Semiconductor package and method for manufacturing semiconductor package

Abstract

The present invention improves reliability of a semiconductor package in which a cavity is sealed by a transparent member. The semiconductor package is provided with a support member, a semiconductor chip, and the transparent member. In this semiconductor package, a step is formed along each of the frame-like four sides on the outer periphery of a light receiving surface of the support member. The semiconductor chip is connected to the support member by a wire. The inside of the transparent member relative to a cut surface is adhered, with an adhesive agent, to an adhesion region of the light receiving surface of the support member, the adhesive region being positioned inside the steps.

Description

Semiconductor package and method for manufacturing semiconductor package

[0001] The present technology relates to a semiconductor package. Specifically, the present technology relates to a semiconductor package in which a semiconductor chip is provided in a cavity, and a method for manufacturing the semiconductor package.

[0002] Conventionally, when an image sensor such as a CIS (CMOS Image Sensor) is provided in a semiconductor package, the image sensor is arranged, for example, in a cavity formed by bonding a frame-shaped member to a substrate. For example, a semiconductor package has been proposed in which a frame-shaped rib having a low step portion formed along the outer periphery is bonded to a substrate, and a transparent member is bonded to the upper surface of the rib for sealing (see, for example, Patent Document 1).

[0003] Japanese Unexamined Patent Application Publication No. 2005-079537

[0004] In the above-described conventional technology, by forming the low step portion along the outer periphery of the rib, the volume of the adhesive is secured when the transparent member is bonded, so as to improve the bonding reliability. However, in the above-described conventional technology, the substrate and the frame-shaped rib are integrally formed of resin, and the rib and the transparent member are simultaneously diced and cut after the transparent member is bonded to the upper surface of the rib. For this reason, the adhesive necessarily reaches the cut surface of the transparent member. When the adhesive reaches the cut surface of the transparent member, cracks starting from the cut surface, appearance defects due to adhesive peeling, poor hermeticity and the like occur, which reduces the reliability of the semiconductor package.

[0005] The present technology has been created in view of such circumstances, and an object thereof is to improve reliability in a semiconductor package having a cavity sealed by a transparent member.

[0006] This technology was developed to solve the aforementioned problems, and its first aspect is a semiconductor package comprising a support member having steps formed along each of the four sides of the outer circumference of a frame-shaped light-receiving surface, a semiconductor chip connected to the support member by wires, and a transparent member of the light-receiving surface whose inner side, beyond the cut surface, is bonded with adhesive to the adhesive region inside the steps, and a method for manufacturing the same. This has the effect of suppressing the reach of adhesive to the cut surface of the transparent member.

[0007] Furthermore, in this first aspect, the support member comprises a frame-shaped frame and a flat substrate to which the frame is bonded, the step is formed on the light-receiving surface of the frame, and the semiconductor chip may be connected to the substrate. This has the effect of improving the reliability of the semiconductor package with the frame.

[0008] Furthermore, in this first aspect, the height from the substrate of the region of the light-receiving surface inside the step may be higher than the height of the region outside the step. This results in excess adhesive accumulating in the region outside the step.

[0009] Furthermore, in this first aspect, grooves may be formed along each of the four sides of the outer circumference of the frame, and the step may occur at the boundary between the groove and the adhesive area. This results in excess adhesive accumulating in the groove.

[0010] Furthermore, in this first aspect, the height of the outer region of the frame from the substrate may be higher than the adhesive region inside the groove. This has the effect of suppressing the overflow of adhesive to the outside of the groove.

[0011] Furthermore, in this first aspect, the frame may be provided with fastening holes formed on the outside of the cut surface. This provides the effect of fixing the semiconductor package to a housing or the like.

[0012] Furthermore, in this first aspect, the frame may be made of resin. This has the effect of making it easier to create steps.

[0013] Furthermore, in this first aspect, the frame may be made of metal. This has the effect of improving the strength of the frame.

[0014] Furthermore, in this first aspect, the corners of the outer periphery of the bonding region, as viewed from the optical axis direction, may be chamfered. This has the effect of distributing stress on the corners.

[0015] Furthermore, in this first aspect, the corners of the outer periphery of the bonding region, as viewed from the optical axis direction, may be rounded. This has the effect of distributing the stress on the corners.

[0016] Furthermore, in this first aspect, the support member may be a substrate with a cavity formed on it, and the step may be formed on the light-receiving surface outside the cavity. This eliminates the need for the process of mounting the frame.

[0017] Furthermore, a second aspect of this technology is a semiconductor package comprising a support member having protrusions formed along the outer circumference of a frame-shaped light-receiving surface, a semiconductor chip connected to the support member by wire bonding, and a transparent member having steps formed along its outer circumference, with the area outside the steps being bonded to the protrusions by adhesive. This has the effect of suppressing the reach of adhesive to the cut surface of the transparent member.

