Compression contact type high reliability semiconductor storage device and storage system including same

Abstract

Disclosed are a compression contact type semiconductor storage device detachably mounted on a main board while providing stable and reliable electrical contact even in a vibrating environment, and a storage system including same. This semiconductor storage device comprises: a storage device substrate on which a semiconductor storage element and a controller that controls same are mounted; and a compression contact structure electrically connecting the storage device substrate to the main board by a compression force generated by screw fastening. Accordingly, the present invention provides the storage device which provides high contact reliability and mechanical stability even in a vibrating environment and allows for easy maintenance and replacement.

Description

Compression contact type high-reliability semiconductor storage device and storage system including the same

[0001] The present invention relates to a semiconductor storage device, and more specifically, to a semiconductor storage device configured to provide robust and stable electrical and mechanical contact by means of compressive force using screws for electrical connection with a system mainboard, so as to ensure stability and reliability even in vibrating environments such as vehicles or robots, and to be replaceable as needed.

[0002] With the advancement of electronic technology and the advent of the data era, there is an increasing demand for high-speed, high-capacity, and high-reliability storage devices capable of collecting and processing continuously increasing data, including surrounding information, in real time and effectively utilizing it, not only in automobiles equipped with advanced technologies such as infotainment and autonomous driving, but also in mechanical devices exposed to harsh environments including vibration, such as aircraft, drones, satellites, and robots. Although semiconductor storage devices are utilized for this purpose, since the aforementioned mechanical devices typically require a long service life of more than 10 years, the storage devices need to be configured to be replaceable with larger storage capacities or higher specifications to cope with the continuously increasing amount of data.

[0003] Conventional semiconductor storage devices are primarily implemented in BGA package forms or as edge cards such as M.2 and EDSFF. However, BGA package storage devices are soldered directly to the motherboard, making them impossible to detach and thus posing a problem of difficulty in repair or replacement. On the other hand, while edge card storage devices can be detached via connectors, the small size and spacing of the connectors and contact pads lead to reduced reliability, such as contact failures in vibrating environments or short circuits between connector leads and adjacent pads.

[0004] The present invention has a technical objective of providing a compression contact type semiconductor storage device that is detachable from a main board and can provide high contact reliability and mechanical stability even in a vibrating environment. Furthermore, another technical objective of the present invention is to provide a semiconductor storage device configured to allow for stable replacement for purposes such as maintenance or upgrades, even if repeated detachment is not necessarily required.

[0005] A compression contact type semiconductor storage device according to an embodiment of the present invention for achieving the aforementioned objectives comprises a storage device substrate including a semiconductor storage device such as a NAND flash memory and a controller semiconductor that controls the management and input / output of data stored in the semiconductor storage device and performs data communication with a main board. The semiconductor storage device and the controller semiconductor may be mounted on at least one surface of the storage device substrate, and an array-type contact pad may be formed on the other surface for electrical connection with the main board.

[0006] Between the storage device substrate and the main board, an elastic connector is disposed to electrically connect the contacts of the array-type contact pads and the corresponding contacts of the main board, and a robust and stable electrical connection between the storage device substrate and the main board is maintained by the compressive force generated by fastening using screws.

[0007] At this time, on the other side of the storage device substrate, the semiconductor storage device or other related components may be additionally mounted, and the thickness of the components may be configured not to be thicker than the thickness of the connector.

[0008] In order to make the fastening of the above screw more robust and secure, a metal plate may be further provided on at least one of the upper part of the storage device substrate or the lower part of the main board. The metal plate may perform the function of physically protecting the semiconductor storage device and improving mechanical stability by dispersing the fastening force, as well as dispersing or mitigating heat generated from the semiconductor storage device, and furthermore, may provide a function as a shielding member to reduce electromagnetic interference. At this time, the metal plate placed on the upper part may have a cavity structure for accommodating components mounted on the upper surface of the storage device substrate.

[0009] The storage device substrate may further be equipped with a power loss protection circuit to minimize loss by recording and protecting data even in the event of power loss due to unexpected situations such as a collision. The power loss protection circuit includes a charge storage component, such as a capacitor, and a circuit that detects the state of the input power and controls the charging and discharging of the charge storage component, and operates as an auxiliary power source when the power supply is interrupted so that the data recording and storage operation can be completed.

[0010] In addition, to improve performance, a semiconductor such as DRAM, which the controller semiconductor can use as a buffer memory, may be further mounted on the storage device substrate. Furthermore, a memory such as DRAM, which is electrically connected and communicates separately from the main board, may be further disposed on the storage device substrate so that an external processor semiconductor can access and use it independently. Accordingly, the semiconductor storage device can simultaneously provide the function of a memory module along with the function of a storage device.

