Electronic device including structure for shielding and heat dissipation

Abstract

This electronic device may comprise: a printed circuit board (PCB); at least one processor mounted on the surface of the PCB and including a processing circuit; a shield can disposed on the surface of the PCB, the top side of the shield can defining an opening; a first heat transfer material in contact with the at least one processor; and a film disposed on the first heat transfer material and the top side of the shield can so as to cover the opening. The film may comprise: a conductive layer attached to the first heat transfer material and attached to the top side of the shield can; and a coating layer including a second heat transfer material and disposed on the conductive layer. The conductive layer may define, within a portion of the conductive layer overlapping the opening, a plurality of openings at least filled with the second heat transfer material.

Description

Electronic device including a structure for shielding and heat dissipation

[0001] The present disclosure relates to an electronic device comprising a structure for shielding and heat dissipation.

[0002] The electronic device may include a processor. The processor may perform computations and / or control of other components of the electronic device (e.g., display and / or communication circuits) for services provided through the electronic device. Heat may be generated from the processor depending on the computations and / or control. The electronic device may include a heat dissipation structure for discharging the heat to the outside or cooling the processor.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0004] An electronic device may include a printed circuit board (PCB). The electronic device may include at least one processor mounted on a surface of the PCB of the electronic device and comprising a processing circuit. The electronic device may include a shield can disposed on the surface of the PCB to cover the at least one processor. The top side of the shield can of the electronic device may define an opening that overlaps at least partially with the at least one processor. The electronic device may include a first heat transfer material in contact with the at least one processor. The electronic device may include a film disposed on the top side of the shield can and the first heat transfer material to cover the opening. The film may include a conductive layer attached to the first heat transfer material and attached to the top side of the shield can. The conductive layer may define a plurality of openings, at least filled with a second heat transfer material, within a portion of the conductive layer that overlaps with the opening. The above film may include a coating layer disposed on the conductive layer, which comprises the second heat transfer material.

[0005] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0006] FIG. 1 illustrates a structure comprising a continuous film covering the top side of a shield can that defines an opening for shielding and heat dissipation.

[0007] FIG. 2 illustrates a structure including a film that covers the top side of the shield can, and defines an opening that overlaps with an opening defined by the top side of the shield can for shielding and heat dissipation.

[0008] FIG. 3 illustrates a structure within an electronic device comprising a film covering the top side of a shield can, which defines a plurality of openings overlapping with an opening defined by the top side of the shield can for shielding and heat dissipation.

[0009] FIGS. 4a and FIGS. 4b illustrate a plurality of openings defined by a conductive layer of a film and overlapping with an opening defined by the top side of a shield can.

[0010] Figure 5 is a chart showing the contact thermal resistance of the conductive layer and the coating layer according to the aperture ratio of the conductive layer.

[0011] FIG. 6 illustrates an arrangement of multiple openings.

[0012] FIG. 7 illustrates a conductive adhesive layer including an opening.

[0013] FIG. 8 illustrates a structure within an electronic device comprising a film covering the top side of a shield can, which covers a processor facing a display, and a plurality of openings that overlap with an opening defined by the top side of the shield can.

[0014] FIG. 9 is a block diagram of an electronic device in a network environment according to various embodiments.

[0015] Hereinafter, embodiments of the present disclosure are described in detail with reference to the drawings so that those skilled in the art can easily practice them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0016] FIG. 1 illustrates a structure comprising a continuous film covering the top side of a shield can that defines an opening for shielding and heat dissipation.

[0017] Referring to FIG. 1, a processor (110) may be mounted on a printed circuit board (101). To shield electromagnetic waves from the processor (110) or to the processor (110), a shield can (105) may be placed on the printed circuit board (101) to cover the processor (110). The shield can (105) may include a top side (108) defining an opening (107) to reduce heat generated by the processor (110). To reduce heat generated by the processor (110), a heat transfer material (115) may be placed on the processor (110). A shielding film (120) may be placed on the top side (108) of the shield can (105) defining the opening (107) to shield electromagnetic waves from the processor (110) or to the processor (110). The shielding film (120) disposed on the top side (108) of the shield can (105) may not include an opening that overlaps with the opening (107) defined by the top side (108) of the shield can (105), unlike the shielding film to be described with reference to FIG. 2. To reduce the heat generated by the processor (110), a heat transfer material (125) may be disposed on the shielding film (120). To reduce the heat generated by the processor (110), a vapor chamber (130) may be disposed on the heat transfer material (125).

[0018] As described above, since the shielding film (120) does not include an opening that overlaps with the opening (107) defined by the top side (108) of the shield can (105), the second heat transfer material (125) can be separated from the first heat transfer material (115) by the shielding film (120).

[0019] For example, heat from the processor (110) can be transferred to a first heat transfer material (115). The heat transferred to the first heat transfer material (115) is not transferred directly to the second heat transfer material (125), but can be transferred to the second heat transfer material (125) through a shielding film (120) embedded between the first heat transfer material (115) and the second heat transfer material (125). The heat transferred to the second heat transfer material (125) can be transferred to a vapor chamber (130). The heat transferred to the vapor chamber (130) can be cooled by the vapor chamber (130).

