Heat dissipation film and display device

Abstract

The present disclosure provides a heat dissipation film and a display device. The heat dissipation film comprises: a heat dissipation layer composed of graphite, a reinforcing member arranged around the periphery of the heat dissipation layer, and an electrically and thermally conductive layer at least bonded to the heat dissipation layer. The tensile strength of the reinforcing member ranges from 500 MPa to 1,050 MPa.

Description

A heat dissipation film and display device

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 202510496128.X, filed on April 18, 2025, entitled "A Heat Dissipation Film and Display Device", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to the field of display technology, and in particular to a heat dissipation film and a display device. Background Technology

[0004] In recent years, Organic Light Emitting Diode (OLED) display technology has rapidly captured the market due to its advantages such as self-illumination and flexibility. However, with the widespread application of OLED in mainstream flagship smartphones, the number of returned products is also gradually increasing. During the repair process, OLED modules are prone to developing water ripple (molding) issues after disassembly, which seriously affects the product's reusability. Therefore, effectively improving the water ripple problem of OLED modules has become an urgent technical issue to be addressed. Summary of the Invention

[0005] This disclosure provides a heat dissipation film and a display device, the specific solutions of which are as follows:

[0006] This disclosure provides a heat dissipation film, comprising:

[0007] A heat dissipation layer composed of graphite, a reinforcing member disposed around the periphery of the heat dissipation layer, and a conductive and thermally conductive layer at least in contact with the heat dissipation layer;

[0008] The tensile strength of the reinforcing member ranges from 515 MPa to 1035 MPa.

[0009] Optionally, in this embodiment of the present disclosure, a groove partially formed on the conductive and thermally conductive layer surrounding the heat dissipation layer is further included; the orthographic projection of the groove on the reinforcing member is located inside the reinforcing member.

[0010] Optionally, in this embodiment of the present disclosure, an adhesive is further included, which is disposed within the groove; the adhesive is used to bond to the middle frame, and the orthographic projection of the adhesive on the reinforcing member is located inside the reinforcing member.

[0011] Optionally, in this embodiment of the present disclosure, along a direction parallel to the plane where the heat dissipation layer is located, the groove is 0.2 mm to 1 mm away from the side edge of the heat dissipation layer opposite to the side edge of the reinforcing member opposite to the heat dissipation layer.

[0012] Optionally, in this embodiment of the present disclosure, it further includes a first through-hole penetrating the heat dissipation layer, a second through-hole penetrating the conductive and thermally conductive layer, and thermoplastic polyester material respectively attached to the sidewalls of the first through-hole and the second through-hole; wherein, the sidewall of the first through-hole is recessed relative to the sidewall of the second through-hole, and the area enclosed by the first through-hole and the second through-hole constitutes a fingerprint recognition area.

[0013] Optionally, in this embodiment of the present disclosure, along a direction perpendicular to the plane where the heat dissipation layer is located, the heat dissipation film further includes a buffer layer and an adhesive layer sequentially disposed on the side of the heat dissipation layer opposite to the conductive and thermally conductive layer.

[0014] Optionally, in this embodiment of the present disclosure, along a direction perpendicular to the plane where the heat dissipation layer is located, the heat dissipation film further includes a release film located on the side of the adhesive layer away from the heat dissipation layer, and a protective film located on the side of the conductive and thermally conductive layer away from the heat dissipation layer; wherein, the thickness of the release film is less than the thickness of the protective film, and the peeling force of the release film is less than the peeling force of the protective film.

[0015] Optionally, in this embodiment of the present disclosure, the distance between the heat dissipation layer and the reinforcing member is 0.05mm to 0.35mm along a direction parallel to the plane where the heat dissipation layer is located.

[0016] Optionally, in this embodiment of the present disclosure, along a direction parallel to the plane of the heat dissipation layer, the heat dissipation film further includes a polyester film material located between the reinforcing member and the heat dissipation layer. The polyester film material is disposed around the periphery of the heat dissipation layer and is bonded to the heat dissipation layer. The reinforcing member is disposed around the polyester film material. The tensile strength of the polyester film material is in the range of 150 MPa to 240 MPa.

[0017] Optionally, in this embodiment of the present disclosure, the edge of the reinforcing member is flush with the corresponding edge of the conductive and thermally conductive layer along a direction parallel to the plane where the heat dissipation layer is located.

[0018] Accordingly, embodiments of this disclosure provide a display device, comprising:

[0019] A heat dissipation film and a display module bonded to the heat dissipation film;

[0020] The heat dissipation film includes a heat dissipation layer composed of graphite, a reinforcing member disposed around the periphery of the heat dissipation layer, and a conductive and thermally conductive layer that is at least attached to the heat dissipation layer; the tensile strength of the reinforcing member is in the range of 500MPa to 1050MPa.

[0021] Optionally, in this embodiment of the present disclosure, an adhesive is further included on the side of the conductive and thermally conductive layer opposite to the display module; the adhesive is used to bond with the middle frame, and the orthogonal projection of the adhesive on the display module is located inside the reinforcing member.

[0022] Optionally, in this embodiment of the present disclosure, a groove partially formed on the conductive and thermally conductive layer surrounding the heat dissipation layer is further included, and an adhesive disposed within the groove; the adhesive is used to bond with the middle frame, and the orthographic projection of the adhesive on the display module is located inside the reinforcing member.