[0011] In addition, the present invention may further include a module substrate composed of memory, such as DRAM, separately from the storage device substrate, wherein the memory module substrate is positioned below the main board and the storage device substrate is positioned above the main board, so that they can be fixed to and electrically connected to the main board by the compressive force generated by the same screw. At this time, the metal plate that can be positioned on the side of the module substrate may also have a cavity structure similar to the metal plate that can be positioned on the side of the storage device substrate.

[0012] The compression contact type semiconductor storage device according to the present invention is a planar semiconductor storage device equipped with a semiconductor storage device and a controller semiconductor, and can maintain a stable electrical connection state even in a vibrating environment through a compression force generated by screw fastening and an elastic contact structure, and provides a structure that facilitates maintenance and performance upgrades due to a detachable structure using screws.

[0013] Furthermore, the semiconductor storage device according to the present invention includes a controller internally, thereby enabling independent management and input / output of data stored in the semiconductor storage device. Moreover, by optionally providing a memory such as DRAM capable of direct communication with an external processor, the functions of a storage device and a memory module can be provided simultaneously, which can be effectively applied to on-device artificial intelligence products such as autonomous vehicles and robots.

[0014] FIG. 1 is a perspective view illustrating the basic configuration of a compression contact type semiconductor storage device (CARSSD) and a storage system including the same according to one embodiment of the present invention.

[0015] FIGS. 2a to 2d are drawings illustrating various embodiments of elastic contact terminals included inside the compression connector shown in FIG. 1.

[0016] FIG. 3 is a perspective view illustrating a compression contact type semiconductor storage device and a storage system including the same according to another embodiment of the present invention, further including a metal plate.

[0017] FIG. 4 is a perspective view illustrating a compression contact type semiconductor storage device and a storage system including the same according to another embodiment of the present invention, wherein the storage device substrate of FIG. 1 additionally has a memory capable of communicating independently with an external processor.

[0018] Hereinafter, a compression-attached reliable semiconductor storage device (CARSSD) and a storage system including the same according to an embodiment of the present invention will be described in detail with reference to the attached drawings. The embodiments described below are merely examples to aid in understanding the present invention, and the technical concept of the present invention is not limited thereto. It is obvious that various modifications and implementations can be made by those skilled in the art within the scope described in the claims. Furthermore, in the drawings, the size, thickness, shape, etc., of each component may be exaggerated for clarity of explanation, and throughout the specification, the same reference numerals indicate the same or corresponding components.

[0019] FIG. 1 is a perspective view illustrating a compression contact type semiconductor storage device (CARSSD) according to one embodiment of the present invention and a state in which the same is mounted on a main board.

[0020] Referring to FIG. 1, the CARSSD of the present invention comprises a storage device substrate (100) and a compression connector (200) connected to the storage device substrate to provide an electrical connection.

[0021] On at least one surface of the storage device substrate (100), a plurality of non-volatile semiconductor storage devices (110), such as NAND Flash memory, and a controller semiconductor (120) that controls the management and input / output of data stored in the semiconductor storage devices (110) and performs data communication with the main board (500) are mounted.

[0022] Additionally, as illustrated in FIG. 1, at least one of a buffer memory (140) for assisting the operation of a controller semiconductor (120) and a power loss protection circuit (160) for minimizing data loss in the event of power loss may be mounted on the storage device substrate (100). In one embodiment, the buffer memory may be a DRAM.

[0023] The above power loss protection circuit (160) may include a charge storage component such as a capacitor and a circuit that detects the state of the input power and controls the charging and discharging of the charge storage component, and when the power supply is cut off or drops below a threshold value, it operates as an auxiliary power source so that the data recording or storage operation can be completed normally.

[0024] In the embodiment illustrated in FIG. 1, the semiconductor storage device (110), controller semiconductor (120), buffer memory (140), and power loss protection circuit (160) are shown mounted on one side (hereinafter, the first side) of the storage device substrate (100), but the present invention is not limited thereto. If necessary, some or all of the components may be placed on the other side of the storage device substrate (100) on which pads for electrical connection with the outside are formed.

[0025] A plurality of array-type contact pads (130) are formed on the storage device substrate (100) for electrical connection with the outside, and a plurality of corresponding connection pads (530) are formed on the main board (500) to which the CARSSD is connected, which provide electrical connection corresponding to the contact pads (130). Meanwhile, for convenience of explanation, only one area of ​​the entire configuration of the main board (500) where the CARSSD is placed and electrically connected is shown in the drawing, and the remaining configuration of the main board is omitted from the drawing.

[0026] For mutual positional alignment of the storage device substrate (100), compression connector (200), and main board (500), an alignment rod (250) and a corresponding alignment hole (150, 550) may be used, but are not limited thereto, various alignment structures including a notch and groove structure may be applied.

