Display module and display device

Abstract

A display module and a display device. The display module comprises a display panel, a first adhesive layer, and a support layer. The display panel comprises a main body portion, a bonding portion, and a bending portion located between the main body portion and the bonding portion; the main body portion has a display side and a non-display side, and the bending portion is bent toward the non-display side of the main body portion, such that the bonding portion is bent to the non-display side of the main body portion; the first adhesive layer is located between the main body portion and the bonding portion, and is in contact with the main body portion; the support layer is located between the first adhesive layer and the bonding portion, and is in contact with the first adhesive layer; the elastic modulus of the support layer is greater than or equal to 200 GPa.

Description

Display module and display device

[0001] This application claims priority to Chinese patent application No. 202510487094.8, filed on April 17, 2025, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0003] With the development of display technology, display devices (such as mobile phones, laptops, or tablets) are increasingly used in people's lives. Among them, organic light-emitting diode (OLED) display devices have received widespread attention due to their advantages such as active light emission, wide viewing angle, high contrast, fast response speed, low power consumption, and ultra-thin design. Summary of the Invention

[0004] On one hand, a display module is provided. The display module includes a display panel, a first adhesive layer, and a support layer. The display panel includes a main body portion, a binding portion, and a bent portion located between the main body portion and the binding portion; the main body portion has a display side and a non-display side, and the bent portion bends toward the non-display side of the main body portion so that the binding portion bends to the non-display side of the main body portion; the first adhesive layer is located between the main body portion and the binding portion and is in contact with the main body portion; the support layer is located between the first adhesive layer and the binding portion and is in contact with the first adhesive layer; the elastic modulus of the support layer is greater than or equal to 200 GPa.

[0005] In some embodiments, the material of the support layer includes stainless steel, ceramic, or carbon fiber.

[0006] In some embodiments, the thickness of the support layer is 0.05 mm to 0.1 mm.

[0007] In some embodiments, the display module further includes a heat dissipation layer, a conductive layer, and a second adhesive layer. The heat dissipation layer is located between the support layer and the bonding portion; the material of the heat dissipation layer includes graphite; the orthographic boundary of the bonding portion on the reference surface is located within the boundary of the orthographic projection of the heat dissipation layer on the reference surface; the conductive layer is located between the heat dissipation layer and the bonding portion, and the orthographic projection of the conductive layer on the reference surface covers the orthographic projection of the conductive layer on the reference surface; the second adhesive layer is located between the conductive layer and the bonding portion, and the orthographic projection of the second adhesive layer on the reference surface is located within the range of the orthographic projection of the bonding portion on the reference surface, and the bonding portion and the heat dissipation layer are bonded together by the second adhesive layer.

[0008] In some embodiments, the display module further includes a first protective layer located between the conductive layer and the support layer, the first protective layer surrounding the heat dissipation layer and covering at least a portion of the sidewalls of the heat dissipation layer.

[0009] In some embodiments, the display module further includes a heat dissipation layer, a conductive layer, and a third adhesive layer. The heat dissipation layer is located between the support layer and the bonding portion; the material of the heat dissipation layer includes graphite; the orthographic projection of the bonding portion on the reference surface is within the range of the orthographic projection of the heat dissipation layer on the reference surface; the conductive layer is located between the heat dissipation layer and the support layer; the third adhesive layer is located between the heat dissipation layer and the bonding portion, and the bonding portion and the heat dissipation layer are bonded by the third adhesive layer; the orthographic projection of the third adhesive layer on the reference surface covers the orthographic projection of the heat dissipation layer on the reference surface.

[0010] In some embodiments, the display module further includes a second protective layer located between the third adhesive layer and the conductive layer, the second protective layer surrounding the heat dissipation layer and covering at least a portion of the sidewalls of the heat dissipation layer.

[0011] In some embodiments, the display module further includes a release film located on the side of the third adhesive layer away from the heat dissipation layer;

[0012] The third adhesive layer includes a first adhesive portion, a second adhesive portion, and a third adhesive portion. In a projection onto the reference surface, the first adhesive portion overlaps with the bonding portion and is offset from the release film; the bonding portion and the heat dissipation layer are bonded through the first adhesive portion. In a projection onto the reference surface, the second adhesive portion does not overlap with the bonding portion but overlaps with the heat dissipation layer and is located within the range of the release film. In a projection onto the reference surface, the third adhesive portion does not overlap with the release film and is located within the range of the second protective layer. The third adhesive portion is used for bonding to the housing.

[0013] In some embodiments, the thickness of the adhesive layer is 25 μm to 100 μm; and / or, the thickness of the heat dissipation layer is 40 μm to 50 μm; and / or, the thickness of the conductive layer is 30 μm to 50 μm.

[0014] In some embodiments, the display module has a first via that penetrates at least one of a heat dissipation layer, a conductive layer, and a support layer; the display module further includes a driver chip located between the main body and the bonding portion, wherein the orthographic projection of the driver chip on the reference surface is within the range of the orthographic projection of the bonding portion on the reference surface; the driver chip is connected to the bonding portion and is located within the first via.

[0015] In some embodiments, the display module further includes a filler layer located within the first via and covering the driver chip.