[0023] Optionally, in this embodiment of the present disclosure, at least one clip is further provided for fixing the heat dissipation film to the display module; the adhesive is provided with receiving spaces to accommodate each of the clips.

[0024] Optionally, in this embodiment of the present disclosure, along a direction perpendicular to the plane of the heat dissipation layer, the display device further includes a cover plate disposed on the side of the display module away from the heat dissipation film; each of the latches includes a first part and a second part connected in sequence; wherein, the first part extends along a direction parallel to the plane of the cover plate, and the second part extends along a direction perpendicular to the plane of the cover plate; the first part is fixedly connected to the conductive and thermally conductive layer by a first adhesive material, and the second part is fixedly connected to the cover plate by a second adhesive material.

[0025] Optionally, in this embodiment of the disclosure, each of the buckles is a one-piece molded structure.

[0026] Optionally, in this embodiment of the present disclosure, a middle frame connected to the adhesive is further included, the middle frame having an accommodating space that avoids the second part.

[0027] Optionally, in this embodiment of the present disclosure, the heat dissipation film further includes a first through-hole penetrating the heat dissipation layer, a second through-hole penetrating the conductive and thermally conductive layer, and thermoplastic polyester material respectively attached to the sidewalls of the first through-hole and the second through-hole; wherein, the sidewall of the first through-hole is recessed relative to the sidewall of the second through-hole, and the area enclosed by the first through-hole and the second through-hole constitutes a fingerprint recognition area. Attached Figure Description

[0028] Figure 1 is a simplified schematic diagram of one of the instantaneous deformations of the OLED module caused by the interaction between the disassembly pull force and the mid-frame adhesive pull force during the disassembly process in related technologies;

[0029] Figure 2 is a schematic diagram of one structure of a heat dissipation film provided in an embodiment of this disclosure;

[0030] Figure 3 is a schematic diagram of one type of cross-sectional structure along the direction shown by MM in Figure 2;

[0031] Figure 4 is a schematic diagram of one of the structures of the heat dissipation layer in Figure 2;

[0032] Figure 5 is a schematic diagram of one type of reinforcement structure in Figure 2;

[0033] Figure 6 is a schematic diagram of one of the bonding structures between the heat dissipation layer and the reinforcing component in Figure 2;

[0034] Figure 7 is a schematic diagram of one of the structures of the conductive and thermally conductive layer in Figure 2;

[0035] Figure 8 is a schematic diagram of one structure of the heat dissipation film provided in an embodiment of this disclosure;

[0036] Figure 9 is a top view of one of the heat dissipation film structures provided in an embodiment of this disclosure;

[0037] Figure 10 is a schematic diagram of one type of cross-sectional structure along the direction NN shown in Figure 9;

[0038] Figure 11 is a schematic diagram of one of the structures of the adhesive in Figure 9;

[0039] Figure 12 is a top view schematic diagram of one of the structures arranged between the conductive and thermally conductive layer and the adhesive in Figure 9;

[0040] Figure 13 is a schematic diagram of one structure of the heat dissipation film provided in an embodiment of this disclosure;

[0041] Figure 14 is a schematic diagram of one structure of the heat dissipation film provided in an embodiment of this disclosure;

[0042] Figure 15 is a schematic diagram of one structure of the heat dissipation film provided in an embodiment of this disclosure;

[0043] Figure 16 is a schematic diagram of one structure of the heat dissipation film provided in an embodiment of this disclosure;

[0044] Figure 17 is a schematic diagram of one structure of the display device provided in an embodiment of the present disclosure;

[0045] Figure 18 is a schematic diagram of one structure of a display device provided in an embodiment of the present disclosure;

[0046] Figure 19 is a schematic diagram of one structure of the display device provided in an embodiment of the present disclosure;

[0047] Figure 20 is a schematic diagram of one distribution of the latches in the display device provided in the embodiments of this disclosure;

[0048] Figure 21 is a schematic diagram of one type of cross-sectional structure along the direction shown by SS in Figure 20. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Furthermore, the embodiments and features in the embodiments of this disclosure can be combined with each other without conflict. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0050] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “inner,” “outer,” “upper,” and “lower” are used only to indicate relative positional relationships; when the absolute position of the described objects changes, the relative positional relationship may also change accordingly.

[0051] It should be noted that the dimensions and shapes of the figures in the accompanying drawings do not reflect actual proportions and are intended only to illustrate the content of this disclosure. Furthermore, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.

[0052] In related technologies, the heat dissipation film (Super Clean Film, SCF) of OLED modules typically uses polyethylene terephthalate (PET) to wrap graphite edges. However, after disassembly and heating, when the frame adhesive 01 separates from the heat dissipation film, wrinkles easily form on the film, leading to deformation of the polarizer (POL). This ultimately manifests as a ripple-shaped imprint on the front of the module. Figure 1 shows a simplified diagram illustrating one type of instantaneous deformation of the OLED module under the interaction of disassembly pull and frame adhesive pull during disassembly. Arrow y1 indicates the direction of the disassembly pull, and arrow y2 indicates the direction of the frame adhesive pull.

[0053] In view of this, the present disclosure provides a heat dissipation film and a display device to fundamentally solve the problem of water ripples during disassembly and improve the performance of the display device.

[0054] As shown in Figure 2, this embodiment of the present disclosure provides a heat dissipation film, including:

[0055] A heat dissipation layer 10 composed of graphite, a reinforcing member 20 disposed around the periphery of the heat dissipation layer 10, and a conductive and thermally conductive layer 30 at least in contact with the heat dissipation layer 10.

