Transport device, substrate processing system, and transport method

Abstract

To correct the position of a tape frame wafer so that the wafer is located at a proper position in a processor.　The present invention comprises an aligner capable of executing wafer correction value acquisition processing for acquiring a wafer correction value for correcting the position of a tape frame wafer so that the wafer is at an appropriate position, a conveyance robot capable of conveying the tape frame wafer between the aligner and a processing device, an aligner control unit, and an EFEM host, and the aligner control unit and the EFEM host cause the aligner to execute the wafer correction value acquisition processing, and transmit the wafer correction value acquired by the wafer correction value acquisition processing to the processing device (S5).

Description

Conveying device, substrate processing system, and conveying method

[0001] The present invention mainly relates to a transport device for transporting tape frame wafers to a processing device.

[0002] Generally, substrate processing systems are known in which substrates stored in containers such as FOUPs are removed and transported to a processing device, where the substrates undergo various processing. Patent Document 1 discloses an alignment device for correcting the misalignment of substrates removed from a container in such a substrate processing system. Specifically, the alignment device of Patent Document 1 corrects the position of the substrate based on the position information of the corners of the rectangular substrate. That is, the position correction of the substrate is performed based on the outer shape of the substrate. By correcting the position of the substrate with the alignment device before transporting it to the processing device, the substrate can be transported to the processing device with the misalignment corrected.

[0003] Furthermore, within the processing unit, it is required that the substrate be placed in a predetermined position with high precision by the robot's hand. Even if the substrate's position is corrected before transport to the processing unit, any misalignment of the substrate that occurred during the transport process to the processing unit must be corrected within the processing unit. However, processing units have many spatial constraints, making it difficult to install an alignment device. Therefore, processing units are usually equipped with a sensor capable of detecting the outer edge of the substrate, such as the one disclosed in Patent Document 2. When placing a substrate within the processing unit, the amount of misalignment of the substrate relative to the hand is calculated from the positional relationship between the hand and the sensor at the moment the sensor detects the outer edge of the substrate, and the substrate is placed after the misalignment has been corrected. In other words, this position correction is also performed based on the outer shape of the substrate.

[0004] Japanese Patent Publication No. 2024-084179 Japanese Patent Publication No. 2000-12657

[0005] The substrates handled in the substrate processing system described above may be tape-frame wafers, in which the wafer is supported by tape attached to a frame. In such tape-frame wafers, misalignment may occur between the frame and the wafer. The substrate position correction in the alignment device described in Patent Document 1 and the substrate position correction using a sensor described in Patent Document 2 are both performed based on the outer shape of the substrate. That is, when the position correction of a tape-frame wafer is performed, the position correction is based on the frame. Therefore, if there is misalignment between the frame and the wafer, even if the frame position is corrected, the wafer will remain shifted from its proper position. When processing a wafer in a processing device, the wafer needs to be in the correct position. Therefore, it is desirable to enable the processing device to correct the position of a tape-frame wafer so that the wafer is in the correct position.

[0006] The object of the present invention is to provide a transport device, a substrate processing system, and a transport method that enable position correction of tape frame wafers so that the wafers are in the correct position in the processing device.

[0007] The first invention relates to a transport device for transporting a tape frame wafer to a processing device that performs predetermined processing on a tape frame wafer, in which a wafer is supported by tape attached to a frame, and comprises a correction device capable of performing a wafer correction value acquisition process to acquire a wafer correction value for correcting the position of the tape frame wafer so that the wafer is in the correct position, a first transport robot capable of transporting the tape frame wafer between the correction device and the processing device, and a first control unit, wherein the first control unit causes the correction device to perform the wafer correction value acquisition process and transmits the wafer correction value acquired by the wafer correction value acquisition process to the processing device.

[0008] In this invention, since the wafer correction value is transmitted to the processing device, the processing device can determine the wafer correction value for correcting the position of the tape frame wafer so that the wafer is in the correct position. Therefore, the processing device can perform position correction of the tape frame wafer based on the wafer correction value so that the wafer is in the correct position.

[0009] In the transport device according to the second invention, in the first invention, the correction device is capable of performing a frame position correction process to correct the position of the tape frame wafer so that the frame is in the correct position.

[0010] If a tape frame wafer is transported with the frame not in the correct position, problems may occur, such as the first transport robot being unable to properly support the tape frame wafer or placing the tape frame wafer on the relay stage. In this invention, the tape frame wafer is transported with its position corrected so that the frame is in the correct position, thus enabling normal transport.

[0011] In the transport device according to the third invention, in the first or second invention, the first control unit calculates the wafer correction value in the wafer correction value acquisition process from the difference between the amount of deviation of the frame from the proper position and the amount of deviation of the wafer from the proper position.

[0012] In this invention, the difference between the amount of displacement of the frame from a predetermined position and the amount of displacement of the wafer from a predetermined position, i.e., the amount of displacement of the wafer relative to the frame, can be obtained as a wafer correction value.

[0013] A substrate processing system according to the fourth invention is a substrate processing system comprising a transport device according to the third invention and a processing device, wherein the processing device has a hand capable of supporting the tape frame wafer, a second transport robot that transports the tape frame wafer from a transport source position to a transport destination position, a sensor positioned between the transport source position and the transport destination position and capable of detecting the outer edge of the frame of the tape frame wafer being transported by the second transport robot, and a second control unit, wherein the second control unit performs a frame position calculation process that calculates the position of the frame relative to the hand from the positional relationship between the hand and the sensor at the timing when the sensor detects the outer edge of the frame while the second transport robot is transporting the tape frame wafer from the transport source position to the transport destination position, and a wafer position correction process that corrects the position of the tape frame wafer so that the wafer is in the correct position based on the position of the frame calculated by the frame position calculation process and the wafer correction value transmitted from the first control unit.

[0014] In this invention, by performing a wafer position correction process, the tape frame wafer can be transported to the destination position with the wafer in the correct position. Therefore, the processing device can properly process the wafer of the tape frame wafer.

