference between this embodiment and the second embodiment in which the cold plate 20 is integrated on the water pump 30 is that: the housing of the water pump 30 is independent of the housing 51 of the controller 50; the third inlet 31 of the water pump 30 is connected to the fourth outlet 43 of the radiator 40 through a pipe, and the third outlet 32 ​​of the water pump 30 is connected to the fourth inlet 42 of the radiator 40 through a pipe; the water pump 30 is mounted on the housing 51 to seal the third opening 244.

[0091] In some preferred embodiments, the cold plate 20 is integrated on the controller 50 and located on the side of the housing 51 opposite to the circuit board 52 of the controller 50, so as to dissipate heat from the controller 50 through the cold plate 20.

[0092] Figures 21 to 23 schematically illustrate a first embodiment in which a cold plate 20 is integrated into a controller 50. As shown in Figures 22 and 23, a first liquid flow channel 21 is integrally formed on the housing 51 of the controller 50. The first liquid flow channel 21 is disposed on the side of the housing 51 opposite to the circuit board 52. A first heat dissipation feature 22 is disposed in the first liquid flow channel 21 and is configured to accelerate the heat exchange efficiency between the liquid in the first liquid flow channel 21 and the housing 51. The first liquid flow channel 21 and the first heat dissipation feature 22 constitute a cold plate 20 in one embodiment to accelerate the heat dissipation efficiency of the cold plate 20 and ensure that the liquid in the first liquid flow channel 21 does not seep into the circuit board 52 and chip 53 between the housing 51 and the bottom cover 54 of the controller 50, so as to avoid damage and failure of the circuit board 52 and chip 53 due to water contact. As an embodiment of the first heat dissipation feature 22, as shown in Figures 22 and 23, the first heat dissipation feature 22 includes at least one of a plurality of fins 221, heat dissipation pillars, and a three-dimensional heat dissipation plate. In some embodiments, as shown in FIG23, the fins 221 are integrally formed on the housing 51 to ensure heat dissipation. As shown in FIG21 and FIG22, the first liquid flow channel 21 is connected to the outside through the first inlet 211 and the first outlet 212. For example, the first inlet 211 is connected to the third outlet 32 ​​of the water pump 30 through a pipe, and the first outlet 212 is connected to the third inlet 31 of the water pump 30 through a pipe. As shown in FIG22 and FIG23, a first opening 213 is provided on the side of the housing 51 opposite to the chip 53 to connect the first liquid flow channel 21 to the outside. A first cover 23 is sealed and covered on the first opening 213. The first liquid flow channel 21, the first heat dissipation feature 22, the first cover 23, the first inlet 211 and the first outlet 212 constitute a cold plate 20 in one embodiment. As shown in Figure 23, the first heat-conducting protrusion 511 is integrally formed on the outer shell 51 and is located on the side of the outer shell 51 facing the chip 53 and corresponds to the position of the chip 53, so as to improve processing efficiency.

[0093] In a first embodiment where the cold plate 20 is integrated on the controller 50, as shown in FIG22, the first heat dissipation feature 22 includes fins 221 extending along a first direction X. The first direction X is not parallel to at least one of a second direction Y and a third direction Y'. The second direction Y is the liquid flow direction of the first inlet 211, and the third direction Y' is the liquid flow direction of the first outlet 212. The fins 221 disturb the liquid flowing into the first inlet 211 to improve the heat exchange effect between the fins 221 and the liquid. The liquid flowing through the fins 221 can also be disturbed by the first outlet 212 to slow down the speed of the liquid flowing out of the first outlet 212 and improve the heat exchange effect between the fins 221 and the liquid.

[0094] In the first embodiment where the cold plate 20 is integrated on the controller 50, as shown in FIG23, the controller 50 includes a housing 51, a heat-conducting component 55, a circuit board 52, a chip 53, and a bottom cover 54. When the housing 51 is connected to the bottom cover 54, an accommodating space for accommodating the circuit board 52, the chip 53, and the heat-conducting component 55 is formed between the bottom cover 54 and the housing 51, and the first heat-conducting protrusion 511 can be pressed onto the chip 53 by the heat-conducting component 55.