[0056] The tensile strength of the reinforcing member 20 ranges from 500 MPa to 1050 MPa.

[0057] In specific implementation, the heat dissipation film provided in this embodiment includes a heat dissipation layer 10, a reinforcing member 20, and a conductive and thermally conductive layer 30. The heat dissipation layer 10 is composed of graphite, ensuring the uniformity of heat conduction. The reinforcing member 20 is disposed around the periphery of the heat dissipation layer 10, and the tensile strength of the reinforcing member 20 ranges from 515 MPa to 1035 MPa. This effectively improves the edge strength of the heat dissipation film. Therefore, even if the heat dissipation film is subsequently applied to a display device, upon disassembly, when the heat dissipation film and adhesive 50 delaminate, the increased strength of the heat dissipation film itself helps to prevent wrinkles, thus ensuring the improvement of water ripple patterns. Furthermore, the conductive and thermally conductive layer 30 is at least attached to the heat dissipation layer 10. For example, the same surface of the conductive and thermally conductive layer 30 is attached not only to the heat dissipation layer 10 but also to the reinforcing member 20. For example, the material of the conductive and thermally conductive layer 30 is copper foil. In this way, the stability of the heat dissipation film structure is ensured, while also guaranteeing the heat dissipation and electrical conductivity of the heat dissipation film.

[0058] In the embodiments disclosed herein, the heat dissipation film may be configured in several ways, but is not limited to these few ways.

[0059] In one exemplary embodiment, the orthographic projections of the reinforcing member 20 and the heat dissipation layer 10 onto the conductive and thermally conductive layer 30 are both located inside the conductive and thermally conductive layer 30.

[0060] Figure 3 shows a schematic diagram of one type of cross-sectional structure along the direction shown in Figure 2 (MM). Specifically, the orthographic projections of the reinforcing member 20 and the heat dissipation layer 10 onto the conductive and thermally conductive layer 30 are both located inside the conductive and thermally conductive layer 30. Correspondingly, the conductive and thermally conductive layer 30 can be a single layer without a pattern, thereby ensuring the conductive and thermally conductive performance of the heat dissipation film while taking into account the structural stability of the heat dissipation film.

[0061] To more clearly illustrate the relationship between the various film layer structures in the exemplary embodiment shown in FIG2, FIG4 to FIG7 are used in conjunction with the following: FIG4 shows a schematic diagram of one structure of the heat dissipation layer 10; FIG5 shows a schematic diagram of one structure of the reinforcing member 20; FIG6 shows a schematic diagram of one structure of the heat dissipation layer 10 and the reinforcing member 20 being bonded together; and FIG7 shows a schematic diagram of one structure of the conductive and thermally conductive layer 30.

[0062] In one exemplary embodiment, as shown in FIG8, the heat dissipation film further includes a groove 40 partially formed on the conductive and thermally conductive layer 30 surrounding the heat dissipation layer 10; the orthographic projection of the groove 40 on the reinforcing member 20 is located inside the reinforcing member 20.

[0063] In practical implementation, after the heat dissipation film with the groove 40 is shipped to the terminal manufacturer, the terminal manufacturer can, according to actual application needs, set adhesive in the groove for bonding the mid-frame. This ensures both a lightweight design of the heat dissipation film and meets customer requirements. In one exemplary embodiment, the heat dissipation film further includes adhesive 50 disposed within the groove 40; the adhesive 50 is used for bonding to the mid-frame, and the orthographic projection of the adhesive 50 onto the reinforcing member 20 is located inside the reinforcing member 20.

[0064] Referring to Figures 9 and 10, where Figure 9 is a top view of one embodiment of the heat dissipation film provided in this disclosure, and Figure 10 is a cross-sectional view along the direction NN shown in Figure 9, specifically, in addition to the groove 40 formed on the conductive and thermally conductive layer 30 and surrounding the heat dissipation layer 10, the heat dissipation film also includes an adhesive 50 disposed in the groove 40; the adhesive 50 is used to bond with the middle frame, and the orthographic projection of the adhesive 50 on the reinforcing member 20 is located inside the reinforcing member 20. In this way, on the one hand, the groove 40 effectively constrains the adhesive 50, which can reduce the bonding area between the adhesive 50 and the middle frame to a certain extent. Even after the adhesive 50 is bonded to the middle frame, when the heat dissipation film and the adhesive 50 are separated, the pulling force at the moment of disassembly can be effectively reduced, thereby avoiding the generation of wrinkles on the back of the heat dissipation film, thus providing a guarantee for improving the water ripple problem. On the other hand, placing the adhesive 50 directly in the groove 40 opened on the conductive and heat-conducting layer 30 reduces the thickness of the heat dissipation film to a certain extent, providing a guarantee for the subsequent thinner and lighter design of the display device. In addition, the conductive and heat-conducting layer 30 can effectively disperse the stress between the middle frame and the adhesive 50 during disassembly to a certain extent, thus providing a guarantee for improving the water ripple problem.

[0065] Referring again to the exemplary embodiment shown in FIG9, FIG11 is a top view schematic diagram of one possible structure for the adhesive 50. Correspondingly, the groove 40 for accommodating the adhesive 50 is also provided at the position shown in FIG11; FIG12 is a top view schematic diagram of one possible structure for the conductive and thermally conductive layer 30 and the adhesive 50. In addition, the orthographic projection of the adhesive 50 on the reinforcing member 20 is located inside the reinforcing member 20. In this way, while taking into account the stability of the heat dissipation film structure, damage to the heat dissipation layer 10 by the adhesive 50 is effectively avoided, and the performance of the heat dissipation film is improved.

