Cutting device and method for producing cut article

Abstract

A cutting device of the present invention includes a cutting mechanism, a table, a plurality of storage members, a transport body, an imaging unit, and a control unit. The cutting mechanism divides a to-be-cut article into a plurality of individual cut pieces by cutting said article. Each of the plurality of cut pieces are disposed on the table. The transport body holds one of the plurality of cut pieces placed on the table, moves while holding the cut piece, and transports the held cut piece to one of the plurality of storage members. The imaging unit generates image data by capturing an image of the held cut piece while the cut piece is moving. On the basis of the image data, the control unit selects which of the plurality of storage members in which to store the held cut piece, and controls the transport body in accordance with the selection result.

Description

Cutting Device, and Method for Manufacturing Cut Products

[0001] The present invention relates to a cutting device, and a method for manufacturing cut products.

[0002] For example, Japanese Patent Laid-Open No. 2024-160303 (Patent Document 1) discloses a cutting device for cutting an object to be cut. In this cutting device, a package substrate is cut, and the package substrate is singulated into a plurality of electronic components.

[0003] Japanese Patent Laid-Open No. 2024-160303 Japanese Patent No. 6640142

[0004] In cutting devices as disclosed in Patent Documents 1 and 2, reduction of the time required for manufacturing electronic components is demanded. However, it cannot be said that Patent Documents 1 and 2 sufficiently disclose a solution to such a problem.

[0005] An object of the present invention is to provide a cutting device capable of shortening the time required for manufacturing cut products, and a method for manufacturing cut products.

[0006] A cutting device according to one aspect of the present invention includes a cutting mechanism, a table, a plurality of storage members, a transport body, an imaging unit, and a control unit. The cutting mechanism singulates the object to be cut into a plurality of cut products by cutting the object to be cut. Each of the plurality of cut products is arranged on the table. The transport body holds any one cut product among the plurality of cut products arranged on the table, moves while holding the cut product, and stores the held cut product in any one storage member among the plurality of storage members. The imaging unit generates image data by photographing the held cut product that is in motion. The control unit selects which storage member among the plurality of storage members the held cut product is to be stored in, based on the image data, and controls the transport body according to the selection result.

[0007] A method for manufacturing cut products according to another aspect of the present invention is a method for manufacturing cut products using the above-described cutting device. This method for manufacturing cut products includes preparing an object to be cut, and singulating the object to be cut into a plurality of cut products by cutting the object to be cut.

[0008] According to the present invention, it is possible to provide a cutting device that can shorten the time required to manufacture cut products, and a method for manufacturing cut products.

[0009] This is a schematic plan view of a cutting device. This is a schematic diagram of the computer's hardware configuration. This is a diagram illustrating the process of transporting electronic components from an index table to a storage member. This is a flowchart showing the procedure from visual inspection by a first optical inspection camera until the electronic components are stored in the storage member. This is a flowchart showing the procedure for visual inspection of electronic components. This is a flowchart showing the procedure for calculating the tilt of electronic components. This is a diagram illustrating the procedure for calculating the rotation angle of electronic components. This is a flowchart showing the procedure for calculating the displacement of the center of gravity of the region showing electronic components. This is a diagram illustrating the procedure for calculating the position of the center of gravity of the region showing electronic components.

[0010] Hereinafter, an embodiment relating to one aspect of the present invention (hereinafter also referred to as "this embodiment") will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and their descriptions will not be repeated. Furthermore, each drawing is schematically depicted with parts omitted or exaggerated as appropriate for ease of understanding.

[0011] [1. Configuration] <1-1. Configuration of the Cutting Device> Figure 1 is a schematic plan view showing a cutting device 1 according to this embodiment. The cutting device 1 is configured to cut a package substrate (object to be cut) and thereby divide the package substrate into multiple electronic components (package components). In the package substrate, the substrate or lead frame on which the semiconductor chip is mounted is resin-encapsulated. Note that the object to be cut does not necessarily have to be a package substrate; for example, it may be a substrate that is not resin-encapsulated (including a wafer). A substrate that is not resin-encapsulated and has been divided into individual pieces by cutting is also included in "electronic components".

[0012] Examples of package substrates include BGA (Ball Grid Array) package substrates, LGA (Land Grid Array) package substrates, CSP (Chip Size Package) package substrates, LED (Light Emitting Diode) package substrates, and QFN (Quad Flat No-leaded) package substrates.

[0013] Furthermore, the cutting device 1 is configured to visually inspect each of the multiple electronic components that have been separated into individual pieces. In the cutting device 1, an image of each electronic component is captured, and a visual inspection of each electronic component is performed based on the image. Inspection data is generated through the visual inspection, and each electronic component is classified as either a "good product" or a "defective product." The specific inspection procedure will be explained later.

[0014] In this example, a package substrate P1 is used as the object to be cut, and the cutting device 1 separates the package substrate P1 into multiple electronic components S1. Hereinafter, of the two sides of the package substrate P1, the side that is resin-sealed will be referred to as the molded side, and the side opposite the molded side will be referred to as the ball / lead side. If the object to be cut is a substrate that is not resin-sealed, the side facing upwards during cutting (the cut surface) corresponds to the ball / lead side in this embodiment, and the side opposite the cut surface corresponds to the molded side in this embodiment.

