Component mounting device

Abstract

This component mounting device comprises a control unit that controls a head unit and a wafer camera unit. In a recognition process, the control unit recognizes a component of a wafer on the basis of an image acquired by the wafer camera unit that has been moved, by means of a component supply unit, to a wafer disposition area where the wafer is disposed. In a pickup process, the control unit causes the component to be picked from the wafer by means of the head unit that has been moved to the wafer disposition area. In a mounting process, the control unit mounts the component on a substrate by means of the head unit that has been moved to a mounting area into which the substrate has been carried by a conveyance unit. In an inspection process, the control unit inspects the substrate on the basis of the image acquired by the wafer camera unit that has been moved to the mounting area.

Description

Component mounting apparatus

[0001] The present invention relates to a component mounting apparatus.

[0002] Conventionally, component mounting apparatuses that mount components on a board such as a printed wiring board are known. In this type of component mounting apparatus, board inspection is performed, such as checking whether foreign matter is present on the board or whether the mounting state of components on the board is normal, so as to suppress the occurrence of defective boards.

[0003] Patent Document 1 discloses a technique related to a component mounting apparatus provided with a control device serving as an inspection execution unit. In the technique disclosed in Patent Document 1, the control device causes a recognition camera to recognize a component mounting position on a board, and performs pre-component-mounting inspection on the component mounting position.

[0004] However, in the technique disclosed in Patent Document 1, sufficient measures have not been taken to perform board inspection while improving the production efficiency of boards.

[0005] Japanese Unexamined Patent Publication No. 2009-224443

[0006] An object of the present invention is to provide a component mounting apparatus capable of performing board inspection while improving the production efficiency of boards.

[0007] A component mounting apparatus according to one aspect of the present invention includes: a transport unit for transporting a substrate to a mounting area where component mounting work is performed; a component supply unit having a wafer supply section for supplying a wafer divided into a plurality of components to a wafer placement area; a head unit that is movable horizontally in the space above the wafer placement area and the mounting area, picks up the components from the wafer in the wafer placement area, and mounts the picked-up components onto the substrate in the mounting area; a wafer camera unit that is movable horizontally in the space above the wafer placement area and the mounting area, and acquires an image by imaging operation; and a control unit that controls the head unit and the wafer camera unit. The control unit performs a recognition process for recognizing the components on the wafer based on an image acquired by the wafer camera unit moved to the wafer placement area; a pickup process for picking up the components from the wafer by the head unit moved to the wafer placement area; a mounting process for mounting the components onto the substrate by the head unit moved to the mounting area; and an inspection process for inspecting the substrate based on an image acquired by the wafer camera unit moved to the mounting area.

[0008] Figure 1 is a plan view showing the overall configuration of a component mounting apparatus according to an embodiment. Figure 2 is a perspective view and a side view of the head unit and push-up unit provided in the component mounting apparatus. Figure 3 is a block diagram showing the control configuration of the component mounting apparatus. Figure 4 is a flowchart showing the processing flow executed by the control unit of the control unit provided in the component mounting apparatus. Figure 5 is a flowchart showing the sequence creation process of the control unit. Figure 6 is a diagram showing an example of a processing sequence created by the sequence creation process of the control unit. Figure 7 is a flowchart showing the operation flow of the wafer camera unit. Figure 8 is a flowchart showing the operation flow of the head unit. Figure 9 is a diagram for explaining the recognition process, pickup process and mounting process executed by the control unit. Figure 10 is a diagram for explaining the inspection process executed by the control unit.

[0009] Embodiments of the present invention will be described below with reference to the attached drawings. Note that the following embodiments are merely examples of the present invention and do not limit the technical scope of the present invention.

[0010] Furthermore, the directional relationships will be explained below using the XYZ Cartesian coordinate axes. The X and Y directions are perpendicular to each other on the horizontal plane, and the Z direction is the vertical direction perpendicular to both the X and Y directions. In addition, one side of the X direction is called the "+X side," and the other side opposite to the X direction is called the "-X side." Similarly, one side of the Y direction is called the "+Y side," and the other side opposite to the Y direction is called the "-Y side." The Z direction is sometimes referred to as the vertical direction.

[0011] [Overall Configuration of the Component Mounting Apparatus] Figure 1 is a plan view showing the overall configuration of the component mounting apparatus 1 according to this embodiment. Figure 2 is a perspective view and a side view of the head unit 4 and the push-up unit 40 provided in the component mounting apparatus 1. The component mounting apparatus 1 is a composite type component mounting apparatus that mounts dies 7a (components) diced from a wafer 7 onto a substrate P, and also mounts chip components (components) supplied by a feeder 5F onto the substrate P. The component mounting apparatus 1 comprises a base 2, a transport unit 3, a head unit 4, a component supply unit 5, a wafer camera unit 32U, and a push-up unit 40.

[0012] The base 2 is the mounting base for various devices provided by the component mounting device 1. The transport unit 3 is composed of, for example, a conveyor. The transport unit 3 is a transport line for substrates P, installed on the base 2 so as to extend in the X direction. The transport unit 3 transports the substrates P into a predetermined mounting area PA where component mounting work is performed, and after the mounting work is completed, it transports the substrates P out of the mounting area PA to the outside of the device. The transport unit 3 has a clamping mechanism for holding the substrates P in the mounting area PA.

[0013] The component supply unit 5 includes a wafer supply unit 6 and a feeder 5F. The feeder 5F supplies chip components such as transistors, resistors, and capacitors to the component supply area 5FA. The component supply area 5FA is located on the -Y side of the mounting area PA. The component supply method of the feeder 5F is not particularly limited, as long as it is configured to supply components. Examples of feeder 5F include a tape feeder that supplies components using tape as a carrier, a tray feeder that supplies components by moving a tray on which components are placed, and a stick feeder that supplies components by pushing them out of a cylindrical stick.

