Substrate processing device, processing liquid supply device, substrate processing method, and processing liquid supply method

Abstract

This processing liquid supply device includes a supply pipe that guides a processing liquid to a chamber. A plurality of adjustment units are provided in a plurality of portions of the supply pipe. Each of the adjustment units includes a temperature adjustment section and a bypass pipe. The temperature adjustment section adjusts the temperature of the processing liquid flowing through the supply pipe. The bypass pipe is provided in the supply pipe to bypass the temperature adjustment section. In each of the adjustment units, one valve is provided in the supply pipe, and another valve is provided in the bypass pipe. The one valve and the other valve are controlled such that the processing liquid flows through the temperature adjustment section when the temperature adjustment section is normal, while the processing liquid bypasses the temperature adjustment section in the event of a failure of the temperature adjustment section.

Description

Substrate processing apparatus, processing liquid supply apparatus, substrate processing method, and processing liquid supply method

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method for performing processing on a substrate using a processing liquid. The present invention also relates to a processing liquid supply apparatus and a processing liquid supply method for supplying a processing liquid to a chamber.

[0002] Substrate processing apparatuses are used to perform various types of processing on substrates such as semiconductor substrates, substrates for FPDs (Flat Panel Displays) for liquid crystal display devices or organic EL (Electro Luminescence) display devices, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, or solar cell substrates.

[0003] As an example of a substrate processing apparatus, Patent Document 1 describes a substrate processing apparatus that performs processing on a substrate using a chemical liquid. That substrate processing apparatus includes a plurality of processing units (chambers) and a chemical liquid supply apparatus (processing liquid supply apparatus). The processing liquid supply apparatus supplies the chemical liquid to the plurality of chambers. In each chamber, processing for supplying the chemical liquid supplied from the processing liquid supply apparatus to the substrate is performed.

[0004] JP 2021-52038 A

[0005] In the processing of a substrate using a chemical liquid, for example, etching of a film formed on the surface of the substrate is performed. In this case, the etching rate of the film varies depending on the temperature of the chemical liquid. Therefore, in order to reduce the occurrence of substrate processing defects, the temperature of the chemical liquid supplied from the processing liquid supply apparatus to the plurality of chambers needs to be appropriately adjusted according to the required etching amount.

[0006] Accordingly, the processing liquid supply apparatus is provided with a temperature adjustment device in a part of the piping that supplies the chemical liquid to the plurality of chambers. However, if the temperature adjustment device of the processing liquid supply apparatus fails, the temperature of the chemical liquid cannot be adjusted, which leads to mass production of defective products.

[0007] Therefore, in order to continuously regulate the temperature of the chemical solution, a configuration in which multiple temperature control devices are installed in multiple sections of the piping through which the chemical solution flows can be considered. In this case, even if some of the temperature control devices fail, the remaining temperature control devices will be able to continue regulating the temperature of the chemical solution.

[0008] However, some malfunctioning temperature control devices may cause unintended temperature changes. In this case, the temperature changes occurring in the malfunctioning temperature control device will act as a disturbance, affecting the temperature of the chemical solution flowing through the piping. If the temperature of the chemical solution cannot be controlled due to the disturbance, processing defects may occur on the circuit board.

[0009] The object of the present invention is to provide a substrate processing apparatus, a processing liquid supply apparatus, a substrate processing method, and a processing liquid supply method that reduce the occurrence of substrate processing defects caused by the failure of some of the multiple temperature control units that adjust the temperature of the processing liquid.

[0010] (a) A substrate processing apparatus according to one aspect of the present invention comprises a chamber for processing a substrate using a processing liquid, a processing liquid supply device for supplying the processing liquid to the chamber, and a control unit for controlling the chamber and the processing liquid supply device, wherein the processing liquid supply device includes a supply channel for guiding the processing liquid to the chamber, a plurality of adjustment units provided in a plurality of parts of the supply channel, and a fault determination unit, each adjustment unit being provided in the supply channel for adjusting the temperature of the processing liquid flowing through the supply channel, a bypass channel provided in the supply channel for bypassing the temperature adjustment channel, and a supply channel that allows the flow of the processing liquid in the temperature adjustment channel and blocks the flow of the processing liquid in the bypass channel. The control unit includes a flow switching unit configured to transition between a first flow state and a second flow state in which the flow of processing liquid in the temperature control unit of the supply flow path is blocked and the flow of processing liquid in the bypass flow path is permitted, the fault determination unit is configured to determine whether the plurality of temperature control units are normal or faulty, and the control unit shifts the flow switching unit to the first flow state for adjustment units that include a temperature control unit determined to be normal by the fault determination unit among the plurality of adjustment units, and shifts the flow switching unit to the second flow state for adjustment units that include a temperature control unit determined to be faulty by the fault determination unit among the plurality of adjustment units.

[0011] (b) A substrate processing apparatus according to another aspect of the present invention comprises a chamber for processing a substrate using a processing liquid, a processing liquid supply device for supplying the processing liquid to the chamber, and a control unit for controlling the chamber and the processing liquid supply device, wherein the processing liquid supply device includes a supply channel for guiding the processing liquid to the chamber, a first adjustment unit and a second adjustment unit provided in a first portion and a second portion of the supply channel arranged from upstream to downstream, respectively, and a fault determination unit, wherein the first adjustment unit includes a first temperature adjustment unit provided in the first portion of the supply channel for adjusting the temperature of the processing liquid flowing through the first portion, and a first temperature detection unit for detecting the temperature of the processing liquid adjusted by the first temperature adjustment unit, and the second adjustment unit is provided in the second portion of the supply channel and the second portion The control unit includes a second temperature adjustment unit for adjusting the temperature of the flowing processing liquid, and a second temperature detection unit for detecting the temperature of the processing liquid adjusted by the second temperature adjustment unit. The fault determination unit is configured to determine whether the first temperature adjustment unit and the second temperature adjustment unit are functioning normally or are malfunctioning. The control unit controls the first temperature adjustment unit based on the detection result from the first temperature detection unit when the fault determination unit determines that both the first and second temperature adjustment units are functioning normally, and controls the second temperature adjustment unit based on the detection result from the second temperature detection unit when the fault determination unit determines that both the first and second temperature adjustment units are functioning normally and are malfunctioning.

[0012] (c) A substrate processing apparatus according to yet another aspect of the present invention comprises a chamber for processing a substrate using a processing liquid, a processing liquid supply device for supplying the processing liquid to the chamber, and a control unit for controlling the chamber and the processing liquid supply device, wherein the processing liquid supply device includes a supply channel for guiding the processing liquid to the chamber, a plurality of adjustment units provided in a plurality of parts of the supply channel, and a fault determination unit, each adjustment unit includes a temperature adjustment unit provided in the supply channel for adjusting the temperature of the processing liquid flowing through the supply channel, and a temperature detection unit for detecting the temperature of the processing liquid adjusted by the temperature adjustment unit, the fault determination unit is configured to determine whether the plurality of temperature adjustment units are normal or faulty, and the control unit controls the plurality of temperature adjustment units based on the fault determination unit If all are determined to be normal, the temperature of the processing liquid is adjusted to maintain or approach a predetermined main target temperature according to the processing performed in the chamber by controlling each temperature control unit according to a predetermined control method. If the fault determination unit determines that some of the multiple temperature control units are faulty, the temperature of the processing liquid is adjusted to approach a secondary target temperature different from the main target temperature by controlling one or more normal temperature control units according to the control method. The secondary target temperature is determined so that, when some of the multiple temperature control units fail, the control unit controls one or more normal temperature control units according to the control method to offset the effect of disturbances generated by the faulty part of the temperature control unit on the processing liquid.

[0013] (d) A processing liquid supply device according to yet another aspect of the present invention is a processing liquid supply device that supplies processing liquid to a chamber that performs processing on a substrate using processing liquid, comprising: a supply channel for guiding the processing liquid to the chamber; a plurality of adjustment units provided in a plurality of parts of the supply channel, a fault determination unit, and a control unit, each adjustment unit comprising: a temperature adjustment unit provided in the supply channel for adjusting the temperature of the processing liquid flowing through the supply channel; a bypass channel provided in the supply channel for bypassing the temperature adjustment unit; a first flow state in the supply channel that allows the flow of processing liquid in the temperature adjustment unit and blocks the flow of processing liquid in the bypass channel; and the supply channel The control unit includes a flow switching unit configured to transition to a second flow state in which the flow of processing liquid in the temperature control unit is blocked and the flow of processing liquid in the bypass flow path is permitted, the fault determination unit is configured to determine whether the plurality of temperature control units are normal or faulty, and the control unit transitions the flow switching unit to the first flow state for adjustment units that include a temperature control unit determined to be normal by the fault determination unit among the plurality of adjustment units, and transitions the flow switching unit to the second flow state for adjustment units that include a temperature control unit determined to be faulty by the fault determination unit among the plurality of adjustment units.

[0014] (e) A processing liquid supply device according to yet another aspect of the present invention is a processing liquid supply device that supplies a processing liquid to a chamber for processing a substrate using a processing liquid, comprising: a supply channel for guiding the processing liquid to the chamber; a first adjustment unit and a second adjustment unit provided in a first portion and a second portion of the supply channel arranged from upstream to downstream, respectively; a fault determination unit; and a control unit, wherein the first adjustment unit is provided in the first portion of the supply channel and includes a first temperature adjustment unit for adjusting the temperature of the processing liquid flowing through the first portion, and a first temperature detection unit for detecting the temperature of the processing liquid adjusted by the first temperature adjustment unit, and the second adjustment unit is provided in the second portion of the supply channel and includes a second temperature detection unit for adjusting the temperature of the processing liquid flowing through the second portion The control unit includes a second temperature adjustment unit and a second temperature detection unit for detecting the temperature of the processing liquid adjusted by the second temperature adjustment unit, the fault determination unit is configured to determine whether the first temperature adjustment unit and the second temperature adjustment unit are normal or faulty, and the control unit controls the first temperature adjustment unit based on the detection result of the first temperature detection unit and the second temperature adjustment unit based on the second temperature detection unit when the fault determination unit determines that both the first and second temperature adjustment units are normal, and controls the first temperature adjustment unit based on the detection result of the second temperature detection unit when the fault determination unit determines that both the first and second temperature adjustment units are faulty.

[0015] (f) A processing liquid supply device according to yet another aspect of the present invention is a processing liquid supply device that supplies processing liquid to a chamber that performs processing on a substrate using processing liquid, comprising: a supply channel for guiding the processing liquid to the chamber; a plurality of adjustment units provided in a plurality of parts of the supply channel; a fault determination unit; and a control unit, each of which includes a temperature adjustment unit provided in the supply channel for adjusting the temperature of the processing liquid flowing through the supply channel; and a temperature detection unit for detecting the temperature of the processing liquid adjusted by the temperature adjustment unit; the fault determination unit is configured to determine whether the plurality of temperature adjustment units are normal or faulty; and the control unit, when the fault determination unit determines that all of the plurality of temperature adjustment units are normal, By controlling each temperature control unit according to the specified control method, the temperature of the processing liquid is adjusted to be maintained at or approach a predetermined main target temperature according to the processing performed in the chamber. If the fault determination unit determines that some of the multiple temperature control units are malfunctioning, the temperature of the processing liquid is adjusted to approach a secondary target temperature different from the main target temperature by controlling one or more normal temperature control units according to the control method. The secondary target temperature is determined so that, when some of the multiple temperature control units malfunction, the control unit controls one or more normal temperature control units according to the control method to offset the effect of disturbances generated by the malfunctioning part of the temperature control unit on the processing liquid.

[0016] (g) A substrate processing method according to yet another aspect of the present invention is a substrate processing method using a substrate processing apparatus, wherein the substrate processing apparatus comprises a chamber for processing the substrate using a processing liquid, and a processing liquid supply device for supplying the processing liquid to the chamber, the processing liquid supply device includes a supply channel for guiding the processing liquid to the chamber, and a plurality of adjustment units provided in a plurality of parts of the supply channel, each adjustment unit comprising: a temperature adjustment unit provided in the supply channel for adjusting the temperature of the processing liquid flowing through the supply channel; a bypass channel provided in the supply channel for bypassing the temperature adjustment unit; a first flow state in the supply channel that allows the flow of the processing liquid in the temperature adjustment unit and blocks the flow of the processing liquid in the bypass channel; and a temperature adjustment unit in the supply channel The substrate processing method includes a flow switching unit configured to transition to a second flow state that blocks the flow of processing liquid in the bypass flow path and allows the flow of processing liquid in the bypass flow path, and the substrate processing method includes controlling the processing liquid supply device to supply processing liquid to the chamber and controlling the chamber to process the substrate, wherein supplying processing liquid to the chamber includes determining whether each of the plurality of temperature control units is normal or malfunctioning, transitioning the flow switching unit to the first flow state for adjustment units that include a temperature control unit determined to be normal among the plurality of adjustment units, and transitioning the flow switching unit to the second flow state for adjustment units that include a temperature control unit determined to be malfunctioning among the plurality of adjustment units.

[0017] (h) A substrate processing method according to yet another aspect of the present invention is a substrate processing method using a substrate processing apparatus, wherein the substrate processing apparatus comprises a chamber for processing the substrate using a processing liquid, and a processing liquid supply device for supplying the processing liquid to the chamber, the processing liquid supply device includes a supply channel for guiding the processing liquid to the chamber, and a first adjustment unit and a second adjustment unit provided in a first portion and a second portion of the supply channel arranged from upstream to downstream, respectively, the first adjustment unit includes a first temperature adjustment unit provided in the first portion of the supply channel for adjusting the temperature of the processing liquid flowing through the first portion, and a first temperature detection unit for detecting the temperature of the processing liquid adjusted by the first temperature adjustment unit, the second adjustment unit includes a second temperature adjustment unit provided in the second portion of the supply channel for adjusting the temperature of the processing liquid flowing through the second portion, and the second The substrate processing method includes a second temperature detection unit that detects the temperature of the processing liquid adjusted by the temperature adjustment unit, and includes controlling the processing liquid supply device to supply the processing liquid to the chamber, and controlling the chamber to process the substrate, wherein supplying the processing liquid to the chamber includes determining whether each of the first temperature adjustment unit and the second temperature adjustment unit is normal or malfunctioning, controlling the first temperature adjustment unit based on the detection result of the first temperature detection unit and controlling the second temperature adjustment unit based on the detection result of the second temperature detection unit when it is determined that both the first and second temperature adjustment units are normal, and controlling the first temperature adjustment unit based on the detection result of the second temperature detection unit when it is determined that both the first and second temperature adjustment units are malfunctioning.

[0018] (i) A substrate processing method according to yet another aspect of the present invention is a substrate processing method using a substrate processing apparatus, wherein the substrate processing apparatus comprises a chamber for processing the substrate using a processing liquid, and a processing liquid supply device for supplying the processing liquid to the chamber, the processing liquid supply device includes a supply channel for guiding the processing liquid to the chamber, and a plurality of adjustment units provided in a plurality of parts of the supply channel, each adjustment unit including a temperature adjustment unit provided in the supply channel for adjusting the temperature of the processing liquid flowing through the supply channel, and a temperature detection unit for detecting the temperature of the processing liquid adjusted by the temperature adjustment unit, the substrate processing method comprising controlling the processing liquid supply device to supply the processing liquid to the chamber, and controlling the chamber to process the substrate, the supply of the processing liquid to the chamber being controlled by each of the plurality of temperature adjustment units The system includes determining whether a temperature control unit is normal or malfunctioning, controlling each temperature control unit according to a predetermined control method if all of the temperature control units are determined to be normal, thereby adjusting the temperature of the processing liquid to maintain or approach a predetermined main target temperature according to the processing performed in the chamber, and controlling one or more normal temperature control units according to the control method if some of the temperature control units are determined to be malfunctioning, thereby adjusting the temperature of the processing liquid to approach a secondary target temperature different from the main target temperature, wherein the secondary target temperature is determined so as to offset the effect of disturbances generated from the malfunctioning part of the temperature control unit on the processing liquid when some of the temperature control units malfunction, by controlling one or more normal temperature control units according to the control method.

[0019] (j) A processing liquid supply method according to yet another aspect of the present invention is a processing liquid supply method for supplying a processing liquid to a chamber for processing a substrate using a processing liquid supply device, wherein the processing liquid supply device comprises a supply channel for guiding the processing liquid to the chamber, and a plurality of adjustment units provided in a plurality of parts of the supply channel, each adjustment unit comprising: a temperature adjustment unit provided in the supply channel for adjusting the temperature of the processing liquid flowing through the supply channel; a bypass channel provided in the supply channel for bypassing the temperature adjustment unit; and a first flow state in the supply channel that allows the flow of the processing liquid in the temperature adjustment unit and blocks the flow of the processing liquid in the bypass channel. The supply method includes a flow switching unit configured to transition to a second flow state in which the flow of the processing liquid in the temperature control unit is blocked and the flow of the processing liquid in the bypass flow unit is permitted, and the method for supplying the processing liquid includes determining whether each of the plurality of temperature control units is normal or malfunctioning, transitioning the flow switching unit to the first flow state for adjustment units that include a temperature control unit determined to be normal, and transitioning the flow switching unit to the second flow state for adjustment units that include a temperature control unit determined to be malfunctioning.

[0020] (k) A processing liquid supply method according to yet another aspect of the present invention is a processing liquid supply method for supplying a processing liquid to a chamber for processing a substrate using a processing liquid supply device, wherein the processing liquid supply device comprises a supply channel for guiding the processing liquid to the chamber, and a first adjustment unit and a second adjustment unit provided in a first portion and a second portion of the supply channel arranged from upstream to downstream, the first adjustment unit includes a first temperature adjustment unit provided in the first portion of the supply channel for adjusting the temperature of the processing liquid flowing through the first portion, and a first temperature detection unit for detecting the temperature of the processing liquid adjusted by the first temperature adjustment unit, the second adjustment unit is provided in the second portion of the supply channel for detecting the temperature of the processing liquid flowing through the second portion The processing liquid supply method includes a second temperature adjustment unit for adjusting the temperature and a second temperature detection unit for detecting the temperature of the processing liquid adjusted by the second temperature adjustment unit, and includes determining whether each of the first temperature adjustment unit and the second temperature adjustment unit is normal or malfunctioning, controlling the first temperature adjustment unit based on the detection result of the first temperature detection unit and controlling the second temperature adjustment unit based on the detection result of the second temperature detection unit when it is determined that both the first temperature adjustment unit and the second temperature adjustment unit are normal, and controlling the first temperature adjustment unit based on the detection result of the second temperature detection unit when it is determined that both the first temperature adjustment unit and the second temperature adjustment unit are malfunctioning.

[0021] (l) A processing liquid supply method according to yet another aspect of the present invention is a processing liquid supply method that supplies a processing liquid to a chamber for processing a substrate using a processing liquid supply device, wherein the processing liquid supply device comprises a supply channel for guiding the processing liquid to the chamber, and a plurality of adjustment units provided in a plurality of parts of the supply channel, each adjustment unit including a temperature adjustment unit provided in the supply channel for adjusting the temperature of the processing liquid flowing through the supply channel, and a temperature detection unit for detecting the temperature of the processing liquid adjusted by the temperature adjustment unit, wherein the processing liquid supply method determines whether each of the plurality of temperature adjustment units is normal or malfunctioning, and if it is determined that all of the plurality of temperature adjustment units are normal, The system includes controlling each temperature control unit according to a control method to maintain or adjust the temperature of the processing liquid to a predetermined main target temperature according to the processing performed in the chamber, and, if it is determined that some of the multiple temperature control units are malfunctioning, controlling one or more normal temperature control units according to the control method to adjust the temperature of the processing liquid to approach a secondary target temperature different from the main target temperature, wherein the secondary target temperature is determined so as to offset the effect of disturbances generated from the malfunctioning part of the temperature control unit on the processing liquid when some of the multiple temperature control units malfunction and the one or more normal temperature control units are controlled according to the control method.

[0022] According to the present invention, it is possible to reduce the occurrence of substrate processing defects caused by a malfunction in a part of the temperature control device for the processing solution.