[0015] As shown in Figure 1, the cutting device 1 includes a cutting module A1 and an inspection / storage module B1 as its components. The cutting module A1 is configured to manufacture a plurality of electronic components S1 by cutting a package substrate P1. The inspection / storage module B1 is configured to inspect each of the manufactured electronic components S1 and then store the electronic components S1 in a storage member (for example, a tray). In the cutting device 1, each component is detachable and interchangeable with respect to the other components.

[0016] The cutting module A1 mainly includes a substrate supply unit 3, a positioning unit 4, a cutting table 5, a cutting mechanism 6, and a transport unit 7. The substrate supply unit 3 supplies package substrates P1 one by one to the positioning unit 4 by pushing them out one by one from a magazine M1 that contains multiple package substrates P1. At this time, the package substrates P1 are arranged with the ball / lead surface facing upwards.

[0017] The positioning unit 4 positions the package substrate P1, which has been extruded from the substrate supply unit 3, onto the rail unit 4a. After that, the positioning unit 4 transports the positioned package substrate P1 to the cutting table 5.

[0018] The cutting table 5 holds the package substrate P to be cut. In this example, a cutting device 1 with a twin-cut table configuration having two cutting tables 5 is shown. The cutting table 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding member 5a holds the package substrate P1, which has been transported by the positioning unit 4, by suction from below. The rotating mechanism 5b rotates the holding member 5a in the θ1 direction in the figure (i.e., rotates it in the XY plane of Figure 1). The XY plane is a horizontal plane. The X axis and Y axis are orthogonal to each other in the horizontal plane. The Z axis extends in a direction perpendicular to the horizontal plane, i.e., vertically. The moving mechanism 5c moves the holding member 5a along the Y axis in the figure. Note that the θ1 direction in the figure is the direction of rotation around the Z axis.

[0019] The cutting mechanism 6 cuts the package substrate P1, thereby dividing the package substrate P1 into multiple electronic components S1. In this example, a cutting device 1 is shown in which two cutting mechanisms 6 cut one package substrate P1. The cutting mechanism 6 is movable along the X and Z axes in the figure.

[0020] The cutting mechanism 6 includes a blade 6a, a rotating shaft 6c extending in the X-axis direction, and a spindle portion 6d that rotates the rotating shaft 6c. The blade 6a is connected to the end of the rotating shaft 6c and is positioned along a plane perpendicular to the rotating shaft 6c, i.e., the YZ plane. In the cutting mechanism 6, the spindle portion 6d rotates the blade 6a at high speed around the rotating shaft 6c. As a result, the blade 6a cuts the package substrate P1, breaking the package substrate P1 into multiple electronic components S1. The blade 6a is mounted on the rotating shaft 6c while being held between first and second flanges (not shown). The first and second flanges are fixed to the rotating shaft 6c by fastening members (not shown), such as nuts.

[0021] The cutting mechanism 6 is equipped with a cutting water nozzle, a cooling water nozzle, and a cleaning water nozzle (none of which are shown). The cutting water nozzle sprays cutting water toward the high-speed rotating blade 6a. The cooling water nozzle sprays cooling water. The cleaning water nozzle sprays cleaning water to wash away cutting debris and the like.

[0022] After the cutting table 5 picks up the package substrate P1, the package substrate P1 is photographed by the first position confirmation camera 5d to confirm its position. The confirmation using the first position confirmation camera 5d is, for example, to confirm the position of a mark provided on the package substrate P1. This mark is, for example, a mark used to determine the cutting position of the package substrate P1.

[0023] Subsequently, the cutting table 5 moves along the Y-axis in the figure toward the cutting mechanism 6. After the cutting table 5 moves below the cutting mechanism 6, alignment is performed, and then the package substrate P1 is cut by moving the cutting table 5 and the cutting mechanism 6 relative to each other. Each time the package substrate P1 is cut by the blade 6a of the cutting mechanism 6, the package substrate P1 is photographed and confirmed by the second position confirmation camera 6b provided in the cutting mechanism 6. Confirmation using the second position confirmation camera 6b is, for example, to confirm the cut position and the cut width of the package substrate P1.

[0024] After the cutting of the package substrate P1 is complete, the cutting table 5 moves away from the cutting mechanism 6 along the Y-axis in the figure, while holding the multiple individual electronic components S1. During this movement process, the first cleaner 5e cleans and dries the upper surfaces (ball / lead surfaces) of the multiple electronic components S1.

[0025] The transport unit 7 picks up the multiple electronic components S1 held on the cutting table 5 from above and transports the multiple electronic components S1 to the flipper 11 of the inspection and storage module B1. During this transport process, the second cleaner 7a cleans and dries the lower surface (molded surface) of the multiple electronic components S1.

[0026] The inspection and storage module B1 mainly includes a flipper 11, a first optical inspection camera 12, an index table 14, a transport unit 15, a second optical inspection camera 13, and a storage member 16. The first optical inspection camera 12 may be provided in the cutting module A1.

[0027] The flipper 11 receives multiple electronic components S1 from the transport unit 7 and holds the received multiple electronic components S1. The flipper 11 is movable along the X-axis in the figure. The flipper 11 can also invert the orientation of the multiple electronic components S1 it is holding. The flipper 11 is provided with a holding member that holds the multiple electronic components S1 by attracting them. The flipper 11 inverts the orientation of the multiple electronic components S1 by rotating the holding member around the Y-axis.