[0015] A transport method according to the fifth invention is a transport method for transporting a tape frame wafer to a processing device that performs a predetermined process on a tape frame wafer, in which a wafer is supported on a tape attached to a frame, and comprises: a wafer correction value acquisition step for acquiring a wafer correction value for correcting the position of the tape frame wafer so that the wafer is in the correct position; a transport step for transporting the tape frame wafer from which the wafer correction value has been acquired in the wafer correction value acquisition step to the processing device; and a correction value transmission step for transmitting the wafer correction value acquired in the wafer correction value acquisition step to the processing device.

[0016] In this invention, since the wafer correction value is transmitted to the processing device, the processing device can determine the wafer correction value for correcting the position of the tape frame wafer so that the wafer is in the correct position. Therefore, the processing device can perform position correction of the tape frame wafer based on the wafer correction value so that the wafer is in the correct position.

[0017] This is a schematic plan view of a substrate processing system according to a preferred embodiment of the present invention. This is a block diagram showing the electrical configuration of the substrate processing system. This is a plan view showing an example of a tape frame wafer. This is a side view of an aligner. This is a plan view of an aligner. This is a block diagram showing the control configuration of an aligner. This is a flowchart showing an example of a processing procedure performed by EFEM. This is a flowchart showing an example of a wafer displacement amount acquisition procedure. This is a flowchart showing an example of a frame position correction procedure. (a) is a diagram showing the process when photographing a wafer, and (b) is a diagram showing the process when photographing a frame. This is a flowchart showing an example of a transport processing procedure performed by the processing apparatus. (a) to (d) are diagrams illustrating a method for detecting the outer edge of a frame. This is a diagram illustrating the calculation of the center position of a frame. (a) to (d) are diagrams illustrating a frame position calculation process according to a first modified example. This is a diagram illustrating a frame position calculation process according to a second modified example. This is a diagram illustrating a frame position calculation process according to a third modified example.

[0018] A preferred embodiment of the present invention will be described below. For the sake of explanation, the directions shown in Figure 1 will be defined as the front-rear, back-left, and right directions. More specifically, the direction in which the EFEM 2 and the processing unit 8 are arranged will be defined as the front-rear direction. In the front-rear direction, the EFEM 2 side will be defined as the front side. In the front-rear direction, the processing unit 8 side will be defined as the rear side. The direction in which the multiple load ports 5 are arranged, perpendicular to the front-rear direction, will be defined as the left-right direction. The direction perpendicular to both the front-rear and left-right directions will be defined as the up-down direction. The up-down direction is the direction parallel to the vertical direction in which gravity acts.

[0019] (Outline of the Substrate Processing System) The schematic configuration of the substrate processing system 1 according to this embodiment will be described with reference to Figures 1 and 2. The substrate to be processed in the substrate processing system 1 is a TFW 100. "TFW" is an abbreviation for "Tape Frame Wafer". As shown in Figure 1, the substrate processing system 1 mainly comprises an EFEM 2 and a processing unit 8. "EFEM" is an abbreviation for "Equipment Front End Module".

[0020] The EFEM2 is equipped with multiple load ports 5. Each load port 5 can accommodate a hoop 20 containing the TFW 100. The EFEM2 is a device for transporting the TFW 100 between the hoop 20 placed on each load port 5 and the processing device 8. The EFEM2 functions as the "transport device" of the present invention. The processing device 8 is a device that performs predetermined processing on the wafer W (see Figure 3), which will be described later, containing the TFW 100.

[0021] The EFEM2 mainly comprises a housing 3, a transport robot 4, multiple load ports 5, an aligner 6, and an EFEM host 7 (see Figure 2). The transport robot 4 is located inside the housing 3. The multiple load ports 5 and the aligner 6 are all connected to the housing 3. The multiple load ports 5 are connected to the front end of the housing 3. In this embodiment, three load ports 5 are connected to the housing 3, but the number of load ports 5 is not limited to this. The aligner 6 is connected to the left end of the housing 3. The connection positions of the multiple load ports 5 and the aligner 6 to the housing 3 are not limited to this. In addition, a load lock chamber 11 of the processing unit 8, which will be described later, is connected to the rear end of the housing 3.

[0022] The aligner 6 is a device for performing position correction processing on the TFW 100. The aligner 6 functions as the "correction device" of the present invention. The transport robot 4 takes the TFW 100 from the hoop 20 and transports it to the aligner 6, and after the TFW 100 has been position corrected by the aligner 6, it takes it out of the aligner 6 and transports it to the load lock chamber 11 of the processing device 8. Conversely, the transport robot 4 receives the processed TFW 100 from the load lock chamber 11 of the processing device 8, transports it to the aligner 6, and after the TFW 100 has been position corrected by the aligner 6, it transports it to the load port 5 and places it in the hoop 20. The transport robot 4 functions as the "first transport robot" of the present invention.

[0023] The EFEM host 7 is a host computer. As shown in Figure 2, the EFEM host 7 is electrically connected to an aligner control unit 15 that controls the aligner 6 and a robot control unit 16 that controls the transport robot 4. In this embodiment, the EFEM host 7 and the aligner control unit 15 function as the "first control unit" of the present invention. The EFEM host 7 or the aligner control unit 15 may function as the "first control unit" on their own.

[0024] The processing unit 8 mainly comprises a vacuum chamber 9, a transport robot 10, a load lock chamber 11, a plurality of processing units 12, a sensor 13 (see Figure 2), and a processing unit host 14 (see Figure 2). The transport robot 10 is located inside the vacuum chamber 9. The transport robot 10 has a hand 10a capable of supporting the TFW 100. The transport robot 10 is, for example, an articulated robot capable of independently driving each joint. The load lock chamber 11 and the plurality of processing units 12 are all connected to the vacuum chamber 9. The load lock chamber 11 is connected to the front end of the vacuum chamber 9. In this embodiment, three processing units 12 are connected to the vacuum chamber 9, but the number of processing units 12 is not limited to this.