[0023] Figure 1 is a schematic diagram of the substrate processing apparatus according to the first embodiment. Figure 2 is a block diagram showing the configuration of the control system of the substrate processing apparatus according to the first embodiment. Figure 3 is a flowchart showing an example of a liquid supply process performed in the substrate processing apparatus according to the first embodiment. Figure 4 is a schematic diagram of the substrate processing apparatus according to the second embodiment. Figure 5 is a block diagram showing the configuration of the control system of the substrate processing apparatus according to the second embodiment. Figure 6 is a flowchart showing an example of a liquid supply process performed in the substrate processing apparatus according to the second embodiment. Figure 7 is a flowchart showing an example of a liquid supply process performed in the substrate processing apparatus according to the second embodiment. Figure 8 is a diagram showing an example of a temperature table. Figure 9 is a flowchart showing a first example of a liquid supply process performed in the substrate processing apparatus according to the third embodiment. Figure 10 is a flowchart showing a second example of a liquid supply process performed in the substrate processing apparatus according to the third embodiment. Figure 11 is a flowchart showing a second example of a liquid supply process performed in the substrate processing apparatus according to the third embodiment.

[0024] Hereinafter, a substrate processing apparatus, a processing liquid supply apparatus, a substrate processing method, and a processing liquid supply method according to one embodiment of the present invention will be described with reference to the drawings. In the following description, "substrate" refers to a substrate for a Flat Panel Display (FPD), semiconductor substrate, optical disk substrate, magnetic disk substrate, magneto-optical disk substrate, photomask substrate, ceramic substrate, or solar cell substrate used in liquid crystal display devices or organic EL (Electro Luminescence) display devices, etc.

[0025] The substrate processing apparatus described below basically processes multiple substrates using a processing solution within a predetermined temperature range. In the following description, the ideal temperature of the processing solution supplied to the substrate W is referred to as the target temperature, and the predetermined temperature range of the processing solution that includes the target temperature and is permitted for processing the substrate W is referred to as the allowable temperature range.

[0026] 1. First Embodiment <1> Diagram 1 of the substrate processing apparatus is a schematic diagram of the substrate processing apparatus according to the first embodiment. The substrate processing apparatus 1 includes a processing liquid supply device 2, a substrate processing unit 3, a chiller 6, a control unit 9, a display unit 81, and an operation unit 82. In this embodiment, the processing liquid used for processing the substrate W is a chemical solution for etching a film such as a silicon oxide film, a silicon nitride film, or a titanium nitride film formed on the substrate W.

[0027] The chemicals include hydrofluoric acid (HF), buffered hydrofluoric acid (BHF), dilute hydrofluoric acid (DHF), a mixture of sulfuric acid and hydrogen peroxide (SPM), a mixture of ammonia water and hydrogen peroxide (SC1), a mixture of hydrochloric acid and hydrogen peroxide (SC2), and diluted ammonium hydroxide (dNH). ４ OH) or tetramethylammonium hydroxide (TMAH), etc., are used. The target temperature and allowable temperature range of the processing solution are determined according to the type of chemical solution used and the processing content of the substrate W. In the substrate processing apparatus 1 according to this embodiment, the target temperature of the processing solution is set to a temperature lower than room temperature (for example, 25°C) (for example, 10°C, etc.).

[0028] The processing liquid supply device 2 stores a fixed amount of processing liquid in a storage tank 10 (described later) and supplies the temperature-adjusted processing liquid to the substrate processing unit 3 while adjusting its temperature to within an acceptable temperature range. The chiller 6 is provided separately from the processing liquid supply device 2 and the substrate processing unit 3 and is used to adjust the temperature of the processing liquid in the processing liquid supply device 2. The chiller 6 supplies cooling water to the multiple temperature adjustment units 12a and 13a of the processing liquid supply device 2 (described later). The details of the configuration of the processing liquid supply device 2 will be described later.

[0029] The substrate processing unit 3 includes a plurality (for example, 12) chambers 4. Each chamber 4 is provided with a spin chuck 4a, a nozzle 4b, and a cup 4c. The spin chuck 4a is configured to hold the substrate W to be processed. The spin chuck 4a is also rotationally driven by a drive device (for example, an electric motor) (not shown) while holding the substrate W. As a result, the substrate W held in the spin chuck 4a rotates.

[0030] The nozzle 4b discharges a portion of the processing liquid supplied from the processing liquid supply device 2 to the substrate processing unit 3 onto the substrate W, which is held and rotated by the spin chuck 4a. This processes the surface (in this example, the top surface) of the substrate W. The cup 4c is provided so as to surround the substrate W held by the spin chuck 4a and catches the processing liquid that splashes from the substrate W during processing. The processing liquid caught by the cup 4c is sent to a drainage facility provided outside the substrate processing device 1, for example. Note that a portion of the processing liquid caught by the cup 4c may be returned to the processing liquid supply device 2.

[0031] The control unit 9 controls the operation of the processing liquid supply device 2, the substrate processing unit 3, and the chiller 6. Details of the control unit 9 will be described later. The display unit 81 is composed of, for example, a liquid crystal display device or an organic EL display device. Examples of information displayed on the display unit 81 will be described later. The operation unit 82 includes, for example, a keyboard and a pointing device, and is configured to be operable by the user. The user can input various types of information to the substrate processing device 1 by operating the operation unit 82.

[0032] <2> As shown in the diagram 1 of the configuration and basic operation of the processing liquid supply device 2, the processing liquid supply device 2 includes a liquid replenishment device 5, a storage tank 10, a pump 11, an adjustment unit 12, an adjustment unit 13, a temperature sensor 14, a replenishment pipe p11, a supply pipe p12, and a circulation pipe p13.

[0033] The substrate processing apparatus 1 according to this embodiment is installed, for example, in a factory. The factory is equipped with a power source for the processing liquid used to process the substrate W, which is used as a power supply for the substrate processing apparatus 1.

[0034] The liquid replenishment device 5 includes fluid-related equipment such as piping, fittings, and valves, and is connected to a source of treatment liquid (not shown). The liquid replenishment device 5 may also include a pump as part of the fluid-related equipment. The upstream end of the replenishment pipe p11 is further connected to the liquid replenishment device 5. The downstream end of the replenishment pipe p11 is located inside the storage tank 10. The liquid replenishment device 5 is configured to supply (replenish) treatment liquid (new treatment liquid) from a source (not shown) to the storage tank 10 through the replenishment pipe p11.

[0035] The storage tank 10 is configured to store a fixed amount of processed liquid. A liquid level sensor LS is attached to the storage tank 10. The liquid level sensor LS detects the liquid level (liquid height) of the processed liquid stored in the storage tank 10. The liquid level sensor LS also outputs a liquid level signal indicating the detected liquid level to the control unit 9. For example, a capacitive liquid level sensor, an optical liquid level sensor, or an ultrasonic liquid level sensor can be used as the liquid level sensor LS.

[0036] The upstream end of the supply pipe p12 is connected to the bottom of the storage tank 10. The supply pipe p12 is equipped with a pump 11, an adjustment unit 12, an adjustment unit 13, and a temperature sensor 14 in that order from upstream to downstream.

[0037] Pump 11 sucks the processed liquid stored in the storage tank 10 and pumps the sucked processed liquid towards the downstream end of the supply pipe p12. The adjustment unit 12 includes a temperature adjustment unit 12a, a temperature detection unit 12b, a fault detector 12c, a bypass pipe p14, and valves v01 and v02. The temperature adjustment unit 12a includes a heat exchanger that receives cooling water from the chiller 6 and a flow rate adjustment device (flow rate adjustment valve, etc.) that adjusts the amount of cooling water flowing through the heat exchanger. The temperature adjustment unit 12a maintains or brings the temperature of the processed liquid flowing through the supply pipe p12 close to the target temperature. The temperature detection unit 12b is located downstream of the temperature adjustment unit 12a. The temperature detection unit 12b includes, for example, a thermocouple or a platinum resistance thermometer, and detects the temperature of the processed liquid adjusted by the temperature adjustment unit 12a. The temperature detection unit 12b also outputs a temperature signal indicating the detected temperature of the processed liquid to the control unit 9.

[0038] The fault detector 12c is configured to detect a failure in the temperature control unit 12a. For example, the fault detector 12c includes a temperature sensor that detects the temperature of the cooling water flowing through the heat exchanger of the temperature control unit 12a, and detects a failure in the temperature control unit 12a when the temperature of the cooling water deviates from the temperature during normal operation. In addition, if the temperature control unit 12a fails, the fault detector 12c outputs a fault signal to the control unit 9 indicating that the temperature control unit 12a has failed.

[0039] Valve v01 is configured to be switchable between an open and a closed state and is located upstream of the temperature control unit 12a. At the mounting portion of valve v01 in the supply piping p12, the flow of the processing liquid is permitted when valve v01 is in the open state. When valve v01 is in the closed state, the flow of the processing liquid is blocked.

[0040] Bypass piping p14 is connected to supply piping p12 in such a way that it bypasses valve v01, temperature control unit 12a, and temperature detection unit 12b, and connects two parts of supply piping p12. Valve v02 is provided in bypass piping p14.

[0041] Valve v02, like valve v01, is configured to be switchable between an open and a closed state. At the mounting portion of valve v02 in the bypass piping p14, the flow of the processing fluid is permitted when valve v02 is in the open state. When valve v02 is in the closed state, the flow of the processing fluid is blocked.

[0042] With this configuration, in the adjustment unit 12, when valve v01 is open and valve v02 is closed, the temperature of the processing liquid flowing through the supply pipe p12 is adjusted by the temperature adjustment unit 12a and flows downstream. On the other hand, when valve v01 is closed and valve v02 is open, the processing liquid flowing through the supply pipe p12 bypasses the temperature adjustment unit 12a and flows downstream without temperature adjustment.

[0043] The adjustment unit 13 has the same configuration as the adjustment unit 12. Specifically, the adjustment unit 13 includes a temperature adjustment unit 13a, a temperature detection unit 13b, a fault detector 13c, a bypass pipe p15, and valves v11 and v12.

[0044] The configurations of the temperature adjustment unit 13a, the temperature detection unit 13b, and the failure detector 13c are respectively the same as the configurations of the above-described temperature adjustment unit 12a, temperature detection unit 12b, and failure detector 12c. Therefore, the temperature adjustment unit 13a includes a heat exchanger that receives cooling water from the chiller 6, and a flow rate adjustment device (such as a flow rate adjustment valve) that adjusts the flow rate of the cooling water in the heat exchanger. The temperature adjustment unit 13a maintains or brings the temperature of the processing liquid flowing through the supply pipe p12 close to the target temperature. The temperature detection unit 13b detects the temperature of the processing liquid adjusted by the temperature adjustment unit 13a, and outputs a temperature signal indicating the detected temperature of the processing liquid to the control unit 9. The failure detector 13c is configured to be capable of detecting a failure of the temperature adjustment unit 13a, and when the temperature adjustment unit 13a has failed, outputs a failure signal indicating that the temperature adjustment unit 13a has failed to the control unit 9.

[0045] The valve v11 is configured to be switchable between an open state and a closed state, and is provided upstream of the temperature adjustment unit 13a. At the mounting portion of the valve v11 in the supply pipe p12, the flow of the processing liquid is permitted when the valve v11 is in the open state. When the valve v11 is in the closed state, the flow of the processing liquid is blocked.

[0046] The bypass pipe p15 is connected to the supply pipe p12 so as to bypass the valve v11, the temperature adjustment unit 13a, and the temperature detection unit 13b and connect two portions of the supply pipe p12. The bypass pipe p15 is provided with a valve v12. The valve v12 is configured to be switchable between an open state and a closed state. At the mounting portion of the valve v12 in the bypass pipe p15, the flow of the processing liquid is permitted when the valve v12 is in the open state. When the valve v12 is in the closed state, the flow of the processing liquid is blocked.

[0047] With such a configuration, in the adjustment unit 13, when the valve v11 is set to the open state and the valve v12 is set to the closed state, the temperature of the processing liquid flowing through the supply pipe p12 is adjusted by the temperature adjustment unit 13a and flows downstream. On the other hand, when the valve v11 is set to the closed state and the valve v12 is set to the open state, the processing liquid flowing through the supply pipe p12 bypasses the temperature adjustment unit 13a and flows downstream without being temperature-adjusted.

[0048] As described above, in each of the plurality of adjustment units 12 and 13, one of the valves v01 and v11 provided in the supply pipe p12 is brought into an open state, and the other of the valves v02 and v12 provided in the bypass pipes p14 and p15 is brought into a closed state, whereby the processing liquid that has flowed through the temperature adjustment sections 12a and 13a flows downstream. In the following description, the state of the two valves when the processing liquid whose temperature has been adjusted by the temperature adjustment section in one adjustment unit flows downstream is appropriately referred to as a first flow state.

[0049] Further, in each of the plurality of adjustment units 12 and 13, one of the valves v01 and v11 provided in the supply pipe p12 is brought into a closed state, and the other of the valves v02 and v12 provided in the bypass pipes p14 and p15 is brought into an open state, whereby the processing liquid that bypasses the temperature adjustment sections 12a and 13a flows downstream. In the following description, the state of the two valves when the processing liquid that bypasses the temperature adjustment section in one adjustment unit flows downstream is appropriately referred to as a second flow state.

[0050] The temperature sensor 14 is provided downstream of the plurality of adjustment units 12 and 13, and includes a thermocouple, a platinum resistance temperature detector, or the like, similarly to the temperature detection sections 12b and 13b described above. The temperature sensor 14 detects the temperature of the processing liquid flowing downstream of the plurality of adjustment units 12 and 13 in the supply pipe p12, that is, the temperature of the processing liquid supplied to the substrate processing section 3. Further, the temperature sensor 14 outputs a temperature signal indicating the detected temperature of the processing liquid to the control section 9.

[0051] The upstream end of a circulation pipe p13 is connected to the downstream end of the supply pipe p12. The downstream end of the circulation pipe p13 is arranged inside the storage tank 10. A plurality of chamber pipes p21 are connected to a plurality of portions of the circulation pipe p13. The plurality of chamber pipes p21 respectively correspond to the plurality of chambers 4 of the substrate processing section 3, and connect the plurality of portions of the circulation pipe p13 to the nozzles 4b of the plurality of chambers 4. The plurality of chamber pipes p21 are each provided with a plurality of valves (not shown). By switching the open / closed state of the plurality of valves, part of the processing liquid flowing through the circulation pipe p13 is selectively guided to the nozzle 4b of any one of the plurality of chambers 4.

[0052] <3> Processing liquid replenishment function In the processing liquid supply device 2 having the above configuration, most of the processing liquid flowing from the storage tank 10 to the supply pipe p12 is returned to the storage tank 10 through the circulation pipe p13. That is, most of the processing liquid stored in the storage tank 10 circulates through the storage tank 10, the supply pipe p12, and the circulation pipe p13. On the other hand, a portion of the processing liquid flowing from the storage tank 10 to the supply pipe p12 is supplied to the substrate processing unit 3. Therefore, if no new processing liquid is supplied to the storage tank 10 from the liquid replenishment device 5, the liquid level of the processing liquid stored in the storage tank 10 will decrease each time substrate processing is performed in the substrate processing unit 3.

[0053] Therefore, the processing liquid supply device 2 according to this embodiment is provided with a processing liquid replenishment function that appropriately replenishes the processing liquid in the storage tank 10. In this processing liquid replenishment function, processing liquid is replenished from the liquid replenishment device 5 to the storage tank 10 based on the liquid level of the processing liquid detected by the liquid level sensor LS and a plurality of liquid level levels set in advance in the storage tank 10.

[0054] The storage tank 10 is configured with multiple liquid level levels, specifically a lower limit level L1 and a specified level L2. The lower limit level L1 corresponds to the minimum amount of processing liquid considered necessary to supply processing liquid to the substrate processing unit 3, and is used to determine whether or not to start replenishing the processing liquid using the liquid replenishment device 5. On the other hand, the specified level L2 is higher than the lower limit level L1, corresponds to an amount of processing liquid considered sufficient to supply processing liquid to the substrate processing unit 3, and corresponds to an amount of processing liquid that is not considered to overflow from the storage tank 10. The specified level L2 is used to determine whether or not to stop replenishing the processing liquid using the liquid replenishment device 5 during the replenishment process.

[0055] An example of replenishing the storage tank 10 with new processing liquid based on the lower limit level L1 and the specified level L2 will be explained. First, assume that the liquid level of the processing liquid stored in the storage tank 10 is higher than the lower limit level L1 and lower than the specified level L2. In this state, assume that no new processing liquid is being supplied to the storage tank 10 from the liquid replenishment device 5.

[0056] Next, as multiple substrates are processed in the substrate processing unit 3, the liquid level of the processing liquid in the storage tank 10 decreases until the liquid level reaches the lower limit level L1. In this case, when the liquid level of the processing liquid reaches the lower limit level L1, the supply of new processing liquid from the liquid replenishment device 5 to the storage tank 10 begins.

[0057] When the supply of new processing fluid is started, the liquid level of the processing fluid gradually rises. As long as the liquid level of the processing fluid is above the lower limit level L1 and below the specified level L2, the supply of processing fluid from the liquid replenishment device 5 to the storage tank 10 continues. After that, the liquid level of the processing fluid is assumed to reach the specified level L2. At this time, the supply of new processing fluid from the liquid replenishment device 5 to the storage tank 10 is stopped.

[0058] Thus, the processing liquid replenishment function of the substrate processing apparatus 1 ensures that the processing liquid is replenished in the storage tank 10 at the appropriate time. This prevents the processing liquid in the storage tank 10 from running out.

[0059] <4> In the first temperature control function processing liquid supply device 2, the temperature of the processing liquid circulating in the storage tank 10, supply pipe p12, and circulation pipe p13 is adjusted by a plurality of adjustment units 12 and 13. Therefore, if either of the temperature adjustment units 12a and 13a of the adjustment units 12 and 13 fails, disturbances generated from the failed temperature adjustment unit may cause the temperature of the processing liquid to change to an unintended temperature.

[0060] For example, in the adjustment unit 12, if the temperature adjustment unit 12a malfunctions and the temperature of the coolant supplied to the temperature adjustment unit 12a rises, the temperature of the processing liquid may change to a temperature higher than room temperature.

[0061] Therefore, the processing liquid supply device 2 according to this embodiment is provided with a first temperature control function. The first temperature control function is turned on when either of the temperature adjustment units 12a or 13a fails.

[0062] In the first temperature control function, for example, when the temperature control section 12a of the adjustment unit 12 is functioning normally, valves v01 and v02 are set to a first flow state. Specifically, valve v01 is set to the open state and valve v02 is set to the closed state. As a result, the processing liquid whose temperature has been controlled by the temperature control section 12a flows downstream. On the other hand, when the temperature control section 12a of the adjustment unit 12 is malfunctioning, valves v01 and v02 are set to a second flow state. Specifically, valve v01 is set to the closed state and valve v02 is set to the open state. As a result, the processing liquid bypasses the temperature control section 12a and flows downstream. Therefore, the flow of processing liquid affected by disturbances in the temperature control section 12a downstream is suppressed.

[0063] Furthermore, for example, when the temperature control section 13a of the adjustment unit 13 is functioning normally, valves v11 and v12 are set to a first flow state. Specifically, valve v11 is set to the open state and valve v12 is set to the closed state. As a result, the processing liquid whose temperature has been adjusted by the temperature control section 13a flows downstream. On the other hand, when the temperature control section 13a of the adjustment unit 13 is malfunctioning, valves v11 and v12 are set to a second flow state. Specifically, valve v11 is set to the closed state and valve v12 is set to the open state. As a result, the processing liquid bypasses the temperature control section 13a and flows downstream. Therefore, the flow of processing liquid affected by disturbances in the temperature control section 13a downstream is suppressed.

[0064] <5> Second temperature control function: If the temperature of the processing liquid supplied from the processing liquid supply device 2 is outside the allowable temperature range in each chamber 4 of the substrate processing unit 3, the desired processing cannot be performed. Processing defects will occur in the substrate W. If processing defects in the substrate W occur continuously in each chamber 4, a large number of defective products will be produced. As a result, a large amount of processing liquid and a large amount of substrate W will be wasted.

[0065] Therefore, the processing liquid supply device 2 according to this embodiment is provided with a second temperature control function that manages the temperature of the processing liquid flowing downstream of the multiple adjustment units 12 and 13. In the second temperature control function, the overall operation of the substrate processing device 1 is permitted or restricted based on the temperature of the processing liquid detected by the temperature sensor 14.