[0016] In some embodiments, the first via penetrates the heat dissipation layer, and the heat dissipation layer further has a first through hole, the orthographic projection of the first through hole on the reference surface covering the orthographic projection of the first via hole on the reference surface; the display module further includes a third protective layer, the third protective layer being located within the first through hole and surrounding the first via hole, the third protective layer covering at least a portion of the hole wall of the first through hole.

[0017] In some embodiments, the display module has a second via penetrating at least one of a heat dissipation layer, a conductive layer, and a support layer; the display module further includes a flexible circuit board and a support member. The flexible circuit board has an electronic component placement portion located on the side of the conductive layer and the heat dissipation layer away from the main body portion, and the orthographic projection of the electronic component placement portion on the reference surface does not overlap with the orthographic projection of the bonding portion on the reference surface; the support member is located between the electronic component placement portion and the main body portion, and the support member is at least partially located within the second via.

[0018] In some embodiments, the second via penetrates the heat dissipation layer, and the heat dissipation layer further has a second through hole, the orthographic projection of the second through hole on the reference surface covering the orthographic projection of the second via hole on the reference surface; the display module further includes a fourth protective layer, the fourth protective layer being located inside the second through hole and surrounding the second via hole, the fourth protective layer covering at least a portion of the hole wall of the second through hole.

[0019] On the other hand, a display device is provided. The display device includes a display module as described in any of the above embodiments. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0021] Figure 1A is a structural diagram of a display device according to some embodiments;

[0022] Figure 1B is another structural diagram of a display device according to some embodiments;

[0023] Figure 2 is a cross-sectional view along section line AA in Figure 1A;

[0024] Figure 3 is a structural diagram of a display module according to some embodiments;

[0025] Figure 4 is a cross-sectional view along section line BB in Figure 1A;

[0026] Figure 5 is another structural diagram of a display module according to some embodiments;

[0027] Figure 6 is a cross-sectional view along section line CC in Figure 5;

[0028] Figure 7 is another structural diagram of a display module according to some embodiments;

[0029] Figure 8 is a cross-sectional view along section line DD in Figure 7;

[0030] Figure 9 is another structural diagram of a display module according to some embodiments;

[0031] Figure 10 is a cross-sectional view along section line EE in Figure 9;

[0032] Figure 11 is another structural diagram of a display module according to some embodiments;

[0033] Figure 12 is a cross-sectional view along section line FF in Figure 11. Detailed Implementation

[0034] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0035] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, a particular feature, structure, material, or characteristic may be included in any suitable manner in any one or more embodiments or examples.

[0036] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0037] In describing some embodiments, the terms "coupled" and "connected," and their derivative expressions, may be used. The term "connected" should be interpreted broadly; for example, a "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection via an intermediate medium. The term "coupled," for example, indicates that two or more components have direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0038] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0039] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0040] As used herein, depending on the context, the term “if” may optionally be interpreted as meaning “when”, “in the event of”, “in response to determination”, or “in response to detection”. Similarly, depending on the context, the phrase “if it is determined that…” or “if [the stated condition or event] is detected” may optionally be interpreted as meaning “in the event of determination that…”, “in response to determination that…”, “when [the stated condition or event] is detected”, or “in response to the detection of [the stated condition or event]”.

[0041] The use of “applies to” or “configured to” in this article implies an open and inclusive language that does not preclude applicability to or configuration to devices that perform additional tasks or steps.

[0042] In addition, the use of "based on" implies openness and inclusivity, because processes, steps, calculations or other actions "based on" one or more conditions or values ​​can in practice be based on additional conditions or values ​​beyond those conditions.

[0043] As used herein, “about,” “approximately,” or “approximately” includes the value stated and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0044] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where the acceptable range of deviation for approximate parallelism can be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where the acceptable range of deviation for approximate perpendicularity can also be, for example, within 5°. “equal” includes absolute equality and approximate equality, where the acceptable range of deviation for approximate equality can be, for example, the difference between the two equals being less than or equal to 5% of either one.

[0045] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on another layer or substrate, or that there is an intermediate layer between the layer or element and another layer or substrate.

[0046] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0047] As shown in Figures 1A and 1B, some embodiments of this disclosure provide a display device 1000, which can be any device that displays either moving (e.g., video) or fixed (e.g., still image) text or images.

[0048] For example, the display device 1000 can be any product or component with display function, such as a television, laptop computer, tablet computer, mobile phone, personal digital assistant (PDA), navigator, wearable device, augmented reality (AR) device, virtual reality (VR) device, in-vehicle display, or flight display.

[0049] In some examples, as shown in Figure 1A, the display device 1000 can be a portable display product. For example, the display device 1000 can be a mobile phone as shown in Figure 1A.

[0050] In some other examples, as shown in Figure 1B, the display device 1000 can be a wearable device. For example, the display device 1000 can be a watch as shown in Figure 1B.

[0051] In some embodiments, as shown in FIG2, the display device 1000 includes a display module 100 and a housing 200. The display module 100 includes a display panel 10 and a cover plate 20.

[0052] The housing 200 can be a box-shaped structure with an opening. The display panel 10 can be disposed inside the housing 200, and the cover plate 20 is disposed on one side of the display panel 10 and located at the opening of the housing 200.