[0018] Furthermore, a third aspect of this technology is a semiconductor package comprising a transparent member, a support member to which the adhesive region inside the cut surface of the transparent member is bonded, and a semiconductor chip connected to the support member by a wire. This has the effect of suppressing the reach of adhesive to the cut surface of the transparent member.

[0019] This is a cross-sectional view showing an example of the configuration of a semiconductor package in the first embodiment of this technology. This is an example of an enlarged view of a semiconductor package and a top view of a frame in the first embodiment of this technology. This is an example of a cross-sectional view of a semiconductor package when grooves are formed in the frame in the first embodiment of this technology. This is a diagram for explaining the manufacturing method of a semiconductor package in the first embodiment of this technology. This is a diagram for explaining the manufacturing method when multiple semiconductor packages are molded together in the first embodiment of this technology. This is a cross-sectional view showing an example of the configuration of a semiconductor package in the first embodiment of this technology when no steps are formed. This is an example of a top view of a frame in the first modified example of the first embodiment of this technology. This is an example of a cross-sectional view of a semiconductor package in a comparative example and in the first modified example of the first embodiment of this technology. This is a cross-sectional view showing an example of the configuration of a semiconductor package in the second modified example of the first embodiment of this technology. This is a cross-sectional view showing an example of the configuration of a semiconductor package in the third modified example of the first embodiment of this technology. This is a cross-sectional view showing an example of the configuration of a semiconductor package in the second embodiment of this technology. This is a diagram for explaining the manufacturing method of a semiconductor package in the second embodiment of this technology. This is a cross-sectional view showing an example of the configuration of a semiconductor package in the third embodiment of this technology. This is a block diagram showing an example of the schematic configuration of a vehicle control system. This is an explanatory diagram showing an example of the installation location of the external information detection unit and the imaging unit.

[0020] The following describes the embodiments for implementing this technology (hereinafter referred to as "embodiments"). The description will proceed in the following order: 1. First embodiment (example with a step in the frame) 2. Second embodiment (example with a step in the substrate with a cavity formed) 3. Third embodiment (example with a step in the transparent member) 4. Application example to a mobile body

[0021] <1. First Embodiment> [Example of Semiconductor Package Configuration] Figure 1 is a cross-sectional view showing an example of the configuration of a semiconductor package 200 in the first embodiment of the present technology. This semiconductor package 200 comprises a transparent member 210, a frame 220, a ceramic IP (InterPoser) substrate 230, and a sensor chip 240. For example, glass is used as the transparent member 210.

[0022] The ceramic IP substrate 230 is a flat interposer substrate made of ceramic. The ceramic IP substrate 230 is an example of the substrate described in the claims.

[0023] Hereinafter, a predetermined axis parallel to the substrate plane of the ceramic IP substrate 230 will be referred to as the "X-axis," and an axis perpendicular to that substrate plane will be referred to as the "Z-axis." Furthermore, an axis perpendicular to the X-axis and Z-axis will be referred to as the "Y-axis." The figure shows a cross-sectional view from the Y-axis direction.

[0024] Incident light is incident on one of the two sides of the sensor chip 240 through the transparent member 210. Hereinafter, the light-receiving side of the transparent member 210, frame 220, ceramic IP substrate 230, and sensor chip 240 will be referred to as the "top surface" or "light-receiving surface," and the side opposite to the light-receiving side will be referred to as the "bottom surface."

[0025] The frame 220 is a frame-shaped member that is bonded to the upper surface of the ceramic IP substrate 230 with an adhesive 251 (such as an adhesive resin). For example, resin is used as the material for this frame 220. The space surrounded by the ceramic IP substrate 230 and the frame 220 is for housing the sensor chip 240 and is called a cavity. The member consisting of the bonded frame 220 and ceramic IP substrate 230 is an example of a support member described in the claims.

[0026] As the sensor chip 240, for example, an image sensor such as a CIS or a Time of Flight (ToF) sensor chip can be used. This sensor chip 240 is placed in the cavity and electrically connected to the upper surface of the ceramic IP substrate 230 by wires 252. Note that the sensor chip 240 is an example of a semiconductor chip described in the claims.

[0027] Furthermore, the transparent member 210 is bonded to the upper surface (i.e., the light-receiving surface) of the frame 220 by adhesive 251. A step is also formed on the upper surface of the frame 220. Details of the step will be described later.

[0028] Figure 2 shows an enlarged view of a semiconductor package and an example of a top view of a frame in the first embodiment of this technology. In Figure 2, a shows an enlarged view of the area enclosed by the dashed line in Figure 1. In Figure 2, b shows a top view of the frame 220.

