Piezoelectric vibrator module

Abstract

This piezoelectric vibrator module comprises: a piezoelectric vibrator; and an airtight film that has an inorganic film. The piezoelectric vibrator is provided with: a piezoelectric vibration element that has a piezoelectric piece and an excitation electrode provided to the piezoelectric piece; a first substrate that is provided so as to face the piezoelectric vibration element; a second substrate that forms, between the first substrate and the second substrate, an internal space in which the piezoelectric vibration element is accommodated; and a bonding part that seals the internal space. The airtight film covers, from among the outside of the piezoelectric vibrator, at least the outside of the bonding part.

Description

Piezoelectric vibrator module

[0001] The present invention relates to a piezoelectric vibrator module.

[0002] In various electronic devices such as mobile communication terminals, communication base stations, and home appliances, piezoelectric vibrating elements are used for applications such as timing devices, sensors, and oscillators. The piezoelectric vibrating element includes a piezoelectric piece having a pair of main surfaces, and a pair of excitation electrodes provided on the pair of main surfaces of the piezoelectric piece.

[0003] For example, Patent Document 1 discloses a piezoelectric vibrating component including a substrate, a piezoelectric vibrator held by the substrate, and a cap fixed to the substrate with an adhesive.

[0004] Japanese Patent No. 4947213

[0005] However, according to the piezoelectric vibrating component described in Patent Document 1, air or water vapor may intrude through the adhesive, causing the frequency to fluctuate in some cases.

[0006] The present invention has been made in view of such circumstances, and an object thereof is to provide a piezoelectric vibrator module capable of improving reliability.

[0007] A piezoelectric vibrator module according to one aspect of the present invention is a piezoelectric vibrator module including a piezoelectric vibrator and an airtight film having an inorganic film, wherein the piezoelectric vibrator includes a piezoelectric vibrating element having a piezoelectric piece and excitation electrodes provided on the piezoelectric piece, a first substrate disposed to face the piezoelectric vibrating element, a second substrate that forms an internal space for accommodating the piezoelectric vibrating element between the second substrate and the first substrate, and a joining portion that seals the internal space, and the airtight film covers at least the outer side of the joining portion on the outer side of the piezoelectric vibrator.

[0008] According to the present invention, a piezoelectric vibrator module capable of improving reliability can be provided.

[0009] This is a perspective view of a quartz crystal resonator module according to the first embodiment. This is a cross-sectional view of a quartz crystal resonator module according to the first embodiment. This is an enlarged cross-sectional view of an airtight membrane according to the first embodiment. This is an exploded perspective view of a quartz crystal resonator according to the first embodiment. This is a cross-sectional view of a quartz crystal resonator module according to the second embodiment. This is an exploded perspective view of a quartz crystal resonator according to the second embodiment. This is an enlarged cross-sectional view of an airtight membrane according to the third embodiment. This is an enlarged cross-sectional view of an airtight membrane according to the fourth embodiment.

[0010] Embodiments of the present invention are described below. In the following drawings, identical or similar components are denoted by identical or similar reference numerals. The drawings are illustrative, and the dimensions and shapes of each part are schematic; the technical scope of the present invention should not be limited to these embodiments.

[0011] Each drawing may include a Cartesian coordinate system consisting of the X, Y', and Z' axes for convenience, in order to clarify the relationships between the drawings and to help understand the positional relationships of each component. The X, Y', and Z' axes correspond to each other in each drawing. The X, Y', and Z' axes correspond to the crystal axes of the quartz substrate 11, which will be described later. The X axis corresponds to the electrical axis (polarity axis) of the quartz, the Y axis to the mechanical axis of the quartz, and the Z axis to the optical axis of the quartz. The Y' and Z' axes are axes obtained by rotating the Y and Z axes counterclockwise by θ degrees around the X axis, respectively, when viewed from the positive direction in the X-axis direction.

[0012] In the following explanation, the direction parallel to the X-axis is referred to as the "X-axis direction," the direction parallel to the Y'-axis as the "Y'-axis direction," and the direction parallel to the Z'-axis as the "Z'-axis direction." Furthermore, the direction of the arrowheads for the X-axis, Y'-axis, and Z'-axis is referred to as "positive" or "+ (plus)," and the direction opposite to the arrow is referred to as "negative" or "- (minus)." For convenience, the +Y'-axis direction will be described as upward and the -Y'-axis direction as downward, but the vertical orientation of the quartz oscillator 10 and the quartz resonator 1 is not limited. Also, the plane specified by the X-axis and Z'-axis will be referred to as the Z'X plane, and the same applies to the planes specified by the other axes.

[0013] <First Embodiment> First, the configuration of the crystal oscillator module 100 according to the first embodiment will be described with reference to Figures 1 to 4. Figure 1 is a perspective view of the crystal oscillator module 100 according to the first embodiment. Figure 2 is a cross-sectional view of the crystal oscillator module 100 according to the first embodiment. Figure 3 is an enlarged cross-sectional view of the airtight film 160 according to the first embodiment. Figure 4 is an exploded perspective view of the crystal oscillator 1 according to the first embodiment.

[0014] As shown in Figures 1 and 2, the quartz oscillator module 100 comprises a quartz oscillator 1, functional components 180, a circuit board 190, an airtight film 160, and a sealing resin 170. Hereinafter, the Y' axis direction will be referred to as the "thickness direction" of the quartz oscillator element 10.

[0015] The crystal oscillator module 100 is, for example, a temperature-compensated crystal oscillator (TCXO), a voltage-controlled crystal oscillator (VCXO), or an oven-controlled crystal oscillator (OCXO). The crystal oscillator module 100 is an example of a piezoelectric oscillator module.

[0016] The crystal oscillator 1 comprises a crystal oscillator element 10, a lower cover 20, an upper cover 30, a lower joint 40, and an upper joint 50. The lower cover 20, the crystal oscillator element 10, and the upper cover 30 are arranged in this order with spacing in the Y' axis direction. The crystal oscillator 1 corresponds to an example of a piezoelectric oscillator, and the crystal oscillator element 10 corresponds to an example of a piezoelectric oscillator. The upper cover 30 corresponds to an example of a first substrate, and the lower cover 20 corresponds to an example of a second substrate. The upper joint 50 corresponds to an example of a first joint, and the lower joint 40 corresponds to an example of a second joint.