[0025] The load lock chamber 11 is a room for temporarily holding the TFW 100. In the processing unit 12, predetermined processing is performed on the TFW 100 by a processing mechanism (not shown). The transport robot 10 transports the TFW 100 that has been transported from the hoop 20 to the load lock chamber 11 to the processing unit 12, and conversely, takes out the TFW 100 that has been processed in the processing unit 12 and transports it to the load lock chamber 11. Furthermore, if each of the multiple processing units 12 is equipped with different functions, such as a film formation function, an etching function, and a cleaning function, and configured to perform each function in sequence, the transport robot 10 will also transport the TFW 100 between the processing units 12. The transport robot 10 functions as the "second transport robot" of the present invention.

[0026] As will be described in detail later, the sensor 13 is used to correct the position of the TFW 100 when the transport robot 10 transports the TFW 100 from the load lock chamber 11 (source position) to the processing unit 12 (destination position). The sensor 13 is positioned between the source position and the destination position when the transport robot 10 transports the TFW 100 in the vacuum chamber 9.

[0027] As shown in Figure 12, the sensor 13 is provided as a pair, consisting of a left sensor 13L and a right sensor 13R. The left sensor 13L and the right sensor 13R are spaced apart in a direction intersecting the transport direction of the TFW 100 from the transport source position to the transport destination position. In this embodiment, the direction of separation between the left sensor 13L and the right sensor 13R is perpendicular to the transport direction of the TFW 100 from the transport source position to the transport destination position.

[0028] The sensor 13 is, for example, a transmissive or reflective photosensor that emits detection light along the vertical direction. As the transport robot 10 transports the TFW 100 from the source position to the destination position, the TFW 100 blocks the detection light of the sensor 13. As a result, the sensor 13 can detect the outer edge of the frame F of the TFW 100 being transported by the transport robot 10.

[0029] The processing unit host 14 is a host computer. As shown in Figure 2, the processing unit host 14 is electrically connected to a robot control unit 17 that controls the transport robot 10. The robot control unit 17 receives output signals from the sensor 13. The processing unit host 14 is configured to enable wired or wireless communication with the EFEM host 7. In this embodiment, the processing unit host 14 and the robot control unit 17 function as the "second control unit" of the present invention. The processing unit host 14 or the robot control unit 17 may function as the "second control unit" on their own.

[0030] (TFW configuration) Here, an example of the configuration of the TFW 100 will be described with reference to Figure 3. As shown in Figure 3, the TFW 100 is a device in which a wafer W is supported by tape T attached to a frame F.

[0031] Frame F is annular in shape. Notches N1, N2 and straight sections F1, F2 are formed on the outer edge of frame F, primarily used for position correction. The position and shape of the notches N1, N2 and straight sections F1, F2 are determined, for example, by SEMI (Semiconductor Equipment and Materials International) standards.

[0032] Tape T is attached to the inside of the annular frame F so as to cover the opening of the frame F. Tape T is disc-shaped.

[0033] The wafer W is disc-shaped. A notch N11 is also formed on the outer edge of the wafer W. The position and shape of the notch N11 are also determined by the SEMI standard. The wafer W is attached to tape T, which is attached to a frame F. At this time, the wafer W is attached in a position where its center coincides with the center of the frame F. Furthermore, it is attached in a position where a straight line L1 passing through the center of the frame F and perpendicular to the straight section F1 passes through the vertex N11A of the notch N11 on the wafer W. However, it is difficult to perform these alignments accurately, and the wafer W after attachment usually contains a slight attachment error between it and the frame F.

[0034] (Alignment Apparatus) Next, the configuration of aligner 6 will be described with reference to FIGS. 4 to 6. As shown in FIGS. 4 and 5, the aligner 6 includes a main body housing 21. As shown in FIG. 4, the main body housing 21 has an upper housing 21A and a lower housing 21B, and a space 26 is formed between the upper housing 21A and the lower housing 21B. On the upper surface 21B1 of the lower housing 21B within the space 26, a stage 30 for placing the TFW 100 is installed. The TFW 100 is placed on the stage 30 in a substantially horizontal state.

[0035] The stage 30 has a turntable 31, four arms 32 extending outward from the turntable 31, and a support portion 33 provided at the tip of each arm 32. The support portions 33 support the frame F of the TFW 100 when the TFW 100 is placed on the stage 30. Further, as shown in FIG. 5, a plurality of suction holes 34 are formed on the upper surface 33A of each support portion 33. A vacuum line (not shown) for sucking the TFW 100 communicates with each suction hole 34. A valve and a vacuum source (for example, a vacuum pump) are connected to the vacuum line, and in a state where the frame F of the TFW 100 is supported on the upper surface 33A of each support portion 33, when a negative pressure is applied by the vacuum source, the frame F of the TFW 100 is suction-held on the upper surface 33A of the support portion 33 via each suction hole 34. The method for holding the frame F of the TFW 100 is not limited to suction holding, and other holding methods such as friction holding may be used, for example.

[0036] Here, the center of the turntable 31 is defined as the origin, and two mutually orthogonal axes are defined as the X-axis and Y-axis. Both the X-axis and the Y-axis extend along the horizontal direction. The turntable 31 is configured to rotate both clockwise and counterclockwise around (X-axis origin Ox, Y-axis origin Oy). The rotation is performed by a predetermined angle at a time using, for example, a stepping motor. The rotation angle θ can be detected by counting the number of pulses input to the stepping motor, but in the present embodiment, it is detected using an encoder 43 (see FIG. 6). Further, instead of the stepping motor, the turntable 31 may be rotated by a configuration in which the encoder 43 is combined with a servo motor.

[0037] Further, the turntable 31 is configured to be movable in both the X-axis direction and the Y-axis direction within a predetermined operation range WRx and an operation range WRy, respectively. As the moving mechanism, a known configuration may be used. For example, a mechanism configured using two ball screws connected to the turntable 31 and extending in the X-axis direction and the Y-axis direction respectively, and a motor for rotating the two ball screws is conceivable. The motor used here may be a stepping motor or other types of motors such as a servo motor.