[0028] The first optical inspection camera 12 photographs the molded surfaces of multiple electronic components S1. The first optical inspection camera 12 is equipped with an illumination unit (not shown), and when the first optical inspection camera 12 is taking a photograph, light is shone onto the molded surfaces of the multiple electronic components S1. Based on the captured image (image data) generated by the first optical inspection camera 12, various visual inspections of the molded surfaces of the multiple electronic components S1 are performed. The first optical inspection camera 12 is positioned near the flipper 11 to photograph upwards. The first optical inspection camera 12 is movable along the Y-axis in the figure. The captured image generated by the first optical inspection camera 12 is, for example, a grayscale image. Each of the multiple pixel values ​​that make up this grayscale image is represented by, for example, 256 levels of gradation.

[0029] The first optical inspection camera 12 photographs the molded surfaces of the multiple electronic components S1 being transported to the flipper 11 by the transport unit 7 while the transport unit 7 is stopped moving. The transport unit 7 then places the multiple electronic components S1 on the holding member of the flipper 11. After the flipper 11 picks up the multiple electronic components S1, it inverts the top and bottom of the multiple electronic components S1 held by the holding member. At this time, the bottom surface of the electronic component S1 is the ball / lead surface. The flipper 11 places the held multiple electronic components S1 on the index table 14.

[0030] Multiple electronic components S1 that have been inspected with respect to the molded surface are placed on the index table 14 by the flipper 11. The index table 14 is movable along the Y-axis in the figure.

[0031] The transport unit 15 transports the multiple electronic components S1 placed on the index table 14 to the storage member 16. More specifically, the transport unit 15 holds the multiple electronic components S1 placed on the index table 14 from above, moves while holding the multiple electronic components S1, and stores the held multiple electronic components S1 in the storage member 16. When held by the transport unit 15, the lower surface of the electronic component S1 is the ball / lead surface, and the upper surface of the electronic component S1 is the molded surface. A second optical inspection camera 13 is provided between the index table 14 and the storage member 16.

[0032] The second optical inspection camera 13 photographs the ball / lead surface of the electronic component S1. The second optical inspection camera 13 is equipped with an illumination unit (not shown), and when the second optical inspection camera 13 is taking a photograph, light is shone onto the ball / lead surface of the electronic component S1. Based on the captured image (image data) generated by the second optical inspection camera 13, various inspections of the ball / lead surface of the electronic component S1 are performed. The second optical inspection camera 13 is positioned between the index table 14 and the storage member 16, to photograph the area above. The second optical inspection camera 13 is movable along the Y-axis in the figure. The captured image generated by the second optical inspection camera 13 is, for example, a grayscale image. Each of the multiple pixel values ​​that make up this grayscale image is represented by, for example, 256 gradation values. As will be described in detail later, the photography of the electronic component S1 by the second optical inspection camera 13 is performed while the electronic component S1 is still moving, not while it has stopped moving.

[0033] The electronic components S1 are sorted into "good" or "defective" based on the results of visual inspection using the first optical inspection camera 12 and the second optical inspection camera 13. The storage member 16 is provided with a storage member 16a for good components and a storage member 16b for defective components. Each of the storage member 16a for good components and the storage member 16b for defective components is movable along the Y axis. The transport unit 15 transports each electronic component S1 to either the storage member 16a for good components or the storage member 16b for defective components based on the sorting results. That is, good electronic components S1 are stored in the storage member 16a for good components, and defective electronic components S1 are stored in the storage member 16b for defective components. When each of the storage member 16a for good components and the storage member 16b for defective components is filled with electronic components S1, it is replaced with a new storage member.

[0034] The cutting device 1 further includes a computer 50 and a monitor 20. The monitor 20 is configured to display an image. The monitor 20 is composed of a display device such as a liquid crystal monitor or an organic EL (Electro-Luminescence) monitor.

[0035] The computer 50 controls, for example, the operation of each part of the cutting module A1 and the inspection / storage module B1. The computer 50 controls, for example, the operation of the substrate supply unit 3, positioning unit 4, cutting table 5, cutting mechanism 6, transport unit 7, flipper 11, first optical inspection camera 12, index table 14, transport unit 15, second optical inspection camera 13, storage member 16, and monitor 20.

[0036] Furthermore, the computer 50 performs various inspections of the electronic component S1 based on image data generated by the first optical inspection camera 12 and the second optical inspection camera 13, for example. Next, the computer 50 will be described in detail.

[0037] <1-2. Computer Configuration> Figure 2 is a schematic diagram showing the hardware configuration of the computer 50. As shown in Figure 2, the computer 50 includes a control unit 70, an input / output interface 90, a reception unit 95, and a storage unit 80, and each component is electrically connected via a bus.

[0038] The control unit 70 includes a CPU (Central Processing Unit) 72, RAM (Random Access Memory) 74, and ROM (Read Only Memory) 76, etc. The control unit 70 is configured to control each component in the computer 50 and each component in the cutting device 1 according to information processing.

[0039] The input / output interface 90 is configured to communicate with each component included in the cutting device 1 via signal lines. The input / output interface 90 is used to transmit data from the computer 50 to each component in the cutting device 1 and to receive data transmitted from each component in the cutting device 1 to the computer 50. The reception unit 95 is configured to receive instructions from the user. The reception unit 95 is composed of, for example, some or all of a touch panel, keyboard, mouse, and microphone.