[0020] Since the heat from the first heat transfer material (115) is not transferred directly to the second heat transfer material (125) but is transferred to the second heat transfer material (125) through the shielding film (120), the greater the thermal resistance of the shielding film (120), the lower the cooling performance of the structure illustrated in FIG. 1 can be.

[0021] FIG. 2 illustrates a structure including a film that covers the top side of the shield can, and defines an opening that overlaps with an opening defined by the top side of the shield can for shielding and heat dissipation.

[0022] Referring to FIG. 2, the shielding film (205) may include an opening that partially overlaps with the opening (107) defined by the top side (108) of the shield can (105). A foam layer (215) may be disposed on the shielding film (205) to implement the shielding film (205) that includes the opening. The foam layer (215) may include an opening that partially overlaps with the opening of the shielding film (205). A heat dissipation member (220) may be disposed on the top side (108) of the foam layer (215). The heat dissipation member (220) may include, for example, a vapor chamber and / or a graphite sheet. The adhesive (210) can connect the shielding film (205) and the heat dissipation member (220) and connect the shielding film (205) and the foam layer (215). The adhesive (210) may be, for example, double-sided tape.

[0023] As described above, since the shielding film (205) and the foam layer (215) include an opening, the heat transfer material (115) can extend from the processor (110) to the heat dissipation member (220). For example, the heat transfer material (115) can thermally connect the processor (110) and the heat dissipation member (220). Heat transferred from the processor (110) to the heat transfer material (115) can be directly transferred to the heat dissipation member (220). The heat transferred to the heat dissipation member (220) can be cooled by the heat dissipation member (220).

[0024] Since the heat from the heat transfer material (115) is directly transferred to the heat dissipation member (220), the structure shown in FIG. 2 may have a relatively small thermal resistance value compared to the structure shown in FIG. 1.

[0025] However, the foam layer (215) included in the structure illustrated in FIG. 2 may have a thickness of at least 200 μm (micrometer). Due to the thickness of the foam layer (215), the portability of the electronic device including the structure illustrated in FIG. 2 may be reduced.

[0026] The electronic device to be described below may provide enhanced heat dissipation by including a film (325) defining a plurality of openings (316) within a structure for shielding and heat dissipation. The electronic device to be described below may provide enhanced portability by including a film (325) defining a plurality of openings (316) within a structure for shielding and heat dissipation.

[0027] FIG. 3 illustrates a structure within an electronic device comprising a film covering the top side of a shield can, which defines a plurality of openings overlapping with an opening defined by the top side of the shield can for shielding and heat dissipation.

[0028] Referring to FIG. 3, the electronic device (300) may include a printed circuit board (301), a processor (310), a shield can (305), a first heat transfer material (315), a conductive adhesive layer (320), a film (325), and a vapor chamber (370).

[0029] The electronic device (300) may be a tablet device. The electronic device (300) may include a bracket within a housing. A printed circuit board (301) may be supported by the bracket. The electronic device (300) may include a display defining at least a portion of the front side of the housing (or the front side of the electronic device). The printed circuit board (301) supported by the bracket may be spaced apart from the display. For example, a gap may be defined between the printed circuit board (301) and the display. The rear side of the display may be in contact with a plate made of copper and / or graphite. As an example, but not limited to, the plate may be supported by the bracket.

[0030] The printed circuit board (301) may include a processor (310). For example, the processor (310) may include one or more of a central processing unit, an application processor, a dynamic random access memory (DRAM), a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. As an example without limitation, the processor (310) may be an assembly comprising a processor (e.g., including a processing circuit) and a memory stacked on said processor (e.g., including one or more storage media). The processor (310) of FIG. 3 may be described as an electronic component within an electronic device (300) that generates heat. For example, the processor (310) of FIG. 3 may be replaced by a display driving circuit included within the electronic device (300). However, various embodiments are not limited thereto.

[0031] The processor (310) may be placed or mounted on one side (302) of the printed circuit board (301). For example, the side (302) of the printed circuit board (301) on which the processor (310) is placed may face the rear side of the electronic device (300). However, various embodiments are not limited thereto. For example, the side (302) of the printed circuit board (301) on which the processor (310) is placed may face the display, as shown in FIG. 8. The processor (310) may include at least a part of the processor (920) and memory (930) of FIG. 9, or correspond to at least a part of the processor (920) and memory (930) of FIG. 9.

[0032] The first heat transfer material (315) may be a material that is applied to the processor (310) in liquid form and changes into a solid over time. However, it is not limited thereto. For example, the first heat transfer material (315) may be a material that continues to maintain its viscosity even after being applied to the processor (310).

