Display module and electronic device comprising same

Abstract

A display module according to one embodiment of the present disclosure may comprise: a glass substrate including a first surface, a second surface opposite to the first surface, and a plurality of through-holes extending from the second surface to the first surface; a plurality of through-electrodes, each of which partially fills one through-hole among the plurality of through-holes; and a plurality of micro LEDs, each of which is disposed in one through-hole among the plurality of through-holes and is electrically connected to one through-electrode among the plurality of through-electrodes.

Description

Display module and electronic device including the same

[0001] The present disclosure relates to a display module and an electronic device including the same.

[0002] LEDs (light emitting diodes) are used in various industrial fields due to their relatively high luminous efficiency and long lifespan, and are being put into practical use in the display field as well as in general lighting.

[0003] Micro LEDs, a next-generation light-emitting device, are more efficient than LCDs or LEDs and, similar to OLEDs, do not require additional filtering or conversion to directly emit pure colors from subpixels. Display modules utilizing Micro LEDs can achieve wide viewing angles, high efficiency, vivid colors, and high definition.

[0004] Multiple pixels are arranged in a display module. Each pixel consists of three R / G / B subpixels. Subpixels are typically based on blue LEDs and are equipped with a phosphor formed on the light-emitting surface of the blue LED to emit a desired color (e.g., red, green) for each subpixel. For blue-emitting LEDs, only the blue LED is used without a phosphor.

[0005] The information described above is provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0006] Various aspects of the present invention aim to resolve the problems and / or disadvantages mentioned above and to provide the advantages described below. Accordingly, one aspect of the present invention is to provide a display module and an electronic device including the same.

[0007] Additional aspects will be presented in part in the following description, and in part will be apparent from the description or will be known through the practice of the presented embodiments.

[0008] According to one aspect of the present disclosure, a display module is provided. The display module may include a glass substrate comprising a first surface, a second surface opposite to the first surface, and a plurality of through holes extending from the second surface to the first surface; a plurality of through electrodes, each through electrode partially filling one of the plurality of through holes; and a plurality of micro LEDs, each micro LED disposed in one of the plurality of through holes and electrically connected to one of the plurality of through electrodes.

[0009] According to one aspect of the present disclosure, an electronic device is provided. The electronic device may include one or more display modules and a driver IC configured to generate a driving signal to be supplied to the one or more display modules. The display module may include a glass substrate comprising a first surface and a second surface opposite to the first surface, and a plurality of through holes extending from the second surface to the first surface; a plurality of through electrodes, each through electrode partially filling one of the plurality of through holes; and a plurality of micro LEDs, each micro LED disposed in one of the plurality of through holes and electrically connected to one of the plurality of through electrodes.

[0010] Other aspects, advantages, and key features of the present invention will become clear to those skilled in the art through the following detailed description provided together with the accompanying drawings, which discloses various embodiments of the invention.

[0011] Specific aspects, features, and advantages of the above and other embodiments of the present disclosure will become more apparent from the description below, together with the accompanying drawings.

[0012] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0013] FIG. 2 is a plan view of a display device according to one embodiment of the present disclosure.

[0014] FIG. 3 is a drawing showing an example of a pixel array constituting a unit module of a display device according to one embodiment of the present disclosure.

[0015] FIG. 4 is a cross-sectional view of a display module according to one embodiment of the present disclosure.

[0016] FIG. 5 is an enlarged view of part A shown in FIG. 4 according to one embodiment of the present disclosure.

[0017] FIG. 6 is a cross-sectional view of a display module according to one embodiment of the present disclosure.

[0018] FIGS. 7a and 7b are drawings illustrating various examples of a layer structure of a display module according to various embodiments of the present disclosure.

[0019] FIG. 8 is a cross-sectional view of a display module according to one embodiment of the present disclosure.

[0020] FIG. 9 is a cross-sectional view of a display module according to one embodiment of the present disclosure.

[0021] It should be noted that the same reference numbers are used throughout the drawing to denote identical or similar elements, features, and structures.

[0022] The following description, provided with reference to the accompanying drawings, is intended to aid in a comprehensive understanding of the various embodiments of the present invention as defined in the claims and their equivalents. While various specific details are included to aid understanding, they should be considered merely illustrative. Accordingly, those skilled in the art will understand that the various embodiments described herein may be varied or modified without departing from the scope and spirit of the invention. Furthermore, for clarity and brevity, descriptions of well-known functions and structures may be omitted.

[0023] The terms and words used in the following description and claims are not limited to their literary meanings and are used by the inventor merely to facilitate a clear and consistent understanding of the invention. Accordingly, those skilled in the art should clearly understand that the following description of various embodiments of the invention is provided for illustrative purposes only and should not be interpreted as limiting the scope of the invention as defined by the appended claims and their equivalents.

[0024] Unless explicitly indicated otherwise in the context, the singular forms "a," "an," and "the" should be understood to include plural referents. Thus, for example, a reference to "component surfaces" includes one or more such surfaces.

[0025] In this document, each of the following phrases may include any one of the items listed with the corresponding phrase, or any combination thereof: "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C." The term "and / or" as used in this document should be understood to encompass any possible combination of one or more of the multiple items listed with the corresponding term. Terms such as "first," "second," "first," or "second" as used in this document may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order).

[0026] Where it is stated that any (e.g., 1st) component is “coupled,” “connected,” “linked,” “coupled,” “supported,” “connected,” or “contacted” with or without the terms “functionally” or “communicationly,” it includes not only cases where the component is directly coupled, connected, linked, coupled, supported, or contacted with the other component, but also cases where it is indirectly coupled, connected, linked, coupled, supported, or contacted through a third component.