[0040] The storage unit 80 is, for example, an auxiliary storage device such as a hard disk drive or a solid-state drive. The storage unit 80 is configured to store, for example, a control program 81. Various functions of the cutting device 1 are realized when the control program 81 is executed by the control unit 70. When the control unit 70 executes the control program 81, the control program 81 is loaded into the RAM 74. The control unit 70 then controls each component by having the CPU 72 interpret and execute the control program 81 loaded into the RAM 74.

[0041] [2. Inspection of Electronic Components During Transport to Storage Member] Figure 3 is a diagram illustrating the process of transporting electronic components S1 from the index table 14 to the storage member 16. Referring to Figure 3, the transport unit 15 includes a base 15a extending along the X-axis and a plurality of pickers PC1, each connected to the base 15a. Each of the plurality of pickers PC1 is columnar, extends along the Z-axis, and is connected to the base 15a via a rod-shaped member (not shown) extending along the Y-axis from the base 15a. Each picker PC1 is configured to extend and retract along the Z-axis and to rotate around an axis AX1 extending in the Z-axis direction as its center of rotation. The axis AX1 passes through the electronic component S1 while the picker PC1 is holding the electronic component S1.

[0042] Each picker PC1 holds an electronic component S1 by attracting one of the multiple electronic components S1 arranged on the index table 14 to its lower end surface. The transport unit 15 moves with the electronic components S1 held by each picker PC1 and stores the multiple electronic components S1 into the storage member 16.

[0043] The transport unit 15 moves without stopping during the process of moving from above the index table 14 to above the storage member 16. As described above, a second optical inspection camera 13 is positioned between the index table 14 and the storage member 16. The second optical inspection camera 13 is positioned to photograph upwards. During the process of moving the electronic components S1 from above the index table 14 to above the storage member 16, each electronic component S1 passes above the second optical inspection camera 13. During the process of moving the electronic components S1 from above the index table 14 to above the storage member 16, the ball / lead surface of each electronic component S1 is sequentially photographed by the second optical inspection camera 13, and a visual inspection of the ball / lead surface of each electronic component S1 is sequentially performed. That is, the visual inspection of the ball / lead surface of each electronic component S1 is performed while the electronic component S1 is moving, not when the electronic component S1 is stopped.

[0044] As described above, in the cutting apparatus 1, the electronic component S1 held by the picker PC1 is imaged while the electronic component S1 is moving. Therefore, according to the cutting apparatus 1, the imaging of the electronic component S1 is performed in parallel with the conveyance of the electronic component S1, so that the time required for manufacturing the electronic component S1 can be shortened as compared with the case where the imaging of the electronic component S1 is performed while the movement of the electronic component S1 is stopped.

[0045] Further, although details will be described later, in the cutting apparatus 1, the holding state of the electronic component S1 by each picker PC1 is determined based on the image data generated by the second optical inspection camera 13. In the cutting apparatus 1, for example, it is determined to what extent the electronic component S1 held by the picker PC1 is held in an inclined state from a reference inclination with the axis AX1 as the rotation center (see FIG. 7). The electronic component S1 has a rectangular parallelepiped shape. Therefore, the image captured by the second optical inspection camera 13 includes an image showing the rectangular electronic component S1. Although details will be described later, the inclination of the electronic component S1 about the axis AX1 as the rotation center is indicated by an angle formed by one side of the outer periphery of the image captured by the second optical inspection camera 13 (hereinafter also referred to as "reference side") and one side of the image of the electronic component S1 facing the reference side. The aforementioned reference inclination is set in advance. In the cutting apparatus 1, the inclination of the electronic component S1 about the axis AX1 as the rotation center is calculated, and the difference between the calculated inclination and the reference inclination is calculated, whereby it is determined how much the electronic component S1 is held in a state inclined from the reference inclination. In the cutting apparatus 1, according to the determination result, for example, the picker PC1 holding the electronic component S1 rotates so as to suppress the difference between the inclination of the electronic component S1 and the reference inclination, and then the picker PC1 places the electronic component S1 on the storage member 16. Therefore, according to the cutting apparatus 1, the electronic component S1 is stored in the storage member 16 in a state where the difference between the inclination of the electronic component S1 and the reference inclination is suppressed, so that the occurrence of a situation where the electronic component S1 is not stored at a desired position in the storage member 16 can be suppressed.

[0046] Furthermore, in the image captured by the second optical inspection camera 13, it is determined, for example, how far the center of gravity of the area showing the electronic component S1 held by the picker PC1 is deviated from a predetermined reference position on the image (hereinafter also referred to as the "reference position"). The transport unit 15, i.e., the picker PC1, moves in the X-axis direction. The storage member 16 moves in the Y-axis direction. As a result, the position of the electronic component S1 held by the picker PC1 is adjusted to be above the position where it should be stored in the storage member 16. In the cutting device 1, according to the determination result, for example, at least one of the stopping position of the transport unit 15 and the stopping position of the storage member 16 is controlled to suppress the deviation of the center of gravity of the area showing the electronic component S1 from the reference position, and then the picker PC1 places the electronic component S1 on the storage member 16. By adjusting the stopping position of the transport unit 15, specifically the picker PC1, the position of the electronic component S1 in the X-axis direction can be adjusted. By adjusting the stopping position of the storage member 16, the position of the electronic component S1 in the Y-axis direction can be adjusted. Therefore, with the cutting device 1, even if the central portion of the electronic component S1 is not held by the picker PC1, it is possible to prevent the situation in which the electronic component S1 is not stored in the desired position in the storage member 16.