[0014] A transfer unit 5S is positioned in a transfer area 5SA near the area where the feeder 5F is located on the base 2. The transfer area 5SA is located on the -Y side of the mounting area PA and on the +X side of the component supply area 5FA. The transfer unit 5S forms a transfer material layer on the electrode surface by transferring a transfer material such as flux to the electrode of the chip component supplied by the feeder 5F. The transfer material has the function of removing oxide films and dirt from the electrode surface and the function of improving the wettability of solder to the electrode surface.

[0015] The wafer supply unit 6 supplies multiple dies 7a in a diced state from the wafer 7. The wafer supply unit 6 supplies the wafer 7, divided into multiple dies 7a, to the wafer stage 10, which is the wafer placement area, while the wafer 7 is held on a pallet 8. The wafer stage 10 is located on the +Y side of the mounting area PA. The wafer 7 is a disc-shaped semiconductor wafer on which circuit patterns, etc., are formed. The pallet 8 holds an elastically deformable sheet 8a. An assembly of multiple dies 7a, formed by dicing the wafer 7 in a grid pattern, is attached to the sheet 8a. In other words, the wafer supply unit 6 supplies the wafer 7, with the multiple dies 7a attached to the sheet 8a, to the wafer stage 10 while the wafer 7 is held on the pallet 8.

[0016] The wafer supply unit 6 includes a wafer storage elevator 9, a wafer stage 10, and a wafer conveyor 11. The wafer storage elevator 9 stores wafers 7, each with multiple dies 7a attached to a sheet 8a, in multiple layers vertically, with the wafers held on a pallet 8. The wafer stage 10 is installed on the base 2 at the -Y side of the wafer storage elevator 9. The wafer stage 10 is positioned to align with the +Y side of the mounting area PA, which is the stopping position of the substrate P. The wafer stage 10 becomes the wafer placement area where the multiple dies 7a attached to the sheet 8a are placed. The wafer conveyor 11 pulls the pallet 8 from the wafer storage elevator 9 onto the wafer stage 10.

[0017] The head unit 4 includes a plurality of suction heads 4H, a head lifting motor 4M, a ball screw shaft 4J, a ball nut 4N, and a spring 4S.

[0018] The suction head 4H is positioned above the wafer stage 10, that is, above the sheet 8a, and is movable in the vertical direction (Z direction) relative to the head unit 4, while being pulled upward by a spring 4S. Above the sheet 8a, the suction head 4H moves downward to hold the die 7a attached to the sheet 8a from above at a predetermined negative pressure level, and then moves upward while holding the die 7a to remove the die 7a from the sheet 8a and pick it up. The suction head 4H is also movable in the vertical direction relative to the head unit 4 above the component supply area 5FA, that is, above the feeder 5F. Above the feeder 5F, the suction head 4H moves downward to hold the chip component supplied to the component supply area 5FA from above at a predetermined negative pressure level, and then moves upward while holding the chip component to remove the chip component from the feeder 5F and pick it up. Furthermore, the suction head 4H mounts the die 7a or chip component onto the substrate P by releasing the die 7a or chip component, which it is holding by suction via pickup, in response to the release of negative pressure, above the substrate P located in the mounting area PA on the transport unit 3.

[0019] The head lifting motor 4M is a motor that generates the driving force to move the suction head 4H in the vertical direction. The ball screw shaft 4J and ball nut 4N transmit the driving force of the head lifting motor 4M to the suction head 4H. The ball screw shaft 4J extends vertically while connected to the head lifting motor 4M and is rotationally driven by the head lifting motor 4M. The ball nut 4N is screwed onto the ball screw shaft 4J while fixed to the suction head 4H. When the head lifting motor 4M operates and the ball screw shaft 4J is rotationally driven, the suction head 4H, to which the ball nut 4N is fixed, moves vertically.

[0020] The head unit 4 is equipped with a head camera unit 31 that images the substrate P. The head camera unit 31 acquires a second image GD2 through imaging. If the second image GD2 acquired by the head camera unit 31 includes an FID (fiducial) mark attached to the substrate P, the FID mark on the substrate P is recognized based on the second image GD2. This allows the misalignment of the substrate P to be recognized, and the misalignment is corrected when the head unit 4 mounts the die 7a or chip component onto the substrate P.

[0021] A component recognition camera 30 is mounted on the base 2. The component recognition camera 30 images the die 7a or chip component, which is held by the suction head 4H, from below before mounting it onto the substrate P. Based on the image acquired by the imaging operation of the component recognition camera 30, abnormalities in the suction of the die 7a or chip component by the suction head 4H are determined.

[0022] The component mounting apparatus 1 includes a head horizontal drive mechanism D1 that moves the head unit 4 horizontally (in the X and Y directions) in the space above the mounting area PA on the transport unit 3 where the substrate P is placed, the wafer stage 10 on which the wafer 7 is placed, the component supply area 5FA on which chip components are supplied by the feeder 5F, and the transfer area 5SA on which the transfer unit 5S is placed. The head horizontal drive mechanism D1 includes a pair of Y-axis fixed rails 13 on the +X side and -X side, a head Y-axis motor 14, and a head Y-movement axis 15 as a mechanism for moving the head unit 4 in the Y direction. The pair of Y-axis fixed rails 13 are fixed on the base 2 and extend in the Y direction parallel to each other at a predetermined distance in the X direction. The head Y-movement axis 15 is a ball screw shaft that is arranged to extend in the Y direction at a position close to the Y-axis fixed rails 13. The head Y-axis motor 14 rotates the head Y-movement axis 15. A support frame 16 for supporting the head unit 4 is installed between a pair of Y-axis fixed rails 13. Nuts 17, which are screwed onto the Y-movement axes 15 of each head, are attached to the +X side end and the -X side end of the support frame 16.

