Probe card

Abstract

This probe card comprises a probe having a tip part that comes into contact with an object under inspection, and a guide plate having a guide hole for guiding the probe in the longitudinal direction (X-axis direction). On the circumferential surface of the probe, a convex part capable of sliding along the inner wall surface of the guide hole is formed, and a first level difference of the convex part facing the tip part side of the probe is disposed in the guide hole.

Description

Probe card

[0001] The present invention relates to a probe card. The present application claims priority based on Japanese Patent Application No. 2025-067820 filed in Japan on April 17, 2025, the content of which is incorporated herein by reference.

[0002] Conventionally, a probe card provided with vertical probes that come into contact with an object to be inspected has been known. These probes are inserted into a plurality of guide plates in which guide holes are formed, in order to maintain their shape and position their tip portions (see Figure 1 of Patent Document 1 below).

[0003] Japanese Unexamined Patent Publication No. 2024-41465

[0004] Meanwhile, during overdrive (hereinafter sometimes referred to as OD) in which the probe card and the object to be inspected are brought into contact, among the plurality of probes, a probe that is displaced from the object to be inspected (for example, a wafer) may come into contact with the edge of the object to be inspected (wafer edge). As a result, bending stress is applied to the tip portion of the probe protruding from the guide hole, which may cause the probe to break. If the broken probe falls onto the object to be inspected, there is a risk of damaging the object to be inspected.

[0005] The present invention has been made in view of the above problems, and an object thereof is to provide a probe card capable of suppressing breakage of probes.

[0006] A probe card according to one aspect of the present invention includes: a probe having a tip portion that comes into contact with an object to be inspected; and a guide plate having a guide hole that guides the probe in the longitudinal direction. A convex portion slidable along the inner wall surface of the guide hole is formed on the peripheral surface of the probe, and a first stepped portion of the convex portion facing the tip portion side of the probe is arranged inside the guide hole.

[0007] According to the above aspect of the present invention, breakage of probes can be suppressed.

[0008] This is a schematic diagram showing the use of a probe card according to one embodiment. This is an enlarged view of the main part of the wiring board according to one embodiment. This is an enlarged view of the main part of the probe according to one embodiment. This is the line IV-IV shown in Figure 3. This is a diagram explaining the operation of the probe and guide plate according to one embodiment. This is a graph showing the relationship between A and B, where A is the dimension from the first stepped portion to the first open end and B is the dimension from the first open end to the tip of the probe according to one embodiment. This is a schematic diagram showing how an elastically deformable portion is formed in the probe according to one embodiment. This is the line VIII-VIII shown in Figure 7. This is a schematic diagram showing how the probe elastically deforms during OD according to one embodiment. This is the line X-X shown in Figure 9.

[0009] The embodiments of the present invention will be described below with reference to the drawings. The embodiments shown below are illustrative of devices and methods for realizing the technical idea of ​​this invention, and the embodiments of this invention do not limit the materials, shapes, structures, arrangements, etc. of the components to those described below.

[0010] Figure 1 is a schematic diagram showing the use of a probe card 1 according to one embodiment. The probe card 1 shown in Figure 1 is attached to an inspection device (tester) (not shown), and for example, the probe 11 is brought into contact with the pads 2a of an object to be inspected 2 such as a wafer to inspect a semiconductor integrated circuit (not shown) formed on the object to be inspected 2.

[0011] The object to be inspected 2 is placed on the upper surface of the chuck top of the probe 3. The chuck top is movable in a planar direction along the horizontal plane, in a vertical direction perpendicular to the horizontal plane, and is also rotatable in the θ direction around the vertical axis. When inspecting the object to be inspected 2, the chuck top can be raised and lowered vertically, bringing the pad 2a of the object to be inspected 2 into electrical contact with the tip of the probe 11.

[0012] The probe card 1 comprises a wiring board 10 and a printed circuit board 20 (main board). The printed circuit board 20 is electrically connected to an inspection board 30 of an inspection device (not shown) via connection terminals 31. The wiring board 10 is a space transformer formed by laminating a multilayer substrate made of a synthetic resin material such as polyimide onto the surface of a ceramic substrate or the like.

[0013] A multilayer substrate is formed on the bottom surface of the wiring board 10. Multiple vertical probes 11 inserted into the guide assembly 40 are in contact with the multilayer substrate. Multiple conductive paths (not shown) are formed on the ceramic substrate or the like that forming the top surface of the wiring board 10, which electrically connect the printed circuit board 20 and the multilayer substrate.

