Thermal management system and vehicle

Abstract

A thermal management system and a vehicle, which are applied in the technical field of thermal management. The thermal management system comprises a first electronic component (101), a battery (102), a first multi-way valve device (104), an electric drive device (117), and a radiator (105). A first line where the first electronic component (101) is located and a second line where the battery (102) is located are connected in parallel, or the first electronic component (101) and the battery (102) are connected in series by means of a pipe. The temperature of a coolant in a circuit where the battery (102) is located is lower than a first temperature threshold. The first temperature threshold is the maximum temperature that the first electronic component (101) can withstand during normal operation. When the temperature of the coolant at the position of the electric drive device (117) is lower than a second temperature threshold, heat is dissipated from the first electronic component (101) by means of a circuit where the electric drive device (117) is located. The thermal management system is capable of reducing power consumption while dissipating heat from low-temperature components.

Description

Thermal management system and vehicle Technical Field

[0001] This application relates to the field of thermal management technology, specifically to thermal management systems and vehicles. Background Technology

[0002] With the development of intelligent vehicles, the components deployed in these vehicles are becoming increasingly diverse. Some of these components have lower temperature requirements than others. These components with lower temperature requirements can be called low-temperature components. Examples of low-temperature components include: various domain controllers such as intelligent driving control modules or intelligent cockpit controllers deployed to meet high computing power needs; ambient lighting deployed to meet in-vehicle ambiance requirements; projectors deployed for viewing purposes, and so on. To meet the low-temperature requirements of these components, heat dissipation can be achieved through the vehicle's thermal management system when the component's temperature becomes too high. However, how to achieve heat dissipation for low-temperature components while saving power consumption requires further research. Summary of the Invention

[0003] This application provides a thermal management system and vehicle that can save power consumption while achieving heat dissipation of low-temperature components.

[0004] In a first aspect, this application provides a thermal management system, which includes a first electronic component, a battery, a first multi-way valve device, an electric drive device, and a heat sink.

[0005] The first conduit containing the first electronic component and the second conduit containing the battery are connected in parallel, or the first electronic component and the battery are connected in series via conduits. The coolant temperature in the circuit containing the battery is lower than a first temperature threshold. The first temperature threshold is the highest tolerable temperature for the first electronic component during normal operation.

[0006] The first multi-way valve device includes a first connection state between at least two interfaces. This first connection state is used to connect the first multi-way valve device, the first electronic component, the electric drive device, and the heat sink in series to form a target circuit. The target circuit is used to dissipate heat to the first electronic component when the coolant temperature at the location of the electric drive device is lower than a second temperature threshold. The second temperature threshold is less than or equal to the first temperature threshold and greater than a third temperature threshold.

[0007] In the above scheme, since the highest tolerable temperature of the first electronic component during normal operation is a first temperature threshold, the temperature of the coolant used to dissipate heat from the first electronic component must be lower than the first temperature threshold (e.g., around 50°C). Therefore, the first electronic component can be connected in parallel or series with the battery to meet the low-temperature requirements of the first electronic component. This is because the temperature of the circuit where the battery is located is generally lower than the first temperature threshold. Thus, this connection can utilize the coolant in the battery circuit to dissipate heat from the first electronic component, ensuring that the coolant temperature does not exceed the highest temperature the first electronic component can withstand, i.e., it does not exceed the first temperature threshold. Furthermore, in the above thermal management system, when the temperature of the circuit where the electric drive device is located (referred to as the electric drive circuit) is low—for example, when the coolant temperature at the location of the electric drive device is lower than the second temperature threshold but higher than the third temperature threshold, i.e., when the electric drive circuit needs heat dissipation—the first multi-way valve device can connect the first electronic component, the electric drive device, and the heat sink to form a target circuit, thereby achieving heat dissipation for the first electronic component. This eliminates the need to specifically turn on the compressor to dissipate heat from the first electronic component, saving compressor power consumption.

[0008] In one possible implementation, the thermal management system further includes a second loop comprising a refrigerant passage for the compressor and the first heat exchanger. The first multi-way valve device includes a third connection state between at least two interfaces, which enables a series connection of the first multi-way valve device, the first electronic component, and the coolant passage for the first heat exchanger. The second loop is used to absorb heat from the first electronic component via the first heat exchanger when the coolant temperature at the location of the electric drive device is higher than a second temperature threshold.

[0009] In the above scheme, when the temperature of the electric drive circuit is high, for example, if the coolant temperature at the location of the electric drive unit exceeds the second temperature threshold, the heat sink in the electric drive circuit can no longer dissipate heat for the first electronic component. Otherwise, the excessively hot coolant would damage the performance of the first electronic component. Therefore, the compressor can be activated to dissipate heat from the first electronic component, ensuring timely heat dissipation for the first electronic component.

[0010] In one possible implementation, where the first pipeline containing the first electronic component and the second pipeline containing the battery are connected in parallel, the thermal management system further includes a water pump and a second multi-way valve. The water pump and the first electronic component are connected in series via pipelines to form a first loop. The inlet of the first loop is connected to the inlet of the second pipeline via the second multi-way valve, and the outlet of the first loop is connected to the outlet of the second pipeline. This connection allows the first electronic component to have its own dedicated first loop. Operating this loop allows the coolant in the loop to mix with coolant from other loops, reducing the adverse effects of the coolant temperature from other loops on the first electronic component. Furthermore, the inclusion of a water pump in the first loop facilitates the circulation of coolant within the loop, improving the heat dissipation efficiency of the first electronic component.

[0011] In one possible implementation, the thermal management system further includes a second loop, which includes a refrigerant passage for the compressor and the first heat exchanger. The first multi-way valve device includes a second connection state between at least two interfaces, which is used to connect the first multi-way valve device, the first electronic component, and the coolant passage of the first heat exchanger in series. The second loop is used to absorb heat from the first electronic component through the first heat exchanger when the compressor is turned on to cool or heat the cabin.

[0012] In the above scheme, when the compressor is used to cool or heat the passenger compartment, the coolant passages of the first electronic component and the first heat exchanger can be connected in series via a first multi-way valve device, allowing the second circuit to recover heat from the first electronic component. This achieves both heat dissipation for the first electronic component and provides the heat required for compressor operation, realizing heat recovery and utilization. Furthermore, since there is an inherent need to operate the compressor, it can be used to actively cool the first electronic component, reducing the noise generated by specifically operating the compressor for cooling the first electronic component.

[0013] In one possible implementation, when the compressor is turned on to heat the crew compartment, the third circuit containing the coolant passages of the first electronic component and the first heat exchanger also includes an electric drive unit.

[0014] In the above scheme, when it is necessary to turn on the air conditioner (i.e. turn on the compressor) for heating, the circuit where the first electronic component is located may also include an electric drive device to realize the heat recovery and utilization of the electric drive device.

[0015] In one possible implementation, when the compressor is turned on to heat the crew compartment, and the third circuit, which contains the coolant passages for the first electronic components and the first heat exchanger, also includes an electric drive unit, the third circuit bypasses the radiator.

[0016] In the above scheme, the third circuit also bypasses the radiator to reduce heat loss into the air and improve the heat recovery and utilization rate.

[0017] In one possible implementation, with a water pump and a first electronic component connected in series via a pipe to form a first loop, the inlet of the first loop connected to the inlet of a second pipe via a second multi-way valve, and the outlet of the first loop connected to the outlet of the second pipe, the thermal management system includes a fourth loop, which includes the second pipe. The second multi-way valve is used to introduce coolant from the fourth loop into the first loop when the battery is heated via the fourth loop and the first electronic component needs to dissipate heat. The water pump in the first loop is used to drive the circulation of coolant in the first loop.

[0018] In the above scheme, because the first electronic component is located in a relatively independent first circuit, when heat dissipation is needed for the first electronic component during battery heating, the coolant from the battery heating circuit (i.e., the fourth circuit) is introduced into the first circuit to dissipate heat from the first electronic component. This allows the introduced coolant to mix with the coolant in the first circuit, achieving a smooth temperature change at the inlet of the first electronic component, thereby reducing condensation at the inlet of the first electronic component due to sudden temperature changes. In this implementation, the water temperature in the fourth circuit is lower than the temperature of the first electronic component.