[0027] Terms such as "include" or "have" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in this Document, and do not preclude the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof. When a component is said to be located "on" another component, this includes not only cases where the component is in contact with the other component, but also cases where another component exists between the two components.

[0028] As used in this document, the expression "configured to..." may be appropriately substituted depending on the context, for example, with "suitable for...", "capable of...", "designed to...", "modified to...", "made to...", or "capable of...". The term "configured to..." does not necessarily mean only that it is "specially designed" in hardware. Instead, in some situations, the expression "device configured to..." may mean that the device is "capable of..." in conjunction with other devices or components. For example, the phrase "device configured (or set) to perform A, B, and C" may refer to a device dedicated to performing the said operation, or it may refer to a general-purpose device capable of performing various operations, including the said operation.

[0029] Terms such as "upper side," "lower side," and "front-rear direction" used in this document are defined based on the drawings, and the shape and location of each component are not limited by these terms.

[0030] The description in this document is centered on specific embodiments, but this document is not limited to such specific embodiments and should be understood to encompass all various modifications, equivalents, and / or substitutions of the various embodiments described in this document. In relation to the description of the drawings, similar reference numerals may be used for similar or related components.

[0031] It must be understood that the blocks of each flowchart and combinations of flowcharts can be executed by one or more computer programs containing instructions. The entirety of one or more computer programs may be stored in a single memory device, or one or more computer programs may be divided into multiple parts and stored in multiple different memory devices.

[0032] All functions or operations described in this specification may be processed by a single processor or a combination of processors. The single processor or combination of processors is a circuit that performs processing and includes an application processor (AP, e.g., a central processing unit (CPU)), a communication processor (CP, e.g., a modem), a graphics processing unit (GPU), a neural processing unit (NPU) (e.g., an artificial intelligence (AI) chip), a wireless communication (Wi-Fi) chip, a Bluetooth® chip, a GPS chip, a near-field communication (NFC) chip, a connectivity chip, a sensor controller, a touch controller, a fingerprint sensor controller, a display driver integrated circuit (IC), an audio codec chip, a USB controller, a camera controller, an image processing IC, a microprocessor unit (MPU), a system-on-chip (SoC), an IC, etc.

[0033] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments.

[0034] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0035] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0036] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0037] Memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. Memory (130) may include volatile memory (132) or non-volatile memory (134). Non-volatile memory (134) may include internal memory (136) and external memory (138).

[0038] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0039] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0040] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0041] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by the touch.

[0042] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0043] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0045] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0046] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0047] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0048] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0049] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0050] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0051] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0052] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0053] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0054] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0055] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0056] FIG. 2 is a plan view of a display device according to one embodiment of the present disclosure.

[0057] FIG. 3 is a drawing showing an example of a pixel array constituting a unit module of a display device according to one embodiment of the present disclosure.

[0058] The embodiments of FIGS. 2 and 3 can be optionally combined with the embodiment of FIG. 1.

[0059] According to one embodiment, the electronic device (200) (e.g., the electronic device (101) of FIG. 1) is a self-emissive display device in which a light-emitting element (e.g., the micro LED (330) of FIG. 4) is arranged for each pixel (P) so that each pixel (P) can emit light on its own. Unlike liquid crystal display devices, the self-emissive display device does not require components such as a backlight unit or a liquid crystal layer, so it can achieve a thin (e.g., minimal) thickness and has a simple structure, allowing for various design changes.

[0060] According to one embodiment, the display device (200) may employ an inorganic light-emitting diode, such as an inorganic light-emitting diode, as a light-emitting element placed in each pixel. The inorganic light-emitting diode has a faster response speed compared to an organic light-emitting diode, such as an OLED, and can achieve high brightness with low power consumption. Unlike organic light-emitting diodes, which are vulnerable to exposure to moisture and oxygen and require an encapsulation process and have poor durability, the inorganic light-emitting diode does not require an encapsulation process and has strong durability. Hereinafter, the inorganic light-emitting diode mentioned in the embodiments described below refers to an inorganic light-emitting diode.

[0061] According to one embodiment, the inorganic light-emitting element employed in the display device (200) may be a micro LED having a short side length of approximately 100 μm, approximately tens of μm, or several μm. In this way, by employing a micro LED, the pixel size can be reduced and high resolution can be achieved even within the same screen size.

[0062] According to one embodiment, if the LED chip is manufactured in a micro-sized form, the problem of breaking when bent due to the characteristics of inorganic materials can be solved. That is, when the micro LED chip is transferred to a flexible substrate, the LED chip does not break even if the substrate is bent, so a flexible display device can also be realized.

[0063] According to one embodiment, a display device employing micro LEDs can be applied to various fields by utilizing ultra-small pixel size and thin thickness. For example, as shown in FIG. 2, a large-area screen can be realized by tiling a plurality of display modules (210) on which a plurality of micro LEDs are transferred and fixing them to a main body (220), and such a large-area screen display device (200) can be used as signage, an electronic display board, etc.

[0064] The three-dimensional coordinate system of the XYZ axes shown in FIG. 2 is based on the display device (200), the plane where the screen of the display device (200) is located is the XZ plane, and the direction in which the image is output or the direction of light emission of the inorganic light-emitting element is the +Y direction. Since the coordinate system is based on the display device (200), the same coordinate system can be applied whether the display device (200) is lying down or standing up.