[0023] The head horizontal drive mechanism D1, as a mechanism for moving the head unit 4 in the X direction, includes a guide member mounted on the support frame 16, a head X-axis motor 18, and a head X-movement shaft 19. The guide member is a member that guides the movement of the head unit 4 in the X direction and is fixed to the support frame 16 on the +Y side surface so as to extend in the X direction. The head X-movement shaft 19 is a ball screw shaft arranged close to the guide member so as to extend in the X direction. The head X-axis motor 18 rotationally drives the head X-movement shaft 19. A nut is attached to the head unit 4, and the nut is screwed onto the head X-movement shaft 19.

[0024] With the head horizontal drive mechanism D1 having the above configuration, the head Y-axis motor 14 is activated and the head Y-movement axis 15 is rotationally driven, causing the head unit 4 to move in the Y direction together with the support frame 16. In addition, the head X-axis motor 18 is activated and the head X-movement axis 19 is rotationally driven, causing the head unit 4 to move in the X direction relative to the support frame 16.

[0025] The head unit 4 is movable in the X and Y directions in the space above the mounting area PA, wafer stage 10, component supply area 5FA, and transfer area 5SA by the head horizontal drive mechanism D1. In the wafer stage 10, the head unit 4 picks up a die 7a from the wafer 7 using the suction head 4H. In the component supply area 5FA, the head unit 4 picks up chip components from the feeder 5F using the suction head 4H. In the transfer area 5SA, the head unit 4 transfers a transfer material to the chip components held by the suction head 4H. In the mounting area PA, the head unit 4 mounts the die 7a or chip components held by the suction head 4H onto the substrate P.

[0026] The wafer camera unit 32U is movable in the X and Y directions between a predetermined standby position located on the +Y side of the wafer stage 10 and the space above the wafer stage 10 and the mounting area PA. The wafer camera unit 32U includes a wafer camera 32. The wafer camera 32 acquires a first image GD1 by imaging. If the first image GD1 acquired by the wafer camera 32 includes a die 7a of the wafer 7 on the wafer stage 10, the position of the die 7a to be picked up by the suction head 4H of the head unit 4 is recognized based on the first image GD1.

[0027] The component mounting apparatus 1 includes a camera horizontal drive mechanism D2 that moves the wafer camera unit 32U horizontally (in the X and Y directions) in the space above the wafer stage 10 and the mounting area PA, between a predetermined standby position. This camera horizontal drive mechanism D2 is a separate and independent drive system from the head horizontal drive mechanism D1 that drives the head unit 4.

[0028] The camera horizontal drive mechanism D2, as a mechanism for moving the wafer camera unit 32U in the Y direction, comprises a pair of Y-axis fixed rails 33 on the +X side and -X side, and a camera Y-axis motor 34 and camera Y-movement axis 35 located on the +X side. The pair of Y-axis fixed rails 33 are fixed on the base 2 and extend in the Y direction parallel to each other at a predetermined distance in the X direction. The camera Y-movement axis 35 is a ball screw shaft positioned to extend in the Y direction at a location close to the Y-axis fixed rail 33 on the +X side. The camera Y-axis motor 34 rotates the camera Y-movement axis 35. A support frame 36 supporting the wafer camera unit 32U is installed between the pair of Y-axis fixed rails 33. A nut 37, which is screwed onto the camera Y-movement axis 35, is assembled to the +X side end of the support frame 36.

[0029] The camera horizontal drive mechanism D2, as a mechanism for moving the wafer camera unit 32U in the X direction, includes a guide member mounted on a support frame 36, a camera X-axis motor 38, and a camera X-axis movement shaft 39. The guide member is a member that guides the movement of the wafer camera unit 32U in the X direction and is fixed to the -Y side of the support frame 36 so as to extend in the X direction. The camera X-axis movement shaft 39 is a ball screw shaft disposed close to the guide member so as to extend in the X direction. The camera X-axis motor 38 rotates the camera X-axis movement shaft 39. A nut is attached to the wafer camera unit 32U, and the nut is screwed onto the camera X-axis movement shaft 39.

[0030] With the camera horizontal drive mechanism D2 having the above configuration, the camera Y-axis motor 34 is activated and the camera Y-movement axis 35 is rotated, causing the wafer camera unit 32U to move in the Y direction together with the support frame 36. In addition, the camera X-axis motor 38 is activated and the camera X-movement axis 39 is rotated, causing the wafer camera unit 32U to move in the X direction relative to the support frame 36.

[0031] The wafer camera unit 32U is movable in the X and Y directions between a predetermined standby position and the space above the wafer stage 10 and the mounting area PA by a camera horizontal drive mechanism D2. On the wafer stage 10, the wafer camera unit 32U uses the wafer camera 32 to image the wafer 7 placed on the wafer stage 10 from above and acquires a first image GD1 that includes the image area of ​​the die 7a of the wafer 7. On the mounting area PA, the wafer camera unit 32U uses the wafer camera 32 to image the substrate P placed on the mounting area PA from above and acquires a first image GD1 that includes the image area of ​​the substrate P.

[0032] The push-up unit 40 is positioned below the wafer stage 10. The push-up unit 40 includes a push-up pin 47, a pin lifting motor 40M, a ball screw shaft 40J, and a ball nut 40N.

[0033] The push-up pin 47 is provided below the wafer stage 10, that is, below the sheet 8a, so as to be movable in the vertical direction relative to the push-up unit 40. By moving upward below the sheet 8a, the push-up pin 47 pushes up the die 7a, which is to be picked up by the suction head 4H, from below the sheet 8a. The push-up unit 40 performs a process of sucking the sheet 8a around the die 7a when the push-up pin 47 pushes up the die 7a.