[0029] As illustrated in Figure 2a, a step is formed on the upper surface (light-receiving surface) of the frame 220 at a position inside (left side in the figure) of coordinate X3 of the cut surface of the transparent member 210. In the figure, the height from the ceramic IP substrate 230 in the area of ​​the light-receiving surface of the frame 220 inside (left side) of coordinate X1 is higher than the area outside of it, and a step is formed at this position. In addition, a slope is formed in the area from coordinate X1 to coordinate X2. The area of ​​the light-receiving surface of the frame 220 inside the step is designated as the "adhesion area," and this adhesion area is bonded to the area of ​​the lower surface of the transparent member 210 inside the cut surface.

[0030] Furthermore, the thick line in the figure b indicates the location of the step. As illustrated in figure b, a step is formed along each of the four sides of the outer circumference of the frame 220 when viewed from the Z-axis (i.e., optical axis) direction. This step corresponds to the outer circumference of the adhesive area. As illustrated in figure b, the shape of the outer circumference of the adhesive area is rectangular.

[0031] As illustrated in figures a and b, by forming steps along each of the four sides of the outer circumference of the frame 220, inward from the cut surface of the transparent member 210, the spread of the adhesive 251 can be prevented. In addition, since excess adhesive 251 accumulates outside the steps, it is possible to suppress the reach of the adhesive 251 to the cut surface of the transparent member 210 and the creeping of the adhesive 251 onto the cut surface. By preventing the spread of the adhesive 251 and suppressing its reach to the cut surface, the reliability of the semiconductor package 200 can be improved. Furthermore, by providing steps, even if misalignment occurs when mounting the transparent member 210, the adhesive width remains constant, thus ensuring stable adhesive quality.

[0032] Note that the cross-sectional shape of the frame 220 is not limited to that shown as exemplified in figure a.

[0033] For example, as illustrated in Figure 3a, grooves can be formed along each of the four sides of the light-receiving surface of the frame 220. For instance, a groove is formed in the region from coordinates X1 to X2 inside the cut surface of the transparent member 210. This groove creates a step at coordinate X1, which is the boundary between the groove and the adhesive region inside it. The position of this step is inside the cut surface of the transparent member 210.

[0034] In Figure a, a straight slope is formed between the boundary of the groove (coordinates X1 and X2) and the bottom of the groove, but a curved slope can also be formed, as illustrated in Figure b.

[0035] Furthermore, while the heights of the outer and inner sides of the groove are the same in figures a and b, the configuration is not limited to this. For example, as illustrated in figure c, the height of the outer side of the groove (right side in the figure) can be made higher than the height of the inner side of the groove. This suppresses the overflow of adhesive 251 to the outside of the groove.

[0036] [Method for Manufacturing Semiconductor Packages] A method for manufacturing the semiconductor package 200 in the first embodiment will be described with reference to Figure 4.

[0037] As illustrated at a in the same figure, an adhesive is applied to the upper surface of the ceramic IP substrate 230, and the sensor chip 240 is fixed (that is, die-bonded).

[0038] Then, as illustrated at b in the same figure, electrode terminals (not shown) on the upper surface of the sensor chip 240 are electrically connected to external terminals (not shown) on the upper surface of the ceramic IP substrate 230 by wires 252.

[0039] Then, as illustrated at c in the same figure, the lower surface of the frame 220, in which a step is formed in advance, is bonded to the upper surface of the ceramic IP substrate 230.

[0040] Then, as illustrated at d in the same figure, the transparent member 210 is bonded to the upper surface of the frame 220 with the adhesive 251, and the cavity is sealed.

[0041] Note that, as illustrated in FIG. 5, a plurality of semiconductor packages 200 can also be collectively molded using the collective substrate 231.

[0042] In this case, for example, as illustrated at a in the same figure, a plurality of sensor chips 240 are fixed (die-bonded) to the upper surface of the collective substrate 231.

[0043] Then, as illustrated at b in the same figure, each of the plurality of sensor chips 240 is electrically connected to the ceramic IP substrate 230 by wires 252.

[0044] Then, as illustrated at c in the same figure, the lower surface of a member in which a plurality of frames 220 are integrated is bonded to the upper surface of the collective substrate 231.

[0045] Then, as illustrated at d in the same figure, the transparent member 210 is bonded to the upper surface of each of the plurality of frames 220 with the adhesive 251.

[0046] Then, as illustrated at e in the same figure, the collective substrate 231 is singulated by dicing.