[0053] As shown in Figure 2, the longitudinal section of the housing 200 can be U-shaped, for example. The display panel 10 is disposed inside the housing 200, and the cover plate 20 is disposed at the opening of the housing 200.

[0054] The display panel 10 mentioned above includes various types, and can be selected and set according to actual needs.

[0055] For example, the display panel 10 described above can be: an organic light-emitting diode (OLED) display panel, a quantum dot light-emitting diode (QLED) display panel, an active matrix organic light-emitting diode (AMOLED) display panel, or a mini / micro light-emitting display (MLED) display panel, etc. The embodiments disclosed herein do not impose specific limitations.

[0056] The following describes some embodiments of the present disclosure using the above-mentioned display panel 10 as an organic light-emitting diode display panel as an example. However, the implementation of the present disclosure is not limited to this, and any other display panel can be considered as long as the same technical concept is applied.

[0057] In some embodiments, as shown in FIG3, the display panel 10 includes a main body portion 11, a bending portion 12, and a binding portion 13 connected in sequence. The bending portion 12 is located on one side of the main body portion 11, and the binding portion 13 is located on the side of the bending portion 12 away from the main body portion 11, that is, the bending portion 12 is located between the main body portion 11 and the binding portion 13.

[0058] As shown in Figure 3, the main body 11 includes a display area A and a peripheral area B disposed on at least one side of the display area A. Some embodiments of this disclosure are illustrated by the example of the peripheral area B surrounding the display area A. The display area A is an area for displaying an image and is configured to provide a plurality of pixel units. The peripheral area B is an area for not displaying an image and is configured to provide display driving circuitry, such as a gate driving circuit and a source driving circuit.

[0059] For example, the orthographic projection of the main body 11 onto the reference plane is approximately any one of a circle, an ellipse, and a rectangle, etc., and this embodiment of the present disclosure is not specifically limited to this.

[0060] It should be noted that the reference plane is the plane on which the display surface of the main body 11 of the display panel 10 is located. Here, the display surface refers to the side surface of the main body 11 used to display image information.

[0061] In this article, "generally circular or elliptical" means that the shape is generally circular or elliptical, but is not limited to a standard circle or ellipse. That is, "circular or elliptical" here includes not only basic circular or elliptical shapes, but also shapes that are similar to circles or ellipses.

[0062] In this article, "roughly rectangular" means that the shape is rectangular overall, but not limited to a standard rectangle. That is, "rectangle" here includes not only the shape of a basic rectangle, but also shapes similar to a rectangle. For example, the long and short sides of the rectangle are curved at each intersection (i.e., at the corners), that is, the corners are smooth, and the shape is a rounded rectangle. The following description uses the example of the main body 11 being roughly a rounded rectangle as an orthographic projection on the reference plane.

[0063] As shown in Figure 3, the main body 11 has a display side 11A and a non-display side 11B that are disposed opposite to each other. It should be noted that the display side 11A refers to the side of the main body 11 that displays the image (the upper side of the main body 11 in Figure 3), and the non-display side 11B refers to the other side opposite to the display side 11A (the lower side of the main body 11 in Figure 3).

[0064] In some embodiments, as shown in FIG3, the display module 100 further includes a circuit board 30, and the bonding portion 13 can be a part of the display panel 10 used for bonding and connecting with the circuit board 30. As shown in FIG4, through a bending process, the bending portion 12 can be bent along a bending axis extending in the first direction X toward the non-display side 11B of the main body portion 11 of the display panel 10, so that the bonding portion 13 bends to the non-display side 11B of the main body portion 11, thereby reducing the bezel of the display device 1000 (as shown in FIG1A and FIG1B). Here, the bending axis is not an actual structure present in the display panel 10, but a concept proposed only to illustrate the bending process of the display panel 10.

[0065] As shown in Figure 4, after the binding part 13 is bent, the circuit board 30 can be bent along with the display panel 10 to the non-display side 11B of the main body part 11, so as to reduce the bezel of the display device 1000.

[0066] It should be noted that the bending radius of the bending part 12 can be 0.1mm to 0.5mm. For example, the bending radius of the bending part 12 can be any one of 0.1mm, 0.2mm, 0.3mm, 0.35mm, 0.4mm and 0.5mm.

[0067] It should be understood that the smaller the bending radius of the bending portion 12, the narrower the bezel of the display device 1000 corresponding to the bending portion 12 (the lower bezel in Figures 1A and 1B) can be designed, which is more conducive to the narrow bezel design of the display device 1000. For example, the bending radius of the bending portion 12 can be 0.1mm to 0.2mm, such as any one of 0.12mm, 0.15mm, and 0.18mm, so that the bezel of the display device 1000 corresponding to the bending portion 12 (the lower bezel in Figures 1A and 1B) can be made narrower.

[0068] In related technologies, display modules are relatively thick. The inventors discovered that the display module also includes a first adhesive layer, a polyimide layer, and a foam layer. The first adhesive layer is located between the main body and the bonding portion, and is in contact with the main body. The polyimide layer is located between the first adhesive layer and the bonding portion, and is in contact with the first adhesive layer. The polyimide layer supports the main body, and the foam layer is located between the polyimide layer and the bonding portion, serving a cushioning function. The total thickness of the polyimide layer and the foam layer is relatively large, resulting in a relatively thick display module.

