Appearance inspection device, cutting device, and method for manufacturing semiconductor member

Abstract

This appearance inspection device inspects the appearance of one surface of a semiconductor member. This appearance inspection device comprises a first illuminator, a second illuminator, and an imaging unit. Each of the first illuminator and the second illuminator irradiates the semiconductor member with light from the normal direction of one surface of the semiconductor member or an oblique direction inclined with respect to the normal direction. The imaging unit images the semiconductor member. The amount of light from each of the first illuminator and the second illuminator is individually adjustable. The imaging unit successively performs first imaging for imaging the semiconductor member with light irradiation by the first illuminator and second imaging for imaging the semiconductor member with light irradiation by the second illuminator.

Description

Appearance inspection apparatus, cutting apparatus, and method for manufacturing semiconductor member

[0001] The present invention relates to an appearance inspection apparatus, a cutting apparatus, and a method for manufacturing a semiconductor member.

[0002] Japanese Patent Laid-Open No. 10-24442 (Patent Document 1) discloses a resin sealing apparatus that resin-seals a semiconductor device mounted on a lead frame. This resin sealing apparatus has an appearance inspection apparatus that performs appearance inspection of the resin-sealed lead frame. In this appearance inspection apparatus, the lead frame irradiated with illumination light is imaged by a TV camera.

[0003] Japanese Patent Laid-Open No. 10-24442

[0004] In the inspection of the appearance of a semiconductor member (hereinafter also referred to as "appearance inspection"), for example, a plurality of images are captured under different imaging conditions. If capturing the plurality of images takes a long time, the time required for the appearance inspection of the semiconductor member also increases. The above Patent Document 1 does not disclose a means for solving such a problem.

[0005] The present invention has been made to solve such a problem, and an object thereof is to provide an appearance inspection apparatus, a cutting apparatus, and a method for manufacturing a semiconductor member that are capable of capturing a plurality of images in the appearance inspection of a semiconductor member at a relatively high speed.

[0006] An appearance inspection apparatus according to an aspect of the present invention inspects the appearance of one surface of a semiconductor member. This appearance inspection apparatus includes a first illuminator, a second illuminator, and an imaging unit. Each of the first illuminator and the second illuminator irradiates light to the semiconductor member from the normal direction of the one surface of the semiconductor member, or from an oblique direction inclined with respect to the normal direction. The imaging unit images the semiconductor member. The light amount of each of the first illuminator and the second illuminator can be adjusted individually. The imaging unit continuously performs first imaging of imaging the semiconductor member with light irradiation from the first illuminator, and second imaging of imaging the semiconductor member with light irradiation from the second illuminator.

[0007] Furthermore, a cutting apparatus according to another aspect of the present invention comprises the above-mentioned visual inspection apparatus, a cutting mechanism, a table, a plurality of storage members, and a transport body. The cutting mechanism cuts the object to be cut, thereby dividing it into a plurality of semiconductor members. Each of the plurality of semiconductor members is placed on the table. The transport body holds one of the plurality of semiconductor members placed on the table, moves while holding the semiconductor member, and transports the held semiconductor member to one of the plurality of storage members. The first and second images are taken while the transport body is moving.

[0008] Furthermore, a method for manufacturing a semiconductor member according to another aspect of the present invention uses the above-described cutting apparatus. This method for manufacturing a semiconductor member includes preparing an object to be cut and cutting the object to be cut to divide it into multiple semiconductor members.

[0009] According to the present invention, it is possible to provide an appearance inspection apparatus, a cutting apparatus, and a method for manufacturing semiconductor materials that can capture multiple images of semiconductor materials at a relatively high speed during appearance inspection.

[0010] This is a schematic plan view of a cutting device. This is a schematic diagram showing a partial cross-section of the second optical inspection camera and illumination unit. This is a schematic plan view of the illumination unit. This is a schematic diagram showing the hardware configuration of a computer. This is a diagram for explaining the characteristics of images obtained through imaging accompanied by the emission of light from a coaxial illuminator. This is a diagram for explaining the characteristics of images obtained through imaging accompanied by the emission of light from a ring illuminator. This is a diagram including a schematic plan view and a side view of an electronic component. This is a diagram for schematically showing an image of an electronic component obtained through first imaging. This is a diagram for schematically showing an image of an electronic component obtained through second imaging. This is a diagram for explaining the problems that occur when one of the ring illuminators is not provided. This is a diagram for explaining the images taken through first imaging and second imaging. This is a flowchart showing the imaging procedure for electronic components transported by a transport unit. This is a flowchart showing the visual inspection procedure for electronic components transported by a transport unit. This is a schematic plan view of an illumination unit including a line illuminator.

[0011] Hereinafter, an embodiment relating to one aspect of the present invention (hereinafter also referred to as "this embodiment") will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and their descriptions will not be repeated. Furthermore, each drawing is schematically depicted with parts omitted or exaggerated as appropriate for ease of understanding. In the drawings, the X axis and Y axis are orthogonal to each other, the X axis and Z axis are orthogonal to each other, and the Y axis and Z axis are orthogonal to each other. The X axis and Y axis are, for example, orthogonal to each other in the horizontal plane.

[0012] [1. Configuration] <1-1. Configuration of the Cutting Device> Figure 1 is a schematic plan view showing a cutting device 1 according to this embodiment. The cutting device 1 is configured to cut a package substrate, thereby separating the package substrate into multiple electronic components (an example of "semiconductor components"). In a package substrate, the substrate on which the semiconductor chip is fixed is resin-encapsulated. An example of a substrate on which a semiconductor chip is fixed is a lead frame. Note that the object to be cut does not necessarily have to be a package substrate; for example, it may be a substrate that is not resin-encapsulated (including a wafer). A substrate that is not resin-encapsulated and is separated into components by cutting is also included in "semiconductor components".

[0013] Examples of package substrates include BGA (Ball Grid Array) package substrates, LGA (Land Grid Array) package substrates, CSP (Chip Size Package) package substrates, LED (Light Emitting Diode) package substrates, and QFN (Quad Flat No-leaded) package substrates.

[0014] Furthermore, the cutting device 1 is configured to visually inspect each of the multiple electronic components that have been separated into individual pieces. In the cutting device 1, an image of each electronic component is captured, and a visual inspection of each electronic component is performed based on the captured image. Inspection data is generated through the visual inspection, and each electronic component is classified as either a "good product" or a "defective product." The specific inspection procedure will be explained later.

[0015] In this example, a package substrate P1 is used as the object to be cut, and the cutting device 1 separates the package substrate P1 into multiple electronic components S1. Hereinafter, of the two sides of the package substrate P1, the side that is resin-sealed will be referred to as the molded side, and the side opposite the molded side will be referred to as the ball / lead side. If the object to be cut is a substrate that is not resin-sealed, the side facing upwards during cutting (the cut surface) corresponds to the ball / lead side in this embodiment, and the side opposite the cut surface corresponds to the molded side in this embodiment.