[0065] According to one embodiment, the display device (200) is generally used in an upright state, and since the user views the image from the front of the display device (200), the +Y direction in which the image is output can be called the front, and the opposite direction can be called the rear.

[0066] According to one embodiment, the display device (200) is generally manufactured in a lying position. Accordingly, it is possible to refer to the -Y direction of the display device (200) as the lower direction and the +Y direction as the upper direction. That is, in one or more embodiments described below, the +Y direction may be referred to as the upper direction or the front, and the -Y direction may be referred to as the lower direction or the rear.

[0067] The remaining four sides, excluding the top and bottom surfaces of the flat-panel display device (200) or display module (210), are all referred to as sides regardless of the orientation of the display device (200) or display module (210).

[0068] In the example of FIG. 2, a case is illustrated in which the display device (200) includes a plurality of display modules to implement a large-area screen, but the embodiment of the display device (200) is not limited thereto. It is also possible for the display device (200) to include a single display module (210) to be implemented as a TV, a wearable device, a portable device, a PC monitor, etc.

[0069] Referring to FIG. 3, the display module (210) may include a plurality of pixels arranged in two dimensions, i.e., a pixel array of M x N (M, N is an integer greater than or equal to 2). FIG. 3 conceptually illustrates the pixel array, and it is obvious that in addition to the active area where the pixels are arranged in the display module (210), there may also be a bezel area where an image is not displayed or a wiring area.

[0070] In the embodiments thereof, the fact that certain components are arranged in two dimensions may include not only cases where the components are placed on the same plane, but also cases where they are placed on different planes parallel to each other. Additionally, when the components are placed on the same plane, the tops of the placed components must not necessarily be located on the same plane, and may include cases where the tops of the placed components are located on different planes parallel to each other.

[0071] A pixel (P) may include multiple subpixels that output light of different colors to realize various colors by color combination. For example, it may consist of at least three subpixels that output light of different colors. Specifically, the pixel (P) may consist of three subpixels (SP(R), SP(G), SP(B)) corresponding to R, G, and B, respectively. Here, the red subpixel (SP(R)) may output red light, the green subpixel (SP(G)) may output green light, and the blue subpixel (SP(B)) may output blue light.

[0072] The pixel arrangement of FIG. 3 is merely an example that can be applied to a display module (210) and a display device (200) according to one embodiment, and it is possible for the subpixels to be arranged along the X-axis direction, not arranged in a row, and for the sizes of the subpixels to be different. It is sufficient for a single pixel to include multiple subpixels to implement various colors, and there are no restrictions on the size or arrangement method of each subpixel.

[0073] In addition, a pixel (P) is not necessarily composed of a red subpixel (SP(R)) that outputs red light, a green subpixel (SP(G)) that outputs green light, and a blue subpixel (SP(B)) that outputs blue light; it is also possible to include subpixels that output yellow light or white light. In other words, there are no restrictions on the color or type of light output from each subpixel, or on the number of subpixels.

[0074] However, for the sake of specific explanation in the embodiments described below, the case in which the pixel (P) is composed of a red subpixel (SP(R)), a green subpixel (SP(G)), and a blue subpixel (SP(B)) will be described as an example.

[0075] As previously mentioned, the display module (210) and the display device (200) according to one embodiment are self-emissive display devices in which each pixel can emit light on its own. Accordingly, an inorganic light-emitting element emitting light of a different color may be disposed in each subpixel. For example, a red inorganic light-emitting element may be disposed in the red subpixel (SP(R)), a green inorganic light-emitting element may be disposed in the green subpixel (SP(G)), and a blue inorganic light-emitting element may be disposed in the blue subpixel (SP(B)).

[0076] According to one embodiment, a pixel (P) may represent a cluster including a red inorganic light-emitting element, a green inorganic light-emitting element, and a blue inorganic light-emitting element, and a subpixel may represent each inorganic light-emitting element.

[0077] Although not specified in the drawing, the display device (200) may include a driver IC (not shown) configured to generate a driving signal to be supplied to one or more display modules (210).

[0078] FIG. 4 is a cross-sectional view of a display module according to one embodiment of the present disclosure.

[0079] Figure 5 is an enlarged view of part A shown in Figure 4.

[0080] The embodiments of FIGS. 4 and 5 can be optionally combined with the embodiments of FIGS. 1 to 3.

[0081] The configuration of the display device (300) of FIGS. 4 and 5 may be all or partly the same as the configuration of the display device (200) of FIGS. 2 and 3.

[0082] Referring to FIGS. 4 and 5, a display device (300) according to one embodiment may include a substrate (310), a plurality of through electrodes (320), a plurality of micro LEDs (330), a wiring pattern layer (340), an insulating layer (350), a transparent electrode layer (360), or a black matrix layer (370).

[0083] According to one embodiment, the glass substrate (310) may include a first surface (310a) and a second surface (310b) opposite to the first surface (310a). For example, the first surface (310a) of the glass substrate (310) may be named as the lower surface of the glass substrate (310) and the second surface (310b) may be named as the upper surface of the glass substrate (310).

[0084] According to one embodiment, the glass substrate (310) may be designed to have a thickness of about 0.5 mm, but the present disclosure is not limited thereto.

[0085] According to one embodiment, the glass substrate (310) may include a plurality of through holes (311). The through holes (311) may be formed through various etching processes, such as etching using an etching solution (e.g., hydrofluoric acid, etc.) or etching using a laser (e.g., laser induced etching; LIE, laser induced deep etching; LIDE).

