Transfer device for electronic component handler and electronic component handler
Patent Information
- Application Number
- PCT/KR2026/096066
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2026-04-17
- Filing Date
- 2026-04-20
- Publication Date
- 2026-10-22
Smart Images
Figure KR2026096066_22102026_PF_FP_ABST
Abstract
Description
Transfer and electronic component handler for electronic component handlers
[0001] The present invention relates to a transfer for transporting a tray loaded with electronic components in an electronic component handler that handles electronic components.
[0002] An electronic component handler is equipment that handles electronic components.
[0003] Electronic component handlers are used to sort or test electronic components.
[0004] Electronic components to be processed are brought into the electronic component handler while loaded on customer trays, and processed electronic components are dispatched while loaded on customer trays.
[0005] The electronic component handler must be equipped with a transfer mechanism for transporting customer trays that have been brought in or are to be shipped out.
[0006] Meanwhile, as the integration density of electronic components such as semiconductor devices increases, circuit line widths are becoming increasingly narrow. Consequently, greater precision is required when connecting electronic components to testers.
[0007] Previously, it was possible to make a proper electrical connection between electronic components and testers with an error range of 20㎛, but now, an error range of 10㎛ or less, or even a few㎛, is required.
[0008] Among electronic components, there are dies that are separated into individual units from the wafer state.
[0009] The die can be completed as a final product by undergoing a packaging process or by stacking it for HBM (High Bandwidth Memory) production and then undergoing a packaging process.
[0010] To perform post-die operations, testing of the die is required.
[0011] Electronic components in die form can be tested by electrically connecting contact pads to a tester.
[0012] Since the gaps between the contact pads on the die are fine and the die is very thin, it can easily break or shatter, so automated testing capable of adequately supporting the testing of electronic components in the die or HBM state has not been proposed until now. Accordingly, the applicant has proposed Korean Published Patent No. 10-2021-0088373 (hereinafter referred to as the 'prior art').
[0013] The prior art proposes a technique for aligning the positions of electronic components by repositioning them before connecting them to a tester.
[0014] The prior art scans an electronic component on a test table (named a 'chuck' in the prior art) with a camera to determine its current position and readjusts the position of the electronic component to reduce the error range.
[0015] According to the prior art, the precise positioning of electronic components enables automated testing of electronic components at the die level.
[0016] The electronic components to be tested are brought into the electronic component handler while loaded on a customer tray.
[0017] In an electronic component handler according to the prior art, the upper surface of the electronic component is electrically contacted with a tester.
[0018] For the top surface of an electronic component to be electrically connected to a tester, there must be contact pads, bumps, or other types of terminals on the top surface of the electronic component.
[0019] The electronic component must be in a dead bug state with the terminal on the top surface.
[0020] An electronic component handler according to the prior art must handle electronic components in a dead bug state.
[0021] Electronic components to be tested must be loaded onto a customer tray in a dead bug state and brought into the electronic component handler.
[0022] Electronic components that have completed testing are loaded onto a customer tray in a deadbug state and removed from the electronic component handler.
[0023] The incoming customer trays are moved to the supply location by transfer or moved from the recovery location to the stacker.
[0024] Customer trays are stacked vertically in the stacker.
[0025] The supply position is the starting point of movement where the electronic components to be tested begin to move toward the tester in individual units.
[0026] The retrieval location is the end point of movement where the movement of individual units is terminated as the electronic components that have completed testing are retrieved and placed on a customer tray.
[0027] To move the customer tray, the transfer needs to grasp or release the customer tray.
[0028] The transfer has a gripping head for gripping or releasing the customer tray.
[0029] The gripping head must be able to be raised and lowered in the vertical direction and moved in the vertical direction.
[0030] During the process of the transfer gripping and transporting the customer tray, electronic components may come into contact with the gripping head due to shocks generated by the movement or various operations of the gripping head.
[0031] Electronic components in a dead bug state can be damaged upon contact with the gripping head.
[0032] Electronic components can be damaged by electrostatic shock during contact with the gripping head.
[0033] When an electronic component in a dead bug state comes into contact with the gripping head, foreign substances on the gripping head can be transferred to the electronic component.
[0034] If foreign substances adhere to electronic components, it causes defects in the electrical connection between the components and the tester.
[0035] [Prior Art Literature]
[0036] [Patent Literature]
[0037] (Patent Document 1) Republic of Korea Published Patent No. 10-2021-0088373
[0038] It is necessary to preserve the electronic components loaded on the customer tray in the transfer in their original state.
[0039] A transfer for an electronic component handler according to the present invention comprises: a gripping head for gripping or releasing a tray on which an electronic component can be loaded; a vertical mover coupled to the gripping head so as to be movable in a vertical direction and for moving the gripping head in a vertical direction; and a horizontal mover for moving the gripping head in a horizontal direction by moving the vertical mover in a horizontal direction; wherein the gripping head comprises: a mounting plate coupled to the vertical mover so as to be movable in a vertical direction; a clamper installed on the mounting plate for gripping or releasing the tray; a cover plate installed on the mounting plate and covering the upper surface of the tray gripped by the clamper; and a protective pad attached to the lower surface of the cover plate.
[0040] The upper surface of the above protective pad is an adhesive surface, and the lower surface of the above protective pad is a lubricating surface.
[0041] The above protective pad is an elastic material capable of compression and expansion in the vertical direction.
[0042] The above protective pad is a dicing tape used to hold the chips cut during the dicing process of semiconductor devices so that they do not scatter.