[0016] As shown in Figure 1, the cutting device 1 includes a cutting module A1 and an inspection / storage module B1 as its components. The cutting module A1 is configured to manufacture a plurality of electronic components S1 by cutting a package substrate P1. The inspection / storage module B1 is configured to inspect each of the manufactured electronic components S1 and then store the electronic components S1 in a storage member (for example, a tray). In the cutting device 1, each component is detachable and interchangeable with respect to the other components.

[0017] The cutting module A1 mainly includes a substrate supply unit 3, a positioning unit 4, a cutting table 5, a cutting mechanism 6, and a transport unit 7. The substrate supply unit 3 supplies package substrates P1 one by one to the positioning unit 4 by pushing them out one by one from a magazine M1 that contains multiple package substrates P1. At this time, the package substrates P1 are arranged with the ball / lead surface facing upwards.

[0018] The positioning unit 4 positions the package substrate P1, which has been extruded from the substrate supply unit 3, onto the rail unit 4a. After that, the positioning unit 4 transports the positioned package substrate P1 to the cutting table 5.

[0019] The cutting table 5 holds the package substrate P to be cut. In this example, a cutting device 1 with a twin-cut table configuration having two cutting tables 5 is shown. The cutting table 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding member 5a holds the package substrate P1, which has been transported by the positioning unit 4, by suction from below. The rotating mechanism 5b rotates the holding member 5a in the direction θ1 in the figure. In the figure, the direction θ1 is the direction of rotation around the Z axis. The moving mechanism 5c moves the holding member 5a along the Y axis in the figure.

[0020] The cutting mechanism 6 cuts the package substrate P1, thereby dividing the package substrate P1 into multiple electronic components S1. In this example, a cutting device 1 is shown in which two cutting mechanisms 6 cut one package substrate P1. The cutting mechanism 6 is movable along the X and Z axes in the figure.

[0021] The cutting mechanism 6 includes a blade 6a, a rotating shaft 6c extending along the X-axis, and a spindle portion 6d that rotates the rotating shaft 6c. The blade 6a is, for example, a disc-shaped blade with a cutting edge on its outer circumference. The central portion of the blade 6a is connected to the end of the rotating shaft 6c. In the cutting mechanism 6, the spindle portion 6d rotates the rotating shaft 6c, causing the blade 6a to rotate at high speed around the rotating shaft 6c. As a result, the blade 6a cuts the package substrate P1, breaking the package substrate P1 into multiple electronic components S1. The blade 6a is mounted on the rotating shaft 6c while being held between first and second flanges (not shown). The first and second flanges are fixed to the rotating shaft 6c by fastening members (not shown), such as nuts.

[0022] The cutting mechanism 6 is equipped with a cutting water nozzle, a cooling water nozzle, and a cleaning water nozzle (none of which are shown). The cutting water nozzle sprays cutting water toward the high-speed rotating blade 6a. The cooling water nozzle sprays cooling water. The cleaning water nozzle sprays cleaning water to wash away cutting debris and the like.

[0023] After the cutting table 5 picks up the package substrate P1, the package substrate P1 is photographed by the first position confirmation camera 5d to confirm its position. The confirmation using the first position confirmation camera 5d is, for example, to confirm the position of a mark provided on the package substrate P1. This mark is, for example, a mark used to determine the cutting position of the package substrate P1.

[0024] Subsequently, the cutting table 5 moves along the Y-axis in the figure toward the cutting mechanism 6. After the cutting table 5 moves below the cutting mechanism 6, alignment is performed, and then the package substrate P1 is cut by moving the cutting table 5 and the cutting mechanism 6 relative to each other. Each time the package substrate P1 is cut by the blade 6a of the cutting mechanism 6, the package substrate P1 is photographed by the second position confirmation camera 6b provided in the cutting mechanism 6 and confirmation is performed. Confirmation using the second position confirmation camera 6b is, for example, confirmation of the cut position and the cut width of the package substrate P1.

[0025] After the cutting of the package substrate P1 is complete, the cutting table 5 moves away from the cutting mechanism 6 along the Y-axis in the figure, while holding the multiple individual electronic components S1. During this movement process, the first cleaner 5e cleans and dries the upper surfaces (ball / lead surfaces) of the multiple electronic components S1.

[0026] The transport unit 7 picks up the multiple electronic components S1 held on the cutting table 5 from above and transports the multiple electronic components S1 to the flipper 11 of the inspection and storage module B1. During this transport process, the second cleaner 7a cleans and dries the lower surface (molded surface) of the multiple electronic components S1.

[0027] The inspection and storage module B1 mainly includes a flipper 11, a first optical inspection camera 12, an index table 14, a transport unit 15, a second optical inspection camera 13, a lighting unit 17, and a storage member 16. The first optical inspection camera 12 may be provided in the cutting module A1.

[0028] The flipper 11 receives multiple electronic components S1 from the transport unit 7 and holds the received multiple electronic components S1. The flipper 11 is movable along the X-axis in the figure. The flipper 11 can also invert the orientation of the multiple electronic components S1 it is holding. The flipper 11 is provided with a holding member that holds the multiple electronic components S1 by attracting them. The flipper 11 inverts the orientation of the multiple electronic components S1 by rotating the holding member around the Y-axis.

[0029] The first optical inspection camera 12 photographs the molded surfaces of multiple electronic components S1. The first optical inspection camera 12 is equipped with an illumination unit (not shown), and when the first optical inspection camera 12 takes a photograph, light is shone onto the molded surfaces of the multiple electronic components S1. Based on the captured image (image data) generated by the first optical inspection camera 12, various visual inspections of the molded surfaces of the multiple electronic components S1 are performed. The first optical inspection camera 12 is positioned near the flipper 11 to photograph upwards. The first optical inspection camera 12 is movable along the Y-axis in the figure. The captured image generated by the first optical inspection camera 12 is, for example, a grayscale image. Each of the multiple pixel values ​​that make up this grayscale image is represented by, for example, 256 levels of gradation.

[0030] The transport unit 7 stops moving along the X-axis above the first optical inspection camera 12. The first optical inspection camera 12 photographs the molded surfaces of the multiple electronic components S1 held by the transport unit 7 while the transport unit 7 is stopped moving along the X-axis. The transport unit 7 then places the multiple electronic components S1 onto the holding member of the flipper 11. After the flipper 11 picks up the multiple electronic components S1, it inverts the multiple electronic components S1 held by the holding member. At this time, the lower surface of the electronic component S1 is the ball / lead surface. The flipper 11 places the held multiple electronic components S1 onto the index table 14.

