Data acquisition system and data acquisition method for x-ray photoelectron spectroscopy analysis

Abstract

Provided in the present application are a data acquisition system and a data acquisition method for X-ray photoelectron spectroscopy analysis. The system comprises a processor, a module power supply, and a detector, wherein the module power supply supplies power to an electron beam control module; the processor is connected to both the module power supply and the detector; the processor sequentially executes a plurality of sampling processes; in each sampling process, the processor configures a first electrical parameter for the module power supply, so that the module power supply outputs to the electron beam control module a first electrical signal corresponding to the first electrical parameter; once the processor confirms that the module power supply has outputted the first electrical signal, the processor triggers the detector to sample an electron beam; and the processor receives a data acquisition completion signal fed back by the detector upon completion of sampling the electron beam, so as to trigger the configuration of a second electrical parameter for the module power supply to execute the next sampling process. Using the present application can achieve real-time data synchronization and state sharing between devices in the data acquisition system, and can achieve highly efficient data acquisition for X-ray photoelectron spectroscopy analysis. The present application has high applicability.

Description

Data acquisition system and data acquisition method for X-ray photoelectron spectroscopy analysis

[0001] This application claims priority to Chinese Patent Application No. 202510495839.5, filed on April 18, 2025, with the China National Intellectual Property Administration, entitled “Data Acquisition System and Data Acquisition Method for Electron Beam Composition Analysis”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of data processing technology, and in particular to a data acquisition system and data acquisition method for X-ray photoelectron spectroscopy analysis. Background Technology

[0003] With the continuous advancement of X-ray photoelectron spectroscopy (XPS) technology, XPS systems are increasingly widely used in various fields such as industry, scientific research, biology, and semiconductors. In semiconductor manufacturing, XPS typically includes sample collection, data acquisition, data processing, and result analysis. Among these, data acquisition is the foundation and key to the entire XPS process.

[0004] In existing X-ray photoelectron spectroscopy (XPS) analysis, the data acquisition system typically includes a high-voltage source, an electron gun, an analyzer control board, and a detector. The analyzer control board controls the electron gun to generate the data to be acquired under different high-voltage conditions, and then controls the detector to acquire the data. However, in the current technology, the analyzer control board triggers the electron gun to configure voltage parameters to generate the data to be acquired via a universal serial bus (USB) interface, and then triggers the detector to acquire the data via the USB interface. Therefore, the discrete control architecture of the existing technology still suffers from problems such as control delay and lack of status feedback in the coordination mechanism of parameter configuration and sampling triggering, resulting in low data acquisition efficiency. Summary of the Invention

[0005] This application provides a data acquisition system and method for X-ray photoelectron spectroscopy analysis, which can realize real-time mutual transmission of status and data between devices in the data acquisition system, reduce the data / status synchronization delay between devices, and thus realize real-time data synchronization and status awareness between devices in the system. This can improve the data acquisition efficiency and system performance of the data acquisition system, and has high applicability.

[0006] In a first aspect, this application provides a data acquisition system for X-ray photoelectron spectroscopy analysis. The data acquisition system includes a processor, a module power supply, and a detector. The module power supply provides power to an electron beam modulation module for controlling X-ray photoelectron spectroscopy analysis. The processor is connected to the module power supply and the detector. The processor sequentially executes multiple sampling processes. In each sampling process, the processor configures a first electrical parameter to the module power supply, causing the module power supply to output a first electrical signal corresponding to the first electrical parameter to the electron beam modulation module. After confirming that the module power supply outputs the first electrical signal, the processor triggers the detector to sample the electron beam. The processor receives a data acquisition completion signal from the detector after sampling the electron beam, thereby triggering the configuration of a second electrical parameter to the module power supply to execute the next sampling process. In this application, the data acquisition system can dynamically configure the electrical parameters of the module power supply through the processor, trigger the detector to sample the electron beam, and switch the configuration of the module power supply's electrical parameters after receiving the detector's feedback signal to execute the next round of sampling. The module power supply can provide power to the electron beam control module, the detector can sample the electron beam, and the processor can realize information exchange with the module power supply and with the detector, enabling real-time communication between devices. This allows the processor to control the module power supply and detector in real time, reducing communication delays between devices and enabling real-time status awareness between devices. Therefore, by configuring the closed-loop parameters of the module power supply and controlling the timing of the detector, the processor achieves fully automatic sampling switching in the dynamic analysis of electron beam multi-parameters, significantly improving data acquisition efficiency.

[0007] In one possible implementation of the first aspect, the processor includes a first parameter configuration interface connected to the module power supply. The processor configures electrical parameters to the module power supply via the first parameter configuration interface to trigger the module power supply to output an electrical signal corresponding to the electrical parameters to the electron beam control module. Each sampling process corresponds to one electrical parameter, and the electrical parameters include the first electrical parameter and the second electrical parameter. In this application, the processor's first parameter configuration interface allows for the configuration of electrical parameters to the module power supply, triggering the module power supply to output an electrical signal corresponding to the electrical parameters to the electron beam control module. Data transmission via the first parameter configuration interface reduces the latency of data synchronization between the processor and the module power supply, enabling real-time triggering of electrical parameter configuration for the module power supply. This improves the configuration efficiency of the module power supply's electrical parameters and, consequently, the efficiency of the module power supply in powering the electron beam control module, resulting in high applicability.

[0008] In one possible implementation of the first aspect, the module power supply includes a second parameter configuration interface connected to the processor. The module power supply receives electrical parameters from the processor via the second parameter configuration interface and outputs an electrical signal corresponding to the electrical parameters to the electron beam control module. In this application, the second parameter configuration interface of the module power supply can communicate with the first parameter configuration interface of the processor, receive electrical parameters transmitted by the first parameter configuration interface, and output an electrical signal corresponding to the electrical parameters to the electron beam control module to generate an electron beam to be sampled. Data transmission via the first and second parameter configuration interfaces reduces the data synchronization delay between the processor and the module power supply, improving the communication efficiency between them. Similarly, it improves the configuration efficiency of the module power supply's electrical parameters, thereby increasing the efficiency of the module power supply in powering the electron beam control module, resulting in high applicability.

[0009] In one possible implementation of the first aspect, the module power supply further includes a configuration status transmission interface; the configuration status transmission interface is connected to the processor; the module power supply is used to transmit a parameter configuration completion signal to the processor through the configuration status transmission interface after outputting the first electrical signal corresponding to the first electrical parameter to the electron beam control module. In this application, the configuration status transmission interface of the module power supply can transmit a parameter configuration completion signal to the processor after outputting the electrical signal corresponding to the electrical parameter to the electron beam control module, thereby triggering the processor to execute the next action. This enables real-time status sharing between the module power supply and the processor, reduces the latency of status sharing between devices, and thus improves the data processing efficiency of the system.

[0010] In one possible implementation of the first aspect, the processor further includes a configuration status sensing interface connected to the module power supply. The processor, upon receiving the parameter configuration completion signal through the configuration status sensing interface, triggers the detector to sample the electron beam. In this application, the processor can communicate with the configuration status transmission interface of the module power supply via the configuration status sensing interface. By receiving the parameter configuration completion signal transmitted by the module power supply through the configuration status sensing interface, it can quickly determine that the module power supply has completed outputting the electrical signal corresponding to the electrical parameters to the electron beam control module. This triggers the detector to sample the electron beam, reducing the delay between the module power supply completing the output of the electrical signal corresponding to the electrical parameters to the electron beam control module and the detector starting to sample the electron beam, thereby improving the data acquisition efficiency of the data acquisition system.

[0011] In one possible implementation of the first aspect, the processor includes a first detection activation interface connected to the detector. After confirming that the module power supply outputs the first electrical signal, the processor outputs a detection activation signal to the detector via the first detection activation interface. This detection activation signal triggers the detector to sample the electron beam. In this application, the processor's first detection activation interface can output a detection activation signal to the detector to trigger electron beam sampling, enabling real-time signal transmission between the processor and the detector, reducing the delay in the detector's electron beam sampling activation, and thereby improving the data acquisition efficiency of the data acquisition system.

[0012] In one possible implementation of the first aspect, the detector includes a second detection activation interface connected to the processor. The detector is used to sample the electron beam after acquiring the detection activation signal through the second detection activation interface. In this application, the detector's second detection activation interface can communicate with the processor's first detection activation interface, receiving the detection activation signal transmitted by the first detection activation interface. The detector can receive a trigger command from the processor via the detection activation signal, thereby starting to sample the electron beam. This allows for real-time control of the detector by the processor. Direct communication between the detector and the processor interface reduces the delay in the detector's electron beam sampling, thus improving the data acquisition efficiency of the data acquisition system.

[0013] In one possible implementation of the first aspect, the detector further includes a detection status transmission interface connected to the processor. The detector, after electron beam sampling is completed, sends a data acquisition completion signal to the processor via the detection status transmission interface. In this application, the detector's detection status transmission interface can output a data acquisition completion signal to the processor to provide feedback on the data acquisition status. This enables real-time status sharing between the detector and the processor, reducing the latency of status sharing between devices and thereby improving the system's data processing performance.

[0014] In one possible implementation of the first aspect, the processor further includes a detection state sensing interface connected to the detector. After receiving the data acquisition completion signal via the detection state sensing interface, the processor configures a second electrical parameter to the module power supply to execute the next sampling process. In this application, the processor can communicate with the detector via the detection state sensing interface and receive the data acquisition completion signal transmitted via the detection state transmission interface. The processor can determine that the detector has completed sampling of the electron beam via the data acquisition completion signal, and then configure the second electrical parameter to the module power supply. This enables state sharing among the detector, processor, and module power supply. Direct communication between the detector and processor interfaces reduces the delay in the processor's awareness of data acquisition completion, thereby reducing the delay in triggering the configuration of the module power supply's electrical parameters. This improves the data acquisition efficiency of the data acquisition system and enhances its applicability.

[0015] In one possible implementation of the first aspect, the processor includes a first processing unit and a second processing unit. During the sampling process, the first processing unit issues a voltage regulation command to the second processing unit, and the second processing unit obtains the second electrical parameter according to the voltage regulation command. After receiving the data acquisition completion signal, the second electrical parameter is configured to configure the module power supply to execute the next sampling process. The first processing unit is a microcontroller, and the second processing unit is a programmable gate array (PGA). In this application, through the division of labor and cooperation between the first and second processing units in the processor, seamless voltage regulation and spectrum acquisition can be achieved, reducing the latency of state sharing and data synchronization between devices, thereby improving the data acquisition efficiency of the data acquisition system. Furthermore, the integrated design maintains a streamlined system structure and high applicability.

[0016] In one possible implementation of the first aspect, the detector further includes a data transmission interface connected to the processor; the detector is used to output the sampled data to the processor via the data transmission interface after the electron beam sampling is completed and the sampled data is obtained. In this application, the data transmission interface of the detector can output the sampled data to the processor in real time after the electron beam sampling is completed, which can reduce the delay of data synchronization transmission and thus improve the data transmission efficiency of the data acquisition system.

[0017] In one possible implementation of the first aspect, the processor includes a data acquisition interface connected to the detector; the processor is used to receive the sampled data obtained by the detector through the data acquisition interface. In this application, by communicating with the detector through the processor's data acquisition interface, the processor can receive the sampled data output by the detector in real time after the detector has finished sampling the electron beam, which can reduce the data synchronization delay and improve the data transmission efficiency of the data acquisition system.

[0018] In one possible implementation of the first aspect, the data acquisition system further includes a control unit connected to a host computer and the processor. The control unit is used to obtain configuration parameters of the module power supply from the host computer and to obtain multiple electrical parameters for configuring the module power supply based on the configuration parameters. Each sampling process corresponds to one electrical parameter, and the multiple electrical parameters include a first electrical parameter and a second electrical parameter. The control unit is also used to transmit the multiple electrical parameters to the processor. In this application, by introducing a control unit, communication with the host computer can be established to obtain configuration parameters, and multiple electrical parameters can be obtained based on the configuration parameters and transmitted to the processor. This enables low-latency electrical parameter acquisition, preprocessing of the configuration parameters to obtain electrical parameters usable for module power supply configuration, reduces the data processing load of the processor, reduces data transmission latency, and thereby improves the data processing efficiency of the data acquisition system.

[0019] In one possible implementation of the first aspect, the data acquisition system further includes a light intensity detection sensor, and the processor further includes an analog-to-digital converter (ADC). The light intensity detection sensor is connected to the ADC. The light intensity detection sensor is used to detect the light intensity data that generates the electron beam and transmit the detected light intensity data to the ADC. The control unit is also used to acquire the sampling data and the light intensity data from the processor and output the sampling data and the light intensity data to the host computer. In this application, by introducing a light intensity detection sensor, the light intensity data that generates the electron beam can be acquired through the collaborative cooperation between the light intensity detection sensor and the ADC in the processor. The light intensity data and the sampling data can be used together for X-ray photoelectron spectroscopy analysis, which can improve the richness of the data acquired by the data acquisition system, thereby improving the effectiveness and reliability of X-ray photoelectron spectroscopy analysis. Here, the processor can transmit the sampling data and light intensity data to the control unit, and the control unit can transmit them to the host computer, which can reduce the resource consumption of data synchronization, thereby improving the system performance of the data acquisition system and making it highly applicable.