[0019] In one possible implementation, the aforementioned fourth circuit also includes a warm air core and a water heater.

[0020] In the above scheme, the water temperature can be heated by a water heater to heat the battery.

[0021] In one possible implementation, with a water pump and a first electronic component connected in series via a pipe to form a first loop, the inlet of the first loop connected to the inlet of a second pipe via a second multi-way valve, and the outlet of the first loop connected to the outlet of the second pipe, the thermal management system includes a fifth loop, which includes the second pipe. The second multi-way valve is used to introduce coolant from the fifth loop into the first loop when the battery needs cooling through the fifth loop and the first electronic component also needs cooling. The water pump in the first loop is used to drive the circulation of coolant in the first loop.

[0022] In the above scheme, since the first electronic component is designed to be located in a relatively independent first circuit, when the first electronic component needs to be cooled during the battery cooling process, the coolant of the battery cooling circuit (i.e., the fifth circuit) is introduced into the first circuit to achieve the cooling of the first electronic component. This allows the introduced coolant to mix with the coolant in the first circuit, achieving a smooth temperature change of the coolant at the inlet of the first electronic component, thereby reducing the condensation at the inlet of the first electronic component caused by sudden temperature changes of the coolant.

[0023] In one possible implementation, the thermal management system further includes a second loop comprising a refrigerant passage for the compressor and the first heat exchanger. A fifth loop also includes a coolant passage for the first heat exchanger, and the second loop is used to absorb heat from the fifth loop via the first heat exchanger.

[0024] In the above scheme, heat dissipation of the battery and the first electronic component can be achieved by turning on the compressor and exchanging heat between the circuits through a heat exchanger.

[0025] In one possible implementation, the second multi-way valve device is a four-way valve. The inlet of the first circuit is connected to the battery inlet via the second multi-way valve device, comprising: a first port of the four-way valve connected to the inlet of the first circuit, a second port of the four-way valve connected to the battery inlet, and a third port of the four-way valve also connected to the battery outlet.

[0026] In the above scheme, a four-way valve is used to connect the first circuit to the battery. This connection allows the battery to be bypassed when heating or cooling is not required, enabling heat dissipation for the first electronic component independently. This allows for more precise temperature control of the first electronic component in the first circuit.

[0027] Secondly, embodiments of this application also provide a vehicle that includes a thermal management system as described in any of the first aspects above. Attached Figure Description

[0028] Figures 1 to 5 are schematic diagrams of the thermal management system provided in the embodiments of this application.

[0029] Figures 6 to 8 are schematic diagrams of the circuits included in the thermal management system provided in the embodiments of this application.

[0030] Figures 8A to 8C are schematic diagrams of the circuits included in the thermal management system provided in the embodiments of this application.

[0031] Figures 9 to 20 are schematic diagrams of the circuits included in the thermal management system provided in the embodiments of this application.

[0032] Reference numerals: First electronic component - 101; Battery - 102; Compressor - 103; First multi-way valve device - 104; Radiator - 105; First heat exchange device - 106; Second heat exchange device - 107; Warm air core - 108; Evaporator - 109; Heater - 110; First water pump - 111; Second water pump - 112; Third water pump - 113; First three-way valve - 114; Second three-way valve - 115; Check valve - 116; Electric drive device - 117 and kettle - 118; Fourth water pump - 119; Four-way valve - 120; Second three-way interface - 121; First valve device - 122; Second valve device - 123. Detailed Implementation

[0033] In this application embodiment, "multiple" refers to two or more. In this application embodiment, "and / or" is used to describe the association relationship of related objects, indicating three relationships that can exist independently. For example, A and / or B can mean: A exists alone, B exists alone, or A and B exist simultaneously. The description methods used in this application embodiment, such as "at least one of a1, a2, ... and an (or at least one of them)," include the case where any one of a1, a2, ... and an exists alone, as well as the case where any combination of any multiple of a1, a2, ... and an exists alone. Each case can exist alone. For example, the description method of "at least one of a, b, and c" includes the cases where a, b, c, a and b combined, a and c combined, b and c combined, or a, b, and c combined.

[0034] In this application, the terms "first," "second," etc., are used to distinguish identical or similar items with substantially the same function. It should be understood that there is no logical or temporal dependency between "first," "second," and "nth," nor does it limit the quantity or order of execution. It should also be understood that although the following description uses the terms "first," "second," etc., to describe various elements, these elements should not be limited by the terms. These terms are merely used to distinguish one element from another.

[0035] In the various embodiments of this application, unless otherwise specified or in case of logical conflict, the terminology and / or descriptions between the various embodiments are consistent and can be referenced by each other. Technical features in different embodiments can be combined to form new embodiments according to their inherent logical relationships.

[0036] For example, the connection described in the embodiments of this application refers to the connection between components through pipes, or through coolant channels or refrigerant channels, or the connection achieved by adjusting related valve devices, etc.

[0037] Exemplary examples show that the components in the thermal management system of this application are all provided with channels for implementing component thermal management. The pipes described in this application are channels connecting components. For example, if component A and component B are connected by pipe C, then the outlet of component A's thermal management channel is connected to one end of pipe C, and the inlet of component B's thermal management channel is connected to the other end of pipe C. Alternatively, the outlet of component B's thermal management channel is connected to one end of pipe C, and the inlet of component A's thermal management channel is connected to the other end of pipe C. For ease of description, in the following description, the thermal management channel connecting the components will be simply referred to as connecting the component.

[0038] Furthermore, the piping described in this application embodiment is part of a thermal management loop, and the piping may include components and connecting pipes. For example, suppose a loop includes component 1, component 2, and component 3, where the outlet of the thermal management channel of component 1 and the inlet of the thermal management channel of component 2 are connected by pipe 1, the outlet of the thermal management channel of component 2 and the inlet of the thermal management channel of component 3 are connected by pipe 2, and the outlet of the thermal management channel of component 3 and the inlet of the thermal management channel of component 1 are connected by pipe 3. Then, component 1, pipe 1, and component 2 can be a single section of piping. Alternatively, pipe 1, component 2, and pipe 2 can also be a single section of piping. It is understood that the description herein is merely illustrative and does not constitute a limitation on the embodiments of this application.

[0039] This application provides a thermal management system and a vehicle that can save power while achieving heat dissipation for low-temperature components. The thermal management system provided in this application is applicable to vehicles and other thermal management scenarios with thermal management requirements. For example, it is suitable for thermal management scenarios such as cold storage, server cluster cooling, or data center cooling. This application does not limit the specific application scenario.

[0040] Exemplarily, this application primarily uses vehicle application scenarios as examples. Exemplarily, the embodiments of this application can be applied to both new energy vehicles and traditional fuel vehicles. The new energy vehicle is a mode of transportation driven by an electric drive system. New energy vehicles can be pure electric vehicles (pure EV / battery EV), hybrid electric vehicles (HEV), range-extended electric vehicles (REEV), plug-in hybrid electric vehicles (PHEV), etc. It is understood that the examples listed here are merely illustrative, and there are many types of new energy vehicles, which will not be described in detail in this application.

[0041] Exemplarily, the thermal management system of this application embodiment can heat or dissipate heat to the managed object using a coolant. In this application, the coolant is used to transfer heat energy. In some possible implementations, the thermal management system of this application can also use a coolant and a refrigerant to heat or dissipate heat to the managed object. The refrigerant can transfer heat through evaporation and condensation. In some possible implementations, the managed object can be a passenger compartment, a battery, an electric drive unit, or a control system, etc. The electric drive unit may include, for example, an electric motor, a motor controller, and a transmission mechanism.

[0042] For example, in some other possible implementations, the managed object may include components with lower temperature requirements than general components. Such components with lower temperature requirements can be called cryogenic components. For example, taking cryogenic components included in a vehicle as an example, these components may include: various domain controllers such as intelligent driving control modules or intelligent cockpit controllers deployed for high computing power requirements; ambient lighting deployed for vehicle interior ambiance requirements; projectors deployed for movie viewing requirements, etc. It is understood that the description of cryogenic components herein is merely illustrative and does not constitute a limitation on the embodiments of this application.

