Method for manufacturing fe-cu-ag ternary alloy powder having high conductivity and high durability, fe-cu-ag ternary alloy powder manufactured using same, method for manufacturing semiconductor test rubber socket comprising same, and rubber socket manufactured using same

Abstract

The present invention relates to: a method for manufacturing a Fe-Cu-Ag ternary alloy powder; a Fe-Cu-Ag ternary alloy powder for manufacturing a rubber-type semiconductor test socket, manufactured using same; a method for manufacturing a semiconductor test rubber socket by using the Fe-Cu-Ag ternary alloy powder; and a semiconductor test rubber socket manufactured using same, the Fe-Cu-Ag ternary alloy powder manufacturing method comprising the steps of: (a) preparing each of raw metals of iron (Fe), copper (Cu) and silver (Ag); (b) melting each raw metal in the order of iron (Fe), copper (Cu) and silver (Ag) so as to form a mixed molten metal; and (c) manufacturing alloy powder particles from the mixed molten metal through gas atomization.

Description

A method for manufacturing Fe-Cu-Ag ternary alloy powder having high conductivity and high durability, Fe-Cu-Ag ternary alloy powder manufactured thereby, a method for manufacturing a rubber socket for semiconductor testing including the same, and a rubber socket manufactured thereby.

[0001] The present invention relates to technology concerning high-performance materials used in semiconductor testing processes, and more specifically, to a method for manufacturing Fe-Cu-Ag ternary alloy powder having high conductivity and high durability suitable for use in the manufacture of rubber sockets for semiconductor testing, Fe-Cu-Ag ternary alloy powder manufactured thereby, a method for manufacturing a rubber socket for semiconductor testing comprising said Fe-Cu-Ag ternary alloy powder as a conductive filler, and a rubber-type semiconductor test socket manufactured thereby.

[0002] In the semiconductor manufacturing process, the inspection stage, which ultimately screens for defects, is an essential step for guaranteeing product quality and performance. The semiconductor test sockets used in this process play a role in determining defects by inserting semiconductor devices, connecting them to inspection equipment, and measuring the electrical and functional characteristics and operating speed of the semiconductors by applying various voltage, electrical signals, and temperature conditions. In particular, semiconductor test sockets must maintain high reliability and durability even during repetitive testing, and high electrical conductivity is required to accurately transmit electrical signals generated during testing.

[0003] Generally, two methods are used for semiconductor testing. The first is the pogo-pin method, where conductive pins directly contact the semiconductor terminals to perform the test. The second is a method that uses a rubber socket, in which conductive metal powder is filled into silicone rubber, to insert the semiconductor and conduct the test. Among these, the rubber socket method is widely used because it has lower manufacturing costs, a simpler structure, and higher test signal transmission efficiency compared to the pogo-pin method.

[0004] The conductive metal powder materials currently used in rubber-socket type semiconductor test sockets are primarily in the form of nickel (Ni) powder coated with a highly conductive gold (Au). While these existing materials offer relatively excellent electrical performance, they have limitations in product lifespan due to the high cost of the gold coating process and coating delamination caused by repeated use. Additionally, the gold coating degrades magnetic properties, leading to performance degradation in certain applications, particularly in test environments requiring high magnetic characteristics.

[0005] Furthermore, with the recent surge in the production of high-performance semiconductor devices such as High Bandwidth Memory (HBM), a problem has emerged where existing test sockets fail to meet new technological requirements. HBM demands significantly higher operating speeds and thermal stability than conventional semiconductors, requiring test sockets to satisfy extreme physical and electrical characteristics. Since conventional rubber sockets struggle to meet these demands due to the composition and structural limitations of their metal powders, there is a growing need for technology to manufacture rubber sockets using new high-performance materials that simultaneously satisfy high conductivity and durability.

[0006] The technical problem that the present invention aims to solve is to resolve the high cost and durability issues of conductive metal powders, such as conventional nickel (Ni)-based gold (Au) coated powders used in conventional semiconductor test sockets, and to provide a method for manufacturing an economical and high-performance alloy powder for semiconductor test sockets that can satisfy the extreme physical and electrical characteristics required in the test environment of next-generation high-performance semiconductor devices, such as high-bandwidth memory (HBM), which require high-current driving and high-speed signal processing; the alloy powder manufactured thereby; a method for manufacturing a rubber socket for semiconductor testing using said alloy powder; and a rubber socket for semiconductor testing manufactured thereby.

[0007] To achieve the above technical objectives, the present invention proposes a method for manufacturing Fe-Cu-Ag ternary alloy powder comprising: (a) a step of preparing raw metals of iron (Fe), copper (Cu), and silver (Ag), respectively; (b) a step of melting each raw metal in the order of iron (Fe), copper (Cu), and silver (Ag) to form a mixed molten metal; and (c) a step of manufacturing alloy powder particles from the mixed molten metal through a gas atomization process.

[0008] In addition, a method for manufacturing Fe-Cu-Ag ternary alloy powder is proposed, characterized by preparing a raw metal having a powder or flake shape in step (a) above.

[0009] In addition, the above step (b) is characterized by comprising: (b-1) a step of melting iron (Fe); (b-2) a step of adding copper (Cu) to the molten iron (Fe) and mixing and melting it; and (b-3) a step of adding silver (Ag) to the mixed molten iron (Fe) and copper (Cu) and mixing and melting it. A method for manufacturing Fe-Cu-Ag ternary alloy powder is proposed.

[0010] In addition, a method for manufacturing Fe-Cu-Ag ternary alloy powder is proposed, characterized by preparing a mixed molten metal of iron (Fe), copper (Cu), and silver (Ag) at a temperature of 1600 to 1700 ℃ in step (b).