[0066] In this embodiment of the present disclosure, along a direction parallel to the plane where the heat dissipation layer 10 is located, the groove 40 is located on one side edge away from the heat dissipation layer 10, and is 0.2 mm to 1 mm away from the corresponding side edge away from the heat dissipation layer 10 of the reinforcing member 20.

[0067] Referring again to the exemplary embodiment shown in Figure 9, along a direction parallel to the plane of the heat dissipation layer 10, the groove 40 is spaced 0.2mm to 1mm away from one edge of the heat dissipation layer 10 and the corresponding edge of the reinforcing member 20 that is also spaced away from the heat dissipation layer 10. For example, along a direction parallel to the plane of the heat dissipation layer 10, the distance between the groove 40 and the corresponding edge of the reinforcing member 20 that is also spaced away from the heat dissipation layer 10 is 0.2mm. In practical applications, the groove 40 can be positioned as close as possible to the edge of the reinforcing member 20. This can, to some extent, avoid the water ripple problem of the heat dissipation film during disassembly, thus improving the performance of the heat dissipation film.

[0068] In this embodiment of the present disclosure, the heat dissipation film further includes a first through-hole H1 penetrating the heat dissipation layer 10, a second through-hole H2 penetrating the conductive and thermally conductive layer 30, and a thermoplastic polyester material 60 respectively attached to the sidewalls of the first through-hole H1 and the second through-hole H2; wherein, the sidewall of the first through-hole H1 is recessed relative to the sidewall of the second through-hole H2, and the area enclosed by the first through-hole H1 and the second through-hole H2 constitutes a fingerprint recognition area.

[0069] Referring again to the exemplary embodiments shown in Figures 2 and 9, the heat dissipation film further includes a first through-hole H1 penetrating the heat dissipation layer 10, a second through-hole H2 penetrating the conductive and thermally conductive layer 30, and a thermoplastic polyester material 60 respectively bonded to the sidewalls of the first through-hole H1 and the second through-hole H2; wherein, the tensile strength of the thermoplastic polyester material 60 is in the range of 50 MPa to 80 MPa, and its impact strength is 1.5 kJ / m2 to 2.5 kJ / m2. Exemplarily, the thermoplastic polyester material 60 may be PET, polybutylene terephthalate (PBT), polypropylene terephthalate (PTT), polycyclohexanediol terephthalate (PCT), polyethylene terephthalate copolymer (PETG), polyethylene terephthalate copolymer (PBTG), polyethylene terephthalate copolymer (PCTG), polyethylene terephthalate copolymer (PEN), etc., and is not limited herein. In this way, the thermoplastic polyester material 60 effectively prevents the powder migration of the heat dissipation layer 10 inside the heat dissipation component, thus improving the performance of the heat dissipation film.

[0070] Furthermore, the sidewall of the first via H1 is recessed compared to the sidewall of the second via H2. This allows the conductive and thermally conductive layer 30 to constrain the edge of the heat dissipation layer 10 at the first via H1 to some extent, thereby improving the performance of the heat dissipation film. Moreover, the area enclosed by the first via H1 and the second via H2 constitutes a fingerprint recognition area. In this way, fingerprint recognition devices can be disposed within the area enclosed by the first via H1 and the second via H2, further improving the performance of the heat dissipation film.

[0071] In this embodiment of the present disclosure, along a direction perpendicular to the plane where the heat dissipation layer 10 is located, the heat dissipation film further includes a buffer layer 70 and an adhesive layer 80 sequentially disposed on the side of the heat dissipation layer 10 away from the conductive and thermally conductive layer 30.

[0072] In specific implementation, referring to Figures 13 and 14, along the direction perpendicular to the plane of the heat dissipation layer 10, the heat dissipation film also includes a buffer layer 70 and an adhesive layer 80 sequentially disposed on the side of the heat dissipation layer 10 facing away from the conductive and thermally conductive layer 30. For example, the material of the buffer layer 70 is foam, and the material of the adhesive layer 80 is EMBO (extracorporeal membrane adhesive). Of course, the materials of the buffer layer 70 and the adhesive layer 80 can be set according to the actual application needs, and are not limited here.

[0073] In this embodiment of the present disclosure, along a direction perpendicular to the plane of the heat dissipation layer 10, the heat dissipation film further includes a release film 90 located on the side of the adhesive layer 80 away from the heat dissipation layer 10, and a protective film 91 located on the side of the conductive and thermally conductive layer 30 away from the heat dissipation layer 10; wherein, the thickness of the release film 90 is less than the thickness of the protective film 91, and the peel force of the release film 90 is less than the peel force of the protective film 91.

