Foldable electronic device comprising heat diffusion member disposed on bracket

Abstract

This foldable electronic device comprises: a foldable housing including a first housing part and a second housing part; a hinge assembly that rotatably connects the first housing part to the second housing part; a printed circuit board disposed in the first housing part; at least one processor mounted on the printed circuit board; a first support member that supports the printed circuit board, the first support member including a first portion and a second portion; a second support member disposed in the second housing part, the second support member including a bonding portion; a heat diffusion member disposed on the first portion of the first support member, the heat diffusion member including a heat transfer member and an elastic member.

Description

Foldable electronic device including a heat diffusion member placed in a bracket

[0001] The present disclosure relates to an electronic device comprising a heat diffusion member disposed in a bracket.

[0002] A foldable electronic device may include a first housing part and a second housing part rotatably coupled to the first housing part. The second housing part may be rotated relative to the first housing part through a hinge mechanism of the foldable electronic device. The foldable electronic device may be in a folded state in which the first housing part and the second housing part are folded. The foldable electronic device may be in an unfolded state in which the first housing part and the second housing part are unfolded.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0004] A foldable electronic device is disclosed. The foldable electronic device may include a foldable housing comprising a first housing part, a second housing part, and a hinge assembly rotatably connecting the first housing part and the second housing part. The foldable electronic device may include a printed circuit board disposed within the first housing part. The foldable electronic device may include at least one processor mounted on the printed circuit board and comprising a processing circuit. The foldable electronic device may include a first support member disposed within the first housing part and supporting the printed circuit board. The first support member may include a first portion that defines a portion of the rear side of the first housing part and is disposed to cover a hinge cover when the foldable electronic device is in an unfolded state. The foldable electronic device may include a second support member disposed within the second housing part. The second support member may include a bonding portion that defines a portion of the rear side of the second housing part and is positioned to cover the hinge cover when the foldable electronic device is in the unfolded state. The foldable electronic device may include a heat diffusion member disposed in the first portion of the first support member. The heat diffusion member may include a heat transfer member configured to transfer heat generated from the at least one processor from the first housing part to the second housing part by contacting the bonding portion of the second support member when the foldable electronic device is in the unfolded state. The heat diffusion member may include an elastic member connecting the heat transfer member and the first portion of the first support member. The elastic member may be compressed so that the bonding portion and the heat transfer member are in firm contact when the foldable electronic device is in the unfolded state.

[0005] A foldable electronic device is disclosed. The foldable electronic device may include a flexible display. The foldable electronic device may include a first housing part and a second housing part. The foldable electronic device may include a hinge assembly that rotatably connects the first housing part and the second housing part. The foldable electronic device may include a printed circuit board disposed within the first housing part. The foldable electronic device may include at least one processor mounted on the printed circuit board and including a processing circuit. The foldable electronic device may include a first support member disposed within the first housing part and supporting the printed circuit board. The first support member may include a first portion that defines a portion of the rear side of the first housing part and is disposed below the hinge assembly when the foldable electronic device is in an unfolded state. The first support member may include a second portion that overlaps with the at least one processor. The foldable electronic device may include a second support member disposed within the second housing part and facing the first portion of the first support member when the foldable electronic device is in the unfolded state. The foldable electronic device may include a heat diffusion member coupled to the first portion of the first support member. The heat diffusion member may include a heat transfer member that thermally connects the first support member and the second support member by contacting the second support member when the foldable electronic device is in the unfolded state. The heat diffusion member may include an elastic member that is fastened to the heat transfer member and fastened to the first portion of the first support member so as to connect the heat transfer member, which is spaced apart from the first portion of the first support member, to the first portion of the first support member.The heat transfer member may be spaced apart from the second support member when the foldable electronic device is in a folded state.

[0006] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0007] FIG. 1 is a plan view of a foldable electronic device comprising at least one processor and a printed circuit board.

[0008] FIG. 2 illustrates the unfolded state of an exemplary electronic device.

[0009] FIG. 3 illustrates the folded state of an exemplary electronic device.

[0010] Figure 4 is a cross-sectional view of A-A' in Figure 2.

[0011] Figure 5 is a cross-sectional view of B-B' in Figure 2.

[0012] Figure 6 is a cross-sectional view of C-C' of Figure 3.

[0013] FIG. 7 is a perspective view of a foldable electronic device including a heat diffusion member.

[0014] FIG. 8 illustrates a state in which a heat diffusion member is combined with a first housing part.

[0015] Fig. 9 is an exploded perspective view of a heat diffusion member.

[0016] FIG. 10 illustrates a portion of a first housing part including a heat diffusion member.

[0017] Fig. 11 is a cross-sectional view of D-D' of Fig. 10.

[0018] FIG. 12 illustrates a part of a first housing part including a heat dissipation sheet.

[0019] FIG. 13 shows the temperature of a foldable electronic device that does not include some components, depending on whether a heat diffusion member and a heat dissipation sheet are included.

[0020] Figure 14 shows the temperature of a foldable electronic device depending on whether a heat diffusion member is included.

[0021] FIG. 15 illustrates a first housing part comprising a heat diffusion member including a portion in contact with a first side wall and a second side wall.

[0022] FIG. 16 is a cross-sectional view of a foldable electronic device including a heat transfer member including a portion in contact with the side of the first portion, cut along the B-B' line of FIG. 2.

[0023] FIG. 17 is a cross-sectional view of a foldable electronic device including other heat diffusion members, cut along the B-B' line of FIG. 2.

[0024] FIG. 18 is a block diagram of an electronic device in a network environment according to various embodiments.

[0025] FIG. 19 illustrates an example of a perspective view of a wearable electronic device according to various embodiments.

[0026] FIG. 20 illustrates one or more hardware disposed within a wearable electronic device according to various embodiments.

[0027] FIG. 21 illustrates a part of a wearable electronic device including a heat diffusion member.

[0028] Hereinafter, embodiments of the present disclosure are described in detail with reference to the drawings so that those skilled in the art can easily practice them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0029] FIG. 1 is a plan view of a foldable electronic device comprising at least one processor and a printed circuit board.

[0030] Referring to FIG. 1, a foldable electronic device (100) may include a housing (110), a hinge assembly (120), a printed circuit board (130), and at least one processor (140).

[0031] The housing (110) may include a first housing part (111) and a second housing part (112). The housing (110) may define the exterior of the foldable electronic device (100). For example, the first housing part (111) may define the top portion of the foldable electronic device (100). For example, the second housing part (112) may define the bottom portion of the foldable electronic device (100). The second housing part (112) may be rotatably coupled to the first housing part (111).

[0032] The housing (110) may provide a space in which components of the foldable electronic device (100) can be placed. For example, at least one processor (140) and a printed circuit board (130) may be placed within the housing (110). For example, the first housing part (111) may include a camera, at least one processor (140), and a printed circuit board (130).

[0033] The hinge assembly (120) may include a gear and a hinge housing. The hinge assembly (120) may be positioned between a first housing part (111) and a second housing part (112). The hinge assembly (120) may be defined to rotatably connect the first housing part (111) and the second housing part (112). For example, the first housing part (111) may be rotated via a gear according to the rotation of the second housing part (112). For example, the second housing part (112) may be rotated via a gear according to the rotation of the first housing part (111). The hinge housing may enclose the gear. The hinge housing may define part of the exterior of the foldable electronic device (100).

[0034] A printed circuit board (130) may be placed within a housing (110). For example, the printed circuit board (130) may be placed within a first housing part (111). For example, the printed circuit board (130) may be placed on a bracket of the first housing part (111). At least one electronic component may be placed on the printed circuit board (130). For example, at least one processor (140) may be placed (or mounted) on the printed circuit board (130). Since the printed circuit board (130) on which at least one processor (140) is placed is placed within the first housing part (111), the first housing part (111) may be referred to as the main housing.

[0035] At least one processor (140) may be disposed within the foldable electronic device (100). For example, at least one processor (140) may be disposed within the first housing part (111). For example, at least one processor (140) may be disposed on a printed circuit board (130). At least one processor (140) may include a processing circuit. At least one processor (140) may be configured to control a display module. For example, at least one processor (140) may be configured to acquire or generate an image to be displayed through the display. Since at least one processor (140) controls other components of the foldable electronic device (100) (e.g., the display module), heat (150) may be generated from at least one processor (140).

[0036] The first housing part (111) and the second housing part (112) can be thermally coupled (or thermally connected). For example, heat (150) from at least one processor (140) of the first housing part (111) can be transferred to the second housing part (112) so that the first housing part (111) and the second housing part (112) can be thermally coupled (or connected).

[0037] When the second housing part (112) is not thermally coupled (or thermally connected) with the first housing part (111) or when the performance of the thermal coupling (or thermal connection) between the first housing part (111) and the second housing part (112) is low, heat (150) from at least one processor (140) of the foldable electronic device (100) may be difficult to spread to the second housing part (112). When the second housing part (112) is not thermally coupled (or thermally connected) with the first housing part (111) or when the performance of the thermal coupling (or thermal connection) between the first housing part (111) and the second housing part (112) is low, heat (150) from at least one processor (140) may increase the temperature of the first housing part (111). When the temperature of the first housing part (111) rises above a certain level, damage or malfunction may occur to the electronic components (or parts) (e.g., camera) contained within the first housing part (111). To reduce the probability of such damage or malfunction, the electronic device (e.g., the foldable electronic device (201) of FIG. 2) described with reference to FIG. 2 through FIG. 18 may include a structure (e.g., the thermal diffusion member (430) of FIG. 5) to strengthen the thermal coupling (or thermal connection) between the first housing part (111) and the second housing part (112).

[0038] Meanwhile, for the usability of the foldable electronic device (100), an electronic device with improved heat dissipation performance may be required. By example, without limitation, heat dissipation performance may be improved by transferring heat generated within the first housing part (111) to the second housing part (112). For example, a structure (e.g., the heat diffusion member (430) of FIG. 5) for diffusing heat (150) generated from at least one processor (140) within the first housing part (111) to the second housing part (112) may be applied to the electronic device to be described with reference to FIG. 2 through FIG. 18.

[0039] FIG. 2 illustrates an unfolded state of an exemplary electronic device. FIG. 3 illustrates a folded state of an exemplary electronic device.

[0040] A foldable electronic device (201) described with reference to FIGS. 2 and 3 may include a foldable housing (200) comprising a first housing part (210), a second housing part (220), and a hinge assembly (250) rotatably connected to the first housing part (210). A foldable electronic device (201) described with reference to FIGS. 2 and 3 may include a flexible display (230) comprising a foldable portion (e.g., a third portion (233)) deformable by a hinge assembly (250) configured to rotate the second housing part (220) with respect to the first housing part (210). However, the foldable electronic device (201) described with reference to FIGS. 2 and 3 is exemplary, and the foldable electronic device (201) may have various foldable form factors.

[0041] A foldable electronic device (201) may include a foldable housing (200) comprising a first housing part (210) and a second housing part (220), and a hinge assembly (250). The first housing part (210) may be rotatably connected to the hinge assembly (250). The first housing part (210) may rotate relative to the second housing part (220) through the hinge assembly (250). The second housing part (220) may be rotatably connected to the hinge assembly (250). The second housing part (220) may rotate relative to the first housing part (210) through the hinge assembly (250).

[0042] The first housing part (210) may include a first front (211), a first rear (212) opposite to the first front (211), and first sides (213) covering at least a portion of the first front (211) and the first rear (212). The first housing part (210) may provide a space for placing components of the foldable electronic device (201).

[0043] The second housing part (220) may include a second front (221), a second rear (222) opposite to the second front (221), and second sides (223) covering at least a portion of the second front (221) and the second rear (222). The second housing part (220) may provide space for placing components of the electronic device (201).

[0044] A hinge assembly (250) may be connected to a first housing part (210) and a second housing part (220), respectively. For example, the hinge assembly (250) may include a first hinge plate and a second hinge plate, which are rotatably configured. The first hinge plate may be connected to the first housing part (210), and the first housing part (210) may be rotated by the first hinge plate. The second hinge plate may be connected to the second housing part (220), and the second housing part (220) may be rotated by the second hinge plate.

[0045] The foldable electronic device (201) can be folded or unfolded along a folding axis (f) passing through a hinge assembly (250) depending on the rotation of the first housing part (210) and the second housing part (220). To allow the foldable electronic device (201) to be folded along the folding axis (f), the hinge assembly (250) can be positioned between the first housing part (210) and the second housing part (220).