[0043] Because cryogenic components have lower temperature requirements, heat dissipation can be achieved through the vehicle's thermal management system when their temperature becomes too high. However, the coolant temperature in the circuit used to cool the electric drive unit in traditional thermal management systems can reach 65°C or even higher. However, to meet the low-temperature requirements of cryogenic components and prevent high temperatures from damaging their performance, the maximum coolant temperature requirement in the circuit used to cool cryogenic components is lower, for example, not exceeding 50°C. Therefore, traditional circuits used to cool the electric drive unit are not suitable for cooling cryogenic components. Setting up a separate circuit for cooling cryogenic components would increase cost and power consumption.

[0044] Based on the above description, in order to achieve heat dissipation of low-temperature components while saving power consumption, embodiments of this application provide a thermal management system. This is described exemplarily below.

[0045] For example, the thermal management system provided in the embodiments of this application includes at least a first electronic component, a battery, a first multi-way valve device, an electric drive device, and a heat sink.

[0046] For example, the highest tolerable temperature of the first electronic component during normal operation is a first temperature threshold. Therefore, when dissipating heat from the first electronic component, the temperature of the coolant in the circuit containing the first electronic component must be lower than the first temperature threshold to avoid damaging the first electronic component. This first temperature threshold can be any value between 45°C and 55°C. The aforementioned first electronic component can be, for example, the low-temperature component described above. For instance, taking a component in a vehicle as an example, the first electronic component can include, but is not limited to, one or more of the following: various domain controllers such as intelligent driving control modules or intelligent cockpit controllers, ambient lighting or projectors in the vehicle, etc. It is understood that the description of the first electronic component herein is merely illustrative and does not constitute a limitation on the embodiments of this application.

[0047] For example, if the thermal management system described above is a thermal management system in a vehicle, then the battery described above may be, for example, a power battery in a vehicle.

[0048] For example, the first multi-way valve device described above may be a nine-way valve. Alternatively, the first multi-way valve device may include a five-way valve and a four-way valve. Or, the first multi-way valve device may include multiple other multi-way valves. The embodiments of this application do not limit the composition of the first multi-way valve device. The following description uses a nine-way valve as an example of the first multi-way valve device.

[0049] In one possible implementation, the aforementioned first electronic component and the aforementioned battery can be connected in parallel, as exemplarily shown in Figure 1. Figure 1 exemplarily illustrates a possible schematic diagram of a thermal management system provided in an embodiment of this application. It can be seen that the thermal management system includes a first electronic component 101, a battery 102, a compressor 103, a first multi-way valve device 104, and a radiator 105. Furthermore, the thermal management system may also include a first heat exchange device 106, a second heat exchange device 107, a heater core 108, an evaporator 109, a heater 110, a first water pump 111, a second water pump 112, a third water pump 113, a first three-way valve 114, a second three-way valve 115, a one-way valve 116, an electric drive device 117, and a kettle 118. These components included in the thermal management system can be connected via pipes and various interfaces; specific connection methods are shown in Figure 1 and will not be elaborated here.

[0050] For example, in a specific implementation, the above-mentioned thermal management system may further include a controller (not shown in Figure 1). The controller can be used to control various devices in the thermal management system, such as the compressor, valves, water pumps, and heat exchangers in the thermal management system, etc., and the embodiments of this application do not limit this.

[0051] For example, in Figure 1, the first multi-way valve device 104 is a nine-way valve. It can be seen that this nine-way valve includes nine ports: port 1, port 2, port 3, ..., port 9. The controller of the thermal management system can control the connection of any two of these nine ports. For example, in another implementation, the nine-way valve in Figure 1 can also be replaced by a combination of multiple multi-way valves, i.e., the first multi-way valve device 104 is a combination of these multi-way valves. Considering this combination of multi-way valves as a whole, it can similarly include nine ports, which will not be elaborated here. For example, the controller can control the connection state between multiple ports in the first multi-way valve device 104. Different connection states can be used to form different thermal management loops, thereby meeting different thermal management requirements. Specific possible connection states will be discussed later and will not be detailed here.

[0052] For example, the first heat exchange device 106 described above may include a refrigerant passage and a coolant passage. As shown in FIG1, d 11 Indicates the inlet of the refrigerant channel, d 12 This indicates the outlet of the refrigerant channel, d 13Indicates the inlet of the coolant passage, d 14 This indicates the outlet of the coolant passage. For example, the first heat exchange device 106 may be a cooler.

[0053] For example, the second heat exchange device 107 described above may include a refrigerant passage and a coolant passage. As shown in FIG1, d 21 Indicates the inlet of the refrigerant channel, d 22 This indicates the outlet of the refrigerant channel, d 23 Indicates the inlet of the coolant passage, d 24 This indicates the outlet of the coolant passage. For example, the second heat exchanger 107 may be a condenser.

[0054] For example, as shown in Figure 1 above, the first pipeline containing the first electronic component 101 and the second pipeline containing the battery 102 are connected in parallel, or in other words, the first electronic component 101 and the battery 102 are connected in parallel. The first pipeline includes a pipe connecting the first three-way valve 114 and the first electronic component 101, the first electronic component 101, and a pipe connecting the first electronic component 101 and the first three-way interface 1117. The second pipeline includes a pipe connecting the first three-way valve 114 and the battery 102, the battery 102, and a pipe connecting the battery 102 and the first three-way interface 1117. Specifically, the first electronic component 101 is connected to the battery 102 circuit through the first three-way valve 114 and the first three-way interface 1117. The coolant inlet of the first electronic component 101 is connected to one interface of the first three-way valve 114. The coolant inlet of the battery 102 is connected to another interface of the first three-way valve 114. The third interface of the first three-way valve 114 can be connected to the outlet of the second water pump 112. The coolant outlet of the first electronic component 101 is connected to one port of the first three-way connector 1117. The coolant outlet of the battery 102 is connected to the other port of the first three-way connector 1117. The third port of the first three-way connector 1117 can be connected to port 4 of the nine-way valve. Because the coolant temperature in the circuit where the battery 102 is located is lower than the aforementioned first temperature threshold, connecting the first electronic component 101 in parallel to the circuit where the battery is located can meet the low-temperature requirements of the first electronic component 101.

[0055] In another possible implementation, the first electronic component and the battery can be connected in series, as exemplarily shown in Figure 2. Figure 2 exemplarily illustrates another possible schematic diagram of the thermal management system provided in this application embodiment. It can be seen that, compared to the thermal management system shown in Figure 1, in the thermal management system shown in Figure 2, the first electronic component 101 and the battery 102 are connected in series via pipes. In Figure 2, the coolant inlet of the battery 102 is connected to the outlet of the second water pump 112. The coolant outlet of the battery 102 is connected to the coolant inlet of the first electronic component 101. The coolant outlet of the first electronic component 101 can be connected to the interface 4 of the nine-way valve. In another possible implementation, as shown in Figure 3, the coolant inlet of the first electronic component 101 can be connected to the outlet of the second water pump 112. The outlet of the first electronic component 101 is connected to the coolant inlet of the battery 102. The coolant outlet of the battery 102 can be connected to the interface 4 of the nine-way valve. Similarly, since the coolant temperature of the circuit where the battery 102 is located is lower than the first temperature threshold mentioned above, connecting the first electronic component 101 in series to the circuit where the battery is located can meet the low temperature requirements of the first electronic component 101.

[0056] In another possible implementation, the target component, consisting of a first circuit including the aforementioned first electronic component, and the aforementioned battery are connected in parallel, as exemplarily shown in Figure 4 or Figure 5. Figure 4 or Figure 5 exemplarily illustrates another possible schematic diagram of the thermal management system provided in an embodiment of this application.