[0074] In the specific implementation process, referring to Figures 13 and 14, along the direction perpendicular to the plane where the heat dissipation layer 10 is located, the heat dissipation film also includes a release film 90 located on the side of the adhesive layer 80 facing away from the heat dissipation layer 10, and a protective film 91 located on the side of the conductive and thermally conductive layer 30 facing away from the heat dissipation layer 10. For example, the orthogonal projection of the conductive and thermally conductive layer 30 onto the protective film 91 is located inside the protective film 91. For example, the edge of the protective film 91 is recessed relative to the edge of the conductive and thermally conductive layer 30. In this way, the protective film 91 effectively protects the side of the conductive and thermally conductive layer 30 facing away from the heat dissipation layer 10, avoiding damage from the outside. Furthermore, the edges of the release film 90 are flush with the edges of the buffer layer 70 and the adhesive layer 80, respectively, thereby effectively protecting the side of the adhesive layer 80 facing away from the heat dissipation layer 10, avoiding damage from the outside. It should be noted that "flush" here can be understood as the edges of both being completely flush, or as relatively flush within the range of process tolerance. For example, the edges of the two differ by 5%. For example, the edges of the two films differ by no more than 5 mm. Furthermore, the thickness of the release film 90 is less than the thickness of the protective film 91. For instance, the thickness of the protective film 91 ranges from 75 μm to 95 μm, while the thickness of the release film 90 ranges from 40 μm to 60 μm. For instance, in the same heat dissipation film, the thickness of the protective film 91 is 85 μm, and the thickness of the release film 90 is 50 μm. In addition, the peel force of the release film 90 is less than that of the protective film 91. For instance, the peel force of the release film 90 ranges from 2 gf / in to 4 gf / in, while the peel force of the protective film 91 ranges from 9 gf / in to 11 gf / in. For instance, in the same heat dissipation film, the peel force of the release film 90 is 3 gf / in, and the peel force of the protective film 91 is 10 gf / in. In this way, when the adhesive layer 80 of the heat dissipation film is bonded to the back film in the display device by peeling off the release film 90, damage to the corresponding adhesive material of the adhesive layer 80 can be effectively avoided, thereby improving the performance of the heat dissipation film.

[0075] In this embodiment of the disclosure, the distance between the heat dissipation layer 10 and the reinforcing member 20 is 0.05mm to 0.35mm along a direction parallel to the plane where the heat dissipation layer 10 is located.

[0076] Referring again to the exemplary embodiments shown in Figures 3 and 10, the distance between the heat dissipation layer 10 and the reinforcing member 20 is 0.05 mm to 0.35 mm along a direction parallel to the plane where the heat dissipation layer 10 is located. For example, the distance between the heat dissipation layer 10 and the reinforcing member 20 is 0.2 mm. This avoids the problem of edge pressing between the heat dissipation layer 10 and the reinforcing member 20, thereby preventing the water ripple problem caused by the protrusion on the surface of the heat dissipation film due to edge pressing.

[0077] In this embodiment of the present disclosure, along a direction parallel to the plane of the heat dissipation layer 10, the heat dissipation film further includes a polyester film material 92 located between the reinforcing member 20 and the heat dissipation layer 10. The polyester film material 92 is disposed around the periphery of the heat dissipation layer 10 and is bonded to the heat dissipation layer 10. The reinforcing member 20 is disposed around the polyester film material 92. The tensile strength of the polyester film material is in the range of 150 MPa to 240 MPa.

[0078] Based on the exemplary embodiments shown in Figures 3 and 10, and as shown in Figures 15 and 16, along a direction parallel to the plane of the heat dissipation layer 10, the heat dissipation film further includes a polyester film material 92 located between the reinforcing member 20 and the heat dissipation layer 10. The tensile strength of the polyester film material 92 ranges from 150 MPa to 240 MPa. For example, the polyester film material 92 can be a polyethylene terephthalate (i.e., Mylar) film manufactured by DuPont. Furthermore, the impact strength of the polyester film material 92 can range from 6 kJ / m² to 10 kJ / m². Of course, other polyester film materials 92 can be used according to actual application needs; these materials need to ensure high temperature resistance above 200°C and good water vapor permeability, but are not limited here. Moreover, the polyester film material 92 is disposed around the periphery of the heat dissipation layer 10 and is bonded to the heat dissipation layer 10, with the reinforcing member 20 disposed around the polyester film material 92. For example, a certain space is reserved between the reinforcing member 20 and the polyester film material 92 for splicing. For example, a 10μm wide Mylar layer can be set around the graphite. Since the polyester film material 92 is relatively soft, water ripples at the seams can be effectively avoided, thereby improving the performance of the heat dissipation film.

[0079] In this embodiment of the disclosure, the edge of the reinforcing member 20 is flush with the corresponding edge of the conductive and thermally conductive layer 30 along a direction parallel to the plane where the heat dissipation layer 10 is located.

[0080] In the specific implementation process, referring to the embodiments shown in Figures 3, 10, and 13 to 16, the edge of the reinforcing member 20 is flush with the edge of the conductive and thermally conductive layer 30, thereby ensuring the structural stability of the heat dissipation film. It should be noted that "flush" here can be understood as the edges of both being completely flush, or as relatively flush within the range of process tolerances. For example, the difference between the edges is 5%. Or, for example, the difference between the edges is within 5mm.

[0081] Based on the same disclosed concept, as shown in FIG17, this disclosure also provides a display device, specifically, the display device includes:

[0082] Heat dissipation film 100 and display module 200 attached to heat dissipation film 100;

[0083] The heat dissipation film 100 includes a heat dissipation layer 10 composed of graphite, a reinforcing member 20 disposed around the periphery of the heat dissipation layer 10, and a conductive and thermally conductive layer 30 at least in contact with the heat dissipation layer 10; the tensile strength of the reinforcing member 20 is in the range of 500MPa to 1050MPa.

