Aromatic polycarbonate resin composition

Abstract

Provided is a polycarbonate resin composition that has good hue, excellent transparency, and also excellent mold staining resistance. The aromatic polycarbonate resin composition is characterized by comprising, per 100 parts by mass of an aromatic polycarbonate resin (A), 0.01-4 parts by mass of a polyether compound (B) represented by general formula (1).

Description

Aromatic polycarbonate resin composition

[0001] The present invention relates to an aromatic polycarbonate resin composition, and more particularly to an aromatic polycarbonate resin composition having good hue, excellent transparency, and excellent mold stain resistance, and a molded article formed therefrom.

[0002] Liquid crystal display devices used in personal computers, mobile phones, and other devices incorporate planar light sources to meet the demands for thinner, lighter, more efficient, and higher-resolution displays. These planar light sources are equipped with wedge-shaped or flat light guide plates, which have one uniformly inclined surface, to uniformly and efficiently guide incoming light to the liquid crystal display. Some also have a light scattering function provided by forming an uneven pattern on the surface of the light guide plate.

[0003] Such light guide plates are obtained by injection molding of thermoplastic resin, and the above-mentioned uneven pattern is imparted by transferring the uneven surface formed on the surface of an insert mold. Conventionally, light guide plates have been molded from resin materials such as polymethyl methacrylate (PMMA), but recently, there is a demand for display devices that can project clearer images, and the temperature inside the device tends to rise due to the heat generated near the light source, so they are being replaced with polycarbonate resin materials, which have higher heat resistance.

[0004] However, while polycarbonate resin excels in mechanical, thermal, electrical properties, weather resistance, light transmittance, and transparency, there is a growing demand to minimize the chromaticity difference between the light-receiving and distant areas of a light guide plate. Polycarbonate resin has the problem of being more prone to yellowing compared to PMMA.

[0005] Patent Document 1 proposes incorporating polyalkylene glycol, composed of linear alkyl groups, into polycarbonate resin to improve transmittance and hue, and improvements in transmittance and yellowing (yellow index: YI) can be observed by incorporating polytetramethylene ether glycol.

[0006] In particular, in recent years, optical components such as light guide plates have become highly integrated in mobile devices such as smartphones and tablet terminals. Therefore, optical components such as light guide plates are strongly required to have not only excellent hue (YI) and high transparency, but also excellent resistance to mold contamination during molding.

[0007] Patent No. 5699188

[0008] The present invention has been made in view of the above circumstances, and its objective (problem) is to provide an aromatic polycarbonate resin composition that has good hue, excellent transparency, and excellent resistance to mold contamination, and a molded article formed therefrom.

[0009] The inventors, after diligent research to achieve the above objectives, discovered that an aromatic polycarbonate resin composition containing a specific amount of a particular polyether compound having an oxymethylene group solves the above problems, and thus completed the present invention. The present invention relates to the following aromatic polycarbonate resin composition and molded article.

[0010] 1. An aromatic polycarbonate resin composition characterized by containing 0.01 to 4 parts by mass of a polyether compound (B) represented by the following general formula (1) per 100 parts by mass of an aromatic polycarbonate resin (A). (In formula (1), R represents a linear or branched hydrocarbon group having 2 to 6 carbon atoms, l, m, and n are integers from 1 to 40, and s is an integer from 1 to 30. Multiple Rs may be the same or different.) 2. The aromatic polycarbonate resin composition according to 1 above, wherein R in general formula (1) is an alkylene group selected from the group consisting of 1,2-ethylene group, 1,2-propylene group, trimethylene group, 1,2-butylene group, and tetramethylene group. 3. The R-O unit and CH in general formula (1) ２1. An aromatic polycarbonate resin composition according to 1 or 2 above, wherein the molar ratio of -O units is 50 to 95:50 to 5. 4. An aromatic polycarbonate resin composition according to any one of 1 to 3 above, wherein the number average molecular weight (Mn) of the polyether compound (B) is 200 to 10,000. 5. An aromatic polycarbonate resin composition according to any one of 1 to 4 above, wherein the viscosity average molecular weight (Mv) of the aromatic polycarbonate resin (A) is 10,000 to 50,000.

[0011] 6. The aromatic polycarbonate resin composition according to any one of 1 to 5 above, further containing 0.005 to 0.5 parts by mass of a phosphorus-based stabilizer (C) per 100 parts by mass of aromatic polycarbonate resin (A). 7. The aromatic polycarbonate resin composition according to 6 above, wherein the phosphorus-based stabilizer (C) is a phosphorus-based compound having a phosphite structure. 8. The aromatic polycarbonate resin composition according to 6 or 7 above, wherein the phosphorus-based stabilizer (C) contains two or more phosphorus-based compounds having a phosphite structure, one or more of which are phosphite compounds having a spiro-ring skeleton. 9. The aromatic polycarbonate resin composition according to any one of 1 to 8 above, further containing 0.0005 to 0.2 parts by mass of an epoxy compound (D1) and / or an oxetane compound (D2) per 100 parts by mass of aromatic polycarbonate resin (A). 10. Furthermore, an aromatic polycarbonate resin composition according to any one of 1 to 9, further containing 0.005 to 0.5 parts by mass of fatty acid ester per 100 parts by mass of aromatic polycarbonate resin (A). 11. Pellets made from the aromatic polycarbonate resin composition according to any one of 1 to 10. 12. A molded article obtained by molding the aromatic polycarbonate resin composition according to any one of 1 to 10. 13. A molded article obtained by molding the pellets according to 11. 14. A molded article according to 12 or 13 that is an optical component. 15. An optical component according to 14 that is a light guide member.

[0012] The aromatic polycarbonate resin composition of the present invention has good hue, excellent transparency, and excellent resistance to mold contamination. Furthermore, molded articles made from the aromatic polycarbonate resin composition of the present invention have excellent hue and transparency with a low YI value and excellent resistance to mold contamination during molding, making them particularly suitable for use as optical components.

[0013] Figure 1 is a plan view of the teardrop-shaped mold used to evaluate mold contamination in the example.

[0014] The present invention will be described in detail below with reference to embodiments and examples. In this specification, unless otherwise specified, "~" means that the numerical values ​​described before and after it are included as the lower limit and upper limit.

[0015] The aromatic polycarbonate resin composition of the present invention is characterized by containing 0.01 to 4 parts by mass of a polyether compound (B) represented by the general formula (1) per 100 parts by mass of an aromatic polycarbonate resin (A).

[0016] The following describes in detail each component and molded article constituting the aromatic polycarbonate resin composition of the present invention.

[0017] [Polyether compound (B)] The polycarbonate resin composition of the present invention contains a polyether compound (B) represented by the following formula (1) having an oxymethylene group.