[0047] [3. Operation] Figure 4 is a flowchart showing the procedure from the visual inspection by the first optical inspection camera 12 until the electronic components S1 are stored in the storage member 16. Referring to Figure 4, the control unit 70 of the computer 50 controls the transport unit 7 to place the multiple electronic components S1 held by the transport unit 7 onto the holding member of the flipper 11 (step S100). When the multiple electronic components S1 are placed on the holding member of the flipper 11, the ball / lead surface of each of the multiple electronic components S1 is facing upward.

[0048] The control unit 70 controls the flipper 11 so as to turn over the plurality of electronic components S1 that are attracted to the holding member in a state where each of the plurality of electronic components S1 is attracted (step S110). In this state, the holding member of the flipper 11 is located on the upper side of the electronic components S1, and the ball / lead surface of each of the plurality of electronic components S1 faces downward. The control unit 70 controls the flipper 11 so as to place each of the plurality of electronic components S1 on the index table 14 (step S120). In a state where the plurality of electronic components S1 are placed on the index table 14, the mold surface of each of the plurality of electronic components S1 faces upward.

[0049] The control unit 70 controls the transport unit 15 such that each picker PC1 holds the mold surface of any one of the plurality of electronic components S1 arranged on the index table 14 from above (step S130). In a state where the electronic component S1 is held by each picker PC1, the ball / lead surface of each electronic component S1 faces downward. After the electronic component S1 is held by the picker PC1, the control unit 70 controls the transport unit 15 to start transporting the electronic component S1 (step S140).

[0050] In the cutting device 1, the second optical inspection camera 13 is configured to automatically take images as the transport unit 15 arrives at a predetermined position. The second optical inspection camera 13 takes images upon receiving a shooting instruction via a hardware trigger, and the shooting instruction via the hardware trigger is given in response to the transport unit 15 arriving at a predetermined position. After the transport of the electronic components S1 has started and the transport unit 15 arrives at the predetermined position, the second optical inspection camera 13 automatically takes images of each electronic component S1 in sequence (step S150). The control unit 70 performs various inspections of each electronic component S1 based on the image data generated by the second optical inspection camera 13 (step S160). These inspections include, for example, an appearance inspection of the electronic component S1, an inspection of the tilt of the electronic component S1, and an inspection of the misalignment of the electronic component S1. Prior to the various inspections, the region showing the electronic component S1 included in the image captured by the second optical inspection camera 13 is identified. The captured image is, for example, a rectangular grayscale image, and the multiple pixels constituting the captured image are arranged in a grid. The pixel value of each pixel is represented, for example, in 256 gradations. In the captured image, for example, the area of ​​electronic component S1 is shown in black or gray, and the background of electronic component S1 is shown in white. In the captured image, the left and right edges of electronic component S1 in the captured image are identified by scanning the pixel values ​​of each row and extracting pixels whose pixel values ​​change rapidly. In the captured image, the top and bottom edges of electronic component S1 in the captured image are identified by scanning the pixel values ​​of each column and extracting pixels whose pixel values ​​change rapidly. This identifies the area of ​​electronic component S1 in the captured image.

[0051] Figure 5 is a flowchart showing the procedure for visual inspection of electronic component S1. The process shown in this flowchart is executed by the control unit 70 of the computer 50 after the region of electronic component S1 in the image captured by the second optical inspection camera 13 has been identified in step S160 of Figure 4. The process shown in the flowchart of Figure 5 is performed for each electronic component S1 being transported by the transport unit 15.

[0052] Referring to Figure 5, the control unit 70 determines whether or not there is a defect in the appearance of the ball / lead surface of the electronic component S1 based on the image data of the second optical inspection camera 13, and also determines whether or not it has been determined that there is no defect in the appearance of the molded surface of the electronic component S1 (step S200). Examples of appearance defects determined in step S200 include the size of the electronic component S1 not being within a specified range, the size of the electrodes provided on the ball / lead surface not being within a specified range, the distance between the electrodes provided on the ball / lead surface not being within a specified range, chipping occurring in the electronic component S1, and burrs being formed on the electronic component S1.

[0053] If it is determined that the electronic component S1 does not have any visible defects (YES in step S200), the control unit 70 decides to store the electronic component S1 in the good product storage member 16a (step S210). On the other hand, if it is determined that the electronic component S1 does have a visible defect (NO in step S200), the control unit 70 decides to store the electronic component S1 in the defective product storage member 16b (step S220). In other words, the control unit 70 makes a selection as to whether to store the electronic component S1 in the good product storage member 16a or the defective product storage member 16b.

[0054] Figure 6 is a flowchart showing the procedure for calculating the tilt of the electronic component S1. The process shown in this flowchart is performed by the control unit 70 of the computer 50 after the region of the electronic component S1 in the image captured by the second optical inspection camera 13 has been identified in step S160 of Figure 4. The process shown in the flowchart of Figure 6 is performed for each electronic component S1 being transported by the transport unit 15.

[0055] Referring to Figure 6, the control unit 70 calculates the rotation angle of the electronic component S1 based on the image of the electronic component S1 shown in the image data generated by the second optical inspection camera 13 (step S300). Here, the rotation angle of the electronic component S1 is the tilt of the electronic component S1 with the axis AX1 described above as the center of rotation.