[0043] The above protective pad is provided for anti-static purposes.
[0044] The above protective pad is provided with a conductive material.
[0045] The above gripping head further includes an elastic member that elastically supports the cover plate with respect to the installation plate.
[0046] The above-mentioned gripping head further includes at least one camera for photographing electronic components located below; and the protective pad has a viewing hole formed therein to secure a field of view for the camera.
[0047] The above-mentioned gripping head further includes at least one lighting element that supports shooting by the at least one camera; and the protective pad has a lighting hole formed therein through which light from the lighting element can pass.
[0048] The electronic component handler according to the present invention applies the above-mentioned transfer for moving a tray that has been brought in with electronic components loaded thereon.
[0049] The above tray contains electronic components in a dead bug state with contact terminals facing upward.
[0050] According to the present invention, the following effects are achieved.
[0051] Since the contact impact between the electronic component and the gripping head is minimized, damage to the electronic component can be suppressed.
[0052] The reliability of the test is improved because foreign substances from the gripping head are not transferred to the electronic components.
[0053] It can protect electronic components from damage caused by static electricity.
[0054] FIG. 1 is a conceptual plan view of an electronic component handler according to the present invention.
[0055] FIGS. 2 to 11 are reference diagrams for explaining the electronic component handler of FIG. 1.
[0056] FIG. 12 is a schematic diagram of a transfer according to the present invention that can be applied to the electronic component handler of FIG. 1.
[0057] FIG. 13 is an excerpt perspective view of the gripping head applied to the transfer of FIG. 12.
[0058] Fig. 14 is an exaggerated and schematic front view of the gripping head of Fig. 13.
[0059] FIGS. 15 and FIGS. 16 are reference diagrams for explaining the protective pad applied to the gripping head of FIG. 13.
[0060] Preferred embodiments according to the present invention are described by example with reference to the attached drawings, provided that for the sake of brevity, descriptions of well-known or redundant components are omitted or compressed as much as possible.
[0061] <Explanation of Electronic Component Handlers>
[0062] FIG. 1 is a conceptual plan view of an electronic component handler (EH, hereinafter abbreviated as 'handler') according to the present invention.
[0063] The handler (EH) according to the present invention is broadly divided into an unloading section (LU), a relocation section (RP), a connection section (CP), and a movement section (MP).
[0064] The handler (EH) includes a transport shuttle (100), a first picker hand (210), a supply stacker (220), a recovery stacker (230), a transfer (260), a second picker hand (310), a test table (300), a vacuum (400), a relocation mechanism (500), a moving mechanism (600), and a controller (700).
[0065] The unloading unit (LU) supplies electronic components to be tested or retrieves electronic components for which testing is complete.
[0066] In the relocation section (RP), the positions of the electronic components to be tested supplied from the unloading section (LU) are precisely relocated.
[0067] In the connection section (CP), electronic components whose positions have been precisely repositioned in the relocation section (RP) are electrically connected to the tester.
[0068] In the moving section (MF), electronic components can be moved to exchange electronic components between the unloading section (LU) and the relocation section (RP).
[0069] The moving section (MF) moves electronic components to be tested from the unloading section (LU) to the relocation section (RP), and moves electronic components that have completed testing from the relocation section (RP) to the unloading section (LU).
[0070] A transport shuttle (100) for carrying electronic components is installed in the moving part (MP).
[0071] When viewed in a planar view, the transport shuttle (100) of the moving part (MP) has a portion of one side (the right side in the drawing) overlapping with the unloading part (LU).
[0072] A transport shuttle (100) is provided to transport electronic components between the unloading section (LU) and the relocation section (RP).
[0073] The transport shuttle (100) has a movable transport table (110).
[0074] The transport shuttle (100) may have at least one transport table (110).
[0075] The transport table (110) can move back and forth in one direction.
[0076] The transport table (110) can move back and forth in the X-axis direction.
[0077] In the case where there are multiple transport tables (100), the multiple transport tables (110) may be provided in parallel in the Y-axis direction. In this case, the multiple transport tables (110) need to be implemented to move back and forth in the X-axis direction independently of each other.
[0078] The transport table (110) can move between the first area (A1) on the side overlapping with the unloading section (LU) and the second area (A2) on the side of the relocation section (RP).
[0079] Electronic components can be loaded on the transport table (110).
[0080] The transport table (110) has a vacuum structure that fixes electronic components placed on a flat surface by vacuum pressure.
[0081] As shown in the schematic plan view of FIG. 2, the transport table (110) has vacuum holes (VH) and vacuum grooves (VG) formed therein for vacuum-adsorbing electronic components.
[0082] One vacuum hole (VH) and one vacuum groove (VG) form a pair.
[0083] When viewed in a planar view, the vacuum hole (VH) is positioned near the center of the area occupied by the vacuum groove (VG).
[0084] The vacuum pressure coming through the vacuum hole (VH) acts on the electronic component as it is evenly distributed through the vacuum groove (VG).
[0085] Since the electronic component can be fixed to the transport table (110) by vacuum pressure, no movement of the electronic component occurs during the process of moving in the X-axis direction while being carried on the transport table (110).
[0086] The vacuum holes (VH) and vacuum grooves (VG) can be arranged in a 2x8 matrix form.
[0087] Since the loading capacity of the transport table (110) can be increased or decreased, the number of vacuum holes (VH) and vacuum grooves (VG) can also be increased or decreased.
[0088] In the unloading section (LU), electronic components are supplied to the handler (EH) or recovered from the handler (EH).