[0018] (In formula (1), R represents a linear or branched hydrocarbon group having 2 to 6 carbon atoms, l, m, and n are integers from 1 to 40, and s is an integer from 1 to 30. Multiple Rs may be the same or different.)

[0019] In general formula (1), R is a linear or branched hydrocarbon group having 2 to 6 carbon atoms. Examples of linear hydrocarbon groups having 2 to 6 carbon atoms include the 1,2-ethylene group, trimethylene group, tetramethylene group, pentamethylene group, and hexamethylene group. Examples of branched hydrocarbon groups having 2 to 6 carbon atoms include 1,2-propylene group, 1,2-butylene group, 2-methyl(1,2-propylene group), 2,2-dimethyl(1,2-propylene group), 1,2-dimethyl(1,2-propylene group), 1-methyl(1,2-propylene group), 1,2,2-trimethyl(1,2-propylene group), 2-methyl(1,2-butylene group), 1-methyl(1,2-butylene group), 1-isopropylene(1,2-ethylene group), 2-methyl,1-isopropylene(1,2-ethylene group), 1-tert-butyl(1,2-ethylene group), 2-ethyl(1,2-butylene group), 1-ethyl(1,2-butylene group), 1,1-dimethyltrimethylene group, 2-methyltetramethylene group, and 1-methylpentylene group. R is preferably an alkylene group selected from among 1,2-ethylene, 1,2-propylene, trimethylene, 1,2-butylene, and tetramethylene groups, more preferably 1,2-propylene and tetramethylene groups, and particularly preferably tetramethylene groups.

[0020] In general formula (1), when l or n is 2 or more, R may be the same hydrocarbon group or different hydrocarbon groups.

[0021] R-O units and CH in general formula (1) ２ - The molar ratio of units (l × s + n) / (m × s) is preferably 50 to 95:50 to 5, more preferably 55 to 90:45 to 10, even more preferably 60 to 85:40 to 15, among which 65 to 85:35 to 15, and especially preferably 70 to 80:30 to 20.

[0022] In general formula (1), l, m, and n are integers from 1 to 40, but l and n are preferably from 1 to 30, more preferably from 1 to 20, even more preferably from 1 to 15, even more preferably from 1 to 10, among which 1 to 8, and especially preferably from 1 to 5. l and n may be the same or different. m is preferably from 1 to 20, more preferably from 1 to 10, even more preferably from 1 to 8, even more preferably from 1 to 5, among which 1 to 4, and especially preferably from 1 to 3. s is an integer from 1 to 30, but is preferably from 1 to 20, more preferably from 1 to 10, even more preferably from 1 to 9, even more preferably from 1 to 8, among which 1 to 7, and especially preferably from 1 to 6.

[0023] The number-average molecular weight (Mn) of the polyether compound (B) is preferably 200 to 10,000, more preferably 300 or more, even more preferably 500 or more, more preferably 5,000 or less, even more preferably 4,000 or less, most preferably 3,000 or less, and particularly preferably 2,500 or less. Having the number-average molecular weight within this range results in excellent compatibility with the aromatic polycarbonate resin (A), and tends to improve transparency and hue. If the number-average molecular weight exceeds the above upper limit, compatibility decreases, and transparency and hue tend to deteriorate, and if the number-average molecular weight falls below the above lower limit, gas is more likely to be generated during molding. The number-average molecular weight (Mn) of the polyether compound (B) is the number-average molecular weight (Mn) calculated based on the hydroxyl value measured in accordance with JIS K 1557.

[0024] The molecular weight distribution (Mw / Mn) of the polyether compound (B) is preferably 1.90 or higher, more preferably 2.00 or higher, and even more preferably 2.30 or higher. There is no particular upper limit, but it is preferably 3.40 or lower, and more preferably 3.20 or lower. The molecular weight distribution of the polyether compound (B) can be calculated from the number-average molecular weight (Mn) and weight-average molecular weight (Mw) obtained by GPC (gel permeation chromatography) using a polystyrene standard.

[0025] The method for producing the polyether compound (B) is not particularly limited and can be produced by known methods. For example, a preferred method involves using at least one compound selected from formaldehyde, paraformaldehyde, or trioxane and polyalkylene glycol as raw materials, and using a homogeneous acid catalyst such as trifluoromethanesulfonic acid. Specifically, for example, it can be produced by the method described in Japanese Patent Application Publication No. 2024-107541.

[0026] The content of the polyether compound (B) is 0.01 to 4 parts by mass per 100 parts by mass of the aromatic polycarbonate resin (A). By including it in this amount, the aromatic polycarbonate resin composition has a good hue, excellent transparency, and excellent resistance to mold staining. The content is preferably 0.05 parts by mass or more, more preferably 0.1 parts by mass or more, even more preferably 0.3 parts by mass or more, even more preferably 0.5 parts by mass or more, preferably 3 parts by mass or less, more preferably 2 parts by mass or less, and even more preferably 1.5 parts by mass or less.

[0027] [Aromatic Polycarbonate Resin (A)] The aromatic polycarbonate resin (A) contained in the resin composition of the present invention is an aromatic polycarbonate resin in which the carbon atoms directly bonded to the carbonate bonds are each aromatic carbon atoms, and is used from the viewpoint of heat resistance, mechanical properties, electrical properties, etc. Aliphatic polycarbonates and polyether polycarbonates having oxyalkylene groups as repeating units are excluded as they are unsuitable from the viewpoint of the above effects.

[0028] Examples of aromatic dihydroxy compounds among the monomers used as raw materials for aromatic polycarbonate resins include: dihydroxybenzenes such as 1,2-dihydroxybenzene, 1,3-dihydroxybenzene (i.e., resorcinol), and 1,4-dihydroxybenzene; and dihydroxybiphenyls such as 2,5-dihydroxybiphenyl, 2,2'-dihydroxybiphenyl, and 4,4'-dihydroxybiphenyl.