[0084] In specific implementation, the display device includes a heat dissipation film 100 and a display module 200 bonded to the heat dissipation film 100. The structural configuration of the heat dissipation film 100 can be referred to the description in the preceding sections. The display module 200 can be an OLED display module 200. Specifically, the heat dissipation film 100 includes a heat dissipation layer 10 composed of graphite, a reinforcing member 20 disposed around the periphery of the heat dissipation layer 10, and a conductive and thermally conductive layer 30 at least bonded to the heat dissipation layer 10. The specific configuration of the heat dissipation layer 10, the reinforcing member 20, and the conductive and thermally conductive layer 30 can be referred to the technical description in the preceding sections, and will not be repeated here. Furthermore, the tensile strength of the reinforcing member 20 ranges from 500 MPa to 1050 MPa. In this way, the edge strength of the heat dissipation film 100 is effectively improved by the reinforcing component 20 with high tensile strength. Thus, even when the heat dissipation film 100 and the adhesive 50 separate during disassembly, the high tensile strength of the reinforcing component 20 effectively prevents the formation of wrinkles on the back of the heat dissipation film 100. This fundamentally solves the problem of deformation of the back of the heat dissipation film 100 pulling the filter layer 700 in the display module 200, and effectively improves the water ripple problem.

[0085] In the embodiments of this disclosure, the display device may have the following configurations, but is not limited to these configurations.

[0086] In one exemplary embodiment, as shown in FIG18, the display device further includes an adhesive 50 located on the side of the conductive and thermally conductive layer 30 opposite to the display module 200; the adhesive 50 is used to bond with the middle frame, and the orthographic projection of the adhesive 50 on the display module 200 is located inside the reinforcing member 20.

[0087] In one exemplary embodiment, as shown in FIG19, the display device further includes a groove 40 partially formed on the conductive and thermally conductive layer 30 surrounding the heat dissipation layer 10, and an adhesive 50 disposed within the groove 40; the adhesive 50 is used to bond with the middle frame, and the orthographic projection of the adhesive 50 on the display module 200 is located inside the reinforcing member 20.

[0088] In the specific implementation process, the relevant settings of the grooves 40 in the conductive and thermally conductive layer 30 can be referred to the descriptions in the aforementioned sections, and will not be repeated here. Furthermore, the orthographic projection of the adhesive 50 on the display module 200 is located inside the reinforcing member 20. In this way, the grooves 40 can effectively constrain the adhesive 50, reducing its bonding area to a certain extent. This effectively reduces the pulling force during disassembly when the heat dissipation film 100 and adhesive 50 are separated after the adhesive 50 is bonded to the mid-frame, thus preventing wrinkles on the back of the heat dissipation film 100 and providing assurance for improving the water ripple problem. Moreover, it can also reduce the thickness of the heat dissipation film 100 to a certain extent, while ensuring a thinner and lighter design for the display device. In addition, the conductive and thermally conductive layer 30 can effectively disperse the stress between the mid-frame and adhesive 50 during disassembly, thus providing assurance for improving the water ripple problem on the front of the display device.

[0089] In this embodiment of the present disclosure, along a direction parallel to the plane where the heat dissipation layer 10 is located, the groove 40 is located on one side edge away from the heat dissipation layer 10, and is 0.2 mm to 1 mm away from the corresponding side edge away from the heat dissipation layer 10 of the reinforcing member 20.

[0090] Referring again to the exemplary embodiment shown in FIG19, along a direction parallel to the plane of the heat dissipation layer 10, the groove 40 is spaced 0.2mm to 1mm away from the edge of the heat dissipation layer 10 on one side, and the corresponding edge of the reinforcing member 20 is also spaced away from the edge of the heat dissipation layer 10. For example, the distance between the groove 40 and the corresponding edge of the reinforcing member 20 is 0.2mm. In practical applications, the groove 40 can be positioned as close as possible to the edge of the reinforcing member 20. This can, to some extent, avoid the water ripple problem on the heat dissipation film 100 during disassembly, thus improving the performance of the display device.

[0091] In one exemplary embodiment, the display device further includes at least one snap fastener 300 for fixing the heat dissipation film 100 to the display module 200; the adhesive 50 has accommodating spaces that accommodate each of the snap fasteners 300.

[0092] In specific implementation, the display device also includes at least one clip 300 for fixing the heat dissipation film 100 to the display module 200. For example, the at least one clip 300 can be one, or two or more, without limitation. Figure 20 shows a schematic diagram of one distribution of multiple clips 300 in a local area of ​​the display device. Of course, the number and distribution of the at least one clip 300 can be set according to actual application needs, which will not be detailed here. Correspondingly, the adhesive 50 has accommodating spaces to avoid the clips 300. In this way, while ensuring the adhesion performance between the heat dissipation film 100 and the display module 200, the structural stability of the display device is guaranteed.

[0093] In this embodiment of the present disclosure, along a direction perpendicular to the plane of the heat dissipation layer 10, the display device further includes a cover plate 400 disposed on the side of the display module 200 facing away from the heat dissipation film 100; each of the latches 300 includes a first part 301 and a second part 302 sequentially connected; wherein, the first part 301 extends along a direction parallel to the plane of the cover plate 400, and the second part 302 extends along a direction perpendicular to the plane of the cover plate 400; the first part 301 is fixedly connected to the conductive and thermally conductive layer 30 by a first adhesive 303, and the second part 302 is fixedly connected to the cover plate 400 by a second adhesive 304.