[0033] A conductive adhesive layer (320) can electrically connect the film (325) to the shield can (305). For example, to shield electromagnetic waves from the processor (310) and / or to the processor (310), the conductive adhesive layer (320) can electrically connect the film (325) to the shield can (305) by contacting the film (325) and contacting the shield can (305). The conductive adhesive layer (320) can thermally connect the film (325) to the processor (310) in contact with the first heat transfer material (315). For example, the conductive adhesive layer (320) can attach the film (325) to the first heat transfer material (315) and the top side (308) of the shield can (305) respectively to cover the opening (307) of the shield can (305). For example, heat emitted from the processor (310) can be transferred to the film (325) through the first heat transfer material (315) and the conductive adhesive layer (320) in contact with the first heat transfer material (315). The conductive adhesive layer (320) may be a conductive adhesive sheet containing an anti-oxidation material.

[0034] The film (325) may include a conductive layer (321) and a coating layer (322).

[0035] A conductive layer (321) may be positioned between a conductive adhesive layer (320) and a coating layer (322). The conductive layer (321) may shield electromagnetic waves. For example, the conductive layer (321) may include a conductive material (e.g., copper) to shield electromagnetic waves emitted from the processor (310) and / or to shield electromagnetic waves directed toward the processor (310).

[0036] The conductive layer (321) may have a plurality of openings (316). The plurality of openings (316) may be filled (at least partially) with a second heat transfer material (324) to be described below. For example, most of the plurality of openings (316) may contain the second heat transfer material (324). For example, at least some of the plurality of openings (316) may be filled with the second heat transfer material (324). The second heat transfer material (324) will be described in more detail below.

[0037] A second heat transfer material (324) filling multiple openings (316) can come into direct contact with a conductive adhesive layer (320).

[0038] A portion (420) of the conductive layer (321) that overlaps with the opening (307) of the shield can (305), and a plurality of openings (316) located within the portion (420) of the conductive layer (321) are described with reference to FIG. 4a.

[0039] FIGS. 4a and FIGS. 4b illustrate a plurality of openings defined by a conductive layer of a film and overlapping with an opening defined by the top side of a shield can.

[0040] Referring to FIG. 4a, a plurality of openings (316) may be defined within a portion (420) of a conductive layer (321) that overlaps with an opening (307) of a shield can (305). For example, the portion (420) of the conductive layer (321) may be defined by the boundary (410) of an opening (307) of a shield can (305). The portion (420) of the conductive layer (321) may be described as a center area (420) of the conductive layer (321) that overlaps with an opening (307) of a shield can (305). The center area (420) of the conductive layer (321) may be surrounded by a peripheral area (another part (430)) of the conductive layer (321).

[0041] Multiple openings (316) may be uniformly positioned within the conductive layer (321). Each of the multiple openings (316) may have the same size as each other. However, various embodiments are not limited thereto. For example, the multiple openings (316) may be non-uniformly positioned within the conductive layer (321). For example, each of the multiple openings (316) may have different sizes. The opening ratio of the conductive layer (321) may change depending on the arrangement of the multiple openings (316).

[0042] The conductive layer (321) may include another part (430) of the conductive layer (321) that overlaps with the top side (308) of the shield can (305) surrounding the opening (307). The other part (430) of the conductive layer (321) may surround a part (420) of the conductive layer (321). The other part (430) of the conductive layer (321) may not overlap with the opening (307). The other part (430) of the conductive layer (321) may be described as a peripheral area (430) of the conductive layer (321) that surrounds a center area (420) of the conductive layer (321).

[0043] As a non-limiting example, the other part (430) of the conductive layer (321) may not define openings. For example, the other part (430) of the conductive layer (321) may be continuous, unlike the part (420) of the conductive layer (321). For example, the other part (430) of the conductive layer (321) that does not define openings may enhance the function of shielding electromagnetic waves from the processor (310) and / or electromagnetic waves toward the processor (310).

[0044] Referring again to FIG. 3, the conductive layer (321) may further define a plurality of openings (317) within another part of the conductive layer (321) that does not overlap with the opening (307) of the shield can (305). For example, the size of the plurality of openings (317) may be substantially the same as the size of the plurality of openings (316). However, various embodiments are not limited thereto. For example, the size of each of the plurality of openings (317) may be smaller than the size of each of the plurality of openings (316). For example, the size of each of the plurality of openings (317) may be larger than the size of each of the plurality of openings (316). The plurality of openings (317) located within the other part (430) of the conductive layer (321) is described with reference to FIG. 4b.

[0045] Referring to FIG. 4b, a plurality of openings (317) may be located within another part (430) of the conductive layer that overlaps with the area outside the boundary (410) of the opening (307) of the shield can (305). In other words, the conductive layer (321) may be defined not only within a portion (420) of the conductive layer (321) that overlaps with the opening (307) of the shield can (305) and the plurality of openings (316), but also within another part (430) of the conductive layer (321) that overlaps with the portion of the top side (308) of the shield can (305) surrounding the opening (307).

[0046] Multiple openings (317) may be uniformly positioned within the conductive layer (321). Each of the multiple openings (317) may have the same size as each other. However, various embodiments are not limited thereto. For example, the multiple openings (317) may be non-uniformly positioned within the conductive layer (321). For example, each of the multiple openings (317) may have different sizes. The opening ratio of the conductive layer (321) may be changed according to a change in the arrangement of the multiple openings (316) and the multiple openings (317).