[0089] Electronic components to be tested are supplied to the handler (EH) through the unloading section (LU), and electronic components that have completed testing are recovered from the handler (EH) through the unloading section (LU).
[0090] Electronic components can be loaded onto a Jetec Tray or a customer tray of other forms and supplied to or retrieved from the handler (EH).
[0091] The structure of the loading / unloading section (LU) may vary depending on the type of customer tray.
[0092] Electronic components to be tested in the unloading section (LU) are loaded onto a transport table (110) in the first area (A1), and electronic components that have completed testing and are loaded onto the transport table (110) in the first area (A1) are unloaded from the transport table (110). To this end, a first picker hand (210) is provided in the unloading section (LU).
[0093] The first picker hand (210) is provided to load electronic components onto the transport table (110) or to unload them from the transport table (110).
[0094] For unloading operations by the first picker hand (210), the transport table (110) must be moved toward the unloading section (LU) and be in the first area (A1).
[0095] The first picker hand (210) loads electronic components to be tested onto a transport table (110) in the first area (A1) or unloads electronic components that have been tested from the transport table (110) in the first area (A1).
[0096] The first picker hand (210) may have one or more pickers capable of gripping or releasing electronic components. The pickers may grip electronic components by vacuum pressure.
[0097] Preferably, four pickers can be installed in pairs on the first picker hand (210) to improve processing capacity.
[0098] For example, as shown in the conceptual diagram of FIG. 3, the first picker hand (210) may have four pickers (P) arranged in a 2x2 matrix form.
[0099] Depending on the embodiment, the number of pickers (P) provided in the first picker hand (210) may be increased or decreased.
[0100] The electronic component to be tested is moved from the customer tray at the supply position (SP) to the transport table (110) by the first picker hand (210).
[0101] The electronic component that has completed testing is moved from the transport table (110) to the customer tray at the recovery position (WP) by the first picker hand (210).
[0102] The unloading section (LU) includes a supply stacker (220) and a recovery stacker (230).
[0103] The supply stacker (220) and the recovery stacker (230) are positioned below the supply position (SP) and the recovery position (WP).
[0104] The supply stacker (220) stores customer trays loaded with electronic components to be tested.
[0105] Customer trays containing electronic components to be tested are brought into the handler (EH) via the supply stacker (220).
[0106] Two supply stackers (220) may be provided.
[0107] It is sufficient to have one or more supply stackers (220).
[0108] The recovery stacker (230) stores customer trays loaded with electronic components that have been tested.
[0109] Customer trays loaded with electronic components that have been tested are removed from the handler (EH) via a recovery stacker (230).
[0110] The unloading section (LU) is equipped with a transfer (260).
[0111] A transfer (260) is provided to transport customer trays.
[0112] The transfer (260) transfers a customer tray containing electronic components to be tested from the supply stacker (220) to the supply position (SP).
[0113] The transfer (260) transfers a customer tray loaded with electronic components that have been tested from the recovery location (WP) to the recovery stacker (220).
[0114] The transfer (260) may also move the customer tray from the supply location (SP) to the recovery location (WP).
[0115] Since the transfer (260) is a major feature of the present invention, it will be described later in a different section.
[0116] In the relocation section (RP), electronic components (ED) to be tested are unloaded from the transport table (110) and loaded onto the test table (300), and the electronic components loaded onto the test table (300) are relocated.
[0117] In the relocation section (RP), a relocation space (RS) is formed for the relocation of electronic components.
[0118] According to the present embodiment, the relocation portion (RP) is positioned on one side of the connection portion (CP) in the X-axis direction.
[0119] The repositioning part (RP) is equipped with a second picker hand (310).
[0120] The second picker hand (310) unloads electronic components to be tested from the transport table (110) or loads electronic components (ED) that have been tested onto the transport table (110).
[0121] For unloading operations by the second picker hand (310), the transport table (110) must be moved toward the relocation section (RP) and be in the second area (A2).
[0122] The second picker hand (310) unloads electronic components to be tested from the transport table (110) in the second area (A2) or loads electronic components that have been tested from the transport table (110) in the second area (A2).
[0123] The second picker hand (310) can be configured in the same way as the first picker hand (210).
[0124] The number of pickers (P) provided in the second picker hand (310) may be different from the number of pickers (P) provided in the first picker hand (210).
[0125] The second picker hand (310) loads the electronic components to be tested from the transport table (110) in the second area (A2) onto the test table (300) that has been moved to the relocation area (RP).
[0126] The second picker hand (310) loads the electronic components that have been tested and are loaded on the test table (300) onto the transport table (110) in the second area (A2).
[0127] In order for electronic components to be tested by the second picker hand (310) to be loaded onto the test table (300), the test table (300) must be located in the relocation space (RP). Therefore, the relocation space (RP) can be renamed as the loading space.
[0128] The test table (300) is provided to load electronic components that are unloaded from the transport table (110) by the second picker hand (310).
[0129] As shown in the schematic excerpt of FIG. 4, the test table (300) is in the shape of a disc and has a flat top surface.
[0130] The test table (300) may be rectangular when viewed from a flat surface, and in this case, the top surface is also flat.
[0131] The electronic components are loaded onto the test table (300) in a manner such that they are placed on the flat upper surface of the test table (300).
[0132] The test table (300) can be moved in the X-axis, Y-axis, and Z-axis directions.
[0133] The test table (300) can be rotated in the Θ-axis direction with the vertical line (V) passing through the center of the test table (300) in the Z-axis direction as the axis of rotation.