[0014] Figure 2 is an enlarged view of the main part of a wiring board 10 according to one embodiment. As shown in Figure 2, the bottom surface of the wiring board 10 has a plurality of terminal portions 10a (lands) to which a plurality of probes 11 are connected. The plurality of probes 11 are inserted into a guide assembly 40. The guide assembly 40 comprises a plurality of guide plates 41 in which guide holes 42 are formed.

[0015] The guide assembly 40 comprises a first guide plate 41A (top guide plate) having a first guide hole 42A, a second guide plate 41B (middle guide plate) having a second guide hole 42B, and a third guide plate 41C (bottom guide plate) having a third guide hole 42C. The first guide plate 41A is located at the top of the guide assembly 40. The second guide plate 41B is located below the first guide plate 41A. The third guide plate 41C is located further below the second guide plate 41B (at the bottom of the guide assembly 40).

[0016] The first guide hole 42A and the second guide hole 42B are not opposite each other in the vertical direction, but are offset in the left-right direction. The vertical direction is the direction in which the first guide plate 41A, the second guide plate 41B, and the third guide plate 41C are arranged. The probe 11 is provided with a bent elastic deformation portion 13 between the first guide plate 41A and the second guide plate 41B. The elastic deformation portion 13 can be formed, for example, by inserting a straight probe 11 into the first guide hole 42A and the second guide hole 42B, and then shifting the first guide plate 41A and the second guide plate 41B relatively in the left-right direction.

[0017] The second guide hole 42B and the third guide hole 42C are opposite each other in the vertical direction. The third guide hole 42C has a smaller opening area than, for example, the first guide hole 42A and the second guide hole 42B, allowing for precise positioning of the tip of the probe 11. The probe 11 is equipped with the elastic deformation portion 13 described above, so that its tip can be elastically displaced in the vertical direction, ensuring reliable electrical connection with the object under inspection 2 (pad 2a) during OD (Optical Distance).

[0018] When inspecting the object under test 2, the prober 3 shown in Figure 1 moves the object under test 2, bringing the pads 2a of the object under test 2 into contact with the tips of the multiple probes 11 provided on the probe card 1 (OD state). In this state, an inspection device (not shown) simultaneously inputs test signals to each semiconductor integrated circuit via the multiple probes 11 and receives output signals from each semiconductor integrated circuit to inspect each semiconductor integrated circuit.

[0019] Figure 3 is an enlarged view of the main part of the probe 11 according to one embodiment. Figure 4 is a view taken along the line IV-IV shown in Figure 3. Figures 3 and 4 show the state of the probe 11 and guide plate 41 (third guide plate 41C) when not in OD mode. The following configuration is applied to the third guide plate 41C, but it may also be applied to the first guide plate 41A and the second guide plate 41B. As shown in Figure 4, the circumferential surface of the probe 11 has an uneven surface 11a with a convex portion 12 and a flat surface 11b. This probe 11 can be formed, for example, by MEMS (micro electro mechanical systems) technology.

[0020] In MEMS technology, for example, the probe 11 is manufactured by stacking metal materials such as Ni alloy on a table (not shown), so the probe 11 is rectangular in shape. That is, the side of the probe 11 that faces the table is a flat surface 11b. The guide holes 42 of the guide plate 41 described above are also formed in a rectangular shape corresponding to the shape of the probe 11. In the following explanation, an XYZ Cartesian coordinate system may be set up, and the positional relationships of each component may be explained while referring to this XYZ Cartesian coordinate system.

[0021] The X-axis direction is the longitudinal direction of the probe 11, the Y-axis direction is the short-axis direction (width direction) of the probe 11, and the Z-axis direction is the thickness direction (metal lamination direction) of the probe 11. The +X side end of the probe 11 is the tip portion 11A (lower end) that contacts the pad 2a. The -X side base end (upper end) of the probe 11 contacts the terminal portion 10a of the wiring board 10 shown in Figure 2.

[0022] As shown in Figure 3, a protrusion 12 is formed on the +Z side uneven surface 11a of the circumferential surface of the probe 11. A first gap S1 is formed between the uneven surface 11a and the inner wall surface of the guide hole 42, as shown in Figure 4. A second gap S2 is formed between the flat surface 11b and the inner wall surface of the guide hole 42. The protrusion 12 may be in contact with the inner wall surface of the guide hole 42, in which case the first gap S1 may be formed below the protrusion 12.