[0047] Note that, as illustrated in FIG. 6, a configuration in which no step is provided in the frame 220 can also be adopted. In this case, as exemplified by a and b in the same figure, the coordinate X1 of the end of the adhesion region of the frame 220 is arranged inside the coordinate X3 of the cut surface of the transparent member 210. By performing adhesion in the adhesion region on the inner side of the cut surface of the transparent member 210, the adhesive 251 can be prevented from reaching the cut surface. As exemplified by a in the same figure, the coordinate X2 of the end of the frame 220 may be between the coordinate X1 and the coordinate X3, or as exemplified by b in the same figure, the coordinate X2 may be outside the coordinate X3. It should be noted that each of the first to third modified examples of the first embodiment described later and the second embodiment using a substrate provided with a cavity can be applied to the configuration of the same figure.

[0048] As described above, according to the first embodiment of the present technology, since the step is formed on the inner side of the cut surface of the transparent member 210 along each of the four sides of the outer periphery of the frame 220, spreading of the adhesive 251 is prevented, and the adhesive 251 can be suppressed from reaching the cut surface. Thereby, the reliability of the semiconductor package 200 can be improved.

[0049] [First Modified Example] In the above-described first embodiment, the outer periphery of the adhesion region inside the step is rectangular when viewed from the Z-axis (optical axis) direction, but the shape of the outer periphery is not limited to a rectangle. The semiconductor package 200 according to the first modified example of the first embodiment differs from the first embodiment in that the shape of the corner of the outer periphery of the adhesion region is changed.

[0050] FIG. 7 is an example of a top view of the frame 220 in the first modified example of the first embodiment of the present technology. As exemplified by a in the same figure, in the first modified example of the first embodiment of the present technology, the corner of the adhesion region inside the step on the top surface of the frame 220 is C-chamfered.

[0051] Alternatively, as exemplified by b in the same figure, the corner of the outer periphery of the adhesion region can be rounded. With the shapes of a and b in the same figure, stress at the corner when thermal stress is generated can be dispersed.

[0052] Here, we consider a configuration in which the frame 220 does not have a step and the outer perimeter of the adhesive area is rectangular as a comparative example.

[0053] Figure 8 shows examples of cross-sectional views of semiconductor packages in a comparative example and in the first embodiment of the present technology. In the figure, a is a cross-sectional view of the semiconductor package of the comparative example, and b is a cross-sectional view of the semiconductor package in the first modified example of the first embodiment.

[0054] As illustrated in figure a, in the comparative example, for example, the distance from coordinate X0 to coordinate X3 is the adhesive width. Also, the distance from coordinate X0 to coordinate X5 is the width of the frame 220.

[0055] In contrast, as illustrated in figure b, in the first modified example of the first embodiment, the distance from coordinate X0 to X1 is the adhesive width, and the distance from coordinate X0 to X4 is the width of the frame 220.

[0056] As illustrated in figures a and b, by providing a step in the frame 220 and distributing stress by chamfering (or rounding) the corners of the bonding area, the bonding width can be shortened compared to the comparative example. Furthermore, the size of the frame 220 can be reduced compared to the comparative example, allowing for miniaturization of the semiconductor package 200.

[0057] Thus, according to the first modification of the first embodiment of this technology, the corners of the bonding area are chamfered (or rounded), which allows the stress on the corners to be distributed.

[0058] [Second Modification] In the first embodiment described above, a frame 220 without holes was used, but fastening holes can also be formed in the frame 220. The semiconductor package 200 in this second modification of the first embodiment differs from the first embodiment in that fastening holes are formed in the frame 220.

[0059] Figure 9 is a cross-sectional view showing an example configuration of a semiconductor package 200 in a second modified example of the first embodiment of the present technology.

[0060] As illustrated in figure a, in the second modification of the first embodiment, a frame 221 with fastening holes 222 is used instead of a frame 220 without fastening holes. The fastening holes 222 are formed on the outside of the cut surface of the transparent member 210. The semiconductor package 200 can be fixed to a housing or the like using these fastening holes 222.

[0061] As illustrated in figure b, an organic IP substrate 232 can be used instead of the ceramic IP substrate 230. Various components such as connectors 261 and capacitors 262 can be mounted on the underside of this organic IP substrate 232.

[0062] Furthermore, the organic IP substrate 232 can be used in embodiments and modifications other than the second modification of the first embodiment.

[0063] Furthermore, the second modification can be applied to the first modification of the first embodiment.

[0064] Thus, according to the second modification of the first embodiment of this technology, fastening holes are formed in the frame 220, so that the semiconductor package 200 can be fixed to a housing or the like.

[0065] [Third Modification] In the first embodiment described above, a resin frame 220 was used, but the material of the frame 220 is not limited to resin. The semiconductor package 200 in this third modification of the first embodiment differs from the first embodiment in that it uses a metal frame.

[0066] Figure 10 is a cross-sectional view showing one example configuration of a semiconductor package 200 in a third modification of the first embodiment of the present technology.