[0086] According to one embodiment, the through hole (311) may extend from the first surface (310a) of the glass substrate (310) to the second surface (310b). The through hole (311) may have a diameter that changes from the first surface (310a) to the second surface (310b), as shown in FIG. 4.

[0087] According to one embodiment, the through hole (311) may include a first portion (311a) in which the diameter gradually decreases from the first surface (310a) to the second surface (310b), and a second portion (311b) in which the diameter gradually increases from the first surface (310a) to the second surface (310b). For example, the first portion (311a) of the through hole (311) may be formed through an etching process (e.g., a first etching process) on the first surface (310a) of the glass substrate (310). For example, the second portion (311b) of the through hole (311) may be formed through an etching process (e.g., a second etching process) on the second surface (310b) of the glass substrate (310). That is, the first part (311a) and the second part (311b) of the through hole (311) can each be formed through a separate etching process to form a single through hole (311). However, the present disclosure is not limited thereto, and the through hole (311) may be formed integrally through a single etching process.

[0088] According to one embodiment, the through electrode (320) may be partially disposed in the through hole (311). For example, the through electrode (320) may be filled inside the through hole (311c) across the first part (311a) and the second part (311b) of the through hole (311). The through electrode (320) may include a first electrode part (320a) corresponding to the first part (311a) of the through hole (311) and a second electrode part (320b) partially corresponding to the second part (311b) of the through hole (311). The size of the second electrode part (320b) of the through electrode (320) may be designed to be smaller than the first electrode part (320a).

[0089] According to one embodiment, the through electrode (320) may be formed by via filling, in which the inner wall of the through hole (311) is plated with a conductive material (e.g., copper) and the through hole (311) is filled with a filling material. Here, the filling material may be the same material as the conductive material. For example, the through electrode (320) may be composed of a conductive material consisting of one or more combinations of gold (Au), silver (Ag), copper (Cu), aluminum (Al), tungsten (W), and nickel (Ni). The through electrode (320) may be named a through glass via (TGV).

[0090] According to one embodiment, the through electrode (320) can transmit an electrical signal received from the lower side of the glass substrate (310) to the upper side of the glass substrate (310). For example, the upper part of the through electrode (320) (e.g., the second electrode portion (320b)) can be electrically connected to a micro LED (330). For example, the lower part of the through electrode (320) (e.g., the first electrode portion (320a)) can be electrically connected to a wiring pattern layer (340) (e.g., a pad (341)).

[0091] According to one embodiment, the micro LED (330) may be composed of an inorganic light-emitting material having a size of 100 μm or less. The micro LED (330) may be a semiconductor chip capable of emitting light on its own when power is supplied. Both the organic light-emitting diode (OLED) and the inorganic light-emitting diode (micro LED (230) have good energy efficiency, but the micro LED (330) has a longer lifespan, higher brightness, and higher luminous efficiency than the OLED. A display module (300) equipped with a plurality of micro LEDs (330) can provide better contrast, faster response time, and higher energy efficiency compared to a liquid crystal display (LCD) panel that requires a backlight.

[0092] According to one embodiment, the micro LED (330) may be placed in the through hole (311). The micro LED (330) may be located above the through electrode (320) within the through hole (311).

[0093] According to one embodiment, the horizontal width (330W) of the micro LED (330) can be designed to be smaller than the diameter (311W) of the through hole (311). Thus, the micro LED (330) can be inserted into the through hole (311) and positioned inside the through hole (311). In relation to the manufacturing process of the display module (300), the electrical connection stability of the display module (300) can be ensured as the micro LED (330) is transferred (e.g., placed) into the through hole (311) and stably fixed within the through hole (311).

[0094] According to one embodiment, the micro LED (330) may include an upper surface (330a) that is substantially coplanar with a second surface (310b) of the glass substrate (310). By the upper surface (330a) of the micro LED (330) being substantially coplanar with the second surface (310b) of the glass substrate (310), the step difference of the upper layer of the glass substrate (310) can be eliminated or minimized, thereby enabling thinning of the display module (300). The upper layer of the glass substrate (310) may include a transparent electrode layer (360) and / or a black matrix layer (370) as layers stacked on the second surface (310b) of the glass substrate (310). Unlike what is shown in this drawing, the upper surface (330a) of the micro LED (330) may be located lower (e.g., in the -Y-axis direction) than the second surface (310b) of the glass substrate (310).

[0095] According to one embodiment, the positional relationship between the upper surface (330a) of the micro LED (330) and the second surface (310b) of the glass substrate (310) may vary depending on the filling amount of the through electrode (320). For example, if the filling amount of the through electrode (320) decreases, the upper surface (330a) of the micro LED (330) may move away from the second surface (310b) of the glass substrate (310) as the height of the through electrode (320) decreases. For example, if the filling amount of the through electrode (320) increases, the upper surface (330a) of the micro LED (330) may move closer to the second surface (310b) of the glass substrate (310) as the height of the through electrode (320) increases.

[0096] According to one embodiment, the micro LED (330) may be a vertical micro LED. Unlike a horizontal micro LED (e.g., a flip-chip LED), the vertical micro LED may include an upper electrode (not shown) (e.g., an anode) provided on the upper side of the LED chip and a lower electrode (not shown) (e.g., a cathode) provided on the lower side. For example, the micro LED (330) may be electrically connected to a transparent electrode layer (360) through the upper electrode (not shown). For example, the micro LED (330) may be electrically connected to a through electrode (320) through the lower electrode (not shown).