[0069] To address the aforementioned issues, as shown in Figure 4, some embodiments of this disclosure provide a display module 100 that further includes a support layer 40 and a first adhesive layer 50. The first adhesive layer 50 is located between the main body portion 11 and the bonding portion 13, and is in contact with the main body portion 11. The support layer 40 is located between the first adhesive layer 50 and the bonding portion 13, and is in contact with the first adhesive layer 50. The elastic modulus of the support layer 40 is greater than or equal to 200 GPa.

[0070] In this configuration, the support layer 40 is relatively rigid, and there is only a first adhesive layer 50 between the main body 11 and the support layer 40. That is, apart from the first adhesive layer 50, there are no other film layers between the main body 11 and the support layer 40. On one hand, the support layer 40 can support the display panel 10, reducing the risk of deformation of the display panel 10. In other words, the support layer 40 provided in some embodiments of this disclosure can replace the polyimide layer in related technologies. On the other hand, the support layer 40 can quickly transfer the force received at a certain point on the support layer 40 to the surrounding area, avoiding stress concentration and thus playing a buffering role. In other words, the support layer 40 provided in some embodiments of this disclosure can also replace the foam layer in related technologies. Therefore, the support layer 40 of the display module 100 provided in some embodiments of this disclosure can replace the polyimide layer and foam layer in related technologies, thereby reducing the number of film layers in the display module 100 and reducing the thickness of the display module 100. Furthermore, while ensuring that the bending radius of the bending portion 12 is equal everywhere, the bending radius of the bending portion 12 can be made smaller, which is beneficial for reducing the bezel of the display device. The fact that the bending radius of the bending portion 12 is equal everywhere can make the stress in the bending portion 12 equal everywhere, reducing the risk of stress concentration in the bending portion 12, thereby reducing the risk of wire breakage in the bending portion 12.

[0071] In some examples, the boundary of the orthographic projection of the display area A onto the reference plane is within the range of the boundary of the orthographic projection of the support layer 40 onto the reference plane.

[0072] In some examples, the elastic modulus of the support layer 40 is 200 GPa to 300 GPa. For example, the elastic modulus of the support layer 40 is 200 GPa, 218 GPa, 225 GPa, 230 GPa, 243 GPa, 258 GPa, 265 GPa, 273 GPa, 291 GPa, or 300 GPa.

[0073] In some examples, the material of the support layer 40 includes stainless steel, ceramic, or carbon fiber.

[0074] In some examples, the thickness of the support layer 40 is 0.05 mm to 0.1 mm. For example, the thickness of the support layer 40 is 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm or 0.1 mm.

[0075] In some examples, the bending radius of the bend 12 is less than or equal to 0.1 mm. For example, the bending radius of the bend 12 is less than or equal to 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, or 0.1 mm.

[0076] In some examples, the material of the first adhesive layer 50 may include other adhesive materials with high light transmittance (e.g., light transmittance greater than or equal to 90%), such as optically clear adhesive (OCA) or pressure-sensitive adhesive (PSA). For example, the material of the first adhesive layer 50 may include optical adhesive.

[0077] For example, the material of the first adhesive layer 50 includes OCA, and the thickness of the first adhesive layer 50 is 35 μm to 50 μm. For example, the thickness of the first adhesive layer 50 is 35 μm, 36 μm, 38 μm, 40 μm, 41 μm, 42 μm, 45 μm, 47 μm, or 50 μm.

[0078] Alternatively, by way of example, the material of the first adhesive layer 50 includes a mesh adhesive, and the thickness of the first adhesive layer 50 is 30μm to 40μm. For example, the thickness of the first adhesive layer 50 is 30μm, 31μm, 32μm, 33μm, 34μm, 35μm, 36μm, 37μm, 38μm, 39μm, or 40μm. The mesh adhesive includes multiple intersecting vertical and horizontal lines. The arrangement of the horizontal and vertical lines in the mesh adhesive allows for better expulsion of air between the mesh adhesive and the support layer 40 or the main body 11 during application, reducing the probability of air bubble formation. This results in a smoother application of the mesh adhesive to the support layer 40 or the main body 11, improving the tightness of the bond between the support layer 40 and the main body 11.

[0079] In some embodiments, as shown in FIG4, the display module 100 further includes a heat dissipation layer 60, which is located between the support layer 40 and the bonding portion 13. The heat dissipation layer 60 is configured to dissipate heat generated by the display module 100 to the outside environment.

[0080] In some examples, the boundary of the orthographic projection of the display area A onto the reference plane lies within the boundary of the orthographic projection of the heat dissipation layer 60 onto the reference plane.

[0081] In some examples, the heat dissipation layer 60 is a vapor chamber or a graphite plate. The graphite plate is made by pressing graphite powder.

[0082] In some examples, the thickness of the heat dissipation layer 60 is 40 μm to 50 μm.

[0083] For example, the thickness of the heat dissipation layer 60 is 40μm, 41μm, 42μm, 43μm, 44μm, 45μm, 46μm, 47μm, 48μm, 49μm or 50μm.