[0020] Secondly, this application provides a data acquisition method for X-ray photoelectron spectroscopy analysis. This method is applicable to a processor in a data acquisition system, which includes a module power supply, a detector, and the processor. The module power supply provides power to an electron beam modulation module for controlling X-ray photoelectron spectroscopy analysis. The processor is connected to the module power supply and to the detector. The processor sequentially executes multiple sampling processes. In each sampling process, the method includes: configuring a first electrical parameter to the module power supply, causing the module power supply to output a first electrical signal corresponding to the first electrical parameter to the electron beam modulation module; after confirming that the module power supply outputs the first electrical signal, triggering the detector to sample the electron beam; and receiving a data acquisition completion signal from the detector after sampling the electron beam, thereby triggering the configuration of a second electrical parameter to the module power supply to execute the next sampling process. In this application, the processor can configure the module power supply by transmitting the first electrical parameter to the module power supply, causing the module power supply to output a first electrical signal corresponding to the first electrical parameter to the electron beam modulation module. After confirming that the module power supply outputs the first electrical signal, the detector is triggered to sample the electron beam. After receiving the data acquisition completion signal output by the detector, the second electrical parameter can be configured to the module power supply to execute the next sampling process. Therefore, by configuring the module power supply with closed-loop parameters and controlling the detector with timing trigger, fully automatic sampling switching in the dynamic analysis of electron beam multi-parameters is realized, which significantly improves the data acquisition efficiency.

[0021] In one possible implementation of the second aspect, the processor includes a first parameter configuration interface connected to the module power supply. The step of configuring the first electrical parameter to the module power supply, causing the module power supply to output a first electrical signal corresponding to the first electrical parameter to the electron beam control module, includes: configuring the first electrical parameter to the module power supply through the first parameter configuration interface, causing the module power supply to output a first electrical signal corresponding to the first electrical parameter to the electron beam control module, and feeding back a parameter configuration completion signal after outputting the first electrical signal. In this application, communication with the module power supply can be achieved through the first parameter configuration interface in the processor. The first electrical parameter can be output to the module power supply to configure the first electrical parameter, thereby triggering the module power supply to output a corresponding first electrical signal to the electron beam control module based on the first electrical parameter configuration. This enables real-time triggering of the module power supply's electrical parameter configuration, reduces the data synchronization delay between the processor and the module power supply, improves the communication efficiency between the processor and the module power supply, improves the configuration efficiency of the module power supply's electrical parameters, and thus improves the efficiency of the module power supply in supplying power to the electron beam control module. This approach has high applicability.

[0022] In one possible implementation of the second aspect, the processor further includes a configuration status sensing interface connected to the module power supply. The step of triggering the detector to sample the electron beam after confirming that the module power supply outputs the first electrical signal includes: triggering the detector to sample the electron beam after obtaining the parameter configuration completion signal through the configuration status sensing interface. In this application, the processor can communicate with the module power supply through the configuration status sensing interface. By receiving the parameter configuration completion signal transmitted by the module power supply through the configuration status sensing interface, it can quickly determine that the module power supply has completed outputting the first electrical signal, thereby triggering the detector to sample the electron beam. This reduces the delay between the module power supply completing power supply to the electron beam control module and the detector starting to collect the data to be measured, thus improving data acquisition efficiency.

[0023] In one possible implementation of the second aspect, the processor includes a first detection activation interface connected to the detector. Triggering the detector to sample the electron beam includes: outputting a detection activation signal to the detector via the first detection activation interface; the detection activation signal triggers the detector to sample the electron beam and, after sampling, feeds back a data acquisition completion signal. In this application, the processor can communicate with the detector via the first detection activation interface. After determining that the module power supply outputs the first electrical signal, the processor can output a detection activation signal to the detector to trigger the detector to sample the electron beam. This enables real-time signal transmission between the processor and the detector, reduces the delay in the detector's data acquisition startup, and thus improves data acquisition efficiency.

[0024] In one possible implementation of the second aspect, the processor further includes a detection state sensing interface connected to the detector; receiving a data acquisition completion signal from the detector after sampling the electron beam to trigger the configuration of second electrical parameters to the module power supply includes: configuring the second electrical parameters to the module power supply after receiving the data acquisition completion signal through the detection state sensing interface. In this application, the processor can communicate with the detector through the detection state sensing interface and receive the data acquisition completion signal transmitted by the detection state transmission interface. The processor can know that the detector has completed sampling of the electron beam through the data acquisition completion signal, and then initiate the process of configuring the second electrical parameters to the module power supply. This enables state sharing among the detector, processor, and module power supply. Through direct communication between the detector and processor interfaces, the delay in the processor knowing that data acquisition is complete can be reduced, thereby reducing the delay in triggering the configuration of electrical parameters to the module power supply, improving data acquisition efficiency, and offering high applicability.

[0025] In one possible implementation of the second aspect, the processor includes a first processing unit and a second processing unit. Before configuring the second electrical parameter to the module power supply after receiving the data acquisition completion signal through the detection state sensing interface, the method further includes: during the sampling process, the first processing unit sends a voltage adjustment command to the second processing unit, and the second processing unit obtains the second electrical parameter according to the voltage adjustment command, so as to configure the second electrical parameter to the module power supply after receiving the data acquisition completion signal through the detection state sensing interface. In this application, the processor, through the collaborative work of the first and second processing units, allows the second processing unit to obtain the second electrical parameter in advance after the first processing unit issues the voltage adjustment command, and then triggers the electrical parameter configuration in real time after receiving the data acquisition completion signal, reducing the latency of state sharing and data synchronization between devices, thereby improving the efficiency of data acquisition and having high applicability.

[0026] In one possible implementation of the second aspect, the processor includes a data acquisition interface connected to the detector, and the method further includes receiving sampled data from the detector through the data acquisition interface. In this application, communication with the detector can be achieved through the processor's data acquisition interface, allowing real-time reception of the sampled data output by the detector after data acquisition is completed. This reduces data synchronization delay and improves the system's data acquisition efficiency.

[0027] In one possible implementation of the second aspect, before configuring the first electrical parameter to the module power supply, the method further includes: acquiring multiple electrical parameters for configuring the module power supply from a host computer; wherein one sampling process corresponds to one electrical parameter, and the multiple electrical parameters include the first electrical parameter and the second electrical parameter. In this application, configuration data can be obtained from a host computer to acquire the electrical parameters for configuring the module power supply, which can improve the flexibility and diversity of electrical parameter acquisition, reduce the data processing burden on the processor, optimize the resource utilization of the data acquisition system, reduce the latency of data preprocessing of electrical parameters, improve the configuration efficiency of the module power supply and the efficiency of powering the electron beam control module, thereby improving data acquisition efficiency. Attached Figure Description

[0028] Figure 1 is a schematic diagram of an application scenario of the data acquisition system for X-ray photoelectron spectroscopy analysis provided in an embodiment of this application.

[0029] Figure 2 is a schematic diagram of the data acquisition system for X-ray photoelectron spectroscopy analysis provided in an embodiment of this application.

[0030] Figure 3 is another structural schematic diagram of the data acquisition system for X-ray photoelectron spectroscopy analysis provided in an embodiment of this application;

[0031] Figure 4 is another structural schematic diagram of the data acquisition system for X-ray photoelectron spectroscopy analysis provided in an embodiment of this application;

[0032] Figure 5 is another structural schematic diagram of the data acquisition system for X-ray photoelectron spectroscopy analysis provided in an embodiment of this application;

[0033] Figure 6 is another structural schematic diagram of the data acquisition system for X-ray photoelectron spectroscopy analysis provided in an embodiment of this application;

[0034] Figure 7 is another structural schematic diagram of the data acquisition system for X-ray photoelectron spectroscopy analysis provided in an embodiment of this application;

[0035] Figure 8a is a schematic diagram of another application scenario of the data acquisition system for X-ray photoelectron spectroscopy analysis provided in the embodiments of this application;

[0036] Figure 8b is a schematic diagram of another application scenario of the data acquisition system for X-ray photoelectron spectroscopy analysis provided in the embodiments of this application;

[0037] Figure 9 is a schematic diagram of the pipeline operation of the processor in the data acquisition system for X-ray photoelectron spectroscopy analysis provided in the embodiments of this application;

[0038] Figure 10 is another structural schematic diagram of the data acquisition system for X-ray photoelectron spectroscopy analysis provided in an embodiment of this application;

[0039] Figure 11 is a flowchart illustrating the data acquisition method for X-ray photoelectron spectroscopy analysis provided in an embodiment of this application.

[0040] Explanation of reference numerals in the attached figures: 10-Host computer; 11-Data acquisition system; 110-Processor; 111-Module power supply; 112-Detector; 113-Electron beam control module; 114-Light intensity detection sensor; 115-Supporting stage; 116-Wafer to be measured; 117-Control unit; 1100-Analog-to-digital converter; 1101-First processing unit; 1102-Second processing unit; 1130-Light source; 1131-Magnetic lens; 1132-Electrostatic lens; 1133-First data generation source; 1134-Second data generation source; 1135-Third data generation source; 113n-Nth data generation source; 11020-System synchronization controller; 11021-Unified interface controller; 11022-Host interface; 11320-First electrostatic lens; 11321-Second electrostatic lens. Detailed Implementation

[0041] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0042] X-ray photoelectron spectroscopy (XPS) is a physical-based analytical technique. Its fundamental principle is to excite photoelectrons on the sample surface by irradiating it with X-rays. When X-ray photons strike the sample surface, these photons are absorbed by electrons in the atomic orbitals of the elements in the sample. This causes the electrons to escape the atomic nucleus and be emitted with a certain kinetic energy, becoming free photoelectrons, while the atom transforms into an excited-state ion. When the energy of the excitation source is fixed, the energy of the photoelectrons can be considered to be only related to the type of element and the ionized atomic orbitals. Therefore, the elemental composition of a substance can be qualitatively analyzed based on the binding energy of the photoelectrons. In other words, the chemical composition, state, and content of elements on the sample surface can be identified by measuring the binding energy of the photoelectrons of each element in the sample. X-ray photoelectron spectroscopy is a relatively common technique for film thickness and composition analysis. The core principle of XPS is to bombard the sample surface with X-rays, causing the elements in the sample to be excited and emit photoelectrons. By analyzing the binding energy of the photoelectrons, the type of element, chemical state, and surface composition can be accurately detected. X-ray photoelectron spectroscopy has wide applications in many fields, including materials science, aerospace, automotive manufacturing, geology, environmental science, biomedicine, and archaeology, which will not be elaborated upon here. In summary, due to its high precision, micro-area analysis capabilities, and non-destructive nature, X-ray photoelectron spectroscopy has become an indispensable tool in modern scientific research and industrial production.

[0043] The X-ray photoelectron spectroscopy (XPS) analysis process typically includes multiple steps such as analytical method selection, sample preparation and data acquisition, qualitative and quantitative analysis, and result evaluation. Each step in the XPS analysis process is interconnected to ensure that XPS analysis provides accurate compositional information for materials research, quality control, and product development. The specific steps can be determined based on the actual application scenario and are not limited herein. It is understood that the XPS data acquisition system provided in this application (which can be simply referred to as the data acquisition system for convenience) can be used to acquire various types of data suitable for XPS analysis. These various types of data include, but are not limited to: element quantity, element type, light intensity data, X-ray energy distribution information, and X-ray intensity. The specific data can be determined based on the analytical method and actual application scenario of XPS analysis and is not limited herein. Optionally, the various types of data in the above examples can be acquired individually or in combination, depending on the actual application scenario and is not limited herein. For ease of description, this application takes the wafer metrology scenario as an example and uses Figure 1 to illustrate the usage scenario of the data acquisition system provided in the embodiment of this application.

[0044] Please refer to Figure 1, which is a schematic diagram of an application scenario of the data acquisition system for X-ray photoelectron spectroscopy analysis provided in this application embodiment. As shown in Figure 1, the data acquisition system 11 may include a processor 110, a module power supply 111, and a detector 112. The data acquisition system 11 can be connected to a host computer 10, which can be used to detect and control the data acquisition system 11. The host computer 10 can typically be a terminal device or a server, depending on the actual application scenario, and is not limited here. The host computer 10 can issue instructions to the processor to adjust the voltage of the module power supply 111. The host computer 10 can collect data from the data acquisition system 11 through a communication protocol, such as data collected by the detector 112, data collected by the light intensity detection sensor 114, and data processed by the processor 110, and perform filtering, analysis, calculation, and storage on the collected data. Optionally, the data acquisition system 11 may further include an electron beam control module 113, a light intensity detection sensor 114, and a support platform 115. The light intensity detection sensor 114 and the support platform 115 can be located within or outside the data acquisition system 11, depending on the specific application scenario; no restrictions are imposed here. For ease of description, the following example will illustrate this by assuming that both the light intensity detection sensor 114 and the support platform 115 are located within the data acquisition system 11. Here, the processor 110 is connected to each device in the data acquisition system 11; that is, the processor 110 can connect to each device through a physical interface and control the operation of each device in the system through a communication protocol. It can be understood that the processor 110 can connect to each device in the data acquisition system 11 through a high-speed serial interface, parallel interface, industrial bus interface, etc., such as the module power supply 111 and detector 112 shown in Figure 1, and control the operation of each device. For example, the processor 110 can control the detector 112 to perform detection work to collect data for output; the specific location can be determined according to the actual application scenario, and no restrictions are imposed here. The module power supply 111 provides a stable current / voltage to the electron beam control module 113. The current / voltage value is determined by the electrical parameter configuration of the module power supply 111; different electrical parameter configurations correspond to different electrical signals, thereby generating multiple electron beams for X-ray photoelectron spectroscopy analysis, which are then sampled by the detector 112. As shown in Figure 1, the electron beam control module 113 may include, but is not limited to, a magnetic lens 1131, an electrostatic lens 1132, a light source 1130, a magnetic compensation coil (not shown in the figure), and a hemispherical analyzer (not shown in the figure), etc. The specific components can be determined according to the actual application scenario and are not limited here. The aforementioned stage 115 can be used to support the wafer 116 to be measured. The light source 1130 generates X-rays to irradiate the wafer 116 to excite and generate electrons to be measured. The magnetic lens 1131 collects the electrons to be measured based on the deflection effect of the magnetic field on charged particles, converging them into an electron beam.It is understood that the electrons under test will generate multiple electron beams that can be used for component analysis under the action of the electron beam control module 113 powered by different electrical signals. That is, different electron beams will be generated under different electrical signal power supply conditions. The detector 112 can be used to sample the above electron beams. The light intensity detection sensor 114 can collect the X-ray intensity data irradiated on the wafer 116 to be measured. Assuming that the user wants to measure the target wafer, the user can use the target wafer as the wafer 116 to be measured and use the light source 1130 to generate X-rays to irradiate the surface of the wafer 116 to be measured. Under the irradiation of X-rays, the wafer 116 to be measured will be excited to generate electrons to be measured. Under the action of the magnetic field provided by the magnetic lens 1131, the electrons to be measured will be focused into the range of the electrostatic lens 1132 and form the electron beam to be measured. At this time, the electrostatic lens 1132 can influence the electron beam to be measured focused within the range of the range of the lens through voltage parameter configuration. Here, it can be assumed that the current parameter configuration of the magnetic lens 1131 remains constant to control the stability of the electrons to be measured converging within the effective range of the electrostatic lens 1132. The sampling data of the converged electron beam will then be associated with the voltage parameter of the electrostatic lens 1132. This voltage parameter can be set by the user; that is, the user can set multiple target voltage parameters on the host computer 10, etc., and then output them to the processor 110 through the host computer 10. Optionally, in this embodiment, the user can input a voltage value configuration range for the target voltage in the host computer 10. The host computer 10 can output the voltage value configuration range to the processor 110, and the processor 110 can obtain multiple target voltage parameters based on the voltage value configuration range. Here, the processor 110 can select multiple target voltage parameters from the aforementioned voltage value configuration range according to selection rules such as equally spaced points and obtaining historical value points within the interval. The specific selection can be determined according to the actual application scenario and is not limited here.