[0134] Generally, when an electronic component (ED) is moved to a test table (300), shock or inertia accompanying the movement occurs.
[0135] Impact or inertia, etc., can disrupt the position of electronic components loaded on the test table (300). To prevent this, vacuum holes (h) are formed in the area where electronic components are loaded on the test table (300).
[0136] The vacuum structure of the test table (300) for fixing electronic components may be the same as the vacuum structure of the transport table (110).
[0137] When an electronic component is placed on the test table (300) by the second picker hand (310), the electronic component can be placed in the same position due to vacuum pressure. In that state, when the second picker hand (310) releases the grip on the electronic component, the electronic component is fixed in the placed position without shifting.
[0138] The vacuum device (400) provides vacuum pressure to the vacuum holes (h) in the test table (300) through a vacuum circuit (not shown).
[0139] The vacuum device (400) can be configured with only a structure that is installed in a factory and distributes vacuum pressure supplied from outside the handler (EH) to each electronic component through a vacuum circuit.
[0140] The vacuum pressure provided by the vacuum device (400) is transmitted to the electronic components (ED) through the vacuum hole (h), and the electronic components loaded on the test table (300) are fixed in position by the vacuum pressure.
[0141] The vacuum holes (h) are implemented to be selectively opened or closed depending on the control of the vacuum circuit. The electronic components may be selectively fixed to the test table (300) or removed from the test table (300).
[0142] The electronic components are electrically connected to the tester while loaded on the test table (300).
[0143] The electrical connection between the electronic components loaded on the test table (300) and the tester is made via a test board (TB).
[0144] The test board (TB) has test pins that make electrical contact with electronic components.
[0145] The test board (TB) is connected to the handler (EH) at the connection part (CP) so that the positions are fixed.
[0146] The electronic components loaded on the test table (300) that has been moved to the connection part (CP) are electrically connected to the test pins of the test board (TB).
[0147] The test board (TB) may have any structure as long as it has a configuration that can be electrically connected to electronic components.
[0148] The test board (TB) may be a widely known probe card. In this case, it is preferable that the test table (300) be provided in the form of a disc.
[0149] The test board (TB) may have a structure having socket modules. Test pins are provided in the socket modules, and the socket modules are installed in the socket body. In this case, it is preferable that the test table (300) be provided in the shape of a square plate.
[0150] As shown in the bottom view of FIG. 5, test zones (TZ) corresponding to one electronic component are arranged on the test board (TB).
[0151] The test zones (TZ) correspond one-to-one with the electronic components loaded on the test table (300).
[0152] One test zone (TZ) is equipped with test pins (t) for electrically connecting to one electronic component.
[0153] The test pins (t) in one test zone (TZ) form a set of clusters that form the test zone (TZ) and are electrically connected to the electronic component (ED).
[0154] When the test board (TB) is a probe card, a set of test pins (t) is densely arranged in the test area (TZ). Here, the set of test pins (t) corresponds to terminals (contact pads) on a single electronic component. The test pins (t) on the probe card are also commonly referred to as probe pins.
[0155] In the case where the test board (TB) has a structure with a socket module, a set of test pins (t) are installed in one socket module (22), and one socket module (22) forms one test zone (TZ). Therefore, replacing one socket module (22) replaces one test zone (TZ).
[0156] The test area (TZ) and the electronic component must be aligned. If the coordinates of the electronic component on the test table (300) on the XY plane do not match the coordinates of the test area (TZ), a defect occurs in the electrical connection between the electronic component and the tester.
[0157] As shown in the conceptual example of FIG. 6, if an electronic component (ED) on the test table (300) is in an angular position having a rotation angle (Θ1) twisted in the Θ-axis direction with respect to the test zone (TZ), a failure occurs in the electrical connection between the electronic component (ED) and the tester. To prevent this, all test zones (TZ) of the test board (TB) and all electronic components (ED) on the test table (300) must be aligned.
[0158] A relocation mechanism (500) is provided to realize alignment between the test zone (TZ) and the electronic component (ED).
[0159] According to the present embodiment, the electronic component (ED) is moved from the transport table (110) to the test table (300) by the second picker hand (310). During this process, an error in the position of the electronic component (ED) may occur due to an operating error or operating shock of the second picker hand (310).
[0160] The positions of the electronic components (ED) loaded onto the test table (300) by the second picker hand (310) on the XY plane or each position may be different, and the electronic components (ED) loaded onto the test table (300) and the test zones (TZ) of the test board (TB) may not coincide with each other.
[0161] It does not matter if the error tolerance between the electronic component (ED) and the test zone (TZ) is wide. However, the reality is that the packaged semiconductor device requires a precision of within 30㎛, and in the case of the die or HBM, a precision of within 5㎛ is required.
[0162] In the present invention, when the second picker hand (310) moves electronic components (ED) from the transport table (110) to the test table (300), the electronic components (ED) are loaded into temporary zones and then relocated from the temporary zones to the fixed zones.
[0163] The temporary area may not be a set location, but any location where the electronic component (ED) is placed on the test table (300) by the second picker hand (310).
[0164] The temporary area is a location that is not set or fixed by the controller (700) and is arbitrarily determined by the operation of the second picker hand (310).
[0165] For example, when the second picker hand (310) places an electronic component (ED) on the test table (300), the area where the electronic component (ED) is placed becomes a temporary area.
[0166] Exaggerated Figure 7 shows an example of a temporary zone (BZ) on a test table (300).