[0031] Multiple electronic components S1 that have been inspected with respect to the molded surface are placed on the index table 14 by the flipper 11. The index table 14 is movable along the Y-axis in the figure.

[0032] The transport unit 15 holds a plurality of electronic components S1 placed on the index table 14 from above, moves while holding the electronic components S1, and stores the held plurality of electronic components S1 into the storage member 16. When the electronic components S1 are held by the transport unit 15, the lower surface of the electronic component S1 is the ball / lead surface, and the upper surface of the electronic component S1 is the molded surface. A second optical inspection camera 13 and an illumination unit 17 are provided between the index table 14 and the storage member 16.

[0033] The second optical inspection camera 13 photographs the ball / lead surface of the electronic component S1. The illumination unit 17 illuminates the ball / lead surface of the electronic component S1 with light when the second optical inspection camera 13 is taking photographs. Based on the captured image (image data) generated by the second optical inspection camera 13, various visual inspections of the ball / lead surface of the electronic component S1 are performed. The second optical inspection camera 13 is positioned between the transport unit 15 and the storage member 16 to photograph the upper surface. The second optical inspection camera 13 is movable along the Y-axis in the figure. The captured image generated by the second optical inspection camera 13 is, for example, a grayscale image. Each of the multiple pixel values ​​that make up this grayscale image is represented by, for example, a value of 256 levels. The photographing of the electronic component S1 by the second optical inspection camera 13 is performed while the electronic component S1 is still moving, not when it has stopped moving. Thus, in the cutting device 1, the photographing by the second optical inspection camera 13 is performed while the electronic component S1 is moving. Therefore, with the cutting device 1, the visual inspection of the ball / lead surface of the electronic component S1 and the transport of the electronic component S1 are performed in parallel. Compared to the case where the second optical inspection camera 13 takes photographs while the electronic component S1 is stopped moving, the manufacturing of the electronic component S1 can be performed at a higher speed.

[0034] Figure 2 is a schematic diagram showing a partial cross-section of the second optical inspection camera 13 and the illumination unit 17. Referring to Figure 2, the second optical inspection camera 13 includes a camera body 13a and a reflector 13b, and the illumination unit 17 includes a coaxial illuminator 17a and ring illuminators 17b and 17c. The illumination unit 17 is positioned above the second optical inspection camera 13, and the transport unit 15 passes above the illumination unit 17. At the time the transport unit 15 passes above the illumination unit 17, the electronic component S1, ring illuminator 17c, ring illuminator 17b, and coaxial illuminator 17a are aligned in this order in the direction normal to the ball / lead surface of the electronic component S1. That is, at the time the transport unit 15 passes above the illumination unit 17, the coaxial illuminator 17a and the ring illuminators 17b and 17c are each located below the electronic component S1. In the example shown in Figure 2, at the point when the transport unit 15 passes above the lighting unit 17, the ball / lead surface is aligned horizontally, and the normal direction of the ball / lead surface is vertical. Here, "horizontal direction" has a practical meaning. That is, if the angle between the ball / lead surface and the horizontal plane is within the margin of error, the ball / lead surface is aligned horizontally. Therefore, even if the ball / lead surface is slightly curved, it is still aligned horizontally.

[0035] The transport unit 15 includes a base 15a extending along the X-axis and a plurality of pickers PC1, each connected to the base 15a. Each of the plurality of pickers PC1 is connected to the base 15a via a rod-shaped member (not shown) extending along the Y-axis from the base 15a. Each of the plurality of pickers PC1 includes a columnar picker body PC1a extending along the Z-axis and a circular member PC1b projecting radially outward from the picker body PC1a. Each picker PC1 holds one electronic component S1. The electronic component S1 is held by the tip of the picker body PC1a, which is located below the circular member PC1b. Each of the plurality of pickers PC1 holds one of the plurality of electronic components S1 arranged on the index table 14, moves while holding the electronic component S1, and stores the held electronic component S1 in the storage member 16. The circular component PC1b is white in color, and its shape in plan view is a perfect circle. The diameter of the circular component PC1b is longer than the length of the diagonal of the rectangular electronic component S1 in plan view. Therefore, when the electronic component S1 is photographed by the second optical inspection camera 13, the background of the electronic component S1 appears white in the grayscale image.

[0036] The camera body 13a photographs the ball / lead surface of the electronic component S1 held by the picker PC1. The reflector 13b is made up of a prism, for example, and has a reflective surface tilted at, for example, 45 degrees with respect to the observation axis C1 of the camera body 13a. The camera body 13a photographs the electronic component S1 reflected by the reflective surface of the reflector 13b.

[0037] The coaxial illuminator 17a has a rectangular parallelepiped shape and includes a plurality of light-emitting elements LT1 arranged on planes along the Y and Z axes, and a half-mirror HM1 tilted at 45 degrees with respect to the observation axis C1 of the camera body 13a. The direction in which the half-mirror HM1 is tilted with respect to the observation axis C1 is the same as the direction in which the reflective surface of the reflector 13b is tilted with respect to the observation axis C1. Light emitted by the plurality of light-emitting elements LT1 is incident on the half-mirror HM1 along the X axis, and the light reflected by the half-mirror HM1 is irradiated onto the electronic component S1 along the Z axis. In other words, the coaxial illuminator 17a is configured to irradiate the electronic component S1 with light from the direction normal to the electronic component S1. The light irradiated by the coaxial illuminator 17a propagates along the Z axis. The image captured by the second optical inspection camera 13 is the image transmitted through the half-mirror HM1.

[0038] Each of the ring illuminators 17b and 17c is, for example, composed of a strobe. Each of the ring illuminators 17b and 17c has a ring shape and includes a plurality of light-emitting elements LT1 arranged in the circumferential direction. Each of the ring illuminators 17b and 17c is configured to irradiate light onto the electronic component S1 from an oblique direction that is inclined with respect to the normal direction of the electronic component S1, neither from the normal direction of the electronic component S1 nor from the horizontal direction. The light irradiated by each of the ring illuminators 17b and 17c propagates in an oblique direction that is neither from the normal direction of the electronic component S1 nor from the horizontal direction. The light intensity of each of the coaxial illuminator 17a and the ring illuminators 17b and 17c can be adjusted individually. The angle between the direction in which the ring illuminator 17b irradiates light and the normal direction may be the same as or different from the angle between the direction in which the ring illuminator 17c irradiates light and the normal direction. Luminous intensity is the total amount of light energy passing through a given surface within a given time, and is also called luminous energy. The unit of luminous intensity is the lumen-second (lm·s).