[0057] For example, as shown in Figure 4 or Figure 5, the first conduit containing the first electronic component 101 and the second conduit containing the battery 102 are connected in parallel. A description of this parallel connection can be found in the relevant introduction of Figure 1 above, and will not be repeated here. Furthermore, unlike Figure 1, in Figures 4 and 5, the thermal management system also includes a fourth water pump 119, and the fourth water pump 119 and the first electronic component 101 are connected in series via pipes to form a first loop L1. The first loop L1 can be considered as a single unit, which is the aforementioned target component.

[0058] For example, as shown in Figure 4, the target component includes the aforementioned first circuit L1. The first circuit L1 includes a first electronic component 101 and a fourth water pump 119. The fourth water pump 119 drives the coolant circulation in the first circuit. The target component and the battery 102 are connected in parallel. Specifically, the target component is connected to the battery 102 circuit via a first three-way valve 114 and a first three-way connector 1117. That is, the inlet of the first circuit L1 is connected to the inlet of the battery 102 via the first three-way valve 114, and the outlet of the first circuit L1 is connected to the outlet of the battery 102 via the first three-way connector 1117. The coolant inlet of the target component (i.e., the first circuit L1) is connected to one port of the first three-way valve 114. The coolant inlet of the battery 102 is connected to another port of the first three-way valve 114. The third port of the first three-way valve 114 can be connected to the outlet of the second water pump 112. The coolant outlet of the target component (i.e., the first circuit L1) is connected to one port of the first three-way connector 1117. The coolant outlet of battery 102 is connected to another port of the first three-way connector 1117. The third port of the first three-way connector 1117 can be connected to port 4 of the nine-way valve. Because the coolant temperature in the circuit where battery 102 is located is lower than the aforementioned first temperature threshold, connecting the target component in parallel to the circuit where the battery is located can meet the low-temperature requirements of the first electronic component 101.

[0059] For example, referring to Figure 5, compared to Figure 4 above, the difference in Figure 5 is that the first three-way valve 114 is replaced by a four-way valve 120, and a second three-way interface 121 is provided between the first three-way interface 1117 and the coolant outlet of the battery 102. The coolant inlet of the target component (i.e., the first circuit L1) is connected to one interface of the four-way valve 120. The coolant inlet of the battery 102 is also connected to one interface of the four-way valve 120. One interface of the four-way valve 120 can be connected to the outlet of the second water pump 112. One interface of the four-way valve 120 can be connected to one interface of the second three-way interface 121, i.e., connected to the coolant outlet of the battery 102. Furthermore, one interface of the second three-way interface 121 is connected to one interface of the first three-way interface 1117. Another interface of the second three-way interface 121 is connected to the coolant outlet of the battery 102. The remaining connections are referenced in Figure 4 and will not be repeated here. Because the coolant temperature in the circuit containing battery 102 is lower than the aforementioned first temperature threshold, connecting the target component in parallel to the circuit containing the battery can meet the low-temperature requirements of the first electronic component 101. Furthermore, in the thermal management system shown in Figure 5, due to the addition of a pipe between the four-way valve 120 and the second three-way interface 121, the interface connecting the four-way valve 120 and the second three-way interface 121 can be opened when the battery 102 does not require heating or cooling, and the interface connecting the four-way valve 120 and the battery 102 can be closed. This bypasses the battery 102, thereby enabling more precise temperature control of the first electronic component 101.

[0060] For example, for ease of subsequent description, the first three-way valve 114 or four-way valve 120 described above can be collectively referred to as the second multi-way valve device.

[0061] It is understood that the thermal management systems shown in Figures 1 to 5 are merely examples and do not constitute a limitation on the embodiments of this application. For example, the heater 110 in the above-described thermal management system can be located in other coolant circuits within the thermal management system, and is not limited to the positions shown in Figures 1 to 5. In other possible implementations, the thermal management system can be modified, or may include more or fewer components, and the embodiments of this application do not impose any limitations on this.

[0062] Exemplarily, in one possible implementation, in the thermal management system provided in this application embodiment, such as the thermal management system shown in any of Figures 1 to 5 above, the connection state between the multiple interfaces of the first multi-way valve device 104 includes a first connection state. The first connection state can be used to realize the series connection of the first multi-way valve device 104, the first electronic component 101, the electric drive device 117, and the heat sink 105 to form a target loop. This target loop is used to dissipate heat to the first electronic component 101 when the coolant temperature at the location of the electric drive device 117 is lower than a second temperature threshold.

[0063] For example, the second temperature threshold may be less than or equal to the first temperature threshold. Furthermore, the second temperature threshold may be greater than the third temperature threshold. This is because heat dissipation is only required when a certain temperature is reached, hence the second temperature threshold is greater than the third temperature threshold. This application embodiment does not limit the value of this temperature threshold.

[0064] For example, the coolant temperature at the location of the electric drive device 117 may be, for example, the temperature at the outlet of the thermal management channel of the electric drive device 117. Alternatively, in another possible implementation, the coolant temperature at the location of the electric drive device 117 may be, for example, the temperature of the coolant in the thermal management channel of the electric drive device 117. Alternatively, in another possible implementation, the coolant temperature at the location of the electric drive device 117 may be, for example, the temperature at the inlet of the thermal management channel of the electric drive device 117.

[0065] To facilitate understanding of the above implementation, an example is provided below.

[0066] For example, if the coolant temperature at the location of the electric drive unit 117 is lower than the second temperature threshold, but there is no need to turn on the compressor 103 to cool or heat the passenger compartment, the connection state inside the first multi-way valve device 104 (e.g., a nine-way valve) can be controlled to the first connection state to form the aforementioned target circuit. For ease of understanding, please refer to Figures 6, 7, or 8 for examples. Figure 6 is an example of the thermal management system shown in Figure 1 above. Figure 7 is an example of the thermal management system shown in Figure 2 above. Figure 8 is an example of the thermal management system shown in Figure 4 above.

[0067] Referring to Figure 6, the interfaces 2 and 7, 3 and 4, and 5 and 6 of the first multi-way valve device 104 (i.e., the nine-way valve) can be connected. This controls the internal connection state of the nine-way valve to the first connected state, thereby forming the aforementioned target loop. Specifically, referring to Figure 6, this target loop can be exemplarily represented by a loop with thickened pipes. This target loop can be circulated by driving the coolant through the second water pump 112 and / or the third water pump 113. For example, driven by the second water pump 112 and / or the third water pump 113, the coolant in the target loop flows to the first electronic component 101 through the first three-way valve 114. After flowing out of the first electronic component 101, the coolant flows through the first three-way interface 1117 to the interface 4 of the nine-way valve. Since interface 4 is connected to interface 3, the coolant flows out of the nine-way valve from interface 3 and into the coolant channel of the first heat exchanger 106. After flowing out of the coolant channel of the first heat exchanger 106, the coolant flows to the interface 6 of the nine-way valve. Interface 6 is connected to interface 5, so coolant flows from interface 5 out of the nine-way valve and into radiator 105. After flowing out of radiator 105, the coolant passes through electric drive unit 117 and third water pump 113, and then flows to interface 2 of the nine-way valve. Interface 2 is connected to interface 7, so coolant flows from interface 7 out of the nine-way valve and passes through second water pump 112 and first three-way valve 114 into first electronic component 101. This forms the target circuit. In one possible implementation, in this target circuit, radiator 105 can be turned on to dissipate heat from the first electronic component 101 and electric drive unit 117.

[0068] Referring to Figure 7, similarly, the interfaces 2 and 7, 3 and 4, and 5 and 6 of the first multi-way valve device 104 (i.e., the nine-way valve) can be connected to form the aforementioned target circuit. Specifically, referring to Figure 7, this target circuit can be exemplarily represented by a target circuit with a thickened pipe. This target circuit can be circulated by the coolant driven by the second water pump 112 and / or the third water pump 113. For example, driven by the second water pump 112 and / or the third water pump 113, the coolant in the target circuit flows sequentially to the battery 102 and the first electronic component 101. After flowing out of the first electronic component 101, the coolant flows to interface 4 of the nine-way valve. Since interface 4 is connected to interface 3, the coolant flows out of the nine-way valve from interface 3 and into the coolant channel of the first heat exchanger 106. After flowing out of the coolant channel of the first heat exchanger 106, the coolant flows to interface 6 of the nine-way valve. Interface 6 is connected to interface 5, so coolant flows from interface 5 out of the nine-way valve and into radiator 105. After flowing out of radiator 105, the coolant passes through electric drive unit 117 and third water pump 113, then flows to interface 2 of the nine-way valve. Interface 2 is connected to interface 7, so coolant flows from interface 7 out of the nine-way valve and through second water pump 112 into battery 102. This forms the target circuit. In one possible implementation, in this target circuit, radiator 105 is turned on to dissipate heat from the first electronic component 101 and electric drive unit 117.