[0067] As illustrated in figure a, in the third modification of the first embodiment, a metal frame 225 is used instead of the resin frame 220. A step is formed on the light-receiving surface of the frame 225, similar to the first embodiment. The frame 225 is formed, for example, by cutting or die-casting.

[0068] When machining is performed, aluminum alloy or stainless steel is selected as the material for frame 225. When die casting is performed, aluminum alloy, zinc alloy, magnesium alloy, copper alloy is selected as the material for frame 225.

[0069] The frame 225 can also be formed by press working. Press working allows for larger steps, for example, as illustrated in figure b. When press working is performed, materials such as ferrous steel sheets, stainless steel sheets, aluminum alloys, copper alloys, titanium, and magnesium alloys can be selected for the frame 225.

[0070] As described above, using a metal frame 225 makes it possible to improve strength compared to a resin frame 220.

[0071] Furthermore, the third modified example can be applied to each of the first and second modified examples of the first embodiment.

[0072] Thus, according to the third modification of the first embodiment of this technology, since a metal frame 225 is used, the strength of the frame can be improved compared to the first embodiment.

[0073] <2. Second Embodiment> In the first embodiment described above, a cavity was formed by the frame 220 and the flat ceramic IP substrate 230, but instead, a substrate with a cavity formed on it can also be used. The semiconductor package 200 in this second embodiment differs from the first embodiment in that it uses a substrate with a cavity formed on it.

[0074] Figure 11 is a cross-sectional view showing an example configuration of a semiconductor package 200 in a second embodiment of the present technology. In the figure, a shows a cross-sectional view of the semiconductor package 200 in the second embodiment. In the figure, b shows an enlarged view of the portion enclosed by the dashed line in a.

[0075] As illustrated in Figure a, the semiconductor package 200 in the second embodiment differs from the first embodiment in that it includes a ceramic IP substrate 235 instead of a frame 220 and a ceramic IP substrate 230. A recess is formed in the ceramic IP substrate 235, and the space inside this recess is used as a cavity. The ceramic IP substrate 235 is an example of a support member as described in the claims.

[0076] As illustrated in figure b, the ceramic IP substrate 235 has a step formed on the upper surface (light-receiving surface) outside the cavity.

[0077] Referring to Figure 12, the manufacturing method for the semiconductor package 200 in the second embodiment will be described.

[0078] As illustrated in figure a, adhesive is applied to the upper surface inside the cavity of the ceramic IP substrate 235, and the sensor chip 240 is fixed (die-bonded).

[0079] As illustrated in figure b, the electrode terminals (not shown) on the upper surface of the sensor chip 240 are electrically connected by wire 252 to external terminals (not shown) in the cavity of the ceramic IP substrate 235.

[0080] Then, as illustrated in figure c, the transparent member 210 is bonded to the outer upper surface (light-receiving surface) of the cavity of the ceramic IP substrate 235 with adhesive 251, thereby sealing the cavity. As illustrated in the figure, in the second embodiment, the process of mounting the frame 220 is unnecessary.

[0081] Thus, according to the second embodiment of this technology, since a ceramic IP substrate 235 with a cavity formed on it is used, the process of mounting the frame 220 becomes unnecessary.

[0082] <3. Third Embodiment> In the first embodiment described above, a step was formed in the frame 220, but the embodiment is not limited to this configuration. The semiconductor package 200 in this third embodiment differs from the first embodiment in that a step is formed on the lower surface of the transparent member 210.

[0083] Figure 13 is a cross-sectional view showing an example configuration of a semiconductor package 200 in a third embodiment of the present technology. The semiconductor package 200 in the third embodiment differs from the first embodiment in that a step is formed on the lower surface of the transparent member 210. For example, the thickness of the transparent member 210 outside coordinate X1 (right side in the figure) is thinner than that inside coordinate X1, and a step is created at that position.

[0084] Furthermore, a protrusion is formed along the outer circumference of the upper surface (light-receiving surface) of the frame 220. This protrusion is bonded to the area outside the step on the lower surface of the transparent member 210 by adhesive 251. For example, the height of the area from coordinates X2 to X3 on the upper surface of the frame 220 is higher than the other areas, and this part corresponds to the protrusion.

[0085] The dimensions of each part of the transparent member 210 and the frame 220 are set taking into consideration not only that the adhesive 251 does not reach the cut surface of the transparent member 210, but also that the strength of the transparent member 210 decreases due to thinning.

[0086] As described above, according to the third embodiment of this technology, a step is formed on the lower surface of the transparent member 210, which prevents the adhesive 251 from spreading during bonding and suppresses its reaching the cut surface. This improves the reliability of the semiconductor package 200.