[0066] Specifically, the temperature sensor 14 detects the temperature of the processing liquid flowing through the supply pipe p12 at intervals of a small amount of time, and outputs a temperature signal. Based on the temperature signal output from the temperature sensor 14, it is determined whether the current temperature of the processing liquid is within the allowable temperature range. If the current temperature of the processing liquid is within the allowable temperature range, the entire operation of the substrate processing apparatus 1 is permitted. On the other hand, if the current temperature of the processing liquid is outside the allowable temperature range, the entire operation of the substrate processing apparatus 1 is restricted. In other words, the entire substrate processing apparatus 1 is stopped.

[0067] Thus, according to the second temperature control function of the processing solution in the substrate processing apparatus 1, the substrate processing apparatus 3 is not supplied with processing solution at a temperature outside the allowable temperature range. As a result, the occurrence of processing defects caused by the temperature of the processing solution is suppressed in each chamber 4. Therefore, continuous processing of inappropriate substrates W is prevented. Furthermore, the wasteful consumption of processing solution and substrates W is suppressed.

[0068] <6> In the third temperature control function processing liquid supply device 2, the temperature of the processing liquid circulating in the storage tank 10, supply pipe p12, and circulation pipe p13 is adjusted by multiple adjustment units 12 and 13. Therefore, if all the temperature adjustment units 12a and 13a of the adjustment units 12 and 13 fail, the temperature of the processing liquid flowing through the supply pipe p12 will not be adjusted. Consequently, there is a high possibility that the temperature of the processing liquid will deviate significantly from the allowable temperature range.

[0069] Therefore, the processing liquid supply device 2 according to this embodiment is provided with a third temperature control function in addition to the first and second temperature control functions described above. In the third temperature control function, the overall operation of the substrate processing device 1 is permitted or restricted based on fault signals output from the fault detectors 12c and 13c of the adjustment units 12 and 13.

[0070] Specifically, it is determined whether or not fault signals are output from the two fault detectors 12c and 13c. If no fault signal is output from fault detector 12c and no fault signal is output from fault detector 13c, the overall operation of the substrate processing device 1 is permitted. Also, if a fault signal is output from only one of the two fault detectors 12c and 13c, the overall operation of the substrate processing device 1 is permitted.

[0071] In contrast, if a fault signal is output from both fault detector 12c and fault detector 13c, the overall operation of the substrate processing device 1 is restricted. That is, the entire substrate processing device 1 is shut down.

[0072] The third temperature control function makes it less likely that the substrate processing unit 3 will be supplied with processing solution at a temperature outside the allowable temperature range. As a result, the occurrence of processing defects caused by the temperature of the processing solution is suppressed in each chamber 4. Therefore, it is prevented that inappropriate processing of substrates W is performed repeatedly. In addition, the wasteful consumption of processing solution and substrates W is suppressed.

[0073] <7> Control System of the Substrate Processing Apparatus 1 The control system of the substrate processing apparatus 1 will be described along with the configuration of the control unit 9 in Figure 1. Figure 2 is a block diagram showing the configuration of the control system of the substrate processing apparatus 1 according to the first embodiment. As shown in Figure 2, the control unit 9 includes a CPU (Central Processing Unit) 91, RAM (Random Access Memory) 92, ROM (Read-Only Memory) 93, and a storage device 94.

[0074] RAM 92 is used as a workspace for the CPU 91. ROM 93 stores the system program. The storage device 94 includes a storage medium such as a hard disk or semiconductor memory and stores a substrate processing program for performing substrate processing in the substrate processing unit 3 and a liquid supply program for supplying processing liquid to multiple chambers 4 in the processing liquid supply device 2.

[0075] Furthermore, the storage device 94 stores processing liquid information relating to the processing liquid. The processing liquid information according to this embodiment includes the target temperature, allowable temperature range, lower limit level L1, and specified level L2.

[0076] The substrate processing program and the liquid supply program may be provided stored on a recording medium such as a CD-ROM 95 and installed on ROM 93 or the storage device 94. Alternatively, the substrate processing program and the liquid supply program may be distributed from a server outside the substrate processing device 1 via a communication network and installed on ROM 93 or the storage device 94.

[0077] The CPU 91 executes a liquid supply program, supplying the required amount of processing liquid from the processing liquid supply device 2 to the substrate processing unit 3. Furthermore, the CPU 91 executes a substrate processing program, controlling the operation of each part of the substrate processing unit 3, and performing substrate processing using the processing liquid in multiple chambers 4.

[0078] The operation of the control unit 9 during the execution of the substrate processing program and the liquid supply program will be explained. The control unit 9 receives the liquid level signal output from the liquid level sensor LS. Based on the detection result of the liquid level sensor LS and the processing liquid information, the control unit 9 controls the liquid replenishment device 5.

[0079] Specifically, the control unit 9 operates the liquid replenishment device 5 to replenish the processed liquid in the storage tank 10 when the liquid level of the processed liquid falls to the lower limit level L1. The control unit 9 also operates the liquid replenishment device 5 to stop replenishing the processed liquid when the liquid level of the processed liquid in the storage tank 10 rises to a specified level L2. As a result, in the storage tank 10, the liquid level of the processed liquid rises to the specified level L2 each time the liquid level of the processed liquid falls to the lower limit level L1.

[0080] Furthermore, the control unit 9 controls the chiller 6 to operate according to predetermined conditions. In addition, the control unit 9 controls the operating state of the pump 11. In this embodiment, the control unit 9 controls the pump 11 to operate at a constant output.

[0081] The control unit 9 receives temperature signals output from the temperature detection units 12b and 13b. Based on the detection results of the temperature detection unit 12b and the processing liquid information of the adjustment unit 12, the control unit 9 provides feedback control to the temperature adjustment unit 12a so that the detection results of the temperature detection unit 12b are maintained at or approach the target temperature. This feedback control allows, for example, the flow rate of the cooling water flowing through the heat exchanger of the temperature adjustment unit 12a to be appropriately changed.

[0082] Furthermore, the control unit 9 provides feedback control to the temperature adjustment unit 13a based on the detection result of the temperature detection unit 13b of the adjustment unit 13 and the processing liquid information, so that the detection result of the temperature detection unit 13b is maintained at or approaches the target temperature. According to this feedback control, for example, the flow rate of the cooling water flowing through the heat exchanger of the temperature adjustment unit 13a is changed as appropriate.

[0083] In this embodiment, the feedback control performed on the multiple temperature adjustment units 12a and 13a is PID (proportional-integral-derivative) control using common control parameters. The control parameters (proportional parameter, integral parameter, and differential parameter) of this PID control are set by the user as a predetermined control method.

[0084] The control unit 9 receives a fault signal output from the fault detector 12c when the adjustment unit 12 malfunctions. Based on this, the control unit 9 determines that the temperature adjustment unit 12a is malfunctioning when it receives a fault signal from the fault detector 12c. Conversely, the control unit 9 determines that the temperature adjustment unit 12a is functioning normally (not malfunctioning) when it does not receive a fault signal from the fault detector 12c.

[0085] The control unit 9 receives a fault signal output from the fault detector 13c when the adjustment unit 13 malfunctions. Based on this, the control unit 9 determines that the temperature adjustment unit 13a is malfunctioning when it receives a fault signal from the fault detector 13c. Conversely, the control unit 9 determines that the temperature adjustment unit 13a is functioning normally (not malfunctioning) when it does not receive a fault signal from the fault detector 13c.

[0086] Furthermore, the control unit 9 switches the state of the two valves v01 and v11 to either a first flow state or a second flow state depending on the state of the temperature adjustment unit 12a of the adjustment unit 12 (first temperature control function). The control unit 9 also switches the state of the two valves v11 and v12 to either a first flow state or a second flow state depending on the state of the temperature adjustment unit 13a of the adjustment unit 13 (first temperature control function).

[0087] Specifically, for adjustment units where the temperature control unit is functioning correctly, the control unit 9 opens the valve (v01 or v11) on the supply pipe p12 and closes the valve (v02 or v12) on the bypass pipe (p14 or p15). On the other hand, for adjustment units where the temperature control unit is malfunctioning, the control unit 9 closes one of the valves (v01 or v11) on the supply pipe p12 and opens the other valve (v02 or v12) on the bypass pipe (p14 or p15).

[0088] Furthermore, the control unit 9 controls the operation of the multiple chambers 4 based on the detection results of the temperature sensor 14 and the processing liquid information. As a result, if the temperature of the processing liquid detected by the temperature sensor 14 is outside the allowable temperature range, the operation of the processing liquid supply device 2 and the substrate processing unit 3 is stopped (second temperature control function).

[0089] Furthermore, the control unit 9 stops the operation of the processing liquid supply device 2 and the substrate processing unit 3 if all of the temperature adjustment units 12a and 13a of the adjustment units 12 and 13 are malfunctioning (third temperature control function).

[0090] Furthermore, when the power to the substrate processing apparatus 1 is turned on, the control unit 9 displays a string of characters or an image on the display unit 81 indicating whether or not the temperature adjustment units 12a and 13a are malfunctioning. This allows the user to easily determine whether or not each of the temperature adjustment units 12a and 13a is malfunctioning by looking at the display unit 81.

[0091] Furthermore, the control unit 9 outputs an alarm via the display unit 81 if the temperature of the processing liquid detected by the temperature sensor 14 is outside the allowable temperature range. Also, the control unit 9 outputs an alarm via the display unit 81 if both the temperature adjustment units 12a and 13a are malfunctioning.

[0092] The user can input the above-mentioned processing liquid information and the values ​​of control parameters used for feedback control of the multiple temperature adjustment units 12a and 13a by operating the operation unit 82. When various types of information are input, the control unit 9 stores the input information in the storage device 94.

[0093] <8> Liquid supply process Figure 3 is a flowchart showing an example of liquid supply process performed in the substrate processing apparatus 1 according to the first embodiment. The liquid supply process described below is performed by the CPU 91 of the control unit 9 executing a liquid supply program stored in the storage device 94 while using the RAM 92 as a work area.

[0094] The liquid supply process is initiated when the power to the substrate processing apparatus 1 is turned on and is repeated at predetermined intervals. In the substrate processing apparatus 1 according to this embodiment, while the power is on, the temperature adjustment unit 12a is feedback controlled based on the detection result of the temperature detection unit 12b and the processing liquid information. The temperature adjustment unit 13a is also feedback controlled based on the detection result of the temperature detection unit 13b and the processing liquid information.

[0095] When the liquid supply process is started, the CPU 91 determines whether all temperature control units 12a and 13a of the processing liquid supply device 2 are malfunctioning, based on whether or not fault signals have been output from the multiple fault detectors 12c and 13c (step S01).

[0096] Specifically, the CPU 91 determines that the temperature control unit 12a of the adjustment unit 12 is not faulty (is functioning normally) if no fault signal is output from the fault detector 12c. The CPU 91 determines that the temperature control unit 12a of the adjustment unit 12 is faulty if a fault signal is output from the fault detector 12c. The CPU 91 also determines that the temperature control unit 13a of the adjustment unit 13 is not faulty (is functioning normally) if no fault signal is output from the fault detector 13c. The CPU 91 determines that the temperature control unit 13a of the adjustment unit 13 is faulty if a fault signal is output from the fault detector 13c.

[0097] If all temperature control units 12a and 13a are functioning correctly, the CPU 91 determines whether all temperature control units 12a and 13a are functioning normally (step S02). If all temperature control units 12a and 13a are functioning normally, the CPU 91 switches the state of the two valves in all adjustment units 12 and 13 to the first flow state (step S03). As a result, the temperature of the processing liquid supplied to the substrate processing unit 3 is adjusted by all temperature control units 12a and 13a. The process then proceeds to step S09, which will be described later.

[0098] On the other hand, if all temperature control units 12a and 13a are not functioning correctly, that is, if some of the temperature control units 12a and 13a are functioning correctly and the remaining temperature control units are malfunctioning, the CPU 91 performs the following processing.

[0099] First, the CPU 91 selects one of the multiple adjustment units 12 and 13 in which the flow state of two valves is not set (step S04). Next, the CPU 91 determines whether the temperature adjustment section of the selected adjustment unit is functioning correctly (step S05).

[0100] If the temperature control section of one adjustment unit is functioning correctly, the CPU 91 switches the state of the two valves of that adjustment unit to the first flow state (step S06). As a result, the processing liquid is sent downstream in that adjustment unit while its temperature is being adjusted.

[0101] On the other hand, if the temperature control unit of one adjustment unit malfunctions, the CPU 91 switches the state of the two valves of that adjustment unit to a second flow state (step S07). As a result, in that adjustment unit, the processing liquid is sent downstream without its temperature being adjusted.

[0102] After either step S06 or S07 above, the CPU 91 determines whether there are any adjustment units for which the flow state of the two valves has not been set (step S08). If there are any adjustment units for which the flow state of the two valves has not been set, the process returns to step S04. On the other hand, if the flow state of the two valves has been set for all adjustment units 12 and 13, the CPU 91 determines whether the temperature of the temperature-adjusted processing liquid is within the allowable temperature range based on the temperature signal output from the temperature sensor 14 (step S09). In other words, it is determined whether the temperature of the processing liquid actually supplied to the substrate processing unit 3 is within the allowable temperature range. If the temperature of the temperature-adjusted processing liquid is within the allowable temperature range, the CPU 91 terminates the liquid supply process.

[0103] This section will explain the cases where the temperature of the treatment solution after temperature adjustment in step S09 is not within the allowable temperature range, and where all temperature control units are malfunctioning in step S01.

[0104] In these cases, the CPU 91 outputs an alarm (step S11). Specifically, the CPU 91 displays a string of characters or an image on the display unit 81 indicating that the temperature of the processing liquid after temperature adjustment is not within the allowable temperature range. Alternatively, the CPU 91 displays a string of characters or an image on the display unit 81 indicating that all temperature adjustment units 12a and 13a are malfunctioning. Furthermore, the CPU 91 displays a string of characters or an image on the display unit 81 indicating that urgent maintenance is required. After that, the CPU 91 stops the operation of the processing liquid supply device 2 and the board processing unit 3 as a whole (step S12), and terminates the liquid supply process.

[0105] Of the liquid supply processes described above, steps S02 to S08 correspond to the first temperature control function. Steps S09, S11, and S12 correspond to the second temperature control function. Furthermore, steps S01, S11, and S12 correspond to the third temperature control function.

[0106] Furthermore, the processing liquid replenishment function of the processing liquid supply device 2 is assumed to operate continuously while the power supply of the substrate processing device 1 is on, based on the processing liquid information (set lower limit level L1 and specified level L2), regardless of the liquid supply process described above.

[0107] <9> Effects In the substrate processing apparatus 1 according to this embodiment, it is determined whether a plurality of temperature adjustment units 12a, 13a are functioning normally or malfunctioning. In the adjustment unit including the temperature adjustment unit that is determined to be functioning normally, two valves switch to a first flow state. As a result, the temperature of the processing liquid flowing through the supply pipe p12 is adjusted. The temperature-adjusted processing liquid is then flowed downstream of the adjustment unit. Therefore, by appropriately adjusting the temperature of the processing liquid, the reliability of processing in the substrate processing unit 3 is improved.

[0108] On the other hand, in the adjustment unit including the temperature control unit that has been determined to be malfunctioning, the two valves switch to a second flow state. As a result, the processing fluid flows downstream of the adjustment unit through the bypass pipe. At this time, the flow of the processing fluid is stopped in the portion of the supply piping p12 where the malfunctioning temperature control unit is located. Therefore, the processing fluid affected by disturbances generated from the malfunctioning temperature control unit is not supplied to the substrate processing unit 3. In other words, the processing fluid adjusted to an unintended temperature is not supplied to the substrate processing unit 3.

[0109] As a result, the occurrence of processing defects in the substrate W due to the failure of some of the multiple temperature control units 12a and 13a is reduced.

[0110] 2. Second Embodiment <1> Configuration of the Substrate Processing Device 1 The differences between the substrate processing device 1 according to the second embodiment and the substrate processing device 1 according to the first embodiment will be explained. Figure 4 is a schematic configuration diagram of the substrate processing device 1 according to the second embodiment. As shown in Figure 4, the adjustment units 12 and 13 according to this embodiment are not provided with the bypass piping p14 and p15 and the multiple valves v01, v02, v11, and v12 shown in Figure 1.

[0111] <2> Fourth Temperature Control Function for Processing Solution The substrate processing apparatus 1 according to this embodiment has a second temperature control function and a third temperature control function, similar to the substrate processing apparatus 1 according to the first embodiment. On the other hand, the substrate processing apparatus 1 according to this embodiment has a fourth temperature control function instead of the first temperature control function according to the first embodiment. The fourth temperature control function will be described below.

[0112] As shown in Figure 4, in the supply piping p12, adjustment units 12 and 13 are arranged in this order from upstream to downstream. Here, we assume that the temperature adjustment section 12a of adjustment unit 12 is functioning correctly and the temperature adjustment section 13a of adjustment unit 13 is functioning correctly. In this case, adjustment unit 12 can maintain or approach the target temperature of the processed liquid by controlling the temperature adjustment section 12a based on the detection result of the temperature detection section 12b and the target temperature. Similarly, adjustment unit 13 can maintain or approach the target temperature of the processed liquid by controlling the temperature adjustment section 13a based on the detection result of the temperature detection section 13b and the target temperature.

[0113] On the other hand, consider the case where the temperature control unit 12a of the adjustment unit 12 malfunctions, but the temperature control unit 13a of the adjustment unit 13 is functioning correctly. In this case, the temperature of the processing liquid flowing through the portion of the adjustment unit 12 in the supply piping p12 may be affected by disturbances generated from the malfunctioning temperature control unit 12a. Even in such a case, the adjustment unit 13 is provided downstream of the adjustment unit 12. Therefore, the adjustment unit 13 can maintain or approach the temperature of the processing liquid at the target temperature by controlling the temperature control unit 13a based on the detection result of the temperature detection unit 13b and the target temperature.

[0114] On the other hand, consider the case where the temperature control section 12a of the adjustment unit 12 is functioning correctly, but the temperature control section 13a of the adjustment unit 13 is malfunctioning. In this case, the temperature of the processing liquid flowing through the adjustment unit 13 in the supply piping p12 may be affected by disturbances generated from the malfunctioning temperature control section 13a. Downstream of the adjustment unit 13, there is no configuration for adjusting the temperature of the processing liquid. Therefore, if the processing liquid affected by disturbances generated from the temperature control section 13a is supplied to the substrate processing section 3, there is a possibility that processing liquid adjusted to an unintended temperature will be supplied to the substrate W.

[0115] The fourth temperature control function is a function to solve the above-mentioned problems. In the fourth temperature control function, when the temperature control unit 12a of the adjustment unit 12 is functioning normally and the temperature control unit 13a of the adjustment unit 13 is malfunctioning, the temperature control unit 12a is controlled based on the detection result of the temperature detection unit 13b and the target temperature. In other words, the temperature control unit 12a of the adjustment unit 12 is controlled so that the detection result of the temperature detection unit 13b is maintained at or approaches the target temperature.

[0116] As a result, temperature disturbances in the processing solution caused by a failure of the temperature control unit 13a of the adjustment unit 13 are reduced by the temperature control unit 12a of the adjustment unit 12. In other words, in the adjustment unit 12, the temperature control unit 12a adjusts the temperature of the processing solution so as to cancel out the effects of disturbances generated from the temperature control unit 13a of the adjustment unit 13. Therefore, the occurrence of processing defects in the substrate W due to a failure of the temperature control unit 13a of the adjustment unit 13 is reduced.

[0117] <3> The control system diagram 5 of the substrate processing apparatus 1 is a block diagram showing the configuration of the control system of the substrate processing apparatus 1 according to the second embodiment. As described above, in this embodiment, the adjustment unit 12 does not include the valves v01 and v11 in Figure 1. Also, the adjustment unit 13 does not include the valves v11 and v12 in Figure 1.

[0118] In Figure 5, the control unit 9 provides feedback control to the temperature adjustment unit 12a based on the detection result of the temperature detection unit 12b and the processing liquid information when the temperature adjustment units 12a and 13a are functioning normally. The control unit 9 also provides feedback control to the temperature adjustment unit 13a based on the detection result of the temperature detection unit 13b and the processing liquid information.