[0069] Referring to Figure 8, similarly, the interfaces 2 and 7, 3 and 4, and 5 and 6 of the first multi-way valve device 104 (i.e., the nine-way valve) can be connected to form the aforementioned target circuit. Specifically, referring to Figure 8, this target circuit can be exemplarily described as a target circuit with thickened pipes. This target circuit can be circulated by the coolant driven by the second water pump 112 and / or the third water pump 113. The components through which the coolant flows sequentially in this target circuit can be exemplarily described in the relevant descriptions in Figure 6, and will not be repeated here. In one possible implementation, in this target circuit, the radiator 105 is turned on to dissipate heat from the first electronic component 101 and the electric drive device 117.

[0070] It is understood that Figures 6 to 8 above are merely examples and do not constitute a limitation on the embodiments of this application. Furthermore, in some possible implementations, as shown in Figures 6, 7, or 8, during the operation of the bolded loop, one or more other loops in the thermal management system may also operate synchronously; this application does not impose any limitations on this.

[0071] In the above implementation, when the temperature of the electric drive circuit where the electric drive device is located is low but the air conditioner does not need to be turned on (i.e., the compressor does not need to be turned on), the first electronic component and the heat sink can be connected through a multi-way valve device to achieve heat dissipation of the first electronic component. This eliminates the need to turn on the compressor to dissipate heat from the electronic component, saving compressor power consumption. This further achieves heat dissipation of low-temperature components while saving power consumption. Furthermore, in another implementation, as shown in Figures 6 to 8 above, since the third water pump 113 in the electric drive circuit and the second water pump 112 of the drive battery 102 are connected in series, only one water pump needs to be turned on. This saves the operating power consumption of one water pump. Additionally, as exemplarily seen from Figures 6 to 8 above, in the above target circuit, after the coolant flows out from the electric drive device 117, the next component requiring thermal management is the first electronic component 101. If the first electronic component 101 is cooled through the target circuit, the coolant temperature at the location of the electric drive device 117 will directly affect the first electronic component. Therefore, detecting the coolant temperature at the location of the electric drive unit 117 allows for a more accurate determination of whether the coolant temperature flowing to the first electronic component 101 exceeds its maximum tolerable temperature during normal operation. If it is not higher, the aforementioned target circuit can be used to dissipate heat from the first electronic component 101, reducing power consumption. If it is higher, the target circuit will not be used to dissipate heat from the first electronic component 101 to avoid damaging it.

[0072] In one possible implementation, the thermal management system provided in this application embodiment, such as the thermal management system shown in any of Figures 1 to 5 above, further includes a second loop L2. The second loop L2 includes refrigerant passages for the compressor 103 and the first heat exchanger 106. The communication state between the multiple interfaces of the first multi-way valve device 104 includes a third communication state. The third communication state is used to realize the series connection of the first multi-way valve device 104, the first electronic component 101, and the coolant passages of the first heat exchanger 106. The second loop L2 can be used to absorb heat from the first electronic component through the first heat exchanger 106 when the coolant temperature at the location of the electric drive device 117 is higher than a second temperature threshold. For ease of understanding, an exemplary description is provided below.

[0073] For example, if the coolant temperature at the location of the electric drive unit 117 is higher than or equal to the second temperature threshold, the first electronic component 101 can be cooled by turning on the compressor 103. For ease of understanding, please refer to Figures 8A, 8B, or 8C. Figure 8A is an example of the thermal management system shown in Figure 1 above. Figure 8B is an example of the thermal management system shown in Figure 2 above. Figure 8C is an example of the thermal management system shown in Figure 4 above.

[0074] Referring to Figure 8A, the thermal management system includes a second loop L2. This second loop L2 includes a compressor 103, a refrigerant passage for a second heat exchanger 107, a first valve device 122, and a refrigerant passage for a first heat exchanger 106. The first valve device 122 can be used to perform one or more functions, such as cooling, pressure reduction, and throttling. The first valve device 122 can be, for example, an expansion valve or a throttling valve. Furthermore, the first multi-way valve device 104, i.e., a nine-way valve, can connect interfaces 3 and 4, and interfaces 6 and 7. This controls the internal connection state of the nine-way valve to a third connection state. This allows the coolant passages of the first electronic component 101 and the first heat exchanger 106 to be connected in series in the same loop. Specifically, referring to Figure 8A, this loop can be exemplarily represented by a loop with thickened pipes. This loop can circulate coolant by driving the coolant through a second water pump 112. For example, driven by the second water pump 112, the coolant in the loop flows to the first electronic component 101 through a first three-way valve 114. After flowing out of the first electronic component 101, the coolant flows through the first three-way port 1117 to port 4 of the nine-way valve. Port 4 is connected to port 3, so the coolant flows out of the nine-way valve from port 3 and into the coolant passage of the first heat exchanger 106. After flowing out of the coolant passage of the first heat exchanger 106, the coolant flows to port 6 of the nine-way valve. Port 6 is connected to port 7, so the coolant flows out of the nine-way valve from port 7 and back to the second water pump 112, thus forming a loop.

[0075] In Figure 8A above, after compressor 103 is turned on, compressor 103 outputs high-temperature and high-pressure refrigerant. This high-temperature and high-pressure refrigerant passes through the refrigerant channel of the second heat exchanger 107, and then passes through the first valve device 122 at the inlet of the refrigerant channel of the first heat exchanger 106 to cool and depressurize, becoming low-temperature and low-pressure refrigerant that flows into the refrigerant channel of the first heat exchanger 106. In the refrigerant channel of the first heat exchanger 106, the low-temperature and low-pressure refrigerant exchanges heat with the circuit containing the first electronic component 101 through the coolant channel of the first heat exchanger 106. That is, it absorbs heat from the coolant in the circuit containing the first electronic component 101. The refrigerant, after absorbing heat, flows back to compressor 103. The coolant in the circuit containing the first electronic component 101, having absorbed heat, flows to the first electronic component 101 under the drive of the second water pump 112, to dissipate heat from the first electronic component 101.

[0076] Referring to Figure 8B, it can be seen that, similarly, the thermal management system includes a second loop L2. A description of this second loop L2 is provided above. Furthermore, interfaces 3 and 4 of the first multi-way valve device 104 (i.e., the nine-way valve), and interfaces 6 and 7, can be connected. This allows the coolant channels of the first electronic component 101 and the first heat exchange device 106 to be connected in series in the same loop. This loop differs from that in Figure 8A in that it also connects to the battery 102, as shown in Figure 8B. Further descriptions of this loop can be found in the description corresponding to Figure 8A, and will not be repeated here. The principle of heat dissipation for the first electronic component 101 in Figure 8B can also be referred to the description corresponding to Figure 8A, and will not be repeated here. For example, Figure 8B can also be used to dissipate heat from the battery 102.

[0077] Referring to Figure 8C, it can be seen that, similarly, the thermal management system includes a second loop L2. A description of this second loop L2 is provided above. Furthermore, interfaces 3 and 4, and interfaces 6 and 7 of the first multi-way valve device 104 (i.e., the nine-way valve) can be connected. Further, the two interfaces in the first three-way valve 114 connecting the second water pump 112 and the target component can be opened. This allows the coolant channels of the first electronic component 101 and the first heat exchanger 106 to be connected in series in the same loop. A description of this loop can be found in the description corresponding to Figure 8A above, and will not be repeated here. The principle of heat dissipation for the first electronic component 101 in Figure 8C can also be referred to the description corresponding to Figure 8A above, and will not be repeated here. In another possible implementation, as shown in Figure 8C, opening the interface in the first three-way valve 114 connecting the battery 102 can also be used to dissipate heat from the battery 102.