[0095] Figures 24 to 26 schematically illustrate a second embodiment in which the cold plate 20 is integrated on the controller 50. As shown in Figures 24 and 25, the main difference between this embodiment and the first embodiment in which the cold plate 20 is integrated on the controller 50 is that: the first liquid flow channel 21 is located on the side of the housing 51 facing the circuit board 52; the side of the first liquid flow channel 21 facing the circuit board 52 has a second opening 243, but no first opening 213; the heat dissipation feature is a second heat dissipation feature 25, instead of a first heat dissipation feature 22; and the second heat dissipation feature 25 has a second heat-conducting boss 26 integrally formed or machined on it, instead of a first heat-conducting boss. 511, the second heat-conducting boss 26 is mounted on the housing 51 to seal the second opening 243; the second water inlet 241 and the second water outlet 242 are integrally formed or machined on the housing 51, and the second liquid flow channel 24 communicates with the outside through the second water inlet 241 and the second water outlet 242. For example, the second water inlet 241 is connected to the third water outlet 32 ​​of the water pump 30 through a pipe, and the second water outlet 242 is connected to the third water inlet 31 of the water pump 30 through a pipe, so as to reduce the connection process and improve the preparation and use efficiency. The second liquid flow channel 24, the second heat dissipation feature 25, the second heat-conducting boss 26, the second water inlet 241 and the second water outlet 242 constitute a cold plate 20 in one embodiment.

[0096] In a second embodiment where the cold plate 20 is integrated on the controller 50, as shown in FIG24, the controller 50 includes a housing 51, a heat-conducting component 55, a circuit board 52, a chip 53, and a bottom cover 54. When the housing 51 is connected to the bottom cover 54, a space for accommodating the circuit board 52, the chip 53, and the heat-conducting component 55 is formed between the bottom cover 54, the housing 51, and the cold plate 20, so that the second heat-conducting protrusion 26 can be pressed onto the chip 53 by the heat-conducting component 55.

[0097] Figures 27 to 29 schematically illustrate a third embodiment where the cold plate 20 is integrated onto the controller 50. As shown in Figures 27 to 29, the main difference between this embodiment and the second embodiment where the cold plate 20 is integrated onto the controller 50 is that the second heat dissipation feature 25 does not have a second heat-conducting protrusion 26 integrally formed on it. As shown in Figure 29, a flange edge 252 is integrally formed on the second heat dissipation feature 25, which is used to connect to the housing 51 to seal the second opening 243. As shown in Figure 29, the second heat-conducting protrusion 26 is welded to the flange edge 252 and is located on the side of the second heat dissipation feature 25 facing the chip 53. Exemplarily, the second heat-conducting protrusion 26 is a heat spreader to improve heat conduction. The second liquid flow channel 24, the second heat dissipation feature 25, the flange edge 252, the second inlet 241, and the second outlet 242 constitute a cold plate 20 in one embodiment.

[0098] In a third embodiment where the cold plate 20 is integrated on the controller 50, as shown in FIG27, the controller 50 includes a housing 51, a heat-conducting component 55, a circuit board 52, a chip 53, and a bottom cover 54. When the housing 51 is connected to the bottom cover 54, a space for accommodating the circuit board 52, the chip 53, and the heat-conducting component 55 is formed between the bottom cover 54, the housing 51, and the cold plate 20, so that the second heat-conducting protrusion 26 can be pressed against the chip 53 by the heat-conducting component 55.