[0034] The pin lifting motor 40M is a motor that generates a driving force to move the push-up pin 47 in the vertical direction. The ball screw shaft 40J and the ball nut 40N transmit the driving force of the pin lifting motor 40M to the push-up pin 47. The ball screw shaft 40J extends vertically while connected to the pin lifting motor 40M and is rotationally driven by the pin lifting motor 40M. The ball nut 40N is screwed onto the ball screw shaft 40J while fixed to the push-up pin 47. When the pin lifting motor 40M operates and the ball screw shaft 40J is rotationally driven, the push-up pin 47, to which the ball nut 40N is fixed, moves vertically.

[0035] The component mounting apparatus 1 includes a push-up horizontal drive mechanism D3 that moves the push-up unit 40 horizontally (in the X and Y directions) in the space below the wafer stage 10. The push-up horizontal drive mechanism D3 includes a pair of guide rails 41, a push-up Y-movement axis 43, and a push-up Y-axis motor 44 as a mechanism for moving the push-up unit 40 in the Y direction. The pair of guide rails 41 are fixed on the base 2 and extend in the Y direction parallel to each other at a predetermined distance in the X direction. The push-up Y-movement axis 43 is a ball screw shaft arranged to extend in the Y direction at a position close to the guide rails 41. The push-up Y-axis motor 44 rotates the push-up Y-movement axis 43. A support frame 42 that supports the push-up unit 40 is installed between the pair of guide rails 41. Nuts that are screwed onto the push-up Y-movement axis 43 are assembled to the support frame 42.

[0036] The thrust-up horizontal drive mechanism D3 includes a guide member mounted on the support frame 42, a thrust-up X-axis movement shaft 45, and a thrust-up X-axis motor 46 as a mechanism for moving the thrust-up unit 40 in the X direction. The guide member is a member that guides the movement of the thrust-up unit 40 in the X direction and is fixed to the -Y side surface of the support frame 42 so as to extend in the X direction. The thrust-up X-axis movement shaft 45 is a ball screw shaft arranged close to the guide member so as to extend in the X direction. The thrust-up X-axis motor 46 rotationally drives the thrust-up X-axis movement shaft 45. A nut is attached to the thrust-up unit 40, and the nut is screwed onto the thrust-up X-axis movement shaft 45.

[0037] With the above configuration, the upward horizontal drive mechanism D3 is activated, causing the upward Y-axis motor 44 to rotate and drive the upward Y-movement axis 43, which in turn causes the upward unit 40 to move in the Y-direction together with the support frame 42. Additionally, the upward X-axis motor 46 is activated, causing the upward X-movement axis 45 to rotate and drive the upward X-direction, which in turn causes the upward unit 40 to move in the X-direction relative to the support frame 42.

[0038] [Control Configuration of Component Mounting Device] Figure 3 is a block diagram showing the control configuration of the component mounting device 1. Figure 4 is a flowchart showing the processing flow executed by the control unit 101 of the control unit 100 provided in the component mounting device 1. The component mounting device 1 includes a control unit 100. The control unit 100 is composed of a computer comprising a control unit 101 consisting of a processor that performs various calculations, and a storage unit 102 which is a memory that stores various information.

[0039] The control unit 101 controls the movement of the head unit 4 by controlling the drive of the head Y-axis motor 14, the head X-axis motor 18, and the head lifting motor 4M, and receives the second image GD2 acquired by the head camera unit 31 attached to the head unit 4. The control unit 101 also controls the movement of the wafer camera unit 32U by controlling the drive of the camera Y-axis motor 34 and the camera X-axis motor 38, and receives the first image GD1 acquired by the wafer camera 32. The control unit 101 also controls the movement of the lifting unit 40 by controlling the drive of the lifting Y-axis motor 44, the lifting X-axis motor 46, and the pin lifting motor 40M.

[0040] The control unit 101 controls the head unit 4, the push-up unit 40, and the wafer camera unit 32U to perform various processes such as recognition, pickup, mounting, and inspection. The control unit 101 also performs sequence creation processing to create the processing sequence PS. Each process performed by the control unit 101 will be described in detail with reference to Figures 4, as well as Figures 5 to 10.

[0041] (Sequence Creation Process) Figure 5 is a flowchart showing the flow of the sequence creation process of the control unit 101. Figure 6 is a diagram showing an example of a processing sequence PS created by the sequence creation process of the control unit 101. Before executing the recognition process, pickup process, mounting process, and inspection process, the control unit 101 executes a sequence creation process to create the processing sequence PS in advance. The control unit 101 creates a processing sequence PS that shows the processing order of the recognition process, pickup process, mounting process, and inspection process based on the control of the head unit 4, the push-up unit 40, and the wafer camera unit 32U, for all components mounted on the substrate P, including the die 7a of the wafer 7 and the chip components supplied by the feeder 5F. The processing sequence PS includes, as processing related to the head unit 4, standby, movement, pickup process and mounting process of the die 7a of the wafer 7, and pickup process and mounting process of the chip components of the feeder 5F. The processing sequence PS also includes, as processing related to the wafer camera unit 32U, standby, movement, recognition process of the die 7a of the wafer 7, and inspection process of the substrate P.

[0042] The memory unit 102 stores the processing sequence PS and cycle time used in past production of substrates P in the component mounting device 1. The cycle time indicates the time required to produce one substrate P by executing recognition processing, pickup processing, mounting processing, and inspection processing based on the control of the head unit 4, the push-up unit 40, and the wafer camera unit 32U. The control unit 101 creates a processing sequence PS that shows the processing order of recognition processing, pickup processing, mounting processing, and inspection processing, assuming the current production of substrate P in the component mounting device 1 (step a1). The control unit 101 performs a simulation of the recognition processing, pickup processing, mounting processing, and inspection processing according to the created processing sequence PS (step a2) and calculates the cycle time (step a3). Then, the control unit 101 determines whether the cycle time when using the created processing sequence PS is shorter than the cycle time stored in the memory unit 102 (step a4). If the cycle time is shorter (YES in step a4), the control unit 101 stores the created processing sequence PS and cycle time in the memory unit 102 (step a5). On the other hand, if the cycle time is not short (NO in step a4), the control unit 101 repeats the processing from step a1 to step a3. In this way, the control unit 101 determines the processing order of the recognition process, pickup process, mounting process and inspection process so as to minimize the cycle time, and creates a processing sequence PS that shows that processing order. The processing sequence PS and cycle time created by the control unit 101 are stored in the storage unit 102.