[0023] Returning to Figure 3, the protrusion 12 is formed on a hard metal portion 12a coated with a hard metal that is harder than the main body of the probe 11 (for example, a Ni alloy). The hard metal portion 12a is formed on three surfaces: the surface facing the +Z side of the probe 11 (first surface), the surface facing the +Y side of the probe 11 (second surface), and the surface facing the -Y side of the probe 11 (third surface). Note that the hard metal portion 12a may be formed only on the surface facing the +Z side of the probe 11 (first surface).

[0024] The protrusion 12 has a substantially rectangular shape that protrudes from the circumferential surface of the probe 11 to a constant height on the +Z side and extends in the X-axis direction. The +X and -X ends of the protrusion 12 are formed in an arc shape. The protrusion 12 is formed with dimension L in the X-axis direction. At least a part of the protrusion 12 (from the middle to the lower end in the X-axis direction) is positioned in the guide hole 42 and is slidable along the inner wall surface of the guide hole 42. Since the protrusion 12 (hard metal portion 12a) is harder than the body of the probe 11, wear of the probe 11 due to sliding in the guide hole 42 during OD can be suppressed.

[0025] The protrusion 12 includes a first stepped portion 14a facing the tip portion 11A side (+X side) of the probe 11, a pair of second stepped portions 14c facing both sides in the short direction of the probe 11 (both sides in the Y-axis direction), and a third stepped portion 14b facing the opposite side (-X side) of the tip portion 11A of the probe 11. The first stepped portion 14a, the second stepped portion 14c, and the third stepped portion 14b are steps (also called the side surfaces of the protrusion 12) formed between the circumferential surface of the probe 11 and the top surface of the protrusion 12.

[0026] The first stepped portion 14a is positioned within the guide hole 42. The first stepped portion 14a is positioned within the guide hole 42 not only when there is no overdrive (OD), but also when there is overdrive (OD). Therefore, when S is the amount of pressure (OD) applied by the probe 11 when the tip 11A of the probe 11 is brought into contact with the object to be inspected 2, and C is the distance from the first stepped portion 14a to the second open end 43b of the guide hole 42, which is located on the opposite side (-X side) from the first open end 43a of the guide hole 42 on the tip 11A side of the probe 11, it is desirable that the relationship S < C be satisfied.

[0027] The guide hole 42 has a flared shape (trumpet shape) in which the opening area increases towards the second open end 43b. Therefore, even if the protrusion 12 comes out upward from the guide hole 42 during overdrive, the protrusion 12 will easily return to the guide hole 42 when the probe 11 recovers from the overdrive state. At least a portion of the second stepped portion 14c (from the middle portion in the X-axis direction to the lower end) is located inside the guide hole 42. It is preferable that at least a portion of the second stepped portion 14c be located inside the guide hole 42 not only when not overdrive, but also when overdrive. The third stepped portion 14b is located outside the guide hole 42. It is preferable that the third stepped portion 14b be located outside the guide hole 42 not only when not overdrive, but also when overdrive.

[0028] As shown in Figure 4, the first stepped portion 14a of the protrusion 12 facing the tip 11A side of the probe 11 is positioned inside the guide hole 42. Here, let A be the distance from the first stepped portion 14a to the first opening end 43a of the guide hole 42 on the tip 11A side (+X side) of the probe 11, and let B be the distance from the first opening end 43a to the tip 11A of the probe 11. It is desirable that the relationship A < B be satisfied. By satisfying the relationship A < B, when the tip 11A of the probe 11 contacts the edge 2b of the object to be inspected 2, as shown in Figure 5 which will be described later, the radius of curvature of the probe 11 increases, and the bending of the probe 11 is suppressed.

[0029] Figure 5 is a diagram illustrating the operation of the probe 11 and guide plate 41 according to one embodiment. The states from Figure 5(a) to Figure 5(d) show the deformation of the probe 11 when it comes into contact with the edge 2b of the object under inspection 2 during OD (Obstruction Distance), when the probe card 1 is brought into contact with the object under inspection 2. Also, in Figure 5, reference numeral 100 indicates the position where the probe 11 experiences maximum stress. As shown in the state of Figure 5(a), when the tip 11A of the probe 11 comes into contact with the edge 2b (angled portion) of the object under inspection 2 during OD, bending stress acts on the probe 11. The maximum stress at this time acts on the first stepped portion 14a in the guide hole 42.