[0039] Figure 3 is a schematic plan view of the lighting unit 17. Referring to Figure 3, the centers of the ring illuminators 17b and 17c overlap, and the diameter of the ring illuminator 17c is longer than the diameter of the ring illuminator 17b. That is, in a plan view, the ring illuminator 17b is located in the area inside the ring illuminator 17c. The coaxial illuminator 17a is located in an area even further inside the ring illuminator 17b. When the electronic component S1 is located above the lighting unit 17, in a plan view, the coaxial illuminator 17a is closest to the electronic component S1, and the ring illuminator 17c is furthest from the electronic component S1. In other words, the lowest-positioned illuminator among the coaxial illuminator 17a and the ring illuminators 17b and 17c is closest to the electronic component S1 in a plan view, and the highest-positioned illuminator among the coaxial illuminator 17a and the ring illuminators 17b and 17c is furthest from the electronic component S1 in a plan view. Since the coaxial illuminator 17a illuminates the electronic component S1 with light propagating along the Z-axis, the light illuminated by the coaxial illuminator 17a is not blocked by the ring illuminators 17b and 17c. Also, since the ring illuminator 17b illuminates the inside in a plan view, the light illuminated by the ring illuminator 17b is not blocked by the ring illuminator 17c.

[0040] Referring again to Figure 1, the electronic components S1 are sorted into "good" or "defective" based on the results of visual inspection using the first optical inspection camera 12 and the second optical inspection camera 13. The storage member 16 is provided as a storage member 16a for good products and a storage member 16b for defective products. Each of the storage member 16a for good products and the storage member 16b for defective products is movable along the Y axis. The transport unit 15 transports each electronic component S1 to either the storage member 16a for good products or the storage member 16b for defective products based on the sorting results. That is, good electronic components S1 are stored in the storage member 16a for good products, and defective electronic components S1 are stored in the storage member 16b for defective products. In other words, the picker PC1 stores the held electronic components S1 in either the storage member 16a for good products or the storage member 16b for defective products. When each of the storage members for good products 16a and defective products 16b is filled with electronic components S1, it is replaced with a new storage member.

[0041] The cutting device 1 further includes a computer 50 and a monitor 20. The monitor 20 is configured to display an image. The monitor 20 is composed of a display device such as a liquid crystal monitor or an organic EL (Electro-Luminescence) monitor.

[0042] The computer 50 controls, for example, the operation of each part of the cutting module A1 and the inspection / storage module B1. The computer 50 controls, for example, the operation of the substrate supply unit 3, positioning unit 4, cutting table 5, cutting mechanism 6, transport unit 7, flipper 11, first optical inspection camera 12, index table 14, transport unit 15, second optical inspection camera 13, lighting unit 17, storage member 16, and monitor 20.

[0043] Furthermore, the computer 50 performs various visual inspections of the electronic component S1 based on image data generated by the first optical inspection camera 12 and the second optical inspection camera 13, for example. Next, the computer 50 will be described in detail.

[0044] <1-2. Configuration of Computer> FIG. 4 is a diagram schematically showing a hardware configuration of a computer 50. As shown in FIG. 4, the computer 50 includes a control unit 70, an input / output I / F (interface) 90, a reception unit 95, and a storage unit 80, and the respective components are electrically connected via a bus.

[0045] The control unit 70 includes a CPU (Central Processing Unit) 72, a RAM (Random Access Memory) 74, a ROM (Read Only Memory) 76, and the like. The control unit 70 is configured to control each component in the computer 50 and each component in the cutting device 1 in accordance with information processing.

[0046] The input / output I / F 90 is configured to communicate with each component included in the cutting device 1 via a signal line. The input / output I / F 90 is used for transmitting data from the computer 50 to each component in the cutting device 1, and receiving data transmitted from each component in the cutting device 1 to the computer 50. The reception unit 95 is configured to receive an instruction from a user. The reception unit 95 is configured by, for example, part or all of a touch panel, a keyboard, a mouse, and a microphone.

[0047] The storage unit 80 is, for example, an auxiliary storage device such as a hard disk drive or a solid state drive. The storage unit 80 is configured to store, for example, a control program 81. Various functions in the cutting device 1 are realized by executing the control program 81 by the control unit 70. When the control unit 70 executes the control program 81, the control program 81 is expanded to the RAM 74. Then, the control unit 70 controls each component by interpreting and executing the control program 81 expanded in the RAM 74 by the CPU 72.

[0048] [2. Visual Inspection of Ball / Lead Surface of Semantic Member] In the cutting apparatus 1 according to the present embodiment, each electronic component S1 is imaged by the second optical inspection camera 13 under two different imaging conditions for visual inspection of the ball / lead surface. That is, for the visual inspection of the ball / lead surface, for each electronic component S1, imaging performed by the second optical inspection camera 13 with light emission from the coaxial illuminator 17a and the ring illuminator 17c (hereinafter also referred to as "first imaging"), and imaging performed by the second optical inspection camera 13 with light emission from the ring illuminator 17b (hereinafter also referred to as "second imaging") are performed. In the first imaging, the ring illuminator 17b does not emit light, and in the second imaging, each of the coaxial illuminator 17a and the ring illuminator 17c does not emit light. Further, the light amount of the ring illuminator 17c during the first imaging is different from the light amount of the ring illuminator 17b during the second imaging. The reason why imaging is performed for each electronic component S1 under two different imaging conditions will be described below.

[0049] FIG. 5 is a diagram for explaining features of an image obtained through imaging performed with light emission from the coaxial illuminator 17a. With reference to FIG. 5, in this example, the imaging object OJ1 is imaged by the second optical inspection camera 13 with light emission from the coaxial illuminator 17a. The imaging object OJ1 has a rectangular shape in plan view. The lower surface of the imaging object OJ1 includes a flat portion PT1 and an uneven portion PT2. The light emitted by the coaxial illuminator 17a is applied to the imaging object OJ1 from the normal direction of the imaging object OJ1. The light incident on the flat portion PT1 is reflected, for example, toward the camera body 13a. On the other hand, the light incident on the uneven portion PT2 is reflected, for example, in a direction different from the direction toward the camera body 13a. Therefore, in the image obtained through the imaging performed with light emission from the coaxial illuminator 17a, the features of the flat portion PT1 are strongly reflected, while the features of the uneven portion PT2 are not significantly reflected.