[0046] The hinge assembly (250) may include a hinge cover (251) (or hinge housing) for concealing an internal structure that constitutes the mechanism of the hinge assembly (250). The hinge cover (251) may be visible from the outside or concealed by a first housing part (210) and a second housing part (220) depending on the degree to which the foldable electronic device (201) is folded. For example, while the foldable electronic device (201) is in the folded state shown in FIG. 3, the hinge cover (251) may be at least partially exposed through the space between the first housing part (210) and the second housing part (220). For example, while the foldable electronic device (201) is in the unfolded state shown in FIG. 2, the hinge cover (251) may be concealed by the first housing part (210) and the second housing part (220).

[0047] The foldable electronic device (201) may include a flexible display (230). A portion of the flexible display (230) may be folded or unfolded depending on the rotation of the first housing part (210) and / or the rotation of the second housing part (220). For example, the flexible display (230) may include a first part (231) corresponding to the first housing part (210), a second part (232) corresponding to the second housing part (220), and a third part (233) extending from the first part (231) to the second part (232) and configured to be bent by a hinge assembly (250). The third part (233) may be bent when the first housing part (210) and the second housing part (220) are folded. In the unfolded state of the foldable electronic device (201), the first part (231), the second part (232), and the third part (233) may form substantially the same plane. In the folded state of the foldable electronic device (201), the first part (231) and the second part (232) may face each other. The flexible display (230) may be referenced as a surface facing the front of the foldable electronic device (201) in the unfolded state of the foldable electronic device (201).

[0048] The flexible display (230) may be referred to as a foldable display or a flexible display. The first part (231), the second part (232), and the third part (233) may each define a first display area, a second display area, and a third display area of ​​the flexible display (230) where visual information can be displayed.

[0049] The foldable electronic device (201) may include a sub-display (235). When the foldable electronic device (201) is in a folded state, the user can see visual information displayed through the sub-display (235).

[0050] The states of the foldable electronic device (201) are described below. The foldable electronic device (201) may include a plurality of states, including the unfolded state shown in FIG. 2 and the folded state shown in FIG. 3. The foldable electronic device (201) may transform or change in the unfolded state and the folded state. The foldable electronic device (201) may include a plurality of intermediate states between the unfolded state and the folded state. Depending on the state of the foldable electronic device (201), the angle between the first housing part (210) and the second housing part (220) may vary.

[0051] Referring to FIG. 2, in the unfolded state, the first housing part (210) and the second housing part (220) may form a first angle. For example, the first angle may be about 180 degrees. The first part (231), the second part (232), and the third part (233) of the flexible display (230) may form a single substantially flat surface. The direction in which the first front (211) (or the first part (231)) of the first housing part (210) faces and the direction in which the second front (221) (or the second part (232)) of the second housing part (220) faces may be substantially the same.

[0052] Referring to FIG. 3, within the unfolded state of the electronic device (101), the first housing part (210) and the second housing part (220) can be folded to face each other by rotating about a folding axis (f). The first housing part (210) and the second housing part (220) can be folded to form a second angle smaller than a first angle. For example, the second angle may be about 0 degrees. The third part (233) of the flexible display (230) may be bent to correspond to the second angle. The first front surface (211) of the first housing part (210) may face the second front surface (221) of the second housing part (220) or overlap with the second front surface (221). The first housing part (210) and the second housing part (220) may be in contact at least partially, but are not limited thereto. The direction in which the first front (211) of the first housing part (210) faces (e.g., +z direction) and the direction in which the second front (221) of the second housing part (220) faces (e.g., -z direction) may be opposite to each other. In the unfolded state, at least a portion of the flexible display (230) may not be visible from outside the foldable electronic device (201), and the sub-display (235) may be visible from outside the foldable electronic device (201).

[0053] The foldable electronic device (201) of FIGS. 2 and FIGS. 3 can correspond to the electronic device (1801) of FIG. 18.

[0054] Figure 4 is a cross-sectional view of A-A' in Figure 2.

[0055] Referring to FIG. 4, the foldable electronic device (201) may include a first housing part (210), a second housing part (220), and a hinge assembly (250).

[0056] The first housing part (210) may include a first support member (410). At least one processor (440) and a printed circuit board (450) may be disposed within the first housing part (210). The first support member (410) may support components disposed within the first housing part (210).

[0057] The second housing part (220) may include a second support member (420). For example, the second support member (420) may support components disposed within the second housing part (220).

[0058] The first support member (410) may include a first part (411), a second part (412), and a third part (413). The first part (411) may be adjacent to the second housing part (220) when the foldable electronic device (201) is in an unfolded state. For example, the first part (411) may be spaced apart from the second support member (420) when the foldable electronic device (201) is in an unfolded state. The first part (411) may be positioned below the hinge assembly (250) (e.g., in the -z direction) when the foldable electronic device (201) is in an unfolded state. For example, the first part (411) may be positioned to cover the hinge cover (251). The first part (411) may define at least a portion of the rear side of the first housing part (210). For example, the first part (411) may be visible from the outside of the first housing part (210). The second part (412) may overlap with at least one processor (440). For example, the second part (412) may be positioned above (e.g., in the +z direction) at least one processor (440). For example, the second part (412) may be positioned toward at least one processor (440). The third part (413) may extend from the first part (411) to the second part (412). The third part (413) may connect the first part (411) and the second part (412).

[0059] A printed circuit board (450) may be placed on a first rear plate (491). The printed circuit board (450) may accommodate at least one electronic component. For example, at least one electronic component may be placed on the printed circuit board (450). For example, at least one processor (440) may be placed on the printed circuit board (450).

[0060] At least one processor (440) may be placed on a printed circuit board (450). For example, at least one processor (440) may be placed on the printed circuit board (450). For example, at least one processor (440) may be mounted on the printed circuit board (450). At least one processor (440) may include a processing circuit for controlling a foldable electronic device (201). When the foldable electronic device (201) is used, heat may be generated from at least one processor (440).

[0061] Path (499) represents a path for transferring heat (490) generated from at least one processor (440) to a second housing part (220). The foldable electronic device (201) may include a heat diffusion member (430) that thermally connects the first housing part (210) and the second housing part (220) when the foldable electronic device (201) is in an unfolded state. Heat (490) generated by at least one processor (440) may be diffused (or transferred) from the first housing part (210) to the second housing part (220) through the heat diffusion member (430) along the path (499).

[0062] For example, heat (490) generated by at least one processor (440) can be transferred to a second housing part (220) when the foldable electronic device (201) is in an unfolded state. Heat (490) generated by at least one processor (440) can be transferred to a second support member (420) along the path (499). For example, heat (490) generated by at least one processor (440) can be transferred to a second part (412) of a first support member that overlaps at least partially with at least one processor (440). Heat (490) transferred to the second part (412) can be transferred to a third part (413). Heat (490) transferred to the third part (413) can be transferred to a first part (411). The heat (490) transferred to the first part (411) can be transferred to the heat diffusion member (430). The heat (490) transferred to the heat diffusion member can be transferred to the second support member (420).

[0063] Since heat (490) generated from at least one processor (440) disposed within the first housing part (210) is diffused to the second housing part (220) through the heat diffusion member (430), the temperature rise of the first housing part (210) caused by the heat (490) can be reduced. Below, a specific structure of a foldable electronic device (201) including the heat diffusion member (430) is described.

[0064] Figure 5 is a cross-sectional view of B-B' in Figure 2.

[0065] Referring to FIG. 5, the foldable electronic device (201) may include a foldable housing (200), a hinge assembly (250), and a heat diffusion member (430).

[0066] The first housing part (210) may include a first support member (410) and a first rear plate (591). At least one processor (440) and a printed circuit board (450) may be disposed within the first housing part (210). For example, at least one processor (440) may be referred to as a main processor (e.g., the main processor (1821) of FIG. 18) configured to control the operation of the foldable electronic device (201). Since the main processor is disposed within the first housing part (210), the first housing part (210) may be referred to as a main housing.

[0067] The first rear plate (591) of the first housing part (210) can define the appearance of the foldable electronic device (201). For example, the first rear plate (591) can define at least a portion of the rear of the first housing part (210). For example, the first rear plate (591) can be seen from the outside. The first rear plate (591) can be referred to as the first rear plate of FIG. 4 (e.g., the first rear plate (491) of FIG. 4).

[0068] The first support member (410) of the first housing part (210) may be disposed within the first housing part (210). The first support member (410) may accommodate components disposed within the first housing part (210). For example, the first support member (410) may support components disposed within the first housing part (210). For example, the first support member (410) may accommodate a printed circuit board (e.g., the printed circuit board (450) of FIG. 4).

[0069] The first support member (410) may include a first part (411), a second part (412), and a third part (413). The first part (411) may be adjacent to a part of the second housing part (220) (e.g., a bonding part (421)) when the foldable electronic device (201) is in an unfolded state. For example, the first part (411) may be spaced apart from the bonding part (421) when the foldable electronic device (201) is in an unfolded state. The first part (411) may be positioned below the hinge assembly (250) (e.g., in the -z direction) when the foldable electronic device (201) is in an unfolded state. For example, the first part (411) may be positioned to cover the hinge cover (251) when the foldable electronic device (201) is in an unfolded state. The first part (411) may define at least a portion of the rear side of the first housing part (210). For example, the first part (411) may be visible from the outside of the first housing part (210).

[0070] The second part (412) may overlap with at least one processor (440). For example, the second part (412) may be positioned above (e.g., in the +z direction) at least one processor (440). For example, the second part (412) may be positioned toward at least one processor (440).

[0071] The third part (413) can extend from the first part (411) to the second part (412). The third part (413) can connect the first part (411) and the second part (412).

[0072] The second housing part (220) may include a second support member (420) and a second rear plate (592). The second housing part (220) may be referred to as a sub-housing. Electronic components of the foldable electronic device (201) may be placed in the sub-housing. As an example without limitation, the second housing part (220) may include a battery.

[0073] The second rear plate (592) of the second housing part (220) can define the appearance of the foldable electronic device (201). For example, the second rear plate (592) can define at least a portion of the rear of the second housing part (220). For example, the second rear plate (592) can be visible from the outside.

[0074] The second support member (420) may include a bonding portion (421). The bonding portion (421) may face the first portion (411) of the first support member (410) when the foldable electronic device (201) is in an unfolded state. For example, the bonding portion (421) may come into contact with a heat diffusion member (430) disposed on the first support member (410) when the foldable electronic device (201) is in an unfolded state. The bonding portion (421) may define at least a portion of the rear side of the second housing part (220). The bonding portion (421) may be disposed below the hinge assembly (250) when the foldable electronic device (201) is in an unfolded state. For example, the joining portion (421) may be positioned to cover the hinge cover (251) when the foldable electronic device (201) is in an unfolded state.

[0075] The heat diffusion member (430) may include an elastic member (531) and a heat transfer member (532). The heat diffusion member (430) can transfer heat generated inside the first housing part (210) to the second housing part (220). For example, the heat diffusion member (430) can transfer heat generated inside the first housing part (210) to the second housing part (220) through the heat transfer member (532).

[0076] The heat diffusion member (430) may be disposed within the first housing part (210). For example, the heat diffusion member (430) may be disposed in the first part (411). For example, the heat diffusion member (430) may be disposed over the first part (411). The heat diffusion member (430) may be disposed below the hinge assembly (250). The heat diffusion member (430) may be spaced apart from the hinge assembly (250). For example, the heat diffusion member (430) may be spaced apart from the hinge cover (251) of the hinge assembly (250). Because the heat diffusion member (430) is spaced apart from the hinge assembly (250), the heat diffusion member (430) may not interfere with the movement of the components within the hinge assembly (250).

[0077] The first housing part (210) and the second housing part (220) may be asymmetric with respect to the folding axis (f). For example, the first part (411) of the first support member (410) may be asymmetric with respect to the joining part (421) of the second support member (420) with respect to the folding axis (f). For example, because a heat diffusion member (430) is disposed on the first part (411), the first housing part (210) and the second housing part (220) may be asymmetric with respect to the folding axis (f).

[0078] The elastic member (531) can bring the heat transfer member (532) into close contact with the joint portion (421). The elastic member (531) can be positioned on the bottom surface of the first portion (411) (e.g., in the +z direction). The elastic member (531) can be fastened to the first portion (411) of the first support member (410). The elastic member (531) can connect the first portion (411) and the heat transfer member (532). For example, the elastic member (531) can be positioned between the first portion (411) and the heat transfer member (532).