[0097] In the case of horizontal micro LEDs, area constraints occur because vias (e.g., through electrodes (320)) and separate pads (not shown) are required on the second surface (310b) of the glass substrate (310) for electrical connection within the display module, and consequently, there are limitations in accommodating fine pitch between LEDs. On the other hand, in the case of vertical micro LEDs, electrodes can be configured vertically, so they are free from spatial constraints and are therefore suitable for high-resolution displays.

[0098] According to one embodiment, the micro LED (330) may include an LED chip (331) and a connecting member (332). The LED chip (331) may be configured to emit red, green, or blue light. The connecting member (332) may be connected to a lower electrode (not shown) of the LED chip (331). The connecting member (332) may physically or electrically connect the LED chip (331) and the through electrode (320). The connecting member (332) may be, for example, a solder bump or a solder ball. For example, the connecting member (332) may be integrally provided on the lower surface of the LED chip (331) to be coupled with the through electrode (320), or provided on the upper surface of the through electrode (320) to be coupled with the LED chip (331).

[0099] According to one embodiment, the wiring pattern layer (340) may be disposed on a first surface (310a) of a glass substrate (310). The wiring pattern layer (340) may be composed of a conductive material such as copper. The wiring pattern layer (340) may include a plurality of pads (341) and a plurality of circuit patterns (342).

[0100] According to one embodiment, the pad (341) may be electrically connected to the through electrode (320). For example, the pad (341) may be placed on the first surface (310a) of the glass substrate (310) to cover the lower side of the through electrode (320). The pad (341) may have, for example, a circular or square flat shape. Accordingly, the cross-section of the pad (341) may have a horizontally elongated rectangular shape.

[0101] According to one embodiment, the circuit pattern (342) may be electrically connected to the pad (341). The circuit pattern (342) may include a via (342a) extending vertically from the pad (341) and a line pattern (342b) extending obliquely or horizontally from the via.

[0102] According to one embodiment, an insulating layer (350) may be arranged to surround a pattern layer (340). The insulating layer (350) may maintain an electrically insulating state of the electrodes and wirings so that the electrodes or wirings are not short-circuited to each other. For example, the insulating layer (350) may include PSR (photosensitive resin), PI (polyimide), SiNx (silicon nitride), or SiOx (silicon oxide).

[0103] According to one embodiment, a transparent electrode layer (360) may be disposed on the upper side of a glass substrate (310). For example, the transparent electrode layer (360) may be disposed on the upper side of the glass substrate (310) to cover a plurality of LEDs (330) and / or a black matrix layer (370). The transparent electrode layer (360) may be understood as a common electrode layer of a plurality of micro LEDs (330). For example, the transparent electrode layer (360) may be electrically connected to the upper electrode (not shown) of each micro LED (330). The transparent electrode layer (360) may be composed of a conductive transparent material comprising, for example, at least one of ITO (indium tin oxide), ITZO (indium tin zinc oxide), silver nanowire (AgNW), and PEDOT (poly-ethylene dioxythiophene).

[0104] According to one embodiment, a black matrix layer (370) may be disposed on a second surface (310b) of a glass substrate (310). The black matrix layer (370) may be disposed between the glass substrate (310) and a transparent electrode layer (360). The black matrix layer (370) may be configured to block light in an area excluding the upper area of ​​a plurality of micro LEDs (330). The black matrix layer (370) may be disposed between pixels (e.g., micro LEDs (330)) to reduce color bleeding, where ambient light leaks out from inside the display module (300) or spreads to neighboring pixels. Additionally, the black matrix layer (370) may enhance the contrast between dark and bright areas of the display module (300). The black matrix layer (370) may be formed by a combination of, for example, carbon black, inorganic pigments, and a polymer binder.

[0105] FIG. 6 is a cross-sectional view of a display module according to one embodiment of the present disclosure.

[0106] The embodiment of FIG. 6 can be optionally combined with the embodiments of FIG. 1 to 5.

[0107] Referring to FIG. 6, a display module (300) according to one embodiment may include a glass substrate (310), a plurality of through electrodes (320), a plurality of micro LEDs (330), a first wiring pattern layer (340), an insulating layer (350), a black matrix layer (370), or a second wiring pattern layer (380).

[0108] The configuration of the first wiring pattern layer (340) of FIG. 6 may be the same as the configuration of the wiring pattern layer (340) of FIG. 4, in whole or in part.

[0109] According to one embodiment, the first wiring pattern layer (340) may be disposed on the first surface (310a) of the glass substrate (310). The first wiring pattern layer (340) may be electrically connected to the lower electrode (not shown) of a plurality of micro LEDs (330) through a through electrode (320).

[0110] According to one embodiment, the second wiring pattern layer (380) may be disposed on the second surface (310b) of the glass substrate (310). The second wiring pattern layer (380) may be electrically connected to the upper electrode (not shown) of a plurality of micro LEDs (330). For example, the second wiring pattern layer (380) of FIG. 6 may be a configuration that replaces the transparent electrode layer (360) of FIG. 4.

[0111] According to one embodiment, the second wiring pattern layer (380) may include a line pattern (381) and connection portions (382, 383) extending from both sides of the line pattern (381). The line pattern (381) of the second wiring pattern layer (380) may be placed over the remaining area of ​​the glass substrate (310), excluding the through hole (311) of the glass substrate (310). A black matrix layer (370) may be placed on the line pattern (381) of the second wiring pattern layer (380). The connection portions (382, 383) of the second wiring pattern layer (380) may extend horizontally from both sides of the line pattern (381) of the second wiring pattern layer (380). The connection portions (382, 383) of the second wiring pattern layer (380) may be partially located on the upper side of the micro LED (330). Each of the connection portions (382, 383) of the second wiring pattern layer (380) can be electrically connected to the upper electrode (not shown) of the micro LED (330). Although not specified in the drawing, the connection portions (382, 383) of the second wiring pattern layer (383) may be line-shaped connection portions that protrude or extend from the line pattern (381).