[0047] Referring again to FIG. 3, the conductive layer (321) may have a laminated structure. For example, the conductive layer (321) may include a first layer (351), a second layer (352) containing an oxide material located between the first layer (351) and the conductive adhesive layer (320), and a third layer (353) containing an oxide material located between the first layer (351) and the coating layer (322). For example, the first layer (351) may be formed from copper. For example, the oxide material contained in the second layer (352) and the third layer (353) may be nickel. However, various embodiments are not limited thereto. For example, the second layer (352) and the third layer (353) may contain an oxide material that is more reactive than copper (e.g., aluminum). According to the embodiments, the second layer (352) and the third layer (353) may be omitted from the conductive layer (321).

[0048] A coating layer (322) may be placed on a conductive layer (321). The coating layer (322) may include a second heat transfer material (324). For example, the second heat transfer material (324) may include silicon. The coating layer (322) may be compressed. For example, the silicon contained within the coating layer (322) may be pressed by a heat dissipation sheet (not shown) placed on the coating layer (322). The second heat transfer material (324) (or coating layer (322)) may be contained within a film (325) for thermal coupling with the first heat transfer material (315).

[0049] A heat dissipation sheet may be positioned between the coating layer (322) and the vapor chamber (370). Heat generated from the processor (310) may be transferred from the coating layer (322) to the vapor chamber (370) through the heat dissipation sheet. The heat dissipation sheet may be formed of a material with high thermal conductivity. For example, the heat dissipation sheet may be a graphite sheet.

[0050] The vapor chamber (370) may be located on the heat dissipation sheet. For example, the vapor chamber (370) may be located between the heat dissipation sheet placed on the coating layer (322) and the back plate (380) (or rear plate (380)) of the electronic device (300). Heat transferred from the processor (310) to the vapor chamber (370) may be cooled by the vapor chamber (370).

[0051] The path through which heat is transferred from the processor (310) to the vapor chamber (370) may include a path through which the heat is transferred via a first region (361) and a path through which the heat is transferred via a second region (362).

[0052] For example, within the first region (361), heat transferred from the processor (310) to the conductive adhesive layer (320) through the first heat transfer material (315) can be transferred to the coating layer (322) (e.g., including the second heat transfer material (324)) through the second heat transfer material (324) filling the plurality of openings (316). The heat transferred to the coating layer (322) can be transferred to the vapor chamber (370). The heat transferred to the vapor chamber (370) can be cooled. In other words, the heat transferred to the conductive adhesive layer (320) can be transferred to the vapor chamber (370) through the second heat transfer material (324).

[0053] For example, within the second region (362), heat transferred from the processor (310) to the conductive adhesive layer (320) through the first heat transfer material (315) can be transferred to the coating layer (322) (e.g., including the second heat transfer material (324)) through the conductive portion of the conductive layer (321) embedded between the conductive adhesive layer (320) and the coating layer (322). The heat transferred to the coating layer (322) can be transferred to the vapor chamber (370). The heat transferred to the vapor chamber (370) can be cooled. In other words, the heat transferred to the conductive adhesive layer (320) can be transferred to the vapor chamber (370) through the conductive portion of the conductive layer (321) and the second heat transfer material (324).

[0054] The thermal resistance of the second heat transfer material (324) may be lower than the thermal resistance of the conductive layer (321) (or the thermal resistance of the conductive portion of the conductive layer (321)). Since the thermal resistance of the second heat transfer material (324) is lower than the thermal resistance of the conductive layer (321), the heat dissipation performance provided through the first region (361) may be higher than the heat dissipation performance provided through the second region (362).

[0055] The thermal resistance of the conductive layer (321) (or the thermal resistance of the conductive portion of the conductive layer (321)) is higher than the thermal resistance of the second heat transfer material (324), but the electromagnetic shielding performance of the conductive layer (321) (or the conductive portion of the conductive layer (321)) may be higher than the shielding performance of the second heat transfer material (324). Since the electromagnetic shielding performance of the conductive layer (321) is higher than the shielding performance of the second heat transfer material (324), the shielding performance provided through the second region (362) may be higher than the shielding performance provided through the first region (361).

[0056] The first region (361) and the second region (362) can alternate with each other.

[0057] Since the first region (361) and the second region (362) alternate with each other, electromagnetic coupling may occur within the first region (361-1) located between the second region (362-1) and the second region (362-2). Due to the electromagnetic coupling, the shielding performance of the first region (361-1) located between the second region (362-1) and the second region (362-2) may be higher than the shielding performance of the first region (361-1) located standalone without the second region (362-1) and the second region (362-2).

[0058] Since the first region (361) and the second region (362) alternate with each other, thermal coupling may occur within the second region (362-1) located between the first region (361-1) and the first region (361-2). Due to the thermal coupling, the heat dissipation performance of the second region (362-1) located between the first region (361-1) and the first region (361-2) may be higher than the heat dissipation performance of the second region (362-1) located standalone without the first region (361-1) and the first region (361-2).

[0059] The opening ratio of the plurality of openings (316) within the conductive layer (321) can be defined in various ways. The opening ratio is explained with reference to FIG. 5.