[0029] Dihydroxynaphthalene compounds such as 2,2'-dihydroxy-1,1'-binaphthyl, 1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, and 2,7-dihydroxynaphthalene;

[0030] Dihydroxydiaryl ethers such as 2,2'-dihydroxydiphenyl ether, 3,3'-dihydroxydiphenyl ether, 4,4'-dihydroxydiphenyl ether, 4,4'-dihydroxy-3,3'-dimethyldiphenyl ether, 1,4-bis(3-hydroxyphenoxy)benzene, and 1,3-bis(4-hydroxyphenoxy)benzene;

[0031] 2,2-bis(4-hydroxyphenyl)propane (i.e., bisphenol A), 1,1-bis(4-hydroxyphenyl)propane, 2,2-bis(3-methyl-4-hydroxyphenyl)propane (i.e., bisphenol C), 2,2-bis(3-methoxy-4-hydroxyphenyl)propane, 2-(4-hydroxyphenyl)-2-(3-methoxy-4-hydroxyphenyl)propane, 1,1-bis(3-tert-butyl-4-hydroxyphenyl)propane, 2,2-bis(3,5-dimethyl-4-hydroxyphenyl)propane, 2,2-bis(3-cyclohexyl-4-hydroxyphenyl)propane, 2-(4-hydroxyphenyl)-2-(3-cyclohexyl-4-hydroxyphenyl)propane, α,α'-bis(4-hydroxyphenyl)-1,4-diisopropylbenzene, 1,3-bis[2-(4-hydroxyphenyl)-2-propyl]benzene, Bis(4-hydroxyphenyl)methane, Bis(4-hydroxyphenyl)cyclohexylmethane, Bis(4-hydroxyphenyl)phenylmethane, Bis(4-hydroxyphenyl)(4-propenylphenyl)methane, Bis(4-hydroxyphenyl)diphenylmethane, Bis(4-hydroxyphenyl)naphthylmethane, 1,1-bis(4-hydroxyphenyl)ethane, 1,1-bis(4-hydroxyphenyl)-1-phenylethane, 1,1-bis(4-hydroxyphenyl)-1-naphthylethane, 1,1-bis(4-hydroxyphenyl)butane, 2,2-bis(4-hydroxyphenyl)butane, 2,2-bis(4-hydroxyphenyl)pentane, 1,1-bis(4-hydroxyphenyl)hexane, 2,2-bis(4-hydroxyphenyl)hexane, 1,1-bis(4-hydroxyphenyl)octane, 2,2-bis(4-hydroxyphenyl)octane, Bis(hydroxyaryl)alkanes such as 4,4-bis(4-hydroxyphenyl)heptane, 2,2-bis(4-hydroxyphenyl)nonane, 1,1-bis(4-hydroxyphenyl)decane, and 1,1-bis(4-hydroxyphenyl)dodecane;

[0032] 1,1-bis(4-hydroxyphenyl)cyclopentane, 1,1-bis(4-hydroxyphenyl)cyclohexane, 1,1-bis(4-hydroxyphenyl)-3,3-dimethylcyclohexane, 1,1-bis(4-hydroxyphenyl)-3,4-dimethylcyclohexane, 1,1-bis(4-hydroxyphenyl)-3,5-dimethylcyclohexane, 1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane, 1,1-bis(4-hydroxy-3,5-dimethylphenyl)-3,3,5-trimethylcyclohexane, 1,1-bis(4-hydroxyphenyl)-3-propyl-5-methylcyclohexane, 1,1-bis(4-hydroxyphenyl)-3-tert-butyl-cyclohexane, 1,1-bis(4-hydroxyphenyl)-4-tert-butyl-cyclohexane, 1,1-bis(4-hydroxyphenyl)-3-phenylcyclohexane, 1,1-bis(4-hydroxyphenyl)-4-phenylcyclohexane, and other bis(hydroxyaryl)cycloalkanes;

[0033] 9,9-bis(4-hydroxyphenyl)fluorene, 9,9-bis(4-hydroxy-3-methylphenyl)fluorene and other cardo structure-containing bisphenols;

[0034] 4,4'-dihydroxydiphenyl sulfide, 4,4'-dihydroxy-3,3'-dimethyldiphenyl sulfide and other dihydroxydiaryl sulfides; 4,4'-dihydroxydiphenyl sulfoxide, 4,4'-dihydroxy-3,3'-dimethyldiphenyl sulfoxide and other dihydroxydiaryl sulfoxides; 4,4'-dihydroxydiphenyl sulfone, 4,4'-dihydroxy-3,3'-dimethyldiphenyl sulfone and other dihydroxydiaryl sulfones; and the like.

[0035] Among these, bis(hydroxyaryl)alkanes are preferred, among which bis(4-hydroxyphenyl)alkanes are preferred, and in view of impact resistance and heat resistance, 2,2-bis(4-hydroxyphenyl)propane (i.e., bisphenol A) and 2,2-bis(3-methyl-4-hydroxyphenyl)propane (i.e., bisphenol C) are particularly preferred. Incidentally, one type of aromatic dihydroxy compound may be used, or two or more types may be used in combination in any arbitrary combination and ratio.

[0036] Among the monomers that serve as raw materials for the aromatic polycarbonate resin, examples of the carbonate precursor include carbonyl halides, carbonate esters and the like. Incidentally, one type of carbonate precursor may be used, or two or more types may be used in combination in any arbitrary combination and ratio.

[0037] Specific examples of the carbonyl halide include phosgene; haloformates such as bischloroformate forms of dihydroxy compounds and monochloroformate forms of dihydroxy compounds.

[0038] Specific examples of the carbonate ester include diaryl carbonates such as diphenyl carbonate and ditolyl carbonate; dialkyl carbonates such as dimethyl carbonate and diethyl carbonate; carbonate forms of dihydroxy compounds such as biscarbonate forms of dihydroxy compounds, monocarbonate forms of dihydroxy compounds, and cyclic carbonates.

[0039] The production method of the aromatic polycarbonate resin (A) is not particularly limited, and any arbitrary method can be adopted. Examples thereof include the interfacial polymerization method, the melt transesterification method, the pyridine method, the ring-opening polymerization method of cyclic carbonate compounds, and the solid-phase transesterification method of prepolymers. Among these, the interfacial polymerization method is particularly preferred.

[0040] In the present invention, the aromatic polycarbonate resin (A) used is preferably one that is sealed with a monovalent phenolic hydroxyl group as a terminal stopper during polymerization. The terminal stopper is preferably an alkylphenol compound, where the alkyl group has 4 or more carbon atoms, preferably 12 or fewer, more preferably 10 or fewer, and even more preferably 8 or fewer. The alkyl group may be linear or branched, with branched being preferred. Particularly preferred alkylphenol compounds include p-tert-butylphenol, p-tert-hexylphenol, and p-tert-octylphenol. Resins sealed at the ends with monofunctional phenols such as alkylphenyl groups are preferred because they allow for high fluidity while maintaining strength and also exhibit good color. While it is common practice to lower the molecular weight of polycarbonate resins to improve fluidity, using an aromatic polycarbonate resin with such a terminal structure allows for high fluidity to be achieved even when adopting a desired molecular weight without reducing it during material design, thus enabling good color and fluidity while maintaining high strength and impact resistance.