[0099] Figures 18 to 20 schematically show a fourth embodiment in which the cold plate 20 is integrated into the controller 50. As shown in Figure 20, a second opening 243 is integrally formed or machined on the side of the housing 51 facing the bottom cover 54, and a third opening 244 is integrally formed or machined on the side of the housing 51 away from the bottom cover 54. The third opening 244 communicates with the second opening 243. When the second heat dissipation feature 25 is sealed and installed on the housing 51, it seals the second opening 243. When the water pump 30 is sealed and installed on the housing 51, it seals the third opening 244, and the cavity 34 of the water pump 30 communicates with the space between the second opening 243 and the third opening 244. The side of the second heat dissipation feature 25 facing the cavity 34 is provided with at least one of a plurality of closely spaced teeth 251, fins, heat dissipation pillars, and a three-dimensional heat dissipation plate. The housing 51 between the second heat dissipation feature 25 and the second opening 243 and the third opening 244 constitutes the cold plate 20 of this embodiment. A second liquid flow channel 24 is formed on the side of the thermal feature 25 facing the cavity 34. The fine teeth 251, fins, heat dissipation pillars, or a three-dimensional heat-dissipating plate are located in the second liquid flow channel 24. A second thermally conductive protrusion 26 is disposed on the side of the second heat dissipation feature 25 facing the chip 53, and the second thermally conductive protrusion 26 corresponds to the position of the chip 53. A thermally conductive element 55 is disposed on the side of the chip 53 facing the housing 51. When the housing 51 is connected to the bottom cover 54, a space is formed between the bottom cover 54, the housing 51, and the cold plate 20 to accommodate the circuit board 52, the chip 53, and the thermally conductive element 55. This allows the second thermally conductive protrusion 26 to be pressed against the chip 53 by the thermally conductive element 55, so that the heat from the circuit board 52 and the chip 53 can be better transferred to the second heat dissipation feature 25 through the thermally conductive element 55, allowing the cold plate 20 to dissipate heat more efficiently. In some embodiments, the second thermally conductive protrusion 26 is integrally formed on the second heat dissipation feature 25 to improve processing efficiency.

[0100] In the fourth embodiment where the cold plate 20 is integrated on the controller 50, the second heat dissipation feature 25 is connected to the housing 51 by friction stir welding to ensure the effect of the second heat dissipation feature 25 sealing the second opening 243.

[0101] In other embodiments where the cold plate 20 is integrated on the controller 50, a first liquid flow channel 21 can also be formed between the outer shell 51 and the second shell body by welding a second shell body onto the outer shell 51.

[0102] In an embodiment of the liquid cooling heat dissipation device, the first heat-conducting protrusion 511 is made of metal (such as copper) and is welded or integrally formed on the outer shell 51 to ensure the heat conduction effect of the first heat-conducting protrusion 511. At this time, the first heat-conducting protrusion 511 also has the effect of uniform heat distribution.

[0103] Figure 5 schematically shows a liquid cooling heat dissipation device for controller 50 according to a second embodiment of this application.

[0104] As shown in Figure 5, the liquid cooling device for the controller 50 includes a cold plate 20, a water pump 30, and a radiator 40. The water pump 30 and the radiator 40 are integrated and set independently of the cold plate 20. The cold plate 20 is used to cool the controller 50. The water pump 30 is used to transport the coolant flowing through the cold plate 20 to the radiator 40 and then to the cold plate 20. The specific implementation of the radiator 40 being integrated into the water pump 30 can adopt the same implementation method as shown in Figures 3 and 4, and will not be described again here. As shown in Figure 5, the third inlet 31 of the water pump 30 is connected to the first outlet 212 of the cold plate 20 through a pipe, and the third outlet 32 ​​of the water pump 30 is connected to the first inlet 211 of the cold plate 20 through a pipe. The cold plate 20 is set on the side of the outer casing 51 of the controller 50 away from the bottom cover 54. This reduces the number of connecting pipes 60 between the water pump 30 and the radiator 40, and allows the cold plate 20 to be placed separately from the water pump 30 and the radiator 40 in a more suitable location as needed, thus ensuring heat dissipation.

[0105] Figure 6 schematically shows a liquid cooling heat dissipation device for controller 50 according to a third embodiment of this application.

[0106] As shown in Figure 6, the liquid cooling device for the controller 50 includes a cold plate 20, a water pump 30, and a radiator 40; the cold plate 20 and the water pump 30 are integrated; the cold plate 20 is used to cool the controller 50; the water pump 30 is used to transport the coolant flowing through the cold plate 20 to the radiator 40 and then back to the cold plate 20. The specific implementation of the cold plate 20 integrated on the water pump 30 can adopt the same implementation method as the first embodiment described above, and will not be repeated here. As shown in Figure 6, the third inlet 31 of the water pump 30 is connected to the fourth outlet 43 of the radiator 40 through a pipe, and the third outlet 32 ​​of the water pump 30 is connected to the fourth inlet 42 of the radiator 40 through a pipe. In some embodiments, as shown in FIG30, when the radiator 40 is set independently, the radiator 40 can be set away from the controller 50. For example, the radiator 40 can be placed in a location with a lower temperature to avoid the high ambient temperature of the radiator 40 affecting the heat dissipation effect of the liquid cooling heat dissipation device for the controller 50.