[0043] When production of substrate P in the component mounting device 1 begins, the control unit 101 reads the processing sequence PS from the storage unit 102 and executes recognition processing, pickup processing, mounting processing, and inspection processing according to the processing sequence PS. As a result, the control unit 101 can efficiently execute each of the recognition processing, pickup processing, mounting processing, and inspection processing. Therefore, it is possible to improve the production efficiency of substrate P in the component mounting device 1.

[0044] (Recognition Processing, Pickup Processing, Mounting Processing, and Inspection Processing) The recognition processing, pickup processing, mounting processing, and inspection processing executed by the control unit 101 will be described with reference to FIG. 7 to FIG. 10. The control unit 101 repeatedly executes the recognition processing, pickup processing, mounting processing, and inspection processing for each die 7a of the wafer 7 arranged on the wafer stage 10. In addition, the control unit 101 skips the recognition processing for the chip components supplied to the component supply area 5FA by the feeder 5F, and executes the pickup processing, mounting processing, and inspection processing.

[0045] First, the operation flow of the wafer camera unit 32U when the control unit 101 executes the recognition processing, pickup processing, mounting processing, and inspection processing will be described with reference to the flowchart of FIG. 7.

[0046] The control unit 101 confirms the processing sequence PS (step b1), and controls the movement of the wafer camera unit 32U and the imaging operation of the wafer camera 32 while taking into consideration the movement area indicating the movement range of the head unit 4. The control unit 101 determines whether or not the wafer camera unit 32U is located within the movement area of the head unit 4 (step b2). When the wafer camera unit 32U is located within the movement area of the head unit 4 (YES in step b2), the control unit 101 moves the wafer camera unit 32U to retract it from the movement area of the head unit 4 (step b21). On the other hand, when the wafer camera unit 32U is not located within the movement area of the head unit 4 (NO in step b2), the control unit 101 determines whether or not there is a die 7a to be recognized among the dies 7a of the wafer 7 on the sheet 8a (step b3).

[0047] When there is a die 7a to be recognized (YES in step b3), the control unit 101 determines whether the die 7a to be recognized is located within the movement area of the head unit 4 (step b31). That is, the control unit 101 determines whether the head unit 4 is positioned at the wafer stage 10. When the head unit 4 is not positioned at the wafer stage 10 (NO in step b31), the control unit 101 moves the wafer camera unit 32U to the wafer stage 10, and causes the wafer camera 32 to acquire a first image GD1 including the image area of the die 7a (step b32). In this case, the control unit 101 recognizes the die 7a on the wafer 7 on the sheet 8a based on the data of the image area of the die 7a included in the first image GD1 (recognition processing). When the head unit 4 is positioned at the wafer stage 10 (YES in step b31), the control unit 101 causes the wafer camera unit 32U to stand by.

[0048] When there is no die 7a to be recognized (NO in step b3), the control unit 101 determines whether there is a site such as a target component to be inspected on the substrate P (step b4). When there is no target site to be inspected on the substrate P (NO in step b4), the control unit 101 ends the control of the operation of the wafer camera unit 32U.

[0049] On the other hand, when there is a target site to be inspected on the substrate P (YES in step b4), the control unit 101 determines whether the mounting of all components on the substrate P has been completed (step b41). When the mounting of all components on the substrate P has not been completed (NO in step b41), the control unit 101 determines whether the head unit 4 is positioned in the mounting area PA (step b42). When the head unit 4 is positioned in the mounting area PA (YES in step b42), the control unit 101 causes the wafer camera unit 32U to stand by.

[0050] If the head unit 4 is not located in the mounting area PA (NO in step b42), or if all components have been mounted on the substrate P (YES in step b41), the control unit 101 moves the wafer camera unit 32U to the mounting area PA and causes the wafer camera 32 to acquire a first image GD1 including the image area of ​​the substrate P (step b43). In this case, the control unit 101 inspects the substrate P based on the data of the image area of ​​the substrate P included in the first image GD1 (inspection process).

[0051] Next, the operation flow of the head unit 4 when the control unit 101 performs recognition processing, pickup processing, mounting processing, and inspection processing will be explained with reference to the flowchart in Figure 8.

[0052] The control unit 101 checks the processing sequence PS (step c1), controls the movement of the head unit 4, and controls the imaging operation of the head camera unit 31. The control unit 101 determines whether or not all components have been mounted on the substrate P (step c2). If all components have not been mounted on the substrate P (NO in step c2), the control unit 101 moves the head unit 4 to the wafer stage 10 and has the suction head 4H pick up the die 7a from the wafer 7 on the sheet 8a (step c3, pick-up process). The control unit 101 also moves the head unit 4 to the component supply area 5FA and has the suction head 4H pick up chip components from the feeder 5F. With the suction head 4H having picked up the die 7a or chip component, the control unit 101 moves the head unit 4 to the mounting area PA and has the head camera unit 31 acquire a second image GD2 including the image area of ​​the FID mark on the substrate P. In this case, the control unit 101 recognizes the FID mark on the substrate P based on the data of the image area of ​​the FID mark included in the second image GD2 (step c4). Then, while recognizing the misalignment of the substrate P, the control unit 101 mounts the die 7a or chip component held by the suction head 4H onto the substrate P (step c5, mounting process).

[0053] If all components have been mounted onto the circuit board P (YES in step c2), the control unit 101 determines whether or not there are any parts of the circuit board P that need to be inspected remaining (step c21). If there are no parts of the circuit board P that need to be inspected remaining (NO in step c21), the control unit 101 terminates control of the operation of the head unit 4.