[0112] FIGS. 7a and 7b are drawings illustrating various examples of the layer structure of a display module according to various embodiments of the present disclosure.

[0113] The embodiments of FIGS. 7a and 7b can be optionally combined with the embodiments of FIGS. 1 to 6.

[0114] Referring to FIG. 7a and FIG. 7b, a display module (300) according to one embodiment may include a glass substrate (310), a plurality of through electrodes (320), a plurality of micro LEDs (330), a wiring pattern layer (340), an insulating layer (350, 350a), or a transparent electrode layer (360).

[0115] According to one embodiment, the display module (300) of FIGS. 7a and 7b may not include a black matrix layer (e.g., the black matrix layer (370) of FIG. 4), unlike the display module (300) of FIGS. 4 to 6 described above.

[0116] For example, the black matrix layer may be omitted if light leakage is minimal in the display module (300) or if a deep blackness (e.g., the degree to which the display can express black deeply and intensely) is not required.

[0117] Referring to FIG. 7a, when the black matrix layer is removed in the display module (300), a transparent electrode layer (360) can be placed on the second surface (310b) of the glass substrate (310).

[0118] For example, the black matrix layer may be omitted to ensure transparency when the display module (300) is implemented as a transparent display.

[0119] Referring to FIG. 7b, when the display module (300) is implemented as a transparent display, the insulating layer (350a) of the display module (300) may be composed of an oxide-based or polymer-based material that is transparent for light transmission, but the present disclosure is not limited thereto. Accordingly, when the display screen is implemented transparently, the user can see an object on the opposite side of the transparent display module (300) through the display screen.

[0120] FIG. 8 is a cross-sectional view of a display module according to one embodiment of the present disclosure.

[0121] The embodiment of FIG. 8 can be optionally combined with the embodiments of FIG. 1 to FIG. 7b.

[0122] Referring to FIG. 8, a display module (300) according to one embodiment may include a glass substrate (310), a plurality of through electrodes (320), a plurality of micro LEDs (330), a wiring pattern layer (340), an insulating layer (350), a transparent electrode layer (360), a black matrix layer (370), or a plurality of color conversion layers (390).

[0123] According to one embodiment, a plurality of micro LEDs (330) may be blue light micro LEDs configured to emit blue light.

[0124] According to one embodiment, the color conversion layer (390) may be configured to absorb most of the light emitted from the corresponding micro LED (330) and emit light of a different color from the absorbed light. A plurality of color conversion layers (390) may include a first color conversion layer (390a) and a second color conversion layer (390b) that emit light of different wavelength ranges.

[0125] For example, the first color conversion layer (390a) may include a red nanophosphor that can be excited by light in the blue wavelength band emitted from the micro LED (330) and emit light in the red wavelength band. For example, the first color conversion layer (390a) may be made of a material including a red quantum dot that emits light in the red wavelength band as an alternative to the red nanophosphor. The first color conversion layer (390a) may be named a red conversion layer.

[0126] For example, the second color conversion layer (390b) may include a green nanophosphor that can be excited by light in the blue wavelength band emitted from the micro LED (330) and emit light in the green wavelength band. For example, the second color conversion layer (390b) may be made of a material containing a green quantum dot that emits light in the red wavelength band as an alternative to the green nanophosphor. The second color conversion layer (390b) may be named a red conversion layer.

[0127] According to one embodiment, a plurality of color conversion layers (390) may be disposed on a transparent electrode layer (360). A plurality of color conversion layers (390) may be located above some of a plurality of micro LEDs (330). For example, a plurality of color conversion layers (390) may be disposed above two of the three micro LEDs (330) that constitute a single pixel (e.g., pixel (P) of FIG. 3). In this case, the three micro LEDs (330) and the two color conversion layers (390) may constitute subpixels (SP(R), SP(G), SP(B)) of a display module (300).

[0128] For example, one of the three micro LEDs (330) and one color conversion layer corresponding to the micro LED (330) (e.g., first color conversion layer (390a)) can form a red subpixel (SP(R)) that emits red light.

[0129] For example, one of the other micro LEDs (330) and the remaining color conversion layer corresponding to the micro LED (330) (e.g., second color conversion layer (390a)) can form a green subpixel (SP(G)) that emits green light.

[0130] For example, the remaining one of the three micro LEDs (330) can be configured as a blue subpixel (SP(B)) that emits blue light on its own without a corresponding color conversion layer (390).

[0131] As described above, by implementing red, green, and blue (RGB) colors through a single blue light micro LED (330) and a corresponding color conversion layer (390a, 390b) in the display module (300), the process can be simplified and high-purity RGB colors can be obtained.

[0132] FIG. 9 is a cross-sectional view of a display module according to one embodiment of the present disclosure.

[0133] The embodiment of FIG. 9 can be optionally combined with the embodiments of FIG. 1 to 6, FIG. 7a, FIG. 7b, and FIG. 8.

[0134] Referring to FIG. 9, a display module (300) according to one embodiment may include a glass substrate (310), a plurality of through electrodes (320), a plurality of micro LEDs (330), a wiring pattern layer (340), an insulating layer (350), a transparent electrode layer (360), a black matrix layer (370), or a plurality of conductive members (400).