[0041] The molecular weight of the aromatic polycarbonate resin (A) is preferably 10,000 to 50,000 in viscosity-average molecular weight (Mv), more preferably 10,000 to 40,000, more preferably 10,000 to 30,000 and 10,000 to 26,000, even more preferably 10,500 or more, 11,000 or more, particularly 11,500 or more, most preferably 12,000 or more, even more preferably 24,000 or less, and particularly preferably 20,000 or less. By setting the viscosity-average molecular weight to be above the lower limit of the above range, the mechanical strength of the aromatic polycarbonate resin composition of the present invention can be further improved, and by setting the viscosity-average molecular weight to be below the upper limit of the above range, the decrease in fluidity of the aromatic polycarbonate resin composition of the present invention can be suppressed and improved, thereby improving moldability and facilitating thin-wall molding. Furthermore, two or more aromatic polycarbonate resins with different viscosity-average molecular weights may be mixed and used. In this case, polycarbonate resins whose viscosity-average molecular weight is outside the above preferred range may also be mixed.

[0042] The viscosity-average molecular weight (Mv) was determined using methylene chloride as the solvent, and the intrinsic viscosity [η] (in dl / g) at 25°C was calculated using an Ubbelohde viscometer. Schnell's viscosity formula, i.e., η = 1.23 × 10⁻¹⁰, was used. －４ Mv ０．８３ It refers to the value calculated from [the formula]. Furthermore, intrinsic viscosity [η] is the specific viscosity [η] at each solution concentration [C] (g / dl). ｓｐ This value was calculated by measuring [the value] and using the following formula.

[0043] Furthermore, in order to improve the appearance and fluidity of the molded article, the aromatic polycarbonate resin (A) may contain a polycarbonate oligomer. The viscosity-average molecular weight (Mv) of this polycarbonate oligomer is usually 1,500 or more, preferably 2,000 or more, and usually 9,500 or less, preferably 9,000 or less. Moreover, it is preferable that the amount of polycarbonate oligomer contained be 30% by mass or less of the total amount of the aromatic polycarbonate resin and the polycarbonate oligomer.

[0044] Furthermore, the aromatic polycarbonate resin (A) may be not only virgin raw material but also aromatic polycarbonate resin recycled from used products (so-called material-recycled polycarbonate resin). However, the recycled aromatic polycarbonate resin is preferably 80% by mass or less of the aromatic polycarbonate resin (A), and more preferably 50% by mass or less. This is because recycled aromatic polycarbonate resin is highly likely to have undergone degradation such as thermal degradation and aging degradation, and using more of such aromatic polycarbonate resin than the above range may reduce its hue and mechanical properties.

[0045] [Phosphorus-based stabilizer (C)] The polycarbonate resin composition of the present invention preferably further contains a phosphorus-based stabilizer. The inclusion of a phosphorus-based stabilizer further improves the hue of the polycarbonate resin composition of the present invention and enhances its heat resistance to discoloration. Any known phosphorus-based stabilizer can be used. Specific examples include phosphorus oxoacids such as phosphoric acid, phosphonic acid, phosphorous acid, phosphinic acid, and polyphosphate; acidic pyrophosphate metal salts such as sodium acidic pyrophosphate, potassium acidic pyrophosphate, and calcium acidic pyrophosphate; phosphates of group 1 or group 2 metals such as potassium phosphate, sodium phosphate, cesium phosphate, and zinc phosphate; phosphate compounds, phosphite compounds, and phosphonite compounds, but phosphite compounds are particularly preferred. By selecting a phosphite compound, a polycarbonate resin composition with higher discoloration resistance and continuous productivity can be obtained.

[0046] Here, the phosphite compound has the general formula: P(OR) ３is a trivalent phosphorus compound represented by, and R represents a monovalent or divalent organic group. Examples of such phosphite compounds include triphenyl phosphite, tris(monononylphenyl) phosphite, tris(monononyl / dinonylphenyl) phosphite, tris(2,4-di-tert-butylphenyl) phosphite, monooctyldiphenyl phosphite, dioctylmonophenyl phosphite, monodecyldiphenyl phosphite, didecylmonophenyl phosphite, tridecyl phosphite, trilauryl phosphite, tristearyl phosphite, distearyl pentaerythritol diphosphite, bis(2,4-di-tert-butyl-4-methylphenyl) pentaerythritol phosphite, bis(2,6-di-tert-butylphenyl) octyl phosphite, 2,2-methylenebis(4,6-di-tert-butylphenyl) octyl phosphite, tetrakis(2,4-di-tert-butylphenyl)-4,4'-biphenylene-diphosphite, 6-[3-(3-tert-butyl-hydroxy-5-methylphenyl)propoxy]-2,4,8,10-tetra-tert-butyldibenzo[d,f][1,3,2]-dioxaphosphepine, and the like.

[0047] Among such phosphite compounds, aromatic phosphite compounds represented by the following general formula (2) or (3) are more preferable, as they effectively enhance the heat discoloration resistance of the polycarbonate resin composition of the present invention.

[0048] (wherein R １ , R ２ and R ３ may be the same or different, and each represents an aryl group having 6 to 30 carbon atoms.)

[0049] (wherein R ４ and R ５ may be the same or different, and each represents an aryl group having 6 to 30 carbon atoms.)

[0050] Among the phosphite compounds represented by the above general formula (2), triphenyl phosphite, tris(mononylphenyl) phosphite, and tris(2,4-di-tert-butylphenyl) phosphite are particularly preferred, with tris(2,4-di-tert-butylphenyl) phosphite being more preferred. Specific examples of such organic phosphite compounds include "ADEKA Stab 1178" manufactured by ADEKA Corporation, "Sumiriser TNP" manufactured by Sumitomo Chemical Co., Ltd., "JP-351" manufactured by Johoku Chemical Industry Co., Ltd., "ADEKA Stab 2112" manufactured by ADEKA Corporation, "Irgaphos 168" manufactured by BASF, and "JP-650" manufactured by Johoku Chemical Industry Co., Ltd.

[0051] Among the phosphite compounds having a spiro-ring skeleton represented by the above general formula (3), those having a pentaerythritol diphosphite structure, such as bis(2,4-di-tert-butyl-4-methylphenyl)pentaerythritol diphosphite, bis(2,6-di-tert-butyl-4-methylphenyl)pentaerythritol diphosphite, and bis(2,4-dicumylphenyl)pentaerythritol diphosphite, are particularly preferred. Specific examples of such organic phosphite compounds include, for example, "ADEKA Stab PEP-24G" and "ADEKA Stab PEP-36" manufactured by ADEKA Corporation, and "Doverphos S-9228PC" manufactured by Dover Chemical Corporation.

[0052] Among phosphite compounds, aromatic phosphite compounds represented by the above general formula (3) are more preferred because they have superior hue.