[0045] In some feasible implementations, the processor 110 can configure multiple target electrical parameters to the module power supply 111, triggering the module power supply 111 to output corresponding voltage / current parameters to components in the electron beam control module 113, such as the magnetic lens 1131, electrostatic lens 1132, or light source 1130, based on these multiple target electrical parameters (e.g., target voltage / current parameters). It can be understood that after configuring the module power supply 111 and supplying power to the electron beam control module 113, a set of electron beams to be tested can be generated. The processor 110 can then trigger the detector 112 to sample these electron beams to obtain a set of sampling data for X-ray photoelectron spectroscopy analysis. In other words, a set of sampling data corresponds to one target electrical parameter. After the module power supply 111 supplies power to the electron beam control module 113 based on the target electrical parameters, the module power supply 111 can send a signal indicating that the parameter configuration is complete to the processor 110, which in turn can trigger the detector 112 to begin sampling the electron beam. After detector 112 completes sampling of the electron beam, it can feed back the acquisition completion signal to processor 110 and upload the acquired data to host computer 10. Processor 110 can configure module power supply 111 based on a new target electrical parameter to trigger module power supply 111 to supply power to electron beam control module 113 based on the new target electrical parameter, thereby generating a new electron beam to be measured. The aforementioned feedback and sampling process is repeated to obtain multiple sets of sampled data. It can be understood that the sampled data is related to the target electrical parameter and the intensity data of X-rays irradiating the surface of the wafer to be measured. The intensity detection sensor 114 in data acquisition system 11 can collect X-ray intensity, convert it into intensity data through analog-to-digital converter (not shown in the figure), and then upload it to host computer 10 to realize X-ray photoelectron spectroscopy analysis.

[0046] Optionally, in this embodiment, communication between the processor 110, detector 112, module power supply 111, and light intensity detection sensor 114 can be implemented based on physical interfaces and logical adaptation. That is, the devices can transmit and parse data, signals, instructions, etc. through physical connections. Here, the logical adaptation of the physical interface can support communication between devices through various communication protocol interfaces, including but not limited to recommended standard 232 (RS232), recommended standard 485 (RS485), serial peripheral interface (SPI), and network port. In specific implementation, the interface type can be determined according to the actual selection of the device and the actual application scenario, and no restrictions are imposed here.

[0047] The data acquisition system and data acquisition method for X-ray photoelectron spectroscopy analysis provided in this application will be described in detail below with reference to Figures 2 to 11.

[0048] Please refer to Figure 2, which is a schematic diagram of the structure of the data acquisition system for X-ray photoelectron spectroscopy analysis provided in an embodiment of this application. As shown in Figure 2, the data acquisition system 11 provided in this embodiment may include a processor 110, a module power supply 111, and a detector 112. The module power supply 111 is used to supply power to the electron beam control module 113 for controlling X-ray photoelectron spectroscopy analysis. The processor 110 is connected to the module power supply 111 and the detector 112. The processor 110 is used to sequentially execute multiple sampling processes. In each sampling process, the processor 110 is used to configure a first electrical parameter to the module power supply 111, so that the module power supply 111 outputs a first electrical signal corresponding to the first electrical parameter to the electron beam control module 113. After confirming that the module power supply 111 outputs the first electrical signal, the detector 112 is triggered to sample the electron beam. The system receives a data acquisition completion signal fed back by the detector 112 after sampling the electron beam, so as to trigger the configuration of a second electrical parameter to the module power supply 111 to execute the next sampling process. It is understandable that multiple sets of sampling data are required for X-ray photoelectron spectroscopy analysis. This necessitates multiple sampling processes after the module power supply is configured repeatedly. The completion of one sampling by the detector 112 and the feedback of a completion signal to the processor 110 can be considered the completion of one sampling process; that is, the processor 110 will trigger the next sampling process. Here, the data acquisition system 11 may also include a stage 115, and the electron beam control module 113 may include, but is not limited to, a light source 1130, an electrostatic lens 1132 (not shown in the figure), a magnetic lens 1131 (not shown in the figure), a magnetic compensation coil (not shown in the figure), and a hemispherical analyzer (not shown in the figure), etc. The specific components can be determined according to the actual application scenario and are not limited here. Optionally, the stage 115 and the electron beam control module 113 used to support the wafer 116 to be measured can be located inside the data acquisition system 11 or connected outside the data acquisition system 11, depending on the actual application scenario and are not limited here. For ease of description, the following examples will use the carrier platform 115 and the electron beam control module 113 located in the data acquisition system 11 as examples.Assuming the electron beam control module 113 includes a light source 1130, an electrostatic lens 1132, a magnetic lens 1131, a magnetic compensation coil (not shown in the figure), and a hemispherical analyzer (not shown in the figure), the light source 1130 can be used to generate X-rays to irradiate the wafer 116 to be measured to excite the generation of electrons to be measured. The magnetic lens 1131 can be used to collect the electrons to be measured and converge them into an electron beam based on the deflection effect of the magnetic field on charged particles. The electrostatic lens 1132 can be used to adjust the high-voltage environment in which the electron beam is located to obtain diverse electron beams to be measured for subsequent sampling. The magnetic compensation coil can be used to correct the influence of the external magnetic field on the electron beam. The hemispherical analyzer can analyze the electron energy in the electron beam to obtain richer data that can be used for X-ray photoelectron spectroscopy analysis. Please refer to Figure 1. As shown in Figure 1, the magnetic lens 1131 can be located above the stage 115 and the wafer 116 to be measured, to collect electrons excited by the X-rays emitted by the light source 1130 on the wafer 116. The electrostatic lens 1132 can be located above the magnetic lens 1131. The electrons collected by the magnetic lens 1131 can be focused into an electron beam and enter the effective range of the electrostatic lens 1132. The magnetic compensation coil (not shown in the figure) and the hemispherical analyzer (not shown in the figure) can usually be located between the electrostatic lens 1132 and the detector 112. The specific location can be determined according to the actual application scenario and is not limited here. Here, the light source 1130 can be, but is not limited to, any light source that emits X-rays, including but not limited to X-ray tubes, synchrotron radiation sources, free electron lasers, plasma X-ray sources, etc. The specific location can be determined according to the actual application scenario and is not limited here. The selection of the light source 1130 can affect the accuracy and quality of the data obtained from subsequent sampling. The specific location can be determined according to the actual detection requirements and the actual application scenario and is not limited here. The module power supply 111 can be used to provide different electrical signals to different components in the electron beam control module 113, such as providing voltage to the light source 1130, voltage to the electrostatic lens 1132, and current to the magnetic lens 1131. The specific application can be determined according to the actual application scenario, and no restrictions are imposed here. It can be understood that under different power supply conditions of the module power supply 111, the electron beam control module 113 can generate different electron beams for sampling by the detector 112; that is, different electron beams will be generated under different power supply conditions. Optionally, to control environmental variables during X-ray photoelectron spectroscopy analysis, the module power supply 111 can provide a unified power supply or independently adjustable power supply to the electron beam control module 113. For example, a continuous power supply can be provided to the light source 1130, adjusting only the power supply to the electrostatic lens 1132 and the magnetic lens 1131; or a continuous power supply can be provided to both the light source 1130 and the magnetic lens 1131, adjusting only the power supply to the electrostatic lens 1132. The specific application can be determined according to the actual application scenario, and no restrictions are imposed here.For ease of understanding, the power supply of the module power supply 111 to the light source 1130 will remain unchanged in subsequent embodiments. The explanation will take the adjustment of the power supply of the electrostatic lens 1132 and the magnetic lens 1131 by the module power supply 111 as an example. For ease of description, the electron beam control module 113 powered by the module power supply 111 will be referred to as the data generation source. The data generation source can control the electron beam according to different power supply conditions of the module power supply 111, so that the detector 112 can collect different sampling data. The internal components and specific connection structure of the data generation source can be determined according to the actual application scenario and are not limited here. Please refer to Figure 2 again. As shown in Figure 2, the data generation source (such as the first data generation source 1133, the second data generation source 1134, etc.) can be used to collect the electron beam formed by X-rays irradiating the wafer 116 to be measured. Here, the electron beam can be controlled by the data generation source to collect electron beam sampling data under different electrical signal conditions. In each sampling process, the processor 110 can configure a first electrical parameter to the module power supply 111 to control the module power supply 111 to output a first electrical signal corresponding to the first electrical parameter to the electron beam control module 113. It can be understood that the electron beam control module 113 powered by the first electrical signal can constitute the first data generation source 1133, that is, the electron beam control module 113 powered by the second electrical signal can constitute the second data generation source 1134. Here, the second electrical signal can be any electrical signal different from the first electrical signal, and can be determined according to the actual application scenario, without limitation. Here, the electrical parameter configured by the processor 110 to the module power supply 111 can be a voltage parameter or a current parameter, and can be determined according to the actual application scenario, without limitation. It can be understood that one electrical parameter corresponds to one sampling process as described above. That is, one electrical parameter corresponds to one electrical signal output by the module power supply 111. The magnetic lens 1131, electrostatic lens 1132, magnetic compensation coil, and hemispherical analyzer, which receive the aforementioned electrical signal, can constitute a data generation source to generate electron beam sampling data. The specific correspondence between the electrical parameter and the output electrical signal can be determined according to the actual application scenario and is not limited here. It can also be understood that multiple data generation sources, including the first data generation source 1133, the second data generation source 1134, the third data generation source 1135, ..., the Nth data generation source 113n, can be used to correspond to multiple electrical parameters, including the first electrical parameter, the second electrical parameter, the third electrical parameter, ..., the Nth electrical parameter, to generate electron beam sampling data for X-ray photoelectron spectroscopy analysis, including the corresponding first electrical signal, second electrical signal, third electrical signal, ..., the Nth electrical signal. The number and structure of the data generation sources can be determined according to the actual application scenario and are not limited here. When the processor 110 confirms that the module power supply 111 outputs a first electrical signal, which constitutes the first data generation source 1133, it triggers the detector 112 to sample the electron beam.Detector 112 can be used to sample the electron beam and send a data acquisition completion signal back to processor 110 after the data acquisition is completed. Processor 110 can also configure a second electrical parameter to the module power supply 111 after receiving the data acquisition completion signal. The module power supply 111 outputs a second electrical signal corresponding to the second electrical parameter to the electron beam control module 113 (magnetic lens 1131 and electrostatic lens 1132) to form a second data generation source 1134. Processor 110 can trigger detector 112 to perform the next round of sampling. Here, the signal interacting between detector 112 and processor 110 can be an analog signal or a digital signal, etc., which can be determined according to the actual application scenario and equipment type, and is not limited here.

