Electronic device including cover and antenna module arranged inside opening in sidewall

Abstract

This electronic device comprises: a frame including a sidewall that defines a portion of a side surface of the electronic device; an antenna module which is disposed inside the electronic device, overlaps the opening in the sidewall when viewed in the direction of the sidewall, and comprises a substrate and a plurality of antennas disposed on one surface, which faces the sidewall, of the substrate; and a cover that is disposed inside the opening and faces the antenna module. The cover includes: a base including a non-conductive material; and one or more conductive ribs supported by the base and arranged in relation to the plurality of antennas.

Description

Electronic device including a cover and an antenna module disposed within an opening in the side wall

[0001] The present disclosure relates to an electronic device comprising a cover and an antenna module disposed within an opening of a side wall.

[0002] The electronic device may include one or more antenna modules for wireless communication with an external electronic device. For example, the electronic device may include an antenna module for 5G communication. The antenna module can meet the performance requirements of 5G communication through beamforming, which focuses a signal in a specific direction. For example, the antenna module may include a mmWave module.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0004] An electronic device is disclosed. The electronic device may include a frame comprising a sidewall that defines a portion of the side of the electronic device. The sidewall may define an opening. The electronic device may include an antenna module disposed within the electronic device and positioned to overlap the opening of the sidewall when viewed from the sidewall. The antenna module may include a substrate and a plurality of antennas disposed on one surface of the substrate facing the sidewall. The electronic device may include a cover disposed within the opening and facing the antenna module. The cover may include a base comprising a non-conductive material and one or more conductive ribs supported by the base and arranged in relation to the plurality of antennas.

[0005] An electronic device is disclosed. The electronic device may include a wireless communication circuit. The electronic device may include a frame including a sidewall that defines a portion of the side of the electronic device. The electronic device may include an antenna module disposed within the electronic device. The antenna module may include a substrate and a plurality of antennas disposed on the substrate. The sidewall may include a base formed of a non-conductive material, and one or more conductive ribs supported by the base, comprising a first conductive rib, a second conductive rib, and a third conductive rib. The plurality of antennas may include a first antenna facing a first portion of the base between the first conductive rib and the second conductive rib, and a second antenna facing a second portion of the base between the second conductive rib and the third conductive rib.

[0006] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0007] FIG. 2 is a front view of an electronic device according to one embodiment.

[0008] FIG. 3 is a rear view of an electronic device according to one embodiment.

[0009] FIGS. 4 and FIGS. 5 illustrate an antenna module according to one embodiment.

[0010] FIG. 6 is a cross-sectional view of the antenna module cut along line A-A' of FIG. 4.

[0011] FIG. 7 illustrates a cover that is joined to an opening in the side wall.

[0012] Figure 8 is a cross-sectional view of an electronic device cut along the B-B' line of Figure 2.

[0013] Fig. 9 is a side view of the cover of Fig. 8.

[0014] Figure 10 is a plan view of the cover of Figure 8.

[0015] FIG. 11 is a side view of a cover including one or more conductive ribs located within a base.

[0016] FIG. 12 is a cross-sectional view of an electronic device including the cover of FIG. 11.

[0017] FIG. 13 illustrates an electronic device according to a comparative example.

[0018] FIG. 14 illustrates a non-conductive part included in the electronic device of FIG. 13.

[0019] FIG. 15 illustrates the side wall of an electronic device according to a comparative example.

[0020] FIG. 16 illustrates a side wall according to one embodiment.

[0021] FIG. 17 illustrates a heat map of an electronic device according to a comparative example for RF signals on a first frequency band.

[0022] FIG. 18 illustrates a heat map of an electronic device according to one embodiment for RF signals on a first frequency band.

[0023] FIG. 19 illustrates a heat map of an electronic device according to a comparative example for RF signals on a second frequency band.

[0024] FIG. 20 illustrates a heat map of an electronic device according to one embodiment for RF signals on a second frequency band.

[0025] FIG. 21 is a plan view of a cover including one or more conductive ribs that overlap with a plurality of antennas.

[0026] FIG. 22 is a plan view of a cover including one or more inclined conductive ribs.

[0027] FIG. 23 illustrates a part of an electronic device according to one embodiment.

[0028] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0029] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0030] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0031] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence is performed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0032] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0033] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0034] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0035] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0036] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0037] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0038] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0039] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0040] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0041] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0042] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0043] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0044] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0045] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0046] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0047] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0048] According to one embodiment, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0049] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0050] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0051] FIG. 2 is a front view of an electronic device according to one embodiment. FIG. 3 is a rear view of an electronic device according to one embodiment.

[0052] Referring to FIG. 2, an electronic device according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include an antenna module (200) (e.g., the antenna module (197) of FIG. 1) for wireless communication with an external electronic device.

[0053] According to one embodiment, at least one processor (e.g., processor (120) of FIG. 1) may be configured to communicate with an external electronic device using an antenna module (200). According to one embodiment, the electronic device (101) may include a printed circuit board (201) on which at least one processor (120) and a wireless communication circuit (e.g., wireless communication module (192) of FIG. 1) are placed. The printed circuit board (201) may be electrically connected to the antenna module (200). For example, the electronic device (101) may include a connecting member (e.g., flexible printed circuit board (240)) for electrically connecting the printed circuit board (201) and the antenna module (200).

[0054] According to one embodiment, an antenna module (200) may be disposed within an electronic device (101). The antenna module (200) may include a substrate (210) electrically connected to a wireless communication circuit (192) and a plurality of antennas (220) configured to radiate electromagnetic waves. The substrate (210) may be electrically connected to a printed circuit board (201) on which the wireless communication circuit (192) is disposed via a flexible printed circuit board (240). For example, the electronic device (101) may include a display (e.g., the display (202) of FIG. 2) that defines at least a portion of the front surface of the electronic device (101) (e.g., the surface of the electronic device (101) facing the +z direction). Referring to FIG. 3, the electronic device (101) may include a rear plate (e.g., rear plate (203) of FIG. 3) that defines at least a portion of the rear surface of the electronic device (101) (e.g., the surface of the electronic device (101) facing the -z direction). The electronic device (101) may include a frame (310) disposed between the display (202) and the rear plate (203) to surround the space between the display (202) and the rear plate (203). The frame (310) may include a side wall (311) that defines at least a portion of the side surface of the electronic device (101). An antenna module (200) may be disposed within the internal space of the electronic device (101) defined by the display (202), the rear plate (203), and the frame (310). The frame (310) may be referred to as a side member.

[0055] According to one embodiment, at least a portion of the antenna module (200) may be accommodated within a bracket (230). For example, the substrate (210) of the antenna module (200) may be accommodated within the bracket (230). The bracket (230) may be coupled to a support portion (e.g., the support portion (820) of FIG. 8) disposed within the electronic device (101). For example, the support portion (820) may support components (e.g., electronic components) disposed within the electronic device (101). For example, a printed circuit board (201) may be placed on the support portion (820) and supported by the support portion (820). The bracket (230) accommodating the antenna module (200) may be fixed at a designated location within the electronic device (101) by being coupled to the support portion (820).

[0056] According to one embodiment, the antenna module (200) may include a mmWave module capable of supporting a high frequency band (e.g., a mmWave (millimeter wave) band). The mmWave module may be used to transmit and / or receive signals on a millimeter wave frequency band (e.g., about 24 GHz or higher). The mmWave module can improve the communication performance of the electronic device (101) by providing high-speed data transmission and a wide bandwidth.

[0057] As described above, since at least a portion of the front of the electronic device (101) is defined by the display (202), when the antenna module (200) is positioned to face the front of the electronic device (101), the radiation pattern formed by the antenna module (200) may be electromagnetically interfered with by the electrically conductive material of the display (202). For example, the performance of the antenna module (200) may be reduced as the conductive layer contained within the display (202) affects the radiation pattern. When a user holds and uses the electronic device (101) with their hand, the rear plate (203) may come into contact with the user's hand. At least a portion of the rear of the electronic device (101) may be obscured by the user's hand. When the antenna module (200) is positioned to face the rear of the electronic device (101), the radiation pattern formed by the antenna module (200) may be obscured by the user's hand, and thus the performance of the antenna module (200) may be reduced. According to one embodiment, the antenna module (200) may be positioned to face the side of the electronic device (101). For example, the antenna module (200) within the electronic device (101) may be positioned to face the side wall (311) of the frame (310). Because the antenna module (200) is positioned to face the side wall (311), the radiation pattern formed by the antenna module (200) may be formed toward the side of the electronic device (101). The antenna module (200) may be configured to transmit and / or receive RF (radio frequency) signals through the radiation pattern formed toward the side.