[0017] The quartz oscillator 10 is an electromechanical energy conversion element that converts electrical energy and mechanical energy mutually through the piezoelectric effect. As shown in Figure 4, the quartz oscillator 10 has a vibrating part 110, a holding part 120, and a support part 130.

[0018] The vibrating section 110 is excited at a predetermined resonant frequency based on the applied alternating voltage. As shown in Figure 2, the vibrating section 110 is held in a vibrable position within an internal space 39 provided between the lower cover 20 and the upper cover 30. The main vibration of the vibrating section 110 is, for example, the thickness-shear vibration mode.

[0019] Furthermore, the main vibration of the vibrating section 110 is not limited to the thickness sliding vibration mode, but may also be, for example, a thickness longitudinal vibration mode, a spreading vibration mode, a length vibration mode, or a bending vibration mode.

[0020] The holding portion 120 is the part for holding the vibrating portion 110. The holding portion 120, together with the lower cover 20, the upper cover 30, the lower joint portion 40, and the upper joint portion 50, forms an internal space 39 that defines the range of motion of the vibrating portion 110. When viewed from above, the holding portion 120 is provided in a frame shape that surrounds the vibrating portion 110, with a gap between them. The support portion 130 supports the vibrating portion 110 and causes the holding portion 120 to hold the vibrating portion 110. The support portion 130 connects the vibrating portion 110 and the holding portion 120.

[0021] As shown in Figure 4, the quartz oscillator 10 comprises a quartz substrate 11, a first excitation electrode 14a, a second excitation electrode 14b, a first extraction electrode 15a, a second extraction electrode 15b, a first connecting electrode 16a, and a second connecting electrode 16b.

[0022] As shown in Figures 2 and 4, the quartz substrate 11 is continuously provided across the vibrating section 110, the holding section 120, and the support section 130. The quartz substrate 11 has an upper surface 11A and a lower surface 11B that face each other. The upper surface 11A is located on the side facing the upper cover 30. The lower surface 11B is located on the side facing the lower cover 20. The upper surface 11A and the lower surface 11B correspond to a pair of main surfaces of the quartz substrate 11. The quartz substrate 11 corresponds to an example of a piezoelectric element.

[0023] The quartz substrate 11 is, for example, an AT-cut type quartz crystal. In an AT-cut type quartz crystal, the XZ' plane is the main plane, and the thickness is in the direction parallel to the Y' axis. The AT-cut type quartz substrate 11 is cut out using the XZ' plane as the main plane, with the Y' axis and Z' axis being the axes obtained by rotating the Y and Z axes around the X axis by 35 degrees 15 minutes ± 1 minute 30 seconds from the Y axis to the Z axis, respectively.

[0024] The quartz oscillator 10 using an AT-cut quartz substrate 11 exhibits high frequency stability over a wide temperature range. Furthermore, the AT-cut quartz oscillator has excellent aging characteristics and can be manufactured at low cost.

[0025] The cut angle of the quartz crystal is not limited to the above. The rotation angles of the Y' and Z' axes in the AT-cut quartz substrate 11 may be tilted in the range of 35 degrees 15 minutes to -5 degrees or more, or +15 degrees or less. In addition, different cuts other than AT cut may be applied to the quartz crystal, such as BT cut, GT cut, SC cut, etc.

[0026] As an example, as shown in Figure 4, the shape of the crystal substrate 11 in the vibrating section 110 when viewed in plan in the thickness direction (hereinafter simply referred to as "plan view") is rectangular, having a pair of short sides extending in the Z' direction and a pair of long sides extending in the X direction. The plan shape of the crystal substrate 11 in the holding section 120 is a rectangular frame shape having a pair of short sides extending in the Z' direction and a pair of long sides extending in the X direction. The plan shape of the crystal substrate 11 in the support section 130 is a quadrilateral shape having a pair of sides connecting the vibrating section 110 and the holding section 120.

[0027] As an example, as shown in Figure 2, the crystal substrate 11 in the vibrating section 110 is a flat plate with a thickness that is approximately constant regardless of its position. The crystal substrate 11 in the holding section 120 is a flat plate with a thickness that is approximately constant regardless of its position. Furthermore, the thickness of the crystal substrate 11 in the holding section 120 is greater than, for example, the thickness of the crystal substrate 11 in the vibrating section 110. The crystal substrate 11 in the support section 130 is a flat plate with a thickness that is approximately constant regardless of its position. Furthermore, the thickness of the crystal substrate 11 in the support section 130 is approximately equal to, for example, the thickness of the crystal substrate 11 in the vibrating section 110.

[0028] The planar shape and thickness of the quartz substrate are not limited to those described above. For example, the planar shape of the quartz substrate in the vibrating part may be rectangular with a long side extending in the Z' direction and a short side extending in the X direction, or it may be square with a side extending in the Z' direction and a side extending in the X direction. The planar shape of the quartz substrate in the vibrating part may be rectangular with sides extending along directions intersecting both the Z' direction and the X direction. The planar shape of the quartz substrate in the vibrating part may be polygonal, circular, elliptical, or a combination thereof. Similarly, the planar shape of the quartz substrate in the support part may be polygonal, circular, elliptical, or a combination thereof. The planar shape of the quartz substrate in the holding part may be a frame shape formed by a polygon, circular, elliptical, or a combination thereof.

[0029] Furthermore, for example, the quartz substrate in the vibrating section may have a mesa-type structure or an inverted mesa-type structure having irregularities on at least one of its upper and lower surfaces. The quartz substrate in the vibrating section may have a convex structure in which the amount of thickness change changes continuously, or a bevel structure in which the amount of thickness change changes discontinuously. The thickness of the quartz substrate in the holding section may be approximately equal to the thickness of the quartz substrate in the vibrating section, or it may be less than the thickness of the quartz substrate in the vibrating section. The thickness of the quartz substrate in the support section may be greater than the thickness of the quartz substrate in the vibrating section or the holding section, or it may be less than the thickness of the quartz substrate in the vibrating section or the holding section.

[0030] The first excitation electrode 14a and the second excitation electrode 14b excite the crystal substrate 11 by applying an alternating voltage to it. The first excitation electrode 14a and the second excitation electrode 14b are located in the central part of the vibrating section 110. The first excitation electrode 14a is located on the upper surface 11A, and the second excitation electrode 14b is located on the lower surface 11B. The first excitation electrode 14a and the second excitation electrode 14b face each other in the Y' axis direction with the crystal substrate 11 in between.