[0167] All temporary zones (BZ) can have their own positions on the X-axis, Y-axis, and Θ-axis.
[0168] The fixed position zone refers to the location where the electronic component and the test zone (TZ) coincide. An exaggerated figure 8 shows the relationship between the temporary zone (BZ) and the fixed position zone (RZ) on the test table (300).
[0169] The position zone (RZ) may be pre-set, but it may also be set to match the position and arrangement of the test zones (TZ) on the test board (TB) after the electronic components (ED) to be tested are loaded onto the test table (300).
[0170] The positioning zone (RZ) can be obtained from an image precisely scanned by a separate high-magnification camera attached to the test table (300) before operation to support the test of the handler (EH).
[0171] In Fig. 8, the temporary zone (BZ) may have errors in the X-axis, Y-axis, and Θ-axis directions with respect to the fixed zone (RZ).
[0172] A relocation mechanism (500) is provided to precisely relocate the position of an electronic component (ED) loaded on a test table (300) in a relocation space (RS).
[0173] The relocation mechanism (500) is provided to relocate the position of an electronic component (ED) loaded on a test table (300) by the second picker hand (310) from a temporary zone (BZ) to a fixed zone (RZ).
[0174] According to the present embodiment, the second picker hand (310) loads the electronic components (ED) to be tested, which are unloaded from the transport table (110), into a temporary zone (BZ). Then, a relocation mechanism (500) is utilized to move the electronic components (ED) in the temporary zone (BZ) to the designated zone (RZ).
[0175] As shown in the schematic diagram of FIG. 9, the relocation mechanism (500) includes a relocation picker (510), a relocation camera (520), and an elevator (530).
[0176] The relocation mechanism (500) has its position fixed.
[0177] The relocation mechanism (500) can be fixedly mounted to the frame forming the skeleton of the handler (EH).
[0178] The repositioning picker (510) can grasp or release the electronic component (ED). The repositioning picker (510) can grasp the electronic component (ED) by vacuum pressure.
[0179] The repositioning picker (510) is fixed in a horizontal position in the X-axis and Y-axis directions.
[0180] The relocation camera (520) is positioned apart from the relocation picker (510).
[0181] The repositioning camera (520) is fixed in position in the horizontal direction, which is the X-axis and Y-axis direction.
[0182] A repositioning camera (520) is provided to photograph electronic components (ED).
[0183] As in the example of FIG. 10, the repositioning camera (520) photographs identification marks (M: M1, M2) on the electronic component (ED). The identification marks (M) may be arranged diagonally opposite each other.
[0184] However, the object photographed by the relocation camera (520) to relocate the electronic component (ED) does not need to be limited to the identification mark (M). The object photographed by the relocation camera (520) may be replaced with the corner of the electronic component (ED), the identification pad or identification pattern of the electronic component (ED), or other identifiable objects.
[0185] The relocation picker (510) and the relocation camera (520) are connected and fixed as a single module.
[0186] On a plane, the mutual placement positions of the relocation picker (510) and the relocation camera (520) are fixed.
[0187] The elevator (530) raises the relocation picker (510).
[0188] By raising the repositioning picker (510) by the elevator (530), the repositioning picker (510) can grasp the electronic component (ED) placed on the test table (300) or properly place the electronic component (ED) on the test table (300).
[0189] The moving mechanism (600) can move the test table (300) in the horizontal direction, which is the X-axis and Y-axis direction.
[0190] The moving mechanism (600) can rotate the test table (300) in the Θ-axis direction.
[0191] The moving mechanism (600) can move the test table (300) up and down in the Z-axis direction.
[0192] As shown in the schematic excerpt of FIG. 11, the moving mechanism (600) includes a rotating mechanism (610), an elevator (620), a first moving mechanism (640), and a second moving mechanism (660).
[0193] The rotator (610) rotates the test table (300) in the Θ-axis direction.
[0194] The test table (300) can be rotated by the rotating mechanism (610) so that the angular position of the electronic component (ED) in the Θ-axis direction can be adjusted.
[0195] The elevator (620) raises the test table (300).
[0196] The test table (300) is connected to the elevator (620) via a rotating mechanism (610).
[0197] When the test table (300) is raised by the elevator (620), the electronic components (ED) of the test table (300) come into contact with the test pins (t), and the electronic components (ED) are electrically connected to the tester.
[0198] When the test table (300) is lowered by the elevator (620), the contact between the electronic components (ED) and the test pins (t) is released, and the test table (300) becomes capable of moving in a horizontal direction.
[0199] The first moving device (640) moves the test table (300) in the X-axis direction.
[0200] As the test table (300) is moved in the X-axis direction by the first moving device (640), the test table (300) can be selectively positioned in the relocation space (RS) and the test space (TS).
[0201] The test space (TS) is a space formed in the connection part (CP), and when the test table (300) is in the test space (TS), an electrical connection is made between the electronic component (ED) and the tester by the raising of the test table (300).
[0202] The second mover (660) moves the test table (300) in the Y-axis direction.
[0203] The above-mentioned moving mechanism (600) has three functions.
[0204] The first function is to move the test table (300) between the relocation space (RS) and the test space (TS).
[0205] The second function is to electrically connect or disconnect electronic components (ED) to the tester.
[0206] The third function is for the relocation of electronic components (ED) in the relocation space (RS).
[0207] Since the position of the repositioning picker (510) is fixed on the plane, the test table (300) moves in the horizontal X-axis and Y-axis directions or rotates in the Θ-axis direction to adjust the position of the electronic component (ED) on the horizontal plane.