[0119] On the other hand, if the temperature adjustment unit 12a is malfunctioning and the temperature adjustment unit 13a is functioning normally, the control unit 9 provides feedback control to the temperature adjustment unit 13a based on the detection result of the temperature detection unit 13b and the processing liquid information. On the other hand, if the temperature adjustment unit 12a is functioning normally and the temperature adjustment unit 13a is malfunctioning, the control unit 9 provides feedback control to the temperature adjustment unit 12a based on the detection result of the temperature detection unit 13b and the processing liquid information.

[0120] <4> Liquid Supply Process In the following description, one temperature detection unit that is set corresponding to each of the adjustment units 12 and 13 and used to control the temperature adjustment unit of the adjustment unit to adjust the temperature of the processing liquid will be referred to as the reference detection unit. That is, of the two temperature detection units 12b and 13b, one temperature adjustment unit that is to be used for feedback control of each temperature adjustment unit 12a and 13a will be referred to as the reference detection unit.

[0121] Figures 6 and 7 are flowcharts illustrating an example of liquid supply processing performed in the substrate processing apparatus 1 according to the second embodiment. The liquid supply processing described below is performed by the CPU 91 of the control unit 9 executing a liquid supply program stored in the storage device 94 while using the RAM 92 as a work area. The liquid supply processing is started when the power to the substrate processing apparatus 1 is turned on and is repeated after a predetermined time has elapsed.

[0122] When the liquid supply process is started, the CPU 91 determines whether all temperature control units 12a and 13a of the processing liquid supply device 2 are malfunctioning, similar to the process in step S01 of Figure 3 (step S21).

[0123] If all temperature control units 12a and 13a are malfunctioning, the process proceeds to step S41, which will be described later. On the other hand, if all temperature control units 12a and 13a are functioning correctly, the CPU 91 determines whether all temperature control units 12a and 13a are functioning normally (step S22). If all temperature control units 12a and 13a are functioning normally, the CPU 91 sets the temperature detection units 12b and 13b of each adjustment unit 12 and 13 as reference detection units corresponding to those adjustment units and performs feedback control of the temperature control units 12a and 13a (step S23). As a result, the temperature of the processing liquid supplied to the substrate processing unit 3 is adjusted to the target temperature by all temperature control units 12a and 13a. After that, the process proceeds to step S31, which will be described later.

[0124] On the other hand, if all temperature control units 12a and 13a are not functioning correctly, that is, if some of the temperature control units 12a and 13a are functioning correctly and the remaining temperature control units are malfunctioning, the CPU 91 performs the following processing.

[0125] First, the CPU 91 sets the temperature detection unit 13b of the most downstream adjustment unit (in this example, adjustment unit 13) as the reference detection unit corresponding to that adjustment unit, and performs feedback control of the temperature adjustment unit (step S24).

[0126] Next, the CPU 91 selects the upstream adjustment unit (in this example, adjustment unit 12) from among the one or more adjustment units for which the reference detection unit is not set (step S25). The CPU 91 also determines whether the temperature adjustment unit of the selected adjustment unit is functioning correctly (step S26).

[0127] If the temperature control unit of the selected adjustment unit is malfunctioning, the process proceeds to step S28, which will be described later. On the other hand, if the temperature control unit of the selected adjustment unit is functioning correctly, the CPU 91 determines whether the temperature control unit of another adjustment unit (in this example, adjustment unit 13) adjacent to and downstream of the selected adjustment unit is functioning correctly (step S27).

[0128] If the temperature control unit of the other adjustment unit is functioning correctly, the CPU 91 sets the temperature detection unit of one adjustment unit as the reference detection unit corresponding to that adjustment unit and performs feedback control of the temperature control unit of one adjustment unit (step S28).

[0129] On the other hand, if the temperature control unit of another adjustment unit is malfunctioning, the CPU 91 sets the temperature detection unit of the other adjustment unit as a reference detection unit corresponding to the first adjustment unit and performs feedback control of the temperature control unit of the first adjustment unit (step S29).

[0130] After processing in step S28 or step S29, the CPU 91 determines whether or not there is an adjustment unit for which the reference detection unit is not set (step S30). Note that since the processing liquid supply device 2 according to this embodiment includes only two adjustment units (adjustment units 12 and 13), the processing in step S30 does not need to be performed.

[0131] In step S30, if there is an adjustment unit for which the reference detection unit is not set, the process returns to step S25. On the other hand, if the reference detection unit is set for all adjustment units, the CPU 91 determines whether the temperature of the temperature-adjusted processing liquid is within the allowable temperature range based on the temperature signal output from the temperature sensor 14 (step S31).

[0132] If the temperature of the processing solution after temperature adjustment is within the allowable temperature range, the CPU 91 terminates the liquid supply process. On the other hand, if the temperature of the processing solution after temperature adjustment is not within the allowable temperature range, the CPU 91 outputs an alarm (step S41), stops the overall operation of the processing solution supply device 2 and the substrate processing unit 3 (step S42), and terminates the liquid supply process. In this case, continuous processing of inappropriate substrates W is prevented. This reduces the wasteful consumption of processing solution and substrates W.

[0133] In step S26 described above, if the temperature control unit of the selected adjustment unit is malfunctioning, the process may proceed to step S29 instead of step S28. This is because, in a malfunctioning adjustment unit, even if the reference detection unit is set, temperature control by the temperature control unit becomes practically impossible.

[0134] Of the liquid supply processes described above, steps S22 to S30 correspond to the fourth temperature control function. Steps S31, S41, and S42 correspond to the second temperature control function. Furthermore, steps S21, S41, and S42 correspond to the third temperature control function.

[0135] <5> Effects (a) In the substrate processing apparatus 1 according to this embodiment, it is determined whether the multiple temperature adjustment units 12a and 13a are functioning normally or malfunctioning. If both the temperature adjustment unit 12a and the temperature adjustment unit 13a are functioning normally, the temperature adjustment unit 12a is controlled based on the detection result by the temperature detection unit 12b. The temperature adjustment unit 13a is also controlled based on the detection result by the temperature detection unit 13b. As a result, the temperature of the processing liquid can be appropriately adjusted with high precision in each of the first adjustment unit 12 and the second adjustment unit 13. The processing liquid after temperature adjustment is supplied to the substrate processing unit 3. Therefore, the reliability of processing in the substrate processing unit 3 is improved.

[0136] If the temperature control unit 12a is functioning correctly and the temperature control unit 13a is malfunctioning, the temperature control unit 12a is controlled based on the detection result from the temperature detection unit 13b. The temperature detection unit 13b is located downstream of the first adjustment unit 12 and the temperature control unit 13a in the supply piping p12. Therefore, the temperature detection unit 13b detects the temperature of the processing liquid that is temperature-controlled by the temperature control unit 12a and is affected by disturbances generated from the malfunctioning temperature control unit 13a.

[0137] Therefore, by controlling the temperature adjustment unit 12a based on the detection result from the temperature detection unit 13b, the adjustment unit 12 can adjust the temperature of the processing liquid so that the influence of disturbances generated from the temperature adjustment unit 13a is canceled out. In this case, processing liquid adjusted to an unintended temperature is not supplied to the chamber.

[0138] As a result, the occurrence of processing defects in the substrate W due to the failure of some of the multiple temperature control units 12a and 13a is reduced.

[0139] (b) In the substrate processing apparatus 1 described above, if the temperature adjustment unit 12a is malfunctioning and the temperature adjustment unit 13a is functioning correctly, the temperature adjustment unit 13a is controlled based on the detection result by the temperature detection unit 13b. Here, as described above, the temperature detection unit 13b is located downstream of the first adjustment unit 12. Therefore, the processing liquid whose temperature is adjusted by the temperature adjustment unit 13a is supplied to the substrate processing apparatus 3 without being affected by disturbances generated from the malfunctioning temperature adjustment unit 12a. In other words, disturbances generated in the temperature adjustment unit 12a are offset by the temperature adjustment by the temperature adjustment unit 13a. Consequently, processing liquid adjusted to an unintended temperature is not supplied to the substrate processing apparatus 3.

[0140] 3. Third Embodiment <1> Configuration of the Substrate Processing Apparatus 1 The following describes the differences between the substrate processing apparatus 1 according to this embodiment and the substrate processing apparatus 1 according to the second embodiment. The substrate processing apparatus 1 according to the third embodiment has basically the same configuration as the substrate processing apparatus 1 shown in Figures 4 and 5 according to the second embodiment. Therefore, the configurations shown in Figures 4 and 5 will be described below as the configuration of the substrate processing apparatus 1 according to the third embodiment.

[0141] <2> Fifth Temperature Control Function for Processing Solution The substrate processing apparatus 1 according to this embodiment has a second temperature control function and a third temperature control function, similar to the substrate processing apparatus 1 according to the second embodiment. On the other hand, the substrate processing apparatus 1 according to this embodiment has a fifth temperature control function instead of the fourth temperature control function according to the second embodiment. The fifth temperature control function will be described below. In the following description, the above target temperature (the ideal temperature of the processing solution supplied to the substrate W) will be referred to as the main target temperature.

[0142] As described in the second embodiment, we assume that the temperature adjustment section 12a of the adjustment unit 12 is functioning correctly and the temperature adjustment section 13a of the adjustment unit 13 is functioning correctly. In this case, the temperature of the processing liquid flowing through the supply pipe p12 is appropriately adjusted to the main target temperature by the temperature adjustment sections 12a and 13a.

[0143] However, in the substrate processing apparatus 1 that does not have the first and fourth temperature control functions described above, if a part of the temperature control unit 12a, 13a malfunctions, the temperature of the processing liquid flowing through the supply pipe p12 will be affected by disturbances generated from the malfunctioning temperature control unit.

[0144] In one adjustment unit, whether or not the actual temperature of the processing liquid flowing through the supply pipe p12 can be adjusted to the main target temperature depends on the temperature of the processing liquid flowing into the adjustment unit, the specifications of the temperature adjustment unit, and the control method of the temperature adjustment unit. Therefore, if the temperature of the processing liquid flowing into the adjustment unit fluctuates significantly, it becomes difficult to adjust the temperature of the processing liquid flowing through the supply pipe p12 to the main target temperature. Specifically, if the temperature of the processing liquid flowing into the adjustment unit remains deviating from the pre-expected temperature, the actual temperature of the processing liquid flowing out of the adjustment unit (the processing liquid after temperature adjustment) may converge to a temperature that deviates significantly from the main target temperature.

[0145] The fifth temperature control function is a function to solve the above-mentioned problems. In the fifth temperature control function, when some of the multiple temperature control units 12a and 13a fail, the temperature of the processing liquid to be adjusted by each temperature control unit according to the failure state of the multiple temperature control units 12a and 13a is set as a secondary target temperature.

[0146] The secondary target temperature is set to a temperature different from the primary target temperature. Furthermore, the secondary target temperature is set for each temperature control unit so that, in the event of a failure in some of the multiple temperature control units 12a, 13a, the effects of disturbances generated from the failed temperature control units are offset by feedback control from the remaining functioning temperature control units. In other words, the secondary target temperature is set as a parameter for driving the functioning temperature control units in order to offset the effect of disturbances from the failed temperature control units on the processing fluid.

[0147] As a result, according to the fifth temperature control function, the actual temperature of the processing liquid adjusted by the normal temperature control unit is maintained at or approaches the main target temperature, which is slightly off from the sub-target temperature. Therefore, the temperature control function of the processing liquid in the processing liquid supply device 2 is guaranteed regardless of whether all of the multiple temperature control units 12a and 13a are functioning correctly or if some of the multiple temperature control units 12a and 13a are malfunctioning. Consequently, the occurrence of processing defects in the substrate W due to the malfunction of some of the multiple temperature control units 12a and 13a is reduced.

[0148] <3> Temperature of the processing liquid to be adjusted in each adjustment unit 12, 13 (1) First method for setting the temperature of the processing liquid to be adjusted in each adjustment unit 12, 13 The temperature of the processing liquid to be adjusted in each adjustment unit 12, 13 (main target temperature and sub-target temperature) may be predetermined by the user. In this case, the storage device 94 of the control unit 9 stores, in addition to the substrate processing program, liquid supply program, and processing liquid information, a temperature table created by the user, for example.

[0149] Here, the temperature table is a table showing the correspondence between multiple combinations of the states of the multiple temperature control units 12a, 13a (whether they are normal or malfunctioning) and multiple temperatures to be adjusted by each temperature control unit 12a, 13a. Preferably, this temperature table is created based on experiments or simulations, for example, so that when at least some of the multiple temperature control units 12a, 13a are normal, the processing solution at the main target temperature is supplied to the substrate processing unit 3.

[0150] In the following explanation, when distinguishing between adjustment unit 12 and adjustment unit 13, the adjustment unit 12 located on the upstream side will be referred to as the first adjustment unit 12, as appropriate. Similarly, the adjustment unit 12 located on the downstream side will be referred to as the second adjustment unit 13, as appropriate.

[0151] Figure 8 shows an example of a temperature table. In this example, it is assumed that the main target temperature is set to 10°C in advance. According to the temperature table in Figure 8, when all temperature adjustment units 12a and 13a are functioning normally, the temperature of the processing liquid to be adjusted in the first adjustment unit 12 and the second adjustment unit 13 is specified to be 10°C (main target temperature).

[0152] On the other hand, when the temperature adjustment section 12a of the first adjustment unit 12 is functioning correctly and the temperature adjustment section 13a of the second adjustment unit 13 is malfunctioning, the temperature of the processing liquid to be adjusted by the first adjustment unit 12 is specified as 8°C (sub-target temperature). In this case, the second adjustment unit 13 cannot adjust the temperature of the processing liquid, so the temperature of the processing liquid to be adjusted by the second adjustment unit 13 is not specified.

[0153] On the other hand, when the temperature adjustment section 12a of the first adjustment unit 12 malfunctions and the temperature adjustment section 13a of the second adjustment unit 13 is functioning correctly, the temperature of the processing liquid to be adjusted by the second adjustment unit 13 is specified as 8°C (sub-target temperature). In this case, the first adjustment unit 12 cannot adjust the temperature of the processing liquid, so the temperature of the processing liquid to be adjusted by the first adjustment unit 12 is not specified.

[0154] When using the temperature table in Figure 8, if all temperature adjustment units 12a and 13a are functioning correctly, the temperature adjustment unit 12a in the first adjustment unit 12 is controlled by a predetermined control method so that the temperature of the processing liquid in the first adjustment unit 12 becomes 10°C (main target temperature). As a result, the actual temperature of the processing liquid in the first adjustment unit 12 is adjusted to 10°C. Similarly, the temperature adjustment unit 13a in the second adjustment unit 13 is controlled by a predetermined control method so that the temperature of the processing liquid in the second adjustment unit 13 becomes 10°C (main target temperature). As a result, the actual temperature of the processing liquid in the second adjustment unit 13 is adjusted to 10°C.

[0155] On the other hand, when the temperature control section 12a of the first adjustment unit 12 is functioning normally and the temperature control section 13a of the second adjustment unit 13 is malfunctioning, the temperature control section 12a of the first adjustment unit 12 is controlled by a predetermined control method so that the temperature of the processing liquid becomes 8°C (sub-target temperature). As a result, the temperature of the processing liquid in the first adjustment unit 12 is adjusted to a temperature lower than the main target temperature. Subsequently, the processing liquid whose temperature has been adjusted in the first adjustment unit 12 is affected by disturbances from the temperature control section 13a as it passes through the second adjustment unit 13. As a result, the temperature of the processing liquid is ultimately adjusted to 10°C (main target temperature).

[0156] On the other hand, when the temperature control unit 12a of the first adjustment unit 12 malfunctions and the temperature control unit 13a of the second adjustment unit 13 is functioning normally, the processing liquid passing through the first adjustment unit 12 is affected by disturbances in the temperature control unit 13a. The processing liquid affected by these disturbances flows to the second adjustment unit 13. In the second adjustment unit 13, the temperature control unit 13a is controlled by a predetermined control method so that the processing liquid, including the disturbances, is 8°C away from the main target temperature. As a result, the actual temperature of the processing liquid is ultimately adjusted to 10°C (the main target temperature).

[0157] According to the first setting method, the control unit 9 sets the temperature of the processing liquid to be adjusted in each adjustment unit 12, 13 based on the combination of states of the temperature adjustment units 12a, 13a and the temperature table stored in the storage device 94.

[0158] (2) Second method for setting the temperature of the processing liquid to be adjusted in each adjustment unit 12, 13 The temperature of the processing liquid to be adjusted in each adjustment unit 12, 13 (main target temperature and sub-target temperature) may be set based on the temperature of the processing liquid flowing through each part of the supply pipe p12 without using the above temperature table.

[0159] In this case, if all of the temperature adjustment units 12a and 13a are functioning correctly, the control unit 9 acquires the main target temperature stored in the storage device 94 as the temperature of the processing liquid to be adjusted in each adjustment unit 12 and 13. The control unit 9 also sets the acquired main target temperature as the temperature of the processing liquid to be adjusted in each adjustment unit 12 and 13.

[0160] On the other hand, if some of the multiple temperature control units 12a and 13a are malfunctioning, the control unit 9 calculates the difference between the detection result of the temperature detection unit provided in the adjustment unit including the malfunctioning temperature control unit and the main target temperature. The difference calculated in this way is thought to represent a value corresponding to the magnitude of the disturbance generated from the malfunctioning temperature control unit.

[0161] Therefore, the control unit 9 determines the temperature of the processing liquid to be adjusted in each adjustment unit 12, 13 as a secondary target temperature based on the calculated difference and the main target temperature. For example, if the temperature adjustment unit 12a of the first adjustment unit 12 is malfunctioning and the temperature adjustment unit 13a of the second adjustment unit 13 is functioning normally, the control unit 9 calculates the difference α between the detection result of the temperature detection unit 12b and the main target temperature. Then, the control unit 9 determines the temperature offset by the difference α from the main target temperature as the secondary target temperature of the processing liquid to be adjusted in the second adjustment unit 13.

[0162] Alternatively, if the temperature adjustment unit 12a of the first adjustment unit 12 is functioning correctly and the temperature adjustment unit 13a of the second adjustment unit 13 is malfunctioning, the control unit 9 calculates the difference β between the detection result of the temperature detection unit 13b and the main target temperature. Then, the control unit 9 determines the temperature offset by the difference β from the main target temperature as the secondary target temperature of the processing liquid to be adjusted in the first adjustment unit 12.

[0163] The method for determining the secondary target temperature is not limited to the examples above. Preferably, the method for determining the secondary target temperature is determined based on experiments or simulations, for example, so as to offset the effects of disturbances generated from a malfunctioning temperature control unit.

[0164] <4> First Example of Liquid Supply Process Figure 9 is a flowchart showing a first example of liquid supply process performed in the substrate processing apparatus 1 according to the third embodiment. In this example, the temperature of the processing liquid to be adjusted in each adjustment unit 12, 13 is set according to the first setting method described above.

[0165] Furthermore, the liquid supply process described below is performed by the CPU 91 of the control unit 9 executing the liquid supply program stored in the storage device 94 while using the RAM 92 as a work area. The liquid supply process is started when the power to the substrate processing device 1 is turned on and is repeated after a predetermined time has elapsed.

[0166] When the liquid supply process is started, the CPU 91 determines whether all temperature control units 12a and 13a of the processing liquid supply device 2 are malfunctioning, similar to the process in step S01 of Figure 3 (step S51).

[0167] If all temperature control units 12a and 13a are malfunctioning, the process proceeds to step S61, which will be described later. On the other hand, if all temperature control units 12a and 13a are functioning correctly, the CPU 91 obtains a combination of states for the multiple temperature control units 12a and 13a to determine whether they are functioning correctly or malfunctioning (step S52). This process is performed by determining whether or not a malfunction signal has been received from the malfunction detectors 12c and 13c.

[0168] Next, the CPU 91 sets the temperature of the processing fluid to be adjusted in each adjustment unit 12, 13 based on the acquired state combination and the temperature table stored in the storage device 94 (step S53). As a result, if all temperature adjustment units 12a, 13a are functioning normally, the temperature of the processing fluid to be adjusted in each adjustment unit is set to the main target temperature specified in the temperature table. On the other hand, if some of the temperature adjustment units 12a, 13a are malfunctioning, the temperature of the processing fluid to be adjusted in each adjustment unit is set to the secondary target temperature specified in the temperature table.

[0169] Next, the CPU 91 controls each temperature adjustment unit 12a, 13a based on the set temperature of the processing liquid according to a predetermined control method (step S54). In this case, at least one adjustment unit adjusts the temperature of the processing liquid so that the temperature of the processing liquid supplied to the substrate processing unit 3 is ultimately adjusted to the main target temperature.