[0079] The elastic member (531) can bring the heat transfer member (532) into close contact with the bonding portion (421) of the second support member (420) when the foldable electronic device (201) is in the unfolded state. For example, the elastic member (531) can be compressed to ensure stable contact between the bonding portion (421) and the heat transfer member (532) when the foldable electronic device (201) is in the unfolded state. The elastic member (531) can be configured to provide movement to the heat transfer member (532) so that the heat transfer member (532) comes into close contact with the second housing part (220) when the foldable electronic device (201) is in the unfolded state. For example, the elastic member (531) can allow movement of the heat transfer member (532) by being compressed when the foldable electronic device (201) is in the unfolded state. For example, the elastic member (531) can allow movement of the heat transfer member (532) by elastically supporting the heat transfer member (532).

[0080] For example, when the foldable electronic device (201) transitions from a folded state to an unfolded state, the bonding portion (421) of the second housing part (220) may press a portion of the heat transfer member (532) facing the second housing part (220). Because a portion of the heat transfer member (532) is pressed, the elastic member (531) may receive a force in the direction of pressing the portion. In response to the force, the elastic member (531) may apply a force in the opposite direction to the direction of pressing the portion of the heat transfer member (532). The force in the opposite direction may be referred to as the restoring force of the elastic member (531). Due to the restoring force of the elastic member (531), the other portion of the heat transfer member (532) that is not in contact with the second bonding portion (421) may move in the opposite direction. As the heat transfer member (532) moves, another part of the heat transfer member (532) may be in close contact with the joint portion (421) of the second support member (420).

[0081] Through the above processes, the heat transfer member (532) is in close contact with the second housing part (220), so the contact area with the second housing part (220) can be increased. Because the contact area with the second housing part (220) is increased, the first housing part (210) can transfer more heat to the second housing part (220). Because more heat from the first housing part (210) can be transferred to the second housing part (220), the foldable electronic device (201) can have improved heat dissipation performance.

[0082] The elastic member (531) may include an elastic material having high elasticity so as to provide a restoring force. For example, the elastic modulus of the elastic member (531) may be higher than the elastic modulus of the heat transfer member (532). For example, the elastic member (531) may include rubber or polyurethane, but the material of the elastic member (531) is not limited thereto.

[0083] The heat transfer member (532) may be positioned above or over the first part (411). For example, the heat transfer member (532) may be spaced apart from the first part (411). For example, the heat transfer member (532) may be connected to an elastic member (531). For example, the heat transfer member (532) may be spaced apart from the first part (411) and fixed above the first part (411) through the elastic member (531). Because the heat transfer member (532) is spaced apart from the first part (411), it may have a high degree of freedom due to the elastic member (531). For example, the heat transfer member (532) may have a high degree of freedom due to the restoring force of the elastic member (531). For example, the heat transfer member (532) may be allowed to move due to the restoring force of the elastic member (531).

[0084] The material of the heat transfer member (532) may require high thermal conductivity to transfer heat generated inside the first housing part (210) to the second housing part (220). For example, the heat transfer member (532) may include a metal material. For example, the heat transfer member (532) may include aluminum or copper.

[0085] The heat diffusion member (430) can transfer heat generated in the first housing part (210) to the second housing part (220) when the foldable electronic device (201) is in an unfolded state. For example, the heat diffusion member (430) can thermally connect (or combine) the first housing part (210) and the second housing part (220). For example, at least one processor (440) of the first housing part (210) can generate heat by a processing circuit. The heat generated by at least one processor (440) can be transferred to the second part (412). The heat transferred to the second part (412) can be transferred to the third part (413) of the first support member (410). The heat transferred to the third part (413) can be transferred to the first part (411). The heat transferred to the first part (411) can be transferred to the heat transfer member (532). The heat transferred to the heat transfer member (532) can be transferred to the joint part (421) of the second support member (420). Since the heat diffusion member (430) transfers the heat generated in the first housing part (210) to the second housing part (220), the heat dissipation performance of the foldable electronic device (201) can be improved.

[0086] The foldable electronic device (201) may include a heat dissipation sheet (550). For example, the heat dissipation sheet (550) may be placed within the first housing part (210). For example, the heat dissipation sheet (550) may be placed under the hinge cover (251). For example, the heat dissipation sheet (550) may be placed under the hinge cover (251) so as not to interfere with the operation of the hinge assembly (250).

[0087] The heat dissipation sheet (550) may be configured to be connected to a heat transfer member (532) so as to transfer heat generated by at least one processor (440) to the heat transfer member (532). For example, the heat dissipation sheet (550) may be placed on a third portion (413) of a first support member (410). For example, the heat dissipation sheet (550) may be placed to be connected to a heat diffusion member (430) placed on a first portion (411) of the first support member (410). For example, the heat dissipation sheet (550) may be placed on a third portion (413) to be in contact with a heat diffusion member (430) placed on a first portion (411).

[0088] The heat dissipation sheet (550) can transfer heat from the first housing part (210) to the second housing part (220). For example, heat generated from at least one processor (440) can be transferred to the first support member (410). The heat transferred to the first support member (410) can be transferred to the heat dissipation sheet (550). The heat transferred to the heat dissipation sheet (550) can be transferred to the heat diffusion member (430). For example, the heat transferred to the heat dissipation sheet (550) can be transferred to the heat transfer member (532) of the heat diffusion member (430). The heat transferred to the heat transfer member (532) can be transferred to the second housing part (220). Since heat from the first housing part (210) can be transferred to the second housing part (220) by the heat dissipation sheet (550), the heat dissipation performance of the foldable electronic device (201) can be improved.

[0089] Figure 6 is a cross-sectional view of C-C' of Figure 3.

[0090] Referring to FIG. 6, the heat diffusion member (430) may protrude beyond the first support member (410) when the foldable electronic device (201) is in the folded state of FIG. 3. For example, the heat diffusion member (430) may protrude beyond the first support member (410) to transfer heat generated in the first housing part (e.g., the first housing part (210) of FIG. 2) to the second housing part (e.g., the second housing part (220) of FIG. 2) when the foldable electronic device (201) is in the unfolded state of FIG. 5. For example, since the heat diffusion member (430) protrudes beyond the first support member (410), it may come into contact with the second housing part (220) when the foldable electronic device (201) is in the unfolded state.

[0091] The heat transfer member (532) may protrude further than the first support member (410) in a direction that contacts the bonding portion (421) of the second support member (420) when the foldable electronic device (201) is in a folded state or when the foldable electronic device (201) is in an unfolded state of FIG. 5. For example, the heat transfer member (532) of the heat diffusion member (430) may protrude further than the first portion (411) of the first support member (410) when the foldable electronic device is in a folded state. For example, the elastic member (531) may be relaxed when in a folded state. The heat transfer member (532) may protrude by the relaxed length of the elastic member. For example, the heat transfer member (532) may protrude further than the first portion (411) due to the relaxed length of the elastic member.

[0092] FIG. 7 is a perspective view of a foldable electronic device including a heat diffusion member.

[0093] Referring to FIG. 7, when the foldable electronic device (201) is in a folded state, the heat diffusion member (430) may be visible from the outside of the foldable electronic device (201). For example, when the foldable electronic device (201) is in a folded state, the heat diffusion member (430) may be visible through the gap between the first housing part (210) and the hinge assembly (250). For example, since the heat diffusion member (430) does not overlap with the hinge assembly (250), it may be visible from the outside of the foldable electronic device (201).

[0094] The first part (e.g., the first part (411) of FIG. 4) of the first support member (e.g., the first support member (410) of FIG. 4) and the heat diffusion member (430) can be seen from the outside of the foldable electronic device (201). Since the first part (411) and the heat diffusion member (430) can be seen from the outside of the foldable electronic device (201), if they are formed of a different material, the aesthetics of the foldable electronic device (201) may be compromised.

[0095] The heat diffusion member (430) may be formed from a material substantially the same as the material of the first support member (410) to enhance the aesthetics of the foldable electronic device (201). For example, the heat diffusion member (430) may be formed from a material substantially the same as the material of the first part of the first support member (410) (e.g., the first part (411) of FIG. 4).

[0096] The heat transfer member (e.g., the heat transfer member (532) of FIG. 5) may include copper. The thermal conductivity of the heat transfer member (532) may be higher when it includes copper compared to when it includes aluminum. The first support member (410) may include aluminum for weight lightening of the foldable electronic device (201). The density of aluminum may be lower than the density of copper. For example, the density of aluminum may be about 2.7 g / cm³. The density of copper may be about 8.96 g / cm³. Since the density of aluminum is lower than the density of copper, the first support member (410) may include aluminum.

[0097] The heat diffusion member (430) may be coated to enhance the aesthetics of the foldable electronic device (201). For example, the heat diffusion member (430) may be coated to look like a surface treatment applied to the first support member (410). For example, the heat diffusion member (430) may be coated when the heat transfer member (532) contains copper. For example, when the heat transfer member (532) contains copper and the first support member (410) contains aluminum, the heat diffusion member (430) may be coated.

[0098] FIG. 8 illustrates a state in which a heat diffusion member is combined with a first housing part.

[0099] Referring to FIG. 8, the first part (411) may include a protrusion (820). As a non-limiting example, the protrusion (820) may be located at the center of the first part (411).

[0100] The first part (411) may have a central region (810). For example, the central region (810) may be defined as an area that overlaps with the protrusion (820). For example, the central region (810) may be defined as an area that includes the protrusion (820).

[0101] The heat diffusion member (430) can be coupled to the first support member (410) of the first housing part (210). For example, the heat diffusion member (430) can be coupled to the first part (411). For example, the heat diffusion member (430) can be placed in the central region (810) of the first part (411) and / or aligned with the central region (810) of the first part (411). For example, the elastic member (531) of the heat diffusion member (430) can be placed in the central region (810) of the first part (411). The elastic member (531) can be contracted by being in close contact with the joint portion (421) of the second support member (420). The elastic member (531) placed in the central region (810) may be more contracted compared to the elastic member (531) placed in a region of the first part (411) different from the central region (810) (e.g., a peripheral region of the first part (411)). For example, when the elastic member (531) is placed in the central region (810), the heat transfer member (532) may also be placed on the central region (810).

[0102] When the heat transfer member (532) is placed on the central region (810), the area of ​​the portion pressed by the joint portion (e.g., the joint portion (421) of FIG. 4) of the second housing part (e.g., the second housing part (220) of FIG. 2) may increase. Because the area of ​​the portion pressed by the joint portion (421) increases, the working force received by the elastic member (531) by the joint portion (421) may increase. The reaction force of the elastic member (531) may increase because the working force increases. Because the reaction force increases, the elastic member (531) placed on the central region (810) may contract further. Because the elastic member (531) placed on the central region (810) contracts further compared to the elastic member (531) not placed on the region, the contact area with the joint portion (421) of the second support member (420) may become wider. For example, the elastic member (531) placed in the central region (810) can be in closer contact with the joint portion (421) of the second support member (420). Since the heat transfer member (532) is in closer contact with the joint portion (421), it can transfer more heat from the first housing part (210) to the second housing part (220). The heat dissipation performance of the foldable electronic device (201) can be improved because more heat from the first housing part (210) is transferred to the second housing part (220).

[0103] The structure of the heat diffusion member (430) shown in FIG. 8 is explained in detail through FIG. 9.

[0104] Fig. 9 is an exploded perspective view of a heat diffusion member.

[0105] Referring to FIG. 9, the heat diffusion member (430) may include an elastic member (531) and a heat transfer member (532).

[0106] The elastic member (531) may define an opening (910). The elastic member (531) may include a projection (920) protruding from the inner surface of the elastic member (531) toward the opening (910). The opening (910) of the elastic member may be coupled with a first part (e.g., the first part (411) of FIG. 5). The elastic member (531) may include another projection (930) protruding from the outer surface of the elastic member (531). The other projection (930) of the elastic member (531) may be coupled with a heat transfer member (532).

[0107] The heat transfer member (532) may define an opening (940). The elastic member (531) may be coupled to the opening (940) of the heat transfer member (532). The heat transfer member (532) may include a groove (950) on the inner surface defining the opening (940) of the heat transfer member (532). The groove (950) of the heat transfer member (532) may be coupled to the elastic member (531). For example, the groove (950) of the heat transfer member (532) may engage with another projection (930) of the elastic member (531). Because the groove (950) of the heat transfer member (532) engages with another projection (930) of the elastic member (531), it may be hook-coupled to the elastic member (531). Since the heat transfer member (532) is hook-coupled to the elastic member (531), the heat transfer member (532) can be prevented from coming off. As a non-limiting example, the elastic member (531) and the heat transfer member (532) can be snap-coupled.