[0208] Depending on the implementation, the test table (300) is raised and lowered during the relocation process of the electronic component (ED), thereby enabling the relocation picker (510) to grasp or release the electronic component (ED).
[0209] Here, the operation during the relocation of electronic components (ED) is explained.
[0210] As shown in Fig. 8, the temporary zone (BZ) of the electronic component (ED) may differ from the fixed zone (RZ) in the X-axis, Y-axis, and Θ-axis directions.
[0211] During the relocation process, the elevator (620) maintains the test table (300) at a certain height, thereby positioning the electronic component (ED) at the focal length of the relocation camera (520).
[0212] The relocation camera (520) photographs the electronic component (ED) on the test table (300) and identifies the temporary zone (BZ) through the location of the identification mark (M).
[0213] When the temporary zone (BZ) is identified, the first mover (640) and the second mover (660) operate to position the center of the temporary zone (BZ) below the relocation picker (510), and the elevator (530) operates to lower the relocation picker (510).
[0214] When the repositioning picker (510) adsorbs and grasps an electronic component (ED) located in the temporary zone (BZ) of the test table (300) using vacuum pressure, the elevator (620) operates to raise the repositioning picker (510). Afterward, the first moving device (640) and the second moving device (660) operate to align the center of the fixed position zone (RZ) with the center of the electronic component (ED) grasped by the repositioning picker (510), and the rotating device (610) operates to align the electronic component (ED) with the fixed position zone (RZ). In this state, the elevator (530) operates to lower the repositioning picker (510), thereby allowing the electronic component (ED) grasped by the repositioning picker (510) to settle in the fixed position zone (RZ).
[0215] When the electronic component (ED) is secured to the test table (300) by vacuum pressure applied through the vacuum hole (h) while the electronic component (ED) is seated in the positioning zone (RZ), the repositioning picker (510) releases the grip of the electronic component (ED). Then, the test table (300) lowers and begins repositioning the next electronic component (ED).
[0216] If precise control of the operation of the second picker hand (310) is possible, the second picker hand (310) may be equipped with a camera, and the relocation mechanism (500) may be omitted. In this case, the relocation of the electronic component (ED) can be achieved by utilizing the second picker hand (310).
[0217] Furthermore, the second picker hand (310) may be implemented to move the electronic component (ED) directly to the positioning zone (RZ) when moving it from the transport table (110) to the test table (300).
[0218] The controller (700) controls the components necessary for the proper operation of the handler (EH), such as the transport shuttle (100), the first picker hand (210), the transfer (260), the second picker hand (310), the vacuum (400), the relocation mechanism (500), and the moving mechanism (600).
[0219] Next, the method of operation of the handler (EH) according to the present invention will be explained from the perspective of the logistics of electronic components (ED).
[0220] The transfer transports a customer tray containing electronic components to be tested from the supply stacker (220) to the supply position (SP).
[0221] The first picker hand (210) moves electronic components (ED) to be tested from a customer tray in the supply position (SP) to a transport table (110) in the first area (A1).
[0222] When all the electronic components (ED) are loaded onto the transport table (110), the transport shuttle (100) operates and moves the transport table (110) to the second area (A2).
[0223] The second picker hand (310) unloads electronic components (ED) from the transport table (110) in the second area (A2) and moves them to the test table (300) in the relocation area (RS). At this time, the locations of the electronic components (ED) loaded onto the test table (300) by the second picker hand (310) are temporary zones (BZ).
[0224] When all the electronic components (ED) to be tested are loaded onto the test table (300), the controller (700) operates the relocation mechanism (500) and the moving mechanism (600) to relocate the electronic components (ED) from the temporary zones (BZ) to the fixed zones (RZ).
[0225] When the rearrangement of electronic components (ED) on the test table (300) is completed, the moving mechanism (600) operates to move the test table (300) to the test space (TS) formed in the connection part (CP).
[0226] Afterwards, the connector (700) operates to raise the test table (300) toward the test board (TB), so that the electronic components (ED) are electrically connected to the tester.
[0227] When the testing of the electronic components (ED) is finished, the test table (300) is moved to the relocation section (RP) by the moving mechanism (600). Then, the second picker hand (310) moves the electronic components (ED) that have completed testing to the transport tray (110) in the second area (A2), and the transport tray (110) filled with the electronic components (ED) that have completed testing moves to the first area (A1).
[0228] Next, the first picker hand (210) unloads the electronic components (ED) that have been tested from the transport table (110) and moves them to the customer tray at the recovery location (WP).
[0229] When the customer tray at the recovery location (WP) is completely filled with electronic components that have been tested, the transfer (260) transfers the customer tray at the recovery location (WP) to the recovery stacker (220).
[0230] According to the basic operation method described above, the electronic component (ED) is supplied from the supply stacker (220) to the tester for testing, and after the test is completed, it is returned to the recovery stacker (220).
[0231] <Explanation of Transfer>
[0232] The transfer (260) transfers the customer tray in the supply stacker (220) to the supply position (SP).
[0233] The transfer (260) transfers the customer tray at the recovery location (WP) to the recovery stacker (230).
[0234] The transfer (260) can transfer the empty customer tray at the supply location (SP) to the recovery location (WP).
[0235] Depending on the implementation, the handler (EH) may be equipped with an empty stacker used for storing empty customer trays.
[0236] If an empty stacker is provided, the transfer (260) can transfer an empty customer tray at the supply position (SP) to the empty stacker or transfer a customer tray in the empty stacker to the recovery position (WP).