[0030] As shown in the states from Figure 5(b) to Figure 5(c), as the amount of OD gradually increases, the bending of the probe 11 becomes more severe, and then the flat surface 11b side of the probe 11 comes into contact with the first open end 43a of the guide hole 42. As shown in the state of Figure 5(d), as the amount of OD increases further, the flat surface 11b side of the probe 11 is pressed strongly against the first open end 43a of the guide hole 42. At this time, the maximum stress moves from the first stepped portion 14a to the contact portion between the flat surface 11b and the first open end 43a.

[0031] In other words, according to this embodiment, when the probe 11 is not bent sharply, the first stepped portion 14a (first part) inside the guide hole 42 receives the maximum bending stress, and when the probe 11 is bent sharply, the bending stress can be distributed and received by the first stepped portion 14a (first part) and the contact portion (second part) between the flat surface 11b of the probe 11 and the first open end 43a. As a result, stress concentration in one place is mitigated, and breakage of the probe 11 can be suppressed. If, for example, the first stepped portion 14a is not located inside the guide hole 42 during OD and protrudes downward from the first open end 43a, bending stress will be applied only to the first stepped portion 14a, making the probe 11 more prone to breaking starting from the first stepped portion 14a.

[0032] Figure 6 is a graph showing the relationship between A and B, where A is the dimension from the first stepped portion 14a to the first open end 43a in one embodiment, and B is the dimension from the first open end 43a to the tip portion 11A of the probe 11. In Figure 6, "×" indicates POOR, showing that the probe 11 broke when it came into contact with the edge 2b of the object under inspection 2 during OD. "△" indicates GOOD, showing that the frequency of the probe 11 breaking when it came into contact with the edge 2b of the object under inspection 2 during OD has decreased, but it can still occur. "○" indicates EXCELLENT, showing that the probe 11 did not break when it came into contact with the edge 2b of the object under inspection 2 during OD.

[0033] As shown in Figure 6, the ratio of the dimensions of B to A was "×" when it was between 1.0 and 1.5, "△" when it was between 2.0 and 3.0, and "○" when it was between 4.0 and 7.0. In other words, the point at which the improvement effect changes is observed when the ratio of the dimensions of B to A is between 1.5 and 2.0, and when it is 4.0 or higher, the breakage is completely eliminated. From the above, it can be seen that when the dimension from the first stepped portion 14a to the first opening end 43a of the guide hole 42 on the tip portion 11A side of the probe 11 is A, and the dimension from the first opening end 43a to the tip portion 11A of the probe 11 is B, it is desirable that the relationship 1.5 × A < B be satisfied.

[0034] Thus, regarding the bending of the probe 11, the longer B is, the better. However, if B becomes too long, the contact accuracy of the object under inspection 2 with the pad 2a decreases. For this reason, when the distance from the first stepped portion 14a to the first opening end 43a of the guide hole 42 on the tip portion 11A side of the probe 11 is A, and the distance from the first opening end 43a to the tip portion 11A of the probe 11 is B, it is desirable that the relationship B < 4 × A is satisfied. In other words, it can be seen that the preferred range for suppressing the occurrence of bending of the probe 11 and ensuring the contact accuracy of the probe 11 with the pad 2a of the object under inspection 2 is 1.5 × A < B < 4 × A.

[0035] Next, the function of the second stepped portion 14c of the protrusion 12 will be explained with reference to Figures 7 to 10. Note that the second guide plate 41B will be described below, but the first guide plate 41A or the third guide plate 41C may also be described.

[0036] Figure 7 is a schematic diagram showing how an elastically deformable portion 13 is formed on a probe 11 according to one embodiment. Figure 8 is a view taken from VIII-VIII along the arrow in Figure 7. As shown in Figure 7, when forming an elastically deformable portion 13 on the probe 11, the first guide plate 41A is moved in the left-right direction relative to the second guide plate 41B, for example, to the -Z side (towards the flat surface 11b of the probe 11). In this state, as shown in Figure 8, the flat surface 11b of the probe 11 is in contact with the inner wall surface of the guide hole 42.

[0037] Figure 9 is a schematic diagram showing how the probe 11 elastically deforms during overdrive according to one embodiment. Figure 10 is a view along the line X-X shown in Figure 9. As shown in Figure 9, during overdrive, the probe 11 elastically deforms starting from the elastic deformation portion 13 and slides within the guide hole 42. In this state, as shown in Figure 10, the flat surface 11b of the probe 11 is separated from the inner wall surface of the guide hole 42, and the uneven surface 11a (protrusion 12) of the probe 11 is in contact with (sliding over) the inner wall surface of the guide hole 42.