[0170] Next, the CPU 91 determines whether the temperature of the processed liquid after temperature adjustment is within the allowable temperature range based on the temperature signal output from the temperature sensor 14 (step S55).

[0171] If the temperature of the processing solution after temperature adjustment is within the allowable temperature range, the CPU 91 terminates the liquid supply process. On the other hand, if the temperature of the processing solution after temperature adjustment is not within the allowable temperature range, the CPU 91 outputs an alarm (step S61), stops the operation of the processing solution supply device 2 and the substrate processing unit 3 (step S62), and terminates the liquid supply process. In this case, continuous processing of inappropriate substrates W is prevented. This reduces the wasteful consumption of processing solution and substrates W.

[0172] Of the liquid supply processes described above, steps S52 to S54 correspond to the fifth temperature control function. Steps S55, S61, and S62 correspond to the second temperature control function. Furthermore, of the liquid supply processes, steps S51, S61, and S62 correspond to the third temperature control function.

[0173] <5> Second Example of Liquid Supply Process Figures 10 and 11 are flowcharts showing a second example of liquid supply process performed in the substrate processing apparatus 1 according to the third embodiment. In this example, the temperature of the processing liquid to be adjusted in each adjustment unit 12, 13 is set according to the second setting method described above.

[0174] Furthermore, the liquid supply process described below is performed by the CPU 91 of the control unit 9 executing the liquid supply program stored in the storage device 94 while using the RAM 92 as a work area. The liquid supply process is started when the power to the substrate processing device 1 is turned on and is repeated after a predetermined time has elapsed.

[0175] When the liquid supply process is started, the CPU 91 determines whether all temperature control units 12a and 13a of the processing liquid supply device 2 are malfunctioning, similar to the process in step S01 of Figure 3 (step S71).

[0176] If all temperature control units 12a and 13a are malfunctioning, the process proceeds to step S91, which will be described later. On the other hand, if all temperature control units 12a and 13a are functioning correctly, the CPU 91 determines whether all temperature control units 12a and 13a are functioning normally (step S72). If all temperature control units 12a and 13a are functioning normally, the CPU 91 sets the temperature of the processing liquid to be adjusted in each adjustment unit 12 and 13 to the main target temperature (step S73).

[0177] On the other hand, if all temperature control units 12a and 13a are not functioning correctly, the CPU 91 calculates the difference between the temperature of the processing liquid detected by the adjustment unit including the faulty temperature control unit and the main target temperature (step S81).

[0178] Furthermore, the CPU 91 determines the temperature of the processing fluid to be adjusted by the normal temperature control unit as the secondary target temperature based on the main target temperature and the calculated difference (step S82). The method for determining the secondary target temperature in step S82 is predetermined by the user.

[0179] Next, the CPU 91 sets the temperature of the treatment solution to be adjusted in the adjustment unit, which includes a normal temperature adjustment unit, to the sub-target temperature determined in step S82 (step S83).

[0180] After the processing in step S73 or step S83 described above, the CPU 91 controls each temperature adjustment unit in a normal state based on the set temperature of the processing liquid according to a predetermined control method (step S74). As a result, the temperature of the processing liquid supplied to the substrate processing unit 3 is adjusted to the main target temperature by at least some of the multiple temperature adjustment units 12a and 13a.

[0181] Next, the CPU 91 determines whether the temperature of the processed liquid after temperature adjustment is within the acceptable temperature range based on the temperature signal output from the temperature sensor 14 (step S75).

[0182] If the temperature of the processing solution after temperature adjustment is within the allowable temperature range, the CPU 91 terminates the liquid supply process. On the other hand, if the temperature of the processing solution after temperature adjustment is not within the allowable temperature range, the CPU 91 outputs an alarm (step S91), stops the overall operation of the processing solution supply device 2 and the substrate processing unit 3 (step S92), and terminates the liquid supply process. In this case, continuous processing of inappropriate substrates W is prevented. This reduces the wasteful consumption of processing solution and substrates W.

[0183] Of the liquid supply processes described above, steps S72, S73, S74, and S81-S83 correspond to the fifth temperature control function. Steps S75, S91, and S92 correspond to the second temperature control function. Furthermore, of the liquid supply processes, steps S71, S91, and S92 correspond to the third temperature control function.

[0184] <6> Effects (a) In the processing liquid supply device 2 according to this embodiment, it is determined whether the multiple temperature adjustment units 12a and 13a are functioning normally or malfunctioning. In addition, the temperature of the processing liquid that has flowed through the temperature adjustment units 12a and 13a is detected in each adjustment unit 12 and 13.

[0185] When all of the temperature control units 12a and 13a are functioning correctly, each temperature control unit 12a and 13a is controlled according to a predetermined control method so that the temperature of the processing liquid is maintained at or approaches the main target temperature. The temperature-controlled processing liquid is then supplied to the substrate processing unit 3. Therefore, by adjusting the temperature of the processing liquid to the main target temperature, the reliability of the processing in the substrate processing unit 3 is improved.

[0186] If the temperature control unit transitions from a state where all of the temperature control units 12a and 13a are functioning normally to a state where some of the temperature control units fail, the temperature of the processing liquid flowing through the supply pipe p12 may change due to disturbances generated by the failed temperature control unit.

[0187] Therefore, in the substrate processing apparatus 1 according to this embodiment, when some of the multiple temperature control units 12a, 13a fail, the normal temperature control units control the temperature of the processing liquid so that it approaches the sub-target temperature. The sub-target temperature is set to offset the effect of disturbances generated from the failed temperature control unit on the processing liquid. As a result, the actual temperature of the processing liquid adjusted by the normal temperature control unit is maintained at or approaches the main target temperature. Therefore, the temperature control function of the processing liquid supply device 2 is guaranteed regardless of whether all of the multiple temperature control units 12a, 13a are normal or some of the multiple temperature control units 12a, 13a are failed.

[0188] As a result, the occurrence of processing defects in the substrate W due to the failure of some of the multiple temperature control units 12a and 13a is reduced.

[0189] (b) The temperature of the processing liquid to be adjusted in each adjustment unit 12, 13 is set, for example, according to the first setting method described above. In this case, the main target temperature or sub-target temperature corresponding to each adjustment unit 12, 13 is determined based on multiple determination results of whether the multiple temperature adjustment units 12a, 13a are normal or malfunctioning, and a temperature table. This makes it possible to maintain or approach the main target temperature of the processing liquid supplied to the substrate processing unit 3 with a simple process.

[0190] (c) The temperature of the processing liquid to be adjusted in each adjustment unit is set, for example, according to the second setting method described above. In this case, if all of the temperature adjustment units 12a and 13a are determined to be functioning normally, the temperature of the processing liquid supplied to the substrate processing unit 3 can be maintained at or approached the main target temperature with a simple process. Also, if some of the temperature adjustment units 12a and 13a are determined to be malfunctioning, a secondary target temperature is appropriately determined based on the detection results of at least some of the temperature detection units and the main target temperature. This makes it possible to maintain or approach the temperature of the processing liquid supplied to the substrate processing unit 3 at or near the main target temperature with a simple process.

[0191] 4. Other Embodiments (a) In the substrate processing apparatus 1 according to the above embodiment, each of the temperature adjustment units 12a and 13a includes a heat exchanger and a flow rate adjustment device, but the present invention is not limited thereto. Each of the temperature adjustment units 12a and 13a does not have to include a flow rate adjustment device. In this case, the control unit 9 may control the amount of temperature adjustment of the processing liquid by each of the temperature adjustment units 12a and 13a by controlling the chiller 6 when the temperature of the processing liquid is adjusted by each of the temperature adjustment units 12a and 13a. In this case, the chiller 6 may, for example, adjust the temperature of the cooling water supplied to each of the temperature adjustment units 12a and 13a based on the control of the control unit 9, or adjust the flow rate of the cooling water supplied to each of the temperature adjustment units 12a and 13a.

[0192] (b) In the substrate processing apparatus 1 according to the above embodiment, a chiller 6 is used to adjust the temperature of the processing liquid to a target temperature. In addition, each of the temperature adjustment units 12a and 13a provided in the processing liquid supply device 2 includes a heat exchanger. However, the present invention is not limited to these examples. Each of the temperature adjustment units 12a and 13a may include a Peltier element instead of a heat exchanger. In this case, the control unit 9 can directly adjust the temperature of the processing liquid by controlling the Peltier elements of each temperature adjustment unit 12a and 13a. Furthermore, it is not necessary to provide a chiller 6 in the substrate processing apparatus 1.

[0193] Furthermore, in the substrate processing apparatus 1, if the target temperature of the processing liquid is set to a temperature lower than room temperature, each of the temperature adjustment units 12a and 13a may include a cooling device such as a cooling fan instead of a heat exchanger. Also, in the substrate processing apparatus 1, if the target temperature of the processing liquid is set to a temperature higher than room temperature, each of the temperature adjustment units 12a and 13a may include a heating device such as a heater. Alternatively, each of the temperature adjustment units 12a and 13a may be provided with a heat exchanger, and a heat pump may be provided separately from the processing liquid supply device 2.

[0194] The degree of freedom in processing the substrate W improves as the adjustable range of the processing solution temperature increases. For example, it becomes possible to adjust the etching amount over a wide range. Therefore, it is preferable that the temperature adjustment units 12a and 13a are configured to be able to adjust the temperature of the processing solution over a wider range.

[0195] (c) In each of the adjustment units 12 and 13 according to the first embodiment, the state of two valves is switched between a first flow state and a second flow state. This switches the flow path of the processing liquid. The two valves provided in each of the adjustment units 12 and 13 function as the flow switching unit of the present invention.

[0196] However, in the adjustment unit 12, instead of providing two valves v01 and v02, a three-way valve may be provided at the connection point between the upstream end of the bypass pipe p14 and the supply pipe p12. Similarly, in the adjustment unit 13, instead of providing two valves v11 and v12, a three-way valve may be provided at the connection point between the upstream end of the bypass pipe p15 and the supply pipe p12. In this case, each three-way valve functions as a flow switching unit according to the present invention. Therefore, the control unit 9 can switch the flow path of the processed liquid in the adjustment units 12 and 13 by controlling each three-way valve.

[0197] (d) In the substrate processing apparatus 1 according to the above embodiment, the temperature of the processing liquid supplied from the processing liquid supply device 2 to the substrate processing unit 3 is adjusted by two temperature adjustment units 12a and 13a, but the present invention is not limited thereto. In the processing liquid supply device 2, there may be two or more temperature adjustment units for adjusting the temperature of the processing liquid. Therefore, the processing liquid supply device 2 may include three or more temperature adjustment units, including the temperature adjustment units 12a and 13a.

[0198] Even in this case, the liquid supply process according to the first to third embodiments (Figures 3, 6, 7, 9 to 11) is performed, which reduces the likelihood of processing defects in the substrate W occurring due to a failure in some of the multiple temperature control units.

[0199] (e) The processing liquid supply device 2 according to the above embodiment supplies a chemical solution for etching the substrate W to the substrate processing unit 3 as an example of a processing liquid, but the present invention is not limited thereto. The processing liquid may be a rinsing liquid for washing the upper surface of the substrate W. That is, the processing liquid supply device 2 may be configured to supply a rinsing liquid to the substrate processing unit 3. Alternatively, the processing liquid may be a replacement liquid for removing chemical solutions remaining on the upper surface of the substrate W. That is, the processing liquid supply device 2 may be configured to supply a replacement liquid to the substrate processing unit 3.

[0200] (f) In the processing liquid supply device 2 according to the above embodiment, each of the replenishment pipe p11, supply pipe p12, circulation pipe p13, bypass pipe p14, bypass pipe p15, and chamber pipe p21 only needs to form a flow path for the processing liquid. Therefore, each of the pipes (p11, p12, p13, p14, p15, p21) according to the above embodiment may consist of multiple pipes and one or more connectors, etc.

[0201] 5. Correspondence between each component of the claim and each part of the embodiment The following describes examples of the correspondence between each component of the claim and each element of the embodiment, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claim can also be used as each component of the claim.

[0202] In the above embodiment, the chamber 4 is an example of a chamber, and the configuration includes a processing liquid supply device 2 and a control unit 9, or the processing liquid supply device 2 is an example of a processing liquid supply device, the control unit 9 is an example of a control unit, the supply piping p12 is an example of a supply piping, the adjustment units 12 and 13 are examples of a plurality of adjustment units, the fault detectors 12c and 13c and the control unit 9 are examples of fault determination units, and the configuration includes temperature adjustment units 12a and 13a and a chiller 6, or the temperature adjustment units 12a and 13a are examples of temperature adjustment units.

[0203] Furthermore, bypass pipes p14 and p15 are examples of bypass flow paths, valves v01, v02, v11, and v12 are examples of flow path switching sections, substrate processing apparatus 1 is an example of a substrate processing apparatus, valves v01 and v11 are examples of first valves, valves v02 and v12 are examples of second valves, adjustment unit 12 is an example of a first adjustment unit, and adjustment unit 13 is an example of a second adjustment unit.

[0204] Furthermore, a configuration including a temperature adjustment unit 12a and a chiller 6, or where the temperature adjustment unit 12a is an example of a first temperature adjustment unit, a configuration including a temperature adjustment unit 13a and a chiller 6, or where the temperature adjustment unit 13a is an example of a second temperature adjustment unit, where the temperature detection unit 12b is an example of a first temperature detection unit, where the temperature detection unit 13b is an example of a second temperature detection unit, and where the storage device 94 is an example of a storage unit.

[0205] 6. Summary of Embodiments (Section 1) The substrate processing apparatus according to Section 1 comprises: a chamber for processing a substrate using a processing liquid; a processing liquid supply device for supplying the processing liquid to the chamber; and a control unit for controlling the chamber and the processing liquid supply device. The processing liquid supply device includes: a supply channel for guiding the processing liquid to the chamber; a plurality of adjustment units provided in a plurality of parts of the supply channel; and a fault determination unit. Each adjustment unit includes: a temperature adjustment unit provided in the supply channel for adjusting the temperature of the processing liquid flowing through the supply channel; a bypass channel provided in the supply channel for bypassing the temperature adjustment unit; and a flow switching unit configured to transition between a first flow state in which the flow of processing liquid in the temperature adjustment unit of the supply channel is permitted and the flow of processing liquid in the bypass channel is blocked, and a second flow state in which the flow of processing liquid in the temperature adjustment unit of the supply channel is blocked and the flow of processing liquid in the bypass channel is permitted. The fault determination unit is configured to determine whether the plurality of temperature adjustment units are normal or faulty. The control unit is configured to determine whether the plurality of temperature adjustment units are normal or faulty. For adjustment units that include a temperature adjustment unit and are determined to be functioning normally by the fault determination unit, the flow switching unit is switched to the first flow state. For adjustment units that include a temperature adjustment unit and are determined to be malfunctioning by the fault determination unit, the flow switching unit is switched to the second flow state.

[0206] In this substrate processing apparatus, a processing liquid is supplied to the chamber through a supply channel of a processing liquid supply device. In the chamber, the substrate is processed using the processing liquid. Multiple adjustment units are provided at multiple points along the supply channel.

[0207] Each adjustment unit includes a temperature control section, a bypass channel, and a channel switching section. The temperature control section is located in the supply channel. The bypass channel is located in the supply channel so as to bypass the temperature control section. The channel switching section is configured to switch between a first flow state in which the processing liquid flows through the temperature control section and a second flow state in which the processing liquid flows through the bypass channel.

[0208] Multiple temperature control units are determined to be either functioning correctly or malfunctioning. In the adjustment unit containing temperature control units determined to be functioning correctly, the flow switching unit switches to the first flow state. This adjusts the temperature of the processing liquid flowing through the supply channel. The temperature-adjusted processing liquid is then flowed downstream of the adjustment unit. Therefore, by properly adjusting the temperature of the processing liquid, the reliability of processing in the chamber is improved.

[0209] On the other hand, in the adjustment unit including the temperature control unit that has been determined to be malfunctioning, the flow switching unit switches to the second flow state. As a result, the processing liquid flows downstream of the adjustment unit through the bypass pipe. At this time, the flow of the processing liquid is stopped in the portion of the supply flow path where the malfunctioning temperature control unit is located. Therefore, the processing liquid affected by disturbances generated from the malfunctioning temperature control unit is not supplied to the chamber. In other words, the processing liquid adjusted to an unintended temperature is not supplied to the chamber.

[0210] As a result, the likelihood of circuit board processing defects occurring due to the failure of some of the multiple temperature control units is reduced.

[0211] (Paragraph 2) In the substrate processing apparatus described in Paragraph 1, the control unit may stop the operation of the chamber and the processing liquid supply device if the fault determination unit determines that the plurality of temperature control units are malfunctioning.

[0212] If multiple temperature control units fail, the temperature of the processing liquid flowing through the supply channel will not be regulated. In contrast, with the above configuration, if multiple temperature control units fail, the operation of the chamber and processing liquid supply device will stop. This prevents the continuous processing of inappropriate substrates. As a result, the wasteful consumption of processing liquid and substrates is suppressed.

[0213] (3) In the substrate processing apparatus described in paragraph 1 or 2, each adjustment unit's flow switching section includes a first valve provided in the supply flow path and bypassed by the bypass flow path, and a second valve provided in the bypass flow path, wherein the first flow state of the flow switching section is a state in which the first valve of the flow switching section is open and the second valve of the flow switching section is closed, and the second flow state of the flow switching section may be a state in which the first valve of the flow switching section is closed and the second valve of the flow switching section is open.

[0214] In this case, each adjustment unit can suppress the supply of processing fluid affected by disturbances to the chamber with a simple configuration.

[0215] (Clause 4) The substrate processing apparatus described in paragraph 4 comprises: a chamber for processing a substrate using a processing liquid; a processing liquid supply device for supplying the processing liquid to the chamber; and a control unit for controlling the chamber and the processing liquid supply device, wherein the processing liquid supply device includes: a supply channel for guiding the processing liquid to the chamber; a first adjustment unit and a second adjustment unit provided in a first portion and a second portion of the supply channel arranged from upstream to downstream, respectively; and a fault determination unit, wherein the first adjustment unit includes: a first temperature adjustment unit provided in the first portion of the supply channel for adjusting the temperature of the processing liquid flowing through the first portion; and a first temperature detection unit for detecting the temperature of the processing liquid adjusted by the first temperature adjustment unit; the second adjustment unit includes: a second temperature adjustment unit provided in the second portion of the supply channel for adjusting the temperature of the processing liquid flowing through the second portion; and a second temperature detection unit for detecting the temperature of the processing liquid adjusted by the second temperature adjustment unit; and the fault determination unit is configured to determine whether the first temperature adjustment unit and the second temperature adjustment unit are functioning normally or are malfunctioning. The control unit controls the first temperature control unit based on the detection result from the first temperature detection unit when the fault determination unit determines that both the first and second temperature control units are functioning correctly, and controls the second temperature control unit based on the detection result from the second temperature detection unit when the fault determination unit determines that both the first and second temperature control units are functioning correctly and are malfunctioning, and controls the first temperature control unit based on the detection result from the second temperature detection unit.

[0216] In the substrate processing apparatus, a processing liquid is supplied to the chamber through a supply channel of a processing liquid supply device. In the chamber, the substrate is processed using the processing liquid. A first adjustment unit and a second adjustment unit are provided in the first and second portions of the supply channel, respectively.

[0217] The first adjustment unit includes a first temperature adjustment unit and a first temperature detection unit. The first temperature adjustment unit adjusts the temperature of the processing liquid flowing through a first portion of the supply channel, and the first temperature detection unit detects the temperature of the processing liquid adjusted by the first temperature adjustment unit. The second adjustment unit includes a second temperature adjustment unit and a second temperature detection unit. The second temperature adjustment unit adjusts the temperature of the processing liquid flowing through a second portion of the supply channel, and the second temperature detection unit detects the temperature of the processing liquid adjusted by the second temperature adjustment unit.

[0218] The system determines whether the first and second temperature control units are functioning correctly or malfunctioning. If both the first and second temperature control units are functioning correctly, the first temperature control unit is controlled based on the detection result from the first temperature detection unit. The second temperature control unit is also controlled based on the detection result from the second temperature detection unit. This allows each control unit to adjust the temperature of the processing liquid with high precision. The temperature-adjusted processing liquid is then supplied to the chamber. Therefore, the reliability of the processing in the chamber is improved by ensuring that the temperature of the processing liquid is properly adjusted.