[0049] In some feasible implementations, corresponding to N electrical parameters, the processor 110 can configure the module power supply 111 N times. The module power supply 111 can output electrical signals corresponding to the electrical parameters to multiple electron beam control modules 113 (such as magnetic lens 1131, electrostatic lens 1132, etc.), thereby forming N data generation sources to generate N sets of electron beams for the detector 112 to collect N sets of electron beam sampling data. For ease of description, the following will use two data generation sources as an example. The data generation sources include the aforementioned magnetic lens 1131 and electrostatic lens 1132. One data generation source corresponds to one electrical signal (that is, one electrical parameter). Specifically, the first data generation source 1133 and the second data generation source 1134 will be used as examples. Please refer to Figure 3, which is another structural schematic diagram of the data acquisition system for X-ray photoelectron spectroscopy analysis provided in the embodiments of this application. As shown in Figure 3, the data acquisition system 11 includes a processor 110, a detector 112, and a module power supply 111. The processor 110 is connected to both the detector 112 and the module power supply 111, and the module power supply 111 is connected to an electron beam control module 113. The processor 110 acquires a first electrical parameter and a second electrical parameter. These parameters can be historical parameters or externally input parameters, depending on the specific circumstances. The processor 110 can configure the first electrical parameter to the module power supply 111, triggering the module power supply 111 to output a first electrical signal to the electron beam control module 113, thus forming a first data generation source 1133, which generates data for X-ray photoelectron spectroscopy analysis. Here, the X-ray emitted by the light source 1130 irradiates the wafer under test, generating electrons. The first data generation source 1133 collects the electrons reflected from the X-rays irradiating the wafer and converges them into an electron beam, which is then used by the detector 112 to acquire electron beam sampling data. In other words, electrons reflected from the wafer under test can generate two sampled electron beams for X-ray photoelectron spectroscopy analysis under the action of the first data generation source 1133 and the second data generation source 1134. Each sampled electron beam corresponds to one data generation source, and the sampled data obtained from the sampled electron beams is associated with the electrical parameters configured in the module power supply 111. When the processor 110 confirms that the module power supply 111 outputs the first electrical signal, it can trigger the detector 112 to sample the electron beam to obtain electron beam sampling data. The detector 112 samples the electron beam and sends a data acquisition completion signal back to the processor 110 after the electron beam sampling data acquisition is completed. When the processor 110 receives the data acquisition completion signal, it can configure the second electrical parameters in the module power supply 111 to trigger the module power supply 111 to output the second electrical signal to the electron beam control module 113 to form the second data generation source 1134, thereby generating new data for X-ray photoelectron spectroscopy analysis.The module power supply 111 can repeat the above implementation to send a signal to the processor 110 indicating that the second electrical signal output is complete, triggering the processor 110 to control the detector 112 to perform electron beam sampling. In this embodiment, the data acquisition system 11 can dynamically configure the electrical parameters of the module power supply 111 through the processor 110, trigger the detector 112 to sample the electron beam, and switch the configured electrical parameters of the module power supply 111 after receiving the feedback signal from the detector 112 to perform the next round of sampling. The module power supply 111 can supply power to the electron beam control module 113, the detector 112 can sample the electron beam, and the processor 110 can realize information exchange with the module power supply 111 and with the detector 112, enabling real-time communication between the devices. This allows the processor 110 to control the module power supply 111 and the detector 112 in real time, reducing communication delays between devices and enabling real-time status awareness between devices. Therefore, through the closed-loop parameter configuration of the module power supply 111 and the timing trigger control of the detector 112 by the processor 110, fully automatic sampling switching in the dynamic analysis of electron beam multi-parameters is realized, significantly improving data acquisition efficiency. In traditional data acquisition, parameter configuration and detector triggering are typically done manually or with clock delays, which is time-consuming and prone to errors. By employing closed-loop control of the processor 110, the output of the module power supply 111 can be dynamically adjusted according to preset parameters. For example, the host computer 10 can set the first and second electrical parameters of the module power supply 111 to control the module power supply 111 to output the corresponding first and second electrical signals after configuration, ensuring parameter accuracy and stability. Simultaneously, the processor 110 achieves precise synchronization of the timing trigger control of the detector 112, enabling the detector to sample the electron beam after the module power supply 111 outputs an electrical signal, avoiding invalid sampling and data loss. This fully automated sampling and switching method reduces manual intervention, improves sampling frequency and data quality, and thus significantly enhances the overall efficiency of data acquisition.

[0050] Optionally, in some feasible implementations, the module power supply 111 can be used to provide a stable electrical signal to the electron beam control module 113 (such as the magnetic lens 1131, the electrostatic lens 1132, and the light source 1130). Here, the module power supply 111 may integrate functional units including, but not limited to, a high-voltage power supply unit, a DC voltage power supply unit, a DC current power supply unit, a control and monitoring unit, a power conversion and distribution unit, and a protection and safety unit, to provide different electrical signals to different components in the electron beam control module 113. For example, it can provide voltage to the light source 1130, voltage to the electrostatic lens 1132, and current to the magnetic lens 1131. The specific configuration can be determined according to the actual application scenario and is not limited here. Here, configuring the electrical parameters of the module power supply 111 can be understood as adjusting the electrical signal provided by the module power supply 111 to the electron beam control module 113. Here, the electrical signal may include one or more of voltage, current, frequency, power, etc., which can be determined according to the actual scenario and is not limited here.

[0051] In some feasible implementations, the electron beam control module 113 may include a magnetic lens 1131 and an electrostatic lens 1132, which can constitute the data generation source. The magnetic lens 1131 can focus electrons using a magnetic field, causing them to be focused on a target area and converge into an electron beam. Here, the magnetic field strength and distribution of the magnetic lens 1131 can be configured with current parameters based on the electrical signals transmitted by the module power supply 111. The electrostatic lens 1132 can be configured with voltage parameters based on the electrical signals transmitted by the module power supply 111 to change the voltage environment of the electron beam in the target area, thereby generating an electron beam that can be used for sampling. Here, the electrical signals output to the magnetic lens 1131 and the electrostatic lens 1132 can affect the stability and diversity of the generated data. The data acquisition system 11 can have multiple electrostatic lenses 1132 and at least one magnetic lens 1131. A magnetic lens 1131 and an electrostatic lens 1132 can form a data generation source, and each magnetic lens 1131 and electrostatic lens 1132 can correspond to an electrical signal. It can be understood that multiple electrostatic lenses 1132 can share a single magnetic lens 1131 to form multiple data generation sources; that is, multiple electrostatic lenses 1132 can share a single magnetic lens 1131. In this way, electrons collected from the target region by the same magnetic lens 1131 under the same current parameter configuration can remain relatively stable, thereby controlling variables in subsequent X-ray photoelectron spectroscopy analysis. Optionally, the data acquisition system 11 can have only one electrostatic lens 1132 and one magnetic lens 1131. The electrostatic lens 1132 can receive multiple electrical signals transmitted from the module power supply 111 for voltage parameter configuration. The magnetic lens 1131 and an electrostatic lens 1132 with the configured voltage parameters can form a data generation source. Similarly, optionally, the magnetic lens 1131 can also receive multiple electrical signals transmitted from the module power supply 111 to configure its current parameters. The electrostatic lens 1132 and a magnetic lens 1131 with configured current parameters can form a data generation source. In other words, the voltage parameters of the electrostatic lens 1132 can be flexibly configured multiple times. When the current parameters of the magnetic lens 1131 remain unchanged, each time the voltage parameters of the electrostatic lens 1132 are configured (that is, each time the electrical signal value output by the module power supply 111 to the electrostatic lens 1132 is changed), a data generation source composed of the electrostatic lens 1132 and the magnetic lens 1131 can be obtained. Similarly, the current parameters of the magnetic lens 1131 can also be flexibly configured multiple times. When the voltage parameters of the electrostatic lens 1132 remain unchanged, each time the current parameters of the magnetic lens 1131 are configured (that is, each time the electrical signal value output by the module power supply 111 to the magnetic lens 1131 is changed), a data generation source composed of the electrostatic lens 1132 and the magnetic lens 1131 can be obtained.

[0052] In some feasible implementations, the electrical parameters transmitted from the processor 110 to the module power supply 111 may include one of the current parameters of the magnetic lens 1131 or the voltage parameters of the electrostatic lens 1132, or a combination of the current parameters of the magnetic lens 1131 and the voltage parameters of the electrostatic lens 1132. It is understood that when the electrical parameters only include one of the current parameters of the magnetic lens 1131 or the voltage parameters of the electrostatic lens 1132, the module power supply 111 can output a corresponding electrical signal to one of the magnetic lens 1131 or the electrostatic lens 1132 based on that electrical parameter, while the other component can maintain its factory default parameters or maintain power supply based on historical parameters. Optionally, when the electrical parameters are a combination of the current parameters of the magnetic lens 1131 and the voltage parameters of the electrostatic lens 1132, electrical signals can be allocated to the two components separately according to their respective electrical parameters. The specific allocation can be determined according to the actual application scenario and is not limited here. For example, please refer to Figure 4, which is another structural schematic diagram of the data acquisition system for X-ray photoelectron spectroscopy analysis provided in this application embodiment. Compared to the data acquisition system 11 shown in Figure 3, in the data acquisition system 11 shown in Figure 4, the first data generation source 1133 is composed of a magnetic lens 1131 and a first electrostatic lens 11320, and the second data generation source 1134 (not labeled in the figure) can be composed of a magnetic lens 1131 and a second electrostatic lens 11321. When the data acquisition system 11 starts working, the processor 110 can configure the first electrical parameters to the module power supply 111. Assuming that the first electrical parameters include the current parameters of the magnetic lens 1131 and the voltage parameters of the first electrostatic lens 11320, the module power supply 111 can be triggered to output the first electrical signal to the magnetic lens 1131 and the first electrostatic lens 11320, so as to configure the current of the magnetic lens 1131 based on the current parameters in the first electrical parameters, and configure the voltage of the first electrostatic lens 11320 based on the voltage parameters in the first electrical parameters. After the first data generation source 1133 receives power from the module power supply 111, when the X-rays emitted by the light source 1130 irradiate the surface of the wafer 116 to be measured, the electrons generated by the wafer 116 can be focused by the magnetic lens 1131 into the effective range of the first electrostatic lens 11320 and the second electrostatic lens 11321 to form an electron beam. Within the voltage environment provided by the first electrostatic lens 11320, the electrons are sampled by the detector 112. At this time, the second electrostatic lens 11321 can be understood as being in an unpowered state and does not affect the electron beam. The second electrical parameters may only include the voltage parameters for configuring the second electrostatic lens 11321. When the processor 110 configures the second electrical parameters to the module power supply 111, it can trigger the module power supply 111 to output a second electrical signal to the magnetic lens 1131 and the second electrostatic lens 11321, thereby configuring the voltage of the second electrostatic lens 11321 based on the voltage parameters in the second electrical parameters.At this time, the magnetic lens 1131 will maintain the historical current configuration, that is, the current output from the module power supply 111 to the magnetic lens 1131 will maintain the historical current value. The magnetic lens 1131 can obtain a stable current from the module power supply 111 and continuously concentrate electrons into the effective range of the electrostatic lens 1132. Within the voltage environment provided by the second electrostatic lens 11321, a new electron beam can be formed for sampling by the detector 112. In this embodiment, by configuring the electrical parameters of the module power supply 111, electrons generated by the wafer 116 under different electrical signal power supply conditions can be collected and concentrated into an electron beam within the effective range of the electrostatic lens 1132 for sampling by the detector 112. This can improve the richness of the collected data and provide abundant electron beam samples for the detector 112 to sample and perform subsequent X-ray photoelectron spectroscopy analysis in a shorter time, thereby improving the efficiency of data acquisition and X-ray photoelectron spectroscopy analysis.

[0053] In some feasible implementations, the processor 110 may include a first parameter configuration interface, which can be connected to the module power supply 111. The processor 110 can configure electrical parameters to the module power supply 111 through the first parameter configuration interface to trigger the module power supply 111 to output an electrical signal corresponding to the electrical parameters to the electron beam modulation module 113. Each sampling process corresponds to one electrical parameter, which includes the first electrical parameter and the second electrical parameter. Here, the first parameter configuration interface can be an SPI interface or a universal synchronous / asynchronous receiver / transmitter (USART) or other interface that can be used to realize data synchronization and real-time communication between devices. The specific interface can be determined according to the actual application scenario and is not limited here. In this embodiment, electrical parameters can be configured to the module power supply 111 through the first parameter configuration interface of the processor 110, thereby triggering the module power supply 111 to output an electrical signal corresponding to the electrical parameters to the electron beam control module 113. Data transmission is performed through the first parameter configuration interface, which reduces the data synchronization delay between the processor 110 and the module power supply 111. This enables real-time triggering of the electrical parameter configuration of the module power supply 111, thereby improving the configuration efficiency of the electrical parameters of the module power supply 111 and thus improving the efficiency of the module power supply 111 in supplying power to the electron beam control module 113. This method has high applicability.

[0054] Correspondingly, in some feasible implementations, the module power supply 111 may include a second parameter configuration interface. This second parameter configuration interface can be connected to the processor 110. The module power supply 111 can receive electrical parameters from the processor 110 through the second parameter configuration interface and output electrical signals corresponding to the electrical parameters to the electron beam control module 113. It can be understood that the processor 110 can configure electrical parameters to the module power supply 111 through the first parameter configuration interface. Correspondingly, the module power supply 111 may include a second parameter configuration interface, which can be connected to the first parameter configuration interface to achieve the connection between the processor 110 and the module power supply 111. Here, the second parameter configuration interface can be an interface of the same type as the first parameter configuration interface, or an interface conversion chip can convert the signal output by the first parameter configuration interface into other types of interface signals to adapt to a second parameter configuration interface of a different type than the first parameter configuration interface. The specific device interface type can be determined according to the actual application scenario and is not limited here. The processor 110 can transmit electrical parameters to the module power supply 111 through the first parameter configuration interface to configure the electrical parameters of the module power supply 111. Correspondingly, the module power supply 111 can receive the electrical parameters from the processor 110 through the second parameter configuration interface and output electrical signals corresponding to the electrical parameters to the electron beam control module 113. In other words, the first parameter configuration interface can send electrical parameters and the second parameter configuration interface can receive electrical parameters to realize data synchronization between the processor 110 and the module power supply 111, and at the same time realize the configuration of the module power supply 111 by the processor 110. In this embodiment, the second parameter configuration interface of the module power supply 111 can communicate with the first parameter configuration interface of the processor 110, receive the electrical parameters transmitted by the first parameter configuration interface, and output electrical signals corresponding to the electrical parameters to the electron beam control module 113 to generate the electron beam to be sampled. Data transmission through the first and second parameter configuration interfaces reduces the data synchronization delay between the processor 110 and the module power supply 111, thereby improving the communication efficiency between the processor 110 and the module power supply 111. Similarly, it can improve the configuration efficiency of the electrical parameters of the module power supply 111, thereby improving the efficiency of the module power supply 111 in supplying power to the electron beam control module 113, and has high applicability.