[0011] In addition, a method for manufacturing Fe-Cu-Ag ternary alloy powder is proposed, characterized by manufacturing Fe-Cu-Ag ternary alloy powder in which the alloy composition of iron (Fe), copper (Cu), and silver (Ag) is uniform throughout the entire particle in step (c).

[0012] In addition, a method for manufacturing an Fe-Cu-Ag ternary alloy powder is proposed, characterized by manufacturing an Fe-Cu-Ag ternary alloy powder having a composite alloy particle structure comprising a plurality of domains including copper (Cu) in step (c); and iron (Fe) and silver (Ag) dispersed within the domains or at the boundaries between the domains.

[0013] In addition, a method for manufacturing Fe-Cu-Ag ternary alloy powder is proposed, characterized by manufacturing a core-shell structured Fe-Cu-Ag ternary alloy powder comprising a core made of iron (Fe) and a shell having a composition in which the combined weight fraction of copper (Cu) and silver (Ag) is higher than the weight fraction of iron (Fe) in step (c).

[0014] In addition, a method for manufacturing Fe-Cu-Ag ternary alloy powder is proposed, characterized by injecting a mixed molten metal containing iron (Fe), copper (Cu), and silver (Ag) in step (c) at a pressure of 20 kPa through a nozzle with a diameter of 3 mm to produce alloy powder particles.

[0015] In addition, in another aspect of the invention, the present invention proposes an Fe-Cu-Ag ternary alloy powder manufactured by the above method and which can be used as a conductive metal powder in the manufacture of a rubber-type semiconductor test socket.

[0016] Furthermore, in another aspect of the invention, the present invention proposes an Fe-Cu-Ag ternary alloy powder comprising (i) Fe-Cu-Ag ternary alloy particles having a composite alloy particle structure comprising a plurality of domains including copper (Cu) and iron (Fe) and silver (Ag) dispersed within the domains or at the boundaries between the domains, or (ii) Fe-Cu-Ag ternary alloy particles having a core-shell structure comprising a core made of iron (Fe) and a shell having a composition in which the combined weight fraction of copper (Cu) and silver (Ag) is higher than the weight fraction of iron (Fe).

[0017] In addition, in another aspect of the invention, the present invention proposes a method for manufacturing a rubber socket for semiconductor testing comprising: (a) preparing raw metals of iron (Fe), copper (Cu), and silver (Ag), respectively; (b) melting each raw metal in the order of iron (Fe), copper (Cu), and silver (Ag) to form a mixed molten metal; (c) manufacturing alloy powder particles from the mixed molten metal through a gas atomization process; and (d) manufacturing a rubber socket for semiconductor testing comprising the Fe-Cu-Ag ternary alloy powder.

[0018] In addition, a method for manufacturing a rubber socket for semiconductor testing is proposed, characterized by preparing a raw metal having a powder or flake shape in step (a) above.

[0019] In addition, the above step (b) is characterized by comprising: (b-1) a step of melting iron (Fe); (b-2) a step of adding copper (Cu) to the molten iron (Fe) and mixing and melting it; and (b-3) a step of adding silver (Ag) to the mixed molten iron (Fe) and copper (Cu) and mixing and melting it. A method for manufacturing a rubber socket for semiconductor testing is proposed.

[0020] In addition, a method for manufacturing a rubber socket for semiconductor testing is proposed, characterized in that, in step (b) above, a mixed molten metal of iron (Fe), copper (Cu), and silver (Ag) is prepared at a temperature of 1600 to 1700 ℃.

[0021] In addition, a method for manufacturing a rubber socket for semiconductor testing is proposed, characterized in that, in step (c) above, an Fe-Cu-Ag ternary alloy powder is manufactured in which the alloy composition of iron (Fe), copper (Cu), and silver (Ag) is uniform throughout the entire particle.

[0022] In addition, a method for manufacturing a rubber socket for semiconductor testing is proposed, characterized by manufacturing a Fe-Cu-Ag ternary alloy powder having a composite alloy particle structure comprising a plurality of domains including copper (Cu); and iron (Fe) and silver (Ag) dispersed within the domains or at the boundaries between the domains in step (c).

[0023] In addition, a method for manufacturing a rubber socket for semiconductor testing is proposed, characterized in that, in step (c) above, a core-shell structured Fe-Cu-Ag ternary alloy powder is manufactured, comprising a core made of iron (Fe) and a shell having a composition in which the combined weight fraction of copper (Cu) and silver (Ag) is higher than the weight fraction of iron (Fe).

[0024] In addition, a method for manufacturing a rubber socket for semiconductor testing is proposed, characterized in that, in step (c) above, a mixed molten metal containing iron (Fe), copper (Cu), and silver (Ag) is sprayed through a nozzle with a diameter of 3 mm at a pressure of 20 kPa to produce alloy powder particles.

[0025] In addition, a method for manufacturing a rubber socket for semiconductor testing is proposed, characterized in that, in step (d) above, a silicone polymer composition containing Fe-Cu-Ag ternary alloy powder is prepared, and the composition is injected into a mold and cured to manufacture a rubber-type semiconductor test socket.

[0026] In addition, the above step (d) comprises: (d-1) mixing liquid silicone rubber (LSR) and a curing agent, and then adding Fe-Cu-Ag ternary alloy powder to prepare a conductive silicone polymer composition; (d-2) degassing the conductive silicone polymer composition under vacuum to remove bubbles; (d-3) injecting the conductive silicone polymer composition into a mold and placing a probe pin or a metal insert; (d-4) curing the silicone polymer composition injected into the mold at 120 to 170°C for 20 to 90 minutes to form a rubber socket; (d-5) demolding the formed rubber socket from the mold and then performing post-curing at 150 to 200°C for 10 to 30 minutes; and (d-6) assembling the contact pin and the socket body. A method for manufacturing a rubber socket for semiconductor testing is proposed.