[0107] Figure 7 schematically shows a liquid cooling heat dissipation device for controller 50 according to a fourth embodiment of this application.

[0108] As shown in Figure 7, the liquid cooling device for the controller 50 includes a cold plate 20, a water pump 30, and a radiator 40; the cold plate 20, water pump 30, and the housing 51 of the controller 50 are integrated; the cold plate 20 is used to cool the controller 50; the water pump 30 is used to transport the coolant flowing through the cold plate 20 to the radiator 40 and then back to the cold plate 20. The specific implementation of the cold plate 20 integrated on the water pump 30 can adopt the same implementation method as the second embodiment described above, which will not be repeated here. As shown in Figure 7, the third inlet 31 of the water pump 30 is connected to the fourth outlet 43 of the radiator 40 through a pipe, and the third outlet 32 ​​of the water pump 30 is connected to the fourth inlet 42 of the radiator 40 through a pipe.

[0109] As one specific embodiment of the heat-conducting component 55, the heat-conducting component 55 can be made of thermally conductive adhesive to ensure that the heat-conducting component 55 can be tightly attached to the surface of the circuit board 52, the chip 53 and the cold plate 20 or the housing 51, so as to ensure the stability of heat conduction.

[0110] The liquid cooling device for the controller 50 of this application integrates at least two of the three components: the cold plate 20, the water pump 30, and the radiator 40. This not only facilitates its connection with the housing 51 of the controller 50 but also reduces the number of components such as pipes 60, thereby lowering costs. Furthermore, by using the cold plate 20 to cool the controller 50 and the water pump 30 to deliver the coolant flowing through the cold plate 20 to the radiator 40 and then back to the cold plate 20, the heat dissipation performance of the liquid cooling device is significantly better than that of air cooling, making it suitable for cooling high-power chips 53 on the vehicle controller 50. Moreover, the coolant in the cooling device is self-circulating, eliminating the need to connect it to the vehicle's water circulation system, thus freeing the liquid cooling device for the controller 50 from reliance on the vehicle's water circulation system.

[0111] In some embodiments, as shown in FIG33, the liquid cooling heat dissipation device for the controller 50 further includes a power supply control module 70. The water pump 30 and the fan 41 of the radiator 40 are connected to the power supply control module 70. The power supply control module 70 is configured to control the timing when the water pump 30 and the fan 41 are connected to the power supply 80 (for example, the power supply control module 70 is configured to control the water pump 30 and the fan 41 to be connected to the power supply 80 only when the controller is in working state; or it is configured to control the water pump 30 and the fan 41 to be connected to the power supply 80 only when the ambient temperature of the controller reaches the preset temperature of the power supply control module), so as to facilitate the power supply control module 70 to adjust the operation of the water pump 30 and the radiator 40.

[0112] In some embodiments, the radiator 40 is integrated into or mounted on the housing 51 or the cooling plate 20. Thus, the liquid cooling device for the controller 50 can be installed simply by connecting the movable platform body (such as a vehicle body) to the housing 51, improving the efficiency of installation, disassembly, and maintenance. In some embodiments, as shown in Figures 31 and 32, the water pump 30 is independently positioned and located away from the controller 50, placing it in a lower temperature location to avoid affecting the heat dissipation effect of the liquid cooling device for the controller 50 due to high temperatures. The water pump 30 can be powered by connecting it to the controller 50 or by being externally powered along with the radiator 40. In some embodiments, the radiator 40 is located on the side of the housing 51 of the controller 50 away from the circuit board 52 of the controller 50, further improving the installation efficiency of the liquid cooling device for the controller 50.

[0113] In some embodiments, the first heat dissipation feature 22 and the second heat dissipation feature 25 may be interchanged as needed.

[0114] According to another aspect of this application, a controller 50 is provided, which includes the liquid cooling heat dissipation device for the controller 50 in any of the foregoing embodiments. Since the heat dissipation performance of the liquid cooling heat dissipation device is significantly better than that of air cooling heat dissipation, it is suitable for heat dissipation of high-power chips 53 on the controller 50, and the coolant of the heat dissipation device is self-circulating, eliminating the need to connect it to an external water circulation system, making it suitable for vehicle-mounted controllers 50; moreover, since at least two of the cold plate 20, water pump 30 and radiator 40 are integrated on the controller 50, the installation and disassembly of the controller 50 are convenient, and the operation is easy.