[0078] It is understood that Figures 8A to 8C are merely examples and do not constitute a limitation on the embodiments of this application. Furthermore, in some possible implementations, during the operation of the bolded loop in Figures 8A, 8B, or 8C, one or more other loops in the thermal management system may also operate synchronously, and this application does not impose any limitations on this.

[0079] In the above scheme, if the temperature of the electric drive circuit is too high to meet the low-temperature requirements of the first electronic component, the compressor can be turned on to cool the first electronic component, thereby ensuring its heat dissipation requirements.

[0080] In another possible implementation, as exemplarily described, the thermal management system provided in this application embodiment, such as the thermal management system shown in any of Figures 1 to 5 above, further includes the aforementioned second loop L2. The communication state between the multiple interfaces of the first multi-way valve device 104 includes a second communication state. This second communication state is used to achieve a series connection of the coolant passages of the first multi-way valve device 104, the first electronic component 101, and the first heat exchange device 106. This second communication state can be the same as the aforementioned first communication state. The second loop L2 is used to absorb heat from the first electronic component 101 through the first heat exchange device 106 when the compressor 103 is turned on to cool or heat the cabin. For ease of understanding, an exemplary description follows.

[0081] For example, if compressor 103 is turned on to heat the passenger compartment, the heat from the first electronic component 101 can be absorbed through the second circuit where compressor 103 is located, thus dissipating heat from the first electronic component 101. For ease of understanding, please refer to Figures 9, 10, or 11. Figure 9 illustrates an example of the thermal management system shown in Figure 1 above. Figure 10 illustrates an example of the thermal management system shown in Figure 2 above. Figure 11 illustrates an example of the thermal management system shown in Figure 4 above.

[0082] As shown in Figures 9, 10, or 11, the thermal management system also includes a second loop L2. A description of this second loop L2 is provided above and will not be repeated here. Furthermore, the thermal management system also includes a warm air loop Lh. This warm air loop Lh includes a warm air core, a coolant passage for the second heat exchanger 107, and a first water pump 111. Optionally, the warm air loop Lh also includes a heater 110. The warm air loop Lh also includes valve devices, such as a second three-way valve 115 and a first multi-way valve device 104 (e.g., a nine-way valve). Additionally, in Figures 9, 10, or 11, the coolant passages of the first electronic component 101 and the first heat exchanger 106 are connected in series via the first multi-way valve device 104 (e.g., a nine-way valve) to form a loop. A description of this loop can be found in Figures 6, 7, or 8 above and will not be repeated here. For ease of subsequent description, this loop will be referred to simply as the third loop.

[0083] For the thermal management system shown in Figures 9, 10, or 11 above, if compressor 103 is turned on to heat the passenger compartment, then after compressor 103 is turned on, compressor 103 outputs high-temperature, high-pressure refrigerant. This high-temperature, high-pressure refrigerant is input into the refrigerant channel of the second heat exchanger 107 to exchange heat with the heating air circuit Lh. The coolant in the heating air circuit Lh exchanges heat with the refrigerant in the refrigerant channel of the second heat exchanger 107 through the coolant channel, and gains heat and rises in temperature. The heated coolant is driven by the first water pump 111 to flow to the heating air core 108. The heating air core 108 heats the air in the passenger compartment to provide heating for the passenger compartment. Furthermore, after heat exchange, the refrigerant flowing out of the refrigerant channel of the second heat exchanger 107 is cooled and depressurized by the first valve device 122 at the inlet of the refrigerant channel of the first heat exchanger 106, resulting in low-temperature, low-pressure refrigerant that flows back to the refrigerant channel of the first heat exchanger 106 to exchange heat with the third circuit. That is, the low-temperature, low-pressure refrigerant in the refrigerant channel of the first heat exchanger 106 can absorb heat from the first electronic component 101 and the electric drive device 117 through the coolant channel of the first heat exchanger 106, thereby achieving heat dissipation for the first electronic component 101 and the electric drive device 117. After absorbing heat, the refrigerant in the refrigerant channel of the first heat exchanger 106 flows back to the compressor 103.

[0084] In the above scheme, when the temperature is low and air conditioning needs to be turned on (i.e., the compressor needs to be turned on), a multi-way valve device (such as the aforementioned nine-way valve) can be used to connect the coolant passages of the first electronic component and the first heat exchange device in series, so that the second circuit can recover the heat from the first electronic component and the electric drive device. This achieves both heat dissipation for the first electronic component and the electric drive device and also helps to generate the heat required for compressor operation, realizing heat recovery and utilization. In addition, since there is a need to turn on the compressor anyway, the compressor can be used to actively cool the first electronic component, reducing the noise generated by turning on the compressor specifically for cooling the first electronic component.

[0085] In one possible implementation, when the compressor 103 is turned on to heat the passenger compartment, the radiator 105 or the bypass radiator 105 can be turned off. This reduces heat loss into the air and improves heat recovery efficiency. For easier understanding of the implementation of the bypass radiator 105, please refer to Figure 12. Figure 12 is an example of the thermal management system shown in Figure 9 above; Figures 10 and 11 are similar and will not be repeated.

[0086] As shown in Figure 12, compared to Figure 9 above, the difference is that port 5 of the nine-way valve is bypassed, and port 9 of the nine-way valve is opened. That is, ports 6 and 5 of the nine-way valve are no longer connected; only ports 6 and 9 are connected. This allows the coolant flowing from the coolant passage of the first heat exchanger 106 to flow from port 6 to port 9 of the nine-way valve. After flowing out of port 9, it flows to the electric drive device 117. Then, it sequentially passes through the third water pump 113, port 2 and port 7 of the nine-way valve, the second water pump 112, the first three-way valve 114, the first electronic component 101, and ports 4 and 3 of the nine-way valve. After flowing out of port 3, it flows back to the coolant passage of the first heat exchanger 106 to form a loop.

[0087] It is understood that Figures 9 to 12 above are merely examples and do not constitute a limitation on the embodiments of this application. Furthermore, in some possible implementations, during the operation of the bolded loop in Figures 9 to 12, one or more other loops in the thermal management system may also operate synchronously, and this application does not impose any limitations on this.

[0088] In another possible implementation, exemplarily, if the compressor 103 is turned on to cool the passenger compartment, the heat from the first electronic component 101 can be absorbed through the second circuit containing the compressor 103 to dissipate heat from the first electronic component 101. For ease of understanding, please refer to Figures 13, 14, or 15. Figure 13 illustrates an example of the thermal management system shown in Figure 1 above. Figure 14 illustrates an example of the thermal management system shown in Figure 2 above. Figure 15 illustrates an example of the thermal management system shown in Figure 4 above.

[0089] As shown in Figures 13, 14, or 15, the thermal management system also includes a second loop L2 and a warm air loop Lh. For a description of the second loop L2 and the warm air loop Lh, please refer to the relevant descriptions in Figures 9 to 11 above; they will not be repeated here. Furthermore, the thermal management system also includes a cold air loop Lc. This cold air loop Lc includes a compressor 103, a refrigerant passage for the second heat exchanger 107, a second valve device 123, and an evaporator 109. The second valve device 123 can be used to perform one or more functions, such as throttling and pressure reduction, flow regulation, and maintaining superheat. The second valve device 123 can be, for example, an expansion valve or a throttling valve. Additionally, as shown in Figures 13, 14, or 15, the coolant passages of the first electronic component 101 and the first heat exchanger 106 are connected in series via a first multi-way valve device 104 (e.g., a nine-way valve), forming a loop. This loop is circulated by the coolant driven by the second water pump 112. For example, driven by the second water pump 112, the coolant in the circuit flows to the first electronic component 101 through the first three-way valve 114. After flowing out of the first electronic component 101, the coolant flows through the first three-way port 1117 to port 4 of the nine-way valve. Port 4 is connected to port 3, so the coolant flows out of the nine-way valve from port 3 and into the coolant channel of the first heat exchanger 106. After flowing out of the coolant channel of the first heat exchanger 106, the coolant flows to port 6 of the nine-way valve. Port 6 is connected to port 7. So, after flowing out of the nine-way valve from port 7, the coolant flows back to the second water pump 112, thus forming a circuit.