[0027] In addition, in another aspect of the invention, the present invention proposes a rubber-type semiconductor test socket manufactured by the above method and comprising the Fe-Cu-Ag ternary alloy powder as a conductive filler.

[0028] In addition, in another aspect of the invention, the present invention proposes a rubber socket for semiconductor testing comprising Fe-Cu-Ag ternary alloy powder as a conductive filler, wherein the Fe-Cu-Ag ternary alloy powder comprises: (i) Fe-Cu-Ag ternary alloy particles having a composite alloy particle structure comprising a plurality of domains including copper (Cu) and iron (Fe) and silver (Ag) dispersed within the domains or at the boundaries between the domains; or (ii) Fe-Cu-Ag ternary alloy particles having a core-shell structure comprising a core made of iron (Fe) and a shell having a composition in which the combined weight fraction of copper (Cu) and silver (Ag) is higher than the weight fraction of iron (Fe).

[0029] In addition, a rubber socket for semiconductor testing is proposed, characterized in that the above-mentioned Fe-Cu-Ag ternary alloy powder has a composition of Fe-50wt%Cu-20wt%Ag.

[0030] In addition, a rubber socket for semiconductor testing is proposed, characterized in that the above-mentioned Fe-Cu-Ag ternary alloy powder is dispersed in a silicon polymer matrix at a packing ratio of 50 vol%.

[0031] According to the method for manufacturing Fe-Cu-Ag ternary alloy powder according to the present invention, Fe-Cu-Ag ternary alloy powder, which includes iron (Fe) that provides high strength and durability to the alloy and copper (Cu) and silver (Ag) that impart excellent electrical conductivity, and consequently improves both electrical and mechanical properties, is manufactured through a gas atomization process. By optimizing the melting order of Fe, Cu, and Ag (Fe → Cu → Ag) when preparing the alloy molten metal provided to the gas atomization process to create a supersaturated state that exceeds the solid solution limit between alloy elements, it is possible to produce powder having a solid mass composition and excellent homogeneity, such as Fe-50wt%Cu-20wt%Ag.

[0032] In addition, the Fe-Cu-Ag ternary alloy powder produced according to the above manufacturing method may have a composite particle form, a structure in which alloy elements are homogeneously dispersed throughout the entire alloy powder particle (composite alloy particle structure), a core-shell structure including a core made of Fe and a shell in which the content of Cu and Ag is dominant, and such structural diversity of the alloy powder particles allows for adjustment of electrical conductivity, magnetic properties, and mechanical properties to meet requirements, and has an electrical conductivity approximately 9 times higher than that of conventional nickel (Ni)-based powder materials, and also exhibits magnetic properties at a similar level.

[0033] Furthermore, according to the method for manufacturing a rubber socket for semiconductor testing of the present invention, by applying the Fe-Cu-Ag ternary alloy powder as a conductive filler for the rubber socket for semiconductor testing, it is possible to manufacture a rubber socket that exhibits excellent performance even in test environments for high-performance semiconductor devices, such as High Bandwidth Memory (HBM), which require extreme characteristics, and has an extended lifespan compared to conventional sockets. This extends the replacement cycle of the test socket and consequently brings about cost reduction effects, while presenting new possibilities in the field of semiconductor testing technology.

[0034] In particular, the rubber socket for semiconductor testing according to the present invention can simultaneously secure high electrical conductivity and excellent mechanical durability by including, as a conductive filler, a composite alloy particle structure comprising a plurality of domains containing copper (Cu) and iron (Fe) and silver (Ag) dispersed within or at the boundary of the domains, or a core-shell structure Fe-Cu-Ag ternary alloy powder comprising an iron (Fe) core and a shell rich in copper (Cu) and silver (Ag).

[0035] Figure 1 shows a raw metal prepared for manufacturing Fe-Cu-Ag ternary alloy powder in the present embodiment, an apparatus for carrying out a gas atomization process, and an alloy powder having a composition of Fe-50wt%Cu-20wt%Ag produced by gas atomization from a mixed molten metal of the raw metal.

[0036] Figure 2 is the XRD analysis result of an alloy powder having a composition of Fe-50wt%Cu-20wt%Ag prepared in the present embodiment.

[0037] Figure 3 is a scanning electron microscope (SEM) image of an alloy powder having a composition of Fe-50wt%Cu-20wt%Ag prepared in the present embodiment.

[0038] FIG. 4 is an SEM image showing various structures of an alloy powder having a composition of Fe-50wt%Cu-20wt%Ag prepared in the present embodiment, showing alloy powder particles of Type 1 (Composite Alloy Particle) structure composed of a plurality of domains containing copper (Cu) and iron (Fe) and silver (Ag) dispersed within the domains or at the boundaries between the domains, where alloy elements are homogeneously dispersed within the particles, and alloy powder particles of Type 2 (Core-Shell Particle) and Type 3 (Thin Core-Shell Particle) structures composed of a core mainly containing iron (Fe) and a shell with a high fraction of copper (Cu) and silver (Ag).

[0039] Figure 5 is an SEM image and EDS mapping result of alloy powder particles with a Type 1 (Composite Alloy Particle) structure among alloy powders having a composition of Fe-50wt%Cu-20wt%Ag prepared in the present embodiment.

[0040] Figure 6 is an SEM image and EDS mapping result of alloy powder particles with a Type 2 (Core-Shell Particles) structure among alloy powders having a composition of Fe-50wt%Cu-20wt%Ag prepared in the present embodiment.