[0050] Figure 6 is a diagram illustrating the characteristics of an image obtained through imaging accompanied by the illumination of the ring illuminator 17b. Referring to Figure 6, in this example, the object to be photographed OJ1 is photographed by the second optical inspection camera 13 accompanied by the illumination of the ring illuminator 17b. The light emitted by the ring illuminator 17b is directed onto the object to be photographed OJ1 from an oblique direction, neither in the direction normal to the electronic component S1 nor horizontally. Light incident on the flat portion PT1 is reflected in a direction different from, for example, the direction toward the camera body 13a. On the other hand, light incident on the uneven portion PT2 is reflected toward, for example, the camera body 13a. Therefore, in the image obtained through imaging accompanied by the illumination of the ring illuminator 17b, the characteristics of the uneven portion PT2 are strongly reflected, while the characteristics of the flat portion PT1 are not reflected to much extent. This is also true when the ring illuminator 17c is used instead of the ring illuminator 17b.

[0051] Multiple inspections are performed for the visual appearance of the electronic component S1. Some inspections are performed with high precision by observing both the flat and uneven parts of the electronic component S1. For example, this includes checking for stains on the ball / lead surface. Other inspections are performed with high precision by observing the uneven parts of the electronic component S1 in more detail. For example, this includes checking for scratches on the ball / lead surface. In the first imaging, the coaxial illuminator 17a and the ring illuminator 17c emit light, so the image obtained through the first imaging (hereinafter also referred to as the "first image") reflects the characteristics of both the flat and uneven parts of the electronic component S1. For example, the visual inspection for stains on the ball / lead surface is performed based on the first image. On the other hand, in the second imaging, only the ring illuminator 17b emits light, so the image obtained through the second imaging (hereinafter also referred to as the "second image") reflects the characteristics of the uneven parts of the electronic component S1 in more detail. For example, visual inspection for scratches on the ball / lead surface is performed based on the second image.

[0052] Figure 7 is a diagram that includes a schematic plan view and a side view of the electronic component S1. Referring to Figure 7, the upper diagram is a plan view of the electronic component S1, and the lower diagram is a side view of the electronic component S1. The electronic component S1 includes a rectangular substrate portion ST1 in plan view and a plurality of ball terminal portions BL1, each of which is arranged on the substrate portion ST1. Each ball terminal portion BL1 protrudes upward from the substrate portion ST1.

[0053] Figure 8 schematically shows an image of the electronic component S1 obtained through the first imaging. Referring to Figure 8, the image IM1 is an image captured by the second optical inspection camera 13. In the image IM1, the image of the electronic component S1 is included on the near side, and the image of the circular member PC1b is included on the far side. In the first imaging, the coaxial illuminator 17a and the ring illuminator 17c emit light, so in the image IM1, the flat substrate portion ST1 and the ball terminal portion BL1 protruding from the substrate portion ST1 are both brightly visible.

[0054] Figure 9 schematically shows an image of the electronic component S1 obtained through the second imaging. Referring to Figure 9, the image IM2 is an image taken by the second optical inspection camera 13. In the image IM2, the image of the electronic component S1 is included on the near side, and the image of the circular member PC1b is included on the far side. In the second imaging, only the ring illuminator 17b emits light, so in the image IM2, the flat substrate portion ST1 is dark, and the ball terminal portion BL1 protruding from the substrate portion ST1 is bright.

[0055] Thus, in the cutting device 1, both first and second imaging are performed for each electronic component S1 in order to capture an appropriate image according to the type of visual inspection. Then, for each electronic component S1, a visual inspection is performed using the first image and a visual inspection is performed using the second image.

[0056] The first and second imaging are performed continuously while the electronic component S1 is moving during transport from the index table 14 to the storage member 16. The faster the electronic component S1 moves, the shorter the time interval between the first and second imaging needs to be. In the cutting device 1 according to this embodiment, a ring illuminator 17c used for the first imaging and a ring illuminator 17b used for the second imaging are provided separately.

[0057] Figure 10 illustrates the problems that arise when one of the ring illuminators 17c is not provided. Referring to Figure 10, in this example, only the coaxial illuminator 17a and the ring illuminator 17b are provided as illuminators. As described above, the required light intensity of the ring illuminator differs between the first and second imaging. For example, suppose the light intensity of the ring illuminator required for the first imaging is the first light intensity, and the light intensity of the ring illuminator required for the second imaging is the second light intensity, which is different from the first light intensity. In this case, it is necessary to perform the first imaging with the light intensity of the ring illuminator 17b changed to the first light intensity, and then perform the second imaging after changing the light intensity of the ring illuminator 17b from the first light intensity to the second light intensity. Changing the light intensity of the ring illuminator 17b requires a certain amount of time. According to this example, it is not possible to perform the first and second imaging consecutively at a time interval shorter than the time interval required for the ring illuminator 17b to emit light of the first light intensity and then emit light of the second light intensity.

[0058] In the cutting apparatus 1 according to this embodiment, both a ring illuminator 17b and a ring illuminator 17c are provided. Therefore, for example, by pre-adjusting the light intensity of the ring illuminator 17c used for the first imaging to a first light intensity, and pre-adjusting the light intensity of the ring illuminator 17b used for the second imaging to a second light intensity, the first and second imaging can be performed continuously at a shorter time interval than the time interval required for the ring illuminator 17b to irradiate with light of the first light intensity, then change the light intensity to the second light intensity, and irradiate with light of the second light intensity. In other words, in the cutting apparatus 1 according to this embodiment, for example, the control unit 70 of the computer 50 controls the second optical inspection camera 13 and the illumination unit 17 respectively so that the first and second imaging are performed at a shorter time interval than the time interval required for the ring illuminator 17b to irradiate with light of the first light intensity, then change the light intensity to the second light intensity, and irradiate with light of the second light intensity.

[0059] Figure 11 is a diagram illustrating the images captured through the first and second imaging processes. Referring to Figure 11, in this example, electronic components S1A, S1B, S1C, and S1D are transported by the transport unit 15 from left to right in the figure, and the first and second imaging processes are performed while the electronic components S1A, S1B, S1C, and S1D are being transported. In the cutting device 1, the first and second imaging processes are performed alternately each time the transport unit 15 arrives at a predetermined position.

[0060] In this example, one or two electronic components S1 are captured in the first and second imaging processes. Specifically, the image IM3 generated through the first imaging process includes an image of electronic component S1A, and the image IM4 generated through the second imaging process includes images of electronic components S1A and S1B. The image IM5 generated through the first imaging process includes images of electronic components S1B and S1C, and the image IM6 generated through the second imaging process includes images of electronic components S1C and S1D. Furthermore, the image generated through the subsequent first imaging process includes an image of electronic component S1D. The images IM3, IM4, IM5, and IM6 are captured in this order.

[0061] Thus, each of the first and second images, which are generated consecutively, contains two or more electronic components S1 that are partially common to each other. Therefore, when performing visual inspection of multiple electronic components S1, the cutting device 1 can reduce the number of first and second images compared to when each of the first and second images contains only an image of one electronic component S1, thus enabling more efficient visual inspection of multiple electronic components S1.