[0031] The first excitation electrode 14a has a rectangular shape with a short side extending in the Z' axis direction and a long side extending in the X axis direction. The first excitation electrode 14a also has thickness in the Y' axis direction. The second excitation electrode 14b has a similar shape.

[0032] The planar shapes of the first and second excitation electrodes are not limited to those described above. The planar shapes of the first and second excitation electrodes may be rectangular with a short side extending in the X-axis direction, or square with sides extending in the X-axis direction and sides extending in the Z'-axis direction. The planar shapes of the first and second excitation electrodes may be rectangular with sides extending along directions intersecting both the Z'-axis direction and the X-axis direction. The planar shapes of the first and second excitation electrodes may be polygonal, circular, elliptical, or a combination thereof.

[0033] The first extraction electrode 15a electrically connects the first excitation electrode 14a and the first connecting electrode 16a, and the second extraction electrode 15b electrically connects the second excitation electrode 14b and the second connecting electrode 16b. The first extraction electrode 15a and the second extraction electrode 15b are provided across the vibrating section 110, the support section 130, and the holding section 120.

[0034] The first connecting electrode 16a and the second connecting electrode 16b electrically connect the quartz oscillator 10 to the lower cover 20. The first connecting electrode 16a and the second connecting electrode 16b are provided on the lower surface 11B of the quartz substrate 11. For example, the first connecting electrode 16a and the second connecting electrode 16b are each provided at corners located diagonally opposite the holding portion 120 in a plan view.

[0035] The first excitation electrode 14a, the first extraction electrode 15a, and the first connecting electrode 16a are integrally provided. The same applies to the second excitation electrode 14b, the second extraction electrode 15b, and the second connecting electrode 16b. These electrodes of the quartz oscillator 10 are, for example, single-layer structures made of aluminum layers, but are not limited to this. The electrodes of the quartz oscillator 10 may also be multilayer structures in which a base layer and a surface layer are stacked in that order. For example, the base layer is a chromium (Cr) layer with good adhesion to the quartz substrate 11, and the surface layer is a gold (Au) layer with good chemical stability. The electrodes of the quartz oscillator 10 may also contain silver (Ag), copper (Cu), titanium (Ti), molybdenum (Mo), or aluminum-copper alloy (AlCu).

[0036] As shown in Figure 2, the lower cover 20 is positioned opposite the vibrating portion 110, holding portion 120, and support portion 130 of the quartz oscillator 10 with a gap in the Y' axis direction. As shown in Figure 4, the lower cover 20 has a quartz substrate 21, power terminals ST1 and ST2, and dummy terminals DT1 and DT2.

[0037] The quartz substrate 21 is a flat substrate that overlaps substantially the entire quartz oscillator 10 in a plan view. The quartz substrate 21 is formed from a quartz crystal with the same cut angle as the quartz substrate 11 of the quartz oscillator 10. This reduces thermal stress caused by differences in the coefficient of thermal expansion and the direction of thermal expansion between the quartz oscillator 10 and the lower cover 20. As a result, fluctuations in the frequency of the quartz oscillator 10 are suppressed. The quartz substrate 21 has an upper surface 21A provided on the side of the quartz oscillator 10 and a lower surface 21B provided on the opposite side of the upper surface 21A. When viewed from above, the quartz substrate 21 has a long side extending along the X-axis and a short side extending along the Z'-axis. A notch is formed at the corner where the short side and the long side of the quartz substrate 21 connect. The area of ​​the quartz substrate 21 in a plan view is smaller than the area of ​​the quartz substrate 31 in a plan view, by the amount of this notch. The shape of the side surface formed by the notch at the corner of the quartz substrate 21 is, for example, planar. However, the shape of the side surface formed by the notch at the corner of the quartz substrate 21 is not limited to this, and may be a curved surface that is part of the side surface of a cylinder or a rectangular prism.

[0038] Power terminals ST1, ST2 and dummy terminals DT1, DT2 are provided on the lower surface 21B of the crystal substrate 21. Power terminals ST1, ST2 and dummy terminals DT1, DT2 correspond to examples of external terminals of the crystal oscillator 1. Power terminals ST1 and ST2 are for supplying a drive signal (drive voltage) to the crystal oscillator 1. Power terminal ST1 is electrically connected to the first connecting electrode 16a via a notch in the corner of the crystal substrate 21 and a side electrode provided on the outer surface of the lower joint 40. Power terminal ST2 is electrically connected to the second connecting electrode 16b via a notch in the corner of the crystal substrate 21 and a side electrode provided on the outer surface of the lower joint 40. Dummy terminals DT1 and DT2 are for balancing electrical characteristics such as capacitance and mechanical strength between them and power terminals ST1 and ST2. Dummy terminals DT1 and DT2 are so-called floating electrodes that are not electrically connected to the crystal oscillator 10.

[0039] At least one of the dummy terminals DT1 and DT2 may be a grounding electrode that electrically grounds a portion of the crystal oscillator 1.

[0040] As shown in Figure 2, the top cover 30 is positioned opposite the bottom cover 20, with a gap in the Y' axis direction relative to the vibrating portion 110, holding portion 120, and support portion 130 of the quartz oscillator 10. As shown in Figure 4, the top cover 30 has a quartz substrate 31.

[0041] The quartz substrate 31 is a flat substrate that overlaps substantially the entire quartz oscillator 10 in a plan view. The quartz substrate 31 is formed from quartz crystals with the same cut angle as the quartz substrate 11 of the quartz oscillator 10. This reduces thermal stress caused by differences in the coefficient of thermal expansion and the direction of thermal expansion between the quartz oscillator 10 and the top cover 30. As a result, fluctuations in the frequency of the quartz oscillator 10 are suppressed. The quartz substrate 31 has a lower surface 31B provided on the side of the quartz oscillator 10 and an upper surface 31A provided on the opposite side from the lower surface 31B. When viewed from above, the quartz substrate 31 is rectangular in shape, with a long side extending along the X-axis and a short side extending along the Z'-axis.

[0042] Note that the cut angles of the crystal substrates 21 and 31 included in the lower lid 20 and the upper lid 30 are not particularly limited, and may be different from the cut angle of the crystal substrate 11 included in the crystal resonator element 10. Further, the lower lid 20 and the upper lid 30 may include a glass substrate, a silicon substrate, a ceramic substrate, a metal substrate, or a composite substrate obtained by combining these, instead of the crystal substrates 21 and 31.