[0090] For the thermal management system shown in Figures 13, 14, or 15 above, if compressor 103 is turned on to cool the passenger compartment, then after compressor 103 is turned on, compressor 103 outputs high-temperature, high-pressure refrigerant. This high-temperature, high-pressure refrigerant is input into the refrigerant channel of the second heat exchanger 107 to exchange heat with the heating circuit Lh. Since heating is not required, the heating core 108 is not turned on. If there is a heater 110, the heater 110 is also not turned on. Then, the refrigerant in the heating circuit Lh bypasses the heating core 108 and will not have a significant impact on the temperature of the passenger compartment. Alternatively, the first water pump 111 in the heating circuit Lh can be turned off, that is, the circulation of the heating circuit Lh can be not started. The refrigerant flowing out of the refrigerant channel of the second heat exchanger 107 after heat exchange is divided into two paths. One path flows through the second valve device 123 to the evaporator 109, so that the evaporator 109 cools the passenger compartment. Another path of refrigerant, after being cooled and depressurized by the first valve device 122 at the inlet of the refrigerant channel of the first heat exchanger 106, flows to the refrigerant channel of the first heat exchanger 106 to exchange heat. That is, the low-temperature, low-pressure refrigerant in the refrigerant channel of the first heat exchanger 106 can absorb heat from the first electronic component 101 through the coolant channel of the first heat exchanger 106, thereby achieving heat dissipation for the first electronic component 101. After absorbing heat, the refrigerant in the refrigerant channel of the first heat exchanger 106 flows back to the compressor 103.

[0091] In the above scheme, when the temperature is high and air conditioning needs to be turned on (i.e., the compressor needs to be turned on), a multi-way valve device (such as the aforementioned nine-way valve) can be used to connect the coolant passages of the first electronic component and the first heat exchanger in series, so that the second circuit can recover the heat from the first electronic component. This achieves both heat dissipation for the first electronic component and the heat required for compressor operation, realizing heat recovery and utilization. In addition, since there is a need to turn on the compressor anyway, the compressor can be used to actively cool the first electronic component, reducing the noise generated by turning on the compressor solely for cooling the first electronic component.

[0092] It is understood that Figures 13 to 15 above are merely examples and do not constitute a limitation on the embodiments of this application. Furthermore, in some possible implementations, during the operation of the bolded loop in Figures 13 to 15, one or more other loops in the thermal management system may also operate synchronously, and this application does not impose any limitations on this.

[0093] In another possible implementation, exemplarily, when the target component and the battery 102 are connected in parallel, such as in the thermal management system shown in any of Figures 4 and 5, if the battery 102 needs heating or cooling, and the first electronic component 101 also needs cooling, a second multi-way valve device (e.g., the first three-way valve 114 shown in Figure 4 or the four-way valve 120 shown in Figure 5) can be used to introduce coolant from the circuit containing the battery 102 into the first circuit L1 included in the target component. The circulation of the first circuit L1 can be activated to reduce condensation at the inlet of the first electronic component due to sudden temperature changes in the coolant. For ease of understanding, please refer to Figures 16 to 20. Figures 16, 18, and 19 are examples of the thermal management system shown in Figure 4. Figures 17 and 20 are examples of the thermal management system shown in Figure 5.

[0094] For example, Figures 16 and 17 illustrate the simultaneous heating of the battery 102 and cooling of the first electronic component 101. As can be seen, the thermal management system shown in Figures 16 and 17 may include a heater circuit Lh, a first circuit L1, and a fourth circuit. This fourth circuit is the battery heating circuit. For details on the heater circuit Lh and the first circuit L1, please refer to the foregoing description; they will not be repeated here. To form the heater circuit Lh, the first circuit L1, and the fourth circuit, interfaces 1 and 8 of the first multi-way valve device 104 (i.e., a nine-way valve) are connected, and interfaces 4 and 7 are connected. Since the battery 102 needs to be heated, the heater 110 in the heater circuit Lh can be turned on to heat the coolant in the circuit. The heated coolant flows through the heater core 108 and then flows from the second three-way valve 115 to the second water pump 112. Driven by the second water pump 112, the coolant flows through the first three-way valve 114 to the battery 102 to heat the battery. After the coolant flows out of the battery 102, it flows back to the heating circuit Lh through ports 4 and 7 of the first multi-way valve device 104 (i.e., the nine-way valve) and the one-way valve 116, thus forming the fourth circuit. Furthermore, if the temperature of the first electronic component 101 is high, for example, above a certain temperature threshold, it needs to be cooled. The temperature of the first electronic component 101 is higher than the temperature of the coolant used to heat the battery 102. Therefore, in Figure 16, the port valve of the first three-way valve 114 connected to the target component can be opened. In Figure 17, the port valve of the four-way valve 120 connected to the target component can be opened. This introduces the coolant from the fourth circuit into the first circuit L1. The fourth water pump 119 in the first circuit L1 is then activated to drive the coolant circulation in the first circuit L1. This achieves heat dissipation for the first electronic component 101 in the first circuit L1. Additionally, the coolant in the first circuit L1 can also flow back to the fourth circuit through the first three-way port 1117.

[0095] By way of example, in another possible implementation, the fourth circuit for heating the battery is not limited to the circuit shown in Figures 16 or 17 above, but can also be a circuit that recovers heat from the electric drive unit 117 to heat the battery. For example, see Figure 18. In Figure 18, ports 3 and 4 of the nine-way valve can be connected, ports 6 and 9 can be connected, and ports 2 and 7 can be connected. Then, driven by the second water pump 112 and / or the third water pump 113, the coolant in the circuit absorbs heat from the electric drive unit 117 and, after heating up, flows sequentially through the third water pump 113, ports 2 and 7 of the nine-way valve, the second water pump 112, and the first three-way valve 114 to the battery 102 for heating the battery 102. After flowing out of the battery 102, the coolant flows back to the electric drive unit 117 through ports 3 and 4 of the nine-way valve, the coolant channel of the first heat exchanger 106, and ports 6 and 9 of the nine-way valve. This forms the fourth circuit for heating the battery. Similarly, if the temperature of the first electronic component 101 is high, for example, above a certain temperature threshold, then heat dissipation is required for the first electronic component 101. The temperature of the first electronic component 101 is higher than the temperature of the coolant used to heat the battery 102. Therefore, in Figure 18, the interface valve connecting the first three-way valve 114 to the target component can be opened. Coolant from the fourth circuit is introduced into the first circuit L1. And the fourth water pump 119 in the first circuit L1 is turned on to drive the coolant in the first circuit L1 to circulate. This achieves heat dissipation for the first electronic component 101 in the first circuit L1. In addition, the coolant in the first circuit L1 can also flow back to the fourth circuit through the first three-way interface 1117.

[0096] It is understood that the above Figures 16 to 18 are merely examples, and the fourth circuit used to achieve battery heating is also merely an example and does not constitute a limitation on the embodiments of this application.

[0097] In the above scheme, because the first electronic component is designed to be located in a relatively independent first circuit, when heat dissipation is needed for the first electronic component during battery heating, the coolant from the battery heating circuit (i.e., the fourth circuit) can be introduced into the first circuit to dissipate heat from the first electronic component. This allows the introduced coolant to mix with the coolant in the first circuit, achieving a smooth temperature change of the coolant at the inlet of the first electronic component, thereby reducing condensation at the inlet of the first electronic component due to sudden temperature changes of the coolant.

