Temperature control device

Abstract

The invention relates to a temperature control device (2) for cooling or heating at least one component (100), the operation of which is temperature-sensitive, the temperature control device (2) comprising: - at least two outer plates (5, 6) configured to define an enclosure (4) for the flow of a heat-transfer fluid, the enclosure (4) having a main extension direction (XP) and the flow of the heat-transfer fluid taking place mainly along this main extension direction (XP), the enclosure (4) having two opposite side walls (7, 8) extending substantially along the main extension direction (XP); - at least two fin structures (9) arranged in the enclosure (4), one after the other in the main extension direction (XP), in particular with a lateral clearance between the fin structures (9) and the side walls (7, 8) of the enclosure (4); - at least one central deflector (10) positioned substantially in the middle of the enclosure (4), the middle being considered in the width direction of the enclosure (4), the central deflector being positioned at an upstream end of at least one of the fin structures (9); - at least one lateral deflector (11; 111) projecting from at least one of the side walls (7, 8) of the enclosure (4) and extending at least partially into an interspace (12) between the successive fin structures (9).

Description

[0001] DESCRIPTION

[0002] Title: Thermal regulation device

[0003] [1] The present invention relates to a thermal regulation device for the cooling and / or heating of at least one component whose operation is sensitive to temperature, this component being in particular a power electronic module of an inverter or a battery cell.

[0004] [2] In the context of automotive electrification, many electronic components are being developed or improved for higher power and duty cycles. Generally speaking, the quality of thermal management of the electronics used is impacted by these components, as they have a maximum operating temperature. Consequently, there is a significant need to optimize the cooling of these electronic components to improve durability or reduce their associated costs. Examples of electronic components include those in the vehicle's electric motor, components of a DC-DC converter, an on-board charger, an inverter, and so on.

[0005] [3] For some of these components, the heat flux produced by these components is high due to their small surface areas (very small components). Furthermore, homogeneity of maximum temperatures is required between the multiple heat sources represented by the components.

[0006] [4] Components to be cooled include, for example, switching cell modules of an inverter. This type of component is temperature-sensitive and requires precise thermal management.

[0007] [5] The present invention aims in particular to further improve the thermal regulation of components, in particular to cool them.

[0008] [6] The invention thus relates to a thermal regulation device for cooling or heating at least one temperature-sensitive component, the thermal regulation device comprising:

[0009] - at least two external plates configured to define an enclosure for the flow of a heat transfer fluid, the enclosure having a principal direction of extension and the flow of the heat transfer fluid occurring mainly along this principal direction of extension, the enclosure having two opposing side walls extending substantially along the principal direction of extension; - at least two finned structures arranged in the enclosure, one after the other along the principal direction of extension, in particular with a lateral clearance between the finned structures and the side walls of the enclosure;

[0010] at least one central deflector positioned substantially in the middle of the enclosure, the middle being considered in the direction of the width of the enclosure, at an upstream end of at least one of the finned structures;

[0011] - at least one lateral deflector projecting from at least one of the lateral walls of the enclosure and extending at least partially into an inter-space between successive finned structures.

[0012] [7] The invention makes it possible in particular to optimize the flow of the fluid and the transfer of heat with the components to be cooled (such as power electronic modules).

[0013] [8] The central deflector forces the fluid flow to redirect laterally towards areas to be cooled preferentially, in particular towards rows of power electronic module chips, these rows being on either side of a median area which is less critical to cool.

[0014] [9] The lateral deflector can follow a radius of a fixing area, in particular for a screw, allows a lateral redirection of the fluid flow towards areas to be cooled preferentially, in particular towards rows of chips of power electronic modules.

[0015]

[0010] The combined effect of the central deflector and the lateral deflectors makes it possible to increase the fluid velocity in a preferential manner under the power modules, in relation to the chip rows in particular, thus improving the cooling efficiency.

[0016]

[0011] The rows of chips in the power electronics module are arranged on the outside (in particular on a flat face) of the outer plate, allowing heat transfer, through this outer plate, with the heat transfer fluid circulating in the enclosure. For example, each power electronics module comprises two rows of electronic chips.

[0017]

[0012] According to one aspect of the invention, the finned structures have fin pitches that decrease in the direction of the flow of the heat transfer fluid.