[0043] As shown in FIG. 4, the lower joint portion 40 and the upper joint portion 50 are provided in a frame shape along the holding portion 120 of the crystal resonator element 10. The lower joint portion 40 joins the holding portion 120 of the crystal resonator element 10 and the end portion of the lower lid 20. The upper joint portion 50 joins the holding portion 120 of the crystal resonator element 10 and the end portion of the upper lid 30. The lower joint portion 40 and the upper joint portion 50 have a single-layer structure composed of an adhesive layer provided by an organic adhesive containing, for example, an epoxy-based, vinyl-based, acrylic-based, urethane-based, or silicone-based resin.

[0044] Note that the lower joint portion 40 and the upper joint portion 50 may have a multilayer structure including an inorganic insulating layer, an organic insulating layer, or a metal layer. The adhesive layers of the lower joint portion 40 and the upper joint portion 50 are not limited to organic adhesives, and may be provided by a silicon-based adhesive containing water glass or the like. The material of the lower joint portion 40 and the upper joint portion 50 may be low-melting-point glass (for example, lead borate-based, tin phosphate-based, etc.). The lower joint portion 40 and the upper joint portion 50 may have a eutectic alloy layer containing gold (Au), tin (Sn), copper (Cu), titanium (Ti), aluminum (Al), germanium (Ge), silicon (Si), or at least one of these. From the viewpoints of reducing raw material costs, streamlining manufacturing processes, and saving energy, it is preferable that the lower joint portion 40 and the upper joint portion 50 are provided with an organic adhesive rather than a metal material such as a eutectic alloy.

[0045] The functional component 180 is an electronic component that causes the crystal resonator 1 to function. The functional component 180 is electrically connected to the crystal resonator 1. The functional component 180 is, for example, a thermistor that measures the temperature of the crystal resonator element 10, or an IC including an oscillation circuit, a compensation circuit, or the like of the crystal resonator element 10.

[0046] The circuit board 190 mounts the crystal oscillator 1 and the functional component 180. As shown in FIG. 2, the circuit board 190 includes a substrate 191, electrode portions 192A, 192B, 194A, 194B, and connection portions 193A, 193B, 195A, 195B.

[0047] The substrate 191 is a flat plate-shaped resin substrate made of a resin such as polyimide resin, polyester resin, epoxy resin, or phenol resin. The substrate 191 has an upper surface 191A provided on the side of the crystal oscillator 1 and the functional component 180, and a lower surface 191B provided on the side opposite to the upper surface 191A. Circuits are printed on the upper surface 191A and the lower surface 191B of the substrate 191 by a conductor, for example. Although not illustrated, the substrate 191 is provided with through holes that electrically connect the circuit on the upper surface 191A side and the circuit on the lower surface 191B side.

[0048] Note that the substrate 191 is not limited to a resin substrate, and may be an inorganic substrate made of glass, ceramic, silicon or the like, or may be a metal substrate made of iron, copper, aluminum or the like.

[0049] The electrode portions 192A, 192B, 194A, 194B are provided on the upper surface 191A of the substrate 191. The electrode portions 192A and 192B are parts for electrically connecting the circuit provided on the upper surface 191A side of the substrate 191 to the crystal oscillator 1. The electrode portions 194A and 194B are parts for electrically connecting the circuit provided on the upper surface 191A side of the substrate 191 to the functional component 180.

[0050] The connection portions 193A and 193B fix the crystal oscillator 1 to the circuit board 190, and electrically connect the crystal oscillator 1 and the circuit board 190. The connection portions 195A and 195B fix the functional component 180 to the circuit board 190, and electrically connect the functional component 180 and the circuit board 190. The connection portions 193A, 193B, 195A, 195B are, for example, metal solder.

[0051] The airtight film 160 prevents oxygen and water vapor from entering the internal space 39 of the quartz crystal oscillator 1. The airtightness of the airtight film 160 is higher than that of the lower joint 40 and the upper joint 50. Furthermore, the airtightness of the airtight film 160 is higher than that of the sealing resin 170. As shown in Figure 2, the airtight film 160 covers the outside of the quartz crystal oscillator 1, the outside of the functional component 180, and the side of the circuit board 190 facing the quartz crystal oscillator 1.

[0052] The outside of the crystal oscillator 1 refers to the surfaces of the crystal oscillator element 10, the lower cover 20, the upper cover 30, the lower joint 40, and the upper joint 50 that are on the side opposite to the internal space 39 of the crystal oscillator 1. For the lower cover 20, the outside refers to the surface facing the circuit board 190 and the outer surface. For the upper cover 30, the outside refers to the surface opposite to the crystal oscillator element 10 and the outer surface. For the lower joint 40 and the upper joint 50, the outside refers to the outer surface.

[0053] The airtight film 160 covers the entire outside of the quartz oscillator 1, but is not limited to this; it is sufficient if it covers at least the entire outside of the lower joint 40 and the upper joint 50. In this case, it is desirable that the airtight film 160 covers the boundary between the lower joint 40 and the lower cover 20, the boundary between the lower joint 40 and the quartz oscillator 10, the boundary between the upper joint 50 and the upper cover 30, and the boundary between the upper joint 50 and the quartz oscillator 10. It is desirable that the airtight film 160 covers the entire outside of the quartz oscillator 10, the entire outside of the lower cover 20, and the entire outside of the upper cover 30.

[0054] The airtight film 160 covering the outside of the functional component 180 is specifically provided on the outside of the functional component 180 and covers the entire surface. The airtight film 160 covering the circuit board 190 specifically covers the upper surface 191A of the substrate 191, the surfaces of the electrode portions 192A, 192B, 194A, 194B, and the surfaces of the connection portions 193A, 193B, 195A, 195B.

[0055] The airtight film 160 is formed on the circuit board 190, the quartz oscillator 1, and the functional component 180 after the quartz oscillator 1 and functional component 180 have been mounted on the circuit board 190. Therefore, it is not provided on the connection surfaces between the electrode portions 192A, 192B, 194A, 194B and the connection portions 193A, 193B, 195A, 195B, the connection surfaces between the connection portions 193A, 193B and the quartz oscillator 1, and the connection surfaces between the connection portions 195A, 195B and the functional component 180.