[0094] In one exemplary embodiment, FIG21 is a schematic cross-sectional view along the direction shown by SS in FIG20. Specifically, along the direction perpendicular to the plane of the heat dissipation layer 10, the display device further includes a cover plate 400 disposed on the side of the display module 200 opposite to the heat dissipation film 100. In this way, the cover plate 400 effectively protects the display module 200. Each latch 300 includes a first part 301 and a second part 302 connected in sequence; the first part 301 extends in a direction parallel to the plane of the cover plate 400, and the second part 302 extends in a direction perpendicular to the plane of the cover plate 400; moreover, the first part 301 is fixedly connected to the conductive and thermally conductive layer 30 by a first adhesive 303, and the second part 302 is fixedly connected to the cover plate 400 by a second adhesive 304. Exemplarily, the first adhesive 303 and the second adhesive 304 can be foam adhesive. Of course, the materials of the first adhesive 303 and the second adhesive 304 can be set according to the actual application needs, and are not limited here. In this way, the heat dissipation film 100 and the display module 200 can be stably attached through the various clips 300, thereby reducing the risk of deformation of the heat dissipation film 100 during disassembly, providing a guarantee for improving the water ripple pattern on the front of the display module 200, and thus ensuring the performance of the display device.

[0095] In the embodiments disclosed herein, each of the buckles 300 is a one-piece molded structure.

[0096] In practice, each snap fastener 300 is a one-piece molded structure. This improves the manufacturing efficiency of each snap fastener 300. For example, injection molding can be used to manufacture each snap fastener 300 using polycarbonate (PC) material. Of course, snap fasteners 300 can also be manufactured according to actual application needs, and this is not limited here.

[0097] In this embodiment of the present disclosure, the display device further includes a mid-frame connected to the adhesive 50, the mid-frame having an accommodating space that avoids the second portion 302.

[0098] In practical implementation, the display device also includes a mid-frame connected to the adhesive 50, thus ensuring the structural stability of the display device. Furthermore, the mid-frame has an accommodating space to avoid interference between the mid-frame and the clip 300. This effectively avoids the problem of water ripples on the front of the display device while maintaining its structural stability.

[0099] In this embodiment, the heat dissipation film 100 further includes a first through-hole H1 penetrating the heat dissipation layer 10, a second through-hole H2 penetrating the conductive and thermally conductive layer 30, and thermoplastic polyester material 60 respectively attached to the sidewalls of the first through-hole H1 and the second through-hole H2; wherein, the sidewall of the first through-hole H1 is recessed relative to the sidewall of the second through-hole H2, and the area enclosed by the first through-hole H1 and the second through-hole H2 constitutes a fingerprint recognition area.

[0100] In the specific implementation process, the specific settings of the first through hole H1, the second through hole H2 and the thermoplastic polyester material 60 in the heat dissipation film 100 can be implemented with reference to the description of the relevant parts mentioned above, and will not be described in detail here.

[0101] In this embodiment of the present disclosure, along a direction perpendicular to the plane where the heat dissipation layer 10 is located, the heat dissipation film 100 further includes a buffer layer 70 and an adhesive layer 80 sequentially disposed on the side of the heat dissipation layer 10 away from the conductive and thermally conductive layer 30.

[0102] In the specific implementation process, the specific settings of the buffer layer 70 and the adhesive layer 80 in the heat dissipation film 100 can be implemented with reference to the description of the relevant parts mentioned above, and will not be described in detail here.

[0103] In this embodiment of the disclosure, along a direction perpendicular to the plane where the heat dissipation layer 10 is located, the display module 200 further includes a back film 500 connected to the adhesive layer 80, and a display panel 600, a filter layer 700, and an adhesive layer 800 sequentially disposed on the side of the back film 500 away from the heat dissipation film 100.

[0104] Referring again to the exemplary embodiment shown in FIG20, the display module 200 further includes a back film 500, a display panel 600, a light filter layer 700, and an adhesive layer 800. The back film 500 is connected to the adhesive layer 80, and the display panel 600, the light filter layer 700, and the adhesive layer 800 are sequentially disposed on the side of the back film 500 facing away from the heat dissipation film 100. For example, the light filter layer 700 may be a polarizer. For example, the adhesive layer 800 may be optically transparent adhesive (OCA).

[0105] It should be noted that the display device provided in this disclosure, in addition to the film layer structure mentioned above, may also include other film layer structures. For example, the display device further includes a protective layer 900 located on the side of the cover plate 400 facing away from the display module 200. Of course, other film layer structures may be provided in the display device according to actual application needs, which will not be detailed here.

[0106] In specific implementations, the display device provided in the embodiments of this disclosure can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator. Other essential components of this display device are those that should be understood by those skilled in the art, and will not be described in detail here, nor should they be construed as limiting this disclosure.

[0107] Although preferred embodiments of this disclosure have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this disclosure.

[0108] Obviously, those skilled in the art can make various modifications and variations to this disclosure without departing from its spirit and scope. Therefore, if such modifications and variations fall within the scope of the claims of this disclosure and their equivalents, this disclosure is also intended to include such modifications and variations.

Claims

1. A heat dissipation film, wherein, include: A heat dissipation layer composed of graphite, a reinforcing member disposed around the periphery of the heat dissipation layer, and a conductive and thermally conductive layer at least in contact with the heat dissipation layer; The tensile strength of the reinforcing member ranges from 500 MPa to 1050 MPa.