[0219] If the first temperature control unit is functioning correctly but the second temperature control unit is malfunctioning, the second control unit cannot adjust the temperature of the processing liquid. The temperature of the processing liquid flowing through the second portion of the supply channel may be affected by disturbances generated from the malfunctioning second temperature control unit. If processing liquid adjusted to an unintended temperature due to these disturbances is supplied to the chamber, the reliability of processing in the chamber will decrease.

[0220] Therefore, in the above-described substrate processing apparatus, when the first temperature control unit is functioning normally and the second temperature control unit is malfunctioning, the first temperature control unit is controlled based on the detection result from the second temperature detection unit.

[0221] The second temperature detection unit is located downstream of the first adjustment unit and the second temperature adjustment unit in the supply flow path. Therefore, if the first temperature adjustment unit is functioning correctly and the second temperature adjustment unit is malfunctioning, the second temperature detection unit detects the temperature of the processing liquid that has been regulated by the first temperature adjustment unit and is affected by disturbances generated from the malfunctioning second temperature adjustment unit.

[0222] Therefore, by controlling the first temperature adjustment unit based on the detection result from the second temperature detection unit, the first adjustment unit can adjust the temperature of the processing liquid so that the influence of disturbances generated from the second temperature adjustment unit is canceled out. In this case, processing liquid adjusted to an unintended temperature is not supplied to the chamber.

[0223] As a result, the likelihood of circuit board processing defects occurring due to the failure of some of the multiple temperature control units is reduced.

[0224] (Clause 5) In the substrate processing apparatus described in paragraph 4, the control unit may control the second temperature control unit based on the detection result of the second temperature detection unit when the fault determination unit determines that the first temperature control unit is faulty and the second temperature control unit is functioning normally.

[0225] According to the above configuration, if the first temperature control unit is malfunctioning and the second temperature control unit is functioning correctly, the second temperature control unit is controlled based on the detection result from the second temperature detection unit. Here, the second temperature detection unit is located downstream of the first temperature control unit. Therefore, the processing liquid whose temperature is controlled by the second temperature control unit is supplied to the chamber without being affected by disturbances generated from the malfunctioning first temperature control unit. Consequently, processing liquid adjusted to an unintended temperature is not supplied to the chamber.

[0226] (Clause 6) In the substrate processing apparatus described in paragraph 4 or 5, the control unit may stop the operation of the chamber and the processing liquid supply device if the fault determination unit determines that the first temperature control unit and the second temperature control unit are malfunctioning.

[0227] In this case, the continuous processing of inappropriate substrates is prevented. This reduces the wasteful consumption of processing solution and substrates.

[0228] (Clause 7) The substrate processing apparatus according to Clause 7 comprises: a chamber for processing a substrate using a processing liquid; a processing liquid supply device for supplying the processing liquid to the chamber; and a control unit for controlling the chamber and the processing liquid supply device, wherein the processing liquid supply device includes: a supply channel for guiding the processing liquid to the chamber; a plurality of adjustment units provided in a plurality of parts of the supply channel; and a fault determination unit, each of which includes: a temperature adjustment unit provided in the supply channel for adjusting the temperature of the processing liquid flowing through the supply channel; and a temperature detection unit for detecting the temperature of the processing liquid adjusted by the temperature adjustment unit; the fault determination unit is configured to determine whether the plurality of temperature adjustment units are normal or faulty; and when the fault determination unit determines that all of the plurality of temperature adjustment units are normal, the control unit controls each temperature adjustment unit according to a predetermined control method to maintain or approach a predetermined main target temperature in accordance with the processing performed in the chamber. When the fault detection unit determines that some of the multiple temperature control units are faulty, the control unit controls one or more normal temperature control units according to the control method to adjust the temperature of the processing liquid to approach a secondary target temperature different from the main target temperature. The secondary target temperature is set such that when some of the multiple temperature control units are faulty, the control unit controls one or more normal temperature control units according to the control method to offset the effect of disturbances generated by the faulty part of the temperature control unit on the processing liquid.

[0229] In this substrate processing apparatus, a processing liquid is supplied to the chamber through a supply channel of a processing liquid supply device. In the chamber, the substrate is processed using the processing liquid. Multiple adjustment units are provided at multiple points along the supply channel.

[0230] Each adjustment unit includes a temperature control unit and a temperature detection unit. The temperature of the processing liquid flowing through the supply channel is adjusted by the temperature control unit. It is determined whether multiple temperature control units are functioning correctly or malfunctioning. In addition, the temperature of the processing liquid adjusted by the temperature control unit is detected in each adjustment unit.

[0231] When all of the multiple temperature control units are functioning correctly, each temperature control unit is controlled according to a predetermined control method so that the temperature of the processing liquid is maintained at or approaches the main target temperature. The temperature-controlled processing liquid is then supplied to the chamber. Therefore, by adjusting the temperature of the processing liquid to the main target temperature, the reliability of processing in the chamber is improved.

[0232] If the temperature control unit transitions from a state where all units are functioning normally to a state where some units fail, the temperature of the processing fluid flowing through the supply channel may change due to disturbances generated by the failed temperature control unit.

[0233] In one adjustment unit, whether or not the actual temperature of the processing liquid flowing through the supply channel can be adjusted to the main target temperature depends, for example, on the temperature of the incoming processing liquid, the specifications of the temperature adjustment unit, and the control method of the temperature adjustment unit. Therefore, if the temperature of the processing liquid flowing into one adjustment unit fluctuates significantly, it becomes difficult to adjust the temperature of the processing liquid flowing through the supply channel to the main target temperature. Specifically, if the temperature of the processing liquid flowing into one adjustment unit remains deviating from the pre-determined temperature, the actual temperature of the processing liquid flowing out of one adjustment unit may converge to a temperature that deviates significantly from the main target temperature.

[0234] Therefore, in the above-described substrate processing apparatus, when some of the multiple temperature control units fail, each of the one or more functioning temperature control units controls the temperature of the processing liquid to approach the sub-target temperature. The sub-target temperature is set to offset the effect of disturbances generated by the failed temperature control unit on the processing liquid. As a result, the actual temperature of the processing liquid adjusted by each of the one or more functioning temperature control units is maintained at or approaches the main target temperature, which is slightly different from the sub-target temperature. Thus, the temperature control function of the processing liquid by the multiple adjustment units is guaranteed regardless of whether all of the multiple temperature control units are functioning correctly or if some of the multiple temperature control units are failing.

[0235] As a result, the likelihood of circuit board processing defects occurring due to the failure of some of the multiple temperature control units is reduced.

[0236] (Clause 8) In the substrate processing apparatus described in paragraph 7, the substrate processing apparatus further includes a storage unit that stores a temperature table showing the correspondence between a plurality of combinations of states of the plurality of temperature control units and a plurality of specified temperatures to be adjusted by each temperature control unit, and the control unit may, when it is determined that all of the plurality of temperature control units are normal, obtain one specified temperature from the temperature table corresponding to a combination of determination results of the fault determination unit and determine the obtained one specified temperature as the main target temperature, and when it is determined that some of the plurality of temperature control units are faulty, obtain other specified temperatures from the temperature table corresponding to a combination of determination results of the fault determination unit and determine the obtained other specified temperatures as the secondary target temperatures.

[0237] In this case, the primary and secondary target temperatures corresponding to each temperature control unit are determined based on multiple determination results regarding whether each temperature control unit is functioning correctly or malfunctioning, and a temperature table. This makes it possible to maintain or approach the primary target temperature of the processing liquid supplied to the chamber with a simple process.

[0238] (Clause 9) In the substrate processing apparatus described in paragraph 7, the substrate processing apparatus further comprises a storage unit for storing the main target temperature, and the control unit may, when it is determined that all of the plurality of temperature adjustment units are functioning normally, acquire the main target temperature stored in the storage unit, and when it is determined that some of the plurality of temperature adjustment units are malfunctioning, calculate the difference between the detection result of one or more temperature detectors corresponding to at least some of the temperature adjustment units and the main target temperature stored in the storage unit, and determine the sub-target temperature based on one or more calculation results and the main target temperature.

[0239] In this case, if all of the temperature control units are determined to be functioning correctly, the temperature of the processing fluid supplied to the chamber can be easily adjusted to or approach the main target temperature. Furthermore, if some of the temperature control units are determined to be malfunctioning, a secondary target temperature can be appropriately determined based on the detection results of at least some of the temperature detection units and the main target temperature. This allows the temperature of the processing fluid supplied to the chamber to be more effectively maintained at or approached the main target temperature through a simple process.

[0240] (Clause 10) In the substrate processing apparatus described in any one of paragraphs 7 to 9, the control unit may stop the operation of the chamber and the processing liquid supply device when the fault determination unit determines that the plurality of temperature control units are malfunctioning.

[0241] If multiple temperature control units fail, the temperature of the processing liquid flowing through the supply channel will not be regulated. In contrast, with the above configuration, if multiple temperature control units fail, the operation of the chamber and processing liquid supply device will stop. This prevents the continuous processing of inappropriate substrates. As a result, the wasteful consumption of processing liquid and substrates is suppressed.

[0242] (Clause 11) The processing liquid supply device according to Clause 11 is a processing liquid supply device that supplies processing liquid to a chamber that performs processing on a substrate using processing liquid, comprising: a supply channel for guiding the processing liquid to the chamber; a plurality of adjustment units provided in a plurality of parts of the supply channel; a fault determination unit; and a control unit, each adjustment unit including: a temperature adjustment unit provided in the supply channel for adjusting the temperature of the processing liquid flowing through the supply channel; a bypass channel provided in the supply channel for bypassing the temperature adjustment unit; and a flow switching unit configured to transition between a first flow state in the supply channel that allows the flow of processing liquid in the temperature adjustment unit and blocks the flow of processing liquid in the bypass channel, and a second flow state in the supply channel that blocks the flow of processing liquid in the temperature adjustment unit and allows the flow of processing liquid in the bypass channel, the fault determination unit is configured to determine whether the plurality of temperature adjustment units are normal or faulty, and the control unit is For adjustment units that include a temperature adjustment unit and are determined to be functioning normally by the fault determination unit, the flow switching unit is switched to the first flow state. For adjustment units that include a temperature adjustment unit and are determined to be malfunctioning by the fault determination unit, the flow switching unit is switched to the second flow state.

[0243] In this processing liquid supply device, the processing liquid is supplied to the chamber through a supply channel. In the chamber, the substrate is processed using the processing liquid. Multiple adjustment units are provided in multiple sections of the supply channel.

[0244] Each adjustment unit includes a temperature control section, a bypass channel, and a channel switching section. The temperature control section is located in the supply channel. The bypass channel is located in the supply channel so as to bypass the temperature control section. The channel switching section is configured to switch between a first flow state in which the processing liquid flows through the temperature control section and a second flow state in which the processing liquid flows through the bypass channel.

[0245] Multiple temperature control units are determined to be either functioning correctly or malfunctioning. In the adjustment unit containing temperature control units determined to be functioning correctly, the flow switching unit switches to the first flow state. This adjusts the temperature of the processing liquid flowing through the supply channel. The temperature-adjusted processing liquid is then flowed downstream of the adjustment unit. Therefore, by properly adjusting the temperature of the processing liquid, the reliability of processing in the chamber is improved.

[0246] On the other hand, in the adjustment unit including the temperature control unit that has been determined to be malfunctioning, the flow switching unit switches to the second flow state. As a result, the processing liquid flows downstream of the adjustment unit through the bypass pipe. At this time, the flow of the processing liquid is stopped in the portion of the supply flow path where the malfunctioning temperature control unit is located. Therefore, the processing liquid affected by disturbances generated from the malfunctioning temperature control unit is not supplied to the chamber. In other words, the processing liquid adjusted to an unintended temperature is not supplied to the chamber.

[0247] As a result, the likelihood of circuit board processing defects occurring due to the failure of some of the multiple temperature control units is reduced.

[0248] (Clause 12) The processing liquid supply device according to Clause 12 is a processing liquid supply device that supplies processing liquid to a chamber for processing a substrate using processing liquid, comprising: a supply channel for guiding the processing liquid to the chamber; a first adjustment unit and a second adjustment unit provided in a first portion and a second portion of the supply channel arranged from upstream to downstream, respectively; a fault determination unit; and a control unit, wherein the first adjustment unit includes a first temperature adjustment unit provided in the first portion of the supply channel for adjusting the temperature of the processing liquid flowing through the first portion, and a first temperature detection unit for detecting the temperature of the processing liquid adjusted by the first temperature adjustment unit; the second adjustment unit includes a second temperature adjustment unit provided in the second portion of the supply channel for adjusting the temperature of the processing liquid flowing through the second portion, and a second temperature detection unit for detecting the temperature of the processing liquid adjusted by the second temperature adjustment unit; the fault determination unit is configured to determine whether the first temperature adjustment unit and the second temperature adjustment unit are normal or faulty; and the control unit is If the fault determination unit determines that the first temperature control unit is functioning normally and the second temperature control unit is functioning normally, the first temperature control unit is controlled based on the detection result from the first temperature detection unit, and the second temperature control unit is controlled based on the second temperature detection unit. If the fault determination unit determines that the first temperature control unit is functioning normally and the second temperature control unit is malfunctioning, the first temperature control unit is controlled based on the detection result from the second temperature detection unit.

[0249] In the processing liquid supply device, the processing liquid is supplied to the chamber through a supply channel. In the chamber, the substrate is processed using the processing liquid. A first adjustment unit and a second adjustment unit are provided in the first and second portions of the supply channel, respectively.

[0250] The first adjustment unit includes a first temperature adjustment unit and a first temperature detection unit. The first temperature adjustment unit adjusts the temperature of the processing liquid flowing through a first portion of the supply channel, and the first temperature detection unit detects the temperature of the processing liquid adjusted by the first temperature adjustment unit. The second adjustment unit includes a second temperature adjustment unit and a second temperature detection unit. The second temperature adjustment unit adjusts the temperature of the processing liquid flowing through a second portion of the supply channel, and the second temperature detection unit detects the temperature of the processing liquid adjusted by the second temperature adjustment unit.

[0251] The system determines whether the first and second temperature control units are functioning correctly or malfunctioning. If both the first and second temperature control units are functioning correctly, the first temperature control unit is controlled based on the detection result from the first temperature detection unit. The second temperature control unit is also controlled based on the detection result from the second temperature detection unit. This allows each control unit to adjust the temperature of the processing liquid with high precision. The temperature-adjusted processing liquid is then supplied to the chamber. Therefore, the reliability of the processing in the chamber is improved by ensuring that the temperature of the processing liquid is properly adjusted.

[0252] If the first temperature control unit is functioning correctly but the second temperature control unit is malfunctioning, the second control unit cannot adjust the temperature of the processing liquid. The temperature of the processing liquid flowing through the second portion of the supply channel may be affected by disturbances generated from the malfunctioning second temperature control unit. If processing liquid adjusted to an unintended temperature due to these disturbances is supplied to the chamber, the reliability of processing in the chamber will decrease.

[0253] Therefore, in the above-described processing liquid supply device, when the first temperature control unit is functioning normally and the second temperature control unit is malfunctioning, the first temperature control unit is controlled based on the detection result from the second temperature detection unit.

[0254] The second temperature detection unit is located downstream of the first adjustment unit and the second temperature adjustment unit in the supply flow path. Therefore, if the first temperature adjustment unit is functioning correctly and the second temperature adjustment unit is malfunctioning, the second temperature detection unit detects the temperature of the processing liquid that has been regulated by the first temperature adjustment unit and is affected by disturbances generated from the malfunctioning second temperature adjustment unit.

[0255] Therefore, by controlling the first temperature adjustment unit based on the detection result from the second temperature detection unit, the first adjustment unit can adjust the temperature of the processing liquid so that the influence of disturbances generated from the second temperature adjustment unit is canceled out. In this case, processing liquid adjusted to an unintended temperature is not supplied to the chamber.

[0256] As a result, the likelihood of circuit board processing defects occurring due to the failure of some of the multiple temperature control units is reduced.

[0257] (Clause 13) The processing liquid supply device according to Clause 13 is a processing liquid supply device that supplies processing liquid to a chamber that performs processing on a substrate using processing liquid, comprising: a supply channel for guiding the processing liquid to the chamber; a plurality of adjustment units provided in a plurality of parts of the supply channel; a fault determination unit; and a control unit, each of which includes: a temperature adjustment unit provided in the supply channel for adjusting the temperature of the processing liquid flowing through the supply channel; and a temperature detection unit for detecting the temperature of the processing liquid adjusted by the temperature adjustment unit; the fault determination unit is configured to determine whether the plurality of temperature adjustment units are normal or faulty; the control unit, when the fault determination unit determines that all of the plurality of temperature adjustment units are normal, controls each temperature adjustment unit according to a predetermined control method to adjust the temperature of the processing liquid to maintain or approach a predetermined main target temperature according to the processing performed in the chamber; and when the fault determination unit determines that a part of the plurality of temperature adjustment units is faulty, controls one or more normal temperature adjustment units according to the control method to adjust the temperature of the processing liquid to approach a sub-target temperature different from the main target temperature. The aforementioned secondary target temperature is determined so that, in the event of a failure in any of the multiple temperature control units, the control unit controls one or more of the normal temperature control units according to the control method, thereby offsetting the effect of disturbances generated by the failed portion of the temperature control units on the processing liquid.

[0258] In this processing liquid supply device, the processing liquid is supplied to the chamber through a supply channel. In the chamber, the substrate is processed using the processing liquid. Multiple adjustment units are provided in multiple sections of the supply channel.

[0259] Each adjustment unit includes a temperature control unit and a temperature detection unit. The temperature of the processing liquid flowing through the supply channel is adjusted by the temperature control unit. It is determined whether multiple temperature control units are functioning correctly or malfunctioning. In addition, the temperature of the processing liquid adjusted by the temperature control unit is detected in each adjustment unit.

[0260] When all of the multiple temperature control units are functioning correctly, each temperature control unit is controlled according to a predetermined control method so that the temperature of the processing liquid is maintained at or approaches the main target temperature. The temperature-controlled processing liquid is then supplied to the chamber. Therefore, by adjusting the temperature of the processing liquid to the main target temperature, the reliability of processing in the chamber is improved.

[0261] If the temperature control unit transitions from a state where all units are functioning normally to a state where some units fail, the temperature of the processing fluid flowing through the supply channel may change due to disturbances generated by the failed temperature control unit.

[0262] In one adjustment unit, whether or not the actual temperature of the processing liquid flowing through the supply channel can be adjusted to the main target temperature depends, for example, on the temperature of the incoming processing liquid, the specifications of the temperature adjustment unit, and the control method of the temperature adjustment unit. Therefore, if the temperature of the processing liquid flowing into one adjustment unit fluctuates significantly, it becomes difficult to adjust the temperature of the processing liquid flowing through the supply channel to the main target temperature. Specifically, if the temperature of the processing liquid flowing into one adjustment unit remains deviating from the pre-prepared temperature, the actual temperature of the processing liquid flowing out of one adjustment unit may converge to a temperature deviating from the main target temperature.

[0263] Therefore, in the above-described processing liquid supply device, when some of the multiple temperature control units fail, each of the one or more functioning temperature control units controls the processing liquid temperature to approach the secondary target temperature. The secondary target temperature is set to offset the effect of disturbances generated by the failed temperature control unit on the processing liquid. As a result, the actual temperature of the processing liquid adjusted by each of the one or more functioning temperature control units is maintained at or approaches the primary target temperature, which is slightly different from the secondary target temperature. Thus, the temperature control function of the processing liquid by the multiple adjustment units is guaranteed regardless of whether all of the multiple temperature control units are functioning correctly or if some of the multiple temperature control units are failing.

[0264] As a result, the likelihood of circuit board processing defects occurring due to the failure of some of the multiple temperature control units is reduced.