[0056] Figure 7 is a diagram illustrating the procedure for calculating the rotation angle of electronic component S1. Referring to Figure 7, the captured image IM1 is an image captured by the second optical inspection camera 13. The captured image IM1 includes electronic component S1. Electronic component S1 has a rectangular shape and has sides SD1 and SD2. As described above, the rotation angle of electronic component S1 is the angle formed by the reference side and one side of electronic component S1 that is opposite the reference side. For example, if the left side LS1 of the captured image IM1 is the reference side, the control unit 70 calculates the rotation angle as the angle θ formed by the side SD1 of electronic component S1 opposite the left side LS1 and the left side LS1. Also, for example, if the bottom side LS2 of the captured image IM1 is the reference side, the control unit 70 calculates the rotation angle as the angle θ formed by the side SD2 of electronic component S1 opposite the bottom side LS2 and the bottom side LS2. Note that the vertical axis in the figure is parallel to the left side LS1, and the horizontal axis is parallel to the bottom side LS2.

[0057] Referring again to Figure 6, the control unit 70 calculates the difference between a reference angle (hereinafter also referred to as the "reference angle") stored in the memory unit 80 and the angle calculated in step S300 (step S310). As the reference angle, for example, the rotation angle of the electronic component S1 when it is ideally stored in the desired position of the storage member 16 is registered. In step S310, the rotation direction of the electronic component S1 is also calculated to offset the difference between the angle calculated in step S300 and the reference angle. As mentioned above, the electronic component S1 is rotated by the picker PC1 with axis AX1 as the center of rotation. The rotation directions include clockwise and counterclockwise. As will be described in detail later, after the electronic component S1 is rotated by the angle (amount of rotation) calculated in step S310 in the rotation direction calculated in step S310, the electronic component S1 is stored in the storage member 16. The storage member 16 is provided with, for example, a recess, and the electronic component S1 is stored in the recess. The bottom surface of the recess is rectangular in shape. The difference between the angle calculated in step S300 and the reference angle is canceled out by the rotation of the electronic component S1, so that the electronic component S1 is stored in the recess with each side of the bottom surface of the recess and each side of the electronic component S1 being parallel.

[0058] Figure 8 is a flowchart showing the procedure for calculating the displacement of the centroid of the region representing the electronic component S1. The process shown in this flowchart is executed by the control unit 70 of the computer 50 after the region of the electronic component S1 in the image captured by the second optical inspection camera 13 has been identified in step S160 of Figure 4. The process shown in the flowchart of Figure 8 is performed for each electronic component S1 being transported by the transport unit 15.

[0059] Referring to Figure 8, the control unit 70 calculates the position of the centroid of the region showing the electronic component S1 in the image based on the electronic component S1 included in the image shown by the image data generated by the second optical inspection camera 13 (step S400).

[0060] Figure 9 is a diagram illustrating the procedure for calculating the position of the centroid of the region showing the electronic component S1. Referring to Figure 9, the captured image IM2 is an image taken by the second optical inspection camera 13. The captured image IM2 includes the electronic component S1. The electronic component S1 has a rectangular shape and has vertices VX1, VX2, VX3, and VX4. The control unit 70 calculates the coordinates of the centroid CP1 based on the coordinates of each of the vertices VX1, VX2, VX3, and VX4.

[0061] Referring again to Figure 8, the control unit 70 calculates the difference between the aforementioned reference position and the position of the center of gravity calculated in step S400 (step S410). The reference position is stored in the storage unit 80. As the reference position, for example, the position of the center of gravity of the electronic component S1 in the image when the electronic component S1 is ideally stored in the desired position of the storage member 16 is registered. An example of a reference position is the reference position BP1 in Figure 9.

[0062] Referring again to Figure 4, once the various inspections are performed in step S160, the control unit 70 determines whether rotation is necessary for each picker PC1, and whether adjustment is necessary for at least one of the stopping positions of the transport unit 15 and the storage member 16 (step S170). If it is determined that rotation is not necessary for each picker PC1 and that no adjustment is necessary for both the stopping position of the transport unit 15 and the stopping position of the storage member 16 (NO in step S170), the process proceeds to step S190.

[0063] On the other hand, if it is determined that rotation is required for at least some of the pickers PC1, or that adjustment is required for at least one of the stopping positions of the transport unit 15 and the storage member 16 (YES in step S170), the control unit 70 controls the transport unit 15 or the storage member 16 so that the necessary processing is carried out. For example, the control unit 70 controls the rotation direction and amount of the pickers PC1 so that the difference between the rotation angle of the electronic component S1 held by the pickers PC1 and the reference angle is canceled out. The control unit 70 also controls the respective stopping positions of the transport unit 15 and the storage member 16 so that the difference between the center of gravity position of the electronic component S1 held by the pickers PC1 and the reference position is canceled out. As described above, the positional displacement along the X-axis is canceled out by the stopping position of the transport unit 15, and the positional displacement along the Y-axis is canceled out by the stopping position of the storage member 16.

[0064] Subsequently, the control unit 70 controls each picker PC1 so that the electronic component S1 is stored in the storage member 16 (storage member 16a for good products or storage member 16b for defective products) determined in step S160 (step S190). As a result, each electronic component S1 is stored in the appropriate position in the storage member 16 below the picker PC1.