[0060] Figure 5 is a chart showing the contact thermal resistance of the conductive layer and the coating layer according to the aperture ratio of the conductive layer.

[0061] Referring to FIG. 5, the horizontal axis of the chart (500) represents the aperture ratio (unit: %) of the conductive layer (321), and the vertical axis of the chart (500) represents the contact thermal resistance (unit: K / W (kelvins per watt)) of the conductive layer (321) and the coating layer (322).

[0062] The line (501) in the chart (500) represents the contact thermal resistance between the conductive layer (321) and the coating layer (322) according to the opening ratio of the conductive layer (321). For example, as the opening ratio increases, the area in which the second heat transfer material (324) filled inside the plurality of openings (316) is thermally bonded to the first heat transfer material (315) through the conductive adhesive layer (320) without passing through the conductive portion of the conductive layer (321) becomes larger, so the contact thermal resistance between the conductive layer (321) and the coating layer (322) can be reduced as indicated by the line (501).

[0063] The range of the aperture ratio may be limited. For example, the range of the aperture ratio may be limited because, when the aperture ratio becomes larger than a certain value, the electromagnetic shielding performance may be lower than the reference performance. For example, the range of the aperture ratio may be limited because, as the aperture ratio increases, the electromagnetic shielding performance decreases further. For example, the range of the aperture ratio may be between 20% and 60%, as indicated by line (501).

[0064] Referring again to FIG. 3, the aperture value of the conductive layer (321) may be, for example, about 20%. However, various embodiments are not limited thereto.

[0065] The arrangement of the multiple openings (316) may vary. The arrangement of the multiple openings (316) is described with reference to FIG. 6.

[0066] FIG. 6 illustrates an arrangement of multiple openings.

[0067] Referring to FIG. 6, the arrangement of the plurality of openings (316) may vary according to the angle (610) defined between adjacent openings (316) and the diameter (611) of each of the plurality of openings (316).

[0068] The angle (610) can be described as the angle between a first line (640) connecting the center of the first opening (316-1) among the plurality of openings (316) and the center of the second opening (316-2) closest to the first opening (316-1) in the horizontal direction (620), and a second line (650) connecting the center of the first opening (316-1) and the center of the third opening (316-3) closest to the first opening (316-1) in the vertical direction (630). For example, the angle (610) may be between about 45 degrees and about 90 degrees. For example, as in state (691), the angle (610) may be about 45 degrees. For example, as in state (692), the angle (610) may be about 60 degrees. For example, as in state (693), the angle (610) may be about 90 degrees.

[0069] The diameter (611) of each of the multiple openings (316) may be limited to a certain range as it affects both the shielding and heat dissipation performance of the electronic device. For example, when the diameter (611) increases, the shielding performance of the conductive layer (321) deteriorates, while the heat dissipation performance improves. For example, the range of the diameter (611) may be between about 400 μm and about 600 μm.

[0070] The horizontal pitch (612) and vertical pitch (613) may be dependent variables. For example, the horizontal pitch (612) and vertical pitch (613) may be determined accordingly once the angle (610) and the diameter (611) of each of the plurality of openings (316) are determined. For example, the horizontal pitch (612) and vertical pitch (613) may be determined to be approximately 1163 μm when the angle (610) is determined to be approximately 90 degrees and the diameter (611) is determined to be approximately 600 μm. The descriptions related to FIG. 6 may be applied substantially the same way to the arrangement of the plurality of openings (317).

[0071] Referring again to FIG. 3, the conductive adhesive layer (320) may have an opening, unlike the illustration in FIG. 3. A conductive adhesive layer (320) that defines or includes an opening is described with reference to FIG. 7.

[0072] FIG. 7 illustrates a conductive adhesive layer including an opening.

[0073] Referring to FIG. 7, a conductive adhesive layer (720) replacing the conductive adhesive layer (320) can attach a conductive layer (321) to a part of the top side (308) of the shield can (305) surrounding the opening (307) of the shield can (305). Unlike the conductive adhesive layer (320), the conductive adhesive layer (720) can define the opening (707). Because the conductive adhesive layer (720) defines the opening (707), the first heat transfer material (315) can be thermally bonded to the second heat transfer material (324) filling the multiple openings (316) through the gap (710) between the first heat transfer material (315) and the second heat transfer material (324) filling the multiple openings (316). For example, when the thermal conductivity of the gap (710) is greater than the thermal conductivity of the conductive adhesive layer (320), the first thermal resistance formed by the first heat transfer material (315), the gap (710), and the second heat transfer material (324) may be lower than the second thermal resistance formed by the first heat transfer material (315), the conductive adhesive layer (320), and the second heat transfer material (324). Since the first thermal resistance is lower than the second thermal resistance, the heat dissipation performance of the structure illustrated in FIG. 7 may be higher than the heat dissipation performance of the structure illustrated in FIG. 3.

[0074] FIG. 7 illustrates a gap (710) defined between a first heat transfer material (315) and a second heat transfer material (324) filling a plurality of openings (316), but various embodiments are not limited thereto. For example, the first heat transfer material (315) may come into direct contact with the second heat transfer material (324) through the opening (707). A third thermal resistance formed by the first heat transfer material (315) and the second heat transfer material (324) may be lower than the first thermal resistance.