[0087] <4. Examples of Application to Mobile Devices> The technology relating to this disclosure (this technology) can be applied to various products. For example, the technology relating to this disclosure may be implemented as a device mounted on any type of mobile device such as automobiles, electric vehicles, hybrid electric vehicles, motorcycles, bicycles, personal mobility devices, airplanes, drones, ships, and robots.

[0088] Figure 14 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile control system to which the technology described herein may be applied.

[0089] The vehicle control system 12000 comprises a plurality of electronic control units connected via a communication network 12001. In the example shown in Figure 14, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an external information detection unit 12030, an internal information detection unit 12040, and an integrated control unit 12050. The functional configuration of the integrated control unit 12050 is shown in the figure, which includes a microcomputer 12051, an audio / image output unit 12052, and an in-vehicle network interface 12053.

[0090] The drivetrain control unit 12010 controls the operation of devices related to the vehicle's drivetrain according to various programs. For example, the drivetrain control unit 12010 functions as a control device for a drivetrain generating device that generates driving force for the vehicle, such as an internal combustion engine or a drive motor; a drivetrain transmission mechanism that transmits driving force to the wheels; a steering mechanism that adjusts the steering angle of the vehicle; and a braking device that generates braking force for the vehicle.

[0091] The body system control unit 12020 controls the operation of various devices mounted on the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window system, or various lamps such as headlights, reverse lights, brake lights, turn signals, or fog lights. In this case, the body system control unit 12020 may receive radio waves transmitted from a portable device that replaces a key or signals from various switches. The body system control unit 12020 receives these radio waves or signals and controls the vehicle's door lock system, power window system, lamps, etc.

[0092] The external information detection unit 12030 detects information from outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the external information detection unit 12030. The external information detection unit 12030 causes the imaging unit 12031 to capture images of the outside of the vehicle and receives the captured images. Based on the received images, the external information detection unit 12030 may perform object detection processing such as detecting people, cars, obstacles, signs, or characters on the road surface, or distance detection processing.

[0093] The imaging unit 12031 is a light sensor that receives light and outputs an electrical signal corresponding to the amount of light received. The imaging unit 12031 can output the electrical signal as an image or as distance measurement information. The light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

[0094] The in-vehicle information detection unit 12040 detects information inside the vehicle. The in-vehicle information detection unit 12040 is connected to, for example, a driver status detection unit 12041 that detects the driver's state. The driver status detection unit 12041 includes, for example, a camera that captures images of the driver, and the in-vehicle information detection unit 12040 may calculate the driver's level of fatigue or concentration, or determine whether the driver is drowsy, based on the detection information input from the driver status detection unit 12041.

[0095] The microcomputer 12051 can calculate control target values ​​for the drive force generator, steering mechanism, or braking device based on information inside and outside the vehicle acquired by the external information detection unit 12030 or the internal information detection unit 12040, and output control commands to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing ADAS (Advanced Driver Assistance System) functions, including collision avoidance or impact mitigation, following driving based on distance between vehicles, maintaining vehicle speed, vehicle collision warning, or vehicle lane departure warning.

[0096] Furthermore, the microcomputer 12051 can perform cooperative control for purposes such as autonomous driving, where the vehicle drives autonomously without driver intervention, by controlling the drive force generating device, steering mechanism, or braking device, etc., based on information about the vehicle's surroundings acquired by the external information detection unit 12030 or the internal information detection unit 12040.

[0097] Furthermore, the microcomputer 12051 can output control commands to the body system control unit 12020 based on external information acquired by the external information detection unit 12030. For example, the microcomputer 12051 can control the headlights according to the position of a preceding or oncoming vehicle detected by the external information detection unit 12030, and perform coordinated control aimed at reducing glare, such as switching from high beams to low beams.

[0098] The audio-image output unit 12052 transmits at least one of audio and image output signals to an output device capable of visually or audibly notifying information to the vehicle's occupants or to those outside the vehicle. In the example shown in Figure 14, the output devices include an audio speaker 12061, a display unit 12062, and an instrument panel 12063. The display unit 12062 may include, for example, at least one of an onboard display and a head-up display.

[0099] Figure 15 shows an example of the installation position of the imaging unit 12031.

[0100] In Figure 15, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104, and 12105.

[0101] The imaging units 12101, 12102, 12103, 12104, and 12105 are installed, for example, on the front nose, side mirrors, rear bumper, back door, and the upper part of the windshield inside the vehicle 12100. The imaging unit 12101 installed on the front nose and the imaging unit 12105 installed on the upper part of the windshield inside the vehicle mainly acquire images of the front of the vehicle 12100. The imaging units 12102 and 12103 installed on the side mirrors mainly acquire images of the sides of the vehicle 12100. The imaging unit 12104 installed on the rear bumper or back door mainly acquires images of the rear of the vehicle 12100. The imaging unit 12105 installed on the upper part of the windshield inside the vehicle is mainly used for detecting preceding vehicles, pedestrians, obstacles, traffic lights, traffic signs, or lanes.