[0237] As shown in the schematic diagram of FIG. 12, the transfer (260) includes a gripping head (261), a vertical mover (262), and a horizontal mover (263), etc.
[0238] The gripping head (261) can grip or release the customer tray.
[0239] Electronic components can be loaded on the customer tray.
[0240] Electronic components are loaded onto the customer tray in a dead bug state, with terminals positioned on the top surface.
[0241] The vertical mover (262) moves the gripping head (261) in a vertical direction.
[0242] The gripping head (261) is coupled to the vertical mover (262) so as to be movable in the vertical direction.
[0243] The horizontal mover (263) moves the vertical mover (262) in the horizontal X-axis direction.
[0244] The vertical mover (262) is coupled to the horizontal mover (263) so as to be movable in the X-axis direction.
[0245] When the vertical mover (262) moves in a horizontal direction, the gripping head (261) connected to the vertical mover (262) also moves in a horizontal direction.
[0246] Accordingly, the horizontal mover (263) moves the gripping head (261) in a horizontal direction.
[0247] Referring to FIGS. 13 and FIGS. 14, we will examine the gripping head (261) further.
[0248] FIG. 13 is an excerpted perspective view of the gripping head (261), and FIG. 14 is a conceptual front view of the gripping head (261).
[0249] The gripping head (291) includes a mounting plate (291a), clampers (291b), cameras (291c), lights (291d), a cover plate (291e), a spring (291f), and a protective pad (291g).
[0250] The mounting plate (291a) is connected to the vertical moving device (292).
[0251] The mounting plate (291a) can be moved vertically by the vertical mover (292).
[0252] The mounting plate (291a) supports clampers (291b), cameras (291c), lighting elements (291d), a cover plate (291e), a spring (291f), and a protective pad (291g).
[0253] Ultimately, clampers (291b), cameras (291c), lighting elements (291d), a cover plate (291e), a spring (291f), and a protective pad (291g) are installed on the mounting plate (291a).
[0254] The clampers (291b) can grip or release the customer tray (CT).
[0255] Four clampers (291b) are provided.
[0256] The cameras (291c) are installed directly on the mounting plate (291a).
[0257] The camera (291c) may also be installed on the cover plate (291e).
[0258] Three cameras (291c) are installed side by side in the front-rear direction.
[0259] It is sufficient to have at least one camera (291c) in the required number.
[0260] The camera (291c) photographs the electronic components (ED) loaded on the customer tray (CT).
[0261] The image captured by the camera (291c) is used to check for poor seating of electronic components (ED).
[0262] The controller (270) photographs the electronic components (ED) with a camera (291c) before gripping the customer tray (CT) with the gripping head (291).
[0263] The controller (270) analyzes the image captured by the camera (291c) to determine whether there is a defect in the seating of the electronic component (ED).
[0264] If the electronic component (ED) is poorly seated, the controller (270) causes a jam.
[0265] If the electronic component (ED) is properly seated, the controller (270) controls the transfer (260) to grip the customer tray with the gripping head (261).
[0266] The lighting elements (261d) support shooting by the camera (261c) by illuminating the customer tray below with light.
[0267] The lighting elements (261d) are installed directly on the mounting plate (261a).
[0268] The lighting elements (261d) may also be installed on the cover plate (261e).
[0269] Multiple lighting elements (261d) are arranged to surround the cameras (291c).
[0270] It is sufficient to have at least one lighting element (261d) in the required number.
[0271] The cover plate (261e) is installed to be supported on the mounting plate (261a).
[0272] The cover plate (261e) covers the upper surface of the customer tray (CT) held by the clamper (261b).
[0273] During operation, the cover plate (261e) prevents electronic components (ED) loaded on the customer tray (CT) from falling out of the customer tray (CT).
[0274] The spring (261f) is an elastic member that elastically supports the cover plate (261e) against the mounting plate (261a).
[0275] The spring (261f) allows the cover plate (261e) to be raised and lowered to some extent, thereby preventing damage to the customer tray (CT) or electronic components (ED) caused by excessive lowering of the gripping head (261).
[0276] The protective pad (261g) is attached to the bottom surface of the cover plate (261e).
[0277] The protective pad (261g) prevents direct contact between the cover plate (261e) and the electronic component (ED).
[0278] Damage caused by direct contact between the cover plate (261e) and the electronic component (ED) can be prevented by the protective pad (261g).
[0279] The cover plate (261e) and the protective pad (261g) are made of different materials.
[0280] The cover plate (261e) is made of metal (aluminum) and the protective pad (261g) is made of synthetic resin.
[0281] The protective pad (261g) has an adhesive surface on its upper surface.
[0282] The upper surface of the protective pad (261g) is adhered to the lower surface of the cover plate (261e).
[0283] The lower surface of the protective pad (261g) is a lubricating surface.
[0284] During operation, the lower surface of the protective pad (261g) may come into contact with the electronic component (ED).
[0285] Since the lower surface of the protective pad (261g) is a lubricating surface, damage to the electronic component (ED) can be prevented.
[0286] According to a preferred example, the protective pad (261g) is dicing tape.
[0287] Dicing tape is used to hold the cut chips in place so that they do not scatter during the dicing process in the semiconductor manufacturing process.
[0288] The role of conventional dicing tape was to hold the cut chips so that they would not scatter, but in the present invention, the dicing tape is used as a protective pad.