[0054] On the other hand, if there is a part to be inspected remaining on the substrate P (YES in step c21), the control unit 101 determines whether the part to be inspected on the substrate P is located within the movement area of ​​the wafer camera unit 32U (step c22). If the part to be inspected on the substrate P is located within the movement area of ​​the wafer camera unit 32U (YES in step c22), the control unit 101 puts the head unit 4 into standby mode.

[0055] If the area to be inspected on the substrate P is not located within the movement area of ​​the wafer camera unit 32U (NO in step c22), the control unit 101 moves the head unit 4 to the mounting area PA and causes the head camera unit 31 to acquire a second image GD2 including the image area of ​​the substrate P (step c23). In this case, the control unit 101 inspects the substrate P based on the data of the image area of ​​the substrate P included in the second image GD2 (inspection process).

[0056] The recognition process, pickup process, mounting process, and inspection process performed by the control unit 101 will be explained in more detail with reference to Figures 9 and 10.

[0057] As shown in Figure 9, in the recognition process, the control unit 101 moves the wafer camera unit 32U above the wafer stage 10 by controlling the drive of the camera Y-axis motor 34 and the camera X-axis motor 38 while the head unit 4 is waiting at a predetermined position away from the wafer stage 10. When the wafer camera unit 32U is positioned above the wafer stage 10, the wafer camera 32 mounted on the wafer camera unit 32U images the wafer 7 placed on the wafer stage 10 from above and acquires a first image GD1 that includes the image region of the die 7a of the wafer 7. The control unit 101 acquires the first image GD1 from the wafer camera unit 32U. Based on the data of the image region of the die 7a included in the first image GD1, the control unit 101 recognizes the die 7a on the wafer 7 on the sheet 8a that is to be picked up.

[0058] As shown in Figure 9, after the recognition process is executed, the control unit 101 performs a pickup process on the die 7a of the wafer 7 recognized in the recognition process. In this pickup process, the control unit 101 moves the wafer camera unit 32U to a predetermined standby position outside the wafer stage 10. In this state, the control unit 101 moves the head unit 4 above the wafer stage 10 by controlling the drive of the head Y-axis motor 14 and the head X-axis motor 18. The control unit 101 also moves the push-up unit 40 below the wafer stage 10 by controlling the drive of the push-up Y-axis motor 44 and the push-up X-axis motor 46. Then, the control unit 101 moves the push-up pin 47 upward by controlling the drive of the pin lifting motor 40M until the tip of the push-up pin 47 contacts the sheet 8a from below, and moves the suction head 4H downward by controlling the drive of the head lifting motor 4M until the tip of the suction head 4H contacts the die 7a of the wafer 7 on the sheet 8a from above. As a result, the die 7a is held between the push-up pin 47 and the suction head 4H via the sheet 8a. With the die 7a held between the push-up pin 47 and the suction head 4H, the push-up unit 40 performs a process of sucking the sheet 8a around the die 7a, and the suction head 4H holds the die 7a by adsorption at a predetermined negative pressure level.

[0059] With the die 7a held between the push-up pin 47 and the suction head 4H, the control unit 101 controls the drive of the pin lifting motor 40M to further move the push-up pin 47 upward, and controls the drive of the head lifting motor 4M to move the suction head 4H upward in accordance with the upward movement of the push-up pin 47. As a result, the push-up pin 47 pushes up the die 7a, which is being held by the suction head 4H, from below the sheet 8a. With the die 7a being pushed up from below the sheet 8a in this state, the control unit 101 controls the drive of the head lifting motor 4M to move the suction head 4H upward. As a result, the suction head 4H picks up the die 7a that it has held by suction from the sheet 8a. The control unit 101 also controls the drive of the pin lifting motor 40M to move the push-up pin 47 downward.

[0060] As shown in Figure 9, after the pickup process is executed, the control unit 101 performs a mounting process on the die 7a picked up by the suction head 4H during the pickup process. In this mounting process, the control unit 101 places the wafer camera unit 32U in standby position on the +Y side of the wafer stage 10, and controls the drive of the head Y-axis motor 14 and the head X-axis motor 18 to move the head unit 4 above the mounting area PA on which the substrate P is placed. With the head unit 4 positioned above the mounting area PA, the suction head 4H releases the die 7a it is holding, thereby mounting the die 7a onto the substrate P.

[0061] When producing substrates P by executing recognition processing, pickup processing, and mounting processing, the control unit 101 performs inspection processing to suppress the occurrence of defective substrates. As shown in Figure 10, in the inspection processing, the control unit 101 moves the wafer camera unit 32U above the mounting area PA where the substrate P is placed by controlling the drive of the camera Y-axis motor 34 and the camera X-axis motor 38. When the wafer camera unit 32U is positioned above the mounting area PA, the wafer camera 32 mounted on the wafer camera unit 32U images the substrate P from above and acquires a first image GD1 that includes the image region of the substrate P. The control unit 101 acquires the first image GD1 from the wafer camera unit 32U. The control unit 101 inspects the substrate P based on the data of the image region of the substrate P included in the first image GD1. In this case, the substrate P can be inspected using the wafer camera unit 32U, which is used to recognize the die 7a of the wafer 7, without using a dedicated camera for inspecting the substrate P. Furthermore, the substrate P is inspected using a wafer camera unit 32U, which is separate from the head unit 4 that performs the operation of mounting components such as the die 7a onto the substrate P. Therefore, compared to, for example, a case where the component mounting operation by the head unit 4 is temporarily stopped and the substrate P is inspected using a head camera unit 31 attached to the head unit 4, the production efficiency of the substrate P can be improved.