[0058] The structure of an antenna module (200) configured to transmit and / or receive RF signals in the mmWave band is described below.

[0059] FIGS. 4 and FIGS. 5 illustrate an antenna module according to one embodiment. FIG. 6 is a cross-sectional view of the antenna module taken along line A-A' of FIG. 4.

[0060] FIGS. 4 and FIGS. 5 illustrate an example of the structure of an antenna module (200) described with reference to FIG. 2. FIG. 4 is a perspective view of the antenna module (200) viewed from above, and FIG. 5 is a perspective view of the antenna module (200) viewed from below.

[0061] Referring to FIG. 4, the antenna module (200) may include a substrate (210) and a plurality of antennas (220). For example, the plurality of antennas (220) may include, but are not limited to, a first antenna (221), a second antenna (222), a third antenna (223), a fourth antenna (224), and / or a fifth antenna (225). The plurality of antennas (220) may be arranged side by side on a first surface (211) of the substrate (210). For example, the plurality of antennas (220) may be arranged in the y-axis direction of FIG. 4. Each antenna of the plurality of antennas (220) may be referred to as an antenna element, a patch antenna, or a conductive patch.

[0062] According to one embodiment, the substrate (210) may include one or more conductive layers and a plurality of non-conductive layers stacked alternately with the one or more conductive layers. The substrate (210) may provide electrical connections between various electronic components disposed on the substrate (210) and / or outside the substrate (210) using wirings and conductive vias formed in the conductive layers. According to one embodiment, the substrate (210) may include a first surface (211) facing in one direction (e.g., +x direction) and a second surface (212) opposite to the first surface (211).

[0063] According to one embodiment, a plurality of antennas (220) may be configured to form a directional beam. A plurality of antennas (220) may be disposed on a first surface (211) of a substrate (210). A plurality of antennas (220) may all have the same shape, or each may have a different shape. A plurality of antennas (220) may be arranged for the directionality of the directional beam. An antenna module (200) may form a beam with high directivity through the arrangement of a plurality of antennas (220) and a polarization beam radiated from each of the plurality of antennas (220), and may be configured to communicate using said beam.

[0064] Referring to FIGS. 5 and 6, a radio frequency integrated circuit (RFIC) (301) and a power management IC (PMIC) (302) may be disposed on a second surface (212) of a substrate (210). For example, at least one processor (e.g., processor (120) of FIG. 1) may generate a baseband signal. The baseband signal may be up-converted into a signal of a specified frequency band through the RFIC (301). The up-converted signal may be filtered through a radio frequency front end module (RFFE) and radiated outside of the electronic device (101) through an antenna module (200). For example, a signal received from an external electronic device through the antenna module (200) may be pre-processed through the RFFE. The RFIC (301) may down-convert the pre-processed radio signal into a baseband signal so that the signal can be processed by at least one processor (120). The down-converted signal may be provided to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) placed on a printed circuit board (e.g., a printed circuit board (201) of FIG. 1) and at least one processor (120).

[0065] According to one embodiment, the RFIC (301) can up-convert an IF signal obtained from an IFIC (intermediate frequency integrate circuit) into an RF signal on a selected band during transmission. The RFIC (301) can down-convert an RF signal obtained through an antenna array into an IF signal and transmit it to the IFIC during reception.

[0066] According to one embodiment, the PMIC (302) receives voltage from a printed circuit board (e.g., the printed circuit board (201) of FIG. 2) and can provide the necessary power to electronic components (e.g., RFIC (301)) placed on the board (210).

[0067] According to one embodiment, the RFIC (301) and the PMIC (302) may be covered by a shielding member (303). The shielding member (303) may be disposed on a second surface (212) of the substrate (210) to electromagnetically shield at least one of the RFIC (301) or the PMIC (302). For example, the shielding member (303) may include a shield can.

[0068] According to one embodiment, a connector (304) may be disposed on a second surface (212) of a substrate (210). A flexible printed circuit board may be connected to the connector (304) to provide an electrical connection between the printed circuit board (201) and the antenna module (200). Through the flexible printed circuit board connected to the connector (304), the RFIC (301) and / or PMIC (302) of the antenna module (200) may be electrically connected to the printed circuit board (201).

[0069] According to one embodiment, a plurality of antennas (220) can support beamforming technology and can form a directional beam to transmit and / or receive a signal in the mmWave band. A directional beam can be referred to as an area within a radiation pattern where radio wave energy is concentrated in a specific direction. An electronic device (101) can form a directional beam by using elements such as a phase shifter and a power amplifier to have a main lobe of the radiation pattern in a designated direction and by minimizing or reducing the side lobes.

[0070] Since the antenna module (200) transmits and / or receives a signal using the beam, the coverage of the antenna module (200) may be based on the beam. Because the directional beam is formed by being concentrated in a specific direction, it can enable high-speed data transmission and cover a relatively long distance, but may have relatively low coverage. An electronic device (e.g., the electronic device (101) of FIG. 2) may include a structure for controlling the radiation pattern of the antenna module (200). If the structure is formed on the side wall (e.g., the side wall (311) of FIG. 3) of a frame (e.g., the frame (310) of FIG. 3), the manufacturing process of the electronic device (101) becomes complex, and the defect rate may increase due to tolerances caused during the manufacturing process.

[0071] An electronic device (101) according to one embodiment can improve the performance of an antenna module (200) by controlling the beam of the antenna module (200) using a cover (700) positioned to face the antenna module (200), rather than a structure formed on the side wall (311) of the frame (310). The cover (700) may be implemented as part of the side wall (311) of the frame (310). An example in which the cover (700) is implemented as part of the frame (310) will be described later with reference to FIG. 23. The cover (700) (e.g., side wall) may include one or more conductive ribs (720). For example, one or more conductive ribs (720) of the cover (700) can improve the coverage of the antenna module (200).

[0072] Below, a structure for improving the performance of the antenna module (200) is described.

[0073] FIG. 7 illustrates a cover that is joined to an opening in the side wall.

[0074] Referring to FIG. 7, the side wall (311) of the frame (310) may define a portion of the side of the electronic device (101). For example, the side wall (311) may define a portion of the side of the electronic device (101) facing the +x direction.

[0075] For the rigidity of the electronic device (101), the side wall (311) may include a metal material. For example, the side wall (311) may include aluminum or titanium, but the material of the side wall (311) is not limited thereto. As described above, an antenna module (200) disposed within the electronic device (101) may be disposed so as to face the side wall (311) of the electronic device (101) so that a radiation pattern formed from a plurality of antennas (220) faces the side of the electronic device (101). Since the side wall (311) includes a metal material, a structure for the radiation pattern may be defined within the side wall (311) so that the radiation pattern is not blocked by the side wall (311).

[0076] According to one embodiment, an opening (312) may be defined within the side wall (311). For example, the opening (312) may penetrate the side wall (311). An antenna module (200) placed within the electronic device (101) may be positioned to overlap at least partially with the opening (312). For example, when viewed vertically from the side wall (311), the antenna module (200) may overlap with the opening (312) of the side wall (311). A plurality of antennas (220) of the antenna module (200) may overlap with the opening (312). Because the plurality of antennas (220) overlap with the opening (312), the radiation pattern formed from the plurality of antennas (220) may not be obscured by the side wall (311) through the opening (312).

[0077] According to one embodiment, the antenna module (200) may include a substrate (210) and a plurality of antennas (220). The substrate (210) may be electrically connected to a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1). The antenna module (200) including a plurality of antennas (220) may be referred to as an array antenna.

[0078] For example, the antenna module (200) may include five antennas having a 1×5 array configured to form the beam (e.g., a first antenna (221), a second antenna (222), a third antenna (223), a fourth antenna (224), and a fifth antenna (225), but the number of multiple antennas (220) is not limited thereto. The antenna module (200) may form the beam using a combination of at least some of the multiple antennas (220). Since the beam formed by the multiple antennas (220) has strong linearity, the antenna module (200) may be positioned to face a direction that facilitates the transmission and / or reception of a signal. As described above, the antenna module (200) may be positioned such that the multiple antennas (220) face the side of the electronic device (101) (e.g., the +x direction). The beam formed from the multiple antennas (220) is of the side It can be formed in a direction (e.g., +x direction). The antenna module (200) can be configured to receive a signal from an external electronic device and / or transmit a signal to an external electronic device using the beam.