[0065] [4. Features] As described above, in the cutting device 1 according to this embodiment, the photograph of the electronic component S1 held by the picker PC1 is taken while the electronic component S1 is moving. Therefore, with the cutting device 1, since the photograph of the electronic component S1 is taken in parallel with the transport of the electronic component S1, the time required to manufacture the electronic component S1 can be shortened compared to the case in which the photograph of the electronic component S1 is taken when the movement of the electronic component S1 is stopped.

[0066] The index table 14 is an example of a "table" in the present invention. The storage member 16 is an example of a "multiple storage members" in the present invention. Each picker PC1 is an example of a "conveyor" in the present invention. The control unit 70 is an example of a "control unit" in the present invention.

[0067] [5. Other Embodiments] The concept of the above embodiments is not limited to those described above. Examples of other embodiments to which the concept of the above embodiments can be applied will be described below.

[0068] <5-1> In the above embodiment, a tray with recesses for storing electronic components S1 was exemplified as the storage member 16. However, the storage member 16 does not necessarily have to be a tray. The storage member 16 may be composed of, for example, an adhesive member including an adhesive sheet to which a plurality of electronic components S1 are attached. In this case, the plurality of electronic components S1 are stored in the adhesive member by attaching the plurality of electronic components S1 to the adhesive sheet.

[0069] <5-2> In the above embodiment, the ball / lead surface of the electronic component S1 was photographed between the index table 14 and the storage member 16, and the visual inspection of the ball / lead surface was performed. However, the objects to be visually inspected between the index table 14 and the storage member 16 are not limited to this. For example, the side surface of the electronic component S1 may be photographed between the index table 14 and the storage member 16, and the visual inspection of the side surface may be performed.

[0070] <5-3> In the above embodiment, the electronic component S1 was stored in either the good product storage member 16a or the defective product storage member 16b. However, the storage location for the electronic component S1 is not necessarily limited to two types. There may be three or more types of storage locations for the electronic component S1. For example, the electronic component S1 may be classified into "good product," "defective product," and "product requiring re-inspection." Products requiring re-inspection may be re-inspected and then classified as good product or defective product.

[0071] Embodiments of the present invention have been described illustratively above. That is, a detailed description and accompanying drawings have been disclosed for illustrative purposes. Therefore, some of the components described in the detailed description and accompanying drawings may not be essential for solving the problem. Consequently, the mere fact that these non-essential components are described in the detailed description and accompanying drawings does not mean that they should be immediately assumed to be essential.

[0072] Furthermore, the above embodiments are merely illustrative in every respect of the present invention. The above embodiments can be improved or modified in various ways within the scope of the present invention. For example, at least a part of the configuration of one embodiment may be combined with at least a part of the configuration of any other embodiment. In other words, in carrying out the present invention, specific configurations can be appropriately adopted depending on the embodiment.

[0073] [6. Addendum] This specification discloses a variety of technical ideas, including at least the following technologies.

[0074] <Technology 1> (Configuration) A cutting device comprising: a cutting mechanism that cuts an object to be cut into multiple cut pieces; a table on which each of the multiple cut pieces is placed; multiple storage members; a transport body that holds one of the multiple cut pieces placed on the table, moves while holding the cut piece, and stores the held cut piece in one of the multiple storage members; an imaging unit that generates image data by photographing the held cut piece while it is moving; and a control unit that selects which of the multiple storage members to store the held cut piece in based on the image data, and controls the transport body according to the result of the selection. (Effects, etc.) In this cutting device, the photograph of the cut piece held by the transport body is taken while the cut piece is moving. Therefore, with this cutting device, since the photograph of the cut piece is taken in parallel with the transport of the cut piece, the time required to manufacture the cut piece can be shortened compared to the case in which the photograph of the cut piece is taken when the movement of the cut piece is stopped.

[0075] <Technology 2> (Configuration) The cutting apparatus according to Technology 1, wherein the control unit performs a visual inspection of the held cut product based on the image data and makes the selection according to the result of the visual inspection. (Effects, etc.) In this cutting apparatus, the visual inspection of the cut product is performed based on image data generated while the cut product is being moved. Therefore, with this cutting apparatus, the visual inspection of the cut product is performed in parallel with the transport of the cut product, so that the time required to manufacture the cut product can be further reduced.

[0076] <Technology 3> (Configuration) The cutting apparatus according to Technology 1 or Technology 2, wherein the transporter holds one of the plurality of cut pieces from above, rotates the held cut piece around an axis extending vertically through the held cut piece as the center of rotation, the imaging unit photographs the moving held cut piece from below, and the control unit controls the transporter to rotate the held cut piece based on the image data. (Effects, etc.) In this cutting apparatus, the cut piece held by the transporter rotates based on the image data. Therefore, with this cutting apparatus, the inclination of the cut piece in the rotation direction around the axis extending vertically as the center of rotation is suppressed, and the cut piece is stored in the storage member, thereby suppressing the occurrence of a situation in which the cut piece is not stored in the desired position in the storage member.

[0077] <Technology 4> (Configuration) The cutting apparatus according to Technology 3, wherein the control unit calculates the rotation direction and amount of rotation of the held cutting piece based on the image data, and controls the transporter to rotate the held cutting piece according to the calculated rotation direction and amount of rotation. (Effects, etc.) In this cutting apparatus, the rotation direction and amount of rotation of the cutting piece held by the transporter are calculated based on the image data, and the cutting piece held by the transporter rotates according to the calculated rotation direction and amount of rotation. Therefore, with this cutting apparatus, the cutting piece is stored in the storage member with the tilt of the cutting piece in the rotation direction with the axis extending in the vertical direction as the center of rotation suppressed, so that the occurrence of a situation in which the cutting piece is not stored in the desired position in the storage member can be suppressed.