[0108] In the example illustrated in FIG. 9, the heat transfer member is illustrated as including an opening penetrating the heat transfer member, but the heat transfer member according to the present disclosure is not limited thereto. For example, the heat transfer member may include a recess instead of an opening. The recess may be formed by indenting a portion of the front surface of the heat transfer member without penetrating the heat transfer member.

[0109] The heat transfer member (532) can define a recess. For example, the heat transfer member (532) can define a recess in the area defining the opening (940). By defining a recess, the heat transfer member (532) can increase the heat transfer area compared to when defining an opening. For example, the heat transfer member (532) defining a recess can increase the heat transfer area because it includes an additional portion below compared to the heat transfer member (532) defining an opening (940). Because the heat transfer area is increased, the heat transfer member (532) can transfer more heat to the second housing part (e.g., the second housing part (220) of FIG. 2).

[0110] FIG. 10 illustrates a portion of a first housing part including a heat diffusion member. FIG. 11 is a cross-sectional view taken along D-D' of FIG. 10.

[0111] Referring to FIGS. 10 and 11, the heat diffusion member (430) can be coupled to the first part (411) of the first support member (410).

[0112] A first portion (411) of the first support member (410) may include a protrusion (820) that protrudes from the bottom surface of the first support member (410) toward the hinge assembly (250) and is inserted into the opening of the elastic member (531) (e.g., the opening (910) of FIG. 9). The bottom surface may be defined as the surface of the first portion (411) toward the hinge assembly (250).

[0113] The protrusion (820) of the first support member (410) may include a neck portion (1110) and a flange portion (1120). The neck portion (1110) may protrude from the bottom surface of the first support member (410). The neck portion (1110) may have a first width (1111). The neck portion (1110) may come into contact with a projection (920) of the elastic member (531). The flange portion (1120) may be connected to the neck portion (1110). The flange portion (1120) may have a second width (1121) that is wider than the first width (1111). The flange portion (1120) may function as a stopper for the projection (920) of the elastic member (531) that comes into contact with the neck portion (1110). The cross-section of the protrusion (820) may have an I-shaped form. As a non-limiting example, the cross-section of the protrusion (820) may have a T-shaped form. Since the protrusion (820) includes a neck portion (1110) and a flange portion (1120), it can prevent the elastic member (531) from coming off. For example, the neck portion (1110) can be connected to the projection (920) of the elastic member (531). For example, the flange portion (1120) can act as a stopper to prevent the projection (920) of the elastic member (531) from coming off.

[0114] The elastic member (531) may include another projection (930) protruding from the outer surface of the elastic member (531). The other projection (930) of the elastic member (531) may be coupled with the heat transfer member (532). The heat transfer member (532) may include a groove (950) on the inner surface defining the opening (940) of the heat transfer member (532). The groove (950) of the heat transfer member (532) may be coupled with the elastic member (531). For example, the groove (950) of the heat transfer member (532) may engage with the other projection (930) of the elastic member (531). Because the groove (950) of the heat transfer member (532) engages with the other projection (930) of the elastic member (531), it may be hook-coupled with the elastic member (531). Since the heat transfer member (532) is hook-coupled to the elastic member (531), the heat transfer member (532) can be prevented from coming off. As a non-limiting example, the elastic member (531) and the heat transfer member (532) can be snap-coupled.

[0115] FIG. 12 illustrates a part of a first housing part including a heat dissipation sheet.

[0116] Referring to FIG. 12, the first housing part (210) may include a heat dissipation sheet (550).

[0117] A heat dissipation sheet (550) may be placed below the hinge assembly (250). The heat dissipation sheet (550) may be placed on a first portion (411) of a first support member (e.g., the first support member (410) of FIG. 5). For example, the heat dissipation sheet (550) may be placed below a heat diffusion member (430) placed on a first portion (411) of the first support member (e.g., the first support member (410) of FIG. 5). The heat dissipation sheet (550) may be placed so as not to interfere with the operation of the hinge assembly (250). For example, the heat dissipation sheet (550) may be spaced apart from the hinge assembly (250). The heat dissipation sheet (550) may be placed in a substantially central area of ​​the first portion (411). The heat dissipation sheet (550) may be attached below the hinge assembly (250). A heat dissipation sheet (550) may be attached to a first portion (411) of a first support member (410). For example, the heat dissipation sheet (550) may be attached below a heat diffusion member (430) disposed on the first portion (411) of the first support member (410). The heat dissipation sheet (550) may be attached so as not to interfere with the operation of the hinge assembly (250). For example, the heat dissipation sheet (550) may be spaced apart from the hinge assembly (250). The heat dissipation sheet (550) may be attached to a substantially central area of ​​the first portion (411).

[0118] The heat dissipation sheet (550) can transfer heat from the first housing part (210) to the second housing part (e.g., the second housing part (220) of FIG. 2). For example, heat generated from at least one processor (e.g., at least one processor (440) of FIG. 4) can be transferred to the first support member (410). The heat transferred to the first support member (410) can be transferred to the heat dissipation sheet (550). The heat transferred to the heat dissipation sheet (550) can be transferred to the second housing part (220). If the heat dissipation sheet (550) is placed in a substantially central area of ​​the first part (411), the heat transfer efficiency can be increased. For example, heat generated in the first housing part (210) can be concentrated in the central part of the first housing part (210). Since the heat generated in the first housing part (210) is concentrated in the central part of the first housing part (210), the central area of ​​the first part (411) can also receive more heat. Because the central area of ​​the first part (411) can receive more heat, its temperature can rise. When the heat dissipation sheet (550) is placed in the substantially central area of ​​the first part (411), it can transfer more heat to the second housing part (220).

[0119] The heat dissipation sheet (550) may include a graphite sheet. As an example, without limitation, it may include a copper sheet.

[0120] FIG. 13 shows the temperature of a foldable electronic device that does not include some components, depending on whether a heat diffusion member and a heat dissipation sheet are included.

[0121] Referring to FIG. 13, a foldable electronic device that does not include some components may include a support member and a hinge assembly. A foldable electronic device that does not include some components may not include a display module. As an example, but not limited to, it may not include a battery.

[0122] A first foldable electronic device (1310) that does not include some components may not include a heat diffusion member (e.g., the heat diffusion member (430) of FIG. 5). A second foldable electronic device (1320) that does not include some components may include a heat diffusion member (430). A third foldable electronic device (1330) may include both a heat diffusion member (430) and a heat dissipation sheet (e.g., the heat dissipation sheet (550) of FIG. 12).

[0123] Table 1 below shows the results of temperature measurements of a foldable electronic device that does not include some components shown in FIG. 13 when the heater power is 3.6W. The heater power can be referred to as the output of a heat source for applying heat to a foldable electronic device that does not include some components.

[0124] First foldable electronic device (1310) Second foldable electronic device (1320) Third foldable electronic device (1330) Temperature of the first housing part 45.9°C 45.1°C 44.8°C Temperature of the second housing part 30.9°C 31.3°C 31.7°C Temperature difference 15°C 13.8°C 13.1°C Chester power 3.6W

[0125] Referring to Table 1 above, the temperature difference can be defined as the difference between the temperature of the first housing part and the temperature of the second housing part. For example, the temperature difference can be defined as the value obtained by subtracting the temperature of the second housing part from the temperature of the first housing part.

[0126] The temperature difference may be smallest in the third foldable electronic device (1330) which does not include some components. The temperature difference may be largest in the first foldable electronic device (1310) which does not include some components. The smaller the temperature difference, the better the heat dissipation performance of the foldable electronic device which does not include some components. For example, the smaller the temperature difference, the more heat generated in the first housing part can be interpreted as being transferred to the second housing part.

[0127] The temperature difference of the second foldable electronic device (1320) that does not include some components may be smaller than the temperature difference of the first foldable electronic device (1310) that does not include some components. Because the temperature difference of the second foldable electronic device (1320) that does not include some components is smaller than the temperature difference of the first foldable electronic device (1310) that does not include some components, the heat dissipation performance of the second foldable electronic device (1320) that does not include some components may be superior to the heat dissipation performance of the first foldable electronic device (1310) that does not include some components.

[0128] The temperature difference of the third foldable electronic device (1330) that does not include some components may be smaller than the temperature difference of the second foldable electronic device (1320) that does not include some components. Because the temperature difference of the third foldable electronic device (1330) that does not include some components is smaller than the temperature difference of the second foldable electronic device (1320) that does not include some components, the heat dissipation performance of the third foldable electronic device (1330) that does not include some components may be superior to the heat dissipation performance of the second foldable electronic device (1320) that does not include some components.

[0129] Since the heat dissipation performance of the third foldable electronic device (1330) that does not include some components is superior to the heat dissipation performance of the second foldable electronic device (1320) that does not include some components, the heat dissipation performance of the third foldable electronic device (1330) that does not include some components may be superior to the heat dissipation performance of the first foldable electronic device (1310) that does not include some components.

[0130] Figure 14 shows the temperature of a foldable electronic device depending on whether a heat diffusion member is included.

[0131] Referring to FIG. 14, the foldable electronic device may include some components. For example, the foldable electronic device may include a display module. As an example, but not limited to, it may include a battery.

[0132] The first foldable electronic device (1410) may not include a heat diffusion member (e.g., the heat diffusion member (430) of FIG. 5). The second foldable electronic device (1420) may include a heat diffusion member (430).

[0133] Table 2 below shows the temperature measurement results and performance measurement results of the foldable electronic device illustrated in FIG. 14. Referring to Table 2, power@42 can be referenced as the output of the foldable electronic device when the surface temperature of the foldable electronic device is 42°C.

[0134] First foldable electronic device (1410) Second foldable electronic device (1420) Front temperature 45.58°C 44.73°C Rear temperature 43.96°C 43.33°C Temperature difference 10.6°C 9.5°C Front power @ 423.27W 3.42W Rear power @ 423.56W 3.69W

[0135] Referring to Table 2 above, the temperature difference can be defined as the difference between the front temperature of the foldable electronic device and the rear temperature of the foldable electronic device. For example, the temperature difference can be defined as the value obtained by subtracting the rear temperature of the foldable electronic device from the front temperature of the foldable electronic device. The smaller the temperature difference, the better the heat dissipation performance of the foldable electronic device. For example, the smaller the temperature difference, the more evenly the heat generated within the foldable electronic device is distributed.

[0136] Referring to Table 2 above, the second foldable electronic device (1420) may have relatively higher heat dissipation performance compared to the first foldable electronic device (1410). The temperature of the front of the second foldable electronic device (1420) may be lowered by 0.85°C compared to the first foldable electronic device (1410). The temperature of the back of the second foldable electronic device (1420) may be reduced by 0.63°C compared to the first foldable electronic device (1410). The temperature difference between the front and back of the second foldable electronic device (1420) may be reduced by 1.1°C compared to the first foldable electronic device (1410). Since the temperature difference of the second foldable electronic device (1420) is lower than the temperature difference of the first foldable electronic device (1410), the heat generated within the second foldable electronic device (1420) can be seen as being more evenly distributed than the heat generated within the first foldable electronic device (1410).

[0137] The front power@42 of the second foldable electronic device (1420) can be increased by 0.15W compared to the front power@42 of the first foldable electronic device (1410). The rear power@42 of the second foldable electronic device (1420) can be increased by 0.13W compared to the rear power@42 of the first foldable electronic device (1410). Since the front power@42 and rear power@42 of the second foldable electronic device (1420) are increased compared to the first foldable electronic device (1410), the device performance can be improved.

[0138] FIG. 15 illustrates a first housing part comprising a heat diffusion member including a portion in contact with a first side wall and a second side wall.

[0139] Referring to FIG. 15, the first housing part (210) may include first sides (e.g., first sides (213) of FIG. 2) defining the side of the first housing part (210). For example, the first sides (213) may include a first side wall (1510) defining the side of the first housing part (210) and a second side wall (1520) defining the other side of the first housing part (210). As a non-limiting example, the side may alternatively be referred to as a side member. As a non-limiting example, the side may alternatively be referred to as a side portion, but is not limited thereto.

[0140] The heat diffusion member (430) may include an elastic member (531) and a heat transfer member (532). The heat transfer member (532) may be disposed in the first part (411). The heat transfer member (532) may include a portion (1530) in contact with a first side wall (1510) defining a side of the first housing part (210) and a second side wall (1520) defining another side of the first housing part (210). Because the heat transfer member (532) includes a portion (1530) in contact with the first side wall (1510) and the second side wall (1520), the contact area with the second housing part (e.g., the second housing part (220) of FIG. 2) may be increased. The heat transfer member (532) can transfer more heat to the second housing part (220) because the contact area with the second housing part (220) is increased. Since the heat transfer member (532) transfers more heat to the second housing part (220), the heat dissipation performance of the foldable electronic device (201) can be improved.