[0079] An electronic device (101) according to one embodiment may include a cover (700) for improving the performance of an antenna module (200). For example, the cover (700) may be placed within an opening (312). The cover (700) placed within the opening (312) may be placed to face an antenna module (200) that is positioned to face the opening (312). The cover (700) inserted within the opening (312) may define another part of the side of the electronic device (101) by filling the opening (312). The cover (700) may be referred to as a decorative member, a non-conductive part, or a non-conductive deco.

[0080] According to one embodiment, the cover (700) may include a base (710) and a conductive rib. The base (710) may include a non-conductive material. For example, the base (710) may include resin, but the material of the base (710) is not limited thereto. Because the base (710) includes a non-conductive material, the base (710) may not electromagnetically interfere with the directional beam formed by the plurality of antennas (220) and RF signals transmitted and / or received through the plurality of antennas (220).

[0081] According to one embodiment, the conductive rib may be a single conductive rib formed integrally, or it may include one or more conductive ribs. For example, one or more conductive ribs (720) may be used to improve the performance of the antenna module (200). For example, one or more conductive ribs (720) may be supported by a base (710). One or more conductive ribs (720) may include a metal material. One or more conductive ribs (720) may be referred to as one or more metal ribs. One or more conductive ribs (720) supported by the base (710) may be arranged in relation to a plurality of antennas (220). For example, one or more conductive ribs (720) may be arranged in relation to a plurality of antennas (220) to cause scattering of electromagnetic waves to extend the coverage of the antenna module (200). Alternatively, one or more conductive ribs (720) may be arranged in relation to a plurality of antennas (220) to improve the directionality of the radiation pattern. Various arrangement structures between one or more conductive ribs (720) and the plurality of antennas (220) will be described later with reference to FIG. 21 and FIG. 22.

[0082] According to one embodiment, since the cover (700) disposed within the opening (312) of the side wall (311) includes one or more conductive ribs (720), the electronic device (101) can improve the performance of the antenna module (200) through the cover (700) having a simple structure.

[0083] For example, if a mechanical pattern for expanding coverage or improving the directionality of the radiation pattern is formed within the sidewall (311), the mechanical pattern may be formed in relation to a plurality of antennas (220). For a slim electronic device (101), if the sidewall (311) has a thin thickness, the manufacturing process of the electronic device (101) for forming the mechanical pattern on the sidewall (311) may be complex and difficult. If the mechanical pattern is formed within the thin sidewall (311), a weakening of the rigidity of the electronic device (101) due to the mechanical pattern may occur.

[0084] For example, the mechanical pattern formed within the thin side wall (311) can be easily broken or damaged by external impact. To form the mechanical pattern, the size of the open area of ​​the side wall (311) facing the antenna module (200) may be reduced, and as the size is reduced, the communication performance of the antenna module (200) may be reduced. An electronic device (101) according to one embodiment may improve the performance or directionality of the antenna module (200) by using a cover (700) placed within the opening (312) of the side wall (311) instead of the mechanical pattern formed in the side wall (311). For example, as shown in FIG. 7, the opening (312) and the cover (700) may each have a simple shape, so the manufacturing process of the electronic device (101) can be simplified. Because the process is simplified, the defect rate caused during the manufacturing process of the electronic device (101) can be reduced. Since no separate mechanical pattern is formed on the side wall (311), the aforementioned weakening of rigidity can be reduced. Since the opening (312) has a simple shape, it can be easy to secure the size of the opening (312).

[0085] Below, specific structures of the cover (700) for improving the performance of the antenna module (200) are described.

[0086] FIG. 8 is a cross-sectional view of the electronic device cut along the B-B' line of FIG. 2. FIG. 9 is a side view of the cover of FIG. 8. FIG. 10 is a top view of the cover of FIG. 8.

[0087] Referring to FIG. 8, the electronic device (101) may include a supporting portion (820) and a non-conductive portion (810).

[0088] As described above, the support portion (820) can support components (e.g., printed circuit board (201), camera, or battery) placed within the electronic device (101). The support portion (820) may include a metal material so as to have high rigidity. The support portion (820) may be at least partially wrapped by a frame (310).

[0089] According to one embodiment, a non-conductive portion (810) may be positioned between the side wall (311) and the support portion (820) to connect the side wall (311) of the frame (310) and the support portion (820). The non-conductive portion (810) may be formed by placing the support portion (820) and the frame (310) into a mold and injecting a non-conductive material. The non-conductive portion (810) may be referred to as an injection portion or a molded portion.

[0090] According to one embodiment, the non-conductive portion (810) may include a recess (821) that supports a cover (700) disposed within the opening (312). For example, the recess (821) may be connected to the opening (312). The cover (700) may be inserted into the opening (312) and supported by the recess (821) of the non-conductive portion (810). Since the electronic device (101) according to one embodiment includes a cover (700) disposed within the opening (312) rather than a mechanical pattern formed on the side wall (311), it may not involve a reduction in the thickness of the opening (312) caused during the process of forming the mechanical pattern. For example, the thickness of the opening (312) (e.g., length in the z-axis direction) may substantially correspond to the thickness of the recess (821).

[0091] According to one embodiment, a bracket (230) that accommodates a substrate (210) of an antenna module (200) may be seated on a support portion (820) and a non-conductive portion (810). For example, the bracket (230) and the non-conductive portion (810) may include a seating portion having a shape corresponding to the shape of the bracket (230) so that the bracket (230) may be seated thereon, and the bracket (230) may be seated on said seating portion. The bracket (230) may be fixed to the support portion (820) and / or the non-conductive portion (810). For example, the bracket (230) may support the antenna module (200) by being fixed to the support portion (820) and / or the non-conductive portion (810) through a fixing member (e.g., a screw).

[0092] According to one embodiment, the substrate (210) may be accommodated within a bracket (230). A plurality of antenna modules (200) may be disposed on one side of the substrate (210) facing the side wall (311) (e.g., the first side (211)). A plurality of antennas (220) may be configured to radiate electromagnetic waves when fed by a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1). In order for the electromagnetic waves to be radiated outside the electronic device (101), the plurality of antennas (220) may overlap with the opening (312) of the side wall (311).

[0093] According to one embodiment, the base (710) may include a first part (711) and a second part (712). For example, the first part (711) may be positioned facing the interior of the electronic device (101). From the perspective of facing the interior of the electronic device (101), the first part (711) may be referred to as an inner part. For example, the second part (712) may be referred to as a part facing the exterior of the electronic device (101). From the perspective of facing the exterior of the electronic device (101), the second part (712) may be referred to as an outer part.

[0094] For example, the first part (711) and the second part (712) can be distinguished according to their material.

[0095] According to one embodiment, one or more conductive ribs (720) may be disposed on the first part (711) among the first part (711) and the second part (712). The first part (711) may include one or more grooves (830) on which one or more conductive ribs (720) are disposed. For example, the one or more grooves (830) may include only one groove or may include a plurality of grooves. Each groove of the one or more grooves (830) may correspond to each conductive rib of the one or more conductive ribs (720). For example, the grooves (830) may be formed on the surface of the first part (711) using laser direct structuring (LDS) technology, which forms patterns using a laser. By plating a metal material within the grooves (830) of the first part (711), one or more conductive ribs (720) disposed within one or more grooves (830) may be formed. For example, each conductive rib of one or more conductive ribs (720) may be disposed within the corresponding groove among one or more grooves (830). The first part (711) may include a material suitable for LDS. For example, the first part (711) may include ABS (acrylonitrile butadiene styrene), polyamide, or PPA (polyphthalamide) suitable for LDS, but the material of the first part (711) is not limited thereto.

[0096] According to one embodiment, the second part (712) may be in contact with the first part (711). The second part (712), which is positioned to face the outside of the electronic device (101), may be exposed to the outside through an opening (312) of the side wall (311). Since the second part (712) is exposed to the outside, it may include a material having high rigidity. For example, the second part (712) may include polycarbonate, but the material of the second part (712) is not limited thereto. Alternatively, the second part (712) may include a material to have an appearance (e.g., color or texture) similar to the side wall (311).