[0027] The storage device board (100), compression connector (200), and main board (500) are compressed and fixed to each other by screws (Screw; 310) that are fastened through screw holes (Screw Hole; 321, 322, 325) formed in each component, and stable mechanical and electrical contact is maintained even in a vibrating environment by the compression force generated by the screw fastening.

[0028] With such alignment structure and compression fastening structure, the CARSSD can be detachably connected to the main board (500).

[0029] A compression connector (200) is positioned between a contact pad (130) of a storage device board (100) and a corresponding connection pad (530) of a main board (500) to provide an electrical connection between the CARSSD and the main board. The area of ​​the compression connector (200) may be smaller than that of the storage device board (100) and may be located on one side corresponding to the array-type contact pad (130) of the storage device board (100).

[0030] A plurality of elastic contact terminals (210) are disposed on the compression connector (200), and the elastic contact terminals (210) can be aligned and supported by a dielectric guide (220). This allows contact stability to be maintained even under repeated attachment and detachment and vibration conditions.

[0031] FIGS. 2a to 2d are drawings illustrating the structure of an elastic contact terminal (210) classified according to the contact method.

[0032] In the embodiment illustrated in FIGS. 2a and 2b, the elastic contact terminal (210) has a structure that elastically contacts both the contact pad (130) of the storage device substrate (100) and the corresponding connection pad (530) of the main board (500). This double-sided elastic contact structure can provide relatively uniform contact pressure to both contact surfaces by means of compressive force, thereby ensuring high contact reliability even in a vibrating environment.

[0033] The example illustrated in FIG. 2a illustrates a cantilever-type elastic structure (211), and the example illustrated in FIG. 2b illustrates a pogo pin-type elastic structure (212), respectively; the structures of the elastic contact terminals illustrated in FIG. 2a and FIG. 2b are merely one embodiment for implementing a double-sided elastic contact structure. That is, the double-sided elastic contact structure of the present invention is not limited to the illustrated shapes and can be implemented in various elastic structures, including a C-shaped spring structure.

[0034] In another embodiment illustrated in FIGS. 2c and 2d, the elastic contact terminal (210) elastically contacts only one side of the storage device substrate (100) or the main board (500), while the other side is electrically and mechanically fixed in a manner such as soldering. As such, the single-sided elastic contact structure illustrated in FIGS. 2c and 2d is advantageous for improving the stability of the manufacturing process or structural durability. The examples illustrated in FIGS. 2c and 2d illustrate cantilever-type (211) and pogo pin-type (212) structures, respectively, and these are also merely one of the specific embodiments for implementing a single-sided elastic contact structure.

[0035] Although the present invention has been illustrated and described in relation to specific embodiments in the above description, anyone with ordinary knowledge in the art will readily understand that various modifications and changes are possible without departing from the spirit and scope of the invention as defined by the claims.

[0036] FIG. 3 illustrates an embodiment of the CARSSD basic structure of FIG. 1 that further includes an upper metal plate (400) and a lower metal plate (450). It is obvious that either the upper metal plate or the lower metal plate may be used as needed.

[0037] The metal plate may provide at least one of the following functions: a function to improve mechanical stability by dispersing the fastening force resulting from screw fastening, a function to disperse or mitigate heat generated in the CARSSD, and a shielding function to reduce electromagnetic interference.

[0038] In one embodiment, the upper metal plate (400) is positioned on the upper side of the storage device substrate (100) and may include a cavity (410) that is open downward to accommodate a storage device (110), a controller semiconductor (120), or a major component mounted on the first surface of the storage device substrate (100). Within the cavity (410), a cushioning member made of a thermally conductive material may be optionally placed on the upper side of a component that generates a large amount of heat or has a high height, thereby ensuring close contact with the upper metal plate to improve heat transfer efficiency and mitigate component damage in a compression bonding or vibration environment.

[0039] The lower metal plate (450) can be placed on the lower part of the main board (500) to contribute to structural support and heat dissipation, and can be fastened together with the upper metal plate (400) by screws (310) through corresponding screw holes.

[0040] FIG. 4 illustrates an embodiment that further includes a memory semiconductor (145) directly accessible by an external processor in addition to the CARSSD configuration of FIG. 1.

[0041] The above memory semiconductor (145) is intended for an external processor to directly write and read data without passing through the controller semiconductor (120), thereby enabling the CARSSD to simultaneously provide the function of a memory module along with the function of a storage device.

[0042] The array-type contact pad (130) formed on the storage device substrate (100) has a structure that arranges multiple contacts in a two-dimensional manner, so additional contacts can be sufficiently formed in addition to the contacts used for communication of the storage device. Accordingly, the memory semiconductor (145) is allocated a portion of the array-type contact pad (130) and connected in parallel with an external processor, thereby sufficiently satisfying the input / output requirements as a memory module.