[0041] Figure 7 shows the SEM image and EDS mapping results of alloy powder particles with a Type 3 (Thin Core-Shell) structure among the alloy powders having a composition of Fe-50wt%Cu-20wt%Ag prepared in the present embodiment.

[0042] FIG. 8 is a photograph of a rubber-type semiconductor test socket containing Fe-Cu-Ag ternary alloy powder having a composition of Fe-50wt%Cu-20wt%Ag manufactured in the present embodiment as a conductive filler, showing a silver border structure with an exposed metal frame, and a contact array filled with alloy powder within a rubber matrix disposed in the central opening.

[0043] FIG. 9 is a photograph of a rubber-type semiconductor test socket containing Fe-Cu-Ag ternary alloy powder having a composition of Fe-50wt%Cu-20wt%Ag manufactured in the present embodiment as a conductive filler, showing that the metal frame surface is coated with a polyimide (PI) insulating layer and a contact array filled with alloy powder within a rubber matrix is ​​disposed in the central opening.

[0044] In describing the present invention, if it is determined that a detailed description of related known functions or configurations may unnecessarily obscure the essence of the invention, such detailed description will be omitted. Since embodiments according to the concept of the present invention may be subject to various modifications and may take various forms, specific embodiments are illustrated in the drawings and described in detail in this specification or application. However, this is not intended to limit the embodiments according to the concept of the present invention to specific disclosed forms, and it should be understood that they include all modifications, equivalents, and substitutions that fall within the spirit and scope of the present invention.

[0045] The terms used herein are merely for describing specific embodiments and are not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as “comprising” or “having” are intended to specify the existence of the described features, numbers, steps, actions, components, parts, or combinations thereof, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0046]

[0047] The present invention relates to a method for manufacturing a rubber socket for semiconductor testing by producing an Fe-Cu-Ag ternary alloy powder comprising iron (Fe), copper (Cu), and silver (Ag) and applying the Fe-Cu-Ag ternary alloy powder as a conductive filler for a rubber socket, and to the alloy powder and rubber socket produced thereby.

[0048]

[0049] [Method for manufacturing Fe-Cu-Ag ternary alloy powder]

[0050] A method for manufacturing Fe-Cu-Ag ternary alloy powder according to the present invention comprises: (a) a step of preparing raw metals of iron (Fe), copper (Cu), and silver (Ag), respectively; (b) a step of melting each raw metal in the order of iron (Fe), copper (Cu), and silver (Ag) to form a mixed molten metal; and (c) a step of manufacturing alloy powder particles from the mixed molten metal through a gas atomization process.

[0051] The present invention provides a high-performance alloy powder that simultaneously improves electrical characteristics and mechanical properties by performing steps (a) to (c), thereby imparting high strength and durability through iron (Fe) and securing excellent electrical conductivity through copper (Cu) and silver (Ag). In particular, a gas atomization process is used in the manufacturing process of the Fe-Cu-Ag alloy powder, and iron, copper, and silver are sequentially melted (Fe → Cu → Ag) during the manufacturing stage of the alloy molten metal, thereby achieving a supersaturated state that exceeds the solid solution limit between alloy elements and producing a Fe-Cu-Ag ternary alloy powder with a homogeneous composition and solid fraction.

[0052] Step (a) above is a step of preparing raw metals of iron (Fe), copper (Cu), and silver (Ag). Each metal is used as a raw material with high purity and is prepared by weighing it in an accurate weight fraction according to the desired alloy composition. Each raw metal may be prepared in the form of powder or flakes to increase the surface area of ​​the metal to improve the melting rate and to promote homogenization of the mixed molten metal. In particular, metals in the form of flakes have a large specific surface area, which facilitates heat transfer and significantly improves melting efficiency during the melting process.

[0053] Step (b) above is a step of sequentially melting prepared iron (Fe), copper (Cu), and silver (Ag) to form a mixed molten metal, and in this process, sequential melting is required considering the melting temperature of each metal. Iron (Fe), which has the highest melting temperature (1538°C), is melted first, then copper (Cu) is added and melted and mixed, and finally silver (Ag) is added to form a complete mixed molten metal. This step optimizes the interaction between each metal and maintains the homogeneity of the composition so that a secondary phase is not formed.

[0054] Specifically, the above step (b) may comprise: (b-1) a step of melting iron (Fe); (b-2) a step of adding copper (Cu) to the molten iron (Fe) and mixing and melting it; and (b-3) a step of adding silver (Ag) to the mixed molten iron (Fe) and copper (Cu) and mixing and melting it.

[0055] In step (b-1) above, iron (Fe) is melted at a temperature of 1538°C or higher to form a single molten metal. This process is important as the first step to form a homogeneous molten metal, taking into account the high melting temperature and viscosity of Fe.

[0056] In step (b-2) above, copper (Cu) is added to molten iron (Fe) to proceed with mixing and melting. Since the melting temperature of copper is approximately 1085°C, which is lower than that of iron, it is rapidly dissolved into the already molten iron and mixed. This process is carried out while maintaining an appropriate mixing time, taking into account the interaction between the two metals.

[0057] In step (b-3) above, silver (Ag), which has the lowest melting point of about 962°C, is added to the mixed molten metal of iron and copper, and mixing and melting are carried out to form a final mixed molten metal. This stepwise melting process optimizes the melting efficiency between metals and forms a molten metal with a homogeneous composition.

[0058] Meanwhile, in order to ensure complete melting and homogeneous mixing of iron (Fe), copper (Cu), and silver (Ag) in step (b) above, it is preferable to prepare a mixed molten metal at a temperature of 1600 to 1700°C.