[0018]

[0013] This allows the heat exchange surface to increase as the fluid heats up.

[0019]

[0014] According to one aspect of the invention, the central deflector has a height of at least 30% of the total height of the enclosure. The height is measured perpendicular to the outer plates.

[0015] According to one aspect of the invention, the central deflector extends over the entire height of the enclosure. Such a central deflector thus divides the flow into two streams.

[0020]

[0016] According to one aspect of the invention, the central deflector has an oblong shape in a direction perpendicular to the main extension direction of the enclosure. In other words, the central deflector has an oblong shape in the direction of the width of the enclosure.

[0021]

[0017] According to one aspect of the invention, the enclosure receives a plurality of central deflectors which are positioned on a median longitudinal line of the finned structures.

[0022]

[0018] According to one aspect of the invention, the central deflectors are present in all the inter-spaces between the successive finned structures.

[0023]

[0019] According to one aspect of the invention, the enclosure includes a central deflector upstream of the first finned structure.

[0024]

[0020] According to one aspect of the invention, the enclosure includes a central deflector downstream of the last finned structure (considering the direction of flow).

[0025]

[0021] According to one aspect of the invention, at least one of the finned structures has notches at least at its upstream longitudinal end.

[0026]

[0022] According to one aspect of the invention, at least one of the finned structures has notches at both of its longitudinal ends, the notches located at the upstream longitudinal end being in particular larger than those located at the downstream longitudinal end.

[0027]

[0023] These notches reduce the width of the finned structure in an upstream region thereof.

[0028]

[0024] Thus, where applicable, the finned structure has an absence of fins in the area of ​​the first chip, thereby reducing pressure losses. This absence of fins creates a preferred path for the fluid.

[0029]

[0025] According to one aspect of the invention, the lateral deflector is configured to extend tangentially to a finned structure.

[0030]

[0026] According to one aspect of the invention, the side deflector has a ramp shape, in particular with a rounded end.

[0031]

[0027] This allows the lateral deflector to approach as closely as possible a chip (transistor) located at one end of the power electronics module (in particular at one end of a row of chips).

[0028] According to one aspect of the invention, the lateral deflector has a gradual shape, in the direction of the fluid flow. This gradual shape extends into a return, forming a substantially orthogonal angle with the lateral wall of the enclosure.

[0032]

[0029] Thus, the lateral deflector has a progressive shape followed by the return (which can be straight), thus creating an asymmetry when following the deflector in the direction of the fluid flow.

[0033]

[0030] According to one aspect of the invention, the lateral deflector defines a protruding shape oriented towards the front (therefore downstream if we consider the flow).

[0034]

[0031] Alternatively, the lateral deflector has a symmetrical shape when followed in the direction of the fluid flow.

[0035]

[0032] According to one aspect of the invention, the enclosure comprises a pair of lateral deflectors for each inter-space between successive finned structures.

[0036]

[0033] According to one aspect of the invention, the enclosure includes a pair of lateral deflectors upstream of the first finned structure.

[0037]

[0034] According to one aspect of the invention, the enclosure includes a pair of lateral deflectors downstream of the last finned structure.

[0038]

[0035] According to one aspect of the invention, for each pair of side deflectors, the side deflectors are symmetrical with respect to the median longitudinal line of the enclosure.

[0039]

[0036] According to one aspect of the invention, the lateral deflector has a shape substantially following a radius of a fixing zone, such as for a screw.

[0040]

[0037] According to one aspect of the invention, the side deflectors allow a lateral redirection of the flow towards rows of chips.

[0041]

[0038] The fluid flow occurs in series through the finned structures.

[0042]

[0039] According to one aspect of the invention, the power electronic modules comprise chips (transistors) arranged in rows (in particular two rows), and the lateral and central deflectors are configured to force the flow along these rows, on two circulation lanes running alongside the rows of chips (transistors).

[0043]

[0040] According to one aspect of the invention, the rows of transistors are arranged on either side of the median longitudinal line of the finned structures.

[0044]

[0041] According to one aspect of the invention, the transistors in the parallel rows are side by side.

[0045]

[0042] Alternatively, the transistors in the parallel rows are arranged in a staggered pattern.