[0097] According to one embodiment, one or more conductive ribs (720) may be disposed on one side of a first part (711). For example, the first part (711) may include a first side (811) facing the interior of the electronic device (101) and a second side (812) opposite to the first side (811). For example, the second part (712) may include a third side (813) in contact with the first side (811) of the first part (711) and a fourth side (814) opposite to the third side (813). The fourth side (814) of the second part (712) may be exposed to the outside of the electronic device (101) through an opening (312). For example, the fourth side (814) may define a side of the electronic device (101) together with a side wall (311). The fourth surface (814) corresponding to the outer surface of the cover (700) may be substantially flat. One or more conductive ribs (720) may be disposed on at least one of the first surface (811) or the second surface (812) of the first part (711). As illustrated in FIG. 8, one or more conductive ribs (720) may be disposed on the first surface (811) of the first part (711). As one or more conductive ribs (720) are disposed on the first surface (811), the distance between the plurality of antennas (220) disposed on one surface of the substrate (210) (e.g., the first surface (211) of FIG. 4) and the one or more conductive ribs (720) (e.g., the first distance (D1) of FIG. 8) may be relatively shorter than the distance between the plurality of antennas (220) and the one or more conductive ribs (720) (e.g., the second distance (D2) of FIG. 12) when one or more conductive ribs (720) are disposed on the second surface (812).

[0098] Referring to FIG. 9, as one or more conductive ribs (720) are disposed on the first surface (811) of the first part (711), one or more conductive ribs (720) may protrude from the first surface (811). As previously described, the first surface (811) may face the interior of the electronic device (e.g., the electronic device (101) of FIG. 7). For example, the first surface (811) may face the -x direction. For example, one or more conductive ribs (720) may protrude from the first surface (811) in a direction facing the interior of the electronic device (101) (e.g., the -x direction). One or more conductive ribs (720) may be disposed at regular intervals along the longitudinal direction (e.g., the y-axis direction) of the base (710).

[0099] FIG. 10 is a top view of a base (710) overlapping with an antenna module (e.g., the antenna module (200) of FIG. 8). Referring to FIG. 10, one or more conductive ribs (720) may be arranged in relation to a plurality of antennas (220). Each of the plurality of antennas (220) may face an area of ​​the base (710) located between one or more conductive ribs (720). For example, at least one antenna of the plurality of antennas (220) may face a portion corresponding to said at least one antenna among a plurality of portions of the base (710) located between one or more conductive ribs (720).

[0100] For example, a plurality of antennas (220) may include a first antenna (221), a second antenna (222), a third antenna (223), a fourth antenna (224), and a fifth antenna (225) arranged sequentially along the longitudinal direction (e.g., the y-axis direction) of the base (710). One or more conductive ribs (720) may include a first conductive rib (911), a second conductive rib (912), a third conductive rib (913), a fourth conductive rib (914), a fifth conductive rib (915), and a sixth conductive rib (916) arranged sequentially along the longitudinal direction.

[0101] According to one embodiment, the first antenna (221) may face a first portion (1011) (or first region) of the base (710) located between the first conductive rib (911) and the second conductive rib (912). The second antenna (222) may face a second portion (1012) (or second region) of the base (710) located between the second conductive rib (912) and the third conductive rib (913). The third antenna (223) may face a third portion (1013) (or third region) of the base (710) located between the third conductive rib (913) and the fourth conductive rib (914). The fourth antenna (224) may face the fourth part (1014) (or fourth region) of the base (710) located between the fourth conductive rib (914) and the fifth conductive rib (915). The fifth antenna (225) may face the fifth part (1015) (or fifth region) of the base (710) located between the fifth conductive rib (915) and the sixth conductive rib (916).

[0102] The structure of the above one or more conductive ribs (720) can improve the coverage of the antenna module (200). For example, when electromagnetic waves are radiated into space, the electromagnetic waves can propagate while forming a wavefront according to the Huygens principle. When the electromagnetic waves pass through parts of the base (710) located between the one or more conductive ribs (720), the one or more conductive ribs (720) can function as waveguides. By the one or more conductive ribs (720), the width of the area where the electromagnetic waves are concentrated (e.g., beam width) can be widened, and the coverage of the antenna module (200) can be improved according to the expansion of said width. According to one embodiment, the cover (700) can improve the performance of the antenna module (200) through the one or more conductive ribs (720).

[0103] According to one embodiment, one or more conductive ribs (720) may be disposed on one of a first surface (e.g., the first surface (811) of FIG. 9) or a second surface (e.g., the second surface (812) of FIG. 9). Referring again to FIG. 8, one or more conductive ribs (720) may be disposed on the first surface (811) of the first part (711). When one or more conductive ribs (720) are disposed on the first surface (811), the first distance (D1) between the plurality of antennas (220) and one or more conductive ribs (720) may be relatively smaller than the second distance (e.g., the second distance (D2) of FIG. 12) between the plurality of antennas (220) and one or more conductive ribs (720) when one or more conductive ribs (720) are disposed on the second surface (812). As described below with reference to FIGS. 11 and 12, one or more conductive ribs (720) may be disposed on a second surface (812) of a first portion (711). Among the first surface (811) or the second surface (812), the surface on which one or more conductive ribs (720) are disposed may be determined based on the frequency band of RF signals transmitted and / or received through a plurality of antennas (220). For example, if the frequency band is high, one or more conductive ribs (720) may be disposed on the first surface (811) so that the first distance (D1) is reduced. If the frequency band is low, one or more conductive ribs (720) may be disposed on the second surface (812) so that the second distance (D2) is increased.

[0104] According to one embodiment, the frequency band of RF signals transmitted and / or received through a plurality of antennas (220) may include a first frequency band and a second frequency band. The second frequency band may be lower than the first frequency band. For example, the first frequency band may overlap at least partially with the second frequency band, but the maximum frequency of the first frequency band may be higher than the maximum frequency of the second frequency band. For example, the first frequency band may correspond to the N260 band defined by the 3GPP (3rd generation partnership project) (e.g., about 37 GHz to about 40 GHz). For example, the second frequency band may correspond to the N261 band defined by the 3GPP (e.g., about 27.5 GHz to about 28.35 GHz).

[0105] As the frequency of the RF signal increases, the energy loss due to the propagation distance of the electromagnetic wave increases. When the frequency of the RF signals transmitted and / or received through the plurality of antennas (220) is included within a first frequency band that is relatively higher than the second frequency band, one or more conductive ribs (720) may be placed on the first surface (811) of the first part (711) so that one or more conductive ribs (720) can affect the electromagnetic wave radiated from the plurality of antennas (220) at a relatively close distance (e.g., first distance (D1)) to the plurality of antennas (220). For example, when the first frequency band corresponds to a frequency band between 37 GHz and 40 GHz (e.g., N260 band), the first distance (D1) between the plurality of antennas (220) and one or more conductive ribs (720) may be about 0.8 mm to about 1.2 mm (e.g., 1.0 mm). However, the aforementioned numerical ranges are merely exemplary and the present disclosure is not limited thereto.

[0106] In FIG. 10, one or more conductive ribs (720) are depicted as including first to sixth conductive ribs, but one or more conductive ribs (720) according to the present disclosure are not limited thereto. For example, one or more conductive ribs (720) may be a single conductive rib extending along the periphery of a plurality of antennas (220). For example, the single conductive rib may be formed by connecting the top of the first conductive rib (911) and the top of the second conductive rib (912) in the first to sixth conductive ribs shown in FIG. 10, connecting the bottom of the second conductive rib (912) and the bottom of the third conductive rib (913), connecting the top of the third conductive rib (913) and the top of the fourth conductive rib (914), connecting the bottom of the fourth conductive rib (914) and the bottom of the fifth conductive rib (915), and connecting the top of the fifth conductive rib (915) and the top of the sixth conductive rib (916). In addition, one or more conductive ribs (720) may include a single-shaped conductive rib extending along the periphery of a plurality of antennas (220).

[0107] Hereinafter, a structure is described in which one or more conductive ribs (720) are disposed on the second surface (812) of the first part (711).

[0108] FIG. 11 is a side view of a cover comprising one or more conductive ribs located within a base. FIG. 12 is a cross-sectional view of an electronic device comprising the cover of FIG. 11.