[0059] Below 1600℃, it is difficult to form a mixed molten metal due to the incomplete melting of iron (Fe), and above 1700℃, the evaporation of copper and silver is accelerated, which can lead to an unbalanced final alloy composition. Therefore, the above temperature range is desirable for maintaining the stability of the mixed molten metal and the uniformity of its composition.

[0060] Step (c) above is a step of producing alloy powder particles from a mixed molten metal of iron (Fe), copper (Cu), and silver (Ag) through a gas atomization process, in which the molten metal is dispersed into a fine powder form using high-pressure gas. The gas atomization process can control the particle size and structure of the powder by controlling process conditions such as the nozzle diameter and the pressure of an inert gas such as argon (Ar).

[0061] The alloy powder produced in step (c) may have a structure in which each alloy element is homogeneously dispersed throughout the entire particle.

[0062] As described above, alloy powder particles having a structure in which iron (Fe), copper (Cu), and silver (Ag) are homogeneously dispersed within the particles are formed by evenly cooling and dispersing the molten metal in a gas atomization process, and can maintain constant electrical conductivity and mechanical strength, thereby providing reliability in high-precision applications such as semiconductor test sockets and ensuring uniform performance in a test environment.

[0063] The alloy powder having a structure in which each of the above alloy elements is homogeneously dispersed may include not only particles having a uniform single composition throughout the entire particle, but also particles having a composite structure in which alloys of different compositions are homogeneously distributed throughout the entire particle.

[0064] For example, the alloy powder of the above-mentioned composite structure may be a composite alloy particle comprising a plurality of domains containing copper (Cu) as a main component and iron (Fe) and silver (Ag) dispersed within the domains or at the boundaries between the domains.

[0065] In this case, the term "domain" refers to a micro-region within Fe-Cu-Ag ternary alloy powder particles manufactured through a gas atomization process, where copper (Cu) atoms are concentrated. The domain has a size ranging from several nanometers to several micrometers and is homogeneously dispersed throughout the alloy powder particles. Copper exists in a relatively high proportion within the domain, while silver (Ag) and iron (Fe) are mainly distributed within parts of the domain or at the boundaries between domains. This structure forms a composite particle structure in which copper (Cu) regions exhibiting high conductivity, iron (Fe) providing mechanical strength, and silver (Ag) assisting electrical properties are arranged complementarily, thereby providing the effect of simultaneously improving conductivity and durability.

[0066] In addition, the alloy powder produced in step (c) may have a core-shell structure consisting of a core made of iron (Fe) and a shell having a dominant composition of copper (Cu) and silver (Ag). In the shell, the content of copper (Cu) and silver (Ag) is higher than that of iron (Fe) by weight fraction, thereby enhancing the electrical conductivity and surface properties of the shell. In the core-shell structure, the iron (Fe) core provides mechanical strength, while the shell, having a dominant composition of copper (Cu) and silver (Ag), serves to increase conductivity. Alloy powder with such a core-shell structure is ideal for applications requiring high electrical properties, such as semiconductor test sockets.

[0067] In addition, the Fe-Cu-Ag ternary alloy powder may include at least one of (i) Fe-Cu-Ag ternary alloy particles having a microstructure in which iron (Fe), copper (Cu), and silver (Ag) are homogeneously dispersed throughout the entire particle, and (ii) Fe-Cu-Ag ternary alloy particles having a core-shell structure comprising a core made of iron (Fe) and a shell having a composition in which the combined weight fraction of copper (Cu) and silver (Ag) is higher than the weight fraction of iron (Fe).

[0068] Furthermore, the above-mentioned Fe-Cu-Ag ternary alloy powder can consist of particles of both micro-scale and nano-scale. That is, Fe-Cu-Ag nano-alloy composite powder manufactured by controlling the particle size of the alloy powder to a level of several hundred nanometers or less can also be applied as a conductive filler for the rubber-type semiconductor test socket according to the present invention. As the specific surface area of ​​such nano-alloy composite powder increases significantly, its dispersibility within the rubber matrix is ​​enhanced, and it can form a denser conductive network, thereby enabling further improvements in electrical conductivity and mechanical properties. In particular, when nano-scale alloy powder is used, the continuity of the conductive path within the rubber socket is strengthened, allowing for excellent performance even in semiconductor test environments requiring high-frequency signal transmission or high-speed operation.

[0069]

[0070] [Method for manufacturing a rubber socket for semiconductor testing]

[0071] A method for manufacturing a rubber socket for semiconductor testing according to the present invention comprises: (a) a step of preparing raw metals of iron (Fe), copper (Cu), and silver (Ag), respectively; (b) a step of forming a mixed molten metal by melting each of the raw metals in the order of iron (Fe), copper (Cu), and silver (Ag); (c) a step of manufacturing alloy powder particles from the mixed molten metal through a gas atomization process; and (d) a step of manufacturing a rubber socket for semiconductor testing comprising the Fe-Cu-Ag ternary alloy powder.

[0072] Since steps (a) to (c) above have been described in detail in the method for manufacturing Fe-Cu-Ag ternary alloy powder, step (d) above will be described below.

[0073] In step (d) above, a rubber-type semiconductor test socket is manufactured by mixing the previously prepared Fe-Cu-Ag ternary alloy powder into a silicone polymer composition to include it as a conductive filler.

[0074] For example, the above step (d) may comprise: (d-1) a step of preparing a conductive silicon polymer composition comprising Fe-Cu-Ag ternary alloy powder; (d-2) a step of degassing the composition under vacuum; (d-3) a step of injecting the composition into a mold and placing a probe pin or a metal insert; (d-4) a step of curing the composition injected into the mold to form a rubber socket; (d-5) a step of post-curing the formed rubber socket; and (d-6) a step of assembling a contact pin and a socket body.