[0062] The control unit 101 may, with the head unit 4 moved outside the mounting area PA, perform an inspection process to inspect the substrate P based on the first image GD1 acquired by the wafer camera 32 of the wafer camera unit 32U, which has been moved to the mounting area PA. In this case, the substrate P can be inspected using the wafer camera unit 32U located in the mounting area PA while avoiding interference between the head unit 4 and the wafer camera unit 32U in the mounting area PA.

[0063] Furthermore, as shown in Figure 10, the control unit 101 may perform an inspection process to inspect the substrate P based on the first image GD1 acquired by the wafer camera 32 of the wafer camera unit 32U, which has been moved to the mounting area PA, while the head unit 4, which has been moved to the component supply area 5FA outside the mounting area PA, is picking up chip components from the feeder 5F. In this case, the period during which the head unit 4 is picking up chip components from the feeder 5F in the component supply area 5FA outside the mounting area PA, and the head unit 4 is not located in the mounting area PA, can be effectively utilized to inspect the substrate P using the wafer camera unit 32U located in the mounting area PA.

[0064] Furthermore, while the head unit 4, which has been moved to the transfer area 5SA outside the mounting area PA, is performing the process of transferring the transfer material to the component using the transfer unit 5S, the control unit 101 may perform an inspection process to inspect the substrate P based on the first image GD1 acquired by the wafer camera 32 of the wafer camera unit 32U, which has been moved to the mounting area PA.

[0065] Furthermore, as shown in Figure 10, the control unit 101 may, while the head unit 4 has moved to the mounting area PA and is performing the mounting process, perform an inspection process to inspect the substrate P based on the first image GD1 acquired by the wafer camera 32 of the wafer camera unit 32U, which has been moved to the interference avoidance area PA1 in the mounting area PA where interference with the head unit 4 can be avoided. In this case, while the head unit 4 is performing the operation of mounting the die 7a or chip components onto the substrate P in the mounting area PA, the substrate P can be inspected using the wafer camera unit 32U located in the interference avoidance area PA1 within the mounting area PA, while avoiding interference between the head unit 4 and the wafer camera unit 32U.

[0066] Furthermore, during the inspection process, the control unit 101 may inspect for the presence or absence of foreign matter on the substrate P, or inspect the mounting state of the die 7a or chip components on the substrate P. When the control unit 101 inspects for the presence or absence of foreign matter on the substrate P, it can inspect whether or not foreign matter exists in the area on the substrate P before component mounting. Alternatively, the control unit 101 can inspect the mounting state of components on the substrate P after component mounting.

[0067] Furthermore, the control unit 101 repeatedly performs pickup, mounting, and inspection processes for all dies 7a and chip components mounted on the substrate P. In this case, as shown in Figure 10, in the inspection process when the mounting process for all components on the substrate P is completed, the control unit 101 inspects the substrate P based on the first image GD1 acquired by the wafer camera 32 of the wafer camera unit 32U moved to the mounting area PA. If there are still parts of the substrate P that need to be inspected, the control unit 101 may inspect the substrate P based on the second image GD2 acquired by the head camera unit 31 attached to the head unit 4 moved to the mounting area PA. When the mounting operation of the head unit 4 for all components on the substrate P is completed, the substrate P can be efficiently inspected using both the head camera unit 31 attached to the head unit 4 and the wafer camera unit 32U.

[0068] [Inventions included in the above embodiments] The embodiments described above include inventions having the following configurations.

[0069] A component mounting apparatus according to one aspect of the present invention includes: a transport unit for transporting a substrate to a mounting area where component mounting work is performed; a component supply unit having a wafer supply section for supplying a wafer divided into a plurality of components to a wafer placement area; a head unit that is movable horizontally in the space above the wafer placement area and the mounting area, picks up the components from the wafer in the wafer placement area, and mounts the picked-up components onto the substrate in the mounting area; a wafer camera unit that is movable horizontally in the space above the wafer placement area and the mounting area, and acquires an image by imaging operation; and a control unit that controls the head unit and the wafer camera unit. The control unit performs a recognition process for recognizing the components on the wafer based on an image acquired by the wafer camera unit moved to the wafer placement area; a pickup process for picking up the components from the wafer by the head unit moved to the wafer placement area; a mounting process for mounting the components onto the substrate by the head unit moved to the mounting area; and an inspection process for inspecting the substrate based on an image acquired by the wafer camera unit moved to the mounting area.

[0070] According to the component mounting apparatus described above, the control unit performs a recognition process to recognize components on the wafer based on an image from a wafer camera unit moved to the wafer placement area, a pickup process to have the recognized components picked up by the head unit, and a mounting process to mount the components picked up by the head unit onto the substrate. By performing the recognition process, pickup process, and mounting process, the control unit can produce substrates with components mounted on them. When producing substrates by performing the recognition process, pickup process, and mounting process, the control unit performs an inspection process to suppress the occurrence of defective substrates. In the inspection process, the control unit inspects the substrate based on an image from a wafer camera unit moved to the mounting area where the substrate is placed. In this case, the substrate can be inspected using the wafer camera unit used to recognize components on the wafer, without using a dedicated camera for inspecting the substrate. Furthermore, the substrate is inspected using a wafer camera unit that is separate and independent from the head unit that performs the operation of mounting components onto the substrate. For this reason, compared to, for example, a case where the component mounting operation by the head unit is temporarily stopped and the substrate is inspected using a camera attached to the head unit, the production efficiency of the substrate can be improved.

[0071] In the component mounting apparatus described above, the control unit may perform the inspection process based on an image acquired by the wafer camera unit, which has been moved to the mounting area, while the head unit has been moved outside the mounting area.

[0072] In this embodiment, the substrate can be inspected using the wafer camera unit located in the mounting area while avoiding interference between the head unit and the wafer camera unit in the mounting area.