[0038] As shown in FIG. 4, a camera 22 is fixedly installed on the lower surface 21A1 of the upper housing 21A. Further, as shown in FIG. 6, a camera lens 23 and a coaxial illumination 24 are provided adjacent to the camera 22. The positional relationship among the camera 22, the camera lens 23 and the coaxial illumination 24 may be any relationship, and various modes are conceivable. For example, a mode in which the camera lens 23 is disposed below the camera 22, and the coaxial illumination 24 is disposed surrounding the camera lens 23 can be cited. In this mode, since the camera 22 is installed facing downward above the subject, it is possible to prevent dust from accumulating on the camera lens 23.

[0039] The camera field of view VA shown in FIG. 5 indicates the range captured by the camera 22. As will be described later, the camera 22 is for capturing the outer edge of the frame F of the TFW 100 (the circumference formed by the frame outer diameter Rf) and the outer edge of the wafer W (the circumference formed by the wafer outer diameter Rw). When capturing the outer edge of the frame F, the stage 30 is moved so that the outer edge of the frame F is included in the camera field of view VA. When capturing the outer edge of the wafer W, the stage 30 is moved so that the outer edge of the wafer W is included in the camera field of view VA.

[0040] The operation of the aligner 6 is controlled by the aligner control unit 15. As shown in Figure 6, the aligner control unit 15 outputs a position command to the XYθ driver 41 to indicate the position of the stage 30. The XYθ driver 41 calculates the control amount for the XYθ motor 42 that moves the stage 30 to the position indicated by the position command and outputs it to the XYθ motor 42. The XYθ motor 42 may be composed of a single motor, or it may be composed of separate motors for the X-axis direction, Y-axis direction, and θ-axis direction. The rotation speed and rotation direction of the XYθ motor 42 are detected by the encoder 43 and output as rotation information (rotation angle θ).

[0041] The aligner control unit 15 outputs the shooting timing to the camera shooting trigger signal output unit 44. The camera shooting trigger signal output unit 44 outputs the shooting timing signal, which is the camera shooting trigger signal, to the camera 22, coaxial illumination 24, and transmitted illumination 25 according to the received shooting timing. The transmitted illumination 25 is installed on the upper surface 21B1 of the lower housing 21B in a position that can illuminate the area including the camera field of view VA.

[0042] Camera 22 captures the camera field of view VA in response to the reception of the shooting timing signal. At this time, only one of the coaxial illumination 24 and transmitted illumination 25 is turned on, and the other is turned off. Specifically, when camera 22 is capturing the wafer W of TFW 100, coaxial illumination 24 is turned on (see Figure 10(a)), and when camera 22 is capturing the frame F of TFW 100, transmitted illumination 25 is turned on (see Figure 10(b)). Image data acquired by camera 22 is sent to the aligner control unit 15. The aligner control unit 15 also reads the θ output from encoder 43 when the shooting timing is output, detects the rotation angle indicating how many degrees the stage 30 has rotated from the initial state in which TFW 100 is placed on the stage 30, associates it with the image data, and stores it together with the image data in a memory (not shown).

[0043] (Processing Procedure Performed by EFEM) Next, an example of the processing procedure performed by EFEM2 will be described with further reference to Figures 7 to 10. The roles of the EFEM host 7 and the aligner control unit 15 in the following description can be changed as appropriate. The processing procedure is also not limited to this and can be changed as appropriate. Here, the processing when the TFW 100 removed from the hoop 20 is transported to the processing unit 8 will be described. Hereafter, in the description of each processing procedure, the step will be denoted as "S".

[0044] As shown in Figure 7, first, under the control of the robot control unit 16, the transport robot 4 takes out the TFW 100 from the hoop 20 and transports it to the aligner 6 and places the TFW 100 on the stage 30 (S1). At this time, as shown in Figure 5, the (X-axis origin Ox, Y-axis origin Oy) of the turntable 31 of the stage 30 is at the reference position. The reference position is a fixed position in space 26.

[0045] When the TFW 100 is placed on the stage 30, the aligner 6 performs wafer displacement acquisition processing under the control of the aligner control unit 15 (S2). The wafer displacement acquisition processing is the process of acquiring the wafer displacement amount, which is the amount of displacement of the wafer W from the correct position. Next, the aligner 6 performs frame position correction processing under the control of the aligner control unit 15 (S3). The frame position correction processing is the process of correcting the position of the TFW 100 so that the frame F is in the correct position. As will be described in detail later, in the frame position correction processing, the aligner control unit 15 acquires the frame displacement amount, which is the amount of displacement of the frame F from the correct position, and corrects the position of the TFW 100 so that the frame F is in the correct position based on the frame displacement amount. As a result, the center position of the frame F of the TFW 100 placed on the stage 30 becomes the reference position.

[0046] Next, the aligner control unit 15 calculates a wafer correction value (S4). The wafer correction value is a correction value used to correct the position of the TFW 100 so that the wafer W is in the correct position. The aligner control unit 15 calculates the wafer correction value from the difference between the wafer displacement amount obtained in the wafer displacement amount acquisition process and the frame displacement amount obtained in the frame position correction process. In other words, the wafer correction value is the bonding error of the wafer W. In this embodiment, the aligner control unit 15 calculates the wafer correction value based on the wafer displacement amount in the X-axis direction and the Y-axis direction, and the frame displacement amount in the X-axis direction and the Y-axis direction. The wafer correction value may also be calculated taking into account the wafer displacement amount and frame displacement amount in the rotational direction. Steps S2 to S4 described above correspond to the "wafer correction value acquisition process" and "wafer correction value acquisition step" of the present invention. Then, the EFEM host 7 transmits the wafer correction value to the processing device host 14 (S5: correction value transmission step).