[0102] Figure 15 shows an example of the imaging ranges of imaging units 12101 to 12104. Imaging range 12111 indicates the imaging range of imaging unit 12101 located on the front nose, imaging ranges 12112 and 12113 indicate the imaging ranges of imaging units 12102 and 12103 located on the side mirrors, respectively, and imaging range 12114 indicates the imaging range of imaging unit 12104 located on the rear bumper or back door. For example, by superimposing the image data captured by imaging units 12101 to 12104, an overhead view image of the vehicle 12100 can be obtained.

[0103] At least one of the imaging units 12101 to 12104 may have a function for acquiring distance information. For example, at least one of the imaging units 12101 to 12104 may be a stereo camera consisting of multiple image sensors, or an image sensor having pixels for phase difference detection.

[0104] For example, the microcomputer 12051, based on distance information obtained from the imaging units 12101 to 12104, can determine the distance to each object within the imaging range 12111 to 12114 and the temporal change of this distance (relative speed to the vehicle 12100). In particular, it can extract the closest object on the vehicle 12100's path that is traveling in approximately the same direction as the vehicle 12100 at a predetermined speed (e.g., 0 km / h or more) as the preceding vehicle. Furthermore, the microcomputer 12051 can set a predetermined distance to be maintained before the preceding vehicle and perform automatic braking control (including follow-and-stop control) and automatic acceleration control (including follow-and-start control), etc. In this way, cooperative control aimed at autonomous driving, where the vehicle drives autonomously without driver intervention, can be performed.

[0105] For example, the microcomputer 12051 can use distance information obtained from imaging units 12101 to 12104 to classify and extract three-dimensional object data related to three-dimensional objects, such as motorcycles, passenger cars, large vehicles, pedestrians, utility poles, and other three-dimensional objects, and use this data for automatic obstacle avoidance. For example, the microcomputer 12051 identifies obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. The microcomputer 12051 then determines the collision risk, which indicates the degree of risk of collision with each obstacle. If the collision risk is above a set value and there is a possibility of collision, the microcomputer 12051 can provide driving assistance to avoid collisions by outputting a warning to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or evasive steering via the drive system control unit 12010.

[0106] At least one of the imaging units 12101 to 12104 may be an infrared camera that detects infrared light. For example, the microcomputer 12051 can recognize pedestrians by determining whether or not pedestrians are present in the images captured by the imaging units 12101 to 12104. Such pedestrian recognition is performed, for example, by a procedure to extract feature points from the images captured by the imaging units 12101 to 12104 as infrared cameras, and a procedure to perform pattern matching on a series of feature points that indicate the contour of an object to determine whether or not it is a pedestrian. When the microcomputer 12051 determines that a pedestrian is present in the images captured by the imaging units 12101 to 12104 and recognizes a pedestrian, the audio-image output unit 12052 controls the display unit 12062 to superimpose a rectangular contour line for emphasis on the recognized pedestrian. The audio-image output unit 12052 may also control the display unit 12062 to display an icon indicating a pedestrian at a desired position.

[0107] The above describes an example of a vehicle control system to which the technology described herein may be applied. The technology described herein can be applied to, for example, the imaging unit 12031 of the configuration described above. Specifically, the semiconductor package 200 in Figure 1 can be applied to the imaging unit 12031. By applying the technology described herein to the imaging unit 12031, it becomes possible to suppress the reach of adhesive to the cut surface of the transparent member and improve reliability.

[0108] The embodiments described above are merely examples of how to realize this technology, and there is a corresponding relationship between the matters in the embodiments and the inventive features in the claims. Similarly, there is a corresponding relationship between the inventive features in the claims and the matters in the embodiments of this technology that bear the same name. However, this technology is not limited to the embodiments and can be realized by making various modifications to the embodiments without departing from the gist of the technology.

[0109] The effects described herein are merely illustrative and not limited to those described herein, and other effects may also occur.