[0084] In some embodiments, the display module 100 further includes a conductive layer 70 located between the support layer 40 and the bonding portion 13, and the conductive layer 70 is used for grounding.

[0085] In some examples, as shown in Figure 4, the orthographic projection of the display area A onto the reference plane is located within the boundary of the orthographic projection of the conductive layer 70 onto the reference plane.

[0086] In some examples, the material of conductive layer 70 includes copper, silver, aluminum, or gold.

[0087] In some examples, the thickness of the conductive layer 70 is 30 μm to 50 μm.

[0088] For example, the thickness of the conductive layer 70 is 30μm, 32μm, 33μm, 35μm, 37μm, 39μm, 40μm, 41μm, 42μm, 45μm, 46μm, 47μm, 48μm, 49μm or 50μm.

[0089] In some embodiments, as shown in Figures 5 and 6, the display module 100 includes a heat dissipation layer 60 and a conductive layer 70. The heat dissipation layer 60 is located between the support layer 40 and the bonding portion 13. The material of the heat dissipation layer 60 includes graphite. The orthographic boundary of the bonding portion 13 on the reference plane is located within the boundary of the orthographic projection of the heat dissipation layer 60 on the reference plane. The conductive layer 70 is located between the heat dissipation layer 60 and the bonding portion 13. The orthographic projection of the conductive layer 70 on the reference plane covers the orthographic projection of the conductive layer 70 on the reference plane.

[0090] With this configuration, the heat dissipation layer 60 is partially exposed by the bonding portion 13, and the conductive layer 70 can prevent the graphite powder at the exposed portion of the heat dissipation layer 60 from moving to other components (e.g., electronic components) in the display module 100, thereby reducing the risk of graphite powder drifting into other components and improving the service life of the display module 100.

[0091] Based on this, as shown in Figure 6, the display module 100 further includes a second adhesive layer 80. The second adhesive layer 80 is located between the conductive layer 70 and the bonding portion 13. The orthographic projection of the second adhesive layer 80 onto the reference plane is within the range of the orthographic projection of the bonding portion 13 onto the reference plane. The bonding portion 13 and the heat dissipation layer 60 are bonded together by the second adhesive layer 80. In this way, the area and weight of the second adhesive layer 80 are relatively small, which helps to reduce the weight of the display module 100.

[0092] In some examples, the material of the second adhesive layer 80 can be the same as that of the first adhesive layer 50, which can improve the consistency of materials in the display module 100 and reduce the manufacturing cost of the display module 100.

[0093] For example, the material of the second adhesive layer 80 is pressure-sensitive adhesive, and the thickness of the second adhesive layer 80 is 25μm to 100μm. For example, the thickness of the second adhesive layer 80 is 25μm, 30μm, 35μm, 40μm, 45μm, 50μm, 60μm, 70μm, 80μm, 90μm, or 100μm.

[0094] In addition, the portion of the conductive layer 70 exposed by the bend 12 is connected to the housing 200, thus completing the grounding.

[0095] In some embodiments, as shown in Figures 5 and 6, the display module 100 further includes a first protective layer 90. The first protective layer 90 is located between the conductive layer 70 and the support layer 40, surrounds the heat dissipation layer 60, and covers at least a portion of the sidewalls of the heat dissipation layer 60. Thus, the first protective layer 90 can prevent graphite powder on the sidewalls of the heat dissipation layer 60 from moving to other components in the display module 100, thereby reducing the risk of graphite powder drifting into other components and improving the service life of the display module 100.

[0096] In some examples, the material of the first protective layer 90 includes polyethylene terephthalate (PET).

[0097] In other embodiments, the display module 100 further includes a first protective layer 90, which is located between the conductive layer 70 and the support layer 40. In orthographic projection onto a reference plane, the first protective layer 90 is located within the conductive layer 70 and the support layer 40. The first protective layer 90 surrounds the heat dissipation layer 60, and a gap exists between the first protective layer 90 and the heat dissipation layer 60. Thus, the first protective layer 90, the conductive layer 70, and the support layer 40 work together to prevent graphite powder on the sidewall of the heat dissipation layer 60 from moving to other components in the display module 100, thereby reducing the risk of graphite powder drifting into other components and improving the service life of the display module 100.

[0098] Based on this, when the pressure in the gap between the first protective layer 90 and the heat dissipation layer 60 is greater than the external pressure, or when the pressure in the gap between the first protective layer 90 and the heat dissipation layer 60 is less than the external pressure, the support layer 40 is relatively hard and not easily deformed, which can improve the problem of mold marks on the display panel 10 caused by the easy deformation of the support layer 40.

[0099] In some embodiments, as shown in Figures 7 and 8, the display module 100 includes a heat dissipation layer 60 and a conductive layer 70. The heat dissipation layer 60 is located between the support layer 40 and the bonding portion 13. The material of the heat dissipation layer 60 includes graphite. The orthographic projection of the bonding portion 13 onto the reference plane is located within the range of the orthographic projection of the heat dissipation layer 60 onto the reference plane. The conductive layer 70 is located between the heat dissipation layer 60 and the support layer 40. In this way, the heat dissipation layer 60 is partially exposed by the bonding portion 13, and the heat dissipation layer 60 is located on the side of the conductive layer 70 away from the support layer 40. The conductive layer 70 cannot prevent the graphite powder at the portion of the heat dissipation layer 60 exposed by the bending portion 12 from moving to other parts of the display module 100.