[0109] Referring to FIG. 11, one or more conductive ribs (720) may be disposed on a first portion (711) of the base (710). According to one embodiment, one or more conductive ribs (720) may be disposed on a second surface (812) of the first portion (711). As previously described, the second surface (812) of the first portion (711) may be opposite to the first surface (811) which faces in a direction (e.g., -x direction) toward the interior of the electronic device (e.g., the electronic device (101) of FIG. 7). The second surface (812) of the first portion (711) may be in contact with the second portion (712) of the base (710). One or more conductive ribs (720) are disposed on the second surface (812) of the first part (711), and since the second part (712) is in contact with the second surface (812), one or more conductive ribs (720) can be located within the base (710).

[0110] According to one embodiment, one or more conductive ribs (720) may be arranged at regular intervals along the longitudinal direction (e.g., the y-axis direction) of the base (710). For example, one or more conductive ribs (720) may include a first conductive rib (1111), a second conductive rib (1112), a third conductive rib (1113), a fourth conductive rib (1114), and a fifth conductive rib (1115) arranged on a second surface (812). The first conductive rib (1111), the second conductive rib (1112), the third conductive rib (1113), the fourth conductive rib (1114), and the fifth conductive rib (1115) may be located within the base (710).

[0111] Referring to FIG. 12, since one or more conductive ribs (720) are located within the base (710), the distance (e.g., second distance (D2)) between one or more conductive ribs (720) and a plurality of antennas (220) placed on the substrate (210) can be increased. For example, one or more conductive ribs (720) can be placed on the second surface (812) among the first surface (811) and the second surface (812) of the first part (711). When one or more conductive ribs (720) are placed on the second surface (812), the distance between the plurality of antennas (220) and one or more conductive ribs (720) (e.g., second distance (D2)) may be relatively larger than the distance between the plurality of antennas (220) and one or more conductive ribs (720) when one or more conductive ribs (720) are placed on the first surface (811) (e.g., first distance (D1) of FIG. 8).

[0112] As described above, one or more conductive ribs (720) may be disposed on one of the first surface (811) or the second surface (812). The one surface on which one or more conductive ribs (720) are disposed may be determined based on the frequency band of RF signals transmitted and / or received through the plurality of antennas (220). If the frequency of the RF signals transmitted and / or received through the plurality of antennas (220) falls within a second frequency band that is relatively lower than the first frequency band, one or more conductive ribs (720) may be placed away from the plurality of antennas (220). One or more conductive ribs (720) may be disposed on the second surface (812) of the first portion (711) so that one or more conductive ribs (720) can affect electromagnetic waves radiated from the plurality of antennas (220) at a relatively long distance (e.g., a second distance (D2)). For example, if the first frequency band corresponds to a frequency band between 27.5 GHz and 28.35 GHz (e.g., N261 band), the second distance (D2) between the plurality of antennas (220) and one or more conductive ribs (720) may be about 1.5 mm to about 1.9 mm. However, the aforementioned numerical ranges are merely exemplary and the present disclosure is not limited thereto.

[0113] For example, the difference between the second distance (D2) of FIG. 12 and the first distance (D1) of FIG. 8 can be determined based on the thickness of the first part (711) of the base (710). The thickness of the first part (711) can be referenced as the distance between the first surface (811) and the second surface (812). The difference between the second distance (D2) and the first distance (D1) can correspond to the thickness of the first part (711). For example, if the first distance (D1) is about 1.0 mm and the thickness of the first part (711) is about 0.66 mm, the second distance (D2) can be about 1.66 mm. In this case, the difference between the second distance (D2) and the first distance (D1) can be about 0.66 mm, which corresponds to the thickness of the first part (711). The aforementioned numerical ranges are merely exemplary and the present disclosure is not limited thereto.

[0114] An electronic device (101) according to one embodiment can improve the performance of an antenna module (200) for a target frequency band through the structure of a cover (700) disposed within an opening (312) of a side wall (311). For example, to improve the performance of the antenna module (200) for RF signals on a first frequency band higher than a second frequency band, the electronic device (101) may include a cover (e.g., cover (700) of FIG. 9) comprising one or more conductive ribs (720) disposed on a first surface (811) of a first part (711). For example, to improve the performance of the antenna module (200) for RF signals on a second frequency band lower than a first frequency band, the electronic device (101) may include a cover (e.g., cover (700) of FIG. 11) comprising one or more conductive ribs (720) disposed on a second surface (812) of a first part (711). If a mechanical pattern for improving the performance of the antenna module (200) is included within the side wall (311), it may be difficult to change the structure of the side wall (311), and thus it may be difficult to make appropriate design changes for the target frequency band. An electronic device (101) according to one embodiment can improve the performance of the antenna module (200) for the target frequency band by changing the structure of the cover (700) placed within the opening (312). According to one embodiment, the structure of the cover (700) may be changed depending on the purpose of use of the electronic device (101).

[0115] FIG. 13 illustrates an electronic device according to a comparative example. FIG. 14 illustrates a non-conductive part included in the electronic device of FIG. 13. FIG. 15 illustrates a side wall of an electronic device according to a comparative example. FIG. 16 illustrates a side wall according to one embodiment.

[0116] Referring to FIG. 13, an electronic device (1301) according to a comparative example may include an antenna module (1310). The antenna module (1310) may include a substrate (1311) and a plurality of antennas (1312) disposed on the substrate (1311). The antenna module (1310) may be disposed to face a side wall (1320) of the electronic device (1301) according to a comparative example. The electronic device (1301) according to a comparative example may include a mechanical pattern (1330) formed within the side wall (1320) to improve the performance of the antenna module (1310). For example, the mechanical pattern (1330) may include a plurality of openings (1331) corresponding to each of the plurality of antenna modules (1310) for a radiation pattern formed from the antenna module (1310). The above mechanical pattern (1330) may be referred to as a muntin structure or a lattice structure in that it has a shape similar to a plurality of windows. To distinguish the plurality of openings (1331), the muntins (1332) located between the plurality of openings (1331) may be thin. The plurality of openings (1331) may be formed by perforating the side wall (1320).

[0117] Referring to FIG. 14, an electronic device according to a comparative example (e.g., the electronic device (1301) of FIG. 13) may include a non-conductive part (1410) having a shape corresponding to the shape of the mechanical pattern (e.g., the mechanical pattern (1330) of FIG. 13). As illustrated in FIG. 12, since the mechanical pattern (1330) includes a plurality of openings (e.g., the plurality of openings (1331) of FIG. 13), the non-conductive part (1410) may include protruding parts (1411) corresponding to the plurality of openings (1331). The protruding parts (1411) may protrude from a base (1412).

[0118] Referring to FIG. 15, a plurality of openings (1331) may define an open area for electromagnetic waves radiated from an antenna module (e.g., the antenna module (1310) of FIG. 13). As previously described, the plurality of openings (1331) may be distinguished by bars (1332) located between the plurality of openings (1331). Electromagnetic waves radiated from the antenna module (1310) may be scattered as they pass through the plurality of openings (1331).

[0119] When the bars (1332) for improving the performance of the antenna module (1310) are formed within the side wall (1320), the size of the opening (312) may be reduced. For example, to form bars between a plurality of separate openings (1331), the first thickness (T1) (e.g., length in the z-axis direction) of the plurality of openings (1331) may be reduced.

[0120] In the case of an electronic device (101) according to one embodiment illustrated in FIG. 16, since an opening (312) having a simple shape is formed within a side wall (311), the second thickness (T2) (e.g., length in the z-axis direction) of the opening (312) may be thicker than the first thickness (e.g., first thickness (T1) of FIG. 15). As described above, the electronic device (101) according to one embodiment may not involve a reduction in the thickness of the opening (312) caused during the process of forming a mechanical pattern. For example, the thickness of the opening (312) (e.g., length in the z-axis direction) may substantially correspond to the thickness of the recess (e.g., recess (821) of FIG. 8).

[0121] For example, even if the thickness of the side wall (311) according to one embodiment and the thickness of the side wall (1320) according to a comparative example are substantially the same, the second thickness (e.g., the second thickness (T2) of FIG. 16) may be thicker than the first thickness (e.g., the first thickness (T1) of FIG. 15). Since the second thickness (T2) is thicker than the first thickness (T1), the opening (312) of the electronic device (101) according to one embodiment may provide a wider open area than the opening (1331) of the electronic device (1301) according to a comparative example, so that electromagnetic waves radiated from the antenna module (200) can be radiated smoothly. In the case of the electronic device (1301) according to the comparative example shown in FIG. 14, the rigidity of the electronic device (1301) may be weakened because thin bars (e.g., bars (1332) of FIG. 13) are placed within the side wall (1320). For example, the bars (1332) may be easily damaged by external force. In the case of the electronic device (101) according to one embodiment shown in FIG. 16, the rigidity of the electronic device (101) may be improved because it does not include the bars.