[0075] The above descriptions illustrate the top side of the processor (310) facing the rear plate (380), but various embodiments are not limited thereto. The top side of the processor (310) may also face the display (801). A structure (e.g., a structure for shielding and heat dissipation) arranged in relation to the processor (310) including the top side facing the display (801) is described with reference to FIG. 8.

[0076] FIG. 8 illustrates a structure within an electronic device comprising a film covering the top side of a shield can, which covers a processor facing a display, and a plurality of openings that overlap with an opening defined by the top side of the shield can.

[0077] Referring to FIG. 8, the electronic device may include a display (801).

[0078] The display (801) may define at least a portion of the front side (808) of the electronic device (800). The display (801) may include a touch-sensitive display. The display (801) may include at least a portion of the display module (960) of FIG. 9 or correspond to at least a portion of the display module (960) of FIG. 9.

[0079] The processor (310) may be placed or mounted on one side of the printed circuit board (301). For example, the side (802) of the printed circuit board (301) on which the processor (310) is placed may face the front side of the electronic device (800). Heat generated from the processor (310) may be transferred from the processor (310) toward the display (801) through a heat dissipation structure placed in relation to the processor (310), which includes a top side facing the display (801) within the electronic device (800).

[0080] The above descriptions can be applied to the electronic device (901) of FIG. 9.

[0081] FIG. 9 is a block diagram of an electronic device (901) in a network environment (900) according to various embodiments. Referring to FIG. 9, in the network environment (900), the electronic device (901) may communicate with an electronic device (902) through a first network (998) (e.g., a short-range wireless communication network) or may communicate with at least one of an electronic device (904) or a server (908) through a second network (999) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (901) may communicate with the electronic device (904) through a server (908). According to one embodiment, the electronic device (901) may include a processor (920), memory (930), input module (950), sound output module (955), display module (960), audio module (970), sensor module (976), interface (977), connection terminal (978), haptic module (979), camera module (980), power management module (988), battery (989), communication module (990), subscriber identification module (996), or antenna module (997). In some embodiments, at least one of these components (e.g., connection terminal (978)) may be omitted from the electronic device (901), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (976), camera module (980), or antenna module (997)) may be integrated into a single component (e.g., display module (960)).

[0082] The processor (920) can control at least one other component (e.g., a hardware or software component) of the electronic device (901) connected to the processor (920) by executing software (e.g., a program (940)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (920) can store commands or data received from other components (e.g., a sensor module (976) or a communication module (990)) in volatile memory (932), process the commands or data stored in volatile memory (932), and store the resulting data in non-volatile memory (934). According to one embodiment, the processor (920) may include a main processor (921) (e.g., a central processing unit or an application processor) or an auxiliary processor (923) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (901) includes a main processor (921) and an auxiliary processor (923), the auxiliary processor (923) may be configured to use lower power than the main processor (921) or to be specialized for a designated function. The auxiliary processor (923) may be implemented separately from the main processor (921) or as part thereof.

[0083] The auxiliary processor (923) may control at least some of the functions or states associated with at least one component of the electronic device (901) (e.g., display module (960), sensor module (976), or communication module (990)) on behalf of the main processor (921) while the main processor (921) is in an inactive (e.g., sleep) state, or together with the main processor (921) while the main processor (921) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (923) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (980) or communication module (990)). According to one embodiment, the auxiliary processor (923) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (901) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (908)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0084] The memory (930) can store various data used by at least one component of the electronic device (901) (e.g., processor (920) or sensor module (976)). The data may include, for example, software (e.g., program (940)) and input or output data for related commands. The memory (930) may include volatile memory (932) or non-volatile memory (934).

[0085] The program (940) may be stored as software in memory (930) and may include, for example, an operating system (942), middleware (944), or an application (946).

[0086] The input module (950) can receive commands or data to be used for a component of the electronic device (901) (e.g., processor (920)) from outside the electronic device (901) (e.g., user). The input module (950) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0087] The sound output module (955) can output a sound signal to the outside of the electronic device (901). The sound output module (955) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0088] The display module (960) can visually provide information to an external (e.g., user) of the electronic device (901). The display module (960) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (960) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0089] The audio module (970) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (970) can acquire sound through the input module (950) or output sound through the sound output module (955) or an external electronic device (e.g., electronic device (902)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (901).

[0090] The sensor module (976) can detect the operating state of the electronic device (901) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (976) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0091] The interface (977) may support one or more specified protocols that can be used for the electronic device (901) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (902)). According to one embodiment, the interface (977) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0092] The connection terminal (978) may include a connector through which the electronic device (901) can be physically connected to an external electronic device (e.g., electronic device (902)). According to one embodiment, the connection terminal (978) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0093] The haptic module (979) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (979) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0094] The camera module (980) can capture still images and video. According to one embodiment, the camera module (980) may include one or more lenses, image sensors, image signal processors, or flashes.