[0100] Based on this, as shown in Figures 7 and 8, the display module 100 further includes a third adhesive layer 110. The third adhesive layer 110 is located between the heat dissipation layer 60 and the bonding portion 13, and the bonding portion 13 and the heat dissipation layer 60 are bonded together by the third adhesive layer 110. The orthographic projection of the third adhesive layer 110 onto the reference plane covers the orthographic projection of the heat dissipation layer 60 onto the reference plane. In this manner, on the one hand, the bonding portion 13 and the heat dissipation layer 60 are bonded together by the third adhesive layer 110. On the other hand, the third adhesive layer 110 can prevent graphite powder at the portion of the heat dissipation layer 60 exposed by the bending portion 12 from moving to other parts of the display module 100, thereby reducing the risk of graphite powder drifting to other parts.

[0101] In some examples, the material of the third adhesive layer 110 can be the same as the material of the first adhesive layer 50, which can improve the consistency of materials in the display module 100 and reduce the manufacturing cost of the display module 100.

[0102] For example, the material of the third adhesive layer 110 is pressure-sensitive adhesive, and the thickness of the third adhesive layer 110 is 25μm to 100μm. For example, the thickness of the second adhesive layer 80 is 25μm, 30μm, 35μm, 40μm, 45μm, 50μm, 60μm, 70μm, 80μm, 90μm, or 100μm.

[0103] Furthermore, as shown in Figure 7, the display module 100 has a third via 103, which penetrates the third adhesive layer 110 and the heat dissipation layer 60. The orthographic projection of the third via 103 on the reference plane does not overlap with the orthographic projection of the bonding portion 13 on the reference plane. The portion of the conductive layer 70 exposed by the third via 103 is connected to the housing 200 to complete grounding.

[0104] In some embodiments, as shown in Figures 7 and 8, the display module 100 further includes a second protective layer 120. The second protective layer 120 is located between the third adhesive layer 110 and the conductive layer 70. The second protective layer 120 surrounds the heat dissipation layer 60 and covers at least a portion of the sidewalls of the heat dissipation layer 60. In this way, the second protective layer 120 can prevent graphite powder on the sidewalls of the heat dissipation layer 60 from moving to other components in the display module 100, thereby reducing the risk of graphite powder drifting into other components and improving the service life of the display module 100.

[0105] In some examples, the material of the second protective layer 120 includes polyethylene terephthalate (PET).

[0106] In other embodiments, the display module 100 further includes a second protective layer 120, which is located between the conductive layer 70 and the third adhesive layer 110. In orthographic projection onto a reference plane, the second protective layer 120 is located within the conductive layer 70 and within the third adhesive layer 110. The second protective layer 120 surrounds the heat dissipation layer 60, and a gap exists between the second protective layer 120 and the heat dissipation layer 60. Thus, the second protective layer 120, the conductive layer 70, and the third adhesive layer 110 work together to prevent graphite powder on the sidewall of the heat dissipation layer 60 from moving to other components in the display module 100, thereby reducing the risk of graphite powder drifting into other components and improving the service life of the display module 100.

[0107] In some embodiments, as shown in Figures 7 and 8, the display module 100 further includes a release film 130 located on the side of the third adhesive layer 110 away from the heat dissipation layer 60. In this way, the release film 130 can reduce the risk of the portion of the third adhesive layer 110 exposed by the bend 12 adhering to other portions of the display module 100.

[0108] In some embodiments, the third adhesive layer 110 includes a first adhesive portion 111, a second adhesive portion 112, and a third adhesive portion 113. In orthographic projection onto a reference plane, the first adhesive portion 111 overlaps with the bonding portion 13 but does not overlap with the release film 130; the bonding portion 13 and the heat dissipation layer 60 are bonded together by the first adhesive portion 111. The second adhesive portion 112 does not overlap with the bonding portion 13, overlaps with the heat dissipation layer 60, and is located within the area of ​​the release film 130. In orthographic projection onto a reference plane, the third adhesive portion 113 does not overlap with the release film 130 and is located within the area of ​​the second protective layer 120; the third adhesive portion 113 is used to bond to the housing 200.

[0109] With this configuration, on the one hand, the third adhesive layer 110 can not only bond the bonding part 13 and the heat dissipation layer 60, but also connect the display module 100 and the housing 200. On the other hand, during the process of disassembling the housing 200 and the display module 100, the second protective layer 120 is stressed while the heat dissipation layer 60 is not stressed, thereby reducing the risk of delamination of the heat dissipation layer 60.

[0110] In some examples, the third adhesive portion 113 includes a first adhesive strip 1131, a second adhesive strip 1132, and a third adhesive strip 1133 connected in sequence. In orthographic projection onto a reference plane, both the first adhesive strip 1131 and the third adhesive strip 1133 extend along a first direction X, and are located on opposite sides of the heat dissipation layer 60 along a second direction Y. The second adhesive strip 1132 extends along the second direction Y, and is located on the side of the heat dissipation layer 60 away from the bonding portion 13.