[0135] According to one embodiment, the conductive member (400) may be disposed in a through hole (311) of a glass substrate (310). For example, the conductive member (400) may be disposed in a through hole (311) among a plurality of through holes (311) where a plurality of micro LEDs (330) are not disposed. The conductive member (400) may be located above the through electrode (320) within the through hole (311).

[0136] According to one embodiment, the conductive member (400) may be electrically connected to a transparent electrode layer (360) and a through electrode (320). The conductive member (400) may be electrically connected to a plurality of adjacent micro LEDs (330) through the transparent electrode layer (360). For example, the conductive member (400) may form an electrical path (P) together with a plurality of adjacent micro LEDs (330) and the transparent electrode layer (360). In this case, the total resistance of the transparent electrode layer (360) can be reduced by shortening the current path to the adjacent micro LEDs (330) through the electrical path (P) formed by the conductive member (400).

[0137] According to one embodiment, the conductive member (400) may be composed of a conductive material consisting of one or more combinations of gold (Au), silver (Ag), copper (Cu), aluminum (Al), tungsten (W), and nickel (Ni). The conductive member (400) may be provided as one body with the through electrode (320), as shown in FIG. 9. For example, the through electrode (320) itself may function as the conductive member (400) as the filling amount of the through electrode (320) is designed differently so that the second electrode portion of the through electrode (320) (e.g., the second electrode portion (320b) of FIG. 4) comes into contact with the transparent electrode layer (360).

[0138] According to one embodiment of the present disclosure, a thinned display module (300) can be provided.

[0139] According to one embodiment of the present disclosure, a vertical micro LED (330) is disposed together with a through electrode (320) in a through hole (311) of a glass substrate (310), so that a separate wiring pattern layer (e.g., via, pad, and insulating layer) for electrical connection with the upper electrode of the micro LED (330) may not be required. Accordingly, a fine pitch of the micro LED (330) and a thinning of the display module (300) can be achieved by reducing the usage area (or occupied area) of the wiring pattern layer on the upper surface of the glass substrate (310) (e.g., the second surface (310b) of FIG. 4).

[0140] According to one embodiment of the present disclosure, in relation to the transfer process of a micro LED (330) during the manufacturing process of a display module (300), a vertical micro LED (330) is placed in a through hole (311) of a glass substrate (310) and fixed within the through hole (311), thereby ensuring electrical connection stability of the display module (300).

[0141] A display module (300) according to one embodiment of the present disclosure may include a glass substrate (310) having a first surface (310a) and a second surface (310b) opposite to the first surface (310a), and a plurality of through holes (311) extending from the second surface (310b) to the first surface (310a); a plurality of through electrodes (320) that partially fill the through holes (311); and a plurality of micro LEDs (330) disposed in the through holes (311) and electrically connected to the through electrodes (320).

[0142] According to one embodiment, the display module (300) may include a first wiring pattern layer (340) disposed on a first surface (310a) of the glass substrate (310) and electrically connected to the through electrode (320).

[0143] According to one embodiment, the display module (300) may include a transparent electrode layer (360) disposed on a second surface (310b) of the glass substrate (310) and electrically connected to the plurality of micro LEDs (330).

[0144] According to one embodiment, the transparent electrode layer (360) may be composed of a conductive transparent material comprising at least one of ITO (indium tin oxide), ITZO (indium tin zinc oxide), silver nanowire (AgNW), and PEDOT (poly-ethylene dioxythiophene).

[0145] According to one embodiment, the display module (300) may include a black matrix (BM) layer (370) disposed on a second surface (310b) of the glass substrate (310) and configured to block light in an area excluding the plurality of micro LEDs (330).

[0146] According to one embodiment, the penetrating electrode (320) may include at least one of gold (Au), silver (Ag), copper (Cu), aluminum (Al), tungsten (W), and nickel (Ni).

[0147] According to one embodiment, the diameter (311W) of the through hole (311) may be larger than the horizontal width (330W) of the micro LED (330).

[0148] According to one embodiment, the micro LED (330) may include an upper surface (330a) that is substantially the same plane as the second surface (310b) of the glass substrate (310).

[0149] According to one embodiment, the display module (300) may include a second wiring pattern layer (380) disposed on a second surface (310b) of the glass substrate (310) and electrically connected to the plurality of micro LEDs (330).

[0150] According to one embodiment, the display module (300) may include an insulating layer (350) that is disposed on a first surface (310a) of the glass substrate (310) and surrounds the first wiring pattern layer (340). The insulating layer (350) may be composed of a polymer of a transparent material.

[0151] According to one embodiment, the plurality of micro LEDs (330) may include a blue micro LED. The display module (300) may include a red color conversion layer (390a) and a green color conversion layer (390b) respectively placed on two of the three micro LEDs (330), and may include a plurality of R / G / B pixels (P) composed of the color conversion layers (390a, 390b) and the three micro LEDs (330).

[0152] According to one embodiment, the display module (300) may include one or more conductive members (400) disposed in a through hole (311) among the plurality of through holes (311) where a micro LED (330) is not disposed. The conductive members (400) may form an electrical path (P) together with the plurality of micro LEDs (330) and the transparent electrode layer (360).

[0153] According to one embodiment, the micro LED (330) may be a vertical micro LED.