[0056] As shown in Figure 3, the airtight film 160 has an inorganic film 161 and an organic film 162. The inorganic film 161 has higher airtightness than the organic film 162 and is responsible for the airtightness of the airtight film 160. The inorganic film 161 covers the outside of the quartz crystal oscillator 1. In other words, the inorganic film 161 is in contact with the quartz crystal oscillator 1. The inorganic film 161 is, for example, an aluminum oxide (alumina) film, a silicon oxide (silica) film, or a silicon nitride film, but is not limited to these as long as it has airtightness. The inorganic film 161 is deposited by a dry process such as chemical vapor deposition (CVD) or physical vapor deposition (PVD), but may also be deposited by a wet process.

[0057] The organic film 162 assists in the airtightness of the inorganic film 161. Furthermore, the organic film 162 has a lower elastic modulus than the inorganic film 161, and plays a role in mitigating external shocks and internal stresses. The organic film 162 covers the outside of the inorganic film 161. That is, the organic film 162 is provided between the inorganic film 161 and the sealing resin 170 (described later), and is in contact with both the inorganic film 161 and the sealing resin 170. The organic film 162 is, for example, a parylene film, a polyimide film, or a liquid crystal polymer (LCP), but is not limited to these. The organic film 162 is deposited, for example, by a dry process, but may also be deposited by a wet process. For example, after the quartz crystal oscillator 1 and functional components 180 are mounted on the circuit board 190, the inorganic film 161 is deposited on the surfaces of the circuit board 190, the quartz crystal oscillator 1, and the functional components 180, and then the organic film 162 is deposited on the surface of the inorganic film 161.

[0058] The sealing resin 170 protects the quartz oscillator 1 from external shocks and contamination. The sealing resin 170 also assists in the airtightness of the airtight membrane 160. The sealing resin 170 covers the airtight membrane 160. The sealing resin 170 contains orientation fillers to adjust its elastic modulus and coefficient of thermal expansion.

[0059] As described above, the crystal oscillator module 100 comprises a crystal oscillator 1 and an airtight film 160 having an inorganic film 161. The crystal oscillator 1 comprises a crystal substrate 11 and a crystal oscillator element 10 having a first excitation electrode 14a and a second excitation electrode 14b provided on the crystal substrate 11, an upper cover 30 provided opposite the crystal oscillator element 10, a lower cover 20 forming an internal space 39 for housing the crystal oscillator element 10 between itself and the upper cover 30, and a lower joint portion 40 and an upper joint portion 50 sealing the internal space 39. The airtight film 160 covers the outside of the crystal oscillator 1, at least the outside of the lower joint portion 40 and the upper joint portion 50.

[0060] According to this, compared to a configuration without the airtight film 160, the intrusion of outside air such as oxygen and water vapor into the internal space 39 of the quartz crystal resonator 1 can be suppressed, thereby suppressing the change in the frequency of the quartz crystal resonator 1 over time. For example, after 1000 cycles of temperature cycling between -55°C and 105°C, and then 1000 hours of processing in a constant temperature and humidity environment of 85°C and 85 RH, the frequency fluctuation rate was about 1.7 ppm for a quartz crystal resonator module with the airtight film 160 omitted, while it was suppressed to about 0.3 ppm for the quartz crystal resonator module 100. In this way, even when each part expands and contracts due to temperature cycling, the airtightness of the quartz crystal resonator module 100 is maintained. Furthermore, since the quartz crystal resonator module 100 can be manufactured using a quartz crystal resonator 1 that has undergone characteristic testing, the occurrence of defective products in the quartz crystal resonator module 100 can be suppressed. Thus, according to this embodiment, a quartz crystal resonator module 100 with improved reliability is provided.

[0061] In one embodiment described above, the lower joint 40 and the upper joint 50 have an adhesive layer provided by an organic adhesive.

[0062] According to this, even if the lower joint 40 and the upper joint 50 have an adhesive layer that is more likely to become a pathway for outside air to enter compared to the quartz oscillator 10, the lower cover 20, and the upper cover 30, it is possible to sufficiently suppress the intrusion of outside air into the internal space 39 of the quartz oscillator 1 and suppress the change in the frequency of the quartz oscillator 1 over time.

[0063] In one embodiment described above, the airtight membrane 160 covers the outside of the upper cover 30 and the lower cover 20.

[0064] According to this, the entry of outside air into the internal space 39 of the quartz oscillator 1, using the upper cover 30 and the lower cover 20 as entry points, can also be suppressed. Furthermore, the entry of outside air through the lower joint 40 and the upper joint 50, using the interface between the quartz oscillator 1 and the airtight film 160 as an entry point, can also be suppressed.

[0065] In one embodiment described above, the airtight membrane 160 further comprises an organic membrane 162.

[0066] According to this, the organic film 162 assists in the airtightness of the inorganic film 161, thereby further suppressing the intrusion of outside air into the internal space 39 of the quartz oscillator 1. In addition, the organic film 162 relieves the stress transmitted to the inorganic film 161. Therefore, damage to the inorganic film 161 is suppressed. Consequently, the intrusion of outside air into the internal space 39 of the quartz oscillator 1, using damaged areas of the inorganic film 161 as entry points, can be suppressed.

[0067] In one embodiment described above, the organic film 162 covers the outside of the inorganic film 161.

[0068] According to this, the organic film 162 can alleviate the stress propagating from the outside of the quartz crystal module 100 to the inorganic film 161.

[0069] In one embodiment described above, the crystal oscillator module 100 further includes a circuit board 190 on which a crystal oscillator 1 is mounted, and the hermetically sealed film 160 further covers the side of the circuit board 190 facing the crystal oscillator 1.

[0070] According to this, the entry of outside air into the internal space 39 of the crystal oscillator 1, using the circuit board 190 as the entry point, can also be suppressed. Therefore, a resin substrate with low airtightness can be used as the circuit board 190.

[0071] In one embodiment described above, the circuit board 190 further comprises a functional component 180 mounted on it, and the airtight film 160 further covers the outside of the functional component 180.

[0072] According to this, the functional component 180 can be protected from the influence of the external environment. Therefore, malfunctions of the functional component 180 can be suppressed.

[0073] In one embodiment described above, the functional component 180 includes a thermistor or an IC.

[0074] According to this method, the influence of the external environment and degradation over time in thermistors or ICs can be suppressed.

[0075] In one embodiment described above, the quartz crystal oscillator module 100 further comprises a sealing resin 170 that covers the hermetically sealed film 160.