[0047] Finally, under the control of the robot control unit 16, the transport robot 4 transports the TFW 100 from the aligner 6 to the load lock chamber 11 of the processing unit 8 and places it on a stage (not shown) in the load lock chamber 11 (S6: transport process). At this time, since the TFW 100 has been corrected so that the frame F is in the correct position by the frame position correction process in S3, the transport robot 4 can properly support the TFW 100 and place it on the stage in the load lock chamber 11. In addition, the size of the stage in the load lock chamber 11 can be made to take into account only the transport error when transporting the TFW 100 from the aligner 6 to the load lock chamber 11. Therefore, the stage in the load lock chamber 11 can be miniaturized.

[0048] Figure 8 is a flowchart showing an example of the processing procedure for acquiring wafer displacement. In the wafer displacement acquisition process, the aligner control unit 15 first outputs a position command to move the stage 30 to the wafer edge measurement position MPw (see Figure 5) (S11). As a result, the XYθ driver 41 outputs a control amount to the XYθ motor 42 to move the Y-axis origin Oy of the turntable 31 in the X-axis direction to the wafer edge measurement position MPw, so the stage 30 moves to the wafer edge measurement position MPw. Therefore, the outer edge of the wafer W attached to the tape T of the TFW 100 comes into the camera field of view VA of the camera 22.

[0049] Next, the aligner control unit 15 outputs the shooting timing (S12). As a result, the coaxial illumination 24 is turned on, and the camera 22 captures the range of the camera field of view VA. The image data acquired by the shooting is output from the camera 22 to the aligner control unit 15 as described above. The aligner control unit 15 stores this image data in memory, associating it with the rotation angle θ detected as described above. Figure 10(a) shows the camera 22 capturing the wafer W of the TFW 100. As shown in Figure 10(a), the amount of light received by the camera 22 differs on the outside and inside of the outer edge of the wafer W, so the aligner control unit 15 can determine the shape of the outer edge of the wafer W based on the acquired image data.

[0050] Next, the aligner control unit 15 outputs a position command to rotate the stage 30 by a predetermined angle (S13). The predetermined angle is the angle by which the region of wafer W currently in the camera field of view VA is moved to the adjacent next region. The current region and the next region may partially overlap. The turntable 31 rotates by the predetermined angle according to this position command.

[0051] Furthermore, the aligner control unit 15 determines whether the stage 30 has rotated 360° or not (S14). If it has not yet rotated 360° (S14: NO), the aligner control unit 15 outputs the shooting timing in the same manner as in S12 (S15), and then returns to processing in S13. The aligner control unit 15 then rotates the stage 30 by predetermined angles while capturing images within the range of the camera field of view VA until the stage 30 has rotated 360°, thereby acquiring image data.

[0052] The aligner control unit 15 then obtains the wafer displacement amount, which is the amount of deviation of the wafer W from the proper position, based on the acquired image data (S16). Here, the center position of the wafer W in the proper position is assumed to be (X-axis origin Ox, Y-axis origin Oy) of the turntable 31. The aligner control unit 15 calculates the center position of the wafer W of the TFW 100 currently placed on the stage 30 from the acquired image data. The aligner control unit 15 then takes the difference between the center position of the wafer W of the TFW 100 currently placed on the stage 30 and (X-axis origin Ox, Y-axis origin Oy) of the turntable 31 as the wafer displacement amount. In other words, in this embodiment, the wafer displacement amount is the amount of deviation of the wafer W in the X-axis direction and the Y-axis direction.

[0053] The wafer displacement may include the displacement in the rotational direction. That is, since the shape of the wafer W is determined by the SEMI standard as described above, the outer edge shape of the wafer W is known. The aligner control unit 15 can calculate the displacement of the wafer W from the correct position in the rotational direction from the amount of displacement between the straight line passing through the center of the wafer W and the vertex N11A of the notch N11 when the wafer W is in the correct position, and the straight line passing through the center of the wafer W of the TFW 100 currently placed on the stage 30 and the vertex N11A of the notch N11.

[0054] Figure 9 is a flowchart showing an example of the processing procedure for frame position correction. In the frame position correction process, first the aligner control unit 15 outputs a position command to move the stage 30 to the frame edge measurement position MPf (see Figure 5) (S21). As a result, the XYθ driver 41 outputs a control amount to the XYθ motor 42 to move the Y-axis origin Oy of the turntable 31 in the X-axis direction to the frame edge measurement position MPf, so the stage 30 moves to the frame edge measurement position MPf. Therefore, the outer edge of frame F of TFW 100 comes into the camera field of view VA of camera 22.

[0055] Next, the aligner control unit 15 performs the same processing as in S12 to S15 in Figure 8, but targeting the outer edge of frame F. Figure 10(b) shows the camera 22 capturing frame F. As shown in Figure 10(b), the amount of light received by the camera 22 differs on the outside and inside of the outer edge of frame F, so the aligner control unit 15 can determine the shape of the outer edge of frame F based on the acquired image data.

[0056] The aligner control unit 15 then obtains the frame misalignment amount, which is the amount of deviation of frame F from the correct position, based on the acquired image data (S26). Here, the center position of frame F in the correct position is assumed to be (X-axis origin Ox, Y-axis origin Oy) of the turntable 31. The aligner control unit 15 calculates the center position of frame F of TFW 100 currently placed on the stage 30 from the acquired image data. The aligner control unit 15 then takes the difference between the center position of frame F of TFW 100 currently placed on the stage 30 and (X-axis origin Ox, Y-axis origin Oy) of the turntable 31 as the frame misalignment amount in the X-axis direction and the Y-axis direction. Furthermore, since the shape of frame F is determined by the SEMI standard as described above, the outer edge shape of frame F is also known. Therefore, the aligner control unit 15 determines the amount of deviation between the straight line passing through the center of the frame F and the notch N1 when the frame F is in the correct position and the straight line passing through the center of the frame F of the TFW 100 currently placed on the stage 30 and the notch N1 as the amount of frame deviation in the rotational direction.