[0055] In some feasible implementations, the module power supply 111 may further include a configuration status transmission interface. This interface can be connected to the processor 110. After outputting a first electrical signal corresponding to the first electrical parameter to the electron beam control module 113, the module power supply 111 can transmit a parameter configuration completion signal to the processor 110 via the configuration status transmission interface. Here, the configuration status transmission interface can be an SPI interface, a USART interface, or other interfaces capable of data synchronization and real-time communication between devices. The specific interface can be determined according to the actual application scenario and is not limited here. After outputting an electrical signal corresponding to the first electrical parameter to the electron beam control module 113, the module power supply 111 can transmit a parameter configuration completion signal to the processor 110 via the configuration status transmission interface. It is understood that the parameter configuration completion signal can be a digital signal or an analog signal, or other signal format agreed upon by both devices. The specific signal can be determined according to the actual application scenario and is not limited here. In this embodiment, the configuration status transmission interface of the module power supply 111 can transmit a parameter configuration completion signal to the processor 110 after outputting an electrical signal corresponding to the electrical parameters to the electron beam control module 113, thereby triggering the processor 110 to execute the next action. This enables real-time status sharing between the two devices, the module power supply 111 and the processor 110, reduces the delay in status sharing between devices, and improves the data processing efficiency of the system.

[0056] Correspondingly, in some feasible implementations, the processor 110 may also include a configuration status sensing interface. This interface can be connected to the module power supply 111. After obtaining the parameter configuration completion signal through the configuration status sensing interface, the processor 110 can trigger the detector 112 to sample the electron beam. Here, the configuration status sensing interface can be an interface of the same type as the configuration status transmission interface. Alternatively, an interface conversion chip can be used to convert the parameter configuration completion signal output by the configuration status transmission interface into other types of interface signals to adapt to configuration status sensing interfaces of different types from the configuration status transmission interface. The specific device interface type can be determined according to the actual application scenario and is not limited here. The module power supply 111 can transmit the parameter configuration completion signal to the processor 110 through the configuration status transmission interface to synchronize the power supply status of the module power supply 111 to the electron beam control module 113 with the processor 110. It can be understood that the parameter configuration completion signal indicates that the module power supply 111 has completed the output of the electrical signal corresponding to the electrical parameters of the electron beam control module 113. The aforementioned components can control the electron beam based on the electrical signal to generate the electron beam to be sampled, and the detector 112 can start sampling of the electron beam to be sampled. The processor 110 can receive the parameter configuration completion signal from the module power supply 111 through the configuration status awareness interface and trigger the detector 112 to sample the electron beam to be sampled. In other words, the configuration status transmission interface can send the parameter configuration completion signal, and the configuration status awareness interface can receive the parameter configuration completion signal to realize the working status awareness between the module power supply 111 and the processor 110. It is understood that the communication between the processor 110 and the module power supply 111 is bidirectional. Signal transmission and reception can be achieved through the first parameter configuration interface, the second parameter configuration interface, the configuration status transmission interface, and the configuration status sensing interface. The first parameter configuration interface and the configuration status sensing interface of the processor 110 can be independent or multiplexed under the communication protocol. The second parameter configuration interface and the configuration status transmission interface on the module power supply 111 can be independent or multiplexed under the communication protocol. The specific choice can be determined according to the actual application scenario and is not limited here. In this embodiment, the processor 110 can communicate with the configuration status transmission interface of the module power supply 111 through the configuration status sensing interface. By receiving the parameter configuration completion signal transmitted by the module power supply 111 through the configuration status sensing interface, it can quickly know that the module power supply 111 has completed outputting the electrical signal corresponding to the electrical parameters to the electron beam control module 113. This can trigger the detector 112 to sample the electron beam, thereby reducing the delay between the module power supply 111 completing the output of the electrical signal corresponding to the electrical parameters to the electron beam control module 113 and the detector 112 starting to sample the electron beam, thus improving the data acquisition efficiency of the data acquisition system 11.

[0057] In some feasible implementations, the aforementioned first parameter configuration interface, second parameter configuration interface, configuration status transmission interface, and configuration status awareness interface can be SPI interfaces. SPI interfaces enable high-speed, full-duplex communication connections between processors 110. Assuming that the first parameter configuration interface, second parameter configuration interface, configuration status transmission interface, and configuration status awareness interface are all SPI interfaces, the processor 110 and the module power supply 111 are connected via the SPI interface. The SPI interfaces of the two devices can be connected using one or more of the following signal lines: serial clock (SCLK), master output / slave input (MOSI), master input / slave output (MISO), and slave select / chip select (SS / CS), to achieve full-duplex synchronous data transmission between the two devices. Optionally, in the transmission of multiple data signals (such as the first electrical parameter, the second electrical parameter, or the parameter configuration completion signal), the transmitting and receiving devices can have multiple SPI interfaces. Each signal can be transmitted and received through an independent SPI interface, and each signal can have its own clock and data lines, avoiding signal conflicts. Alternatively, both transmitting and receiving devices can each have only one SPI interface, which can send and receive different signals in different time slots through the SPI protocol, thereby simplifying the device structure complexity of both transmitting and receiving devices. The specific type and number of interfaces can be determined according to the actual application scenario and are not limited here.

[0058] For example, please refer to Figure 5, which is another structural schematic diagram of the data acquisition system for X-ray photoelectron spectroscopy analysis provided in this application embodiment. As shown in Figure 5, based on the data acquisition system 11 shown in Figure 3, the processor 110 may include a digital-to-analog converter (DAC) and an analog-to-digital converter (ADC), namely DAC1, DAC2, ADC1, and ADC2, which can be used to convert digital signals into analog signals and analog signals into digital signals. For example, DAC1 can be used to convert a first electrical parameter into a first analog signal, which can be transmitted on a signal line to transmit the first electrical parameter to the module power supply 111. The processor 110 also includes interfaces 1 to 4. Correspondingly, the module power supply 111 includes interfaces 5 to 8. The interfaces of the two devices are connected one by one, and all of the above interfaces can adopt SPI interfaces. It can be understood that the number of the first parameter configuration interface of the processor 110 and the second parameter configuration interface in the module power supply 111, the configuration status sensing interface in the processor 110 and the configuration status transmission interface in the module power supply 111 can be equal, and they are connected one-to-one. For example, interface 1 of processor 110 is connected to interface 5 of module power supply 111, interface 2 of processor 110 is connected to interface 6 of module power supply 111, interface 3 of processor 110 is connected to interface 7 of module power supply 111, and interface 4 of processor 110 is connected to interface 8 of module power supply 111. In the data acquisition system 11 shown in Figure 5, assuming that interface 1 and interface 2 are the first parameter configuration interfaces, and interface 3 and interface 4 are the configuration status sensing interfaces, then correspondingly, interface 5 and interface 6 are the second parameter configuration interfaces, and interface 7 and interface 8 are the configuration status transmission interfaces. When the data acquisition system 11 starts working, the processor 110 transmits the first electrical parameter to the interface 5 through interface 1 to configure the module power supply 111, thereby triggering the module power supply 111 to output the first electrical signal corresponding to the first electrical parameter to the electron beam control module 113. After confirming the output of the first electrical signal, the module power supply 111 can transmit a parameter configuration completion signal to the interface 3 through interface 7 to trigger communication between the processor 110 and the detector 112, thereby triggering the detector 112 to start sampling the electron beam to obtain electron beam sampling data. After the detector 112 finishes sampling, the processor 110 transmits the second electrical parameter to the interface 6 through interface 2 to configure the second electrical parameter of the module power supply 111, thereby triggering the module power supply 111 to output the second electrical signal corresponding to the second electrical parameter to the electron beam control module 113. After confirming the output of the second electrical signal, the module power supply 111 can transmit a parameter configuration completion signal to the interface 4 through interface 8 to trigger communication between the processor 110 and the detector 112, thereby triggering the detector 112 to start sampling a new electron beam.

[0059] In some feasible implementations, the processor 110 may include a first detection start interface, which can be connected to the detector 112. After confirming that the module power supply 111 outputs the first electrical signal, the processor 110 can output a detection start signal to the detector 112 through the first detection start interface. The detection start signal can be used to trigger the detector 112 to sample the electron beam. Here, the first detection start interface can be, but is not limited to, a 9-pin D-type connector (d-subminiature 9-pin connector, DB9), a twisted pair interface, an 8-pin modular connector (registered Jack 45, RJ45), a three-wire interface, or other interfaces that can achieve high-speed communication. The specific interface can be determined according to the actual application scenario and is not limited here. In this embodiment, the processor 110 can output a detection start signal to the detector 112 through the first detection start interface to trigger the detector 112 to sample the electron beam, which can realize real-time signal transmission between the processor 110 and the detector 112, reduce the delay of the detector 112 initiating electron beam sampling, and thus improve the data acquisition efficiency of the data acquisition system 11.

[0060] Correspondingly, in some feasible implementations, detector 112 may include a second detection activation interface, which can be connected to processor 110. After obtaining the detection activation signal through the second detection activation interface, detector 112 can sample the electron beam. It is understood that processor 110 can transmit the detection activation signal to detector 112 through the first detection activation interface. Correspondingly, detector 112 may include a second detection activation interface, which can be connected to the first detection activation interface to achieve connection between processor 110 and detector 112. Here, the second detection activation interface can be an interface of the same type as the first detection activation interface, or an interface conversion chip can convert the detection activation signal of the first detection activation interface data into other types of interface signals to adapt to the second detection activation interface of a different type than the first detection activation interface. The specific device interface type can be determined according to the actual application scenario and is not limited here. Processor 110 can send the detection activation signal to detector 112 through the first detection activation interface to trigger detector 112 to sample the electron beam. Correspondingly, detector 112 can receive a detection start signal from processor 110 through the second detection start interface to respond to the triggering of electron beam sampling, enabling processor 110 to control detector 112 in real time. Here, the detection start signal can be one of the following: including but not limited to differential signals, single-ended signals, etc. The specific signal can be determined based on the communication protocol supported by the transceiver interfaces and the actual application scenario. For example, when the transceiver interfaces support the RS232 single-ended serial communication standard, the detection start signal can be a single-ended signal; when the transceiver interfaces support the RS485 differential serial communication standard, the detection start signal can be a differential signal. The signal type and port type can be determined according to the actual application scenario and are not limited here. In this embodiment, detector 112 can communicate with the first detection start interface of processor 110 through the second detection start interface and receive the detection start signal transmitted by the first detection start interface. Detector 112 can receive trigger commands from processor 110 by detecting start signals, and then start sampling the electron beam. It can respond to real-time control of detector 112 by processor 110. Direct communication between the interface of detector 112 and processor 110 can reduce the delay of detector 112 starting electron beam sampling, thereby improving the data acquisition efficiency of data acquisition system 11.

[0061] In some feasible implementations, the detector 112 may further include a detection status transmission interface, which can be connected to the processor 110. After the electron beam sampling is completed, the detector 112 can send a data acquisition completion signal to the processor 110 through the detection status transmission interface. Here, the detection status transmission interface can be a DB9 interface, or an RJ45 interface, or other interfaces that can realize inter-device communication functions. The specific type can be determined according to the actual application scenario and is not limited here. After the electron beam sampling is completed, the detector 112 can transmit a data acquisition completion signal to the processor 110 through the detection status transmission interface. It is understood that the data acquisition completion signal can be a differential signal, a single-ended signal, or other signal format agreed upon by both devices. The specific type can be determined according to the actual application scenario and is not limited here. In this embodiment, the detector 112 can output a data acquisition completion signal to the processor 110 through the detection status transmission interface to provide feedback on the data acquisition status to the processor 110. This enables real-time status sharing between the two devices, the detector 112 and the processor 110, reduces the latency of status sharing between devices, and thus improves the data processing performance of the system.

[0062] Correspondingly, in some feasible implementations, the processor 110 may also include a detection status sensing interface, which can be connected to the detector 112. After receiving a data acquisition completion signal through the detection status sensing interface, the processor 110 can configure a second electrical parameter to the module power supply 111 to execute the next sampling process. Here, the detection status sensing interface can be an interface of the same type as the detection status transmission interface, or an interface conversion chip can be used to convert the data acquisition completion signal output by the detection status transmission interface into other types of interface signals to adapt to a detection status sensing interface of a different type than the detection status transmission interface. The specific device interface type can be determined according to the actual application scenario and is not limited here. The detector 112 can transmit a data acquisition completion signal to the processor 110 through the detection status transmission interface to synchronize the acquisition completion status of the detector 112. It can be understood that the data acquisition completion signal indicates that the detector 112 has completed sampling of the electron beam. Correspondingly, the processor 110 can receive the data acquisition completion signal from the detector 112 through the detection status sensing interface and configure new electrical parameters to the module power supply 111 to trigger the module power supply 111 to output a new electrical signal to generate a new electron beam to be sampled. In other words, the detection status transmission interface can send a data acquisition completion signal, and the detection status sensing interface can receive the data acquisition completion signal, thereby realizing real-time sharing of the working status between the detector 112 and the processor 110. In this embodiment, the processor 110 can communicate with the detector 112 through the detection status sensing interface and receive the data acquisition completion signal transmitted by the detection status transmission interface. The processor 110 can know that the detector 112 has completed sampling of the electron beam through the data acquisition completion signal, and then configure the second electrical parameters to the module power supply 111. This enables status sharing between the detector 112, the processor 110, and the module power supply 111. Through direct communication between the interfaces of the detector 112 and the processor 110, the delay in the processor 110 knowing that data acquisition is complete can be reduced, thereby reducing the delay in triggering the configuration of the electrical parameters of the module power supply 111. This improves the data acquisition efficiency of the data acquisition system 11 and has high applicability.

[0063] In some feasible implementations, the detector 112 may further include a data transmission interface connected to the processor 110. The detector 112 outputs the sampled data to the processor 110 via the data transmission interface after the electron beam sampling is completed and the sampled data is obtained. The data transmission interface can be connected to the processor 110. Here, the data transmission interface can be a DB9 interface, or a universal asynchronous receiver / transmitter (UART) interface, or any other interface that enables data transmission between devices. The specific interface can be determined based on the actual application scenario and is not limited here. After the data to be measured is acquired, the detector 112 can output the acquired data to the processor 110 via the data transmission interface. It is understood that the acquired data can be transmitted in the form of digital signals on the signal lines between the interfaces. The specific signal form can be agreed upon by both devices and is not limited here. In this embodiment, the data transmission interface of the detector 112 can output the sampled data to the processor 110 in real time after the electron beam sampling is completed, which can reduce the delay of data synchronization transmission and thus improve the data transmission efficiency of the data acquisition system 11.