[0122] FIG. 17 illustrates a heat map of an electronic device according to a comparative example for RF signals in a first frequency band. FIG. 18 illustrates a heat map of an electronic device according to an embodiment for RF signals in a first frequency band.

[0123] The heat maps described below represent the gain of a radiation pattern formed in three-dimensional space based on an electronic device (e.g., the electronic device (1301) according to the comparative example of FIG. 13 or the electronic device (101) according to one embodiment of FIG. 7). Boundary lines within the heat map are lines connecting points having substantially the same gain, corresponding to contour lines for the gain. The density of the area enclosed by the boundary lines represents the value of the gain. For example, the higher the value of the gain, the denser the area is depicted. The peak of the gain is high. The x-axis of the heat map represents the azimuth angle (phi, unit: degrees), and the y-axis of the heat map represents the elevation angle (theta, unit: degrees).

[0124] FIG. 17 is a heat map (1701) showing the gain of a radiation pattern formed around an electronic device (1301) when the electronic device (1301) according to a comparative example radiates RF signals on a first frequency band (e.g., N260 band). A first area (1711) corresponds to the front side of the electronic device (101) (e.g., the side facing the +z direction). A second area (1712) corresponds to the lateral side (e.g., the side facing the +x direction) to which the antenna module (e.g., the antenna module (1310) of FIG. 13) of the electronic device (1301) faces. A third area (1713) corresponds to the rear side of the electronic device (1301) (e.g., the side facing the -z direction). A fourth area (1714) corresponds to the other side of the electronic device (1301) opposite to the lateral side (e.g., the side facing the -x direction). The fifth region (1715) corresponds to the top side of the electronic device (1301) (e.g., the side facing the +y direction). The sixth region (1716) corresponds to the bottom side of the electronic device (1301) (e.g., the side facing the -y direction).

[0125] FIG. 18 is a heat map (1801) showing the gain of a radiation pattern formed around an electronic device (101) when the electronic device (101) according to one embodiment radiates RF signals on a first frequency band (e.g., N260 band). A first area (1811) corresponds to the front side of the electronic device (101) (e.g., the side facing the +z direction). A second area (1812) corresponds to the lateral side (e.g., the side facing the +x direction) to which the antenna module (e.g., the antenna module (200) of FIG. 8) of the electronic device (101) faces. A third area (1813) corresponds to the rear side of the electronic device (101) (e.g., the side facing the -z direction). A fourth area (1814) corresponds to the other side of the electronic device (101) opposite to the lateral side (e.g., the side facing the -x direction). The fifth region (1815) corresponds to the top side of the electronic device (101) (e.g., the side facing the +y direction). The sixth region (1816) corresponds to the bottom side of the electronic device (101) (e.g., the side facing the -y direction).

[0126] Referring to the heat map (1701) illustrated in FIG. 17, the density of the second region (1712) may be the highest. Since the second region (1712) corresponds to the side of the electronic device (101) facing the antenna module, the radiation pattern may be concentrated in the second region (1712). Referring to the heat map (1801) illustrated in FIG. 18, similar to the heat map (1701), the radiation pattern may be concentrated in the second region (1812) corresponding to the side of the electronic device (101) facing the antenna module.

[0127] When comparing the heat map (1701) of FIG. 17 with the heat map (1801) of FIG. 18, the coverage of the antenna module (e.g., the antenna module (200) of FIG. 8) of the electronic device (101) according to one embodiment is wider than the coverage of the antenna module (e.g., the antenna module (1310) of FIG. 13) of the electronic device (1301) according to a comparative example. The size of the area where the radiation pattern is concentrated within the heat map (1801) may be larger than the size of the area where the radiation pattern is concentrated within the heat map (1701). Since the coverage is wider the larger the size of the area where the radiation pattern is concentrated, the electronic device (101) according to one embodiment can provide higher communication performance for RF signals on the first frequency band than the electronic device (1301) according to the comparative example. For example, a cover (e.g., cover (700) of FIG. 8) comprising one or more conductive ribs (e.g., one or more conductive ribs (720) of FIG. 9) may be more useful for improving coverage than a mechanical pattern (e.g., mechanical pattern (1330) of FIG. 13) formed within a side wall (e.g., side wall (1320) of FIG. 13). According to one embodiment, as the mechanical pattern is omitted from the side wall (e.g., side wall (311) of FIG. 8) of the electronic device (101), the electronic device (101) may have high rigidity and may improve the coverage of the antenna module (200), thereby providing high communication performance.

[0128] FIG. 19 illustrates a heat map of an electronic device according to a comparative example for RF signals in a second frequency band. FIG. 20 illustrates a heat map of an electronic device according to an embodiment for RF signals in a second frequency band.

[0129] The heat map (1901) of FIG. 19 and the heat map (2001) of FIG. 20 can be interpreted in the same way as the heat map (1701) of FIG. 17 and the heat map (1801) of FIG. 18 described above.

[0130] FIG. 19 is a heat map (1901) showing the gain of a radiation pattern formed around an electronic device (1301) when the electronic device (1301) according to a comparative example radiates RF signals on a second frequency band (e.g., N261 band). The descriptions of the regions of FIG. 17 (e.g., first region (1711), second region (1712), third region (1713), fourth region (1714), fifth region (1715), and sixth region (1716)) may be applied substantially the same to the regions of FIG. 19 (e.g., first region (1911), second region (1912), third region (1913), fourth region (1914), fifth region (1915), and sixth region (1916)).

[0131] FIG. 20 is a heat map (2001) showing the gain of a radiation pattern formed around an electronic device (101) when the electronic device (101) according to one embodiment radiates RF signals on a second frequency band (e.g., N261 band). Descriptions of the regions of FIG. 18 (e.g., first region (1811), second region (1812), third region (1813), fourth region (1814), fifth region (1815), and sixth region (1816)) may be applied substantially the same to the regions of FIG. 20 (e.g., first region (2011), second region (2012), third region (2013), fourth region (2014), fifth region (2015), and sixth region (2016)).

[0132] When comparing the heat map (1901) of FIG. 19 with the heat map (2001) of FIG. 20, the coverage of the antenna module (e.g., antenna module (200) of FIG. 8) of the electronic device according to one embodiment (e.g., electronic device (101) of FIG. 8) is wider than the coverage of the antenna module (e.g., antenna module (1310) of FIG. 13) of the electronic device according to a comparative example (e.g., electronic device (1301) of FIG. 13). The size of the area where the radiation pattern is concentrated within the heat map (2001) may be larger than the size of the area where the radiation pattern is concentrated within the heat map (1901). Since the coverage is wider the larger the size of the area where the radiation pattern is concentrated, the electronic device (101) according to one embodiment can provide higher communication performance for RF signals on the second frequency band than the electronic device (1301) according to the comparative example.

[0133] FIG. 21 is a plan view of a cover including one or more conductive ribs that overlap with a plurality of antennas.

[0134] As described above, one or more conductive ribs (720) may be arranged in relation to a plurality of antennas (220). As described with reference to FIG. 10, the plurality of antennas (220) may be arranged to face portions of the base (710) between one or more conductive ribs (720), but the arrangement structure of the one or more conductive ribs (720) may be designed in various ways depending on the purpose.

[0135] Referring to FIG. 21, at least one of the one or more conductive ribs (720) may overlap with an antenna corresponding to said at least one conductive rib among a plurality of antennas (220) when looking at a side wall (e.g., side wall (311) of FIG. 8). The one or more conductive ribs (720) that overlap with the plurality of antennas (220) may control the peak of the electromagnetic waves radiated from the plurality of antennas (220).

[0136] According to one embodiment, a plurality of antennas (220) may include a first antenna (221), a second antenna (222), a third antenna (223), a fourth antenna (224), and a fifth antenna (225) arranged sequentially along the longitudinal direction (e.g., the y-axis direction) of the base (710). One or more conductive ribs (720) may include a first conductive rib (2111), a second conductive rib (2112), a third conductive rib (2113), a fourth conductive rib (2114), and a fifth conductive rib (2115) arranged sequentially along the longitudinal direction.