[0078] <Technology 5> (Configuration) The cutting device according to any one of Technology 1 to Technology 4, wherein the transporter holds one of the plurality of cut pieces from above, moves while holding the cut piece, stops above one of the plurality of storage members, and then stores the held cut piece in the storage member below, the imaging unit photographs the held cut piece from below while it is moving, and the control unit controls the stopping position of the transporter above one of the plurality of storage members based on the image data. (Effects, etc.) In this cutting device, the stopping position of the transporter above one of the plurality of storage members is controlled based on image data. Therefore, with this cutting device, even if the central part of the cut piece is not held by the transporter, it is possible to suppress the occurrence of a situation in which the cut piece is not stored in the desired position in the storage member.

[0079] <Technology 6> (Configuration) The cutting apparatus according to Technology 5, wherein the control unit detects the amount of deviation of the center of gravity of the held cut product from a reference position based on the image data, and controls the stopping position based on the detected amount of deviation. (Effects, etc.) In this cutting apparatus, the stopping position of the conveyor above any one of the storage members among the plurality of storage members is controlled based on the amount of deviation of the center of gravity of the cut product held by the conveyor from a reference position. Therefore, with this cutting apparatus, even if the central part of the cut product is not held by the conveyor, it is possible to suppress the occurrence of a situation in which the cut product is not stored in the desired position in the storage member.

[0080] <Technology 7> (Configuration) A method for manufacturing cut products using a cutting device described in any one of Technology 1 to Technology 6, comprising: preparing the object to be cut; and cutting the object to be cut to divide the object into a plurality of cut products. (Effects, etc.) In this method for manufacturing cut products, the photograph of the cut product held by the conveyor is taken while the cut product is moving. Therefore, with this method for manufacturing cut products, the photograph of the cut product is taken in parallel with the conveying of the cut product, so the time required to manufacture the cut product can be shortened compared to the case in which the photograph of the cut product is taken when the movement of the cut product is stopped.

[0081] 1 Cutting device, 3 Substrate supply unit, 4 Positioning unit, 4a Rail unit, 5 Cutting table, 5a Holding member, 5b Rotation mechanism, 5c Movement mechanism, 5d First position confirmation camera, 5e First cleaner, 6 Cutting mechanism, 6a Blade, 6b Second position confirmation camera, 6c Rotation axis, 6d Spindle unit, 7 Transport unit, 7a Second cleaner, 11 Flipper, 12 First optical inspection camera, 13 Second optical inspection camera, 14 Index table, 15 Transport unit, 15a Base unit, 16 Storage member, 16a Storage member for good products, 16b Storage member for defective products, 20 Monitor, 50 Computer, 70 Control unit, 72 CPU, 74 RAM, 76 ROM, 80 Memory unit, 81 Control program, 90 Input / Output I / F, 95 Reception unit, A1 Cutting module, AX1 Axis, B1 Inspection and storage module, BP1 reference position, CP1 center of gravity, FL1 resin sheet, IM1, IM2 captured image, LS1 left edge, LS2 bottom edge, M1 magazine, P1 package substrate, PC1 picker, RT1 plate-shaped member, S1 electronic component, SD1, SD2 edges, VX1-VX4 vertices.

Claims

1. A cutting device comprising: a cutting mechanism that cuts an object to be cut into multiple individual cut pieces; a table on which each of the multiple cut pieces is placed; a plurality of storage members; a transport body that holds one of the multiple cut pieces placed on the table, moves while holding the cut piece, and stores the held cut piece in one of the plurality of storage members; an imaging unit that generates image data by photographing the held cut piece while it is moving; and a control unit that selects which of the plurality of storage members to store the held cut piece in based on the image data, and controls the transport body according to the result of the selection.

2. The cutting apparatus according to claim 1, wherein the control unit performs a visual inspection of the held cut product based on the image data and makes the selection according to the result of the visual inspection.

3. The cutting apparatus according to claim 1 or 2, wherein the transporter holds one of the plurality of cut pieces from above, rotates the held cut piece around an axis extending vertically through the held cut piece as the center of rotation, the imaging unit photographs the moving held cut piece from below, and the control unit controls the transporter to rotate the held cut piece based on the image data.

4. The cutting apparatus according to claim 3, wherein the control unit calculates the rotation direction and amount of rotation of the held cut piece based on the image data, and controls the conveyor to rotate the held cut piece according to the calculated rotation direction and amount of rotation.

5. The cutting device according to any one of claims 1 to 4, wherein the transporter holds one of the plurality of cut pieces from above, moves while holding the cut piece, stops above one of the plurality of storage members and then stores the held cut piece in a lower storage member, the imaging unit photographs the moving held cut piece from below, and the control unit controls the stopping position of the transporter above one of the plurality of storage members based on the image data.

6. The cutting apparatus according to claim 5, wherein the control unit detects the amount of deviation of the center of gravity of the held cut piece from a reference position based on the image data, and controls the stop position based on the detected amount of deviation.

7. A method for manufacturing a cut product using a cutting device according to any one of claims 1 to 6, comprising: preparing an object to be cut; and cutting the object to be cut to divide the object into a plurality of cut products.

Images