[0095] The power management module (988) can manage the power supplied to the electronic device (901). According to one embodiment, the power management module (988) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0096] The battery (989) can supply power to at least one component of the electronic device (901). According to one embodiment, the battery (989) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0097] The communication module (990) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (901) and an external electronic device (e.g., electronic device (902), electronic device (904), or server (908)), and the performance of communication through the established communication channel. The communication module (990) may include one or more communication processors that operate independently of the processor (920) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (990) may include a wireless communication module (992) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (994) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (904) through a first network (998) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (999) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (992) can identify or authenticate the electronic device (901) within a communication network such as the first network (998) or the second network (999) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (996).

[0098] The wireless communication module (992) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. The NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (992) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (992) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (992) can support various requirements specified in the electronic device (901), external electronic device (e.g., electronic device (904)), or network system (e.g., second network (999)). According to one embodiment, the wireless communication module (992) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0099] An antenna module (997) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (997) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (997) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (998) or a second network (999), may be selected from the plurality of antennas, for example, by a communication module (990). A signal or power may be transmitted or received between the communication module (990) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (997).

[0100] According to various embodiments, the antenna module (997) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0101] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0102] According to one embodiment, commands or data may be transmitted or received between the electronic device (901) and an external electronic device (904) through a server (908) connected to a second network (999). Each of the external electronic devices (902, or 904) may be the same or a different type of device as the electronic device (901). According to one embodiment, all or part of the operations performed on the electronic device (901) may be performed on one or more of the external electronic devices (902, 904, or 908). For example, if the electronic device (901) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (901) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (901). The electronic device (901) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (901) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (904) may include an Internet of Things (IoT) device. The server (908) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (904) or the server (908) may be included within a second network (999).The electronic device (901) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0103] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure pertains.

[0104] As described above, the electronic device (300) may include a PCB (301) (printed circuit board). The electronic device (300) may include at least one processor (310) mounted on a surface of the PCB (301) and including a processing circuit. The electronic device (300) may include a shield can (305) disposed on the surface of the PCB (301) to cover the at least one processor (310). The top side (308) of the shield can (305) may define an opening (307) that at least partially overlaps with the at least one processor (310). The electronic device (300) may include a first heat transfer material (315) in contact with the at least one processor (310). The electronic device (300) may include a film (325) disposed on the top side (308) of the first heat transfer material (315) and the shield can (305) to cover the opening (307). The film (325) may include a conductive layer (321) attached to the first heat transfer material (315) and attached to the top side (308) of the shield can (305). The conductive layer (321) may be defined within a portion (420) of the conductive layer (321) that overlaps the opening (307) with a plurality of openings (316) that are at least filled with the second heat transfer material (324). The film (325) may include a coating layer (322) disposed on the conductive layer (321), which includes the second heat transfer material (324).

[0105] The electronic device (300) may include a conductive adhesive layer (320) that attaches the film (325) to each of the first heat transfer material (315) and the top side (308) of the shield can (305) to cover the opening (307).

[0106] The conductive adhesive layer (320) is a conductive adhesive sheet and may include an anti-oxidation material.

[0107] The conductive layer (321) may include: a first conductive layer (351); a second layer (352) contained between the first conductive layer (351) and the conductive adhesive layer (320) to cover a first surface of the first conductive layer (351) and containing an oxide material; and a third layer (353) contained between the first conductive layer (351) and the coating layer (322) to cover a second surface of the first conductive layer (351) opposite to the first surface of the first conductive layer (351) and containing an oxide material.

[0108] The first conductive layer (351) may contain copper, and the second layer (352) and the third layer (353) may contain nickel.

[0109] The second heat transfer material (324) filling the plurality of openings (316) can come into direct contact with the conductive adhesive layer (320).

[0110] The electronic device (300) may include a conductive adhesive layer (320) that attaches the film (325) to a part of the top side (308) of the shield can (305) surrounding the opening (307).

[0111] In one embodiment, the second heat transfer material (324) filling the plurality of openings (316) can come into direct contact with the first heat transfer material (315).

[0112] The first heat transfer material (315) can be hardened from a liquid material.

[0113] The electronic device (300) includes a heat dissipation sheet disposed on the coating layer (322), and the second heat transfer material (324) contained within the coating layer (322) can be pressed by the heat dissipation sheet disposed on the coating layer (322).

[0114] The electronic device (300) may include a vapor chamber (370) disposed on the heat dissipation sheet.

[0115] The second heat transfer material (324) may include silicon.

[0116] The above at least one processor (310) can be mounted on the side (302) of the PCB (301) facing the rear side of the electronic device (300).

[0117] The electronic device (300) includes a display (801) that defines at least a portion of the front side of the electronic device (300), and the at least one processor (310) can be mounted on a surface (802) of the PCB (301) facing the display (801).

[0118] The plurality of openings (316) can be uniformly positioned within the conductive layer (321).

[0119] The conductive layer (321) may further define a plurality of openings (317) within another part (430) of the conductive layer (321) that overlaps with a part of the top side (308) of the shield can (305) surrounding the opening (307).