[0057] Next, the aligner control unit 15 corrects the position of the TFW 100 so that the frame F is in the correct position (S27). That is, the aligner control unit 15 outputs a position command to the XYθ driver 41 that eliminates the deviation of the frame F from the correct position acquired in S26. In this way, the position correction based on the frame F is performed based only on the notch N1, but it is not limited to this, and may be performed based only on the notch N2, or on both notches N1 and N2. Furthermore, the linear sections F1 and F2 may also be taken into consideration, or used individually, for correction.

[0058] Finally, the aligner control unit 15 outputs a position command to the XYθ driver 41 to return the stage 30 to the position where the TFW 100 was placed (S28), and then terminates the frame position correction process. As a result, the TFW 100 returns to the position where it was handed over, in a state where its position has been corrected based on the frame F. However, the stage 30 does not return to the same position as when the TFW 100 was placed, where the (X-axis origin Ox, Y-axis origin Oy) of the turntable 31 is the reference position, but rather returns to a position where the center position of the frame F of the TFW 100 placed on the stage 30 becomes the reference position. This is because the process in S27 corrects not only the deviation in the rotational direction, but also the deviations in the X-axis and Y-axis directions.

[0059] (Transportation processing procedure performed by the processing unit) Next, an example of the transport processing procedure performed by the processing unit 8 will be described with further reference to Figures 11 to 13. The roles of the processing unit host 14 and the robot control unit 17 in the following description can be changed as appropriate. Here, the process for transporting the TFW 100 from the load lock chamber 11 to the processing unit 12 will be described. Hereafter, in the description of each processing procedure, the step will be denoted as "S".

[0060] As shown in Figure 11, first, the transport robot 10 supports the TFW 100 with its hand 10a in the load lock chamber 11 under the control of the robot control unit 17 (S31). Then, under the control of the robot control unit 17, the transport robot 10 transports the TFW 100 from the load lock chamber 11, which is the source of transport, to the processing unit 12, which is the destination of transport. At this time, while the transport robot 10 is transporting the TFW 100 from the source to the destination, the sensor 13 detects the outer edge of the frame F of the TFW 100 (S32).

[0061] Here, the method for detecting the outer edge of frame F will be explained using the example shown in Figure 12. Here, the center of hand 10a is taken as the origin, and the mutually orthogonal axes are taken as the X-axis and Y-axis. Both the X-axis and Y-axis extend along the horizontal direction. The center position of frame F in the correct position is assumed to be (X-axis origin Ox, Y-axis origin Oy) of hand 10a. At this time, the center position of wafer W in the correct position is also (X-axis origin Ox, Y-axis origin Oy) of hand 10a.

[0062] First, as shown in Figure 12(a), as the transport robot 10 transports the TFW 100 from the source position to the destination position, the detection light of the left sensor 13L is blocked by the TFW 100. At this time, it can be seen that the detected point A (see Figure 13) on the outer edge of the frame F of the TFW 100 is located at the position of the left sensor 13L. Therefore, from the positional relationship between the hand 10a and the left sensor 13L at this timing, the position of the detected point A on the outer edge of the frame F relative to the hand 10a (X L1 , Y L1 ) can be understood.

[0063] Next, as shown in Figure 12(b), the detection light from the right sensor 13R is blocked by the TFW 100. At this time, it can be seen that the detected point B (see Figure 13) on the outer edge of the frame F of the TFW 100 is located at the position of the right sensor 13R. Therefore, from the positional relationship between the hand 10a and the right sensor 13R at this timing, the position of the detected point B on the outer edge of the frame F relative to the hand 10a (X R1 , Y R1 ) can be understood.

[0064] Thereafter, as shown in FIG. 12(c), when the detection light of the right sensor 13R is no longer blocked, it is found that the detected point C (see FIG. 13) on the outer edge of the frame F of the TFW 100 is positioned at the position of the right sensor 13R. Therefore, from the positional relationship between the hand 10a and the right sensor 13R at this timing, the position of the detected point C on the outer edge of the frame F relative to the hand 10a (X R2 , Y R2 ) is determined.

[0065] Further, as shown in FIG. 12(d), when the detection light of the left sensor 13L is no longer blocked, it is found that the detected point D (see FIG. 13) on the outer edge of the frame F of the TFW 100 is positioned at the position of the left sensor 13L. Therefore, from the positional relationship between the hand 10a and the left sensor 13L at this timing, the position of the detected point D on the outer edge of the frame F relative to the hand 10a (X L2 , Y L2 ) is determined.

[0066] Thereby, as shown in FIG. 13, the positions of the four detected points A, B, C, D on the outer edge of the frame F of the TFW 100 supported by the hand 10a are determined. The detected points A, B, C, D are portions where the notches N1, N2 and the linear portions F1, F2 of the frame F are not formed. The arrangement of the left sensor 13L and the right sensor 13R and the transport path of the hand 10a are adjusted so that the notches N1, N2 and the linear portions F1, F2 of the frame F are not detected by the left sensor 13L and the right sensor 13R. The portions of the outer edge of the frame F where the notches N1, N2 and the linear portions F1, F2 are not formed have an arc shape centered on the center position of the frame F. Therefore, from the positions of the four detected points A, B, C, D, the center position F0 (X F0 , Y F0 ) of the frame F is determined. After the outer edge of the frame F is detected in S32, the robot control unit 17 executes a frame position calculation process for calculating the center position F0 (X F0 , Y F0 ) of the frame F (S33).