[0115] According to another aspect of this application, a mobile platform 90 is provided, which includes the aforementioned controller 50. As shown in FIG34, the mobile platform 90 is a vehicle, and the controller 50 is mounted on the door of the mobile platform 90. Since the liquid cooling device of the controller 50 realizes the self-circulation of the coolant, it does not need to be connected to an external water circulation system. When the controller 50 is used in the mobile platform, the pipe connection to the external water circulation system can be eliminated, making operation convenient. In other embodiments, the controller 50 can also be mounted in other locations such as the bottom of the vehicle or the trunk, as needed.

[0116] In other embodiments, the mobile platform 90 may also be a robot, a boat, or other mobile device, and the controller 50 may be used to control the operation of the mobile platform 90.

[0117] In this application, the connection or installation is referred to as a fixed connection unless otherwise specified. A fixed connection can be implemented as a detachable or non-detachable connection commonly used in the prior art. A detachable connection can be implemented using existing technologies, such as threaded connections or keyed connections. A non-detachable connection can also be implemented using existing technologies, such as welding or adhesive bonding.

[0118] The above descriptions are merely some embodiments of this application. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this application, and all such modifications and improvements fall within the scope of protection of this application.

Claims

1. A liquid cooling heat dissipation device for a controller, characterized in that, Includes a cold plate (20), a water pump (30), and a radiator (40); At least two of the cold plate (20), water pump (30) and radiator (40) are integrated; The cold plate (20) is used to cool the controller (50); The water pump (30) is used to transport the coolant flowing through the cold plate (20) to the radiator (40) and then to the cold plate (20).

2. The liquid cooling heat dissipation device for a controller according to claim 1, characterized in that, The water pump (30) is integrated into at least one of the housing (51) of the cold plate (20), the radiator (40), and the controller (50).

3. The liquid cooling heat dissipation device for a controller according to claim 1, characterized in that, The cold plate (20) is integrated or mounted on the housing (51) of the controller (50) and is located on the side of the housing (51) opposite to the circuit board (52) of the controller (50).

4. The liquid cooling heat dissipation device for a controller according to claim 3, characterized in that, The outer casing (51) is provided with a first heat-conducting protrusion (511), which corresponds to the position of the chip (53) on the circuit board (52). The first heat-conducting protrusion (511) is provided on the side of the outer casing (51) facing the circuit board (52) and is used to conduct the heat of the chip (53) into the cold plate (20).

5. The liquid cooling heat dissipation device for a controller according to claim 3, characterized in that, The cold plate (20) includes a first liquid flow channel (21) and a first heat dissipation feature (22). The first liquid flow channel (21) is disposed on the side of the housing (51) away from the circuit board (52). The first heat dissipation feature (22) is disposed in the first liquid flow channel (21) and is configured to accelerate the heat exchange efficiency between the liquid in the first liquid flow channel (21) and the housing (51).

6. The liquid cooling heat dissipation device for a controller according to claim 4, characterized in that, The first heat-conducting boss (511) is integrally formed on the outer shell (51), or the first heat-conducting boss (511) is made of metal and welded to the outer shell (51).

7. The liquid cooling heat dissipation device for a controller according to claim 5, characterized in that, The cold plate (20) also includes a first cover (23); the first liquid channel (21) is integrally processed on the outer shell (51), the first liquid channel (21) has a first opening (213), the first opening (213) faces the side away from the circuit board (52), and the first cover (23) seals the first opening (213).

8. The liquid cooling heat dissipation device for a controller according to claim 5, characterized in that, The first liquid flow channel (21) is connected to the water pump (30) through the first inlet (211) and the first outlet (212).

9. The liquid cooling heat dissipation device for a controller according to claim 8, characterized in that, The first heat dissipation feature (22) includes fins (221) extending along a first direction X, the first direction X being not parallel to at least one of a second direction Y and a third direction Y', the second direction Y being the liquid flow direction of the first inlet (211), and the third direction Y' being the liquid flow direction Y' of the first outlet (212).