[0073] In the component mounting apparatus described above, the component supply unit may have a feeder that supplies the components to a component supply area different from the wafer placement area. The head unit is movable horizontally in the space above the component supply area in addition to the wafer placement area and the mounting area, and picks up the components from the feeder in the component supply area. In this case, while the head unit, which has been moved to the component supply area outside the mounting area, is picking up the components from the feeder, the control unit performs the inspection process based on the image acquired by the wafer camera unit, which has been moved to the mounting area.

[0074] In this embodiment, the head unit picks up components from a feeder in a component supply area outside the mounting area, and the period when the head unit is not located in the mounting area can be effectively utilized to inspect the substrate using a wafer camera unit located in the mounting area.

[0075] In the component mounting apparatus described above, the control unit may perform the inspection process based on an image acquired by the wafer camera unit, which has been moved to an interference avoidance area in the mounting area where interference with the head unit can be avoided, while the mounting process is being performed by the head unit, which has been moved to the mounting area.

[0076] In this embodiment, when the head unit is performing the operation of mounting components onto the substrate in the mounting area, the substrate can be inspected using a wafer camera unit located in an interference avoidance area within the mounting area, while avoiding interference between the head unit and the wafer camera unit.

[0077] In the component mounting apparatus described above, the control unit may, in the inspection process, inspect for the presence or absence of foreign matter on the substrate, or inspect the mounting state of the components on the substrate.

[0078] In this embodiment, when the control unit inspects for the presence or absence of foreign matter on the substrate, it can inspect whether or not foreign matter is present in the area of ​​the substrate before component mounting. Alternatively, the control unit can inspect the mounting state of components on the substrate after component mounting.

[0079] The component mounting apparatus described above may further include a head camera unit attached to the head unit, which acquires images by an imaging operation. The control unit repeatedly performs the pickup process, the mounting process and the inspection process for all the components to be mounted on the substrate. In the inspection process after the mounting process for all the components on the substrate is completed, the control unit inspects the substrate based on an image acquired by the wafer camera unit moved to the mounting area. If there are still parts on the substrate that need to be inspected, the control unit inspects the substrate based on an image acquired by the head camera unit attached to the head unit moved to the mounting area.

[0080] In this embodiment, once the mounting operation of the head unit for all components on the substrate is complete, the substrate can be efficiently inspected using both the head camera unit and the wafer camera unit attached to the head unit.

[0081] In the component mounting apparatus described above, the control unit may perform a sequence creation process to create a processing sequence in advance that indicates the processing order of the recognition process, the pickup process, the mounting process, and the inspection process, and then perform the recognition process, the pickup process, the mounting process, and the inspection process according to the processing sequence.

[0082] In this embodiment, the control unit creates a processing sequence indicating the order of processing for recognition, pickup, mounting, and inspection based on the control of the head unit and the wafer camera unit. The control unit then executes the recognition, pickup, mounting, and inspection processes according to the created processing sequence. As a result, the control unit can efficiently execute each of the recognition, pickup, mounting, and inspection processes. This makes it possible to improve the production efficiency of substrates in a component mounting device.

Claims

1. A component mounting apparatus comprising: a transport unit for transporting a substrate to a mounting area where component mounting work is performed; a component supply unit having a wafer supply section for supplying a wafer divided into a plurality of components to a wafer placement area; a head unit that is movable horizontally in the space above the wafer placement area and the mounting area, picks up the components from the wafer in the wafer placement area, and mounts the picked-up components onto the substrate in the mounting area; a wafer camera unit that is movable horizontally in the space above the wafer placement area and the mounting area, and acquires an image by imaging operation; and a control unit that controls the head unit and the wafer camera unit, wherein the control unit performs: a recognition process for recognizing the components on the wafer based on an image acquired by the wafer camera unit moved to the wafer placement area; a pickup process for picking up the components from the wafer by the head unit moved to the wafer placement area; a mounting process for mounting the components onto the substrate by the head unit moved to the mounting area; and an inspection process for inspecting the substrate based on an image acquired by the wafer camera unit moved to the mounting area.

2. The component mounting apparatus according to claim 1, wherein the control unit performs the inspection process based on an image acquired by the wafer camera unit moved to the mounting area, with the head unit moved outside the mounting area.

3. The component mounting apparatus according to claim 2, wherein the component supply unit has a feeder that supplies the components to a component supply area different from the wafer placement area, the head unit is movable horizontally in the space above the component supply area in addition to the wafer placement area and the mounting area, and picks up the components from the feeder in the component supply area, and the control unit performs the inspection process based on an image acquired by the wafer camera unit moved to the mounting area while the head unit, which has been moved to the component supply area outside the mounting area, is picking up the components from the feeder.

4. The component mounting apparatus according to claim 1, wherein the control unit performs the inspection process based on an image acquired by the wafer camera unit, which has been moved to an interference avoidance area in the mounting area where interference with the head unit can be avoided, while the mounting process is being performed by the head unit which has been moved to the mounting area.

5. The component mounting apparatus according to claim 1, wherein the control unit, in the inspection process, inspects for the presence or absence of foreign matter on the substrate, or inspects the mounting state of the components on the substrate.

6. The component mounting apparatus according to claim 1, further comprising a head camera unit attached to the head unit and acquiring an image by an imaging operation, wherein the control unit repeatedly performs the pickup process, the mounting process and the inspection process for all the components mounted on the substrate, and in the inspection process when the mounting process for all the components on the substrate is completed, the substrate is inspected based on an image acquired by the wafer camera unit moved to the mounting area, and if there are any parts on the substrate that need to be inspected remaining, the substrate is inspected based on an image acquired by the head camera unit attached to the head unit moved to the mounting area.

7. The component mounting apparatus according to any one of claims 1 to 6, wherein the control unit performs a sequence creation process to create in advance a processing sequence indicating the processing order of the recognition process, the pickup process, the mounting process and the inspection process, and performs the recognition process, the pickup process, the mounting process and the inspection process according to the processing sequence.

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