[0038] Here, as shown in Figure 10, the guide hole 42 is formed in a square shape with rounded corner portions 44 when viewed from the longitudinal direction of the probe 11. The rounded shape of the corner portions 44 is unavoidable when machining the guide hole 42 into a square shape, depending on the tools and machining methods (e.g., laser machining). On the other hand, a second stepped portion 14c is formed on the convex portion 12 of the circumferential surface of the probe 11, which is positioned inside the guide hole 42 and faces the short direction (Y-axis direction) of the probe 11. With this configuration, even if the probe 11, which slides during OD, slides in the Y-axis direction within the guide hole 42, for example, collision between the probe 11 and the corner portions 44 can be avoided. Therefore, wear of the probe 11 during OD (sliding) can be suppressed.

[0039] As described above, the probe card 1 according to this embodiment comprises a probe 11 having a tip portion 11A that contacts the object to be inspected 2, and a guide plate 41 having a guide hole 42 that guides the probe 11 in the longitudinal direction (X-axis direction). A protrusion 12 that can slide along the inner wall surface of the guide hole 42 is formed on the circumferential surface of the probe 11, and a first stepped portion 14a of the protrusion 12 facing the tip portion 11A side of the probe 11 is positioned inside the guide hole 42. With this configuration, when the bend of the probe 11 is gentle, the first stepped portion 14a (first portion) inside the guide hole 42 receives the maximum bending stress, and when the bend of the probe 11 becomes sharper, the bending stress can be distributed and received at the contact portion (second portion) between the first stepped portion 14a (first portion) and the first open end 43a. Therefore, the breakage of the probe 11 can be suppressed. Although Figure 5 illustrates the case where the tip 11A of the probe 11 deforms toward the opposite side of the convex portion 12, if the tip 11A of the probe 11 deforms toward the convex portion 12, the gap (first gap S1) between the convex portion 12 and the guide hole 42 is large, so the probe 11 hardly breaks.

[0040] Furthermore, in this embodiment, when the distance from the first stepped portion 14a to the first open end 43a of the guide hole 42 on the tip portion 11A side of the probe 11 is A, and the distance from the first open end 43a to the tip portion 11A of the probe 11 is B, the relationship A < B is satisfied. With this configuration, when the tip portion 11A of the probe 11 comes into contact with the edge 2b of the object to be inspected 2, the radius of curvature of the bending of the probe 11 increases, and the bending of the probe 11 is suppressed.

[0041] Furthermore, in this embodiment, when the distance from the first stepped portion 14a to the first open end 43a of the guide hole 42 on the tip portion 11A side of the probe 11 is A, and the distance from the first open end 43a to the tip portion 11A of the probe 11 is B, the relationship 1.5 × A < B is satisfied. With this configuration, the frequency of the probe 11 breaking when it comes into contact with the edge 2b of the object being inspected 2 during OD can be reduced.

[0042] Further, in the present embodiment, letting A be the dimension from the first stepped portion 14a to the first open end 43a of the guide hole 42 on the tip portion 11A side of the probe 11, and B be the dimension from the first open end 43a to the tip portion 11A of the probe 11, the relationship of B < 4 × A is satisfied. According to this configuration, the contact accuracy of the probe 11 to the pad 2a of the device under test 2 can be ensured.

[0043] Further, in the present embodiment, letting S be the pressing amount of the probe 11 when the tip portion 11A of the probe 11 is brought into contact with the device under test 2, and C be the dimension from the first stepped portion 14a to the second open end 43b of the guide hole 42 disposed on the side opposite to the first open end 43a of the guide hole 42 on the tip portion 11A side of the probe 11, the relationship of S < C is satisfied. According to this configuration, the first stepped portion 14a can be disposed inside the guide hole 42 not only during non-OD but also during OD.

[0044] Further, in the present embodiment, the guide hole 42 has a lead-in shape whose opening area increases toward the second open end 43b. According to this configuration, even if the convex portion 12 slips out upward from the guide hole 42 during OD, the convex portion 12 can easily return into the guide hole 42 when the probe 11 recovers from the OD state.

[0045] Further, in the present embodiment, on the peripheral surface of the probe 11, there is formed a second stepped portion 14c of the convex portion 12 that is disposed inside the guide hole 42 and faces the lateral direction of the probe 11, and the guide hole 42 is formed in a square shape having rounded corner portions 44 when viewed from the longitudinal direction of the probe 11. According to this configuration, collision between the probe 11 and the corner portions 44 is avoided, and wear of the probe 11 during OD (during sliding) can be suppressed.