[0062] [3. Operation] <3-1. Photography operation of the ball / lead surface of semiconductor material> Figure 12 is a flowchart showing the procedure for photographing the electronic component S1 being transported by the transport unit 15. Referring to Figure 12, the process shown in this flowchart is performed while the electronic component S1 is being transported from the index table 14 to the storage member 16. Photography by the second optical inspection camera 13 and illumination by the lighting unit 17 are performed in response to instructions via a hardware trigger, and the instructions via the hardware trigger are given in accordance with the arrival of the transport unit 15 at a predetermined position.

[0063] After the transport unit 15 arrives at a predetermined position following the start of transport of the electronic components S1 from the index table 14 to the storage member 16, the second optical inspection camera 13 and the illumination unit 17 perform a first photograph (step S100). Specifically, the second optical inspection camera 13 performs a photograph accompanied by the emission of light from the coaxial illuminator 17a and the ring illuminator 17c.

[0064] Subsequently, when the transport unit 15 arrives at another predetermined location, a second image is taken by the second optical inspection camera 13 and the illumination unit 17 (step S110). That is, the second optical inspection camera 13 takes an image accompanied by the illumination of the ring illuminator 17b. Each predetermined location is a location in which a desired number of electronic components S1 are included in the desired position in the captured image. The process shown in this flowchart is repeated until the first and second images of each electronic component S1 transported by the transport unit 15 are completed.

[0065] <3-2. Visual Inspection Operation of Ball / Lead Surfaces of Semiconductor Materials> Figure 13 is a flowchart showing the visual inspection procedure for electronic components S1 transported by the transport unit 15. Referring to Figure 13, the process shown in this flowchart is executed by the control unit 70 of the computer 50 as the first and second imaging are completed while the electronic components S1 are being transported from the index table 14 to the storage member 16.

[0066] The control unit 70 extracts an image of the target component (hereinafter also referred to as the "target component") from the first image which contains the electronic component S1 that is the subject of the visual inspection (step S200). As described above, the image captured by the second optical inspection camera 13 (for example, the first image) is a grayscale image, and the pixel value of each pixel is shown in 256 gradations. In the first image, the area of ​​the electronic component S1 is shown in black or gray, and the background of the electronic component S1 (circular component PC1b) is shown in white. In the first image, the left and right edges of the electronic component S1 in the first image are identified by scanning the pixel values ​​of each row and extracting pixels whose pixel values ​​change rapidly. In the first image, the top and bottom edges of the electronic component S1 in the first image are identified by scanning the pixel values ​​of each column and extracting pixels whose pixel values ​​change rapidly. As a result, if the first image contains an image of only one electronic component S1, the area of ​​the target component is identified. If the first image contains images of two electronic components S1, the position of the target component (left or right) in the first and second images is stored in advance, and the region of the target component is identified according to that information.

[0067] The control unit 70 extracts an image of the target component from the second image which contains the target component (step S210). The extraction of the image of the target component from the second image is performed in the same manner as the extraction of the image of the target component from the first image. The control unit 70 performs the visual inspection performed using the first image by using the image of the target component extracted from the first image (step S220). The control unit 70 also performs the visual inspection performed using the second image by using the image of the target component extracted from the second image (step S230). The process shown in this flowchart is repeated until all visual inspections of each electronic component S1 transported by the transport unit 15 are completed.

[0068] [4. Features] As described above, in the cutting device 1 according to this embodiment, the first image is taken with light irradiation by the coaxial illuminator 17a and the ring illuminator 17c, and the second image is taken with light irradiation by the ring illuminator 17b. Therefore, with the cutting device 1, even if it is necessary to have different light intensity levels for the illuminators for the first and second images, it is not necessary to change the light intensity level of the illuminators between the first and second images. Thus, compared to cases where it is necessary to change the light intensity level of the illuminators between the first and second images, two types of images can be captured at high speed.

[0069] The inspection and storage module B1 is an example of a "visual inspection device" in the present invention. The electronic component S1 is an example of a "semiconductor member" in the present invention. The coaxial illuminator 17a is an example of a "first illuminator" in the present invention. The ring illuminator 17b is an example of a "second illuminator" in the present invention. The ring illuminator 17c is an example of a "third illuminator" in the present invention. The second optical inspection camera 13 is an example of an "imaging unit" in the present invention. The control unit 70 is an example of an "inspection unit" in the present invention. The cutting mechanism 6 is an example of a "cutting mechanism" in the present invention. The index table 14 is an example of a "table" in the present invention. The storage member 16 is an example of a "multiple storage members" in the present invention. The picker PC1 is an example of a "transporter" in the present invention.

[0070] [5. Other Embodiments] The concept of the above embodiments is not limited to those described above. Examples of other embodiments to which the concept of the above embodiments can be applied will be described below.

[0071] <5-1> In the above embodiment, ring illuminators 17b and 17c were provided as illuminators that illuminate the electronic component S1 held by the transport unit 15 from an oblique direction. However, the illuminators that illuminate the electronic component S1 held by the transport unit 15 from an oblique direction do not necessarily have to be ring illuminators. The illuminators that illuminate the electronic component S1 held by the transport unit 15 from an oblique direction may be, for example, line illuminators.

[0072] Figure 14 is a schematic plan view showing a lighting unit including line illuminators. Referring to Figure 14, in this example, a line illuminator 17bA is provided instead of a ring illuminator 17b, and a line illuminator 17cA is provided instead of a ring illuminator 17c. Each of the line illuminators 17bA and 17cA irradiates light onto the electronic component S1 from an oblique direction inclined with respect to the normal direction of the electronic component S1. In the direction normal to the electronic component S1, the electronic component S1, line illuminator 17cA, line illuminator 17bA, and coaxial illuminator 17a are arranged in this order. Also, in a plan view, the coaxial illuminator 17a, line illuminator 17bA, and line illuminator 17cA are closest to the electronic component S1 in this order. Such a configuration is also acceptable.

[0073] <5-2> In the above embodiment, the appearance of the electronic component S1 cut by the cutting device 1 was inspected by using the second optical inspection camera 13 and the illumination unit 17. However, the object of appearance inspection is not limited to this. For example, the appearance of a resin molded product (an example of a "semiconductor component") manufactured by a molding device may be inspected by using the second optical inspection camera 13 and the illumination unit 17.