[0141] FIG. 16 is a cross-sectional view of a foldable electronic device including a heat transfer member including a portion in contact with the side of the first portion, cut along the B-B' line of FIG. 2.

[0142] Referring to FIG. 16, a heat diffusion member (430) may be disposed on the first part (411). The heat diffusion member (430) may include an elastic member (531) and a heat transfer member (532).

[0143] The heat transfer member (532) may include a portion (1630) that protrudes toward the rear side of the first housing part (210) from a side portion (1610) of the heat transfer member (532) that contacts the second support member (420) when the foldable electronic device (201) is in an unfolded state, and contacts the side portion (1620) of the first portion (411) that contacts the second housing part (220). The heat transfer member (532) may have an increased contact area with the second support member (420) due to the portion (1630). Since the contact area with the second support member (420) is increased, the heat transfer member (532) can transfer more heat. The foldable electronic device (201) may have improved heat dissipation performance because the heat transfer member (532) transfers more heat to the second housing part (220).

[0144] FIG. 17 is a cross-sectional view of a foldable electronic device including other heat diffusion members, cut along the B-B' line of FIG. 2.

[0145] Referring to FIG. 17, the foldable electronic device (201) may include a foldable housing (200), a hinge assembly (250), a heat diffusion member (430), and other heat diffusion members (1730).

[0146] The foldable housing (200) may include a first housing part (210) and a second housing part (220). The foldable housing (200) may define the appearance of the foldable electronic device (201).

[0147] The first housing part (210) and the second housing part (220) may be symmetrical with respect to the folding axis (f). For example, the first part (411) of the first support member (410) may be symmetrical with respect to the first part (1721) of the second support member (1720) with respect to the folding axis (f). For example, since a different heat diffusion member (1730) and a heat diffusion member (430) are respectively disposed on the first part (1721) of the second support member (1720) and the first part (411) of the first support member (410), the first housing part (210) and the second housing part (220) may be symmetrical with respect to the folding axis (f).

[0148] The second housing part (220) may include a second support member (1720) and a second rear plate (592). The second housing part (220) may be referred to as a sub-housing. Electronic components of the foldable electronic device (201) may be placed in the sub-housing. As an example without limitation, the second housing part (220) may include a battery.

[0149] The second rear plate (592) of the second housing part (220) can define the appearance of the foldable electronic device (201). For example, the second rear plate (592) can define at least a portion of the rear of the second housing part (220). For example, the second rear plate (592) can be visible from the outside.

[0150] The second support member (1720) may be referred to as the second support member (420) of FIG. 4. The second support member (1720) may include a first part (1721). The first part (1721) may be adjacent to a part of the first housing part (210) (e.g., the first part (411) of the first housing part (210)) when the foldable electronic device (201) is in an unfolded state. For example, the first part (1721) may be spaced apart from the first part (411) of the first housing part (210) when the foldable electronic device (201) is in an unfolded state. The first part (1721) may be positioned below the hinge assembly (250) (e.g., in the -z direction) when the foldable electronic device (201) is in an unfolded state. The first part (1721) may define at least a portion of the rear side of the second housing part (220). For example, the first part (1721) may be visible from the outside of the second housing part (220).

[0151] The other heat diffusion member (1730) may include another elastic member (1731) and another heat transfer member (1732). The other heat diffusion member (1730) can transfer heat generated in the first housing part (210) to the second housing part (220) together with the heat diffusion member (430).

[0152] Another elastic member (1731) can bring another heat transfer member (1732) into close contact with the heat transfer member (532). The other elastic member (1731) can be placed on the bottom surface (e.g., in the +z direction) of the first part (1721) of the second support member (1720). For example, the other elastic member (1731) can be fastened to the first part (1721) of the second support member (1720). The other elastic member (1731) can connect the first part (1721) and the other heat transfer member (1732). For example, the other elastic member (1731) can be placed between the first part (1721) and the other heat transfer member (1732).

[0153] The other elastic member (1731) can bring the other heat transfer member (1732) into close contact with the heat transfer member (532) of the heat diffusion member (430) when the foldable electronic device (201) is in an unfolded state. The other elastic member (1731) may be configured to provide movement to the other heat transfer member (1732) so that the other heat transfer member (1732) comes into close contact with the heat transfer member (532) when the foldable electronic device (201) is in an unfolded state. For example, the other elastic member (1731) may allow movement of the other heat transfer member (1732) by being compressed when the foldable electronic device (201) is in an unfolded state. For example, the other elastic member (1731) may allow movement of the other heat transfer member (1732) by elastically supporting the other heat transfer member (1732).

[0154] For example, when the foldable electronic device (201) transitions from a folded state to an unfolded state, the heat transfer member (532) of the heat diffusion member (430) may press a portion of another heat transfer member (1732) toward the first housing part (210). Because a portion of the other heat transfer member (1732) is pressed, the other elastic member (1731) may receive a force in the direction of pressing the portion. In response to the force, the other elastic member (1731) may apply a force in the opposite direction to the direction of pressing the portion of the other heat transfer member (1732). The force in the opposite direction may be referred to as the restoring force of the other elastic member (1731). Due to the restoring force of the other elastic member (1731), another portion of the other heat transfer member (1732) that is not in contact with the heat transfer member (532) may move in the opposite direction. Following the movement of the other heat transfer member (1732), another part of the other heat transfer member (1732) may be in close contact with the heat transfer member (532) of the heat diffusion member (430).

[0155] Through the above processes, the other heat transfer member (1732) is in close contact with the heat transfer member (532) of the heat diffusion member (430), so the contact area with the heat transfer member (532) of the heat diffusion member (430) can be increased. Because the contact area with the heat transfer member (532) of the heat diffusion member (430) is increased, the first housing part (210) can transfer more heat to the second housing part (220). Because the heat of the first housing part (210) can be transferred more to the second housing part (220), the foldable electronic device (201) can have improved heat dissipation performance.

[0156] The other elastic member (1731) may include an elastic material having high elasticity so as to provide a restoring force. For example, the elastic modulus of the other elastic member (1731) may be higher than the elastic modulus of the other heat transfer member (1732). For example, the other elastic member (1731) may include rubber or polyurethane, but the material of the other elastic member (1731) is not limited thereto.

[0157] Another heat transfer member (1732) may be placed above or over the first part (1721). For example, the other heat transfer member (1732) may be spaced apart from the first part (1721). For example, the other heat transfer member (1732) may be spaced apart from the first part (1721) and connected to another elastic member (1731). For example, the other heat transfer member (1732) may be spaced apart from the first part (1721) and fixed above the first part (1721) through the other elastic member (1731).

[0158] The material of the other heat transfer member (1732) may require high thermal conductivity to transfer heat generated inside the first housing part (210) to the second housing part (220). For example, the other heat transfer member (1732) may include a metal material. For example, the other heat transfer member (1732) may include aluminum or copper.

[0159] Another heat diffusion member (1730) may be thermally connected to the heat diffusion member (430). For example, the other heat diffusion member (1730) may be in contact with the heat diffusion member (430). For example, the other heat transfer member (1732) may be in contact with the heat transfer member (532). Since the heat diffusion member (430) and the other heat diffusion member (1730) include an elastic member (531) and another elastic member (1731), the contact area may be widened. For example, the elastic member (531) and the other elastic member (1731) may improve the positional freedom of the heat transfer member (532) and the other heat transfer member (1732) by being compressed. Since the positional freedom of the heat transfer member (532) and the other heat transfer member (1732) is improved, the contact area may be widened. The foldable electronic device (201) can have improved heat dissipation performance because the contact area between the heat transfer member (532) and another heat transfer member (1732) is widened. For example, at least one processor (440) of the first housing part (210) can generate heat by a processing circuit. The heat generated by at least one processor (440) can be transferred to the second part (412). The heat transferred to the second part (412) can be transferred to the third part (413) of the first support member (410). The heat transferred to the third part (413) can be transferred to the first part (411). The heat transferred to the first part (411) can be transferred to the heat transfer member (532). The heat transferred to the heat transfer member (532) can be transferred to another heat transfer member (1732). Heat transferred to another heat transfer member (1732) can be transferred to a first part (1721) of the second support member (1720). Heat transferred to the first part (1721) can be transferred to the entire second support member (1720). Heat transferred to the second support member (1720) can be transferred to the second housing part (220).Since the heat diffusion member (430) and the other heat diffusion member (1730) transfer heat generated in the first housing part (210) to the second housing part (220), the heat dissipation performance of the foldable electronic device (201) can be improved.

[0160] FIG. 18 is a block diagram of an electronic device in a network environment according to various embodiments.

[0161] Referring to FIG. 18, in a network environment (1800), an electronic device (1801) may communicate with an electronic device (1802) through a first network (1898) (e.g., a short-range wireless communication network) or with at least one of an electronic device (1804) or a server (1808) through a second network (1899) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (1801) may communicate with the electronic device (1804) through a server (1808). According to one embodiment, the electronic device (1801) may include a processor (1820), memory (1830), input module (1850), sound output module (1855), display module (1860), audio module (1870), sensor module (1876), interface (1877), connection terminal (1878), haptic module (1879), camera module (1880), power management module (1888), battery (1889), communication module (1890), subscriber identification module (1896), or antenna module (1897). In some embodiments, at least one of these components (e.g., connection terminal (1878)) may be omitted from the electronic device (1801), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (1876), camera module (1880), or antenna module (1897)) may be integrated into a single component (e.g., display module (1860)).

[0162] The processor (1820) can, for example, execute software (e.g., program (1840)) to control at least one other component (e.g., hardware or software component) of the electronic device (1801) connected to the processor (1820) and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (1820) can store commands or data received from other components (e.g., sensor module (1876) or communication module (1890)) in volatile memory (1832), process the commands or data stored in volatile memory (1832), and store the resulting data in non-volatile memory (1834). According to one embodiment, the processor (1820) may include a main processor (1821) (e.g., a central processing unit or an application processor) or an auxiliary processor (1823) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (1801) includes a main processor (1821) and an auxiliary processor (1823), the auxiliary processor (1823) may be configured to use less power than the main processor (1821) or to be specialized for a specified function. The auxiliary processor (1823) may be implemented separately from the main processor (1821) or as part thereof.

[0163] The auxiliary processor (1823) may control at least some of the functions or states associated with at least one component of the electronic device (1801) (e.g., display module (1860), sensor module (1876), or communication module (1890)) on behalf of the main processor (1821) while the main processor (1821) is in an inactive (e.g., sleep) state, or together with the main processor (1821) while the main processor (1821) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (1823) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (1880) or communication module (1890)). According to one embodiment, the auxiliary processor (1823) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (1801) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (1808)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0164] The memory (1830) may store various data used by at least one component of the electronic device (1801) (e.g., a processor (1820) or a sensor module (1876)). The data may include, for example, input data or output data for software (e.g., a program (1840)) and related commands. The memory (1830) may include volatile memory (1832) or non-volatile memory (1834).

[0165] The program (1840) may be stored as software in memory (1830) and may include, for example, an operating system (1842), middleware (1844), or an application (1846).

[0166] The input module (1850) can receive commands or data to be used for a component of the electronic device (1801) (e.g., processor (1820)) from outside the electronic device (1801) (e.g., user). The input module (1850) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0167] The sound output module (1855) can output a sound signal to the outside of the electronic device (1801). The sound output module (1855) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0168] The display module (1860) can visually provide information to an external (e.g., user) of the electronic device (1801). The display module (1860) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (1860) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0169] The audio module (1870) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (1870) can acquire sound through the input module (1850) or output sound through the sound output module (1855) or an external electronic device (e.g., electronic device (1802)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (1801).

[0170] The sensor module (1876) can detect the operating state of the electronic device (1801) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (1876) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0171] The interface (1877) may support one or more specified protocols that can be used for the electronic device (1801) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (1802)). According to one embodiment, the interface (1877) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0172] The connection terminal (1878) may include a connector through which the electronic device (1801) can be physically connected to an external electronic device (e.g., electronic device (1802)). According to one embodiment, the connection terminal (1878) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0173] The haptic module (1879) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (1879) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0174] The camera module (1880) can capture still images and video. According to one embodiment, the camera module (1880) may include one or more lenses, image sensors, image signal processors, or flashes.