[0098] For example, Figures 19 and 20 illustrate the simultaneous cooling of the battery 102 and the first electronic component 101. It can be seen that the thermal management system shown in Figures 19 and 20 may include a first loop L1, a second loop L2, and a fifth loop. This fifth loop is the battery cooling loop. For details on the first loop L1 and the second loop L2, please refer to the foregoing description; they will not be repeated here. To form this fifth loop, interfaces 3 and 4 of the first multi-way valve device 104 (i.e., the nine-way valve) are connected, and interfaces 6 and 7 are connected. This fifth loop is driven by the second water pump 112 to circulate the coolant. Specifically, driven by the second water pump 112, the coolant flows to the battery 102 after passing through the first three-way valve 114. After flowing out of the battery 102, it flows back to the second water pump 112 through interfaces 4 and 3 of the nine-way valve, the coolant passage of the first heat exchange device 106, and interfaces 6 and 7 of the nine-way valve. This forms the fifth loop.

[0099] In Figures 19 and 20 above, compressor 103 can be turned on to dissipate heat from battery 102. After compressor 103 is turned on, it outputs high-temperature, high-pressure refrigerant. This high-temperature, high-pressure refrigerant passes through the refrigerant channel of the second heat exchanger 107, and then passes through the first valve device 122 at the inlet of the refrigerant channel of the first heat exchanger 106 to cool and depressurize, becoming low-temperature, low-pressure refrigerant that flows into the refrigerant channel of the first heat exchanger 106. The low-temperature, low-pressure refrigerant exchanges heat with the fifth circuit through the coolant channel of the first heat exchanger 106, that is, it absorbs heat from the coolant in the fifth circuit. The refrigerant that has absorbed heat flows back to compressor 103. The coolant that has absorbed heat in the fifth circuit flows to battery 102 under the drive of the second water pump 112 to dissipate heat from battery 102.

[0100] Furthermore, in Figures 19 and 20 above, if the temperature of the first electronic component 101 is high, for example, above a certain temperature threshold, then heat dissipation is required for the first electronic component 101. The temperature of the first electronic component 101 is higher than the temperature of the coolant used to dissipate heat from the battery 102. Therefore, in Figure 19, the interface valve connecting the first three-way valve 114 to the target component can be opened. In Figure 20, the interface valve connecting the four-way valve 120 to the target component can be opened. This introduces coolant from the fifth circuit into the first circuit L1. The fourth water pump 119 in the first circuit L1 is then activated to drive the coolant circulation in the first circuit L1. This achieves heat dissipation for the first electronic component 101 in the first circuit L1. Additionally, the coolant in the first circuit L1 can also flow back to the fifth circuit through the first three-way interface 1117.

[0101] It is understood that the above Figures 19 and 20 are merely examples, and the fifth circuit used to achieve battery heating is also merely an example and does not constitute a limitation on the embodiments of this application.

[0102] In the above scheme, because the first electronic component is located in a relatively independent first circuit, when the battery needs to dissipate heat, the coolant from the battery cooling circuit (i.e., the fifth circuit) is introduced into the first circuit to dissipate heat from the first electronic component. This allows the introduced coolant to mix with the coolant in the first circuit, achieving a smooth temperature change of the coolant at the inlet of the first electronic component, thereby reducing condensation at the inlet of the first electronic component due to sudden temperature changes of the coolant.

[0103] It is understood that the devices included in each loop of the various possible thermal management systems shown above are merely examples and do not constitute a limitation on the embodiments of this application. In specific implementations, each loop may include more or fewer devices, and the embodiments of this application do not impose any limitations on this.

[0104] This application also provides a vehicle that may include the thermal management system described in any of the possible embodiments described above.

[0105] It should be understood that in the various embodiments of this application, the sequence number of each process does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0106] It should also be understood that the term “comprising” (also referred to as “includes”, “including”, “comprises” and / or “comprising”) as used in this specification specifies the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0107] It should also be understood that the phrases "an embodiment," "an embodiment," and "a possible implementation" used throughout the specification mean that a specific feature, structure, or characteristic related to an embodiment or implementation is included in at least one embodiment of this application. Therefore, the phrases "in an embodiment," "an embodiment," or "a possible implementation" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.

[0108] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A thermal management system, characterized by, The heat management system comprises a first electronic component, a battery, a first multi-way valve device, an electric drive device and a radiator; The first pipeline where the first electronic component is located and the second pipeline where the battery is located are connected in parallel, or the first electronic component and the battery are connected in series through a pipeline; the cooling liquid temperature of the loop where the battery is located is less than a first temperature threshold; the first temperature threshold is the maximum tolerance temperature when the first electronic component is normally working; The first multi-way valve device comprises at least two interfaces, and the communication state between the at least two interfaces comprises a first communication state, the first communication state is used to realize the series connection of the first multi-way valve device, the first electronic component, the electric drive device and the radiator, so as to form a target loop; wherein the target loop is used to dissipate heat for the first electronic component when the cooling liquid temperature at the position of the electric drive device is lower than a second temperature threshold, the second temperature threshold is less than or equal to the first temperature threshold, and greater than a third temperature threshold.

2. The system of claim 1, wherein, In the case that the first pipeline where the first electronic component is located and the second pipeline where the battery is located are connected in parallel, the heat management system further comprises a water pump and a second multi-way valve device; The water pump and the first electronic component are connected in series through a pipeline to form a first loop; The inlet of the first loop is connected to the inlet of the second pipeline through the second multi-way valve device, and the outlet of the first loop is connected to the outlet of the second pipeline.

3. The system of claim 1 or 2, wherein, The heat management system further comprises a second loop, and the second loop comprises a compressor and a refrigerant channel of a first heat exchange device; The first multi-way valve device comprises at least two interfaces, and the communication state between the at least two interfaces comprises a second communication state, the second communication state is used to realize the series connection of the first multi-way valve device, the first electric component and the cooling liquid channel of the first heat exchange device; the second loop is used to absorb the heat of the first electronic component through the first heat exchange device when the compressor is started to cool or heat the crew cabin.

4. The system of claim 3, wherein, In the case that the compressor is started to heat the crew cabin, a third loop where the first electronic component and the cooling liquid channel of the first heat exchange device are located further comprises the electric drive device.

5. The system of claim 4, wherein, The third loop bypasses the radiator.

6. The system of claim 2, wherein, The heat management system comprises a fourth loop, and the fourth loop comprises the second pipeline; The second multi-way valve device is used to introduce the cooling liquid of the fourth loop into the first loop when the fourth loop is used to heat the battery and the first electronic component needs to dissipate heat, and the water pump in the first loop is used to drive the circulation of the cooling liquid in the first loop.

7. The system of claim 6, wherein, The fourth loop further comprises a warm air core and a water heater.

8. The system of claim 2, wherein, The heat management system comprises a fifth loop, and the fifth loop comprises the second pipeline; The second multi-way valve device is used to introduce the cooling liquid in the fifth loop into the first loop when the fifth loop is used to heat the battery and the first electronic component needs to dissipate heat, and a water pump in the first loop is used to drive the circulation of the cooling liquid in the first pipeline.

9. The system of claim 8, wherein, The thermal management system further comprises a second circuit comprising a compressor and a refrigerant passage of the first heat exchange device; The first circuit further comprises a coolant passage of the first heat exchange device, and the second circuit is configured to absorb heat in the first circuit through the first heat exchange device.

10. The system of any of claims 2, 6-9, wherein, The second multi-way valve device is a four-way valve. The inlet of the first circuit is connected to the inlet of the battery through the second multi-way valve device, and the first interface of the four-way valve is connected to the inlet of the first circuit, and the second interface of the four-way valve is connected to the inlet of the battery. The third interface of the four-way valve is further connected to the outlet of the battery.

11. The system of any of claims 1-10, wherein, The thermal management system further comprises a second circuit comprising a compressor and a refrigerant passage of the first heat exchange device; The communication state between the at least two interfaces of the first multi-way valve device comprises a third communication state, and the third communication state is configured to realize series connection of the first multi-way valve device, the first electronic component and the coolant passage of the first heat exchange device; and the second circuit is configured to absorb heat of the first electronic component through the first heat exchange device when the coolant temperature at the position of the electric drive device is higher than the second temperature threshold.

12. A vehicle characterized by comprising: The vehicle comprises the thermal management system according to any one of claims 1-11.

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