[0043] According to one aspect of the invention, the finned structures are corrugated.

[0046]

[0044] According to one aspect of the invention, the device is configured to cool electronic power modules of an inverter.

[0047]

[0045] According to one aspect of the invention, the side deflector is different from a notch intended for screw fixing.

[0048]

[0046] The invention further relates to an assembly comprising a thermal regulation device as mentioned above, and at least one component to be cooled disposed against a face of this thermal regulation device, said component to be cooled being in particular a power electronic module comprising rows of parallel electronic chips.

[0049]

[0047] According to one aspect of the invention, the rows of electronic chips are oriented parallel to the main extension direction of the enclosure.

[0050]

[0048] Other features, details and advantages of the invention will become clearer upon reading the following description on the one hand, and several illustrative and non-limiting examples of embodiments given with reference to the accompanying schematic drawings on the other hand, in which:

[0051]

[0049] [Fig 1] Figure 1 is a perspective representation of an example of an embodiment of an assembly according to the invention, configured to be integrated into an electronic device;

[0052]

[0050] [Fig. 2] Figure 2 is a representation along a direction perpendicular to the external plates, of the whole of Figure 1;

[0053]

[0051] [Fig. 3] Figure 3 is a representation of a thermal regulation device according to another embodiment of the invention;

[0054]

[0052] [Fig. 4] Figure 4 is a representation of a thermal regulation device according to yet another embodiment of the invention.

[0055]

[0053] The features, variants, and different embodiments of the invention can be combined in various ways, provided they are not incompatible or mutually exclusive. In particular, variants of the invention may be conceived comprising only a selection of features, described hereafter in isolation from the other described features, if this selection of features is sufficient to confer a technical advantage and / or to differentiate the invention from the prior art.

[0054] In the following description, identical elements or elements with identical function bear the same reference numeral. For the sake of brevity, only the differences between the embodiments presented are described.

[0056]

[0055] Figures 1 and 2 show an assembly 1 comprising a thermal regulation device 2 and a plurality of components 100 to be cooled arranged against a face 3 of this thermal regulation device 2. Each component 100 to be cooled is, in the example described, a power electronic module comprising each of two parallel rows RG of electronic chips 101. The rows RG of electronic chips 101 are oriented parallel to a main extension direction XP of an enclosure 4 described below.

[0057]

[0056] The 100 power electronic modules are part of an inverter, in particular for a motor vehicle.

[0058]

[0057] The thermal regulation device 2 comprises two external plates 5 and 6, in particular made of aluminium, configured to define, by being brazed together, a chamber 4 for the flow of a heat transfer fluid, the chamber 4 having a main extension direction XP and the flow of the heat transfer fluid occurring mainly along this main extension direction XP.

[0059]

[0058] The enclosure 4 comprises two opposing side walls 7 and 8 extending substantially along the main extension direction XP.

[0060]

[0059] The heat transfer fluid is, for example, glycol water.

[0061]

[0060] The enclosure 4 includes a fluid inlet 16 and a fluid outlet 17 at the longitudinal ends of the enclosure 4. This fluid inlet 16 and this fluid outlet 17 are formed by openings on the outer plate 5.

[0062]

[0061] The RG rows of transistors 101 are arranged on either side of the median longitudinal line of the finned structures 9.

[0063]

[0062] The transistors 101 of the parallel RG rows are side by side.

[0064]

[0063] Three finned structures 9, in particular made of aluminium, are arranged in the enclosure 4, one after the other along the main extension direction XP, with a lateral clearance JL between the finned structures 9 and the side walls 7 and 8 of the enclosure 4. Alternatively, there could be no lateral clearance between the finned structures 9 and the side walls 7 and 8 of the enclosure 4.

[0065]

[0064] The finned structures 9 comprise substantially straight fins 18, arranged parallel to each other in rows of fins, and these rows of fins extend substantially in the principal extension direction XP of the enclosure 4.

[0065] The fins 18 may be of the alternating or "offset" type. Thus, the fins 18 are arranged in an alternating pattern, each fin 18 being offset laterally (and therefore orthogonally to the axis XP) relative to the adjacent fins 18, in order to disrupt the flow of the heat transfer fluid and generate turbulence that promotes heat transfer.