[0064] Correspondingly, in some feasible implementations, the processor 110 may also include a data acquisition interface, which can be connected to the detector 112. The processor 110 can receive the sampled data obtained by the detector 112 through the data acquisition interface. Here, the data acquisition interface can be an interface of the same type as the data transmission interface, or the acquired data output by the data transmission interface can be converted into other types of interface signals through an interface conversion chip to adapt to a data acquisition interface of a different type than the data transmission interface. The specific device interface type can be determined according to the actual application scenario and is not limited here. The detector 112 can transmit the acquired data to the processor 110 through the data acquisition interface. The processor 110 can upload or store the acquired data received through the data acquisition interface and output new electrical parameters to the module power supply 111 to complete the new data generation source configuration and generate new test data for acquisition. It can be understood that the data transmission interface can send acquired data, and the data acquisition interface can receive acquired data to realize data synchronization between the detector 112 and the processor 110, thereby realizing the system's data acquisition. It is understood that the communication between the processor 110 and the detector 112 is bidirectional. Signal transmission and data synchronization can be achieved through the first detection start interface, the second detection start interface, the detection status transmission interface, the detection status sensing interface, the data transmission interface, and the data acquisition interface. The first detection start interface, the detection status sensing interface, and the data acquisition interface on the processor 110 can be independent or multiplexed under the communication protocol. Similarly, the second detection start interface, the detection status sensing interface, and the data transmission interface on the detector 112 can be independent or multiplexed under the communication protocol. The specific choice depends on the actual application scenario and is not limited here. In this embodiment, the processor 110 communicates with the detector 112 through the data acquisition interface. The processor 110 can receive the sampled data output by the detector 112 in real time after the detector 112 has finished sampling the electron beam, which can reduce the data synchronization delay and improve the data transmission efficiency of the data acquisition system 11.

[0065] In some feasible implementations, the first detection start interface, the second detection start interface, the detection status transmission interface, the detection status sensing interface, the data transmission interface, and the data acquisition interface can all use the RS485 communication standard. RS485 can be used as a differential serial communication standard for signal transmission and reception between two devices, enabling half-duplex, multi-point communication between the two devices. Assuming that the first detection start interface, the second detection start interface, the detection status transmission interface, the detection status sensing interface, the data transmission interface, and the data acquisition interface all use physical connectors based on RS485 communication (which can be referred to as RS485 interfaces for convenience), the interfaces between the processor 110 and the detector 112 can be connected via two differential signal lines and one ground line. Here, the two differential signal lines can be positive differential signal lines and negative differential signal lines. The two differential signal lines can be used to transmit data signals, and the ground line can provide a reference level for the data signals. The combination of the three signal lines can provide high signal anti-interference capability, ensuring communication reliability and enabling real-time communication between the processor 110 and the detector 112. Optionally, in the transmission of multiple data signals, such as detection start signal, data acquisition completion signal, and acquired data, the transceiver devices can transmit signals through multiple RS485 interfaces. Each signal can be transmitted and received through an independent RS485 interface, and each signal can have an independent clock and data line to avoid signal conflicts. Alternatively, both transceiver devices can have only one multiplexed RS485 interface, which can send and receive different signals in different time slots through the RS485 protocol, thereby simplifying the structural complexity of the transceiver devices. The type and number of interfaces can be determined according to the actual application scenario and are not limited here. For example, please refer to Figure 6, which is another structural schematic diagram of the X-ray photoelectron spectroscopy analysis data acquisition system provided in this application embodiment. As shown in Figure 6, based on the data acquisition system 11 shown in Figure 5, the processor 110 can include interface 9 and interface 10, and correspondingly, the detector 112 includes interface 11 and interface 12. The interfaces of the two devices are connected one by one, and all of the above interfaces can be RS485 interfaces. For example, interface 9 of processor 110 is connected to interface 11 of detector 112, and interface 10 of processor 110 is connected to interface 12 of detector 112. All interfaces communicate via RS485. In the data acquisition system 11 shown in Figure 6, assuming interface 9 is a multiplexed first detection start interface and detection status sensing interface, and interface 10 is a data acquisition interface, then correspondingly, interface 11 is a multiplexed second detection start interface and detection status transmission interface, and interface 12 is a data transmission interface. After confirming that the module power supply 111 outputs the first electrical signal to the electron beam control module 113, the module power supply 111 transmits a parameter configuration completion signal to processor 110.When processor 110 receives the parameter configuration completion signal, it can send a detection start signal to interface 11 via interface 9 to trigger detector 112 to sample the electron beam and obtain electron beam sampling data. After detector 112 finishes sampling, it can transmit a data acquisition completion signal to interface 9 via interface 11 to trigger processor 110 to configure the second electrical parameters of module power supply 111. Additionally, detector 112 can also send sampling data to interface 10 via interface 12. After confirming that module power supply 111 outputs the second electrical signal corresponding to the second electrical parameters to electron beam control module 113, module power supply 111 can send a parameter configuration completion signal to processor 110 again to trigger communication between processor 110 and detector 112. That is, processor 110 again sends a detection start signal to interface 11 via interface 9, thereby triggering detector 112 to start sampling a new electron beam. After completing electron beam sampling again, detector 112 can send sampling data to interface 10 via interface 12 and simultaneously transmit an acquisition completion signal to interface 9 via interface 11. In this embodiment, the communication connection between the first detection start interface of the processor 110 and the second detection start interface of the detector 112 enables the processor 110 to trigger the detector 112 in real time, reducing the delay of the detector 112 initiating data acquisition. After data acquisition is completed, the communication connections between the detection status transmission interface of the detector 112 and the detection status perception interface of the processor 110, and between the data transmission interface of the detector 112 and the data acquisition interface of the processor 110, enable the perception of the working status and data synchronization between the two devices. This reduces the delay of the processor 110 in knowing that data acquisition is complete, thereby reducing the delay in triggering the configuration of electrical parameters of the module power supply 111 and improving the data acquisition efficiency of the data acquisition system 11.

[0066] In some feasible implementations, the data acquisition system 11 may further include a light intensity detection sensor 114, and the processor 110 may further include an analog-to-digital converter 1100. The light intensity detection sensor 114 can be connected to the analog-to-digital converter 1100. The light intensity detection sensor 114 can be used to detect the light intensity data of the generated electron beam and can transmit the detected light intensity data to the analog-to-digital converter 1100. The processor 110 can output the sampling data and the light intensity data to the host computer 10. It can be understood that the light intensity detection sensor 114 can collect the X-ray intensity irradiated on the surface of the wafer 116 to be measured, and then convert it into light intensity data through the analog-to-digital converter 1100. It is understood that the data acquired by the data acquisition system 11 is used for X-ray photoelectron spectroscopy analysis of the electron beam generated by the irradiation of the wafer 116 to be measured. The X-rays irradiating the wafer 116 to be measured can come from various light sources 1130, such as one or more of X-ray tubes, synchrotron radiation sources, free-electron lasers, and plasma X-ray sources. The specific source can be determined according to the actual application scenario and is not limited here. The selection of the light source 1130 can affect the accuracy and quality of the data obtained from subsequent sampling. Therefore, in X-ray photoelectron spectroscopy analysis, light intensity data can be analyzed to improve the accuracy of X-ray photoelectron spectroscopy analysis. The light intensity detection sensor 114 can include, but is not limited to, photoresistors, photodiodes, and integrated light intensity sensors, etc. The specific source can be determined according to the actual application scenario and is not limited here. The output terminal of the light intensity detection sensor 114 can be connected to the input terminal of the analog-to-digital converter 1100 in the processor 110. The processor 110 can acquire the light intensity data and output the light intensity data to the host computer 10. Please refer to Figure 7, which is another structural schematic diagram of the data acquisition system for X-ray photoelectron spectroscopy analysis provided in this application embodiment. As shown in Figure 7, the data acquisition system 11 may include a light intensity detection sensor 114, a processor 110, a module power supply 111, a detector 112, and an electron beam control module 113. The processor 110 may include an analog-to-digital converter 1100, and the electron beam control module 113 may include a light source 1130 (not shown in the figure), etc. The processor 110 can be externally connected to a host computer 10 (not shown in the figure) outside the data acquisition system 11 via a physical port or other means. The output terminal of the light intensity detection sensor 114 can be connected to the input terminal of the analog-to-digital converter. Here, the light intensity detection sensor 114 and the analog-to-digital converter 1100 can be connected via a physical port; the specific connection can be determined according to the actual equipment structure and is not limited here. The light intensity sensor 114 can detect the light intensity (i.e., light strength) on the surface of the wafer under test when the light source 1130 illuminates the wafer under test, and transmit the acquired light intensity to the analog-to-digital converter 1100. The analog-to-digital converter 1100 converts the light intensity into light intensity data, and then the processor 110 can upload the light intensity data and the collected data output by the detector 112 to the host computer 10.In this embodiment, by introducing a light intensity detection sensor 114, the light intensity data of the generated electron beam can be acquired through the collaborative cooperation between the light intensity detection sensor 114 and the analog-to-digital converter in the processor 110. The light intensity data and the sampled data can be used together for X-ray photoelectron spectroscopy analysis, which can improve the richness of the data acquired by the data acquisition system 11, thereby improving the effectiveness and reliability of X-ray photoelectron spectroscopy analysis. Here, the processor 110 can transmit the sampled data and light intensity data to the host computer 10, which can reduce the resource consumption for data synchronization, thereby improving the system performance of the data acquisition system 11 and making it highly applicable.

[0067] In some feasible implementations, the data acquisition system 11 may further include a control unit 117. The control unit 117 can be used to connect the host computer 10 and the processor 110. The control unit 117 can obtain the configuration parameters of the module power supply 111 from the host computer 10, and can obtain multiple electrical parameters of the module power supply 111 based on the configuration parameters. One sampling process corresponds to one electrical parameter, and the multiple electrical parameters may include a first electrical parameter and a second electrical parameter. The control unit 117 can also be used to transmit multiple electrical parameters to the processor 110. It is understood that the control unit 117 can be located outside the processor 110 to connect the host computer 10 and the processor 110. Here, the control unit 117 can be a microprocessor (MPU), digital signal processor (DSP), microcontroller unit (MCU), etc., while the processor 110 can be a field-programmable gate array (FPGA), etc. The specific choice depends on the actual application scenario and is not limited here. Here, the host computer 10 can be used to detect and control the data acquisition system 11. It typically runs on a terminal device or server, and can acquire data from the data acquisition system 11, performing filtering, analysis, calculation, and storage. Users can control the data acquisition system 11 via the host computer 10 through user operations on terminal devices such as mobile phones and computers or on the server. For example, users can input configuration parameters of the module power supply 111 into the host computer 10. These parameters may include, but are not limited to, the current parameters of the magnetic lens 1131, the voltage parameters of the electrostatic lens 1132, and the light intensity parameters of the light source 1130. The specific parameters can be determined according to the actual application scenario and are not limited here. The control unit 117 can obtain the configuration parameters of the module power supply 111 from the host computer 10. These configuration parameters can be input by the user through the host computer 10 or generated from historical data, depending on the actual application scenario and are not limited here. The control unit 117 can obtain multiple electrical parameters configured to the module power supply 111 in multiple sampling processes based on the configuration parameters. Here, the configuration parameter type obtained by the control unit 117 from the host computer 10 can be multiple data or a data block, etc. The specific type can be determined according to the actual situation and is not limited here. The control unit 117 can perform one or more parameter processing on the configuration parameters, including but not limited to fixed-point processing, data splitting processing, parameter recombination processing, etc., to obtain multiple electrical parameters configured to the module power supply 111 in multiple sampling processes from the configuration parameters.The control unit 117 can also be used to send multiple electrical parameters to the processor 110. Here, the control unit 117 can transmit data through serial communication, network port communication, etc., which can be determined according to the actual application scenario and is not limited here. For example, please refer to Figure 8a, which is a schematic diagram of another application scenario of the data acquisition system for X-ray photoelectron spectroscopy analysis provided in the embodiment of this application. The data acquisition system 11 shown in Figure 8a may include a processor 110, a module power supply 111, a detector 112, an electron beam control module 113, and a control unit 117. The control unit 117 can be selected from the above-mentioned MCU, MPU, DSP, etc., and is located between the host computer 10 and the processor 110. It can be connected to the host computer 10 and the processor 110 through physical interfaces, etc. The specific structure and ports of the control unit 117 can be determined according to the actual application scenario and are not limited here. Assuming the user inputs configuration parameters for the module power supply 111 into the host computer 10, the host computer 10 can transmit the configuration parameters to the control unit 117. The control unit 117 can obtain multiple electrical parameters based on the configuration parameters and transmit them to the processor 110. The processor 110 can then send these multiple electrical parameters to the module power supply 111 to configure its electrical parameters. After the detector 112 completes its data acquisition, it can send the sampled data to the processor 110. The control unit 117 can obtain the sampled data from the processor 110 and upload it to the host computer 10 to complete the data acquisition work of the data acquisition system 11. In this embodiment, by introducing the control unit 117, it can communicate with the host computer 10 to obtain configuration parameters and obtain multiple electrical parameters based on these parameters to transmit to the processor 110. This enables low-latency electrical parameter acquisition, preprocessing of the configuration parameters to obtain electrical parameters usable for configuring the module power supply 111, reduces the data processing load of the processor 110, reduces data transmission latency, and thus improves the data processing efficiency of the data acquisition system 11.