[0067] Subsequently, the wafer position correction process is executed under the control of the robot control unit 17 (S34). The wafer position correction process is performed using the center position F0(X) of the frame F calculated by the frame position calculation process. F0 , Y F0 This process corrects the position of the TFW 100 so that the wafer W is in the correct position, based on the wafer correction value transmitted from the EFEM host 7 to the processing host 14 in S5 described above. The wafer correction value is the amount of displacement of the wafer W relative to the frame F, so the center position F0 of the frame F is F0 (X F0 , Y F0 ) from the center position W0 (X W0 , Y W0 ) can be determined. Therefore, the center position W0(X) of the wafer W of TFW100 supported by the hand 10a can be determined. W0 , Y W0 The amount of deviation of the hand 10a from (X-axis origin Ox, Y-axis origin Oy) can be determined. The transport robot 10 is located at the center position W0 (X) of the wafer W. W0 , Y W0 Based on the amount of deviation of the hand 10a from the (X-axis origin Ox, Y-axis origin Oy), the position of the TFW 100 is corrected so that the wafer W is in the correct position, and then the TFW 100 is placed on a stage or the like at the transport destination position.

[0068] (Features of the Embodiment) As described above, the EFEM2 of this embodiment is a device for transporting a TFW100 to a processing device 8 that performs a predetermined process on a TFW100 in which a wafer W is supported by tape T attached to a frame F. The EFEM2 comprises an aligner 6 capable of performing a wafer correction value acquisition process to acquire a wafer correction value for correcting the position of the TFW100 so that the wafer W is in the correct position, a transport robot 4 capable of transporting the TFW100 between the aligner 6 and the processing device 8, an aligner control unit 15 and an EFEM host 7. The aligner control unit 15 and the EFEM host 7 cause the aligner 6 to perform the wafer correction value acquisition process and transmit the wafer correction value acquired by the wafer correction value acquisition process to the processing device 8.

[0069] With this configuration, the wafer correction value is transmitted to the processing unit 8, so the processing unit 8 can determine the wafer correction value for correcting the position of the TFW 100 so that the wafer W is in the correct position. Therefore, the processing unit 8 can correct the position of the TFW 100 so that the wafer W is in the correct position based on the wafer correction value.

[0070] Furthermore, in the EFEM2 of this embodiment, the aligner 6 can perform frame position correction processing to correct the position of the TFW 100 so that the frame F is in the correct position. If the TFW 100 is transported while the frame F is not in the correct position, problems may occur such as the transport robot 4 not being able to properly support the TFW 100 or the TFW 100 not being able to be placed on the stage of the load lock chamber 11. In this configuration, the TFW 100 is transported with its position corrected so that the frame F is in the correct position, so transport can be performed normally.

[0071] Furthermore, in the EFEM2 of this embodiment, the aligner control unit 15 calculates a wafer correction value in the wafer correction value acquisition process from the difference between the amount of deviation of the frame F from the correct position and the amount of deviation of the wafer W from the correct position. With this configuration, the difference between the amount of deviation of the frame F from a predetermined position and the amount of deviation of the wafer W from a predetermined position, that is, the amount of deviation of the wafer W relative to the frame F, can be obtained as the wafer correction value.

[0072] Furthermore, the substrate processing system 1 of this embodiment includes an EFEM 2 and a processing unit 8. The processing unit 8 has a hand 10a capable of supporting the TFW 100, a transport robot 10 that transports the TFW 100 from a transport source position to a transport destination position, a sensor 13 positioned between the transport source position and the transport destination position and capable of detecting the outer edge of the frame F of the TFW 100 being transported by the transport robot 10, and a robot control unit 17. The robot control unit 17 performs a frame position calculation process that calculates the position of the frame F relative to the hand 10a from the positional relationship between the hand 10a and the sensor 13 at the timing when the sensor 13 detects the outer edge of the frame F while the transport robot 10 is transporting the TFW 100 from the transport source position to the transport destination position, and a wafer position correction process that corrects the position of the TFW 100 so that the wafer W is in the correct position based on the position of the frame F calculated by the frame position calculation process and a wafer correction value transmitted from the EFEM host 7.

[0073] With this configuration, by performing wafer position correction processing, the TFW 100 can be transported to the destination position with the wafer W in the correct position. Therefore, the processing device 8 can properly process the wafer W of the TFW 100.

[0074] Although embodiments of the present invention have been described above with reference to the drawings, it should be understood that the specific configurations are not limited to these embodiments. The scope of the present invention is indicated by the claims rather than the above description of embodiments, and all modifications within the meaning and scope equivalent to the claims are included.

[0075] In the above embodiment, the case in which wafer correction values ​​are obtained by an aligner 6 that corrects the position of the TFW 100 was described, but the invention is not limited to this. A device other than the aligner 6 for obtaining wafer correction values ​​may be provided.

[0076] Furthermore, in the above-described embodiment, the case in which the stage 30 is moved so that the frame F is in the correct position was explained during the frame position correction process, but the invention is not limited to this. For example, in the frame position correction process, a correction value for setting the frame F to the correct position may be transmitted from the EFEM host 7 to the robot control unit 16.

[0077] Furthermore, in the embodiments described above, the wafer correction value was described as the difference between the amount of deviation of the frame F from the proper position and the amount of deviation of the wafer W from the proper position, but it is not limited to this. The wafer correction value may be, for example, the amount of deviation of the wafer W from the proper position.

[0078] In addition, the above-described embodiment explains a case in which the robot control unit 17 of the processing unit 8 performs a frame position calculation process to calculate the position of the frame F relative to the hand 10a of the transport robot 10, but it is not limited to this. If the transport error when transporting the TFW 100 from the aligner 6 to the load lock chamber 11 can be ignored, the frame position calculation process can be omitted.

[0079] Furthermore, although the above embodiment described a case in which the center position of frame F is calculated in the frame position calculation process, it is not limited to this. For example, by detecting the straight sections F1, F2, etc. of frame F with the sensor 13, it is possible to calculate the angle of frame F in addition to the center position of frame F.