[0120] The plurality of openings (316) include a first opening (316-1); a second opening (316-2) that is closest to the first opening (316-1) in the horizontal direction (620) and has the same size as the first opening (316-1); and a third opening (316-3) that is closest to the first opening (316-1) in the vertical direction (630) and has the same size as the first opening (316-1), and the angle (610) between a first line (640) connecting the center of the first opening (316-1) and the center of the second opening (316-2) and a second line (650) connecting the center of the first opening (316-1) and the center of the third opening (316-3) may be about 90 degrees.

[0121] The plurality of openings (316) include a first opening (316-1); a second opening (316-2) that is closest to the first opening (316-1) in the horizontal direction (620) and has the same size as the first opening (316-1); and a third opening (316-3) that is closest to the first opening (316-1) in the vertical direction (630) and has the same size as the first opening (316-1), and the angle (610) between a first line (640) connecting the center of the first opening (316-1) and the center of the second opening (316-2) and a second line (650) connecting the center of the first opening (316-1) and the center of the third opening (316-3) may be about 45 degrees.

[0122] The plurality of openings (316) include a first opening (316-1); a second opening (316-2) that is closest to the first opening (316-1) in the horizontal direction (620) and has the same size as the first opening (316-1); and a third opening (316-3) that is closest to the first opening (316-1) in the vertical direction (630) and has the same size as the first opening (316-1), and the angle (610) between a first line (640) connecting the center of the first opening (316-1) and the center of the second opening (316-2) and a second line (650) connecting the center of the first opening (316-1) and the center of the third opening (316-3) may be about 60 degrees.

[0123] The aperture ratio of the conductive layer (321) may be between 20% and 60%.

[0124] The diameter (611) of each of the plurality of openings (316) may be between 200 micrometers and 600 micrometers.

[0125] The diameter (611) of each of the plurality of openings (316) is about 400 micrometers, and the opening ratio of the conductive layer (321) may be about 20%.

[0126] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs.

[0127] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0128] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, each of phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any component (e.g., the first) is referred to as "coupled" or "connected" to another component (e.g., the second), with or without the terms "functionally" or "communicationally," it means that said component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0129] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0130] Various embodiments of the present document may be implemented as software (e.g., program (940)) comprising one or more instructions stored in a storage medium (e.g., internal memory (936) or external memory (938)) readable by a machine (e.g., electronic device (901)). For example, a processor (e.g., processor (920)) of the machine (e.g., electronic device (901)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0131] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0132] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device, PCB (printed circuit board); At least one processor mounted on the surface of the PCB and comprising a processing circuit; A shield can disposed on the surface of the PCB to cover at least one processor, wherein the top side of the shield can defines an opening that overlaps at least partially with the at least one processor; A first heat transfer material in contact with at least one processor; and It includes a film disposed on the top side of the first heat transfer material and the shield can to cover the opening, The above film is, A conductive layer attached to the first heat transfer material and attached to the top side of the shield can, wherein the conductive layer is defined within a portion of the conductive layer that overlaps with the openings, wherein a plurality of openings filled with at least a second heat transfer material are defined; and A coating layer comprising the above-mentioned second heat transfer material and disposed on the above-mentioned conductive layer, Electronic device.

2. In Claim 1, A conductive adhesive layer comprising attaching the film to each of the first heat transfer material and the top side of the shield can to cover the opening, Electronic device.

3. In claim 2, the conductive adhesive layer is, It is a conductive adhesive sheet, and containing antioxidant substances, Electronic device.

4. In claim 2, the conductive layer is, First conductive layer; A second layer comprising an oxide material, which is embedded between the first conductive layer and the conductive adhesive layer to cover a first surface of the first conductive layer; and A third layer comprising an oxide material, which is embedded between the first conductive layer and the coating layer to cover the second surface of the first conductive layer opposite to the first surface of the first conductive layer. Electronic device.

5. In claim 4, the first conductive layer is, Contains copper, The above second layer and the above third layer are, Nickel-containing, Electronic device.

6. In claim 2, the second heat transfer material filling the plurality of openings is, Directly in contact with the conductive adhesive layer, Electronic device.

7. In Claim 1, A conductive adhesive layer comprising attaching the above film to a portion of the top side of the shield can surrounding the opening, Electronic device.

8. In claim 7, the second heat transfer material filling the plurality of openings is, Directly in contact with the first heat transfer material, Electronic device.

9. In claim 1, the first heat transfer material is, Hardened from a liquid substance, Electronic device.

10. In Claim 1, It includes a heat dissipation sheet disposed on the above coating layer, and The second heat transfer material included in the coating layer is, Pressed by the heat dissipation sheet disposed on the coating layer, Electronic device.

11. In Claim 10, A vapor chamber disposed on the heat dissipation sheet, comprising Electronic device.

12. In claim 1, the second heat transfer material is, Containing silicon, Electronic device.

13. In claim 1, the at least one processor is, Mounted on the surface of the PCB facing the rear side of the electronic device, Electronic device.

14. In Claim 1, It includes a display defining at least a portion of the front side of the electronic device, and The above-mentioned at least one processor is, Mounted on the surface of the PCB facing the display, Electronic device.

15. In claim 1, the plurality of openings are, Uniformly located within the above conductive layer, Electronic device.

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