[0053] Furthermore, the phosphorus-based stabilizer (C) may contain one type, or two or more types in any combination and ratio. In particular, it is especially preferable that the phosphorus-based stabilizer (C) contains two or more phosphorus compounds having a phosphite structure, of which one or more are phosphite compounds having a spiro-ring skeleton.

[0054] The content of the phosphorus-based stabilizer (C) is preferably 0.005 to 0.5 parts by mass, more preferably 0.007 parts by mass or more, even more preferably 0.008 parts by mass or more, particularly preferably 0.01 parts by mass or more, even more preferably 0.4 parts by mass or less, even more preferably 0.3 parts by mass or less, even more preferably 0.2 parts by mass or less, and particularly preferably 0.1 parts by mass or less, per 100 parts by mass of polycarbonate resin (A). If the content of the phosphorus-based stabilizer (C) is less than 0.005 parts by mass, the hue and heat discoloration resistance tend to be insufficient, and if it exceeds 0.5 parts by mass, not only does the heat discoloration resistance worsen, but the moist heat stability also tends to decrease.

[0055] [Epoxy compound (D1) and / or oxetane compound (D2)] The aromatic polycarbonate resin composition of the present invention may also preferably contain an epoxy compound (D1) and / or an oxetane compound (D2). The inclusion of an epoxy compound and / or an oxetane compound can further improve heat resistance and discoloration. The content of the epoxy compound (D1) and / or oxetane compound (D2) is preferably 0.0005 to 0.2 parts by mass per 100 parts by mass of aromatic polycarbonate resin (A).

[0056] As the epoxy compound (D1), compounds having one or more epoxy groups in one molecule are used. Specifically, these include phenyl glycidyl ether, allyl glycidyl ether, t-butylphenyl glycidyl ether, 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate, 3,4-epoxy-6-methylcyclohexylmethyl-3',4'-epoxy-6'-methylcyclohexanecarboxylate, 2,3-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate, and 4-(3,4-epoxy-5-methylcyclohexyl)butyl-3',4'-epoxy Xycyclohexanecarboxylate, 3,4-epoxycyclohexylethylene oxide, cyclohexylmethyl 3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-6-methylcyclohexylmethyl-6'-methylcyclohexanecarboxylate, bisphenol-A diglycidyl ether, tetrabromobisphenol-A glycidyl ether, diglycidyl ester of phthalate, diglycidyl ester of hexahydrophthalate, bis-epoxydicyclopentadienyl ether, bis-epoxy Diylene glycol, bis-epoxycyclohexyl adipate, butadiene diepoxide, tetraphenylethylene epoxide, octyl epoxy talate, epoxidized polybutadiene, 3,4-dimethyl-1,2-epoxycyclohexane, 3,5-dimethyl-1,2-epoxycyclohexane, 3-methyl-5-t-butyl-1,2-epoxycyclohexane, octadecyl-2,2-dimethyl-3,4-epoxycyclohexane carboxylate, N-butyl-2,2-dimethyl-3,4-epoxycyclohexane carboxylate Xylate, cyclohexyl-2-methyl-3,4-epoxycyclohexanecarboxylate, N-butyl-2-isopropyl-3,4-epoxy-5-methylcyclohexanecarboxylate, octadecyl-3,4-epoxycyclohexanecarboxylate, 2-ethylhexyl-3',4'-epoxycyclohexanecarboxylate, 4,6-dimethyl-2,3-epoxycyclohexyl-3',4'-epoxycyclohexanecarboxylate, 4,5-epoxytetrahydrophthalic anhydride, 3-t-butyl-4,Preferred examples include 5-epoxy tetrahydrophthalic anhydride, diethyl 4,5-epoxy-cis-1,2-cyclohexanedicarboxylate, di-n-butyl-3-t-butyl-4,5-epoxy-cis-1,2-cyclohexanedicarboxylate, epoxidized soybean oil, and epoxidized linseed oil.

[0057] Of these, alicyclic epoxy compounds are preferred, and 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate is particularly preferred.

[0058] Furthermore, polyalkylene glycol derivatives having epoxy groups at one or both ends can also be preferably used. Polyalkylene glycols having epoxy groups at both ends are particularly preferred.

[0059] Examples of polyalkylene glycol derivatives containing epoxy groups in their structure include, for example, polyalkylene glycol derivatives such as polyethylene glycol diglycidyl ether, poly(1-methyl)ethylene glycol diglycidyl ether, poly(2-ethyl)ethylene glycol diglycidyl ether, polytetramethylene glycol diglycidyl ether, polyethylene glycol-poly(1-methyl)ethylene glycol diglycidyl ether, polytetramethylene glycol-poly(2-methyl)ethylene glycol diglycidyl ether, and polytetramethylene glycol-poly(1-ethyl)ethylene glycol diglycidyl ether.

[0060] Epoxy compounds may be used individually or in combination of two or more types.

[0061] The preferred content of the epoxy compound (D1) is 0.0005 to 0.2 parts by mass per 100 parts by mass of aromatic polycarbonate resin (A), more preferably 0.001 parts by mass or more, even more preferably 0.003 parts by mass or more, even more preferably 0.005 parts by mass or more, particularly preferably 0.01 parts by mass or more, and more preferably 0.15 parts by mass or less, even more preferably 0.1 parts by mass or less, particularly preferably 0.05 parts by mass or less. If the content of the epoxy compound is less than 0.0005 parts by mass, the hue and heat discoloration resistance tend to be insufficient, and if it exceeds 0.2 parts by mass, the heat discoloration resistance tends to worsen, and the hue and moist heat stability also tend to decrease.

[0062] As the oxetane compound (D2), any compound having one or more oxetane groups in its molecule can be used, including monooxetane compounds having one oxetane group in their molecule and bifunctional or polyoxetane compounds having two or more oxetane groups in their molecule. By including an oxetane compound, good hue and high heat resistance to discoloration can be further improved.

[0063] Examples of monooxetane compounds (D2) include compounds represented by the following general formulas (4), (5), or (6).

[0064]

[0065] In general formulas (4) to (6), R １ is an alkyl group, R ２ R represents an alkyl group or a phenyl group. ３ is a divalent organic group which may have an aromatic ring, and n is 0 or 1.

[0066] In the above general formulas (4) to (6), R １ R is an alkyl group, preferably an alkyl group having 1 to 6 carbon atoms, preferably a methyl group or an ethyl group, and particularly preferably an ethyl group. ２R is an alkyl group or a phenyl group, preferably an alkyl group having 2 to 10 carbon atoms, and may be a linear alkyl group, a branched alkyl group or an alicyclic alkyl group, or a linear or branched alkyl group having an ether bond (ether oxygen atom) in the middle of the alkyl chain. ２ Specific examples include ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, 2-ethylhexyl group, nonyl group, decyl group, 3-oxypentyl group, cyclohexyl group, phenyl group, etc. Among these, R ２ The group is preferably a 2-ethylhexyl group, a phenyl group, or a cyclohexyl group.