[0137] According to one embodiment, each of one or more conductive ribs (720) may overlap with each of a plurality of antennas (220). For example, a first conductive rib (2111) may overlap with a first antenna (221). A second conductive rib (2112) may overlap with a second antenna (222). A third conductive rib (2113) may overlap with a third antenna (223). A fourth conductive rib (2114) may overlap with a fourth antenna (224). A fifth conductive rib (2115) may overlap with a fifth antenna (225).

[0138] As illustrated in FIG. 21, each rib of one or more conductive ribs (720) may extend from a first edge (2101) of the base (710) facing the front side (e.g., +z direction) to a second edge (2102) of the base (710) opposite to the first edge (2101). For example, the thickness (e.g., length in the z-axis direction) of each rib may correspond to the gap between the first edge (2101) and the second edge (2102). However, the structure of each rib of one or more conductive ribs (720) is not limited thereto. For example, at least one rib of one or more conductive ribs (720) may have a thickness shorter than the gap between the first edge (2101) and the second edge (2102).

[0139] FIG. 22 is a plan view of a cover including one or more inclined conductive ribs.

[0140] Referring to FIG. 22, a plurality of antennas (220) may include a first antenna (221), a second antenna (222), a third antenna (223), a fourth antenna (224), and a fifth antenna (225) arranged sequentially along the longitudinal direction (e.g., the y-axis direction) of the base (710). One or more conductive ribs (720) may include a first conductive rib (2211), a second conductive rib (2212), a third conductive rib (2213), a fourth conductive rib (2214), and a fifth conductive rib (2215) arranged sequentially along the longitudinal direction. As described above, each conductive rib of one or more conductive ribs (720) may overlap with the corresponding antenna of the plurality of antennas (220).

[0141] According to one embodiment, at least one of the one or more conductive ribs (720) may be inclined with respect to the edge of the base (710). For example, the first conductive rib (2211), the second conductive rib (2212), the third conductive rib (2213), the fourth conductive rib (2214), and the fifth conductive rib (2215) may be inclined with respect to the first edge (2101) and the second edge (2102). For example, an imaginary line extending from the first conductive rib (2211) may form an angle different from 90 degrees with respect to the first edge (2101), and the imaginary line may form an angle different from 90 degrees with respect to the second edge (2102).

[0142] According to one embodiment, one or more inclined conductive ribs (720) may affect the polarization of electromagnetic waves radiated from a plurality of antennas (220). For example, when a plurality of antennas (220) are fed from a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1), horizontal polarization (e.g., H-pole) and vertical polarization (e.g., V-pole) may be radiated from the plurality of antennas (220). If one or more conductive ribs (720) overlapping with the plurality of antennas (220) are substantially parallel to either vertical polarization or horizontal polarization, the one or more conductive ribs (720) may have difficulty affecting said polarization. The shape of each of the plurality of antennas (220) may be a rectangle, and each of the one or more inclined conductive ribs (720) may overlap parallel to the diagonal of the rectangle with respect to the corresponding antenna. For example, one or more conductive ribs (720) may each be tilted about 45 degrees with respect to the plurality of antennas (220). Since one or more conductive ribs (720) tilted about 45 degrees can affect both horizontal polarization and vertical polarization, the effect of the feed can be reduced.

[0143] One or more conductive ribs (720) illustrated in FIG. 22 are all depicted as being inclined in the same direction, but the one or more conductive ribs (720) according to the present disclosure are not limited thereto. For example, the inclination of each conductive rib of the one or more conductive ribs (720) may differ from one another. Additionally, the one or more conductive ribs may include a single conductive rib in which the first to fifth conductive ribs of FIG. 22 are partially connected. Furthermore, the shape of the one or more conductive ribs (720) may vary.

[0144] FIG. 23 illustrates a part of an electronic device according to one embodiment.

[0145] In the examples described above, the cover (e.g., the cover (700) of FIG. 7) is described as a separate member disposed within the opening (312) of the side wall (311), but the present disclosure is not limited thereto. For example, the cover may be implemented as part of the side wall (311). Referring to FIG. 23, the side wall (311) may include a base (2310) and one or more conductive ribs (2320). For example, the base (2310) may include a non-conductive material. Since the base (2310) comprises a non-conductive material, the base (2310) may not electromagnetically interfere with the directional beam formed by the plurality of antennas (220) of the antenna module (200) and with RF signals transmitted and / or received through the plurality of antennas (220). According to one embodiment, the sidewall (311) may include one or more conductive ribs (2320). One or more conductive ribs (2320) may be supported by the base (2310). One or more conductive ribs (2320) may extend the coverage of the antenna module (200) by causing scattering and / or reflection of electromagnetic waves radiated from the antenna module (200).

[0146] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure pertains.

[0147] An electronic device (101) is disclosed. The electronic device (101) may include a frame (310) including a side wall (311) that defines a portion of the side of the electronic device (101). The side wall (311) may define an opening (312). The electronic device (101) may include an antenna module (200) disposed within the electronic device (101) and positioned to overlap the opening (312) of the side wall (311) when viewed from the side wall (311). The antenna module (200) may include a substrate (210) and a plurality of antennas (220) disposed on one side of the substrate (210) facing the side wall (311). The electronic device (101) may include a cover (700) disposed within the opening (312) and facing the antenna module (200). The cover (700) may include a base (710) comprising a non-conductive material and one or more conductive ribs (720) supported by the base (710) and arranged in relation to the plurality of antennas (220). The cover (700) comprising one or more conductive ribs (720) can improve the performance of the antenna module (200). For example, electromagnetic waves radiated from the plurality of antennas (220) of the antenna module (200) can be scattered by the one or more conductive ribs (720). By said scattering, the performance (e.g., coverage) of the antenna module (200) can be improved. For example, the antenna module (200) may include a mmWave module. In the electronic device (101), one or more conductive ribs (720) for improving the performance of the antenna module (200) are not formed within the side wall (311) but are contained within a cover (700) disposed within the opening (312), so a structure (e.g., a bar structure) corresponding to one or more conductive ribs (720) from the side wall (311) can be omitted.According to one embodiment, by the above omission, the rigidity of the electronic device (101) can be improved and the manufacturing process of the electronic device (101) can be simplified.

[0148] As a non-limiting example, the base (710) may include a first portion (711) comprising a first surface (811) facing the interior of the electronic device (101) and a second surface (812) opposite to the first surface (811), and a second portion (712) in contact with the second surface (812) of the first portion (711) and defining another portion of the side of the electronic device (101). The one or more conductive ribs (720) may be disposed on either the first surface (811) of the first portion (711) or the second surface (812) of the first portion (711). Since the base (710) is formed of a non-conductive material, it may not affect the performance of the antenna module (200). One or more conductive ribs (720) may be disposed on at least one of the first surface of the first part (711) or the second surface (812) of the first part (711). The first part (711) may include a material suitable for an LDS for forming one or more conductive ribs (720).

[0149] As a non-limiting example, the one surface on which the one or more conductive ribs (720) are disposed, which is either the first surface (811) of the first part (711) or the second surface (812) of the first part (711), may be based on a first frequency band of RF (radio frequency) signals transmitted through the plurality of antennas (220) of the antenna module (200) or a second frequency band of the RF signals that is lower than the first frequency band.

[0150] As a non-limiting example, the plurality of antennas (220) may be configured to transmit the RF signals within a first frequency band. The one or more conductive ribs (720) may be disposed on the first surface (811) of the first portion (711).

[0151] As a non-limiting example, the first frequency band may correspond to a frequency band between 37 GHz and 40 GHz. The first distance (D1) between the plurality of antennas (220) and the one or more conductive ribs (720) may be 0.8 mm to 1.2 mm. For example, the first frequency band may be the N260 band.

[0152] As a non-limiting example, the plurality of antennas (220) may be configured to transmit the RF signals within the second frequency band. The one or more conductive ribs (720) may be disposed on the second surface (812) of the first portion (711).

[0153] As a non-limiting example, the second frequency band may correspond to a frequency band between 27.5 GHz and 28.35 GHz. The second distance (D2) between the plurality of antenna radiators and the one or more conductive ribs (720) may be 1.5 mm to 1.9 mm. For example, the second frequency band may be the N261 band.