[0111] In some embodiments, as shown in Figures 9 and 10, the display module 100 has a first via 101 that penetrates at least one of the heat dissipation layer 60, the conductive layer 70, and the support layer 40.

[0112] Based on this, the display module 100 also includes a driver chip 140, which is located between the main body 11 and the bonding part 13. The orthographic projection of the driver chip 140 on the reference surface is within the range of the orthographic projection of the bonding part 13 on the reference surface. The driver chip 140 is connected to the bonding part 13 and is located in the first via 101.

[0113] This configuration offers several advantages. First, it frees up space on the side of the mounting portion 13 furthest from the main body 11, allowing for the placement of other electronic components and expanding the applicability of the display device. Second, it shortens the heat transfer path between the driver chip 140 and the heat dissipation layer 60, enabling rapid transfer of heat generated by the driver chip 140 to the heat dissipation layer 60 and subsequently to the outside environment, thus improving the heat dissipation efficiency of the display module 100.

[0114] In some examples, the first via 101 penetrates the heat dissipation layer 60 and the conductive layer 70.

[0115] In some examples, as shown in Figure 10, the first via 101 penetrates the heat dissipation layer 60, the conductive layer 70, and the support layer 40.

[0116] In some embodiments, as shown in FIG10, the display module 100 further includes a filler layer 150, which is located within the first via 101 and covers the driver chip 140. In this way, the filler layer 150 can protect the driver chip 140 and reduce the risk of collision between the driver chip 140 and the hole wall of the first via 101 of the functional stack.

[0117] In some examples, the filler layer 150 is made of thermosetting adhesive.

[0118] In some embodiments, as shown in FIG10, a first via 101 penetrates a heat dissipation layer 60. The heat dissipation layer 60 also has a first through-hole 61, the orthographic projection of the first through-hole 61 on a reference surface covering the orthographic projection of the first via 101 on the reference surface. The display module 100 further includes a third protective layer 160, which is located within the first through-hole 61 and surrounds the first via 101, covering at least a portion of the hole wall of the first through-hole 61. Thus, the third protective layer 160 can prevent graphite powder on the hole wall of the first via 101 from moving to other components in the display module 100, thereby reducing the risk of graphite powder drifting into other components and improving the service life of the display module 100.

[0119] In some embodiments, as shown in Figures 11 and 12, the circuit board 30 is a flexible circuit board 30. The flexible circuit board 30 has an electronic component placement section 31, which is located on the side of the conductive layer 70 and the heat dissipation layer 60 away from the main body 11. The orthographic projection of the electronic component placement section 31 on the reference plane does not overlap with the orthographic projection of the bonding portion 13 on the reference plane. The electronic component placement section 31 is used to place components such as resistors, diodes, capacitors, and transistors.

[0120] In addition, the display module 100 also includes a support member 170, which is located between the electronic component mounting section 31 and the main body section 11. Thus, during the mounting of components such as resistors, diodes, capacitors, and transistors on the flexible circuit board 30, the support member 170 can support the electronic component mounting section 31, reducing the risk of deformation of the flexible circuit board 30.

[0121] Based on this, the flexible circuit board 30 also includes a first connecting portion 32 and a second connecting portion 33. The first connecting portion is used for bonding with the binding portion 13, and the second connecting portion 33 is used for connecting with the motherboard.

[0122] In some embodiments, as shown in Figures 11 and 12, the display module 100 has a second via 102 that penetrates at least one of the heat dissipation layer 60, the conductive layer 70, and the support layer 40. The support member 170 is at least partially located within the second via 102. This reduces the distance between the flexible circuit board 30 and the support layer 40, thereby reducing the thickness of the display module 100.

[0123] In some examples, as shown in Figures 11 and 12, the second via 102 penetrates the heat dissipation layer 60, and the support 170 is connected to the conductive layer 70 via conductive adhesive. In other examples, the second via 102 penetrates both the heat dissipation layer 60 and the conductive layer 70. In still other examples, the second via 102 penetrates the heat dissipation layer 60, the conductive layer 70, and the support layer 40.

[0124] In some embodiments, as shown in Figures 11 and 12, the second via 102 penetrates the heat dissipation layer 60, and the heat dissipation layer 60 also has a second through hole 62. The orthographic projection of the second through hole 62 on the reference plane covers the orthographic projection of the second via 102 on the reference plane. The display module 100 also includes a fourth protective layer 180, which is located within the second through hole 62 and surrounds the second via hole 102, covering at least a portion of the hole wall of the second through hole 62. In this way, the fourth protective layer 180 can prevent graphite powder on the hole wall of the second through hole 102 from moving to other components in the display module 100, thereby reducing the risk of graphite powder drifting into other components and improving the service life of the display module 100.

[0125] In some embodiments, as shown in FIG4, the display module 100 further includes a fourth adhesive layer 190 and a circular polarizer 210. The circular polarizer 210 is located between the cover plate and the main body 11, and is configured to reduce the reflection of ambient light by the display panel 10. The fourth adhesive layer 190 is located between the cover plate 20 and the circular polarizer 210. The fourth adhesive layer 190 is configured to bond the cover plate 20 and the circular polarizer 210.