[0175] The power management module (1888) can manage the power supplied to the electronic device (1801). According to one embodiment, the power management module (1888) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0176] The battery (1889) can supply power to at least one component of the electronic device (1801). According to one embodiment, the battery (1889) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0177] The communication module (1890) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (1801) and an external electronic device (e.g., electronic device (1802), electronic device (1804), or server (1808)), and the performance of communication through the established communication channel. The communication module (1890) may include one or more communication processors that operate independently of the processor (1820) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1890) may include a wireless communication module (1892) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (1894) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (1804) via a first network (1898) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (1899) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1892) can identify or authenticate the electronic device (1801) within a communication network such as the first network (1898) or the second network (1899) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (1896).

[0178] The wireless communication module (1892) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (1892) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (1892) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (1892) can support various requirements specified in the electronic device (1801), external electronic device (e.g., electronic device (1804)), or network system (e.g., second network (1899)). According to one embodiment, the wireless communication module (1892) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0179] An antenna module (1897) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (1897) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (1897) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (1898) or a second network (1899), may be selected from the plurality of antennas, for example, by a communication module (1890). A signal or power may be transmitted or received between the communication module (1890) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (1897).

[0180] According to various embodiments, the antenna module (1897) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0181] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0182] According to one embodiment, commands or data may be transmitted or received between the electronic device (1801) and an external electronic device (1804) through a server (1808) connected to a second network (1899). Each of the external electronic devices (1802, or 1804) may be the same or a different type of device as the electronic device (1801). According to one embodiment, all or part of the operations performed on the electronic device (1801) may be performed on one or more of the external electronic devices (1802, 1804, or 1808). For example, if the electronic device (1801) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (1801) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (1801). The electronic device (1801) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (1801) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (1804) may include an Internet of Things (IoT) device. The server (1808) may be an intelligent server using machine learning and / or neural networks.According to one embodiment, an external electronic device (1804) or server (1808) may be included within the second network (1899). The electronic device (1801) may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0183] FIG. 19 illustrates an example of a perspective view of a wearable electronic device according to various embodiments. FIG. 20 illustrates one or more hardware disposed within a wearable electronic device according to various embodiments.

[0184] A wearable electronic device (1900) according to one embodiment may have the form of glasses that are wearable on a part of a user's body (e.g., head). The wearable electronic device (1900) may include a head-mounted display (HMD). For example, the housing of the wearable electronic device (1900) may include a flexible material such as rubber and / or silicone that has a shape that adheres to a part of the user's head (e.g., a part of the face covering both eyes). For example, the housing of the wearable electronic device (1900) may include one or more straps that can be twined around the user's head and / or one or more temples that are attachable to the ears of the head.

[0185] Referring to FIG. 19, a wearable electronic device (1900) according to one embodiment may include at least one display (1950) and a frame supporting at least one display (1950).

[0186] A wearable electronic device (1900) according to one embodiment may be worn on a part of a user's body. The wearable electronic device (1900) may provide augmented reality (AR), virtual reality (VR), or mixed reality (MR) that combines augmented reality and virtual reality to a user wearing the wearable electronic device (1900). For example, the wearable electronic device (1900) may display a virtual reality image provided by at least one optical device (1982, 1984) of FIG. 20 on at least one display (1950) in response to a specified gesture of the user obtained through the motion recognition camera (1960-2, 1960-3) of FIG. 20.

[0187] According to one embodiment, at least one display (1950) may provide visual information to a user. For example, at least one display (1950) may include a transparent or translucent lens. At least one display (1950) may include a first display (1950-1) and / or a second display (1950-2) spaced apart from the first display (1950-1). For example, the first display (1950-1) and the second display (1950-2) may be positioned at locations corresponding to the user's left eye and right eye, respectively.

[0188] Referring to FIG. 20, at least one display (1950) may provide visual information transmitted from external light to a user through a lens included in at least one display (1950) and other visual information distinct from said visual information. The lens may be formed based on at least one of a Fresnel lens, a pancake lens, or a multi-channel lens. For example, at least one display (1950) may include a first surface (1931) and a second surface (1932) opposite to the first surface (1931). A display area may be formed on the second surface (1932) of at least one display (1950). When a user wears the wearable electronic device (1900), external light may be transmitted to the user by being incident on the first surface (1931) and transmitted through the second surface (1932). As another example, at least one display (1950) can display an augmented reality image combined with a virtual reality image provided by at least one optical device (1982, 1984) on a real image transmitted through external light in a display area formed on a second surface (1932).

[0189] In one embodiment, at least one display (1950) may include at least one waveguide (1933, 1934) that diffracts light emitted from at least one optical device (1982, 1984) and transmits it to a user. At least one waveguide (1933, 1934) may be formed based on at least one of glass, plastic, or polymer. A nano pattern may be formed on the exterior or at least a portion of the interior of at least one waveguide (1933, 1934). The nano pattern may be formed based on a polygonal and / or curved grating structure. Light incident on one end of at least one waveguide (1933, 1934) may be propagated to the other end of at least one waveguide (1933, 1934) by the nano pattern. At least one waveguide (1933, 1934) may include at least one diffractive element (e.g., DOE (diffractive optical element), HOE (holographic optical element)) and at least one reflective element (e.g., a reflective mirror). For example, at least one waveguide (1933, 1934) may be placed within a wearable electronic device (1900) to guide a screen displayed by at least one display (1950) to the user's eye. For example, the screen may be transmitted to the user's eye based on total internal reflection (TIR) ​​occurring within at least one waveguide (1933, 1934).

[0190] A wearable electronic device (1900) can analyze an object included in a real-world image collected through a camera (1960-4), combine a virtual object corresponding to an object among the analyzed objects that is the target of augmented reality provision, and display it on at least one display (1950). The virtual object may include at least one of text and an image regarding various information related to the object included in the real-world image. The wearable electronic device (1900) can analyze the object based on a multi-camera such as a stereo camera. For the object analysis, the wearable electronic device (1900) can perform spatial recognition (e.g., SLAM (simultaneous localization and mapping)) using a multi-camera and / or time-of-flight (ToF). A user wearing the wearable electronic device (1900) can view the image displayed on at least one display (1950).

[0191] According to one embodiment, the frame may be formed as a physical structure that allows the wearable electronic device (1900) to be worn on the user's body. According to one embodiment, the frame may be configured so that when the user wears the wearable electronic device (1900), the first display (1950-1) and the second display (1950-2) can be positioned corresponding to the user's left and right eyes. The frame may support at least one display (1950). For example, the frame may support the first display (1950-1) and the second display (1950-2) so that they are positioned corresponding to the user's left and right eyes.

[0192] Referring to FIG. 19, the frame may include a region (1920) in which at least a portion of the frame contacts a part of the user's body when the user wears the wearable electronic device (1900). For example, the region (1920) of the frame in contact with a part of the user's body may include a part of the user's nose, a part of the user's ear, and a part of the side of the user's face that the wearable electronic device (1900) contacts. According to one embodiment, the frame may include a nose pad (1910) that contacts a part of the user's body. When the wearable electronic device (1900) is worn by the user, the nose pad (1910) may contact a part of the user's nose. The frame may include a first temple (1904) and a second temple (1905) that contact a different part of the user's body distinct from the part of the user's body.

[0193] For example, the frame may include a first rim (1901) covering at least a portion of a first display (1950-1), a second rim (1902) covering at least a portion of a second display (1950-2), a bridge (1903) positioned between the first rim (1901) and the second rim (1902), a first pad (1911) positioned along a portion of the edge of the first rim (1901) from one end of the bridge (1903), a second pad (1912) positioned along a portion of the edge of the second rim (1902) from the other end of the bridge (1903), a first temple (1904) extending from the first rim (1901) and fixed to a portion of the wearer's ear, and a second temple (1905) extending from the second rim (1902) and fixed to a portion of the ear opposite to the ear. The first pad (1911) and the second pad (1912) may come into contact with a part of the user's nose, and the first temple (1904) and the second temple (1905) may come into contact with a part of the user's face and a part of the ear. The temples (1904, 1905) may be rotatably connected to the rim through the hinge units (1906, 1907) of FIG. 20. The first temple (1904) may be rotatably connected to the first rim (1901) through a first hinge unit (1906) positioned between the first rim (1901) and the first temple (1904). The second temple (1905) may be rotatably connected to the second rim (1902) through a second hinge unit (1907) disposed between the second rim (1902) and the second temple (1905). According to one embodiment, the wearable electronic device (1900) may identify an external object touching the frame (e.g., a user's fingertip) and / or a gesture performed by said external object by using a touch sensor, a grip sensor, and / or a proximity sensor formed on at least a portion of the surface of the frame.

[0194] According to one embodiment, the wearable electronic device (1900) may include hardware that performs various functions. For example, the hardware may include a battery module (1970), an antenna module (1975), at least one optical device (1982, 1984), speakers (e.g., speakers (1955-1, 1955-2)), a microphone (e.g., microphones (1965-1, 1965-2, 1965-3)), a light-emitting module, and / or a printed circuit board (1990) (e.g., a printed circuit board). Various hardware components may be placed within a frame.

[0195] According to one embodiment, a microphone (e.g., microphones (1965-1, 1965-2, 1965-3)) of a wearable electronic device (1900) may be placed on at least a portion of a frame to acquire a sound signal. A first microphone (1965-1) placed on a bridge (1903), a second microphone (1965-2) placed on a second rim (1902), and a third microphone (1965-3) placed on a first rim (1901) are shown in FIG. 20, but the number and placement of the microphones (1965) are not limited to one embodiment of FIG. 20. If the number of microphones (1965) included in the wearable electronic device (1900) is two or more, the wearable electronic device (1900) may identify the direction of the sound signal using a plurality of microphones placed on different portions of the frame.

[0196] According to one embodiment, at least one optical device (1982, 1984) may project a virtual object onto at least one display (1950) to provide various image information to a user. For example, at least one optical device (1982, 1984) may be a projector. At least one optical device (1982, 1984) may be disposed adjacent to at least one display (1950) or included within at least one display (1950) as part of at least one display (1950). According to one embodiment, a wearable electronic device (1900) may include a first optical device (1982) corresponding to a first display (1950-1) and a second optical device (1984) corresponding to a second display (1950-2). For example, at least one optical device (1982, 1984) may include a first optical device (1982) positioned at the edge of a first display (1950-1) and a second optical device (1984) positioned at the edge of a second display (1950-2). The first optical device (1982) may transmit light to a first waveguide (1933) positioned on the first display (1950-1), and the second optical device (1984) may transmit light to a second waveguide (1934) positioned on the second display (1950-2).

[0197] In one embodiment, the camera (1960) may include a shooting camera (1960-4), an eye tracking camera (ET CAM) (1960-1), and / or a motion recognition camera (1960-2, 1960-3). The shooting camera (1960-4), the eye tracking camera (1960-1), and the motion recognition camera (1960-2, 1960-3) may be positioned at different locations on the frame and may perform different functions. The eye tracking camera (1960-1) may output data indicating the position of the eyes or the gaze of a user wearing the wearable electronic device (1900). For example, the wearable electronic device (1900) may detect the gaze from an image containing the user's pupils obtained through the eye tracking camera (1960-1).

[0198] A wearable electronic device (1900) can identify an object focused by a user (e.g., a real object, and / or a virtual object) by using the user's gaze acquired through an eye-tracking camera (1960-1). The wearable electronic device (1900), having identified the focused object, can perform a function (e.g., gaze interaction) for interaction between the user and the focused object. The wearable electronic device (1900) can represent a portion corresponding to the eyes of an avatar representing the user in a virtual space by using the user's gaze acquired through the eye-tracking camera (1960-1). The wearable electronic device (1900) can render an image (or screen) displayed on at least one display (1950) based on the position of the user's eyes.

[0199] For example, the visual quality of a first region related to the gaze within an image and the visual quality of a second region distinct from the first region (e.g., resolution, brightness, saturation, grayscale, PPI (pixels per inch)) may differ from each other. The wearable electronic device (1900) may acquire an image having the visual quality of the first region and the visual quality of the second region that match the user's gaze by using foveated rendering. For example, if the wearable electronic device (1900) supports an iris recognition function, user authentication may be performed based on iris information acquired using an eye-tracking camera (1960-1). An example in which the eye-tracking camera (1960-1) is positioned toward the user's right eye is illustrated in FIG. 20, but the embodiment is not limited thereto, and the eye-tracking camera (1960-1) may be positioned solely toward the user's left eye or toward both eyes.