[0043] For convenience of explanation, the power loss protection circuit (160) and the metal plates (400, 450) are not shown in FIG. 4, but the power loss protection circuit and the metal plates may be included in this embodiment in the same way as in the embodiments of FIG. 1 and FIG. 3, respectively.

[0044] In addition, in another embodiment, the memory semiconductor (145) may be placed on a separate memory module substrate separated from the storage device substrate (100), and the memory module substrate may be placed on the opposite side of the storage device substrate (100) with the main board (500) in between, and may be compressed and fixed to the main board by the same screw as the storage device substrate.

[0045] Furthermore, in another embodiment, a storage device substrate (100), a memory module substrate, and a main board (500) may be arranged in a stacked structure. In this case, a first compression connector may be disposed between the storage device substrate (100) and the memory module substrate, and a second compression connector may be disposed between the memory module substrate and the main board (500). The second compression connector may include more contacts than the first compression connector to accommodate the number of contacts required for the storage device and the memory module. The stacked structure may also be configured so that mechanical fixation and electrical connection between each component are simultaneously achieved by the compressive force generated by screw fastening.

[0046] Although the present invention has been illustrated and described in relation to specific embodiments in the above description, anyone with ordinary knowledge in the art will readily understand that various modifications and changes are possible without departing from the spirit and scope of the invention as defined by the claims.

[0047] <Explanation of Symbols>

[0048] 100: Storage device board

[0049] 11O: Semiconductor storage device

[0050] 120: Controller semiconductor

[0051] 140: Buffer memory

[0052] 145: Memory semiconductor

[0053] 150, 550: Alignment hole

[0054] 160: Power loss protection circuit

[0055] 200: Compression connector

[0056] 210: Elastic contact terminal

[0057] 211: Cantilever-type elastic structure

[0058] 212: Pogo pin-type elastic structure

[0059] 220: Genome Guide

[0060] 250: Alignment bar

[0061] 310: Screw

[0062] 321, 322, 325: Screw holes

[0063] 400, 450: Metal plate

[0064] 410: Joint

[0065] 530: Corresponding connection pad

[0066] The present invention provides a compression contact type semiconductor storage device that is detachable from a main board and can provide high contact reliability and mechanical stability even in a vibration environment.

[0067] These semiconductor storage devices can be applied not only to automobiles but also to machinery exposed to harsh environments, including vibrations, such as aircraft, drones, satellites, and robots.

Claims

1. Semiconductor storage devices, and A storage device substrate including a controller semiconductor that controls the management and input / output of data stored in the semiconductor storage device and performs data communication with a main board; and It is disposed between the storage device substrate and the main board, and A semiconductor storage device comprising: a compression contact structure that electrically connects the storage device substrate and the main board by a compressive force generated by screw fastening.

2. In Claim 1, The above compression contact structure is a semiconductor storage device including elastic contact terminals.

3. In Claim 1, A semiconductor storage device configured such that the above screw fastening applies a compressive force between the storage device substrate and the main board.

4. In Claim 1, A semiconductor storage device comprising a metal plate further included on at least one of the upper portion of the storage device substrate or the lower portion of the main board.

5. In Claim 4, The above metal plate has the function of improving mechanical stability by dispersing the fastening force, and, Dispersing or mitigating heat generated from the above semiconductor storage device, and A semiconductor storage device that provides at least one shielding function for reducing electromagnetic interference.

6. In Claim 1, A semiconductor storage device having a power loss protection circuit further included in the above storage device substrate to prevent data loss in the event of power loss.

7. In Claim 1, A semiconductor storage device in which the above storage device substrate further includes a buffer memory to assist the operation of the controller semiconductor.

8. Semiconductor storage devices, and A storage device substrate including a controller semiconductor that controls the management and input / output of data stored in the semiconductor storage device and performs data communication with a main board; and It is disposed between the storage device substrate and the main board, and A compression contact structure that electrically connects the storage device substrate and the main board by a compressive force generated by screw fastening; comprising, On the above storage device substrate, A semiconductor storage device further comprising a memory semiconductor that allows an external processor to directly access, read, and write data without passing through the controller semiconductor.

9. In Claim 8, The above memory semiconductor is placed on a memory module substrate separated from the above storage device substrate, and The memory module substrate is positioned on the opposite side of the storage device substrate with the main board in between, and A semiconductor storage device that is compressed and fixed to the main board by screw fastening identical to that of the storage device substrate.

10. In claim 8 or 9, A semiconductor storage device in which the storage device substrate, the memory module substrate, and the main board are arranged in a stacked structure.

11. In Claim 10, A first compression contact structure is disposed between the storage device substrate and the memory module, and A semiconductor storage device having a second compression contact structure having more contacts than the first compression contact structure disposed between the memory module substrate and the main board.

12. In storage systems, Mainboard; and A storage system comprising a semiconductor storage device according to claim 1 or claim 8.

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