[0074] <5-3> In the above embodiment, the coaxial illuminator 17a and the ring illuminator 17c emitted light in the first shot, and the ring illuminator 17b emitted light in the second shot. However, the combination of illuminators that emit light in each shot is not limited to this. For example, only the ring illuminator 17c may emit light in the first shot and only the ring illuminator 17b may emit light in the second shot, or only the coaxial illuminator 17a may emit light in the first shot and only the ring illuminator 17b may emit light in the second shot, or both the coaxial illuminator 17a and the ring illuminator 17b may emit light in the first shot and the ring illuminator 17c may emit light in the second shot. In addition, another coaxial illuminator may be added, and different coaxial illuminators may emit light in the first and second shots, respectively.

[0075] <5-4> In the above embodiment, a tray for storing electronic components S1 was exemplified as the storage member 16. The tray has, for example, a plurality of recesses, and an electronic component S1 is stored in each of the plurality of recesses. However, the storage member 16 does not necessarily have to be a tray. The storage member 16 may be composed of, for example, an adhesive member including an adhesive sheet to which a plurality of electronic components S1 are attached. In this case, a plurality of electronic components S1 are stored in the adhesive member by attaching the plurality of electronic components S1 to the adhesive sheet.

[0076] Embodiments of the present invention have been described illustratively above. That is, a detailed description and accompanying drawings have been disclosed for illustrative purposes. Therefore, some of the components described in the detailed description and accompanying drawings may not be essential for solving the problem. Consequently, the mere fact that these non-essential components are described in the detailed description and accompanying drawings does not mean that they should be immediately assumed to be essential.

[0077] Furthermore, the above embodiments are merely illustrative in every respect of the present invention. The above embodiments can be improved or modified in various ways within the scope of the present invention. For example, at least a part of the configuration of one embodiment may be combined with at least a part of the configuration of any other embodiment. In other words, in carrying out the present invention, specific configurations can be appropriately adopted depending on the embodiment.

[0078] [6. Addendum] This specification discloses a variety of technical ideas, including at least the following technologies.

[0079] <Technology 1> (Configuration) An appearance inspection apparatus for inspecting the appearance of one surface of a semiconductor material, comprising: a first illuminator and a second illuminator, each irradiating the semiconductor material with light from the direction normal to the surface of the semiconductor material, or from an oblique direction inclined with respect to the normal direction; and an imaging unit for photographing the semiconductor material, wherein the light intensity of each of the first and second illuminators can be individually adjusted, and the imaging unit continuously performs a first imaging, in which the semiconductor material is photographed with light irradiation from the first illuminator, and a second imaging, in which the semiconductor material is photographed with light irradiation from the second illuminator. (Effects, etc.) In this appearance inspection apparatus, the first imaging is performed with light irradiation from the first illuminator, and the second imaging is performed with light irradiation from a second illuminator different from the first illuminator. Therefore, with this visual inspection device, even if it is necessary to change the light intensity of the illuminator between the first and second images, it is not necessary to change the light intensity of the illuminator between the first and second images. As a result, two types of images can be captured at high speed compared to cases where it is necessary to change the light intensity of the illuminator between the first and second images.

[0080] <Technology 2> (Configuration) The appearance inspection apparatus according to Technology 1, wherein the first illuminator irradiates the semiconductor member with light from the normal direction, the second illuminator irradiates the semiconductor member with light from an oblique direction tilted with respect to the normal direction, and the apparatus further comprises a third illuminator that irradiates the semiconductor member with light from an oblique direction tilted with respect to the normal direction, the light intensity of each of the second and third illuminators can be adjusted individually, and the first photograph is further performed with irradiation of light by the third illuminator. (Effects, etc.) In this appearance inspection apparatus, the first photograph is performed with irradiation of light by the first and third illuminators, and the second photograph is performed with irradiation of light by the second illuminator. Therefore, with this appearance inspection apparatus, even if it is necessary to change the light intensity of the illuminators between the first and second photographs, it is not necessary to change the light intensity of the illuminators between the first and second photographs, so two types of images can be captured at high speed compared to when it is necessary to change the light intensity of the illuminators between the first and second photographs.

[0081] <Technology 3> (Configuration) The appearance inspection apparatus according to Technology 2, wherein the light intensity of the second illuminator is pre-adjusted to a first light intensity, the light intensity of the third illuminator is pre-adjusted to a second light intensity, the first light intensity and the second light intensity are different from each other, and the imaging unit performs the first imaging and the second imaging continuously at a time interval shorter than the time interval required for the second illuminator to irradiate with light of the first light intensity, then change the light intensity to the second light intensity, and irradiate with light of the second light intensity. (Effects, etc.) In this appearance inspection apparatus, the first imaging and the second imaging are performed continuously at a time interval shorter than the time interval required for the second illuminator to irradiate with light of the first light intensity, then change the light intensity to the second light intensity, and irradiate with light of the second light intensity. Therefore, with this appearance inspection apparatus, two types of images can be captured at a speed that cannot be achieved by capturing two types of images using one illuminator.

[0082] <Technology 4> (Configuration) When the imaging unit is used to image the semiconductor material, the first illuminator, the second illuminator, and the third illuminator are each positioned below the semiconductor material, the lowest illuminator among the first, second, and third illuminators is closest to the semiconductor material in a plan view, and the highest illuminator among the first, second, and third illuminators is furthest from the semiconductor material in a plan view, as described in Technology 2 or Technology 3. (Effects, etc.) In this appearance inspection apparatus, the lowest illuminator among the first, second, and third illuminators is closest to the semiconductor material in a plan view, and the highest illuminator among the first, second, and third illuminators is furthest from the semiconductor material in a plan view. Therefore, with this appearance inspection apparatus, for example, light irradiated onto the semiconductor material by the lower illuminator can be made less likely to be blocked by the upper illuminator.

[0083] <Technology 5> (Configuration) An appearance inspection apparatus according to any one of Technology 1 to 4, wherein the first and second imaging are performed while the semiconductor material is in motion. (Effects, etc.) In this appearance inspection apparatus, the first and second imaging are performed while the semiconductor material is in motion. Therefore, with this appearance inspection apparatus, the inspection of the appearance of the semiconductor material and the transport of the semiconductor material are performed in parallel, so the manufacturing of the semiconductor material can be performed at a higher speed compared to the case where the first and second imaging are performed while the movement of the semiconductor material is stopped.

[0084] <Technical 6> (Configuration) The appearance inspection apparatus according to Technical 5, wherein each of the first and second imaging is performed while a plurality of semiconductor members are moving in one direction, each of the first image captured through the first imaging and each of the second image captured through the second imaging includes two or more semiconductor members, a part of the two or more semiconductor members included in the first image and a part of the two or more semiconductor members included in the second image are common, and the apparatus further comprises an inspection unit for inspecting the appearance based on the first and second images. (Effects, etc.) In this appearance inspection apparatus, when inspecting the appearance of a plurality of semiconductor members, each of the first and second images used to inspect the appearance of the semiconductor members includes two or more semiconductor members that are partially common to each other. Therefore, with this appearance inspection apparatus, when inspecting the appearance of a plurality of semiconductor members, the number of times each of the first and second imaging can be performed can be reduced compared to when each of the first and second images includes only one semiconductor member, so that the appearance of a plurality of semiconductor members can be inspected more efficiently.