[0076] According to this, the sealing resin 170 assists in the airtightness of the airtight film 160, thereby further suppressing the intrusion of outside air into the internal space 39 of the quartz oscillator 1. In addition, since the sealing resin 170 protects the airtight film 160 from the influence of the external environment, damage to the inorganic film 161 is suppressed. Therefore, the intrusion of outside air into the internal space 39 of the quartz oscillator 1, using damaged areas of the inorganic film 161 as entry points, can be suppressed.

[0077] In one embodiment described above, the quartz crystal oscillator module 100 further comprises a sealing resin 170 covering the airtight film 160, and the airtight film 160 further comprises an organic film 162 provided between the sealing resin 170 and the inorganic film 161.

[0078] According to this, the organic film 162 mitigates the propagation of stress to the inorganic film 161 due to curing shrinkage when the sealing resin 170 is applied, thereby suppressing damage to the inorganic film 161. Therefore, it is possible to suppress the intrusion of outside air into the internal space 39 of the quartz oscillator 1, using the damaged area of ​​the inorganic film 161 as an entry point.

[0079] In one embodiment described above, the sealing resin 170 contains an inorganic filler.

[0080] According to this, damage to the inorganic film 161 is suppressed by adjusting the coefficient of linear expansion and elastic modulus of the sealing resin 170 with an inorganic filler. Therefore, it is possible to suppress the intrusion of outside air into the internal space 39 of the quartz oscillator 1, which would otherwise use the damaged areas of the inorganic film 161 as entry points.

[0081] In one embodiment described above, the lower joint 40 and the upper joint 50 include an upper joint 50 that joins the upper cover 30 and the crystal oscillator 10, and a lower joint 40 that joins the lower cover 20 and the crystal oscillator 10.

[0082] According to this, even in a configuration where there are two joints, a lower joint 40 and an upper joint 50, which serve as entry points for outside air, it is possible to sufficiently suppress the intrusion of outside air into the internal space 39 of the quartz oscillator 1.

[0083] Other embodiments are described below. Components identical or similar to those shown in the first embodiment are denoted by the same or similar reference numerals, and their descriptions are omitted as appropriate. Furthermore, similar effects and benefits from similar components are not mentioned sequentially.

[0084] <Second Embodiment> Next, the configuration of the crystal oscillator module 200 according to the second embodiment will be described with reference to Figures 5 and 6. Figure 5 is a cross-sectional view of the crystal oscillator module 200 according to the second embodiment. Figure 6 is an exploded perspective view of the crystal oscillator 2 according to the second embodiment.

[0085] The crystal oscillator module 200 according to the second embodiment differs from the crystal oscillator module 100 according to the first embodiment in that the configuration of the crystal oscillator 2 is different.

[0086] The crystal oscillator 2 includes a crystal oscillator element 210, a base member 230, a cover member 240, and a joint 250. The base member 230 corresponds to an example of a first substrate, and the cover member 240 corresponds to an example of a second substrate.

[0087] The quartz crystal oscillator 210 comprises a thin quartz crystal element 211, a first excitation electrode 214a and a second excitation electrode 214b constituting a pair of excitation electrodes, a first extraction electrode 215a and a second extraction electrode 215b constituting a pair of extraction electrodes, and a first connecting electrode 216a and a second connecting electrode 216b constituting a pair of connecting electrodes.

[0088] The quartz substrate 11 has an upper surface 211A and a lower surface 211B that face each other. The upper surface 211A is located on the side facing the top wall portion 241 of the lid member 240, which will be described later. The lower surface 211B is located on the side facing the base member 230. The upper surface 211A and the lower surface 211B correspond to a pair of main surfaces of the quartz piece 211. The planar shape of the quartz piece 211 is rectangular, having a pair of short sides extending in the Z' axis direction and a pair of long sides extending in the X axis direction. As an example, the shape of the quartz piece 211 is a flat plate with a uniform thickness.

[0089] The first excitation electrode 214a and the second excitation electrode 214b are located in the central part of the quartz crystal 211 in a plan view. The first extraction electrode 215a is located from the upper surface 211A to the lower surface 211B of the quartz crystal 211, and the second extraction electrode 215b is located on the lower surface 211B of the quartz crystal 211. The first connecting electrode 216a and the second connecting electrode 216b are located on the lower surface 211B of the quartz crystal 211.

[0090] The base member 230 holds the quartz oscillator 210 in a viable manner. The base member 230 comprises a base body 231, connecting electrodes 233a, 233b, leading electrodes 234a, 234b, and external electrodes 235a, 235b, 235c, 235d.

[0091] The substrate 231 is a plate-shaped insulator having an upper surface 231A and a lower surface 231B that face each other in the thickness direction. The upper surface 231A is located on the side facing the quartz oscillator 10 and the lid member 240, and corresponds to the mounting surface on which the quartz oscillator 210 is mounted. From the viewpoint of suppressing thermal stress acting from the substrate 231 to the quartz oscillator 10 due to thermal history such as reflow soldering, it is preferable that the substrate 231 be made of a heat-resistant material. From a similar viewpoint, the substrate 231 may be made of a material having a coefficient of thermal expansion close to that of the quartz crystal 211. The substrate 231 may be made of, for example, a ceramic substrate, a glass substrate, or a quartz substrate.

[0092] The corner portion of the base body 231 has a notched side surface in which a part is formed in a cylindrical curved shape (also called a castellation shape). However, the shape of the corner portion of the base body 231 is not limited to this. The corner portion of the base body 231 may have a notched side surface formed in a prismatic shape, or it may be a nearly right-angle corner portion without a notch.

[0093] The connecting electrodes 233a and 233b are electrically connected to the quartz crystal oscillator 210. The connecting electrode 233a is electrically connected to the first connecting electrode 216a of the quartz crystal oscillator 210, and the connecting electrode 233b is connected to the second connecting electrode 216b of the quartz crystal oscillator 210.

[0094] The lead electrode 234a electrically connects the connecting electrode 233a and the external electrode 235a, and the lead electrode 234b electrically connects the connecting electrode 233b and the external electrode 235b. The lead electrodes 234a and 234b are provided on the upper surface 231A of the base body 231.