[0068] Optionally, the control unit 117 can also be located inside the processor 110, and can be integrated into the processor 110 as the first processing unit 1101. In this case, the processor 110 can also integrate a second processing unit 1102. The second processing unit 1102 can be an FPGA or other components, and the first processing unit 1101 can be an MCU, MPU, DSP or other components. The specific components can be determined according to the actual application scenario, and there are no restrictions here. Here, the second processing unit 1102 can realize real-time control and data synchronization of the module power supply 111 and the detector 112. The first processing unit 1101 can be used to connect the host computer 10 and the second processing unit 1102, thereby realizing data synchronization between the host computer 10 and the second processing unit 1102. For example, please refer to Figure 8b, which is a schematic diagram of another application scenario of the data acquisition system for X-ray photoelectron spectroscopy analysis provided in the embodiment of this application. The data acquisition system 11 shown in Figure 8b may include a processor 110, a module power supply 111, a detector 112, and an electron beam control module 113. The processor 110 is integrated with a first processing unit 1101 and a second processing unit 1102. The module power supply 111 and the detector 112 can be connected to the second processing unit 1102 respectively. The first processing unit 1101 and the second processing unit 1102 are internally connected within the processor 110. The first processing unit 1101 can be externally connected to a host computer 10 via a physical interface, etc. The specific connection method and port can be determined according to the actual application scenario and are not limited here. Assuming the user inputs configuration parameters for the module power supply 111 into the host computer 10, the host computer 10 can transmit the configuration parameters to the first processing unit 1101. The first processing unit 1101 can obtain multiple electrical parameters based on the configuration parameters and transmit them to the second processing unit 1102. The second processing unit 1102 can then send the multiple electrical parameters to the module power supply 111 to configure the electrical parameters of the module power supply 111. After the detector 112 completes its data acquisition, it can send the sampled data to the second processing unit 1102. The first processing unit 1101 can then obtain the sampled data from the second processing unit 1102 and upload it to the host computer 10 to complete the data acquisition work of the data acquisition system 11. It can be understood that by integrating the first processing unit 1101 and the second processing unit 1102 into the same processor 110, the first processing unit 1101 focuses on communication management and task scheduling with the host computer 10. Both share data and resources through an internal bus, significantly reducing external interface circuits and improving system integration and anti-interference capabilities. Meanwhile, the second processing unit 1102 directly controls peripherals such as the module power supply 111 and the detector 112 through parallel hardware logic, providing nanosecond-level real-time response and high-speed data synchronization capabilities.This architecture retains the flexible logic control advantages of the first processing unit 1101, while fully leveraging the hardware acceleration capabilities of the second processing unit 1102. Furthermore, through dynamic function allocation and unified clock management, it significantly improves system reliability, scalability, and development efficiency while reducing power consumption and cost.

[0069] In some feasible implementations, the processor 110 may include a first processing unit 1101 and a second processing unit 1102. Before receiving a data acquisition completion signal through the detection status sensing interface of the processor 110 to configure the second electrical parameters to the module power supply 111, during the sampling process, the first processing unit 1101 may issue a voltage adjustment command to the second processing unit 1102. The second processing unit 1102 obtains the second electrical parameters according to the voltage adjustment command, so that after receiving the data acquisition completion signal through the detection status sensing interface, the second electrical parameters are configured to the module power supply 111. The first processing unit 1101 may be an MCU, and the second processing unit 1102 may be an FPGA. Here, the sampling process refers to the time between the module power supply 111 configuring the second electrical parameters and the detector 112 sampling. Optionally, the second processing unit 1102 may integrate interfaces and modules including, but not limited to, a system synchronization controller 11020 (SSC11020), a unified interface controller 11021 (UIC11021), and a host port interface 11022 (HPI11022). The specific integration can be determined based on the actual application scenario and is not limited here. Here, the second processing unit 1102 in the processor 110, under the action of the aforementioned modules such as SSC11020, UIC11021, and HPI11022, can perform data read and write operations alternately through two data buffers, thereby achieving seamless data processing and optimizing data processing and transmission efficiency. The second processing unit 1102 can provide a ping-pong interface to receive multiple electrical parameters sent by the first processing unit 1101 and to receive the collected data output by the detector 112. It is understood that the processor 110 can use a ping-pong design to ensure uninterrupted information exchange within two large cycles via the ping-pong interface, thereby achieving seamless pipelined operation of the module power supply 111 parameter adjustment and the detector 112 spectrum acquisition. For ease of understanding, please refer to Figure 9, which is a schematic diagram of the pipelined operation of the processor 110 in the X-ray photoelectron spectroscopy data acquisition system 11 provided in this embodiment of the application. As shown in Figure 9, without the ping-pong design, the processor 110 only has one working cycle. That is, the second processing unit 1102 needs to complete the module power supply 111 configuration (i.e., voltage adjustment as shown in the figure) and the detector 112 data acquisition (i.e., spectrum acquisition as shown in the figure) before receiving the voltage adjustment command for the next cycle. This makes it impossible to achieve uninterrupted voltage adjustment and spectrum acquisition, resulting in low data acquisition efficiency.Assuming processor 110 adopts the ping-pong design shown in the figure, and uses the ping-pong interface for data caching and communication, it can perform voltage regulation and spectrum acquisition within two large cycles (large cycle A and large cycle B as shown in the figure). As shown in Figure 9, during the voltage regulation and spectrum acquisition process in large cycle A, it can receive instructions from large cycle B. For example, when configuring the first electrical parameter of the module power supply 111, the first processing unit 1101 can output the second electrical parameter to the second processing unit 1102, and the second electrical parameter will be cached in the second processing unit 1102. After the spectrum acquisition work in large cycle A is completed, the instruction is sent to the module power supply 111, realizing uninterrupted voltage regulation and spectrum acquisition pipelined operation. The specific buffer structure and ping-pong interface structure can be determined according to the actual situation and are not limited here. It can be understood that the ping-pong interface in the second processing unit 1102 can be combined with modules such as SSC11020, UIC11021, and HPI11022 to optimize data processing and transmission efficiency. For ease of understanding, please also refer to Figure 10, which is another structural schematic diagram of the data acquisition system for X-ray photoelectron spectroscopy analysis provided in this application embodiment. The data acquisition system 11 shown in Figure 10 includes a processor 110, a module power supply 111, a detector 112, and a light intensity detection sensor 114. The processor 110 is integrated by a second processing unit 1102 and a first processing unit 1101. The second processing unit 1102 may include modules such as SSC11020, UIC11021, and HPI11022. HPI11022 can be used to connect the second processing unit 1102 and the first processing unit 1101, enabling the first processing unit 1101 to read the storage space of the second processing unit 1102 for fast data transmission. The first processing unit 1101 can be externally connected to a host computer 10 (not shown in the figure) outside the data acquisition system 11; the specific connection can be determined according to the actual application scenario and is not limited here. As shown in Figure 10, UIC11021, as a unified interface manager, is mainly used to connect to the module power supply 111. It can integrate multiple SPI interfaces to communicate independently with multiple interfaces in the module power supply 111. Assuming that the data acquisition system 11 expects to acquire 14 sets of sampling signals, it can configure the electrical parameters of the module power supply 111 14 times. The module power supply 111 can be connected to the UIC11021 module in the second processing unit 1102 through 14 SPI interfaces. UIC11021 can include multiple digital-to-analog converters (DAC0 to DAC13 in UIC11021 as shown in Figure 10) and multiple analog-to-digital converters (ADC0 to ADC13 in UIC11021 as shown in Figure 10) to configure 14 electrical parameters (such as the first electrical parameter, the second electrical parameter, etc. mentioned above) to the module power supply 111 and receive the configuration completion signal fed back by the module power supply 111.As shown in Figure 10, the SSC11020 can be used to connect to the detector 112 and the light intensity detection sensor 114, enabling clock and data synchronization between the devices. It can integrate multiple communication protocols and interfaces, such as RS485, UART, and SPI as shown in Figure 10, to transmit detection start signals, data acquisition completion signals, and data such as acquired data and light intensity data. Assuming the second processing unit 1102 uses RS485 to communicate with the detector 112, the status synchronization signal and data synchronization signal can be transmitted through independent signal lines and interfaces. As shown in Figure 10, the RS485_SYNC interface can be used to transmit the detection start signal and data acquisition completion signal, thereby enabling the second processing unit 1102 and the detector 112 to perceive and control the working status in real time. The collaboration between RS485_DATA and UART can be used to transmit acquired data, enabling the uploading of data acquired by the detector 112. Meanwhile, the second processing unit 1102 can communicate with the light intensity detection sensor 114 via an SPI interface. That is, the light intensity detection sensor 114 can connect to the analog-to-digital converter (ADC0 to ADC3 in SSC11020 as shown in Figure 10) via the SPI interface, enabling the collected light intensity data to be transmitted to the processor 110, and then transmitted together with the sampled data to the first processing unit 1101 for output. In this embodiment, the processor 110, integrated by the first processing unit 1101 and the second processing unit 1102, flexibly employs various communication protocols and interfaces to achieve seamless voltage regulation and spectrum acquisition, reducing the latency of sharing operating states between devices and the latency of data synchronization, thereby improving the data acquisition efficiency of the data acquisition system 11. At the same time, the integrated approach maintains the simplicity of the data acquisition system 11's structure and its high applicability.

[0070] In summary, the X-ray photoelectron spectroscopy data acquisition system 11 provided in this application embodiment consists of at least a module power supply 111, a detector 112, and a processor 110. It may also include functional components such as a light intensity detection sensor 114 and a power supply unit, and can be externally connected to a host computer 10, terminal equipment, etc. The data acquisition system can dynamically configure the electrical parameters of the module power supply 111 through the processor 110, trigger the detector 112 to sample the electron beam, and switch the configured electrical parameters of the module power supply 111 after receiving feedback signals from the detector 112 to execute the next round of sampling. The module power supply 111 provides power to the electron beam control module 113, the detector 112 samples the electron beam, and the processor 110 enables information exchange with the module power supply 111 and with the detector 112, achieving real-time communication between the devices. This allows the processor 110 to control the module power supply 111 and detector 112 in real time, reducing communication latency and enabling real-time status awareness between devices. Through the coordinated operation of the module power supply 111, detector 112, and processor 110, high-efficiency X-ray photoelectron spectroscopy data acquisition can be achieved, offering high applicability. Therefore, the data acquisition system 11 provided in this embodiment can improve work efficiency, enhance user experience, and strengthen the product's market competitiveness.

[0071] Please refer to Figure 11, which is a flowchart illustrating the data acquisition method for X-ray photoelectron spectroscopy analysis provided in this embodiment. The data acquisition method for X-ray photoelectron spectroscopy analysis provided in this embodiment (which can be simply referred to as the data acquisition method for ease of description) is applicable to the processor 110 in the data acquisition system 11 shown in Figures 1 to 10. The data acquisition system 11 includes a module power supply 111, a detector 112, and the processor 110. The module power supply 111 provides power to the electron beam control module 113 for controlling X-ray photoelectron spectroscopy analysis. The processor 110 can be connected to both the module power supply 111 and the detector 112. The processor 110 can sequentially execute multiple sampling processes. In each sampling process, the data acquisition method includes:

[0072] S1101, Configure the module power supply to configure the first electrical parameter, so that the module power supply outputs a first electrical signal corresponding to the first electrical parameter to the electron beam control module.

[0073] In some feasible implementations, before configuring the first electrical parameter of the module power supply, the processor can obtain multiple electrical parameters corresponding to the configuration of the module power supply from the host computer in multiple sampling processes. Each sampling process corresponds to one electrical parameter, and the multiple electrical parameters include the first electrical parameter and the second electrical parameter. Optionally, the processor can obtain the configuration parameters of the module power supply from the host computer, and can perform data processing on the configuration parameters of the module power supply, including but not limited to fixed-point processing and slicing processing, to obtain multiple electrical parameters corresponding to multiple sampling processes. The specific processing method can be determined according to the actual application scenario and is not limited here. In the embodiments of this application, obtaining configuration data from the host computer to obtain the electrical parameters for configuring the module power supply can improve the flexibility and diversity of electrical parameter acquisition, reduce the data processing burden on the processor, optimize the resource utilization of the data acquisition system, reduce the latency of data preprocessing of electrical parameters, improve the configuration efficiency of the module power supply and the efficiency of powering the electron beam control module, thereby improving the data acquisition efficiency.

[0074] In some feasible implementations, the processor may include a first parameter configuration interface. This first parameter configuration interface can be connected to the module power supply. The processor can configure first electrical parameters to the module power supply through the first parameter configuration interface, so that the module power supply outputs a first electrical signal corresponding to the first electrical parameters to the electron beam control module and feeds back a parameter configuration completion signal after outputting the first electrical signal. It can be understood that the first electrical parameters can be converted into analog signals in the processor via components such as a digital-to-analog converter and transmitted on signal lines to complete the configuration of the module power supply's first electrical parameters. The module power supply then feeds back a parameter configuration completion signal after outputting the first electrical signal corresponding to the first electrical parameters. For example, referring to Figure 6, interface 1 of the processor shown in Figure 6 can serve as the first parameter configuration interface. The processor can transmit the first electrical parameters to interface 5 of the module power supply through interface 1 to configure the module power supply's first electrical parameters. Here, interface 1, as the first parameter configuration interface, outputs the first electrical parameters, thus configuring the first electrical parameters for the module power supply. After the module power supply outputs the first electrical signal corresponding to the first electrical parameters to the electron beam control module, it can feed back a parameter configuration completion signal to the processor. In this embodiment, the processor can communicate with the module power supply through the first parameter configuration interface. The processor can output the first electrical parameter to the module power supply to configure the first electrical parameter, thereby triggering the module power supply to output the corresponding first electrical signal for the electron beam control module based on the first electrical parameter configuration. This can realize real-time triggering of the electrical parameter configuration of the module power supply, reduce the data synchronization delay between the processor and the module power supply, improve the communication efficiency between the processor and the module power supply, improve the configuration efficiency of the electrical parameters of the module power supply, and thus improve the efficiency of the module power supply in supplying power to the electron beam control module. It has high applicability.