10. The liquid cooling heat dissipation device for a controller according to claim 4, characterized in that, At least one of the circuit board (52) and the chip (53) of the controller (50) is provided with a heat-conducting element (55) on the side facing the housing (51).

11. The liquid cooling heat dissipation device for a controller according to claim 2, characterized in that, The cold plate (20) includes a second liquid flow channel (24) and a second heat dissipation feature (25). The second liquid flow channel (24) is disposed on the housing (51) and on the side of the housing (51) facing the circuit board (52) of the controller (50). The second liquid flow channel (24) has a second opening (243) facing the side of the circuit board (52) of the controller (50). The second heat dissipation feature (25) is disposed on a second heat-conducting protrusion (26). When the second heat-conducting protrusion (26) seals and covers the second opening (243), the second heat dissipation feature (25) is located in the second liquid flow channel (24). The second heat-conducting protrusion (26) is disposed on the housing (51) at a position corresponding to the chip (53) on the circuit board (52) and is used to conduct the heat of the chip (53) into the cold plate (20).

12. The liquid cooling heat dissipation device for a controller according to claim 11, characterized in that, The second heat dissipation feature (25) includes multiple dense teeth (251).

13. The liquid cooling heat dissipation device for a controller according to claim 11, characterized in that, The second heat-conducting boss (26) is connected to the outer shell (51) by friction stir welding.

14. The liquid cooling heat dissipation device for a controller according to claim 11, characterized in that, The water pump (30) has part of its housing and outer shell (51) integrally formed.

15. The liquid cooling heat dissipation device for a controller according to claim 11, characterized in that, The second heat dissipation feature (25) is made of at least one of aluminum or copper.

16. The liquid cooling heat dissipation device for a controller according to claim 11, characterized in that, The second heat dissipation feature (25) is integrally formed with the second heat-conducting boss (26).

17. The liquid cooling heat dissipation device for a controller according to claim 11, characterized in that, The second heat dissipation feature (25) is provided with a flange edge (252), which is welded to a second heat-conducting boss (26), and the second heat-conducting boss (26) is a heat-spreading block.

18. The liquid cooling heat dissipation device for a controller according to claim 11, characterized in that, A third opening (244) is provided on the side of the outer casing (51) away from the circuit board (52). The third opening (244) is connected to the second liquid flow channel (24). The water pump (30) is sealed and covered on the third opening (244) and forms a closed cavity (34) with the second liquid flow channel (24).

19. The liquid cooling heat dissipation device for a controller according to claim 11, characterized in that, The second liquid flow channel (24) is connected to the water pump (30) through the second inlet (241) and the second outlet (242).

20. The liquid cooling heat dissipation device for a controller according to claim 11, characterized in that, At least one of the second liquid flow channel (24), the second inlet (241), and the second outlet (242) is integrally formed on the outer shell (51).

21. The liquid cooling heat dissipation device for a controller according to claim 2, characterized in that, The water pump (30) is located on the side of the cold plate (20) away from the outer casing (51).

22. The liquid cooling heat dissipation device for a controller according to claim 2, characterized in that, The water pump (30) is located on one side of the radiator (40).

23. The liquid cooling heat dissipation device for a controller according to claim 2, characterized in that, It also includes a power supply control module (70), and the water pump (30) and the fan (41) of the radiator (40) are connected to the power supply control module (70). The power supply control module (70) is configured to control the timing when the water pump (30) and the fan (41) are connected to the power supply (80).

24. The liquid cooling heat dissipation device for a controller according to claim 22, characterized in that, The radiator (40) is integrated on the side of the cold plate (20) away from the outer casing (51).

25. The liquid cooling heat dissipation device for a controller according to any one of claims 2 to 24, characterized in that, At least one of the water pump (30) and the radiator (40) is integrated into or mounted on the housing (51).

26. The liquid cooling heat dissipation device for a controller according to claim 1, characterized in that, The water pump (30) is set up independently and is located away from the controller (50).

27. The liquid cooling heat dissipation device for a controller according to claim 26, characterized in that, The radiator (40) is located on the side of the housing (51) of the controller (50) away from the circuit board (52) of the controller (50).

28. A controller, characterized in that, Includes the liquid cooling heat dissipation device for the controller as described in any one of claims 1 to 27.

29. A mobile platform (90), characterized in that, Includes the controller as described in claim 28.

Images