[0075] First, in step (d-1), a conductive silicone polymer composition is prepared by mixing liquid silicone rubber (LSR) and a curing agent, and then adding Fe-Cu-Ag ternary alloy powder. Subsequently, in step (d-2), the composition is degassed under vacuum to remove bubbles, thereby suppressing the formation of pores within the cured body. In step (d-3), the conductive silicone composition is injected into a mold, and a probe pin or a metal insert is placed simultaneously to form an electrode structure within the socket. Afterward, in step (d-4), the composition injected into the mold is cured at a temperature of 120 to 170°C for 20 to 90 minutes to form a rubber socket body, and in step (d-5), after demolding the molded body from the mold, a post-curing treatment is performed at 150 to 200°C for 10 to 30 minutes to remove residual volatile matter and improve electrical and mechanical stability. Finally, in step (d-6), the contact pins and the socket body are assembled to manufacture a finished rubber-type semiconductor test socket.

[0076] According to the method for manufacturing a rubber socket for semiconductor testing according to the present invention, a Fe-Cu-Ag ternary alloy powder is manufactured through a gas atomization process, comprising iron (Fe) which provides high strength and durability to the alloy, and copper (Cu) and silver (Ag) which impart excellent electrical conductivity, resulting in improved electrical and mechanical properties. In this method, the melting order of Fe, Cu, and Ag (Fe → Cu → Ag) is optimized during the preparation of the molten alloy provided for the gas atomization process to create a supersaturated state that exceeds the solid solution limit between alloy elements, thereby producing a Fe-Cu-Ag ternary alloy powder having a solid mass composition and excellent homogeneity, such as Fe-50wt%Cu-20wt%Ag. By applying the Fe-Cu-Ag ternary alloy powder as a conductive filler for a rubber socket for semiconductor testing, the lifespan is extended compared to existing sockets, and excellent performance is exhibited even in test environments for high-performance semiconductor devices, such as High Bandwidth Memory (HBM), where extreme characteristics are required. Rubber sockets can be manufactured.

[0077]

[0078] The present invention will be described in more detail below with reference to examples.

[0079]

[0080] The embodiments according to this specification may be modified in various different forms, and the scope of this specification is not to be interpreted as being limited to the embodiments described below. The embodiments of this specification are provided to more fully explain this specification to those with average knowledge in the art.

[0081]

[0082] <Example 1> Preparation of Fe-Cu-Ag Ternary Alloy Powder and Evaluation of Properties

[0083] This embodiment includes the manufacturing process of a ternary alloy powder containing Fe, Cu, and Ag, and the results of the characteristic evaluation of the said ternary alloy powder.

[0084] As shown in Fig. 1, each raw metal was prepared in a total weight ratio of 80g, consisting of 30wt% flake-shaped iron (Fe), 50wt% flake-shaped copper (Cu), and 20wt% powder-shaped silver (Ag). Next, iron (Fe) was loaded into a carbon crucible and heated to 1650°C to completely melt it, after which copper (Cu) was added, mixed, and melted to produce a mixed molten iron (Fe) and copper (Cu). Subsequently, silver (Ag) was added, mixed, and melted to obtain a mixed molten iron (Fe), copper (Cu), and silver (Ag). A gas spraying process was then performed on the resulting mixed molten iron (Fe), copper (Cu), and silver (Ag) under conditions of a nozzle diameter of 3.0mm, a gas pressure of 20kPa, a voltage of 150V, and a current of 16A, thereby successfully pulverizing the Fe-Cu-Ag ternary alloy. However, when the nozzle diameter was 0.1 mm, 0.2 mm, or 0.4 mm during gas atomization, no powder was ejected, and the same phenomenon was observed when the pressure was less than 20 kPa. In addition, when the pressure exceeded 20 kPa, alloy powder was not produced due to excessive pressure. This indicates that nozzle size and pressure are important variables in the manufacturing process.

[0085] As a result of performing phase analysis on the Fe-50wt%Cu-20wt%Ag alloy powder prepared in this example through X-ray diffraction analysis (XRD), it was confirmed that the alloy powder composed of Fe, Cu and Ag has a uniform structure without forming secondary phases (Fig. 2).

[0086] It was confirmed that the Fe-50wt%Cu-20wt%Ag alloy powder particles produced in this embodiment can consist of relatively large particles (particle size 63–90㎛) as well as relatively small particles (particle size less than 63㎛) depending on the gas atomization process conditions (Fig. 3), which shows that the Fe-Cu-Ag ternary alloy powder produced by the gas atomization method can satisfy the desired particle size distribution.

[0087] As a result of performing Energy Dispersive X-ray Spectroscopy (EDS) to analyze the composition of the Fe-50wt%Cu-20wt%Ag alloy powder prepared in this example, it was confirmed that all of the prepared powders were Fe-Cu-Ag ternary alloys.

[0088] As a result of investigating the structural characteristics of the Fe-50wt%Cu-20wt%Ag alloy powder prepared in this example, it was classified into three main types as shown in Fig. 4. First, there is a composite alloy powder (Type 1) in which Fe, Cu, and Ag are homogeneously dispersed throughout the entire powder particle. Second, there is an alloy powder (Type 2) having a structure in which Fe serves as the core and Cu and Ag form the shell. Third, there is a structure (Type 3) composed of a thin Fe core and a Cu-Ag shell. These structural characteristics could be controlled depending on the manufacturing conditions and composition ratio.