[0067] Specific examples of compounds of general formula (4) include 3-hydroxymethyl-3-methyloxetane, 3-hydroxymethyl-3-ethyloxetane, 3-hydroxymethyl-3-propyloxetane, and 3-hydroxymethyl-3-n-butyloxetane. Among these, 3-hydroxymethyl-3-methyloxetane and 3-hydroxymethyl-3-ethyloxetane are particularly preferred. Specific examples of compounds of general formula (5) include 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, which is particularly preferred.

[0068] In general formula (6), R ３ This is a divalent organic group that may have an aromatic ring, and examples include linear or branched alkylene groups having 1 to 12 carbon atoms, such as ethylene, propylene, butylene, neopentylene, n-pentamethylene, n-hexamethylene, and phenylene groups, formula: -CH ２ -Ph-CH ２ - or -CH ２ -Ph-Ph-CH ２ Examples include divalent groups represented by - (where Ph indicates a phenyl group), hydrogenated bisphenol A residues, hydrogenated bisphenol F residues, hydrogenated bisphenol Z residues, cyclohexanedimethanol residues, and tricyclodecanedimethanol residues.

[0069] Specific examples of compounds of general formula (6) include bis(3-methyl-3-oxetanylmethyl) ether, bis(3-ethyl-3-oxetanylmethyl) ether, bis(3-propyl-3-oxetanylmethyl) ether, bis(3-butyl-3-oxetanylmethyl) ether, 1,4-bis[(3-ethyl-3-oxetanylmethoxy)methyl]benzene, 3-ethyl-3{[(3-ethyloxetan-3-yl)methoxy]methyl}oxetane, 4,4'-bis[(3-ethyl-3-oxetanyl)methoxymethyl]biphenyl, and 1,4-bis[(3-ethyl-3-oxetanyl)methoxymethyl]benzene, which are particularly preferred.

[0070] The oxetane compound (D2) may be used alone or in combination of two or more types.

[0071] When an oxetane compound (D2) is included, its content is preferably 0.0005 to 0.2 parts by mass, more preferably 0.001 parts by mass or more, even more preferably 0.003 parts by mass or more, even more preferably 0.005 parts by mass or more, particularly preferably 0.01 parts by mass or more, and more preferably 0.15 parts by mass or less, even more preferably 0.1 parts by mass or less, particularly preferably 0.05 parts by mass or less. If the content of the oxetane compound is less than 0.0005 parts by mass, the hue and heat discoloration resistance tend to be insufficient, and if it exceeds 0.2 parts by mass, the heat discoloration resistance tends to worsen, and gas is likely to be generated during molding.

[0072] The epoxy compound (D1) and the oxetane compound (D2) may be included together, and the total content when both are included is preferably 0.0005 to 0.2 parts by mass per 100 parts by mass of aromatic polycarbonate resin (A). More preferably 0.001 parts by mass or more, even more preferably 0.003 parts by mass or more, even more preferably 0.005 parts by mass or more, particularly preferably 0.01 parts by mass or more, and also more preferably 0.15 parts by mass or less, even more preferably 0.1 parts by mass or less, particularly preferably 0.05 parts by mass or less.

[0073] [Release Agent (E)] The resin composition of the present invention may also preferably contain a release agent. Examples of release agents include aliphatic carboxylic acids, fatty acid esters which are esters of aliphatic carboxylic acids and alcohols, aliphatic hydrocarbon compounds with a number average molecular weight of 200 to 15,000, and polysiloxane-based silicone oils. The number average molecular weight of aliphatic hydrocarbon compounds can be measured by gel permeation chromatography (GPC) using an organic solvent.

[0074] Examples of aliphatic carboxylic acids include saturated or unsaturated aliphatic monovalent, divalent, or trivalent carboxylic acids. Here, aliphatic carboxylic acids also include alicyclic carboxylic acids. Among these, preferred aliphatic carboxylic acids are monovalent or divalent carboxylic acids having 6 to 36 carbon atoms, and more preferably aliphatic saturated monovalent carboxylic acids having 6 to 36 carbon atoms. Specific examples of such aliphatic carboxylic acids include palmitic acid, stearic acid, caproic acid, capric acid, lauric acid, arachidic acid, behenic acid, lignoceric acid, cerotic acid, melissic acid, tetrariacontanoic acid, montanic acid, adipic acid, and azelaic acid.

[0075] As the aliphatic carboxylic acid in the ester of an aliphatic carboxylic acid and an alcohol, for example, the same aliphatic carboxylic acid as described above can be used. On the other hand, as the alcohol, for example, saturated or unsaturated monohydric or polyhydric alcohols can be used. These alcohols may have substituents such as fluorine atoms or aryl groups. Among these, monohydric or polyhydric saturated alcohols having 30 or fewer carbon atoms are preferred, and aliphatic saturated monohydric alcohols or aliphatic saturated polyhydric alcohols having 30 or fewer carbon atoms are more preferred. Here, "aliphatic" is used as a term that also includes alicyclic compounds.

[0076] Specific examples of such alcohols include octanol, decanol, dodecanol, stearyl alcohol, behenyl alcohol, ethylene glycol, diethylene glycol, glycerin, pentaerythritol, 2,2-dihydroxyperfluoropropanol, neopentylene glycol, ditrimethylolpropane, and dipentaerythritol.

[0077] Furthermore, the above-mentioned esters may contain aliphatic carboxylic acids and / or alcohols as impurities. Also, the above-mentioned esters may be pure substances or mixtures of multiple compounds. Moreover, the aliphatic carboxylic acids and alcohols that combine to form a single ester may be used individually, or two or more may be used in any combination and ratio.

[0078] Specific examples of esters of aliphatic carboxylic acids and alcohols include beeswax (a mixture mainly composed of myricyl palmitate), stearyl stearate, behenyl behenate, stearyl behenate, glycerin monopalmitate, glycerin monostearate, glycerin distearate, glycerin tristearate, pentaerythritol monopalmitate, pentaerythritol monostearate, pentaerythritol distearate, pentaerythritol tristearate, and pentaerythritol tetrastearate.