[0289] As shown in Fig. 15, the dicing tape is divided into a substrate layer (BF) and an adhesive layer (AF).
[0290] The substrate layer (BF) is formed of polypropylene because it must have excellent flexibility and resilience.
[0291] The upper and lower thickness of the substrate layer (BF) is approximately within 80㎛.
[0292] The adhesive layer (AF) is formed from an acrylic resin.
[0293] The upper and lower thickness of the adhesive layer (AF) is approximately 5 μm.
[0294] The upper and lower thickness of the dicing tape is determined to be within approximately 85㎛.
[0295] Dicing tape is an elastic material that, although thin, has some tensile strength and elongation, allowing for compression and expansion. Therefore, dicing tape can absorb pressure shocks applied to electronic components (ED).
[0296] According to the present invention, the substrate layer (BF) of the dicing tape is used to prevent scratching and impact of electronic components (ED).
[0297] Dicing tape can prevent contamination of electronic components (ED).
[0298] The excellent feature of dicing tape is that it does not transfer foreign substances adhering to the base layer (BF) of the dicing tape to the electronic components (ED).
[0299] Based on numerous tests, foreign substances adhering to the bottom surface of the substrate layer (BF) of the dicing tape were very passive in transferring to the electronic components (ED).
[0300] It is desirable for the protective pad (261g) to have a function to prevent static electricity.
[0301] Since the protective pad (261g) prevents static electricity shock, it is possible to prevent the electronic component (ED) from being damaged by static electricity.
[0302] The protective pad (261g) can be made of a conductive material.
[0303] Since the protective pad (261g) made of a conductive material is grounded, static electricity is dissipated through the protective pad (261g), so static electricity does not accumulate on the protective pad (261g).
[0304] Fig. 16 is an excerpt of the protective pad (261g).
[0305] The protective pad (261g) has a viewing hole (ch) and a lighting hole (lh) formed therein.
[0306] A viewing hole (ch) is formed to secure a view of the camera (261c).
[0307] The camera (261c) can photograph the electronic components (ED) of the customer tray (CT) through the viewing hole (ch).
[0308] The light hole (lh) passes the light of the light element (261d).
[0309] The light from the light source (261d) can pass through the light hole (lh) and be irradiated onto the electronic components (ED) of the customer tray (CT).
[0310] As described above, according to the present invention, an electronic component (ED) can be protected by a spring (261f) and a protective pad (261g).
[0311] <Additional Details>
[0312] 1. The transfer (260) according to the present invention can be appropriately used for transporting any type of tray capable of carrying electronic components (ED) as well as customer trays (CT).
[0313] 2. The transfer (260) according to the present invention can be appropriately used regardless of the type of electronic component (ED) loaded on the tray.
[0314] 3. The transfer (260) according to the present invention can be appropriately used even when the electronic component (ED) is loaded into the tray in a live bug state.
[0315] For example, even in the case where the electronic component (ED) is a memory device that is loaded onto a tray in a live bug state, the protective pad (261g) prevents surface scratching or surface damage of the electronic component (ED), thereby enabling the maintenance of marketability.
[0316] The embodiments described above are merely preferred examples of the present invention and may have various applications. Therefore, the present invention should not be understood as being limited only to the contents described above. Instead, the scope of the present invention should be understood as the separately described claims and their equivalents.
[0317]
Claims
1. A gripping head that grips or releases a tray capable of holding electronic components; A vertical moving device that moves the gripping head in a vertical direction, wherein the gripping head is coupled to be movable in a vertical direction; and A horizontal mover that moves the gripping head in a horizontal direction by moving the vertical mover in a horizontal direction; comprising The above gripping head A mounting plate coupled to the above-mentioned vertical moving device so as to be movable in the vertical direction; A clamp installed on the above-mentioned mounting plate to grip or release the tray; A cover plate installed on the above-mentioned mounting plate and covering the upper surface of the tray held by the above-mentioned clamper; and A protective pad attached to the bottom surface of the above cover plate; comprising Transfer for electronic component handlers.
2. In Paragraph 1, The upper surface of the protective pad is an adhesive surface, and the lower surface of the protective pad is a lubricating surface. Transfer for electronic component handlers.
3. In Paragraph 1, The above protective pad is an elastic material capable of compression and expansion in the vertical direction. Transfer for electronic component handlers.
4. In Paragraph 1, The above protective pad is a dicing tape used to hold the cut chips in the dicing process of semiconductor devices so that they do not scatter. Transfer for electronic component handlers.
5. In Paragraph 1, The above protective pad is provided for anti-static purposes. Transfer for electronic component handlers.
6. In Paragraph 1, The above protective pad is provided with a conductive material. Transfer for electronic component handlers.
7. In Paragraph 1, The above gripping head Further comprising an elastic member that elastically supports the cover plate with respect to the installation plate. Transfer for electronic component handlers.
8. In Paragraph 1, The above gripping head It further includes at least one camera for photographing electronic components located below; and The above protective pad has a viewing hole formed therein to secure the field of view of the camera. Transfer for electronic component handlers.
9. In Paragraph 8, The above gripping head Further comprising at least one lighting element that supports shooting by the above at least one camera, and The above protective pad has a light hole formed therein through which light from a lighting element can pass. Transfer for electronic component handlers.
10. A transfer according to any one of paragraphs 1 through 9 applied to move a tray brought in with electronic components loaded thereon. Electronic component handler.
11. In Paragraph 10, The above tray contains electronic components in a dead bug state with contact terminals facing upward. Electronic component handler.