[0110] Furthermore, this technology can also take the following configurations: (1) A semiconductor package comprising: a support member having steps formed along each of the four sides of the outer circumference of a frame-shaped light-receiving surface; a semiconductor chip connected to the support member by a wire; and a transparent member whose inner side, beyond the cut surface, is bonded with adhesive to the adhesive region inside the steps of the light-receiving surface. (2) The semiconductor package according to (1), wherein the support member comprises a frame-shaped frame and a flat substrate to which the frame is bonded, the steps are formed on the light-receiving surface of the frame, and the semiconductor chip is connected to the substrate. (3) The semiconductor package according to (2), wherein the height from the substrate of the region inside the steps of the light-receiving surface is higher than that of the region outside the steps. (4) The semiconductor package according to (2), wherein grooves are formed along each of the four sides of the outer circumference of the frame, and the steps occur at the boundary between the groove and the adhesive region. (5) The semiconductor package according to (4), wherein the height from the substrate of the region of the frame outside the groove is higher than the adhesive region inside the groove. (6) The semiconductor package according to any one of (2) to (5), wherein the frame has fastening holes formed on the outside of the cut surface. (7) The semiconductor package according to any one of (2) to (6), wherein the frame is made of resin. (8) The semiconductor package according to any one of (2) to (6), wherein the frame is made of metal. (9) The semiconductor package according to any one of (1) to (8), wherein the corners of the outer periphery of the adhesive region, as viewed from the optical axis direction, are chamfered. (10) The semiconductor package according to any one of (1) to (8), wherein the corners of the outer periphery of the adhesive region, as viewed from the optical axis direction, are rounded. (11) The semiconductor package according to (1), wherein the support member is a substrate in which a cavity is formed, and the step is formed on the light-receiving surface outside the cavity. (12) A semiconductor package comprising: a support member having a protrusion formed along the outer circumference of a frame-shaped light-receiving surface; a semiconductor chip connected to the support member by wire bonding; and a transparent member having a step formed along its outer circumference, the area outside the step being bonded to the protrusion by adhesive.(13) A semiconductor package comprising a transparent member, a support member to which the adhesive region inside the cut surface of the transparent member is bonded to the transparent member, and a semiconductor chip connected to the support member by a wire. (14) A method for manufacturing a semiconductor package comprising a connection procedure for connecting a semiconductor chip by a wire to a support member having steps formed along each of the four sides of the outer circumference of a frame-shaped light-receiving surface, and an adhesive procedure for bonding the inside of the cut surface of the transparent member to the adhesive region inside the steps of the light-receiving surface with an adhesive.

[0111] 200 Semiconductor package 210 Transparent component 220, 221, 225 Frame 222 Fastening holes 230, 235 Ceramic IP substrate 231 Assembly substrate 232 Organic IP substrate 240 Sensor chip 251 Adhesive 252 Wire 261 Connector 262 Capacitor 12031 Imaging unit

Claims

1. A semiconductor package comprising: a support member having steps formed along each of the four sides of the outer circumference of a frame-shaped light-receiving surface; a semiconductor chip connected to the support member by wires; and a transparent member whose inner side, beyond the cut surface, is bonded with adhesive to the adhesive region inside the steps of the light-receiving surface.

2. The semiconductor package according to claim 1, wherein the support member comprises a frame-shaped frame and a flat substrate to which the frame is bonded, the step is formed on the light-receiving surface of the frame, and the semiconductor chip is connected to the substrate.

3. The semiconductor package according to claim 2, wherein the height from the substrate of the region inside the step of the light-receiving surface is greater than that of the region outside the step.

4. The semiconductor package according to claim 2, wherein grooves are formed along each of the four sides of the outer circumference of the frame, and the step is formed at the boundary between the groove and the adhesive area.

5. The semiconductor package according to claim 4, wherein the height from the substrate of the region of the frame outside the groove is higher than the adhesive region inside the groove.

6. The semiconductor package according to claim 2, wherein the frame comprises fastening holes formed on the outside of the cut surface.

7. The semiconductor package according to claim 2, wherein the frame is made of resin.

8. The semiconductor package according to claim 2, wherein the frame is a metal frame.

9. The semiconductor package according to claim 1, wherein the corners of the outer periphery of the adhesive region, viewed from the optical axis direction, are chamfered.

10. The semiconductor package according to claim 1, wherein the corners of the outer periphery of the adhesive region, viewed from the optical axis direction, are rounded.

11. The semiconductor package according to claim 1, wherein the support member is a substrate in which a cavity is formed, and the step is formed on the light-receiving surface outside the cavity.

12. A semiconductor package comprising: a support member having a protrusion formed along the outer circumference of a frame-shaped light-receiving surface; a semiconductor chip connected to the support member by wire bonding; and a transparent member having a step formed along its outer circumference, the area outside the step being bonded to the protrusion by adhesive.

13. A semiconductor package comprising a transparent member, a support member whose adhesive region inside the cut surface of the transparent member is bonded to the transparent member, and a semiconductor chip connected to the support member by a wire.

14. A method for manufacturing a semiconductor package, comprising: a connection procedure for connecting a semiconductor chip with a wire to a support member having steps formed along each of the four sides of the outer circumference of a frame-shaped light-receiving surface; and an adhesion procedure for bonding the inside of the cut surface of a transparent member to the adhesive area inside the steps of the light-receiving surface with an adhesive.

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