[0079] Examples of aliphatic hydrocarbons with a number-average molecular weight of 200 to 15,000 include liquid paraffin, paraffin wax, microwax, polyethylene wax, Fischer-Tropsch wax, and α-olefin oligomers having 3 to 12 carbon atoms. Alicyclic hydrocarbons are also included as aliphatic hydrocarbons. These hydrocarbons may also be partially oxidized. Among these, paraffin wax, polyethylene wax, or partially oxidized polyethylene wax are preferred, with paraffin wax and polyethylene wax being more preferred. The number-average molecular weight of the aliphatic hydrocarbons is preferably 5,000 or less. The aliphatic hydrocarbon may be a single substance, but a mixture of substances with various components and molecular weights can also be used as long as the main component is within the above range.

[0080] Examples of polysiloxane-based silicone oils include dimethyl silicone oil, methylphenyl silicone oil, diphenyl silicone oil, and fluorinated alkyl silicone.

[0081] Furthermore, the above-mentioned release agent may contain one type, or two or more types in any combination and ratio.

[0082] The content of the release agent (E) is usually 0.001 parts by mass or more, preferably 0.005 parts by mass or more, more preferably 0.01 parts by mass or more, per 100 parts by mass of aromatic polycarbonate resin (A), and is also usually 2 parts by mass or less, preferably 1 part by mass or less, more preferably 0.5 parts by mass or less, and particularly preferably 0.1 parts by mass or less. If the content of the release agent is below the lower limit of the above range, the release effect may not be sufficient, and if the content of the release agent exceeds the upper limit of the above range, a decrease in hydrolysis resistance and mold contamination during injection molding may occur.

[0083] As the release agent (E), a fatty acid ester is more preferred in that it improves YI and causes less mold contamination, and its content is preferably 0.005 to 0.5 parts by mass, and particularly preferably 0.01 to 0.1 parts by mass, per 100 parts by mass of aromatic polycarbonate resin (A).

[0084] [Additives, etc.] The aromatic polycarbonate resin composition of the present invention may contain other additives besides those mentioned above, such as antioxidants, ultraviolet absorbers, fluorescent whitening agents, pigments, dyes, polymers other than polycarbonate resin, flame retardants, impact modifiers, antistatic agents, plasticizers, and compatibilizers. These additives may be blended one or more types. It is preferable not to include fluororesins as they tend to impair transparency, and if they are included, it is preferable that the amount is less than 1 part by mass.

[0085] The aromatic polycarbonate resin composition of the present invention preferably contains 50% by mass or more of aromatic polycarbonate resin (A), more preferably 55% by mass or more, and depending on the application, it may contain 60% by mass or more, 65% by mass or more, 70% by mass or more, 75% by mass or more, 80% by mass or more, 90% by mass or more, and preferably 99% by mass or less, more preferably 95% by mass or less, even more preferably 90% by mass or less, even more preferably 85% by mass or less, and depending on the application, it may contain 80% by mass or less, 78% by mass or less, or 75% by mass or less. Furthermore, if other polymers other than aromatic polycarbonate resin (A) are included, their content is preferably 20 parts by mass or less, more preferably 10 parts by mass or less, even more preferably 5 parts by mass or less, and particularly preferably 3 parts by mass or less, per 100 parts by mass of aromatic polycarbonate resin (A).

[0086] [Method for Producing Aromatic Polycarbonate Resin Composition] There are no limitations on the method for producing the aromatic polycarbonate resin composition of the present invention, and a wide range of known methods for producing aromatic polycarbonate resin compositions can be employed. For example, an aromatic polycarbonate resin (A), a polyether compound (B), and other components to be added as needed are pre-mixed using various mixers such as a tumbler or a Henschel mixer, and then melt-kneaded using a kneader such as a Banbury mixer, roll, brabender, single-screw (kneading) extruder, twin-screw (kneading) extruder, or kneader. The melt-kneading temperature is not particularly limited, but is usually in the range of 240 to 320°C.

[0087] [Aromatic Polycarbonate Resin Composition] The aromatic polycarbonate resin composition of the present invention has excellent hue and therefore excellent YI (yellowing degree). The initial YI value at a 300 mm optical path length is preferably 20 or less, more preferably 19 or less, even more preferably 18 or less, and among these, 17 or less, 16 or less, 15 or less, and particularly preferably 14 or less. Details of the measurement of the YI value are as described in the examples.

[0088] [Optical Components] The aromatic polycarbonate resin composition of the present invention can be used to manufacture optical components by molding pellets obtained by pelletizing the above-mentioned aromatic polycarbonate resin composition using various molding methods. Alternatively, optical components can be manufactured by directly molding the resin that has been melt-kneaded in an extruder without going through pellets. Examples of various molding methods include injection molding, injection compression molding, extrusion molding, shape extrusion, transfer molding, hollow molding, gas-assisted hollow molding, blow molding, extrusion blow molding, IMC (in-mold coating molding) molding, rotational molding, multilayer molding, two-color molding, insert molding, sandwich molding, foam molding, and pressure molding.

[0089] The aromatic polycarbonate resin composition of the present invention has good hue, excellent transparency, and generates little gas during molding and contaminates the mold, making it suitable for use in injection molding to form optical components, particularly thin-walled optical components that are prone to mold contamination. When using the resin composition during injection molding, especially in the case of thin-walled molded bodies such as thin-walled optical components, it is preferable to mold at a resin composition temperature higher than the 260 to 300°C generally applied to injection molding of polycarbonate resin compositions, with a resin composition temperature of 305 to 400°C being preferred. A resin composition temperature of 310°C or higher is more preferable, 315°C or higher is even more preferable, 320°C or higher is particularly preferable, and 390°C or lower is even more preferable. When using conventional aromatic polycarbonate resin compositions, there was a problem that yellowing of the molded body was likely to occur when the resin composition temperature during molding was increased to form thin-walled molded bodies. However, by using the resin composition of the present invention, it is possible to manufacture molded bodies with good hue and high transparency, particularly thin-walled optical components, even within the above temperature range. If the resin composition temperature is difficult to measure directly, it is determined as the barrel setting temperature.

[0090] Here, a thin-walled molded body refers to a molded body having a plate-like portion with a wall thickness (thickness) of 1 mm or less, preferably 0.8 mm or less, and more preferably 0.6 mm or less. Here, the plate-like portion may be a flat plate or a curved plate, may have a flat surface or may have irregularities on its surface, and may have an inclined surface or a wedge-shaped cross-section.

[0091] Optical components include parts for equipment and devices that directly or indirectly utilize light sources such as LEDs, organic ELs, incandescent bulbs, fluorescent lamps, and cathode tubes. Specifically, these include headlights, taillights, and fog lights for vehicles such as automobiles and motorcycles.