[0200] In one embodiment, the camera (1960-4) can capture a real image or background to be matched with a virtual image in order to implement augmented reality or mixed reality content. The camera (1960-4) can be used to acquire high-resolution images based on HR (high resolution) or PV (photo video). The camera (1960-4) can capture an image of a specific object located at the position viewed by the user and provide the image to at least one display (1950). The at least one display (1950) can display a single image in which information regarding a real image or background including the image of the specific object acquired using the camera (1960-4) and a virtual image provided through at least one optical device (1982, 1984) are superimposed. The wearable electronic device (1900) can compensate for depth information (e.g., distance between the wearable electronic device (1900) and an external object obtained through a depth sensor) using an image obtained through a shooting camera (1960-4). The wearable electronic device (1900) can perform object recognition using an image obtained through a shooting camera (1960-4). The wearable electronic device (1900) can perform a function of focusing on an object (or subject) within an image (e.g., auto focus) and / or an optical image stabilization (OIS) function (e.g., anti-shake function) using a shooting camera (1960-4). The wearable electronic device (1900) can perform a pass-through function to display an image obtained through a shooting camera (1960-4) superimposed on at least a portion of the screen while displaying a screen representing a virtual space on at least one display (1950). In one embodiment, the camera (1960-4) may be placed on a bridge (1903) positioned between the first rim (1901) and the second rim (1902).

[0201] A gaze tracking camera (1960-1) can achieve more realistic augmented reality by tracking the gaze of a user wearing a wearable electronic device (1900), thereby matching the user's gaze with visual information provided to at least one display (1950). For example, when the user looks straight ahead, the wearable electronic device (1900) can naturally display environmental information related to the user's front at the location where the user is situated on at least one display (1950). The gaze tracking camera (1960-1) may be configured to capture an image of the user's pupil to determine the user's gaze. For example, the gaze tracking camera (1960-1) may receive a gaze detection light reflected from the user's pupil and track the user's gaze based on the position and movement of the received gaze detection light. In one embodiment, the gaze tracking camera (1960-1) may be positioned at locations corresponding to the user's left and right eyes. For example, the eye-tracking camera (1960-1) may be positioned within the first rim (1901) and / or the second rim (1902) to face the direction in which the user wearing the wearable electronic device (1900) is located.

[0202] A motion recognition camera (1960-2, 1960-3) can provide a specific event to a screen provided on at least one display (1950) by recognizing the movement of the user's entire body or part thereof, such as the user's torso, hands, or face. A motion recognition camera (1960-2, 1960-3) can recognize the user's gesture, acquire a signal corresponding to the gesture, and provide a display corresponding to the signal to at least one display (1950). A processor can identify the signal corresponding to the gesture and, based on the identification, perform a designated function. A motion recognition camera (1960-2, 1960-3) can be used to perform spatial recognition functions using SLAM and / or depth maps for a 6-degrees-of-freedom pose (6 dof pose). A processor can use the motion recognition camera (1960-2, 1960-3) to perform gesture recognition functions and / or object tracking functions. In one embodiment, a motion recognition camera (1960-2, 1960-3) may be placed on the first rim (1901) and / or the second rim (1902).

[0203] The camera (1960) included within the wearable electronic device (1900) is not limited to the eye-tracking camera (1960-1) and motion recognition camera (1960-2, 1960-3) described above. For example, the wearable electronic device (1900) can identify external objects included within the FoV by using a camera positioned toward the user's FoV. The identification of external objects by the wearable electronic device (1900) can be performed based on a sensor for identifying the distance between the wearable electronic device (1900) and the external object, such as a depth sensor and / or a time of flight (ToF) sensor. The camera (1960) positioned toward the FoV may support an autofocus function and / or an optical image stabilization (OIS) function. For example, the wearable electronic device (1900) may include a camera (1960) (e.g., a face tracking camera) positioned toward the face to acquire an image including the face of a user wearing the wearable electronic device (1900).

[0204] Although not illustrated, according to one embodiment, a wearable electronic device (1900) may further include a light source (e.g., LED) that emits light toward a subject (e.g., user's eye, face, and / or an object outside the FoV) being photographed using a camera (1960). The light source may include an LED of infrared wavelength. The light source may be placed in at least one of a frame and hinge units (1906, 1907).

[0205] According to one embodiment, the battery module (1970) can supply power to the electronic components of the wearable electronic device (1900). In one embodiment, the battery module (1970) may be placed within the first temple (1904) and / or the second temple (1905). For example, the battery module (1970) may be a plurality of battery modules (1970). The plurality of battery modules (1970) may each be placed in the first temple (1904) and the second temple (1905), respectively. In one embodiment, the battery module (1970) may be placed at the end of the first temple (1904) and / or the second temple (1905).

[0206] The antenna module (1975) can transmit a signal or power to the outside of the wearable electronic device (1900) or receive a signal or power from the outside. In one embodiment, the antenna module (1975) may be placed within the first temple (1904) and / or the second temple (1905). For example, the antenna module (1975) may be placed close to one side of the first temple (1904) and / or the second temple (1905).

[0207] The speaker (1955) can output an acoustic signal to the outside of the wearable electronic device (1900). The acoustic output module may be referred to as the speaker. In one embodiment, the speaker (1955) may be placed within a first temple (1904) and / or a second temple (1905) to be placed adjacent to the ear of a user wearing the wearable electronic device (1900). For example, the speaker (1955) may include a second speaker (1955-2) placed adjacent to the user's left ear by being placed within the first temple (1904), and a first speaker (1955-1) placed adjacent to the user's right ear by being placed within the second temple (1905).

[0208] A light-emitting module (not shown) may include at least one light-emitting element. The light-emitting module may emit light of a color corresponding to a specific state or emit light with an action corresponding to a specific state in order to visually provide information regarding a specific state of the wearable electronic device (1900) to the user. For example, if the wearable electronic device (1900) requires charging, it may emit red light at a constant frequency. In one embodiment, the light-emitting module may be placed on the first rim (1901) and / or the second rim (1902).

[0209] Referring to FIG. 20, a wearable electronic device (1900) according to one embodiment may include a printed circuit board (PCB) (1990). The PCB (1990) may be included in at least one of a first temple (1904) or a second temple (1905). The PCB (1990) may include an interposer disposed between at least two sub-PCBs. On the PCB (1990), one or more hardware components included in the wearable electronic device (1900) (e.g., hardware components illustrated by different blocks in FIG. 19) may be disposed. The wearable electronic device (1900) may include a flexible PCB (FPCB) for interconnecting the hardware components.

[0210] According to one embodiment, a wearable electronic device (1900) may include at least one of a gyroscope sensor, a gravity sensor, and / or an acceleration sensor for detecting the posture of the wearable electronic device (1900) and / or the posture of a body part (e.g., head) of a user wearing the wearable electronic device (1900). Each of the gravity sensor and the acceleration sensor may measure gravitational acceleration and / or acceleration based on designated three-dimensional axes (e.g., x-axis, y-axis, and z-axis) that are perpendicular to each other. The gyroscope sensor may measure the angular velocity of each of the designated three-dimensional axes (e.g., x-axis, y-axis, and z-axis). At least one of the gravity sensor, the acceleration sensor, and the gyroscope sensor may be referred to as an inertial measurement unit (IMU). According to one embodiment, the wearable electronic device (1900) can identify a user's motion and / or gesture performed to execute or stop a specific function of the wearable electronic device (1900) based on an IMU.

[0211] FIG. 21 illustrates a part of a wearable electronic device including a heat diffusion member.

[0212] The description of the foldable electronic device (e.g., the foldable electronic device (201) of FIG. 2) provided with reference to FIG. 1 through 17 may also be applied to the wearable electronic device (1900) of FIG. 19 through 21 in substantially the same, similar, or corresponding manner.

[0213] For example, the heat diffusion member (2130) may be disposed on at least one temple. For example, the heat diffusion member (2130) may be disposed on a first temple (e.g., the first temple (1904) of FIG. 19) or a second temple (1905). For example, the heat diffusion member (2130) disposed on the first temple (1904) may be in contact with the first rim (e.g., the first rim (1901) of FIG. 19) and spaced apart from the first hinge unit (e.g., the first hinge unit (1906) of FIG. 19). For example, the heat diffusion member (2130) disposed on the second temple (1905) may be in contact with the second rim (1902) and spaced apart from the second hinge unit (1907).

[0214] The heat diffusion member (2130) may include a heat transfer member (2132) and an elastic member (2131). The heat transfer member (2132) may be configured to transfer heat generated in the second temple (1905) to the second rim (1902) when the wearable electronic device (1900) is in an unfolded state.

[0215] As a non-limiting example, the heat diffusion member (2130) may include a heat transfer member (2132) and an elastic member (2131). The heat transfer member (2132) may be configured to transfer heat generated in the first temple (1904) to the first rim (1901) when the wearable electronic device (1900) is in an unfolded state.

[0216] The heat diffusion member (2130) may include an elastic member (2131). The elastic member (2131) may connect the heat transfer member (2132) and the second temple (1905). The elastic member (2131) may be compressed to ensure stable contact with the second rim (1902) when the wearable electronic device (1900) is in an unfolded state.

[0217] As a non-limiting example, the elastic member (2131) may connect the heat transfer member (2132) and the first temple (1904). The elastic member (2131) may be compressed to ensure stable contact with the first rim (1901) when the wearable electronic device (1900) is in an unfolded state.

[0218] The heat diffusion member (2130) can transfer heat generated in the second temple (1905) to the second rim (1902). For example, the heat diffusion member (2130) can transfer heat generated from at least one electronic component placed in the second temple (1905) to the second rim (1902).

[0219] For example, heat generated by at least one electronic component can be transferred to the second rim (1902) when the wearable electronic device (1900) is in an unfolded state. For example, heat generated by at least one electronic component can be diffused to the second temple (1905). Heat diffused to the second temple (1905) can be transferred to the heat transfer member (2132) when the wearable electronic device (1900) is in an unfolded state. Heat transferred to the heat transfer member (2132) can be transferred to the second rim (1902).

[0220] As a non-limiting example, heat generated by at least one electronic component may be transferred to the first rim (1901) when the wearable electronic device (1900) is in an unfolded state. For example, heat generated by at least one electronic component may be diffused to the first temple (1904). Heat diffused to the first temple (1904) may be transferred to the heat transfer member (2132) when the wearable electronic device (1900) is in an unfolded state. Heat transferred to the heat transfer member (2132) may be transferred to the first rim (1901).

[0221] Since heat generated in the first temple (1941) (or second temple (1905)) can be transferred to the first rim (1901) (or second rim (1902)) by the heat diffusion member (2130), the heat dissipation performance of the wearable electronic device (1900) can be improved.

[0222] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure pertains.

[0223] A foldable electronic device (201) is disclosed. The foldable electronic device (201) may include a foldable housing (200) comprising a first housing part (210), a second housing part (220), and a hinge assembly (250) that rotatably connects the first housing part (210) and the second housing part (220). The foldable electronic device (201) may include a printed circuit board (450) disposed within the first housing part (210). The foldable electronic device (201) may include at least one processor (440) mounted on the printed circuit board (450) and comprising a processing circuit. The foldable electronic device (201) may include a first support member (410) disposed within the first housing part (210) and supporting the printed circuit board (450). The first support member (410) may include a first portion (411) that defines a portion of the rear side of the first housing part (210) and is positioned to cover the hinge cover (251) when the foldable electronic device (201) is in an unfolded state. The foldable electronic device (201) may include a second support member (420) positioned within the second housing part (220). The second support member (420) may include a bonding portion (421) that defines a portion of the rear side of the second housing part (220) and is positioned to cover the hinge cover (251) when the foldable electronic device (201) is in an unfolded state. The foldable electronic device (201) may include a heat diffusion member (430) positioned in the first portion (411) of the first support member (410).The heat diffusion member (430) may include a heat transfer member (532) configured to transfer heat generated in the at least one processor (440) from the first housing part (210) to the second housing part (220) by contacting the bonding portion (421) of the second support member (420) when the foldable electronic device (201) is in the unfolded state. The heat diffusion member (430) may include an elastic member (531) connecting the heat transfer member (532) and the first portion (411) of the first support member (410). The elastic member (531) may be compressed so that the bonding portion (421) and the heat transfer member (532) are in firm contact when the foldable electronic device (201) is in the unfolded state.

[0224] The heat generated by the above at least one processor (440) can be transferred to the first part (411) of the first support member (410). The heat transferred to the heat transfer member (532) can be transferred to the second support member (420) when the foldable electronic device (201) is in the unfolded state.