[0066]

[0066] It is possible that the finned structures 9 have decreasing fin pitches in the direction of the flow of the heat transfer fluid.

[0067]

[0067] This allows the heat exchange surface to increase as the fluid heats up.

[0068]

[0068] Central deflectors 10 are positioned substantially in the middle of the enclosure 4, the middle being considered in the direction of the width of the enclosure 4, at an upstream end of at least one of the finned structures 9. The enclosure 4 has a substantially rectangular perimeter.

[0069]

[0069] Each central deflector 10 has a height of at least 30% of the total height of the enclosure 4. The height is measured perpendicular to the external plates 5 and 6.

[0070]

[0070] For example, the central deflector 10 extends over the entire height of the enclosure 4. Such a central deflector 10 thus divides the flow into two streams.

[0071]

[0071] The central deflector 10 has an oblong shape in a direction perpendicular to the main extension direction XP of the enclosure 4. In other words, the central deflector 10 has an oblong shape in the direction of the width of the enclosure 4.

[0072]

[0072] The plurality of central deflectors 10 are positioned on a median longitudinal line of the finned structures 9.

[0073]

[0073] The central deflectors 10 are present in all the inter-spaces 12 between the successive finned structures 9.

[0074]

[0074] The enclosure 4 includes a central deflector 10 upstream of the first finned structure 9.

[0075]

[0075] The enclosure 4 includes a central deflector 10 downstream of the last finned structure 9 (considering the direction of flow).

[0076]

[0076] A plurality of lateral deflectors 11 protrude from the lateral walls 7 and 8 of the enclosure 4 and extend into each of the inter-spaces 12 between the successive finned structures 9.

[0077]

[0077] Each side deflector 11 is configured to extend tangentially to a finned structure 9.

[0078] The side deflector 11 has a ramp shape, notably with a rounded end.

[0078]

[0079] This allows the side deflector 11 to get as close as possible to a chip 101 (transistor) located at one end of the power electronic module 100 (in particular at one end of an RG row of chips 101).

[0079]

[0080] The lateral deflector 11 exhibits a symmetrical shape when viewed along the direction of fluid flow. In other words, the lateral deflector 11 is symmetrical with respect to a plane orthogonal to the external plates 5 and 6 and passing through the midpoint of this lateral deflector 11.

[0080]

[0081] The enclosure 4 includes a pair of lateral deflectors 11 for each interspace 12 between successive finned structures 9.

[0081]

[0082] The enclosure 4 includes a pair of side deflectors 11 upstream of the first finned structure 9.

[0082]

[0083] The enclosure 4 includes a pair of side deflectors 11 downstream of the last finned structure 9.

[0083]

[0084] For each pair of side deflectors 11, the side deflectors 11 are symmetrical with respect to the median longitudinal line of the enclosure 4.

[0084]

[0085] The lateral deflector 11 has a shape that substantially follows a radius of a fixing area 13, such as for a screw.

[0085]

[0086] The lateral deflectors 11 allow lateral redirection of the flow towards RG rows of chips 101.

[0086]

[0087] The invention notably optimizes fluid flow and heat transfer with the components 100 to be cooled. The central deflector 10 forces the fluid flow to be redirected laterally towards areas requiring preferential cooling, particularly towards the RG rows of power electronic modules 101, these RG rows being located on either side of a central area that is less critical to cool. The lateral deflector 11 can follow the radius of a mounting area 13 and allows for lateral redirection of the fluid flow towards areas requiring preferential cooling, particularly towards the RG rows of power electronic modules 101. The combined effect of the central deflector 10 and the lateral deflectors 11 increases the fluid velocity preferentially under the power modules 100, particularly with respect to the RG rows of chips 101, thus improving cooling efficiency.

[0087]

[0088] The finned structures 9 have notches 15 at both longitudinal ends, the notches 15 located at the upstream longitudinal end being notably larger than those located at the downstream longitudinal end.

[0089] These notches 15 reduce the width of the finned structure 9, in an upstream region of it.

[0088]

[0090] Thus, where applicable, the finned structure 9 exhibits a lack of fins in the area of ​​the first chip 101, thereby reducing pressure losses. This absence of fins creates a preferred path for the fluid.