[0265] (Clause 14) The substrate processing method relating to paragraph 14 is a substrate processing method for processing a substrate using a substrate processing apparatus, wherein the substrate processing apparatus comprises a chamber for processing the substrate using a processing liquid, and a processing liquid supply device for supplying the processing liquid to the chamber, the processing liquid supply device includes a supply channel for guiding the processing liquid to the chamber, and a plurality of adjustment units provided in a plurality of parts of the supply channel, each adjustment unit includes a temperature adjustment unit provided in the supply channel for adjusting the temperature of the processing liquid flowing through the supply channel, a bypass channel provided in the supply channel for bypassing the temperature adjustment unit, and a flow switching unit configured to transition between a first flow state that allows the flow of the processing liquid in the temperature adjustment unit of the supply channel and blocks the flow of the processing liquid in the bypass channel, and a second flow state that blocks the flow of the processing liquid in the temperature adjustment unit of the supply channel and allows the flow of the processing liquid in the bypass channel, the substrate processing method comprises controlling the processing liquid supply device to supply the processing liquid to the chamber, and controlling the chamber to process the substrate. Supplying the processing liquid to the chamber includes determining whether each of the plurality of temperature control units is functioning normally or is malfunctioning; switching the flow switching unit to the first flow state for the adjustment unit that includes the temperature control unit determined to be functioning normally among the plurality of adjustment units; and switching the flow switching unit to the second flow state for the adjustment unit that includes the temperature control unit determined to be malfunctioning among the plurality of adjustment units.

[0266] In this substrate processing method, a processing liquid is supplied to the chamber through a supply channel of a processing liquid supply device. In the chamber, the substrate is processed using the processing liquid. Multiple adjustment units are provided in multiple sections of the supply channel.

[0267] Each adjustment unit includes a temperature control section, a bypass channel, and a channel switching section. The temperature control section is located in the supply channel. The bypass channel is located in the supply channel so as to bypass the temperature control section. The channel switching section is configured to switch between a first flow state in which the processing liquid flows through the temperature control section and a second flow state in which the processing liquid flows through the bypass channel.

[0268] Multiple temperature control units are determined to be either functioning correctly or malfunctioning. In the adjustment unit containing temperature control units determined to be functioning correctly, the flow switching unit switches to the first flow state. This adjusts the temperature of the processing liquid flowing through the supply channel. The temperature-adjusted processing liquid is then flowed downstream of the adjustment unit. Therefore, by properly adjusting the temperature of the processing liquid, the reliability of processing in the chamber is improved.

[0269] On the other hand, in the adjustment unit including the temperature control unit that has been determined to be malfunctioning, the flow switching unit switches to the second flow state. As a result, the processing liquid flows downstream of the adjustment unit through the bypass pipe. At this time, the flow of the processing liquid is stopped in the portion of the supply flow path where the malfunctioning temperature control unit is located. Therefore, the processing liquid affected by disturbances generated from the malfunctioning temperature control unit is not supplied to the chamber. In other words, the processing liquid adjusted to an unintended temperature is not supplied to the chamber.

[0270] As a result, the likelihood of circuit board processing defects occurring due to the failure of some of the multiple temperature control units is reduced.

[0271] (Clause 15) The substrate processing method relating to paragraph 15 is a substrate processing method for processing a substrate using a substrate processing apparatus, wherein the substrate processing apparatus comprises a chamber for processing the substrate using a processing liquid, and a processing liquid supply device for supplying the processing liquid to the chamber, the processing liquid supply device includes a supply channel for guiding the processing liquid to the chamber, and a first adjustment unit and a second adjustment unit provided in a first portion and a second portion of the supply channel arranged from upstream to downstream, respectively, the first adjustment unit includes a first temperature adjustment unit provided in the first portion of the supply channel for adjusting the temperature of the processing liquid flowing through the first portion, and a first temperature detection unit for detecting the temperature of the processing liquid adjusted by the first temperature adjustment unit, the second adjustment unit includes a second temperature adjustment unit provided in the second portion of the supply channel for adjusting the temperature of the processing liquid flowing through the second portion, and a second temperature detection unit for detecting the temperature of the processing liquid adjusted by the second temperature adjustment unit, the substrate processing method comprises controlling the processing liquid supply device to supply the processing liquid to the chamber, The process includes controlling the chamber to process the substrate, and supplying a processing liquid to the chamber includes determining whether the first temperature control unit and the second temperature control unit are functioning normally or malfunctioning, controlling the first temperature control unit based on the detection result of the first temperature detection unit and controlling the second temperature control unit based on the detection result of the second temperature detection unit when it is determined that both the first and second temperature control units are functioning normally, and controlling the first temperature control unit based on the detection result of the second temperature detection unit when it is determined that both the first and second temperature control units are functioning normally.

[0272] In this substrate processing method, a processing liquid is supplied to the chamber through a supply channel of a processing liquid supply device. In the chamber, the substrate is processed using the processing liquid. A first adjustment unit and a second adjustment unit are provided in the first and second portions of the supply channel, respectively.

[0273] The first adjustment unit includes a first temperature adjustment unit and a first temperature detection unit. The first temperature adjustment unit adjusts the temperature of the processing liquid flowing through a first portion of the supply channel, and the first temperature detection unit detects the temperature of the processing liquid adjusted by the first temperature adjustment unit. The second adjustment unit includes a second temperature adjustment unit and a second temperature detection unit. The second temperature adjustment unit adjusts the temperature of the processing liquid flowing through a second portion of the supply channel, and the second temperature detection unit detects the temperature of the processing liquid adjusted by the second temperature adjustment unit.

[0274] The system determines whether the first and second temperature control units are functioning correctly or malfunctioning. If both the first and second temperature control units are functioning correctly, the first temperature control unit is controlled based on the detection result from the first temperature detection unit. The second temperature control unit is also controlled based on the detection result from the second temperature detection unit. This allows each control unit to adjust the temperature of the processing liquid with high precision. The temperature-adjusted processing liquid is then supplied to the chamber. Therefore, the reliability of the processing in the chamber is improved by ensuring that the temperature of the processing liquid is properly adjusted.

[0275] If the first temperature control unit is functioning correctly but the second temperature control unit is malfunctioning, the second control unit cannot adjust the temperature of the processing liquid. The temperature of the processing liquid flowing through the second portion of the supply channel may be affected by disturbances generated from the malfunctioning second temperature control unit. If processing liquid adjusted to an unintended temperature due to these disturbances is supplied to the chamber, the reliability of processing in the chamber will decrease.

[0276] Therefore, in the above substrate processing method, when the first temperature control unit is functioning normally and the second temperature control unit is malfunctioning, the first temperature control unit is controlled based on the detection result from the second temperature detection unit.

[0277] The second temperature detection unit is located downstream of the first adjustment unit and the second temperature adjustment unit in the supply flow path. Therefore, if the first temperature adjustment unit is functioning correctly and the second temperature adjustment unit is malfunctioning, the second temperature detection unit detects the temperature of the processing liquid that has been regulated by the first temperature adjustment unit and is affected by disturbances generated from the malfunctioning second temperature adjustment unit.

[0278] Therefore, by controlling the first temperature adjustment unit based on the detection result from the second temperature detection unit, the first adjustment unit can adjust the temperature of the processing liquid so that the influence of disturbances generated from the second temperature adjustment unit is canceled out. In this case, processing liquid adjusted to an unintended temperature is not supplied to the chamber.

[0279] As a result, the likelihood of circuit board processing defects occurring due to the failure of some of the multiple temperature control units is reduced.

[0280] (Clause 16) The substrate processing method relating to paragraph 16 is a substrate processing method for processing a substrate using a substrate processing apparatus, wherein the substrate processing apparatus comprises a chamber for processing the substrate using a processing liquid, and a processing liquid supply device for supplying the processing liquid to the chamber, the processing liquid supply device includes a supply channel for guiding the processing liquid to the chamber, and a plurality of adjustment units provided in a plurality of parts of the supply channel, each adjustment unit includes a temperature adjustment unit provided in the supply channel for adjusting the temperature of the processing liquid flowing through the supply channel, and a temperature detection unit for detecting the temperature of the processing liquid adjusted by the temperature adjustment unit, the substrate processing method includes controlling the processing liquid supply device to supply the processing liquid to the chamber, and controlling the chamber to process the substrate, the supply of processing liquid to the chamber includes determining whether each of the plurality of temperature adjustment units is normal or malfunctioning, and, if all of the plurality of temperature adjustment units are determined to be normal, controlling each temperature adjustment unit according to a predetermined control method to maintain or approach the temperature of the processing liquid to a predetermined main target temperature according to the processing performed in the chamber, If it is determined that some of the multiple temperature control units are malfunctioning, the control method is used to control one or more of the normal temperature control units to adjust the temperature of the processing liquid to approach a secondary target temperature different from the primary target temperature, wherein the secondary target temperature is determined to be such that, when some of the multiple temperature control units malfunction, the control method is used to control one or more of the normal temperature control units to offset the effect of disturbances generated by the malfunctioning part of the temperature control unit on the processing liquid.

[0281] In this substrate processing method, a processing liquid is supplied to the chamber through a supply channel of a processing liquid supply device. In the chamber, the substrate is processed using the processing liquid. Multiple adjustment units are provided in multiple sections of the supply channel.

[0282] Each adjustment unit includes a temperature control unit and a temperature detection unit. The temperature of the processing liquid flowing through the supply channel is adjusted by the temperature control unit. It is determined whether multiple temperature control units are functioning correctly or malfunctioning. In addition, the temperature of the processing liquid adjusted by the temperature control unit is detected in each adjustment unit.

[0283] When all of the multiple temperature control units are functioning correctly, each temperature control unit is controlled according to a predetermined control method so that the temperature of the processing liquid is maintained at or approaches the main target temperature. The temperature-controlled processing liquid is then supplied to the chamber. Therefore, by adjusting the temperature of the processing liquid to the main target temperature, the reliability of processing in the chamber is improved.

[0284] If the temperature control unit transitions from a state where all units are functioning normally to a state where some units fail, the temperature of the processing fluid flowing through the supply channel may change due to disturbances generated by the failed temperature control unit.

[0285] In one adjustment unit, whether or not the actual temperature of the processing liquid flowing through the supply channel can be adjusted to the main target temperature depends, for example, on the temperature of the incoming processing liquid, the specifications of the temperature adjustment unit, and the control method of the temperature adjustment unit. Therefore, if the temperature of the processing liquid flowing into one adjustment unit fluctuates significantly, it becomes difficult to adjust the temperature of the processing liquid flowing through the supply channel to the main target temperature. Specifically, if the temperature of the processing liquid flowing into one adjustment unit remains deviating from the pre-prepared temperature, the actual temperature of the processing liquid flowing out of one adjustment unit may converge to a temperature deviating from the main target temperature.

[0286] Therefore, in the above substrate processing method, when some of the multiple temperature control units fail, each of the one or more functioning temperature control units controls the temperature of the processing solution to approach the sub-target temperature. The sub-target temperature is set to offset the effect of disturbances generated by the failed temperature control unit on the processing solution. As a result, the actual temperature of the processing solution adjusted by each of the one or more functioning temperature control units is maintained at or approaches the main target temperature, which is slightly different from the sub-target temperature. Thus, the temperature control function of the processing solution by the multiple adjustment units is guaranteed regardless of whether all of the multiple temperature control units are functioning correctly or if some of the multiple temperature control units are failing.

[0287] As a result, the likelihood of circuit board processing defects occurring due to the failure of some of the multiple temperature control units is reduced.

[0288] (Clause 17) A processing liquid supply method relating to paragraph 17, comprising: a processing liquid supply device for supplying a processing liquid to a chamber for processing a substrate, wherein the processing liquid supply device comprises: a supply channel for guiding the processing liquid to the chamber; and a plurality of adjustment units provided in a plurality of parts of the supply channel, each adjustment unit comprising: a temperature adjustment unit provided in the supply channel for adjusting the temperature of the processing liquid flowing through the supply channel; a bypass channel provided in the supply channel for bypassing the temperature adjustment unit; and a flow switching unit configured to transition between a first flow state in which the flow of the processing liquid in the temperature adjustment unit of the supply channel is permitted and the flow of the processing liquid in the bypass channel is blocked, and a second flow state in which the flow of the processing liquid in the temperature adjustment unit of the supply channel is blocked and the flow of the processing liquid in the bypass channel is permitted, wherein the processing liquid supply method comprises: determining whether each of the plurality of temperature adjustment units is normal or malfunctioning; and, for the adjustment unit including the temperature adjustment unit that has been determined to be normal among the plurality of adjustment units, the flow switching unit is switched to the first flow state. This includes, with respect to the adjustment unit, which includes a temperature adjustment unit that has been determined to be malfunctioning among the plurality of adjustment units, switching the flow switching unit to the second flow state.

[0289] In this processing liquid supply method, the processing liquid is supplied to the chamber through the supply channel of the processing liquid supply device. In the chamber, the substrate is processed using the processing liquid. Multiple adjustment units are provided in multiple parts of the supply channel.

[0290] Each adjustment unit includes a temperature control section, a bypass channel, and a channel switching section. The temperature control section is located in the supply channel. The bypass channel is located in the supply channel so as to bypass the temperature control section. The channel switching section is configured to switch between a first flow state in which the processing liquid flows through the temperature control section and a second flow state in which the processing liquid flows through the bypass channel.

[0291] Multiple temperature control units are determined to be either functioning correctly or malfunctioning. In the adjustment unit containing temperature control units determined to be functioning correctly, the flow switching unit switches to the first flow state. This adjusts the temperature of the processing liquid flowing through the supply channel. The temperature-adjusted processing liquid is then flowed downstream of the adjustment unit. Therefore, by properly adjusting the temperature of the processing liquid, the reliability of processing in the chamber is improved.

[0292] On the other hand, in the adjustment unit including the temperature control unit that has been determined to be malfunctioning, the flow switching unit switches to the second flow state. As a result, the processing liquid flows downstream of the adjustment unit through the bypass pipe. At this time, the flow of the processing liquid is stopped in the portion of the supply flow path where the malfunctioning temperature control unit is located. Therefore, the processing liquid affected by disturbances generated from the malfunctioning temperature control unit is not supplied to the chamber. In other words, the processing liquid adjusted to an unintended temperature is not supplied to the chamber.

[0293] As a result, the likelihood of circuit board processing defects occurring due to the failure of some of the multiple temperature control units is reduced.

[0294] (Clause 18) A processing liquid supply method relating to paragraph 18, a processing liquid supply method comprising supplying a processing liquid to a chamber for processing a substrate using a processing liquid supply device, wherein the processing liquid supply device comprises a supply channel for guiding the processing liquid to the chamber, and a first adjustment unit and a second adjustment unit provided in a first portion and a second portion of the supply channel arranged from upstream to downstream, respectively, the first adjustment unit comprising a first temperature adjustment unit provided in the first portion of the supply channel for adjusting the temperature of the processing liquid flowing through the first portion, and a first temperature detection unit for detecting the temperature of the processing liquid adjusted by the first temperature adjustment unit, the second adjustment unit comprising a second temperature adjustment unit provided in the second portion of the supply channel for adjusting the temperature of the processing liquid flowing through the second portion, and a second temperature detection unit for detecting the temperature of the processing liquid adjusted by the second temperature adjustment unit, the processing liquid supply method comprising determining whether each of the first temperature adjustment unit and the second temperature adjustment unit is normal or malfunctioning, The system includes controlling the first temperature control unit based on the detection result of the first temperature detection unit and controlling the second temperature control unit based on the detection result of the second temperature detection unit when it is determined that the first temperature control unit is functioning normally and the second temperature control unit is functioning normally, and controlling the first temperature control unit based on the detection result of the second temperature detection unit when it is determined that the first temperature control unit is functioning normally and the second temperature control unit is malfunctioning.

[0295] In this processing liquid supply method, the processing liquid is supplied to the chamber through the supply channel of the processing liquid supply device. In the chamber, the substrate is processed using the processing liquid. A first adjustment unit and a second adjustment unit are provided in the first and second portions of the supply channel, respectively.

[0296] The first adjustment unit includes a first temperature adjustment unit and a first temperature detection unit. The first temperature adjustment unit adjusts the temperature of the processing liquid flowing through a first portion of the supply channel, and the first temperature detection unit detects the temperature of the processing liquid adjusted by the first temperature adjustment unit. The second adjustment unit includes a second temperature adjustment unit and a second temperature detection unit. The second temperature adjustment unit adjusts the temperature of the processing liquid flowing through a second portion of the supply channel, and the second temperature detection unit detects the temperature of the processing liquid adjusted by the second temperature adjustment unit.

[0297] The system determines whether the first and second temperature control units are functioning correctly or malfunctioning. If both the first and second temperature control units are functioning correctly, the first temperature control unit is controlled based on the detection result from the first temperature detection unit. The second temperature control unit is also controlled based on the detection result from the second temperature detection unit. This allows each control unit to adjust the temperature of the processing liquid with high precision. The temperature-adjusted processing liquid is then supplied to the chamber. Therefore, the reliability of the processing in the chamber is improved by ensuring that the temperature of the processing liquid is properly adjusted.

[0298] If the first temperature control unit is functioning correctly but the second temperature control unit is malfunctioning, the second control unit cannot adjust the temperature of the processing liquid. The temperature of the processing liquid flowing through the second portion of the supply channel may be affected by disturbances generated from the malfunctioning second temperature control unit. If processing liquid adjusted to an unintended temperature due to these disturbances is supplied to the chamber, the reliability of processing in the chamber will decrease.

[0299] Therefore, in the above-described processing liquid supply method, when the first temperature control unit is functioning normally and the second temperature control unit is malfunctioning, the first temperature control unit is controlled based on the detection result from the second temperature detection unit.

[0300] The second temperature detection unit is located downstream of the first adjustment unit and the second temperature adjustment unit in the supply flow path. Therefore, if the first temperature adjustment unit is functioning correctly and the second temperature adjustment unit is malfunctioning, the second temperature detection unit detects the temperature of the processing liquid that has been regulated by the first temperature adjustment unit and is affected by disturbances generated from the malfunctioning second temperature adjustment unit.

[0301] Therefore, by controlling the first temperature adjustment unit based on the detection result from the second temperature detection unit, the first adjustment unit can adjust the temperature of the processing liquid so that the influence of disturbances generated from the second temperature adjustment unit is canceled out. In this case, processing liquid adjusted to an unintended temperature is not supplied to the chamber.

[0302] As a result, the likelihood of circuit board processing defects occurring due to the failure of some of the multiple temperature control units is reduced.

[0303] (Clause 19) The processing liquid supply method relating to paragraph 19 is a processing liquid supply method for supplying a processing liquid to a chamber for processing a substrate using a processing liquid supply device, wherein the processing liquid supply device comprises a supply channel for guiding the processing liquid to the chamber, and a plurality of adjustment units provided in a plurality of parts of the supply channel, each adjustment unit including a temperature adjustment unit provided in the supply channel for adjusting the temperature of the processing liquid flowing through the supply channel, and a temperature detection unit for detecting the temperature of the processing liquid adjusted by the temperature adjustment unit, the processing liquid supply method includes determining whether each of the plurality of temperature adjustment units is normal or malfunctioning, if all of the plurality of temperature adjustment units are determined to be normal, adjusting the temperature of the processing liquid to maintain or approach a predetermined main target temperature according to the processing performed in the chamber by controlling each temperature adjustment unit according to a predetermined control method, and if some of the plurality of temperature adjustment units are determined to be malfunctioning, adjusting the temperature of the processing liquid to approach a sub-target temperature different from the main target temperature by controlling one or more normal temperature adjustment units according to the control method. The aforementioned secondary target temperature is determined so as to offset the effect of disturbances generated by the malfunctioning portion of the temperature control unit on the processing liquid by controlling the normal one or more temperature control units according to the control method when some of the multiple temperature control units fail.

[0304] In this processing liquid supply method, the processing liquid is supplied to the chamber through the supply channel of the processing liquid supply device. In the chamber, the substrate is processed using the processing liquid. Multiple adjustment units are provided in multiple parts of the supply channel.

[0305] Each adjustment unit includes a temperature control unit and a temperature detection unit. The temperature of the processing liquid flowing through the supply channel is adjusted by the temperature control unit. It is determined whether multiple temperature control units are functioning correctly or malfunctioning. In addition, the temperature of the processing liquid adjusted by the temperature control unit is detected in each adjustment unit.

[0306] When all of the multiple temperature control units are functioning correctly, each temperature control unit is controlled according to a predetermined control method so that the temperature of the processing liquid is maintained at or approaches the main target temperature. The temperature-controlled processing liquid is then supplied to the chamber. Therefore, by adjusting the temperature of the processing liquid to the main target temperature, the reliability of processing in the chamber is improved.