2. The heat dissipation film as described in claim 1, wherein, It also includes a groove formed on the conductive and thermally conductive layer that surrounds the heat dissipation layer; the orthographic projection of the groove on the reinforcing member is located inside the reinforcing member.

3. The heat dissipation film as described in claim 2, wherein, It also includes adhesive disposed within the groove; the adhesive is used to bond to the middle frame, and the orthographic projection of the adhesive on the reinforcing member is located inside the reinforcing member.

4. The heat dissipation film as described in claim 2 or 3, wherein, Along a direction parallel to the plane of the heat dissipation layer, the groove is located on one side of the heat dissipation layer away from the heat dissipation layer, and the groove is 0.2mm to 1mm away from the corresponding side of the reinforcing member away from the heat dissipation layer.

5. The heat dissipation film according to any one of claims 1-3, wherein, It also includes a first through-hole penetrating the heat dissipation layer, a second through-hole penetrating the conductive and thermally conductive layer, and thermoplastic polyester material respectively attached to the sidewalls of the first through-hole and the second through-hole; wherein the sidewall of the first through-hole is recessed relative to the sidewall of the second through-hole, and the area enclosed by the first through-hole and the second through-hole constitutes a fingerprint recognition area.

6. The heat dissipation film as described in claim 5, wherein, Along a direction perpendicular to the plane of the heat dissipation layer, the heat dissipation film further includes a buffer layer and an adhesive layer sequentially disposed on the side of the heat dissipation layer opposite to the conductive and thermally conductive layer.

7. The heat dissipation film as described in claim 6, wherein, Along a direction perpendicular to the plane of the heat dissipation layer, the heat dissipation film further includes a release film located on the side of the adhesive layer away from the heat dissipation layer, and a protective film located on the side of the conductive and thermally conductive layer away from the heat dissipation layer; wherein, the thickness of the release film is less than the thickness of the protective film, and the peel force of the release film is less than the peel force of the protective film.

8. The heat dissipation film according to any one of claims 1-3, 6, and 7, wherein, Along a direction parallel to the plane where the heat dissipation layer is located, the distance between the heat dissipation layer and the reinforcing member is 0.05mm to 0.35mm.

9. The heat dissipation film as described in claim 8, wherein, Along a direction parallel to the plane of the heat dissipation layer, the heat dissipation film further includes a polyester film material located between the reinforcing member and the heat dissipation layer. The polyester film material is disposed around the periphery of the heat dissipation layer and is bonded to the heat dissipation layer. The reinforcing member is disposed around the polyester film material. The tensile strength of the polyester film material is in the range of 150 MPa to 240 MPa.

10. The heat dissipation film according to any one of claims 1-3, 6, 7, and 9, wherein, Along a direction parallel to the plane where the heat dissipation layer is located, the edge of the reinforcing member is flush with the corresponding edge of the conductive and thermally conductive layer.

11. A display device, wherein, include: A heat dissipation film and a display module bonded to the heat dissipation film; The heat dissipation film includes a heat dissipation layer composed of graphite, a reinforcing member disposed around the periphery of the heat dissipation layer, and a conductive and thermally conductive layer that is at least attached to the heat dissipation layer; the tensile strength of the reinforcing member is in the range of 500MPa to 1050MPa.

12. The display device as claimed in claim 11, wherein, It also includes an adhesive located on the side of the conductive and thermally conductive layer opposite to the display module; the adhesive is used to bond with the middle frame, and the orthogonal projection of the adhesive on the display module is located inside the reinforcing member.

13. The display device as claimed in claim 11, wherein, It also includes a groove partially formed on the conductive and thermally conductive layer surrounding the heat dissipation layer, and an adhesive disposed within the groove; the adhesive is used to bond to the mid-frame, and the orthographic projection of the adhesive on the display module is located inside the reinforcing member.

14. The display device as claimed in claim 12 or 13, wherein, It also includes at least one clip for fixing the heat dissipation film to the display module; the adhesive has accommodating spaces to accommodate each of the clips.

15. The display device as claimed in claim 14, wherein, Along a direction perpendicular to the plane of the heat dissipation layer, the display device further includes a cover plate disposed on the side of the display module away from the heat dissipation film; each of the latches includes a first part and a second part connected in sequence; wherein, the first part extends in a direction parallel to the plane of the cover plate, and the second part extends in a direction perpendicular to the plane of the cover plate; the first part is fixedly connected to the conductive and thermally conductive layer by a first adhesive material, and the second part is fixedly connected to the cover plate by a second adhesive material.

16. The display device as claimed in claim 15, wherein, Each of the aforementioned buckles is a one-piece molded structure.

17. The display device as claimed in claim 15 or 16, wherein, It also includes a middle frame connected to the adhesive, the middle frame having an accommodating space that avoids the second part.

18. The display device according to any one of claims 11-13, 15, and 16, wherein, The heat dissipation film further includes a first through-hole penetrating the heat dissipation layer, a second through-hole penetrating the conductive and thermally conductive layer, and thermoplastic polyester material respectively attached to the sidewalls of the first through-hole and the second through-hole; wherein, the sidewall of the first through-hole is recessed relative to the sidewall of the second through-hole, and the area enclosed by the first through-hole and the second through-hole constitutes a fingerprint recognition area.

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