[0085] <Technology 7> (Configuration) A cutting apparatus comprising: an appearance inspection apparatus described in any one of Technology 1 to Technology 6; a cutting mechanism that cuts an object to be cut into a plurality of semiconductor members; a table on which each of the plurality of semiconductor members is placed; a plurality of storage members; and a transport body that holds one of the plurality of semiconductor members placed on the table, moves while holding the semiconductor member, and stores the held semiconductor member in one of the plurality of storage members, wherein the first and second imaging are performed while the transport body is moving. (Effects, etc.) In this cutting apparatus, the first and second imaging are performed while the semiconductor member is moving from the table to the storage member. Therefore, with this cutting apparatus, the appearance inspection of the semiconductor member and the transport of the semiconductor member are performed in parallel, so the manufacturing of semiconductor members can be performed at a higher speed compared to the case in which the first and second imaging are performed while the movement of the semiconductor member is stopped.

[0086] <Technology 8> (Configuration) A method for manufacturing a semiconductor member using the cutting apparatus described in Technology 7, comprising: preparing an object to be cut; and cutting the object to be cut to divide the object into a plurality of semiconductor members. (Effects, etc.) In this semiconductor member manufacturing method, the first image is taken with light irradiation from a first illuminator, and the second image is taken with light irradiation from a second illuminator different from the first illuminator. Therefore, according to this semiconductor member manufacturing method, even if it is necessary to change the light intensity of the illuminator between the first and second images, it is not necessary to change the light intensity of the illuminator between the first and second images, so that two types of images can be taken at high speed compared to when it is necessary to change the light intensity of the illuminator between the first and second images. As a result, according to this semiconductor member manufacturing method, semiconductor members can be manufactured at a higher speed.

[0087] 1 Cutting device, 3 Substrate supply unit, 4 Positioning unit, 4a Rail unit, 5 Cutting table, 5a Holding member, 5b Rotation mechanism, 5c Moving mechanism, 5d First position confirmation camera, 5e First cleaner, 6 Cutting mechanism, 6a Blade, 6b Second position confirmation camera, 6c Rotation axis, 6d Spindle unit, 7 Transport unit, 7a Second cleaner, 11 Flipper, 12 First optical inspection camera, 13 Second optical inspection camera, 13a Camera body, 13b Reflector, 14 Index table, 15 Transport unit, 15a Base unit, 16 Storage member, 16a Storage member for good products, 16b Storage member for defective products, 17 Lighting unit, 17a Coaxial illuminator, 17b, 17c Ring illuminator, 17bA, 17cA Line illuminator, 20 Monitor, 50 Computer, 70 Control unit, 72 CPU, 74 RAM, 76 ROM, 80 Memory unit, 81 Control program, 90 Input / Output I / F, 95 Reception unit, A1 Cutting module, B1 Inspection / Storage module, BL1 Ball terminal unit, C1 Observation axis, HM1 Half mirror, IM1-IM6 Captured image, LT1 Light-emitting element, M1 Magazine, OJ1 Target for shooting, P1 Package substrate, PC1 Picker, PC1a Picker body, PC1b Circular member, PT1 Flat part, PT2 Uneven part, S1 Electronic component, ST1 Substrate part.

Claims

1. An appearance inspection apparatus for inspecting the appearance of one surface of a semiconductor material, comprising: a first illuminator and a second illuminator, each irradiating the semiconductor material with light from the direction normal to the surface of the semiconductor material, or from an oblique direction inclined with respect to the normal direction; and an imaging unit for photographing the semiconductor material, wherein the light intensity of each of the first and second illuminators can be individually adjusted, and the imaging unit continuously performs a first imaging, in which the semiconductor material is photographed with light irradiation from the first illuminator, and a second imaging, in which the semiconductor material is photographed with light irradiation from the second illuminator.

2. The appearance inspection apparatus according to claim 1, wherein the first illuminator irradiates the semiconductor member with light from the normal direction, the second illuminator irradiates the semiconductor member with light from an oblique direction tilted with respect to the normal direction, and the apparatus further comprises a third illuminator that irradiates the semiconductor member with light from an oblique direction tilted with respect to the normal direction, the light intensity of each of the second and third illuminators can be adjusted individually, and the first photograph is further performed with irradiation of light by the third illuminator.

3. The appearance inspection apparatus according to claim 2, wherein the light intensity of the second illuminator is pre-adjusted to a first light intensity, the light intensity of the third illuminator is pre-adjusted to a second light intensity, the first light intensity and the second light intensity are different from each other, and the imaging unit performs the first imaging and the second imaging continuously at a time interval shorter than the time interval required for the second illuminator to change the light intensity from the first light intensity to the second light intensity and emit light of the second light intensity.

4. The appearance inspection apparatus according to claim 2 or 3, wherein, when the imaging unit is used to photograph the semiconductor member, each of the first illuminator, the second illuminator and the third illuminator is positioned below the semiconductor member, the lowest illuminator among the first illuminator, the second illuminator and the third illuminator is closest to the semiconductor member in a plan view, and the highest illuminator among the first illuminator, the second illuminator and the third illuminator is furthest from the semiconductor member in a plan view.

5. The appearance inspection apparatus according to any one of claims 1 to 4, wherein each of the first and second imaging is performed while the semiconductor member is moving.

6. The appearance inspection apparatus according to claim 5, wherein each of the first and second imaging is performed while a plurality of semiconductor members are moving in one direction, and each of the first image captured through the first imaging and the second image captured through the second imaging includes two or more semiconductor members, and a portion of the two or more semiconductor members included in the first image is common to a portion of the two or more semiconductor members included in the second image, and the apparatus further comprises an inspection unit for inspecting the appearance based on the first and second images.

7. A cutting device comprising: an appearance inspection device according to any one of claims 1 to 6; a cutting mechanism for cutting an object to be cut into a plurality of semiconductor members by cutting the object to be cut; a table on which each of the plurality of semiconductor members is arranged; a plurality of storage members; and a transport body for holding any one of the plurality of semiconductor members arranged on the table, moving while holding the semiconductor member, and storing the held semiconductor member in any one of the plurality of storage members, wherein the first and second imaging are each performed while the transport body is moving.

8. A method for manufacturing a semiconductor member using the cutting apparatus described in claim 7, comprising: preparing an object to be cut; and cutting the object to be cut to divide the object into a plurality of semiconductor members.

Images