[0225] The elastic member (531) of the heat diffusion member (430) can bring the heat transfer member (532) of the heat diffusion member (430) into close contact with the joint portion (421) of the second support member (420) when the foldable electronic device (201) is in an unfolded state.

[0226] The elastic member (531) of the heat diffusion member (430) may be configured to provide movement to the heat transfer member (532) of the heat diffusion member (430) so that when the foldable electronic device (201) is in an unfolded state, the heat transfer member (532) of the heat diffusion member (430) is in close contact with the joint portion (421) of the second support member (420).

[0227] The elastic member (531) of the heat diffusion member (430) may be placed within the central region (810) of the first part (411) of the first support member (410).

[0228] The above foldable electronic device (201) may further include a heat dissipation sheet (550) disposed within a first housing part (210) and configured to be connected to a heat transfer member (532) so as to transfer heat generated by the at least one processor (440) to the heat transfer member (532).

[0229] The elastic member (531) of the heat diffusion member (430) may include a protrusion (920) that defines an opening (910) and protrudes into the opening (910) from the inner surface of the elastic member (531) that defines the opening (910). The first part (411) of the first support member (410) may include a protrusion (820) that protrudes from the bottom surface of the first support member (410) toward the hinge assembly (250) and is inserted into the opening (910). The protrusion (820) may include a neck portion (1110) that protrudes from the bottom surface of the first support member (410), has a first width (1111), and contacts the protrusion (920) of the elastic member (531) of the heat diffusion member (430). The above protrusion (820) may include a flange portion (1120) that is connected to the neck portion (1110), has a second width (1121) wider than the first width (1111), and functions as a stopper for the projection (920) of the elastic member (531) that contacts the neck portion (1110).

[0230] The elastic member (531) of the heat diffusion member (430) may include another projection (930) protruding from the outer surface of the elastic member (531).

[0231] The heat transfer member (532) of the heat diffusion member (430) may include a groove (950) that engages with the other projection (930) of the elastic member (531) of the heat diffusion member (430) on the inner surface that defines the opening (940) of the heat transfer member (532) of the heat diffusion member (430).

[0232] The first portion (411) of the first support member (410) may be asymmetric with respect to the joining portion (421) of the second support member (420) with respect to the folding axis of the foldable electronic device (201).

[0233] The heat transfer member (532) of the heat diffusion member (430) may protrude beyond the first part (411) of the first support member (410) when the foldable electronic device (201) is in a folded state.

[0234] The above heat diffusion member (430) can be seen from the outside of the foldable electronic device (201) when the foldable electronic device (201) is in a folded state.

[0235] The heat transfer member (532) of the heat diffusion member (430) may include a portion (1530) in contact with a first side wall (1510) defining a side of the first housing part (210) and a second side wall (1520) defining another side of the first housing part (210).

[0236] The heat transfer member (532) of the heat diffusion member (430) may include a portion (1630) that protrudes toward the rear side of the first housing part (210) from a side portion (1610) of the heat transfer member (532) that contacts the second support member (420) when the foldable electronic device (201) is in an unfolded state, and contacts the side portion (1620) of the first portion (411) of the first support member (410) that faces the second housing part (220).

[0237] The elastic modulus of the elastic member (531) of the heat diffusion member (430) may be higher than the elastic modulus of the heat transfer member (532) of the heat diffusion member (430).

[0238] The heat transfer member (532) of the heat diffusion member (430) may include a metal material.

[0239] A foldable electronic device (201) is disclosed. The foldable electronic device (201) may include a flexible display (230). The foldable electronic device (201) may include a foldable housing (200) comprising a first housing part (210) and a second housing part (220). The foldable electronic device (201) may include a hinge assembly (250) that rotatably connects the first housing part (210) and the second housing part (220). The foldable electronic device (201) may include a printed circuit board (450) disposed within the first housing part (210). The foldable electronic device (201) may include at least one processor (440) mounted on the printed circuit board (450) and comprising a processing circuit. The foldable electronic device (201) may include a first support member (410) disposed within the first housing part (210) and supporting the printed circuit board (450). The first support member (410) may include a first portion (411) that defines a portion of the rear side of the first housing part (210) and is disposed below the hinge assembly (250) when the foldable electronic device (201) is in an unfolded state. The first support member (410) may include a second portion (412) that overlaps with the at least one processor (440). The foldable electronic device (201) may include a second support member (420) disposed within the second housing part (220). The above foldable electronic device (201) may include a heat diffusion member (430) coupled to the first portion (411) of the first support member (410).The above-mentioned heat diffusion member (430) may include a heat transfer member (532) that thermally connects the first support member (410) and the second support member (420) by contacting the second support member (420) when the foldable electronic device (201) is in the unfolded state. The above-mentioned heat diffusion member (430) may include an elastic member (531) that is fastened to the heat transfer member (532) and fastened to the first part (411) of the first support member (410) so as to connect the heat transfer member (532), which is spaced apart from the first part (411) of the first support member (410), to the first part (411) of the first support member (410). The heat transfer member (532) can be separated from the second support member (420) when the foldable electronic device (201) is in a folded state.

[0240] The heat generated by the at least one processor (440) can be transferred to the first part (411) of the first support member (410). The heat transferred to the first part (411) of the first support member (410) can be transferred to the heat transfer member (532). The heat transferred to the heat transfer member (532) can be transferred to the second support member (420) when the foldable electronic device (201) is in the unfolded state.

[0241] The elastic member (531) of the heat diffusion member (430) can bring the heat transfer member (532) of the heat diffusion member (430) into close contact with the second support member (420) when the foldable electronic device (201) is in an unfolded state.

[0242] The elastic member (531) of the heat diffusion member (430) may be configured to provide movement to the heat transfer member (532) of the heat diffusion member (430) so that the heat transfer member (532) of the heat diffusion member (430) is in close contact with the second support member (420) when the foldable electronic device (201) is in an unfolded state.

[0243] The elastic member (531) of the heat diffusion member (430) may be placed within the central region (810) of the first part (411) of the first support member (410).

[0244] A wearable electronic device (1900) is disclosed. The wearable electronic device (1900) may include a display (1950). The wearable electronic device (1900) may include a rim (1901; 1902) coupled to the outer surface of the display (1950). The wearable electronic device (1900) may include at least one temple (1904; 1905) rotatably connected to the rim (1901; 1902). The wearable electronic device (1900) may include a hinge unit (1906; 1907) rotatably connecting the at least one temple (1904; 1905) to the rim (1901; 1902). The wearable electronic device (1900) may include a heat diffusion member (2130) disposed on at least one temple (1904; 1905). The heat diffusion member (2130) may include a heat transfer member (2132) configured to transfer heat generated in the at least one temple (1904; 1905) to the rim (1901; 1902) when the wearable electronic device (1900) is in an unfolded state. The heat diffusion member (2130) may include an elastic member (2131) connecting the heat transfer member (2132) and the at least one temple (1904; 1905). The elastic member (2131) can be compressed so that the rim (201; 202) and the heat transfer member (2132) are in tight contact when the wearable electronic device (1900) is in the unfolded state.

[0245] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs.

[0246] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0247] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0248] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0249] Various embodiments of the present document may be implemented as software (e.g., program (1840)) comprising one or more instructions stored in a storage medium (e.g., internal memory (1836) or external memory (1838)) readable by a machine (e.g., electronic device (1801)). For example, a processor (e.g., processor (1820)) of the machine (e.g., electronic device (1801)) may call at least one of the one or more instructions stored from the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0250] According to one embodiment, the method according to the various embodiments disclosed herein may be provided as included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0251] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In a foldable electronic device, A foldable housing comprising a first housing part, a second housing part, and a hinge assembly rotatably connecting the first housing part and the second housing part; A printed circuit board disposed within the first housing part; At least one processor mounted on the above printed circuit board and comprising a processing circuit; A first support member disposed within the first housing part and supporting the printed circuit board, wherein the first support member includes a first portion that defines a portion of the rear side of the first housing part and is disposed to cover a hinge cover when the foldable electronic device is in an unfolded state; A second support member disposed within the second housing part, wherein the second support member includes a joining portion that defines a portion of the rear side of the second housing part and is disposed to cover the hinge cover when the foldable electronic device is in the unfolded state; and It includes a heat diffusion member disposed in the first portion of the first support member, and The above-mentioned heat diffusion member is, A heat transfer member configured to transfer heat generated in the at least one processor from the first housing part to the second housing part by contacting the bonding portion of the second support member when the foldable electronic device is in the unfolded state, and The apparatus includes an elastic member connecting the heat transfer member and the first portion of the first support member, wherein the elastic member is compressed such that the bonding portion and the heat transfer member are in firm contact when the foldable electronic device is in the unfolded state. Foldable electronic device.

2. In Paragraph 1, The above-mentioned foldable electronic device is, A heat dissipation sheet further comprising a heat dissipation sheet disposed within the first housing part and configured to be connected to a heat transfer member to transfer heat generated by the at least one processor to the heat transfer member. Foldable electronic device.

3. In Paragraph 1, The heat generated by the above at least one processor is, It is transmitted to the first part of the first support member, and The heat transferred to the heat transfer member is, When the above foldable electronic device is in the above unfolded state, the second support member is transmitted, Foldable electronic device.

4. In Paragraph 1, The elastic member of the above-mentioned heat diffusion member is, When the above-described foldable electronic device is in the above-described unfolded state, the heat transfer member of the heat diffusion member is brought into close contact with the joint portion of the second support member. Foldable electronic device.

5. In Paragraph 1, The elastic member of the above-mentioned heat diffusion member is, When the above-described foldable electronic device is in the above-described unfolded state, the heat transfer member of the heat diffusion member is configured to provide movement to the heat transfer member of the heat diffusion member so that the heat transfer member of the heat diffusion member is in close contact with the bonding portion of the second support member. Foldable electronic device.

6. In Paragraph 1, The elastic member of the above-mentioned heat diffusion member is, disposed within the central region of the first part of the first support member, Foldable electronic device.

7. In Paragraph 1, The elastic member of the above-mentioned heat diffusion member is, Defines an opening, and includes a projection protruding from the inner surface of the elastic member defining the opening into the opening. The first portion of the first support member is, It includes a protrusion that protrudes from the bottom surface of the first support member toward the hinge assembly and is inserted into the opening, The above protrusion is, A neck portion protruding from the bottom surface of the first support member, having a first width, and contacting the projection of the elastic member of the heat diffusion member, and A flange portion connected to the neck portion, having a second width wider than the first width, and functioning as a stopper for the projection of the elastic member in contact with the neck portion. Foldable electronic device.

8. In Paragraph 1, The elastic member of the above-mentioned heat diffusion member is, It includes other protrusions protruding from the outer surface of the elastic member, and The heat transfer member of the above-mentioned heat diffusion member is, Defines an opening, and includes a groove on the inner surface defining the opening of the heat transfer member of the heat diffusion member that engages with the other projection of the elastic member of the heat diffusion member. Foldable electronic device.

9. In Paragraph 1, The first portion of the first support member is, Asymmetric with respect to the folding axis of the foldable electronic device, with respect to the joining portion of the second support member, Foldable electronic device.

10. In Paragraph 1, The heat transfer member of the above-mentioned heat diffusion member is, When the above-mentioned foldable electronic device is in a folded state, the first portion of the first support member protrudes more than the first portion of the first support member. Foldable electronic device.

11. In Paragraph 1, The above-mentioned heat diffusion member is, When the above-mentioned foldable electronic device is in a folded state, it can be seen from the outside of the above-mentioned foldable electronic device. Foldable electronic device.

12. In Paragraph 1, The heat transfer member of the above-mentioned heat diffusion member is, A portion comprising a first side wall defining a side of the first housing part and a portion in contact with a second side wall defining another side of the first housing part. Foldable electronic device.

13. In Paragraph 1, The heat transfer member of the above-mentioned heat diffusion member is, When the above-described foldable electronic device is in the unfolded state, it protrudes toward the rear side of the first housing part from the side portion of the heat transfer member that contacts the second support member, and includes a portion that contacts the side portion of the first part of the first support member facing the second housing part. Foldable electronic device.

14. In Paragraph 1, The elastic modulus of the elastic member of the above-mentioned heat diffusion member is, Higher than the elastic modulus of the heat transfer member of the above heat diffusion member, Foldable electronic device.

15. In Paragraph 1, The heat transfer member of the above-mentioned heat diffusion member is, including metal material, Foldable electronic device.

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