[0075] In the specific implementation, the implementation method of the electrical parameters (including the first electrical parameter) of the processor configuration module power supply can be referred to the implementation method of the processor in the data acquisition system provided in Figures 1 to 10 above, and will not be repeated here.

[0076] S1102, after confirming that the module power supply outputs the first electrical signal, the detector is triggered to sample the electron beam.

[0077] In some feasible implementations, the processor may include a configuration status sensing interface. This interface can be connected to the module power supply. After obtaining the parameter configuration completion signal through the configuration status sensing interface, the processor can trigger the detector to sample the electron beam. Optionally, the processor can periodically or continuously detect whether the configuration status sensing interface has received the parameter configuration completion signal sent by the module power supply. The specific detection method can be determined based on the actual application scenario and is not limited here. For example, as shown in Figure 6, interface 3 of the processor can serve as the configuration status sensing interface. The processor can obtain the parameter configuration completion signal output by the module power supply through interface 7 via interface 3 to determine that the module power supply has completed outputting the electrical signal corresponding to the electrical parameters to the electron beam control module. This triggers communication between the processor and the detector, thereby initiating the detector to begin collecting the data to be measured. In this embodiment, the processor can communicate with the module power supply through the configuration status sensing interface. By receiving the parameter configuration completion signal transmitted by the module power supply through the configuration status sensing interface, it can quickly know that the module power supply has completed outputting the first electrical signal, which can then trigger the detector to perform electron beam sampling. This can reduce the delay between the module power supply completing power supply to the electron beam control module and the detector starting to collect the data to be measured, thereby improving data acquisition efficiency.

[0078] In some feasible implementations, the processor may further include a first detection start interface. This first detection start interface can be connected to the detector. The processor can output a detection start signal to the detector through the first detection start interface. This detection start signal can trigger the detector to sample the electron beam and, after sampling, send back a data acquisition completion signal. It can be understood that after confirming that the module power supply outputs the first electrical signal, the processor can output a detection start signal to the detector through the first detection start interface. This detection start signal can be used to trigger the detector to sample the electron beam. After the electron beam sampling is completed, the processor can receive a data acquisition completion signal from the detector. For example, as shown in Figure 6, the processor's interface 9 can serve as the first detection start interface. The processor can send a detection start signal to the detector's interface 11 through interface 9 to trigger the detector to start acquiring the data to be measured. After completing sampling of the electron beam, the detector can output a data acquisition completion signal to the processor to trigger the processor to execute the next action. In this embodiment, the processor can communicate with the detector through the first detection start interface. After determining that the module power supply outputs the first electrical signal, the processor can output a detection start signal to the detector to trigger the detector to sample the electron beam. This enables real-time signal transmission between the processor and the detector, reduces the delay of the detector starting data acquisition, and thus improves data acquisition efficiency.

[0079] In the specific implementation, the method by which the processor triggers the detector to sample the electron beam can be found in the implementation method of the processor in the data acquisition system provided in Figures 1 to 10 above, and will not be repeated here.

[0080] S1103, receive the data acquisition completion signal fed back by the detector after it has finished sampling the electron beam, so as to trigger the configuration of the second electrical parameters to the power supply of the module to execute the next sampling process.

[0081] In some feasible implementations, the processor may further include a detection status sensing interface. This interface can be connected to the detector. After receiving the data acquisition completion signal via the detection status sensing interface, the processor can configure the second electrical parameters of the module power supply. Optionally, the processor can periodically or continuously detect whether the detection status sensing interface has received the data acquisition completion signal from the detector. The specific detection status sensing interface can be determined according to the actual application scenario and is not limited here. After receiving the data acquisition completion signal via the detection status sensing interface, the processor can trigger the configuration of the second electrical parameters of the module power supply. For example, as shown in Figure 6, the processor's interface 9 can be reused as a detection status sensing interface. The processor can receive the data acquisition completion signal sent by the detector's interface 11 via interface 9 to trigger the configuration of the second electrical parameters of the module power supply. In this embodiment, the processor can communicate with the detector via its detection status sensing interface and receive the data acquisition completion signal transmitted by the detection status transmission interface. The processor can learn that the detector has completed sampling of the electron beam by the data acquisition completion signal, and then initiate the process of configuring the second electrical parameters to the module power supply. This enables state sharing between the detector, processor, and module power supply. Through direct communication between the detector and processor interfaces, the delay in the processor learning that data acquisition is complete can be reduced, thereby reducing the delay in triggering the configuration of electrical parameters of the module power supply. This improves data acquisition efficiency and has high applicability.

[0082] In some feasible implementations, the processor may include a first processing unit and a second processing unit. During the sampling process, the first processing unit can send a voltage adjustment command to the second processing unit, and the second processing unit can obtain the second electrical parameters based on the voltage adjustment command. After receiving the data acquisition completion signal through the detection state sensing interface, the second electrical parameters are configured to the module power supply. Here, the sampling process refers to the time during which the module power supply 111 configures the second electrical parameters and the detector 112 samples. Optionally, the first processing unit can be an FPGA, and the second processing unit can be an MCU; the specific choice depends on the actual application scenario and is not limited here. Here, the first processing unit can be externally connected to a host computer through a physical interface, etc., to obtain configuration parameters from the host computer or transmit sampling data to the host computer. Simultaneously, the first processing unit can be connected to the second processing unit internally. The first processing unit can send a voltage adjustment command to the second processing unit, and the second processing unit can obtain the second electrical parameters based on the voltage adjustment command and configure the second electrical parameters to the module power supply after receiving the data acquisition completion signal. In this application, the processor, through the collaborative work of the first processing unit and the second processing unit, obtains the second electrical parameters in advance after the first processing unit issues the voltage adjustment command, and then triggers the electrical parameter configuration in real time after receiving the data acquisition completion signal, thereby reducing the latency of state sharing and data synchronization between devices, improving the efficiency of data acquisition, and having high applicability.

[0083] In some feasible implementations, the processor may further include a data acquisition interface, which can be connected to the detector. The processor can receive sampled data from the detector through the data acquisition interface. Optionally, the processor can periodically or continuously detect whether the data acquisition interface has received sampled data sent by the detector. The specific method can be determined according to the actual application scenario and is not limited here. The processor can also receive acquired data from the detector through the data acquisition interface. For example, as shown in FIG6, the processor's interface 10 can be used as a data acquisition interface. The processor can receive sampled data sent by the detector's interface 12 through interface 10 to store the sampled data or output the sampled data to external devices, etc. In the embodiments of this application, communication with the detector can be achieved through the processor's data acquisition interface. The processor can receive the sampled data output by the detector in real time after the detector has completed data acquisition, which can reduce the data synchronization delay and thus improve the data acquisition efficiency of the system.

[0084] In the specific implementation, the implementation method of the processor configuring the power supply of the module (including the second electrical parameter) other than the first electrical parameter and the processor acquiring the sampling data output by the detector can be referred to the implementation method of the processor in the data acquisition system provided in Figures 1 to 10 above, and will not be repeated here.

[0085] In summary, in the data acquisition method provided in this application embodiment, the processor can configure the module power supply by transmitting a first electrical parameter to the module power supply, so that the module power supply outputs a first electrical signal corresponding to the first electrical parameter to the electron beam control module. After confirming that the module power supply outputs the first electrical signal, the detector is triggered to sample the electron beam. After receiving the data acquisition completion signal output by the detector, a second electrical parameter can be configured to the module power supply to execute the next sampling process. Therefore, by performing closed-loop parameter configuration of the module power supply and timing trigger control of the detector, fully automatic sampling switching in electron beam multi-parameter dynamic analysis is realized, significantly improving data acquisition efficiency. Thus, the data acquisition method provided in this application embodiment can improve user experience and enhance the market competitiveness of the product.

[0086] The terms "first," "second," etc., in the specification, claims, and drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the term "comprising," and any variations thereof, are intended to cover non-exclusive inclusion. Those skilled in the art will recognize that the units or steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the composition and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0087] The above-disclosed embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of this application. Therefore, any equivalent variations made in accordance with the claims of this application shall still fall within the scope of this application.

Claims

1. A data acquisition system for X-ray photoelectron spectroscopy analysis, characterized in that, The data acquisition system includes a processor, a module power supply, and a detector. The module power supply is used to power the electron beam modulation module for controlling X-ray photoelectron spectroscopy analysis. The processor is connected to the module power supply and the processor is connected to the detector. The processor is configured to sequentially execute multiple sampling processes, and in each sampling process, the processor is configured to: Configure the module power supply with a first electrical parameter, such that the module power supply outputs a first electrical signal corresponding to the first electrical parameter to the electron beam control module; After confirming that the module power supply outputs the first electrical signal, the detector is triggered to sample the electron beam; The system receives a data acquisition completion signal from the detector after sampling the electron beam, which triggers the configuration of a second electrical parameter to the module power supply to execute the next sampling process.

2. The data acquisition system according to claim 1, characterized in that, The processor includes a first parameter configuration interface, which is connected to the module power supply. The processor is configured to configure electrical parameters to the module power supply through the first parameter configuration interface, so as to trigger the module power supply to output an electrical signal corresponding to the electrical parameters to the electron beam control module. Each sampling process corresponds to one electrical parameter, and the electrical parameters include the first electrical parameter and the second electrical parameter.

3. The data acquisition system according to claim 2, characterized in that, The module power supply includes a second parameter configuration interface, which is connected to the processor. The module power supply is used to receive the electrical parameters from the processor through the second parameter configuration interface, and output an electrical signal corresponding to the electrical parameters to the electron beam control module.

4. The data acquisition system according to any one of claims 1 to 3, characterized in that, The module power supply also includes a configuration status transmission interface; the configuration status transmission interface is connected to the processor. The module power supply is used to transmit a parameter configuration completion signal to the processor through the configuration status transmission interface after outputting the first electrical signal corresponding to the first electrical parameter to the electron beam control module.

5. The data acquisition system according to claim 4, characterized in that, The processor also includes a configuration status awareness interface, which is connected to the module power supply. The processor is used to trigger the detector to sample the electron beam after obtaining the parameter configuration completion signal through the configuration status sensing interface.

6. The data acquisition system according to any one of claims 1 to 5, characterized in that, The processor includes a first detection activation interface, which is connected to the detector. After confirming that the module power supply outputs the first electrical signal, the processor outputs a detection start signal to the detector through the first detection start interface. The detection start signal is used to trigger the detector to sample the electron beam.

7. The data acquisition system according to claim 6, characterized in that, The detector includes a second detection activation interface, which is connected to the processor. The detector is used to sample the electron beam after obtaining the detection start signal through the second detection start interface.

8. The data acquisition system according to claim 7, characterized in that, The detector also includes a detection status transmission interface, which is connected to the processor. The detector is used to send a data acquisition completion signal to the processor through the detection status transmission interface after the electron beam sampling is completed.

9. The data acquisition system according to claim 8, characterized in that, The processor also includes a detection state sensing interface, which is connected to the detector. The processor is used to configure a second electrical parameter to the module power supply after receiving the data acquisition completion signal through the detection state perception interface, so as to execute the next sampling process.

10. The data acquisition system according to claim 9, characterized in that, The processor includes a first processing unit and a second processing unit; during the sampling process, the first processing unit is used to send a voltage adjustment command to the second processing unit, and the second processing unit is used to obtain the second electrical parameter according to the voltage adjustment command, so as to configure the second electrical parameter to the module power supply after receiving the data acquisition completion signal, so as to execute the next sampling process.

11. The data acquisition system according to any one of claims 7-10, characterized in that, The detector also includes a data transmission interface, which is connected to the processor. The detector is used to output the sampled data to the processor through the data transmission interface after the electron beam sampling is completed and the sampled data is obtained.

12. The data acquisition system according to claim 11, characterized in that, The processor includes a data acquisition interface, which is connected to the detector. The processor is used to receive the sampled data obtained by the detector through the data acquisition interface.

13. The data acquisition system according to any one of claims 1-12, characterized in that, The data acquisition system also includes a control unit, which is connected to the host computer and the processor. The control unit is used to obtain the configuration parameters of the module power supply from the host computer, and obtain multiple electrical parameters for configuring the module power supply based on the configuration parameters, wherein one sampling process corresponds to one electrical parameter, and the multiple electrical parameters include the first electrical parameter and the second electrical parameter; The control unit is also used to transmit the plurality of electrical parameters to the processor.

14. The data acquisition system according to claim 13, characterized in that, The data acquisition system also includes a light intensity detection sensor, and the processor also includes an analog-to-digital converter; the light intensity detection sensor is connected to the analog-to-digital converter. The light intensity detection sensor is used to detect the light intensity data of the generated electron beam and transmit the detected light intensity data to the analog-to-digital converter; The control unit is also used to acquire the sampling data and the light intensity data from the processor, and output the sampling data and the light intensity data to the host computer.

15. A data acquisition method for X-ray photoelectron spectroscopy analysis, characterized in that, The method is applicable to a processor in a data acquisition system, which includes a module power supply, a detector, and the processor; the module power supply is used to power the electron beam modulation module for controlling X-ray photoelectron spectroscopy analysis. The processor is connected to the module power supply, and the processor is also connected to the detector; The processor is configured to sequentially execute multiple sampling processes, wherein in each sampling process, the method includes: Configure the module power supply with a first electrical parameter, such that the module power supply outputs a first electrical signal corresponding to the first electrical parameter to the electron beam control module; After confirming that the module power supply outputs the first electrical signal, the detector is triggered to sample the electron beam; The system receives a data acquisition completion signal from the detector after sampling the electron beam, which triggers the configuration of a second electrical parameter to the module power supply to execute the next sampling process.

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