[0307] If the temperature control unit transitions from a state where all units are functioning normally to a state where some units fail, the temperature of the processing fluid flowing through the supply channel may change due to disturbances generated by the failed temperature control unit.

[0308] In one adjustment unit, whether or not the actual temperature of the processing liquid flowing through the supply channel can be adjusted to the main target temperature depends, for example, on the temperature of the incoming processing liquid, the specifications of the temperature adjustment unit, and the control method of the temperature adjustment unit. Therefore, if the temperature of the processing liquid flowing into one adjustment unit fluctuates significantly, it becomes difficult to adjust the temperature of the processing liquid flowing through the supply channel to the main target temperature. Specifically, if the temperature of the processing liquid flowing into one adjustment unit remains deviating from the pre-prepared temperature, the actual temperature of the processing liquid flowing out of one adjustment unit may converge to a temperature deviating from the main target temperature.

[0309] Therefore, in the above processing fluid supply method, when some of the multiple temperature control units fail, each of the one or more functioning temperature control units controls the processing fluid temperature to approach the secondary target temperature. The secondary target temperature is set to offset the effect of disturbances generated by the failed temperature control unit on the processing fluid. As a result, the actual temperature of the processing fluid adjusted by each of the one or more functioning temperature control units is maintained at or approaches the primary target temperature, which is slightly different from the secondary target temperature. Thus, the temperature control function of the processing fluid by the multiple adjustment units is guaranteed regardless of whether all of the multiple temperature control units are functioning correctly or if some of the multiple temperature control units are failing.

[0310] As a result, the likelihood of circuit board processing defects occurring due to the failure of some of the multiple temperature control units is reduced.

Claims

1. The apparatus comprises a chamber for performing processing on a substrate using a processing liquid, a processing liquid supply device for supplying the processing liquid to the chamber, and a control unit for controlling the chamber and the processing liquid supply device, wherein the processing liquid supply device includes a supply channel for guiding the processing liquid to the chamber, a plurality of adjustment units provided in a plurality of parts of the supply channel, and a fault determination unit, each adjustment unit includes a temperature adjustment unit provided in the supply channel for adjusting the temperature of the processing liquid flowing through the supply channel, a bypass channel provided in the supply channel for bypassing the temperature adjustment unit, and a flow switching unit configured to transition between a first flow state in the supply channel that allows the flow of processing liquid in the temperature adjustment unit and blocks the flow of processing liquid in the bypass channel, and a second flow state in the supply channel that blocks the flow of processing liquid in the temperature adjustment unit and allows the flow of processing liquid in the bypass channel, the fault determination unit is configured to determine whether the plurality of temperature adjustment units are normal or faulty, and the control unit is configured to determine whether the plurality of temperature adjustment units are normal or faulty. A substrate processing apparatus that, among the plurality of adjustment units, shifts the flow switching unit to the first flow state for adjustment units including a temperature adjustment unit that is determined to be normal by the fault determination unit, and shifts the flow switching unit to the second flow state for adjustment units including a temperature adjustment unit that is determined to be faulty by the fault determination unit.

2. The substrate processing apparatus according to claim 1, wherein the control unit stops the operation of the chamber and the processing liquid supply device when the fault determination unit determines that the plurality of temperature control units are malfunctioning.

3. The substrate processing apparatus according to claim 1 or 2, wherein each adjustment unit's flow switching section includes a first valve provided in the supply flow path and bypassed by the bypass flow path, and a second valve provided in the bypass flow path, the first flow state of the flow switching section being a state in which the first valve of the flow switching section is open and the second valve of the flow switching section is closed, and the second flow state of the flow switching section being a state in which the first valve of the flow switching section is closed and the second valve of the flow switching section is open.

4. The apparatus comprises a chamber for performing processing on a substrate using a processing liquid, a processing liquid supply device for supplying the processing liquid to the chamber, and a control unit for controlling the chamber and the processing liquid supply device, wherein the processing liquid supply device includes a supply channel for guiding the processing liquid to the chamber, a first adjustment unit and a second adjustment unit provided in a first and second portion of the supply channel arranged from upstream to downstream, respectively, and a fault determination unit, the first adjustment unit includes a first temperature adjustment unit provided in the first portion of the supply channel for adjusting the temperature of the processing liquid flowing through the first portion, and a first temperature detection unit for detecting the temperature of the processing liquid adjusted by the first temperature adjustment unit, the second adjustment unit includes a second temperature adjustment unit provided in the second portion of the supply channel for adjusting the temperature of the processing liquid flowing through the second portion, and a second temperature detection unit for detecting the temperature of the processing liquid adjusted by the second temperature adjustment unit, the fault determination unit is configured to determine whether the first temperature adjustment unit and the second temperature adjustment unit are normal or faulty, and the control unit is configured to determine whether the first temperature adjustment unit and the second temperature adjustment unit are normal or faulty, A substrate processing apparatus that, when the fault determination unit determines that the first temperature control unit is normal and the second temperature control unit is normal, controls the first temperature control unit based on the detection result of the first temperature detection unit, controls the second temperature control unit based on the detection result of the second temperature detection unit, and when the fault determination unit determines that the first temperature control unit is normal and the second temperature control unit is faulty, controls the first temperature control unit based on the detection result of the second temperature detection unit.

5. The substrate processing apparatus according to claim 4, wherein the control unit controls the second temperature adjustment unit based on the detection result of the second temperature detection unit when the fault determination unit determines that the first temperature adjustment unit is faulty and the second temperature adjustment unit is functioning normally.

6. The substrate processing apparatus according to claim 4 or 5, wherein the control unit stops the operation of the chamber and the processing liquid supply device when the fault determination unit determines that the first temperature control unit and the second temperature control unit are malfunctioning.

7. The apparatus comprises a chamber for performing processing on a substrate using a processing liquid, a processing liquid supply device for supplying the processing liquid to the chamber, and a control unit for controlling the chamber and the processing liquid supply device, wherein the processing liquid supply device includes a supply channel for guiding the processing liquid to the chamber, a plurality of adjustment units provided in a plurality of parts of the supply channel, and a fault determination unit, each adjustment unit includes a temperature adjustment unit provided in the supply channel for adjusting the temperature of the processing liquid flowing through the supply channel, and a temperature detection unit for detecting the temperature of the processing liquid adjusted by the temperature adjustment unit, the fault determination unit is configured to determine whether the plurality of temperature adjustment units are normal or faulty, and the control unit, when the fault determination unit determines that all of the plurality of temperature adjustment units are normal, controls each temperature adjustment unit according to a predetermined control method to maintain or approach a predetermined main target temperature of the processing liquid according to the processing performed in the chamber. A substrate processing apparatus, wherein, when the fault determination unit determines that some of the multiple temperature control units are faulty, the control unit controls one or more normal temperature control units according to the control method to adjust the temperature of the processing liquid to approach a secondary target temperature different from the primary target temperature, and the secondary target temperature is set such that, when some of the multiple temperature control units are faulty, the control unit controls one or more normal temperature control units according to the control method to offset the effect of disturbances generated from the faulty part of the temperature control unit on the processing liquid.

8. The substrate processing apparatus according to claim 7, further comprising a storage unit that stores a temperature table showing the correspondence between multiple combinations of states of the multiple temperature control units and multiple specified temperatures to be adjusted by each temperature control unit, wherein the control unit, when it is determined that all of the multiple temperature control units are normal, obtains one specified temperature from the temperature table corresponding to a combination of determination results of the fault determination unit and determines the obtained one specified temperature as the main target temperature, and when it is determined that some of the multiple temperature control units are faulty, obtains other specified temperatures from the temperature table corresponding to a combination of determination results of the fault determination unit and determines the obtained other specified temperatures as the secondary target temperatures.

9. The substrate processing apparatus according to claim 7, further comprising a storage unit for storing the main target temperature, wherein the control unit obtains the main target temperature stored in the storage unit when it is determined that all of the plurality of temperature adjustment units are functioning normally, and when it is determined that some of the plurality of temperature adjustment units are malfunctioning, it calculates the difference between the detection result of one or more temperature detectors corresponding to at least some of the temperature adjustment units and the main target temperature stored in the storage unit, and determines the sub-target temperature based on one or more calculation results and the main target temperature.

10. The substrate processing apparatus according to any one of claims 7 to 9, wherein the control unit stops the operation of the chamber and the processing liquid supply device when the fault determination unit determines that the plurality of temperature control units are malfunctioning.

11. A processing liquid supply device for supplying processing liquid to a chamber for performing processing on a substrate using processing liquid, comprising: a supply channel for guiding the processing liquid to the chamber; a plurality of adjustment units provided in a plurality of parts of the supply channel; a fault determination unit; and a control unit, each of which includes: a temperature adjustment unit provided in the supply channel for adjusting the temperature of the processing liquid flowing through the supply channel; a bypass channel provided in the supply channel for bypassing the temperature adjustment unit; and a flow switching unit configured to transition between a first flow state in the supply channel that allows the flow of processing liquid in the temperature adjustment unit and blocks the flow of processing liquid in the bypass channel, and a second flow state in the supply channel that blocks the flow of processing liquid in the temperature adjustment unit and allows the flow of processing liquid in the bypass channel, the fault determination unit is configured to determine whether the plurality of temperature adjustment units are normal or faulty, and the control unit, for adjustment units that include a temperature adjustment unit determined to be normal by the fault determination unit, switches the flow switching unit to the first flow state. A processing liquid supply device that, with respect to an adjustment unit, including a temperature adjustment unit, which is determined to be malfunctioning by the fault determination unit, among the plurality of adjustment units, switches the flow switching unit to the second flow state.

12. A processing liquid supply device for supplying processing liquid to a chamber for processing a substrate using processing liquid, comprising: a supply channel for guiding the processing liquid to the chamber; a first adjustment unit and a second adjustment unit provided in a first portion and a second portion of the supply channel arranged from upstream to downstream, respectively; a fault determination unit; and a control unit, wherein the first adjustment unit includes a first temperature adjustment unit provided in the first portion of the supply channel for adjusting the temperature of the processing liquid flowing through the first portion, and a first temperature detection unit for detecting the temperature of the processing liquid adjusted by the first temperature adjustment unit; the second adjustment unit includes a second temperature adjustment unit provided in the second portion of the supply channel for adjusting the temperature of the processing liquid flowing through the second portion, and a second temperature detection unit for detecting the temperature of the processing liquid adjusted by the second temperature adjustment unit; the fault determination unit is configured to determine whether the first temperature adjustment unit and the second temperature adjustment unit are normal or faulty; and the control unit is configured to determine whether the first temperature adjustment unit and the second temperature adjustment unit are normal or faulty. A processing liquid supply device that, when the fault determination unit determines that the first temperature control unit is normal and the second temperature control unit is normal, controls the first temperature control unit based on the detection result of the first temperature detection unit and controls the second temperature control unit based on the second temperature detection unit, and when the fault determination unit determines that the first temperature control unit is normal and the second temperature control unit is faulty, controls the first temperature control unit based on the detection result of the second temperature detection unit.

13. A processing liquid supply device for supplying processing liquid to a chamber for performing processing on a substrate using a processing liquid, comprising: a supply channel for guiding the processing liquid to the chamber; a plurality of adjustment units provided in a plurality of parts of the supply channel; a fault determination unit; and a control unit, each of which includes: a temperature adjustment unit provided in the supply channel for adjusting the temperature of the processing liquid flowing through the supply channel; and a temperature detection unit for detecting the temperature of the processing liquid adjusted by the temperature adjustment unit; the fault determination unit is configured to determine whether the plurality of temperature adjustment units are normal or faulty; the control unit, when the fault determination unit determines that all of the plurality of temperature adjustment units are normal, controls each temperature adjustment unit according to a predetermined control method to adjust the temperature of the processing liquid to maintain or approach a predetermined main target temperature according to the processing performed in the chamber; and when the fault determination unit determines that some of the plurality of temperature adjustment units are faulty, controls one or more normal temperature adjustment units according to the control method to adjust the temperature of the processing liquid to approach a secondary target temperature different from the main target temperature. A processing liquid supply device in which the sub-target temperature is determined so that, in the event of a failure of some of the multiple temperature control units, the control unit controls one or more of the normal temperature control units according to the control method, thereby offsetting the effect of disturbances generated from the failed some of the temperature control units on the processing liquid.

14. A substrate processing method for processing a substrate using a substrate processing apparatus, wherein the substrate processing apparatus comprises a chamber for processing the substrate using a processing liquid, and a processing liquid supply device for supplying the processing liquid to the chamber, the processing liquid supply device includes a supply channel for guiding the processing liquid to the chamber, and a plurality of adjustment units provided in a plurality of parts of the supply channel, each adjustment unit includes a temperature adjustment unit provided in the supply channel for adjusting the temperature of the processing liquid flowing through the supply channel, a bypass channel provided in the supply channel for bypassing the temperature adjustment unit, and a flow switching unit configured to transition between a first flow state that allows the flow of processing liquid in the temperature adjustment unit of the supply channel and blocks the flow of processing liquid in the bypass channel, and a second flow state that blocks the flow of processing liquid in the temperature adjustment unit of the supply channel and allows the flow of processing liquid in the bypass channel, the substrate processing method comprises controlling the processing liquid supply device to supply the processing liquid to the chamber, and controlling the chamber to process the substrate, the supply of processing liquid to the chamber is A substrate processing method comprising: determining whether each of the plurality of temperature control units is normal or malfunctioning; shifting the flow switching unit to the first flow state for the adjustment unit that includes the temperature control unit determined to be normal among the plurality of adjustment units; and shifting the flow switching unit to the second flow state for the adjustment unit that includes the temperature control unit determined to be malfunctioning among the plurality of adjustment units.

15. A substrate processing method for processing a substrate using a substrate processing apparatus, wherein the substrate processing apparatus comprises a chamber for processing the substrate using a processing liquid, and a processing liquid supply device for supplying the processing liquid to the chamber, the processing liquid supply device includes a supply channel for guiding the processing liquid to the chamber, and a first adjustment unit and a second adjustment unit provided in a first portion and a second portion of the supply channel arranged from upstream to downstream, respectively, the first adjustment unit includes a first temperature adjustment unit provided in the first portion of the supply channel for adjusting the temperature of the processing liquid flowing through the first portion, and a first temperature detection unit for detecting the temperature of the processing liquid adjusted by the first temperature adjustment unit, the second adjustment unit includes a second temperature adjustment unit provided in the second portion of the supply channel for adjusting the temperature of the processing liquid flowing through the second portion, and a second temperature detection unit for detecting the temperature of the processing liquid adjusted by the second temperature adjustment unit, the substrate processing method comprises controlling the processing liquid supply device to supply the processing liquid to the chamber, and controlling the chamber to process the substrate, and supplying the processing liquid to the chamber is A substrate processing method comprising: determining whether each of the first temperature control unit and the second temperature control unit is normal or malfunctioning; controlling the first temperature control unit based on the detection result of the first temperature detection unit and the detection result of the second temperature detection unit when it is determined that both the first and second temperature control units are normal; and controlling the first temperature control unit based on the detection result of the second temperature detection unit when it is determined that both the first and second temperature control units are malfunctioning.

16. A substrate processing method for processing a substrate using a substrate processing apparatus, wherein the substrate processing apparatus comprises a chamber for processing the substrate using a processing liquid, and a processing liquid supply device for supplying the processing liquid to the chamber, the processing liquid supply device includes a supply channel for guiding the processing liquid to the chamber, and a plurality of adjustment units provided in a plurality of parts of the supply channel, each adjustment unit includes a temperature adjustment unit provided in the supply channel for adjusting the temperature of the processing liquid flowing through the supply channel, and a temperature detection unit for detecting the temperature of the processing liquid adjusted by the temperature adjustment unit, the substrate processing method comprises controlling the processing liquid supply device to supply the processing liquid to the chamber, and controlling the chamber to process the substrate, the supply of processing liquid to the chamber includes determining whether each of the plurality of temperature adjustment units is normal or malfunctioning, and, if all of the plurality of temperature adjustment units are determined to be normal, controlling each temperature adjustment unit according to a predetermined control method to maintain or approach a predetermined main target temperature according to the processing performed in the chamber, A substrate processing method comprising: when it is determined that a part of the plurality of temperature control units is malfunctioning, controlling one or more normal temperature control units in accordance with the control method to adjust the temperature of the processing liquid to approach a secondary target temperature different from the primary target temperature, wherein the secondary target temperature is determined to be such that, when a part of the plurality of temperature control units malfunctions, the control method is used to control one or more normal temperature control units in accordance with the control method to offset the effect of disturbances generated from the malfunctioning part of the temperature control unit on the processing liquid.

17. A method for supplying a processing liquid to a chamber for processing a substrate using a processing liquid supply device, wherein the processing liquid supply device comprises: a supply channel for guiding the processing liquid to the chamber; and a plurality of adjustment units provided in a plurality of parts of the supply channel, each adjustment unit including: a temperature adjustment unit provided in the supply channel for adjusting the temperature of the processing liquid flowing through the supply channel; a bypass channel provided in the supply channel for bypassing the temperature adjustment unit; and a flow switching unit configured to transition between a first flow state in the supply channel that allows the flow of processing liquid in the temperature adjustment unit and blocks the flow of processing liquid in the bypass channel, and a second flow state in the supply channel that blocks the flow of processing liquid in the temperature adjustment unit and allows the flow of processing liquid in the bypass channel, the processing liquid supply method comprising: determining whether each of the plurality of temperature adjustment units is normal or malfunctioning; and, for the adjustment unit including the temperature adjustment unit that has been determined to be normal among the plurality of adjustment units, the flow switching unit to the first flow state. A method for supplying processing liquid, comprising, with respect to an adjustment unit, including a temperature adjustment unit, that has been determined to be malfunctioning among the plurality of adjustment units, switching the flow switching unit to the second flow state.

18. A method for supplying a processing liquid to a chamber for processing a substrate using a processing liquid supply device, wherein the processing liquid supply device comprises a supply channel for guiding the processing liquid to the chamber, and a first adjustment unit and a second adjustment unit provided in a first portion and a second portion of the supply channel arranged from upstream to downstream, respectively, the first adjustment unit includes a first temperature adjustment unit provided in the first portion of the supply channel for adjusting the temperature of the processing liquid flowing through the first portion, and a first temperature detection unit for detecting the temperature of the processing liquid adjusted by the first temperature adjustment unit, the second adjustment unit includes a second temperature adjustment unit provided in the second portion of the supply channel for adjusting the temperature of the processing liquid flowing through the second portion, and a second temperature detection unit for detecting the temperature of the processing liquid adjusted by the second temperature adjustment unit, and the method for supplying the processing liquid comprises determining whether each of the first temperature adjustment unit and the second temperature adjustment unit is functioning normally or malfunctioning, A method for supplying processing liquid, comprising: controlling the first temperature control unit based on the detection result of the first temperature detection unit and controlling the second temperature control unit based on the detection result of the second temperature detection unit when it is determined that the first temperature control unit is functioning normally and the second temperature control unit is functioning normally; and controlling the first temperature control unit based on the detection result of the second temperature detection unit when it is determined that the first temperature control unit is functioning normally and the second temperature control unit is malfunctioning.

19. A method for supplying a processing liquid to a chamber for processing a substrate using a processing liquid supply device, wherein the processing liquid supply device comprises a supply channel for guiding the processing liquid to the chamber, and a plurality of adjustment units provided in a plurality of parts of the supply channel, each adjustment unit including a temperature adjustment unit provided in the supply channel for adjusting the temperature of the processing liquid flowing through the supply channel, and a temperature detection unit for detecting the temperature of the processing liquid adjusted by the temperature adjustment unit, the processing liquid supply method comprising: determining whether each of the plurality of temperature adjustment units is normal or malfunctioning; if all of the plurality of temperature adjustment units are determined to be normal, controlling each temperature adjustment unit according to a predetermined control method to maintain or approach a predetermined main target temperature according to the processing performed in the chamber; and if some of the plurality of temperature adjustment units are determined to be malfunctioning, controlling one or more normal temperature adjustment units according to the control method to adjust the temperature of the processing liquid to approach a secondary target temperature different from the main target temperature. A processing liquid supply method wherein the sub-target temperature is determined so as to offset the effect of disturbances generated from the malfunctioning part of the temperature control unit on the processing liquid when some of the multiple temperature control units fail, by controlling one or more of the normal temperature control units according to the control method.

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