[0089] Figures 5 to 7 show the results of SEM and EDS mapping techniques for each of the Fe-Cu-Ag ternary alloy powders of Type 1, Type 2, and Type 3 structures.

[0090] Figure 5 shows the SEM image and EDS mapping results of a composite alloy powder particle with a Type 1 (Composite Alloy Particle) structure among the alloy powders having a composition of Fe-50wt%Cu-20wt%Ag prepared in the present embodiment. It was confirmed that Fe, Cu, and Ag are evenly distributed throughout the particle, and that multiple domains with copper (Cu) as the main component are formed inside the particle. Additionally, it was confirmed that iron (Fe) and silver (Ag) are uniformly dispersed within the copper domains and at the boundaries between domains. In particular, the Fe signal is observed as a locally concentrated pattern, while Ag exhibits the characteristic of being distributed over a relatively wide area within the copper matrix.

[0091] Figure 6 shows the SEM image and EDS mapping results of alloy powder particles with a Type 2 (Core-Shell Particles) structure among the alloy powders having a composition of Fe-50wt%Cu-20wt%Ag prepared in the present embodiment. Through the SEM image, a core-shell structure in which the Fe core and the Cu / Ag shell are clearly distinguished can be observed, and the EDS mapping results visually demonstrate a structure in which Fe constitutes the core and Cu and Ag form the shell.

[0092] Figure 7 shows the SEM image and EDS mapping results of alloy powder particles with a Type 3 (Thin Core-Shell) structure among the alloy powders having a composition of Fe-50wt%Cu-20wt%Ag prepared in the present embodiment, where the thin core-shell structure is clearly visible in the SEM image. Through EDS mapping, the Fe core and the thin, uniformly distributed Cu / Ag shell surrounding it can be confirmed.

[0093] Figures 5 to 7 demonstrate the design flexibility and structural diversity of the Fe-Cu-Ag alloy powder in the present invention, showing that each structure can be designed to be suitable for various applications.

[0094] As a result of evaluating the electrical properties of the Fe-50wt%Cu-20wt%Ag alloy powder prepared in this example, the electrical conductivity after heat treatment increased by approximately 9 times compared to nickel (Ni) powder, as shown in Table 1 below. In addition, the magnetic properties were found to be at a level similar to that of nickel (Ni) powder. This demonstrates that the Fe-Cu-Ag ternary alloy powder prepared according to the present invention is an excellent material in terms of conductivity and magnetic properties.

[0095]

[0096] [Table 1]

[0097]

[0098]

[0099] Example 2> Fabrication of a rubber-type semiconductor test socket containing Fe-Cu-Ag ternary alloy powder as a conductive filler

[0100] In this embodiment, a semiconductor test socket was manufactured by using the Fe-Cu-Ag ternary alloy powder (Fe-50wt%Cu-20wt%Ag) prepared in Example 1 as a conductive filler, filling it into a silicone rubber matrix, and molding it.

[0101] (1) Rubber socket design

[0102] The pin pitch, terminal arrangement (BGA / pad matrix), and external dimensions of the target semiconductor package were measured to determine the effective contact area of ​​the socket, rubber thickness (0.8 mm), and hardness (50 based on Shore A). A micro-hole / channel pattern was designed based on the position of the contact pins (probe pins) or metal contact pattern, and a target filling rate (50 vol%) and distribution uniformity standard for Fe-50wt%Cu-20wt%Ag alloy powder were set so that current paths within the rubber are continuously formed.

[0103] (2) Manufacturing mold

[0104] Master molds (upper and lower dies) were fabricated using micro-milling. Guides for pin positioning and alignment keys were formed in the molds, and gate / vent structures were designed considering rubber flow and degassing paths. Mold release and wear resistance were ensured through DLC (Diamond-Like Carbon) coating.

[0105] (3) Silicone rubber mixing and pretreatment

[0106] An additive (Platinum-cure) silicone prepolymer and a curing agent were prepared in a weight ratio of 10:1, and small amounts of a viscosity modifier and a dispersant were added. Subsequently, Fe-50wt%Cu-20wt%Ag alloy powder was added in small amounts stepwise, and a conductive silicone composition was prepared by performing high-shear mixing at 1000 rpm for 5 minutes in a planetary vacuum mixer. After reaching the target filling rate (50 vol%), bubbles were removed by degassing at 5 mbar or less for 10 minutes.

[0107] (4) Mold injection and pin placement

[0108] Under vacuum, the probe pin was placed in a preheated mold, and a conductive silicone composition was injected. After clamping the mold, vacuum-pressurization was performed three times to ensure that the rubber completely filled the micro-pattern and the area around the pin.

[0109] (5) Curing (high temperature treatment)

[0110] First curing was performed at a temperature of 150 ℃ for 60 minutes in the mold state, and after demolding, post-curing was performed at 170 ℃ for 20 minutes to remove residual volatile matter.

[0111] (6) Demolding and post-processing

[0112] After demolding the socket, the surface was cleaned by removing burrs, fine shape correction, and plasma cleaning (Fig. 8). Subsequently, a polyimide (PI) protective film lamination was performed on the socket frame (Fig. 9).

[0113]

[0114] The invention is not limited to the above embodiments and can be manufactured in various different forms, and those skilled in the art will understand that the invention can be implemented in other specific forms without altering the technical concept or essential features of the invention. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive.

Claims

1. (a) A step of preparing the raw metals of iron (Fe), copper (Cu), and silver (Ag), respectively; (b) A step of forming a mixed molten metal by melting each raw metal in the order of iron (Fe), copper (Cu), and silver (Ag); (c) a step of producing alloy powder from the mixed molten metal through a gas atomization process; and (d) a step of manufacturing a rubber socket for semiconductor testing comprising the above Fe-Cu-Ag ternary alloy powder; comprising Method for manufacturing Fe-Cu-Ag ternary alloy powder.