[0046] Further, in the present embodiment, a plurality of guide plates 41 (a first guide plate 41A, a second guide plate 41B, and a third guide plate 41C) are provided, the probe 11 includes an elastically deformable portion 13 (see FIG. 9) that buckles in a gap between any one of the plurality of guide plates 41 (the gap between the first guide plate 41A and the second guide plate 41B) when a tip portion 11A comes into contact with a device under test 2, and the convex portion 12 is provided in a direction opposite to the buckling direction of the elastically deformable portion 13 (the right side of the paper surface in FIG. 9) within a guide hole 42 (a third guide hole 42C) of the guide plate 41 (the third guide plate 41C) disposed closest to the device under test 2 among the plurality of guide plates 41. According to this configuration, at the time of overdrive (OD) when the elastically deformable portion 13 of the probe 11 buckles, the convex portion 12 side is easily pressed against the inner wall surface of the guide hole 42, so that wear during sliding of the probe 11 can be suppressed.

[0047] While preferred embodiments of the present invention have been described and illustrated above, it should be understood that these are illustrative of the present invention and are not to be considered as limiting. Additions, omissions, substitutions, and other modifications can be made without departing from the scope of the present invention. Accordingly, the present invention should not be regarded as limited by the foregoing description, but is restricted by the scope of the appended claims.

[0048] For example, although the case where the probe 11 is formed in a square shape has been illustrated in the above embodiment, the same structure as that of the present embodiment can be applied even when the probe 11 is formed in a round shape (pin shape).

[0049] Furthermore, within the scope not departing from the gist of the present invention, the components in the above-described embodiment can be appropriately replaced with well-known components, and the above-described embodiment and modified examples may be appropriately combined.

[0050] According to one aspect of the present invention described above, breakage of the probe can be suppressed.

[0051] 1 Probe card 2 Object under inspection 2a Pad 2b Edge 3 Probe 10 Wiring board 10a Terminal section 11 Probe 11a Uneven surface 11A Tip 11b Flat surface 12 Convex section 12a Hard metal section 13 Elastic deformation section 14a First step section 14b Third step section 14c Second step section 20 Printed circuit board 30 Inspection board 31 Connection terminal 40 Guide assembly 41 Guide plate 41A First guide plate 41B Second guide plate 41C Third guide plate 42 Guide hole 42A First guide hole 42B Second guide hole 42C Third guide hole 43a First opening end 43b Second opening end 44 Corner section S1 First gap S2 Second gap

Claims

1. A probe card comprising: a probe having a tip that contacts an object to be inspected; and a guide plate having a guide hole that guides the probe in the longitudinal direction, wherein a projection is formed on the circumferential surface of the probe that is slidable along the inner wall surface of the guide hole, and a first stepped portion of the projection facing the tip of the probe is positioned inside the guide hole.

2. The probe card according to claim 1, wherein the distance from the first stepped portion to the first open end of the guide hole on the tip side of the probe is A, and the distance from the first open end to the tip of the probe is B, and the relationship A < B is satisfied.

3. The probe card according to claim 1, wherein the distance from the first stepped portion to the first open end of the guide hole on the tip side of the probe is A, and the distance from the first open end to the tip of the probe is B, and the relationship 1.5 × A < B is satisfied.

4. The probe card according to claim 1, wherein the distance from the first stepped portion to the first open end of the guide hole on the tip side of the probe is A, and the distance from the first open end to the tip of the probe is B, and the relationship B < 4 × A is satisfied.

5. The probe card according to claim 1, wherein S is the amount of pressure applied by the probe when the tip of the probe is brought into contact with the object to be inspected, and C is the distance from the first stepped portion to the second open end of the guide hole located on the opposite side of the first open end of the guide hole on the tip side of the probe, and the relationship S < C is satisfied.

6. The probe card according to claim 5, wherein the guide hole has a guide shape in which the opening area increases toward the second opening end.

7. The probe card according to claim 1, wherein a second stepped portion of the protrusion is formed on the circumferential surface of the probe, which is positioned within the guide hole and faces the short direction of the probe, and the guide hole is formed in a square shape with rounded corners when viewed from the longitudinal direction of the probe.

8. The probe card according to claim 1, comprising a plurality of guide plates, wherein the probe has an elastically deformable portion that buckles in the gap of any one of the plurality of guide plates when the tip portion contacts the object to be inspected, and the convex portion is provided in the guide hole of the guide plate that is positioned closest to the object to be inspected among the plurality of guide plates, in the direction opposite to the direction in which the elastically deformable portion buckles.

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