[0089]

[0091] The fluid flow occurs in series through the finned structures 9.

[0090]

[0092] The power electronic modules 100 include chips 101 (transistors) arranged in RG rows (in particular two RG rows), and the lateral deflectors 11 and central deflectors 10 are configured to force the flow along these RG rows, on two traffic lanes running alongside the RG rows of chips 101 (transistors).

[0091]

[0093] In an alternative embodiment illustrated in Figure 3, the lateral deflector 111 has a gradual shape 112, in the direction of the fluid flow. This gradual shape 112 extends into a return 113, forming a substantially orthogonal angle with the lateral wall 7 or 8 of the enclosure 4.

[0092]

[0094] Thus, the lateral deflector 111 has a progressive shape followed by the return 113 (which can be substantially straight), creating an asymmetry when following the deflector 111 in the direction of the fluid flow.

[0093]

[0095] The lateral deflector 111 defines a protruding shape oriented towards the front (therefore downstream if we consider the flow).

[0094]

[0096] Figure 4 shows another embodiment of the invention, which differs from the example in Figure 3 in that the central deflector 10 following the last power electronic module 100 is absent. In fact, the entire flow is directed towards the fluid outlet 17, which is centered.

Claims

DEMANDS

1. A thermal control device (2) for cooling or heating at least one temperature-sensitive component (100), the thermal control device (2) comprising: - at least two external plates (5, 6) configured to define an enclosure (4) for the flow of a heat transfer fluid, the enclosure (4) having a principal extension direction (XP) and the flow of the heat transfer fluid occurring mainly along this principal extension direction (XP), the enclosure (4) having two opposite lateral walls (7, 8) extending substantially along the principal extension direction (XP); - at least two finned structures (9) arranged in the enclosure (4), one after the other along the main extension direction (XP), in particular with a lateral gap between the finned structures (9) and the side walls (7, 8) of the enclosure (4); at least one central deflector (10) positioned substantially in the middle of the enclosure (4), the middle being considered in the direction of the width of the enclosure (4), at an upstream end of at least one of the finned structures (9); - at least one lateral deflector (11;111) projecting from at least one of the lateral walls (7, 8) of the enclosure (4) and extending at least partially into an interspace (12) between successive finned structures (9).

2. Thermal regulation device (2) according to claim 1, wherein the finned structures (9) have decreasing fin pitches in the direction of the flow of the heat transfer fluid.

3. Thermal regulation device (2) according to claim 1 or 2, wherein the central deflector (10) has a height of at least 30% of the total height of the enclosure (4), the height being measured perpendicular to the external plates (5, 6), and in particular the central deflector (10) extends over the entire height of the enclosure (4), thus dividing the flow into two streams.

4. Thermal regulation device (2) according to any one of the preceding claims, wherein the central deflector (10) has an oblong shape in a direction perpendicular to the main extension direction (XP) of the enclosure (4).

5. Thermal regulation device (2) according to any one of the preceding claims, wherein the enclosure (4) receives a plurality of central deflectors (10) positioned on a median longitudinal line of the finned structures (9), and in particular the central deflectors (10) are present in all the inter-spaces (12) between successive finned structures (9).

6. Thermal regulation device (2) according to any one of the preceding claims, wherein the enclosure (4) comprises a central deflector (10) upstream of the first finned structure (9), and a central deflector (10) downstream of the last finned structure (9).

7. Thermal regulation device (2) according to any one of the preceding claims, wherein at least one of the finned structures (9) has notches (15) at least at its upstream longitudinal end.

8. Thermal regulation device (2) according to claim 7, wherein at least one of the finned structures (9) has notches (15) at both of its longitudinal ends, the notches (15) located at the upstream longitudinal end being larger than those located at the downstream longitudinal end.

9. Thermal regulation device (2) according to any one of the preceding claims, wherein the lateral deflector (11) has a ramp shape, in particular with a rounded end.

10. Assembly (1) comprising a thermal regulation device (2) according to any one of the preceding claims, and at least one component (100) to be cooled disposed against a face (3) of this device (2), said component (100) to be cooled being in particular a power electronic module comprising parallel rows (RG) of electronic chips (101)

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