[0092] Furthermore, a typical example of an optical component is a light guide member. A light guide member is a member that has a light source (e.g., LED, organic EL, incandescent bulb, fluorescent lamp, cathode tube, etc., particularly an LED light source) placed on one side or back surface, and directs the light from the light source into the light guide member, causing it to reflect and refract while guiding and / or emitting light. Preferred light guide members include light guide plates, surface light emitting materials, light guide films, light guide sheets, and vehicle light guides (e.g., light guides for automobile lamps), with light guide plates being particularly preferred. Light guide plates can be suitably used in the fields of liquid crystal backlight units, various display devices, and lighting devices, and are particularly suitable for use as high-performance edge-lit type light guide plates. As for light guide members, those with an optical path length of preferably 30 mm or more, more preferably 50 mm or more, are preferred.

[0093] Furthermore, the light guide member is preferably the thin-walled molded body described above, which may be a flat plate or a curved plate, may have a flat surface or may have irregularities on the surface, and may have an inclined cross-section or a wedge shape in which the thickness changes sequentially in the length direction. Examples of light guide films or sheets include sheets or films with a thickness of less than 1 mm, preferably 0.8 mm or less, more preferably 0.5 mm or less, even more preferably 0.4 mm or less, and particularly preferably 0.3 mm or less. Examples of light guide plates include those with a thickness of less than 3 mm, preferably 2 mm or less, more preferably 1 mm or less, preferably 0.3 mm or more, and particularly preferably 0.4 mm or more, but are not limited to these.

[0094] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to the following examples. The raw materials used in the following examples and comparative examples are shown in Table 1 below.

[0095]

[0096] (Examples 1-15, Comparative Examples 1-6) [Production of Resin Composition Pellets] The above components were blended in the proportions (parts by mass) shown in Table 2 and below, mixed in a tumbler for 20 minutes, and then melt-kneaded at a cylinder temperature of 240°C using a vented single-screw extruder with a screw diameter of 40 mm (Tanabe Plastic Machinery Co., Ltd. "VS-40"). The mixture was extruded as strands through the nozzle of the die at the tip of the extruder, and the strands were cut in a pelletizer to obtain pellets.

[0097] [Hue (YI)] The obtained pellets were dried at 120°C for 4 hours in a hot air circulation dryer, and then a long-path molded product (300 mm x 7 mm x 4 mm thick) was molded using an injection molding machine (Sodick "HSP100A") at a resin composition temperature of 340°C and a mold temperature of 80°C. The YI (degree of yellowing) of this long-path molded product was measured with a path length of 300 mm (initial YI). A long-path spectrophotometer (Nippon Denshoku Industries "ASA 1", C light source, 2° field of view) was used for the measurement.

[0098] [Gas generation during molding: Mold contamination evaluation (mold deposits)] Contamination evaluation in injection molding (mold fouling) The pellets obtained above were dried at 120°C for 4 hours, and then 200 injection moldings were performed using an injection molding machine (Sumitomo Heavy Industries "SE7M") with a teardrop-shaped mold as shown in Figure 1, under the conditions of a cylinder temperature of 340°C, a molding cycle of 10 seconds, and a mold temperature of 40°C. The state of contamination by white deposits that formed on the metal mirror surface on the fixed side of the mold after completion was visually evaluated according to the following criteria. ○: The amount of deposits on the mold is small, and the mold contamination resistance is extremely good. △: The amount of deposits on the mold is slightly between ○ and ×. ×: There are many deposits on the mold, and mold contamination is significant.

[0099] The teardrop-shaped mold shown in Figure 1 is designed so that the resin composition is introduced from the gate G and the generated gas easily accumulates at the tip P. The width of the gate G is 1 mm and the thickness is 1 mm. In Figure 1, the width h1 is 14.5 mm, the length h2 is 7 mm, the length h3 is 27 mm, and the thickness of the molded part is 3 mm.

[0100] The evaluation results are shown in Table 2 and below.

[0101]

[0102]

[0103]

[0104] The aromatic polycarbonate resin composition of the present invention has good color, excellent transparency, and excellent resistance to mold contamination, making it extremely suitable for use in various molded products, especially optical components.

Claims

1. An aromatic polycarbonate resin composition characterized by containing 0.01 to 4 parts by mass of a polyether compound (B) represented by the following general formula (1) per 100 parts by mass of an aromatic polycarbonate resin (A). (In formula (1), R represents a linear or branched hydrocarbon group having 2 to 6 carbon atoms, l, m, and n are integers from 1 to 40, and s is an integer from 1 to 30. Multiple Rs may be the same or different.) 2. The aromatic polycarbonate resin composition according to claim 1, wherein R in general formula (1) is an alkylene group selected from the group consisting of a 1,2-ethylene group, a 1,2-propylene group, a trimethylene group, a 1,2-butylene group, and a tetramethylene group.

3. R-O units and CH in general formula (1) ２ The aromatic polycarbonate resin composition according to claim 1 or 2, wherein the molar ratio of -O units is 50 to 95:50 to 5.

4. The aromatic polycarbonate resin composition according to claim 1 or 2, wherein the number average molecular weight (Mn) of the polyether compound (B) is 200 to 10,000.

5. The aromatic polycarbonate resin composition according to claim 1 or 2, wherein the viscosity-average molecular weight (Mv) of the aromatic polycarbonate resin (A) is 10,000 to 50,000.

6. The aromatic polycarbonate resin composition according to claim 1 or 2, further comprising 0.005 to 0.5 parts by mass of a phosphorus-based stabilizer (C) per 100 parts by mass of aromatic polycarbonate resin (A).

7. The aromatic polycarbonate resin composition according to claim 6, wherein the phosphorus-based stabilizer (C) is a phosphorus-based compound having a phosphite structure.

8. The aromatic polycarbonate resin composition according to claim 7, wherein the phosphorus-based stabilizer (C) comprises two or more phosphorus-based compounds having a phosphite structure, one or more of which are phosphite compounds having a spiro-ring skeleton.

9. The aromatic polycarbonate resin composition according to claim 1 or 2, further comprising 0.0005 to 0.2 parts by mass of an epoxy compound (D1) and / or an oxetane compound (D2) per 100 parts by mass of an aromatic polycarbonate resin (A).

10. The aromatic polycarbonate resin composition according to claim 1 or 2, further comprising 0.005 to 0.5 parts by mass of fatty acid ester per 100 parts by mass of aromatic polycarbonate resin (A).

11. Pellets comprising the aromatic polycarbonate resin composition according to any one of claims 1 to 10.

12. A molded article obtained by molding an aromatic polycarbonate resin composition according to any one of claims 1 to 10.

13. A molded body obtained by molding the pellets described in claim 11.

14. The molded article according to claim 12 or 13, which is an optical component.

15. The optical component according to claim 14, which is a light guide member.

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