[0154] An electronic device according to one embodiment of the present disclosure (e.g., the electronic device (101) of FIG. 1) may include one or more display modules (300) and a driver IC configured to generate a driving signal to be supplied to the one or more display modules (300). The display module (300) may include a glass substrate (310) comprising a first surface (310a) and a second surface (310b) opposite to the first surface (310a), and a plurality of through holes (311) extending from the second surface (310b) to the first surface (310a); a plurality of through electrodes (320) that partially fill the through holes (311); and a plurality of micro LEDs (330) disposed in the through holes (311) and electrically connected to the through electrodes (320).

[0155] According to one embodiment, the display module (300) may include a first wiring pattern layer (340) disposed on a first surface (310a) of the glass substrate (310) and electrically connected to the through electrode (320).

[0156] According to one embodiment, the display module (300) may include a transparent electrode layer (360) disposed on a second surface (310b) of the glass substrate (310) and electrically connected to the plurality of micro LEDs (330).

[0157] According to one embodiment, the display module (300) may include a black matrix (BM) layer (370) disposed on a second surface (310b) of the glass substrate (310) and configured to block light in an area excluding the plurality of micro LEDs (330).

[0158] According to one embodiment, the diameter (311W) of the through hole (311) may be larger than the horizontal width (330W) of the micro LED (330).

[0159] According to one embodiment, the micro LED (330) may include an upper surface (330a) that is substantially the same plane as the second surface (310b) of the glass substrate (310).

[0160] According to one embodiment, the micro LED (330) may be a vertical micro LED.

[0161] Although the present invention has been disclosed and described with reference to various embodiments, those skilled in the art will understand that various changes in form and detail may be made without departing from the spirit and scope of the invention as defined by the appended claims and their equivalents.

Claims

1. In the display module (300), A glass substrate (310) comprising a first surface (310a), a second surface (310b) opposite to the first surface (310a), and a plurality of through holes (311) extending from the second surface (310b) to the first surface (310a); A plurality of through electrodes (320), wherein each through electrode partially fills one of the through holes (311); and A display module comprising a plurality of micro LEDs (330), wherein each micro LED is disposed in one of the plurality of through holes (311) and electrically connected to one of the plurality of through electrodes (320).

2. In Paragraph 1, A display module comprising a first wiring pattern layer (340) disposed on a first surface (310a) of the glass substrate (310) and electrically connected to the plurality of through electrodes (320).

3. In Paragraph 2, It includes an insulating layer (350) disposed on the first surface (310a) of the glass substrate (310) and surrounding the first wiring pattern layer (340), The above insulating layer (350) is a display module composed of a transparent polymer.

4. In any one of paragraphs 1 through 3, A display module comprising a transparent electrode layer (360) disposed on a second surface (310b) of the glass substrate (310) and electrically connected to the plurality of micro LEDs (330).

5. In Paragraph 4, The above transparent electrode layer (360) is a display module composed of a conductive transparent material including at least one of ITO (indium tin oxide), ITZO (indium tin zinc oxide), silver nanowire (AgNW), and PEDOT (poly-ethylene dioxythiophene).

6. In Paragraph 4, It includes one or more conductive members (400) disposed in a through hole (311) among the plurality of through holes (311) where a micro LED (330) is not disposed, and The above conductive member (400) forms an electrical path (P) together with the plurality of micro LEDs (330) and the transparent electrode layer (360), in a display module.

7. In any one of paragraphs 1 through 6, A display module comprising a black matrix (BM) layer (370) disposed on a second surface (310b) of the glass substrate (310) and configured to block light in an area excluding the plurality of micro LEDs (330).

8. In any one of paragraphs 1 through 7, A display module in which each of the plurality of through electrodes (320) comprises at least one of gold (Au), silver (Ag), copper (Cu), aluminum (Al), tungsten (W), and nickel (Ni).

9. In any one of paragraphs 1 through 8, A display module in which the diameter (311W) of each of the plurality of through holes (311) is larger than the horizontal width (330W) of the corresponding micro LED among the plurality of micro LEDs (330).

10. In any one of paragraphs 1 through 9, A display module in which each of the plurality of micro LEDs (330) comprises an upper surface (330a) that is substantially the same plane as the second surface (310b) of the glass substrate (310).

11. In Paragraph 1, A display module comprising a second wiring pattern layer (380) disposed on a second surface (310b) of the glass substrate (310) and electrically connected to the plurality of micro LEDs (330).

12. In Paragraph 1, The plurality of micro LEDs (330) above include blue micro LEDs, and The above display module (300) is, A display module comprising a plurality of R / G / B pixels (P), each pixel comprising a plurality of R / G / B pixels (P) composed of three micro LEDs (330), a red color conversion layer (390a) disposed on the first micro LED among the three micro LEDs (330), and a green color conversion layer (390b) disposed on the second micro LED among the three micro LEDs (330).

13. In any one of paragraphs 1 through 12, Among the plurality of micro LEDs (330) above, each micro LED is a vertical micro LED, and the display module.

14. In electronic devices, One or more display modules (300); and It includes a driver IC configured to generate a driving signal to be supplied to one or more display modules (300), and Each of the above one or more display modules (300) is, A glass substrate (310) comprising a first surface (310a) and a second surface (310b) opposite to the first surface (310a), and a plurality of through holes (311) extending from the second surface (310b) to the first surface (310a); A plurality of through electrodes (320), wherein each through electrode partially fills one of the through holes (311); and An electronic device comprising a plurality of micro LEDs (330), wherein each micro LED is disposed in one of the plurality of through holes (311) and electrically connected to one of the plurality of through electrodes (320).

15. In Paragraph 14, Among the plurality of micro LEDs (330) above, each micro LED is a vertical micro LED, an electronic device.

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