[0154] As a non-limiting example, the first portion (711) of the base (710) may include a plurality of grooves (830). Each conductive rib of the one or more conductive ribs (720) may be disposed within a groove of the plurality of grooves (830) corresponding to each conductive rib.

[0155] As an example not limited to, the electronic device (101) may include a support portion (820) that is at least partially enclosed by the frame (310) and supports electronic components disposed within the electronic device (101). The electronic device (101) may include a non-conductive portion (810) comprising a non-conductive material that connects the side wall (311) of the frame (310) and the support portion (820). The electronic device (101) may include a bracket (230) that accommodates the substrate (210) and is seated on the support portion (820) and the non-conductive portion (810).

[0156] As an example not limited to, the non-conductive portion (810) may include a recess (821) connected to the opening (312) of the side wall (311). The thickness of the opening (312) may substantially correspond to the thickness of the recess (821). Since a structure (e.g., a lattice structure) corresponding to one or more conductive ribs (720) within the side wall (311) of the electronic device (101) is omitted, the electronic device (101) may not entail a reduction in the thickness of the opening (312) caused by a process for forming the lattice.

[0157] As a non-limiting example, the outer surface of the cover (700) placed within the opening (312) may be substantially flat. Since the lattice structure is omitted, the outer surface of the cover (700) may be flat. Since the cover (700) has a simple shape, the manufacturing process of the electronic device (101) can be simplified.

[0158] In a non-limiting example, at least one of the plurality of antennas (220) may face a region of the base (710) corresponding to the at least one antenna among a plurality of regions of the base (710) located between the one or more conductive ribs (720). For example, the first antenna (e.g., the first antenna (221) of FIG. 10) may face a first region (e.g., the first region (1011) of FIG. 10) of the base (710) located between the first conductive rib (e.g., the first conductive rib (911) of FIG. 10) and the second conductive rib (e.g., the second conductive rib (912) of FIG. 10).

[0159] As a non-limiting example, at least one of the one or more conductive ribs (720) may overlap with an antenna corresponding to the at least one conductive rib among the plurality of antennas when viewed from the side wall (311). For example, the first conductive rib (e.g., the first conductive rib (2111) of FIG. 21) may overlap with the first antenna (e.g., the first antenna (221) of FIG. 21).

[0160] As an example not limited to, the at least one conductive rib may be inclined with respect to the edge of the base (710). For example, the first conductive rib (e.g., the first conductive rib (2211) of FIG. 22) may be inclined with respect to the edge of the base (710).

[0161] As a non-limiting example, the one or more conductive ribs (720) may be omitted from the side wall (311) of the frame (310). For example, the side wall (311) may not include a structure corresponding to the one or more conductive ribs (720).

[0162] An electronic device (101) is disclosed. The electronic device (101) may include a wireless communication circuit (192). The electronic device (101) may include a frame (310) including a side wall (311) that defines a portion of the side of the electronic device (101). The electronic device (101) may include an antenna module (200) disposed within the electronic device (101). The antenna module (200) may include a substrate (210) and a plurality of antennas (220) disposed on the substrate (210). The side wall (311) may include a base (710) formed of a non-conductive material and one or more conductive ribs (720) supported by the base (710), including a first conductive rib, a second conductive rib, and a third conductive rib. The plurality of antennas (220) may include a first antenna directed toward a first portion of the base between the first conductive rib and the second conductive rib, and a second antenna directed toward a second portion of the base between the second conductive rib and the third conductive rib.

[0163] As an example not limited to, the base (710) may include a first portion (711) comprising a first surface (811) facing the interior of the electronic device (101) and a second surface (812) opposite to the first surface (811). The base (710) may include a second portion (712) that is in contact with the second surface (812) of the first portion (711) and defines another portion of the side of the electronic device (101). The one or more conductive ribs (720) may be disposed on either the first surface (811) of the first portion (711) or the second surface (812) of the first portion (711).

[0164] As a non-limiting example, the one surface on which the one or more conductive ribs (720) are disposed, which is either the first surface (811) of the first part (711) or the second surface (812) of the first part (711), may be based on a first frequency band of RF (radio frequency) signals transmitted through the plurality of antennas (220) of the antenna module (200) or a second frequency band of the RF signals that is lower than the first frequency band.

[0165] As a non-limiting example, at least one of the one or more conductive ribs (720) may overlap with the antenna corresponding to the at least one conductive rib among the plurality of antennas when looking at the side wall (311).

[0166] As a non-limiting example, the one or more conductive ribs (720) arranged in relation to the plurality of antennas (220) may be configured to function as waveguides for electromagnetic waves radiated from the plurality of antennas (220).

[0167] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs.

[0168] The electronic devices according to the various embodiments disclosed in this document may be of various forms. The electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or consumer electronics. The electronic devices according to the embodiments of this document are not limited to the devices described above.

[0169] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0170] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0171] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0172] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as the memory (130) of the manufacturer's server, the application store's server, or the relay server.

[0173] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device, A frame including a sidewall defining a part of the side of the electronic device, wherein the sidewall defines an opening; An antenna module disposed within the electronic device and positioned to overlap with the opening of the side wall when viewed from the side wall, the antenna module is, Substrate, and Includes a plurality of antennas disposed on one surface of the substrate facing the side wall; and It includes a cover disposed within the above opening and facing the antenna module, The above cover is, A base comprising a non-conductive material, and A plurality of conductive ribs supported by the base and arranged in relation to the plurality of antennas, Electronic device.

2. In Paragraph 1, The above base is, A first portion comprising a first surface facing the interior of the electronic device and a second surface opposite to the first surface, and It includes a second part that is in contact with the second surface of the first part and defines another part of the side of the electronic device, and The above one or more conductive ribs are, disposed on one of the first surface of the first part or the second surface of the first part, Electronic device.

3. In Paragraph 2, The one surface on which the one or more conductive ribs are disposed among the first surface of the first part or the second surface of the first part is, Based on a first frequency band of RF (radio frequency) signals transmitted through the plurality of antennas of the antenna module, or a second frequency band of the RF signals lower than the first frequency band, Electronic device.

4. In Paragraph 3, The above plurality of antennas are, It is configured to transmit the above RF signals within a first frequency band, and The above one or more conductive ribs are, disposed on the first surface of the first part, Electronic device.

5. In Paragraph 4, The above first frequency band is, It corresponds to a frequency band between 37GHz and 40GHz, and The first distance between the plurality of antennas and the one or more conductive ribs is, 0.8mm to 1.2mm, Electronic device.

6. In Paragraph 3, The above plurality of antennas are, It is configured to transmit the above RF signals within a second frequency band, and The above one or more conductive ribs are, disposed on the second surface of the first part, Electronic device.

7. In Paragraph 6, The above second frequency band is, It corresponds to a frequency band between 27.5 GHz and 28.35 GHz, and The second distance between the plurality of antennas and the one or more conductive ribs is, 1.5mm to 1.9mm, Electronic device.

8. In Paragraph 2, The first part of the above base is, Includes one or more grooves, Each conductive rib of the above one or more conductive ribs is, disposed within the grooves of the one or more grooves corresponding to each of the above conductive ribs, Electronic device.

9. In Paragraph 1, A support portion that is at least partially enclosed by the above frame and supports electronic components disposed within the electronic device; A non-conductive portion connecting the side wall and the support portion of the above frame and comprising a non-conductive material; and A bracket that accommodates the substrate and is seated on the support portion and the non-conductive portion, further comprising Electronic device.

10. In Paragraph 9, The above-mentioned non-conductive part is, It includes a recess connected to the opening of the above side wall, The thickness of the above opening is, substantially corresponding to the thickness of the above recess, Electronic device.

11. In Paragraph 1, The outer surface of the cover placed within the above opening is, flat, Electronic device.

12. In Paragraph 1, At least one of the plurality of antennas above is, Among the plurality of parts of the base located between the one or more conductive ribs, the part of the base corresponding to the at least one antenna facing Electronic device.

13. In Paragraph 1, At least one of the above one or more conductive ribs is, When looking at the above side wall, among the plurality of antennas, the antenna corresponding to the at least one conductive rib overlaps, Electronic device.

14. In Paragraph 13, The above-mentioned at least one conductive rib is, Slanted with respect to the edge of the above base, Electronic device.

15. In Paragraph 1, The above one or more conductive ribs are, Omitted from the side wall of the above frame, Electronic device.

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