[0095] External electrodes 235a and 235b are external terminals for electrically connecting the quartz oscillator 210 to an external substrate (not shown). External electrode 235a electrically connects the first excitation electrode 214a of the quartz oscillator 210 to the external substrate, and external electrode 235b electrically connects the second excitation electrode 214b of the quartz oscillator 210 to the external substrate. One of the external electrodes 235c and 235d is a ground electrode that grounds the cover member 240, and the other is a dummy electrode that is not electrically connected to the quartz oscillator 210 or the cover member 240. Each of the external electrodes 235a, 235b, 235c, and 235d is continuously provided from the notched side surface to the bottom surface 231B, which is provided at the four corners of the base body 231. In the example shown in Figure 6, external electrodes 235a and 235b are located diagonally opposite each other on the lower surface 231B of the substrate 231, while external electrodes 235c and 235d are located diagonally opposite each other on the lower surface 231B of the substrate 231.

[0096] Conductive holding members 236a and 236b are provided on the base member 230 on the side of the quartz oscillator 210. Conductive holding members 236a and 236b electrically connect the base member 230 and the quartz oscillator 210 and mechanically hold the quartz oscillator 210. Conductive holding member 236a electrically connects the first connecting electrode 216a of the quartz oscillator 210 to the connecting electrode 233a of the base member 230. Conductive holding member 236b electrically connects the second connecting electrode 216b of the quartz oscillator 210 to the connecting electrode 233b of the base member 230. Conductive holding members 236a and 236b are cured products of a conductive adhesive containing a thermosetting resin or a photocurable resin. The main component of conductive holding members 236a and 236b is, for example, a cured product of silicone resin. The conductive retaining members 236a and 236b contain conductive particles, and for example, metal particles containing silver (Ag) are used as such conductive particles.

[0097] The conductive retaining members 236a and 236b are not limited to cured silicone resins, but may also be cured epoxy resins or the like. Furthermore, the conductive particles contained in the conductive retaining members 236a and 236b are not limited to silver particles, but may be formed from other metals, conductive ceramics, conductive organic materials, etc. The conductive retaining members 236a and 236b may also contain conductive polymers.

[0098] The lid member 240 forms an internal space 239 between itself and the base member 230 in which the quartz crystal oscillator 210 is housed. The lid member 240 has a top wall portion 241 and side wall portions 242 extending from the outer periphery of the top wall portion 241 toward the base member 230. The top wall portion 241 faces the base member 230 in the Y' axis direction, with the quartz crystal oscillator 210 in between. The side wall portions 242 surround the quartz crystal oscillator 210 with a gap in the XZ' plane direction. The material of the lid member 240 is preferably a conductive material, and more preferably a highly airtight metallic material. By making the lid member 240 out of a conductive material, an electromagnetic shielding function that reduces the inflow and outflow of electromagnetic waves into and out of the internal space 239 can be provided to the lid member 240. From the viewpoint of suppressing the generation of thermal stress, it is desirable that the material of the lid member 240 be a material having a coefficient of thermal expansion close to that of the base member 230, for example, an Fe-Ni-Co alloy whose coefficient of thermal expansion near room temperature matches that of glass or ceramic over a wide temperature range. The lid member 240 is electrically connected to at least one of the external electrodes 35c and 35d by a grounding member (not shown).

[0099] Furthermore, the material of the lid member is not limited to conductive materials. The lid member may be made of an insulating material such as ceramic. In this case, when the electrode provided on the main surface of the base member crosses the joint, an electrical short circuit will not occur through the lid member. For this reason, it is not necessary to electrically isolate the electrode and the lid member at the joint, and the thickness of the joint can be reduced. When the lid member is made of ceramic, it is desirable to use the same material for the base member's substrate and the lid member from the viewpoint of suppressing the generation of thermal stress.

[0100] The joint portion 250 joins the base member 230 and the lid member 240, sealing the internal space 239. The joint portion 250 is provided in a frame shape surrounding the quartz oscillator 210 along the end portion of the side wall portion 242 of the lid member 240 that is on the base member 230 side (hereinafter referred to as the "tip portion"). The joint portion 250 is sandwiched between the tip portion of the side wall portion 242 of the lid member 240 and the upper surface 231A of the base member 230.

[0101] As shown in Figure 5, the joint 250 has an insulating film 252 and an adhesive layer 251. The insulating film 252 is provided between the adhesive layer 251 and the lid member 240. The adhesive layer 251 is provided between the base member 230 and the insulating film 252. The insulating film 252 is made of an organic insulating material. The adhesive layer 251 is made of an organic adhesive.

[0102] The insulating film 252 covers the leading edge of the side wall portion 242 of the lid member 240. The insulating film 252 insulates the base member 230 from the lid member 240. The insulating film 252 also increases the contact area with the joint portion 250, thereby improving the bonding strength. Furthermore, the insulating film 252 reduces fluctuations in the thickness of the adhesive layer 251 caused by positional changes of the leading edge of the side wall portion 242 due to waviness in the lid member 240. In other words, because the flatness of the leading edge of the insulating film 252 is higher than the flatness of the leading edge of the side wall portion 242, the decrease in bonding strength and sealing performance due to fluctuations in the thickness of the adhesive layer 251 is suppressed.

[0103] The outside of both the insulating film 252 and the adhesive layer 251 is covered by the airtight film 160. The outside of the base member 230 and the lid member 240 are also covered by the airtight film 160.

[0104] As described above, in the crystal oscillator module 200, the joint 250 connects the base member 230 and the cover member 240.

[0105] According to this, since the joint 250 connects the base member 230 and the lid member 240, which are made of different materials and shapes, the joint 250 is prone to being subjected to load. Even with this configuration, it is possible to sufficiently suppress the intrusion of outside air using the joint 250 as an entry point.

[0106] <Third Embodiment> Next, the configuration of the crystal oscillator module 300 according to the third embodiment will be described with reference to Figure 7. Figure 7 is an enlarged cross-sectional view of the airtight film 360 according to the third embodiment.

[0107] The third embodiment differs from the first embodiment in that the airtight film 360 has a three-layer structure. The airtight film 360 has an organic film 369 covering the outside of the quartz crystal oscillator 1, an inorganic film 361 covering the outside of the organic film 369, and an organic film 362 covering the outside of the inorganic film 361. The organic film 369 is in contact with the quartz crystal oscillator 1. The inorganic film 361 is in contact with the organic film 369 and the organic film 362, and is provided between the organic film 369 and the organic film 362. The organic film 362 is in contact with the inorganic film 361 and the sealing resin 170, and is provided between the inorganic film 361 and the sealing resin 170. The organic film 369 assists in the airtightness of the inorganic film 361. In addition, the organic film 369 mitigates the stress propagating from the quartz crystal oscillator 1 to the inorganic film 361, suppressing damage to the inorganic film 361. Therefore, according to this embodiment, it is possible to provide a crystal oscillator module 300 with even greater reliability.