[0080] In other words, in the first modified version of the frame position calculation process, the angle of the frame F is first calculated by detecting the straight portion F1 of the outer edge of the frame F using either the left sensor 13L or the right sensor 13R. Then, the center position of the frame F is calculated by detecting the arc-shaped portion of the outer edge of the frame F using the left sensor 13L and the right sensor 13R. Now, the method for calculating the angle of the frame F will be explained. Two straight portions F1 are formed on the outer edge of the frame F. The two straight portions F1 are parallel to each other. In the TFW100 shown in Figures 14(a) and (b), the straight portions F1 extend along a direction parallel to the separation direction. In the TFW100 shown in Figures 14(c) and (d), the straight portions F1 extend along a direction intersecting the separation direction. In other words, the angle of the frame F is different between the TFW100 shown in Figures 14(a) and (b) and the TFW100 shown in Figures 14(c) and (d). When calculating the angle of frame F, first, as shown in Figures 14(a) and (c), the first straight section F1 is detected by the sensor 13 (right sensor 13R). Then, the TFW 100 is moved further in the transport direction, and as shown in Figures 14(b) and (d), the second straight section F1 is detected by the sensor 13 (right sensor 13R). At this time, the distance traveled by the TFW 100 from the detection of the first straight section F1 to the detection of the second straight section F1 differs depending on the angle of frame F. Therefore, the angle of frame F is calculated from the distance traveled by the TFW 100 at this time.

[0081] Furthermore, by utilizing the center position of frame F, it is possible to calculate the angle of frame F by detecting a single straight section F1 with sensor 13. In other words, the distance between the position of the detected straight section F1 and the center position of frame F is calculated. Since this distance differs depending on the center position and angle of frame F, the angle of frame F can be calculated.

[0082] Furthermore, in a second modified example of the frame position calculation process, the angle of the frame F is calculated by detecting the straight section F1 on the outer edge of the frame F using a sensor 13a, which is provided separately from the left sensor 13L and the right sensor 13R. In the example shown in Figure 15, the sensors 13a are provided as a pair, the left sensor 13aL and the right sensor 13aR. The left sensor 13aL and the right sensor 13aR are arranged at a distance from each other in a direction intersecting the transport direction of the TFW 100, similar to the left sensor 13L and the right sensor 13R. In this modified example, the angle of the frame F is calculated based on the position at which the left sensor 13aL and the right sensor 13aR each detect one straight section F1. There may be only one sensor 13a. When the sensors 13a are provided as a pair, the angle of the frame F can be calculated with higher accuracy compared to when there is only one sensor. Also, when only the angle of the frame F is calculated in the frame position calculation process, the left sensor 13L and the right sensor 13R do not need to be provided.

[0083] Furthermore, in a third modified example of the frame position calculation process, as shown in Figure 16, the angle of the frame F is calculated by detecting the straight portion F2 of the outer edge of the frame F using a sensor 13a (left sensor 13aL, right sensor 13aR) provided separately from the left sensor 13L and the right sensor 13R. The straight portion F2 extends in a direction perpendicular to the direction in which the straight portion F1 extends. In this case, the direction of movement of the TFW 100 is perpendicular to the direction of movement of the TFW 100 in the above-described embodiment when viewed from above. Also, the direction of separation between the left sensor 13L and the right sensor 13R is perpendicular to the direction of separation in the above-described embodiment when viewed from above. In the example shown in Figure 16, the sensor 13a is provided as a pair, the left sensor 13aL and the right sensor 13aR. The left sensor 13aL and the right sensor 13aR are arranged separated in a direction intersecting the transport direction of the TFW 100.

[0084] 1 Substrate processing system 2 EFEM (transport device) 4 Transport robot (first transport robot) 6 Aligner (correction device) 7 EFEM host (first control unit) 8 Processing device 10 Transport robot (second transport robot) 10a Hand 13 Sensor 14 Processing device host (second control unit) 15 Aligner control unit (first control unit) 17 Robot control unit (second control unit) 100 TFW (Tape Frame Wafer) F Frame T Tape W Wafer

Claims

1. A transport device for transporting a tape frame wafer, in which a wafer is supported by tape attached to a frame, to a processing device that performs predetermined processing on the tape frame wafer, comprising: a correction device capable of performing a wafer correction value acquisition process to acquire a wafer correction value for correcting the position of the tape frame wafer so that the wafer is in the correct position; a first transport robot capable of transporting the tape frame wafer between the correction device and the processing device; and a first control unit, wherein the first control unit causes the correction device to perform the wafer correction value acquisition process and transmits the wafer correction value acquired by the wafer correction value acquisition process to the processing device.

2. The transport apparatus according to claim 1, characterized in that the correction device is capable of performing a frame position correction process to correct the position of the tape frame wafer so that the frame is in the correct position.

3. The transport apparatus according to claim 1 or 2, characterized in that the first control unit calculates the wafer correction value in the wafer correction value acquisition process from the difference between the amount of deviation of the frame from the proper position and the amount of deviation of the wafer from the proper position.

4. A substrate processing system comprising: a transport device according to claim 3; and a processing device, wherein the processing device comprises: a second transport robot having a hand capable of supporting the tape frame wafer and transporting the tape frame wafer from a transport source position to a transport destination position; a sensor positioned between the transport source position and the transport destination position and capable of detecting the outer edge of the frame of the tape frame wafer being transported by the second transport robot; and a second control unit, wherein the second control unit performs: a frame position calculation process that calculates the position of the frame relative to the hand from the positional relationship between the hand and the sensor at the timing when the sensor detects the outer edge of the frame while the second transport robot is transporting the tape frame wafer from the transport source position to the transport destination position; and a wafer position correction process that corrects the position of the tape frame wafer so that the wafer is in the correct position based on the position of the frame calculated by the frame position calculation process and the wafer correction value transmitted from the first control unit.

5. A transport method for transporting a tape frame wafer, in which a wafer is supported by tape attached to a frame, to a processing device that performs a predetermined process on the tape frame wafer, the transport method comprising: a wafer correction value acquisition step for acquiring a wafer correction value for correcting the position of the tape frame wafer so that the wafer is in the correct position; a transport step for transporting the tape frame wafer, from which the wafer correction value has been acquired in the wafer correction value acquisition step, to the processing device; and a correction value transmission step for transmitting the wafer correction value acquired in the wafer correction value acquisition step to the processing device.

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