2. In Paragraph 1, A method for manufacturing Fe-Cu-Ag ternary alloy powder, characterized by preparing a raw metal having a powder or flake shape in step (a) above.

3. In Paragraph 1, A method for manufacturing Fe-Cu-Ag ternary alloy powder, characterized in that the above step (b) comprises the following steps (b-1) to (b-3): (b-1) A step of melting iron (Fe); and (b-2) A step of adding copper (Cu) to molten iron (Fe), mixing, and melting; (b-3) A step of adding silver (Ag) to a mixed molten iron (Fe) and copper (Cu) and mixing and melting it.

4. In Paragraph 1, A method for manufacturing Fe-Cu-Ag ternary alloy powder, characterized by preparing a mixed molten metal of iron (Fe), copper (Cu), and silver (Ag) at a temperature of 1600 to 1700 ℃ in step (b) above.

5. In Paragraph 1, A method for manufacturing Fe-Cu-Ag ternary alloy powder characterized by manufacturing Fe-Cu-Ag ternary alloy powder in which the alloy composition of iron (Fe), copper (Cu), and silver (Ag) is uniform throughout the entire particle in step (c) above.

6. In Paragraph 1, A method for manufacturing Fe-Cu-Ag ternary alloy powder, characterized by manufacturing, in step (c) above, a Fe-Cu-Ag ternary alloy powder having a composite alloy particle structure comprising a plurality of domains including copper (Cu); and iron (Fe) and silver (Ag) dispersed within the domains or at the boundaries between the domains.

7. In Paragraph 1, A method for manufacturing Fe-Cu-Ag ternary alloy powder, characterized in that, in step (c) above, a core-shell structured Fe-Cu-Ag ternary alloy powder comprising a core made of iron (Fe) and a shell having a composition in which the combined weight fraction of copper (Cu) and silver (Ag) is higher than the weight fraction of iron (Fe).

8. In Paragraph 1, A method for manufacturing Fe-Cu-Ag ternary alloy powder, characterized by producing alloy powder particles by spraying a mixed molten metal containing iron (Fe), copper (Cu), and silver (Ag) in step (c) at a pressure of 20 kPa through a nozzle with a diameter of 3 mm.

9. (i) Fe-Cu-Ag ternary alloy particles having a composite alloy particle structure comprising a plurality of domains containing copper (Cu) and iron (Fe) and silver (Ag) dispersed within the domains or at the boundaries between the domains, or (ii) Fe-Cu-Ag ternary alloy particles having a core-shell structure comprising a core made of iron (Fe) and a shell having a composition in which the combined weight fraction of copper (Cu) and silver (Ag) is higher than the weight fraction of iron (Fe). Fe-Cu-Ag ternary alloy powder. 10.(a) A step of preparing the raw metals of iron (Fe), copper (Cu), and silver (Ag), respectively; (b) A step of forming a mixed molten metal by melting each raw metal in the order of iron (Fe), copper (Cu), and silver (Ag); (c) a step of producing alloy powder from the mixed molten metal through a gas atomization process; and (d) a step of manufacturing a rubber socket for semiconductor testing comprising the above Fe-Cu-Ag ternary alloy powder; comprising Method for manufacturing a rubber socket for semiconductor testing.

11. In Paragraph 10, A method for manufacturing a rubber socket for semiconductor testing, characterized in that, in step (d) above, a silicone polymer composition containing Fe-Cu-Ag ternary alloy powder is prepared, and the composition is injected into a mold and cured to manufacture a rubber-type semiconductor test socket.

12. In Paragraph 11, A method for manufacturing a rubber socket for semiconductor testing, wherein the above step (d) comprises the following steps (d-1) to (d-6): (d-1) A step of preparing a conductive silicone polymer composition by mixing liquid silicone rubber (LSR) and a curing agent, and then adding Fe-Cu-Ag ternary alloy powder; (d-2) A step of removing bubbles by degassing the conductive silicone polymer composition under vacuum; (d-3) Injecting the conductive silicon polymer composition into a mold and placing a probe pin or a metal insert; (d-4) A step of forming a rubber socket by curing the silicone polymer composition injected into the mold at 120–170 ℃ for 20–90 minutes; (d-5) A step of performing post-curing treatment at 150–200°C for 10–30 minutes after demolding the molded rubber socket from the mold; and (d-6) Step of assembling the contact pins and the socket body.

13. A rubber socket for semiconductor testing comprising Fe-Cu-Ag ternary alloy powder as a conductive filler, The above Fe-Cu-Ag ternary alloy powder is, (i) Fe-Cu-Ag ternary alloy particles having a composite alloy particle structure comprising a plurality of domains containing copper (Cu) and iron (Fe) and silver (Ag) dispersed within the domains or at the boundaries between the domains, or (ii) A rubber socket for semiconductor testing characterized by comprising Fe-Cu-Ag ternary alloy particles having a core-shell structure, comprising a core made of iron (Fe) and a shell having a composition in which the combined weight fraction of copper (Cu) and silver (Ag) is higher than the weight fraction of iron (Fe).

14. In Paragraph 13, A rubber socket for semiconductor testing characterized in that the above-mentioned Fe-Cu-Ag ternary alloy powder has a composition of Fe-50wt%Cu-20wt%Ag.

15. In Paragraph 13 or 14, A rubber socket for semiconductor testing characterized in that the above-mentioned Fe-Cu-Ag ternary alloy powder is dispersed within a silicon polymer matrix at a packing ratio of 50 vol%.

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