[0108] <Fourth Embodiment> Next, the configuration of the quartz crystal resonator module 400 according to the fourth embodiment will be described with reference to Figure 8. Figure 8 is an enlarged cross-sectional view of the airtight film 460 according to the fourth embodiment.

[0109] The fourth embodiment differs from the first embodiment in that the airtight film 460 has a five-layer structure. The airtight film 460 has an organic film 469 covering the outside of the quartz crystal oscillator 1, an inorganic film 461 covering the outside of the organic film 469, an organic film 462 covering the outside of the inorganic film 461, an inorganic film 463 covering the outside of the organic film 462, and an organic film 464 covering the outside of the inorganic film 463. The organic film 469 is in contact with the quartz crystal oscillator 1. The inorganic film 461 is in contact with the organic film 469 and the organic film 462, and is provided between the organic film 469 and the organic film 462. The organic film 462 is in contact with the inorganic film 461 and the inorganic film 463, and is provided between the inorganic film 461 and the inorganic film 463. The inorganic film 463 is in contact with the organic film 462 and the organic film 464, and is provided between the organic film 462 and the organic film 464. The organic film 464 is in contact with the inorganic film 463 and the sealing resin 170, and is provided between the inorganic film 463 and the sealing resin 170. The airtightness of the airtight film 460 is further improved by having two inorganic films. Therefore, according to this embodiment, it is possible to provide a crystal oscillator module 400 with even greater reliability.

[0110] In the first to fourth embodiments, airtight membranes with two, three, and five layers were described, but the layer structure of the airtight membrane is not limited to the configurations of the first to fourth embodiments as long as it contains an inorganic film. The airtight membrane may be a single layer, a four-layer structure, or a multilayer structure with six or more layers. Furthermore, the order in which the inorganic film and organic film are layered is not limited.

[0111] In this specification, a quartz crystal resonator comprising a quartz crystal element has been described as an example of a piezoelectric element, but the piezoelectric resonator is not limited to this. Suitable piezoelectric elements for use in the piezoelectric resonator according to this embodiment include, for example, piezoelectric ceramics such as lead zirconate titanate (PZT) and aluminum nitride, and piezoelectric single crystals such as lithium niobate and lithium tantalate, but are not limited to these and can be appropriately selected.

[0112] The embodiments of the present invention are not particularly limited and can be applied as appropriate to any device that performs electromechanical energy conversion by the piezoelectric effect, such as timing devices, sound generators, oscillators, and load sensors.

[0113] As described above, according to one aspect of the present invention, it is possible to provide a piezoelectric vibrator module that can improve reliability.

[0114] The embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit its interpretation. The present invention can be modified or improved without departing from its spirit, and equivalents thereof are also included. That is, embodiments and / or modifications made by those skilled in the art are also included in the scope of the present invention, as long as they retain the features of the present invention. For example, the elements and their arrangement, materials, conditions, shapes, sizes, etc., of the embodiments and / or modifications are not limited to those exemplified and can be modified as appropriate. Furthermore, the embodiments and modifications are illustrative, and it goes without saying that partial substitution or combination of the configurations shown in different embodiments and / or modifications is possible, and these are also included in the scope of the present invention as long as they retain the features of the present invention.

[0115] 100… Crystal Vibrator Model 1… Crystal Vibrator 10… Crystal Vibrator Element 11… Crystal Substrate 11A… Top 11B… Bottom 14a… First Excitation Electrode 14b… Second Excitation Electrode 15a… First Lead-Out Electrode 15b… Second Lead-Out Electrode 16a… First Connection Electrode 16b… Second Connection Electrode 20… Bottom Cover 21… Crystal Substrate 21A… Top 21B… Bottom ST1, ST2… Power Terminals DT1, DT2… Damping Terminal 30… Top Cover 31… Crystal Substrate 31A… Top 31B… Bottom 39… Internal Space 40… Lower Joint 50… Upper Joint 160… Airtight Film 161… Inorganic Film 162… Organic Film 170… Sealing Resin 180… Functional Components 190… Circuit Board

Claims

1. A piezoelectric vibrator module comprising a piezoelectric vibrator and an airtight film having an inorganic film, wherein the piezoelectric vibrator comprises a piezoelectric vibrating element having a piezoelectric piece and an excitation electrode provided on the piezoelectric piece, a first substrate provided opposite to the piezoelectric vibrating element, a second substrate forming an internal space for housing the piezoelectric vibrating element between itself and the first substrate, and a joint portion sealing the internal space, and the airtight film covers the outside of the piezoelectric vibrator, at least the outside of the joint portion.

2. The piezoelectric vibrator module according to claim 1, wherein the joint portion has an adhesive layer provided by an organic adhesive.

3. The piezoelectric vibrator module according to claim 1 or 2, wherein the airtight film covers the outside of the first substrate and the second substrate.

4. The piezoelectric vibrator module according to any one of claims 1 to 3, wherein the airtight membrane further comprises an organic membrane.

5. The piezoelectric vibrator module according to claim 4, wherein the organic film covers the outside of the inorganic film.

6. The piezoelectric vibrator module according to any one of claims 1 to 5, further comprising a circuit board on which the piezoelectric vibrator is mounted, wherein the airtight film further covers the side of the circuit board facing the piezoelectric vibrator.

7. The piezoelectric vibrator module according to claim 6, further comprising a functional component mounted on the circuit board, wherein the airtight film further covers the outside of the functional component.

8. The piezoelectric vibrator module according to claim 7, wherein the functional component includes a thermistor or an IC.

9. The piezoelectric vibrator module according to any one of claims 1 to 8, further comprising a sealing resin covering the hermetically sealed film.

10. The piezoelectric vibrator module according to claim 1, further comprising a sealing resin covering the airtight film, wherein the airtight film further comprises an organic film provided between the sealing resin and the inorganic film.

11. The piezoelectric vibrator module according to claim 9 or 10, wherein the sealing resin contains an inorganic filler.

12. The piezoelectric vibrator module according to any one of claims 1 to 11, wherein the joint portion comprises a first joint portion for joining the first substrate and the piezoelectric vibrator element, and a second joint portion for joining the second substrate and the piezoelectric vibrator element.

13. The piezoelectric vibrator module according to any one of claims 1 to 11, wherein the joint is used to join the first substrate and the second substrate.

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