[0126] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0127] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A display module, comprising: The display panel includes a main body, a binding part, and a bent part located between the main body and the binding part; The main body has a display side and a non-display side, and the bending portion bends toward the non-display side of the main body so that the binding portion bends toward the non-display side of the main body; The first adhesive layer is located between the main body and the binding part, and is in contact with the main body; A support layer is located between the first adhesive layer and the binding portion, and is in contact with the first adhesive layer; the elastic modulus of the support layer is greater than or equal to 200 GPa.

2. The display module according to claim 1, wherein, The material of the support layer includes stainless steel, ceramic, or carbon fiber.

3. The display module according to claim 2, wherein, The thickness of the support layer is 0.05mm to 0.1mm.

4. The display module according to any one of claims 1 to 3, further comprising: A heat dissipation layer is located between the support layer and the bonding portion; The material of the heat dissipation layer includes graphite; the orthographic projection boundary of the bonding portion on the reference plane is located within the boundary of the orthographic projection of the heat dissipation layer on the reference plane. A conductive layer is located between the heat dissipation layer and the bonding portion, and the orthographic projection of the conductive layer on the reference surface covers the orthographic projection of the conductive layer on the reference surface. A second adhesive layer is located between the conductive layer and the bonding portion. The orthographic projection of the second adhesive layer on the reference surface is within the range of the orthographic projection of the bonding portion on the reference surface. The bonding portion and the heat dissipation layer are bonded together by the second adhesive layer.

5. The display module according to claim 4, further comprising: A first protective layer is located between the conductive layer and the support layer, the first protective layer is disposed around the heat dissipation layer, and covers at least a portion of the sidewalls of the heat dissipation layer.

6. The display module according to any one of claims 1 to 3, further comprising: A heat dissipation layer is located between the support layer and the bonding portion; the material of the heat dissipation layer includes graphite; the orthographic projection of the bonding portion on the reference plane is located within the range of the orthographic projection of the heat dissipation layer on the reference plane; A conductive layer is located between the heat dissipation layer and the support layer; A third adhesive layer is located between the heat dissipation layer and the bonding portion, and the bonding portion and the heat dissipation layer are bonded together by the third adhesive layer; The orthographic projection of the third adhesive layer on the reference surface covers the orthographic projection of the heat dissipation layer on the reference surface.

7. The display module according to claim 6, further comprising: A second protective layer is located between the third adhesive layer and the conductive layer, the second protective layer is disposed around the heat dissipation layer and covers at least a portion of the sidewalls of the heat dissipation layer.

8. The display module according to claim 7, further comprising: The release film is located on the side of the third adhesive layer away from the heat dissipation layer; The third adhesive layer includes: In the orthographic projection onto the reference surface, the first adhesive portion overlaps with the bonding portion and is offset from the release film. The bonding portion and the heat dissipation layer are bonded together through the first adhesive portion. The second adhesive portion, in its orthographic projection onto the reference surface, does not overlap with the bonding portion, overlaps with the heat dissipation layer, and is located within the range of the release film. The third adhesive portion, in its orthographic projection onto the reference surface, does not overlap with the release film and is located within the range of the second protective layer; the third adhesive portion is used to bond to the housing.

9. The display module according to any one of claims 4 to 8, wherein, The thickness of the adhesive layer is 25μm to 100μm; and / or the thickness of the heat dissipation layer is 40μm to 50μm; and / or the thickness of the conductive layer is 30μm to 50μm.

10. The display module according to any one of claims 4 to 9, having a first via, the first via penetrating at least one of a heat dissipation layer, a conductive layer, and a support layer; The display module also includes: A driving chip is located between the main body and the bonding part, and the orthographic projection of the driving chip on the reference surface is within the range of the orthographic projection of the bonding part on the reference surface. The driver chip is connected to the bonding part, and the driver chip is located inside the first via.

11. The display module according to claim 10, further comprising: A filling layer is located within the first via and covers the driver chip.

12. The display module according to claim 10 or 11, wherein, The first via penetrates the heat dissipation layer, and the heat dissipation layer also has a first through hole, the orthographic projection of the first through hole on the reference surface covering the orthographic projection of the first via on the reference surface; the display module further includes: A third protective layer is located inside the first through hole and surrounds the first through hole, the third protective layer covering at least a portion of the hole wall of the first through hole.

13. The display module according to any one of claims 4 to 12, comprising a second via, the second via penetrating at least one of a heat dissipation layer, a conductive layer, and a support layer; the display module further comprising: A flexible circuit board has an electronic component mounting section located on the side of the conductive layer and the heat dissipation layer away from the main body. The orthographic projection of the electronic component mounting section on the reference surface does not overlap with the orthographic projection of the bonding section on the reference surface. A support member is located between the electronic component mounting portion and the main body portion, and the support member is at least partially located within the second through hole.

14. The display module according to claim 13, wherein, The second via penetrates the heat dissipation layer, and the heat dissipation layer also has a second through-hole, the orthographic projection of the second through-hole on the reference surface covering the orthographic projection of the second via on the reference surface; the display module further includes: A fourth protective layer is located inside the second through hole and surrounds the second through hole, the fourth protective layer covering at least a portion of the hole wall of the second through hole.

15. A display device, comprising: The display module as described in any one of claims 1 to 14.

Images